INTEGRATED CIRCUITS
DATA SHEET
TDA6800
TDA6800T
Video modulator circuit
March 1986
Product specification
File under Integrated Circuits, IC02
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Philips Semiconductors
Product specification
TDA6800
TDA6800T
Video modulator circuit
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage
V5−4
V8−4
V6, 7−4
Tstg
max.
max.
max.
max.
max.
7 V
4 V
Input voltage
Output voltage
9 V
Storage temperature
Junction temperature
Operating ambient temperature range
125 °C
125 °C
Tj
Tamb
−25 to + 85 °C
THERMAL RESISTANCE
From junction to ambient in free air
TDA6800T
TDA6800
Rth j−a
Rth j−a
260 K/W
120 K/W
Fig.1 Block diagram TDA6800 and TDA6800T.
March 1986
3
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Philips Semiconductors
Product specification
TDA6800
TDA6800T
Video modulator circuit
CHARACTERISTICS
VP = 5 V; Tamb = 25 °C; measured in Fig.1; unless otherwise specified
PARAMETER
Supply voltage range
SYMBOL
V5-4
MIN.
TYP.
MAX.
UNIT
4,5
−
−
−
9
5,5
13
−
V
Supply current consumption
Video input voltage
Input impedance
I5
mA
V
V8(p-p)
R8
1
30
−
−
kΩ
Voltage (d.c.) at video
input (clamp voltage)
Voltage (d.c.) at
V8
−
1,4
−
V
sound input
V1
−
−
−
−
−
2,5
13
10
−
−
−
−
10
10
V
Output voltage f = 50 MHz; RL = 75 Ω
Output voltage f = 600 MHz; RL = 75 Ω
Differential gain
V6-7
V6-7
mV
mV
%
∆
G
Differential phase
Intermodulation
∆
φ
−
deg.
(1,1 MHz) (note 1)
Frequency shift
−
−
−
−
−
−80
−
−60
100
−
dB
Vb = 5%, f = 600 MHz
Frequency shift
∆
kHz
kHz
kHz
kHz
f
Vb = 5%, f = 800 MHz
Frequency drift
∆
f
tbf
−
25 to 40 °C
Frequency drift
∆
f
100
300
15 to 55 °C
∆
f
−
Positive modulation
(see Fig.3)
Residual carrier voltage
Cross modulation (note 2)
Vr
−
−
−
0,1
2,5
%
%
α
0,25
Notes
1. Input signal: d.c. 0,45 V (V8-4 = 1,85 V)
4,4 MHz; input voltage (p-p) = 0,6 V
5,5 MHz; input voltage (p-p) = 1,26 V
measured with respect to picture carrier, at f = 600 MHz.
2. Input signal: d.c. 1 V (V8-4 = 3,5 V)
5,5 MHz AM modulated, fm = 100 kHz
m = 0,8; input voltage (p-p) = 2,27 V (including modulation)
measured with respect to the picture carrier, at f = 600 MHz.
March 1986
4
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Philips Semiconductors
Product specification
TDA6800
TDA6800T
Video modulator circuit
* Close to output transformer.
Fig.2 Application for negative modulation.
* Close to output transformer
Fig.3 Application for positive modulation.
5
March 1986
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Philips Semiconductors
Product specification
TDA6800
TDA6800T
Video modulator circuit
* Close to output transformer.
Fig.4 Application for general purpose modulation.
March 1986
6
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Philips Semiconductors
Product specification
TDA6800
TDA6800T
Video modulator circuit
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
D
M
E
A
2
A
A
1
L
c
w M
Z
b
1
e
(e )
1
M
H
b
b
2
8
5
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
(1)
(1)
1
2
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
1.15
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT97-1
050G01
MO-001AN
March 1986
7
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Philips Semiconductors
Product specification
TDA6800
TDA6800T
Video modulator circuit
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-02-04
97-05-22
SOT96-1
076E03S
MS-012AA
March 1986
8
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Philips Semiconductors
Product specification
TDA6800
TDA6800T
Video modulator circuit
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
WAVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
DIP
• The package footprint must incorporate solder thieves at
the downstream end.
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
REPAIRING SOLDERED JOINTS
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
March 1986
9
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Philips Semiconductors
Product specification
TDA6800
TDA6800T
Video modulator circuit
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
March 1986
10
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