Intel Extreme Desktop Motherboard BOXDX79SR User Manual

PRoDUCT BRIef  
Intel® Desktop Board DX79SR  
extreme Series  
ATX Form Factor  
Primed and Ready!  
Introducing the Intel® Desktop Board DX79SR, designed to unleash  
the power of the new Intel® Core™ i7 Processors in the LGA2011 package  
attacks and enables advance security checks  
and balances. Fast Boot also speeds through  
boot times and eliminates unnecessary  
delays. Intel® Extreme Memory Profiles (Intel®  
XMP) is a performance-packed expansion of  
the standard DDR3 memory specification,  
enabling a robust and stable solution for  
ultra-fast memory.  
UV reactive SATA cables  
Extreme mouse pad  
Build Upon a Winner  
With the Intel® Desktop Board DX79SR, Intel  
is once again offering the board of choice  
for champion gamers and performance  
enthusiasts who live to push their systems  
WAY beyond the limits. The DX79SR board  
offers the customization features every  
power user needs. The Overclocking  
Bluetooth*/Wi-Fi*module  
Board and back panel I/O layout stickers  
Quick reference guide  
Intel® Express Installer driver  
and software DVD  
Assistant provides single-step overclocking1  
to boost performance to quickly maximize  
your gaming advantage. The massive data  
throughput and support for the Intel® Core™  
i7 processor allows more applications to run  
simultaneously, with less wait time.  
Windows* Premium WHQL certified  
NVIDIA* SLI* Bridge connectors  
Post code information card  
The Boxed Intel® Desktop Board  
DX79SR Solution Includes:  
Intel® Desktop Board DX79SR  
ATX 2.2 compliant I/O shield  
Software Included:  
Power for the Hottest New Games  
Capability  
Security  
Software Included  
With incredible support for up to twelve  
threads of raw processing power, unprec-  
edented bandwidth, quad-channel DDR3  
memory with support for up to eight DIMMs,  
the Intel Desktop Board DX79SR goes where  
no desktop board has gone before.  
• Protect against antivirus threats with McAfee*  
and ESET* Smart Security  
Gaming  
Utilities  
• Unlock your gaming potential with Razer* Peripherals  
discounts and Steam* online games  
• Increase productivity with Splashtop* Remote  
Desktop and LapLink* PCMover. Monitor PC Health  
with Intel® Desktop Utility  
BIOS Vault Technology protects the board  
and provides fault tolerant and secure firm-  
ware. Intel BIOS is protected from outside  
Intel® Desktop Board DX79SR Extreme Series  
Technical Specifications  
Memory Types  
• DDR3 2400+ O.C. SDRAM memory support  
• Non-ECC Memory  
PRoCeSSoR  
Processor Support  
eNvIRoNMeNT  
Operating Temperature  
• 0° C to +55° C  
Storage Temperature  
• –20° C to +70° C  
HARDWARe MANAGeMeNT feATUReS  
• Processor fan speed control  
• System chassis fan speed control  
• Voltage and temperature sensing  
• Fan sensor inputs used to monitor fan activity  
• Power management support for ACPI 3.0b  
• Intel® Core™ i7 processors in the LGA2011 package  
• Intel® Turbo Boost Technology2  
• Intel® Hyper-Threading Technology3  
• Integrated Memory Controller with support for up  
to 64 GB4 of system memory DDR3 2400+ O.C.  
SDRAM  
Memory Modes  
• Quad- or tri- or dual- or single-channel  
operation support  
ReGULATIoNS AND SAfeTy STANDARDS  
United States and Canada  
UL 1950, Third edition—CAN/CSA C22.2  
No. 950-95 with recognized U.S. and Canadian  
component marks  
INTePRo 10/100/1000  
NeTWoRk CoNNeCTIoN  
• Dual Intel® LAN on the back panel  
• New low-power design can meet Energy Star*  
5.0 specifications  
Memory Voltage  
• 1.35 V low voltage  
• 1.5 V standard JEDEC voltage  
• Support for Intel® XMP extended voltage profiles  
• Intel® Fast Memory Access  
• Supports Intel® 64 architecture6  
CHIPSeT  
Intel® X79 Express Chipset  
• Intel® X79 PCH  
• Intel® Rapid Storage Manager (RAID 0, 1, 5, 10)  
• Two SATA (6.0 Gb/s) and four SATA (3.0 Gb/s) ports  
• Two SATA (6.0 Gb/s) via Marvell controller  
Europe  
JUMPeRS AND fRoNT PANeL CoNNeCToRS  
Jumpers  
• Single configuration jumper design  
• Jumper access for BIOS maintenance mode  
Nemko certified to EN 60950 International  
Nemko certified to IEC 60950  
(CB report with CB certificate)  
eMC Regulations (tested in  
representative chassis)  
United States  
FCC Part 15, Class B  
FCC Part 15, Class B open-chassis (cover off) testing  
Canada  
ICES-003, Class B  
Europe  
EMC directive 89/336/EEC; EN 55022:1998  
Class B; EN 55024:1998  
Australia/New Zealand  
AS/NZS 3548, Class B  
eXPANSIoN CAPABILITIeS  
• Three PCI Express* x16 connectors (configured  
as x16/x16/x8 in Tri graphics mode)  
• Two PCI Express 2.0 x1 slots  
• One PCI slot  
Front Panel Connectors  
• Reset, HD LED, Power LEDs, power on/off  
• Four front-panel Hi-Speed USB 2.0 headers  
• One front-panel Super-Speed USB 3.0 headers  
• Front-panel audio header  
USB PoRTS  
AUDIo  
• Six Hi-Speed USB 2.0 ports via back panel  
• Eight additional Hi-Speed USB 2.0 ports via four  
internal headers  
• 10-channel Intel® High Definition Audio5 codec  
• 8-channel via the back panel  
• 2-channel via the front panel  
• Back panel support for output via optical cable  
• One internal header for S/PDIF output for  
HDMI* support  
• One IEEE 1394a header  
• Six Super-Speed USB 3.0 ports via NEC controller  
MeCHANICAL  
Board Style  
• ATX  
Board Size  
11.6¨ x 9.6¨ (29.46 cm x 24.38 cm)  
Baseboard Power Requirements  
• ATX 12 V  
SySTeM BIoS  
• 64 Mb Flash EEPROM with Intel® Platform  
Innovation Framework for EFI Plug and Play,  
IDE drive auto-configure  
• Advanced configuration and power interface  
V3.0b, DMI 2.5  
SySTeM MeMoRy  
Memory Capacity  
Taiwan  
• Eight 240-pin DIMM connectors supporting  
quad channel memory. Two double-sided  
DIMMS per channel  
CNS 13438, Class B International  
CISPR 22:1997, Class B  
fAST BooT  
• Fast boot  
• Intel® Express BIOS update support: BIOS update  
via F7 function key  
• Maximum system memory up to 64 GB7 using  
8 GB double-sided DIMMs  
3
Intel® Desktop Board DX79SR Extreme Series  
Technical Specifications  
environmental Compliance  
For ordering information, visit www.intel.com  
For the most current product information, visit www.intel.com/go/idb  
Complies with US CRF via EN55022 +6 db in  
system configurations with an open chassis and  
EU Directive 89/336/EEC and use via EN55022  
and EN50082-1 in a representative chassis.  
Lead-Free: The symbol is used to identify  
electrical and electronic assemblies and  
components in which the lead (Pb) concentra-  
tion level in any of the raw materials and the end  
product is not greater than 0.1% by weight (1000  
ppm). This symbol is also used to indicate confor-  
mance to lead-free requirements and definitions  
adopted under the European Union’s Restriction  
on Hazardous Substances (RoHS) directive,  
2002/95/EC.  
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Warning: Altering clock frequency and/or voltage may (i) reduce system  
Maximum peak memory bandwidth requires four DDR3 modules to  
be populated in each of the blue memory slots. DDR3 2400 memory  
support on this motherboard requires advanced knowledge of BIOS and  
memory tuning; individual results may vary. For specific supported memory  
for more details.  
Intel® High Definition Audio requires a system with an appropriate Intel®  
chipset and a motherboard with an appropriate codec and the necessary  
drivers installed. System sound quality will vary depending on actual imple-  
mentation, controller, codec, drivers, and speakers. For more information  
about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm.  
64-bit computing on Intel® architecture requires a computer system with a  
processor, chipset, BIOS, operating system, device drivers, and applications  
enabled for Intel® 64 architecture. Processors will not operate (including 32-  
bit operation) without an Intel 64 architecture-enabled BIOS. Performance  
will vary depending on your hardware and software configurations. See  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION  
WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY  
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY  
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN  
INTELS TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,  
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS  
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR  
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES  
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANT-  
ABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER  
INTELLECTUAL PROPERTY RIGHT.  
Intel products are not intended for use in medical, life-saving, or life-  
sustaining applications. Intel may make changes to specifications and  
product descriptions at any time, without notice.  
All products, dates, and figures specified are preliminary based on current  
expectations, and are subject to change without notice. Availability in different  
channels may vary.  
Actual Intel® Desktop Board may differ from the image on the box.  
*Other names and brands may be claimed as the property of others.  
0312/JB/HBD/PDF 326850-001US  
stability and useful life of the system and processor; (ii) cause the processor  
and other system components to fail; (iii) cause reductions in system perfor-  
mance; (iv) cause additional damage; and (v) affect system data integrity.  
Intel has not tested, and does not warranty, the operation of the processor  
beyond its specifications.  
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5
Intel® Turbo Boost Technology requires a PC with a processor with  
Intel Turbo Boost Technology capability. Intel Turbo Boost Technology  
performance varies depending on hardware, software, and overall system  
configuration. Check with your PC manufacturer on whether your system  
boost for more information.  
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3
Intel® Hyper-Threading Technology requires a computer system with a  
processor supporting HT Technology and an HT Technology-enabled  
chipset, BIOS, and operating system. Performance will vary depending on  
the specific hardware and software you use. For more information including  
info/hyperthreading  
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System resources and hardware (such as PCI and PCI Express*) require  
physical memory address locations that can reduce available addressable  
system memory. This could result in a reduction of as much as 1 GB or more  
of physical addressable memory being available to the operating system and  
applications, depending on the system configuration and operating system.  
Copyright © 2012 Intel Corporation. All rights reserved. Intel, the Intel  
logo, and Intel Core are trademarks of Intel Corporation in the U.S.  
and other countries.  

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