Product Manual
TM
Pulsar
ST9200011FS
ST9100011FS
ST950011FS
100596473
Rev. A
April 2010
Contents
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
About the Serial ATA interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Drive specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Specification summary tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Formatted capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
LBA mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Default logical geometry for ATA based systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Performance, Recording and interface technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Interface technology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recording technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Access time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Time to Ready . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Power specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Conducted noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Voltage tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Environmental specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Temperature gradient. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Altitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Vibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Electromagnetic immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Reliability specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Agency certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Safety certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
FCC verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Environmental protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Corrosive environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Configuring and mounting the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Handling and static-discharge precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Configuring the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Serial ATA cables and connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Drive mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Serial ATA (SATA) interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Hot-Plug compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Serial ATA device plug connector pin definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Supported ATA commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Identify Device command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Set Features command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
S.M.A.R.T. commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.0
Seagate Technology support services. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Pulsar Product Manual, Rev. A
i
ii
Pulsar Product Manual, Rev. A
List of Figures
Figure 4.
Typical 5V startup and operation current profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Attaching SATA cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Mounting dimensions—top, side and end view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Air flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Pulsar Product Manual, Rev. A
iii
1.0
Introduction
This manual describes the functional, mechanical and interface specifications for the following Seagate
PulsarTM model drives:
ST9200011FS
ST9100011FS
ST950011FS
These drives provide the following key features:
• Single Layer Cell (SLC) NAND Flash storage.
• High instantaneous (burst) data-transfer rates (up to 300MB/s).
• Parallel flash access channels.
• State-of-the-art on-the-fly error-correction algorithms.
• Native Command Queueing with command ordering to increase performance in demanding applications.
• Highly integrated hardware functions.
• Power loss data protection.
• Data Set Management with Trim Support.
• Silent operation.
• SeaTools diagnostic software performs a drive self-test that eliminates unnecessary drive returns.
• Support for S.M.A.R.T. drive monitoring and reporting.
• Supports latching SATA cables and connectors.
• Worldwide Name (WWN) capability uniquely identifies the drive.
Pulsar Product Manual, Rev. A
1
1.1
About the Serial ATA interface
The Serial ATA interface provides several advantages:
• Easy installation and configuration with true plug-and-play connectivity. It is not necessary to set any jump-
ers or other configuration options.
• Thinner and more flexible cabling for improved enclosure airflow and ease of installation.
• Scalability to higher performance levels.
The Serial ATA interface connects each drive in a point-to-point configuration with the Serial ATA host adapter.
If two drives are attached on one Serial ATA host adapter, the host operating system views the two devices as
if they were both “masters” on two separate ports.
Note. The host adapter may, optionally, emulate a master/slave environment to host software where two
devices on separate Serial ATA ports are represented to host software as a Device 0 (master) and
Device 1 (slave) accessed at the same set of host bus addresses. A host adapter that emulates a
master/slave environment manages two sets of shadow registers. This is not a typical Serial ATA
environment.
The Serial ATA host adapter and drive share the function of emulating parallel ATA device behavior to provide
backward compatibility with existing host systems and software. The Command and Control Block registers,
PIO and DMA data transfers, resets, and interrupts are all emulated.
The Serial ATA host adapter contains a set of registers that shadow the contents of the traditional device regis-
ters, referred to as the Shadow Register Block. All Serial ATA devices behave like Device 0 devices. For addi-
tional information about how Serial ATA emulates parallel ATA, refer to the “Serial ATA: High Speed Serialized
2
Pulsar Product Manual, Rev. A
2.0
Drive specifications
Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal
power. For convenience, the phrases the drive and this drive are used throughout this manual to indicate the
following drive models:
ST9200011FS
ST9100011FS
ST950011FS
Product data communicated in this manual is specific only to the model numbers listed in this manual. The data
listed in this manual may not be predictive of future generation specifications or requirements. If you are
designing a system which will use one of the models listed or future generation products and need further
assistance, please contact your Customer Technical Support Engineer or our global support services group as
shown in Section 5.0.
2.1
Specification summary tables
The specifications listed in the following table is for quick reference. For details on specification measurement
or definition, see the appropriate section of this manual.
Table 1:
Drive specifications summary for 200, 100 and 50 GB models
Drive specification
ST9200011FS
200
ST9100011FS
100
ST950011FS
50
Formatted GB (512 bytes/sector)*
Guaranteed logical block addresses (LBAs)
Emulated Bytes per LBA
390,721,968
512
195,371,568
97,696,368
Sustained 128KB sequentialread/write data transfer rate
(MB/s max)
200/100
240/220
200/60
200/30
Peak 128KB sequential read/write data transfer rate
(MB/s max)
Sustained 4KB Random read/write command rate (IOPs)
Peak 4KB Random read/write command rate (IOPs)
Flash Memory Type
25,000/5200
30,000/25,000
NAND SLC
300
25,000/2600
I/O data-transfer rate (MB/s max)
Height (mm max)
7.0 mm (0.276 in)
70.1 mm (2.76 in)
100.53 mm (3.958 in)
135 g (0.298 lb)
120 µs
Width (mm max)
Length (mm max)
Weight (max)
Average latency
Power-on to ready (sec max)
Standby to ready (sec max)
Average LBA access time (µs typ)
Data Retention (typical minimum at 25C)
10 sec
2 sec
~200 µs read; ~300 µs write
1 year
Pulsar Product Manual, Rev. A
3
Drive specification
ST9200011FS
ST9100011FS
ST950011FS
Sustainable 4KB Random IOPs for 5 year Endurance
(65%/35% R/W 70% Duty Cycle)
10,500
Startup current (typical) 5V (peak)
Voltage tolerance (including noise)
0.83 amps
5V ± 5%
5° to 60°C (operating)
–40° to 70°C (nonoperating)
Ambient temperature
20°C (operating)
20°C (nonoperating)
Temperature gradient (°C per hour max)
5% to 95% (operating)
5% to 95% (nonoperating)
Relative humidity
Relative humidity gradient
Wet bulb temperature (°C max)
20% per hour max
37.7 (operating)
40.0 (nonoperating)
–60.96 m to 3048 m
(–200 ft. to 10,000+ ft.)
Altitude, operating
Altitude, nonoperating
(below mean sea level, max)
–60.96 m to 12,192 m
(–200 ft to 40,000+ ft)
Operational Shock (max at 0.5ms)
Non-Operational Shock (max at 0.5ms)
Vibration, random operating
1500 Gs
1500 Gs
20–2000 Hz: 16 Grms
20–2000 Hz: 16 Grms
1 LBA per 1016 bits read
0.44%
Vibration, random nonoperating
Nonrecoverable read errors, max
Annualized Failure Rate (AFR)
To determine the warranty for a specific drive, use a web browser to
access the following web page:
support.seagate.com/customer/warranty_validation.jsp
You will be asked to provide the drive serial number, model number (or
part number) and country of purchase. After submitting this information,
the system will display the warranty information for your drive.
Warranty
Lifetime Power cycles
50,000
Yes
Supports Hotplug operation per
Serial ATA Revision 2.6 specification
*One GB equals one billion bytes when referring to drive capacity. Accessible capacity may vary depending on operating environment and
formatting.
4
Pulsar Product Manual, Rev. A
2.2
Formatted capacity
Model
Formatted capacity*
Guaranteed LBAs
390,721,968
Emulated LBA Size (Bytes)
ST9200011FS
ST9100011FS
ST950011FS
200GB
100GB
50GB
195,371,568
512
97,696,368
*One GB equals one billion bytes when referring to drive capacity. Accessible capacity may vary depending on operating environment and
formatting.
2.2.1
LBA mode
When addressing these drives in LBA mode, all blocks (LBAs) are consecutively numbered from 0 to n–1,
where n is the number of guaranteed LBAs as defined above.
See Section 4.3.1, "Identify Device command" (words 60-61 and 100-103) for additional information about 48-
bit addressing support of drives with capacities over 137GB.
2.3
Default logical geometry for ATA based systems
Cylinders
16,383
Read/write heads
Sectors per track
16
63
2.4
Performance, Recording and interface technology
2.4.1
Interface technology
200GB
100GB
50GB
Interface
Serial ATA (SATA-II)
Interface Speeds Supported
Maximum Burst Transfer Rate
Hot Plug Support
3Gb/s, 1.5Gb/s
300MB/s
Yes
Native Command Queuing Support
Trim Support
Yes
Yes
Lifetime Endurance Throttling
Yes
2.4.2
Recording technology
Flash Memory Type
NAND SLC
512
Emulated LBA Size (Bytes)
Native Programmable Page size (User Bytes)
Default transfer alignment offset
4096
0
Typical Data Retention with Power removed (at 25C)
1 year
Pulsar Product Manual, Rev. A
5
2.4.3
Performance
Notes 200GB
100GB
50GB
Maximum Burst Transfer Rate
300MB/s
Peak sequential 128KB read/write data transfer rate (MB/s max)
Sustained sequential 128KB read/write data transfer rate (MB/s)
Peak 4KB random read/write command rate (IOPs)
Sustained 4KB random read/write command rate (IOPs)
240/220
200/100
200/60
200/30
30,000/25,000
25,000/5200
10,500
25,000/2600
Sustainable 4KB Random combined IOPS for 5 year Endurance
(65%/35% R/W, 70% Duty Cycle)
[1] Testing performed at Queue Depth = 32, Sequentially Preconditioned drive, using IOMeter 2008.6.28.
[2] Testing performed at Queue Depth = 32, Sequentially Preconditioned drive, using IOMeter 2006.7.27.
[3] Testing performed at Queue Depth = 32, Randomly Preconditioned drive, using IOMeter 2008.6.28.
[4] Testing performed at Queue Depth = 32, Randomly Preconditioned drive, using IOMeter 2006.7.27.
[5] Testing performed at Queue Depth = 32, Non-Preconditioned drive, using IOMeter 2006.7.27.
IOMeter is licensed under the Intel Open Source License and the GNU General Public License. Intel
does not endorse any IOMeter results.
Peak performance is defined as the typical best case performance that the product will be able to
achieve when the product is preconditioned as mentioned and host commands are aligned on 4KB
boundaries.
Sustained performance is defined as the typical worst case performance that the product will be able to
achieve when the product is preconditioned as mentioned and host commands are aligned on 4KB boundar-
ies. Write values also take into account the worst case performance throttling that may occur to ensure the
product meets specified reliability specifications.
Due to the nature of Flash memory technologies there are many factors that can result in values different than
those stated in this specification. Some discrepancies can be caused by bandwidth limitations in the host
adapter, operating system, or driver limitations. It is not the intent of this manual to cover all possible causes of
performance discrepancies.
When evaluating performance of SSD devices, it is recommended to measure performance of the device in a
method that resembles the targeted application using real world data and workloads. Test time should also be
adequately large to ensure that sustainable metrics and measures are obtained.
2.5
Physical characteristics
Maximum height
7.0 mm (0.276 in)
70.1 mm (2.76 in)
100.53 mm (3.958 in)
135 g (0.298 lb)
Maximum width
Maximum length
Max weight
6
Pulsar Product Manual, Rev. A
2.6
Access time
Access measurements are taken with nominal power at 25°C ambient temperature. All times are measured
using drive diagnostics. The specifications in the table below are defined as follows:
• Page-to-page access time is an average of all possible page-to-page accesses in both directions for a
sequentially preconditioned drive.
• Average access time is a true statistical random average of at least 5000 measurements of accesses
between programmable pages, less overhead, on a randomly preconditioned drive.
*Typical access times (µs)
Page-to-page
Read
120
Write
200
Average
200
300
Average latency:
120
Note. These drives are designed to provide the highest possible performance under typical conditions.
However, due to the nature of Flash memory technologies there are many factors that can result in
values different than those stated in this specification.
2.7
Time to Ready
ST9200011FS
3 (max)
ST9100011FS
ST950011FS
Power-on to Ready for non-Media related Commands (sec)
Power-on to Ready for Media related commands (sec)
Standby to Ready (sec)
10 (max)
2 (max)
Ready to power removal (sec)
3 (max)
Power-on to Ready for non-media related commands is defined as the time that it will take the drive to respond
from the application power until it is ready to accept commands from the host that do not require access to the
flash media. In some cases the drive may accept media access commands during this time, but the commands
will not be completed or status returned to the host until the media can be accessed safely. Commands such
as Check Power and Identify are examples of non-media related commands.
Power-on to Ready for media related commands is defined as the time that it will take the drive to respond from
the application power until it is ready to accept commands from the host that require access to the flash media.
Commands such as FPDMA Read Extended and FPDMA Write Extended are examples of media related com-
mands. This value includes the time needed to charge the Power Loss Data Protection Circuit to a level that is
adequate to protect customer data from unexpected power loss
Pulsar Product Manual, Rev. A
7
2.8
Power specifications
The drive receives DC power (+5V) through a native SATA power connector. See Figure 2 on page 20.
2.8.1 Power consumption
Power requirements for the drives are listed in the table on page 9. Typical power measurements are based on
an average of drives tested, under nominal conditions, using +5V input voltage at 35°C ambient temperature.
• Startup power
Startup power is measured from the time of power-on to the time that the drive reaches operating condition
and can process media access commands.
• Peak operating mode
During peak operating mode, the drive is tested in various read and write access patterns to simulate the
worst-case power consumption.
• Idle mode power
Idle mode power is measured with the drive powered up and ready for media access commands, with no
media access commands having been received from the host.
• Standby mode
During Standby mode, the drive accepts commands, but not be able to immediately access the media
because the drive electronics are in a partial power-down mode.
8
Pulsar Product Manual, Rev. A
Table 2:
200GB DC power requirements
Parameter
200Gb (3.0GB)
+/‐5%
Regulation
Voltage
+5 V
Current (A) Power (W)
Average Idle Current
Standby
Average Sleep Current
Maximum Start Current:
DC (Peak DC)
DCx
DCx
DCx
0.15
0.11
0.11
0.75
0.55
0.55
3σ
3σ
3σ
0.83
1.60
0.11
AC (Peak AC)
Delayed Motor Start (DC max)
Peak Operating Current (random read):
Typical DC
Maximum DC
Maximum DC (peak)
0.55
DCx
3σ
3σ
0.26
0.27
0.98
1.30
1.35
Peak Operating Current (random write):
Typical DC
Maximum DC
Maximum DC (peak)
DCx
3σ
3σ
0.30
0.31
1.06
1.50
1.55
Peak operating current (sequential read):
Typical DC
Maximum DC
Maximum DC (peak)
DCx
3σ
3σ
0.23
0.25
0.77
1.15
1.25
Peak operating current (sequential write):
Typical DC
Maximum DC
Maximum DC (peak)
DCx
3σ
3σ
0.39
0.40
1.04
1.95
2.00
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase power to oper-
ational levels.
Pulsar Product Manual, Rev. A
9
Table 3:
100GB DC power requirements
Parameter
100Gb (3.0GB)
+/‐5%
Regulation
Voltage
+5 V
Current (A) Power (W)
Average Idle Current
Standby
Average Sleep Current
Maximum Start Current:
DC (Peak DC)
DCx
DCx
DCx
0.14
0.11
0.10
0.70
0.55
0.50
3σ
3σ
3σ
0.80
1.48
0.11
AC (Peak AC)
Delayed Motor Start (DC max)
Peak Operating Current (random read):
Typical DC
Maximum DC
Maximum DC (peak)
0.55
DCx
3σ
3σ
0.16
0.17
0.67
0.80
0.85
Peak Operating Current (random write):
Typical DC
Maximum DC
Maximum DC (peak)
DCx
3σ
3σ
0.26
0.27
0.97
1.30
1.35
Peak operating current (sequential read):
Typical DC
Maximum DC
Maximum DC (peak)
DCx
3σ
3σ
0.23
0.24
0.77
1.15
1.20
Peak operating current (sequential write):
Typical DC
Maximum DC
Maximum DC (peak)
DCx
3σ
3σ
0.38
0.40
1.04
1.90
2.00
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase power to oper-
ational levels.
10
Pulsar Product Manual, Rev. A
Table 4:
50GB DC power requirements
Parameter
50Gb (3.0GB)
+/‐5%
Regulation
Voltage
+5 V
Current (A) Power (W)
Average Idle Current
Standby
Average Sleep Current
Maximum Start Current:
DC (Peak DC)
DCx
DCx
DCx
0.13
0.11
0.09
0.65
0.55
0.45
3σ
3σ
3σ
0.83
1.59
0.11
AC (Peak AC)
Delayed Motor Start (DC max)
Peak Operating Current (random read):
Typical DC
Maximum DC
Maximum DC (peak)
0.55
DCx
3σ
3σ
0.16
0.18
0.67
0.80
0.90
Peak Operating Current (random write):
Typical DC
Maximum DC
Maximum DC (peak)
DCx
3σ
3σ
0.25
0.28
0.98
1.25
1.40
Peak operating current (sequential read):
Typical DC
Maximum DC
Maximum DC (peak)
DCx
3σ
3σ
0.23
0.25
0.74
1.15
1.25
Peak operating current (sequential write):
Typical DC
Maximum DC
Maximum DC (peak)
DCx
3σ
3σ
0.37
0.40
0.90
1.85
2.00
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase power to oper-
ational levels.
Pulsar Product Manual, Rev. A
11
2.8.1.1
Typical current profiles
Figure 1. Typical 5V startup and operation current profile
2.8.2 Conducted noise
Input noise ripple is measured at the host system power supply across an equivalent 15-ohm resistive load on
the +5 volt line.
• Using 5-volt power, the drive is expected to operate with a maximum of 250 mV peak-to-peak sine-wave
injected noise at a frequency from 100Hz up to 20 MHz.
Note. Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write
current.
2.8.3
Voltage tolerance
Voltage tolerance (including noise):
5V ±5%
12
Pulsar Product Manual, Rev. A
2.9
Environmental specifications
Ambient temperature
2.9.1
Ambient temperature is defined as the temperature of the environment immediately surrounding the drive.
Actual drive case temperature should not exceed 60°C (140°F) within the operating ambient conditions.
Above 1000 feet (305 meters), the maximum temperature is derated linearly to 112°F (44°C) at 10,000 feet
(3,048 meters).
Operating:
5° to 60°C (41° to 140°F)
Nonoperating:
–40° to 70°C (–40° to 158°F)
2.9.2
Temperature gradient
Operating:
20°C per hour (68°F per hour max), without condensation
20°C per hour (86°F per hour max)
Nonoperating:
2.9.3
2.9.3.1
Humidity
Relative humidity
Operating:
Nonoperating:
5% to 95% noncondensing (20% per hour max)
5% to 95% noncondensing (20% per hour max)
2.9.3.2
Wet bulb temperature
Operating:
37.7°C (99.9°F max)
40.0°C (104.0°F max)
Nonoperating:
2.9.4
Altitude
** Operating:
–60.96 m to 3,048 m (–200 ft. to 10,000+ ft.)
–60.96 m to 12,192 m (–200 ft. to 40,000+ ft.)
** Nonoperating:
** Applies to atmospheric pressure only.
2.9.5
Shock
All shock specifications assume that the drive is mounted securely with the input shock applied at the drive
mounting screws. Shock may be applied in the X, Y or Z axis.
2.9.5.1
Operating shock
These drives comply with the performance levels specified in this document when subjected to a maximum
operating shock of 1500 Gs based on half-sine shock pulses of 0.5ms. This specification does not cover con-
nection issues that may result from testing at this level.
2.9.5.2
Nonoperating shock
The nonoperating shock level that the drive can experience without incurring physical damage or degradation
in performance when subsequently put into operation is 1500 Gs based on a half-sine shock pulse of 0.5ms
duration.
Pulsar Product Manual, Rev. A
13
2.9.6
Vibration
All vibration specifications assume that the drive is mounted securely with the input vibration applied at the
drive mounting screws. Vibration may be applied in the X, Y or Z axis.
2.9.6.1
Operating vibration
The maximum random vibration levels that the drive may experience while meeting the performance standards
specified in this document are specified below. This specification does not cover connection issues that may
result from testing at this level.
20–2000 Hz
16 Grms
2.9.6.2
Nonoperating vibration
The maximum random nonoperating vibration levels that the drive may experience without incurring physical
damage or degradation in performance when subsequently put into operation are specified below.
20–2000 Hz
16 Grms
2.10
Electromagnetic immunity
When properly installed in a representative host system, the drive operates without errors or degradation in
performance when subjected to the radio frequency (RF) environments defined in the following table:
Table 5:
Test
Radio frequency environments
Description
Performance level
Reference standard
Electrostatic
discharge
Contact, HCP, VCP: ± 4 kV; Air: ± 8 kV
B
EN 61000-4-2: 95
Radiated RF
immunity
80 to 1000 MHz, 3 V/m,
A
B
EN 61000-4-3: 96
ENV 50204: 95
80% AM with 1 kHz sine
900 MHz, 3 V/m, 50% pulse modulation @ 200 Hz
Electrical fast
transient
± 1 kV on AC mains, ± 0.5 kV on external I/O
EN 61000-4-4: 95
Surge immunity ± 1 kV differential, ± 2 kV common, AC mains
B
A
EN 61000-4-5: 95
EN 61000-4-6: 97
Conducted RF
immunity
150 kHz to 80 MHz, 3 Vrms, 80% AM with 1 kHz sine
Voltage dips,
interrupts
0% open, 5 seconds
0% short, 5 seconds
40%, 0.10 seconds
70%, 0.01 seconds
C
C
C
B
EN 61000-4-11: 94
14
Pulsar Product Manual, Rev. A
2.11
Reliability
2.11.1
Annualized Failure Rate (AFR) and Mean Time Between Failures (MTBF)
The product shall achieve an Annualized Failure Rate - AFR - of 0.44%. AFR and MTBF are population statis-
tics that are not relevant to individual units.
AFR and MTBF specifications are based on the following assumptions:
• 8760 power-on-hours per year.
• 250 average power cycles per year.
• Operations at nominal voltages.
• Systems will provide adequate cooling to ensure the case temperatures do not exceed specification.
2.11.2
Reliability specifications
16
Unrecoverable read error rate during typical
product lifetime
1 LBA per 10 bits read, max
15
Unrecoverable read error rate as product
approaches end of useful life
Annualized Failure Rate (AFR)
Power cycles
0.44%
50,000 cycles
(at nominal voltage and temperature, with 60 cycles per hour and a 50%
duty cycle)
Warranty
support.seagate.com/customer/warranty_validation.jsp
You will be asked to provide the drive serial number, model number (or
part number) and country of purchase. After submitting this information,
the system will display the warranty information for your drive.
Preventive maintenance
None required.
Typical Data Retention with Power removed
(at 25C)
Endurance
[1] As NAND Flash devices age with use, the capability of the media to retain a programmed value begins to deteriorate.
This deterioration is affected by the number of times a particular memory cell is programmed and subsequently
erased. As deterioration continues, the memory will reach a point at which the amount of deterioration will exceed the
error recovery capabilities of the drive. Therefore an unrecoverable error rate is provided to indicate the expected
error rate as the device nears the end of its useful life due to the deterioration.
[2] As NAND Flash devices age with use, the capability of the media to retain a programmed value begins to deteriorate.
This deterioration is affected by the number of times a particular memory cell is programmed and subsequently
erased. When a device is new, it has a powered off data retention capability of up to ten years. With use the retention
capability of the device is reduced. Temperature also has an effect on how long a Flash component can retain its pro-
grammed value with power removed. At high temperature the retention capabilities of the device are reduced. Data
retention is not an issue with power applied to the SSD. The SSD drive contains firmware and hardware features that
can monitor and refresh memory cells when power is applied.
[3] Endurance is the expected life of a product when subjected to a specified workload at a specified operating and stor-
age temperature. For the specific workload and performance to achieve this level of endurance, please reference sec-
tion 2.4.3.
Pulsar Product Manual, Rev. A
15
2.12
Agency certification
Safety certification
2.12.1
These products are certified to meet the requirements of UL60950-1, CSA60950-1 and EN60950 and so
marked as to the certify agency.
2.12.2
Electromagnetic compatibility
Drives that display the CE mark comply with the European Union (EU) requirements specified in the Electro-
magnetic Compatibility Directive (2004/108/EC) as put into place 20 July 2007. Testing is performed to the lev-
els specified by the product standards for Information Technology Equipment (ITE). Emission levels are
defined by EN 55022, Class B and the immunity levels are defined by EN 55024.
Seagate uses an independent laboratory to confirm compliance with the EC directives specified in the previous
paragraph. Drives are tested in representative end-user systems. Although CE-marked Seagate drives comply
with the directives when used in the test systems, we cannot guarantee that all systems will comply with the
directives. The drive is designed for operation inside a properly designed enclosure, with properly shielded I/O
cable (if necessary) and terminators on all unused I/O ports. Computer manufacturers and system integrators
should confirm EMC compliance and provide CE marking for their products.
Korean RRL
If these drives have the Korean Communications Commission (KCC) logo, they comply with paragraph 1 of
Article 11 of the Electromagnetic Compatibility control Regulation and meet the Electromagnetic Compatibility
(EMC) Framework requirements of the Radio Research Laboratory (RRL) Communications Commission,
Republic of Korea.
These drives have been tested and comply with the Electromagnetic Interference/Electromagnetic
Susceptibility (EMI/EMS) for Class B products. Drives are tested in a representative, end-user system by a
Korean-recognized lab.
• Certificate number: STX-ST9200011FS (B)
• Trade name or applicant: Seagate Technology LLC
• Manufacturing date: February 23, 2010 (Date of Certification)
• Manufacturer/nationality: USA, Singapore and China
Australian C-Tick (N176)
If these models have the C-Tick marking, they comply with the Australia/New Zealand Standard AS/NZ
CISPR22 and meet the Electromagnetic Compatibility (EMC) Framework requirements of the Australian
Communication Authority (ACA).
2.12.3
FCC verification
These drives are intended to be contained solely within a personal computer or similar enclosure (not attached
as an external device). As such, each drive is considered to be a subassembly even when it is individually mar-
keted to the customer. As a subassembly, no Federal Communications Commission verification or certification
of the device is required.
Seagate Technology LLC has tested this device in enclosures as described above to ensure that the total
assembly (enclosure, drive, motherboard, power supply, etc.) does comply with the limits for a Class B comput-
ing device, pursuant to Subpart J, Part 15 of the FCC rules. Operation with noncertified assemblies is likely to
result in interference to radio and television reception.
16
Pulsar Product Manual, Rev. A
Radio and television interference. This equipment generates and uses radio frequency energy and if not
installed and used in strict accordance with the manufacturer’s instructions, may cause interference to radio
and television reception.
This equipment is designed to provide reasonable protection against such interference in a residential installa-
tion. However, there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause interference to radio or television, which can be determined by turning the equipment on and off,
you are encouraged to try one or more of the following corrective measures:
• Reorient the receiving antenna.
• Move the device to one side or the other of the radio or TV.
• Move the device farther away from the radio or TV.
• Plug the computer into a different outlet so that the receiver and computer are on different branch outlets.
If necessary, you should consult your dealer or an experienced radio/television technician for additional sug-
gestions. You may find helpful the following booklet prepared by the Federal Communications Commission:
How to Identify and Resolve Radio-Television Interference Problems. This booklet is available from the Super-
intendent of Documents, U.S. Government Printing Office, Washington, DC 20402. Refer to publication num-
ber 004-000-00345-4.
2.13
Environmental protection
Seagate designs its products to meet environmental protection requirements worldwide, including regulations
restricting certain chemical substances.
2.13.1
European Union Restriction of Hazardous Substances (RoHS) Directive
The European Union Restriction of Hazardous Substances (RoHS) Directive, restricts the presence of chemi-
cal substances, including Lead, Cadmium, Mercury, Hexavalent Chromium, PBB and PBDE, in electronic prod-
ucts, effective July 2006. This drive is manufactured with components and materials that comply with the RoHS
Directive.
中国限制危险物品的指令
2.13.2
China Restriction of Hazardous Substances (RoHS) Directive
This product has an Environmental Protection Use Period (EPUP) of 20 years. The following
table contains information mandated by China's "Marking Requirements for Control of Pollution
Caused by Electronic Information Products" Standard.
CHASSIS
"O" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is lower
than the threshold defined by the China RoHS MCV Standard.
O"
RoHS MCV
表示该部件（于同类物品程度上）所含的危险和有毒物质低于中国
标准所定义的门槛值。
Pulsar Product Manual, Rev. A
17
"X" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is over
the threshold defined by the China RoHS MCV Standard.
X "
RoHS MCV
表示该部件（于同类物品程度上）所含的危险和有毒物质超出中国
标准所定义的门槛值。
2.14
Corrosive environment
Seagate electronic drive components pass accelerated corrosion testing equivalent to 10 years exposure to
light industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM
B845. However, this accelerated testing cannot duplicate every potential application environment. Users
should use caution exposing any electronic components to uncontrolled chemical pollutants and corrosive
chemicals as electronic drive component reliability can be affected by the installation environment. The silver,
copper, nickel and gold films used in Seagate products are especially sensitive to the presence of sulfide, chlo-
ride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic components
should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or
exposed to an ambient relative humidity greater than 95%. Materials used in cabinet fabrication, such as vulca-
nized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of any
electronic equipment may be extended by replacing materials near circuitry with sulfide-free alternatives.
18
Pulsar Product Manual, Rev. A
3.0
Configuring and mounting the drive
This section contains the specifications and instructions for configuring and mounting the drive.
3.1
Handling and static-discharge precautions
After unpacking, and before installation, the drive may be exposed to potential handling and electrostatic dis-
charge (ESD) hazards. Observe the following standard handling and static-discharge precautions:
Caution:
• Before handling the drive, put on a grounded wrist strap, or ground yourself frequently by touching the metal
chassis of a computer that is plugged into a grounded outlet. Wear a grounded wrist strap throughout the entire
installation procedure.
• Handle the drive by its edges or frame only.
• The drive is fragile—handle it with care. Do not press down on the drive top cover.
• Always rest the drive on a padded, antistatic surface until you mount it in the computer.
• Do not touch the connector pins or the printed circuit board.
• Do not remove the factory-installed labels from the drive or cover them with additional labels. Removal voids
the warranty. Some factory-installed labels contain information needed to service the drive.
Pulsar Product Manual, Rev. A
19
3.2
Configuring the drive
Each drive on the Serial ATA interface connects point-to-point with the Serial ATA host adapter. There is no
master/slave relationship because each drive is considered a master in a point-to-point relationship. If two
drives are attached on one Serial ATA host adapter, the host operating system views the two devices as if they
were both “masters” on two separate ports. Both drives behave as if they are Device 0 (master) devices.
Serial ATA drives are designed for easy installation. If you connect the drive and receive a “drive not detected”
error, your SATA equipped motherboard or host adapter may use a chipset that does not support SATA 3.0Gb
speed autonegotiation. You will need to install a SATA host adapter that supports autonegotiation.
3.3
Serial ATA cables and connectors
The Serial ATA interface cable consists of four conductors in two differential pairs, plus three ground connec-
tions. The cable size may be 30 to 26 AWG with a maximum length of one meter (39.37 inches). See Table 6
for connector pin definitions. Either end of the SATA signal cable can be attached to the drive or host.
For direct backplane connection, the drive connectors are inserted directly into the host receptacle. The drive
and the host receptacle incorporate features that enable the direct connection to be hot pluggable and blind
mateable.
For installations which require cables, you can connect the drive as illustrated in Figure 2.
Signal connector
Power connector
Signal cable
Power cable
Figure 2. Attaching SATA cabling
Each cable is keyed to ensure correct orientation. Pulsar drives support latching SATA connectors.
20
Pulsar Product Manual, Rev. A
3.4
Drive mounting
You can mount the drive in any orientation using four screws in the side-mounting holes or four screws in the
bottom-mounting holes. See Figure 3 for drive mounting dimensions. Follow these important mounting precau-
tions when mounting the drive:
• Allow a minimum clearance of 0.030 in (0.76 mm) around the entire perimeter of the drive for cooling as a
• Use only M3 x 0.5 metric mounting screws.
• Four (4) threads (0.080 in) minimum screw engagement recommended. Also ensure maximum screw length
does not bottom out in mounting holes.
• Do not overtighten the mounting screws (maximum torque: 4.5 in-lb, ± 0.45 in-lb).
Figure 3. Mounting dimensions—top, side and end view
Pulsar Product Manual, Rev. A
21
3.5
Cooling
Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding
the drive will not exceed temperature conditions specified in Section 2.9.1, "Ambient temperature."
The rack, cabinet, or drawer environment for the drive must provide heat removal. You should confirm that ade-
quate heat removal is provided using the temperature measurement guidelines described in Section 2.9.1.
Forced air flow may be required to keep temperatures at or below the temperatures specified in Section 2.9.1
in which case the drive should be oriented, or air flow directed, so that the least amount of air flow resistance is
created while providing air flow to the drive. Also, the shortest possible path between the air inlet and exit
should be chosen to minimize the travel length of air heated by the drive and other heat sources within the
rack, cabinet, or drawer environment.
If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 4. The air-flow pat-
terns are created by one or more fans, either forcing or drawing air as shown in the illustrations. Conduction,
convection, or other forced air-flow patterns are acceptable as long as the temperature measurement guide-
Above unit
Under unit
Note. Air flows in the direction shown (back to front)
or in reverse direction (front to back)
Above unit
Under unit
Note. Air flows in the direction shown or
in reverse direction (side to side)
Figure 4. Air flow
22
Pulsar Product Manual, Rev. A
4.0
Serial ATA (SATA) interface
These drives use the industry-standard Serial ATA interface that supports FIS data transfers. It supports ATA
programmed input/output (PIO) modes 0–4; multiword DMA modes 0–2, and Ultra DMA modes 0–6.
For detailed information about the Serial ATA interface, refer to the “Serial ATA: High Speed Serialized AT
Attachment” specification.
4.1
Hot-Plug compatibility
Pulsar drives incorporate connectors which enable you to hot plug these drives in accordance with the Serial
ata.org.
Pulsar Product Manual, Rev. A
23
4.2
Serial ATA device plug connector pin definitions
Table 6 summarizes the signals on the Serial ATA interface and power connectors.
Table 6: Serial ATA connector pin definitions
Segment Pin
Function
Ground
A+
Definition
S1
S2
S3
S4
S5
S6
2nd mate
Differential signal pair A from Phy
A-
Ground
B-
2nd mate
Differential signal pair B from Phy
B+
Signal
S7
Ground
2nd mate
Key and spacing separate signal and power segments
P1
V33
not used
P2
V33
not used
P3
V33
not used
P4
Ground
Ground
Ground
V5
1st mate
P5
2nd mate
P6
2nd mate
P7
5V power, pre-charge, 2nd mate
5V power
P8
V5
Power
P9
V5
5V power
P10
P11
P12
P13
P14
P15
Ground
2nd mate
Ground or LED signal If grounded, drive ignores this signal
Ground
V12
1st mate.
not used
not used
not used
V12
V12
Notes:
1. All pins are in a single row, with a 1.27 mm (0.050”) pitch.
2. The comments on the mating sequence apply to the case of backplane blindmate connector only. In this
case, the mating sequences are:
• the ground pins P4 and P12.
• the pre-charge power pins and the other ground pins.
• the signal pins and the rest of the power pins.
3. There are three power pins for each voltage. One pin from each voltage is used for pre-charge when
installed in a blind-mate backplane configuration.
4. All used voltage pins (Vx) must be terminated.
24
Pulsar Product Manual, Rev. A
4.3
Supported ATA commands
The following table lists Serial ATA standard commands that the drive supports. For a detailed description of
Table 7:
Supported ATA commands
Command name
Command code (in hex)
Check Power Mode
Data Set Management with Trim Support
Download Microcode
Execute Device Diagnostics
Flush Cache
E5
H
H
H
H
06
92
90
E7
H
Flush Cache Extended
Identify Device
EA
H
EC
H
Idle
E3
E1
H
Idle Immediate
H
H
Initialize Device Parameters
Read Buffer
91
E4
H
Read DMA
C8
H
Read DMA Extended
Read FPDMA Queued
Read Log Ext
25
60
H
H
2F
H
Read Multiple
C4
H
Read Multiple Extended
Read Native Max Address
Read Native Max Address Extended
Read Sectors
29
H
F8
H
H
H
H
H
H
27
20
24
40
42
Read Sectors Extended
Read Verify Sectors
Read Verify Sectors Extended
Security Disable Password
Security Erase Prepare
Security Erase Unit
Security Freeze
F6
F3
F4
F5
F1
F2
H
H
H
H
H
H
Security Set Password
Security Unlock
Set Features
EF
H
H
Set Max Address
F9
Pulsar Product Manual, Rev. A
25
Command name
Note: Individual Set Max Address
Command code (in hex)
Address:
Password:
Lock:
00
01
02
03
04
H
H
H
H
H
commands are identified by the value
placed in the Set Max Features regis-
ter as defined to the right.
Unlock:
Freeze Lock:
Set Max Address Extended
Set Multiple Mode
37
H
C6
H
H
Sleep
E6
S.M.A.R.T. Disable Operations
S.M.A.R.T. Enable/Disable Autosave
S.M.A.R.T. Enable Operations
S.M.A.R.T. Execute Offline
S.M.A.R.T. Read Attribute Thresholds
S.M.A.R.T. Read Data
S.M.A.R.T. Read Log Sector
S.M.A.R.T. Return Status
S.M.A.R.T. Save Attribute Values
S.M.A.R.T. Write Log Sector
Standby
B0 / D9
H
H
H
H
H
H
H
H
B0 / D2
H
B0 / D8
H
B0 / D4
H
B0 / D1
H
B0 / D0
H
B0 / D5
H
B0 / DA
H
H
H
H
B0 / D3
H
B0 / D6
H
E2
E0
E8
H
H
H
Standby Immediate
Write Buffer
Write DMA
CA
H
Write DMA Extended
Write DMA FUA Extended
Write FPDMA Queued
Write Log Extended
35
H
3D
61
H
H
3F
H
Write Multiple
C5
H
Write Multiple Extended
Write Multiple FUA Extended
Write Sectors
39
H
CE
H
30
34
55
H
Write Sectors Extended
Write Uncorrectable
H
H
26
Pulsar Product Manual, Rev. A
4.3.1
Identify Device command
The Identify Device command (command code EC ) transfers information about the drive to the host following
H
power up. The data is organized as a single 512-byte block of data, whose contents are shown in Table 7 on
page 25. All reserved bits or words should be set to zero. Parameters listed with an “x” are drive-specific or
The following commands contain drive-specific features that may not be included in the Serial ATA
specification.
Word
0
Description
Value
0040
General configuration
H
1
Number of logical cylinders (obsolete) 16,383
Specific configuration
3FFF
C837
H
H
2
3
Number of logical heads (obsolete) 16
Retired
0010
0000
H
4-5
6
H
Number of logical sectors per logical track (obsolete) 63
Reserved for CompactFlash Association
Retired
003F
H
H
H
7–8
9
0000
0000
10–19
20-21
22
Serial number: (ATA ASCII string padded with spaces (20 ))
ASCII
H
Retired
0000
0004
H
H
Obsolete
23–26
27–46
47
Firmware revision (ATA ASCII string padded with spaces (20h))
Model number (ATA ASCII string padded with spaces (20h))
ASCII
ASCII
(Bits 7-0) Maximum number of logical sectors that shall be transferred
per DRQ data block on READ/WRITE MULTIPLE commands. 16
8010
H
48
Reserved for Trusted Computing feature set options
Capabilities – Standby Timer, IORDY Support, etc
Capabilities Continued
0000
H
49
2F00
H
H
H
H
H
50
4000
0200
0200
0007
51
PIO data transfer cycle timing option (Obsolete)
Retired
52
53
Words 54–58, 64–70 and 88 are valid
Number of current logical cylinders (Obsolete)
Number of current logical heads (Obsolete)
Number of current logical sectors per logical track (Obsolete)
Current capacity in sectors (Obsolete)
54
3FFF
H
55
0010
H
56
003F
H
57–58
59
FC10 00FB
H
H
Number of LBAs transferred per Read Multiple or Write Multiple.
Sanitize Command Support
0101
H
60–61
Total number of user addressable logical sectors for 28-bit commands
Note: The maximum value allowed in this field is: 0FFFFFFFh. If this
field contains 0FFFFFFFh and the device has user addressable LBAs
greater than or 137GB, then words 100..103 contain the total number
of user addressable LBAs
XXXXXXXX *
H
62
63
Obsolete
0000
0007
H
Multiword DMA active and modes supported
(see note following this table)
H
Pulsar Product Manual, Rev. A
27
Word
64
Description
Value
Advanced PIO modes supported. SATA = 0003h
Minimum Multiword DMA transfer cycle time per word (120ns)
Recommended Multiword DMA transfer cycle time (120ns)
Minimum PIO transfer cycle time without flow control (120ns)
Minimum PIO transfer cycle time with IORDY flow control (120ns)
0003
0078
0078
0078
0078
4000
H
H
H
H
H
H
65
66
67
68
69
Additional Features and Commands supported.
Trim Features supported, DMA commands supported
70
Reserved
0000
0000
H
H
71–74
75
Reserved for ATAPI
Queue depth
001F
H
H
H
76
Serial ATA Capabilities Supported
Reserved for Serial ATA
0706
0000
77
78
Serial ATA features supported
Serial ATA features enabled
Major version number
004C
H
79
0040
H
80
01FC
H
81
Minor version number
0028
H
82
Commands and feature sets supported
Commands and feature sets supported
Commands and feature sets supported
Commands and feature sets supported or enabled
Commands and feature sets supported or enabled
Commands and feature sets supported or enabled
Ultra DMA support and current mode (see note following this table)
Security erase time
746B
H
H
H
H
83
7501
6193
7069
84
85
86
B401
H
H
87
6163
207F
88
H
H
H
89
0000
0000
90
Enhanced security erase time
Current APM level value
91
00FE
H
92
Master password Identifier
0000
0000
0000
0000
H
93
Hardware reset result
H
H
H
94
Reserved
95–99
100–103
ATA-reserved
Total Number of User Addressable Logical Blocks for 48-bit com-
mands. These words are required for drives that support the 48-bit
addressing feature. Maximum value: 0000FFFFFFFFFFFFh
200GB model = 390,721,968
100GB model = 195,371,568
50GB model =
97,696,368
104
105
Reserved for Streaming Command Set
0000
H
H
Maximum number of 512-byte blocks of LBA Range Entries
(see 4.18.3.2) per DATA SET MANAGEMENT command
0001
106
Physical sector size / logical sector size
Inter-seek delay for ISO 7779 standard acoustic testing
World wide name
4000
0000
H
107
H
108–111
XXXX
H
28
Pulsar Product Manual, Rev. A
Word
112–115
116
Description
Value
Reserved
0000
0000
0000
4010
4010
0000
0000
0001
0000
0000
0000
0001
0000
0000
0000
1025
0000
4000
0000
0000
0000
0000
0001
0000
0000
0000
0000
1010
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
Reserved for TLC
117–118
119
Logical sector size (DWord)
Commands and feature sets supported
Commands and feature sets supported or enabled
Reserved for expanded supported and enabled settings
Obsolete
120
121–126
127
128
Security status
129–159
160–167
168
Vendor specific
Reserved for the CompactFlash Association
Device Nominal Form Factor
DATA SET MANAGEMENT features supported
Additional Product Identifier (ATA String)
Reserved
169
170–173
174–175
176–205
206
Reserved
SCT Command Transport
Reserved for CE-ATA
207–208
209
Alignment of logical blocks within a physical block
Write-Read-Verify Sector Count Mode 3
Write-Read-Verify Sector Count Mode 2 (DWord)
NV Cache Capability
210–211
212–213
214
215-216
217
NV Cache Size in Logical Blocks (DWord)
Nominal media rotation rate
Reserved
218
219
NV Cache Options
220
Write-Read-Verify feature set
Reserved
221
222
Transport major version number
Transport minor version number
Reserved
223
FFFF
H
224-233
234
0000
0000
H
Minimum number of 512-byte data blocks per
DOWNLOAD MICROCODE command for mode 03h
H
235
Maximum number of 512-byte data blocks per
DOWNLOAD MICROCODE command for mode 03h
0000
H
236-254
255
Reserved
0000
xxA5
H
H
Integrity word (XXA5 )
H
Pulsar Product Manual, Rev. A
29
Note. See the bit descriptions below for words 49, 50, 69, 76, 78, 82-86, 119 and 119-120 of the Identify Drive data.
Description (if bit is set to 1)
Bit
8
Word 49
DMA Supported
9
Shall be set to 1
10
11
13
Bit
14
Bit
5
IORDY May be disabled
IORDY supported
Standby Timer Values supported
Word 50
Shall be set to 1
Word 69
Shall be set to 1
6
Optional ATA 28-bit commands supported
Download Microcode DMA supported
Set Max Password DMA and Set Max Unlock DMA supported
Write Buffer DMA Supported
Read Buffer DMA Supported
8
9
10
11
12
DEVICE CONFIGURATION IDENTIFY DMA and
DEVICE CONFIGURATION SET DMA are supported
13
14
Bit
0
Long Physical Sector Alignment Error Reporting Control is supported
Deterministic read after Trim is supported
Word 76
Shall be cleared to zero
1
Supports SATA Gen1 Signaling Speed (1.5Gb/s)
Supports SATA Gen2 Signaling Speed (3.0Gb/s)
Reserved for Serial ATA
2
3-7
8
Supports the NCQ feature set
9
Supports receipt of host initiated power management requests
Supports Phy Event Counters
10
11
12
13-15
Bit
0
Supports Unload while NCQ commands are outstanding
Supports NCQ priority information
Reserved for Serial ATA
Word 78
Shall be cleared to zero
1
Device supports non-zero buffer offsets
Device supports DMA Setup auto-activation
Device supports initiating power management
Device supports in-order data delivery
Reserved for Serial ATA
2
3
4
5
30
Pulsar Product Manual, Rev. A
6
Device supports Software Settings Preservation
Reserved for Serial ATA
7-15
Bit
0
Word 82
The SMART feature set is supported
The Security feature set is supported
Obsolete
1
2
3
Mandatory Power Management feature set is supported
PACKET feature set is supported
Volatile write cache is supported
Read look-ahead is supported
Release interrupt is supported
SERVICE interrupt is supported
DEVICE RESET command is supported
HPA feature set is supported
Obsolete
4
5
6
7
8
9
10
11
12
13
14
15
Bit
0
WRITE BUFFER command is supported
READ BUFFER command is supported
NOP command is supported
Obsolete
Word 83
DOWNLOAD MICROCODE command is supported
Obsolete
1
2
CFA feature set is supported
APM feature set is supported
Obsolete
3
4
5
PUIS feature set is supported
SET FEATURES subcommand is required to spin-up after power-up
Reserved
6
7
8
SET MAX security extension is supported
AAM feature set is supported
48-bit Address feature set is supported
DCO feature set is supported
Mandatory FLUSH CACHE command is supported
FLUSH CACHE EXT command is supported
Shall be set to one
9
10
11
12
13
14
15
Bit
0
Shall be cleared to zero
Word 84
SMART error logging is supported
SMART self-test is supported
1
Pulsar Product Manual, Rev. A
31
2
Media serial number is supported
Media Card Pass Through Command feature set is supported
Streaming feature set is supported
GPL feature set is supported
3
4
5
6
WRITE DMA FUA EXT and WRITE MULTIPLE FUA EXT commands are supported
Obsolete
7
8
64-bit World wide name is supported
Obsolete
9-10
11-12
13
14
15
Bit
9
Reserved for TLC
IDLE IMMEDIATE command with UNLOAD feature is supported
Shall be set to one
Shall be cleared to zero
Word 85
DEVICE RESET command is not supported
HPA feature set is supported
10
11
12
13
14
15
Bit
0
Obsolete
WRITE BUFFER command is supported
READ BUFFER command is supported
NOP command is supported
Obsolete
Word 86
DOWNLOAD MICROCODE command is supported
Obsolete
1
2
CFA feature set is supported
6
SET FEATURES subcommand is required to spin-up after power-up
The 48-bit Address features set is supported
The DCO feature set is supported
FLUSH CACHE command supported
FLUSH CACHE EXT command supported
Words 119..120 are valid
10
11
12
13
15
Bit
0
Word 87
SMART error logging is supported
SMART self-test supported
1
3
The Media Card Pass Through Command feature set is supported
The GPL feature set is supported
WRITE DMA FUA EXT and WRITE MULTIPLE FUA EXT commands are supported
The 64-bit World wide name is supported
The IDLE IMMEDIATE command with UNLOAD FEATURE is supported
5
6
8
13
32
Pulsar Product Manual, Rev. A
14
15
Bit
0
Shall be set to one
Shall be cleared to zero
Word 119
Reserved
1
Write-Read-Verify feature set is supported
WRITE UNCORRECTABLE EXT command is supported
READ LOG DMA EXT and WRITE LOG DMA EXT commands are supported
DOWNLOAD MICROCODE command with mode 3 is supported
Free-fall Control feature set is supported
Extended Status Reporting feature set is supported
Extended Power Conditions feature set is supported
Reserved
2
3
4
5
6
7
8-13
14
15
Bit
2
Shall be set to one
Shall be cleared to zero
Word 119
WRITE UNCORRECTABLE EXT command is supported
READ LOG DMA EXT and WRITE LOG DMA EXT commands are supported
DOWNLOAD MICROCODE command with mode 3 is supported
Shall be set to one
3
4
14
15
Shall be cleared to zero
Pulsar Product Manual, Rev. A
33
4.3.2
Set Features command
This command controls the implementation of various features that the drive supports. When the drive receives
this command, it sets BSY, checks the contents of the Features register, clears BSY and generates an inter-
rupt. If the value in the register does not represent a feature that the drive supports, the command is aborted.
Power-on default has the read look-ahead and write caching features enabled. The acceptable values for the
Features register are defined as follows:
Table 8:
Set Features command values
02
03
Enable write cache (default).
H
H
Set transfer mode (based on value in Sector Count register).
Sector Count register values:
00 Set PIO mode to default (PIO mode 2).
H
01 Set PIO mode to default and disable IORDY (PIO mode 2).
H
08 PIO mode 0
H
09 PIO mode 1
H
0A PIO mode 2
H
0B PIO mode 3
H
0C PIO mode 4 (default)
H
20 Multiword DMA mode 0
H
21 Multiword DMA mode 1
H
22 Multiword DMA mode 2
H
40 Ultra DMA mode 0
H
41 Ultra DMA mode 1
H
42 Ultra DMA mode 2
H
43 Ultra DMA mode 3
H
44 Ultra DMA mode 4
H
45 Ultra DMA mode 5
H
46 Ultra DMA mode 6
H
10
Enable use of SATA features
H
02 DMA Setup FIS Auto-Activate optimization
H
03 Device-initiated interface power state transitions
H
06 Software Settings Preservation
H
55
66
82
90
Disable read look-ahead (read cache) feature
Disable reverting to power-on defaults
Disable write cache
H
H
H
H
Disable use of SATA features
02 DMA Setup FIS Auto-Activate optimization
H
03 Device-initiated interface power state transitions
H
06 Software Settings Preservation
H
AA
Enable read look-ahead (read cache) feature (default).
H
CC
Enable reverting to power-on defaults
H
Note. At power-on, or after a hardware or software reset, the default values of the features are as
indicated above.
34
Pulsar Product Manual, Rev. A
4.3.3
S.M.A.R.T. commands
S.M.A.R.T. provides near-term failure prediction for drives. When S.M.A.R.T. is enabled, the drive monitors
predetermined drive attributes that are susceptible to degradation over time. If self-monitoring determines that
a failure is likely, S.M.A.R.T. makes a status report available to the host. Not all failures are predictable.
S.M.A.R.T. predictability is limited to the attributes the drive can monitor. For more information on S.M.A.R.T.
commands and implementation, see the Draft ATA-8 Standard.
SeaTools diagnostic software activates a built-in drive self-test (DST S.M.A.R.T. command for D4 ) that elimi-
H
nates unnecessary drive returns. The diagnostic software ships with all new drives and is also available at:
This drive is shipped with S.M.A.R.T. features disabled. You must have a recent BIOS or software package that
supports S.M.A.R.T. to enable this feature. The table below shows the S.M.A.R.T. command codes that the
drive uses.
Table 9:
S.M.A.R.T. commands
Code in features register
S.M.A.R.T. command
D0
D2
D3
D4
D5
D6
D8
D9
S.M.A.R.T. Read Data
H
H
H
H
H
H
H
H
S.M.A.R.T. Enable/Disable Attribute Autosave
S.M.A.R.T. Save Attribute Values
S.M.A.R.T. Execute Off-line Immediate (runs DST)
S.M.A.R.T. Read Log Sector
S.M.A.R.T. Write Log Sector
S.M.A.R.T. Enable Operations
S.M.A.R.T. Disable Operations
S.M.A.R.T. Return Status
DA
H
Note. If an appropriate code is not written to the Features Register, the command is aborted and 0x04
(abort) is written to the Error register.
Pulsar Product Manual, Rev. A
35
36
Pulsar Product Manual, Rev. A
5.0
Seagate Technology support services
Online services
Web
Worldwide support is available 24 hours daily by email for your questions.
Warranty Support:
http://www.seagate.com/www/en-us/support/warranty_&_returns_assistance
direct.seagate.com
direct.seagate.com is the industry's first Web portal designed specifically for OEMs and distributors. It provides
self-service access to critical applications, personalized content and the tools that allow our partners to man-
age their Seagate account functions. Submit pricing requests, orders and returns through a single, password-
protected Web interface-anytime, anywhere in the world.
spp.seagate.com
spp.seagate.com supports Seagate resellers with product information, program benefits and sales tools. You
may register for customized communications that are not available on the web. These communications contain
product launch, EOL, pricing, promotions and other channel-related information. To learn more about the ben-
Pulsar Product Manual, Rev. A
37
Customer Service Operations
Presales Support
Our Presales Support staff can help you determine which Seagate products are best suited for your specific
application or computer system, as well as product availability and compatibility.
Technical Support
Seagate technical support is available to assist you online at support.seagate.com or through one of our call
centers. Have your system configuration information and your "ST" model/product number available.
Warranty Service
Seagate offers worldwide customer support for Seagate products. Seagate distributors, OEMs and other direct
customers should contact their Seagate Customer Service Operations (CSO) representative for warranty-
related issues. Resellers or end users of drive products should contact their place of purchase or Seagate war-
ranty service for assistance. Have your serial number and model or part number available.
Data Recovery Services
Seagate offers data recovery services for all formats and all brands of storage media. Our data recovery ser-
vices labs are currently located throughout the world. . Additional information, including an online request form
Authorized Service Centers
Seagate Service Centers are available on a global basis for the return of defective products.
USA/Canada/Latin America support services
For an extensive list of telephone numbers to technical support, presales and warranty service in USA/
Presales, Technical, and Warranty Support
Call Center
USA, Canada,
and Mexico
Toll-free
Direct dial
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+1-405-324-4700
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Call Center
Toll-free
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+1-905-474-2162
1-800-475-0158
+1-905-474-2459
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For an extensive list of telephone numbers to technical support, presales and warranty service in Europe, the
Asia/Pacific Support Services
For an extensive list of telephone numbers to technical support, presales and warranty service in Asia/Pacific,
38
Pulsar Product Manual, Rev. A
EN60950 16
ESD 19
Index
A
ACA 16
acceleration 14
EU 16
altitude 13
F
features 1
C
capacity 5
certification 16
G
geometry 5
Gs 14
compatibility 16
connectors 20
H
heads 5
height 6
humidity 13
I
CSA60950-1 16
cycles 15
Idle 25
Cylinders 5
D
is 7
dimensions 21
E
ITE 16
Electromagnetic Compatibility Directive (2004/108/
EC) 16
K
KCC 16
Pulsar Product Manual, Rev. A
39
42
Pulsar Product Manual, Rev. A
Seagate Technology LLC
920 Disc Drive, Scotts Valley, California 95066-4544, USA
Publication Number: 100596473, Rev. A
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