INTEGRATED CIRCUITS
DATA SHEET
TDA1516BQ
24 W BTL or 2 x 12 watt stereo car
radio power amplifier
July 1994
Product specification
File under Integrated Circuits, IC01
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
PACKAGE OUTLINE
13-lead SIL-bent-to-DIL; plastic power (SOT141); SOT141-6; 1996 July 24.
Fig.1 Block diagram.
July 1994
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
PINNING
1
2
3
4
5
6
7
−INV1 non-inverting input 1
INV inverting input
GND1 ground (signal)
reference voltage
OUT1 output 1
8
9
BS2
OUT2 output 2
V supply voltage
P
bootstrap 2
10
V
11 M/SS mute/stand-by switch
ref
12 RR
supply voltage ripple rejection
BS1
bootstrap 1
13 −INV2 non-inverting input 2
GND2 ground (substrate)
FUNCTIONAL DESCRIPTION
The TDA1516BQ contains two identical amplifiers with differential input stages. This device can be used for stereo or
bridge applications. The gain of each amplifier is fixed at 20 dB. A special feature of this device is the mute/stand-by
switch which has the following features:
• low stand-by current (< 100 µA)
• low mute/stand-by switching current (low cost supply switch)
• mute condition.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
Supply voltage
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
operating
V
V
−
−
18
30
V
V
P
non-operating
load dump protected
P
during 50 ms;
t ≥ 2,5 ms
V
−
45
V
r
P
A.C. and d.c. short-circuit-
safe voltage
V
V
−
−
18
6
V
V
PSC
Reverse polarity
PR
Energy handling capability
at outputs
V = 0 V
−
−
200
6
mJ
A
P
Non-repetitive peak output
current
I
OSM
Repetitive peak output
current
I
−
−
−
4
A
ORM
Total power dissipation
Crystal temperature
Storage temperature range
see Fig.2
P
T
25
W
°C
°C
tot
150
+ 150
c
T
−55
stg
July 1994
4
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
Fig.2 Power derating curve.
July 1994
5
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
D.C. CHARACTERISTICS (note 1)
V = 14,4 V; T
= 25 °C; unless otherwise specified
P
amb
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply
Supply voltage range
Quiescent current
note 2
V
I
6,0
14,4
18,0
V
P
−
−
−
40
6,8
−
80
mA
P
D.C. output voltage at
approximately V /2
note 3
V
O
−
V
P
D.C. output offset
voltage
|∆V
|
100
mV
5-9
mute
O
Mute/stand-by switch
Switch-on voltage level
Mute condition
V
8,5
3,0
−
−
−
6,4
V
V
ON
V
V
Output signal in mute
position
V = 1 V (max.);
I
f = 20 Hz to
15 kHz
−
−
2
mV
D.C. output offset
voltage
|∆V
|
−
0
−
−
100
2
mV
V
5-9
V
Stand-by condition
sb
D.C. current in
stand-by condition
Switch-on current
I
−
−
−
12
100
40
µA
µA
sb
I
sw
July 1994
6
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
A.C. CHARACTERISTICS
V = 14,4 V; R = 4 Ω; f = 1 kHz; T
= 25 °C; unless otherwise specified
P
L
amb
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
note 1
Stereo application
Output power
note 4;
THD = 0,5%
THD = 10%
notes 4 and 5;
THD = 10%
note 4;
P
P
4
5
−
−
W
o
5,5
6,0
W
o
P
6
7
−
W
o
Output power at
R = 2 Ω
THD = 0,5%
THD = 10%
notes 4 and 5;
THD = 10%
note 6;
P
P
7.5
10
8,5
11
−
−
W
W
L
o
o
P
f
10,5
12,0
−
W
o
Low frequency roll-off
−3 dB
−1 dB
−
20
19
45
−
−
−
Hz
L
High frequency roll-off
Closed loop voltage gain
Supply voltage ripple
rejection:
f
kHz
dB
H
G
20
21
v
note 7
ON
RR
RR
RR
48
48
80
50
−
−
−
60
−
−
−
75
dB
dB
dB
kΩ
mute
stand-by
Input impedance
Noise output voltage:
ON
|Z |
I
note 8;
R = 0 Ω
V
−
−
−
40
−
50
70
50
−
−
100
−
−
1
µV
µV
µV
dB
dB
S
no(rms)
ON
R = 10 kΩ
V
V
α
S
no(rms)
no(rms)
mute
note 9
Channel separation
Channel balance
R = 10 kΩ
S
G
−
v
July 1994
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
PARAMETER
BTL application
CONDITIONS
note 10
SYMBOL
MIN.
TYP.
MAX.
UNIT
Output power
THD = 0,5%
P
P
P
15,5
17,0
−
−
−
W
o
THD = 10%
20
21
22
24
W
W
o
o
note 5; THD = 10%
Output power at V
= 13,2 V
P
THD = 0,5%
P
P
P
−
−
−
13,5
17
−
−
−
W
W
W
o
o
o
THD = 10%
note 5; THD = 10%
THD = 0,5%
19
Power bandwidth
P = 15 W
B
−
20 to
−
Hz
o
w
15 000
Low frequency roll-off
note 6;
−3 dB
−1 dB
f
−
20
25
25
−
−
−
Hz
L
High frequency roll-off
f
kHz
dB
H
Closed loop voltage gain
G
26
27
v
Supply voltage ripple
rejection:
note 7
ON
RR
RR
RR
48
48
80
25
−
−
−
30
−
−
−
38
dB
dB
dB
kΩ
mute
stand-by
Input impedance
|Z |
I
Noise output voltage
note 8;
ON
R = 0 Ω
V
−
−
−
70
−
200
−
µV
µV
µV
S
no(rms)
ON
R = 10 kΩ
V
V
100
60
S
no(rms)
no(rms)
mute
note 9
Notes to the characteristics
1. All characteristics, for stereo application are measured using the circuit shown in Fig.3.
2. The circuit is d.c. adjusted at V = 6 V to 18 V and a.c. operating at V = 8,5 to 18 V.
P
P
3. At 18 V < V < 30 V the d.c. output voltage ≤ V /2.
P
P
4. Output power is measured directly at the output pins of the IC.
5. With bootstrap and a 100 kΩ resistor from pin 12 to the positive supply voltage (V ), value of bootstrap capacitor is
P
47 µF.
6. Frequency response externally fixed.
7. Ripple rejection measured at the output with a source impedance of 0 Ω (maximum ripple amplitude of 2 V) and a
frequency between 1 kHz and 10 kHz.
8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
9. Noise output voltage independent of R (V = 0 V).
S
I
10. All characteristics, for BTL application are measured using the circuit shown in Fig.4.
July 1994
8
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
APPLICATION INFORMATION
Fig.3 Stereo application circuit diagram.
Fig.4 BTL application circuit diagram (without bootstrapping).
9
July 1994
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
PACKAGE OUTLINE
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
non-concave
x
D
h
D
E
h
view B: mounting base side
d
A
2
B
j
E
A
L
3
L
Q
c
1
13
e
e
m
v
M
w
M
1
Z
2
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.2 0.60 0.38 23.6 19.6
12.2
11.8
3.4 12.4 2.4
3.1 11.0 1.6
2.00
1.45
2.1
1.8
6
mm
10
3.4
1.7 5.08
0.8
4.3
0.25 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-03-11
SOT141-6
July 1994
10
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
SOLDERING
Introduction
specified maximum storage temperature (T
). If the
stg max
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994
11
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