User Guide
hp rp7405/7410 Servers
Third Edition
Manufacturing Part Number: A6752-96008
21102
USA
© Copyright 2002
Download from Www.Somanuals.com. All Manuals Search And Download.
Contents
hp rp7405/rp7410 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Cell Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
System Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
I/O Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
hp rp7405 Servers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Detailed hp rp7405/rp7410 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Cell Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Cells and nPartitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
System Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
I/O Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Unpacking the Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Unpacking a Racked Server. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Unpacking a Non-Racked Server. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Installing Server Into the Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Installing the Cable Management Arm (CMA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Installing Add-On Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Connecting AC Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
MP Core I/O Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
MP/SCSI Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
LAN/SCSI Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Management Processor Access. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Setting Up the CE Tool (PC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Standby Power and Logging in to the MP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Configuring LAN Information for the MP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Verifying Presence of the Cell Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Powering On the hp rp7405/rp7410 Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Selecting a Boot Partition using the Management Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Verifying the System Configuration using Boot Console Handler (BCH) . . . . . . . . . . . . . . . . . . . . . . . 46
Booting HP-UX using Boot Console Handler (BCH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Common Installation Problems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
The Server Does Not Power On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
The Server Powers On But Then Shuts Down with a Fault Light . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
hp rp7405/rp7410 LED Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Shutting Down nPartitions and Powering Off Hardware Components . . . . . . . . . . . . . . . . . . . . . . . . . 58
Shutting Down an nPartition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Powering Off Hardware Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Removing and Replacing the Top Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Removing the Top Cover. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
iii
Download from Www.Somanuals.com. All Manuals Search And Download.
Contents
Replacing the Top Cover. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Removing and Replacing a Disk Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Removing a Disk Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Replacing a Disk Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Removing and Replacing a CD/DVD Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Removing a CD/DVD Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Replacing a CD/DVD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Removing and Replacing a Front Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Removing a Front Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Replacing a Front Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Removing and Replacing a Rear Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Removing a Rear Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Replacing a Rear Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Removing and Replacing a PCI Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Removing a PCI Smart Fan Assembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Replacing a PCI Smart Fan Assembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Removing and Replacing a Bulk Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Removing a BPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Replacing a BPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Removing and Replacing a PCI Power Module (Brick) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Removing a PCI Power Module (Brick) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Replacing a PCI Power Module (Brick) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Removing and Replacing the PCI Voltage Regulator Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Removing PCI VRM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Replacing the PCI VRM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Removing and Replacing a PCI Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Removing and Replacing a PCI Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Removing and Replacing the Mass Storage Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Removing the Backplane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Replacing the Backplane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Removing and Replacing a MP/SCSI Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Removing a MP/SCSI board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Replacing a MP/SCSI Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Dimensions and Weights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Circuit Breaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
System AC Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Temperature and Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Cooling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Typical Power Dissipation and Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
iv
Download from Www.Somanuals.com. All Manuals Search And Download.
Contents
Acoustic Noise Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Air Flow. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Electrical Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Electrical Load Requirements (Circuit Breaker Sizing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Power Quality. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Sources of Electrical Disturbances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Power System Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Distribution Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Wire Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Raceway Systems (electrical conduits) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Building Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Power Routing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Grounding Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Power Distribution Safety Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Cabinet Performance Grounding (High frequency Ground). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Equipment Grounding Implementation Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
System Installation Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Wiring Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Data Communications Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Environmental Elements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Computer Room Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Basic Air Conditioning Equipment Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Air Conditioning System Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Air Conditioning System Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Basic Air Distribution Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Air Conditioning System Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Humidity Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Air Conditioning Ducts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Dust and Pollution Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Electrostatic Discharge (ESD) Prevention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Computer Room Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Fire Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Lighting Requirements for Equipment Servicing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Facility Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Floor Loading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Windows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Space Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Delivery Space Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Operational Space Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Zinc Particle Contamination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
v
Download from Www.Somanuals.com. All Manuals Search And Download.
Contents
vi
Download from Www.Somanuals.com. All Manuals Search And Download.
Tables
Table 1-1. hp rp7405 Servers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 1-2. hp rp7405-to-rp7410 Upgrades . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 1-3. hp rp7405/rp7410 DIMMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 1-4. PCI Slot Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 2-1. hp rp7405/rp7410 DIMMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 3-1. Front Panel LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Table 3-2. BPS LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 3-3. PCI Power Supply LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 3-4. System, Standby, and I/O Fan LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Table 3-5. SINC POST LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Table 3-6. OL* LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 3-7. OL* LEDs States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 3-8. MP Core I/O LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 3-9. LAN/SCSI LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Table 4-1. Front Smart Fan Assembly LED Indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Table 4-2. Rear Smart Fan Assembly LED Indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Table 4-3. Smart Fan Assembly LED Indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 4-4. PCI Power Module LED Indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Table A-1. hp rp7405/rp7410 Field Replaceable Unit (FRU) List . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Table B-1. hp rp7405/rp7410 Server Dimensions and Weights. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Table B-2. hp rp7405/rp7410 Component Weights. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Table B-3. Power Cords . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Table B-4. AC Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Table B-5. System Power Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Table B-6. Typical hp rp7405/rp7410 Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Table C-1. Computer Room Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Table C-2. Effect of Humidity on ESD Charge Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Table C-3. Floor Loading Term Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Table C-4. Typical Raised Floor Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
vii
Download from Www.Somanuals.com. All Manuals Search And Download.
Tables
viii
Download from Www.Somanuals.com. All Manuals Search And Download.
Figures
Figure 3. Korean RFI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiii
Figure 1-1. hp rp7405/rp7410 Server (front view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 1-2. hp rp7405/rp7410 Server (without front bezel). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Figure 1-3. hp rp7410 8-Way Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 1-4. Cell Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 1-5. Cell Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 1-6. Memory Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 1-7. Internal Disks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 1-8. System Backplane Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 1-9. I/O Subsystem Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 1-10. Right-Front View of hp rp7405/rp7410 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 1-11. Left-Rear View of hp rp7405/rp7410 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 2-1. Removing the Polystraps and Cardboard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 2-2. Removing the Shipping Bolts and Plastic Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 2-3. Preparing to Roll Off the Pallet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 2-4. Securing the Cabinet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 2-5. RONI Lifter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 2-6. Server with Shipping Box Removed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 2-7. Remove Cushions for Lift Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 2-8. Raising a Server Off the Pallet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 2-9. Lifting the Server to the Rack. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 2-10. Positioning the Lift handles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 2-11. Inserting the Pins Into the Rack. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 2-12. Lift Handles Mounted . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 2-13. Lifting the Server. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 2-14. Cable Management Arm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 2-15. Attaching CMA to Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 2-16. Attaching CMA to the Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 2-17. Embedded Disks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 2-18. Cell Board (Two processors and CC Shown) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 2-19. DIMM Loading Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 2-20. Power Cord Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 2-21. Power Source vs. Power Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 2-22. Front Panel Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 2-23. MP Main Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 2-24. The lc Command Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 2-25. The ls Command Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 2-26. The du Command Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 4-1. Top Cover. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
ix
Download from Www.Somanuals.com. All Manuals Search And Download.
Figures
Figure 4-2. Top Cover Retaining Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Figure 4-3. Disk Drive Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Figure 4-4. Disk Drive Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Figure 4-5. CD/DVD Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Figure 4-6. CD/DVD Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Figure 4-7. CD/DVD Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Figure 4-8. Front Smart Fan Assembly Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Figure 4-9. Front Fan Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Figure 4-10. Rear Smart Fan Assembly Locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Figure 4-11. Rear Fan Detail. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Figure 4-12. PCI Smart Fan Assembly Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Figure 4-13. PCI Smart Fan Assembly Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Figure 4-14. BPS Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Figure 4-15. BPS Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Figure 4-16. PCI Power Module Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Figure 4-17. PCI Power Module Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Figure 4-18. Locating the VRMs on PCI Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Figure 4-19. PCI Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Figure 4-20. PCI Gate Detail. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Figure 4-21. Locating Internal Disks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Figure 4-22. Locating the Mass Storage Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Figure 4-23. Mass Storage Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Figure 4-24. MP/SCSI Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Figure 4-25. MP/SCSI Detail. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Figure B-1. Airflow Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Figure C-1. Raised Floor Ground System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Figure C-2. Cabinet Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Figure C-3. Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
x
Download from Www.Somanuals.com. All Manuals Search And Download.
Preface
Download from Www.Somanuals.com. All Manuals Search And Download.
Revision History
Table 1
Revisions
Revision
Part Number
Release Date
Description
Third
A6752-96008
November 2002
Corrected power cord and power reqirements section.
Corrected DIMM oading order. Other general
corrections.
Second
First
A6752-96002
A6752-91001
August 2002
Changed title, revised entire book
Initial release
February 2002
viii
Download from Www.Somanuals.com. All Manuals Search And Download.
Notational Conventions
WARNING
Warnings highlight procedures or information necessary to avoid injury to
personnel. The warning should tell the reader exactly what will result from what
actions and how to avoid them.
CAUTION
NOTE
A caution highlights procedures or information necessary to avoid damage to equipment,
damage to software, loss of data, or invalid test results.
A note highlights supplemental information.
ix
Download from Www.Somanuals.com. All Manuals Search And Download.
Safety and Regulatory
Regulatory Model: RSVLA-0102
For your protection, this product has been tested to various national and international regulations and
standards. The scope of this regulatory testing includes electrical/mechanical safety, radio frequency
interference, acoustics, and know hazardous materials.Where applicable, approvals obtained from third-party
test agencies are shown on the product label.
Safety in Material Handling
WARNING
Do not lift the cabinet manually. To avoid physical injury you must use a mechanical
lifting device.
WARNING
Use care when working with hazardous voltages. This equipment may be configured
with dual input line sources. Hazardous voltages and energy maybe present even
after the removal of a single input source. Trained service personnel must follow the
service guidelines.
WARNING
Do not stand in front of the equipment as it is rolled off the pallet onto the ramps.
When removing the equipment from the shipping pallet, follow the guidelines
specified in the Installation Procedures section of the appropriate equipment
guides.
x
Download from Www.Somanuals.com. All Manuals Search And Download.
USA Radio Frequency Interference
FCC Notice
The Federal Communications Commission (in 47 CFR Part 15 subpart B) has specified that the following
notice be brought to the attention of the users of this product.
NOTE
This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a residential area is
likely to cause harmful interference in which case the user will be required to correct the
interference at his own expense.
The user is cautioned that changes or modifications not expressly approved by Hewlett-Packard could result
in the equipment being noncompliant with FCC Class A requirements and void the user’s authority to
operated the equipment.
Japanese Radio Frequency Interference
VCCI
This equipment is in the Class A category information technology equipment based on the rules of Voluntary
Control Council For Interference by Information Technology Equipment (VCCI). When used in a residential
area, radio interference may be caused. In this case, user may be required to take appropriate corrective
actions.
Figure 2
Japanese RFI
xii
Download from Www.Somanuals.com. All Manuals Search And Download.
Korean RFI Statement
Certification Number: E - AAAAA - BB - CCCC
•
•
•
•
E: EMC registration
AAAAA: equipment codes (RRL notice, 2000.10.26)
BB: certification year
CCCC: registration number
Figure 3
Korean RFI
Translation
Class A Equipment:
Please note that this equipment has been approved for business purpose with regards to electromagnetic
interference, if purchased un error for use in residential area, you may wish to exchange the equipment where
you purchase it.
Class B Equipment:
Please note that this equipment has been approved for non-business with regards to electromagnetic
interference. So, this equipment can be allowed to use all area as well as residential area.
European Union RFI Statement
This is a Class A product. In a domestic environment this product may cause radio interference in which case
the user may be required to take adequate measures.
Canada RFI Statement
This Class A digital apparatus complies with Canadian ICES-003.
Notice relative aux interférences radioélectriques (Canada)
Cet appareil numéric de la classe A est conforme à la norme NMB-003 du Canada.
xiii
Download from Www.Somanuals.com. All Manuals Search And Download.
BSMI (Taiwan Area)
This product is fully compliant to CNS 13438 (CISPR 22: 1993) Class A. The EMC label is in the form shown
Figure 4
Taiwan Area EMC
NOTE
Electrical practices and suggestions in this guide are based on North American practices. For
countries outside North America, local electrical codes will take precedence over North
American electrical codes.
An example would be the recommendation that the PE (protective earthing) conductor be green
with yellow stripes. This requirement is a North American directive and does not override the
local code requirements for a country outside North America.
Throughout this manual, the [LAHJ] acronym will be used to indicate Local Authority Has Jurisdiction.
Acoustics (Germany)
Acoustic Noise (A-weighted Sound Pressure Level LpA) measured at the bystander position, normal
operation, to ISO 7779: LpA = 59 dB.
Geräuschemission (Deutschland)
Lärmangabe (Schalldruckpegel LpA) gemessen am fiktiven Arbeitsplatz bei normalem Betrieb nach
DIN 45635, Teil 19: LpA = 59 dB.
IT Power System
This product has not been evaluated for connection to an IT power system (an AC distribution system having
no direct connection to earth according to IEC 60950).
TT, TN-C, and TN-C-S Power Systems
These products should not be connected to power systems that switch open the return lead when the return
lead also functions as the protective earth (PE). A separate PE ground wire must be connected to the
equipment at the designated PE terminal tie point.
xiv
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation Conditions
See installation instructions before connecting this equipment to the input supply.
Voir la notice d’installation avant de raccorder au réseau.
WARNING
WARNING
NORDIC Class 1 Equipment
Denmark: Før tilslutning af de øvrige ledere, se medfølgende
installationsvejledning.
NORDIC Class 1 Equipment
Sweden: Apparaten skall anslutas till jordat uttag, när den ansluts till ett nätverk.
Network Connected Equipment
The installation must provide a ground connection for the network equipment.
CAUTION
CAUTION
Sweden: Apparaten skall anslutas till jordat uttang när deb abskuts till ett nätverk.
Norway: Apparaten skall anslutas till jordat uttang nar deb abskuts till ett natverk.
xv
Download from Www.Somanuals.com. All Manuals Search And Download.
Lithium Battery Caution
WARNING
Observe the correct polarity when changing the lithium battery. There is a danger of
explosion if battery is installed incorrectly.
Replace only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions and local
disposal requirements.
IMPORTANT Switzerland: Annex 4.10 of SR 814.013 applies to batteries.
Australian C-Tick Label
Figure 5
C-Tick Label
xvi
Download from Www.Somanuals.com. All Manuals Search And Download.
Laser Safety
NOTE
If a Fibre Channel I/O card is present, the following laser safety statement applies.
This product contains a laser internal to the Optical Link Module (OLM) for connection to the Fibre
communications port.
In the USA, the OLM is certified as a Class 1 laser product conforming to the requirements contained in the
Department of Health and Human Services (DHHS) regulation 21 CFR, Subchapter J. The certification is
indicated by a label on the plastic OLM housing.
Outside the USA, the OLM is certified as a Class 1 laser product conforming to the requirements contained in
IEC 60825-1:1993 and EN 60825-1:1994, including Amendment 11:1996.
NOTE
If a DVD is present, the following laser safety statement applies.
This product contains a laser internal to the Digital Versatile Disc (DVD) housing.
In the USA, the DVD is certified as a Class 1 laser product conforming to the requirements contained in the
Department of Health and Human Services (DHHS) regulation 21 CFR, Subchapter J. The certification is
indicated by a label on the DVD housing.
Outside the USA, the DVD is certified as a Class 1 laser product conforming to the requirements contained in
IEC 60825-1:1993+A1 and EN 60825-1:1994+A11.
xvii
Download from Www.Somanuals.com. All Manuals Search And Download.
xviii
Download from Www.Somanuals.com. All Manuals Search And Download.
1 Introduction
The hp rp7410 is a member of Hewlett-Packard’s business-critical computing platform family: a mid-range,
mid-volume server, positioned as an upgrade to the current N-Class product in the PL-1X product line. It
provides increased performance over its predecessor but in a smaller volume. Its shallower depth allows it to
fit in a standard rack. In addition to the hp rp7410, Hewlett-Packard offers a series of cost-effective servers
1
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
hp rp7405/rp7410 Overview
hp rp7405/rp7410 Overview
The hp rp7405/rp7410 is a 10U, 8-way SMP, rack-mount server that accommodates up to 32 GB of memory (64
GB available at a later date); PCI-4X I/O; and internal peripherals including disks and DVD/tape. Its high
availability features include N+1 hot-pluggable fans and power, redundant power cords, and hot-pluggable
PCI cards and internal disks. It uses the PA8700 PA-RISC processors.
Figure 1-1
hp rp7405/rp7410 Server (front view)
2
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
hp rp7405/rp7410 Overview
Figure 1-2
hp rp7405/rp7410 Server (without front bezel)
Improvements over its predecessor, N4000, include:
•
•
•
•
•
•
•
•
•
•
•
Better availability and up time
Depth optimized (shallower, fewer racking issues)
Performance density increase
Performance increase
Internal removable media
More internal disks
Optimal power cord quantity (2 min., 4 max)
Enabled for cell hot-plug, dual-partition, dual and/or redundant MP Core I/O
More PCI slots (up to 16)
Upgradeable to PCI-X
Superset of MP Core I/O functionality
Cell Board
The cell board contains the processors, main memory, and the CC ASIC that interfaces the processors and
memory to the off-board I/O. The CC provides a crossbar connection, which allows communication with other
cell boards in the system. It connects to the PDH and SINC hardware. Each cell board holds up to 16 DIMMS.
There can be one or two cell boards installed in a server. The cell boards have hot-plug capability.
3
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
hp rp7405/rp7410 Overview
System Backplane
The system backplane comprises the system clock generation logic, the system reset generation logic,
DC-to-DC converters, power monitor logic, and two Local Bus adaptor (LBA) link-to-PCI converter ASICs. It
also includes connectors for attaching the cell boards, PCI backplane, MP Core I/O MP/SCSI boards, SCSI
cables, bulk power, chassis fans, front panel display, intrusion switches, and the system scan card. Unlike
Superdome or the rp8400, there are no XBC chips on the system backplane. The “crossbar-less” back-to-back
CC connection increases performance and reduces costs.
There are only two sets of cell board connectors, because the server has only two cells
Also, only half of the MP Core I/O board set connects to the system backplane. The MP/SCSI boards plug into
the backplane, while the LAN/SCSI boards plug into the PCI Backplane.
I/O Subsystem
All of the I/O is integrated into the system by way of the PCI busses. The CC on each cell board communicates
with one SBA over the SBA link. The SBA link consists of both an inbound and an outbound link with an
effective bandwidth of approximately 1 GB/sec. The SBA converts the SBA link protocol into “ropes”. SBA can
support up to 16 of these high-speed bi-directional links for a total aggregate bandwidth of approximately 4
GB/sec. The LBA acts as a bus bridge, supporting either one or two ropes, and capable of driving either
PCI-2x Turbo (33 MHz x 64 bits) or PCI-4 Twin Turbo (66 MHz x 64 bits) respectively.
4
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
hp rp7405 Servers
hp rp7405 Servers
Hewlett-Packard offers a cost-effective server based on the hp rp7410 by employing a reduced number of
processors, memory, core I/O, or power supplies as indicated in Table 1-1.These servers provide a somewhat
reduced performance than the fully functional hp rp7410 servers.
Table 1-1
hp rp7405 Servers
Server
Product Number
Description
rp7405 2-way system
rp7405 4-way system
rp7405 8-way system
A7111A
A7112A
A7113A
Includes rp7405 SMP base system, two 650-MHz PA-RISC
processors, 4-GB memory (2 x 2GB memory modules), two
73-GB 10k internal disks, one DVD drive, one cell board, one
core I/O, and two power supplies
Includes rp7405 SMP base system, four 650-MHz PA-RISC
processors, 8-GB memory (4 x 2 GB memory modules), four
73-GB 10k internal disks, one DVD drive, two cell boards,
two core I/O, and two powers supplies
Includes rp7405 SMP base system, eight 650-MHz PA-RISC
processors, 16-GB memory (8 x 2 GB memory modules), four
73-GB 10k internal disks, one DVD drive, two cell boards,
two core I/O, and two power supplies
These servers may be upgraded with additional processors/cell boards, memory, core I/O, etc. according to the
corporate price list.
In addition, these servers may be upgraded to fully functional hp rp7410 servers with the kits given in
Table 1-2.
Table 1-2
hp rp7405-to-rp7410 Upgrades
Kit Description
Upgrade
Part Number
Upgrade kit from 2-way rp7405 to rp7410
Upgrade kit from 4-way rp7405 to rp7410
Upgrade kit from 8-way rp7405 to rp7410
750 MHz upgrade
875 MHz upgrade
750 MHz upgrade
875 MHz upgrade
750 MHz upgrade
875 MHz upgrade
A7144A
A7145A
A7146A
A7147A
A7148A
A7149A
5
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
Detailed hp rp7405/rp7410 Description
Cell Board
The cell board contains the processors, main memory, and the cell controller (CC) ASIC that interfaces the
processors and memory to the off-board I/O. Shown in Figure 1-4 is the CC. This is the heart of the cell board.
The CC provides a crossbar connection, which allows communication with other cell boards in the system. It
connects to the PDH and SINC hardware. Each cell board holds up to 16 DIMMs. There can be one or two cell
boards installed in an system. The cell boards have hot-plug capability.
Figure 1-4
Cell Controller
Figure 1-5
Cell Board
7
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
Detailed hp rp7405/rp7410 Description
The hp rp7405/rp7410 has a 48V distributed power system and receives the 48V power from the system
backplane board. The cell board contains DC-to-DC converters to generate the required voltage rails. The
DC-to-DC converters on the cell board do not provide N+1 redundancy.
The cell board contains several major buses including:
•
•
•
•
•
Runway buses for each of the four processors
Two memory buses (one going to each half of the main memory array)
Incoming and outgoing I/O bus that goes off board to a SBA chip
Incoming and outgoing crossbar bus that goes off board to the other cell boards
PDH bus that goes to the PDH/SINC circuitry
All of these buses come together at the CC chip.
Due to space limitations on the cell board the PDH/SINC circuitry resides on a riser board that plugs at a
right angle into the cell board. The cell board also includes clock circuits, test circuits and de-coupling
capacitors.
Figure 1-6 shows a simplified view of the memory subsystem. It consists of two independent access paths,
each path having its own address bus, control bus, data bus, and DIMMs. In practice, the CC runs the two
paths 180 degrees out of phase with respect to each other to facilitate pipelining in the CC. Address and
control signals are fanned out through register ports to the SDRAMs on the DIMMs.
Data transferred between the CC and SDRAM passes through custom VLSI circuits (M2) that are bit-sliced;
four form one 72-bit CC memory data bus. These circuits perform speed and width conversion between the
SDRAM and MID busses. They also perform the write (tag update) portion of a read-modify-write (RMW)
access. The CC memory data busses are bi-directional and run at 250 MT/s (million transfers per second).
These links are self-clocked in that a pair of clock strobes is passed along with the data so that phase
realignment can be done by the receiver.
Figure 1-6
Memory Subsystem
8
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
Detailed hp rp7405/rp7410 Description
PDH Riser Board
The PDH riser board is a daughter card for the cell board. It contains a micro-processor memory interface
microcircuit, processor-dependent hardware (PDH) including the processor dependant code (PDC) Flash
memory, and a manageability micro-controller, called SINC, with associated circuitry. The PDH obtains cell
board configuration information from cell board signals and from the cell's LPM. See the PDH Riser Board
ERS for operational details.
The memory interface microcircuit is the heart of the PDH. It provides the CC access to the PDH space by a
4-bit, 50-75 MHz bus. This microcircuit also supports an interrupt mechanism to the CC that can interrupt a
processor for the PDH. It provides access to the FLASH ROM and scratch RAM memory chips together with
2
the external registers and an interface to an I C micro controller (SINC) that monitors sensors throughout
the system. It also controls system reset and initialization signals, as well as the low-level debugger (LDB)
port, UART, semaphore register, and GPIO pins. It is the primary master for a Serial Presence Detect bus.
The PDH supports up to 4 MB of address space for ROM (FLASH) to hold the PDC firmware.
The non-volatile memory and scratch RAM have been combined and placed in a 512KB battery-backed SRAM
DIMMs
Custom designed by Hewlett-Packard, each DIMM contains 36x4 SDRAM memory components similar to
PC-133 memory but qualified to run at 125MHz. They have an low-voltage TTL interface. The CEC does not
support traditional DRAMs.
The hp rp7405/rp7410 supports DIMMs with 128, 256, 512, and 1024 Mbit devices. Table 1-3 shows each
DIMM supported with its associated capacity, the resulting total system capacity, and the memory component
density.
DIMMs must be loaded in sets of four at specific locations. For best performance, loading sets of eight DIMMs
is recommended.
Table 1-3
DIMM Capacity
512 Mbyte
1G Byte
hp rp7405/rp7410 DIMMs
Total Capacity
16 Gbytes
Memory Component Density
128 Mbit
32 Gbytes
256 Mbit
Main Memory Performance Latency to main memory is an important parameter in determining overall
system performance. With memory busses running at 125 MHz, the latency for a page hit is 8.5 cycles (68ns),
the latency for a page closed is 11.5 cycles (92ns), and the latency for a page miss is 14.5 cycles (116ns).
Cells and nPartitions
NOTE
In the following discussion, the term “cell” refers to a cell board.
A cell board that has an I/O link to a bootable device and a console (usually supplied by an MP Core I/O card)
is a potential boot cell. The cell that contains the boot console I/O path is the called the root cell. Both cells are
potential root cells. The primary or default root cell in a single nPartition system is the bottom cell (cell 1).
An nPartition (also called a Protection Domain) is a cell(s) running the same OS and sharing processes and
memory space among the components. Each nPartition must have one root cell and may have both. The hp
rp7405/rp7410 has only two possible nPartition configurations: single or dual. The additional cell that may be
part of the nPartition does not require I/O links nor MP Core I/O cards.
9
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
Detailed hp rp7405/rp7410 Description
In the single nPartition case, if two cells are present, either cell may be the root cell, assuming the both cells
have MP Core I/O functionality present. If only one cell is present, that cell is the root cell (and should be cell
1).
In the dual nPartition case (two cells required), each nPartition consists of one cell, and each cell must be a
root cell. The ability to interconnect two cells in one nPartition or isolate the cells in a dual nPartition system
provides system configuration flexibility. System partitioning is configured by the system management
processor.
Internal Disk Devices for hp rp7405/rp7410
As Figure 1-4 shows, in an hp rp7405/rp7410 cabinet the top internal disk drives connect to cell 1 through the
MP Core I/O for cell 1 (for 1/0/0/3/0.6) and the LAN/SCSI card in slot 1_8 (I/O chassis 1 slot 8, for
1/0/1/0/0/1/1.6). Both of the bottom disk drives (0/0/0/3/0.6 and 0/0/0/3/0.5) connect to cell 0 through the MP
core I/O for cell 0. A CD/DVD-ROM drive or DAT drive connects to cell 1 through the core I/O card for cell 1,
thus it can be accessed through the cell 1 nPartition only.
Figure 1-7
Internal Disks
Drive 1-1
Path: 1/0/0/3/0.6
Drive 1-2
Path: 1/0/1/0/0/1/1.6
Removable media path
DVD: 1/0/0/3/1.2
DAT: 1/0/0/3/1.3
Drive 0-2
Path: 0/0/0/3/0.5
Drive 0-1
Path: 0/0/0/3/0.6
10
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
Detailed hp rp7405/rp7410 Description
System Backplane
The system backplane comprises the system clock generation logic, the system reset generation logic,
DC-to-DC converters, power monitor logic, and two LBA link-to-PCI converter ASICs. It also includes
connectors for attaching the cell boards, PCI backplane, MP Core I/O MP/SCSI boards, SCSI cables, bulk
power, chassis fans, front panel display, intrusion switches, and the system scan card.
Figure 1-8
System Backplane Block Diagram
System backplane
MP Core I/O
MP/SCSI
PCI backplane
Cell board 0
MP Core I/O
MP/SCSI
Cell board 1
Cell boards are perpendicular
to the system backplane.
Bulk power supply
Only half of the MP Core I/O board set connects to the system backplane. The MP/SCSI boards plug into the
backplane, while the LAN/SCSI boards plug into the PCI backplane.
Clocks and Reset
The system backplane contains reset and clock circuitry that propagates through the whole system. The
central clocks drive all major chip set clocks. Therefore, these circuits represent a system wide single point of
failure.
I/O Subsystem
The cell board-to-I/O path runs from the CC to the SBA, from the SBA to the ropes, from the ropes to the LBA,
and from the LBA to the PCI buses. The CC on each cell board communicates with one SBA over the SBA
link. The SBA link consists of both an inbound and an outbound link with an effective bandwidth of
approximately 1 GB/sec. The SBA converts the SBA link protocol into “ropes.” The SBA can support up to 16
of these high-speed bi-directional rope links for a total aggregate bandwidth of approximately 4 GB/sec. The
LBA acts as a bus bridge, supporting either one or two ropes and capable of driving either PCI-2x Turbo (33
MHz x 64 bits) or PCI-4 Twin Turbo (66 MHz x 64 bits) respectively
11
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
Detailed hp rp7405/rp7410 Description
.
Figure 1-9
I/O Subsystem Architecture
The server supports two internal SBAs. The SBAs generate 32 rope busses (16 per SBA). The 32 available
internal rope busses are divided in the following manner:
•
•
•
Two ropes are routed as single rope bundles to support PCI-2x Turbo (264 MB/sec. bandwidth, 64-bit
transfers at 33 MHz) for the MP Core I/O boards for SCSI/LAN.
Two ropes are routed as single rope bundles to two LBAs to support two slots operating at PCI-2x for
MP/SCSI.
The remaining 28 ropes are bundled in two rope pairs to 14 LBAs to support 14 slots operating at PCI-4x
(528 MB/sec., 64-bit transfers at 66 MHz).
The hp rp7405/rp7410 uses Hewlett-Packard’s proprietary adaptive signaling concept, also known as the
Universal PCI slot concept (not to be confused with the Universal PCI card). Circuitry on the backplane
senses a standard connector, keyed for 5V, to determine the type of the cards inserted. The circuitry controls
the voltage rail supplied to the connector for powering the card’s I/O pads, VIO. The card can either be of the
5V only, or universal type. 5V only cards require VIO to be 5V, whereas universal cards operate 5V as well as
3.3V. To take advantage of the 66-MHz potential of universal cards, one must operate those cards at 3.3V. The
control circuitry on the backplane, therefore, provides 5V to the slot when a 5V-only card is present, or 3.3V
when a universal card is present. Firmware controls the setting of the slot’s clock rate.
12
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
Detailed hp rp7405/rp7410 Description
This concept allows maximum connectivity for mainstream 5V-only, 33 MHz, 32 bit (PCI-1x) and 64-bit
(PCI-2x) cards, as well as full I/O bandwidth utilization through the use of 64-bit, 66 MHz (PCI-4x) universal
cards.
Table 1-4
PCI Slot Types
Slot#
Device:
0_1
0_2
0_3
0_4
0_5
0_6
0_7
0_8
1_1
1_2
1_3
1_4
1_5
1_6
1_7
1_8
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-2x, Turbo 64-bit, 33 MHz, Adaptive Signaling, 5V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.
PCI-2x, Turbo 64-bit, 33 MHz, Adaptive Signaling, 5V connector, Hot Swap Slot.
MP/SCSI MP Core I/O Board
The hp rp7405/rp7410 accommodates two sets of MP Core I/O functionality. Each MP Core I/O board set
consists of a MP/SCSI board and a Procurium LAN/SCSI board. At least one MP/SCSI board is required
(independent of partitions) An additional MP/SCSI board can be added as well (and is required in a dual
partition system). Both MP/SCSI boards are oriented vertically and plug into the system backplane. The
MP/SCSI board incorporates a dual Ultra160 SCSI controller and is hot pluggable.
Procurium LAN/SCSI Board
At least one Procurium LAN/SCSI board is required for the minimum system configuration; two are required
in a dual partition system. The Procurium board is a standard PCI form factor card with PCI card edge
connectors. The PCI backplane has one slot location reserved for the required Procurium board and another
that can accommodate either a Procurium board or any other supported add-in PCI card. The Procurium
board is hot pluggable.
13
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
Detailed hp rp7405/rp7410 Description
Mass Storage (Disk) Backplane
Internal mass storage connections (to disks) are routed on the mass storage backplane, having connectors and
termination logic. All disks are hot pluggable. The hp rp7405/rp7410 accommodates one internal removable
media device. Therefore, only one power connector for a removable media device is required on the mass
storage backplane. The mass storage backplane incorporates a circuit that allows power to the internal
removable media device to be programmatically cycled.
Package Description
Dimensions
The dimensions of the hp rp7405/rp7410 are as follows:
•
•
Width: 44.45 cm (17.5 inches), constrained by EIA standard 19 inch racks.
Depth: Defined by cable management constraints to fit into standard 36 inch deep racks (Rittal/Compaq,
Rosebowl I):
25.5 inches from front rack column to PCI connector surface:
26.7 inches from front rack column to MP Core I/O connector surface
30 inches overall package dimension, including 2.7 inches protruding in front of the front rack columns.
•
Height: 10U – 5.4 cm = 43.91 cm (17.287 inches). This is the appropriate height for a product that
consumes 10U of rack height while allowing adequate clearance between products directly above and
below this product. Fitting four server units per 2 m rack and upgrade of current 10U height products in
the future are the main height constraints.
System Chassis
The mass storage section located in the front allows access to removable mass storage devices without
removal of the bezel (not shown.) This is especially helpful when the system is mounted in the lowest position
in a rack. The mass storage bay accommodates one 5.25-inch removable media device and up to four 3.5-inch
hard drives. The front panel display board, containing LEDs and the system power switch, is located directly
above the 5.25-inch removable media bay.
Below the mass storage section and behind a removable bezel are two PCI DC-to-DC power converters.
The bulk power supply section is partitioned by a sealed metallic enclosure located in the bottom of the
package. This enclosure houses the 2N fully redundant BPSs.
14
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
Detailed hp rp7405/rp7410 Description
Figure 1-10
Right-Front View of hp rp7405/rp7410
PCI cards
Front panel
display board
Cell boards
PCI DC-to-DC
converters
Slide
Bulk powers supplies
The PCI I/O card section, located towards the rear, is accessed by removing the top cover.
The PCI OLR fan modules are located in front of the PCI cards. These six 9.2 cm fans are housed in plastic
carriers. They are configured in two rows of three fans.
The MP/SCSI MP Core I/O boards are positioned vertically at the rear of the chassis.
The PCI card bulkhead connectors are located in the top rear portion of the product volume.
Four OLR system fan modules, externally attached to the chassis, are 15 cm (6.5-inch) fans. Two fans are
mounted on the front surface of the chassis and two are mounted on the rear surface.
Redundant line cords attach to the floating AC connector module at the bottom rear. Two 20-amp cords are
required to power the server. Two additional line cords provide redundancy.
A cable harness that connects from the rear of the BPSs to the system backplane provides DC power
distribution.
Access the system backplane is accomplished by removing the left side cover. The system backplane inserts by
a guide/insertion mechanism using a single large jack screw assembly.
SCSI ribbon-cable assemblies route from the mass storage area to the backside of the system backplane and
to the Procurium PCI MP Core I/O card.
15
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Introduction
Detailed hp rp7405/rp7410 Description
Cell boards are accessed from the right side of the chassis behind a removable side cover.
Figure 1-11
Left-Rear View of hp rp7405/rp7410
System backplane
MP Core I/O MP/SCSIs
16
Chapter 1
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Unpacking the Server
Hewlett-Packard shipping containers are designed to protect their contents under normal shipping
conditions. After the equipment arrives, carefully inspect each carton for signs of shipping damage. A tilt
indicator is installed on each carton shipped. The beads in the indicator will roll to the upper position if the
container has been tilted to an angle that could cause equipment damage. The tilt indicator itself will have
two windows and each window under normal conditions will show four beads present. If a carton has been
mishandled, accidentally dropped, or knocked against something, the tilt indicator will indicate missing
beads. If damage is found, document the damage with photographs and contact the transport carrier
immediately.
Examine the server cabinet for visible shipping damage. After unpacking the cabinet, check for damage that
may have been obscured by the shipping container. If damage is found after visual inspection, document the
damage with photographs and contact the transport carrier immediately.
If the equipment has any damage, a damage claim form must be obtained by the customer from the shipping
representative. The customer should complete the form and return it to the shipping representative.
NOTE
The server may come already racked, or ready for rack installation.
Unpacking a Racked Server
This section contains information pertaining to unpacking the cabinet.
WARNING
Wear protective glasses while cutting the plastic bands around the shipping
container. These bands are under tension. When cut, they can spring back and cause
serious eye injury.
NOTE
Position the pallet allowing for enough space to roll the cabinet off the pallet before starting.
Remove the cabinet using the following procedure:
Step 1. Cut the polystrap bands around the shipping container.
Step 3. Remove the corrugated wrap from the pallet.
Step 4. Remove the packing materials.
18
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
CAUTION
The plastic wrapping material should be cut off rather than pulled off. Pulling the
plastic covering off represents an ESD hazard.
Figure 2-1 Removing the Polystraps and Cardboard
19
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Figure 2-3 Preparing to Roll Off the Pallet
WARNING
Make sure that the leveling feet on the rack are raised before you roll the
rack down the ramp and any time you roll the rack on the casters. Use
caution when rolling the cabinet off the ramp. A single server in the cabinet
weighs approximately 400 pounds. It is strongly recommended that two
people roll the cabinet off the pallet.
21
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Securing the Cabinet
Once in position, secure and stabilize the cabinet using the leveling feet at the corners of the base and install
the anti-tip mechanisms on the bottom front and rear of the rack.
Figure 2-4
Securing the Cabinet
Unpacking a Non-Racked Server
NOTE
Hewlett-Packard recommends the use of a lifter, such as a RONI Company model 17000 SP 400
install the lift handle panels provided with the system.
Unloading with a Lifter
Use the following procedure to unload the server from the pallet using a lifter.
WARNING
Use caution when using a lifter. Because of the weight of the server, it must be
centered on the lifter forks before raising it off the pallet to avoid injury.
Never extend more than one server from the same cabinet while installing or
servicing either an hp rp7405/rp7410 or another server product. Failure to follow
these instructions could result in the cabinet tipping over.
22
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Figure 2-5
RONI Lifter
Step 1. Follow the instructions on the outside of the server packaging to remove the banding and carton top
from the server pallet.
Figure 2-6 Server with Shipping Box Removed
Step 2. Remove all cartons from the pallet leaving only the server.
23
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Figure 2-7 Remove Cushions for Lift Access
Remove cushion
Remove cushion
Clearance for RonI lift is 28”x5”
Step 4. Insert the lifter forks under the server.
Step 5. Carefully roll the lift forward until it is fully positioned against the side of the server.
24
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Step 6. Slowly raise the server off the pallet until it clears the pallet cushions.
Figure 2-8 Raising a Server Off the Pallet
Step 7. Roll the lifter and server away from the pallet. Do not raise the server any higher than necessary
when moving it over to the rack.
Figure 2-9 Lifting the Server to the Rack
NOTE
If you are installing the system in a rack, refer to the hp J1530A Rack Integration Kit
Installation Guide.
25
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Unloading with Lift Handle Panels
WARNING
Use this procedure only if no Hewlett-Packard approved lift is available. This
procedure should only be attempted by two (2) authorized Hewlett-Packard service
people.
Before attempting this procedure, it is recommended that you first remove all Cell
Boards and AC power supplies. Instructions for removing these components can be
found in the Removal and Replacement chapter of the service manual. Check with
local safety regulations before attempting to move the system using the lift handle
panels.
Failure to observe these precautions can cause serious injury to personnel or
damage to equipment.
CAUTION
Unpack the server in an ESD safe environment. Observe all ESD safety precautions before
attempting this procedure. Failure to follow ESD safety precautions could result in damage to
the server.
Step 1. Remove both side covers. If present, remove the front panel.
Step 2. Locate lift handles and remove from storage plate.
Step 3. Orient lift handle panels such that when installed, the handles hang downward at 90 degrees and
lock in a horizontal position during lifting.
Figure 2-10 Positioning the Lift handles
26
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Step 4. With one handle in each hand, install the pin end of the panel into the backside of the front rack
mount ears on the chassis.
Figure 2-11 Inserting the Pins Into the Rack
Step 5. Pull the spring plunger out, move the handles apart and install the shoulder washer end of the
panel into the keyway feature.
Figure 2-12 Lift Handles Mounted
27
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Step 6. Continue to pull the handles apart until the spring plunger snaps into final position. The spring
plunger will drop down into the recess position.
Step 7. Check that the handles are secure by pressing the handles together and moving back and forth.
Check to see if lift handle panel breaks free of chassis.
Step 8. Repeat the steps above for the other handle
Step 9. To lift the server, rotate the handles 90 degrees to horizontal position.
NOTE
If you are installing the system in a rack, refer to the installation guide, hp J1530A,
rack installation kit (lower case intended).
Step 10. After moving the server, remove the lift handle panels from the chassis and reinstall the server
covers and front bezel. Refer to installation guide, hp J1530A, rack installation kit (lower case
intended).
Figure 2-13 Lifting the Server
Installing Server Into the Rack
Any hp rp7405/rp7410 server that is to be installed into a rack is shipped with equipment slides. With every
set of slides comes an installation guide: installation guide, hp J1530A, rack installation kit (lower case
intended). Follow the steps in this installation guide to determine where and how to place the server into the
rack.
28
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Installing the Cable Management Arm (CMA)
Once the server is installed in the rack, the CMA must be installed on the rear of the server. Follow the
instructions for installing the CMA can be found in the installation guide, hp J1530A, rack installation kit
(lower case intended).
Figure 2-14
Cable Management Arm
Cable Management Arm
Step 1. Attach CMA to the rack using T-25 Torx screws.
Figure 2-15 Attaching CMA to Rack
29
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Step 2. Attach the other end of the CMA to the server using the thumb screws that came with the CMA.
Figure 2-16 Attaching CMA to the Server
Installing Add-On Products
This section explains load orders and dependencies for add-on products. For physical installation procedures,
refer to that components replacement procedure in Chapter 4, “Removal and Replacement.”
If installing add-on products to an existing server, follow operating system backup and shutdown procedures
before powering off the server.
Cell Boards
The server requires at least one cell board to operate. Install the first cell board slot 1 (lower slot) and the
second cell board in slot 0 (upper). Cell Board 0 enables the PCI cards in Chassis 0 and Cell Board 1 enables
the PCI cards in Chassis 1.
MP Core I/O Cards
MP Core I/O consists of two cards that must be installed in pairs: the MP/SCSI and the LAN/SCSI.
The first (primary) set of MP Core I/O cards is installed as follows: MP/SCSI in MP/SCSI slot 1 (lower slot)
and LAN/SCSI in PCI slot 8 of Chassis 1 (from the rear, the extreme right-hand PCI slot).
The second set of MP Core I/O cards is installed as follows: MP/SCSI in MP/SCSI slot 0 and LAN/SCSI in PCI
slot 1 of Chassis 0. Cell Board 0 is required to enable the MP/SCSI slot 0 (upper slot) and LAN/SCSI slot 1 in
Chassis 0 (from the rear, the extreme left-hand PCI slot).
30
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Embedded Disks
The hp rp7405/rp7410 server can operate in the diskless (LAN boot) mode. If disks are to be installed, the top
two disks are driven by the primary MP Core I/O set. Install the first embedded disk in the top left location.
Install the second embedded disk in the top right location.
Figure 2-17
Embedded Disks
Drive 1-1
Path: 1/0/0/3/0.6
Drive 1-2
Path: 1/0/1/0/0/1/1.6
Drive 0-2
Path: 0/0/0/3/0.5
Drive 0-1
Path: 0/0/0/3/0.6
31
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Processors
Each cell board can hold up to four processors. Processor slots are numbered 0-3. Install processors in
ascending order: slot 0, 1, 2, and 3. It is not necessary to balance the number of processors across both cell
boards.
Figure 2-18
Cell Board (Two processors and CC Shown)
Cell Controller
Processor 3
Processor 2
Processor 1
Processor 0
DIMMs
Each cell board can hold up to four quads (or ranks) of DIMMs. A rank is a group of four DIMMs. Each DIMM
within a rank must be the same capacity. The slots within each rank are numbered a,b,c,d. Install DIMMs in
ascending order: rack 0, 1, 2 and 3. It is not necessary to balance the number of DIMMs across both cell
boards. For Example: one rank = slots 0a, 0b, 0c and 0d.
Valid Memory Configurations DIMMs must be loaded in sets of four at specific locations. For best
performance, loading sets of 8 DIMMs is recommended.
Table 2-1
DIMM Capacity
512 Mbyte
1G Byte
hp rp7405/rp7410 DIMMs
Total Capacity
16 GBytes
Memory Component Density
128 Mbit
32 Gbytes
256 Mbit
The hp rp7405/rp7410 is capable of supporting as little as 2 Gbytes of main memory using four 512 MByte
DIMMs and one cell board and as much as 32 Gbytes using all 16 DIMM slots on both cell boards with 1GB
DIMMs.
32
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Unpacking the Server
Different densities of main DIMMs can be mixed within a system, but each set of four DIMMs must be
identical. A set of DIMMs is defined as the group of four DIMMs that must be loaded together on a cell board.
Each cell board has four sets of DIMM slots, and they must be populated in order. Figure 2-19 shows the order
in which the DIMM slots must be populated.
Figure 2-19
DIMM Loading Sequence
Block 1 shows the minimum memory configuration per cell board. Each cell board, therefore, could have up to
four different density DIMMs (if there were that many), as long as each set of four are identical. Box 2 and
Box 4 show the more optimal memory configurations, because loading DIMMs in sets of eight takes
advantage of the pipelined structure of the memory interface of the CC.
33
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Connecting AC Input Power
Connecting AC Input Power
The hp rp7405/rp7410 has five line cord configurations:
•
•
•
•
•
All four line cords
Cords A0 and A1 only
Cords B0 and B1 only
Cords A0 and B0 only
Cords A1 and B1 only
A single-line-cord configuration is not allowed.
Figure 2-20 Power Cord Configuration
A0
A1
B0
B1
The power cord configuration is passed to the operating system using the pwrgrd(Power Grid) command.
Each of the five selections in the pwrgrdcommand matches one of the configurations. The appropriate option
should be selected for the actual line cord configuration. With the correct configuration selected, the LEDs
should be green. when the pwrgrd command is invoked, the following menu is displayed.
IMPORTANT Options 1 and 2 are for Hewlett-Packard internal use only. Do not select these options.
prompt> pwrgrd
Power grid configuration preference.
1. Grid A only (Cords A0,A1 required)
2. Grid B only (Cords B0,B1 required)
3. Grids A & B (Cords A0,A1,B0,B1 required)
4. Cords A0 & B0 only
5. Cords A1 & B1 only
Select Option:
34
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Connecting AC Input Power
If two separate power sources are available, the two power supplies can be plugged into the separate power
sources, increasing system reliability should one power source fail.
Figure 2-21
Power Source vs. Power Distribution
BPS 0
BPS 1
B1
A1
A0
B0
220 VAC*
220 VAC*
220 VAC*
220 VAC*
Rear of Cabinet
*180-269 VAC
WARNING
Voltage is present at various locations within the server whenever a power source is
connected. This voltage is present even when the main power switch is in the off
position. Failure to observe this warning could result in personal injury or damage
to equipment.
NOTE
System firmware will prevent boot when a single power cord configuration is detected.
35
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
MP Core I/O Connections
MP Core I/O Connections
Each hp rp7405/rp7410 can have up to two MP Core I/O board sets installed. This allows for two partitions to
be operating, or allows for MP Core I/O redundancy in a single partition configuration. Each MP Core I/O
board set consists of two boards: the MP/SCSI board and the LAN/SCSI board. The MP/SCSI board is
oriented vertically and accessed from the back of the server. The LAN/SCSI is accessed from the PCI
expansion card bay. Only the primary MP core I/O board set (MP/SCSI slot 1 & LAN/SCSI slot 8, Chassis 1) is
required for a single partition implementation. The secondary MP/SCSI board is not necessary for full
operation, however, without the secondary MP/SCSI board only two internal disks can be accessed.
MP/SCSI Connections
The MP/SCSI board is required to update firmware, access the console, turn partition power on/off, access all
but one of the internal peripherals, and utilize other features of the system.
Connections to the MP/SCSI board include the following:
•
DB25 Connector; via the M cable.
This RS232 connector provides connections for a local console, external modem, and a UPS. The server
end of the M cable terminates in a DB25 connector. The opposite side of the cable terminates in 3 DB9
connectors labeled CONSOLE, UPS, and REMOTE.
•
10/100 Base-T LAN RJ45 connector (for LAN and Web Console access).
This LAN uses standby power and is active when AC is present and the front panel power switch is off.
Internal LVD Ultra 160 SCSI channel for connections to internal mass storage.
Internal SE Ultra SCSI channel for connection to internal removable media device.
•
•
LAN/SCSI Connections
The LAN/SCSI board is a PCI form factor card that provides the basic external I/O connectivity for the
system.
Connections to the LAN/SCSI board include the following:
•
•
•
•
PCI-X to PCI-X Bridge for multi-device compatibility
Internal LVD Ultra 160 SCSI channel for connections to internal mass storage.
External LVD Ultra 160 SCSI channel connected to a 68-pin VHDCI connector
10/100/1000 Base-T LAN RJ45 connector.
The primary LAN interface is located on the LAN/SCSI board installed in the rightmost slot when viewing
the system from the back.
Management Processor Access
NOTE
In order to access the Management Processor for the initial installation, the M cable must first
be connected to the DB25 connector located on the Primary MP/SCSI board. The Primary
MP/SCSI board is located in the lower MP/SCSI board slot.
36
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
MP Core I/O Connections
Setting Up the CE Tool (PC)
The CE Tool is usually a laptop. It allows communication with the Management Processor (MP) in the hp
rp7405/rp7410. The MP monitors the activity of either a one partition or a multiple partition configuration.
During installation, communicating with the MP enables such tasks as:
•
•
•
Verifying that the components are present and installed correctly
Setting LAN IP addresses
Shutting down cell board power
Communication with the MP is established by connecting the CE Tool to the Local RS-232 port on the MP
Core I/O card.
Setting CE Tool Parameters
After powering on the CE Tool, ensure the communications settings are as follows:
•
•
•
•
8/none (parity)
9600 baud
na (Receive)
na (Transmit)
37
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
MP Core I/O Connections
If the CE Tool is a laptop using Reflection 1, check or change these communications settings using the
following procedure:
1. From the Reflection 1 Main screen, pull down the Connection menu and select Connection Setup.
2. Select Serial Port.
3. Select Com1.
4. Check the settings and change, if required.
Go to More Settings to set Xon/Xoff. Click OK to close the More Settings window.
5. Click OK to close the Connection Setup window.
6. Pull down the Setup menu and select Terminal (under the Emulation tab).
7. Select any HP terminal type.
Preferred types are HP70092, HP70096 or HP70094, HP70098, VT100.
8. Click Apply.
This option is not highlighted if the terminal type you want is already selected.
9. Click OK.
Connecting the CE Tool to the Local RS-232 Port on the MP
This connection allows direct communications with the MP. Only one window can be created on the CE
Tool to monitor the MP. When enabled, it provides direct access to the MP and any partition.
Use the following procedure to connect the CE Tool to the Local RS-232 Port on the MP:
1. Connect one end of a null modem cable (9-pin to 9-pin) (Part Number 5182-4794) to the M cable connector
labeled CONSOLE.
2. Connect the other end of the RS-232 cable to the CE Tool.
Standby Power and Logging in to the MP
After connecting the serial device, it is possible to login to the Management Processor (MP). Housekeeping
power (also known as standby power) is generated as soon as AC power is applied to the server. Because the
MP uses standby power, it is possible to login to the MP even when the power switch is in the OFF position.
The power switch is a DC power switch that controls +48v DC.
Before powering up the hp rp7405/rp7410 server for the first time:
1. Verify that the AC voltage at the input source is within specifications for each hp rp7405/rp7410 being
installed.
2. If not already done so, power on the serial display device.
The preferred tool is the CE tool running Reflection 1.
To power up the MP, set up a communications link, and login to the MP:
1. Connect the server to AC power.
38
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
MP Core I/O Connections
On the front of the hp rp7405/rp7410, a solid green Standby Power, a solid green MP Present, and a
flashing amber Attention light will illuminate after about 30 seconds.
Figure 2-22 Front Panel Display
2. Check the bulk power supply LED for each BPS.
When on, the breakers distribute power to the BPSs. AC power is present at the BPSs:
•
•
When power is first applied. Note the BPS LEDs will be flashing amber.
After 30 seconds has elapsed. Note the flashing amber BPS LED for each BPS becomes a flashing
green LED
Refer to power cord policies to interpret LED indicators.
3. Login to the MP:
a. Enter Adminat the login prompt. This term is case sensitive.
It takes a few moments for the MP prompt to appear. If it does not, make sure the laptop serial device
settings are correct: 8 bits, no parity, 9600 baud, and na for both Receive and Transmit. Then, try
again.
b. Enter Adminat the password prompt. This term is case sensitive.
39
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
MP Core I/O Connections
The MP Main Menu appears:
Figure 2-23 MP Main Menu
MP login: Admin
MP password:
Welcome to the
rp7410
Management Processor
(c) Copyright 1995-2001 Hewlett-Packard Co., All Rights Reserved.
MP MAIN MENU:
CO: Consoles
VFP: Virtual Front Panel
CM: Command Menu
CL: Console Logs
SL: Show chassis Logs
HE: Help
X: Exit Connection
MP>
Configuring LAN Information for the MP
To set the MP LAN IP address:
1. At the MP Main Menu prompt (MP>), enter cm. From the MP Command Menu prompt (MP:CM>), enter
lc(for LAN configuration).
The screen displays the default values and asks if you want to modify them. It is a good idea to write
down the information, as it may be required for future troubleshooting.
NOTE
If the Command Menu is not shown, enter qto return to the MP Main Menu, then enter cm
40
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
MP Core I/O Connections
Enter lcand press the Return key. The following screen appears:
Figure 2-24 The lc Command Screen
NOTE
The value in the “IP address” field has been set at the factory. The customer must provide
the actual LAN IP address.
2. At the prompt, Do you want to modify the configuration for the customer LAN?, enter y.
The current IP address is shown; then the following prompt appears: Do you want to modify it? (Y/[N])
3. Enter y.
4. Enter the new IP address.
The customer shall provide this address for network interface 0.
5. Confirm the new address.
6. Enter the MP Network name.
This is the host name for the customer LAN. The name can be as many as 64 characters, and include
alpha numerics, - (dash), _ (under bar),. (period), or a space. It is recommended that the name be a
derivative of the complex name. For example, Acme.com_MP.
7. Enter the LAN parameters for Subnet mask and Gateway address.
This information shall come from the customer.
8. Once step 7 is completed, the system will indicate the parameters have been updated and return to the
MP Command Menu prompt (MP:CM>)
9. To check the LAN parameters and status, enter the lscommand at the MP Command Menu prompt
(MP:CM>).
41
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
MP Core I/O Connections
10. A screen similar to the following will appear allowing verification of the settings:
Figure 2-25 The ls Command Screen
To return to the MP main menu, enter ma.
To exit the MP, enter xat the MP main menu.
Verifying Presence of the Cell Boards
To perform this activity, either connect to the management processor (MP) using a console or connect the CE
Tool (laptop) to the RS-232 Local port on the MP.
After login to the MP, verify that the MP detects the presence of all the cells installed in the cabinet. It is
important for the MP to detect the cell boards. If it does not, the partitions will not boot.
To determine if the MP detects the cell boards:
1. At the MP prompt, enter cm.
This displays the Command Menu. Among other things, the Command Menu allows one to view or modify
the configuration and/or look at utilities controlled by the MP.
To look at a list of the commands available, enter he. You may have to press Enter to see more than one
screen of commands. Use the Page Up and Page Down keys to view the previous or next screen of
commands. To exit the Help Menu, enter q.
2. From the command prompt (MP:CM>), enter du.
42
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
MP Core I/O Connections
The ducommand displays the MP Bus topology. A screen similar to the following appears:
Figure 2-26 The du Command Screen
3. There will be an asterisk (*) in the column marked MP.
4. Verify that there is an asterisk (*) for each of the cells installed in the cabinet, by comparing what is in the
Cells column with the cells physically located inside the cabinet.
Figure 5-9 shows that cells are installed in slots 0 and 1. In the cabinet, there should be cells physically
located in slots 0 and 1.
43
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Powering On the hp rp7405/rp7410 Server
Powering On the hp rp7405/rp7410 Server
After powering on the Management Processor (MP) (+3.3 V HKP), and checking that the MP detects the
presence of the cell boards, power up the server.
If using a LAN crossover cable with the laptop, review server activity for each partition configured, as it
powers up and boots. Windows can be opened for the complex and for each partition. It is recommended that
at least two windows be opened.
•
•
A window showing all activity in the complex. Following the installation procedure in this manual, will
have a window open already on the laptop.
To display activity for the complex:
1. If not already done, open a separate Reflection 1 window and connect to the MP.
2. From the MP Main Menu, select the VFPcommand with the soption.
A window showing activity for a single partition.
To display activity for each partition as it powers up:
1. Open a separate Reflection 1 window and connect to the MP.
2. Select the VFPcommand and choose the partition desired to view.
There should be no activity on the screen at this point in the installation process.
NOTE
More than one window cannot be opened using a serial display device.
To power on the server:
1. Switch the power switch at the front of the server to On. The following events occur:
•
•
•
•
•
Power is applied to the server.
Processor Dependent Code (PDC) starts to run on each cell.
Cell self test executes.
Hardware initializes for the server.
Console communication is established.
2. When activity on the Reflection 1 screen stops, return to the MP Main Menu by typing Ctrl-B.
3. Enter coto enter console mode.
4. Enter the partition number of the partition to boot.
5. Press Enter.
44
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Selecting a Boot Partition using the Management Processor
Selecting a Boot Partition using the Management Processor
At this point in the installation process, the hardware is set up, the Management Processor (MP) is connected
to the LAN, the AC and DC power have been turned on, and the selftest is completed. Now the configuration
can be verified.
After DC is powered on and the selftest is complete, use the MP to select a boot partition.
1. From the MP Main Menu, enter cm.
2. From the MP Command Menu, enter bo.
3. Select the partition to boot. Partitions may be booted in any order.
4. Return to the MP Main menu by typing mafrom the MP Command menu
5. Exit the MP by typing coat the MP Main Menu.
Exiting the MP should automatically bring you to the Boot Console Handler Main menu.
45
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Verifying the System Configuration using Boot Console Handler (BCH)
Verifying the System Configuration using Boot Console Handler
(BCH)
From the BCH main menu, type into go the Information Menu. Use the corresponding command from the
menu to verify the type and quantity of processors, memory and I/O cards:
•
•
•
PR (Processors)
ME (Memory)
IO (Check the PCI Device Information to determine if the values match the devices installed in the
server)
Once the parameters have been verified, use the ma command to return to the BCH Main Menu.
46
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Booting HP-UX using Boot Console Handler (BCH)
Booting HP-UX using Boot Console Handler (BCH)
If Instant Ignition was ordered, HP-UX will have been installed in the factory at the Primary Path address. If
HP-UX is at a path other than the Primary Path, use the pa(path) command (from the Configuration Menu)
to set boot path.
1. Main Menu: Enter command or Menu> co
2. Configuration Menu> pa pri xx/xx/xx
3. Configuration Menu> ma
Once the Primary Path has been set, use the bo(boot) command (from the Main Menu) to boot HP-UX.
1. Main Menu: Enter command or Menu> bo pri
2. The following prompt appears:
Do you wish to stop at the ISL prompt prior to booting (y/n)?
Enter n.
NOTE
If the partition fails to boot, or if the server was shipped without instant ignition, you may have
to boot from a DVD that contains the operating system and other necessary software.
47
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Installation
Booting HP-UX using Boot Console Handler (BCH)
48
Chapter 2
Download from Www.Somanuals.com. All Manuals Search And Download.
Troubleshooting
Common Installation Problems
Common Installation Problems
The following sections contain general procedures to help you locate installation problems.
CAUTION
Replace the top cover before operating the server, even for a short time. Otherwise, overheating
can damage chips, boards, and mass storage devices. However, you can safely remove the PCI
access panel while the server is running to remove and replace PCI hot-plug boards. For any
other service activity requiring access to the processor baseboard or I/O backplane, power down
the server and observe all safety precautions.
Most problems are the result of incorrect system and SCSI subsystem configurations.
To troubleshoot an installation problem, perform the following checks in the order given:
1. Check all cable and power connections, including those in the rack, etc.
2. Ensure the server is configured properly.
Check the Setup Utility. If the error is a network-related problem, determine if the server has enough
memory and hard disk drive capacity.
3. Verify all cables and boards are securely plugged into the appropriate connectors or slots.
4. Remove all extra options such as disk drives one at a time, checking its affect on the server.
5. Unplug the power cord, wait 20 seconds, plug the power cord in again, and restart the server.
6. If you suspect a hardware error, follow these steps:
a. Log users off the LAN and power down the server.
b. Extend the server out of the rack and remove the top cover.
c. Simplify the hp rp7405/rp7410 to the minimum configuration.
The minimum configuration consists of the following:
•
•
•
•
•
•
•
•
•
•
One cell
Two processors
One quad of memory DIMMS (size 256MB or larger)
One MP/SCSI card
One LAN/SCSI card
System Backplane
PCI Backplane
One BPS
Two PCI power modules
Two power cords.
7. Remove all third-party options, and reinstall each one, one at a time, checking the server after each
installation.
8. Replace the top cover and reconnect the power cord and other cables.
50
Chapter 3
Download from Www.Somanuals.com. All Manuals Search And Download.
Troubleshooting
Common Installation Problems
9. Boot the server and if it does not function properly, refer to the following procedures.
The Server Does Not Power On
Use these steps to check for power related problems:
1. Check each bulk power supply’s (BPS) LED.
The LED is located in the lower left hand corner of the power supply face. Table 3-2 shows the states of
the LEDs.
2. Check that the power supply and both power cords are plugged in to the chassis.
The Server Powers On But Then Shuts Down with a Fault Light
Use this checklist to check for the following problems when the server powers on and then off:
1. Check that a conductive item has not been dropped or left inside the server chassis.
2. Check the connections on all boards.
3. Check the system backplane for bent pins.
hp rp7405/rp7410 LED Indicators
The server has LEDs that indicate the health of the server. This section defines those LEDs.
Front Panel LEDs
There are seven LEDs located on the front panel.
Table 3-1
LED
Bulk Power Good
Front Panel LEDs
Driven By
State
Description
GPM
On Green
48V Good (LED works even if SP is not installed, or
installed and not active)
Off
48V Off
Standby Power Good GPM
On Green
3.3V SB Good (LED works even if SP is not
installed, or installed and is not active)
Off
3.3V Off
SP Active
Remote
GPM
On Green
Off
At least one SP is installed and Active
No SPs are installed or at least one is installed but
not active
SP via GPM
SP via GPM
On Green
Off
Dial-in (remote) console enabled
Dial-in (remote) console is disabled, or SP not
installed, or SP installed and not active
Attention
Flash Yellow Chassis log alert unread
Off No alert, or SP not installed, or SP installed and not
active
51
Chapter 3
Download from Www.Somanuals.com. All Manuals Search And Download.
Troubleshooting
Common Installation Problems
Table 3-1
LED
Front Panel LEDs (Continued)
Driven By
State
Description
Run
PDC/SP via
GPM
On Green
Off
One or more partition running
No partition running, or SP not installed, or SP
installed and not active
Fault
PDC/SP via
GPM
Flash Red
Off
One or more Partitions have reported a fault
No Partitions running, or SP not installed, or SP
installed and not active
Bulk Power Supply LEDs
There is a single three-color LED on each bulk power supply.
Table 3-2
BPS LEDs
LED Indication
Description
Blink Green
Green
BPS in standby state and no faults or warnings
BPS in run state (48 volt output enabled) and no faults or
warnings
Blink Yellow
Yellow
BPS in standby or run state and warning(s) present but no faults
BPS in standby state and recoverable fault(s) present but no
non-recoverable faults
Blink RED
Red
BPS state may be unknown, non-recoverable fault(s) present
Not Used (therefore BPS Failure)
Off
BPS state unknown, (therefore BPS Fault or Failure)
PCI Power Supply LEDs
There are three LEDs on the PCI power supply. Green and yellow LEDs follow OL* operation. A multi-color
LED reports warnings and faults.
Table 3-3
PCI Power Supply LEDs
LED
Driven By
Each Supply
State
Description
Power
On Green
All output voltages generated by the power
supply are within limits.
Off
Output voltages are turned off
Attention
SP via PCI LPM Yellow
52
Chapter 3
Download from Www.Somanuals.com. All Manuals Search And Download.
Troubleshooting
Common Installation Problems
Table 3-3
PCI Power Supply LEDs (Continued)
LED
Driven By
Each Supply
State
Description
Fault
Flash Yellow
The temperature within the power supply is
above the lower threshold.
On Yellow
Flash Red
The temperature of the power supply is
approaching the thermal limit
Power supply has shut down due to an over
temperature condition, a failure to regulate the
power within expected limits, or a
current-limit condition.
On Red
Off
Not Used
No Faults
System, Standby, and I/O Fan LEDs
There is a single three-color LED on each System, Standby, and I/O Fan.
Table 3-4
System, Standby, and I/O Fan LEDs
LED
Driven By
State
Description
Fan Status Fan
On Green
Normal
Flash Yellow Predictive Failure
Flash Red
Off
Failed
No Power
SINC POST LEDs
The four SINC POST LEDs (Green) display the current state of the SINC firmware.
Table 3-5
SINC POST LEDs
Driven By State
SINC
LED
Description
SINC POST
Off
3.3V SB Off
All On
SINC is reset or dead
SINC POST State
0x1-0xE
53
Chapter 3
Download from Www.Somanuals.com. All Manuals Search And Download.
Troubleshooting
Common Installation Problems
OL* LEDs
Table 3-6
OL* LEDs
Location
LED
Driven By
State
Description
Chassis Beside
Cell Board Power
Cell LPM
On Green
3.3V SB and Cell_Pwr_Good
Cell and On Cell
3.3V SB off, or 3.3V SB on and no
Cell_Pwr_Good
Cell Attention
PCI Slot Power
SP via GPM
LBA
Yellow
On Green
Off
Slot is powered
Slot is not powered
Normal
PCI OL* Board
PCI Slot Attention LBA
Off
Yellow
On Green
Off
Core is powered
Core is not powered
Normal
MP Core I/O
Panel
PCI Slot Power
LBA
PCI Slot Attention LBA
Off
Yellow
PCI/Cell LED OL*
Table 3-7
OL* LEDs States
State
Power
(Green)
Attention (Yellow)
Normal Operation (powered)
Fault Detected, power on
On
On
Off
Flashing
On
Slot Selected, power on, NOT Ready for OL* On
Power off or Slot Available
Fault Detected, power off
Ready for OL*
Off
Off
Off
Off
Flashing
On
MP Core I/O LEDs
The MP Core I/O LEDs are located on the MP Core I/O Panel.
Table 3-8 MP Core I/O LEDs
LED
Driven By
State
Description
Management Processor
Power Good
3.3SB
On Green
Off
3.3V SB is on
3.3V SB off
54
Chapter 3
Download from Www.Somanuals.com. All Manuals Search And Download.
Troubleshooting
Common Installation Problems
Table 3-8
MP Core I/O LEDs (Continued)
Driven By
LED
State
Description
Management Processor
Active
SP
On Green
Service Processor on this MP
Core I/O Board is managing box.
Off
Off
SP is not managing box.
SP is reset or off
Management Processor
POST
SP
0x1-0xF Green SP POST Code
MP LAN 100BT
MP LAN 10BT
SP LAN Controller
SP LAN Controller
SP LAN Controller
SP LAN Controller
On Green
On Green
On Green
On Green
SP LAN in 100BT Mode
SP LAN in 10BT Mode
SP LAN Link OK
MP LAN Link OK
MP LAN Activity
System SCSI Diffsense
System SCSI TermPower
SelfTest
SP LAN Data Activity
On=LVD, Off=Single Ended
Terminators are powered
Yellow during POST of failure
System SCSI Controller On Green
System SCSI Controller On Green
On Yellow
LAN/SCSI (PCI Slot) LEDs
The LAN/SCSI LEDs are located on the PCI Panel.
Table 3-9 LAN/SCSI LEDs
LED
Driven By
State
Description
System LAN 1000BT
System LAN 100BT
System LAN 10BT
System LAN Controller On Green
System LAN Controller On Green
System LAN Controller On Green
System LAN Controller On Green
System LAN Controller On Green
System LAN Controller On Green
System LAN in 1000BT Mode
System LAN in 100BT Mode
System LAN in 10BT Mode
System LAN link OK
System LAN Link OK
System LAN Activity
System LAN Full Duplex
System SCSI Diffsense
System LAN Data Activity
System LAN in full duplex mode
On=LVD, Off=Single ended
System SCSI
Controller
On Green
System SCSI TermPower
System SCSI
Controller
On Green
Terminators are powered
55
Chapter 3
Download from Www.Somanuals.com. All Manuals Search And Download.
Troubleshooting
Common Installation Problems
56
Chapter 3
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Shutting Down nPartitions and Powering Off Hardware Components
Shutting Down nPartitions and Powering Off Hardware Components
When you remove and replace hardware you may need to shut down one or more nPartitions on the server. In
some cases you also will need to power off hardware components as part of the remove and replace procedure.
This section gives details on how to ensure that an nPartition is properly shut down, and it also describes how
to power off (and power on) hardware components.
Shutting Down an nPartition
This procedure is for checking an nPartition’s boot status and, if needed, shutting down HP-UX on the
nPartition.
Step 1. Advise the customer that the system (one or more nPartitions) must be shut down for repairs.
Ensure that the customer has a current backup, and inform the customer of the anticipated
downtime.
Step 2. Login to the server’s service processor (MP).
Step 3. Use the Virtual Front Panel (VFP) to view the current state of the nPartition that you will shut
down.
From the MP Main menu, enter VFPto access the Virtual Front Panel menu, and select the
nPartition whose boot state you want to view.
Type Control-b (^B) to exit the VFP display.
•
If an nPartition has booted HP-UX, or if it is in the process of launching HP-UX, you must shut
down HP-UX on the nPartition.
When HP-UX is running on an nPar, its VFP displays “HP-UX heartbeat” with a blinking
asterisk (*) to indicate its interactivity.
In this case, proceed with the next step.
•
•
If the nPartition is at its Boot Console Handler (BCH) interface, then HP-UX has already been
shut down.
If the nPartition currently is booting, then you should wait for it to reach the BCH interface
and—if necessary—interrupt auto-boot when you see the “Attempting to boot” and “To
discontinue, press any key within 10 seconds” messages.
If the nPartition is at the BCH menu interface then HP-UX is shut down. Otherwise, proceed with
the next step to shut down HP-UX.
Step 4. From the MP Main menu, enter COand select the console for the nPartition you plan to shut down.
You should have access to the HP-UX login prompt (or command line) when using the nPartition’s
console. If you have no interactivity at the console, HP-UX may be halted or hung.
Step 5. At the nPartition’s console, login to HP-UX and shut down the operating system.
After making arrangements with the customer, issue the shutdowncommand to shut down and
halt HP-UX on the nPartition.
58
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Shutting Down nPartitions and Powering Off Hardware Components
For example, the shutdown -h 240command will shut down and halt HP-UX on the nPartition
after waiting for a grace period of four minutes (240 seconds).
To reboot the nPartition after it is halted, use the MP Command menu’s RScommand to restart the
nPartition. (This allows the nPartition to reset and boot to its BCH interface; if auto-boot is
configured it also boots HP-UX.)
Powering Off Hardware Components
This procedure is for powering off and powering on components that are to be removed and replaced.
Step 1. Login to the server’s service processor (MP).
Step 2. If the component you will power off is assigned to an nPartition, then use the Virtual Front Panel
(VFP) to view the current boot state of the nPartition.
HP-UX on the nPartition must be shut down before you power off any of the hardware assigned to
the nPartition.
Once you are certain the nPartition is not running HP-UX, you can power off components that
belong to the nPartition.
Refer to the procedure Shutting Down an nPartition for details on determining the nPartition boot
state and shutting down HP-UX.
Step 3. Access the MP Command menu.
From the MP Main menu enter CMto access the Command menu.
Step 4. Use the MP Command menu’s PScommand to check details about the hardware component you
plan to power off.
The PScommand enables you to check the status of the cabinet, system backplane, MP Core I/O,
PCI power domains — or bricks — in the I/O card cage, and cells.
Step 5. Use the MP Command menu’s PEcommand to power off the hardware component.
Using the PEcommand you can power on or off the cabinet (including all cells and I/O in the
cabinet), individual cells, or PCI power domains (bricks).
Using the Command menu’s PEcommand to manage cabinet power is equivalent to using the front
panel power switch.
Step 6. If you need to disable all power in the entire cabinet, you also must disconnect all power cords in
order to disable all housekeeping power.
NOTE
Ensure that all power cords are labeled to indicate which receptacle each cord plugs
into. Because of power redundancy capabilities it is important that each power cord
plugs into its proper receptacle.
Also, ensure that the cabinet power has been turned off before disconnecting any
power cords.
Step 7. Perform the hardware removal and replacement procedure for the powered off component.
Step 8. If needed, reconnect all power cords to the receptacles where they belong.
59
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Shutting Down nPartitions and Powering Off Hardware Components
Step 9. Use the MP Command menu’s PEcommand to power on the hardware component that you powered
off.
Step 10. Use the MP Command menu’s PScommand to confirm the status of the newly replaced component.
NOTE
You may need to allow time for some components to complete power on self tests
(POST) before a complete status is available.
60
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing the Top Cover
Removing and Replacing the Top Cover
It is necessary to remove and replace one or more of the covers to access the components within the server
chassis.
CAUTION
Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions could result in damage to the server.
Figure 4-1
Top Cover
61
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing the Top Cover
Removing the Top Cover
Figure 4-2
Top Cover Retaining Screws
Step 1. Loosen the retaining screws securing the cover to the rear of the chassis.
Step 2. Slide the cover toward the rear of the chassis.
Step 3. Lift the cover up and away from the chassis.
Replacing the Top Cover
Step 1. Slide the cover into position. It should easily slide into position; however, a slow firm pressure will
be needed to properly seat the cover.
Step 2. Tighten the retaining screws securing the cover to the chassis.
62
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a Disk Drive
Removing and Replacing a Disk Drive
The disk drives are located in the front of the chassis. The nPartition must be shutdown to remove or replace
the drive that serves as the boot disk. Refer to “Shutting Down nPartitions and Powering Off Hardware
Components” for more information. The remainder of the internal disk drives are hot pluggable.
CAUTION
Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions could result in damage to the server.
Figure 4-3
Disk Drive Location
63
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a Disk Drive
Removing a Disk Drive
Figure 4-4
Disk Drive Detail
Step 1. Disengage the front locking latch on the disk drive by pushing the release tab to the right and the
latch lever to the left.
Step 2. Pull forward on the front locking latch and carefully slide the disk drive from the chassis.
Replacing a Disk Drive
NOTE
Sometimes using the diskinfoand ioscancommands will produce encached data. To resolve
this, these commands should be run when the disk drive is removed.
Step 1. Before installing the disk drive, enter the following command:
#diskinfo -v /dev/rdsk/cxtxdx
Step 2. Enter the following command:
#ioscan -f
The response message after running this command is:
NO_HW
Step 3. Make sure the front locking latch is open, then position the disk drive in the chassis.
Step 4. Slide the disk drive into the chassis; a slow firm pressure will be needed to properly seat the
connection.
Step 5. Depress the front locking latch to secure the disk drive in the chassis.
Step 6. Spin up the disk by entering one of the following commands:
#diskinfo -v /dev/rdsk/cxtxdx
#ioscan -f
64
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a Disk Drive
#pvcreate
#vgcfgrestore
65
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a CD/DVD Drive
Removing and Replacing a CD/DVD Drive
The CD/DVD is located in the front of the chassis. The system power to this component must be removed
before attempting to remove or replace it. Refer to “Shutting Down nPartitions and Powering Off Hardware
Components” for more information.
CAUTION
Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions could result in damage to the server.
Figure 4-5
CD/DVD Location
CD/DVD
66
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a CD/DVD Drive
Removing a CD/DVD Drive
Figure 4-6
CD/DVD Detail
Step 1. To remove the CD/DVD, depress the front locking latch to loosen the drive from the chassis.
Step 2. Disengage the cables from the rear of the CD/DVD.
Step 3. Slide the drive from the chassis.
67
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a CD/DVD Drive
Replacing a CD/DVD
Figure 4-7
CD/DVD Detail
Step 1. Connect the cables to the rear of the CD/DVD.
Step 2. Slide the drive in the chassis.
CAUTION
Before attempting to install the drive into the chassis, position the data cable over
the top of the drive in order to avoid pinching the cable during installation.
Step 3. The drive easily slides into the chassis; however, a slow firm pressure is needed to properly seat the
drive.
Step 4. Depress the front locking latch to secure the disk drive in the chassis.
68
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a Front Smart Fan Assembly
Removing and Replacing a Front Smart Fan Assembly
The Front Smart Fan Assembly is located in the front of the chassis. The fan assembly is a hot swappable
component.
CAUTION
Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions could result in damage to the server.
Figure 4-8
Front Smart Fan Assembly Locations
FAN 1
FAN 0
Front View
LED
LED
Table 4-1
Front Smart Fan Assembly LED Indications
Meaning
LED
State
On Green
Fan is at speed and in sync or not at speed less than 6 seconds
Flash
Fan is not keeping up with speed/sync pulse for greater than 6 seconds
Yellow
Flash Red
Off
Fan failed/stalled or has run slow or fast for greater than 6 seconds
Fan is not installed or no power is applied to fan
69
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a Front Smart Fan Assembly
Removing a Front Smart Fan Assembly
Figure 4-9
Front Fan Detail
Step 1. Push the Fan Release Pin away from the fan.
Step 2. Slide the fan away from the connector.
Step 3. Pull the fan away from the chassis.
Replacing a Front Smart Fan Assembly
Step 1. Position the fan assembly on the chassis fan guide pins.
Step 2. Slide the fan into the connector.
Step 3. Verify that the Fan Release Pin is in the locked position.
NOTE
The fan LED should show fan is operational (green).
70
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a Rear Smart Fan Assembly
Removing and Replacing a Rear Smart Fan Assembly
The Rear Smart Fan Assembly is located in the rear of the chassis. The Fan assembly is a hot swappable
component.
CAUTION
Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions could result in damage to the server.
Figure 4-10
Rear Smart Fan Assembly Locations
FAN 2
FAN 3
Rear View
LED
LED
Table 4-2
Rear Smart Fan Assembly LED Indications
Meaning
LED
State
On Green
Fan is at speed and in sync or not at speed less than 6 seconds
Flash
Fan is not keeping up with speed/sync pulse for greater than 6 seconds
Yellow
Flash Red
Off
Fan failed/stalled or has run slow or fast for greater than 6 seconds
Fan is not installed or no power is applied to fan
71
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a Rear Smart Fan Assembly
Removing a Rear Smart Fan Assembly
Figure 4-11
Rear Fan Detail
Step 1. Push the Fan Release Pin away from the fan.
Step 2. Slide the fan away from the connector.
Step 3. Pull the fan away from the chassis.
Replacing a Rear Smart Fan Assembly
Step 1. Carefully position the fan assembly on the chassis fan guide pins.
Step 2. Slide the fan into the connector.
Step 3. Verify that the Fan Release Pin is in the locked position.
NOTE
A green fan LED indicates the fan is operational.
72
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a PCI Smart Fan Assembly
Removing and Replacing a PCI Smart Fan Assembly
The PCI Smart Fan Assembly is located in the rear of the PCI cardcage. The Fan assembly is a hot swappable
component.
CAUTION
Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions could result in damage to the server.
Figure 4-12
PCI Smart Fan Assembly Location
Table 4-3
Smart Fan Assembly LED Indications
Meaning
LED
State
On Green
Fan is at speed and in sync or not at speed less than 6 seconds
Flash
Fan is not keeping up with speed/sync pulse for greater than 6 seconds
Yellow
Flash Red
Off
Fan failed/stalled or has run slow or fast for greater than 6 seconds
Fan is not installed or no power is applied to fan
73
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a PCI Smart Fan Assembly
Removing a PCI Smart Fan Assembly
Figure 4-13
PCI Smart Fan Assembly Detail
Step 1. Securely grasp the two thumb holds on the fan assembly.
NOTE
The two right side fans, as viewed from the front, are located very close to the
chassis. It may be necessary to use a tool such as a flatblade screwdriver to assist in
removing them.
Step 2. Slide the fan upward from the chassis.
Replacing a PCI Smart Fan Assembly
Step 1. Carefully position the fan assembly in the chassis.
Step 2. The fan easily slides into the chassis; however, a slow firm pressure will be needed to properly seat
the connection.
NOTE
A green fan LED indicates the fan is operational.
74
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a Bulk Power Supply
Removing and Replacing a Bulk Power Supply
The bulk power supply is located in the front of the chassis. The BPS is a hot swappable component.
CAUTION
Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions could result in damage to the server.
Figure 4-14
BPS Location
BPS Locations
IMPORTANT When a BPS is pulled from the server and then immediately re-inserted, the server can report
an overcurrent condition and shut down.
75
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a Bulk Power Supply
Removing a BPS
Figure 4-15
BPS Detail
Step 1. Pull the extraction levers located on the upper front outer portion of the BPS.
Step 2. Slide the BPS forward using the extractions levers to remove it from the chassis.
Replacing a BPS
Step 1. Verify that the extraction levers are in the open position, then insert the BPS into the empty slot.
NOTE
The BPS easily slides into the chassis; however, a slow firm pressure will be needed
to properly seat the connection.
Step 2. Ensure the BPS has seated by closing the extraction levers.
NOTE
BPS LED should show BPS operational and no fault. BPS LED should be GREEN.
76
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a PCI Power Module (Brick)
Removing and Replacing a PCI Power Module (Brick)
The PCI power module is located in the front of the chassis. The PCI power module is a hot pluggable
component.
CAUTION
Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions could result in damage to the server.
Figure 4-16
PCI Power Module Location
PCI Power Modules
Table 4-4
PCI Power Module LED Indications
LED
LED State
Meaning
Power LED (Green)
Off
On
Off
Power module failure
Normal operation
Normal operation
Fault LED (Multi-color)
Blink amber Module internal failure
Amber
Module internal failure
Module internal failure
Bink red
77
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a PCI Power Module (Brick)
Removing a PCI Power Module (Brick)
Figure 4-17
PCI Power Module Detail
Step 1. Securely grasp the handle on the front of the power module.
Step 2. Firmly depress the securing thumb latch.
Step 3. Slide the module from the chassis.
Replacing a PCI Power Module (Brick)
Step 1. Carefully position the power module in the chassis and depress the thumb latch.
Step 2. The module easily slides into the chassis; however, a slow firm pressure will be needed to properly
seat the connection.
Step 3. Release the thumb latch.
NOTE
PCI power module LED should show power module is operational and the green LED
should be on.
78
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing the PCI Voltage Regulator Modules
Removing and Replacing the PCI Voltage Regulator Modules
Removing PCI VRM
Step 1. Power down server.
IMPORTANT Power must be removed from both PCI Chassis 0 and PCI Chassis 1 to continue.
Step 2. Remove right side cover.
Step 3. Remove PCI side panel.
Step 4. Identify VRM to be replaced (O or 1).
Step 5. Unscrew VRM from bracket (2 screws on non-component side).
Step 6. Lift up and gently pull from the socket.
Figure 4-18
Locating the VRMs on PCI Backplane
VRM 1
VRM 0
Replacing the PCI VRM
Step 1. Firmly seat the VRM into the socket being careful not to bend pins.
Step 2. Attach bracket to VRM using 2 screws removed earlier.
Step 3. Put PCI side panel back onto chassis.
79
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing the PCI Voltage Regulator Modules
Step 4. Put right side cover back onto chassis.
Step 5. Power server back up.
80
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a PCI Card
Removing and Replacing a PCI Card
The PCI cards are located in the rear of the chassis in the PCI card cage. PCI cards are hot swappable
components.
CAUTION
Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions could result in damage to the server.
Figure 4-19
PCI Cards
Removing and Replacing a PCI Card
You can remove and replace a PCI I/O card by using the SAM (/usr/sbin/sam) application or by using
Partition Manager (/opt/parmgr/bin/parmgr).
This procedure describes how to perform an online replacement of a PCI card using SAM, for cards whose
drivers support online add or replacement (OLAR).
IMPORTANT Some PCI I/O cards cannot be added or replaced online (while HP-UX remains running). For
these cards, you must shut down HP-UX on the nPartition before performing the card
replacement or addition. See “Shutting Down nPartitions and Powering Off Hardware
Step 1. Run SAM (/usr/sbin/sam) and from the main SAM Areas screen select the Peripheral Devices area,
then select the Cards area.
Step 2. From the I/O Cards screen, select the card you will replace and then select the Actions—>Replace
menu item.
81
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a PCI Card
Step 3. Wait for SAM to complete its critical resource analysis for the selected card and then review the
analysis results.
If no critical resources will be disabled by taking the selected card offline then click the OK button
to suspend the card’s driver and power off the card’s PCI slot, and then proceed with the next step.
If SAM detected that the selected PCI card cannot be taken offline, you will not be able to click the
OK button and cannot replace the card while HP-UX remains running. In this case, you must shut
down HP-UX on the nPartition before replacing the defective card.
Step 4. Locate the PCI slot where the selected card resides.
On the server, you can view the PCI slots and slot LEDs from the rear of the cabinet.
The selected slot will be powered off (its green power LED will be off), and the slot’s amber
attention indicator (a dark orange yellow LED) will be blinking.
Step 5. Label and remove the cable(s) connected to the PCI card to be removed.
Step 6. Remove the top cover.
Step 7. Flip the card slot’s PCI gate to the open position.
Figure 4-20PCI Gate Detail
Step 8. Firmly pull up on the tabs on the PCI card separator.
Step 9. Remove the card from the PCI slot.
Note that the card is defective, for future reference.
Step 10. Position the new, replacement PCI card in the slot.
NOTE
A slow firm pressure is needed to properly set the card into its connection. PCI cards
tend to be difficult to install.
Step 11. Flip the card slot’s PCI gate to the closed position.
Step 12. Replace the top cover.
82
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a PCI Card
Step 13. Connect all cables to the replacement PCI card.
Step 14. In SAM’s Replace Card window, click the OK button.
SAM powers the PCI slot back on, and turns off (stops blinking) the slot’s attention indicator. SAM
also resumes the card’s drivers.
Step 15. Confirm that the replacement card is online and powered in, using SAM’s I/O Cards screen.
Step 16. Synchronize the PDH and I/O card SCSI parameters.
1. When powering up system, go into CO (console window). When POST finishes running, the
system displays the Main Menu (the system is at BCH at this point in time).
2. From the Main Menu enter ser. This takes you to the Service Menu.
3. At the Service Menu prompt enter scsi default. The system then informs you that it will
clear (reset) all scsi paths and prompts you to enter either Yesor No.
4. Enter y. The system takes a few seconds to reset the scsi ports, list all the ports with the reset
values, then displays the Service Menu prompt.
5. Reboot the system.
83
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing the Mass Storage Backplane
Removing and Replacing the Mass Storage Backplane
Removing the Backplane
Step 1. Remove all internal disks.
Figure 4-21Locating Internal Disks
Drive 1-1
Drive 1-2
Drive 0-2
Drive 0-1
Step 2. Remove the top and right side covers.
Step 3. Remove the PCI side panel.
Step 4. Disconnect all cables to the backplane.
84
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing the Mass Storage Backplane
Ensure that you notice where each is removed, so that they may be correctly reinstalled.
Figure 4-22Locating the Mass Storage Backplane
Mass Storage Backplane
Step 5. Unscrew the two captive screws and remove backplane/bracket assembly.
Figure 4-23Mass Storage Backplane
Captive Screws
85
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing the Mass Storage Backplane
Replacing the Backplane
Step 1. Align and press the backplane/bracket assembly into its mount.
Step 2. Fasten the two captive screws.
Step 3. Connect all cables to the backplane.
Step 4. Install the PCI side panel.
Step 5. Install the top and right side covers.
Step 6. Install all internal disks.
86
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a MP/SCSI Board
Removing and Replacing a MP/SCSI Board
The MP/SCSI board is located in the rear of the chassis. The MP/SCSI board is a hot pluggable component.
There may be up to two MP/SCSI boards installed in a system.
CAUTION
Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions could result in damage to the server.
Figure 4-24
MP/SCSI Location
87
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Removal and Replacement
Removing and Replacing a MP/SCSI Board
Removing a MP/SCSI board
Figure 4-25
MP/SCSI Detail
MP for Cell 0
MP for Cell 1
(Partition 0)
Step 1. Label and remove all cables connected to the MP/SCSI board to be removed.
Step 2. Loosen the two retaining screws securing the MP/SCSI board to the chassis.
Step 3. Securely grasp the handle on the MP/SCSI board.
Step 4. Slide the MP/SCSI board from the chassis.
Replacing a MP/SCSI Board
Step 1. Position the MP/SCSI board in the chassis.
Step 2. The board slides easily into the chassis; however, a slow firm pressure will be needed to properly
seat the connection.
Step 3. Tighten the two retaining screws securing the MP/SCSI board to the chassis.
88
Chapter 4
Download from Www.Somanuals.com. All Manuals Search And Download.
Replaceable Parts
Table A-1
hp rp7405/rp7410 Field Replaceable Unit (FRU) List
Replacement Part
Exchange Part
Number
FRU Description
Number
18GB 10K RPM SCSI Disk
1GB DIMM (single)
A6537-67001
A6098AX
A6537-69001
A6098-69001
None
240V N. American UPS 4.5m C19/L6-30P
256MB DIMM (single)
8120-8494
A6802AX
A6802-69001
A6541-69001
A6097-69001
A6539-69001
None
36GB 15K RPM SCSI Disk
512MB DIMM (single)
A6541-60001
A6097AX
73GB 10K RPM SCSI Disk
AC cord retention bracket
AC Power Supply (qty 2 per system)
Adaptor, SCSI
A6539-60001
A6752-00123
0950-4173
A6752-69013
None
A6093-00239
A6752-67042
A6094AX
Anti-tip Foot
None
Assembly, Cell/PDH Riser
Assembly, Cover, Left Side
Assembly, Cover, Right Side
Assembly, Cover, Top
A6094-69003
None
A6752-67034
A6752-67033
A6752-67035
A6752-04003
A6752-67037
5065-5959
None
None
Assembly, Front Bezel
None
Assembly, Front Panel Plastic
Assembly, Interlock Device
Assembly, Lift handle, left panel
Assembly, Lift handle, right panel
Assembly, PCI Card Cage
Assembly, PCI OLR
None
None
A6752-04045
A6752-04048
A6752-67014
A6093-67014
A6093-40041
5065-7443
None
None
A6752-69014
None
Assembly, PCI OLR Paddle
Assembly, PCI Separator (W/Light Pipe)
Assembly, Slide rail, left
None
None
A6752-04058
A6752-04059
A6752-67029
A6752-67030
None
Assembly, Slide rail, right
Assembly, Smart Fan (Front/Rear) (qty 4)
Assembly, Smart Fan (PCI C/C) (qty 6)
None
None
None
90
Appendix A
Download from Www.Somanuals.com. All Manuals Search And Download.
Replaceable Parts
Table A-1
hp rp7405/rp7410 Field Replaceable Unit (FRU) List (Continued)
Replacement Part
Number
Exchange Part
Number
FRU Description
Assembly, Front Bezel, No NamePlate
Ballast, J1479 (1 per system)
Box, DVD Filler
A6752-04066
J1479-60001
A6752-67041
5065-5951
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Cable Management Arm
Cable, DVD Power
A6752-67021
A6093-63025
A6752-67019
A6752-67020
A6752-63027
A6752-63019
A6752-67022
A6752-67023
0950-4352
Cable, Intrusion Switch
Cable, Mass Storage Power #1
Cable, Mass Storage Power #2
Cable, PCI OLR Switch
Cable, SCSI Bundle
Cable, System Fan, External
Cable, System Fan, Internal
DC-to-DC Converter, 48V (PCI VRM)
Filler, Bulkhead Core I/O
Filler, Internal Disk
A6752-04017
A6198-60002
A6752-67025
5040-6317
Harness, Main Power
Intrusion Switch
Jumper, PDU-PDU 2.5m C19/C20
Jumper, UPS-PDU 4.5m C19/C20
Kit, Removable Media Rail
M-Cable
8120-6884
8120-6961
A6752-67011
A6144-63001
A7111-40001
A6752-40002
A6752-67036
A6752-67005
Nameplate, rp7405
Nameplate, rp7410
Panel, PCI, Upper Right Side
None
None
a
PCA, Front Panel (Display)
PCA, LAN/SCSI (Procurium)
PCA, Mass Storage Backplane
PCA, MP/SCSI (Core IO)
PCA, System Backplane
A6794AX
A6794-69001
None
A6752-67003
A6793AX
A6793-69001
A6752-69001
A6752-60001
91
Appendix A
Download from Www.Somanuals.com. All Manuals Search And Download.
Replaceable Parts
Table A-1
hp rp7405/rp7410 Field Replaceable Unit (FRU) List (Continued)
Replacement Part
Number
Exchange Part
Number
FRU Description
PCI Filler Plate
5001-6892
0950-3819
8120-6899
8121-0070
None
PCI Power Module (Brick)
A6093-69023
None
Power Cord, C19/CEE 7-7 4.5m Black CA Assembly
Power Cord, C19/GB 1002 4.5m Black CA Assembly
None
Power Cord, C19/IEC-309 L6-20 4.5m Black CA Assembly 8120-6897
None
Power Cord, C19/ISI-32 2.5m Black CA Assembly
Power Cord, C19/L6-20 4.5m Black CA Assembly
Power Cord, C19/unterminated International-Europe
Processor Module (650 MHz)
8121-0161
8120-6903
8120-6895
A6443AX
None
None
None
A6443-69001
A6444-69001
A6435-69001
C5686-69203
None
Processor Module (750 MHz)
A644AX
Processor Module (875 MHz)
A6435-67001
C5686-67203
A5220-67003
1253-0703
A6752-04002
Removable DAT Tape Drive (DDS4)
Removable DVD Drive
Socket, PCX-W
None
VAC Value Added Chassis
None
a. Cable assembly is part of the FRU.
92
Appendix A
Download from Www.Somanuals.com. All Manuals Search And Download.
System Specifications
Dimensions and Weights
Dimensions and Weights
This section provides dimensions and weights of the system components.
Table B-1
hp rp7405/rp7410 Server Dimensions and Weights
Standalone
Packaged
Height - Inches (centimeters)
Width - Inches (centimeters)
Depth - Inches (centimeters)
Weight - Pounds (kilograms)
17.3 (43.9)
17.5 (44.4)
30.0 (76.2)
220 (100)
35.75 (90.8)
28.0 (71.1)
28.38 (72.0)
N./A
Shipping box, pallet, ramp, and container adds approximately 50 lbs to the total system weight. The size and
number of miscellaneous pallets will be determined by the equipment ordered by the customer.
Table B-2
hp rp7405/rp7410 Component Weights
Description Weight (lb/kg.)
Cell board
Quantity
1 or 2
19.81(9.0)
1
1
2
1
2
System backplane
12 (estimate) 5.44 (estimate)
20.4 (9.25)
PCI backplane
Bulk power supply
Mass storage backplane
PCI DC-to-DC converters
18 (8.2)
1 (0.45)
5 (2.27)
94
Appendix B
Download from Www.Somanuals.com. All Manuals Search And Download.
System Specifications
Electrical Specifications
Electrical Specifications
This section provides electrical specifications for hp rp7405/rp7410 servers.
Grounding
The site building shall provide a safety ground/protective earth for each AC service entrance to all cabinets.
Install a PE (protective earthing) conductor that is identical in size, insulation material, and thickness to the
branch-circuit supply conductors. The PE conductor must be green with yellow stripes. The earthing
conductor described is to be connected from the unit to the building installation earth or, if supplied by a
separately derived system, at the supply transformer or motor-generator set grounding point.
Circuit Breaker
The Marked Electrical for the hp rp7405/rp7410 server is 12 amps. The recommended circuit breaker size is
20 amps for North America. For countries outside North America, consult your local electrical authority
having jurisdiction for the recommended circuit breaker size.
System AC Power Specifications
Power Cords
The supplied power cord length is 15 feet (457.4 cm). Table B-3 lists the various power cables available for use
with a hp rp7405/rp7410 system. Each power cord is 15 feet (4.5 meters) in length with a IEC 60320-1 C19
female connector attached to one end.
Table B-3
Power Cords
Part Number
Description
Where Used
8120-6895
8120-6897
8121-0070
8120-6899
8121-0558
8120-6903
Stripped end, 240 volt
Male IEC309, 240 volt
Male GB-1002, 240 volts
Male CEEE 7/7, 240 volt
Male ISI-32, 240 volts
Male NEMA L6-20, 240 volt
International-Europe
International
China
Continental Europe
Israel
North America/Japan
95
Appendix B
Download from Www.Somanuals.com. All Manuals Search And Download.
System Specifications
Electrical Specifications
System Power Specifications
Table B-4 and Table B-5 list the AC power requirements for an hp rp7405/rp7410 server. These tables provide
information to help determine the amount of AC power needed for your computer room.
Table B-4
AC Power Specifications
Requirements
Value
Comments
Nominal input voltage
200, 208, 220, 240 VAC
180 VAC
Minimum Operating Voltage
Maximum Operating Voltage
269 VAC
Frequency range (minimum -
maximum)
50 - 60 (Hz)
Number of phases
1
Rated line current
12 A rms
Maximum inrush current
30 A peak for 15 ms
20 ms
Per line cord
Dropout carry-through time at
minimum line voltage
Circuit breaker rating
20 A
Per line cord
Branch Circuit Breaker (Size,
Type)
20A, slow trip delay
type
Power factor correction
>0.97 @269VAC
>0.93 @262VAC
At all loads of 50% - 100% of
supply rating
At all loads 0f 30% - 50% of
supply rating
Ground leakage current (mA)
kVA rating
<3.0 (ma)
2.7 KVA
Per line cord
Table B-5
System Power Requirements
Power Required (50 - 60 Hz)
VA
Comments
Maximum configuration hp rp7405/rp7410 server PA8700
Typical configuration hp rp7405/rp7410 server PA8700
3000
1700
Theoretical
Typical
Future upgrades may increase the Maximum Theoretical System Power to 3400 VA.
Maximum power is the sum of the worst case power consumption of every subsystem in the box, and should
be used to size worst case power consumption for facility installation. Typical power consumption numbers
are what HP engineers have measured running power intensive applications. These are generally lower than
maximum power numbers due to the fact that getting all of the subsystems in the box to simultaneously draw
maximum power for long durations being uncommon.
96
Appendix B
Download from Www.Somanuals.com. All Manuals Search And Download.
System Specifications
Environmental Specifications
Environmental Specifications
This section provides the environmental, power dissipation, noise emission, and air flow specifications for the
hp rp7405/rp7410 server.
Temperature and Humidity
The cabinet is actively cooled using forced convection in a Class C1-modified environment.
Operating Environment
The system is designed to run continuously and meet reliability goals in an ambient temperature of 5° C - 35°
C at sea level. The maximum allowable temperature is derated 1° C per 1000 feet of elevation above 5000 feet
above sea level up to 30° C at 10,000 feet. For optimum reliability and performance, the recommended
operating range is 20° C to 25° C
Environmental Temperature Sensor
To ensure that the system is operating within the published limits, the ambient operating temperature is
measured using a sensor placed near the chassis inlet, between the cell boards. Data from the sensor is used
to control the fan speed and also to initiate system overtemp shutdown. (For more details see the platform
management section.)
Non-Operating Environment
The system is designed to withstand ambient temperatures between -40° C to 70° C under non-operating
conditions.
Cooling
Cell Section Cooling
The cabinet incorporates front to back airflow across the cell boards and system backplane. Two (2) 150mm
fans, mounted externally on the front chassis wall behind the cosmetic front bezel, push air into the Cell
section; and two (2) 150mm fans housed in cosmetic plastic fan carriers and mounted externally to the rear
chassis wall, pull air through the Cell section.
Each cell area fan cooling is controlled by a smart fan control board, embedded in the fan module plastic
housing. The smart fan control board receives fan control input from the system fan controller on the system
backplane and returns fan status information to the system fan controller. The smart fan control board also
controls the power and the pulse width modulated control signal to the fan and monitors the speed indicator
back from the fan. The fan status LED is driven by the smart fan control board.
Bulk Power Supply Cooling
Cooling for the bulk power supplies is provided by two (2) 60mm fans contained within each BPS. Air flows
into the front of the BPS and is exhausted out of the top of the power supply though upward facing vents near
the rear of the supply. The air is then ducted out of the rear of the chassis with minimal leakage into the cell
airflow plenum.
97
Appendix B
Download from Www.Somanuals.com. All Manuals Search And Download.
System Specifications
Environmental Specifications
PCI/Mass Storage Section Cooling
Six (6) 92mm fans located between the Mass Storage Devices and the PCI Card Cage provide airflow through
these devices. The PCI fans are powered off of housekeeping power and + run at full speed at all times. The
air is pulled through the mass storage devices and pushed through the PCI Card Cage. Perforation is
provided between the PCI bulkheads to allow adequate exhaust ventilation and to help reduce the localized
airflow dead spots that typically occur at the faceplate tail of each PCI card.
Standby Cooling
Several components within the chassis consume significant amounts of power while the system is in standby
mode. The system fans will be run at 1541 rpm, or 38% of full speed, during standby to remove the resulting
heat from the cabinet. The fans within the power supply will operate at full speed during standby.
Typical Power Dissipation and Cooling
Table B-6
Typical hp rp7405/rp7410 Configurations
PCI Cards
Memory
Per Cell
Board
Hard
Disk
Drives
Bulk
Power
Supplies
Cell
Boards
(assumes
10 watts
each)
Core
I/O
Typical
Power
Typical
Cooling
DVDs
Qty
Qty
GBytes
Qty
Qty
Qty
Qty
Watts
Watts
2
2
2
1
16
8
16
2
4
2
2
2
2
2
2000
1810
1757
1148
6826
6179
5998
3919
8
8
8
0
0
0
2
2
1
2
2
1
4
4
Acoustic Noise Specification
The acoustic noise specification for the hp rp7410 server is 57.3 db (sound pressure level at bystander
position) It is appropriate for dedicated computer room environments, not office environments. The LwA is 7.5
Bels. Care should be taken to understand the acoustic noise specifications relative to operator positions
within the computer room or when adding servers to computer rooms with existing noise sources.
Air Flow
The hp rp7405/rp7410 servers require that the cabinet air intake temperature be between 68° F and 77° F
(20° C and 25° C) at 960 CFM.
98
Appendix B
Download from Www.Somanuals.com. All Manuals Search And Download.
System Specifications
Environmental Specifications
Figure B-1 illustrates the location of the inlet and outlet airducts on a single cabinet.
Figure B-1
Airflow Diagram
99
Appendix B
Download from Www.Somanuals.com. All Manuals Search And Download.
System Specifications
Environmental Specifications
100
Appendix B
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Electrical Considerations
Electrical Considerations
Proper design and installation of a power distribution system for an hp rp7405/rp7410 server requires
specialized skills. Those responsible for this task must have a thorough knowledge and understanding of
appropriate electrical codes and the limitations of the power systems for computer and data processing
equipment.
In general, a well-designed power distribution system exceeds the requirements of most electrical codes. A
good design, when coupled with proper installation practices, produces the most trouble-free operation.
The electrical factors discussed in this section are:
A detailed discussion of power distribution system design and installation is beyond the scope of this
document. However, electrical factors relating to power distribution system design and installation must be
considered during the site preparation process.
•
•
•
•
•
Computer room safety
Electrical load requirements (circuit breaker sizing)
Power quality
Distribution hardware
System installation guidelines
102
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Electrical Load Requirements (Circuit Breaker Sizing)
Electrical Load Requirements (Circuit Breaker Sizing)
It is always a good idea to derate power distribution systems for one or more of the following reasons:
•
To avoid nuisance tripping from load shifts or power transients, circuit protection devices should never be
run above 80% of their root-mean-square (RMS) current ratings.
•
Safety agencies derate most power connectors to 80% of their RMS current ratings.
103
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Power Quality
Power Quality
This equipment is designed to operate over a wide range of voltages and frequencies. It has been tested and
shown to comply with EMC Specification EN50082. However, damage can occur if these ranges are exceeded.
Severe electrical disturbances can exceed the design specifications of the equipment.
Sources of Electrical Disturbances
Electrical disturbances, sometimes called glitches, affect the quality of electrical power. Common sources of
these disturbances are:
•
•
•
•
•
•
•
•
Fluctuations occurring within the facility’s distribution system
Utility service low-voltage conditions (such as sags or brownouts)
Wide and rapid variations in input voltage levels
Wide and rapid variations in input power frequency
Electrical storms
Large inductive sources (such as motors and welders)
Faults in the distribution system wiring (such as loose connections)
Microwave, radar, radio, or cell phone transmissions
Power System Protection
Computer systems can be protected from the sources of many of these electrical disturbances by using:
•
•
•
•
•
A dedicated power distribution system
Power conditioning equipment
Over- and under-voltage detection and protection circuits
Screening to cancel out the effects of undesirable transmissions
Lightning arresters on power cables to protect equipment against electrical storms
Every precaution has been taken during power distribution system design to provide immunity to power
outages of less than one cycle. However, testing cannot conclusively rule out loss of service. Therefore,
adherence to the following guidelines provides the best possible performance of power distribution systems
for server equipment:
•
•
Dedicated power source—Isolates server power distribution system from other circuits in the facility.
Missing-phase and low-voltage detectors—Shuts equipment down automatically when a severe power
disruption occurs. For peripheral equipment, these devices are recommended but optional.
•
Online uninterruptible power supply (UPS)—Keeps input voltage to devices constant and should be
considered if outages of one-half cycle or more are common. Refer to qualified contractors or consultants
for each situation.
104
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Distribution Hardware
Distribution Hardware
This section describes wire selection and the types of raceways (electrical conduits) used in the distribution
system.
Wire Selection
Use copper conductors instead of aluminum, as aluminum’s coefficient of expansion differs significantly from
that of other metals used in power hardware. Because of this difference, aluminum conductors can cause
connector hardware to work loose, overheat, and fail.
Raceway Systems (electrical conduits)
Raceways (electrical conduits) form part of the protective ground path for personnel and equipment.
Raceways protect the wiring from accidental damage and also provide a heatsink for the wires.
Any of the following types may be used:
•
•
•
Electrical metallic tubing (EMT) thin-wall tubing
Rigid (metal) conduit
Liquidtight with RFI strain relief (most commonly used with raised floors)
Building Distribution
All building feeders and branch circuitry should be in rigid metallic conduit with proper connectors (to
provide ground continuity) Conduit that is exposed and subject to damage should be constructed of rigid
galvanized steel.
Power Routing
Power drops and interface cables from the equipment are routed down from the power panel, through a
grommet protected opening (beneath the floor level), and under the floor panels.
105
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Grounding Systems
Grounding Systems
hp rp7405/rp7410 servers require two methods of grounding:
•
•
Power distribution safety grounding
High frequency intercabinet grounding
Power Distribution Safety Grounding
The power distribution safety grounding system consists of connecting various points in the power
distribution system to earth ground using green (green/yellow) wire ground conductors. Having these ground
connections tied to metal chassis parts that may be touched by computer room personnel protects them
against shock hazard from current leakage and fault conditions.
Power distribution systems consist of several parts. Hewlett-Packard recommends that these parts be solidly
interconnected to provide an equipotential ground to all points.
Main Building Electrical Ground
The main electrical service entrance equipment should have an earth ground connection, as required by
applicable codes. Connections such as a grounding rod, building steel, or a conductive type cold water service
pipe provide an earth ground.
Electrical Conduit Ground
All electrical conduits should be made of rigid metallic conduit that is securely connected together or bonded
to panels and electrical boxes, so as to provide a continuous grounding system.
Power Panel Ground
Each power panel should be grounded to the electrical service entrance with green (green/yellow) wire ground
conductors. The green (green/yellow) wire ground conductors should be sized per applicable codes (based on
circuit over current device ratings).
NOTE
The green wire ground conductor mentioned above may be a black wire marked with green
tape.
Computer Safety Ground
Ground all computer equipment with the green (green/yellow) wire included in the branch circuitry. The
green (green/yellow) wire ground conductors should be connected to the appropriate power panel and should
be sized per applicable codes (based on circuit over current device ratings).
Cabinet Performance Grounding (High frequency Ground)
Signal interconnects between system cabinets require high frequency ground return paths. Connect all
cabinets to site ground.
106
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Grounding Systems
NOTE
In some cases power distribution system green (green/yellow) wire ground conductors are too
long and inductive to provide adequate high frequency ground return paths. Therefore, the
server is shipped with a ground strap for connecting the system cabinet to the site grounding
grid (customer-supplied). When connecting this ground, ensure that the raised floor is properly
grounded.
Power panels located in close proximity to the computer equipment should also be connected to the site
grounding grid. Methods of providing a sufficiently high frequency ground grid are described in the next
sections.
Raised Floor Grounding
If a raised floor system is used, install a complete signal grounding grid for maintaining equal potential over
a broad band of frequencies. The grounding grid should be connected to the equipment cabinet and electrical
service entrance ground at multiple connection points using a minimum #6 AWG (16mm2) wire ground
conductor.
Hewlett-Packard recommends the following approaches:
•
Excellent—Add a grounding grid to the subfloor. The grounding grid should be made of aluminum strips
mounted to the subfloor. The strips should be 0.032 in. (0.08 cm) thick and a minimum of 3.0 in. (8.0 cm)
wide.
Connect each pedestal to four strips using 1/4 in. (6.0 mm) bolts tightened to the manufacturer’s torque
recommendation.
107
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Grounding Systems
•
Good—Use the raised floor structure as a ground grid. In this case, the floor must be designed as a ground
grid with bolted down stringers and corrosion resistive plating (to provide low resistance and attachment
points for connection to service entrance ground and server equipment). The use of conductive floor tiles
with this style of grid further enhances ground performance.
Figure C-1
Raised Floor Ground System
Equipment Grounding Implementation Details
If it has been determined to be necessary, connect all Hewlett-Packard equipment cabinets to the site ground
grid as follows:
Step 1. Attach one end of each ground strap to the applicable cabinet ground lug.
Step 2. Attach the other end to the nearest pedestal base (raised floor) or cable trough ground point
(nonraised floor).
Step 3. Check that the braid contact on each end of the ground strap consists of a terminal and connection
hardware (a 1/4-in. (6.0-mm) bolt, nuts, and washers).
Step 4. Check that the braid contact connection points are free of paint or other insulating material and
treated with a contact enhancement compound (similar to Burndy Penetrox).
108
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
System Installation Guidelines
System Installation Guidelines
This section contains information about installation practices. Some common pitfalls are highlighted. Both
power cable and data communications cable installations are discussed.
NOTE
In domestic installations, the proper receptacles should be installed prior to the arrival of
Hewlett-Packard equipment. Refer to the appropriate installation guide for installation
procedures.
Wiring Connections
Expansion and contraction rates vary among different metals. Therefore, the integrity of an electrical
connection depends on the restraining force applied. Connections that are too tight compress or deform the
hardware and causes it to weaken. This usually leads to high impedance causing circuit breakers to trip.
CAUTION
Connections that are too loose have a high resistance that cause serious problems, such as
erratic equipment operation. A high resistance connection overheats and sometimes causes fire
or high temperatures that can destroy hard-to-replace components such as distribution panels
or system bus bars.
Wiring connections must be properly torqued. Many equipment manufacturers specify the proper connection
torque values for their hardware.
Ground connections must only be made on a conductive, nonpainted surface. When equipment vibration is
present, lockwashers must be used on all connections to prevent connection hardware from working loose.
Data Communications Cables
Power transformers and heavy foot traffic create high energy fields. Route data communications cables away
from these areas. Use shielded data communications cables that meet approved industry standards to reduce
the effects of external fields.
109
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Environmental Elements
Environmental Elements
The following environmental elements can affect an hp rp7405/rp7410 server installation:
•
•
•
•
•
•
•
Computer room preparation
Cooling requirements
Humidity level
Air conditioning ducts
Dust and pollution control
Electrostatic discharge (ESD) prevention
Acoustics (noise reduction)
Computer Room Preparation
The following guidelines are recommended when preparing a computer room for an hp rp7405/rp7410 server
system:
•
Locate the computer room away from the exterior walls of the building to avoid the heat gain from
windows and exterior wall surfaces.
•
When exterior windows are unavoidable, use windows that are double or triple glazed and shaded to
prevent direct sunlight from entering the computer room.
•
•
•
•
Maintain the computer room at a positive pressure relative to surrounding spaces.
Use a vapor barrier installed around the entire computer room envelope to restrain moisture migration.
Caulk and vapor seal all pipes and cables that penetrate the envelope.
Use at least a 12-inch raised floor system for the most favorable room air distribution system (underfloor
distribution).
•
Ensure a minimum ceiling height of 12 inches between the top of the server and the ceiling and that all
ceiling clips are in place.
Basic Air Conditioning Equipment Requirements
The cooling capacity of the installed air conditioning equipment for the computer room should be sufficient to
offset the computer equipment dissipation loads, as well as any space envelope heat gain. This equipment
should include:
•
•
•
•
•
•
Air filtration
Cooling or dehumidification
Humidification
Reheating
Air distribution
System controls adequate to maintain the computer room within the operating range.
Lighting and personnel must also be included. For example, a person dissipates about 450 BTUs per hour
while performing a typical computer room task.
110
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Environmental Elements
At altitudes above 10,000 feet (3048 m), the lower air density reduces the cooling capability of air conditioning
systems. If your facility is located above this altitude, the recommended temperature ranges may need to be
modified. For each 1000 feet (305 m) increase in altitude above 10,000 feet (up to a maximum of 15,000 feet),
subtract 1.5° F (0.83° C) from the upper limit of the temperature range.
Air Conditioning System Guidelines
The following guidelines are recommended when designing an air conditioning system and selecting the
necessary equipment:
•
The air conditioning system that serves the computer room should be capable of operating 24 hours a day,
365 days a year. It should also be independent of other systems in the building.
•
Consider the long-term value of computer system availability, redundant air conditioning equipment or
capacity.
•
•
The system should be capable of handling any future computer system expansion.
Air conditioning equipment air filters should have a minimum rating of 45% (based on “AShRA Standard
52-76, Dust Spot Efficiency Test”).
•
Introduce only enough outside air into the system to meet building code requirements (for human
occupancy) and to maintain a positive air pressure in the computer room.
Air Conditioning System Types
The following three air conditioning system types are listed in order of preference:
•
•
•
•
Complete self-contained package unit(s) with remote condenser(s)—These systems are available with up
or down discharge and are usually located in the computer room.
Chilled water package unit with remote chilled water plant—These systems are available with up or
down discharge and are usually located in the computer room.
Central station air handling units with remote refrigeration equipment—These systems are usually
located outside the computer room
Scalable overhead distribution system—This system distributes water overhead to air heat exchangers,
TM
which cool the air locally over the servers. This system called DataCool
density environments of 100 to 500 watts per square foot.
is primarily used in high
Basic Air Distribution Systems
A basic air distribution system includes supply air and return air.
An air distribution system should be zoned to deliver an adequate amount of supply air to the cooling air
intake vents of the computer system equipment cabinets. Supply air temperature should be maintained
within the following parameters:
•
•
Ceiling supply system—From 55° F (12.8° C) to 60° F (15.6° C)
Floor supply system—At least 60° F (15.6° C)
If a ceiling plenum return air system or a ducted ceiling return air system is used, the return air grille(s) in
the ceiling should be located directly above the computer equipment cabinets.
The following three types of air distribution system are listed in order of recommendation:
111
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Environmental Elements
•
•
Underfloor air distribution system—Downflow air conditioning equipment located on the raised floor of
the computer room uses the cavity beneath the raised floor as plenum for the supply air.
Perforated floor panels (available from the raised floor manufacturer) should be located around the
perimeter of the system cabinets. Supply air emitted though the perforated floor panels is then available
near the cooling air intake vents of the computer system cabinets.
Ceiling plenum air distribution system—Supply air is ducted into the ceiling plenum from upflow air
conditioning equipment located in the computer room or from an air handling unit (remote).
The ceiling construction should resist air leakage. Place perforated ceiling panels (with down discharge
air flow characteristics) around the perimeter of the system cabinets. The supply air emitted downward
from the perforated ceiling panels is then available near the cooling air intake vents of the computer
system cabinets.
Return air should be ducted back to the air conditioning equipment though the return air duct above the
ceiling.
•
Above ceiling ducted air distribution system—Supply air is ducted into a ceiling diffuser system from
upflow air conditioning equipment located in the computer room or from an air handling unit (remote).
Adjust the supply air diffuser system grilles to direct the cooling air downward around the perimeter of
the computer system cabinets. The supply air is then available near the cooling air intake vents of the
computer system cabinets.
Table C-1
Computer Room Environment
Recommended
Maximum Rate of
Change (per hour)
Non-Operating
Ranges
Parameter
Operating Limits
Operating
Range
a
41° - 95° F
68° - 77° F
20° C/hour
-40° C - +70° C
Temperature
Humidity
(5° - 35° C)
(20° - 25° C)
15% - 80%
with no condensation
(40% - 55% recommended)
40% - 55% RH
non-condensing
30% RH/hour
non-condensing
90% RH
non-condensing
@ 65° C (149° F)
a. The temperature ranges stated are at 0 to 5,000 feet. The maximum operating temperature must
be de-rated by 1° C/1,000 feet from 5,000 to 10,000 feet.
Air Conditioning System Installation
All air conditioning equipment, materials, and installation must comply with any applicable construction
codes. Installation of the various components of the air conditioning system must also conform to the air
conditioning equipment manufacturer’s recommendations.
Humidity Level
Maintain proper humidity levels. High humidity causes galvanic actions to occur between some dissimilar
metals. This eventually causes a high resistance between connections, leading to equipment failures. High
humidity can also have an adverse affect on some magnetic tapes and paper media.
112
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Environmental Elements
CAUTION
Low humidity contributes to undesirably high levels of electrostatic charges. This increases the
electrostatic discharge (ESD) voltage potential. ESD can cause component damage during
servicing operations. Paper feed problems on high-speed printers are usually encountered in
low-humidity environments.
Low humidity levels are often the result of the facility heating system and occur during the cold season. Most
heating systems cause air to have a low humidity level, unless the system has a built-in humidifier.
Air Conditioning Ducts
Use separate computer room air conditioning duct work. If it is not separate from the rest of the building, it
might be difficult to control cooling and air pressure levels. Duct work seals are important for maintaining a
balanced air conditioning system and high static air pressure. Adequate cooling capacity means little if the
direction and rate of air flow cannot be controlled because of poor duct sealing. Also, the ducts should not be
exposed to warm air, or humidity levels may increase.
Dust and Pollution Control
Computer equipment can be adversely affected by dust and microscopic particles in the site environment.
Specifically, disk drives, tape drives, and some other mechanical devices can have bearing failures resulting
from airborne abrasive particles. Dust may also blanket electronic components like printed circuit boards
causing premature failure due to excess heat and/or humidity build up on the boards. Other failures to power
supplies and other electronic components can be caused by metallically conductive particles. These metallic
particles are conductive and can short circuit electronic components. Use every effort to ensure that the
environment is as dust and particulant free as possible.
Smaller particles can pass though some filters and, over a period of time, resulting in possible cause problems
in mechanical parts. Small dust particles can be prevented from entering the computer room by maintaining
its air conditioning system at a high static air pressure level.
Other sources of dust, metallic, conductive, abrasive, and/or microscopic particles can be present. Some
sources of these particulants are:
•
•
•
Subfloor shedding
Raised floor shedding
Ceiling tile shedding
These pollutants are not always visible to the naked eye. A good check to determine their possible presence is
to check the underside of the tiles. The tile should be shiny, galvanized, and free from rust.
The computer room should be kept clean. The following guidelines are recommended:
•
Smoking—Establish a no-smoking policy. Cigarette smoke particles are eight times larger than the
clearance between disk drive read/write heads and the disk surface.
•
•
Printer—Locate printers and paper products in a separate room to eliminate paper particulate problems.
Eating or drinking—Establish a no-eating or drinking policy. Spilled liquids can cause short circuits in
equipment such as keyboards.
•
Tile floors—Use a dust-absorbent cloth mop rather than a dry mop to clean tile floors.
113
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Environmental Elements
Special precautions are necessary if the computer room is near a source of air pollution. Some air pollutants,
especially hydrogen sulfide (H2S), are not only unpleasant but corrosive as well. Hydrogen sulfide damages
wiring and delicate sound equipment. The use of activated charcoal filters reduces this form of air pollution.
Electrostatic Discharge (ESD) Prevention
Static charges (voltage levels) occur when objects are separated or rubbed together. The voltage level of a
static charge is determined by the following factors:
•
•
•
Types of materials
Relative humidity
Rate of change or separation
Table C-2 lists charge levels based on personnel activities and humidity levels.
Table C-2
Effect of Humidity on ESD Charge Levels
a
b
c
Personnel Activity
Humidity and Charge Levels (voltages)
26%
32%
40%
50%
Person walking across a
linoleum floor
6,150 V
5,750 V
4,625 V
3,700 V
Person walking across a carpeted
floor
18,450 V
17,250 V
13,875 V
11,100 V
Person getting up from a plastic
chair
24,600 V
23,000 V
18,500 V
14,800 V
a. Source: B.A. Unger, Electrostatic Discharge Failures of Semiconductor Devices
(Bell Laboratories, 1981)
b. For the same relative humidity level, a high rate of airflow produces higher
static charges than a low airflow rate.
c. Some data in this table has been extrapolated.
Static Protection Measures
Follow these precautions to minimize possible ESD-induced failures in the computer room:
•
•
•
•
•
•
•
Install conductive flooring (conductive adhesive must be used when laying tiles).
Use conductive wax if waxed floors are necessary.
Ensure that all equipment and flooring are properly grounded and are at the same ground potential.
Use conductive tables and chairs.
Use a grounded wrist strap (or other grounding method) when handling circuit boards.
Store spare electronic modules in antistatic containers.
Maintain recommended humidity level and airflow rates in the computer room.
114
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Environmental Elements
Acoustics
Computer equipment and air conditioning blowers cause computer rooms to be noisy. Ambient noise level in a
computer room can be reduced as follows:
•
•
•
Dropped ceiling—Cover with a commercial grade of fire-resistant, acoustic rated, fiberglass ceiling tile.
Sound deadening—Cover the walls with curtains or other sound deadening material.
Removable partitions—Use foam rubber models for most effectiveness.
115
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Computer Room Safety
Computer Room Safety
Inside the computer room, fire protection and adequate lighting (for equipment servicing) are important
safety considerations. Federal and local safety codes govern computer installations.
Fire Protection
The national Fire Protection Association’s Standard for the Protection of Electronic Computer Data
Processing Equipment, NFPA 75, contains information on safety monitoring equipment for computer rooms.
Most computer room installations are equipped with the following fire protection devices:
•
•
•
Smoke detectors
Fire and temperature alarms
Fire extinguishing system
Additional safety devices are:
•
•
•
Circuit breakers
An emergency power cutoff switch
Devices specific to the geographic location i.e., earthquake protection
Lighting Requirements for Equipment Servicing
Adequate lighting and utility outlets in a computer room reduce the possibility of accidents during equipment
servicing. Safer servicing is also more efficient and, therefore, less costly.
For example, it is difficult to see cable connection points on the hardware if there is not enough light.
Adequate lighting reduces the chances of connector damage when cables are installed or removed.
The minimum recommended illumination level is 70 foot-candles (756 lumens per square meter) when the
light level is measured at 30 inches (76.2 cm) above the floor.
116
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Facility Characteristics
Facility Characteristics
This section contains information about facility characteristics that must be considered for the installation or
operation of an hp rp7405/rp7410 server. Facility characteristics are:
•
•
•
Floor loading
Windows
Altitude effects
Floor Loading
The computer room floor must be able to support the total weight of the installed computer system as well as
the weight of the individual cabinets as they are moved into position.
Floor loading is usually not an issue in nonraised floor installations. The information presented in this section
is directed toward raised floor installations.
NOTE
Any floor system under consideration for an hp rp7405/rp7410 server installation should be
verified by an appropriate floor system consultant.
Raised Floor Loading
Raised floor loading is a function of the manufacturer’s load specification and the positioning of the
equipment relative to the raised floor grid. While Hewlett-Packard cannot assume responsibility for
determining the suitability of a particular raised floor system, it does provide information and illustrations
for the customer or local agencies to determine installation requirements.
The following guidelines are recommended:
•
•
Because many raised floor systems do not have grid stringers between floor stands, the lateral support for
the floor stands depends on adjacent panels being in place. To avoid compromising this type of floor
system while gaining under floor access, remove only one floor panel at a time.
Larger floor grids (bigger panels) are generally rated for lighter loads.
CAUTION
Do not install any raised floor system until you have carefully examined it to verify that it is
adequate to support the appropriate installation.
Floor Loading Terms
Table C-3 defines floor loading terms.
Table C-3
Floor Loading Term Definitions
Term
Definition
Dead load
Live load
The weight of the raised panel floor system, including the
understructure. Expressed in lb/ft2 (kg/m2).
The load that the floor system can safely support. Expressed
in lb/ft2 (kg/m2).
117
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Facility Characteristics
Table C-3
Floor Loading Term Definitions (Continued)
Definition
Term
Concentrated load
The load that a floor panel can support on a 1-in2 (6.45 cm2)
area at the panel’s weakest point (typically the center of the
panel), without the surface of the panel deflecting more than
a predetermined amount.
Ultimate load
The maximum load (per floor panel) that the floor system can
support without failure. Failure expressed by floor panel(s)
breaking or bending.
Ultimate load is usually stated as load per floor panel.
Rolling load
The load a floor panel can support (without failure) when a
wheel of specified diameter and width is rolled across the
panel.
Average floor load
Computed by dividing total equipment weight by the area of
its footprint. This value is expressed in lb/ft2 (kg/m2).
Average Floor Loading
The average floor load value, defined in Table C-4, is not appropriate for addressing raised floor ratings at the
floor grid spacing level. However, it is useful for determining floor loading at the building level, such as the
area of solid floor or span of raised floor tiles covered by the hp rp7405/rp7410 server footprint.
Typical Raised Floor Site
This section contains an example of a computer room raised floor system that is satisfactory for the
installation of an hp rp7405/rp7410 server.
Based on specific information provided by Hewlett-Packard, Tate Access Floors has approved its Series 800
all-steel access floor with bolt-together stringers and 24 in. (61.0 cm) by 24 in. (61.0 cm) floor panels.
In the event that the flooring is being replaced or a new floor is being installed, Tate Access Floors
recommends its Series 1250 all-steel access floor with bolt-together stringers and 24 in. (61.0 cm) by 24 in.
(61.0 cm) floor panels be used to support the server installation.
NOTE
If the specific floor being evaluated or considered is other than a Tate Series 800 floor, the
specific floor manufacturer must be contacted to evaluate the floor being used.
Table C-4 lists specifications for the Tate Access Floors Series 800 raised floor system.
Table C-4
Typical Raised Floor Specifications
a
Rating
Item
Dead load
Live load
7 lb/ft 2 (34.2 kg/m2)
313 lb/ft 2 (1528.3 kg/m2)
1250 lb (567 kg)
b
Concentrated load
118
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Facility Characteristics
Table C-4
Typical Raised Floor Specifications (Continued)
Rating
a
Item
Ultimate load
4000 lb (1814 kg) per
panel
Rolling load
400 lb (181 kg)
500 lb (227 kg)
Average floor load
a. From Table C-3 on page 117
b. With 0.08 in (0.2 cm) of span maximum deflection
Windows
Avoid housing computers in a room with windows. Sunlight entering a computer room may cause problems.
Magnetic tape storage media is damaged if exposed to direct sunlight. Also, the heat generated by sunlight
places an additional load on the cooling system.
119
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Space Requirements
Space Requirements
This section contains information about space requirements for an hp rp7405/rp7410 server. This data should
be used as the basic guideline for space plan developments. Other factors, such as airflow, lighting, and
equipment space requirements must also be considered.
Delivery Space Requirements
There should be enough clearance to move equipment safely from the receiving area to the computer room.
Permanent obstructions, such as pillars or narrow doorways, can cause equipment damage.
Delivery plans should include the possible removal of walls or doors.
Figure C-2
Cabinet Dimensions
Operational Space Requirements
Other factors must be considered along with the basic equipment dimensions. Reduced airflow around
equipment causes overheating, which can lead to equipment failure. Therefore, the location and orientation of
air conditioning ducts, as well as airflow direction, are important. Obstructions to equipment intake or
exhaust airflow must be eliminated.
The locations of lighting fixtures and utility outlets affect servicing operations. Plan equipment layout to take
advantage of lighting and utility outlets. Do not forget to include clearance for opening and closing equipment
doors.
Clearance around the cabinets must be provided for proper cooling airflow through the equipment.
120
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Space Requirements
The service area space requirements, shown in Figure C-3, are minimum dimensions. If other equipment is
located so that it exhausts heated air near the cooling air intakes of the computer system cabinets, larger
space requirements are needed to keep ambient air intake to the computer system cabinets within the
specified temperature and humidity ranges.
Figure C-3
Footprint
Space planning should also include the possible addition of equipment or other changes in space
requirements. Equipment layout plans should also include provisions for the following:
•
•
•
•
•
Channels or fixtures used for routing data cables and power cables
Access to air conditioning ducts, filters, lighting, and electrical power hardware
Power conditioning equipment
Cabinets for cleaning materials
Maintenance area and spare parts
121
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Site Preparation
Zinc Particle Contamination
Zinc Particle Contamination
Metallic particulates can be especially harmful around electronic equipment. This type of contamination may
enter the data center environment from a variety of sources, including but not limited to raised floor tiles,
worn air conditioning parts, heating ducts, rotor brushes in vacuum cleaners or printer component wear.
Because metallic particulates conduct electricity, they have an increased potential for creating short circuits
in electronic equipment. This problem is exaggerated by the increasingly dense circuitry of electronic
equipment.
Over time, very fine whiskers of pure metal can form on electroplated zinc, cadmium, or tin surfaces. If these
whiskers are disturbed, they may break off and become airborne, possibly causing failures or operational
interruptions. For over 50 years, the electronics industry has been aware of the relatively rare but possible
threat posed by metallic particulate contamination. During recent years, a growing concern has developed in
computer rooms where these conductive contaminants are formed on the bottom of some raised floor tiles.
Although this problem is relatively rare, it may be an issue within your computer room. Since metallic
contamination can cause permanent or intermittent failures on your electronic equipment, Hewlett-Packard
strongly recommends that your site be evaluated for metallic particulate contamination before installation of
electronic equipment.
122
Appendix C
Download from Www.Somanuals.com. All Manuals Search And Download.
Index
I
IP address
power
K
power distribution system
Keystone system
power requirements
L
Processor Dependent Code
LED
R
raised floor
login name
S
M
serial display device
MP
MP (Management Processor)
T
U
N
null modem cable
upgrade
O
V
P
password
W
wiring
PDC
124
Download from Www.Somanuals.com. All Manuals Search And Download.
|