Intel Computer Hardware BLKDZ75ML45K User Manual

®
Intel Desktop Board  
DZ75ML-45K  
Optimized for Intel® -K Processors  
microATX Form Factor  
proDucT brieF  
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intel® Desktop board DZ75ML-45K  
Features and Benefits  
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8
7
1
Support for the intecore™ i7 processor  
in the LGA 1155 package. optimized  
for the intel® -K processors. Features  
Intel® Turbo Boost Technology2, Intel®  
Hyper-Threading Technology3  
10 HDMi* and DVi-i Video connectors.  
2
3
11 intel® Gigabit ethernet LAN: Features  
onboard 10/100/1000 Mb/s Ethernet LAN  
connectivity.  
12 microATX (9.6” × 9.6”) Form Factor.  
for exceptional performance and scalability.  
2
3
intel® Z75 express chipset: Features  
Overclocking1 Support.  
1
Four DiMM slots: Designed to support  
overclocked1 DDR3 2400MHz + O.C.4  
memory, delivering up to 32 GB/s  
memory bandwidth.  
5
6
4
Four Super-Speed uSb 3.0 ports  
(2 external, 2 via internal header),  
ten uSb 2.0 ports (4 external,  
6 via internal headers).  
opTiMiZeD For iNTeL®-K proceSSorS  
Intel® Desktop Board optimized for Intel®  
-K processors for maximum overclocking1  
performance and best experience.  
11  
4
5
6
pci express 3.0* ×16 slot.  
10  
9
12  
pci express* x16 (x4 electrical)  
and 2 pci express* x1 connectors.  
9.6” (24.38 cm)  
7
8
Two SATA 6.0 Gb/s ports, four SATA  
3.0 Gb/s ports.  
iNTeL® FAST booT TecHNoLoGY  
Go from system off to Windows*  
in mere seconds.  
ersal.GPU.Virtualization  
interapid Storage Technology:  
Performance and reliability with support  
for RAID 0, 1, 5, 10.  
11  
4
9
10  
9
8 channel (5.1+2) intel® High  
-Definition-Audio5 Enables high-quality  
integrated audio that rivals the perfor-  
mance of high-end discrete solutions.  
poWer SuperViSor  
Active monitoring of power ensures  
system protection.  
3
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intel® Desktop board DZ75ML-45K  
Technical Specifications  
proceSSor  
processor Support  
eXpANSioN cApAbiLiTieS  
One PCI Express* 3.0 x16 connector  
One PCI Express* 2.0 x16 connector (x4 Electrical)  
Two PCI Express* 2.0 x1 connector  
MecHANicAL  
board Style  
eMc reGuLATioNS (cLASS b)  
united States  
FCC CFR Title 47, Chapter I, Part 15, Subparts A/B  
canada  
ICES-003  
europe  
(EMC Directive 2004/108/EC)  
EN 55022 and EN 55024  
Australia/New Zealand  
EN 55022  
Optimized for Intel® -K processors. Supports 2nd and 3rd  
Generation Intel® Core™, and other Intel® processors  
in the LGA1155 package  
microATX  
board Size  
AuDio  
9.6” x 9.6” (24.38 cm x 24.38 cm)  
cHipSeT  
intel® Z75 express chipset  
5.1 + 2 Intel® High Definition Audio5  
Three stack analog audio ports plus internal S/PDIF  
headers  
baseboard power requirements  
ATX 12 V  
Intel® Z75 PCH  
Intel® Rapid Storage Manager (RAID 0, 1, 5, 10)  
eNViroNMeNT  
operating Temperature  
ViDeo  
HDMI* and DVI-I Video connectors for Intel® processors  
with Intel® HD Graphics  
peripHerAL coNNecTiViTY  
0° C to +55° C  
Storage Temperature  
• –20° C to +70° C  
Japan  
Two SATA 6.0 Gb/s ports  
Four SATA 3.0 Gb/s ports  
Four SuperSpeed USB 3.0 ports with 5.0 Gb/s link speed  
(two back panel and two via internal headers)  
Ten Hi-Speed USB 2.0 ports (four back panel ports  
and six ports via internal headers)  
VCCI V-3, V-4  
South Korea  
KN-22 and KN-24  
Taiwan  
CNS 13438  
international  
CISPR 22  
SYSTeM MeMorY  
Memory capacity  
Four 240-pin DIMM connectors supporting up to four  
double-sided DIMMs  
reGuLATioNS AND SAFeTY STANDArDS  
united States  
UL 60950-1  
Maximum system memory up to 32 GB6 using 8 GB  
doublesided DIMMs  
SYSTeM bioS  
canada  
64 Mb Flash EEPROM with Intel® Platform  
Innovation Framework for EFI Plug and Play  
Advanced configuration and power interface  
V3.0b, SMBIOS2.5  
CAN/CSA-C22.2 No. 60950-1  
europe  
(Low Voltage Directive 2006/95/EC)  
EN 60950-1  
international  
IEC 60950-1  
eNViroNMeNTAL coMpLiANce  
europe  
Europe RoHS (Directive 2002/95/EC)  
WEEE (Directive 2002/96/EC)  
china  
Intel® Express BIOS update support  
China RoHS  
HArDWAre MANAGeMeNT FeATureS  
Processor fan speed control  
Front and rear system chassis fan speed control  
Voltage and temperature sensing  
Fan sensor inputs used to monitor fan activity  
ACPI-compliant power management support  
JuMperS AND FroNT pANeL coNNecTorS  
Jumpers  
Jumper access for BIOS maintenance mode  
Front panel connectors  
Reset, HD LED, Power LEDs, power on/off  
Front-panel audio header  
iNTeL® pro 10/100/1000 NeTWorK coNNecTioN  
Low-power design  
other connectors  
Chassis intrusion detect header  
1
2
3
4
Warning: Altering clock frequency and/or voltage may (i) reduce system stability  
and useful life of the system and processor; (ii) cause the processor and other  
system components to fail; (iii) cause reductions in system performance; (iv) cause  
additional damage; and (v) affect system data integrity. Intel has not tested,  
and does not warranty, the operation of the processor beyond its specifications.  
Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo  
Boost Technology capability. Intel Turbo Boost Technology performance varies  
depending on hardware, software, and overall system configuration. Check with  
your PC manufacturer on whether your system delivers Intel Turbo Boost Technology.  
Intel® Hyper-Threading Technology requires a computer system with a procesor  
supporting HT Technology and an HT Technology-enabled chipset, BIOS,  
and operating system. Performance will vary depending on the specific hardware  
and software you use. For more information including details on which processors  
5 Intel® High Definition Audio requires a system with an appropriate Intel® chipset  
and a motherboard with an appropriate codec and the necessary drivers installed.  
System sound quality will vary depending on actual implementation, controller,  
codec, drivers, and speakers. For more information about Intel® HD Audio, refer  
6 System resources and hardware (such as PCI and PCI Express*) require physical  
memory address locations that can reduce available addressable system memory.  
This could result in a reduction of as much as 1 GB or more of physical addressable  
memory being available to the operating system and applications, depending  
on the system configuration and operating system.  
Intel products are not intended for use in medical, life-saving, or life sustaining  
applications. Intel may make changes to specifications and product descriptions  
at any time, without notice.  
All products, dates, and figures specified are preliminary based on current expec-  
tations, and are subject to change without notice. Availability in different channels  
may vary.  
For ordering information, visit  
www.intel.com  
For the most current product information, visit  
www.intel.com/go/idb  
Actual Intel® Desktop Board may differ from the image shown.  
Other names and brands may be claimed as the property of others.  
*
Copyright 2012 Intel Corporation 09/12/FB/MED/PDF 327986-001US  
©
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®  
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.  
EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH  
PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS  
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL  
PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR  
A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,  
COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.  
Maximum peak memory bandwidth requires four DDR 3 modules to be populated  
in each of the blue memory slots. DDR 3 2400 memory support on this  
motherboard requires advanced knowledge of BIOS and memory tuning; individual  
results may vary. For specific supported memory for this motherboard, please  
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