Builder’s Guide for
AMD Opteron™
Processor-Based
Servers and Workstations
Publication # 30925 Revision: 3.04
Issue Date:
February 2004
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
Based Servers and Workstations
Contents
Revision History...............................................................................................................................7
1.1 The AMD64 Architecture..................................................................................................9
Validated Server Program (VSP).........................................................................11
Not Yet a Member of VSP?.............................................................................................15
AMD Opteron™ Processor-In-a-Box ..................................................................17
Heatsink Installation Procedure.......................................................................................19
Power Supply Considerations..................................................................................30
5.3.2
Thermally Tested Populated Chassis Server Solutions for AMD Opteron
Processor..................................................................................................................34
Contents
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-Based
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AMD Opteron Processor Utilities and Updates.............................................................. 39
Appendix B FAQs....................................................................................................................... 51
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Contents
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
Based Servers and Workstations
List of Figures
Figure 5. Retention Frame and Backplate for the AMD Opteron Processor Heatsink....................19
Figure 6. Backplate Release Liner...................................................................................................20
Figure 10. Tightening Down the Retention Frame..........................................................................22
Figure 12. Pushing Gently Down on the Processor.........................................................................23
Figure 16. Pushing Straight Down on the Clip................................................................................25
Figure 20. Installed Heatsink...........................................................................................................27
Figure 21. Desirable Airflow—Power Supply with Bottom Inlet...................................................30
List of Figures
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-Based
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List of Tables
Table 4. Microsoft® Drivers for the AMD-8000™ Series of Chipset Components ....................... 39
6
List of Tables
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
Based Servers and Workstations
Revision History
Date
Revision
Description
February 2004
3.04
Revised public release. Added EMEA contact information.
December 2003
3.00
Initial public release.
Revision History
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-Based
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8
Revision History
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
Based Servers and Workstations
Chapter 1
AMD Opteron™ Processor Key
Architectural Features
The key architectural features of an AMD Opteron™ processor-based system include AMD64
architecture, integrated DDR DRAM memory controller, HyperTransport™ technology, and many
other features.
Figure 1 shows a block diagram of the AMD Opteron processor architecture.
Figure 1. AMD Opteron™ Processor Architecture
1.1
The AMD64 Architecture
AMD64 architecture allows end users to run existing, installed 32-bit applications and operating
systems at peak performance, while providing a migration path that is 64-bit capable. It is
designed to enable 64-bit computing while remaining compatible with the vast x86 software
infrastructure. AMD64 architecture represents a new class of computing, enabling a single
architecture across 32- and 64-bit environments.
Chapter 1
AMD Opteron™ Processor Key Architectural Features
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-Based
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Integrated DDR DRAM Memory Controller
The 128-bit wide integrated DDR DRAM memory controller:
• changes the way the processor accesses main memory, resulting in increased bandwidth,
reduced memory latencies, and increased processor performance.
• allows available memory bandwidth to scale with the number of processors.
• can support up to eight registered DDR DIMMs per processor.
• has available memory bandwidth of up to 5.3 Gbytes/s (with PC2700) per processor.
HyperTransport™ Technology
The HyperTransport technology of the AMD64 architecture offers the following features:
• A scalable bandwidth interconnection between processors, I/O subsystems, and other chipsets
• Support for up to three coherent HyperTransport links, providing up to 19.2 Gbytes/s of peak
bandwidth per processor
• Up to 6.4 Gbytes/s bandwidth per link providing sufficient bandwidth for supporting new
interconnects including PCI-X, DDR, InfiniBand, and 10G Ethernet
• Low power consumption (1.2 W) to help reduce the system thermal budget
Other Features of the AMD Opteron™ Processor
Other features of the AMD Opteron processor include:
• 64-bit wide key data and address paths that incorporate a 48-bit virtual address space and a
40-bit physical address space
• ECC (error correcting code) protection for L1 cache data, L2 cache data and tags, and DRAM
with hardware scrubbing of all ECC-protected arrays
• Lower thermal output levels and improved frequency scaling through .13 micron SOI (silicon-
on-insulator) process technology
• Support for all instructions necessary to be fully compatible with SSE2 technology
• Two additional pipeline stages (compared to AMD’s 32-bit architecture) for increased
performance and frequency scalability
• Higher IPC (instructions-per-clock) achieved through additional key features, such as larger
TLBs (translation lookaside buffer), flush filters, and enhanced branch prediction algorithms
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AMD Opteron™ Processor Key Architectural Features
Chapter 1
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
Based Servers and Workstations
Chapter 2
Validated Server Program (VSP)
For those System Builders, VARs and Integrators that prefer a pre-built system, the Validated
Server Program (VSP) is designed to enable rapid introduction of AMD Opteron™ processor-
based servers. AMD has joined forces with Celestica, one of the world’s leading electronics
manufacturing services (EMS) providers, to bring you the VSP. Building on tested, stable, and
reliable VSP solutions available from Celestica, your organization can:
• Gain leverage in a highly competitive market
• Streamline the development cycle and simplify your business
• Speed time-to-market
• Build revenue through value-added products and services
• Focus on customer service and other core competencies
• Boost customer satisfaction with Celestica’s end-to-end service and support
2.1
Value Proposition
VSP platforms are designed to take advantage of the performance of AMD Opteron processors,
HyperTransport™ technology links, and the AMD-8000™ series of chipsets. All of Celestica’s
server platforms are defined with reliability, availability, and serviceability as key objectives. This
attention to detail provides servers that can be relied on for mission critical applications.
2.2
Design Methodology for the VSP Platform
The design methodology for the VSP platform includes:
• Hot plug testing with multiple operating systems
• Peripheral compatibility testing with more than 100 cards, drives, and multiple operating
systems
• Worst-case power consumption analysis (including PCI-X® peripherals and drives)
• Thermal analysis of components
• Accelerated life test (used to determine MTBF figures)
• Full Flotherm analysis using the latest software modeling tools to confirm sufficient airflow in
the design
• Signal analysis on all high-speed bus and critical signal traces
• Acoustic testing
• Shock, vibration, and drop testing
Chapter 2
Validated Server Program (VSP)
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-Based
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In addition to the rigorous design and test methodologies, Celestica provides an Engineering
Change Notice (ECN) procedure to give advanced warning of any modifications in hardware or
firmware along with an explanation of the severity and cause. These ECNs are designed to allow
you to proactively solve potential issues with your customers and provide orderly transitions to
new revisions of the platforms.
Celestica offers comprehensive phone and web-based support for all VSP platforms. A
knowledgebase is available for common issues while a trained staff of technicians and engineers
handles more difficult situations. All issues are tracked with trouble tickets to help ensure a
prompt response.
2.3
Platform Description
VSP includes two product lines—one for 2-way multiprocessing and one for 4-way
multiprocessing. Both product lines are available in bare-bones and fully-configured options. Both
product lines feature AMD Opteron processors with AMD64 architecture, enabling end-users to
leverage their current base of 32-bit applications and migrate to 64-bit applications when ready. In
addition, each platform offers high-bandwidth I/O for increased flexibility and expandability,
along with an integrated QLogic baseboard management controller (BMC) for streamlined
management, IPMI v1.5-compliance, and remote management capabilities.
2.3.1
Model A2210 1U/2P—Based on the AMD Opteron™ 200-Series
Processor
This rack-optimized 1U platform is ideal for print/file server applications, Internet/network-edge
devices, dedicated web servers, and high performance cluster nodes. Figure 2 on page 13 shows a
1U/2P rack-optimized server based on the AMD Opteron 200-series processor.
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Validated Server Program (VSP)
Chapter 2
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
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Figure 2. Model A2210 1U/2P Rack Server
Key features of this platform include:
• Up to two AMD Opteron 200-series processors
• AMD64 architecture
• Up to 16 GBytes of DDR ECC registered memory (4 DIMMs per processor)
• One PCI-X 64-bit/133MHz or two PCI-X 64-bit/100 full length slots
• Up to two fixed IDE or two hot-swappable SCSI Ultra320 hard drives
• Slimline DVD-ROM or optional floppy disk drive
• Dual Broadcom 10/100/1000 Ethernet onboard
• 500-W power supply
• Integrated QLogic baseboard management controller (BMC); IPMI v1.5-compliant
2.3.2
4U/4P Model A8440—Based on the AMD Opteron™ 800-Series
Processor
The VSP 4-way multiprocessor solution is designed to deliver incredible performance for
enterprise-level computing including—database, Internet infrastructure, data center environments,
CAD/CAM, high performance cluster nodes, and scientific applications.
Chapter 2
Validated Server Program (VSP)
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-Based
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Figure 3. Model A8440 4U/4P Rack Server
Key features of this platform include:
• Up to four AMD Opteron 800-series processors
• AMD64 architecture
• Up to 32 Gbytes of DDR memory (4 DIMMs per processor)
• Two PCI-X 64-bit/133-MHz hot-swappable slots
• Three 64-bit/66-MHz slots
• Two LSI Logic SCSI Ultra 320 channels—one internal and one external
• Four 1” hot-swap SCSI drive bays with U320 SCSI-capable SAF-TE backplane
• Slimline DVD-ROM and floppy drive
• Dual Broadcom 10/100/1000 Ethernet onboard
• Up to three hot-swap 500-W power supplies with 2+1 redundancy
• Integrated QLogic BMC management controller; IPMI v1.5-compliant
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Validated Server Program (VSP)
Chapter 2
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
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2.4
Not Yet a Member of VSP?
For more information, register as a member, and find out how to order VSP products, please visit
Chapter 2
Validated Server Program (VSP)
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30925 Rev. 3.04 February 2004
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Validated Server Program (VSP)
Chapter 2
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
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Chapter 3
AMD Opteron™
Processor-In-a-Box
The best solution for System Builders and Resellers manufacturing pedestal platforms is the
processor-in-a-box (PIB) from AMD. The PIB is available now in a new retail box. The improved
display options allow the product to be either free-standing, stacked, or hung. The boxed processor
package is heat-sealed to alleviate lid tampering and to help ensure the authenticity of the AMD
processor. The AMD PIB is covered by a three-year limited warranty.
Figure 4. AMD64 Processor-in-a-Box
The PIB includes the following items:
• The AMD64 processor of choice
• Heatsink and fan, properly sized for the thermal requirements of the processor
• Assembly and installation instructions
• AMD64 processor case sticker
• Double processor packaging allows higher impact resistance adding more protection
• A three-year limited warranty
• Certificate of Authenticity
Check with your preferred distribution partner for AMD Opteron™ processor in a box or buy
distribution partner for AMD Opteron™ processor-in-a-box.
Chapter 3
AMD Opteron™ Processor-In-a-Box
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30925 Rev. 3.04 February 2004
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AMD Opteron™ Processor-In-a-Box
Chapter 3
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
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Chapter 4
Heatsink Installation
This chapter contains instructions for the installation of the AMD Opteron™ processor heatsink.
The AMD Opteron processor heatsink requires the retention frame and the backplate to be
attached to the motherboard. If the retention frame and backplate are already attached to the
match the one provided in a PIB.
Figure 5. Retention Frame and Backplate for the AMD Opteron™ Processor Heatsink
4.1
Heatsink Installation Procedure
Follow the instructions to install the AMD Opteron processor heatsink.
CAUTION: As with all computer equipment, the processor and motherboard components may be
damaged by electrostatic discharge (ESD). Please take proper ESD precautions
when handling any board.
Warning: Do not apply voltage until the heatsink is fully installed. If voltage is applied before
the heatsink is fully installed, the processor will overheat and failure will result.
Read through the entire installation instructions completely to make sure you
understand them before you begin.
1. Place the backplate on a flat surface.
Chapter 4
Heatsink Installation
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-Based
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Figure 6. Backplate Release Liner
3. Gently lift the motherboard by the edges over the backplate.
4. Align the two threaded standoffs on the backplate with the two mounting holes near the socket
on the motherboard. (See Figure 7.)
Figure 7. Motherboard Placed Over Backplate
5. Gently lower the motherboard until the standoffs fit through the holes near the socket and the
backplate makes complete contact with the motherboard.
6. Press firmly on the socket to ensure proper contact between the backplate and motherboard.
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Heatsink Installation
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
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Figure 8. Ensure Proper Contact Between Backplate and Motherboard
7. Carefully place the retention frame on the motherboard.
Figure 9. Retention Frame Screw Holes Aligned with Backplate Standoffs
− Ensure that the retention frame is flat with the motherboard.
− Do not over-tighten the screws.
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-Based
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Figure 10. Tightening Down the Retention Frame
10. Lift the socket locking-lever. (Pull it out slightly, and then lift up.)
Warning: Do not apply voltage until the heatsink is fully installed. If voltage is applied before
the heatsink is fully installed, the processor will overheat and failure will result.
11. Gently place the zero insertion force (ZIF) processor into the socket.
The AMD Opteron processor has a small triangle marking on one corner. (See Figure 11.) This
triangle corresponds to the alignment marking on the motherboard. The corner with the
triangle must be located at the corresponding corner marked on the motherboard.
Be careful not to bend the processor pins.
Figure 11. Alignment Markers on Processor and Motherboard
12. Push down gently on the processor while lowering the locking lever and latching it into the
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Heatsink Installation
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
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Figure 12. Pushing Gently Down on the Processor
13. Inspect the thermal interface material for scratches or gaps.
The heatsink has a thermal interface material pre-applied on the bottom. This material is
protected by a plastic cover. (See Figure 13.)
Do not use the thermal interface material if it has scratches or gaps. If replacement thermal
interface material is needed, contact AMD technical support for assistance at
If a heatsink is removed for any reason, clean the processor and heatsink surface and re-apply
an AMD approved thermal interface material before re-installing the processor.
14. Remove and discard the plastic cover.
Be careful not to touch or scratch the thermal interface material.
Figure 13. Plastic Cover Over Thermal Interface Material
15. Center the heatsink over the processor. (See Figure 14 on page 24.)
The mounting lug on the retention frame must match the heatsink clip.
The heatsink must have full contact with the processor.
Chapter 4
Heatsink Installation
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-Based
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Figure 14. Heatsink Centered Over Processor
16. Hook the spring clip under the cam lever to the mounting lug on the retention frame.
Some force may need to be applied.
Figure 15. Heatsink Spring Clip
17. Ensure the spring clip is aligned with the plastic lug on the retention frame.
18. Carefully push straight down on the clip. (See Figure 16 on page 25.)
This may take more force than the first side.
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Heatsink Installation
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
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Figure 16. Pushing Straight Down on the Clip
The spring clip must be installed as shown in Figure 17.
Figure 17. Correctly Installed Spring Clip
Chapter 4
Heatsink Installation
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-Based
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19. Carefully turn the cam lever to lock into place. (See Figure 18.)
Figure 18. Turning the Cam Lever
20. Ensure the cam lever is locked into the retention frame. (See Figure 19.)
Figure 19. Cam Lever Locked into Retention Frame
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Heatsink Installation
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
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21. Connect the fan power lead to the proper connector on the motherboard.
Figure 20. Installed Heatsink
22. Check the installation completely to make sure heatsink is installed correctly before starting
the system.
23. Power-on the system.
24. Verify immediately that the fan on the processor heatsink is turning at a rapid rate.
If the fan is spinning at a slow rate or not spinning at all, power-down the system immediately
to avoid any thermal damage.
Chapter 4
Heatsink Installation
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30925 Rev. 3.04 February 2004
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Heatsink Installation
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30925 Rev. 3.04 February 2004
Builder’s Guide for AMD Opteron™ Processor-
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Chapter 5
Hardware Considerations
AMD frequently updates its list of motherboard solutions. For the most up-to-date list of providers
please visit our Web site.
In EMEA, for the most up-to-date list of providers please visit our Web site.
5.1
System Enclosures and Chassis Selection
AMD Opteron™ processor-based motherboards can leverage industry-standard tower or pedestal
chassis. The selection of the proper system chassis is a critical element to the success of the
finished system. For best results, a system builder should always contact the motherboard and
chassis suppliers or vendors to verify that each of the chosen components supports the desired
system configuration. The following data is a basic guideline that has been tested by the
engineering staff at AMD.
Note: This data is only a guideline and is not a substitute for a system builder verifying that a
chassis meets industry and customer requirements, nor is it a substitute for the system
builder conducting its own research, testing, and validation.
5.1.1
Basic System Enclosure Selection Guidelines
The choice of the appropriate system enclosure depends on many factors as follows:
• It must be compatible with the chosen motherboard and power supply. Confirm the
motherboard and power supply requirements with those suppliers.
• It must allow enough airflow through the system to adequately cool all the internal
components, especially critical parts like the processor.
• It must have good fit and finish, e.g., no razor-sharp edges.
5.1.2
Basic Chassis Selection Guidelines
The following are some basic guidelines to aid in finding an enclosure with adequate cooling
capability:
• Use 80 mm fans or larger.
• Choose a chassis with a fan in the back that is in addition to the processor fan.
Chapter 5
Hardware Considerations
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