Intel Personal Computer BOXD54250WYK User Manual

PRODUCT BRIEF  
D54250WYK  
Intel® NUC Kit  
C O N S U M E R  
M I N I  
INFRARED  
S E N S O R  
*
GIGABIT LAN  
HDMI  
MINI DISPLAY  
USB  
*
P O RT  
3.0  
The Shape that Fits the Future.  
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Power, Capabilities, and Performance  
in Four Inches Square  
HIGHLIGHTED FEATURES  
1 Intel Core i5-4250U processor  
2 Two SO-DIMM sockets for memory  
5 Dual rear Panel USB 3.0 ports  
6 Intel® Gigabit LAN  
On Back  
2
3
expandability up to 16 GB  
7 19V, 65 W DC power connector  
8 Dual front panel USB 3.0 ports  
9 Consumer infrared sensor  
10 Headphone/microphone jack  
3 Dual PCIe* mini card connectors  
for flexible support of wireless  
and SSD configurations  
4 One Mini DisplayPort supporting  
DP 1.2 and one Mini HDMI port  
supporting HDMI 1.4a  
8
10  
9
1
5
6
4
4¨ (11 cm)  
7
D54250WYK PRODUCT BRIEF 3  
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Intel® NUC Kit D54250WYK  
TECHNICAL SPECIFICATIONS  
PROCESSOR  
FAST BOOT BIOS  
FRONT-PANEL CONNECTORS  
International  
• Intel® Core™ i5 4250U Processor (1.3 GHz with turbo  
capability to achieve 2.6 GHz, Dual-Core processor  
with 3 MB smart cache)  
• Supports Intel® Hyper-Threading Technology5  
• Supports Intel® 64 architecture6  
• Optimized POST for almost instant-on access to  
PC from power on  
• Reset, HDD LED, Power LEDs, power on/off  
IEC 60950-1  
MECHANICAL CHASSIS SIZE  
• 4.59¨ x 4.41¨ x 1.36¨  
EMC REGULATIONS (CLASS B)  
United States  
FCC CFR Title 47, Chapter I, Part 15, Subparts A, B  
SYSTEM MEMORY  
• Dual-channel DDR3L with two connectors for  
1600/1333 MHz memory support (16 GB max)  
116.6mm x 112.0mm x 34.5mm  
Canada  
ICES-003  
BOARD SIZE  
• 4¨ x 4¨  
GRAPHICS  
• Intel® HD Graphics 5000  
HARDWARE MANAGEMENT FEATURES  
• Processor fan speed control  
Europe  
(EMC Directive 2004/108/EC)  
EN 55022 and EN 55024  
• 101.6mm x 101.6mm  
• One Mini DisplayPort* 1.2 supporting ultra-high definition  
4K displays and multiple monitor functionality  
• Voltage and temperature sensing  
BASEBOARD POWER REQUIREMENTS  
• DC Power 12 - 19 V, 65 W  
• Fan sensor inputs used to monitor fan activity  
• ACPI-compliant power management control  
• One Mini HDMI* 1.4a port  
Australia/New Zealand  
EN 55022  
• Power Cord Options (Types B, E, and G)  
PERIPHERAL CONNECTIVITY  
• Integrated Intel 10/100/1000 Network Connection  
INTEL® PRO 10/100/1000  
NETWORK CONNECTION  
• Low-power design  
Japan  
VCCI V-3, V-4  
ENVIRONMENT OPERATING TEMPERATURE  
• 0° C to +50° C  
• Four Super Hi-Speed USB 3.0 ports  
(two back panel ports and two front ports)  
South Korea  
KN-22 and KN-24  
STORAGE TEMPERATURE  
• -20° C to +70° C  
• Two additional Hi-Speed USB 2.0 ports via  
internal header  
EXPANSION CAPABILITIES  
• One PCI Express* half-mini card connector7  
• One PCI Express full-mini card connector7  
• 1x SATA port (6 Gb/s)  
Taiwan  
CNS 13438  
MEMORY VOLTAGE  
• 1.35 V  
REGULATIONS AND SAFETY STANDARDS  
United States  
UL 60950-1  
International  
CISPR 22  
AUDIO  
SYSTEM BIOS  
• 64 Mb Flash EEPROM with Intel® Platform Innovation  
Framework for EFI Plug and Play  
• Intel® HD Audio8 via Mini HDMI 1.4a and Mini  
DisplayPort 1.2 output supporting 8 channel (7.1)  
digital audio  
Canada  
CAN/CSA-C22.2 No. 60950-1  
ENVIRONMENTAL COMPLIANCE  
Europe  
Europe RoHS (Directive 2011/65/EU)  
• Advanced configuration and power interface V3.0b,  
SMBIOS2.5  
Europe  
• Intel® HD Audio via stereo analog audio jack  
(microphone in/headphone out/speaker out)  
(Low Voltage Directive 2006/95/EC)  
EN 60950-1  
China  
• Intel® Visual BIOS  
China RoHS (MII Order #39)  
• Intel® Express BIOS update support  
5 Available on select Intel® Core™ processors. Requires an Intel® HT Technology-  
enabled system. Consult your PC manufacturer. Performance will vary depend-  
ing on the specific hardware and software used. For more information including  
info/hyperthreading.  
6 Requires a system with a 64-bit enabled processor, chipset, BIOS and software.  
Performance will vary depending on the specific hardware and software you  
use. Consult your PC manufacturer for more information. For more information,  
7 System resources and hardware (such as PCI and PCI Express*) require physi-  
cal memory address locations that can reduce available addressable system  
memory. This could result in a reduction of as much as 1 GB or more of physical  
addressable memory being available to the operating system and applications,  
depending on the system configuration and operating system.  
8 Requires an Intel® HD Audio enabled system. Consult your PC manufacturer  
for more information. Sound quality will depend on equipment and actual  
com/design/chipset/hdaudio.htm  
1 Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Tech-  
nology and Intel Turbo Boost Technology 2.0 are only available on select Intel®  
processors. Consult your system manufacturer. Performance varies depending  
on hardware, software, and system configuration. For more information, visit  
2 Requires a select Intel® processor, Intel® software and BIOS update, and a  
Solid-State Drive (SSD) or hybrid drive. Depending on system configuration,  
your results may vary. Contact your system manufacturer for more information.  
3 Intel® Smart Connect Technology requires a select Intel® processor, Intel®  
software and BIOS update, Intel® Wireless adapter, and Internet connectivity.  
Solid-state memory or drive equivalent may be required. Depending on system  
configuration, your results may vary. Contact your system manufacturer for  
more information.  
4 Intel® Smart Response Technology requires a Intel® Core™ processor, select  
Intel® chipset, Intel® Rapid Storage Technology software version 12.5 or higher,  
and a solid state hybrid drive reporting at least 16 GB capacity and supporting  
SATA-IO hybrid information feature. Depending on system configuration, your  
results may vary. Contact your system manufacturer for more information.  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH  
INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL  
OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED  
BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTELS TERMS AND  
CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LI-  
ABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED  
WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS  
INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A  
PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY  
PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.  
Look for Intel® NUC with Intel Inside® at  
www.intel.com/NUC  
Intel products are not intended for use in medical, life-saving, or life-sustaining  
applications. Intel may make changes to specifications and product descriptions at  
any time, without notice.  
All products, dates, and figures specified are preliminary based on current  
expectations, and are subject to change without notice. Availability in different  
channels may vary.  
Actual Intel® NUC kit or board may differ from the image shown.  
Copyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Intel Inside, Look Inside, the Look Inside logo, and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.  
*Other names and brands may be claimed as the property of others. Printed in USA 1113/JMD/HBD/PDF Please Recycle  
329414-003US  
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