Intel Switch 6300ESB User Manual

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Intel 6300ESB I/O Controller  
Hub  
Thermal and Mechanical Design Guide  
February 2004  
Order Number: 300682-001  
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Contents  
Contents  
Figures  
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Intel 6300ESB I/O Controller Hub Package Dimensions..........................................................14  
Tables  
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Intel 6300ESB I/O Controller Hub Thermal Specifications .........................................................9  
Revision History  
Date  
Revision  
Description  
Initial release of this document.  
February 2004  
1.0  
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Contents  
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Introduction  
1.0  
Introduction  
As the complexity of computer systems increases, so do the power dissipation requirements. Care  
must be taken to ensure that the additional power is properly dissipated. Heat may be dissipated  
using improved system cooling and/or attaching passive heatsinks.  
The objective of thermal management is to ensure that the temperatures of all components in a  
system are maintained within functional limits. The functional temperature limit is the range within  
which the electrical circuits may be expected to meet specified performance requirements.  
Operation outside the functional limit may degrade system performance, cause logic errors, or  
cause component and/or system damage. Temperatures exceeding the maximum operating limits  
may result in irreversible changes in the operating characteristics of the component. The goal of  
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this document is to provide an understanding of the operating limits of the Intel 6300ESB I/O  
Controller Hub (ICH).  
The simplest and most cost effective method is to improve the inherent system cooling  
characteristics through careful design and placement of fans, vents, and ducts. When additional  
cooling is required, component thermal solutions may be implemented in conjunction with system  
thermal solutions. The size of the fan or heatsink may be varied to balance size and space  
constraints with acoustic noise.  
This document presents the conditions and requirements to properly design a cooling solution for  
systems using the Intel 6300ESB ICH. Properly designed solutions should provide adequate  
cooling to maintain the Intel 6300ESB ICH case temperatures at or below thermal specifications.  
This is accomplished by providing a low local-ambient temperature, ensuring adequate local  
airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the case  
temperatures of the Intel 6300ESB ICH at or below those recommended in this document, a system  
designer may ensure the proper functionality, performance, and reliability of these components.  
1.1  
Definition of Terms  
Table 1. Definition of Terms  
Term  
Definition  
Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is  
mounted, bonded and encapsulated in molding compound. The primary electrical interface is  
an array of solder balls attached to the substrate opposite the die and molding compound.  
BGA  
The maximum package case temperature without any package thermal solution. This  
temperature is measured at the geometric center of the top of the package case.  
Tcase-nhs  
Tj-max  
TDP  
The maximum component temperature specification measured at the hottest point in the  
processor die.  
Thermal Design Power. Thermal solutions should be designed to dissipate this target power  
level.  
Linear Feet Per Minute. A measure of airflow emitted from a forced convection device, such  
as an axial fan or blower.  
LFM  
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Introduction  
1.2  
Reference Documents  
Table 2. Reference Documents  
Document  
Document Number / Location  
Intel® 6300ESB I/O Controller Hub Datasheet  
300641  
Thermal Design Suggestions for Various Form Factors  
NOTE: Unless otherwise noted, these documents are available through your Intel Field Sales representative  
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Packaging Technology  
2.0  
Packaging Technology  
The Intel 6300ESB ICH component is available in a 37.5 mm square package as shown in  
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Appendix A, “Mechanical Drawings”. Package information is also provided in the Intel 6300ESB  
I/O Controller Hub Datasheet.  
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Packaging Technology  
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Thermal Specifications  
3.0  
Thermal Specifications  
3.1  
Case Temperature and Thermal Design Power  
To ensure proper operation and reliability of the Intel 6300ESB ICH component, the case and  
junction temperatures must be at or below the values specified in Table 3. System and/or  
component level thermal solutions are required to maintain the case temperature below the  
maximum temperature specification while dissipating the thermal design power (TDP) listed in  
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Table 3. Intel 6300ESB I/O Controller Hub Thermal Specifications  
Parameter  
Maximum  
Notes  
Tcase-nhs  
Tj-max  
TDP  
105 °C  
115 °C  
3.9 W  
NOTES:  
1. Tcase-nhs is defined as the maximum package case temperature without a  
thermal solution attached.  
2. Tj-max is defined as the maximum component temperature specification  
measured at the hottest point in the processor die.  
3.2  
Case Temperature Metrology  
The component case temperature should be measured by attaching a thermocouple to the geometric  
center of the package case top. Refer to Appendix A, “Mechanical Drawings” for package  
dimensions.  
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Thermal Specifications  
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Reference Thermal Solution  
4.0  
Reference Thermal Solution  
Based on a component local operating environment of natural convection (zero LFM of airflow)  
with a maximum local-ambient temperature of 55° C, the Intel 6300ESB ICH component does not  
require an attached heatsink to meet thermal specifications. For systems where the local-ambient  
temperature is severe (greater than 55° C, natural convection), a component level thermal solution  
or system thermal solution improvement may be required. Attaching a heatsink to the package case  
and/or improving airflow at the component may be potential solutions.  
4.1  
Reliability Requirements  
If an attached heatsink is implemented due to a severe component local operating environment, the  
reliability requirements in Table 4 are recommended. Each motherboard, heatsink, and attach  
combination may vary the mechanical loading of the component. It is recommended that the user  
carefully evaluate the reliability of the completed assembly prior to use in high volume.  
Table 4. Reliability Requirements  
Test1  
Requirement  
Pass/Fail Criteria2  
Mechanical Shock  
Random Vibration  
50g, board level, 11 msec, 3 shocks/axis  
Visual check and electrical functional test  
7.3g, board level, 45 min/axis, 50 Hz to  
2000 Hz  
Visual check and electrical functional test  
Visual check  
85° C, 2000 hours total, checkpoints at  
168, 500, 1000, and 2000 hours  
Temperature Life  
Thermal Cycling  
-5° C to +70° C, 500 cycles, ° C/min rise  
and fall  
Visual check  
Visual check  
Humidity  
85% relative humidity, 55° C, 1000 hours  
NOTES:  
1. The above tests should be performed on a sample size of at least 12 assemblies from 3 lots of material.  
2. Additional pass/fail criteria may be added at the discretion of the user.  
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Reference Thermal Solution  
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Mechanical Drawings  
Appendix A Mechanical Drawings  
Figure 1 shows the package dimensions for the Intel 6300ESB ICH. Unless otherwise specified,  
the units in the figure are in millimeters.  
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Mechanical Drawings  
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Figure 1. Intel 6300ESB I/O Controller Hub Package Dimensions  
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