Compaq MSB900 User Manual

Detailed Technical USER MANUAL FOR:  
3.5”-SBC  
MSB900/L  
Nordstrasse 11/F  
CH- 4542 Luterbach  
Tel.:  
Fax:  
Email:  
++41 (0)32 681 58 00  
++41 (0)32 681 58 01  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
Table of Contents  
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DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
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DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
1. PREFACE  
The information contained in this manual has been carefully checked and is believed to be accurate; it is  
subject to change without notice. Product advances mean that some specifications may have changed.  
DIGITAL-LOGIC AG assumes no responsibility for any inaccuracies, or the consequences thereof, that may  
appear in this manual. Furthermore, DIGITAL-LOGIC AG does not accept any liability arising from the use or  
application of any circuit or product described herein.  
1.1. Trademarks  
DIGITAL-LOGIC, DIGITAL-LOGIC-Logo, MICROSPACE, and smartModule are registered trademarks  
owned worldwide by DIGITAL-LOGIC AG, Luterbach (Switzerland). In addition, this document may include  
names, company logos, and registered trademarks which are, therefore, proprietary to their respective own-  
ers.  
1.2. Disclaimer  
DIGITAL-LOGIC AG makes no representations or warranties with respect to the contents of this manual, and  
specifically disclaims any implied warranty of merchantability or fitness, for any particular purpose. DIGITAL-  
LOGIC AG shall, under no circumstances, be liable for incidental or consequential damages or related ex-  
penses resulting from the use of this product, even if it has been notified of the possibility of such damage.  
1.3. Environmental Protection Statement  
This product has been manufactured to satisfy environmental protection requirements wherever possible.  
Many of the components used (structural parts, printed circuit boards, connectors, batteries, etc.) are capa-  
ble of being recycled. Final disposal of this product after its service life must be accomplished in accordance  
with applicable country, state, or local laws or regulations.  
1.4. Who should use this Product  
Electrical engineers with know-how in PC-technology.  
Because of the complexity and the variability of PC-technology, we cannot guarantee that the product  
will work in any particular situation or set-up. Our technical support will try to help you find a solution.  
Pay attention to electrostatic discharges; use a CMOS protected workplace.  
Power supply must be OFF when working on the board or connecting any cables or devices.  
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MSB900/L Detailed Technical Manual V1.0  
1.5. Recycling Information  
All components within this product fulfill the requirements of the RoHS (Restriction of Hazardous Substances  
Directive). The product is soldered with a lead free process.  
1.6. Technical Support  
1.  
2.  
Contact your local DIGITAL-LOGIC Technical Support, in your country.  
Use the Internet Support Request form at http://support.digitallogic.ch/ embedded products ꢀ  
New Support Request  
Support requests are only accepted with detailed information about the product (i.e., BIOS-, Board-  
version)!  
1.7. Limited Two Year Warranty  
DIGITAL-LOGIC AG guarantees the hardware and software products it manufactures and produces to be  
free from defects in materials and workmanship for two years following the date of shipment from DIGITAL-  
LOGIC AG, Switzerland. This warranty is limited to the original purchaser of the product and is not transfer-  
able.  
During the two year warranty period, DIGITAL-LOGIC AG will repair or replace, at its discretion, any defec-  
tive product or part at no additional charge, provided that the product is returned, shipping prepaid, to  
DIGITAL-LOGIC AG. All replaced parts and products become property of DIGITAL-LOGIC AG.  
Before returning any product for repair, direct customers of DIGITAL-LOGIC AG, Switzerland are re-  
quired to register a RMA (Return Material Authorization) number in the Support Center at  
All other customers must contact their local distributors for returning defective materials.  
This limited warranty does not extend to any product which has been damaged as a result of accident, mis-  
use, abuse (such as use of incorrect input voltages, wrong cabling, wrong polarity, improper or insufficient  
ventilation, failure to follow the operating instructions that are provided by DIGITAL-LOGIC AG or other con-  
tingencies beyond the control of DIGITAL-LOGIC AG), wrong connection, wrong information or as a result of  
service or modification by anyone other than DIGITAL-LOGIC AG. Nor if the user has insufficient knowledge  
of these technologies or has not consulted the product manuals or the technical support of DIGITAL-LOGIC  
AG and therefore the product has been damaged.  
Empty batteries (external and onboard), as well as all other battery failures, are not covered by this manufac-  
turer’s limited warranty.  
Except, as directly set forth above, no other warranties are expressed or implied, including, but not limited to,  
any implied warranty of merchantability and fitness for a particular purpose, and DIGITAL-LOGIC AG ex-  
pressly disclaims all warranties not stated herein. Under no circumstances will DIGITAL-LOGIC AG be liable  
to the purchaser or any user for any damage, including any incidental or consequential damage, expenses,  
lost profits, lost savings, or other damages arising out of the use or inability to use the product.  
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1.8. Explanation of Symbols  
CE Conformity  
This symbol indicates that the product described in this manual is in compliance with all ap-  
plied CE standards.  
Caution, Electric Shock!  
This symbol and title warn of hazards due to electrical shocks (> 60V) when touching prod-  
ucts or parts of them. Failure to observe the precautions indicated and/or prescribed by the  
law may endanger your life/health and/or result in damage to your equipment.  
Caution, Electric Shock!  
This symbol and title warn of hazards due to electrical shocks (> 32V) when touching prod-  
ucts or parts of them. Failure to observe the precautions indicated and/or prescribed by the  
law may endanger your life/health and/or result in damage to your equipment  
Warning, ESD Sensitive Device!  
This symbol and title inform that electronic boards and their components are sensitive to  
Electro Static Discharge (ESD). In order to ensure product integrity at all times, care must  
always be taken while handling and examining this product.  
Attention!  
This symbol and title emphasize points which, if not fully understood and taken into consid-  
eration by the reader, may endanger your health and/or result in damage to your equipment.  
Note...  
This symbol and title emphasize aspects the user should read through carefully for his, or  
her, own advantage.  
Warning, Heat Sensitive Device!  
This symbol indicates a heat sensitive component.  
Safety Instructions  
This symbol shows safety instructions for the operator to follow.  
This symbol warns of general hazards from mechanical, electrical,  
and/or chemical failure. This may endanger your life/health and/or  
result in damage to your equipment.  
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MSB900/L Detailed Technical Manual V1.0  
1.9. Applicable Documents and Standards  
The following publications are used in conjunction with this manual. When any of the referenced specifica-  
tions are superseded by an approved revision, that revision shall apply. All documents may be obtained from  
their respective organizations.  
Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright  
© 1996-2003 Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix Tech-  
nologies Ltd., Toshiba Corporation. All rights reserved. http://www.acpi.info/  
ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) In-  
terface Circuits, January 1, 2001. http://www.ansi.org/  
ANSI INCITS 361-2002: AT Attachment with Packet Interface - 6 (ATA/ATAPI-6), November 1, 2002.  
ANSI INCITS 376-2003: American National Standard for Information Technology – Serial Attached  
SCSI (SAS), October 30, 2003. http://www.ansi.org/  
Audio Codec ’97 Revision 2.3 Revision 1.0, April 2002 Copyright © 2002 Intel Corporation. All rights  
Display Data Channel Command Interface (DDC/CI) Standard (formerly DDC2Bi) Version 1, August  
14, 1998 Copyright © 1998 Video Electronics Standards Association. All rights reserved.  
ExpressCard Standard Release 1.0, December 2003 Copyright © 2003 PCMCIA. All rights reserved.  
IEEE 802.3-2002, IEEE Standard for Information technology, Telecommunications and information ex-  
change between systems–Local and metropolitan area networks–Specific requirements – Part 3: Car-  
rier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer  
Specifications. http://www.ieee.org  
IEEE 802.3ae (Amendment to IEEE 802.3-2002), Part 3: Carrier Sense Multiple Access with Collision  
Detection (CSMA/CD) Access Method and Physical Layer Specifications, Amendment: Media Access  
Control (MAC) Parameters, Physical Layers, and Management Parameters for 10 GB/s Operation.  
Intel Low Pin Count (LPC) Interface Specification Revision 1.1, August 2002 Copyright © 2002 Intel  
PCI Express Base Specification Revision 1.1, March 28, 2005, Copyright © 2002-2005 PCI Special In-  
terest Group. All rights reserved. http://www.pcisig.com/  
PCI Express Card Electromechanical Specification Revision 1.1, March 28, 2005, Copyright © 2002-  
2005 PCI Special Interest Group. All rights reserved. http://www.pcisig.com/  
PCI Local Bus Specification Revision 2.3, March 29, 2002 Copyright © 1992, 1993, 1995, 1998, 2002  
PCI Special Interest Group. All rights reserved. http://www.pcisig.com/  
PCI-104 Specification, Version V1.0, November 2003. All rights reserved. http://www.pc104.org  
PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004,  
PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500, Wake-  
field, MA 01880, USA, Tel: 781.224.1100, Fax: 781.224.1239. http://www.picmg.org/  
Serial ATA: High Speed Serialized AT Attachment Revision 1.0a January 7, 2003 Copyright © 2000-  
2003, APT Technologies, Inc, Dell Computer Corporation, Intel Corporation, Maxtor Corporation, Sea-  
gate Technology LLC. All rights reserved. http://www.sata-io.org/  
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DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
Smart Battery Data Specification Revision 1.1, December 11, 1998. www.sbs-forum.org  
System Management Bus (SMBus) Specification Version 2.0, August 3, 2000 Copyright © 1994, 1995,  
1998, 2000 Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear  
Technology Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, Power-  
Smart, Inc., Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc. All rights reserved.  
Universal Serial Bus Specification Revision 2.0, April 27, 2000 Copyright © 2000 Compaq Computer  
Corporation, Hewlett-Packard Company, Intel Corporation, Lucent Technologies Inc., Microsoft Corpo-  
ration, NEC Corporation, Koninklijke Philips Electronics N.V. All rights reserved. http://www.usb.org/  
1.10. For Your Safety  
Your new DIGITAL-LOGIC product was developed and tested carefully to provide all features neces-  
sary to ensure its compliance with electrical safety requirements. It was also designed for a long,  
fault-free life. However, this life expectancy can be drastically reduced by improper treatment during  
unpacking and installation. Therefore, in the interest of your own safety and for the correct operation  
of your new DIGITAL-LOGIC product, please comply with the following guidelines.  
Attention!  
All work on this device must only be carried out by sufficiently skilled personnel.  
Caution, Electric Shock!  
Before installing your new DIGITAL-LOGIC product, always ensure that your mains power is  
switched off. This applies also to the installation of piggybacks or peripherals. Serious electri-  
cal shock hazards can exist during all installation, repair and maintenance operations with this  
product. Therefore, always unplug the power cable and any other cables which provide  
external voltage before performing work.  
Warning, ESD Sensitive Device!  
Electronic boards and their components are sensitive to static electricity. In order to ensure  
product integrity at all times, be careful during all handling and examinations of this product.  
1.11. RoHS Commitment  
DIGITAL-LOGIC AG is committed to develop and produce environmentally friendly products according to the  
Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC) and the Waste Electrical and Electronic  
Equipment (WEEE) Directive (2002/96/EC) established by the European Union. The RoHS directive was  
adopted in February 2003 by the European Union and came into effect on July 1, 2006. It is not a law but a  
directive, which restricts the use of six hazardous materials in the manufacturing of various types of elec-  
tronic and electrical equipment. It is closely linked with the Waste Electrical and Electronic Equipment Direc-  
tive (WEEE) 2002/96/EC, which has set targets for collection, recycling and recovery of electrical goods and  
is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste.  
Each European Union member state is adopting its own enforcement and implementation policies using the  
directive as a guide. Therefore, there could be as many different versions of the law as there are states in the  
EU. Additionally, non-EU countries like China, Japan, or states in the U.S. such as California may have their  
own regulations for green products, which are similar, but not identical, to the RoHS directive.  
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MSB900/L Detailed Technical Manual V1.0  
RoHS is often referred to as the "lead-free" directive but it restricts the use of the following substances:  
Lead  
Mercury  
Cadmium  
Chromium VI  
PBB and PBDE  
The maximum allowable concentration of any of the above mentioned substances is 0.1% (except for Cad-  
mium, which is limited to 0.01%) by weight of homogeneous material. This means that the limits do not apply  
to the weight of the finished product, or even to a component but to any single substance that could (theo-  
retically) be separated mechanically.  
1.11.1. RoHS Compatible Product Design  
All DIGITAL-LOGIC standard products comply with RoHS legislation.  
Since July 1, 2006, there has been a strict adherence to the use of RoHS compliant electronic and mechani-  
cal components during the design-in phase of all DIGITAL-LOGIC standard products.  
1.11.2. RoHS Compliant Production Process  
DIGITAL-LOGIC selects external suppliers that are capable of producing RoHS compliant devices. These  
capabilities are verified by:  
1. A confirmation from the supplier indicating that their production processes and resulting devices are  
RoHS compliant.  
2. If there is any doubt of the RoHS compliancy, the concentration of the previously mentioned sub-  
stances in a produced device will be measured. These measurements are carried out by an accred-  
ited laboratory.  
1.11.3. WEEE Application  
The WEEE directive is closely related to the RoHS directive and applies to the following devices:  
Large and small household appliances  
IT equipment  
Telecommunications equipment (although infrastructure equipment is exempt in some countries)  
Consumer equipment  
Lighting equipment – including light bulbs  
Electronic and electrical tools  
Toys, leisure and sports equipment  
Automatic dispensers  
It does not apply to fixed industrial plants and tools. The compliance is the responsibility of the company that  
brings the product to market, as defined in the directive. Components and sub-assemblies are not subject to  
product compliance. In other words, since DIGITAL-LOGIC does not deliver ready-made products to end  
users the WEEE directive is not applicable for DIGITAL-LOGIC. Users are nevertheless encouraged to prop-  
erly recycle all electronic products that have reached the end of their life cycle.  
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MSB900/L Detailed Technical Manual V1.0  
1.12. Swiss Quality  
100% Made in Switzerland  
DIGITAL-LOGIC is a member of "Swiss-Label"  
This product was not manufactured by employees earning  
piecework wages  
This product was manufactured in humane work conditions  
All employees who worked on this product are paid  
customary Swiss market wages and are insured  
ISO 9000:2001 (quality management system)  
1.13. The Swiss Association for Quality and Management Sys-  
tems  
The Swiss Association for Quality and Management Systems (SQS) provides certification and assessment  
services for all types of industries and services. SQS certificates are accepted worldwide thanks to accredita-  
tion by the Swiss Accreditation Service (SAS), active membership in the International Certification Network,  
IQNet, and co-operation contracts/agreements with accredited partners.  
The SQS Certificate ISO 9001:2000 has been issued to DIGITAL-LOGIC AG, the entire company, in the field  
of development, manufacturing and sales of embedded computer boards, embedded computer modules and  
computer systems. The certification is valid for three years at which time an audit is performed for recertifica-  
tion.  
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2. OVERVIEW  
2.1. Standard Features of the MSB900/L  
The MICROSPACE 3.5”-SBC is a miniaturized modular device incorporating the major elements of a PC/AT  
compatible computer. It includes standard PC/AT compatible elements, such as:  
Powerful GEODELX-900 600MHz  
Legacy BIOS ROM  
DDR-SODIMM 200pin socket (for DDR-RAM 256-1024MB)  
128k second level cache  
Timers  
DMA  
Real-time clock with CMOS-RAM and battery buffer (only on MSB900, not on MSB900L)  
LPT1 parallel port  
COM1-, COM2- RS2332 serial port  
Speaker interface  
PS/2-keyboard and mouse interface (shared on one mini DIN connector)  
PATA-IDE hard disk interface  
VGA video interface  
PCI/104 (one slot), limited I/O connector space  
4 Channels USB 2.0  
Onboard CF socket Type II  
2.2. Unique Features  
The MICROSPACE 3.5”-SBC includes all standard PC/AT functions plus unique DIGITAL-LOGIC AG en-  
hancements, such as:  
Two channel LAN Ethernet, INTEL 82551QM (LAN A) and INTEL 82551ER (LAN B)  
Boot from LAN (PXE and RPL)  
Single 8 - 32Volt supply  
Video input (only on MSB900, not available on MSB900L)  
Watchdog  
EEPROM for setup and configuration  
UL approved parts  
Optional: interface for operator display (LVDS, COM2, CRT, USB, SMBus)  
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MSB900/L Detailed Technical Manual V1.0  
2.3. MSB900 Block Diagram  
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2.4. MSB900/MSB900L specifications  
CPU  
Specification  
GEODE LX900  
1.25V very low powered  
Real / Protected  
x86  
32Bits  
128kB  
32 lines  
16GB  
CPU  
CPU Core Supply  
Mode  
Compatibility  
Word Size  
Secondary Cache  
Physical Addressing  
Virtual Addressing  
Clock Rates  
Socket Standard  
600MHz  
Soldered BGA  
Chipset  
Specification  
AMD LX900  
AMD CS5536  
Northbridge  
Southbridge  
LAN  
Audio  
Codec  
2x 10/100Mbit Intel 82551QM (LAN A), Intel 82551ER (LAN B)  
Stereo In and Stereo Line-Out  
AD1985 up to 96kHz sampling rate, 16Bit (Analog Devices)  
Not on board  
16MByte Video-DDRAM  
Firewire IEEE1394  
Video  
Power Management:  
Specification  
The LX900 supports ACPI and APM Version 1.2  
The following ACPI Sleep States are supported:  
- S1 (Standby)  
- S3 (Suspend to RAM) not available  
- S4 (Hibernation)  
DMA:  
Specification  
8237A comp.  
4 channel 8bit  
3 channel 16bit  
Interrupts:  
Specification  
8259 comp.  
8 + 7 levels  
PC compatible  
Timers:  
Specification  
8254 comp.  
3 programmable counters/timers  
Memory:  
Specification  
SODIMM  
SODIMM200pin DDR PC2700 333MHz 256-1024MByte  
Video  
Specification  
Controller  
BUS  
Enhanced BIOS  
Memory  
CRT-Monitor  
Video Input  
GEODE LX900  
32Bit high speed 33MHz PCI bus  
VGA / LCD BIOS  
2-16MByte shared RAM  
VGA, SVGA up to 1920x1440  
MSB900: yes, 1 channel  
MSB900L: no  
Drivers  
WIN2000, XP  
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Mass Storage  
Specification  
FD  
HD  
Floppy disk interface not supported  
E-IDE interface, AT-type, for max. 2 hard disks, 44pin connector,  
for 1.3, 1.8 and 2.5" hard disk with 44 pins IDE  
Standard AT Interfaces:  
Specification  
Name  
COM1  
COM2  
FIFO  
yes  
yes  
IRQs  
IRQ4  
IRQ3  
Addr.  
3F8  
2F8  
Standard Option  
RS232C  
RS232C  
Serial  
COM1/2 available on headers onboard.  
For DSub-connectors, option MSB800-CON is needed.  
W83627HF from WINBOND  
LPT1 printer interface mode: SPP (output), EPP (bidir.)  
AT or PS/2-keyboard  
PS/2  
No speaker  
Integrated into the chipset, RTC with CMOS-RAM 256Byte  
<5 µA  
Onboard 3.6Volt Lithium 400mAh available  
External connection, no onboard battery available  
SuperIO Chip  
Parallel  
Keyboard  
Mouse  
Speaker  
RTC  
Backup current  
RTC-backup MSB900  
RTC-backup MSB900L  
BUS  
Specification  
PCI/104  
Clock  
PCI 32Bit Bus, 1 slot  
33MHz defined by the GEODE  
USB  
Specification  
USB  
Transfer rate  
Channels  
2.0  
480MBps, 12.5MBps / 1.5MBps  
4
Peripheral Extension  
ISA  
PCI MSB900  
PCI MSB900L  
Specification  
Not supported  
With PCI/104 BUS (1 slot), limited I/O space  
Not available  
Power Supply  
Working  
Specification  
8-32Volt 5% (peak 36Volt)  
Unspecified  
MSB900/L with HD, MS/KB (PS/2), CRT Monitor  
Windows XP Desktop: type 8.5-10W  
MSB900/L:  
Power Rise Time  
Power consumption  
Standby power consumption  
Windows Standby: 2.5W (without MS/KB wakeup function)  
Windows Standby: 4.5W (with PS/2 wakeup function)  
Physical Characteristics  
Specification  
Dimensions  
Length: 146 mm  
Depth: 102 mm  
Height: 20 mm  
160g  
1.6mm / 0.0625 inches nominal  
Multilayer  
Weight  
PCB Thickness  
PCB Layer  
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Operating Environment  
Relative humidity  
Vibration  
Shock  
Temperature  
Specification  
5-90%, non-condensing  
5-2000Hz, 0.1G  
1G  
MSB900*:  
Operating: Standard version: -25°C to +70°C  
Extended version: -40°C to +85°C  
Storage: -55°C to +85°C  
* = with passive cooler  
MSB900L**:  
Operating: Standard version: 0°C to +60°C  
Storage: -55°C to +85°C  
** = without passive cooler  
EMI/EMC (IEC1131-2 refer MIL  
461/462)  
Specification  
ESD Electro Static Discharge  
IEC 801-2, EN55101-2, VDE 0843/0847 Part 2  
Metallic protection needed  
Separate ground layer included  
15kV single peak  
REF Radiated Electromagnetic Field IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9. (not tested)  
EFT Electric Fast Transient (Burst)  
IEC 801-4, EN50082-1, VDE 0843 Part 4  
250V - 4kV, 50 ohms, Ts=5ns  
Grade 2: 1kV Supply, 500 I/O, 5kHz  
IEC 801-5, IEEE587, VDE 0843 Part 5  
SIR Surge Immunity Requirements  
Supply:  
I/O:  
2kV, 6 pulse/minute  
500V, 2 pulse/minute  
FD, CRT: none  
EN55022  
High-frequency Radiation  
Compatibility  
Specification  
MSB900/L  
Mechanically compatible to 3.5inch industrial embedded com-  
puter boards  
All information is subject to change without notice.  
2.5. Examples of Ordering Codes  
802220  
802221  
802205  
MSB900 with LX900 CPU, 0MB-RAM, Battery, PCI/104 and Video input  
MSB900L with LX900 CPU, 0MB RAM, …  
MSB800CON COM1, LPT1 Expansion board.  
These are only examples; for current ordering codes, please see the current price list.  
2.6. Related Application Notes  
Application Notes are available at http://www.digitallogic.com support, or on any DIGITAL-LOGIC  
Application CD.  
#
Description  
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2.7. Dimensions & Diagrams  
2.7.1.  
MSB900/L  
Board / Version  
Unit:  
Tolerance:  
+ / - 0.1mm  
Date / Author  
MSB900/L  
mm (millimeter)  
25.10.2006 / BRR  
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2.7.2.  
MSB800CON Part Nr 802205  
Board / Version  
Unit:  
Tolerance:  
+ / - 0.1mm  
Date / Author  
MSB800CON  
mm (millimeter)  
25.10.2006 / BRR  
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2.8. MSB900/L Incompatibilities to a standard PC/AT  
None.  
2.9. Related Application Notes  
Application Notes are available at http://www.digitallogic.com support, or on any DIGITAL-LOGIC  
Application CD.  
#
Description  
2.10. High Frequency Radiation (to meet EN55022)  
All connectors are filtered onboard to comply with the EMI standards.  
The following filters are used:  
Interface  
3db-  
Frequency  
Inductivity  
L and R  
Capacitor  
to GND  
Filter-Type  
Protection  
VGA-RGB  
VGA-HS/VS  
VGA-VCC  
Ferrite  
33ohms  
Ferrite  
2x 10pF  
33pF  
1nF  
0V/3V Diode  
0V/3V Diode  
None  
Video Input  
USB  
-
-
-
-
None  
Inductors  
none  
DLP31D  
Diode SRV05-4  
GND/5V  
IDE  
33ohms series  
Ferrite  
-
-
None  
None  
Sound I/O  
1nF  
PS2-KB  
Ferrite  
Ferrite  
Ferrite  
Ferrite  
47pF  
47pF  
1nF  
None  
None  
None  
None  
PS2-MS  
PS2-VCC  
PS2-GND  
1nF  
COM1  
COM2  
LPT1  
47pF  
47pF  
47pF  
MAX211E  
MAX211E  
none  
LAN  
Integrated  
PULSE  
J00-0065NL  
Isolated 500V  
None  
All 33MHz-Clocks  
33Ohms series 10pF  
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2.11. Battery-Lifetime  
Battery specs:  
Lowest temp.  
-40°C  
Nominal temp.  
+20°C  
Highest temp.  
+85°C  
Manufacturer:  
Type:  
Capacity versus Temp:  
Voltage versus Temp.  
Nominal values:  
pba  
ER10280  
10uA  
10uA  
420mAh  
3.6V  
400mAh  
3.6V  
350mAh  
Ca. 3.6V  
3.6V / 400mAh @ 0.5mA / -55°C...~+85°C  
Information taken from the datasheet of ER10280  
PRODUCT:  
Temperature  
°C  
Battery voltage  
V
VCC (+5)  
switched ON  
µA  
VCC (+5V)  
switched off  
µA  
Battery current:  
Battery-Lifetime:  
+25°C  
+25°C  
3.6  
< 1  
< 3  
>3.5 years  
>3.5 year  
2.11.1. External battery assembling (for the MSB900L):  
On the MSB900L board, an external battery can be connected to J3. Attach the battery ground to pin 2.  
If the customer wants to connect an external battery, then some precautions have to be taken:  
The battery is prohibited from charging. Do not use a rechargeable battery!  
The RTC device defines a voltage level of 3.0-3.6V, so use an external battery within this range (inclusive of  
the diode which is pre-assembled onboard).  
3. BUS SIGNALS  
3.1. Addressing PCI Devices  
3.1.1.  
MSB900 and MSB900L  
DEVICE  
IDSEL  
PIRQ  
#REG #GNT  
Remarks  
SLOT 1  
AD20 A / B / C / D  
3
3
For additional cards (peripheral boards)  
Onboard used:  
LAN A  
LAN B  
AD28  
AD29  
AD27  
C
A
A / B  
1
4
5
1
4
5
Onboard device  
Onboard device  
Optional device  
Mini-PCI  
CPU  
AD11  
A
2
2
Onboard device  
23  
         
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
4. BIOS HISTORY  
This BIOS history is for the MSB900/L.  
This BIOS history is not for the following products:  
MSEP900, MSM900, SM900  
Version:  
Date:  
Status:  
Modifications:  
1.23  
02.2007  
Initial Release  
-
-
-
-
-
-
-
Note…  
This product has a unique BIOS version. For a description of the other features of the BIOS, please  
refer to the driver/software/BIOS manual “GEODE_LX800-LX900” on the Product CD.  
24  
 
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
5. DETAILED SYSTEM DESCRIPTION  
This system configuration is based on the ISA architecture. Check the I/O and memory map in this chapter.  
5.1. Power Requirements  
The power is connected through the wide-range power connector. The supply uses only the +8V to +32V  
and the ground connection.  
Attention:  
Make sure the power plug is wired correctly before supplying power to the board! A built-in diode  
protects the board against reverse polarity.  
Tolerance of supply:  
Must be within 8-32Volt norm.  
Test environment for power consumption measurement:  
Peripheries:  
Hard disk Hitachi Model HTA422020F9ATJ0 20GB  
Monitor Eizo Flexscan F340I-W  
PS/2-KB Logitech Model iTouch Keyboard  
PS/2-MS Logitech Model M-CAA43  
Software:  
MS-DOS V6.22  
WinXP  
Current consumption @ 12Volt supply at -40°C/+25°C/+85°C  
Mode  
MSB900-600MHz  
DOS: C:\  
Memory  
1GB  
DLAG-Nr. -30 °C  
[mA]  
+25°C  
[mA]  
700  
+85 °C  
[mA]  
WinXP: Desktop  
1GB  
700  
5.2. Boot Time  
System Boot-Times  
Definitions/Boot-Medium  
MSB900-600MHz  
Quick Boot Normal Boot  
time [s]  
time [s]  
From hard disk Hitachi Model J4K20-20:  
Boot from hard disk to “Starting MS-DOS”.-Prompt  
Boot from hard disk to XP desktop  
-
-
15  
45  
10  
Booting without a storage device (only BIOS)  
25  
     
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
5.3. CPU, Boards and RAMs  
5.3.1.  
CPUs of this MICROSPACE Product  
Processor:  
Type:  
National  
Clock:  
600 MHz  
GEODE LX900  
5.3.2.  
Numeric Coprocessor  
It is integrated in the LX900 CPU.  
5.3.3.  
DDRAM Memory  
Speed:  
Size:  
333  
DDR-SODIMM  
DDRDIMM 200pin  
64bit  
256-1024MBytes  
DDR-SODIMM  
1
Bits:  
Capacity:  
Bank:  
5.4. Interfaces  
5.4.1.  
Keyboard AT compatible and PS/2 Mouse  
The PS/2 Keyboard and Mouse are combined on the PS2-connector. It is needed to use a Y-Cable to con-  
nect both, the mouse and the keyboard.  
5.4.2.  
Line Printer Port LPT1  
A standard bi-directional LPT port is integrated into the MICROSPACE PC.  
Further information about these signals is available in numerous publications, including the IBM technical  
reference manuals for the PC and AT computers and from other reference documents.  
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DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
5.4.3.  
Serial Ports COM1-COM2  
The serial channels are fully compatible with 16C550 UARTS. COM1 is the primary serial port, and is sup-  
ported by the board's ROM-BIOS as the PC-DOS 'COM1' device. The secondary serial port is COM2; it is  
supported as the 'COM2' device.  
Standard: COM 1/2: National PC87317VUL: 2 x 16C550 compatible serial interfaces  
Serial Port Connectors COM1, COM2  
Pin  
1
2
3
4
5
6
7
8
Signal Name Function  
in/out  
in  
in  
DB25 Pin DB9 Pin  
CD  
DSR  
RXD  
RTS  
TXD  
CTS  
DTR  
RI  
Data Carrier Detect  
Data Set Ready  
Receive Data  
Request To Send  
Transmit Data  
Clear to Send  
Data Terminal Ready  
Ring Indicator  
Signal Ground  
8
6
1
6
2
7
3
8
4
9
5
in  
3
4
2
5
out  
out  
in  
out  
in  
20  
22  
7
9
GND  
The serial port signals are compatible with the RS232C specifications.  
5.4.4.  
Floppy Disk Interface  
This is not available with this product; use a USB Floppy.  
5.5. Controllers  
5.5.1.  
Interrupt Controllers  
An 8259A compatible interrupt controller, within the chipset, provides seven prioritized interrupt levels. Of  
these, several are normally associated with the board's onboard device interfaces and controllers, and sev-  
eral are available on the AT expansion bus.  
Interrupt:  
IRQ0  
IRQ1  
Sources:  
Onboard used:  
ROM-BIOS clock tick function, from timer 0  
Keyboard controller output buffer full  
Used for cascade 2. 8259  
COM2 serial port  
yes  
yes  
IRQ2  
IRQ3  
yes  
yes  
IRQ4  
IRQ5  
IRQ6  
IRQ7  
IRQ8  
IRQ9  
COM1 serial port  
LPT2 parallel printer (if present)  
Floppy controller  
LPT1 parallel printer  
Battery backed clock  
Free for user  
yes  
no *  
yes  
yes  
yes  
no *  
IRQ10  
IRQ11  
IRQ12  
IRQ13  
IRQ14  
IRQ15  
Free for user  
Free for user  
PS/2 mouse  
Math. coprocessor  
Hard disk IDE  
Free for user  
no *  
no *  
yes  
yes  
yes  
no *  
* It may depend on the LAN configuration.  
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DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
5.6. Timers and Counters  
5.6.1.  
Programmable Timers  
An 8253 compatible timer/counter device is also included in the board's ASIC device. This device is utilized  
in precisely the same manner as in a standard AT implementation. Each channel of the 8253 is driven by a  
1.190 MHz clock, derived from a 14.318 MHz oscillator, which can be internally divided in order to provide a  
variety of frequencies.  
Timer 2 can also be used as a general purpose timer if the speaker function is not required.  
Timer Assignment  
Timer  
Function  
0
1
2
ROM-BIOS clock tick (18.2Hz)  
DRAM refresh request timing (15 µs)  
Speaker tone generation time base  
5.6.2.  
RTC (Real Time Clock)  
An AT compatible date/time clock is located within the chipset. The device also contains a CMOS static  
RAM, compatible with that in standard ATs. System configuration data is normally stored in the clock chip's  
CMOS RAM in a manner consistent with the convention used in other AT compatible computers. To attach  
an external battery on a MSB900L board refer to section 2.11.1.  
5.6.3.  
Watchdog  
The watchdog timer detects a system crash and performs a hardware reset. After power up, the watchdog is  
always disabled as the BIOS does not send strobes to the watchdog. In case the user wants to take advan-  
tage of the watchdog, the application must produce a strobe at least every 800 ms. If no strobe occurs within  
the 800 ms, the watchdog resets the system.  
For more information, please refer to the driver/software/BIOS manual “GEODE_LX800-LX900” on the Prod-  
uct CD. The watchdog feature is integrated in the INT15 function.  
There are some programming examples available:  
Product CD-Rom or customer download area: \tools\SM855\int15dl\…  
5.6.4.  
ROM-BIOS Sockets  
An EPROM socket with 8bit wide data access normally contains the board’s AT compatible ROM-BIOS. The  
socket takes a 29F020 EPROM (or equivalent) device. The board's wait-state control logic automatically in-  
serts four memory wait states in all CPU accesses to this socket. The ROM-BIOS sockets occupy the mem-  
ory area from C0000H through FFFFFh; however, the board's ASIC logic reserves the entire area from  
C0000h through FFFFFh for onboard devices, so that this area is already usable for ROM-DOS and BIOS  
expansion modules. Consult the appropriate address map for the MICROSPACE PC-Product ROM-BIOS  
sockets.  
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DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
5.6.4.1. Standard BIOS ROM  
Device:  
Map:  
FWH  
E0000 - FFFFFh  
C0000 - C7FFFh  
CC000 - CFFFFh  
Core BIOS 128k  
VGA BIOS 32k  
FREE  
5.6.5.  
BIOS CMOS Setup  
If wrong setups are memorized in the CMOS-RAM, the default values will be loaded after resetting the  
RTC/CMOS-RAM by de-soldering the battery.  
If the battery is down, it is always possible to start the system with the default values from the BIOS.  
5.7. CMOS RAM Map  
Systems based on the industry-standard specification include a battery backed Real Time Clock chip. This  
clock contains at least 64Bytes of non-volatile RAM. The system BIOS uses this area to store information  
including system configuration and initialization parameters, system diagnostics, and the time and date. This  
information remains intact even when the system is powered down.  
The BIOS supports 128Bytes of CMOS RAM. This information is accessible through I/O ports 70h and 71h.  
CMOS RAM can be divided into several segments:  
Locations 00h - 0Fh contain the real time clock (RTC) and status information  
Locations 10h - 2Fh contain system configuration data  
Locations 30h - 3Fh contain system BIOS-specific configuration data as well as chipset-specific in-  
formation  
Locations 40h - 7Fh contain chipset-specific information as well as power management configuration  
parameters  
The following table provides a summary of how these areas may be further divided.  
Beginning  
Ending  
Checksum Description  
00h  
10h  
2Eh  
30h  
34h  
40h  
5Ch  
5Eh  
6Fh  
7Eh  
0Fh  
2Dh  
2Fh  
33h  
3Fh  
5Bh  
5Dh  
6Eh  
7Dh  
7Fh  
No  
RTC and Checksum  
Yes  
No  
System Configuration  
Checksum Value of 10h - 2Dh  
Standard CMOS  
No  
No  
Standard CMOS - SystemSoft Reserved  
Extended CMOS - Chipset Specific  
Checksum Value of 40h - 5Bh  
Extended CMOS - Chipset Specific  
Extended CMOS - Power Management  
Checksum Value of 6Fh - 7Dh  
Yes  
No  
No  
Yes  
No  
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DIGITAL-LOGIC AG  
CMOS Map  
MSB900/L Detailed Technical Manual V1.0  
Location  
00h  
Description  
Time of day (seconds) specified in BCD  
Alarm (seconds) specified in BCD  
Time of day (minutes) specified in BCD  
Alarm (minutes) specified in BCD  
Time of day (hours) specified in BCD  
Alarm (hours) specified in BCD  
Day of week specified in BCD  
Day of month specified in BCD  
Month specified in BCD  
01h  
02h  
03h  
04h  
05h  
06h  
07h  
08h  
09h  
Year specified in BCD  
0Ah  
Status Register A  
Bit 7  
=
Update in progress  
Bits 6-4 = Time based frequency divider  
Bits 3-0 = Rate selection bits that define the periodic  
interrupt rate and output frequency.  
0Bh  
Status Register B  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
=
0
1
=
0
1
=
0
1
=
0
1
=
0
1
=
0
1
=
0
1
=
0
1
Run/Halt  
Run  
Halt  
Periodic Timer  
Disable  
Enable  
Alarm Interrupt  
Disable  
Enable  
Update Ended Interrupt  
Disable  
Enable  
Square Wave Interrupt  
Disable  
Enable  
Calendar Format  
BCD  
Binary  
Time Format  
12-Hour  
24-Hour  
Daylight Savings Time  
Disable  
Enable  
0Ch  
Status Register C  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
=
=
=
=
Interrupt Flag  
Periodic Interrupt Flag  
Alarm Interrupt Flag  
Update Interrupt Flag  
Bits 3-0 = Reserved  
Status Register D  
0Dh  
Bit 7  
=
0
1
Real Time Clock  
Lost Power  
Power  
Continued...  
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MSB900/L Detailed Technical Manual V1.0  
CMOS Map continued...  
Location Description  
0Eh  
CMOS Location for Bad CMOS and Checksum Flags  
Bit 7  
Bit 6  
= Flag for CMOS Lost Power  
0
1
=
=
Power OK  
Lost Power  
= Flag for CMOS checksum bad  
0
1
=
=
Checksum is valid  
Checksum is bad  
0Fh  
10h  
Shutdown Code  
Diskette Drives  
Bits 7-4 = Diskette Drive A  
0000  
0001  
0010  
0011  
0100  
0101  
=
Not installed  
=
Drive A = 360 kB  
Drive A = 1.2MB  
Drive A = 720 kB  
Drive A = 1.44MB  
Drive A = 2.88MB  
=
=
=
=
Bits 3-0 = Diskette Drive B  
0000  
0001  
0010  
0011  
0100  
0101  
=
=
=
=
=
=
Not installed  
Drive B = 360 kB  
Drive B = 1.2MB  
Drive B = 720 kB  
Drive B = 1.44MB  
Drive B = 2.88MB  
11h  
12h  
Reserved  
Fixed (Hard) Drives  
Bits 7-4 = Hard Drive 0, AT Type  
0000  
0001-1110  
1111  
=
=
=
Not installed  
Types 1-14  
Extended drive types 16-44.  
See location 19h.  
Bits 3-0 = Hard Drive 1, AT Type  
0000  
0001-1110  
1111  
=
=
=
Not installed  
Types 1-14  
Extended drive types 16-44.  
See location 2Ah.  
13h  
14h  
Reserved  
Equipment  
Bits 7-6 = Number of Diskette Drives  
00  
01  
=
=
One diskette drive  
Two diskette drives  
Reserved  
10, 11 =  
Bits 5-4 = Primary Display Type  
00  
01  
10  
11  
=
=
=
=
Adapter with option ROM  
CGA in 40 column mode  
CGA in 80 column mode  
Monochrome  
Bits 3-2 = Reserved  
Bit 1  
= Math Coprocessor Presence  
0
1
=
=
Not installed  
Installed  
Bit 0  
= Bootable Diskette Drive  
0
1
=
=
Not installed  
Installed  
Continued...  
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MSB900/L Detailed Technical Manual V1.0  
CMOS Map continued...  
Location Description  
15h  
16h  
17h  
18h  
19h  
1Ah  
1Bh  
Base Memory Size (in kB) - Low Byte  
Base Memory Size (in kB) - High Byte  
Extended Memory Size (in kB) - Low Byte  
Extended Memory Size (in kB) - High Byte  
Extended Drive Type - Hard Drive 0  
Extended Drive Type - Hard Drive 1  
Custom and Fixed (Hard) Drive Flags  
Bits 7-6 = Reserved  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
= Internal Floppy Disk Controller  
0
1
=
=
Disabled  
Enabled  
= Internal IDE Controller  
0
1
=
=
Disabled  
Enabled  
= Hard Drive 0 Custom Flag  
0
1
=
=
Disabled  
Enabled  
= Hard Drive 0 IDE Flag  
0
1
=
=
Disabled  
Enabled  
= Hard Drive 1 Custom Flag  
0
1
=
=
Disabled  
Enabled  
= Hard Drive 1 IDE Flag  
0
1
=
=
Disabled  
Enabled  
1Ch  
1Dh  
1Eh  
Reserved  
EMS Memory Size Low Byte  
EMS Memory Size High Byte  
1Fh - 24h Custom Drive Table 0  
These 6 Bytes (48 bits) contain the following data:  
Cylinders  
10bits  
10bits  
10bits  
08bits  
08bits  
range 0-1023  
Landing Zone  
Write Precompensation  
Heads  
range 0-1023  
range 0-1023  
range 0-15  
Sectors/Track  
range 0-254  
Byte 0  
1Fh  
20h  
Bits 7-0 = Lower 8 bits of Cylinders  
Byte 1  
Bits 7-2 = Lower 6 bits of Landing Zone  
Bits 1-0 = Upper 2 bits of Cylinders  
Byte 2  
21h  
Bits 7-4 = Lower 4 bits of Write Precompensation  
Bits 3-0 = Upper 4 bits of Landing Zone  
Continued...  
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DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
CMOS Map continued...  
Location Description  
Byte 3  
22h  
Bits 7-6 = Reserved  
Bits 5-0 = Upper 6 bits of Write Precompensation  
Byte 4  
23h  
24h  
Bits 7-0 = Number of Heads  
Byte 5  
Bits 7-0 = Sectors Per Track  
25h - 2Ah Custom Drive Table 1  
These 6 Bytes (48 bits) contain the following data:  
Cylinders  
10bits  
10bits  
10bits  
08bits  
08bits  
range 0-1023  
Landing Zone  
Write Precompensation  
Heads  
range 0-1023  
range 0-1023  
range 0-15  
Sectors/Track  
range 0-254  
Byte 0  
25h  
26h  
Bits 7-0 = Lower 8 bits of Cylinders  
Byte 1  
Bits 7-2 = Lower 6 bits of Landing Zone  
Bits 1-0 = Upper 2 bits of Cylinders  
Byte 2  
27h  
28h  
29h  
Bits 7-4 = Lower 4 bits of Write Precompensation  
Bits 3-0 = Upper 4 bits of Landing Zone  
Byte 3  
Bits 7-6 = Reserved  
Bits 5-0 = Upper 6 bits of Write Precompensation  
Byte 4  
Bits 7-0 = Number of Heads  
Byte 5  
2Ah  
2Bh  
Bits 7-0 = Sectors Per Track  
Boot Password  
Bit 7  
= Enable/Disable Password  
0
1
=
=
Disable Password  
Enable Password  
Bits 6-0 = Calculated Password  
SCU Password  
2Ch  
Bit 7  
= Enable/Disable Password  
0
1
=
=
Disable Password  
Enable Password  
Bits 6-0 = Calculated Password  
Reserved  
2Dh  
2Eh  
2Fh  
30h  
31h  
32h  
High Byte of Checksum - Locations 10h to 2Dh  
Low Byte of Checksum - Locations 10h to 2Dh  
Extended RAM (kB) detected by POST - Low Byte  
Extended RAM (kB) detected by POST - High Byte  
BCD Value for Century  
Continued...  
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MSB900/L Detailed Technical Manual V1.0  
CMOS Map continued...  
Location Description  
33h  
34h  
35h  
Base Memory Installed  
Bit 7 = Flag for Memory Size  
0
1
=
=
640kB  
512kB  
Bits 6-0 = Reserved  
Minor CPU Revision  
Differentiates CPUs within a CPU type (i.e., 486SX vs 486 DX,  
vs 486 DX/2). This is crucial for correctly determining CPU input  
clock frequency. During a power-on reset, Reg DL holds minor  
CPU revision.  
Major CPU Revision  
Differentiates between different CPUs (i.e., 386, 486, Pentium).  
This is crucial for correctly determining CPU input clock fre-  
quency. During a power-on reset, Reg DH holds major CPU  
revision.  
36h  
Hotkey Usage  
Bits 7-6 = Reserved  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
= Semaphore for Completed POST  
= Semaphore for 0 Volt POST (not currently used)  
= Semaphore for already in SCU menu  
= Semaphore for already in PM menu  
= Semaphore for SCU menu call pending  
= Semaphore for PM menu call pending  
Definitions for these locations vary depending on the chipset.  
40h-7Fh  
5.8. EEPROM saved CMOS Setup  
The EEPROM has different functions, as listed below:  
Backup of the CMOS-Setup values.  
Storing system information (i.e., version, production date, customization of the board, CPU type).  
Storing user/application values.  
The EEPROM will be updated automatically after exiting the BIOS setup menu. The system will operate also  
without any CMOS battery. While booting, the CMOS is automatically updated with the EEPROM values.  
Press the Esc-key while powering on the system before the video shows the BIOS message and the CMOS  
will not be updated.  
This would be helpful, if wrong parameters are stored in the EEPROM and the setup of the BIOS does not  
start.  
If the system hangs or a problem appears, the following steps must be performed:  
1. Reset the CMOS-Setup (disconnect the battery for at least 10 minutes).  
2. Press Esc until the system starts up.  
3. Enter the BIOS Setup:  
a) load DEFAULT values  
b) enter the settings for the environment  
c) exit the setup  
4. Restart the system.  
The user may access the EEPROM through the INT15 special functions. Refer to that chapter in the GEODE  
LX800-LX900 manual on the Product CD.  
The system information is read-only and uses the SFI functions. Refer to the GEODE LX800-LX900 manual.  
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MSB900/L Detailed Technical Manual V1.0  
5.8.1.  
EEPROM Memory for Setup  
The EEPROM is used for setup and configuration data, stored as an alternative to the CMOS-RTC. Option-  
ally, the EEPROM setup driver may update the CMOS RTC, if the battery is running down and the checksum  
error would appear and stop the system. The capacity of the EEPROM is 2 kByte.  
Organization of the 2048Byte EEPROMs:  
Address MAP:  
Function:  
0000h  
0001h  
0003h  
CMOS-Setup valid (01=valid)  
Reserved  
Flag for DLAG-Message (FF=no message)  
Copy of CMOS-Setup data  
Reserved for AUX-CMOS-Setup  
Serial-Number  
Production date (year/day/month)  
1. Service date (year/day/month)  
2. Service date (year/day/month)  
3. Service date (year/day/month)  
Boot errors (Auto incremented if any boot error occurs)  
Setup Entries (Auto incremented on every Setup entry)  
Low Battery (Auto incremented every time the battery is low, EEPROM -> CMOS)  
Startup (Auto incremented on every power-on start)  
Reserved  
0010h-007Fh  
0080h-00FFh  
0100h-010Fh  
0110h-0113h  
0114h-0117h  
0118h-011Bh  
011Ch-011Fh  
0120h-0122h  
0123h-0125h  
0126h-0128h  
0129h-012Bh  
0130h  
0131h  
Reserved  
0132h/0133h  
0134h/0135h  
0136h  
BIOS Version (V1.4 => [0132h]:= 4, [0133h]:=1)  
BOARD Version (V1.5 => [0124h]:=5, [0125h]:=1)  
BOARD TYPE (‘M’=PC/104, ‘E’=Euro, ‘W’=MSWS, ‘S’=Slot, ‘C’=Custom, ‘X’= smart-  
Core or smartModule)  
0137h  
CPU TYPE:  
(01h=ELAN300/310, 02h=ELAN400, 05h=P5, 08h=P3, 09h=ELAN520, 10h=P-M).  
Reserved  
Reserved  
0200h-03FFh  
0200h-027Fh  
0400h-07FFh  
Free for Customer use  
5.9. Memory & I/O Map  
5.9.1.  
System Memory Map  
The X86 CPU, used as a central processing unit on the MICROSPACE, has a memory address space which  
is defined by 32 address bits. Therefore, it can address 1 GByte of memory. The memory address MAP is as  
follows:  
CPU GEODE  
Address:  
Size:  
Function / Comments:  
000000 - 09FFFFh  
0A0000 - 0BFFFFh  
0C0000 - 0C7FFFh  
0C8000 - 0CFFFFh  
0D0000 - 0DFFFFh  
0E0000 - 0EBFFFh  
0EC000 - 0EFFFFh  
0F0000 - 0FFFFFh  
100000 - 1FFFFFFh  
640 kBytes  
128 kBytes  
32 kBytes  
32 kBytes  
64 kBytes  
32 kBytes  
16 kBytes  
64 kBytes  
31 MBytes  
Onboard DRAM for DOS applications  
CGA, EGA, LCD Video RAM 128kB  
VGA BIOS  
Free for user  
Free for user  
Bios  
BIOS extensions  
Core BIOS  
DRAM for extended onboard memory  
35  
     
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
5.9.2.  
System I/O map  
The following table details the legacy I/O range for 000h through 4FFh. Each I/O location has a read/write  
(R/W) capability.  
Note the following abbreviations:  
---  
Unknown or can not be determined.  
Yes  
WO  
RO  
Read and write the register at the indicated location. No shadow required.  
Write only. Value written can not be read back. Reads do not contain any useful information.  
Read only. Writes have no effect.  
The value written to the register can not be read back via the same I/O location. Read back is  
accomplished via a “Shadow” register located in MSR space.  
Shw  
Shw@  
Shw$  
Reads of the location return a constant or meaningless value.  
Reads of the location return a status or some other meaningful information  
Writes to the location are “recorded” and written to the LPC. Reads to the location return the re-  
corded value. The LPC is not read.  
Rec  
I/O Map  
I/O Addr. Function  
Slave DMA Address - Channel 0  
Size R/W Comment  
000h  
001h  
002h  
003h  
004h  
005h  
006h  
007h  
008h  
009h  
00Ah  
00Bh  
00Ch  
00Dh  
00Eh  
00Fh  
8bit Yes 16bit values in two transfers.  
8bit Yes 16bit values in two transfers.  
8bit Yes 16bit values in two transfers.  
8bit Yes 16bit values in two transfers.  
8bit Yes 16bit values in two transfers.  
8bit Yes 16bit values in two transfers.  
8bit Yes 16bit values in two transfers.  
8bit Yes 16bit values in two transfers.  
8bit Shw$  
Slave DMA Counter - Channel 0  
Slave DMA Address - Channel 1  
Slave DMA Counter - Channel 1  
Slave DMA Address - Channel 2  
Slave DMA Counter - Channel 2  
Slave DMA Address - Channel 3  
Slave DMA Counter - Channel 3  
Slave DMA Command/Status - Channels [3:0]  
Slave DMA Request - Channels [3:0]  
Slave DMA Mask - Channels [3:0]  
Slave DMA Mode - Channels [3:0]  
Slave DMA Clear Pointer - Channels [3:0]  
Slave DMA Reset - Channels [3:0]  
Slave DMA Reset Mask - Channels [3:0]  
Slave DMA General Mask - Channels [3:0]  
8bit WO Reads return value B2h.  
8bit Shw@ Reads return value B2h.  
8bit Shw@ Reads return value B2h.  
8bit WO Reads return value B2h.  
8bit WO Reads return value B2h.  
8bit Shw@ Reads return value B2h.  
8bit Shw@ Reads return value B2h.  
010h-01Fh No Specific Usage  
---  
---  
020h  
021h  
PIC Master - Command/Status  
PIC Master - Command/Status  
8bit Shw$  
8bit Shw$  
022h-03Fh No Specific Usage  
---  
---  
040h  
041h  
042h  
043h  
PIT – System Timer  
PIT – Refresh Timer  
PIT – Speaker Timer  
PIT – Control  
8bit Shw$  
8bit Shw$  
8bit Shw$  
8bit Shw$  
044h-05Fh No Specific Usage  
---  
---  
Continued…  
36  
 
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
I/O Map Continued…  
I/O Addr. Function  
Size R/W Comment  
If KEL Memory Offset 100h[0] = 1(Emulation-  
Enabled bit).  
060h  
Keyboard/Mouse - Data Port  
8bit Yes  
If MSR 5140001Fh[0] = 1 (SNOOP bit) and  
KEL Memory Offset 100h[0] = 0 (Emulation-  
Enabled bit).  
061h  
Port B Control  
8bit Yes  
062h-063h No Specific Usage  
---  
---  
If KEL Memory Offset 100h[0] = 1  
(Emulation-Enabled bit).  
.
064h  
Keyboard/Mouse - Command/ Status  
8bit Yes  
If MSR 5140001Fh[0] = 1 (SNOOP  
bit) and KEL Memory Offset 100h[0]  
= 0 (Emulation-Enabled bit)  
065h-06Fh No Specific Usage  
---  
---  
070h-071h RTC RAM Address/Data Port  
072h-073h High RTC RAM Address/Data Port  
074-077h No Specific Usage  
8bit Yes Options per MSR 51400014h[0]. (Note 1)  
8bit Yes Options per MSR 51400014h[1].  
---  
---  
---  
---  
078h-07Fh No Specific Usage  
080h  
081h  
082h  
083h  
Post Code Display  
8bit Rec Write LPC and DMA. Read only DMA.  
DMA Channel 2 Low Page  
DMA Channel 3 Low Page  
DMA Channel 1 Low Page  
Upper addr bits [23:16]. Write LPC and  
8bit Rec  
DMA. Read only DMA.  
084h-086h No Specific Usage  
8bit Rec Write LPC and DMA. Read only DMA.  
Upper addr bits [23:16]. Write LPC and DMA.  
Read only DMA.  
087h  
DMA Channel 0 Low Page  
8bit Rec  
088h  
089h  
08Ah  
08B  
No Specific Usage  
8bit Rec Write LPC and DMA. Read only DMA.  
DMA Channel 6 Low Page  
DMA Channel 7 Low Page  
DMA Channel 5 Low Page  
Upper addr bits [23:16]. Write LPC and DMA.  
Read only DMA.  
8bit Rec  
08Ch-08Dh No Specific Usage  
8bit Rec Write LPC and DMA. Read only  
08Eh  
08Fh  
DMA  
DMA C4 Low Page  
8bit Rec Upper addr bits [23:16]. See comment at 080h.  
090h-091h No Specific Usage  
092h Port A  
093h-09Fh No Specific Usage  
---  
8bit Yes  
--- ---  
---  
If kel_porta_en is enabled, then access Port A;  
else access LPC.  
0A0h  
0A1h  
PIC Slave - Command/Status  
PIC Slave - Command/Status  
8bit Shw$  
8bit Shw$  
0A2h-0BFh No Specific Usage  
8bit  
8bit Yes 16bit values in two transfers.  
8bit ---  
8bit Yes 16bit values in two transfers.  
8bit ---  
---  
0C0h  
Master DMA Address - Channel 4  
0C1h  
No Specific Usage  
0C2h  
Master DMA Counter - Channel 4  
No Specific Usage  
0C3h  
0C4h  
Master DMA Address - Channel 5  
Master DMA Counter - Channel 5  
No Specific Usage  
8bit Yes 16bit values in two transfers.  
8bit Yes 16bit values in two transfers.  
0C6h  
0C7h  
8bit  
---  
0C8h  
Master DMA Address - Channel 6  
Master DMA Counter - Channel 6  
No Specific Usage  
8bit Yes 16bit values in two transfers.  
8bit Yes 16bit values in two transfers.  
0CAh  
0CBh  
Continued…  
8bit  
---  
37  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
I/O Map Continued…  
I/O Addr. Function  
Size R/W Comment  
8bit Yes 16bit values in two transfers.  
8bit ---  
8bit Yes 16bit values in two transfers.  
8bit ---  
8bit Shw$  
8bit ---  
8bit WO  
8bit ---  
8bit Yes  
8bit ---  
8bit Shw@  
8bit ---  
8bit WO  
8bit ---  
8bit WO  
8bit ---  
8bit WO  
8bit ---  
8bit Shw@  
0CCh  
0CDh  
0CEh  
0CFh  
0D0h  
0D1h  
0D2h  
0D3h  
0D4h  
0D5h  
0D6h  
0D7h  
0D8h  
0D9h  
0DAh  
0DBh  
0DCh  
0DDh  
0DEh  
0DFh  
Master DMA Address - Channel 7  
No Specific Usage  
Master DMA Counter - Channel 7  
No Specific Usage  
Master DMA Command/Status – Channels [7:4]  
No Specific Usage  
Master DMA Request - Channels [7:4]  
No Specific Usage  
Master DMA Mask - Channels [7:4]  
No Specific Usage  
Master DMA Mode - Channels [7:4]  
No Specific Usage  
Master DMA Clear Pointer - Channels [7:4]  
No Specific Usage  
Master DMA Reset - Channels [7:4]  
No Specific Usage  
Master DMA Reset Mask - Channels [7:4]  
No Specific Usage  
Master DMA General Mask - Channels [7:4]  
No Specific Usage  
8bit  
---  
---  
---  
0E0h-2E7h No Specific Usage  
2E8h-2EFh UART/IR - COM4  
2F0h-2F7h No Specific Usage  
2F8h-2FFh UART/IR - COM2  
300h- 36Fh No Specific Usage  
MSR bit enables/disables into I/O  
2EFh space. (UART1 MSR  
51400014h[18:16], UART2 MSR  
51400014h[22:20]). Defaults to  
LPC.  
8bit  
---  
---  
---  
MSR bit enables/disables into I/O  
2FFh space. (UART1 MSR  
8bit  
--- 51400014h[18:16], UART2 MSR  
51400014h[22:20]). Defaults to  
LPC.  
---  
---  
370h  
371h  
372h  
373h  
374h  
375h  
376h  
377h  
Floppy Status R A  
Floppy Status R B  
Floppy Digital Out  
No Specific Usage  
Floppy Cntrl Status  
Floppy Data  
8bit  
8bit  
RO Second Floppy.  
RO Second Floppy.  
8bit Shw@ Second Floppy.  
8bit  
8bit  
---  
RO Second Floppy.  
8bit Yes Second Floppy.  
8bit ---  
8bit Shw$ Second Floppy.  
No Specific Usage  
Floppy Conf Reg  
378h-3E7h No Specific Usage  
---  
---  
MSR bit enables/disables into I/O  
3EFh space. (UART1 MSR  
51400014h[18:16], UART2 MSR  
51400014h[22:20]). Defaults to  
LPC.  
3E8h-3EFh UART/IR - COM3  
8bit  
8bit  
---  
3F0h  
Floppy Status R A  
RO First Floppy.  
Continued…  
38  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
I/O Map Continued…  
I/O Addr. Function  
Size R/W Comment  
8bit RO First Floppy.  
8bit Shw@ First Floppy.  
3F1h  
3F2h  
3F3h  
3F4h  
3F5h  
3F6h  
3F7h  
Floppy Status R B  
Floppy Digital Out  
No Specific Usage  
Floppy Cntrl Status  
Floppy Data  
8bit  
8bit  
---  
RO First Floppy.  
8bit Yes First Floppy.  
8bit ---  
8bit Shw$ First Floppy.  
MSR bit enables/disables into I/O  
No Specific Usage  
Floppy Conf Reg  
3FFh space. (UART1 MSR  
51400014h[18:16], UART2 MSR  
51400014h[22:20]). Defaults to  
LPC.  
3F8h-3FFh UART/IR - COM1  
8bit  
---  
480h  
481h  
No Specific Usage  
8bit WO Write LPC and DMA. Read only DMA.  
Upper addr bits [31:24]. Write LPC and DMA.  
Read only DMA.  
DMA Channel 2 High Page  
8bit Rec  
482h  
483h  
DMA Channel 3 High Page  
DMA Channel 1 High Page  
484h-486h No Specific Usage  
8bit WO Write LPC and DMA. Read only DMA.  
Upper addr bits [31:24]. Write LPC and DMA.  
Read only DMA.  
487h  
489h  
DMA Channel 0 High Page  
8bit Rec  
Upper addr bits [31:24]. Write LPC and DMA.  
Read only DMA.  
DMA Channel 6 High Page  
8bit Rec  
48Ah  
48Bh  
DMA Channel 7 High Page  
DMA Channel 5 High Page  
48Ch-48Eh No Specific Usage  
8bit WO Write LPC and DMA. Read only DMA.  
Upper addr bits [31:24]. Write LPC and DMA.  
Read only DMA.  
48Fh  
DMA Channel 4 High Page  
8bit Rec  
490h-4CFh No Specific Usage  
---  
---  
4D0h  
4D1h  
PIC Level/Edge  
PIC Level/Edge  
8bit Yes IRQ0-IRQ 7.  
8bit Yes IRQ8-IRQ15.  
4D2h-4FFh No Specific Usage  
---  
---  
Note 1: The Diverse Device Snoops writes to this port and maintains the MSB as NMI enabled. When low,  
NMI is enabled. When high, NMI is disabled. This bit defaults high. Reads of this port return bits  
[6:0] from the on-chip or off-chip target, while Bit 7 is returned from the “maintained” value.  
39  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
6. VGA  
6.1. VGA/LCD Controller of the Geode LX900  
Highly integrated flat panel and CRT GUI Accelerator & Multimedia Engine, Palette/DAC, Clock Synthe-  
sizer, and integrated frame buffer  
HiQColorTM Technology implemented with TMED (Temporal Modulated Energy Distribution)  
Hardware Windows Acceleration  
Hardware Multimedia Support  
High-Performance flat panel display resolution and color depth at 3.3V  
18/24bit direct interface to color TFT panels (X1)  
Advanced Power Management minimizes power usage in:  
Normal operation  
Standby (Sleep) modes  
Panel-Off Power-Saving Mode  
VESA standards supported  
Fully compatible with IBM® VGA  
Driver support for Windows XP, Windows 2000, Windows 98, Windows NT4.0  
Attention!  
When connecting or disconnecting the monitor, be very careful. Also hold the socket on the board  
at the same time to add stability.  
6.2. Graphic Modes  
Bios settings: 254MB video memory (shared)  
Resolution  
Col. Dept.  
Frequency  
800x600  
16bit / 32bit  
16bit / 32bit  
16bit / 32bit  
16bit / 32bit  
16bit / 32bit  
16bit / 32bit  
60Hz – 100Hz  
60Hz – 100Hz  
60Hz – 100Hz  
60Hz – 100Hz  
60Hz – 100Hz  
60Hz – 85Hz  
1024x768  
1152x864  
1280x1024  
1600x1200  
1920x1440  
40  
     
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
7. VIDEO INPUT  
The MSB900 contains a low-cost video input port. It consist of LX900’s video input port (VIP) and the exter-  
nal frame grabber chip SAA7111A. This port is capable of digitizing a CVBS video signal with 15 frames per  
second at a resolution of 352x288bits. Note that this frame rate is only achievable when the raw data stream  
is compressed before being stored on the hard drive. Driver support is currently available for the Windows  
XP platform.  
8. DESCRIPTION OF THE CONNECTORS  
Flat cable  
44pin IDE is: IDT Terminal for Dual Row (2.00mm grid) and 1.00mm flat cable  
All others are: IDT Terminal for Dual Row 0.1" (2.54mm grid) and 1.27mm flat cable  
NC: not connected  
Connector  
Structure  
Pin  
Remarks  
X1  
X14  
X15  
X20  
X22  
X31  
X33  
X34  
X39  
X50  
X51  
X52  
X60  
X61  
X71  
X101  
X110  
X120  
X230  
X301  
Power  
Video Input  
2pin jack plug  
SMA  
44pin RM 2.0  
3.5mm jack plug  
3.5mm jack plug  
PS/2  
RJ45  
RJ45  
10pin RM 2.54mm  
Dual-USB  
Dual-USB  
Operator panel connector / Flat panel  
Sound MIC stereo input  
Sound speaker stereo output  
Keyboard PS/2 and Mouse Utility connector  
LAN Port A  
Not assembled  
LAN Port B  
COM2 serial interface connector  
USB 0/1 connector  
USB 2/3 connector  
Socket for USB UDOC  
IDE PATA connector  
10pin RM2.54mm Not assembled  
44pin RM 2.0  
32pin RM 2.54mm  
50pin  
COM1 and LPT connector  
CompactFlash Socket  
PCI/104 expansion connector  
POD-Port interface connector  
MiniPCI socket  
120pin  
14pin  
124pin  
4 pin  
15pin DSUB  
JTAG-Port  
DSUB VGA connector  
High-density  
41  
   
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MSB900/L Detailed Technical Manual V1.0  
Top view of the MSB900/L  
42  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
Bottom view of the MSB900/L  
43  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
X1  
Power Supply  
Signal  
Pin  
1 (Shield) Power supply 8-30V  
2
3
NC  
Power supply GND  
X14 Video IN  
Pin Signal  
Pin Signal  
GND  
1
CVBS  
2
44  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
X15 Operator Panel / Flat Panel (bottom side)  
X15 is intended to be used internally to attach an operator panel. Some signals may not be present or are  
shared with other connectors. This connector is not assembled and is only for OEM-specific applications. A  
2mm x 44pin header is needed.  
Pin Signal  
1
2
3
4
5
6
7
8
9
GND  
VCC (+5V output)  
LVDS YAM0  
LVDS YAP0  
GND  
VCC (+5V output)  
LVDS YAM1  
LVDS YAP1  
GND  
Note...  
VCC:  
VCC3:  
max. 0.5 Amp  
max. 0.5 Amp  
DCMAIN: DC supply input must be within  
the 8-30V range.  
10 VCC (+5V output)  
11 LVDS YAM2  
12 LVDS YAP2  
13 GND  
14 Enable VDD  
15 LVDS CLKAP  
16 LVDS CLKAM  
17 CRT red  
Attention!  
If the VGA or COM2 signals on X15 are  
used, the X10 (VGA connector) or the  
X39 (COM2 connector) must not be con-  
nected.  
18 CRT green  
19 CRT blue  
20 CRT hsync  
21 CRT vsync  
22 CRT SCL  
23 CRT SDA  
24 GND  
Attention!  
USB-signals on X15 are multiplexed with  
the USB-Port1. They must be enabled by  
soldering the two resistors.  
25 COM2 DCD  
26 COM2 DSR  
27 COM2 RXD  
28 COM2 RTS  
29 COM2 TXD  
30 COM2 CTS  
31 COM2 DTR  
32 COM2 RI  
33 SYS_RST#  
34 VCC3 (+3.3V output)  
35 USB D-  
36 USB D+  
37 VCC3 (+3.3V output)  
38 SMB SCL  
39 SMB SDA  
40 AVR PA0  
41 AVR PA3  
42 DCMAIN (filtered power input)  
43 GND  
44 VCC (+5V output)  
45  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
X15 Reverse Pin Configuration MSB900 LVDS X15 (on component side)  
Attention!  
When X15 is soldered on the component side, a different pin numbering schema must be applied.  
Odd and even pin numbers are swapped. Ignoring this warning may result in the destruction  
of any attached devices such as displays!  
Pin Signal  
1
2
3
4
5
6
7
8
9
VCC (+5V Output)  
GND  
LVDS_YAP0  
LVDS_YAM0  
VCC (+5V Output)  
GND  
LVDS_YAP1  
LVDS_YAM1  
VCC (+5V Output)  
10 GND  
11 LVDS_YAP2  
12 LVDS_YAM2  
13 Enable VDD  
14 GND  
15 LVDS_CLKAM  
16 LVDS_CLKAP  
17 CRT green  
18 CRT red  
19 CRT hsync  
20 CRT blue  
21 CRT SCL  
22 CRT vsync  
23 GND  
24 CRT SDA  
25 COM2 DSR  
26 COM2 DCD  
27 COM2 RTS  
28 COM2 RXD  
29 COM2 CTS  
30 COM2 TXD  
31 COM2 RI  
32 COM2 DTR  
33 VCC3 (+3.3V Output)  
34 SYS_RST#  
35 USB D+  
36 USB D-  
37 SMB SCL  
38 VCC3 (+3.3V Output)  
39 AVR PA0  
40 SMB SDA  
41 DCMAIN (filtered power input)  
42 AVR PA3  
43 VCC (+5V Output)  
44 GND  
46  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
X31 Keyboard PS/2 and Mouse Utility Connector  
Connector and Adapter  
Mini- DIN PS/2 (6 PC)  
Remarks  
KEYBOARD  
Shield  
DATA  
GND  
VCC (+5V)  
CLK  
Shield  
1
3
4
5
Mini- DIN PS/2 (6 PC)  
Remarks  
MOUSE  
VCC (+5V)  
DATA  
GND  
4
2
3
6
CLK  
PS/2 Front side (female)  
X33 10/100 BASE-T Interface Connector 0  
Pin Signal (CAT 5)  
1
2
3
4
5
6
7
8
TX+  
TX-  
RX+  
RX-  
X34 10/100 BASE-T Interface Connector 1  
Pin Signal  
1
2
3
4
5
6
7
8
TX+  
TX-  
RX+  
RX-  
47  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
X39 Serial Port COM2  
Header onboard  
D-SUB connector  
Signal  
Pin 1  
Pin 2  
Pin 3  
Pin 4  
Pin 5  
Pin 6  
Pin 7  
Pin 8  
Pin 9  
Pin 10  
Pin 1  
Pin 6  
Pin 2  
Pin 7  
Pin 3  
Pin 8  
Pin 4  
Pin 9  
Pin 5  
DCD  
DSR  
RxD  
RTS  
TxD  
CTS  
DTR  
RI  
GND  
open  
Attention!  
If the X39 connector is used, DO NOT connect the COM2 signals on the X15 connector!  
X50 USB 1 Connector (Dual-USB)  
Pin Signal Remarks  
1
2
3
4
5
6
7
8
VCC  
USB-P1-  
USB-P1+  
GND  
VCC  
USB-P2-  
USB-P2+  
GND  
On MPC20/21, not assembled.  
X51 USB 2 Connector (Dual USB)  
Pin Signal Remarks  
1
2
3
4
5
6
7
8
VCC  
USB-P2-  
USB-P2+  
GND  
VCC  
USB-P4-  
USB-P4+  
GND  
Pin 1  
Pin 2  
Pin 3  
Pin 4  
VCC  
USB-P-  
USB-P+  
GND  
48  
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MSB900/L Detailed Technical Manual V1.0  
X52 USB UDOC (not assembled)  
Pin Signal  
Pin Signal  
1
2
3
4
5
VCC  
NC  
6
7
8
9
NC  
GND  
NC  
NC  
USB-P2-  
NC  
USB-P2+  
10 NC  
Attention!  
X52 for USB-DOC-Flash drives are only for OEM use. The connector is not assembled. The UDOC  
may be assembled if the CompactFlash is not assembled.  
X60 IDE Interface  
Pin Signal  
Pin Signal  
1
3
5
7
9
Reset (active low)  
2
4
6
8
GND  
D8  
D9  
D7  
D6  
D5  
D4  
D10  
10 D11  
12 D12  
14 D13  
16 D14  
18 D15  
11 D3  
13 D2  
15 D1  
17 D0  
19 GND  
21 DREQ  
23 IOW (active low)  
25 IOR (active low)  
27 IORDY  
29 DACK  
20 (keypin) NC  
22 GND  
24 GND  
26 GND  
28 ALE / Master-Slave  
30 GND  
31 IRQ14  
33 ADR1  
35 ADR0  
37 CS0 (active low)  
39 LED (active low)  
41 VCC Logic  
43 GND  
32 NC  
34 NC  
36 ADR2  
38 CS1 (active low)  
40 GND  
42 VCC Motor  
44 NC  
49  
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MSB900/L Detailed Technical Manual V1.0  
X61 Serial Port COM1, Parallel Port LPT1  
Header onboard  
D-SUB connector  
Signal  
Pin 1  
Pin 2  
Pin 3  
Pin 4  
Pin 5  
Pin 6  
Pin 7  
Pin 8  
Pin 9  
Pin 1  
Pin 6  
Pin 2  
Pin 7  
Pin 3  
Pin 8  
Pin 4  
Pin 9  
Pin 5  
DCD  
DSR  
RxD  
RTS  
TxD  
CTS  
DTR  
RI  
GND  
GND  
Pin 10  
Pin 11  
Pin 12  
Pin 13  
Pin 14  
Pin 15  
Pin 16  
Pin 17  
Pin 18  
Pin 19  
Pin 20  
Pin 21  
Pin 22  
Pin 23  
Pin 24  
Pin 25  
Pin 26  
Pin 27  
Pin 28  
Pin 29  
Pin 30  
Pin 29  
Pin 30  
select  
paper end  
busy  
Pin 12  
Pin 11  
Pin 10  
Pin 9  
Pin 8  
Pin 7  
Pin 6  
Pin 5  
Pin 17  
Pin 4  
Pin 16  
Pin 3  
Pin 15  
Pin 2  
Pin 14  
Pin 1  
Pin 23-25  
acknowledge  
data 7  
data 6  
data 5  
data 4  
data 3  
shift in  
data 2  
init printer  
data 1  
error  
data 0  
auto feed  
strobe  
GND  
power supply GND  
power supply 8-30V  
power supply GND  
power supply 8-30V  
50  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
X101 PCI-104 BUS Interface  
Pin  
A
B
C
D
1
2
3
4
5
6
7
8
GND/5.0V KEY2  
VI/O  
AD05  
C/BE0*  
GND  
AD11  
AD14  
+3.3V  
SERR*  
GND  
STOP*  
+3.3V  
FRAME*  
GND  
AD18  
AD21  
+3.3V  
IDSEL0  
AD24  
GND  
AD29  
+5V  
REQ0*  
GND  
Reserved  
AD02  
GND  
AD07  
AD09  
VI/O  
AD13  
C/BE1*  
GND  
PERR*  
+3.3V  
TRDY*  
GND  
AD16  
+3.3V  
AD20  
AD23  
GND  
C/BE3*  
AD26  
+5V  
AD30  
GND  
REQ2*  
VI/O  
+5  
AD00  
+5V  
AD03  
AD06  
GND  
M66EN  
AD12  
+3.3V  
PAR  
SDONE  
GND  
DEVSEL*  
+3.3V  
C/BE2*  
GND  
AD01  
AD04  
GND  
AD08  
AD10  
GND  
AD15  
SB0*  
+3.3V  
LOCK*  
GND  
IRDY*  
+3.3V  
AD17  
GND  
AD22  
IDSEL1  
VI/O  
AD25  
AD28  
GND  
REQ1*  
+5V  
GNT2*  
GND  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
AD19  
+3.3V  
IDSEL2  
IDSEL3  
GND  
AD27  
AD31  
VI/O  
GNT0*  
GND  
CLK1  
GND  
RST*  
GNT1*  
+5V  
CLK2  
GND  
+12V  
CLK0  
+5V  
INTD*  
INTA*  
Reserved  
CLK3  
+5V  
INTB*  
Reserved  
INTC*  
GND/3.3V KEY2  
-12V  
Notes:  
1. The shaded area denotes power or ground signals.  
2. The KEY pins are to guarantee proper module installation. Pin-A1 will be removed and the female side  
plugged for 5.0V I/O signals and Pin-D30 will be modified in the same manner for 3.3V I/O. It is highly  
recommended that both KEY pins (A1 and D30) be electrically connected to GND for shielding.  
DLAG boards have them as NC (not connected).  
X110 LPC-Port  
Only for factory and POD-Diagnostic use.  
Pin Signal  
Pin Signal  
1
3
5
7
9
VCC 3.3V  
2
4
6
8
LAD0  
LAD1  
LAD2  
LAD3  
LFrame#  
PCI_RST#  
FWH_TBL#  
VCC 5V  
10 PCI_RST#  
12 nc  
14 FWH_Control  
11 LPC_Clock  
13 Ground  
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X230 JTAG-Port  
Pin Signal  
Pin Signal  
1
3
TCK  
TDI  
2
4
TMS  
TDO  
X301 VGA Monitor (CRT-Signals)  
15pins High-Density DSub  
Pin  
Signal  
1
2
Red  
Green  
Blue  
H-Synch  
V-Synch  
Bridged  
3
13  
14  
5 + 11  
5, 6, 7, 8 Grounded  
The VGA-CRT signals from J2 must be wired to a standard VGA High Density DSub-connector (female):  
The LCD signals must be wired panel-specific.  
Solder-side view of the female 15pin HiDSub  
1
2
3
4
5
Red Green Blue  
GND  
6
7
8
9
10  
GND  
11  
12  
13  
14  
15  
HSyn VSyn  
Attention!  
If the X10 connector is used, DO NOT connect the VGA signals on the X15 connector!  
52  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
9. JUMPER LOCATIONS ON THE BOARD  
The following figure shows the location of all jumper blocks on the MSB900/L board. The numbers shown in  
this figure are silk screened on the board so that the pins can easily be located. This chapter refers to the  
individual pins for these jumpers. The default jumper settings are indicated with asterisks.  
Be careful: some jumpers are soldering bridges; you will need a miniature soldering station with a vacuum  
pump.  
9.1. The Jumpers on MSB900/L  
Settings written in bold are defaults.  
Remarks  
Jumper  
Structure  
1-2 / open  
2-3 / closed  
J1  
J2  
J3  
J4  
CompactFlash master  
Autostart function  
Disconnect Battery  
Slave  
Master  
N/A  
N/A  
1)  
Enabled  
Disabled  
Disabled  
Disconnect CMOS EEPROM  
N/A  
1) With the autostart function enabled, the system will start booting up within 2 seconds after the power  
supply is turned on.  
9.2. Reload Default BIOS Settings  
To reload default BIOS settings when the system refuses to boot after defective BIOS settings have been  
made please proceed as follows.  
Turn off the system.  
Remove J3 on MSB900 or disconnect the optional external battery on the MSB900L.  
Remove J4.  
Turn on the system and enter the BIOS setup menu.  
Close J4 and J5 or attach the optional external battery.  
Choose save and exit in the BIOS setup menu.  
53  
     
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MSB900/L Detailed Technical Manual V1.0  
54  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
10.CABLE INTERFACES  
10.1. The Hard Disk Cable 44pin  
IDT Terminal for Dual Row (2.00mm grid) and 1.00mm flat cable; 44pins = 40pins signal and 4pins power.  
1
2
1 2  
39  
40  
39  
40  
43 44  
43 44  
Max. length for the IDE cable is 30cm.  
Attention!  
Check the pin 1 marker of the cable and the connector before you power-on. Refer to the tech-  
nical manual of the installed drives because a wrong cable will immediately destroy the drive  
and/or the MICROSPACE MSB900/L board. In this case the warranty is void! Without the tech-  
nical manual you may not connect this type of drive.  
The 44pin IDE connector on the drives is normally composed of the 44 pins, 2 open pins and 4  
test pins, 50 pins in total. Leave the 4 test pins unconnected.  
c d  
a b  
1 3  
43  
Testpin  
44pin IDE Interface with integrated power lines  
open pin  
55  
   
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
10.2. The COM1/LPT Serial Interface Cable  
Terminal for dual row 2mm grid and 1mm flat cable.  
Connector X61  
Pin  
Signal  
COM1 9pin D-Sub male  
Pin 1  
Pin 2  
Pin 3  
Pin 4  
Pin 5  
Pin 6  
Pin 7  
Pin 8  
Pin 9  
Pin 10  
= DCD  
= DSR  
= RXD  
= RTS  
= TXD  
= CTS  
= DTR  
= RI  
1
6
2
7
3
8
4
9
5
= GND  
Pin  
Signal  
LPT1 25pin D-Sub female  
Pin 11  
Pin 12  
Pin 13  
Pin 14  
Pin 15  
Pin 16  
Pin 17  
Pin 18  
Pin 19  
Pin 20  
Pin 21  
Pin 22  
Pin 23  
Pin 24  
Pin 25  
Pin 26  
Pin 27  
Pin 28  
= SELECT  
= Paper end  
= Busy  
13  
12  
11  
10  
9
8
7
6
5
17  
4
16  
3
15  
2
14  
1
= Acknowledge  
= Data 7  
= Data 6  
= Data 5  
= Data 4  
= Data 3  
= Shift in  
= Data 2  
= Init  
= Data 1  
= Error  
= Data 0  
= Autofeed  
= Strobe  
= GND  
18-25  
Attention!  
Do not short circuit these signal lines.  
Never connect any pins on the same plug or to any other plug on the MICROSPACE  
MSB900/L. The +/-10 Volts will immediately destroy the MICROSPACE core logic. In this  
case the warranty is void!  
Do not overload the output; the maximum output of the current converters is 10mA.  
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DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
10.3. The COM2 Serial Interface Cable  
DT terminal for dual row 0.1" (2.54mm grid) and 1.27mm flat cable.  
Connector X39  
Pin  
Signal  
COM2 9pin D-Sub male  
Pin 1  
Pin 2  
Pin 3  
Pin 4  
Pin 5  
Pin 6  
Pin 7  
Pin 8  
Pin 9  
Pin 10  
= DCD  
= DSR  
= RXD  
= RTS  
= TXD  
= CTS  
= DTR  
= RI  
1
6
2
7
3
8
4
9
5
= GND  
Attention!  
Do not short circuit these signal lines.  
Never connect any pins on the same plug or to any other plug on the MICROSPACE  
MSB900/L. The +/-10 Volts will immediately destroy the MICROSPACE core logic. In this  
case the warranty is void!  
Do not overload the output; the maximum output of the current converters is 10mA.  
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DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
11. THERMAL SPECIFICATIONS  
11.1. Thermal Analysis for Case Integration  
The MSB900/L has a unique thermal design. Heat sources are located on the bottom side of the PCB.  
Usually this means the board will be mounted upside down with the CPU thermally in contact with a heat  
sink. Alternatively, the CPU will be in contact with the system enclosure which then works as a heat sink.  
The LX900 CPU is rated with a Total Dissipated Power (TDP) of 3.8W maximum and 1.6W typical @ 600  
MHz.  
The following picture is a thermal analysis of the bottom side. It was taken after one hour of operating (BIOS  
screen) at room temperature. There was no heat sink mounted on the CPU.  
fCPU  
[MHz]  
Uin [V]  
TCPUmax [°C]  
TCS5536max[°C]  
600  
12  
Pay particular attention when mounting the PC-product in a fully enclosed case/box. The thermal energy will  
be stored in the interior of this environment.  
If the case has a fan:  
The hot air must be exchanged with cool air from outside using a filtered fan.  
The hot air must be cooled with a heat exchanger.  
If the case has no fan or opening to exchange hot air:  
The heat sink of the CPU must be mounted directly to a heat sink integrated in the case. The heat will  
be conducted directly through the alloy of the heat sink to the outside.  
58  
   
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
12.ASSEMBLY VIEWS  
12.1. MSB900/L  
59  
   
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60  
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
12.2. Mechanical Dimensions  
MSB900 Version  
Unit: mm (millimeter)  
Tolerance: +/- 0.1mm  
Date: 28.03.2006  
Author: BRR  
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DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
13.PXE-BOOT AND PXE-SETUP IN THE BIOS  
PXE Protocol  
PXE is defined on a foundation of industry-standard Internet protocols and services that are widely deployed  
in the industry, namely TCP/IP, DHCP, and TFTP. These standardize the form of the interactions between  
clients and servers. To ensure that the meaning of the client-server interaction is standardized as well, cer-  
tain vendor option fields in DHCP protocol are used, which are allowed by the DHCP standard. The opera-  
tions of standard DHCP and/or BOOTP servers (that serve up IP addresses and/or NBPs) will not be dis-  
rupted by the use of the extended protocol. Clients and servers that are aware of these extensions will rec-  
ognize and use this information, and those that do not recognize the extensions will ignore them.  
In brief, the PXE protocol operates as follows. The client initiates the protocol by broadcasting a  
DHCPDISCOVER containing an extension that identifies the request as coming from a client that implements  
the PXE protocol. Assuming that a DHCP server or a Proxy DHCP server implementing this extended proto-  
col is available, after several intermediate steps, the server sends the client a list of appropriate Boot Serv-  
ers. The client then discovers a Boot Server of the type selected and receives the name of an executable file  
on the chosen Boot Server. The client uses TFTP to download the executable from the Boot Server. Finally,  
the client initiates execution of the downloaded image. At this point, the client’s state must meet certain re-  
quirements that provide a predictable execution environment for the image. Important aspects of this envi-  
ronment include the availability of certain areas of the client’s main memory, and the availability of basic net-  
work I/O services.  
Deployment of servers  
On the server end of the client-server interaction there must be available services that are responsible for  
providing redirection of the client to an appropriate Boot Server. These redirection services may be deployed  
in two ways:  
1. Combined standard DHCP and redirection services.  
The DHCP servers that are supplying IP addresses to clients are modified to become, or are replaced  
by servers that serve up IP addresses for all clients and redirect PXE-enabled clients to Boot Servers  
as requested.  
2. Separate standard DHCP and redirection services.  
PXE redirection servers (Proxy DHCP servers) are added to the existing network environment. They  
respond only to PXE-enabled clients, and provide only redirection to Boot Servers. Each PXE Boot  
Server must have one or more executables appropriate to the clients that it serves.  
Preboot Execution Environment (PXE) Specification 11  
Version 2.1 September 20, 1999  
Copyright © 1998, 1999 Intel Corporation. All rights reserved.  
This diagram illustrates the relationship between the NBP (the remote boot program) and the PXE APIs.  
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DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
BIOS-Setup Screen with the LAN-BOOT (PXE) DISABLE / ENABLE menu:  
After ENABLING the LAN-Boot, the Password must be entered.  
The Password must be requested with the PXE-licence order form on the following page.  
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DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
14.PXE-LICENSE ORDER  
The PXE-Function must be licensed before it can be enabled. To order, fill out and sign this form; return to  
the fax number below. This form may be printed out separately from the digital copy of this manual on the  
Product CD.  
Note... One license per form  
Each computer system requires an individual, one-time royalty payment for the PXE-license. After  
receipt of payment, you will be emailed the password necessary to enable the PXE-Function (see  
Section 13).  
Customer Information:  
Company Name:  
Your Name:  
Street Address:  
ZIP / City:  
Email:  
Information for the PXE-License:  
Currency  
(circle one)  
Product  
USD  
MPC20  
Euro  
MPC21/A  
CHF  
Price per license  
23 USD  
17 Euro  
28 CHF  
For each additional license, please fill out another form.  
Date:  
Signature:  
dd / mm / yyyy  
Fax this form to your DIGITAL-LOGIC Sales Manager:  
(please write in his/her name)  
Fax: +0041 32 681 58 01  
64  
 
DIGITAL-LOGIC AG  
MSB900/L Detailed Technical Manual V1.0  
15.INDEX  
1
I
10/100 BASE-T Interface  
47  
I/O Map  
IDE interface  
36  
15  
IDE Interface  
Incompatibilities  
Interfaces  
Interrupt Controllers  
ISO 9001:2000  
49  
22  
15, 26  
27  
11  
A
Addressing PCI Devices  
Application Notes  
23  
16, 22  
B
J
Battery-Lifetime  
BIOS CMOS  
BIOS History  
BIOS, Reload Default Settings  
Block Diagram  
Boot Time  
23  
29  
24  
53  
13  
25  
23  
JTAG-Port  
Jumper Locations  
52  
53  
K
L
Bus Signals  
Keyboard PS/2  
26, 47  
C
CMOS  
29  
34  
41  
27  
28  
26  
LCD TFT Interface  
LPC-Port  
LPT1  
45  
51  
26  
CMOS Setup  
Connectors  
Controllers  
Counters  
CPU  
M
Manual, How to Use It  
Mechanical Dimensions  
memory address MAP  
Memory Map  
Mouse Utility Connector  
MSM800-LVDSCON  
2
61  
35  
35  
47  
21  
D
Dimensions & Diagrams  
Disclaimer  
DRAM  
17  
5
26  
E
O
P
EEPROM Memory for Setup  
EMI / EMC  
Environmental Protection Statement  
External battery assembling  
35  
16  
5
Ordering Codes  
16  
23  
Parallel Port  
PCI-104 BUS Interface  
power  
Power Requirements  
Power Supply  
Printer  
PS/2  
PXE-Boot  
PXE-License Order  
PXE-Setup  
50  
51  
25  
25  
44  
26  
47  
62  
64  
62  
F
Features, Standard  
Features, Unique  
Floppy disk  
12  
12  
15  
27  
Floppy Disk Interface  
G
Graphic Modes  
40  
55  
R
H
Radiation  
RAM Map  
Recycling Information  
22  
29  
6
Hard Disk Cable  
65  
 
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MSB900/L Detailed Technical Manual V1.0  
RoHS Commitment  
ROM-BIOS  
RTC  
9
28  
28  
T
Technical Support  
6
58  
28  
5
Thermal Specifications  
Timers  
Trademarks  
S
Safety Precautions  
Schematics  
Serial Interface Cable  
Serial Port COM1  
Serial Port COM2  
Serial Ports  
Specifications  
SQS  
Standards  
Swiss Association for Quality and Management  
Systems  
9
59  
56, 57  
50  
48  
U
V
UDOC  
USB  
44, 49  
48  
27  
14  
11  
8
VGA  
VGA Monitor  
Video Input  
40  
52  
41  
11  
11  
7
Swiss Quality  
Symbols  
System Description  
25  
W
Warranty  
Watchdog  
6
28  
66  

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