Telit Wireless Solutions Work Light GE864 User Manual

GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
Contents  
1
2
3
Overview ...........................................................................................................................7  
GE864 Mechanical Dimensions ......................................................................................8  
GE864 module connections ............................................................................................9  
3.1  
PIN-OUT...................................................................................................................................9  
3.1.1  
BGA Balls Layout........................................................................................................................... 13  
4
5
Hardware Commands ....................................................................................................15  
4.1  
Turning ON the GE864-QUAD / PY......................................................................................15  
4.2  
Turning OFF the GE864-QUAD / PY....................................................................................17  
Hardware shutdown....................................................................................................................... 17  
Hardware Unconditional Restart.................................................................................................... 17  
4.2.1  
4.2.2  
Power Supply .................................................................................................................19  
5.1  
Power Supply Requirements...............................................................................................19  
5.2  
General Design Rules ..........................................................................................................20  
5.2.1  
Electrical Design Guidelines.......................................................................................................... 20  
5.2.1.1 + 5V input Source Power Supply Design Guidelines ................................................................ 20  
5.2.1.2 + 12V input Source Power Supply Design Guidelines .............................................................. 21  
5.2.1.3 Battery Source Power Supply Design Guidelines ..................................................................... 23  
5.2.1.4 Battery Charge control Circuitry Design Guidelines .................................................................. 24  
5.2.2  
5.2.3  
Thermal Design Guidelines ........................................................................................................... 26  
Power Supply PCB layout Guidelines ........................................................................................... 27  
6
Antenna...........................................................................................................................28  
6.1  
GSM Antenna Requirements...............................................................................................28  
GSM Antenna – PCB line Guidelines..................................................................................29  
GSM Antenna – Installation Guidelines..............................................................................30  
6.2  
6.3  
7
8
Logic level specifications..............................................................................................31  
7.1  
Reset signal ..........................................................................................................................32  
Serial Ports .....................................................................................................................33  
8.1  
MODEM SERIAL PORT.........................................................................................................33  
RS232 level translation ........................................................................................................35  
5V UART level translation....................................................................................................37  
8.2  
8.3  
9
Audio Section Overview ................................................................................................39  
9.1  
INPUT LINES (Microphone) .................................................................................................40  
Short description............................................................................................................................ 40  
Input Lines Characteristics ............................................................................................................ 41  
9.1.1  
9.1.2  
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GE864 Hardware User Guide  
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9.2  
9.2.1  
9.2.2  
OUTPUT LINES (Speaker)....................................................................................................42  
Short description............................................................................................................................ 42  
Output Lines Characteristics.......................................................................................................... 43  
9.3  
SIM Holder Implementation .................................................................................................43  
10 General Purpose I/O.......................................................................................................44  
10.1 GPIO Logic levels.................................................................................................................46  
10.2 Using a GPIO Pad as INPUT ................................................................................................47  
10.3 Using a GPIO Pad as OUTPUT ............................................................................................47  
10.4 Using the RF Transmission Control GPIO4 .......................................................................48  
10.5 Using the RFTXMON Output GPIO5....................................................................................48  
10.6 Using the Alarm Output GPIO6 ...........................................................................................48  
10.7 Using the Buzzer Output GPIO7..........................................................................................49  
10.8 Magnetic Buzzer Concepts..................................................................................................50  
10.8.1  
10.8.2  
10.8.3  
10.8.4  
10.8.5  
Short Description ........................................................................................................................... 50  
Frequency Behaviour..................................................................................................................... 51  
Power Supply Influence................................................................................................................. 51  
Warning.......................................................................................................................................... 51  
Working Current Influence............................................................................................................. 51  
10.9 Using the Temperature Monitor Function..........................................................................52  
10.9.1  
10.9.2  
Short Description ........................................................................................................................... 52  
Allowed GPIO ................................................................................................................................ 52  
10.10  
Indication of network service availability.......................................................................53  
RTC Bypass out ................................................................................................................54  
VAUX1 power output ........................................................................................................54  
10.11  
10.12  
11 DAC and ADC section....................................................................................................55  
11.1 DAC Converter......................................................................................................................55  
11.1.1  
11.1.2  
11.1.3  
Description..................................................................................................................................... 55  
Enabling DAC ................................................................................................................................ 56  
Low Pass Filter Example ............................................................................................................... 56  
11.2 ADC Converter......................................................................................................................57  
11.2.1  
11.2.2  
Description..................................................................................................................................... 57  
Using ADC Converter .................................................................................................................... 57  
12 Mounting the GE864 on your Board .............................................................................58  
12.1 General ..................................................................................................................................58  
12.1.1  
12.1.2  
12.1.3  
12.1.4  
12.1.5  
12.1.6  
Module finishing & dimensions ...................................................................................................... 58  
Recommended foot print for the application (GE864)................................................................... 59  
Suggested Inhibit Area .................................................................................................................. 60  
Debug of the GE864 in production ................................................................................................ 61  
Stencil ............................................................................................................................................ 61  
PCB pad design............................................................................................................................. 62  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
12.1.7  
12.1.8  
Solder paste................................................................................................................................... 63  
GE864 Solder reflow...................................................................................................................... 64  
12.2 Packing system ....................................................................................................................65  
12.2.1  
12.2.2  
GE864 orientation on the tray........................................................................................................ 66  
Moisture sensibility ........................................................................................................................ 66  
13 Conformity Assessment Issues....................................................................................67  
14 SAFETY RECOMMANDATIONS.....................................................................................68  
15 Document Change Log..................................................................................................69  
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GE864 Hardware User Guide  
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DISCLAIMER  
The information contained in this document is the proprietary information of Telit Communications  
S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other  
than the officers, employees, agents or subcontractors of the owner or licensee of this document,  
without the prior written consent of Telit, is strictly prohibited.  
Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the  
foregoing, Telit does not make any warranty as to the information contained herein, and does not  
accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the  
information.  
Telit disclaims any and all responsibility for the application of the devices characterized in this  
document, and notes that the application of the device must comply with the safety standards of the  
applicable country, and where applicable, with the relevant wiring rules.  
Telit reserves the right to make modifications, additions and deletions to this document due to  
typographical errors, inaccurate information, or improvements to programs and/or equipment at any  
time and without notice. Such changes will, nevertheless be incorporated into new editions of this  
application note.  
All rights reserved.  
© 2006 - 2008 Telit Communications S.p.A.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
1 Overview  
The aim of this document is the description of some hardware solutions useful for developing a product with the  
Telit GE864-QUAD / PY module.  
In this document all the basic functions of a mobile phone will be taken into account; for each one of them a  
proper hardware solution will be suggested and eventually the wrong solutions and common errors to be  
avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products  
that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the  
suggested hardware configurations shall not be considered mandatory, instead the information given shall be  
used as a guide and a starting point for properly developing your product with the Telit GE864-QUAD / PY module.  
For further hardware details that may not be explained in this document refer to the Telit GE864-QUAD / PY  
Product Description document where all the hardware information is reported.  
NOTICE  
(EN) The integration of the GSM/GPRS GE864-QUAD / PY cellular module within user application shall be  
done according to the design rules described in this manual.  
(IT) L’integrazione del modulo cellulare GSM/GPRS GE864-QUAD / PY all’interno dell’applicazione  
dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.  
(DE) Die integration des GE864-QUAD / PY GSM/GPRS Mobilfunk-Moduls in ein Gerät muß gemäß der in  
diesem Dokument beschriebenen Kunstruktionsregeln erfolgen  
(SL) Integracija GSM/GPRS GE864-QUAD / PY modula v uporabniški aplikaciji bo morala upoštevati  
projektna navodila, opisana v tem piročniku.  
(SP) La utilización del modulo GSM/GPRS GE864-QUAD / PY debe ser conforme a los usos para los cuales  
ha sido deseñado descritos en este manual del usuario.  
(FR) L’intégration du module cellulaire GSM/GPRS GE864-QUAD / PY dans l’application de l’utilisateur  
sera faite selon les règles de conception décrites dans ce manuel.  
GE864-QUAD / PY  
The information presented in this document is believed to be accurate and reliable. However, no responsibility is  
assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third  
parties which may result from its use. No license is granted by implication or otherwise under any patent rights of  
Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to  
change without notice.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
2 GE864 Mechanical Dimensions  
The Telit GE864 module overall dimension are:  
Length:  
Width:  
Thickness:  
30 mm  
30 mm  
2.9 mm  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
3 GE864 module connections  
3.1 PIN-OUT  
Ball  
Signal  
I/O  
Function  
Audio  
Internal PULL UP  
Type  
H9  
EAR_MT-  
AO Handset earphone signal output, phase -  
AO Handset earphone signal output, phase +  
AO Handsfree ear output, phase +  
Audio  
Audio  
Audio  
Audio  
Audio  
Audio  
Audio  
Audio  
G10  
H10  
J10  
J8  
EAR_MT+  
EAR_HF+  
EAR_HF-  
MIC_MT+  
MIC_MT-  
MIC_HF+  
MIC_HF-  
AXE  
AO Handsfree ear output, phase -  
AI  
AI  
AI  
AI  
I
Handset mic.signal input; phase+  
Handset mic.signal input; phase-  
Handsfree mic. input; phase +  
Handsfree mic.input; phase -  
Handsfree switching  
G9  
G8  
J9  
F9  
100K  
47K  
CMOS 2.8V  
SIM card interface  
C10  
E9  
SIMCLK  
SIMRST  
SIMIO  
O
O
I/O  
I
External SIM signal – Clock  
External SIM signal – Reset  
External SIM signal – Data I/O  
External SIM signal – Presence (active low)  
External SIM signal – Power supply for the SIM  
Trace  
1,8 / 3V  
1,8 / 3V  
1,8 / 3V  
1,8 / 3V  
1,8 / 3V  
D10  
C11  
D41  
SIMIN  
SIMVCC  
-
D11  
F10  
TX_TRACE  
RX_TRACE  
O
I
TX Data for debug monitor  
RX Data for debug monitor  
Prog. / Data + HW Flow Control  
Serial data input (TXD) from DTE  
Serial data output to DTE  
CMOS 2.8V  
CMOS 2.8V  
E7  
H8  
C103/TXD  
C104/RXD  
I
CMOS 2.8V  
CMOS 2.8V  
O
Input for Data terminal ready signal (DTR) from  
DTE  
B7  
C108/DTR  
I
CMOS 2.8V  
Input for Request to send signal (RTS) from  
DTE  
F7  
F6  
D9  
C105/RTS  
C106/CTS  
C109/DCD  
I
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
O
O
Output for Clear to send signal (CTS) to DTE  
Output for Data carrier detect signal (DCD) to  
DTE  
E11  
B6  
C107/DSR  
C125/RING  
O
O
Output for Data set ready signal (DSR) to DTE  
Output for Ring indicator signal (RI) to DTE  
DAC and ADC  
CMOS 2.8V  
CMOS 2.8V  
1 On this line a maximum of 10nF bypass capacitor is allowed  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
Ball  
C7  
Signal  
DAC_OUT  
I/O  
Function  
Internal PULL UP  
Type  
AO Digital/Analog converter output  
D/A  
A/D  
A/D  
A/D  
J11  
H11  
G11  
ADC_IN1  
ADC_IN2  
ADC_IN3  
AI  
AI  
AI  
Analog/Digital converter input  
Analog/Digital converter input  
Analog/Digital converter input  
Miscellaneous Functions  
Reset input  
A2  
E2  
D8  
G1  
G2  
RESET*  
VRTC  
I
AO VRTC Backup capacitor  
Power  
STAT_LED  
CHARGE  
CHARGE  
O
Status indicator led  
Charger input  
CMOS 1.8V  
Power  
AI  
AI  
Charger input  
Power  
Input command for switching power ON or OFF  
(toggle command).  
J5  
ON_OFF*  
I
47K  
Pull up to VBATT  
D5  
L8  
L4  
D7  
VAUX1  
-
Power output for external accessories  
Power ON Monitor  
-
PWRMON  
Antenna  
O
O
-
CMOS 2.8V  
RF  
Antenna output – 50 ohm  
DVI2_CLK (Digital Voice Interface)  
GPIO  
DVI2_CLK  
4.7K  
CMOS 2.8  
G4  
C2  
TGPIO_12  
TGPIO_03  
I/O  
I/O  
Telit GPIO12 Configurable GPIO  
Telit GPIO03 Configurable GPIO  
CMOS 2.8V  
CMOS 2.8V  
Telit GPIO04 Configurable GPIO / RF  
Transmission Control  
B3  
TGPIO_04  
I/O  
CMOS 2.8V  
C3  
B4  
D1  
B1  
C1  
TGPIO_20  
TGPIO_14  
TGPIO_11  
TGPIO_19  
TGPIO_01  
I/O  
I/O  
I/O  
I/O  
I/O  
Telit GPIO20 Configurable GPIO  
Telit GPIO14 Configurable GPIO  
Telit GPIO11 Configurable GPIO  
Telit GPIO19 Configurable GPIO  
Telit GPIO01 Configurable GPIO  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
Telit GPIO18 Configurable GPIO/ DVI2_RX  
(Digital Voice Interface)  
Telit GPIO17 Configurable GPIO / DVI2_WA  
(Digital Voice Interface)  
K7  
H5  
TGPIO_18  
TGPIO_17  
I/O  
I/O  
CMOS 2.8V  
CMOS 2.8V  
F5  
TGPIO_15  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
Telit GPIO15 Configurable GPIO  
Telit GPIO08 Configurable GPIO  
Telit GPIO06 Configurable GPIO / ALARM  
Telit GPIO09 GPIO I/O pin  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
K11  
B5  
C9  
E6  
TGPIO_08  
TGPIO_06 / ALARM  
TGPIO_09  
TGPIO_02 / JDR  
TGPIO_07 / BUZZER  
TGPIO_16  
Telit GPIO02 I/O pin / Jammer detect report  
Telit GPIO07 Configurable GPIO / Buzzer  
Telit GPIO16 Configurable GPIO  
Telit GPIO13 Configurable GPIO  
L9  
H6  
K10  
TGPIO_13  
Telit GPIO05 Configurable GPIO / Transmitter  
ON monitor  
K8  
TGPIO_05 / RFTXMON I/O  
CMOS 2.8V  
CMOS 2.8V  
L10  
E8  
TGPIO_21  
TGPIO_22  
I/O  
I/O  
Telit GPIO21 Configurable GPIO  
CMOS 1.8V  
(not 2.8V !!)  
Telit GPIO22 Configurable GPIO  
Telit GPIO10 Configurable GPIO / DVI2_TX  
(Digital Voice Interface)  
H3  
TGPIO_10  
I/O  
CMOS 2.8V  
Power Supply  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
Ball  
J1  
Signal  
I/O  
Function  
Internal PULL UP  
Type  
VBATT  
VBATT  
VBATT  
VBATT  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Main power supply  
Main power supply  
Main power supply  
Main power supply  
Ground  
Power  
K1  
J2  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
K2  
A1  
F1  
Ground  
H1  
L1  
Ground  
Ground  
H2  
L2  
Ground  
Ground  
J3  
Ground  
K3  
L3  
Ground  
Ground  
K4  
K5  
D6  
K6  
L6  
Ground  
Ground  
Ground  
Ground  
Ground  
A11  
F11  
L11  
Ground  
Ground  
Ground  
RESERVED  
A10  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
B10  
B11  
B2  
B8  
B9  
C4  
C8  
D2  
D3  
E1  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
E10  
E3  
E4  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
Ball  
F2  
Signal  
I/O  
Function  
Internal PULL UP  
Type  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
F3  
F4  
G6  
G7  
H4  
H7  
J4  
J6  
J7  
K9  
L5  
E5  
L7  
G5  
G3  
C6  
F8  
C5  
NOTE: RESERVED pins must not be connected  
NOTE: If not used, almost all pins should be left disconnected. The only exceptions are the following  
pins:  
pin  
J1,K1,J2,K2  
A1,F1,H1,L1,H2,L2,J3,K3,L3,  
signal  
VBATT  
GND  
K4,K5,D6,K6,L6,A11,F11,L11  
J5  
E7  
A2  
H8  
F7  
ON/OFF*  
TXD  
RESET*  
RXD  
RTS2  
2 RTS should be connected to the GND (on the module side) if flow control is not used  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
3.1.1 BGA Balls Layout  
TOP VIEW  
F
A
B
C
D
E
G
H
J
K
L
GND  
TGPIO_19 TGPIO_01 TGPIO_11  
GND  
CHARGE  
GND  
VBATT  
VBATT  
GND  
1
2
-
RESET*  
-
TGPIO_03  
-
VRTC  
-
-
-
CHARGE  
VMICN  
TGPIO_12  
VMICP  
-
GND  
VBATT  
GND  
-
VBATT  
GND  
GND  
GND  
Antenna  
-
-
TGPIO_04 TGPIO_20  
-
-
-
-
TGPIO_10  
3
--  
TGPIO_14  
-
SIMVCC  
VAUX1  
GND  
-
GND  
4
TGPIO_06  
/ ALARM  
-
TGPIO_15  
TGPIO_17 ON_OFF*  
GND  
5
TGPIO_02  
/ JDR  
C106 /  
CTS  
C125/RING  
-
TGPIO_16  
-
GND  
GND  
6
DVI2_CL  
K
C108 /  
DTR  
C103 /  
TXD  
C105 /  
RTS  
-
DAC_OUT  
-
-
-
TGPIO_18  
-
7
TGPIO_05  
/
RFTXMON  
STAD_  
LED  
C104 /  
RXD  
-
-
-
-
-
-
TGPIO_22  
-
MIC_HF+  
MIC_MT-  
MIC_MT+  
MIC_HF-  
EAR_HF-  
ADC_IN1  
PWRMON  
8
C109 /  
DCD  
TGPIO_07  
/ BUZZER  
-
-
TGPIO_09  
SIMCLK  
SIMIN  
SIMRST  
AXE  
EAR_MT-  
-
9
-
RX_TRACE  
GND  
SIMIO  
EAR_MT+ EAR_HF+  
TGPIO_13 TGPIO_21  
10  
11  
C107 /  
DSR  
TX_TRACE  
GND  
ADC_IN3  
ADC_IN2  
TGPIO_08  
GND  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
AUDIO Signals balls  
SIM CARD interface balls  
TRACE Signals balls  
Prog. / data + Hw Flow Control signals balls  
DAC and ADC signals balls  
MISCELLANEOUS functions signals balls  
TELIT GPIO balls  
POWER SUPPLY VBATT balls  
POWER SUPPLY GND balls  
RESERVED  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
4 Hardware Commands  
4.1 Turning ON the GE864-QUAD / PY  
To turn on the GE864-QUAD / PY the pad ON# must be tied low for at least 1 second and then  
released.  
The maximum current that can be drained from the ON# pad is 0,1 mA.  
A simple circuit to do it is:  
ON#  
R1  
Q1  
Power ON impulse  
R2  
GND  
NOTE: don’t use any pull up resistor on the ON# line, it is internally pulled up. Using pull up resistor may bring to  
latch up problems on the GE864-QUAD / PY power regulator and improper power on/off of the module. The line ON#  
must be connected only in open collector configuration.  
NOTE: In this document all the lines that are inverted, hence have active low signals are labeled with a name that  
ends with a “#” or with a bar over the name.  
NOTE: The GE864-QUAD / PY turns fully on also by supplying power to the Charge pad (Module provided with a  
battery on the VBATT pads).  
TIP: To check if the device has powered on, the hardware line PWRMON should be monitored. After 900ms the line  
raised up the device could be considered powered on.  
PWRMON line rises up also when supplying power to the Charge pad  
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For example:  
Let’s assume you need to drive the ON# pad with a totem pole output of a +3/5 V micro controller  
(uP_OUT1):  
1s  
Let’s assume you need to drive the ON# pad directly with an ON/OFF button:  
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4.2 Turning OFF the GE864-QUAD / PY  
The turning off of the device can be done in three ways:  
by software command (see GE864-QUAD / PY Software User Guide)  
by hardware shutdown  
by Hardware Unconditional Restart  
When the device is shut down by software command or by hardware shutdown, it issues to the  
network a detach request that informs the network that the device will not be reachable any more.  
4.2.1 Hardware shutdown  
To turn OFF the GE864-QUAD / PY the pad ON# must be tied low for at least 2 seconds and then  
released.  
The same circuitry and timing for the power on shall be used.  
The device shuts down after the release of the ON# pad.  
TIP: To check if the device has powered off, the hardware line PWRMON should be monitored. When PWRMON goes  
low, the device has powered off.  
4.2.2 Hardware Unconditional Restart  
To unconditionally Restart the GE864-QUAD / PY, the pad RESET# must be tied low for at least 200  
milliseconds and then released.  
The maximum current that can be drained from the ON# pad is 0,15 mA.  
A simple circuit to do it is:  
RESET#  
Unconditional Restart  
impulse  
GND  
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NOTE: don’t use any pull up resistor on the RESET# line nor any totem pole digital output. Using pull up resistor  
may bring to latch up problems on the GE864-QUAD / PY power regulator and improper functioning of the module.  
The line RESET# must be connected only in open collector configuration.  
TIP: The unconditional hardware Restart should be always implemented on the boards and software should use it  
as an emergency exit procedure.  
For example:  
Let’s assume you need to drive the RESET# pad with a totem pole output of a +3/5 V microcontroller  
(uP_OUT2):  
This signal is internally pulled up so the pin can be left floating if not used.  
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5 Power Supply  
The power supply circuitry and board layout are a very important part in the full product design and  
they strongly reflect on the product overall performances, hence read carefully the requirements and  
the guidelines that will follow for a proper design.  
5.1 Power Supply Requirements  
POWER SUPPLY  
Nominal Supply Voltage  
Max Supply Voltage  
3.8V  
4.2  
Supply Voltage Range  
3.4 – 4.2  
The GE864-QUAD / PY power consumptions are:  
GE864-QUAD/PY  
Mode  
Average (mA)  
IDLE mode  
Mode description  
Stand by mode; no call in progress  
AT+CFUN=1  
AT+CFUN=4  
23,9  
Normal mode: full functionality of the module  
Disabled TX and RX; module is not registered on the  
network  
22  
Power saving: CFUN=0 module registered on the network  
and can receive voice call or an SMS; but it is not possible  
to send AT commands; module wakes up with an  
unsolicited code (call or SMS) or rising RTS line. CFUN=5  
full functionality with power saving; module registered on  
the network can receive incoming calls and SMS  
AT+CFUN=0 or  
AT+CFUN=5  
7,20 / 3,563  
RX mode  
1 slot in downlink  
2 slot in downlink  
3 slot in downlink  
4 slot in downlink  
52,3  
65,2  
78,6  
88,4  
GSM Receiving data mode  
GSM TX and RX mode  
GSM Sending data mode  
GPRS Sending data mode  
Min power level  
Max power level  
GPRS (class 10) TX and RX mode  
Min power level  
Max power level  
78,1  
200,1  
123,7  
370,8  
1 Worst/best case depends on network configuration and is not under module control  
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The GSM system is made in a way that the RF transmission is not continuous, else it is packed into  
bursts at a base frequency of about 216 Hz, the relative current peaks can be as high as about 2A.  
Therefore the power supply has to be designed in order to withstand with these current peaks without  
big voltage drops; this means that both the electrical design and the board layout must be designed for  
this current flow.  
If the layout of the PCB is not well designed a strong noise floor is generated on the ground and the  
supply; this will reflect on all the audio paths producing an audible annoying noise at 216 Hz; if the  
voltage drop during the peak current absorption is too much, then the device may even shutdown as a  
consequence of the supply voltage drop.  
TIP: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output  
of at least 2 A.  
5.2 General Design Rules  
The principal guidelines for the Power Supply Design embrace three different design steps:  
the electrical design  
the thermal design  
the PCB layout.  
5.2.1 Electrical Design Guidelines  
The electrical design of the power supply depends strongly from the power source where this power is  
drained. We will distinguish them into three categories:  
+5V input (typically PC internal regulator output)  
+12V input (typically automotive)  
Battery  
5.2.1.1 + 5V input Source Power Supply Design Guidelines  
The desired output for the power supply is 3.8V, hence there’s not a big difference between the  
input source and the desired output and a linear regulator can be used. A switching power supply  
will not be suited because of the low drop out requirements.  
When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power  
generated.  
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current  
absorption peaks close to the GE864-QUAD / PY, a 100μF tantalum capacitor is usually suited.  
Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at  
least 10V.  
A protection diode should be inserted close to the power input, in order to save the GE864-QUAD /  
PY from power polarity inversion.  
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An example of linear regulator with 5V input is:  
5.2.1.2 + 12V input Source Power Supply Design Guidelines  
The desired output for the power supply is 3.8V; hence due to the big difference between the input  
source and the desired output, a linear regulator is not suited and shall not be used. A switching  
power supply will be preferable because of its better efficiency especially with the 2A peak current  
load represented by the GE864-QUAD/PY.  
When using a switching regulator, a 500kHz or more switching frequency regulator is preferable  
because of its smaller inductor size and its faster transient response. This allows the regulator to  
respond quickly to the current peaks absorption.  
In any case the frequency and Switching design selection is related to the application to be  
developed due to the fact the switching frequency could also generate EMC interferences.  
For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when  
choosing components: all components in the power supply must withstand this voltage.  
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current  
absorption peaks, a 100μF tantalum capacitor is usually suited.  
Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at  
least 10V.  
For Car applications a spike protection diode should be inserted close to the power input, in order  
to clean the supply from spikes.  
A protection diode should be inserted close to the power input, in order to save the GE864-  
QUAD/PY from power polarity inversion. This can be the same diode as for spike protection.  
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An example of switching regulator with 12V input is in the below schematic (it is split in 2 parts):  
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5.2.1.3 Battery Source Power Supply Design Guidelines  
The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is  
4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit  
GE864-QUAD/PY module.  
The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE USED  
DIRECTLY since their maximum voltage can rise over the absolute maximum voltage for the  
GE864-QUAD/PY and damage it.  
NOTE: DON’T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with GE864-QUAD/PY. Their  
use can lead to overvoltage on the GE864-QUAD/PY and damage it. USE ONLY Li-Ion battery types.  
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current  
absorption peaks, a 100μF tantalum capacitor is usually suited.  
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.  
A protection diode should be inserted close to the power input, in order to save the GE864-  
QUAD/PY from power polarity inversion. Otherwise the battery connector should be done in a way  
to avoid polarity inversions when connecting the battery.  
The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the  
suggested capacity is from 500mAh to 1000mAh.  
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5.2.1.4 Battery Charge control Circuitry Design Guidelines  
The charging process for Li-Ion Batteries can be divided into 4 phases:  
Qualification and trickle charging  
Fast charge 1 – constant current  
Final charge – constant voltage or pulsed charging  
Maintenance charge  
The qualification process consists in a battery voltage measure, indicating roughly its charge status. If  
the battery is deeply discharged, that means its voltage is lower than the trickle charging threshold,  
then the charge must start slowly possibly with a current limited pre-charging process where the  
current is kept very low with respect to the fast charge value: the trickle charging.  
During the trickle charging the voltage across the battery terminals rises; when it reaches the fast  
charge threshold level the charging process goes into fast charge phase.  
During the fast charge phase the process proceeds with a current limited charging; this current limit  
depends on the required time for the complete charge and from the battery pack capacity. During this  
phase the voltage across the battery terminals still raises but at a lower rate.  
Once the battery voltage reaches its maximum voltage then the process goes into its third state: Final  
charging. The voltage measure to change the process status into final charge is very important. It  
must be ensured that the maximum battery voltage is never exceeded, otherwise the battery may be  
damaged and even explode. Moreover for the constant voltage final chargers, the constant voltage  
phase (final charge) must not start before the battery voltage has reached its maximum value,  
otherwise the battery capacity will be highly reduced.  
The final charge can be of two different types: constant voltage or pulsed. GE864-QUAD/PY uses  
constant voltage.  
The constant voltage charge proceeds with a fixed voltage regulator (very accurately set to the  
maximum battery voltage) and hence the current will decrease while the battery is becoming charged.  
When the charging current falls below a certain fraction of the fast charge current value, then the  
battery is considered fully charged, the final charge stops and eventually starts the maintenance.  
The pulsed charge process has no voltage regulation, instead the charge continues with pulses.  
Usually the pulse charge works in the following manner: the charge is stopped for some time, let’s say  
few hundreds of ms, then the battery voltage will be measured and when it drops below its maximum  
value a fixed time length charging pulse is issued. As the battery approaches its full charge the off  
time will become longer, hence the duty-cycle of the pulses will decrease. The battery is considered  
fully charged when the pulse duty-cycle is less than a threshold value, typically 10%, the pulse charge  
stops and eventually the maintenance starts.  
The last phase is not properly a charging phase, since the battery at this point is fully charged and the  
process may stop after the final charge. The maintenance charge provides an additional charging  
process to compensate for the charge leak typical of a Li-Ion battery. It is done by issuing pulses with  
a fixed time length, again few hundreds of ms, and a duty-cycle around 5% or less.  
This last phase is not implemented in the GE864-QUAD/PY internal charging algorithm, so that the  
battery once charged is left discharging down to a certain threshold so that it is cycled from full charge  
to slight discharge even if the battery charger is always inserted. This guarantees that anyway the  
remaining charge in the battery is a good percentage and that the battery is not damaged by keeping it  
always fully charged (Li-Ion rechargeable battery usually deteriorate when kept fully charged).  
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Last but not least, in some applications it is highly desired that the charging process restarts when the  
battery is discharged and its voltage drops below a certain threshold, GE864-QUAD/PY internal  
charger does it.  
As you can see, the charging process is not a trivial task to be done; moreover all these operations  
should start only if battery temperature is inside a charging range, usually 5°C – 45°C.  
The GE864-QUAD/PY measures the temperature of its internal component, in order to satisfy this last  
requirement, it’s not exactly the same as the battery temperature but in common application the two  
temperature should not differ too much and the charging temperature range should be guaranteed.  
NOTE: For all the threshold voltages, inside the GE864-QUAD/PY all thresholds are fixed in order to  
maximize Li-Ion battery performances and do not need to be changed.  
NOTE: In this application the battery charger input current must be limited to less than 400mA. This can  
be done by using a current limited wall adapter as the power source.  
NOTE: When starting the charger from Module powered off the startup will be in CFUN4; to activate the  
normal mode a command AT+CFUN=1 has to be provided. This is also possible using the POWER ON.  
There is also the possibility to activate the normal mode using the ON_OFF* signal.  
In this case, when HW powering off the module with the same line (ON_OFF*) and having the charger still  
connected, the module will go back to CFUN4.  
NOTE: It is important having a 100uF Capacitor to VBAT in order to avoid instability of the charger circuit  
if the battery is accidentally disconnected during the charging activity.  
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5.2.2 Thermal Design Guidelines  
The thermal design for the power supply heat sink should be done with the following specifications:  
Average current consumption during transmission @PWR level max:  
Average current consumption during transmission @ PWR level min:  
Average current during Power Saving (CFUN=5):  
500mA  
100mA  
4mA  
Average current during idle (Power Saving disabled)  
24mA  
NOTE: The average consumption during transmissions depends on the power level at which the device is requested  
to transmit by the network. The average current consumption hence varies significantly.  
Considering the very low current during idle, especially if Power Saving function is enabled, it is  
possible to consider from the thermal point of view that the device absorbs current significantly only  
during calls.  
If we assume that the device stays into transmission for short periods of time (let’s say few minutes)  
and then remains for a quite long time in idle (let’s say one hour), then the power supply has always  
the time to cool down between the calls and the heat sink could be smaller than the calculated one for  
500mA maximum RMS current, or even could be the simple chip package (no heat sink).  
Moreover in the average network conditions the device is requested to transmit at a lower power level  
than the maximum and hence the current consumption will be less than the 500mA, being usually  
around 150mA.  
For these reasons the thermal design is rarely a concern and the simple ground plane where the  
power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating.  
For the heat generated by the GE864-QUAD / PY, you can consider it to be during transmission 1W  
max during CSD/VOICE calls and 2W max during class10 GPRS upload.  
This generated heat will be mostly conducted to the ground plane under the GE864-QUAD / PY; you  
must ensure that your application can dissipate it.  
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5.2.3 Power Supply PCB layout Guidelines  
As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the  
output to cut the current peaks and a protection diode on the input to protect the supply from spikes  
and polarity inversion. The placement of these components is crucial for the correct working of the  
circuitry. A misplaced component can be useless or can even decrease the power supply  
performances.  
The Bypass low ESR capacitor must be placed close to the Telit GE864-QUAD / PY power input  
pads or in the case the power supply is a switching type it can be placed close to the inductor to  
cut the ripple provided the PCB trace from the capacitor to the GE864-QUAD / PY is wide enough  
to ensure a dropless connection even during the 2A current peaks.  
The protection diode must be placed close to the input connector where the power source is  
drained.  
The PCB traces from the input connector to the power regulator IC must be wide enough to ensure  
no voltage drops occur when the 2A current peaks are absorbed. Note that this is not made in  
order to save power loss but especially to avoid the voltage drops on the power line at the current  
peaks frequency of 216 Hz that will reflect on all the components connected to that supply,  
introducing the noise floor at the burst base frequency. For this reason while a voltage drop of 300-  
400 mV may be acceptable from the power loss point of view, the same voltage drop may not be  
acceptable from the noise point of view. If your application doesn’t have audio interface but only  
uses the data feature of the Telit GE864-QUAD / PY, then this noise is not so disturbing and power  
supply layout design can be more forgiving.  
The PCB traces to the GE864-QUAD / PY and the Bypass capacitor must be wide enough to  
ensure no significant voltage drops occur when the 2A current peaks are absorbed. This is for the  
same reason as previous point. Try to keep this trace as short as possible.  
The PCB traces connecting the Switching output to the inductor and the switching diode must be  
kept as short as possible by placing the inductor and the diode very close to the power switching  
IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the  
switching frequency (100-500 kHz usually).  
The use of a good common ground plane is suggested.  
The placement of the power supply on the board should be done in such a way to guarantee that  
the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry  
as the microphone amplifier/buffer or earphone amplifier.  
The power supply input cables should be kept separate from noise sensitive lines such as  
microphone/earphone cables.  
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6 Antenna  
The antenna connection and board layout design are the most important part in the full product design  
and they strongly reflect on the product overall performances, hence read carefully and follow the  
requirements and the guidelines for a proper design.  
6.1 GSM Antenna Requirements  
As suggested on the Product Description the antenna and antenna line on PCB for a Telit GE864-  
QUAD / PY device shall fulfill the following requirements:  
When using the Telit GE864-QUAD / PY, since there’s no antenna connector on the module, the  
antenna must be connected to the GE864-QUAD / PY through the PCB with the antenna pad.  
In the case that the antenna is not directly developed on the same PCB, hence directly connected at  
the antenna pad of the GE864-QUAD / PY, then a PCB line is needed in order to connect with it or  
with its connector.  
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This line of transmission shall fulfill the following requirements:  
ANTENNA LINE ON PCB REQUIREMENTS  
Impedance  
50 ohm  
Max Attenuation  
0,3 dB  
No coupling with other signals allowed  
Cold End (Ground Plane) of antenna shall be equipotential to  
the GE864-QUAD / PY ground pins  
Furthermore if the device is developed for the US market and/or Canada market, it shall comply to the  
FCC and/or IC approval requirements:  
This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter  
must be installed to provide a separation distance of at least 20 cm from all persons and must not be  
co-located or operating in conjunction with any other antenna or transmitter. End-Users must be  
provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators  
must ensure that the end user has no manual instructions to remove or install the GE864-QUAD / PY  
module. Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed  
operating configurations.  
6.2 GSM Antenna – PCB line Guidelines  
Ensure that the antenna line impedance is 50 ohm;  
Keep the antenna line on the PCB as short as possible, since the antenna line loss shall be less  
than 0,3 dB;  
Antenna line must have uniform characteristics, constant cross section, avoid meanders and  
abrupt curves;  
Keep, if possible, one layer of the PCB used only for the Ground plane;  
Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having other  
signal tracks facing directly the antenna line track;  
The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by  
placing vias once per 2mm at least;  
Place EM noisy devices as far as possible from GE864-QUAD / PY antenna line;  
Keep the antenna line far away from the GE864-QUAD / PY power supply lines;  
If you have EM noisy devices around the PCB hosting the GE864-QUAD / PY, such as fast  
switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB  
and surround it with Ground planes, or shield it with a metal frame cover.  
If you don’t have EM noisy devices around the PCB of GE864-QUAD / PY, by using a strip-line on  
the superficial copper layer for the antenna line, the line attenuation will be lower than a buried  
one;  
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6.3 GSM Antenna – Installation Guidelines  
Install the antenna in a place covered by the GSM signal.  
The Antenna must be installed to provide a separation distance of at least 20 cm from all persons  
and must not be co-located or operating in conjunction with any other antenna or transmitter;  
Antenna shall not be installed inside metal cases  
Antenna shall be installed also according Antenna manufacturer instructions.  
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7 Logic level specifications  
Where not specifically stated, all the interface circuits work at 2.8V CMOS logic levels. The following  
table shows the logic level specifications used in the Telit GE864-QUAD / PY interface circuits:  
Absolute Maximum Ratings –Not Functional  
Parameter  
Min  
Max  
Input level on any  
digital pin when on  
Input voltage on analog  
pins when on  
-0.3V  
+3.6V  
-0.3V  
+3.0 V  
Operating Range – Interface levels (2.8V CMOS)  
Level  
Min  
2.1V  
0V  
Max  
3.3V  
0.5V  
3.0V  
0.35V  
Input high level  
Input low level  
Output high level  
Output low level  
2.2V  
0V  
For 1.8V signals:  
Operating Range – Interface levels (1.8V CMOS)  
Level  
Min  
1.6V  
0V  
Max  
3.3V  
0.4V  
2.2V  
0.35V  
Input high level  
Input low level  
Output high level  
Output low level  
1,65V  
0V  
Current characteristics  
Level  
Typical  
Output Current  
Input Current  
1mA  
1uA  
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7.1 Reset signal  
Signal  
Function  
Phone reset  
I/O  
Bga Ball  
RESET  
I
A2  
RESET is used to reset the GE864-QUAD / PY modules. Whenever this signal is pulled low, the GE864-  
QUAD / PY is reset. When the device is reset it stops any operation. After the release of the reset  
GE864-QUAD / PY is unconditionally shut down, without doing any detach operation from the network  
where it is registered. This behaviour is not a proper shut down because any GSM device is requested  
to issue a detach request on turn off. For this reason the Reset signal must not be used to normally  
shutting down the device, but only as an emergency exit in the rare case the device remains stuck  
waiting for some network response.  
The RESET is internally controlled on start-up to achieve always a proper power-on reset sequence,  
so there’s no need to control this pin on start-up. It may only be used to reset a device already on that  
is not responding to any command.  
NOTE: do not use this signal to power off the GE864-QUAD / PY. Use the ON/OFF signal to perform this  
function or the AT#SHDN command.  
Reset Signal Operating levels:  
Signal  
Min  
2.0V*  
0V  
Max  
2.2V  
0.2V  
RESET Input high  
RESET Input low  
this signal is internally pulled up so the pin can be left floating if not used.  
If unused, this signal may be left unconnected. If used, then it must always be connected with an  
open collector transistor, to permit to the internal circuitry the power on reset and under voltage  
lockout functions.  
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8 Serial Ports  
The serial port on the Telit GE864-QUAD/PY is the core of the interface between the module and  
OEM hardware.  
2 serial ports are available on the module:  
MODEM SERIAL PORT  
MODEM SERIAL PORT 2 (DEBUG)  
8.1 MODEM SERIAL PORT  
Several configurations can be designed for the serial port on the OEM hardware, but the most  
common are:  
RS232 PC com port  
Micro controller UART @ 2.8V – 3V (Universal Asynchronous Receive Transmit)  
Micro controller UART@ 5V or other voltages different from 2.8V  
Depending from the type of serial port on the OEM hardware a level translator circuit may be needed  
to make the system work. The only configuration that doesn’t need a level translation is the 2.8V  
UART.  
The serial port on the GE864-QUAD/PY is a +2.8V UART with all the 7 RS232 signals. It differs from  
the PC-RS232 in the signal polarity (RS232 is reversed) and levels. The levels for the GE864-  
QUAD/PY UART are the CMOS levels:  
Absolute Maximum Ratings –Not Functional  
Parameter  
Min  
Max  
Input level on any  
digital pad when on  
Input voltage on  
-0.3V  
+3.6V  
-0.3V  
+3.0 V  
analog pads when on  
Operating Range – Interface levels (2.8V CMOS)  
Level  
Min  
2.1V  
0V  
Max  
3.3V  
0.5V  
3.0V  
0.35V  
Input high level VIH  
Input low level VIL  
Output high level VOH  
Output low level VOL  
2.2V  
0V  
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The signals of the GE864 serial port are:  
RS232 Pin  
Number  
Signal  
GE864-  
QUAD / PY  
Pad  
Name  
Usage  
Number  
1
2
3
4
5
DCD –  
dcd_uart  
RXD –  
tx_uart  
TXD –  
rx_uart  
DTR –  
dtr_uart  
GND  
D9  
Data Carrier Detect  
Transmit line *see Note  
Receive line *see Note  
Data Terminal Ready  
Ground  
Output from the GE864-QUAD / PY that indicates  
the carrier presence  
Output transmit line of GE864-QUAD / PY UART  
H8  
E7  
B7  
Input receive of the GE864-QUAD / PY UART  
Input to the GE864-QUAD / PY that controls the  
DTE READY condition  
A1,F1,H1,L1  
, H2, L2, J3,  
K3….  
ground  
6
7
8
9
DSR –  
dsr_uart  
RTS –  
rts_uart  
CTS –  
E11  
Data Set Ready  
Request to Send  
Clear to Send  
Output from the GE864-QUAD / PY that indicates  
the module is ready  
Input to the GE864-QUAD / PY that controls the  
Hardware flow control  
Output from the GE864-QUAD / PY that controls  
the Hardware flow control  
Output from the GE864-QUAD / PY that indicates  
the incoming call condition  
F7  
F6  
B6  
cts_uart  
RI – ri_uart  
Ring Indicator  
NOTE: According to V.24, RX/TX signal names are referred to the application side, therefore on  
the GE864 side these signal are on the opposite direction: TXD on the application side will be  
connected to the receive line (here named TXD/ rx_uart ) of the GE864 serial port and  
viceversa for RX.  
TIP: For a minimum implementation, only the TXD and RXD lines can be connected, the other  
lines can be left open provided a software flow control is implemented.  
TIP: In order to avoid noise or interferences on the RXD lines it is suggested to add a pull up  
resistor (100Kohm to 2.8V)  
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8.2 RS232 level translation  
In order to interface the Telit GE864 with a PC com port or a RS232 (EIA/TIA-232) application a level  
translator is required. This level translator must  
ƒ
ƒ
invert the electrical signal in both directions  
change the level from 0/3V to +15/-15V  
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on  
the RS232 side (EIA/TIA-562) , allowing for a lower voltage-multiplying ratio on the level translator.  
Note that the negative signal voltage must be less than 0V and hence some sort of level translation is  
always required.  
The simplest way to translate the levels and invert the signal is by using a single chip level translator.  
There are a multitude of them, differing in the number of driver and receiver and in the levels (be sure  
to get a true RS232 level translator not a RS485 or other standards).  
By convention the driver is the level translator from the 0-3V UART level to the RS232 level, while the  
receiver is the translator from RS232 level to 0-3V UART.  
In order to translate the whole set of control lines of the UART you will need:  
ƒ
ƒ
5 driver  
3 receiver  
NOTE: The digital input lines working at 2.8VCMOS have an absolute maximum input voltage  
of 3,75V; therefore the level translator IC shall not be powered by the +3.8V supply of the  
module. Instead it shall be powered from a +2.8V / +3.0V (dedicated) power supply.  
This is because in this way the level translator IC outputs on the module side (i.e. GE864  
inputs) will work at +3.8V interface levels, stressing the module inputs at its maximum input  
voltage.  
This can be acceptable for evaluation purposes, but not on production devices.  
NOTE: In order to be able to do in circuit reprogramming of the GE864 firmware, the serial port  
on the Telit GE864 shall be available for translation into RS232 and either it’s controlling device  
shall be placed into tristate, disconnected or as a gateway for the serial data when module  
reprogramming occurs.  
Only RXD, TXD, GND and the On/off module turn on pad are required to the reprogramming of  
the module, the other lines are unused.  
All applicator shall include in their design such a way of reprogramming the GE864.  
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An example of level translation circuitry of this kind is:  
The RS232 serial port lines are usually connected to a DB9 connector with the following layout:  
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8.3 5V UART level translation  
If the OEM application uses a microcontroller with a serial port (UART) that works at a voltage different  
from 2.8 – 3V, then a circuitry has to be provided to adapt the different levels of the two sets of  
signals. As for the RS232 translation there are a multitude of single chip translators. For example a  
possible translator circuit for a 5V TRANSMITTER/RECEIVER can be:  
TO TELIT  
MODULE  
TIP: This logic IC for the level translator and 2.8V pull-ups (not the 5V one) can be powered directly from VAUX line  
of the GE864-QUAD / PY. Note that the TC7SZ07AE has open drain output; therefore the resistor R2 is mandatory.  
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NOTE: The UART input line TXD (rx_uart) of the GE864-QUAD / PY is NOT internally pulled up with a resistor, so  
there may be the need to place an external 47Kpull-up resistor, either the DTR (dtr_uart) and RTS (rts_uart) input  
lines are not pulled up internally, so an external pull-up resistor of 47Kmay be required.  
A power source of the internal interface voltage corresponding to the 2.8VCMOS high level is  
available at the VAUX pin on the connector,  
A maximum of 9 resistors of 47 Kpull-up can be connected to the PWRMON pin, provided no other  
devices are connected to it and the pulled-up lines are GE864-QUAD / PY input lines connected to  
open collector outputs in order to avoid latch-up problems on the GE864-QUAD / PY.  
Care must be taken to avoid latch-up on the GE864-QUAD / PY and the use of this output line to  
power electronic devices shall be avoided, especially for devices that generate spikes and noise such  
as switching level translators, micro controllers, failure in any of these condition can severely  
compromise the GE864-QUAD / PY functionality.  
NOTE: The input lines working at 2.8VCMOS can be pulled-up with 47Kresistors that can be connected directly to  
the VAUX line provided they are connected as in this example.  
In case of reprogramming of the module has to be considered the use of the RESET line to start correctly the  
activity.  
The preferable configuration is having an external supply for the buffer.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
9 Audio Section Overview  
The Base Band Chip of the GE864-QUAD / PY Telit Module provides two different audio blocks; both  
in transmit (Uplink) and in receive (Downlink) direction:  
MT lines” should be used for handset function,  
HF lines” is suited for hands –free function (car kit).  
These two blocks can be active only one at a time, selectable by AXE hardware line or by AT  
command. The audio characteristics are equivalent in transmit blocks, but are different in the receive  
ones and this should be kept in mind when designing.  
EXTERNAL  
AMPLIFIER  
3,3mV  
0,33mV  
rms  
rms  
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GE864 Hardware User Guide  
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9.1 INPUT LINES (Microphone)  
9.1.1 Short description  
The Telit GE864-QUAD / PY provides two audio paths in transmit section. Only one of the two paths  
can be active at a time, selectable by AXE hardware line or by AT command.  
You must keep in mind the different audio characteristics of the transmit blocks when designing:  
The MIC_MTaudio path should be used for handset function, while the “MIC_HFaudio path is  
suited for hands-free function (car kit).  
TIP: being the microphone circuitry the more noise sensitive, its design and layout must be  
done with particular care. Both microphone paths are balanced and the OEM circuitry should  
be balanced designed to reduce the common mode noise typically generated on the ground  
plane. However also an unbalanced circuitry can be used for particular OEM application needs.  
TIP: due to the difference in the echo canceller type, the “Mic_MT” audio path is suited for  
Handset applications, while the “Mic_HF”audio path is suited for hands-free function (car kit).  
The Earphone applications should be made using the “Mic_HF” audio path but DISABLING the  
echo canceller by software AT command. If the echo canceller is left active with the Earphone,  
then some echo might be introduced by the echo cancel algorithm.  
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9.1.2 Input Lines Characteristics  
“MIC_MT” 1st differential microphone path  
Line Coupling  
AC*  
Line Type  
Balanced  
100nF  
50kΩ  
Coupling capacitor  
Differential input resistance  
Differential input voltage  
Microphone nominal sensitivity  
Analog gain suggested  
Echo canceller type  
1,03Vpp (365mVrms  
-45 dBVrms/Pa  
+ 20dB  
)
Handset  
“MIC_HF” 2nd differential microphone path  
Line Coupling  
AC*  
Balanced  
Line Type  
Coupling capacitor  
100nF  
Differential input resistance  
Differential input voltage  
Microphone nominal sensitivity  
Analog gain suggested  
Echo canceller type  
50kΩ  
65mVpp (23mVrms  
-45 dBVrms/Pa  
+10dB  
)
Car kit hands-free  
(*) WARNING: AC means that the signals from microphone has to be connected to input lines of the  
module by a CAPACITOR, which value must be 100nF. Not respecting this constraint, the input stage  
will be damaged.  
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9.2 OUTPUT LINES (Speaker)  
9.2.1 Short description  
The Telit GE864-QUAD / PY provides two audio paths in receive section. Only one of the two paths  
can be active at a time, selectable by AXE hardware line or by AT command.  
You must keep in mind the different audio characteristics of the receive blocks when designing:  
Æ the EAR_MTlines EPN1 and EPP1 are the Differential Line-Out Drivers ; they can drive an  
external amplifier or directly a 16 earpiece at –12dBFS (*) ;  
Æ the “EAR_HFlines EPPA1_2 and EPPA2 are the Fully Differential Power Buffers ; they can  
directly drive a 16speaker in differential (balanced) or single ended (unbalanced) operation mode .  
(*) FS : acronym of Full Scale. It is equal to 0dB, the maximum Hardware Analog Receive Gain of  
BaseBand Chip.  
The EAR_MTaudio path should be used for handset function, while the “EAR_HFaudio path is  
suited for hands-free function (car kit).  
Both receiver outputs are B.T.L. type (Bridged Tie Load) and the OEM circuitry shall be designed  
bridged to reduce the common mode noise typically generated on the ground plane and to get the  
maximum power output from the device; however also a single ended circuitry can be designed for  
particular OEM application needs.  
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9.2.2 Output Lines Characteristics  
“EAR_MT” Differential Line-out Drivers Path  
Line Coupling  
DC  
Line Type  
Bridged  
14 Ω  
Output load resistance  
Internal output resistance  
Signal bandwidth  
4 (typical)  
150 – 4000 Hz @ -3 dB  
328mVrms /16 @ -12dBFS  
- 2 dB  
Differential output voltage  
SW volume level step  
Number of SW volume steps  
10  
“EAR_HF” Power Buffers Path  
Line Coupling  
DC  
Bridged  
Line Type  
Output load resistance  
Internal output resistance  
Signal bandwidth  
14 Ω  
4 ( >1,7 )  
150 – 4000 Hz @ -3 dB  
1310 mVrms (typ, open circuit)  
656 mVrms (typ, open circuit)  
- 2 dB  
Max Differential output voltage  
Max Single Ended output voltage  
SW volume level step  
Number of SW volume steps  
10  
For more detailed information about audio please refer to the Audio Settings Application Note  
80000NT10007a.  
9.3 External SIM Holder Implementation  
Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a)  
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10 General Purpose I/O  
The general purpose I/O pads can be configured to act in three different ways:  
input  
output  
alternate function (internally controlled)  
Input pads can only be read and report the digital value (high or low) present on the pad at the read  
time; output pads can only be written or queried and set the value of the pad output; an alternate  
function pad is internally controlled by the GE864-QUAD / PY firmware and acts depending on the  
function implemented. For Logic levels please refer to chapter 7.  
The following GPIO are available on the GE864-QUAD and GE864-PY:  
Input /  
output  
current  
State  
during  
Reset  
Default  
State  
Ball  
Signal  
I/O  
Function  
Type  
ON_OFF  
state  
Note  
C1  
E6  
C2  
TGPIO_01  
TGPIO_02  
TGPIO_03  
I/O GPIO01 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO02 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO03 Configurable GPIO CMOS 2.8V 1uA / 1mA  
INPUT  
INPUT  
INPUT  
0
0
0
Alternate function  
(JDR)  
Alternate function  
(RF Transmission  
Control)  
B3  
TGPIO_04  
I/O GPIO04 Configurable GPIO CMOS 2.8V 1uA / 1mA  
INPUT  
0
Alternate function  
(RFTXMON)  
Alternate function  
(ALARM)  
Alternate function  
(BUZZER)  
K8  
B5  
L9  
TGPIO_05  
TGPIO_06  
TGPIO_07  
I/O GPIO05 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO06 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO07 Configurable GPIO CMOS 2.8V 1uA / 1mA  
INPUT  
INPUT  
INPUT  
0
Pict 01  
0
1
K11  
C9  
H3  
D1  
G4  
K10  
B4  
F5  
TGPIO_08  
TGPIO_09  
TGPIO_10  
TGPIO_11  
TGPIO_12  
TGPIO_13  
TGPIO_14  
TGPIO_15  
TGPIO_16  
TGPIO_17  
TGPIO_18  
TGPIO_19  
TGPIO_20  
TGPIO_21  
I/O GPIO08 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO09 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO10 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO11 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO12 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO13 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO14 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO15 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO16 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO17 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO18 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO19 Configurable GPIO CMOS 2.8V 1uA / 1mA  
I/O GPIO20 Configurable GPIO CMOS 2.8V 1uA / 1mA  
INPUT  
INPUT  
INPUT  
INPUT  
INPUT  
INPUT  
INPUT  
INPUT  
INPUT  
INPUT  
INPUT  
INPUT  
INPUT  
INPUT  
0
0
0
0
0
0
0
0
0
0
0
0
0
1
H6  
H5  
K7  
B1  
C3  
L10  
I/O GPIO21 Configurable GPIO CMOS 2.8V 1uA / 1mA  
CMOS 1.8V  
E8  
TGPIO_22  
I/O GPIO22 Configurable GPIO  
(not 2.8V  
!!)  
1uA / 1mA  
INPUT  
0
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Not all GPIO pads support all these three modes:  
GPIO2 supports all three modes and can be input, output, Jamming Detect Output (Alternate  
function)  
GPIO4 supports all three modes and can be input, output, RF Transmission Control (Alternate  
function)  
GPIO5 supports all three modes and can be input, output, RFTX monitor output (Alternate  
function)  
GPIO6 supports all three modes and can be input, output, alarm output (Alternate function)  
GPIO7 supports all three modes and can be input, output, buzzer output (Alternate function)  
pict01  
ch1: ON_OFF (2sec)  
ch2: GPIO 06 [ bis ]  
GE864  
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10.1 GPIO Logic levels  
Where not specifically stated, all the interface circuits work at 2.8V CMOS logic levels.  
The following table shows the logic level specifications used in the GE864-QUAD/PY interface circuits:  
Absolute Maximum Ratings –Not Functional  
Parameter  
Min  
Max  
Input level on any -0.3V  
digital pin when on  
+3.6V  
Input voltage on -0.3V  
analog pins when on  
+3.0 V  
Operating Range – Interface levels (2.8V CMOS)  
Level  
Min  
2.1V  
0V  
Max  
Input high level  
Input low level  
Output high level  
Output low level  
3.3V  
0.5V  
3.0V  
0.35V  
2.2V  
0V  
For 1.8V signals:  
Operating Range – Interface levels (1.8V CMOS)  
Level  
Min  
1.6V  
0V  
Max  
Input high level  
Input low level  
Output high level  
Output low level  
3.3V  
0.4V  
2.2V  
0.35V  
1,65V  
0V  
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10.2 Using a GPIO Pad as INPUT  
The GPIO pads, when used as inputs, can be connected to a digital output of another device and  
report its status, provided this device has interface levels compatible with the 2.8V CMOS levels of the  
GPIO.  
If the digital output of the device to be connected with the GPIO input pad has interface levels different  
from the 2.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to  
2.8V.  
10.3 Using a GPIO Pad as OUTPUT  
The GPIO pads, when used as outputs, can drive 2.8V CMOS digital devices or compatible hardware.  
When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be  
omitted.  
VDD  
Q1  
GPIO7  
Q2  
Base circuit of a push-pull stage  
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10.4 Using the RF Transmission Control GPIO4  
The GPIO4 pin, when configured as RF Transmission Control Input, permits to disable the Transmitter  
when the GPIO is set to Low by the application.  
In the design is necessary to add a pull up resistor (47K to PWRMON).  
10.5 Using the RFTXMON Output GPIO5  
The GPIO5 pin, when configured as RFTXMON Output, is controlled by the GE864-QUAD / PY  
module and will rise when the transmitter is active and fall after the transmitter activity is completed.  
For example, if a call is started, the line will be HIGH during all the conversation and it will be again  
LOW after hanged up.  
The line rises up 300ms before first TX burst and will became again LOW from 500ms to 1sec after  
last TX burst.  
10.6 Using the Alarm Output GPIO6  
The GPIO6 pad, when configured as Alarm Output, is controlled by the GE864-QUAD / PY module  
and will rise when the alarm starts and fall after the issue of a dedicated AT command.  
This output can be used to power up the GE864-QUAD / PY controlling micro controller or application  
at the alarm time, giving you the possibility to program a timely system wake-up to achieve some  
periodic actions and completely turn off either the application and the GE864-QUAD / PY during sleep  
periods, dramatically reducing the sleep consumption to few μA.  
In battery-powered devices this feature will greatly improve the autonomy of the device.  
NOTE: During RESET the line is set to HIGH logic level.  
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GE864 Hardware User Guide  
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10.7 Using the Buzzer Output GPIO7  
As Alternate Function, the GPIO7 is controlled by the firmware that depends on the function  
implemented internally.  
This setup places always the GPIO7 pin in OUTPUT direction and the corresponding function must be  
activated properly by AT#SRP command (refer to AT commands specification).  
Also in this case, the dummy value for the pin state can be both 0” or 1”.  
Send the command  
AT#GPIO=7, 1, 2<cr>:  
Wait for response  
OK  
Send the command  
AT#SRP=3  
The GPIO7 pin will be set as Alternate Function pin with its dummy logic status set to HIGH value.  
The "Alternate function” permits your application to easily implement Buzzer feature with some small  
hardware extension of your application as shown in the next sample figure.  
TR2  
+V buzzer  
SMBT2907A  
R1  
4,7K  
D1  
D1N4148  
C1  
33pF  
+
-
R2  
1K  
GPIO7  
TR1  
BCR141W  
Example of Buzzer’s driving circuit.  
NOTE: To correctly drive a buzzer, a driver must be provided; its characteristics depend on the Buzzer and for them  
refer to your buzzer vendor.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
10.8 Magnetic Buzzer Concepts  
10.8.1 Short Description  
A magnetic Buzzer is a sound-generating device with a coil located in the magnetic circuit consisting  
of a permanent magnet, an iron core, a high permeable metal disk, and a vibrating diaphragm.  
Drawing of the Magnetic Buzzer  
The disk and diaphragm are attracted to the core by the magnetic field. When an oscillating signal is  
moved through the coil, it produces a fluctuating magnetic field, which vibrates the diaphragm at a  
frequency of the drive signal. Thus the sound is produced relative to the frequency applied.  
Diaphragm movement  
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GE864 Hardware User Guide  
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10.8.2 Frequency Behaviour  
The frequency behavior represents the effectiveness of the reproduction of the applied signals.  
Because its performance is related to a square driving waveform (whose amplitude varies from  
0V to Vpp), if you modify the waveform (e.g. from square to sinus) the frequency response will  
change.  
10.8.3 Power Supply Influence  
Applying a signal whose amplitude is different from that suggested by manufacturer, the  
performance change following the rule “if resonance frequency fo increases, amplitude  
decreases”.  
Because of resonance frequency depends from acoustic design, lowering the amplitude of the  
driving signal the response bandwidth tends to become narrow, and vice versa.  
Summarizing:  
Vpp Æ fo ↓  
Vpp Æ fo ↑  
The risk is that the fo could easily fall outside of new bandwidth; consequently the SPL could  
be much lower than the expected.  
10.8.4 Warning  
It is very important to respect the sense of the applied voltage: never apply to the "-" pin a  
voltage more positive than "+" pin : if this happens, the diaphragm vibrates in the opposite  
sense with a high probability to be expelled from its physical position , damaging the device  
forever .  
10.8.5 Working Current Influence  
In the component data sheet you will find the value of MAX CURRENT : this represents the  
maximum average current that can flow at nominal voltage without current limitation .  
In other words it is not the peak current, which could be twice or three times higher.  
If driving circuitry does not support these peak values , the SPL will never reach the declared  
level or the oscillations will stop.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
10.9 Using the Temperature Monitor Function  
10.9.1 Short Description  
The Temperature Monitor is a function of the module that permits to control its internal  
temperature and if properly set (see the #TEMPMON command on AT Interface guide) it raise  
to High Logic level a GPIO when the maximum temperature is reached.  
10.9.2 Allowed GPIO  
The AT#TEMPMON set command could be used with one of the following GPIO:  
Input /  
Ball  
Signal  
Function  
Type  
output  
Note  
current  
C1  
C2  
K11  
C9  
H3  
D1  
G4  
K10  
B4  
F5  
TGPIO_01  
TGPIO_03  
TGPIO_08  
TGPIO_09  
TGPIO_10  
TGPIO_11  
TGPIO_12  
TGPIO_13  
TGPIO_14  
TGPIO_15  
TGPIO_16  
TGPIO_17  
TGPIO_18  
TGPIO_19  
TGPIO_20  
GPIO01 Configurable GPIO  
GPIO03 Configurable GPIO  
GPIO08 Configurable GPIO  
GPIO09 Configurable GPIO  
GPIO10 Configurable GPIO  
GPIO11 Configurable GPIO  
GPIO12 Configurable GPIO  
GPIO13 Configurable GPIO  
GPIO14 Configurable GPIO  
GPIO15 Configurable GPIO  
GPIO16 Configurable GPIO  
GPIO17 Configurable GPIO  
GPIO18 Configurable GPIO  
GPIO19 Configurable GPIO  
GPIO20 Configurable GPIO  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
CMOS 2.8V  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
1uA / 1mA  
H6  
H5  
K7  
B1  
C3  
CMOS 1.8V  
(not 2.8V !!)  
E8  
TGPIO_22  
GPIO22 Configurable GPIO  
1uA / 1mA  
The set command could be used also with one of the following GPIO but in that case the  
alternate function is not usable:  
Input /  
Ball  
Signal  
Function  
Type  
output  
Note  
current  
E6  
B3  
TGPIO_02  
TGPIO_04  
GPIO02 Configurable GPIO  
GPIO04 Configurable GPIO  
CMOS 2.8V  
CMOS 2.8V  
1uA / 1mA  
Alternate function (JDR)  
Alternate function (RF  
Transmission Control)  
Alternate function  
(RFTXMON)  
1uA / 1mA  
K8  
L9  
TGPIO_05  
TGPIO_07  
GPIO05 Configurable GPIO  
GPIO07 Configurable GPIO  
CMOS 2.8V  
CMOS 2.8V  
1uA / 1mA  
1uA / 1mA  
Alternate function (BUZZER)  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
10.10  
Indication of network service availability  
The STAT_LED pin status shows information on the network service availability and Call status.  
In the GE864 modules, the STAT_LED usually needs an external transistor to drive an external LED.  
Therefore, the status indicated in the following table is reversed with respect to the pin status.  
LED status  
Device Status  
Permanently off  
Device off  
Fast blinking  
(Period 1s, Ton 0,5s)  
Net search / Not registered /  
turning off  
Slow blinking  
Registered full service  
(Period 3s, Ton 0,3s)  
Permanently on  
a call is active  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
10.11  
RTC Bypass out  
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital  
part, allowing having only RTC going on when all the other parts of the device are off.  
To this power output a backup capacitor can be added in order to increase the RTC autonomy during  
power off of the battery. NO Devices must be powered from this pin.  
10.12  
VAUX1 power output  
A regulated power supply output is provided in order to supply small devices from the module.  
This output is active when the module is ON and goes OFF when the module is shut down.  
The operating range characteristics of the supply are:  
Operating Range – VAUX1 power supply  
Min  
Typical  
Max  
2.95V  
100mA  
2.2μF  
Output voltage  
Output current  
2.75V  
2.85V  
Output bypass capacitor  
(inside the module)  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
11 DAC and ADC section  
11.1 DAC Converter  
11.1.1 Description  
The GE864-QUAD / PY module provides a Digital to Analog Converter. The signal (named  
DAC_OUT) is available on BGA Ball C7 of the GE864-QUAD / PY module and on pin 17 of PL102 on  
EVK2 Board (CS1152).  
The on board DAC is a 10-bit converter, able to generate a analogue value based a specific input in  
the range from 0 up to 1023. However, an external low-pass filter is necessary  
Min  
0
0
Max  
2,6  
1023  
Units  
Volt  
Steps  
Voltage range (filtered)  
Range  
The precision is 10 bits so, if we consider that the maximum voltage is 2V, the integrated voltage could  
be calculated with the following formula:  
Integrated output voltage = 2 * value / 1023  
DAC_OUT line must be integrated (for example with a low band pass filter) in order to obtain an  
analog voltage.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
11.1.2 Enabling DAC  
An AT command is available to use the DAC function.  
The command is AT#DAC[=<enable>[,<value>]]  
<value> - scale factor of the integrated output voltage (0..1023 – 10 bit precision)  
it must be present if <enable>=1  
Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.  
NOTE: The DAC frequency is selected internally. D/A converter must not be used during  
POWERSAVING.  
11.1.3 Low Pass Filter Example  
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GE864 Hardware User Guide  
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11.2 ADC Converter  
11.2.1 Description  
The on board A/D are 11-bit converter. They are able to read a voltage level in the range of 0÷2 volts  
applied on the ADC pin input, store and convert it into 11 bit word.  
Min  
0
-
Max  
2
11  
Units  
Volt  
bits  
Input Voltage range  
AD conversion  
Resolution  
-
< 1  
mV  
The GE864-QUAD / PY module provides 3 Analog to Digital Converters. The input lines are:  
ADC_IN1 available on Ball J11 and Pin 19 of PL102 on EVK2 Board (CS1152).  
ADC_IN2 available on Ball H11 and Pin 20 of PL102 on EVK2 Board (CS1152).  
ADC_IN3 available on Ball G11 and Pin 21 of PL102 on EVK2 Board (CS1152).  
11.2.2 Using ADC Converter  
An AT command is available to use the ADC function.  
The command is AT#ADC=1,2  
The read value is expressed in mV  
Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
12 Mounting the GE864 on your Board  
12.1General  
The Telit GE864 modules have been designed in order to be compliant with a standard lead-free SMT  
process.  
12.1.1 Module finishing & dimensions  
Pin A1  
Lead-free Alloy:  
Surface finishing Sn/Ag/Cu for all solder pads  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
12.1.2 Recommended foot print for the application (GE864)  
Top View  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
12.1.3 Suggested Inhibit Area  
In order to easily rework the GE864 is suggested to consider on the application a 1.5mm Inhibit area  
around the module:  
1.5mm  
1.5mm  
Top View  
It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the  
application in direct contact with the module.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
12.1.4 Debug of the GE864 in production  
To test and debug the mounting of the GE864, we strongly recommend to foreseen test pads on the  
host PCB, in order to check the connection between the GE864 itself and the application and to test  
the performance of the module connecting it with an external computer. Depending by the customer  
application, these pads include, but are not limited to the following signals:  
TXD  
RXD  
ON/OFF  
RESET  
GND  
VBATT  
TX_TRACE  
RX_TRACE  
PWRMON  
12.1.5 Stencil  
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a  
thickness of stencil foil 120µm.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
12.1.6 PCB pad design  
Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.  
Recommendations for PCB pad dimensions  
Ball pitch [mm]  
2,5  
Solder resist opening diameter A [mm]  
Metal pad diameter B [mm]  
1,150  
1 ± 0.05  
Placement of microvias not covered by solder resist is not recommended inside the “Solder resist  
opening”, unless the microvia carry the same signal of the pad itself.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
Holes in pad are allowed only for blind holes and not for through holes.  
Recommendations for PCB pad surfaces:  
Finish  
Electro-less Ni / 3 –7 /  
Immersion Au 0.05 – 0.15  
Layer thickness [µm]  
Properties  
good solder ability protection, high  
shear force values  
The PCB must be able to resist the higher temperatures which are occurring at the lead-free process.  
This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder  
paste on the described surface plating is better compared to lead-free solder paste.  
12.1.7 Solder paste  
Lead free  
Solder paste  
Sn/Ag/Cu  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
12.1.8 GE864 Solder reflow  
The following is the recommended solder reflow profile  
Profile Feature  
Average ramp-up rate (TL to TP)  
Pb-Free Assembly  
3°C/second max  
Preheat  
8
8
Temperature Min (Tsmin) 150°C  
Temperature  
(Tsmax)  
Max 200°C  
60-180 seconds  
– Time (min to max) (ts)  
Tsmax to TL  
– Ramp-up Rate  
3°C/second max  
Time maintained above:  
8
Temperature (TL)  
217°C  
– Time (tL)  
60-150 seconds  
245 +0/-5°C  
10-30 seconds  
Peak Temperature (Tp)  
Time within 5°C of actual Peak  
Temperature (tp)  
Ramp-down Rate  
Time 25°C to Peak Temperature  
6°C/second max.  
8 minutes max.  
NOTE: All temperatures refer to topside of the package, measured on the package body surface.  
NOTE: GE864 module can accept only one reflow process  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
12.2 Packing system  
The Telit GE864 modules are packaged on trays of 20 pieces each. This is especially suitable for the  
GE864 according to SMT processes for pick & place movement requirements.  
Section A-A  
The size of the tray is: 329 x 176mm  
NOTE: These trays can withstand at the maximum temperature of 65° C.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
12.2.1 GE864 orientation on the tray  
12.2.2 Moisture sensibility  
The level of moisture sensibility of GE864 module is “3”, in according with standard IPC/JEDEC J-STD-  
020, take care all the relatives requirements for using this kind of components.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
13 Conformity Assessment Issues  
The GE864-QUAD / PY module is assessed to be conform to the R&TTE Directive as stand-alone  
products, so If the module is installed in conformance with Dai Telecom installation instructions require  
no further evaluation under Article 3.2 of the R&TTE Directive and do not require further involvement  
of a R&TTE Directive Notified Body for the final product.  
In all other cases, or if the manufacturer of the final product is in doubt then the equipment integrating  
the radio module must be assessed against Article 3.2 of the R&TTE Directive.  
In all cases assessment of the final product must be made against the Essential requirements of the  
R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, and any relevant Article 3.3  
requirements.  
The GE864-QUAD / PY module is conform with the following European Union Directives:  
R&TTE Directive 1999/5/EC (Radio Equipment & Telecommunications Terminal Equipments)  
Low Voltage Directive 73/23/EEC and product safety  
Directive 89/336/EEC for conformity for EMC  
In order to satisfy the essential requisite of the R&TTE 99/5/EC directive, the GE864-QUAD /  
PY module is compliant with the following standards:  
GSM (Radio Spectrum). Standard: EN 301 511 and 3GPP 51.010-1  
EMC (Electromagnetic Compatibility). Standards: EN 301 489-1 and EN 301 489-7  
LVD (Low Voltage Directive) Standards: EN 60 950  
In this document and the Hardware User Guide, Software User Guide all the information you may  
need for developing a product meeting the R&TTE Directive is included.  
The GE864-QUAD / PY module is conform with the following US Directives:  
Use of RF Spectrum. Standards: FCC 47 Part 24 (GSM 1900)  
EMC (Electromagnetic Compatibility). Standards: FCC47 Part 15  
To meet the FCC’s RF exposure rules and regulations:  
-
The system antenna(s) used for this transmitter must be installed to provide a separation  
distance of at least 20 cm from all the persons and must not be co-located or operating in  
conjunction with any other antenna or transmitter.  
-
-
The system antenna(s) used for this module must not exceed 3 dBi for mobile and fixed or mobile  
operating configurations.  
Users and installers must be provided with antenna installation instructions and transmitter  
operating conditions for satisfying RF exposure compliance.  
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify  
any regulatory questions and to have their complete product tested and approved for FCC  
compliance.  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
14 SAFETY RECOMMANDATIONS  
READ CAREFULLY  
Be sure the use of this product is allowed in the country and in the environment required. The use of  
this product may be dangerous and has to be avoided in the following areas:  
Where it can interfere with other electronic devices in environments such as hospitals, airports,  
aircrafts, etc  
Where there is risk of explosion such as gasoline stations, oil refineries, etc  
It is responsibility of the user to enforce the country regulation and the specific environment regulation.  
Do not disassemble the product; any mark of tampering will compromise the warranty validity.  
We recommend following the instructions of the hardware user guides for a correct wiring of the  
product. The product has to be supplied with a stabilized voltage source and the wiring has to be  
conforming to the security and fire prevention regulations.  
The product has to be handled with care, avoiding any contact with the pins because electrostatic  
discharges may damage the product itself. Same cautions have to be taken for the SIM, checking  
carefully the instruction for its use. Do not insert or remove the SIM when the product is in power  
saving mode.  
The system integrator is responsible of the functioning of the final product; therefore, care has to be  
taken to the external components of the module, as well as of any project or installation issue,  
because the risk of disturbing the GSM network or external devices or having impact on the security.  
Should there be any doubt, please refer to the technical documentation and the regulations in force.  
Every module has to be equipped with a proper antenna with specific characteristics. The antenna has  
to be installed with care in order to avoid any interference with other electronic devices and has to  
guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied,  
the system integrator has to assess the final product against the SAR regulation EN 50360.  
The European Community provides some Directives for the electronic equipments introduced on the  
market. All the relevant information’s are available on the European Community website:  
The text of the Directive 99/05 regarding telecommunication equipments is available, while the  
applicable Directives (Low Voltage and EMC) are available at:  
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GE864 Hardware User Guide  
1vv0300694 Rev.10 - 10/06/08  
15 Document Change Log  
Revision  
ISSUE#0  
ISSUE #1  
ISSUE #2  
ISSUE #3  
Date  
Changes  
12/06/06 Release First ISSUE# 0  
22/11/05 Added notice on page 4.  
19/12/05 Added Paragr.10 Conformity Assessment Issues  
07/02/06 Added products order codes table  
Added Disclaimer  
Added Safety Recommendations  
07/09/06 Full Review of the manual  
Added ADC description  
ISSUE #4  
Added DAC description  
Added Pin out and Process flow description  
Added Packaging  
ISSUE #5  
03/10/06 TGPIO23 now RESERVED; modified low pass filter example for DAC, 6.1  
antenna characteristics  
ISSUE #6  
ISSUE #7  
23/10/06 Updated “GE864 orientation on the tray” layout.  
08/02/07 Pin out updated, Camera removed, Added Stat Led and GPIO5 description,  
added VAUX1, schematics updated for ON_OFF, reset, level adapter 5V,  
RS232 transceiver, Power supply. Modified Charger description.  
07/06/07 Updated DISCLAIMER, Added note on charger (CFUN4 and ON_OFF), Added  
Power consumptions table, Added new table for GPIO status in Reset and  
Power on, added RFTXMON timing, Switching description modified in “+ 12V  
input Source Power Supply Design Guidelines”, Added Alternate Function for  
GPIO4, Added BGA balls mechanical drawing.  
ISSUE #8  
ISSUE #9  
19/06/07 Modified absolute maximum ratings; added GPIO2 Alternate function  
description  
ISSUE #10  
10/06/08 Par 02: Updated Mechanical drawings  
Par 3.1: Removed nominal values on Audio, added DVI description  
Par 5.1: Added Supply Voltage Range  
Par 11.7: GPIO7 description; added section on Buzzer description  
Par 9: Audio section removed (a dedicated User guide on audio has been  
created)  
Par 5.2.1.4: added note on Charger  
Par 8.1: tip on RXD pull up added  
EVK chapter removed  
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