FUJITSU MICROELECTRONICS
DATA SHEET
DS04-21215-3Ea
ASSP
IF Band
PLL Frequency Synthesizer
MB15C101
■ DESCRIPTION
The Fujitsu Microelectronics MB15C101 is an exclusive Intermediate Frequency (IF) band Phase Locked Loop (PLL)
frequency synthesizer with pulse swallow operation. The reference divider and comparison divider have fixed divide
ratios, so that it is not required to set the divide ratios by a microcontroller externally.
It operates with a supply voltage of 3.0 V typ. and dissipates 1.0 mA typ.(270MHz) of current realized through the
use of Fujitsu Microelectronics’s CMOS technology.
The MB15C101 is ideally suitable for PHS systems.
■ FEATURES
• Low power supply current: ICC = 1.0 mA typ. (VCC = 3 V, 270MHz)
• Pulse swallow function; Prescaler: 16/17
• Setting frequency (Selectable by Div input.)
– fosc = 19.2 MHz, fIF = 233.15 MHz (Div = “H”)
– fosc = 19.2 MHz, fIF = 259.20 MHz (Div = “L”)
• Lock detector
• Low power supply voltage: VCC = 2.4 V min.
• Wide operating temperature: Ta = –40 to +85°C
■ PACKAGE
8-pin plastic SSOP
16-pad plastic BCC
(FPT-8P-M03)
(LCC-16P-M06)
Copyright©1999-2008 FUJITSU MICROELECTRONICS LIMITED All rights reserved
1
1999.4
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MB15C101
■ BLOCK DIAGRAM
VCC
Reference divider
Oscillator
OSCIN
input
fr
charge
Do
buffer
Reference
counter
(R)
Phase
comparator
pump
fp
LD
Lock
detector
Comparison divider
Data
setting
circuit
DIV
fout
Output
selector
Swallow
counter
(A)
Main
counter
(N)
Prescaler
16 / 17(P)
fin
Control circuit
GND
3
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MB15C101
■ ABSOLUTE MAXIMUM RATINGS
Rating
Parameter
Symbol
Unit
Min.
–0.5
–0.5
–0.5
0
Max.
+4.0
Power supply voltage
Input voltage
VCC
VI
V
V
VCC +0.5
VCC +0.5
+5
Output voltage
VOUT
IOUT
TSTG
V
Output current
mA
°C
Storage temperature
–55
+125
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
■ RECOMMENDED OPERATING CONDITIONS
Value
Parameter
Symbol
Unit
Note
Min.
2.4
Typ.
3.0
–
Max.
3.6
Power supply voltage
Input voltage
VCC
VIN
Ta
V
V
GND
–40
VCC
Operating temperature
–
+85
°C
Handling Precautions
• This device should be transported and stored in anti-static containers.
• This is a static-sensitive device; take proper anti-ESD precautions. Ensure that personnel and equipment are
properly grounded. Cover workbenches with grounded conductive mats.
• Always turn the power supply off before inserting or removing the device from its socket.
• Protect leads with a conductive sheet when handling or transporting PC boards with devices.
4
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MB15C101
■ ELECTRICAL CHARACTERISTICS
Recommended operating conditions unless otherwise noted.
Value
Parameter
Power supply current
Symbol
Condition
Unit
Min.
Typ.
Max.
PLL is locked.(270MHz)
ICC
fin
0.1
1.0
2.0
mA
MHz
MHz
dBm
Vpp
V
VCC = 3.0 V, Ta = +25°C
AC coupling by 1000 pF
capacitor
fin
50
3
–
–
–
–
–
–
270
26
+2
–
Operating frequency
Input sensitivity
Input voltage
AC coupling by 1000 pF
capacitor
OSCIN
fin
fosc
Pfin
Vosc
VIH
AC coupling by 1000 pF
capacitor
–10
0.5
AC coupling by 1000 pF
capacitor
OSCIN
VCC ×
–
–
–
0.7
Div
VCC ×
VIL
–
V
0.3
IIH
IIL
–
–
–1.0
–100
2.6
–
–
–
–
–
–
1.0
–
µA
µA
µA
V
Input current
Input current
Output voltage
Div
–
OSCIN
Do
IOSC
VOH
VOL
–
100
–
VCC = 3.0 V, IOH=–0.3mA
VCC = 3.0 V, IOL= 0.3mA
0.4
V
VCC = 3.0 V, VOH = 2V,
IOH
IOL
–
–
–
–6.0
6.0
–
–
–
3
mA
mA
nA
Ta = +25°C
Output current
Do
Do
VCC = 3.0 V, VOL = 1V,
Ta = +25°C
High impedance cut off
current
IOFF
0 ≤ VDO ≤ VCC
5
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MB15C101
■ FUNCTIONAL DESCRIPTIONS
Two different frequencies can be selected by Div input “H” or “L”.
The divide ratios are calculated using the following equation:
fVCO = {(P × N) + A} × fOSC ÷ R (A < N)
Symbol
fvco
fosc
N
Description
Div = “H”
233.15 MHz
19.2 MHz
291
Div = “L”
259.20 MHz
19.2 MHz
33
Output frequency of external VCO
Reference oscillation frequency
Divide ratio of the main counter
Divide ratio of the swallow counter
A
7
12
Preset divide ratio of dual modulus
prescaler
P
R
16/17
16/17
Divide ratio of the reference counter
384 (fr = 50 kHz)
40 (fr = 480 kHz)
■ PHASE DETECTOR TIME CHART
fr
fp
tWU
tWL
LD
DO
High impedance
Note: • .Phase error detection range: –2π to +2π
• Pulses on Do output signal during locked state are output to prevent dead zone.
• LD output becomes low when phase is tWU or more. LD output becomes high when phase error is tWL or
less and continues to be so for three cycles or more.
• .tWU and tWL depend on OSCin input frequency.
tWU > 8/fosc (s) (e. g.tWU > 625.0ns, foscin = 12.8 MHz)
tWL < 16/fosc (s) (e. g. tWL < 1250.0ns, foscin = 12.8 MHz)
6
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MB15C101
■ MEASURMENT CIRCUIT (for measuring input sensitivity fin/OSCin)
SSOP-8
VCC
S.G
1000 pF
1
2
3
4
8
7
6
5
0.1 µF
VCC
50 Ω
2 KΩ
Oscilloscope
S.G
DIV : H or L
1000 pF
50 Ω
BCC-16
8
7
9
6
5
VCC
S.G
1000 pF
10
0.1 µF
VCC
2 KΩ
50 Ω
11
12
13
4
3
2
Oscilloscope
S.G
DIV : H or L
1000 pF
50 Ω
14
1
15
16
7
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MB15C101
■ TYPICAL CHARACTERISTICS
1. fin Input Sensitivity
(dBm)
10
Ta = +25 °C
5
0
SPEC
−5
−10
−15
−20
−25
−30
−35
−40
−45
−50
VCC = 2.4 V
VCC = 3.0 V
VCC = 3.6 V
0
100
200
300
400
500
600
700
800
900
1000 (MHz)
fin (MHz)
2. OSCIN Input Sensitivity
(dBm)
10
Ta = +25 °C
VCC = 2.4 V
VCC = 3.0 V
VCC = 3.6 V
5
0
SPEC
−5
−10
−15
−20
−25
−30
−35
−40
−45
−50
0
10
20
30
40
50
60
70
80
90
100 (MHz)
fosc (MHz)
8
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MB15C101
3. fin Input Impedance
4 : 11.867 Ω
−131.54 Ω
4.0331 pF
300.000 000 MHz
1 : 58.875 Ω
−850.16 kΩ
50 MHz
2 : 16.891 Ω
−416.2 Ω
100 MHz
3 : 12.047 Ω
−202.87 Ω
200 MHz
1
2
4
3
START .500 000 MHz
STOP 1 000.000 000 MHz
4. OSCIN Input Impedance
4 : 068.25 Ω
−1.4236 Ω
4.3 pF
26.000 000 MHz
1 :5.1345 Ω
−10.288 kΩ
3 MHz
529.87 Ω
2 :
−3.6659 kΩ
10 MHz
114.44 Ω
3 :
−1.8514 kΩ
4
1
20 MHz
2
3
START .500 000 MHz
STOP 100.000 000 MHz
9
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MB15C101
5. Do Outut Current
VOH – IOH
VCC = 3.0 V, Ta =+ 25 °C
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
−2
−4
−6
−8
−10
−12
IOH (mA)
VOL – IOL
VCC = 3.0 V, Ta = +25 °C
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
2
4
6
8
10
12
IOL (mA)
Measurement Circuit
VCC
IOH
VCC
fin
Parameter Analyzer
Do
OSCin
GND
1000 pF
S.G.
S.G.
50 Ω
VCC
IOL
VCC
fin
Parameter Analyzer
Do
1000 pF
OSCin
50 Ω
GND
10
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MB15C101
■ REFERENCE INFORMATION
1. Application Measurement
• Test Results
Results
Lockup time 1 kHz
Un lock → Lock
2.3 ms
3.4 ms
Power on → Lock
Reference leakage (∆f = 58 kHz)
–88.5 dBc
Phase noise
(∆f = 1 kHz)
–88.0 dBc/Hz
–111.0 dBc/Hz
–118.0 dBc/Hz
–134.0 dBc/Hz
(∆f = 10 kHz)
(∆f = 100 kHz)
(∆f = 1 MHz)
VCC (V)
VCO
3.0 V
Discrete VCO (Kv = 3.5 MHz/V)
Lock Frequency = 274.0 MHz (fr = 58 kHz)
• Measurement Circuit
18 Ω
18 Ω
Spectrum
Analyzer
VCC = 3.0 V
18 Ω
Loop Filter
1000 pF
fin
R1
MB15C101
VCO
S.G
R2
1000 pF
OSCin
C1
C3
C1 = 6800 pF
C2 = 0.068 µF
C3 = 4800 pF
R1 = 3.0 kΩ
50 Ω
C2
R2 = 3.9 KΩ
11
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MB15C101
2. Phase Noise
∆ f = 1 kHz
∆ f = 10 kHz
ATTEN 10dB
ATTEN 10dB
RL −1.5 dBm
∆MKR −73.83 dB
1.000 kHz
∆MKR −91.83 dB
10.00 kHz
SPAN 2.0 kHz
10 dB/
SPAN 20 kHz
10 dB/
RL −1.5 dBm
D
D
CENTER 273.999827 MHz
RBW 30 Hz VBW 3.0 Hz
SPAN 2.000 kHz
SWP 3.00 sec
CENTER 273.999827 MHz
SPAN 20.00 kHz
SWP 30. 0 sec
RBW 100 Hz
VBW 30 Hz
∆ f = 100 kHz
ATTEN 10 dB
∆ f = 1 MHz
ATTEN 10dB
∆MKR −88.50 dB
58.0 kHz
∆MKR −105.5 dB
275.000 MHz
SPAN 200 kHz
10 dB/
SPAN 2 MHz
RL −30.0 dBm 10 dB/
RL −1.5 dBm
D
D
CENTER 274.0002 MHz
RBW 1.0 kHz VBW 30 Hz
SPAN 200.0 kHz
SWP 30.0 sec
START 274.000 MHz
RBW 1.0 Hz VBW 100 Hz
STOP 276.000 MHz
SWP 100 sec
12
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MB15C101
3. Lockup Time: Un-Lock to Lock
Un-Lock to Lock : DIV = “L” to “H”
VCC “OFF” to VCC “ON”
∆ Mkr : 2.30 ms
∆ Mkr : 3.40 ms
30.00300
MHz
30.00300
MHz
1.00
1.000
kHz/div
kHz/div
29.99800
MHz
29.99800
MHz
20.0000000 ms
10.0000000 ms
0 s
0 s
13
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MB15C101
■ ORDERING INFORMATION
Part number
Package
Remarks
8-pin, Plastic SSOP
(FPT-8P-M03)
MB15C101PFV
16-pad, Plastic BCC
(LCC-16P-M06)
MB15C101PV1
14
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MB15C101
■ PACKAGE DIMENSIONS
*: This dimension does not include resin protrusion.
8-pin plastic SSOP
(FPT-8P-M03)
+0.20
*
3.50±0.10
(.138±.004)
1.25–0.10
(Mounting height)
.049+–..000048
0.10(.004)
4.20±0.10
(.165±.004)
5.20(.205)
NOM
6.20±0.20
(.244±.008)
INDEX
"A"
+0.05
0.80(.0315)
TYP
0.35±0.10
(.014±.004)
0.15–0.02
M
0.10(.004)
+.002
Details of "A" part
0.10±0.10(.004±.004)
.006–.001
(STAND OFF)
2.40(.094)REF
0
10°
0.50±0.20
(.020±.008)
C
Dimensions in mm (inches)
(Continued)
1994 FUJITSU LIMITED F08005S-1C-2
15
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MB15C101
(Continued)
16-pad plastic BCC
(LCC-16P-M06)
4.55±0.10
(.179±.004)
0.80(.031)MAX
Mounting height
3.40(.134)TYP
0.65(.026)
0.325±0.10
(.013±.004)
TYP
0.40±0.10
(.016±.004)
14
9
9
14
0.80(.031)
REF
INDEX AREA
3.40±0.10
(.134±.004)
2.45(.096)
TYP
1.15(.045)
REF
"B"
"A"
0.075±0.025
(.003±.001)
(Stand off)
1.725(.068)
REF
1
6
6
1
Details of "A" part
0.75±0.10
Details of "B" part
0.60±0.10
(.024±.004)
(.030±.004)
0.05(.002)
0.40±0.10
0.60±0.10
(.016±.004)
(.024±.004)
C
Dimensions in mm (inches)
1999 FUJITSU LIMITED C16017S-1C-1
16
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MB15C101
MEMO
17
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MB15C101
MEMO
18
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MB15C101
MEMO
19
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FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku,
Tokyo 163-0722, Japan
Tel: +81-3-5322-3347 Fax: +81-3-5322-3387
For further information please contact:
North and South America
Asia Pacific
FUJITSU MICROELECTRONICS AMERICA, INC.
1250 E. Arques Avenue, M/S 333
Sunnyvale, CA 94085-5401, U.S.A.
Tel: +1-408-737-5600 Fax: +1-408-737-5999
FUJITSU MICROELECTRONICS ASIA PTE LTD.
151 Lorong Chuan, #05-08 New Tech Park,
Singapore 556741
Tel: +65-6281-0770 Fax: +65-6281-0220
Europe
FUJITSU MICROELECTRONICS SHANGHAI CO., LTD.
Rm.3102, Bund Center, No.222 Yan An Road(E),
Shanghai 200002, China
FUJITSU MICROELECTRONICS EUROPE GmbH
Pittlerstrasse 47, 63225 Langen,
Germany
Tel: +86-21-6335-1560 Fax: +86-21-6335-1605
Tel: +49-6103-690-0 Fax: +49-6103-690-122
FUJITSU MICROELECTRONICS PACIFIC ASIA LTD.
10/F., World Commerce Centre, 11 Canton Road
Tsimshatsui, Kowloon
Korea
FUJITSU MICROELECTRONICS KOREA LTD.
206 KOSMO TOWER, 1002 Daechi-Dong,
Kangnam-Gu,Seoul 135-280
Korea
Hong Kong
Tel: +852-2377-0226 Fax: +852-2376-3269
Tel: +82-2-3484-7100 Fax: +82-2-3484-7111
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with sales representatives before ordering.
The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose
of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS
does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporat-
ing the device based on such information, you must assume any responsibility arising out of such use of the information.
FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use
or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS
or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or
other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured
as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect
to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in
nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in
weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising
in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current
levels and other abnormal operating conditions.
Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of
the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.
The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited Strategic Business Development Dept.
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