Seagate MOMENTUS THIN ST250LT009 9WC14C User Manual

Product Manual  
®
Momentus Thin  
7200-RPM  
ST model # - Part #  
ST model # - Part #  
Standard models  
SED model  
ST320LT007 - 9ZV142  
ST250LT007 - 9ZV14C  
ST160LT007 - 9ZV14D  
ST320LT014 - 9YK142  
ST250LT014 - 9YK14C  
ST160LT014 - 9YK14D  
Free-Fall Sensor models  
ST320LT011 - 9ZVG42  
ST250LT011 - 9ZVG4C  
ST160LT011 - 9ZVG4D  
SED (FIPS 140-2) models  
ST320LT009 - 9WC142  
ST250LT009 - 9WC14C  
ST160LT009 - 9WC14D  
Gen-2  
100625253  
Rev. C  
January 2011  
Contents  
6.3.3  
Momentus Thin Product Manual, Rev. C Gen-2  
i
ii  
Momentus Thin Product Manual, Rev. C Gen-2  
1.0  
Seagate Technology support services  
SEAGATE ONLINE SUPPORT and SERVICES  
Available services include:  
Presales & Technical support  
Global Support Services telephone numbers & business hours  
Authorized Service Centers  
For information regarding Warranty Support, visit  
http://www.seagate.com/www/en-us/support/warranty_&_returns_assistance  
Momentus Thin Product Manual, Rev. C Gen-2  
1
   
2.0  
Introduction  
This manual describes the functional, mechanical and interface specifications for the following Seagate  
Momentus® Thin model drives:  
ST model #  
Part #  
ST model #  
Part #  
ST model #  
Part #  
ST model #  
Part #  
Standard models  
Standard SED models  
SED (FIPS 140-2) models  
Free-Fall Sensor models  
ST320LT007  
ST250LT007  
ST160LT007  
9ZV142  
ST320LT014  
ST250LT014  
ST160LT014  
9YK142  
9YK14C  
9YK14D  
ST320LT009  
ST250LT009  
ST160LT009  
9WC142  
9WC14C  
9WC14D  
ST320LT011  
ST250LT011  
ST160LT011  
9ZVG42  
9ZVG4C  
9ZVG4D  
9ZV14C  
9ZV14D  
Note. Previous generations of Seagate Self-Encrypting Drive models were called Full Disk Encryption  
(FDE) models before a differentiation between drive-based encryption and other forms of encryp-  
tion was necessary.  
Note. The Self-Encrypting Drive models indicated on the cover of this product manual have provisions for  
“Security of Data at Rest” based on the standards defined by the Trusted Computing Group (see  
www.trustedcomputinggroup.org).  
For more information on FIPS 140-2 Level 2 certification See Section 5.0 on page 22 .  
These drives provide the following key features:  
• 7200-RPM spindle speed.  
• 16-MB buffer.  
• Quiet operation. Fluid Dynamic Bearing (FDB) motor.  
• High instantaneous (burst) data-transfer rates (up to 3Gb/s).  
• Perpendicular recording technology.  
• State-of-the-art cache and on-the-fly error-correction algorithms.  
• Native Command Queuing (NCQ) with command ordering.  
• Full-track multiple-sector transfer capability without local processor intervention.  
• 1000 Gs nonoperating shock and 350 Gs of operating shock.  
• SeaTools diagnostic software performs a drive self-test that eliminates unnecessary drive returns.  
• The 3D Defense System™, which includes Drive Defense, Data Defense and Diagnostic Defense, offers the  
industry’s most comprehensive protection for disk drives.  
• Support for S.M.A.R.T. drive monitoring and reporting.  
• Support for Read Multiple and Write Multiple commands.  
2
Momentus Thin Product Manual, Rev. C Gen-2  
       
Momentus Thin Self-Encrypting Drive models have the following additional features:  
• Automatic data encryption/decryption  
• Controlled access  
• Random number generator  
• Drive locking  
• 16 independent data bands  
• Cryptographic erase of user data for a drive that will be repurposed or scrapped  
• Authenticated firmware download  
There is no significant performance difference between Self-Encrypting Drive and standard (non-Self-Encrypt-  
ing Drive) models.  
2.1  
About the Serial ATA interface  
The Serial ATA interface provides several advantages over the traditional (parallel) ATA interface. The primary  
advantages include:  
• Easy installation and configuration with true plug-and-play connectivity. It is not normally necessary to set  
any jumpers or other configuration options.  
• Thinner and more flexible cabling for improved enclosure airflow and ease of installation.  
• Scalability to higher performance levels.  
In addition, Serial ATA makes the transition from parallel ATA easy by providing legacy software support. Serial  
ATA was designed to allow you to install a Serial ATA host adapter and Serial ATA disk drive in your current  
system and expect all of your existing applications to work as normal.  
The Serial ATA interface connects each disk drive in a point-to-point configuration with the Serial ATA host  
adapter. There is no master/slave relationship with Serial ATA devices like there is with parallel ATA. If two  
drives are attached on one Serial ATA host adapter, the host operating system views the two devices as if they  
were both “masters” on two separate ports. This essentially means both drives behave as if they are Device 0  
(master) devices.  
Note. The host adapter may, optionally, emulate a master/slave environment to host software where two  
devices on separate Serial ATA ports are represented to host software as a Device 0 (master) and  
Device 1 (slave) accessed at the same set of host bus addresses. A host adapter that emulates a  
master/slave environment manages two sets of shadow registers. This is not a typical Serial ATA  
environment.  
The Serial ATA host adapter and drive share the function of emulating parallel ATA device behavior to provide  
backward compatibility with existing host systems and software. The Command and Control Block registers,  
PIO and DMA data transfers, resets, and interrupts are all emulated.  
The Serial ATA host adapter contains a set of registers that shadow the contents of the traditional device regis-  
ters, referred to as the Shadow Register Block. All Serial ATA devices behave like Device 0 devices. For addi-  
tional information about how Serial ATA emulates parallel ATA, refer to the “Serial ATA: High Speed Serialized  
Momentus Thin Product Manual, Rev. C Gen-2  
3
       
3.0  
Drive specifications  
Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal  
power. For convenience, the phrases the drive and this drive are used throughout this manual to indicate all  
models.  
3.1  
Specification summary table  
The specifications listed in this table are for quick reference. For details on specification measurement or defi-  
nition, see the appropriate section of this manual  
Table 1:  
Drive specifications  
ST320LT007 - 9ZV142  
ST320LT009 - 9WC142  
ST320LT011 - 9ZVG42  
ST320LT014 - 9YK142  
ST250LT007 - 9ZV14C  
ST250LT009 - 9WC14C  
ST250LT011 - 9ZVG4C  
ST250LT014 - 9YK14C  
ST160LT007 - 9ZV14D  
ST160LT009 - 9WC14D  
ST160LT011 - 9ZVG4D  
ST160LT014 - 9YK14D  
Drive specification  
Formatted capacity (GB)*  
Guaranteed logical blocks (LBA)  
Bytes per physical sector  
Physical read/write heads  
Disks  
320  
250  
160  
625,142,448  
4096  
2
488,397,168  
312,581,808  
1
1
Cache (MB)  
16  
Recording density in BPI (bits/in avg)  
Track density TPI (tracks/in avg)  
Areal density (Gb/in2 avg)  
Spindle speed (RPM)  
1397k  
315k  
425  
7200  
4.17  
1247  
3.0  
Average latency (ms)  
Internal transfer rate (Mb/s max)  
I/O data transfer rate (Gb/s max)  
ATA data-transfer modes supported  
SATA 1.0, Serial ATA Revision 2.6  
PIO modes 0–4  
Multiword DMA modes 0–2  
Ultra DMA modes 0–6  
Height (max)  
7.0 mm (0.276 in)  
70.10 mm (2.76 in)  
100.55 mm (3.959 in)  
<92.0 g (<0.203 lb)  
3.5  
Width (max)  
Length (max)  
Weight (max)  
Power-on to ready (sec typical)  
Standby to ready (sec typical)  
3.0  
Track-to-track seek time, read (ms typical) 1.5  
Average seek, read (ms typical)  
Startup current, +5V (max)  
11  
1.0A  
4
Momentus Thin Product Manual, Rev. C Gen-2  
                                                                   
Table 1:  
Drive specifications  
ST320LT007 - 9ZV142  
ST320LT009 - 9WC142  
ST320LT011 - 9ZVG42  
ST320LT014 - 9YK142  
ST250LT007 - 9ZV14C  
ST250LT009 - 9WC14C  
ST250LT011 - 9ZVG4C  
ST250LT014 - 9YK14C  
ST160LT007 - 9ZV14D  
ST160LT009 - 9WC14D  
ST160LT011 - 9ZVG4D  
ST160LT014 - 9YK14D  
Drive specification  
Read/write power (typical)  
Idle mode, low power (typical)  
Standby/Sleep mode (typical)  
Voltage tolerance (including noise)  
Ambient temperature  
Read: 1.6W; Write: 1.9W  
0.66W  
0.15W ***  
+5V ± 10%  
0° to 60°C (operating), –40° to 70°C (nonoperating)  
Temperature gradient  
(°C per hour max)  
20°C (operating)  
35°C (nonoperating)  
Relative humidity  
5% to 95% (operating)  
5% to 95% (nonoperating)  
Relative humidity gradient  
30% per hour max  
Wet bulb temperature  
(°C max)  
37.7 (operating)  
40 (nonoperating)  
Altitude, operating  
–304.8 m to 3,048 m (–1000 ft. to 10,000+ ft.)  
–304.8 m to 12,192 m (–1000 ft. to 40,000+ ft.)  
Altitude, nonoperating  
(meters below mean sea level, max)  
Shock, operating (Gs max at 2ms)  
Shock, nonoperating (Gs max at 2ms)  
Shock, nonoperating (Gs max at 1ms)  
Shock, nonoperating (Gs max at 0.5ms)  
Vibration, operating (Swept Sine)  
Vibration, nonoperating  
350  
800  
1000  
600  
1.0 Gs (0 to peak, 5–500 Hz)  
5.0 Gs (0 to peak, 5–500 Hz)  
Drive acoustics, sound power (bels)  
Idle**  
2.3 (typical)  
2.5 (max)  
Seek  
2.5 (typical)  
2.7 (max)  
Nonrecoverable read errors  
Annualized Failure Rate (AFR)  
Load/Unload (U/UL) cycles  
1 per 1014 bits read  
0.50%  
25°C, 50% relative humidity  
600,000 software-controlled power on/off cycles  
20,000 hard power on/off cycles  
32°C, 80% relative humidity  
5°C, 80% relative humidity  
5°C, 10% relative humidity  
55°C, 16% relative humidity  
600,000 software-controlled power on/off cycles  
20,000 hard power on/off cycles  
Warranty  
To determine the warranty for a specific drive, use a web browser to access the following  
web page: http://www.seagate.com/www/en-us/support/warranty_&_returns_assistance  
You will be asked to provide the drive serial number, model number (or part number)  
and country of purchase. After submitting this information, the system will display the  
warranty information for your drive.  
Supports Hotplug operation per Serial ATA Yes (requires COMRESET from host after a hotplug event)  
Revision 2.6 specification  
*One GB equals one billion bytes when referring to hard drive capacity. Accessible capacity may vary depending on operating environment  
and formatting.  
**During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and  
power to operational levels.  
***Typical notebooks will pull power to the drive when entering S3 and S4; while in the S3 and S4 states, drive sleep and drive standby  
modes will not contribute to battery power consumption.  
Momentus Thin Product Manual, Rev. C Gen-2  
5
                                                 
3.2  
Formatted capacity  
Formatted capacity*  
Guaranteed logical blocks (LBA) - 512 emulation  
Bytes per physical sector  
ST320LT007 - 9ZV142  
ST320LT009 - 9WC142  
ST320LT011 - 9ZVG42  
ST320LT014 - 9YK142  
625,142,448  
ST250LT007 - 9ZV14C  
ST250LT009 - 9WC14C  
ST250LT011 - 9ZVG4C  
ST250LT014 - 9YK14C  
488,397,168  
312,581,808  
4096  
ST160LT007 - 9ZV14D  
ST160LT009 - 9WC14D  
ST160LT011 - 9ZVG4D  
ST160LT014 - 9YK14D  
*One GB equals one billion bytes when referring to hard drive capacity. Accessible capacity may vary depending on operating environment  
and formatting.  
3.2.1  
LBA mode  
When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1,  
where n is the number of guaranteed logical blocks (LBA) as defined above.  
See Section 6.3.1, "Identify Device command" (words 60-61 and 100-103) for additional information about 48-  
bit addressing support of drives with capacities over 137GB.  
3.3  
Default logical geometry  
Cylinders  
Read/write heads  
Sectors per track  
63  
16,383  
16  
LBA mode  
When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1,  
where n is the number of guaranteed logical blocks (LBA) as defined above.  
3.4  
Physical organization  
Models  
Read/write heads  
Number of disks  
320GB models  
250GB models  
160GB models  
2
1
1
6
Momentus Thin Product Manual, Rev. C Gen-2  
                                     
3.5  
Recording and interface technology  
4K sector models  
Interface  
Serial ATA (SATA)  
Recording method  
Perpendicular  
Recording density BPI (bits/in avg)  
Track density TPI (tracks/in avg)  
1397k  
315k  
2
Areal density (Gb/in avg)  
425  
Spindle speed (RPM) ( 0.2%)  
Maximum Internal transfer rate (Mb/s)  
I/O data-transfer rate (Gb/s max)  
Interleave  
7200  
1247  
3.0  
1:1  
Cache buffer  
16 MB (16,384 KB)  
3.6  
Physical characteristics  
Drive specification  
Height  
(mm)  
(in)  
6.8 +/-0.2  
0.268 +/-0.0079  
Width  
(mm)  
(in)  
69.85 +/-0.25  
2.75 +/-0.0098  
Length  
(mm)  
(in)  
100.35 +0.20/-0.25  
3.951 +0.008/-0.010  
Weight (max)  
All models  
92.0 g  
0.203 lb  
3.7  
Seek time  
Seek measurements are taken with nominal power at 25°C ambient temperature. All times are measured using  
drive diagnostics. The specifications in the table below are defined as follows:  
• Track-to-track seek time is an average of all possible single-track seeks in both directions.  
• Average seek time is a true statistical random average of at least 5000 measurements of seeks between  
random tracks, less overhead.  
Table 2:  
Typical seek times  
Typical seek times (ms)  
Track-to-track  
Read  
1.5  
Average  
11  
Average latency  
4.17  
Note. These drives are designed to consistently meet the seek times represented in this manual. Physical  
seeks, regardless of mode (such as track-to-track and average), are expected to meet the noted  
values. However, due to the manner in which these drives are formatted, benchmark tests that  
include command overhead or measure logical seeks may produce results that vary from these  
specifications.  
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3.8  
Start/stop times  
Max @ 25°C  
Time to ready  
Typical  
3.5  
Power-on to Ready (sec)  
Standby to Ready (sec)  
4.0  
3.0  
3.0  
3.9  
Power specifications  
The drive receives DC power (+5V) through a native SATA power connector.  
3.9.1 Power consumption  
Power requirements for the drives are listed in the table on page 8. Typical power measurements are based on  
an average of drives tested, under nominal conditions, at 25°C ambient temperature. These power measure-  
ments are done with Interface Power Management modes like HIPM and DIPM enabled.  
• Spinup power  
Spinup power is measured from the time of power-on to the time that the drive spindle reaches operating speed.  
• Seek mode  
During seek mode, the read/write actuator arm moves toward a specific position on the disk surface and does  
not execute a read or write operation. Servo electronics are active. Seek mode power is measured based on  
three random seek operations every 100ms. This mode is not typical.  
Read/write power and current  
Read/write power is measured with the heads on track, based on three 63 sector read or write operations  
every 100ms.  
• Idle mode power  
Idle mode power is measured with the drive up to speed, with servo electronics active and with the heads in  
a random track location.  
• Standby mode  
During Standby mode, the drive accepts commands, but the drive is not spinning, and the servo and read/  
write electronics are in power-down model  
Table 3:  
DC power  
Power dissipation  
Spinup (max)  
Seek  
+5V input average (25° C)  
1.00A  
1.6W  
Read  
1.6W  
Write  
1.9W  
Idle, performance*  
Idle, active*  
Idle, low power mode*  
Standby**  
1.3W  
0.90W  
0.66W  
0.15W  
0.15W  
Sleep  
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and  
8
Momentus Thin Product Manual, Rev. C Gen-2  
                                             
power to operational levels.  
**Standby power is measured at steady state (after 200ms from transition)  
Momentus Thin Product Manual, Rev. C Gen-2  
9
3.9.1.1  
Typical current profile  
Figure 1. Typical +5V only startup and operation current profile  
3.9.2 Deferred spinup  
Momentus Thin drives do not support the deferred spinup option. If you require this option, refer to the Momen-  
tus 5400.3 SATA Blade Server family of drives.  
3.9.3  
Conducted noise  
Input noise ripple is measured at the host system power supply across an equivalent 15-ohm resistive load on  
the +5 volt line.  
Using 5-volt power, the drive is expected to operate with a maximum of 100 mV peak-to-peak square-wave  
injected noise at up to 10 MHz.  
Note. Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write  
current.  
3.9.4  
Voltage tolerance  
Voltage tolerance (including noise):  
5V ± 10%  
10  
Momentus Thin Product Manual, Rev. C Gen-2  
                 
3.9.5  
Power-management modes  
The drive provides programmable power management to provide greater energy efficiency. In most systems,  
you can control power management through the system setup program. The drive features the following  
power-management modes:  
Table 4:  
Power management modes  
Power modes  
Active (operating)  
Idle, performance  
Idle, active  
Heads  
Spindle  
Rotating  
Rotating  
Rotating  
Rotating  
Stopped  
Stopped  
Buffer  
Tracking  
Tracking  
Floating  
Parked  
Parked  
Parked  
Full power  
Self refresh—low power  
Self refresh—low power  
Self refresh—low power  
Self refresh—low power  
Self refresh—low power  
Idle, low power  
Standby  
Sleep  
• Active mode  
The drive is in Active mode during the read/write and seek operations.  
• Idle mode  
The buffer remains enabled, and the drive accepts all commands and returns to Active mode any time disk  
access is necessary.  
• Standby mode  
The drive enters Standby mode when the host sends a Standby Immediate command. If the host has set the  
standby timer, the drive can also enter Standby mode automatically after the drive has been inactive for a  
specifiable length of time. The standby timer delay is established using a Standby or Idle command. In Standby  
mode, the drive buffer is in Self Refresh Low Power mode, the heads are parked and the spindle is at rest.  
The drive accepts all commands and returns to Active mode any time disk access is necessary.  
• Sleep mode  
The drive enters Sleep mode after receiving a Sleep command from the host. In Sleep mode, the drive buffer  
is in Self Refresh Low Power mode, the heads are parked and the spindle is at rest. The drive leaves Sleep  
mode after it receives a Hard Reset or Soft Reset from the host. After receiving a reset, the drive exits Sleep  
mode and enters Standby mode with all current translation parameters intact.  
• Idle and Standby timers  
Each time the drive performs an Active function (read, write or seek), the standby timer is reinitialized and  
begins counting down from its specified delay times to zero. If the standby timer reaches zero before any  
drive activity is required, the drive makes a transition to Standby mode. In both Idle and Standby mode, the  
drive accepts all commands and returns to Active mode when disk access is necessary.  
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11  
                     
3.10  
Environmental specifications  
Ambient temperature  
3.10.1  
Ambient temperature is defined as the temperature of the environment immediately surrounding the drive.  
Above 1000 feet (305 meters), the maximum temperature is derated linearly by 1°C every 1000 feet.  
Operating:  
0° to 60°C (32° to 140°F)  
Nonoperating:  
–40° to 70°C (–40° to 158°F)  
3.10.2  
Temperature gradient  
Operating  
20°C per hour (68°F per hour max), without condensation  
35°C per hour (95°F per hour max), without condensation  
Nonoperating  
3.10.3  
Humidity  
Relative humidity  
3.10.3.1  
Operating  
5% to 95% noncondensing (30% per hour max)  
5% to 95% noncondensing (30% per hour max)  
Nonoperating  
3.10.3.2  
Wet bulb temperature  
Operating  
37.7°C (99.86°F max)  
40°C (104°F max)  
Nonoperating  
3.10.4  
Altitude  
Operating  
Nonoperating  
–304.8 m to 3,048 m (–1000 ft to 10,000+ ft)  
–304.8 m to 12,192 m (–1000 ft to 40,000+ ft)  
12  
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3.10.5  
Shock  
All shock specifications assume that the drive is mounted securely with the input shock applied at the drive  
mounting screws. Shock may be applied in the X, Y or Z axis.  
3.10.5.1  
Operating shock  
These drives comply with the performance levels specified in this document when subjected to a maximum  
operating shock of 350 Gs based on half-sine shock pulses of 2ms. Shocks should not be repeated more than  
two times per second.  
3.10.5.2  
Nonoperating shock  
The nonoperating shock level that the drive can experience without incurring physical damage or degradation  
in performance when subsequently put into operation is 800 Gs based on a nonrepetitive half-sine shock pulse  
of 2ms duration.  
The nonoperating shock level that the drive can experience without incurring physical damage or degradation  
in performance when subsequently put into operation is 1000 Gs based on a nonrepetitive half-sine shock  
pulse of 1ms duration.  
The nonoperating shock level that the drive can experience without incurring physical damage or degradation  
in performance when subsequently put into operation is 600 Gs based on a nonrepetitive half-sine shock pulse  
of 0.5ms duration.  
3.10.6  
Vibration  
All vibration specifications assume that the drive is mounted securely with the input vibration applied at the  
drive mounting screws. Vibration may be applied in the X, Y or Z axis.  
3.10.6.1  
Operating vibration  
The maximum vibration levels that the drive may experience while meeting the performance standards speci-  
fied in this document are specified below.  
5–500 Hz  
1.0 Gs (0 to peak). Max displacement may apply below 10Hz.  
3.10.6.2  
Nonoperating vibration  
The maximum nonoperating vibration levels that the drive may experience without incurring physical damage  
or degradation in performance when subsequently put into operation are specified below.  
5–500 Hz:  
5.0 Gs (0 to peak). Max displacement may apply below 22Hz.  
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13  
                   
3.11  
Acoustics  
Drive emission of sound is measured consistent with the ECMA-74 and its’ referenced standards. Testing is  
conducted at room temperature (approximately 25°C). Emission levels are reported as the total A-weighted  
sound power levels for steady state, idle, and active seek modes of operation.  
Table 5:  
Drive A-weighted Sound Power Levels (SWL, BA)  
Idle*  
Performance seek  
2.3 bels (typ)  
2.5 bels (max)  
2.5 bels (typ)  
2.7 bels (max)  
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and  
power to operational levels.  
Test for Prominent Discrete Tones (PDTs)  
Seagate follows the ECMA-74 standards for measurement and identification of PDTs. An exception to this pro-  
cess is the use of the absolute threshold of hearing. Seagate uses the lower limit for the threshold curve* to  
discern tone audibility and to compensate for the inaudible components of sound prior to computation of tone  
ratios according to Annex D of the ECMA-74 standards.  
*Defined as the median curve given by ISO 389-7 (Tf curve) minus 10dB at all frequencies.  
3.12  
Electromagnetic immunity  
When properly installed in a representative host system, the drive operates without errors or degradation in  
performance when subjected to the radio frequency (RF) environments defined in the following table:  
Table 6:  
Radio frequency environments  
Performance  
level  
Reference  
standard  
Test  
Description  
Electrostatic discharge  
Radiated RF immunity  
Contact, HCP, VCP: 4 kV; Air: 8 kV  
B
A
EN 61000-4-2: 95  
80 to 2000 MHz, 10 V/m,  
80% AM with 1 kHz sine  
900 MHz, 3 V/m, 50% pulse modulation @ 200 Hz  
EN 61000-4-3: 96  
ENV 50204: 95  
Electrical fast transient  
Surge immunity  
1 kV on AC mains, 0.5 kV on external I/O  
1 kV differential, 2 kV common, AC mains  
B
B
A
EN 61000-4-4: 95  
EN 61000-4-5: 95  
EN 61000-4-6: 97  
Conducted RF immunity  
150 kHz to 80 MHz, 3 Vrms, 80% AM with 1 kHz  
sine  
Power Frequency H-field  
immunity  
1 A/m, 50Hz/60Hz, 3 axes  
A
EN 61000-4-8: 97  
EN 61000-4-11: 94  
Voltage dips, interrupts  
30% Reduction for 25 cycles  
>95% Reduction for 250 cycles  
>95%, 0.5 cycles  
C
C
B
14  
Momentus Thin Product Manual, Rev. C Gen-2  
                       
3.13  
Reliability  
Measurement type  
Specification  
14  
Nonrecoverable read errors  
Annualized Failure Rate (AFR)  
Load/Unload (U/UL)  
1 per 10 bits read, max  
<0.50%  
25°C, 50% relative humidity  
600,000 software-controlled power on/off cycles  
20,000 hard power on/off cycles  
32°C, 80% relative humidity  
5°C, 80% relative humidity  
5°C, 10% relative humidity  
55°C, 16% relative humidity  
600,000 software-controlled power on/off cycles  
20,000 hard power on/off cycles  
To determine the warranty for a specific drive, use a web browser to access the  
following web page:  
Warranty  
http://www.seagate.com/www/en-us/support/warranty_&_returns_assistance  
You will be asked to provide the drive serial number, model number (or part number)  
and country of purchase. After submitting this information, the system will display the  
warranty information for your drive.  
3.14  
Agency certification  
3.14.1  
Safety certification  
These products are certified to meet the requirements of UL60950-1, CSA60950-1 and EN60950 and so  
marked as to the certify agency.  
3.14.2  
Electromagnetic compatibility  
Hard drives that display the CE mark comply with the European Union (EU) requirements specified in the Elec-  
tromagnetic Compatibility Directive (2004/108/EC) as put into place 20 July 2007. Testing is performed to the  
levels specified by the product standards for Information Technology Equipment (ITE). Emission levels are  
defined by EN 55022, Class B and the immunity levels are defined by EN 55024.  
Drives are tested in representative end-user systems. Although CE-marked Seagate drives comply with the  
directives when used in the test systems, we cannot guarantee that all systems will comply with the directives.  
The drive is designed for operation inside a properly designed enclosure, with properly shielded I/O cable (if  
necessary) and terminators on all unused I/O ports. Computer manufacturers and system integrators should  
confirm EMC compliance and provide CE marking for their products.  
Korean RRL  
If these drives have the Korean Communications Commission (KCC) logo, they comply with paragraph 1 of  
Article 11 of the Electromagnetic Compatibility control Regulation and meet the Electromagnetic Compatibility  
(EMC) Framework requirements of the Radio Research Laboratory (RRL) Communications Commission,  
Republic of Korea.  
These drives have been tested and comply with the Electromagnetic Interference/Electromagnetic  
Susceptibility (EMI/EMS) for Class B products. Drives are tested in a representative, end-user system by a  
Korean-recognized lab.  
• Certificate number:  
• Trade name or applicant:  
• Certificate date:  
STX-MomentusThin (B)  
Seagate Technology LLC  
May 14, 2010  
• Manufacturer/nationality:  
USA, Singapore and China  
Momentus Thin Product Manual, Rev. C Gen-2  
15  
                                                                       
Australian C-Tick (N176)  
If these models have the C-Tick marking, they comply with the Australia/New Zealand Standard AS/NZ  
CISPR22 and meet the Electromagnetic Compatibility (EMC) Framework requirements of the Australian  
Communication Authority (ACA).  
3.14.3  
FCC verification  
These drives are intended to be contained solely within a personal computer or similar enclosure (not attached  
as an external device). As such, each drive is considered to be a subassembly even when it is individually mar-  
keted to the customer. As a subassembly, no Federal Communications Commission verification or certification  
of the device is required.  
Seagate Technology LLC has tested this device in enclosures as described above to ensure that the total  
assembly (enclosure, disk drive, motherboard, power supply, etc.) does comply with the limits for a Class B  
computing device, pursuant to Subpart J, Part 15 of the FCC rules. Operation with noncertified assemblies is  
likely to result in interference to radio and television reception.  
Radio and television interference. This equipment generates and uses radio frequency energy and if not  
installed and used in strict accordance with the manufacturer’s instructions, may cause interference to radio  
and television reception.  
This equipment is designed to provide reasonable protection against such interference in a residential installa-  
tion. However, there is no guarantee that interference will not occur in a particular installation. If this equipment  
does cause interference to radio or television, which can be determined by turning the equipment on and off,  
you are encouraged to try one or more of the following corrective measures:  
• Reorient the receiving antenna.  
• Move the device to one side or the other of the radio or TV.  
• Move the device farther away from the radio or TV.  
• Plug the computer into a different outlet so that the receiver and computer are on different branch outlets.  
If necessary, you should consult your dealer or an experienced radio/television technician for additional sug-  
gestions. You may find helpful the following booklet prepared by the Federal Communications Commission:  
How to Identify and Resolve Radio-Television Interference Problems. This booklet is available from the Super-  
intendent of Documents, U.S. Government Printing Office, Washington, DC 20402. Refer to publication num-  
ber 004-000-00345-4.  
16  
Momentus Thin Product Manual, Rev. C Gen-2  
                 
3.15  
Environmental protection  
Seagate designs its products to meet environmental protection requirements worldwide, including regulations  
restricting certain chemical substances.  
3.15.1  
European Union Restriction of Hazardous Substances (RoHS)  
The European Union Restriction of Hazardous Substances (RoHS) Directive, restricts the presence of chemi-  
cal substances, including Lead, Cadmium, Mercury, Hexavalent Chromium, PBB and PBDE, in electronic prod-  
ucts, effective July 2006. This drive is manufactured with components and materials that comply with the RoHS  
Directive.  
3.15.2  
China Restriction of Hazardous Substances (RoHS) Directive  
This product has an Environmental Protection Use Period (EPUP) of 20 years. The following  
table contains information mandated by China's "Marking Requirements for Control of Pollution  
Caused by Electronic Information Products" Standard.  
"O" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is lower  
than the threshold defined by the China RoHS MCV Standard.  
O”  
RoHS MCV  
表示该部件(于同类物品程度上)所含的危险和有毒物质低于中国  
标准所定义的门槛值。  
"X" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is over  
the threshold defined by the China RoHS MCV Standard.  
X”  
RoHS MCV  
表示该部件(于同类物品程度上)所含的危险和有毒物质超出中国  
标准所定义的门槛值。  
3.16  
Corrosive environment  
Seagate electronic drive components pass accelerated corrosion testing equivalent to 10 years exposure to  
light industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM  
B845. However, this accelerated testing cannot duplicate every potential application environment.  
Users should use caution exposing any electronic components to uncontrolled chemical pollutants and corro-  
sive chemicals as electronic drive component reliability can be affected by the installation environment. The sil-  
ver, copper, nickel and gold films used in Seagate products are especially sensitive to the presence of sulfide,  
chloride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic components  
should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or  
exposed to an ambient relative humidity greater than 95%. Materials used in cabinet fabrication, such as vulca-  
nized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of any  
electronic equipment may be extended by replacing materials near circuitry with sulfide-free alternatives.  
Momentus Thin Product Manual, Rev. C Gen-2  
17  
                 
4.0  
Configuring and mounting the drive  
This section contains the specifications and instructions for configuring and mounting the drive.  
4.1  
Handling and static-discharge precautions  
After unpacking, and before installation, the drive may be exposed to potential handling and electrostatic dis-  
charge (ESD) hazards. Observe the following standard handling and static-discharge precautions:  
Caution:  
• Keep the drive in the electrostatic discharge (ESD) bag until you are ready for installation to limit the drive’s  
exposure to ESD.  
• Before handling the drive, put on a grounded wrist strap, or ground yourself frequently by touching the metal  
chassis of a computer that is plugged into a grounded outlet. Wear a grounded wrist strap throughout the entire  
installation procedure.  
• Handle the drive only by its edges or frame.  
• The drive is fragile—handle it with care. Do not press down on the drive top cover.  
• Always rest the drive on a padded, antistatic surface until you mount it in the computer.  
• Do not touch the connector pins or the printed circuit board.  
• Do not remove the factory-installed labels from the drive or cover them with additional labels. Removal voids  
the warranty. Some factory-installed labels contain information needed to service the drive. Other labels are  
used to seal out dirt and contamination.  
4.2  
Configuring the drive  
Each drive on the Serial ATA interface connects in a point-to-point configuration with the Serial ATA host  
adapter. There is no master/slave relationship because each drive is considered a master in a point-to-point  
relationships. If two drives are attached on one Serial ATA host adapter, the host operating system views the  
two devices as if they were both “masters” on two separate ports. This means both drives behave as if they are  
Device 0 (master) devices.  
Serial ATA drives are designed for easy installation. It is normally not necessary to set any jumpers on this  
drive for proper operation. If the host system does not support SATA 3Gb/s operation, place a jumper on pins 1  
and 2 to limit the drive to 1.5Gb/s operation.  
3.0 Gbits per second operation  
Limit data transfer rate to  
1.5 Gbits per second  
Jumper block  
SATA power connector  
SATA interface connector  
Figure 2. Serial ATA connectors  
18  
Momentus Thin Product Manual, Rev. C Gen-2  
                         
4.3  
Serial ATA cables and connectors  
The Serial ATA interface cable consists of four conductors in two differential pairs, plus three ground connec-  
tions. The cable size may be 30 to 26 AWG with a maximum length of one meter (39.37 inches). See Table 7  
for connector pin definitions. Either end of the SATA signal cable can be attached to the drive or host.  
For direct backplane connection, the drive connectors are inserted directly into the host receptacle. The drive  
and the host receptacle incorporate features that enable the direct connection to be hot pluggable and blind  
mateable.  
For installations which require cables, you can connect the drive as illustrated in Figure 3.  
SATA interface connector  
Power connector  
SATA interface cable  
Power cable  
Figure 3. Attaching SATA cabling  
Each connector is keyed to ensure correct orientation.  
4.4  
Drive mounting  
You can mount the drive using four screws in the side-mounting holes or four screws in the bottom-mounting  
holes. See Figure 4 for drive mounting dimensions. Follow these important mounting precautions when mount-  
ing the drive:  
• Allow a minimum clearance of 0.030 inches (0.76 mm) around the entire perimeter of the drive for cooling.  
• Use only M3 UNC mounting screws.  
• Do not overtighten the mounting screws. Maximum torque: 4.0 in-lb (0.4519 N-m).  
• Four (4) threads (0.080 inches, 2.032 mm) minimum screw engagement recommended.  
• Avoid excessive drive distortion when mounting. Refer to the following specifications for stiffness/deflection  
information:  
Top cover stiffness/deflection  
Operating with no performance degradation, emitted noise,  
mechanical damage, or hard errors  
10 mm probe: 1.02kgf or  
5 mm probe: 0.92kgf  
Non-operating with no hard errors  
20 mm probe: 2kgf at any point of top cover  
20 mm probe: 15kgf at top cover edges only  
Momentus Thin Product Manual, Rev. C Gen-2  
19  
               
Measurements shown in Figures 4 and 5 are in inches.  
Figure 4. Mounting dimensions (for FIPS 140-2 models) — top, side and end view  
Warning: FIPS 140-2 Models Contain 3 Tamper Evident Stickers with the marking "Tamper Indicator - Do Not  
Remove". These stickers must remain attached to provide the tamper evidence throughout the life of the  
drive. Removing these stickers will indicate tampering and void the drive warranty.  
20  
Momentus Thin Product Manual, Rev. C Gen-2  
     
Figure 5. Mounting dimensions (for standard models) — top, side and end view  
Momentus Thin Product Manual, Rev. C Gen-2  
21  
   
5.0  
About FIPS  
The Federal Information Processing Standard (FIPS) Publication 140-2, FIPS PUB 140-2, is a U.S. govern-  
ment computer security standard used to accredit cryptographic modules. It is titled “Security Requirements for  
Cryptographic Modules”. The initial publication was on May 25, 2001 and was last updated December 3, 2002.  
Purpose  
The National Institute of Standards and Technology (NIST) issued the FIPS 140 Publication Series to coordi-  
nate the requirements and standards for cryptography modules that include both hardware and software com-  
ponents.  
Federal Information Processing Standard (FIPS) 140-2 Level 2 Certification requires drives to go through gov-  
ernment agencies certifications to add requirements for physical tamper-evidence and role-based authentica-  
tion.  
Level 2 security  
Level 2 improves upon the physical security mechanisms of a Level 1 (lowest level of security) cryptographic  
module by requiring features that show evidence of tampering, including tamper-evident coatings or seals that  
must be broken to attain physical access to the plaintext cryptographic keys and critical security parameters  
(CSPs) within the module, or pick-resistant locks on covers or doors to protect against unauthorized physical  
access.  
Figure 6. Example of FIPS tamper evidence labels.  
22  
Momentus Thin Product Manual, Rev. C Gen-2  
           
Note. May not represent actual drive.  
Momentus Thin Product Manual, Rev. C Gen-2  
23  
6.0  
Serial ATA (SATA) interface  
These drives use the industry-standard Serial ATA interface that supports FIS data transfers. It supports ATA  
programmed input/output (PIO) modes 0–4; multiword DMA modes 0–2, and Ultra DMA modes 0–6. The drive  
also supports the use of the IORDY signal to provide reliable high-speed data transfers.  
For detailed information about the Serial ATA interface, refer to the “Serial ATA: High Speed Serialized AT  
Attachment” specification.  
6.1  
Hot-Plug compatibility  
Momentus Thin drives incorporate connectors which enable you to hot plug these drives in accordance with  
the Serial ATA: High Speed Serialized AT Attachment specification revision 2.0. This specification can be  
event.  
6.2  
Serial ATA device plug connector pin definitions  
Table 7 summarizes the signals on the Serial ATA interface and power connectors.  
Table 7: Serial ATA connector pin definitions  
Segment Pin  
Function  
Ground  
A+  
Definition  
S1  
S2  
S3  
S4  
S5  
S6  
2nd mate  
Differential signal pair A from Phy  
A-  
Ground  
B-  
2nd mate  
Differential signal pair B from Phy  
B+  
Signal  
S7  
Ground  
2nd mate  
Key and spacing separate signal and power segments  
24  
Momentus Thin Product Manual, Rev. C Gen-2  
             
Table 7:  
Serial ATA connector pin definitions  
Segment Pin  
Function  
V33  
Definition  
P1  
P2  
P3  
P4  
P5  
P6  
P7  
P8  
3.3V power  
V33  
3.3V power  
V33  
3.3V power, pre-charge, 2nd mate  
1st mate  
Ground  
Ground  
Ground  
V5  
2nd mate  
2nd mate  
5V power, pre-charge, 2nd mate  
5V power  
V5  
Power  
P9  
V5  
5V power  
P10  
P11  
Ground  
Reserved  
2nd mate  
The pin corresponding to P11 in the backplane receptacle connector is also reserved  
The corresponding pin to be mated with P11 in the power cable receptacle connector  
shall always be grounded  
P12  
P13  
P14  
P15  
Ground  
V12  
1st mate.  
12V power, pre-charge, 2nd mate  
12V power  
V12  
V12  
12V power  
Notes:  
1. All pins are in a single row, with a 1.27 mm (0.050”) pitch.  
2. The comments on the mating sequence apply to the case of backplane blindmate connector only. In this  
case, the mating sequences are:  
• the ground pins P4 and P12.  
• the pre-charge power pins and the other ground pins.  
• the signal pins and the rest of the power pins.  
3. There are three power pins for each voltage. One pin from each voltage is used for pre-charge when  
installed in a blind-mate backplane configuration.  
4. All used voltage pins (Vx) must be terminated.  
Momentus Thin Product Manual, Rev. C Gen-2  
25  
6.3  
Supported ATA commands  
The following table lists Serial ATA standard commands that the drive supports. For a detailed description of  
the ATA commands, refer to the Serial ATA: High Speed Serialized AT Attachment specification. See  
“S.M.A.R.T. commands” on page 33.for details and subcommands used in the S.M.A.R.T. implementation.  
Command name  
Command code (in hex)  
ATA-standard commands  
Device Configuration Restore  
Device Configuration Freeze Lock  
Device Configuration Identify  
Device Configuration Set  
Download Microcode  
Execute Device Diagnostics  
Flush Cache  
B1h/C0h  
B1h/C1h  
B1h/C2h  
B1h/C3h  
92h  
90h  
E7h  
Flush Cache Extended  
Identify Device  
EAh  
ECh  
91h  
Initialize Device Parameters  
Read Buffer  
E4h  
Read DMA  
C8h  
Read DMA Extended  
Read DMA without Retries  
Read Long with Retries  
Read Long without Retries  
Read Multiple  
25h  
C9h  
22h  
23h  
C4h  
Read Multiple Extended  
Read Native Max Address  
Read Native Max Address Extended  
Read Sectors  
29h  
F8h  
27h  
20h  
Read Sectors Extended  
Read Sectors without Retries  
Read Verify Sectors  
24h  
21h  
40h  
Read Verify Sectors Extended  
Read Verify Sectors without Retries  
Seek  
42h  
41h  
70h  
Set Features  
EFh  
Set Max Address  
F9h  
Note: Individual Set Max commands are identi-  
fied by the value placed in the Set Max Fea-  
tures register as defined to the right.  
Address:  
Password:  
Lock:  
00  
01  
02  
03  
04  
H
H
H
H
H
Unlock:  
Freeze Lock:  
Set Multiple Mode  
C6h  
S.M.A.R.T. Disable Operations  
S.M.A.R.T. Enable/Disable Autosave  
B0h/D9h  
B0h/D2h  
26  
Momentus Thin Product Manual, Rev. C Gen-2  
                                                                               
Command name  
Command code (in hex)  
B0h/D8h  
B0h/DBh  
B0h/E0h  
B0h/D4h  
B0h/D1h  
B0h/D0h  
B0h/D5h  
B0h/DAh  
B0h/D3h  
B0h/D7h  
B0h/E1h  
B0h/D6h  
E8h  
S.M.A.R.T. Enable Operations  
S.M.A.R.T. Enable/Disable Auto Offline  
S.M.A.R.T. Enable One Attribute Modification  
S.M.A.R.T. Execute Offline  
S.M.A.R.T. Read Attribute Thresholds  
S.M.A.R.T. Read Data  
S.M.A.R.T. Read Log Sector  
S.M.A.R.T. Return Status  
S.M.A.R.T. Save Attribute Values  
S.M.A.R.T. Write Attribute Thresholds  
S.M.A.R.T. Write Attribute Values  
S.M.A.R.T. Write Log Sector  
Write Buffer  
Write DMA  
CAh  
Write DMA Extended  
35h  
Write DMA without Retries  
Write Long with Retries  
Write Long without Retries  
Write Multiple  
CBh  
32h  
33h  
C5h  
Write Multiple Extended  
Write Sectors  
39h  
30h 31h  
,
Write Sectors Extended  
Write Uncorrectable  
34h  
45h  
ATA-standard power-management commands  
Check Power Mode  
E5h  
E3h  
E1h  
E6h  
E2h  
E0h  
Idle  
Idle Immediate  
Sleep  
Standby  
Standby Immediate  
ATA-standard security commands  
Security Set Password  
Security Unlock  
F1h  
F2h  
F3h  
F4h  
F5h  
F6h  
Security Erase Prepare  
Security Erase Unit  
Security Freeze Lock  
Security Disable Password  
Momentus Thin Product Manual, Rev. C Gen-2  
27  
                                           
6.3.1  
Identify Device command  
The Identify Device command (command code EC ) transfers information about the drive to the host following  
H
power up. The data is organized as a single 512-byte block of data, whose contents are shown in the table on  
page 27. All reserved bits or words should be set to zero. Parameters listed with an “x” are drive-specific or  
vary with the state of the drive.  
The following commands contain drive-specific features that may not be included in the Serial ATA specifica-  
tion.  
Word  
Description  
Value  
Configuration information:  
• Bit 15: 0 = ATA; 1 = ATAPI  
• Bit 7: removable media  
• Bit 6: removable controller  
• Bit 0: reserved  
0C5A  
H
0
1
Number of logical cylinders  
16,383  
2
ATA-reserved  
0000  
16  
H
3
Number of logical heads  
4
Retired  
0000  
0000  
H
H
5
Retired  
6
Number of logical sectors per logical track: 63  
Retired  
003F  
H
H
7–9  
10–19  
20  
21  
22  
0000  
Serial number: (20 ASCII characters, 0000 = none)  
ASCII  
H
Retired  
Retired  
Obsolete  
0000  
0400  
0000  
H
H
H
Firmware revision (8 ASCII character string, padded with blanks  
to end of string)  
23–26  
27–46  
47  
x.xx  
ST320LT007 - 9ZV142  
ST320LT009 - 9WC142  
ST320LT011 - 9ZVG42  
ST320LT014 - 9YK142  
ST250LT007 - 9ZV14C  
ST250LT009 - 9WC14C  
ST250LT011 - 9ZVG4C  
ST250LT014 - 9YK14C  
ST160LT007 - 9ZV14D  
ST160LT009 - 9WC14D  
ST160LT011 - 9ZVG4D  
ST160LT014 - 9YK14D  
Drive model number: (40 ASCII characters, padded with blanks  
to end of string)  
(Bits 7–0) Maximum sectors per interrupt on Read multiple and  
Write multiple (16)  
8010  
0000  
H
H
48  
49  
50  
51  
52  
53  
54  
Reserved  
Standard Standby timer, IORDY supported and may be disabled  
ATA-reserved  
2F00  
H
H
H
H
H
0000  
0200  
0200  
0007  
PIO data-transfer cycle timing mode  
Retired  
Words 54–58, 64–70 and 88 are valid  
Number of current logical cylinders  
xxxx  
H
28  
Momentus Thin Product Manual, Rev. C Gen-2  
   
Word  
55  
Description  
Value  
Number of current logical heads  
Number of current logical sectors per logical track  
Current capacity in sectors  
xxxx  
xxxx  
xxxx  
H
H
H
56  
57–58  
Number of sectors transferred during a Read Multiple or Write  
Multiple command  
59  
xxxx  
H
ST320LT007 = 0FFFFFFFh  
ST320LT009 = 0FFFFFFFh  
ST320LT011 = 0FFFFFFFh  
ST320LT014 = 0FFFFFFFh  
ST250LT007 = 0FFFFFFFh  
ST250LT009 = 0FFFFFFFh  
ST250LT011 = 0FFFFFFFh  
ST250LT014 = 0FFFFFFFh  
ST160LT007 = 0FFFFFFFh  
ST160LT009 = 0FFFFFFFh  
ST160LT011 = 0FFFFFFFh  
ST160LT014 = 0FFFFFFFh  
Total number of user-addressable sectors  
This field contains a value that is one greater than the total num-  
ber of user-addressable sectors. The maximum value that shall  
be placed in this field is 0FFFFFFFh. The 0FFFFFFFh value  
applies to all capacities over 137GB (see Section 3.2 and 3.3 for  
related information).  
60–61  
62  
63  
64  
65  
Retired  
0000  
H
Multiword DMA active and modes supported  
(see note following this table)  
xx07  
H
Advanced PIO modes supported (modes 3 and 4 supported)  
0003  
H
H
Minimum multiword DMA transfer cycle time per word  
(120 nsec)  
0078  
Recommended multiword DMA transfer cycle time per word  
(120 nsec)  
66  
67  
0078  
H
Minimum PIO cycle time without IORDY flow control  
(240 nsec)  
00F0  
H
68  
Minimum PIO cycle time with IORDY flow control (120 nsec)  
ATA-reserved  
0078  
0000  
H
69–74  
75  
76  
H
Queue depth  
001F  
H
H
H
H
H
Serial ATA capabilities  
0508  
0000  
0048  
0040  
77  
ATA-reserved  
78  
Serial ATA features supported  
Serial ATA features enabled  
Major version number  
79  
80  
81  
82  
83  
84  
85  
86  
87  
003E  
H
H
Minor version number  
0028  
Command sets supported  
Command sets supported  
Command sets support extension  
Command sets enabled  
Command sets enabled  
Command sets enable extension  
306B  
H
H
H
H
4001  
4000  
30xx  
0001  
H
H
4000  
Ultra DMA support and current mode  
(see note following this table)  
88  
89  
xx7F  
H
Security erase time  
0000  
H
Momentus Thin Product Manual, Rev. C Gen-2  
29  
Word  
90  
Description  
Value  
0000  
Enhanced security erase time  
Master password revision code  
H
92  
FFFE  
H
Hardware reset value  
93  
xxxx  
xxxx  
H
(see description following this table)  
94  
Auto acoustic management setting  
ATA-reserved  
H
95–99  
0000  
H
ST320LT007 = 625,142,448  
ST320LT009 = 625,142,448  
ST320LT011 = 625,142,448  
ST320LT014 = 625,142,448  
ST250LT007 = 488,397,168  
ST250LT009 = 488,397,168  
ST250LT011 = 488,397,168  
ST250LT014 = 488,397,168  
ST160LT007 = 312,581,808  
ST160LT009 = 312,581,808  
ST160LT011 = 312,581,808  
ST160LT014 = 312,581,808  
Total number of user-addressable LBA sectors available  
(see Section 3.2 for related information)  
These words are required for drives that support the 48-bit  
addressing feature. Maximum value: 0000FFFFFFFFFFFFh.  
100–  
103  
104–  
118  
ATA-reserved  
0000  
H
1 = Free Fall Protection supported  
119  
120  
Free Fall Protection support (bit 5)  
Free Fall Protection enable/disable (bit 5)  
0 = Free Fall Protection not supported  
1 = Free Fall Protection feature is enabled  
0 = Free Fall Protection feature is disabled  
121–  
127  
ATA reserved  
0000  
0001  
H
H
128  
Security status  
Seagate-reserved  
129–  
159  
xxxx  
H
160–  
254  
ATA-reserved  
Integrity word  
0000  
xxA5  
H
255  
H
Note. See the bit descriptions below for words 63, 88, and 93 of the Identify Drive data:  
Description (if bit is set to 1)  
Bit  
0
Word 63  
Multiword DMA mode 0 is supported.  
Multiword DMA mode 1 is supported.  
Multiword DMA mode 2 is supported.  
Multiword DMA mode 0 is currently active.  
Multiword DMA mode 1 is currently active.  
Multiword DMA mode 2 is currently active.  
1
2
8
9
10  
30  
Momentus Thin Product Manual, Rev. C Gen-2  
Bit  
0
Word 88  
Ultra DMA mode 0 is supported.  
Ultra DMA mode 1 is supported.  
Ultra DMA mode 2 is supported.  
Ultra DMA mode 3 is supported.  
Ultra DMA mode 4 is supported.  
Ultra DMA mode 5 is supported  
Ultra DMA mode 6 is supported  
Ultra DMA mode 0 is currently active.  
Ultra DMA mode 1 is currently active.  
Ultra DMA mode 2 is currently active.  
Ultra DMA mode 3 is currently active.  
Ultra DMA mode 4 is currently active.  
Ultra DMA mode 5 is currently active.  
Ultra DMA mode 6 is currently active.  
Word 93  
1
2
3
4
5
6
8
9
10  
11  
12  
13  
14  
Bit  
13  
1 = 80-conductor cable detected, CBLID above VIH  
0 = 40-conductor cable detected, CBLID below VIL  
Momentus Thin Product Manual, Rev. C Gen-2  
31  
6.3.2  
Set Features command  
This command controls the implementation of various features that the drive supports. When the drive receives  
this command, it sets BSY, checks the contents of the Features register, clears BSY and generates an inter-  
rupt. If the value in the register does not represent a feature that the drive supports, the command is aborted.  
Power-on default has the read look-ahead and write caching features enabled. The acceptable values for the  
Features register are defined as follows:  
Table 8:  
Set Features command values  
02  
03  
Enable write cache (default).  
H
H
Set transfer mode (based on value in Sector Count register).  
Sector Count register values:  
00 Set PIO mode to default (PIO mode 2).  
H
01 Set PIO mode to default and disable IORDY (PIO mode 2).  
H
08 PIO mode 0  
H
09 PIO mode 1  
H
0A PIO mode 2  
H
0B PIO mode 3  
H
0C PIO mode 4 (default)  
H
20 Multiword DMA mode 0  
H
21 Multiword DMA mode 1  
H
22 Multiword DMA mode 2  
H
40 Ultra DMA mode 0  
H
41 Ultra DMA mode 1  
H
42 Ultra DMA mode 2  
H
43 Ultra DMA mode 3  
H
44 Ultra DMA mode 4  
H
45 Ultra DMA mode 5  
H
46 Ultra DMA mode 6  
H
55  
82  
Disable read look-ahead (read cache) feature.  
Disable write cache  
H
H
AA  
Enable read look-ahead (read cache) feature (default).  
H
H
H
C1  
Disable the Free Fall Protection feature (41 above enables the Free Fall Protection feature)  
H
F1  
Report full capacity available  
Note. At power-on, or after a hardware or software reset, the default values of the features are as indi-  
cated above.  
32  
Momentus Thin Product Manual, Rev. C Gen-2  
 
6.3.3  
S.M.A.R.T. commands  
S.M.A.R.T. provides near-term failure prediction for disk drives. When S.M.A.R.T. is enabled, the drive moni-  
tors predetermined drive attributes that are susceptible to degradation over time. If self-monitoring determines  
that a failure is likely, S.M.A.R.T. makes a status report available to the host. Not all failures are predictable.  
S.M.A.R.T. predictability is limited to the attributes the drive can monitor. For more information on S.M.A.R.T.  
commands and implementation, see the Draft ATA-8 Standard.  
SeaTools diagnostic software activates a built-in drive self-test (DST S.M.A.R.T. command for D4 ) that elimi-  
H
nates unnecessary drive returns. The diagnostic software ships with all new drives and is also available at:  
This drive is shipped with S.M.A.R.T. features disabled. You must have a recent BIOS or software package that  
supports S.M.A.R.T. to enable this feature. The table below shows the S.M.A.R.T. command codes that the  
drive uses.  
Table 9:  
S.M.A.R.T. commands  
Code in features register  
S.M.A.R.T. command  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
D9  
S.M.A.R.T. Read Data  
H
H
H
H
H
H
H
H
H
H
Vendor-specific  
S.M.A.R.T. Enable/Disable Attribute Autosave  
S.M.A.R.T. Save Attribute Values  
S.M.A.R.T. Execute Off-line Immediate (runs DST)  
S.M.A.R.T. Read Log Sector  
S.M.A.R.T. Write Log Sector  
Vendor-specific  
S.M.A.R.T. Enable Operations  
S.M.A.R.T. Disable Operations  
S.M.A.R.T. Return Status  
DA  
H
Note. If an appropriate code is not written to the Features Register, the command is aborted and 0x04  
(abort) is written to the Error register.  
Momentus Thin Product Manual, Rev. C Gen-2  
33  
 
34  
Momentus Thin Product Manual, Rev. C Gen-2  
D
Index  
data-transfer rates 2  
DC power 8  
Default logical geometry 6  
density 4  
Device Configuration Freeze Lock 26  
Device Configuration Restore 26  
Device Configuration Set 26  
Diagnostics 26  
dimensions 20, 21  
Disks 4  
dissipation 8  
Download Microcode 26  
A
ACA 16  
acoustics 5, 14  
Active mode 11  
Address 26  
AFR 15  
Agency certification 15  
Altitude 12  
Altitude, nonoperating 5  
Altitude, operating 5  
Ambient temperature 5, 12  
ambient temperature 7  
E
Annualized Failure Rate 15  
Annualized Failure Rate (AFR) 5  
Areal density 4, 7  
Electrical fast transient 14  
Electromagnetic compatibility 15  
Electromagnetic Compatibility (EMC) 15  
Electromagnetic Compatibility control Regulation 15  
Electromagnetic Compatibility Directive (2004/108/  
EC) 15  
Electromagnetic immunity 14  
Electrostatic discharge 14  
electrostatic discharge (ESD) 18  
EN 55022, Class B 15  
ATA commands 26  
ATA data-transfer modes supported 4  
Australia/New Zealand Standard AS/NZ CISPR22 16  
Australian Communication Authority (ACA) 16  
Australian C-Tick 16  
Average seek time 7  
Average seek, read 4  
EN 55024 15  
EN60950 15  
B
bels 5  
BPI 4  
buffer 4, 7  
Environmental protection 17  
Environmental specifications 12  
error-correction algorithms 2  
errors 5, 15  
ESD 18  
Bytes per physical sector 4, 6  
C
European Union (EU) requirements 15  
European Union Restriction of Hazardous Substanc-  
evice Configuration Identify 26  
Execute Device Diagnostics 26  
cables and connectors 19  
Cache 4  
cache 7  
capacity 6  
CE mark 15  
certification 15  
F
Check Power Mode 27  
chemical substances 17  
China RoHS directive 17  
Class B computing device 16  
compatibility 15  
Conducted noise 10  
Conducted RF immunity 14  
Configuring the drive 18  
connectors 19  
FCC verification 16  
features 2  
Federal Communications Commission 16  
Federal Information Processing Standard 22  
FIPS 22  
Flush Cache 26  
Flush Cache Extended 26  
Formatted capacity 4, 6  
Freeze Lock 26  
CSA60950-1 15  
current 4  
cycles 15  
Cylinders 6  
G
geometry 6  
gradient 5  
Momentus Thin Product Manual, Rev. C Gen-2  
35  
Guaranteed lba 4, 6  
guaranteed sectors 6  
N
National Institute of Standards and Technology 22  
NIST 22  
noise 10  
H
handling 18  
Handling precautions 18  
heads 6  
Height 4  
height 7  
nominal power 7  
Nonoperating shock 13  
Nonoperating vibration 13  
Nonrecoverable read errors 5  
nonrecoverable read errors 15  
Humidity 12  
humidity 5  
O
Operating shock 13  
Operating vibration 13  
I
I/O data-transfer rate 4, 7  
Identify 26  
Identify Device 26  
P
Physical characteristics 7  
Physical organization 6  
Physical read/write heads 4  
point-to-point 3, 18  
Identify Device command 28  
Idle 8, 27  
Idle and Standby timers 11  
Idle Immediate 27  
Power consumption 8  
power dissipation 8  
Idle mode 5, 11  
Idle mode power 8  
Information Technology Equipment (ITE) 15  
Initialize Device Parameters 26  
Input noise ripple 10  
Interface 7  
power management 11  
power on/off cycles 15  
Power specifications 8  
Power-management modes 11  
Power-on to Ready 8  
Power-on to ready 4  
precautions 18, 19  
programmable power management 11  
interface 24  
Interleave 7  
Internal data transfer rate 4  
Internal data-transfer rate 7  
ITE 15  
Q
quick reference 4  
K
KCC 15  
R
Korean Communications Commission 15  
Korean RRL 15  
Radiated RF immunity 14  
Radio and television interference 16  
radio frequency (RF) 14  
random track location 8  
Read Buffer 26  
L
latency 4  
LBA mode 6  
Length 4  
length 7  
Load/Unload 15  
logical geometry 6  
Read DMA 26  
Read DMA Extended 26  
Read DMA without Retries 26  
read errors 5, 15  
Read Long with Retries 26  
Read Long without Retries 26  
Read Multiple 26  
M
master/slave 3  
Read Multiple Extended 26  
Read Native Max Address 26  
Read Native Max Address Extended 26  
Read Sectors 26  
Max Address 26  
maximum temperature 12  
Microcode 26  
mounting 19  
mounting screws 13  
mounting the drive 18  
Read Sectors Extended 26  
Read Sectors without Retries 26  
Read Verify Sectors 26  
36  
Momentus Thin Product Manual, Rev. C Gen-2  
Read Verify Sectors Extended 26  
Read Verify Sectors without Retries 26  
Read/write heads 6  
Read/write power 5  
read/write power and current 8  
Recording density 4, 7  
Recording method 7  
Recording technology 7  
Relative humidity 5, 12  
Reliability 15  
Standby 8, 27  
Standby Immediate 27  
Standby mode 5, 8, 11  
Standby to Ready 8  
Standby to ready 4  
Start/stop times 8  
Startup current 4  
static-discharge 18  
support services 1  
Surge immunity 14  
resistance 10  
Retries 26  
T
tamper evident stickers 20  
technical support services 1  
temperature 5, 7, 12  
Temperature gradient 5, 12  
timers 11  
RoHS 17  
RPM 4  
RRL 15  
S
TPI 4  
S.M.A.R.T. 27  
Track density 4, 7  
S.M.A.R.T. implementation 26  
Safety certification 15  
SATA 7, 24  
screws 13, 19  
sector 6  
Track-to-track seek time 4, 7  
U
UL60950-1 15  
Sectors per track 6  
Security Disable Password 27  
Security Erase Prepare 27  
Security Erase Unit 27  
Security Freeze Lock 27  
Security Set Password 27  
Security Unlock 27  
Seek 26  
V
Vibration 13  
Vibration, nonoperating 5  
Vibration, operating 5  
Voltage dips, interrupts 14  
Voltage tolerance 5, 10  
seek mode 8  
Seek time 7  
seek time 4  
Seeking 8  
Self refresh, low power 11  
Serial ATA 7  
Serial ATA (SATA) interface 24  
serial ATA ports 3  
servo electronics 8  
Set Features 26  
Set Max Address 26  
Set Multiple Mode 26  
Shock 13  
Shock, nonoperating 5  
Shock, operating 5  
single-track seeks 7  
Sleep 8, 27  
Sleep mode 5, 11  
sound power 5  
W
Warranty 15  
Weight 4  
weight 7  
Wet bulb temperature 5, 12  
Width 4  
width 7  
Write Buffer 27  
Write DMA 27  
Write DMA Extended 27  
Write Long with Retries 27  
Write Long without Retries 27  
Write Multiple 27  
Write Sectors 27  
Write Sectors Extended 27  
write uncorrectable 27  
Specification summary table 4  
Spindle speed 4, 7  
Spinup 8  
spinup power 8  
Momentus Thin Product Manual, Rev. C Gen-2  
37  
38  
Momentus Thin Product Manual, Rev. C Gen-2  
Seagate Technology LLC  
920 Disc Drive, Scotts Valley, California 95066-4544, USA  
Publication Number: 100625253, Rev. C  

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