HP Hewlett Packard Server 654080 S01 User Manual

HP ProLiant DL/ML370 G6 Server  
Maintenance and Service Guide  
Abstract  
This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing  
hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.  
Part Number: 513481-007  
October 2012  
Edition: 7  
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Contents  
Contents  
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Contents  
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Customer self repair  
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for  
greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service  
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will  
ship that part directly to you for replacement. There are two categories of CSR parts:  
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts,  
you will be charged for the travel and labor costs of this service.  
Optional—Parts for which customer self repair is optional. These parts are also designed for customer  
self repair. If, however, you require that HP replace them for you, there may or may not be additional  
charges, depending on the type of warranty service designated for your product.  
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,  
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the  
Illustrated Parts Catalog.  
Based on availability and where geography permits, CSR parts will be shipped for next business day  
delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.  
If assistance is required, you can call the HP Technical Support Center and a technician will help you over the  
telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must  
be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective  
part back to HP within a defined period of time, normally five (5) business days. The defective part must be  
returned with the associated documentation in the provided shipping material. Failure to return the defective  
part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping  
and part return costs and determine the courier/carrier to be used.  
For more information about HP's Customer Self Repair program, contact your local service provider. For the  
North American program, refer to the HP website (http://www.hp.com/go/selfrepair).  
Parts only warranty service  
Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty  
service, HP will provide replacement parts free of charge.  
For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these parts,  
you will be charged for the travel and labor costs of this service.  
Réparation par le client (CSR)  
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin  
de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la  
période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être  
effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:  
Customer self repair  
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Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de  
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à  
votre produit.  
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la  
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué  
par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.  
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation  
géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même  
ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le  
Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise  
s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai  
indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans  
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les  
coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de  
retour, et détermine la société de courses ou le transporteur à utiliser.  
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus  
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP  
Service de garantie "pièces seules"  
Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de  
rechange fournies par HP ne sont pas facturées.  
Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à  
HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
Riparazione da parte del cliente  
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti  
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente  
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza  
HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per  
la sostituzione. Vi sono due categorie di parti CSR:  
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere  
spese addizionali a seconda del tipo di garanzia previsto per il prodotto.  
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono  
identificate da un "No" nel Catalogo illustrato dei componenti.  
Customer self repair  
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In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il  
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento  
di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del  
centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente  
deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve  
spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il  
componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione  
fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.  
Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il  
corriere/vettore da utilizzare.  
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il  
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).  
Servizio di garanzia per i soli componenti  
La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia  
del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.  
Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da  
parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di spedizione  
e di manodopera per il servizio.  
Customer Self Repair  
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere  
Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der  
Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses  
Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:  
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den  
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen  
Service berechnet.  
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,  
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche  
Kosten anfallen.  
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des  
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog  
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.  
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.  
Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen  
Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und  
sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert  
werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es  
erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen  
Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen  
Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das  
Customer self repair  
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defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer  
Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den  
Kurier-/Frachtdienst.  
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner  
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter  
Parts-only Warranty Service (Garantieservice  
ausschließlich für Teile)  
Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich  
für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile kostenlos zur  
Verfügung.  
Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch  
dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service  
berechnet.  
Reparaciones del propio cliente  
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self  
Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar  
sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios  
de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente  
CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se  
clasifican en dos categorías:  
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a  
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de  
desplazamiento y de mano de obra de dicho servicio.  
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos  
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si  
precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de  
servicio de garantía correspondiente al producto.  
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que  
el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado  
realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el  
catálogo ilustrado de componentes.  
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su  
destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el  
mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de  
asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales  
para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán  
devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá  
hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes  
defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no  
Customer self repair  
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enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas  
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de  
componentes y escogerá la empresa de transporte que se utilice para dicho servicio.  
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en  
contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite  
la página web de HP siguiente (http://www.hp.com/go/selfrepair).  
Servicio de garantía exclusivo de componentes  
La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según las  
condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto sin  
cargo adicional alguno.  
Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por  
parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse  
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.  
Customer Self Repair  
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een  
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze  
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij  
de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat  
onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee  
categorieën CSR-onderdelen:  
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen  
voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.  
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen  
voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het  
product.  
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met  
de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.  
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de  
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden  
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service  
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het  
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte  
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde  
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de  
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het  
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij  
reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en  
kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.  
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Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma  
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).  
Garantieservice "Parts Only"  
Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van  
de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.  
Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze  
onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening  
gebracht.  
Reparo feito pelo cliente  
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a  
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,  
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo  
pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.  
Existem duas categorias de peças CSR:  
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de  
taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de  
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão  
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.  
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o  
pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser  
feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico  
da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR  
de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é  
preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.  
A peça com defeito deve ser enviada com a documentação correspondente no material de transporte  
fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a  
HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço  
postal a ser utilizado.  
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o  
fornecedor de serviços local. Para o programa norte-americano, visite o site da HP  
Serviço de garantia apenas para peças  
A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do  
serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.  
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No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas  
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.  
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Illustrated parts catalog  
Mechanical components  
Item Description  
Spare part number  
Customer self repair (on  
page 6)  
Access panel  
1
519557-001  
519564-001  
519563-001  
515048-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Front bezel (tower model only)  
2
Rack bezel (rack model only)  
3
Tower configuration panel  
4
Illustrated parts catalog 16  
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Item Description  
Spare part number  
Customer self repair (on  
page 6)  
Miscellaneous hardware kit  
519560-001  
Mandatory1  
5
a) Fan blank  
b) Power supply blank  
c) Hard drive cage blank  
d) Media bay blank  
Air baffle  
519558-001  
413965-001  
519561-001  
Mandatory1  
Mandatory1  
Mandatory1  
6
7
8
T-10/T-15 Torx screwdriver*  
Tower feet*  
*Not shown  
1Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be  
charged for the travel and labor costs of this service.  
2Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,  
however, you require that HP replace them for you, there may or may not be additional charges, depending on the type  
of warranty service designated for your product.  
3No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that  
an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.  
1Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces  
pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.  
3No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour  
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces  
pièces sont identifiées par la mention “Non” dans le Catalogue illustré.  
1Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese  
addizionali a seconda del tipo di garanzia previsto per il prodotto.  
3No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate  
da un “No” nel Catalogo illustrato dei componenti.  
1Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie  
diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.  
2Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei  
diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.  
3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen,  
muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.  
„Nein“ gekennzeichnet.  
1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP  
que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano  
de obra de dicho servicio.  
2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes  
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su  
Illustrated parts catalog 17  
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sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al  
producto.  
3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario  
haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos  
componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.  
1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te  
vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.  
2Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn  
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.  
3No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de  
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze  
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
2Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa  
adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
3No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia  
do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”  
(Não), no catálogo de peças ilustrado.  
Illustrated parts catalog 18  
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System components  
Item  
Description  
Spare part number  
Customer self repair (on  
page 6)  
System components  
Power supply  
9
a) Hot-plug power supply, 460-W  
511777-001  
Mandatory1  
b) Hot-plug power supply, 750-W  
c) Hot-plug power supply, 1200-W  
511778-001  
498152-001  
Mandatory1  
Mandatory1  
Fan  
519559-001  
153009-001  
Mandatory1  
Mandatory1  
10  
11  
12  
Battery  
Processor  
a) 1.86-GHz Intel Xeon processor E5502, 490075-001  
Optional2  
80W**  
b) 2.00-GHz Intel Xeon processor E5503, 594889-001  
80W* **  
Optional2  
Illustrated parts catalog 19  
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Item  
Description  
Spare part number  
Customer self repair (on  
page 6)  
Optional2  
c) 2.00-GHz Intel Xeon processor E5504, 490074-001  
80W* **  
d) 2.13-GHz Intel Xeon processor E5506, 506013-001  
80W* **  
e) 2.26-GHz Intel Xeon processor E5520, 490073-001  
80W* **  
f) 2.40-GHz Intel Xeon processor E5530, 490072-001  
80W* **  
g) 2.53-GHz Intel Xeon processor E5540, 490071-001  
80W* **  
h) 1.60-GHz Intel Xeon processor E5603, 628700-001  
80W* **  
i) 2.13-GHz Intel Xeon processor E5606, 628699-001  
80W* **  
j) 2.26-GHz Intel Xeon processor E5607, 628698-001  
80W* **  
k) 2.40-GHz Intel Xeon processor E5620, 594887-001  
80W* **  
l) 2.53-GHz Intel Xeon processor E5630, 594886-001  
80W* **  
m) 2.66-GHz Intel Xeon processor E5640, 594885-001  
80W* **  
n) 2.40-GHz Intel Xeon processor E5645, 628696-001  
80W* **  
o) 2.53-GHz Intel Xeon processor E5649, 628695-001  
80W* **  
p) 2.26-GHz Intel Xeon processor L5520, 504021-001  
60W* **  
q) 2.13-GHz Intel Xeon processor L5630, 594891-001  
140W* **  
r) 3.20-GHz Intel Xeon processor W5580, 513597-001  
130W* **  
s) 2.67-GHz Intel Xeon processor X5550, 490070-001  
95W* **  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
t) 2.80-GHz Intel Xeon processor X5560, 490069-001  
95W* **  
u) 2.93-GHz Intel Xeon processor X5570, 506012-001  
95W* **  
v) 2.66-GHz Intel Xeon processor X5650, 594884-001  
95W* **  
w) 2.80-GHz Intel Xeon processor X5660, 594883-001  
95W* **  
x) 3.06-GHz Intel Xeon processor X5667, 614533-001  
95W* **  
y) 2.93-GHz Intel Xeon processor X5670, 594882-001  
95W* **  
z) 3.2-GHz Intel Xeon processor X5672, 638135-001  
95W* **  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
aa) 3.06-GHz Intel Xeon processor  
X5675, 95W* **  
638134-001  
bb) 3.46-GHz Intel Xeon processor  
594881-001  
Illustrated parts catalog 20  
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Item  
Description  
Spare part number  
Customer self repair (on  
page 6)  
X5677, 130W* **  
cc) 3.33-GHz Intel Xeon processor X5680, 594880-001  
95W* **  
Optional2  
Optional2  
Optional2  
dd) 3.60-GHz Intel Xeon processor  
X5687, 130W* **  
638137-001  
ee) 3.40-GHz Intel Xeon processor X5690, 638136-001  
130W* **  
Heatsink  
508996-001  
491838-001  
519562-001  
491837-001  
Optional2  
13  
14  
15  
16  
HP NC375i adapter  
I/O bezel  
Mandatory1  
Mandatory1  
Mandatory1  
Systems Insight Display  
Boards  
System board  
491835-001  
Optional2  
17  
Power supply backplane with cables  
8-bay SFF drive cage backplane  
6-bay LFF backplane*  
491836-001  
511785-001  
491840-001  
511786-001  
Optional2  
Optional2  
Optional2  
Optional2  
18  
19  
20  
21  
2-bay LFF drive cage backplane*  
Storage devices  
DVD-ROM drive  
Slimline optical drive*  
Miscellaneous  
447464-001  
481428-001  
Mandatory1  
Mandatory1  
22  
23  
Rack mounting kit*  
381679-001  
Mandatory1  
24  
25  
Memory  
DIMMs  
a) PC3-8500R (DDR-1067) 4-GB RDIMM 501535-001  
b) PC3-8500R (DDR-1067) 8-GB RDIMM 519201-001  
c) PC3-10600R (DDR-1333) 2-GB RDIMM 501533-001  
d) PC3-10600R (DDR-1333) 4-GB RDIMM 501534-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
e) PC3-10600R (DDR-1333) 16-GB  
RDIMM  
501538-001  
f) PC3-1600R (DDR-1333) 16-GB RDIMM 632204-001  
g) PC3-10600E (DDR-1333) 1-GB UDIMM 501539-001  
h) PC3-10600E (DDR-1333) 2-GB UDIMM 501540-001  
i) PC3-10600E (DDR-1333) 4-GB UDIMM 501541-001  
Cables  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Miscellaneous cable kit*  
a) SAS drive cable  
519565-001  
Mandatory1  
26  
b) 2-bay LFF LED cable  
c) I/O bezel cable assembly  
d) Power on button cable  
Illustrated parts catalog 21  
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Item  
Description  
Spare part number  
Customer self repair (on  
page 6)  
e) Systems Insight Display sideband cable —  
Mini-SAS cable*  
498426-001  
Mandatory1  
27  
28  
Options  
SFF hard drive*  
a) 146-GB, SAS, 10,000-rpm  
432320-001  
Mandatory1  
b) 300-GB, SAS, 10,000-rpm  
c) 450-GB, SAS, 10,000-rpm  
d) 60-GB, SATA, 5,400-rpm  
e) 120-GB, SATA, 5,400-rpm  
f) 160-GB, SATA, 5,400-rpm  
g) 250-GB, SATA, 5,400-rpm  
493083-001  
454274-001  
405419-001  
431908-001  
431909-001  
460427-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
LFF hard drive*  
29  
a) 146-GB, SAS, 15,000-rpm  
376595-001  
Mandatory1  
b) 160-GB, SATA, 7,200-rpm  
c) 250-GB, SATA, 7,200-rpm  
d) 300-GB, SAS, 15,000-rpm, dual-port  
e) 400-GB, SAS, 15,000-rpm  
f) 450-GB, SAS, 15,000-rpm, dual-port  
g) 500-GB, SATA, 7,200-rpm  
h) 750-GB, SAS, 15,000-rpm  
i) 1-TB, SAS, 15,000-rpm  
399968-001  
399969-001  
516248-001  
456896-001  
454274-001  
404654-001  
461288-001  
461289-001  
508010-001  
549320-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
j) 2-TB, SAS, 15,000-rpm  
k) 750-GB, 7,200-rpm, hot-plug, 3G,  
NCQ  
l) 1-TB, 7,200-rpm, hot-plug, 3G, NCQ  
545273-001  
Mandatory1  
Mandatory1  
m) 2-TB, 7,200-rpm, hot-plug, 3G, NCQ 508040-001  
Keyboard*  
Mouse*  
355630-001  
344704-001  
142258-001  
Mandatory1  
Mandatory1  
Mandatory1  
Optional2  
30  
31  
32  
33  
34  
AC power cord*  
HP NC524SFP Dual Port 10GbE Module 490712-001  
Smart Array P410i controller cache  
module (512 MB)*  
462975-001  
Optional2  
Smart Array P410i controller battery  
pack*  
Smart Array P410i controller battery cable 409124-001  
assembly, 29.21 cm (11.50 in)*  
Smart Array P410i controller battery cable 462976-001  
assembly, 60.96 cm (24.00 in)*  
TPM*  
488138-001  
Optional2  
Optional2  
Optional2  
35  
36  
37  
505836-001  
No3  
Mandatory1  
38  
39  
Battery cable, 60.96 cm ( 24.00 in)*  
488138-001  
Illustrated parts catalog 22  
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Item  
Description  
Spare part number  
Customer self repair (on  
page 6)  
FBWC capacitor pack*  
FBWC cache module, 512-MB*  
FBWC cache module, 1-GB*  
Retainer clip  
587324-001  
578882-001  
505908-001  
651079-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
40  
41  
42  
43  
* Not shown  
**Do not mix single-, dual-, or quad-core processors, or processors with different cache sizes, speeds, or power  
consumption.  
1Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be  
charged for the travel and labor costs of this service.  
2Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,  
however, you require that HP replace them for you, there may or may not be additional charges, depending on the type  
of warranty service designated for your product.  
3No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that  
an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.  
1Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces  
pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.  
3No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour  
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces  
pièces sont identifiées par la mention “Non” dans le Catalogue illustré.  
1Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese  
addizionali a seconda del tipo di garanzia previsto per il prodotto.  
3No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate  
da un “No” nel Catalogo illustrato dei componenti.  
1Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie  
diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.  
2Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei  
diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.  
3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen,  
muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.  
„Nein“ gekennzeichnet.  
1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP  
que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano  
de obra de dicho servicio.  
2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes  
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su  
sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al  
producto.  
Illustrated parts catalog 23  
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3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario  
haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos  
componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.  
1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te  
vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.  
2Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn  
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.  
3No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de  
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze  
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
2Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa  
adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
3No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia  
do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”  
(Não), no catálogo de peças ilustrado.  
Illustrated parts catalog 24  
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Removal and replacement procedures  
Required tools  
You need the following items for some procedures:  
T-10/T-15 Torx screwdriver (included with the server)  
Diagnostics Utility (included on the SmartStart CD-ROM)  
Safety considerations  
Before performing service procedures, review all the safety information.  
Preventing electrostatic discharge  
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system  
or handling parts. A discharge of static electricity from a finger or other conductor may damage system  
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.  
To prevent electrostatic damage:  
Avoid hand contact by transporting and storing products in static-safe containers.  
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.  
Place parts on a grounded surface before removing them from their containers.  
Avoid touching pins, leads, or circuitry.  
Always be properly grounded when touching a static-sensitive component or assembly.  
Symbols on equipment  
The following symbols may be placed on equipment to indicate the presence of potentially hazardous  
conditions.  
This symbol indicates the presence of hazardous energy circuits or electric shock  
hazards. Refer all servicing to qualified personnel.  
WARNING: To reduce the risk of injury from electric shock hazards, do not open this  
enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.  
This symbol indicates the presence of electric shock hazards. The area contains no user  
or field serviceable parts. Do not open for any reason.  
WARNING: To reduce the risk of injury from electric shock hazards, do not open this  
enclosure.  
Removal and replacement procedures 25  
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This symbol on an RJ-45 receptacle indicates a network interface connection.  
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do  
not plug telephone or telecommunications connectors into this receptacle.  
This symbol indicates the presence of a hot surface or hot component. If this surface is  
contacted, the potential for injury exists.  
WARNING: To reduce the risk of injury from a hot component, allow the surface to cool  
before touching.  
This symbol indicates that the component exceeds the recommended weight for one  
individual to handle safely.  
WARNING: To reduce the risk of personal injury or damage to the equipment, observe  
local occupational health and safety requirements and guidelines for manual material  
handling.  
25-47 kg  
55-103 lb  
These symbols, on power supplies or systems, indicate that the equipment is supplied  
by multiple sources of power.  
WARNING: To reduce the risk of injury from electric shock, remove all power cords to  
completely disconnect power from the system.  
Rack warnings  
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:  
The leveling jacks are extended to the floor.  
The full weight of the rack rests on the leveling jacks.  
The stabilizing feet are attached to the rack if it is a single-rack installation.  
The racks are coupled together in multiple-rack installations.  
Only one component is extended at a time. A rack may become unstable if more than one  
component is extended for any reason.  
WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:  
At least two people are needed to safely unload the rack from the pallet. An empty 42U rack  
can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might  
become unstable when being moved on its casters.  
Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle  
the rack from both sides.  
WARNING: To reduce the risk of personal injury or damage to the equipment, adequately  
stabilize the rack before extending a component outside the rack. Extend only one component at  
a time. A rack may become unstable if more than one component is extended.  
WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately  
secured at the top and bottom to the building structure.  
Preparation procedures  
To access some components and perform certain service procedures, you must perform one or more of the  
following procedures:  
Removal and replacement procedures 26  
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Extend the server from the rack (on page 28).  
If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet,  
you can use the locking feature of the rack rails to support the server and gain access to internal  
components.  
For more information about telco rack solutions, refer to the RackSolutions.com website  
Power down the server (on page 27).  
If you must remove a server from a rack or a non-hot-plug component from a server, power down the  
server.  
Remove the server from the rack (on page 27).  
If the rack environment, cabling configuration, or the server location in the rack creates awkward  
conditions, remove the server from the rack.  
Power down the server  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.  
1.  
2.  
Shut down the OS as directed by the OS documentation.  
Press the Power On/Standby button to place the server in standby mode. When the server enters  
standby power mode, the system power LED changes to amber.  
3.  
Disconnect the power cords.  
The system is now without power.  
Remove the server from the rack  
To remove the server from an HP, telco, or third-party rack:  
1.  
2.  
3.  
Power down the server (on page 27).  
Disconnect the cabling.  
Extend the server from the rack. Reverse the server installation steps in the documentation that ships with  
the rack-mounting option.  
CAUTION: Do not use the server release lever to lift or carry the server. Always support the  
weight of the server by handling the chassis directly. Improper use can damage the release lever  
and the server.  
Removal and replacement procedures 27  
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4.  
5.  
Press the server rail-release latches and remove the server from the rack.  
Place the server on a sturdy, level surface.  
Extend the server from the rack  
IMPORTANT: If the server is installed in a telco rack, remove the server from the rack to access  
internal components.  
1.  
Extend the server on the rack rails until the server rail-release latches engage.  
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is  
adequately stabilized before extending a component from the rack.  
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release  
latches and sliding the server into the rack. The sliding rails could pinch your fingers.  
Removal and replacement procedures 28  
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2.  
After performing the installation or maintenance procedure, slide the server into the rack by pressing the  
server rail-release latches.  
Access the product rear panel  
Cable management arm with left-hand swing  
To access the server rear panel, open the cable management arm.  
Cable management arm with right-hand swing  
NOTE: To access some components, you may need to remove the cable management arm.  
To access the product rear panel components, open the cable management arm:  
Power down the server (on page 27).  
1.  
Removal and replacement procedures 29  
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2.  
3.  
4.  
Swing open the cable management arm.  
Remove the cables from the cable trough.  
Remove the cable management arm.  
Tower bezel  
This server has a removable bezel that must be unlocked and opened before accessing the hard drives or  
removing the access panel. The bezel should be kept closed during normal server operations.  
To remove the component:  
1.  
Use the key provided with the server to unlock the bezel with a counterclockwise turn.  
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2.  
Remove the tower bezel.  
To replace the component, reverse the removal procedure.  
Access panel  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
To remove the component:  
1.  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
2.  
Open the locking latch, slide the access panel to the rear of the chassis, and remove the access panel.  
If the locking latch is locked, use a T-15 Torx screwdriver to unlock the latch.  
To replace the component, reverse the removal procedure.  
Fan 5  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
IMPORTANT: When installing or replacing server components, one or more fans might need to  
be removed. To prevent an orderly or immediate server shutdown, HP highly recommends  
powering down the server during these procedures. To determine if powering down is required,  
see the specific procedure.  
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IMPORTANT: When replacing one failed fan only in a redundant configuration, powering down  
the server is not required.  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
Remove the access panel ("Access panel" on page 31).  
Remove the fan from the air baffle.  
To replace the component, reverse the removal procedure.  
Cache module  
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMM  
pinout. Do not use the controller with cache modules designed for other controller models,  
because the controller can malfunction and you can lose data. Also, do not transfer this cache  
module to an unsupported controller model, because you can lose data.  
To remove the component:  
1.  
Power down the server (on page 27).  
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be  
powered down and the last to be powered back up. Taking this precaution ensures that the system  
does not erroneously mark the drives as failed when the server is powered up.  
2.  
3.  
Do one of the following:  
o
o
Unlock and remove the bezel ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
Remove the access panel ("Access panel" on page 31).  
Removal and replacement procedures 32  
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4.  
Remove the cache module.  
To replace the component, reverse the removal procedure.  
BBWC battery pack or FBWC capacitor pack  
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove  
the battery pack while an array capacity expansion, RAID level migration, or stripe size migration  
is in progress.  
CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED  
before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do  
not remove the cable from the cache module. The cache module is backing up data, and data is  
lost if the cable is detached.  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
Remove the access panel ("Access panel" on page 31).  
Disconnect the cable from the cache module only if the battery pack is not being used to recover data  
from the server or transfer data to another server.  
Removal and replacement procedures 33  
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5.  
Remove the battery pack.  
To replace the component, reverse the removal procedure.  
Air baffle  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
Removal and replacement procedures 34  
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6.  
Remove the air baffle.  
To replace the component, reverse the removal procedure.  
Fan cage  
IMPORTANT: When installing or replacing server components, one or more fans might need to  
be removed. To prevent an orderly or immediate server shutdown, HP highly recommends  
powering down the server during these procedures. To determine if powering down is required,  
see the specific procedure.  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
Remove the air baffle ("Air baffle" on page 34).  
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7.  
Remove the fan cage.  
To replace the component, reverse the removal procedure.  
Fan blank  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
Remove the air baffle ("Air baffle" on page 34).  
Removal and replacement procedures 36  
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7.  
Remove the fan blank.  
To replace the component, reverse the removal procedure.  
Fans 1-4  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
IMPORTANT: When installing or replacing server components, one or more fans might need to  
be removed. To prevent an orderly or immediate server shutdown, HP highly recommends  
powering down the server during these procedures. To determine if powering down is required,  
see the specific procedure.  
IMPORTANT: When replacing one failed fan only in a redundant configuration, powering down  
the server is not required.  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
Remove the access panel ("Access panel" on page 31).  
Locate the fan to be removed ("Fans" on page 95).  
Removal and replacement procedures 37  
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5.  
Remove the fan.  
To replace the component, reverse the removal procedure.  
Tower side panels  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
With a T-15 Torx screwdriver, remove the following seven screws:  
Inside (4)  
o
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o
Rear (1)  
o
Front (2)  
4.  
Remove the chassis from the tower side panels:  
Removal and replacement procedures 39  
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a. Disengage the chassis from the tower side panels by pushing the bottom side panel back and by  
pulling the chassis forward.  
b. Lift the chassis up and out of the tower side panels.  
To replace the component, reverse the removal procedure.  
Feet  
NOTE: This procedure applies to tower servers only.  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Place the server on its side.  
Removal and replacement procedures 40  
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3.  
Remove the feet.  
To replace the component, slide it back into the locking slot. Be sure that the foot clicks securely into the  
chassis. Repeat with the remaining feet, as necessary.  
SAS hard drive blank  
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
Remove the component as indicated.  
To replace the blank, slide the blank into the bay until it locks into place.  
SAS/SATA hard drive  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
1.  
Determine the status of the drive from the hot-plug SAS hard drive LED combinations ("SAS and SATA  
Removal and replacement procedures 41  
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2.  
3.  
Back up all server data on the hard drive.  
Remove the hard drive.  
To replace the component, reverse the removal procedure.  
Media bay blank  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
1.  
2.  
3.  
Power down the server (on page 27).  
Remove the tower bezel ("Tower bezel" on page 30).  
Remove the media bay blank.  
To replace the component, reverse the removal procedure.  
DVD-ROM drive  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
Removal and replacement procedures 42  
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To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
7.  
8.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the fan cage ("Fan cage" on page 35).  
Disconnect and remove the DVD-ROM drive data/power cable. For more information, see "DVD-ROM  
drive cabling (on page 107)."  
9.  
Remove the DVD-ROM drive.  
To replace the component, reverse the removal procedure.  
Slimline optical drive  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
Removal and replacement procedures 43  
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6.  
7.  
8.  
9.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the fan cage ("Fan cage" on page 35).  
Disconnect the data and power cable from the rear of the optical drive.  
Remove the optical drive.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To replace the component, reverse the removal procedure.  
Hard drive cage blank  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
Removal and replacement procedures 44  
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Remove the component as indicated.  
To replace the component, reverse the removal procedure.  
Hard drive cages and backplanes  
The server supports the following hard drive cages and backplanes:  
Two-bay LFF drive cage (on page 45)  
Six-bay LFF backplane (on page 47)  
Eight-bay SFF drive cage backplane (bay 1) (on page 48)  
Eight-bay SFF drive cage backplane (bay 2) (on page 49)  
Eight-bay SFF drive cage backplane (bay 3) (on page 51)  
For jumper settings, see "Drive cage jumper location and configuration settings (on page 98)."  
Two-bay LFF drive cage  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
7.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the fan cage ("Fan cage" on page 35).  
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8.  
9.  
Disconnect the data and power cables from the two-bay LFF drive cage.  
Remove all LFF drives installed in the drive cage ("SAS/SATA hard drive" on page 41).  
10. Remove the locking brackets.  
11. Remove the two-bay LFF drive cage.  
Removal and replacement procedures 46  
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12. Using a T-15 Torx screwdriver, remove the backplane from the drive cage.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To replace the component, reverse the removal procedure.  
Six-bay LFF backplane  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
7.  
8.  
9.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the fan cage ("Fan cage" on page 35).  
Disconnect the power and data cables from the six-bay LFF backplane.  
Remove any LFF drives installed in the drive cage bay ("SAS/SATA hard drive" on page 41).  
Removal and replacement procedures 47  
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10. Using a T-15 Torx screwdriver, remove the six-bay LFF backplane.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To replace the component, reverse the removal procedure.  
Eight-bay SFF drive cage backplane (bay 1)  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
7.  
8.  
Remove the air baffle ("Air baffle" on page 34).  
Remove any SFF drives installed in bay 1 ("SAS/SATA hard drive" on page 41).  
Disconnect the power and data cables from the eight-bay SFF drive cage in drive cage bay 1.  
Removal and replacement procedures 48  
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9.  
Using a T-10 Torx screwdriver, remove the eight-bay SFF drive cage from drive cage bay 1.  
10. Using a T-15 Torx screwdriver, remove the backplane from the drive cage.  
The outer sleeve is not shown for clarity.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To replace the component, reverse the removal procedure.  
Eight-bay SFF drive cage backplane (bay 2)  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Removal and replacement procedures 49  
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o
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
7.  
8.  
9.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the fan cage ("Fan cage" on page 35).  
Disconnect the data and power cables from the eight-bay SFF drive cage in bay 2.  
Remove any SFF drives installed in bay 2 ("SAS/SATA hard drive" on page 41).  
10. Using a T-15 Torx screwdriver, remove the eight-bay SFF drive cage from bay 2.  
11. Using a T-15 Torx screwdriver, remove the backplane from the drive cage.  
The outer sleeve is not shown for clarity.  
Removal and replacement procedures 50  
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CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To replace the component, reverse the removal procedure.  
Eight-bay SFF drive cage backplane (bay 3)  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
7.  
8.  
9.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the fan cage ("Fan cage" on page 35).  
Disconnect the data and power cables from the eight-bay SFF drive cage in bay 3.  
Remove any SFF drives installed in bay 3 ("SAS/SATA hard drive" on page 41).  
10. Remove the locking brackets.  
Removal and replacement procedures 51  
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11. Remove the eight-bay SFF drive cage from bay 3.  
12. Using a T-15 Torx screwdriver, remove the backplane from the drive cage.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To replace the component, reverse the removal procedure.  
Power supply  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
Determine how many hot-plug power supplies are installed:  
1.  
Removal and replacement procedures 52  
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o
o
If only one hot-plug power supply is installed, power down and remove the power cord from the  
If more than one hot-plug power supply is installed, continue with the next step.  
2.  
3.  
4.  
5.  
Access the product rear panel (on page 29).  
Disconnect the power cord from the AC power source.  
Disconnect the power cord from the power supply.  
Remove the power supply.  
To replace the component, reverse the removal procedure.  
Heatsink  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 31).  
Place the tower server on its side.  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
7.  
8.  
Remove the air baffle ("Air baffle" on page 34).  
Open the heatsink retaining latches.  
Removal and replacement procedures 53  
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9.  
Remove the heatsink.  
To replace the heatsink:  
1.  
Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol to  
evaporate before continuing.  
2.  
Apply new grease to the top of the processor using a five-dot pattern to ensure even distribution.  
CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the  
heatsink is removed from the processor after it has been installed.  
Removal and replacement procedures 54  
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3.  
Install the heatsink. and close the heatsink retaining latches.  
4.  
5.  
6.  
7.  
8.  
Install the air baffle.  
If removed, install the BBWC battery pack or the FBWC capacitor pack.  
Install fan 5.  
Install the access panel.  
Do one of the following:  
o
o
Install and lock the bezel.  
Slide the server back into the rack.  
9.  
Power up the server.  
Processor  
The server supports single- and dual-processor operation. With two processors installed, the server supports  
boot functions through the processor installed in processor socket 1. However, if processor 1 fails, the system  
attempts to boot from processor 2 and provides a processor failure message.  
The server uses embedded PPMs to provide power to each processor.  
CAUTION: To avoid damage to the processor and system board, only authorized personnel  
should attempt to replace or install the processor in this server.  
CAUTION: To avoid damage to the processor:  
Handle the processor only by the edges.  
Do not touch the bottom of the processor, especially the contact area.  
IMPORTANT: Processor socket 1 must always be populated. If processor socket 1 is empty, the  
server halts during POST.  
To remove the component:  
1.  
Update the system ROM.  
Removal and replacement procedures 55  
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Locate and download the latest ROM version from the HP website (http://www.hp.com/support).  
Follow the instructions on the website to update the system ROM.  
2.  
3.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
4.  
5.  
6.  
7.  
Remove the access panel ("Access panel" on page 31).  
Place the tower server on its side.  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
8.  
9.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the heatsink ("Heatsink" on page 53).  
10. Open the processor locking lever and the processor socket retaining bracket.  
11. Using the processor tool, remove the processor from the system board:  
a. Line up the processor tool, ensuring the locking lever graphic on the tool is oriented correctly.  
b. Press in on the plastic tabs, and then place the tool on the processor.  
Removal and replacement procedures 56  
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c. Release the tabs, and then carefully lift the processor and tool straight up.  
12. Carefully rotate the tool, and then push in and release the tabs to secure the processor in the tool.  
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,  
especially the contact area.  
Removal and replacement procedures 57  
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To replace a processor:  
1.  
Carefully insert the processor into the processor installation tool. Handle the processor by the edges  
only, and do not touch the bottom of the processor, especially the contact area.  
Removal and replacement procedures 58  
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2.  
Be sure the tool is oriented correctly. Align the processor installation tool with the socket, and then install  
the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.  
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To  
avoid damage to the system board:  
Never install or remove a processor without using the processor installation tool.  
Do not touch the processor socket contacts.  
Do not tilt or slide the processor when lowering the processor into the socket.  
Removal and replacement procedures 59  
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3.  
Press and hold the tabs on the processor installation tool to separate it from the processor, and then  
remove the tool.  
4.  
Close the processor socket retaining bracket and the processor locking lever.  
CAUTION: Be sure to close the processor socket retaining bracket before closing the processor  
locking lever. The lever should close without resistance. Forcing the lever closed can damage the  
processor and socket, requiring system board replacement.  
Removal and replacement procedures 60  
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5.  
Install the heatsink, and then close the heatsink retaining latches.  
6.  
7.  
8.  
9.  
Install the air baffle.  
If removed, install the BBWC battery pack or the FBWC capacitor pack.  
Install fan 5.  
Install the access panel.  
10. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Slide the server back into the rack.  
11. Power up the server.  
DIMMs  
IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix  
these two types causes the server to halt during BIOS initialization.  
To identify the DIMMs installed in the server, see "DIMM identification (on page 90)."  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
7.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the fan cage ("Fan cage" on page 35).  
Removal and replacement procedures 61  
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8.  
Remove the DIMM.  
To replace the component, reverse the removal procedure.  
For DIMM configuration information, see the server user guide.  
PCIe expansion board  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
Remove the access panel ("Access panel" on page 31).  
Disconnect any external and internal cables from the PCIe expansion board.  
Removal and replacement procedures 62  
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5.  
Open the expansion board retainer.  
6.  
Remove the expansion board.  
To replace the component, reverse the removal procedure.  
HP NC375i adapter  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
Removal and replacement procedures 63  
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5.  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
7.  
8.  
Remove the air baffle ("Air baffle" on page 34).  
Disconnect the network cable.  
If the HP NC524SFP Dual Port 10GbE Module is installed, remove the retaining screw.  
9.  
Open the expansion board slot retainer.  
10. Remove the HP NC375i adapter from expansion slot 10.  
Removal and replacement procedures 64  
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11. Remove the mini-DIMM, if installed.  
12. Remove the HP NC524SFP Dual Port 10GbE Module ("HP NC524SFP Dual Port 10GbE Module" on  
page 65), if installed.  
To replace the component, reverse the removal procedure.  
HP NC524SFP Dual Port 10GbE Module  
To remove the component:  
1.  
2.  
3.  
Power down the server (on page 27).  
Disconnect the network cables.  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
7.  
8.  
Remove the air baffle ("Air baffle" on page 34).  
Using a T-15 Torx screwdriver, remove the retaining screw.  
Removal and replacement procedures 65  
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Save the retaining screw.  
9.  
Open the expansion board slot retainer.  
10. Remove the HP NC375i adapter ("HP NC375i adapter" on page 63) from expansion slot 10.  
11. Remove the HP NC524SFP module from the HP NC375i adapter.  
To replace the component, reverse the removal procedure.  
Systems Insight Display  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
Removal and replacement procedures 66  
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3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
7.  
8.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the fan cage ("Fan cage" on page 35).  
Extend the Systems Insight Display from the chassis.  
The cages, blanks, and drives are not shown for clarity.  
9.  
Disconnect the System Insight Display cables from the Systems Insight Display.  
10. Remove the Systems Insight Display.  
To replace the component, reverse the removal procedure.  
Systems Insight Display cables  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
7.  
8.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the fan cage ("Fan cage" on page 35).  
Remove the Systems Insight Display ("Systems Insight Display" on page 66).  
Removal and replacement procedures 67  
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9.  
Remove the Systems Insight Display cables from the system board.  
To replace the component, reverse the removal procedure.  
I/O bezel  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
7.  
8.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the fan cage ("Fan cage" on page 35).  
Extend the I/O bezel from the chassis.  
The cages, blanks, and drives are not shown for clarity.  
9.  
Disconnect the cables from the I/O bezel.  
10. Remove the I/O bezel.  
To replace the component, reverse the removal procedure.  
I/O bezel cables  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
Removal and replacement procedures 68  
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o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
7.  
8.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the I/O bezel ("I/O bezel" on page 68).  
Disconnect the I/O bezel cables from the system board.  
To replace the component, reverse the removal procedure.  
Battery  
If the server no longer automatically displays the correct date and time, you may need to replace the battery  
that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.  
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium  
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not  
properly handled. To reduce the risk of personal injury:  
Do not attempt to recharge the battery.  
Do not expose the battery to temperatures higher than 60°C (140°F).  
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.  
Replace only with the spare designated for this product.  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
6.  
Remove the air baffle ("Air baffle" on page 34).  
Removal and replacement procedures 69  
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7.  
Remove the battery.  
IMPORTANT: Replacing the system board battery resets the system ROM to its default  
configuration. After replacing the battery, reconfigure the system through RBSU.  
To replace the component, reverse the removal procedure.  
For more information about battery replacement or proper disposal, contact an authorized reseller or an  
authorized service provider.  
HP Trusted Platform Module  
The TPM is not a customer-removable part.  
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures  
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM,  
administrators should consider the system compromised and take appropriate measures to ensure  
the integrity of the system data.  
If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP  
authorized service provider for a replacement system board and TPM board.  
System board  
IMPORTANT: If replacing the system board or clearing NVRAM, you must re-enter the server  
serial number through RBSU.  
To remove the component:  
1.  
2.  
Power down the server (on page 27).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Remove the server from the rack (on page 27).  
Removal and replacement procedures 70  
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3.  
4.  
5.  
6.  
7.  
Remove the access panel ("Access panel" on page 31).  
Remove all expansion boards ("PCIe expansion board" on page 62).  
Remove the HP NC375i adapter ("HP NC375i adapter" on page 63).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
8.  
9.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the fan cage ("Fan cage" on page 35).  
10. Remove all DIMMs ("DIMMs" on page 61).  
11. Disconnect all cables connected to the system board.  
12. Remove the heatsink ("Heatsink" on page 53).  
CAUTION: To avoid damage to the processor:  
Handle the processor only by the edges.  
Do not touch the bottom of the processor, especially the contact area.  
CAUTION: To avoid damage to the system board:  
Do not touch the processor socket contacts.  
Always install the processor socket cover after removing the processor from the socket.  
Do not tilt or slide the processor when lowering the processor into the socket.  
CAUTION: Removal of the processor or heatsink renders the thermal layer between the  
processor and heatsink useless. Clean the component with the provided alcohol swab, then add  
thermal grease.  
13. Open the processor locking lever and the processor socket retaining bracket.  
14. Using the processor tool, remove the processor from the system board:  
a. Line up the processor tool, ensuring the locking lever graphic on the tool is oriented correctly.  
b. Press in on the plastic tabs, and then place the tool on the processor.  
Removal and replacement procedures 71  
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c. Release the tabs, and then carefully lift the processor and tool straight up.  
15. Carefully rotate the tool, and then push in and release the tabs to secure the processor in the tool.  
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,  
especially the contact area.  
16. Loosen the two system board thumbscrews.  
Removal and replacement procedures 72  
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17. Using the system board tray handles, slide the tray forward and remove the failed system board.  
To replace the component:  
1.  
Install the spare system board in the server before installing the processor.  
CAUTION: Failure to completely open the processor locking lever prevents the processor from  
seating during installation, leading to hardware damage.  
Removal and replacement procedures 73  
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2.  
Open the processor locking lever and the processor socket retaining bracket. Do not remove the  
processor socket cover.  
IMPORTANT: Be sure the processor remains inside the processor installation tool.  
3.  
If the processor has separated from the installation tool, carefully re-insert the processor in the tool.  
Handle the processor by the edges only, and do not touch the bottom of the processor, especially the  
contact area.  
Removal and replacement procedures 74  
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4.  
Align the processor installation tool with the socket, and then install the processor. THE PINS ON THE  
SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.  
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To  
avoid damage to the system board:  
Never install or remove a processor without using the processor installation tool.  
Do not touch the processor socket contacts.  
Do not tilt or slide the processor when lowering the processor into the socket.  
Removal and replacement procedures 75  
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5.  
Press the tabs on the processor installation tool to separate it from the processor, and then remove the  
tool.  
6.  
Close the processor socket retaining bracket and the processor locking lever. The processor socket  
cover is automatically ejected. Remove the cover.  
CAUTION: Be sure to close the processor socket retaining bracket before closing the processor  
locking lever. The lever should close without resistance. Forcing the lever closed can damage the  
processor and socket, requiring system board replacement.  
7.  
8.  
Install the processor socket cover onto the processor socket of the failed system board.  
Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.  
Allow the alcohol to evaporate before continuing.  
Removal and replacement procedures 76  
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9.  
Apply all the grease to the top of the processor in the following pattern to ensure even distribution.  
10. Install the heatsink.  
11. Close the heatsink locking levers.  
IMPORTANT: Install all components with the same configuration that was used on the failed  
system board.  
12. Install all components removed from the failed system board.  
13. Connect the cables.  
14. Install the air baffle.  
15. If removed, install the BBWC battery pack or the FBWC capacitor pack.  
16. Install fan 5.  
17. Install the access panel.  
18. Do one of the following:  
o
o
Close or install the tower bezel, as needed.  
Install the server in the rack.  
Removal and replacement procedures 77  
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19. Power up the server.  
After you replace the system board, you must re-enter the server serial number and the product ID.  
1.  
2.  
3.  
4.  
During the server startup sequence, press the F9 key to access RBSU.  
Select the Advanced Options menu.  
Select Service Options.  
Select Serial Number. The following warnings appear:  
WARNING! WARNING! WARNING! The serial number is loaded into the system during  
the manufacturing process and should NOT be modified. This option should only  
be used by qualified service personnel. This value should always match the  
serial number sticker located on the chassis.  
Warning: The serial number should ONLY be modified by qualified personnel.  
This value should always match the serial number located on the chassis.  
5.  
6.  
7.  
Press the Enter key to clear the warning.  
Enter the serial number and press the Enter key.  
Select Product ID. The following warning appears:  
Warning: The Product ID should ONLY be modified by qualified personnel. This  
value should always match the Product ID on the chassis.  
8.  
9.  
Enter the product ID and press the Enter key.  
Press the Esc key to close the menu.  
10. Press the Esc key to exit RBSU.  
11. Press the F10 key to confirm exiting RBSU. The server automatically reboots.  
Power supply backplane  
To remove the component:  
1.  
2.  
3.  
Power down the server (on page 27).  
Remove the power supplies ("Power supply" on page 52).  
Do one of the following:  
o
o
Open or remove the tower bezel, as needed ("Tower bezel" on page 30).  
Extend the server from the rack (on page 28).  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 31).  
Remove fan 5 ("Fan 5" on page 31).  
If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or  
7.  
8.  
9.  
Remove the air baffle ("Air baffle" on page 34).  
Remove the fan cage ("Fan cage" on page 35).  
Disconnect all power supply backplane cables from the drive cages and system board.  
10. Remove the power supply backplane.  
Removal and replacement procedures 78  
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The cables are not shown for clarity.  
To replace the component, reverse the removal procedure.  
Removal and replacement procedures 79  
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Diagnostic tools  
Troubleshooting resources  
The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and  
comprehensive courses of action for fault isolation and identification, error message interpretation, issue  
resolution, and software maintenance on ProLiant servers and server blades. This guide includes  
problem-specific flowcharts to help you navigate complex troubleshooting processes. To view the guide,  
select a language:  
HP Insight Diagnostics  
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions,  
that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server  
installations, troubleshoot problems, and perform repair validation.  
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS  
is not running. To run this utility, launch the SmartStart CD.  
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and  
other related data needed for effective server management. Available in Microsoft® Windows® and Linux  
versions, the utility helps to ensure proper system operation.  
For more information or to download the utility, refer to the HP website (http://www.hp.com/servers/diags).  
HP Insight Diagnostics survey functionality  
HP Insight Diagnostics (on page 80) provides survey functionality that gathers critical hardware and software  
information on ProLiant servers.  
This functionality supports operating systems that may not be supported by the server. For operating systems  
supported by the server, see the HP website (http://www.hp.com/go/supportos).  
If a significant change occurs between data-gathering intervals, the survey function marks the previous  
information and overwrites the survey data files to reflect the latest changes in the configuration.  
Diagnostic tools 80  
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Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can be  
installed through the HP PSP.  
NOTE: The current version of SmartStart provides the memory spare part numbers for the server.  
To download the latest version, see the HP website (http://www.hp.com/support).  
Integrated Management Log  
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event  
with 1-minute granularity.  
You can view recorded events in the IML in several ways, including the following:  
From within HP SIM  
From within Survey Utility  
From within operating system-specific IML viewers  
o
o
o
For NetWare: IML Viewer (does not apply to HP ProLiant DL980 Servers)  
For Windows®: IML Viewer  
For Linux: IML Viewer Application  
From within the iLO 2 user interface  
From within HP Insight Diagnostics (on page 80)  
For more information, see the Management CD or DVD in the HP Insight Foundation suite for ProLiant.  
HP Insight Remote Support software  
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or  
upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or  
HP contractual support agreement. HP Insight Remote Support supplements your monitoring 24 x 7 to ensure  
maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of  
hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s  
service level. Notifications may be sent to your authorized HP Channel Partner for on-site service, if  
configured and available in your country. The software is available in two variants:  
HP Insight Remote Support Standard: This software supports server and storage devices and is  
optimized for environments with 1–50 servers. Ideal for customers who can benefit from proactive  
notification but do not need proactive service delivery and integration with a management platform.  
HP Insight Remote Support Advanced: This software provides comprehensive remote monitoring and  
proactive service support for nearly all HP servers, storage, network, and SAN environments, plus  
selected non-HP servers that have a support obligation with HP. It is integrated with HP Systems Insight  
Manager. A dedicated server is recommended to host both HP Systems Insight Manager and HP Insight  
Remote Support Advanced.  
Details for both versions are available on the HP website (http://www.hp.com/go/insightremotesupport).  
To download the software, go to Software Depot (http://www.software.hp.com).  
Select Insight Remote Support from the menu on the right.  
Diagnostic tools 81  
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USB support  
HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by  
the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB  
devices through legacy USB support, which is enabled by default in the system ROM.  
Legacy USB support provides USB functionality in environments where USB support is not available normally.  
Specifically, HP provides legacy USB functionality for the following:  
POST  
RBSU  
Diagnostics  
DOS  
Operating environments which do not provide native USB support  
Diagnostic tools 82  
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Component identification  
Front panel components  
Item  
Description  
USB connectors (2)  
1
2
3
4
5
6
7
8
Drive cage blank  
SAS/SATA drives (8)  
Front video connector (rack model only)  
Systems Insight Display  
Removable media bay  
DVD-ROM drive  
Optical drive blank  
Component identification 83  
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Front panel LEDs and buttons  
Item  
Description  
Status  
Power On/Standby button  
and system power LED  
Green = Normal (system on)  
Amber = System in standby, but power still applied  
Off = Power cord not attached or power supply failure  
1
Health LED  
UID LED  
Green = Normal (system on)  
Amber = System health is degraded  
Red = System health is critical.  
Off = Normal (system off)  
2
3
Blue = Activated  
Flashing blue = System is being managed remotely  
Off = Deactivated  
Component identification 84  
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Systems Insight Display LEDs  
The HP Systems Insight Display LEDs represent the system board layout.  
Item  
Description  
Status  
Power cap  
To determine Power cap status, see  
"Systems Insight Display LED combinations  
(on page 85)."  
1
AMP Status  
DIMM LEDs  
All other LEDs  
Green = AMP mode enabled  
Amber = Failover  
Flashing amber = Invalid configuration  
Off = AMP mode disabled  
2
3
All LEDs flashing = DIMM unseated  
Amber = Failure  
Off = Normal  
IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.  
Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing  
each DIMM in a bank with a known working DIMM.  
Systems Insight Display LED combinations  
When the health LED on the front panel illuminates either amber or red, the server is experiencing a health  
event. Combinations of illuminated Systems Insight Display LEDs, the system power LED, and the health LED  
indicate system status.  
Component identification 85  
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Systems Insight Display Health LED  
LED and color  
System power  
LED  
Status  
Red  
Amber  
One or more of the following conditions may  
exist:  
Processor (amber)  
Processor in socket X has failed.  
Processor X is not installed in the socket.  
Processor X is unsupported.  
ROM detects a failed processor during  
POST  
Amber  
Green  
Processor in socket X is in a pre-failure  
condition.  
Processor (amber)  
Red  
Green  
Green  
Green  
One or more DIMMs have failed.  
DIMM (amber)  
Amber  
Amber  
DIMM in slot X is in a pre-failure condition.  
DIMM (amber)  
The Health Driver has detected a cautionary  
temperature level.  
Overtemperature (amber)  
Red  
Amber  
The server has detected a hardware critical  
temperature level.  
Overtemperature (amber)  
Amber  
Red  
Green  
Green  
One fan has failed or has been removed.  
Fan (amber)  
Fan (amber)  
Two or more fans have failed or been  
removed.  
Red  
Amber  
Power supply (amber)  
Only one power supply is installed and  
that power supply is in standby.  
Power supply fault  
System board fault  
Amber  
Green  
Power supply (amber)  
Redundant power supply is installed and  
only one power supply is functional.  
AC power cord is not plugged into  
redundant power supply.  
Redundant power supply fault  
Power supply mismatch at POST or  
power supply mismatch through hot-plug  
addition.  
Amber  
Standby  
Power cap (off)  
Flashing green  
Amber  
Waiting for power  
Power cap has been exceeded  
Power cap (green)  
Power cap (flashing  
amber)  
Green  
Power is available  
Power cap (green)  
IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.  
Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing  
each DIMM in a bank with a known working DIMM.  
Component identification 86  
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Rear panel components  
Item  
Description  
Mouse connector  
Keyboard connector  
Serial connector  
iLO 2 connector  
USB connectors (2)  
1
2
3
4
5
NIC connectors (4)  
6
7
8
PCI expansion slots  
Reserved for PCI-X option kit  
Video connector  
9
Power supply bay 2  
10  
11  
Power supply bay 1 (populated)  
Component identification 87  
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Rear panel LEDs  
Item  
Description  
Status  
UID LED  
Blue = Activated  
Flashing blue = System is being managed remotely.  
Off = Deactivated  
1
iLO 2 activity LED  
iLO 2 link LED  
Green or flashing green = Network activity  
Off = No network activity  
2
3
4
5
6
Green = Linked to network  
Off = No network connection  
NIC link LED  
Green = Linked to network  
Off = No network connection  
NIC activity LED  
Power supply LED  
Green or flashing green = Network activity  
Off = No network activity  
Green = System has AC power and is powered up.  
Off = System has no AC power, the system is off, or the power supply  
has failed.  
Component identification 88  
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System board components  
Item  
Description  
SD card slot  
1
Power backplane connector  
Processor 1 DIMM slots  
Power supply connector  
SAS connector B  
2
3
4
5
SAS connector A  
6
Front panel connector  
Systems Insight Display connector  
Front video connector  
Front USB connector  
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
Smart Array P410i memory module  
Reserved  
System battery  
TPM connector  
SATA connectors (6)  
Slot 1 PCIe x8 (4, 2, 1)  
Slot 2 PCIe2 x8 (4, 2, 1)  
Slot 3 PCIe2 x16 (16, 8, 4, 2, 1)  
System maintenance switch  
Slot 4 PCIe2 x8 (4, 2, 1)  
Slot 5 PCIe2 x8 (4, 2, 1)  
Slot 6 PCIe2 x16 (8, 4, 2, 1)  
Slot 7 PCIe2 x8 (4, 2, 1)  
Slot 8 PCIe2 x16 (16, 8, 4, 2, 1)  
Slot 9 PCIe2 x8 (4, 2, 1)  
24  
25  
Component identification 89  
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Item  
Description  
Slot 10 PCIe2 x8 (8, 4, 2, 1)  
26  
Internal USB connector  
27  
Processor socket 2  
28  
29  
30  
31  
Processor 2 DIMM slots  
Power supply connector  
Processor socket 1 (populated)  
DIMM slots  
DIMM slots are numbered sequentially (1 through 9) for each processor. The supported AMP modes use the  
letter assignments for population guidelines.  
DIMM identification  
IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix  
these two types causes the server to halt during BIOS initialization.  
Component identification 90  
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The memory subsystem may be populated with either RDIMMs or UDIMMs, but mixing the two types is not  
supported. To determine DIMM characteristics, use the label attached to the DIMM and the following  
illustration and table.  
Item Description  
Definition  
Size  
1
2
Rank  
1R = Single-rank  
2R = Dual-rank  
4R = Quad-rank  
Data width  
x4 = 4-bit  
x8 = 8-bit  
3
4
5
Memory speed  
DIMM type  
10600 = 1333-MHz  
8500 = 1066-MHz  
R = RDIMM (registered)  
E = UDIMM (unbuffered with ECC)  
For the latest supported memory information, see the QuickSpecs on the HP website (http://www.hp.com).  
System maintenance switch  
The system maintenance switch (SW1) is a ten-position switch that is used for system configuration.  
Position  
Description  
Function  
iLO security  
Off = iLO security is enabled.  
On = iLO security is disabled.  
S1  
Configuration  
lock  
Off = System configuration can be  
changed.  
On = System configuration is  
locked.  
S2  
Rack/Tower ID  
Reserved  
Off = Tower  
On = Rack  
S3  
S4  
Reserved  
Component identification 91  
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Position  
Description  
Function  
Password  
protection  
override  
Off = No function  
On = Clears power-on password  
and administrator password  
S5  
Invalidate  
configuration  
Off = Normal  
On = ROM treats the system  
configuration as invalid.  
S6  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
S7  
S8  
S9  
S10  
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all  
system configuration settings from both CMOS and NVRAM.  
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to  
properly configure the server or data loss could occur.  
NMI functionality  
An NMI crash dump enables administrators to create crash dump files when a system is hung and not  
responding to traditional debug mechanisms.  
Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating  
systems, device drivers, and applications. Many crashes freeze a system, and the only available action for  
administrators is to cycle the system power. Resetting the system erases any information that could support  
problem analysis, but the NMI feature preserves that information by performing a memory dump before a  
hard reset.  
To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can use the iLO  
Virtual NMI feature.  
For more information, see the white paper on the HP website  
SAS and SATA device numbers  
With optional hard drive cages installed, the server supports up to 24 SFF hard drives or up to 14 LFF hard  
drives. The server does not support mixing SFF and LFF hard drives.  
HP recommends populating hard drive bays starting with the lowest SAS or SATA device number.  
Component identification 92  
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SFF hard drives  
LFF hard drives  
Component identification 93  
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SAS and SATA hard drive LEDs  
Item  
Description  
Status  
Fault/UID LED  
Amber = Drive failure  
1
Flashing amber = Fault-process activity  
Blue = Unit identification is active  
Off = No fault-process activity  
Online/activity LED  
Green = Drive activity  
2
Flashing green = High activity on the drive or  
drive is being configured as part of an array  
Off = No drive activity  
SAS and SATA hard drive LED combinations  
Online/activity Fault/UID LED  
Interpretation  
LED (green)  
(amber/blue)  
Alternating amber and The drive has failed, or a predictive failure alert has been  
On, off, or  
flashing  
blue  
received for this drive; it also has been selected by a management  
application.  
Steadily blue  
The drive is operating normally, and it has been selected by a  
management application.  
On, off, or  
flashing  
Amber, flashing  
regularly (1 Hz)  
A predictive failure alert has been received for this drive.  
Replace the drive as soon as possible.  
On  
Off  
The drive is online, but it is not active currently.  
On  
Amber, flashing  
regularly (1 Hz)  
Do not remove the drive. Removing a drive may terminate the  
current operation and cause data loss.  
The drive is part of an array that is undergoing capacity  
expansion or stripe migration, but a predictive failure alert has  
been received for this drive. To minimize the risk of data loss, do  
not replace the drive until the expansion or migration is complete.  
Flashing regularly  
(1 Hz)  
Component identification 94  
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Online/activity Fault/UID LED  
Interpretation  
LED (green)  
(amber/blue)  
Off  
Do not remove the drive. Removing a drive may terminate the  
current operation and cause data loss.  
The drive is rebuilding, or it is part of an array that is undergoing  
capacity expansion or stripe migration.  
Flashing regularly  
(1 Hz)  
Amber, flashing  
regularly (1 Hz)  
The drive is active, but a predictive failure alert has been received  
for this drive. Replace the drive as soon as possible.  
Flashing  
irregularly  
Off  
The drive is active, and it is operating normally.  
Flashing  
irregularly  
Steadily amber  
A critical fault condition has been identified for this drive, and the  
controller has placed it offline. Replace the drive as soon as  
possible.  
Off  
Amber, flashing  
regularly (1 Hz)  
A predictive failure alert has been received for this drive. Replace  
the drive as soon as possible.  
Off  
Off  
Off  
The drive is offline, a spare, or not configured as part of an array.  
Fans  
Item  
Description  
Fan 1  
Configuration  
Redundant  
Primary  
1
2
3
4
5
Fan 2  
Fan 3  
Redundant  
Primary  
Fan 4  
Fan 5  
Primary  
Component identification 95  
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Battery pack LEDs  
Item  
Color  
Description  
Green  
System Power LED. This LED is on when the system is  
powered up and 12 V system power is available. This  
power supply is used to maintain the battery charge and  
provide supplementary power to the cache microcontroller.  
1
Green  
Auxiliary Power LED. This LED is on when 3.3V auxiliary  
voltage is detected. The auxiliary voltage is used to  
preserve BBWC data and is available any time that the  
system power cords are connected to a power supply.  
2
Amber  
Green  
Battery Health LED. To interpret the illumination patterns of  
this LED, see the following table.  
3
4
BBWC Status LED. To interpret the illumination patterns of  
this LED, see the following table.  
LED3 pattern  
LED4 pattern  
Interpretation  
Flashing (2 Hz)  
The system is powered down, and the cache contains data that has not  
yet been written to the drives. Restore system power as soon as  
possible to prevent data loss.  
Off  
Data preservation time is extended any time that 3.3 V auxiliary  
power is available, as indicated by LED 2. In the absence of auxiliary  
power, battery power alone preserves the data. A fully-charged  
battery can normally preserve data for at least 2 days.  
The battery lifetime also depends on the cache module size. For more  
information, see the controller QuickSpecs on the HP website  
Double flash, then The cache microcontroller is waiting for the host controller to  
pause communicate.  
Off  
Component identification 96  
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LED3 pattern  
LED4 pattern  
Interpretation  
Flashing (1 Hz)  
The battery pack is below the minimum charge level and is being  
charged. Features that require a battery (such as write cache, capacity  
expansion, stripe size migration, and RAID migration) are unavailable  
temporarily until charging is complete. The recharge process takes  
between 15 minutes and 2 hours, depending on the initial capacity of  
the battery.  
Off  
On  
The battery pack is fully charged, and posted write data is stored in the  
cache.  
Off  
Off  
The battery pack is fully charged, and no posted write data exists in  
the cache.  
Off  
Flashing (1 Hz)  
An alternating green and amber flashing pattern indicates that the  
cache microcontroller is executing from within its boot loader and  
receiving new flash code from the host controller.  
Flashing (1 Hz)  
A short circuit exists across the battery terminals or within the battery  
pack. BBWC features are disabled until the battery pack is replaced.  
The life expectancy of a battery pack is typically more than 3 years.  
On  
An open circuit exists across the battery terminals or within the battery  
pack. BBWC features are disabled until the battery pack is replaced.  
The life expectancy of a battery pack is typically more than 3 years.  
Flashing (1 Hz)  
FBWC module LEDs  
The FBWC module has two single-color LEDs (green and amber). The LEDs are duplicated on the reverse side  
of the cache module to facilitate status viewing.  
1 Green LED  
2 Amber LED  
Interpretation  
On  
On  
Off  
Off  
A backup is in progress.  
Off  
A restore is in progress.  
Flashing (1 Hz)  
Flashing (1 Hz)  
On  
The capacitor pack is charging.  
The capacitor pack has completed charging.  
One of the following conditions exists:  
Flashing (2 Hz)  
Alternating with  
green LED  
Flashing (2 Hz)  
Alternating with  
amber LED  
The charging process has timed out.  
The capacitor pack is not connected.  
On  
The flash code image failed to load.  
On  
Component identification 97  
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1 Green LED  
2 Amber LED  
Interpretation  
Off  
The flash code is corrupt.  
Off  
Power supply backplane connectors  
Connector  
BP1  
BP2  
BP3  
P1  
Description  
Drive bay 1 power cable  
Drive bay 2 power cable  
Drive bay 3 power cable  
Power supply 1 cable  
Power supply 2 cable  
SATA power cable  
P2  
P6  
SATA power cable  
P7  
SATA power cable  
P8  
Video adapter power cable  
Data cable  
P9  
P10  
P12  
Video adapter power cable  
Drive cage jumper location and configuration settings  
Two-bay LFF backplane  
Component identification 98  
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Six-bay LFF backplane  
Eight-bay SFF backplane  
Drive cage  
Installation  
Standard  
Optional  
Optional  
Pin setting  
No jumper  
1-2*  
1
2
3
2-3  
*Optional drive cages ship with the jumper set across pins 1 and 2.  
Component identification 99  
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Cabling  
Storage device cabling guidelines  
CAUTION: To prevent damage to the equipment, be sure that the server is powered down, all  
cables are disconnected from the back of the server, and the power cord is disconnected from the  
grounded (earthed) AC outlet before installing devices.  
CAUTION: To prevent damage to electrical components, properly ground the server before  
beginning any installation procedure. Improper grounding can cause electrostatic discharge.  
Data cabling  
Server data cabling  
Item  
Description  
SATA connector  
1
2
SAS connector A  
Cabling 100  
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Item  
Description  
SAS connector B  
3
4
5
6
DVD-ROM drive  
Hard drive cage 1, SAS connector 2  
Hard drive cage 1, SAS connector 1  
SAS hard drive cabling  
Item  
Description  
Optional SAS controller 1, port 1  
Optional SAS controller 1, port 2  
Optional SAS controller 2, connector 1  
Optional SAS controller 2, connector 2  
SAS connector A  
1
2
3
4
5
SAS connector B  
6
Hard drive cage 3, SAS connector 2  
Hard drive cage 3, SAS connector 1  
Hard drive cage 2, SAS connector 2  
Hard drive cage 2, SAS connector 1  
Hard drive cage 1, SAS connector 2  
Hard drive cage 1, SAS connector 1  
7
8
9
10  
11  
12  
Cabling 101  
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Two-bay LFF drive cage cabling  
Two-bay LFF drive cage cabling to an optional six-bay LFF backplane  
Item  
Description  
Drive cage bay 1 power cable  
Drive cage bay 3 power cable  
SAS cable (connector A)  
SAS cable (connector B)  
LED cable  
1
2
3
4
5
Two-bay LFF drive cage cabling to an optional SAS controller  
Cabling 102  
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Six-bay LFF backplane cabling  
Drive cage bay 1  
Drive cage bay 2  
Cabling 103  
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Eight-bay SFF drive cage cabling  
Drive cage bay 1  
Drive cage bay 2  
Cabling 104  
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Drive cage bay 3  
SAS expander cabling  
The colors are shown for illustration purposes only.  
Item  
Description  
SAS expander card, connectors C and D  
1
Cabling 105  
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Item  
Description  
SAS expander card, connectors E and F  
SAS expander card, connectors G and H  
SAS expander card, connectors A and B  
System board SAS connectors A and B  
Hard drive cage 3  
2
3
4
5
6
7
8
Hard drive cage 2  
Hard drive cage 1  
Media device data cabling  
Item  
Description  
SATA connectors  
Slimline optical drive  
DVD-ROM drive  
1
2
3
4
Half-height media device  
Cabling 106  
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DVD-ROM drive cabling  
Slimline optical drive cabling  
Cabling 107  
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Power cabling  
Server power cabling (basic configuration)  
Item  
Description  
Power supply backplane connector  
24-pin power connector  
Hard drive cage 1  
1
2
3
4
DVD-ROM drive  
Cabling 108  
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Server power cabling (maximum configuration)  
The colors are shown for illustration purposes only.  
Item  
Description  
Video card, slot 6  
1
Video card, slot 8  
2
Power connector  
3
Power supply backplane connector  
24-pin power connector  
Hard drive cage 1  
Hard drive cage 2  
Half-height media device  
DVD-ROM drive  
4
5
6
7
8
9
Slimline optical drive  
P9 power connector  
P12 power connector  
10  
11  
12  
Cabling 109  
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Hard drive cage power cabling  
Item  
Description  
24-pin power connector  
1
2
3
4
5
Power supply backplane connector  
Hard drive bay 1 (must use BP1 power cable)  
Hard drive bay 2 (must use BP2 power cable)  
Hard drive bay 3 (must use BP3 power cable)  
Cabling 110  
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Front panel cabling  
Item  
Description  
Front USB connector  
Front video connector  
Systems Insight Display connector  
Front panel connector  
1
2
3
4
Cabling 111  
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BBWC battery pack and FBWC capacitor pack  
cabling  
Cabling 112  
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Specifications  
Environmental specifications  
Specification  
Value  
Temperature range*  
Operating  
10°C to 35°C (50°F to 95°F)  
-40°C to 70°C (-40°F to 158°F)  
28°C (82.4°F)  
Shipping  
Maximum wet bulb temperature  
Relative humidity  
(noncondensing)**  
10% to 90%  
5% to 95%  
Operating  
Nonoperating  
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3,048  
m (10,000 ft) is applicable. No direct sunlight allowed.  
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for  
storage corresponds to a pressure minimum of 70 kPa.  
Server specifications  
Specification  
Value  
Dimensions  
Rack model  
17.48 cm (6.88 in)  
69.93 cm (27.53 in)  
48.34 cm (19.03 in)  
Height  
Depth  
Width  
Tower model  
47.04 cm (18.52 in)  
73.96 cm (29.12 in)  
24.77 cm (9.75 in)  
Height  
Depth  
Width  
Weight  
Weight (when lightly loaded)  
Rack  
25.00 kg (55.12 lbs)  
30.00 kg (66.14 lbs)  
46.75 kg (103.06 lbs)  
Tower  
Weight (maximum)  
Power supply specifications  
Depending on installed options, the server is configured with one of the following power supplies:  
HP ProLiant 1200 W Power Supply  
Specifications 113  
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Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
10 A at 100 VAC  
4.9 A at 200 VAC  
930 W at 100V AC input  
1348 W at 200V AC input  
Rated input power  
BTUs per hour  
3530 at 120V AC input  
4600 at 200V to 240V AC input  
Power supply output  
800 W at 100V AC input  
900 W at 120V AC input  
1200 W at 200V to 240V AC  
input  
Rated steady-state power  
800 W at 100V AC input  
900 W at 120V AC input  
1200 W at 200V to 240V AC  
input  
Maximum peak power  
HP ProLiant 750 W Power Supply  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
8.9 A at 100 VAC  
4.3 A at 200 VAC  
857 W at 100V AC input  
824 W at 200V AC input  
Rated input power  
BTUs per hour  
2925 at 100V AC input  
2812 at 200V AC input  
Power supply output  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Rated steady-state power  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Maximum peak power  
HP ProLiant 460 W Power Supply  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
5.5 A at 100 VAC  
2.6 A at 200 VAC  
Specifications 114  
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526 W at 100V AC input  
505 W at 200V AC input  
Rated input power  
BTUs per hour  
1794 at 100V AC input  
1725 at 200V AC input  
Power supply output  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Rated steady-state power  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Maximum peak power  
Specifications 115  
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Acronyms and abbreviations  
AMP  
Advanced Memory Protection  
BBWC  
battery-backed write cache  
CSR  
Customer Self Repair  
FBWC  
flash-backed write cache  
iLO  
Integrated Lights-Out  
IML  
Integrated Management Log  
LFF  
large form factor  
NCQ  
Native Command Queuing  
NMI  
nonmaskable interrupt  
NVRAM  
nonvolatile memory  
PCIe  
peripheral component interconnect express  
POST  
Power-On Self Test  
Acronyms and abbreviations 116  
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RBSU  
ROM-Based Setup Utility  
RDIMM  
registered dual in-line memory module  
SAS  
serial attached SCSI  
SATA  
serial ATA  
SFF  
small form factor  
SIM  
Systems Insight Manager  
TPM  
Trusted Platform Module  
UDIMM  
unregistered dual in-line memory module  
UID  
unit identification  
Acronyms and abbreviations 117  
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Index  
drive LEDs 94  
DVD-ROM cabling 107  
DVD-ROM drive 42, 83  
A
access panel 31  
additional information 80  
air baffle 26, 34  
E
Eight-bay SFF drive cage 104  
Eight-bay SFF drive cage backplane 48, 49, 51  
electrostatic discharge 25  
environmental requirements 113  
environmental specifications 113  
expansion slots 87, 89  
B
battery 89  
battery cabling for BBWC 112  
battery pack LEDs 96  
battery pack, removing 33  
battery-backed write cache (BBWC) 32, 33, 96  
BBWC (battery-backed write cache) 32, 33, 96  
BBWC battery pack 33  
extending server from rack 28  
F
blue screen event 92  
buttons 83  
fan blank 36  
fan cage 35  
fans 95  
C
cable management arm 29  
cabling, storage system 100  
cache module 32  
capacitor pack 33, 97  
components, identification 16, 83  
connectors 83  
fans, removing 31, 37  
FBWC cabling 112  
FBWC capacitor pack 33, 112  
FBWC module 32, 97  
FBWC module LEDs 97  
features 83  
front panel buttons 84  
front panel cabling 111  
front panel components 83  
front panel LEDs 84  
crash dump analysis 92  
CSR (customer self repair) 6  
customer self repair (CSR) 6  
H
hard drive backplane 45  
hard drive blanks 41  
hard drive cage 45  
hard drive cage blank 44  
hard drive LEDs 94  
hard drives, determining status of 94  
hard drives, removing 41  
health LEDs 84  
D
device numbers 92  
diagnostic tools 80  
diagnostics utility 80  
DIMM identification 90  
DIMM slots 89, 90  
DIMMs 90  
heatsink 53  
hot-plug fans 29  
HP Insight Diagnostics 80  
drive cage jumper 98  
Index 119  
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HP Insight Diagnostics survey functionality 80  
HP Insight Remote Support software 81  
HP NC375i adapter 63  
NMI switch 92  
O
HP NC524SFP Dual Port 10GbE Module 65  
operating system crash 92  
optical drive blank 83  
I
I/O bezel 68  
illustrated parts catalog 16  
iLO 2 activity LED 88  
P
part numbers 16  
PCI expansion slots 87, 89  
PCIe expansion boards 62  
power backplane connector 89  
power cabling 108, 109, 110  
power cap 85  
power LEDs, system 96  
Power On button 27, 84  
power supply 52  
iLO 2 link LED 88  
IML (Integrated Management Log) 81  
Insight Diagnostics 80  
Integrated Management Log (IML) 81  
internal USB connector 89  
J
jumper settings 98  
power supply backplane 78  
power supply backplane connector 98  
power supply connector 89  
power supply LEDs 88  
powering down 27  
K
keyboard connector 87  
preparation procedures 26  
processors 55, 89  
L
LED, system power 27  
LEDs, battery pack 96  
LEDs, FBWC module 97  
LEDs, hard drive 94  
LEDs, SAS hard drive 94  
LEDs, SATA hard drive 94  
link LED 88  
R
rack warnings 26  
rear panel components 87  
rear panel LEDs 88  
rear panel, accessing 29  
removal and replacement procedures 25  
removing server from rack 27  
removing the access panel 31  
replacement procedures 25  
requirements, environmental 113  
M
management tools 80  
mechanical components 16  
media bay 83  
S
media bay blank 42  
media device data cabling 106, 107  
memory 61  
memory dump 92  
mouse connector 87  
safety considerations 25  
SAS connector 89  
SAS device numbers 92  
SAS drive numbers 94  
SAS drives 94  
SAS hard drive 94  
SAS hard drive LEDs 94  
SATA connectors 89  
SATA hard drive 94  
SATA hard drive LEDs 94  
SD card slot 89  
N
NIC activity LED 88  
NIC connectors 87  
NIC link LED 88  
NMI functionality 92  
NMI header 92  
serial connector 87  
Index 120  
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server specifications 113  
side panels, removing 38  
six-bay LFF backplane 47, 103  
slimline optical drive 43, 107  
Smart Array P410i controller 89  
specifications 113  
specifications, environmental 113  
specifications, server 113  
static electricity 25  
status lights, battery pack 96  
storage system, cabling 100  
switch, NMI 92  
switches 92  
symbols on equipment 25  
system battery 69  
system board components 89  
system board replacement 70  
system components 19, 83  
system maintenance switch 89, 91, 92  
system power LED 27, 84, 96  
Systems Insight Display 66, 67, 83, 85  
Systems Insight Display connector 89  
Systems Insight Display LEDs 85  
T
telco racks 26  
tools 25  
Torx screwdriver 25  
tower bezel, removing 30  
tower feet 40  
TPM (Trusted Platform Module) 70, 89  
TPM connector 89  
troubleshooting 80  
troubleshooting resources 80  
two-bay LFF drive cage 102  
two-bay LFF drive cage backplane 45  
U
UID LED 84, 88, 92  
USB connectors 83, 87, 89  
USB support 82  
utilities 80  
V
video connector 83, 87, 89  
Index 121  
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