User’s Guide
February 2001
Mixed-Signal Products
SLOU108
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Preface
About This Manual
This manual is written to provide information about the evaluation module of
the fully differential amplifier under test. Additionally, this document provides
a good example of PCB design for high speed applications. The user should
keep in mind the following points.
The design of the high-speed amplifier PCB is an elegant and sensitive
process. Therefore, the user must approach the PCB design with care and
awareness. It is recommend that the user initially review the datasheet of the
device under test. It is also helpful to review the schematic and layout of the
THS4150 EVM to determine the design techniques used in the evaluation
board. In addition, it is recommended that the user review the application note
Fully-Differential Amplifiers (literature number SLOA054B) to gain more
insight about differential amplifiers. This application note reviews the
differential amplifiers and presents calculations for various filters.
How to Use This Manual
Chapter 1—Introduction and Description
Chapter 2—Using the THS4150 EVM
Chapter 3—General High-Speed Amplifier Design Considerations
Read This First
iii
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Related Documentation From Texas Instruments
Information About Cautions and Warnings
This book may contain cautions and warnings.
This is an example of a caution statement.
A caution statement describes a situation that could potentially
damage your software or equipment.
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you.
The information in a caution or a warning is provided for your protection.
Please read each caution and warning carefully.
Related Documentation From Texas Instruments
THS4150 data sheet (literature number SLOS321)
THS4150 application report (literature number SLOA054A),
Fully-Differential Amplifiers
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.
Trademarks
PowerPAD is a trademark of Texas Instruments.
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Contents
1
Introduction and Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Evaluation Module Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
THS4150 EVM Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Schematic of the Populated Circuit (Default Configuration) . . . . . . . . . . . . . . . . . . . . . . . 1-3
THS4150 EVM Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Additional Sample Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
THS4150 EVM Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
2
Using the THS4150 EVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Required Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Power Supply Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Input and Output Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Testing the EVM Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
Power Down Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
Measuring the Frequency Response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
Butterworth Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
THS4150 EVM Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
3
General High-Speed Amplifier Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
v
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Figures
1–1
1–2
1–3
1–4
1–5
1–6
1–7
1–8
1–9
Schematic of the Populated Circuit on the EVM (Default Configuration) . . . . . . . . . . . . . . 1-3
Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Fully-Differential In/Fully-Differential Out, Without Transformer . . . . . . . . . . . . . . . . . . . . . . 1-5
Fully-Differential In/Fully-Differential Out, Utilizing Transformer . . . . . . . . . . . . . . . . . . . . . . 1-5
VICR Level Shifter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Butterworth Filter With Multiple Feedback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Top Layer (Silkscreen) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Top (Layer 1) (Signals) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Internal Plane (Layer 2) (Ground Plane) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
1–10 Internal Plane (Layer 3) (+ VCC Plane) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
1–11 Bottom (Layer 4) (Ground and Signal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
2–1
2–2
2–3
2–4
2–5
Power Supply Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Signal Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Driver 1 Output Signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
Multiple Feedback Filter Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
Gain vs Phase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
Tables
2–1
THS4150 EVM Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
vi
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Chapter 1
Introduction and Description
The Texas Instruments THS4150 evaluation module (EVM) helps designers
evaluate the performance of the THS4150 operational amplifier. Also, this
EVM is a good example of high-speed PCB design.
This document details the Texas Instruments THS4150 high-speed
operational amplifier evaluation module (EVM). It includes a list of EVM
features, a brief description of the module illustrated with a series of schematic
diagrams, EVM specifications, details on connecting and using the EVM, and
a discussion of high-speed amplifier design considerations.
This EVM enables the user to implement various circuits to clarify the available
configurations presented by the schematic of the EVM. In addition, the
schematic of the default circuit has been added to depict the components
mounted on the EVM when it is received by the customer. This configuration
correlates to the single input/differential output signal.
Othersamplecircuitsarepresentedtoshowhowtheusercanimplementother
circuit configurations such as differential input/differential output signal,
transformer utilization on the input and output terminals, VICR level shifter,
and Butterworth filter with multiple feedback. The user may be able to create
and implement circuit configurations in addition to those presented in this
document using the THS4150 EVM.
Topic
Page
1.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.2 Evaluation Module Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.3 THS4150 EVM Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1.4 Schematic of the Populated Circuit (Default Configuration) . . . . . . . 1-3
1.5 THS4150 EVM Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
1.6 Additional Sample Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
1.7 THS4150 EVM Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
1-1
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Description
1.1 Description
The THS4150 EVM is a good example of PCB design and layout for
high-speed operational amplifier applications. It is a complete circuit for the
high-speed operational amplifier. The EVM is made of the THS4150
high-speed operational amplifier, a number of passive components, and
various features and footprints that enable the user to experiment, test, and
verify various operational amplifier circuit implementations. The board
measures 4.5 inches in length by 2.5 inches in width. Initially, this board is
populated for a single-ended input amplifier (see Figure 1-2 for populated
circuits). The outputs (V
and V ) can be tested differentially or single
O+
O–
ended. Gain is set to one and can be changed by changing the ratios of the
feedback and gain resistors (see the device datasheet for recommended
resistor values). The user may populate various footprints on the evaluation
module board to verify filter designs or perform other experiments. Each input
is terminated with a 50-Ω resistor to provide correct line-impedance matching.
1.2 Evaluation Module Features
THS4150 high-speed operational amplifier EVM features include:
Voltage supply operation range: 5-V to ±15-V operation (see the
device data sheet)
Single and differential input and output capability
Nominal 50-Ω input and output termination resistors. They can be
configured according to the application requirement.
V
direct input control (see schematic and the device data sheet)
OCM
OCM
V
pin can be controlled via transformer center-tap (see
schematic)
Shutdown pin control, JU1 (if applicable to the device, see the device
data sheet)
Input and output transformer footprints for changing single-ended
signals to differential signals
Footprint for high-precision, balanced feedback and gain resistors
(0.01% or better)
Footprints for low-pass filter implementation (see application note
SLOA054A)
Footprints for antialiasing filter implementation (see application note
SLOA054A)
Differential probe terminals on input and output nodes for differential
probe insertion
Various GND and signal test points on the PCB
Circuit schematic printed on the back of the EVM
A good example of high-speed amplifier PCB design and layout
1-2
Introduction and Description
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THS4150 EVM Specifications
1.3 THS4150 EVM Specifications
Supply voltage range, ±V
. . . . 5 V to ±15 V (see the device data sheet)
CC
Supply current, I
. . . . . . . . . . . . . . . . . . . . . . . . (see the device data sheet)
CC
Output drive, I
V
= ±15 . . . . . . . . . . . . . . . . . (see the device data sheet)
O, CC
For complete THS4150 amplifier IC specifications, parameter measurement
information, and additional application information, see the THS4150 data
sheet, TI literature number SLOS321.
1.4 Schematic of the Populated Circuit (Default Configuration)
For verification of jumper locations and other bypass components, see the
complete EVM schematic in Figure 1–2.
Figure 1–1. Schematic of the Populated Circuit on the EVM (Default Configuration)
R6B
402 Ω
RX3
49.9 Ω
C4
CC
V
50 Ω
RX1
R1b
R3b
R4b
Rx4 R10
Source
JU4
+
–
0 Ω
R4a
0 Ω 49.9 Ω
Rx5 Rx6
V
0 Ω
0 Ω 374 Ω
R1a
IN
THS4150
R3a
AC
+
–
JU3
374 Ω
0 Ω
0 Ω
0 Ω 49.9 Ω
V
C1
C6
CC–
Rx0
24.9 Ω
V
OCM
R6a
402 Ω
Note: Default populated footprints on the EVM from the input nodes to the output terminals Gain = 1
1-3
Introduction and Description
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THS4150 EVM Schematic
1.5 THS4150 EVM Schematic
Figure 1–2. Schematic
1-4
Introduction and Description
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Additional Sample Schematics
1.6 Additional Sample Schematics
For verification of jumper locations and other bypass components, see the
complete EVM schematic in Figure 1–2.
Figure 1–3. Fully-Differential In/Fully-Differential Out, Without Transformer
R6b
R3B
C4
V
CC
RX1
0 Ω
R1b
50 Ω
0 Ω
R4b Rx4
R10
Rx6
Source
+
V
–
IN
0 Ω 0 Ω
R4a Rx5
R16 Termination
Resistor
THS4150
+
–
AC
RX2
0 Ω
R1a
0 Ω
0 Ω 0 Ω
V
C1
C6
CC–
V
OCM
R6a
R3a
Note: Fully-differential in / fully-differential out signal path. See the Texas Instruments February 2001 Analog Applications
Journal for the information on the termination resistors.
Figure 1–4. Fully-Differential In/Fully-Differential Out, Utilizing Transformer
R6b
C4
V
CC
50 Ω
R5
R9
R1B R3b
R1A R3a
R4b R14
R10
Rx6
Source
T1
T2
+
V
–
IN
0 Ω 0 Ω
R4a R15
AC
THS4150
+
–
0 Ω 0 Ω
C1
C6
GND
V
OCM
R6a
Note: Utilizingtheinputandoutputtransformerstocreateafully-differentialsignalinput/differentialor singleoutputandisolate
the amplifier from the rest of the front-end and back-end circuits.
1-5
Introduction and Description
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Additional Sample Schematics
Figure 1–5. VICR Level Shifter
R6B
402 Ω
V
CC
RPU1
RX3
C4
49.9 Ω
V
CC
50 Ω
RX1
R1b
R3b
R4b Rx4
R10
Source
+
–
0 Ω 0 Ω
R4a Rx5
49.9 Ω
Rx6
V
0 Ω
0 Ω 374 Ω
Rx0
IN
THS4150
R3a
AC
+
–
374 Ω
24.9 Ω
0 Ω 0 Ω
49.9 Ω
C6
V
CC–
C1
V
OCM
RPU2
R6a
402 Ω
Note: ShiftingtheVICRwithinthespecifiedrangeinthedatasheetviaRPU1andRPU2iftheVICRisoutofthespecifiedrange.
See the Application section of the data sheet for the THS4150 for more information.
Figure 1–6. Butterworth Filter With Multiple Feedback.
R2B
C1B
RX3
V
CC
RX1
R1B
R1A
R10
RX7
5 V
R3B
R3A
+
–
1 dBm
AC
C2
THS4150
R7
RX2
+
–
–5 V
V
CC–
C1A
R2A
Note:
Butterworth filter implemented with multiple feedback architecture
1-6
Introduction and Description
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THS4150 EVM Layout
1.7 THS4150 EVM Layout
Figure 1–7. Top Layer (Silkscreen)
TEXAS INSTRUMENTS
THS4150 EVM
REV_B
Figure 1–8. Top (Layer 1) (Signals)
TEXAS INSTRUMENTS
THS4150 EVM
REV_B
1-7
Introduction and Description
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THS4150 EVM Layout
Figure 1–9. Internal Plane (Layer 2) (Ground Plane)
Figure 1–10. Internal Plane (Layer 3) (± V
Plane)
CC
1-8
Introduction and Description
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THS4150 EVM Layout
Figure 1–11. Bottom (Layer 4) (Ground and Signal)
1-9
Introduction and Description
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1-10
Introduction and Description
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Chapter 2
Using the THS4150 EVM
It is recommended that the user perform the following exercises to learn the
usage of the EVM. This practice helps the user learn about the various
terminals on the EVM and their function. In addition, it suggests the
components and equipment needed to operate the EVM.
Topic
Page
2.1 Required Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
2.2 Power Supply Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
2.3 Input and Output Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3
2.4 Testing the EVM Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
2.5 Power Down Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–5
2.6 Measuring the Frequency Response . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–5
2.7 Butterworth Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6
2.8 THS4150 EVM Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7
2-1
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2.1 Required Equipment
One double-output dc power supply (±5 V, 100 mA output minimum)
Two dc current meters with resolution to 1 mA and capable of the
maximum current the dc power supply can supply. If available, set the
current limit on the dc power supply to 100 mA.
Note: Some power supplies incorporate current meters which may be
applicable to this test.
50-Ω source impedance function generator (1 MHz, 10 V sine wave)
PP
Oscilloscope (50-MHz bandwidth minimum, 50-Ω input impedance).
2.2 Power Supply Setup
1) Set the dc power supply to ±5 V.
2) Make sure the dc power supply is turned off before proceeding to the next
step.
3) Connect the positive (+) terminal of the power supply to the positive (+)
terminal of the current meter number 1.
4) Connect the negative (–) terminal of the current meter number 1 to the
V
of the EVM (J7).
CC+
5) Connect the common ground terminal of the power supply to the ground
GND on the EVM (J9).
6) Connect the negative (–) terminal of the power supply to the negative (–)
terminal of the second current meter.
7) Connectthepositive(+)terminalofthecurrentmeternumber2totheV
of the EVM (J8).
CC–
Figure 2–1. Power Supply Connection
CURRENT
METER 2
CURRENT
METER 1
POWER SUPPLY
–5V
GND
+5V
+
–
+
–
J8 V
J7 V
J9 GND
CC–
J6 V
CC+
OCM
EVM
THS4150
Figures are not drawn to scale.
2-2
Using the THS4150 EVM
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2.3 Input and Output Setup
1) Ensure that JU3, JU4, and JU1 are not installed (open circuit).
2) Set the function generator to generate a 1 MHz, ±0.5 V (1 V ) sine wave
PP
with no dc offset.
3) Turn off the function generator before proceeding to the next step.
4) Using a BNC-to-SMA cable, connect the function generator to J1 (V ) on
I+
the EVM.
5) Using a BNC-to-SMA cable, connect the oscilloscope to J3 (V ) on the
O–
EVM.
6) Using a BNC-to-SMA cable, connect the oscilloscope to J4 (V ) on the
O+
EVM. Set the oscilloscope to 0.5 V/division and a time-base of 0.2
µs/division.
Note: The oscilloscope must be set to use a 50-Ω input impedance for
proper results.
Figure 2–2. Signal Connections
OSCILLOSCOPE
50 Ω Impedance
FUNCTION
GENERATOR
1 MHz
1 V
0 V Offset
OUT
PP
CH-1
CH-2
J1 V
J3 V
J4 V
in+
out–
50 Ω Source
Impedance
THS4150 EVM
out+
Figures are not drawn to scale.
2-3
Using the THS4150 EVM
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2.4 Testing the EVM Setup
1) Turn on the dc power supply.
2) Verify that both the +5 V (current meter 1) and the –5 V (current meter 2)
currents are below 20 mA.
Caution:
Currents above 20 mA indicate a possible short or a wrong resistor value
on the PCB. Do not proceed until this situation is corrected.
3) Turn on the function generator.
4) Verify the oscilloscope is showing two 1 MHz sine waves with amplitude
of ±0.125 V. The dc offset of the signal must be below 50 mV.
Note:V
andV
shouldbe180degreesoutofphase.Theinternal
OUT+
OUT–
attenuation of the scope should be set to 6 dB for a gain of one. Otherwise,
the output will show a gain of one-half due to the voltage division occurring
at the 50-Ω termination resistor.
Use Figure 3 as a reference for the input and output signals.
Figure 2–3. Driver 1 Output Signal
THS4150
C1
C2
C3
2-4
Using the THS4150 EVM
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2.5 Power Down Verification
This EVM is used to evaluate devices with and without the shutdown function.
Therefore, this step is only applicable if the device has a shutdown function.
Please see the data sheet for power-down verification.
1) Insert the jumper JU1 to power down the device. The current consumption
(dc current meters) should drop to less than 1.5 mA. Remember to dis-
count the current flow through the 10-kΩ pullup resistor on the EVM when
calculating the device current consumption in the shutdown mode.
2) Turn off the power supply and disconnect the wiring.
3) Turn off the function generator and disconnect the wiring.
4) Basic operation of the operational amplifier and its EVM is complete.
2.6 Measuring the Frequency Response
This EVM is designed to easily interface with network analyzers. Jumpers J3
and J4 facilitate the use and insertion of the differential probes at the input and
output nodes. It is important to consider the following steps to ensure optimal
performance in terms of bandwidth, phase margin, gain, and peaking
1) Connect the power supply according to the power supply set up (section
2.2)
2) Use proper load values. Loads directly effect the performance of the
differential operational amplifier (the suggested value is 200 Ω
differentially, 100 Ω on each output node).
Caution:
Incorrect connections cause excessive current flow and may damage
the device.
3) Place the GND connection of the probe as close as possible to the output
nodes. Use the GND holes on the EVM. The GND holes create a shorter
route to the GND plane and output nodes.
4) Place the probe at the input nodes, set the power level of the network
analyzer to the proper level (information in the data sheet typically is
produced at –20 dBm power level), and calibrate the network analyzer.
Note:
If a differential probe is used, verify that resistors R1a, R1b, R4b, and R4a
are in place. The resistors are 0 Ω values providing the path to the differential
probe terminals.
5) Place the probe at the output nodes (if a differential probe is used, insert
the probe into the provided jumper), and measure the frequency
response.
2-5
Using the THS4150 EVM
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Butterworth Filter
Note:
Transformers are used to change the single ended signals to differential
signal or vice versa. On this EVM, they can be populated according to the
applicationortheexperiment. TheV
pinofthedevicemaybeconnected
OCM
to the center-tap of the transformer, or maybe set via an external sourcesuch
as V of a data converter. If the V pin is not connected to an external
ref
OCM
source, it will be set at the center point of the power supply. For example, if
±5 sources are used, the V level will be set to zero.
OCM
2.7 Butterworth Filter
An example of a Butterworth filter implemented with multiple feedback archi-
tecture is provided. The following circuit is implemented on the EVM board.
The following figures represent the circuit configuration and the component
values. The corner frequency of the filter (–3dB) is set at 1 MHz.
For verification of jumper locations and other bypass components, see the
complete EVM schematic in Figure 1–2.
Figure 2–4. Multiple Feedback Filter Circuit
787 Ω
100 pF
V
CC
732 Ω
100 Ω
787 Ω
220 pF
787 Ω
5 V
+
–
–1 dBm
AC
THS4150
732 Ω
+
–
100 Ω
–5 V
V
EE
100 pF
787 Ω
2-6
Using the THS4150 EVM
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THS4150 EVM Bill of Materials
Figure 2–5. Gain vs Phase
Butterworth filter with multiple feedback frequency response.
10
8
6
Phase
4
2
0
Gain
–2
–4
–8
–10
V
R
= –1 dBm
= 200 Ω Diff
= ±15
IN
L
V
CC
0.1
1
10
f – Frequency – MHz
100
500
2.8 THS4150 EVM Bill of Materials
Table 2–1. THS4150 EVM Bill of Materials
Ref.
Description
Size
Qty.
Manufacturer
Murata
Part Number
C1, C4,
C5, C6
Capacitor, 0.1 µF, ceramic
0805
4
GRM40–X7R104K25
C7, C8
Capacitor, 6.8 µF, 35 V, 20%
7343
0805
2
5
Sprague
293D685X9035D2T
tantalum, SM
C1A, C1B, Open
C2, C3A,
C3B
J1, J2, J3, SMT_PCB_MT
J4
SMA jack
4
4
4
2
Amphenol
Newark
901-144-8RFX
35F865
J6, J7, J8, Banana jack
J9
JU1, JU2,
JU3, JU4
2 pos jumper header, 0.1 ctrs.,
0.025” sq pins
2 pos
jump
JU1, JU2
Shorting jumpers header, 0.1
ctrs., 0.025” sq pins
L1, L2
Inductor, 0.22 µH SM
0805
0805
2
5
Digi-Key
Digi-Key
PCD1176CT–ND
P0.0ACT–ND
R1a, R1b, Resistor, 0 Ω, 1%
RX1, RX4,
RX5
R2a, R2b, Open
R5, R12,
0805
11
R13, R14,
R15, RX2,
RX7, RX8,
RX9
2-7
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THS4150 EVM Bill of Materials
Table 2–1. THS4150 EVM Bill of Materials (continued)
Ref.
R3a, R3b
R4a, R4b
R6a, R6b
R11
Description
Resistor, 374 Ω, 1%
Resistor, 0 Ω, 1%
Size
0805
1206
0805
0805
1206
Qty.
2
Manufacturer
Digi-Key
Part Number
P374CTR-ND
2
Digi-Key
Digi-Key
Digi-Key
Digi-Key
P0.0ECT-ND
P402CTR-ND
P10.KCTR-ND
P49.9FTR-ND
Resistor, 402 Ω, 1%
Resistor, 10 kΩ, 1%
2
1
R10, RX3, Resistor, 49.9 Ω, 1%
RX6
3
R16, R7
Open
1206
2
2
R36aA,
R36aB,
R36bA,
R36bB
High precision resistor
RPU1,
RPU2
Open
0805
2
RX0
Resistor, 24.9 Ω, 1%
0805
1
2
3
Digi–Key
P24.9CTR-ND
T1, T2
Open
MC KK81
TP .025
TP1, TP2, Test point 2
TP3
Farnell
Farnell
240-345
240-333
TP4, TP5, Test point 2
TP6, TP7
TP .025
4
1
U1
IC, THS4150
8 Pin
DGN
Texas Instruments THS4150CDGN
2-8
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Chapter 3
General High-Speed Amplifier Design
Considerations
The THS4150 EVM layout has been designed for use with high-speed signals
and can be used as an example when designing PCBs incorporating the
THS4150. Careful attention has been given to component selection,
grounding, power supply bypassing, and signal path layout. Disregarding
these basic design considerations could result in less than optimum
performance of the THS4150 high-speed operational amplifier.
Surface-mount components were selected because of the extremely low lead
inductance associated with this technology. This helps minimize both stray
inductance and capacitance. Also, because surface-mount components are
physically small, the layout can be very compact.
Tantalum power supply bypass capacitors at the power input pads help supply
currents needed for rapid, large signal changes at the amplifier output. The
0.1-µF power supply bypass capacitors were placed as close as possible to
the IC power input pins in order to minimize the return path impedance. This
improves high frequency bypassing and reduces harmonic distortion.
A proper ground plane on both sides of the PCB should be used with
high-speed circuit design. This provides low-inductive ground connections for
return current paths. In the area of the amplifier input pins, however, the
ground plane should be removed to minimize stray capacitance and reduce
ground plane noise coupling into these pins. This is especially important for
the inverting pin while the amplifier is operating in the noninverting mode.
Because the voltage at this pin swings directly with the noninverting input
voltage, any stray capacitance would allow currents to flow into the ground
plane. This could cause possible gain error and/or oscillation. Capacitance
variations at the amplifier input pin of greater than 1 pF can significantly affect
the response of the amplifier.
In general, it is best to keep signal lines as short and as straight as possible.
Incorporation of microstrip or stripline techniques is also recommended when
signal lines are greater than 1 inch in length. These traces must be designed
with a characteristic impedance of either 50 Ω or 75 Ω, as required by the
application. Such a signal line must also be properly terminated with an
appropriate resistor.
3-1
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Finally, proper termination of all inputs and outputs must be incorporated into
the layout. Unterminated lines, such as coaxial cable, can appear to be a
reactive load to the amplifier. By terminating a transmission line with its
characteristic impedance, the amplifier’s load then appears to be purely
resistive, and reflections are absorbed at each end of the line. Another
advantage of using an output termination resistor is that capacitive loads are
isolated from the amplifier output. This isolation helps minimize the reduction
in the amplifier’s phase-margin and improves the amplifier stability resulting
in reduced peaking and settling times.
3-2
General High-Speed Amplifier Design Considerations
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