Intel CELERON 200 User Manual
Intel® Celeron® Processor 200Δ  
Sequence  
Thermal and Mechanical Design Guidelines  
— Supporting the Intel® Celeron® processor 220Δ  
October 2007  
318548-001  
Contents  
1
Introduction.....................................................................................................7  
1.1  
Document Goals and Scope .....................................................................7  
1.1.1  
1.1.2  
1.1.3  
Importance of Thermal Management............................................7  
Document Goals........................................................................7  
Document Scope.......................................................................8  
1.2  
1.3  
Reference Documents .............................................................................9  
Definition of Terms.................................................................................9  
2
Processor Thermal/Mechanical Information.........................................................11  
2.1  
Mechanical Requirements ......................................................................11  
2.1.1  
2.1.2  
Processor Package...................................................................11  
Heatsink Attach ......................................................................16  
2.2  
2.3  
Thermal Requirements..........................................................................18  
2.2.1 Processor Junction Temperature................................................19  
Heatsink Design Considerations..............................................................19  
2.3.1  
2.3.2  
2.3.3  
Heatsink Size..........................................................................20  
Heatsink Mass ........................................................................21  
Thermal Interface Material........................................................21  
2.4  
System Thermal Solution Considerations .................................................22  
2.4.1  
2.4.2  
2.4.3  
Chassis Thermal Design Capabilities...........................................22  
Improving Chassis Thermal Performance ....................................22  
Summary...............................................................................25  
3
4
Thermal Metrology..........................................................................................27  
3.1  
Characterizing Cooling Performance Requirements ....................................27  
3.1.1 Example ................................................................................29  
3.2  
3.3  
Local Ambient Temperature Measurement Guidelines.................................30  
Processor Power Measurement Metrology Recommendation........................32  
3.3.1  
Sample Preparation .................................................................33  
System Thermal/Mechanical Design Information..................................................37  
4.1  
4.2  
Overview of the Reference Design...........................................................37  
4.1.1  
4.1.2  
Altitude..................................................................................37  
Heatsink Thermal Validation .....................................................37  
Environmental Reliability Testing............................................................38  
4.2.1  
4.2.2  
4.2.3  
Structural Reliability Testing .....................................................38  
Power Cycling.........................................................................40  
Recommended BIOS/CPU/Memory Test Procedures......................40  
4.3  
4.4  
4.5  
Material and Recycling Requirements ......................................................40  
Safety Requirements ............................................................................41  
Reference Attach Mechanism..................................................................41  
4.5.1  
4.5.2  
Structural Design Strategy .......................................................41  
Mechanical Interface to the Reference Attach Mechanism ..............41  
Thermal and Mechanical Design Guidelines  
3
Appendix A  
Heatsink Clip Load Metrology............................................................................43  
A.1  
A.2  
Overview ............................................................................................43  
Test Preparation...................................................................................43  
A.2.1  
A.2.2  
Heatsink Preparation ...............................................................43  
Typical Test Equipment ............................................................43  
A.3  
Test Procedure Examples.......................................................................45  
Appendix B  
Appendix C  
Intel® Enabled Boxed Processor Thermal Solution Information...............................47  
Mechanical Drawings.......................................................................................49  
Figures  
Figure 1. Micro-FCBGA Processor Package Drawing – Isometric View .....................13  
Figure 2. Micro-FCBGA Processor Package Drawing (Sheet 1 of 2).........................14  
Figure 3. Micro-FCBGA Processor Package Drawing (Sheet 2 of 2).........................15  
Figure 4. Vertical Lock-Down Alignment Feature.................................................18  
Figure 5. Various Types of Solder Crack ...........................................................18  
Figure 6. Case Study #1: Top view — Poor μATX Chassis Layout Design for  
Intel® Celeron® Processor 200 Sequence on Intel® Desktop Board  
D201GLY2 (chassis cover removed for illustration)................................23  
Figure 7. Case Study #2: Relocate System Fan to CAG Venting for Airflow  
Improvement ..................................................................................24  
Figure 8. Case Study#3: An μATX Chassis Equipped with Two Exhaust Fans...........24  
Figure 9. Case Study #4: A “Top Mount Fan” PSU is located next to Processor  
in μATX Chassis for System Thermal Performance Improvement .............25  
Figure 10. Processor Thermal Characterization Parameter Relationships.................29  
Figure 11. Locations for Measuring Local Ambient Temperature, Active Heatsink .....31  
Figure 12. Locations for Measuring Local Ambient Temperature, Passive Heatsink ...32  
Figure 13. Precision Resistor Connected in-series with Processor Circuitry for  
Power Measurement .........................................................................34  
Figure 14. Installation of Isotek Resistor on Intel® Desktop Board D201GLY2 to  
Setup Connection for Power Measurement ..........................................34  
Figure 15. Probing Resistance of the Soldered Walsin Resistor (R =19.6 KΩ)  
on Intel® Desktop Board D201GLY2 to Ensure Proper Attachment ..........35  
Figure 16. Precision Resistor Soldered on on Intel® Desktop Board D201GLY2,  
and Connected to netDAQ for Voltage Measurement.............................35  
Figure 17. Random Vibration PSD.....................................................................38  
Figure 18. Shock Acceleration Curve.................................................................39  
Figure 19. Top Plate and Package Simulator Fasten onto Clip Force Measurement  
Machine.........................................................................................45  
Figure 20. Anchors Installed and Glued Down the BTX Base Plate – for reference only46  
Figure 21. Motherboard Keep-out Footprint Definition and Height Restrictions for  
Enabling Components ......................................................................50  
Figure 22. Reference Clip E21952-001 ..............................................................51  
Figure 23. Reference Heatsink D96271-001 .......................................................52  
Figure 24. Intel® Boxed Processor Thermal Solution E21953-001..........................53  
4
Thermal and Mechanical Design Guidelines  
Tables  
Table 1. Micro-FCBGA Package Mechanical Specifications.....................................12  
Table 2. Thermal Specifications for Intel® Celeron® Processor 200 Sequence ..........19  
Table 3. System Thermal Solution Design Requirement .......................................22  
Table 4. Test Accessories ................................................................................33  
Table 5. Typical Test Equipment.......................................................................44  
Table 6. Intel® Boxed Processor Thermal Solution Providers.................................47  
Thermal and Mechanical Design Guidelines  
5
Revision History  
Revision  
Number  
Description  
Revision Date  
-001  
• Initial Release  
October 2007  
§
6
Thermal and Mechanical Design Guidelines  
Introduction  
1 Introduction  
1.1  
Document Goals and Scope  
1.1.1  
Importance of Thermal Management  
The objective of thermal management is to ensure that the temperatures of all  
components in a system are maintained within their functional temperature range.  
Within this temperature range, a component is expected to meet its specified  
performance. Operation outside the functional temperature range can degrade  
system performance, cause logic errors or cause component and/or system damage.  
Temperatures exceeding the maximum operating limit of a component may result in  
irreversible changes in the operating characteristics of this component.  
In a system environment, the processor temperature is a function of both system and  
component thermal characteristics. The system level thermal constraints consist of  
the local ambient air temperature and airflow over the processor as well as the  
physical constraints at and above the processor. The processor temperature depends  
in particular on the component power dissipation, the processor package thermal  
characteristics, and the processor thermal solution.  
All of these parameters are affected by the continued push of technology to increase  
processor performance levels and packaging density (more transistors). As operating  
frequencies increase and packaging size decreases, the power density increases while  
the thermal solution space and airflow typically become more constrained or remains  
the same within the system. The result is an increased importance on system design  
to ensure that thermal design requirements are met for each component, including  
the processor, in the system.  
1.1.2  
Document Goals  
Depending on the type of system and the chassis characteristics, new system and  
component designs may be required to provide adequate cooling for the processor.  
The goal of this document is to provide an understanding of these thermal  
characteristics and discuss guidelines for meeting the thermal requirements imposed  
on single processor systems using the Intel® Celeron® processor 200 sequence.  
The concepts given in this document are applicable to any system form factor.  
Specific examples used will be the Intel enabled reference solution for a system.  
Thermal and Mechanical Design Guidelines  
7
 
Introduction  
1.1.3  
Document Scope  
This design guide supports the following processors:  
• Intel® Celeron® Processor 200 sequence applies to the Intel® Celeron® processor  
220.  
In this document the Intel Celeron Processor 200 sequence will be referred to as “the  
processor”.  
In this document when a reference is made to “the processor” it is intended that this  
includes all the processors supported by this document. If needed for clarity, the  
specific processor will be listed.  
In this document, when a reference is made to “datasheet”, the reader should refer to  
the Intel® Celeron® Processor 200 Sequence Datasheet. If needed for clarity, the  
specific processor datasheet will be referenced.  
In this document, when a reference is made to the “the reference design” it is  
intended that this includes all reference designs (D16869-001 and D96271-001)  
supported by this document. If needed for clarify, the specific reference design will be  
listed.  
Chapter 2 of this document discusses package thermal mechanical requirements to  
design a thermal solution for the Intel Celeron processor 200 sequence in the context  
of personal computer applications. Chapter 3 discusses the thermal solution  
considerations and metrology recommendations to validate a processor thermal  
solution. Chapter 4 gives information on the Intel reference thermal solution for the  
processor in a system application.  
The physical dimensions and thermal specifications of the processor that are used in  
this document are for illustration only. Refer to the Datasheet for the product  
dimensions, thermal power dissipation, and maximum junction temperature. In case  
of conflict, the data in the datasheet supersedes any data in this document.  
8
Thermal and Mechanical Design Guidelines  
 
Introduction  
1.2  
Reference Documents  
Material and concepts available in the following documents may be beneficial when  
reading this document.  
Document  
Document  
No./Location  
Intel® Celeron® Processor 200 Sequence Datasheet  
http://developer.intel  
.com/design/processo  
r/datashts/318546.ht  
m
Power Supply Design Guide for Desktop Platform Form Factors (Rev  
1.1)  
http://www.formfacto  
rs.org/  
ATX Thermal Design Suggestions  
http://www.formfactors.  
org/  
microATX Thermal Design Suggestions  
http://www.formfactors.  
org/  
Balanced Technology Extended (BTX) System Design Guide  
Thermally Advantaged Chassis version 1.1  
http://www.formfactors.  
org/  
http://www.intel.com/g  
o/chassis/  
1.3  
Definition of Terms  
Term  
Description  
The measured ambient temperature locally surrounding the processor. The  
ambient temperature should be measured just upstream of a passive heatsink or  
at the fan inlet for an active heatsink.  
TA  
TJ  
Processor junction temperature.  
Heatsink temperature measured at vicinity to center on the top surface of  
heatsink base.  
TS-TOP  
Junction-to-ambient thermal characterization parameter (psi). A measure of  
thermal solution performance using total package power. Defined as  
(TJ – TA) / Total Package Power.  
ΨJA  
Note: Heat source must be specified for Ψ measurements.  
Junction-to-sink thermal characterization parameter. A measure of thermal  
interface material performance using total package power. Defined as  
(TJ – TS) / Total Package Power.  
ΨJS  
Note: Heat source must be specified for Ψ measurements.  
Sink-to-ambient thermal characterization parameter. A measure of heatsink  
thermal performance using total package power. Defined as  
ΨSA  
Thermal and Mechanical Design Guidelines  
9
 
Introduction  
Term  
Description  
(TS – TA) / Total Package Power.  
Note: Heat source must be specified for Ψ measurements.  
Thermal Interface Material: The thermally conductive compound between the  
heatsink and the processor die surface. This material fills the air gaps and voids,  
and enhances the transfer of the heat from the processor die surface to the  
heatsink.  
TIM  
PD  
Processor total power dissipation (assuming all power dissipates through the  
processor die).  
Thermal Design Power: a power dissipation target based on worst-case  
applications. Thermal solutions should be designed to dissipate the thermal  
design power.  
TDP  
PUSAGE  
Maximum usage power of processor when running SysMark utility.  
§
10  
Thermal and Mechanical Design Guidelines  
Processor Thermal/Mechanical Information  
2 Processor Thermal/Mechanical  
Information  
2.1  
Mechanical Requirements  
2.1.1  
Processor Package  
The Intel Celeron processor 200 sequence is available in a 479-pin Micro-FCBGA  
package, as shown in Figure 1 to Figure 3. The processor uses a Flip-Chip Ball Grid  
Array (FC-BGA6) package technology that directly solder down to a 479-pin footprint  
on PCB surface.  
Mechanical specifications of the package are listed in Table 1. Refer to the datasheet  
for detailed mechanical specifications. In case of conflict, the package dimensions in  
the datasheet supersedes dimensions provided in this document.  
The processor package has mechanical load limits that are specified in the processor  
datasheet. The specified maximum static and dynamic load limits should not be  
exceeded during their respective stress conditions. These include heatsink  
installation, removal, mechanical stress testing, and standard shipping conditions.  
• When a compressive static load is necessary to ensure thermal performance of the  
thermal interface material between the heatsink base and the processor die, it  
should not exceed the corresponding specification given in the processor  
datasheet.  
• When a compressive static load is necessary to ensure mechanical performance, it  
should remain in the minimum/maximum range specified in the processor  
datasheet.  
No portion of the substrate should be used as a mechanical reference or load-bearing  
surface for the thermal or mechanical solution.  
The processor datasheet provides package handling guidelines in terms of maximum  
recommended shear, tensile and torque loads for the processor substrate. These  
recommendations should be followed in particular for heatsink removal operations.  
Thermal and Mechanical Design Guidelines  
11  
 
Processor Thermal/Mechanical Information  
Table 1. Micro-FCBGA Package Mechanical Specifications  
Symbol  
B1  
Parameter  
Min  
Max  
Unit  
mm  
mm  
mm  
mm  
mm  
mm  
Figure  
Package substrate width  
Package substrate length  
Die width  
34.95  
34.95  
11.1  
35.05  
35.05  
Figure 2  
Figure 2  
Figure 2  
Figure 2  
Figure 2  
Figure 2  
B2  
C1  
C2  
Die length  
8.2  
F2  
Die height (with underfill)  
0.89  
F3  
Package overall height  
(package substrate to  
die)  
2.022 Max  
G1  
G2  
Width (first ball center to  
last ball center)  
31.75 Basic  
31.75 Basic  
mm  
mm  
Figure 2  
Figure 2  
Length (first ball center  
to last ball center)  
J1  
J2  
M
Ball pitch (horizontal)  
Ball pitch (vertical)  
Solder Resist Opening  
Ball height  
1.27 Basic  
1.27 Basic  
0.61  
mm  
mm  
mm  
mm  
mm  
Figure 2  
Figure 2  
Figure 2  
Figure 2  
Figure 3  
0.69  
0.8  
N
0.6  
--  
Corner Keep-out zone at  
corner (4X)  
7 × 7  
--  
Keep-out from edge of  
package (4X)  
5
mm  
mm  
kPa  
Figure 3  
Figure 3  
--  
Package edge to first ball  
center  
1.625  
689  
Pdie  
Allowable pressure on  
the die for thermal  
solution  
W
Package weight  
6
g
NOTE:  
1.  
All dimensions are subject to change.  
2.  
Overall height as delivered. Values were based on design specifications and tolerances.  
Final height after surface mount depends on OEM motherboard design and SMT  
process.  
12  
Thermal and Mechanical Design Guidelines  
 
Processor Thermal/Mechanical Information  
Figure 1. Micro-FCBGA Processor Package Drawing – Isometric View  
Thermal and Mechanical Design Guidelines  
13  
 
Processor Thermal/Mechanical Information  
Figure 2. Micro-FCBGA Processor Package Drawing (Sheet 1 of 2)  
NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for  
specific details.  
14  
Thermal and Mechanical Design Guidelines  
 
Processor Thermal/Mechanical Information  
Figure 3. Micro-FCBGA Processor Package Drawing (Sheet 2 of 2)  
NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for  
specific details.  
Thermal and Mechanical Design Guidelines  
15  
 
Processor Thermal/Mechanical Information  
2.1.2  
Heatsink Attach  
General Guidelines  
2.1.2.1  
The micro-FCBGA package may have capacitors placed in the area surrounding the  
processor die. The die-side capacitors, which are only slightly shorter than the die  
height, are electrically conductive and contact with electrically conductive materials  
should be avoided. The use of an insulating material between the capacitors and any  
thermal and mechanical solution should be considered to prevent capacitors shorting.  
A thermal and mechanical solution design must not intrude into the required keep-out  
zones as specified in the datasheet.  
There are no features on the 479-pins micro-FCBGA package for direct heatsink  
attachment: a mechanism must be designed to attach the heatsink directly to the  
motherboard. In addition to holding the heatsink in place on top of the processor die,  
this mechanism plays a significant role in the robustness of the system in which it is  
implemented, in particular:  
• Ensuring thermal performance of the thermal interface material (TIM) applied  
between the processor die and the heatsink. TIMs based on phase change  
materials are very sensitive to applied pressure: the higher the pressure, the  
better the initial performance. Designs should incorporate a possible decrease in  
applied pressure over time due to potential structural relaxation in retention  
components (creep effect causing clip to lose its preload and causing anchor pull-  
out). It is not recommended to use TIMs such as thermal greases onto small bare  
die package, due to the TIM “pump-out” concern after heatsink is assembled.  
• Ensuring system electrical, thermal, and structural integrity under shock and  
vibration events. The mechanical requirements of the heatsink attach mechanism  
depend on the mass of the heatsink and the level of shock and vibration that the  
system must support. The overall structural design of the motherboard and the  
system should be considered in designing the heatsink attach mechanism. The  
design should provide a means for protecting the solder joints.  
2.1.2.2  
Heatsink Clip Load Requirement  
The attach mechanism for the heatsink developed to support the processor creates a  
nominal static compressive preload on the package of 9.9 lbf ± 1.2 lbf throughout the  
life of the product for designs compliant with the Intel reference design assumptions:  
• Using TIM Honeywell PCM45F (pad version).  
• 55.88 mm (2.2”) x 54.88 mm (2.16”) attach pattern. Refer to Figure 21 for  
heatsink keep-out zone.  
• And no board stiffening device (backing plate, chassis attach, etc.).  
The minimum load is required to thermal performance while protecting solder joint  
against fatigue failure in temperature cycling.  
Notes the load range above is required to ensure a minimum load of 8.7lbf at end-of-  
life. The tolerance and nominal load is based on reference design and will slightly  
differ on alternate thermal solution provided by third party.  
It is important to take into account potential load degradation from creep over time  
when designing the clip or fastener to the required minimum load. This means that,  
16  
Thermal and Mechanical Design Guidelines  
 
Processor Thermal/Mechanical Information  
depending on clip stiffness, the initial preload at beginning of life of the product may  
be significantly higher than the minimum preload that must be met throughout the life  
of the product.  
Refer to Appendix A for clip load metrology guidelines.  
2.1.2.3  
Heatsink Attach Mechanism Design Considerations  
In addition to the general guidelines given above, the heatsink attach mechanism for  
the processor should be designed to the following guidelines:  
• Solder joint reliability compliant with INTEL quality specification before & after  
reliability test such as shock & vibration. The Critical-To-Function (CTF) corner  
solder joints of processor package for Intel® Desktop Board D201GLY2 experience  
high stress concentration during shock and vibration test, therefore the “vertical  
lock-down” alignment feature is integrated into z-clip design to prevent solder  
joints failures. Please refer to the datasheet for CTF and NCTF locations.  
• Vertical Lock-Down Alignment Feature. Generic z-clip solution should include this  
feature to improve structural performance during shock and vibration test. The  
vertical lock-down feature is basically an additional feature (bends etc.) that is  
incorporated into the z-clip to better constraint the heatsink. The reference  
thermal solution adds a vertical bend that contacts the heatsink after preload  
application. This in turn provides a 4 contact constraint as opposed to the 2  
contact constraint as shown in Figure 4 (thru z-clip center indentation). Note that  
the vertical lock feature sizing must be determined thru FOC (First Order  
Calculation) or FEA (Finite Element Analysis) to ensure it touches the heatsink  
base just enough to provide the required restraint without causing the center  
indent feature losing contact. Refer to Figure 4 for further illustration.  
• Figure 5 illustrates solder crack types.  
• Heatsink should be held in place under mechanical shock and vibration events and  
applies force to the heatsink base to maintain desired pressure on the thermal  
interface material. Note that the load applied by the heatsink attach mechanism  
must comply with the package specifications described in the processor datasheet.  
One of the key design parameters is the height of the top surface of the processor  
die above the motherboard, is expected in the range of 2.73 mm ± 0.125 mm.  
This data is provided for information only, and should be derived from:  
⎯ The height of the package, from the package seating plane to the top of the  
die, and accounting for its nominal variation and tolerances that are given in  
the corresponding processor datasheet.  
• Engages easily, and if possible, without the use of special tools. In general, the  
heatsink is assumed to be installed after the motherboard has been installed into  
the chassis. Ergo force requirement states that assembly force shall not exceed  
15lbf (target is 10lbf).  
• Minimizes contact with the motherboard surface during installation and actuation  
to avoid scratching/damaging the motherboard.  
Thermal and Mechanical Design Guidelines  
17  
Processor Thermal/Mechanical Information  
Figure 4. Vertical Lock-Down Alignment Feature  
Figure 5. Various Types of Solder Crack  
2.2  
Thermal Requirements  
The processor requires a thermal solution to maintain temperatures within operating  
limits. Refer to the datasheet for the processor thermal specifications.  
To allow for the optimal operation and long-term reliability of Intel processor-based  
systems, the system/processor thermal solution should remain within the minimum  
and maximum junction temperature specifications at corresponding thermal design  
power (TDP) as listed in datasheet.  
The thermal limits for the processor are the junction temperature (TJ). The TJ defines  
the maximum junction temperature as a function of power being dissipated.  
Designing to this specification allows optimization of thermal designs for processor  
performance.  
18  
Thermal and Mechanical Design Guidelines  
 
Processor Thermal/Mechanical Information  
2.2.1  
Processor Junction Temperature  
Table 2. Thermal Specifications for Intel® Celeron® Processor 200 Sequence  
Core  
Frequency  
and  
Thermal Design  
Power  
Processor  
Number  
Symbol  
Cache  
Notes  
(W)  
Voltage  
TDP  
220  
1.20 GHz  
512 KB  
19  
1, 4, 5  
Symbol  
Parameter  
Min  
Max  
Notes  
0 °C  
TJ (°C)  
Junction Temperature  
100 °C  
3, 4  
NOTE:  
1.  
2.  
The TDP is not the maximum theoretical power the processor can generate.  
Not 100% tested. These power specifications are determined by characterization of the  
processor currents at higher temperatures and extrapolating the values for the  
temperature indicated.  
3.  
As measured by the activation of the on-die Intel® Thermal Monitor. The Intel Thermal  
Monitor’s automatic mode is used to indicate that the maximum TJ has been reached.  
Refer to datasheet for more details.  
4.  
5.  
The Intel Thermal Monitor automatic mode must be enabled for the processor to  
operate within specifications, please refer to datasheet for more details.  
At TJ of 100 °C.  
2.3  
Heatsink Design Considerations  
To remove the heat from the processor, three basic parameters should be considered:  
• The area of the surface on which the heat transfer takes place. Without  
any enhancements, this is the surface of the processor die. One method used to  
improve thermal performance is by attaching a heatsink to the die. A heatsink  
can increase the effective heat transfer surface area by conducting heat out of the  
die and into the surrounding air through fins attached to the heatsink base.  
• The conduction path from the heat source to the heatsink fins. Providing a  
direct conduction path from the heat source to the heatsink fins and selecting  
materials with higher thermal conductivity typically improves heatsink  
performance. The length, thickness, and conductivity of the conduction path from  
the heat source to the fins directly impact the thermal performance of the  
heatsink. In particular, the quality of the contact between the package die and  
the heatsink base has a higher impact on the overall thermal solution performance  
as processor cooling requirements become stricter. Thermal interface material  
(TIM) is used to fill in the gap between the die and the bottom surface of the  
heatsink, and thereby improve the overall performance of the stack-up (die-TIM-  
Heatsink). With extremely poor heatsink interface flatness or roughness, TIM may  
not adequately fill the gap. The TIM thermal performance depends on its thermal  
conductivity as well as the pressure applied to it. Refer to Section 2.3.3 for  
further information.  
• The heat transfer conditions on the surface on which heat transfer takes  
place. Convective heat transfer occurs between the airflow and the surface  
exposed to the flow. It is characterized by the local ambient temperature of the  
Thermal and Mechanical Design Guidelines  
19  
 
Processor Thermal/Mechanical Information  
air, TA, and the local air velocity over the surface. The higher the air velocity over  
the surface, and the cooler the air, the more efficient is the resulting cooling. The  
nature of the airflow can also enhance heat transfer via convection. Turbulent  
flow can provide improvement over laminar flow. In the case of a heatsink, the  
surface exposed to the flow includes in particular the fin faces and the heatsink  
base.  
Active heatsinks typically incorporate a fan that helps manage the airflow through  
the heatsink.  
Passive heatsink solutions require in-depth knowledge of the airflow in the chassis.  
Typically, passive heatsinks see lower air speed. These heatsinks are therefore  
typically larger (and heavier) than active heatsinks due to the increase in fin surface  
required to meet a required performance. As the heatsink fin density (the number of  
fins in a given cross-section) increases, the resistance to the airflow increases: it is  
more likely that the air travels around the heatsink instead of through it, unless air  
bypass is carefully managed. Using air-ducting techniques to manage bypass area  
can be an effective method for controlling airflow through the heatsink.  
2.3.1  
Heatsink Size  
The size of the heatsink is dictated by height restrictions for installation in a system  
and by the real estate available on the motherboard and other considerations for  
component height and placement in the area potentially impacted by the processor  
heatsink. The height of the heatsink must comply with the requirements and  
recommendations published for the motherboard form factor of interest. Designing a  
heatsink to the recommendations may preclude using it in system adhering strictly to  
the form factor requirements, while still in compliance with the form factor  
documentation.  
For the ATX/microATX form factor, it is recommended to use:  
• The ATX motherboard keep-out footprint definition and height restrictions for  
enabling components, defined for the platforms designed with the micro-FCBGA of  
this design guide.  
• The motherboard primary side height constraints defined in the ATX Specification  
V2.2 and the microATX Motherboard Interface Specification V1.2 found at  
http://www.formfactors.org/.  
The resulting space available above the motherboard is generally not entirely available  
for the heatsink. The target height of the heatsink must take into account airflow  
considerations (for fan performance for example) as well as other design  
considerations (air duct, etc.).  
20  
Thermal and Mechanical Design Guidelines  
 
Processor Thermal/Mechanical Information  
2.3.2  
Heatsink Mass  
With the need to push air cooling to better performance, heatsink solutions tend to  
grow larger (increase in fin surface) resulting in increased mass. The insertion of  
highly thermally conductive materials like copper to increase heatsink thermal  
conduction performance results in even heavier solutions. As mentioned in  
Section 2.1.2, the heatsink mass must take into consideration the package load limits,  
the heatsink attach mechanical capabilities, and the mechanical shock and vibration  
profile targets. Beyond a certain heatsink mass, the cost of developing and  
implementing a heatsink attach mechanism that can ensure the system integrity  
under the mechanical shock and vibration profile targets may become prohibitive.  
The recommended maximum heatsink mass for the Intel Celeron processor 200  
sequence reference thermal solution is 62 g. This mass includes the fan and the  
heatsink only. The attach mechanism (clip, fasteners, etc.) are not included.  
Note: The 62 g mass limit for current solution is based on the capabilities of reference  
design components that retain the heatsink to the board and apply the necessary  
preload. Any reuse of the clip and fastener in alternate or derivative designs should  
not exceed 62 g. Designs that have a mass of greater than 62 g should analyze the  
preload and retention limits of the fastener.  
Note: The chipset components on the board are affected by processor heatsink mass.  
Exceeding these limits may require the evaluation of the chipset for shock and  
vibration.  
2.3.3  
Thermal Interface Material  
Thermal interface material application between the processor die and the heatsink  
base is generally required to improve thermal conduction from the die to the heatsink.  
Many thermal interface materials can be pre-applied to the heatsink base prior to  
shipment from the heatsink supplier and allow direct heatsink attach, without the  
need for a separate thermal interface material dispense or attach process in the final  
assembly factory.  
All thermal interface materials should be sized and positioned on the heatsink base in  
a way that ensures the entire processor die area is covered. It is important to  
compensate for heatsink-to-processor attach positional alignment when selecting the  
proper thermal interface material size.  
When pre-applied material is used, it is recommended to have a protective film  
applied. This film must be removed prior to heatsink installation.  
The recommended TIM for the Intel Celeron processor 200 sequence reference  
thermal solution is Honeywell PCM45F (pad version). It is not recommended to use  
TIMs such as thermal greases onto small bare die package as specified in  
Section 2.1.2.1.  
Thermal and Mechanical Design Guidelines  
21  
 
Processor Thermal/Mechanical Information  
2.4  
System Thermal Solution Considerations  
2.4.1  
Chassis Thermal Design Capabilities  
The reference thermal solution for the Intel Celeron processor 200 sequence on the  
Intel Desktop Board D201GLY2 is a passive heatsink design, which requires chassis to  
deliver sufficient airflow cooling to ensure stability and reliability of processor. The  
maximum allowable heatsink temperature (TS-TOP-MAX) is set to 91 °C for  
processor to ensure the capability of a chassis in providing sufficient airflow for  
processor cooling. TS-TOP-MAX is the maximum limit value for heatsink which is similar  
to TCASE-MAX for lidded processors.  
The “usage power consumption” (PCPU-USAGE) of the Intel Celeron processor 200  
sequence was quantified at maximum of 16 W based on measurement done on Intel®  
Desktop Board D201GLY2 when tested with SYSMark04. The reference thermal  
solution for processor is designed at PCPU-USAGE for performance & cost optimal  
considerations. Do not mistaken PCPU-USAGE with processor’s TDP as documented in  
datasheet.  
Table 3. System Thermal Solution Design Requirement  
1.  
System Thermal Solution Design Requirement  
3. TS-TOP-MAX ≤ 91°C  
Note  
4.  
1
NOTE:  
1.  
Based on processor maximum Usage Power Consumption (PUSAGE) of 16 W measured on  
Intel® Desktop Board D201GLY2 when tested with SYSMark04.  
To evaluate the system thermal capability of a given chassis, the system designer is  
recommended to conduct in-chassis system thermal test. The data to be collected are  
both processor power consumption (PCPU) and heatsink temperature (TS-TOP) with the  
above mentioned processor load at 35 °C external ambient condition. The TS-SYSTEM  
can be estimated using Equation 1. The thermal pass requirement for a given chassis  
can be met if TS-SYSTEM ≤ TS-TOP-MAX  
.
Equation 1 TS-SYSTEM = TA + (TS-TOP − TA) × 16/PCPU ≤ TS-TOP-MAX = 91°C  
2.4.2  
Improving Chassis Thermal Performance  
The heat generated by components within the chassis must be removed to provide an  
adequate operating environment for the processor and all other components in the  
system. Moving airflow through the chassis brings in fresh cool air from the external  
ambient environment and transports the heat generated by the processor and other  
system components out of the system. Therefore, the number, size and relative  
position of fans and vents determine the chassis thermal performance, and the  
resulting ambient temperature around the processor.  
It is particularly important to choose a thermally advantaged chassis for the reference  
thermal solution for Intel Celeron processor 200 sequence on the Intel Desktop Board  
D201GLY2, which is a passive heatsink design.  
22  
Thermal and Mechanical Design Guidelines  
 
Processor Thermal/Mechanical Information  
By analyzing airflow condition in an μATX chassis, a case study in Figure 6 shows that  
a chassis layout is critical to components cooling in the system. The alignment of  
system fan (80×80mm2) with power supply fan results in pass-through airflow which  
bypasses the motherboard region. The cooling airflow from external environment is  
not able to reach motherboard region to cool critical components on the motherboard.  
Vents located at chassis top and side causes thermal gradient that induces natural  
convection flow (blue arrow) for processor and MCH. Majority of regions are  
dominated by natural convection or low flow eddies (yellow lines).  
For a Chassis Air Guide Design Guide (Rev 1.1) compliant μATX chassis, such as in  
Case Study #1, it is recommended to relocate system fan to CAG (Chassis Air Guide)  
venting to provide impingement airflow to processor and MCH on motherboard as well  
as improving overall airflow within chassis. Figure 7 shows a Case Study #2 by  
relocating system fan to CAG venting location for airflow improvement.  
System exhaust fan located at rear side of chassis (at motherboard input/output back  
panel) will effectively improve chassis thermal by exhausting hot air heated by  
components on board, and regulating cool air from environment into chassis via  
chassis venting. Figure 8 shows Case Study #3 of an μATX chassis with two exhaust  
fan installed for system cooling.  
Additionally, mounting position and type of power supply unit with fan could assist to  
improve system thermal performance. Figure 9 shows that a “top mount fan” power  
supply located next to processor is able to direct airflow to heatsink for cooling. Refer  
to Power Supply Design Guide (Rev 1.1) for power supply selection.  
Figure 6. Case Study #1: Top view — Poor μATX Chassis Layout Design for Intel®  
Celeron® Processor 200 Sequence on Intel® Desktop Board D201GLY2  
(chassis cover removed for illustration)  
Thermal and Mechanical Design Guidelines  
23  
 
Processor Thermal/Mechanical Information  
Figure 7. Case Study #2: Relocate System Fan to CAG Venting for Airflow  
Improvement  
Figure 8. Case Study#3: An μATX Chassis Equipped with Two Exhaust Fans  
24  
Thermal and Mechanical Design Guidelines  
 
Processor Thermal/Mechanical Information  
Figure 9. Case Study #4: A “Top Mount Fan” PSU is located next to Processor in μATX  
Chassis for System Thermal Performance Improvement  
2.4.3  
Summary  
In summary, heatsink design considerations for the Intel Celeron processor 200  
sequence on the Intel Desktop Board D201GLY2 include:  
• The heatsink temperature  
which is a function of system thermal  
TS-TOP-MAX  
performance must be compliant in order to ensure processor reliability.  
• Heatsink interface to die surface characteristics, including flatness and roughness.  
• The performance of the thermal interface material used between the heatsink and  
the die.  
• The required heatsink clip static load, 9.9 lbf ± 1.2 lbf, throughout the life of the  
product (refer to Section 2.1.2.2 for further information).  
• Surface area of the heatsink.  
• Heatsink material and technology.  
• Volume of airflow over the heatsink surface area.  
• Development of airflow entering and within the heatsink area.  
• Physical volumetric constraints placed by the system.  
§
Thermal and Mechanical Design Guidelines  
25  
 
Processor Thermal/Mechanical Information  
26  
Thermal and Mechanical Design Guidelines  
Thermal Metrology  
3 Thermal Metrology  
This section discusses guidelines for testing thermal solutions, including measuring  
processor temperatures. In all cases, the thermal engineer must measure power  
dissipation and temperature to validate a thermal solution. To define the performance  
of a thermal solution the “thermal characterization parameter”, Ψ (“psi”) will be used.  
3.1  
Characterizing Cooling Performance  
Requirements  
The idea of a “thermal characterization parameter”, Ψ (“psi”), is a convenient way to  
characterize the performance needed for the thermal solution and to compare thermal  
solutions in identical situations (same heat source and local ambient conditions). The  
thermal characterization parameter is calculated using total package power.  
Note: Heat transfer is a three-dimensional phenomenon that can rarely be accurately and  
easily modeled by a single resistance parameter like Ψ.  
The junction-to-local ambient thermal characterization parameter value (ΨJA) is used  
as a measure of the thermal performance of the overall thermal solution that is  
attached to the processor package. It is defined by the following equation, and  
measured in units of °C/W:  
Equation 2 ΨJA = (TJ – TA) / PD  
Where:  
ΨJA  
TJ  
=
=
=
=
Junction-to-local ambient thermal characterization parameter (°C/W)  
Processor junction temperature (°C)  
TA  
PD  
Local ambient temperature in chassis at processor (°C)  
Processor total power dissipation (W) (assumes all power dissipates  
through the processor die)  
Thermal and Mechanical Design Guidelines  
27  
 
Thermal Metrology  
For reference thermal solution of Intel Celeron processor 200 sequence on Intel  
Desktop Board D201GLY2, the junction-to-local ambient thermal characterization  
parameter of the processor, ΨJA, is comprised of ΨJS, the thermal interface material  
thermal characterization parameter, ΨHS_BASE the thermal characterization parameter  
of the heatsink base from bottom center of heatsink base to top center of heatsink  
base surface, and of ΨS-TOP-A, the sink-to-local ambient thermal characterization  
parameter:  
Equation 3 ΨJA = ΨJS + ΨHS_BASE + ΨS-TOP-A  
Where:  
ΨJS  
=
Thermal characterization parameter of the thermal interface material  
(°C/W)  
Ψ HS_BASE  
ΨS-TOP-A  
=
=
Thermal characterization parameter of the heatsink base (°C/W)  
Thermal characterization parameter from heatsink top to local  
ambient (°C/W)  
ΨJS is strongly dependent on the thermal conductivity, thickness and performance  
degradation across time of the TIM between the heatsink and processor die.  
Ψ HS_BASE is a measure of the thermal characterization parameter of the heatsink base.  
It is dependent on the heatsink base material, thermal conductivity, thickness and  
geometry.  
ΨS-TOP-A is a measure of the thermal characterization parameter from the top center  
point of the heatsink base to the local ambient air. ΨS-TOP-A is dependent on the  
heatsink material, thermal conductivity, and geometry. It is also strongly dependent  
on the air flow through the fins of the heatsink.  
Equation 4 (ΨJA  
Ψ
Ψ
HS_BASE) × PD + TA  
= TS-TOP-MAX  
−
−
JS  
With a given processor junction-to-local ambient requirement (ΨJA) and TIM  
performance (ΨJS) and processor power consumption (PD), the processor’s heatsink  
requirement (TS-TOP-MAX) could be defined by Equation 4.  
28  
Thermal and Mechanical Design Guidelines  
 
Thermal Metrology  
Figure 10 illustrates the combination of the different thermal characterization  
parameters.  
Figure 10. Processor Thermal Characterization Parameter Relationships  
TA  
TS-TOP  
ΨS-TOP-A  
ΨHS BASE  
ΨJS  
TIM  
TJ  
3.1.1  
Example  
The cooling performance, ΨJA, is then defined using the principle of thermal  
characterization parameter described above:  
• The junction temperature  
and thermal design power TDP given in the  
TJ-MAX  
processor datasheet.  
• Define the allowable heatsink temperature for processor, TS-TOP-MAX  
.
The following provides an illustration of how one might determine the appropriate not  
related to any specific Intel processor thermal specifications, and are for illustrative  
purposes only.  
Assume the TDP, as listed in the datasheet, is 20 W and the maximum junction  
temperature 20 W is 90 °C. Assume as well that the system airflow has been  
designed such that the local ambient temperature is 42 °C, and Ψ  
°
HS_BASE = 0.3 C/W.  
Then the following could be calculated using Equation 2:  
Ψ
JA = (TJ – TA) / TDP = (90 – 55) / 20 = 1.75 °C/W  
Thermal and Mechanical Design Guidelines  
29  
 
Thermal Metrology  
To determine the required heatsink performance, a heatsink solution provider would  
need to determine ΨJS performance for the selected TIM and mechanical load  
configuration. If the heatsink solution were designed to work with a TIM material  
performing at ΨJS ≤ 0.50 °C/W, solving for Equation 3 from above, the performance of  
the heatsink would be:  
Ψ
SA = ΨJA − ΨJS = 1.75 − 0.50 = 1.25 °C/W  
The heatsink temperature requirement can be obtained from Equation 4.  
TS-TOP-MAX = (ΨjA − ΨjS − ΨHS_BASE) × PD + TA = (1.25 – 0.30) × 20 + 55 = 74 °C  
3.2  
Local Ambient Temperature Measurement  
Guidelines  
The local ambient temperature TA is the temperature of the ambient air surrounding  
the processor. For a passive heatsink, TA is defined as the heatsink approach air  
temperature; for an actively cooled heatsink, it is the temperature of inlet air to the  
active cooling fan.  
It is worthwhile to determine the local ambient temperature in the chassis around the  
processor to understand the effect it may have on the die temperature.  
TA is best measured by averaging temperature measurements at multiple locations in  
the heatsink inlet airflow. This method helps reduce error and eliminate minor spatial  
variations in temperature. The following guidelines are meant to enable accurate  
determination of the localized air temperature around the processor during system  
thermal testing.  
For active heatsinks, it is important to avoid taking measurement in the dead flow  
zone that usually develops above the fan hub and hub spokes. Measurements should  
be taken at four different locations uniformly placed at the center of the annulus  
formed by the fan hub and the fan housing to evaluate the uniformity of the air  
temperature at the fan inlet. The thermocouples should be placed approximately  
3 mm to 8 mm [0.1 to 0.3 in] above the fan hub vertically and halfway between the  
fan hub and the fan housing horizontally as shown in Figure 11 (avoiding the hub  
spokes). Using an open bench to characterize an active heatsink can be useful, and  
usually ensures more uniform temperatures at the fan inlet. However, additional tests  
that include a solid barrier above the test motherboard surface can help evaluate the  
potential impact of the chassis. This barrier is typically clear Plexiglas*, extending at  
least 100 mm [4 in] in all directions beyond the edge of the thermal solution. Typical  
distance from the motherboard to the barrier is 81 mm [3.2 in]. For even more  
realistic airflow, the motherboard should be populated with significant elements like  
memory cards, graphic card, and chipset heatsink. If a barrier is used, the  
thermocouple can be taped directly to the barrier with a clear tape at the horizontal  
location as previously described, half way between the fan hub and the fan housing.  
If a variable speed fan is used, it may be useful to add a thermocouple taped to the  
barrier above the location of the temperature sensor used by the fan to check its  
speed setting against air temperature. When measuring TA in a chassis with a live  
motherboard, add-in cards, and other system components, it is likely that the TA  
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Thermal and Mechanical Design Guidelines  
 
Thermal Metrology  
measurements will reveal a highly non-uniform temperature distribution across the  
inlet fan section.  
For passive heatsinks, thermocouples should be placed approximately 3 mm away  
from the heatsink as shown in Figure 12.  
Note: Testing an active heatsink with a variable speed fan can be done in a thermal  
chamber to capture the worst-case thermal environment scenarios. Otherwise, when  
doing a bench top test at room temperature, the fan regulation prevents the heatsink  
from operating at its maximum capability. To characterize the heatsink capability in  
the worst-case environment in these conditions, it is then necessary to disable the fan  
regulation and power the fan directly, based on guidance from the fan supplier.  
Figure 11. Locations for Measuring Local Ambient Temperature, Active Heatsink  
NOTE: Drawing Not to Scale  
Thermal and Mechanical Design Guidelines  
31  
 
Thermal Metrology  
Figure 12. Locations for Measuring Local Ambient Temperature, Passive Heatsink  
3MM AWAY FROM HEATSINK SIDES  
HALF OF HEATSINK FIN HEIGHT  
SIDE VIEW  
POTISTION THERMOCOUPLES (X4)  
AT LOCATIONS AS INDICATED  
TO MEASURE TA.  
TC2  
TC1  
TC3  
TOP VIEW  
TC4  
NOTE: Drawing Not to Scale  
It is recommended that full and routine calibration of temperature measurement  
equipment be performed before attempting to perform temperature measurement.  
Intel recommends checking the meter probe set against known standards. This  
should be done at 0 ºC (using ice bath or other stable temperature source) and at an  
elevated temperature, around 80 ºC (using an appropriate temperature source).  
Wire gauge and length also should be considered as some less expensive  
measurement systems are heavily impacted by impedance. There are numerous  
resources available throughout the industry to assist with implementation of proper  
controls for thermal measurements.  
3.3  
Processor Power Measurement Metrology  
Recommendation  
This section recommends a metrology to measure power consumption of the Intel  
Celeron processor 200 sequence on the Intel Desktop Board D201GLY2. Should there  
be any modification of motherboard layout or design, contact Intel field sales  
representative or product marketing staff for clarification of this metrology.  
32  
Thermal and Mechanical Design Guidelines  
 
Thermal Metrology  
3.3.1  
Sample Preparation  
In order to accurately measure the processor power consumption, it is required to  
attach sense resistor and replace one of the motherboard resistors. Schematic  
diagram in Figure 13 illustrates the precision resistor (RSENSE) attached in series with  
processor circuitry. The processor power consumption can be estimated by  
Equation 5.  
Equation 5 PD = VCC × (Vi / RSENSE  
)
Where:  
PD  
=
Processor total power dissipation (W) (assumes all power dissipates  
through the processor die)  
VCC  
=
=
=
Processor core voltage.  
Vi  
Voltage measured across precision sense resistor.  
Given resistance value of precision resistor.  
RSENSE  
The Isotek 4 terminal (Kelvin) precision resistor (with resistance of 1 mΩ and  
Tol=0.1%) is recommended to be used for processor power measurement. Locate the  
inductor L1VR inductor (near processor) on motherboard and attach the Isotek  
precision resistor in-series with inductor as illustrated in Figure 13 schematic and  
Figure 14 board layout schematic diagram. Additionally, it is required to replace  
R27VR chip resistor (near processor) with a 19.6 KΩ rated chip resistor as illustrated  
in Figure 15. The Walsin chip resistor (WR06X1962FTL) is one of the recommended  
chip resistors for the rework.  
Table 4. Test Accessories  
5.  
Description  
Q
7.  
Part Number  
N
1
uantity  
otes  
9. Isotek 4 terminal  
(Kelvin) precision  
resistor  
10. 1  
14. 1  
11. P/N A-N-R001-F1-K2-0.1.  
R=1 mΩ, Tol=0.1%, P=2W,  
TCR<10 ppm/°C  
12.  
13. Walsin chip  
resistor  
15. WR06X1962FTL. R= 19.6 KΩ,  
Tol =1%, P=0.1W, TCR<200  
ppm/°C.  
16.  
2
NOTE:  
1.  
http://www.isotekcorp.com/productDisplay.asp?CatID=1&SubCatID  
http://www.passivecomponent.com/lh3/search.asp  
2.  
Thermal and Mechanical Design Guidelines  
33  
 
Thermal Metrology  
Figure 13. Precision Resistor Connected in-series with Processor Circuitry for Power  
Measurement  
Figure 14. Installation of Isotek Resistor on Intel® Desktop Board D201GLY2 to Setup  
Connection for Power Measurement  
Isotek  
Resistor  
Measuring Vi  
1
2
2
1
Measuring VCC  
34  
Thermal and Mechanical Design Guidelines  
 
Thermal Metrology  
Figure 15. Probing Resistance of the Soldered Walsin Resistor (R =19.6 KΩ) on Intel®  
Desktop Board D201GLY2 to Ensure Proper Attachment  
Figure 16. Precision Resistor Soldered on on Intel® Desktop Board D201GLY2, and  
Connected to netDAQ for Voltage Measurement  
§
Thermal and Mechanical Design Guidelines  
35  
 
Thermal Metrology  
36  
Thermal and Mechanical Design Guidelines  
System Thermal/Mechanical Design Information  
4 System Thermal/Mechanical  
Design Information  
4.1  
Overview of the Reference Design  
This chapter will document the requirements for designing a passive heatsink that  
meets the maximum usage power consumption that mentioned in Section 2.4. The  
Intel® Boxed Processor thermal solution E21953-001 satisfies the specified thermal  
requirements.  
Note: The part number E21953-001 provided in this document is for reference only. The  
revision number -001 may be subject to change without notice. OEMs and System  
Integrators are responsible for thermal, mechanical and environmental validation of  
this solution (refer to Sections 4.1.2 and 4.2).  
The Intel® Boxed Processor thermal solution E21953-001 takes advantage of cost  
savings. The thermal solution supports the unique and smaller desktop PCs including  
small and ultra small form factors, down to a 5L system size.  
The motherboard keep-out and height recommendations shown in Section 2.1 remain  
the same for a thermal solution for the Intel Celeron processor 200 sequence in the  
micro-FCBGA package.  
4.1.1  
Altitude  
Many companies design products that must function reliably at high altitude, typically  
1,500 m [5,000 ft] or more. Air-cooled temperature calculations and measurements  
at the test site elevation must be adjusted to take into account altitude effects like  
variation in air density and overall heat capacity. This often leads to some  
degradation in thermal solution performance compared to what is obtained at sea  
level, with lower fan performance and higher surface temperatures. The system  
designer needs to account for altitude effects in the overall system thermal design to  
make sure that the TS-TOP-MAX requirement for the processor is met at the targeted  
altitude.  
4.1.2  
Heatsink Thermal Validation  
Intel recommends evaluation of the heatsink within the specific boundary conditions  
based on the methodology described in Chapter 3.  
Testing is done on bench top test boards at ambient laboratory temperature.  
The test results, for a number of samples, are reported in terms of a worst-case mean  
+ 3σ value for thermal characterization parameter using real processors.  
Thermal and Mechanical Design Guidelines  
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System Thermal/Mechanical Design Information  
4.2  
Environmental Reliability Testing  
4.2.1  
Structural Reliability Testing  
Structural reliability tests consist of unpackaged, board-level vibration and shock tests  
of a given thermal solution in the assembled state. The thermal solution should meet  
the specified thermal performance targets after these tests are conducted; however,  
the test conditions outlined here may differ from your own system requirements.  
4.2.1.1  
Random Vibration Test Procedure  
Duration: 10 min/axis, 3 axes  
Frequency Range: 5 Hz to 500 Hz  
Power Spectral Density (PSD) Profile: 3.13 G RMS  
Figure 17. Random Vibration PSD  
0.1  
3.13GRMS (10 minutes per axis)  
(20, 0.02)  
(500, 0.02)  
(5, 0.01)  
0.01  
5 Hz  
500 Hz  
0.001  
1
10  
100  
1000  
Frequency (Hz)  
4.2.1.2  
Shock Test Procedure  
Recommended performance requirement for a motherboard:  
• Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (i.e.,  
total 18 drops).  
• Profile: 50 G trapezoidal waveform, 170 in/sec minimum velocity change.  
• Setup: Mount sample board on test fixture.  
38  
Thermal and Mechanical Design Guidelines  
 
System Thermal/Mechanical Design Information  
Figure 18. Shock Acceleration Curve  
60  
A
c
c
50  
e
l
40  
e
r
a
t
i
o
n
30  
20  
10  
0
(g)  
0
2
4
6
8
10  
12  
Time (milliseconds)  
4.2.1.2.1 Recommended Test Sequence  
Each test sequence should start with components (i.e. motherboard, heatsink  
assembly, etc.) that have never been previously submitted to any reliability testing.  
The test sequence should always start with a visual inspection after assembly, and  
BIOS/CPU/Memory test (refer to Section 4.2.1.2.2).  
Prior to the mechanical shock & vibration test, the units under test should be  
preconditioned for 72 hours at 45 ºC. The purpose is to account for load relaxation  
during burn-in stage.  
The stress test should be followed by a visual inspection and then BIOS/CPU/Memory  
test.  
4.2.1.2.2 Post-Test Pass Criteria  
The post-test pass criteria are:  
1. No significant physical damage to the heatsink attach mechanism (including such  
items as clip and motherboard fasteners).  
2. Heatsink must remain attached to the motherboard.  
3. Heatsink remains seated and its bottom remains mated flatly against die surface.  
No visible gap between the heatsink base and processor die. No visible tilt of the  
heatsink with respect to its attach mechanism.  
4. No signs of physical damage on motherboard surface due to impact of heatsink or  
heatsink attach mechanism.  
5. No visible physical damage to the processor package.  
6. Successful BIOS/Processor/memory test of post-test samples.  
7. Thermal compliance testing to demonstrate that the case temperature  
specification can be met.  
Thermal and Mechanical Design Guidelines  
39  
 
System Thermal/Mechanical Design Information  
4.2.2  
4.2.3  
Power Cycling  
Thermal performance degradation due to TIM degradation is evaluated using power  
cycling testing. The test is defined by 7500 cycles for the heatsink temperature from  
room temperature (~23 ºC) to TS-TOP-MAX at usage power consumption.  
Recommended BIOS/CPU/Memory Test Procedures  
This test is to ensure proper operation of the product before and after environmental  
stresses, with the thermal mechanical enabling components assembled. The test shall  
be conducted on a fully operational motherboard that has not been exposed to any  
battery of tests prior to the test being considered.  
Testing setup should include the following components, properly assembled and/or  
connected:  
• Appropriate system motherboard  
• Processor  
• All enabling components, including socket and thermal solution parts  
• Power supply  
• Disk drive  
• Video card  
• DIMM  
• Keyboard  
• Monitor  
The pass criterion is that the system under test shall successfully complete the  
checking of BIOS, basic processor functions and memory, without any errors.  
4.3  
Material and Recycling Requirements  
Material shall be resistant to fungal growth. Examples of non-resistant materials  
include cellulose materials, animal and vegetable based adhesives, grease, oils, and  
many hydrocarbons. Synthetic materials such as PVC formulations, certain  
polyurethane compositions (e.g., polyester and some polyethers), plastics which  
contain organic fillers of laminating materials, paints, and varnishes also are  
susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-  
STD-810E, Method 508.4 must be performed to determine material performance.  
Material used shall not have deformation or degradation in a temperature life test.  
Any plastic component exceeding 25 grams must be recyclable per the European Blue  
Angel recycling standards.  
40  
Thermal and Mechanical Design Guidelines  
 
System Thermal/Mechanical Design Information  
4.4  
Safety Requirements  
Heatsink and attachment assemblies shall be consistent with the manufacture of units  
that meet the safety standards:  
• UL Recognition-approved for flammability at the system level. All mechanical and  
thermal enabling components must be a minimum UL94V-2 approved.  
• CSA Certification. All mechanical and thermal enabling components must have  
CSA certification.  
• All components (in particular the heatsink fins) must meet the test requirements  
of UL1439 for sharp edges.  
• If the International Accessibility Probe specified in IEC 950 can access the moving  
parts of the fan, consider adding safety feature so that there is no risk of personal  
injury.  
4.5  
Reference Attach Mechanism  
4.5.1  
Structural Design Strategy  
Structural design strategy for the Intel reference thermal solution is to minimize  
upward board deflection during shock.  
The design uses a high clip stiffness that resists local board curvature under the  
heatsink, and minimizes, in particular, upward board deflection.  
4.5.2  
Mechanical Interface to the Reference Attach Mechanism  
The attach mechanism component (E21952-001) from the Intel Boxed Processor  
thermal solution can be used by other 3rd party cooling solutions. The attach  
mechanism consists of:  
• A metal clip that interfaces with the heatsink, see Figure 22 for the component  
drawings.  
• Heatsink/fan mass ≤ 62 g  
§
Thermal and Mechanical Design Guidelines  
41  
 
System Thermal/Mechanical Design Information  
42  
Thermal and Mechanical Design Guidelines  
Heatsink Clip Load Metrology  
Appendix AHeatsink Clip Load  
Metrology  
A.1  
Overview  
The primary objective of the preload measurement is to ensure the preload designed  
into the retention mechanism is able to meet minimum of 8.7lbf at end-of-line and  
does not violate the maximum specifications of the package.  
A.2  
Test Preparation  
A.2.1  
Heatsink Preparation  
The following components are required to validate a generic z-clip solution:  
1. Thermal solution heatsink (for example, PN: D96271-001 for the Intel Celeron  
processor 200 sequence on Intel® Desktop Board D201GLY2)  
2. Z-clip (for example, PN: D96271-001 for the Intel Celeron processor 200  
sequence on Intel® Desktop Board D201GLY2)  
3. 2X Anchors (IPN: A13494-008 if using Intel’s part)  
4. Customized top plate to allow anchor attachment and package simulator  
A.2.2  
Typical Test Equipment  
For the heatsink clip load measurement, use equivalent test equipment to the one  
listed Table 5.  
Thermal and Mechanical Design Guidelines  
43  
 
Heatsink Clip Load Metrology  
Table 5. Typical Test Equipment  
9.  
Part Number  
(Model)  
7.  
Item  
18.  
Description  
20. Load  
22. Honeywell*-Sensotec* Model 13  
subminiature load cells, compression  
only  
25. AL322BL  
cell  
21. Notes:  
1, 5  
23. Select a load range depending on load  
level being tested.  
24. www.sensotec.com  
26. Data  
Logger  
(or  
28. Vishay* Measurements Group Model  
6100 scanner with a 6010A strain card  
(one card required per channel).  
29. Model 6100  
scanner  
)
27. Notes:  
2, 3, 4  
30. Clip  
Force  
32. Customized machine that houses load  
cell for force measurement. Top side  
plate can be modified to accommodate  
various attach pattern  
33. CFM-001 (Cool  
Star  
Measure  
ment  
Technology)  
machine  
31. Notes:  
644  
NOTES:  
1.  
Select load range depending on expected load level. It is usually better, whenever  
possible, to operate in the high end of the load cell capability. Check with your load cell  
vendor for further information.  
2.  
Since the load cells are calibrated in terms of mV/V, a data logger or scanner is  
required to supply 5 volts DC excitation and read the mV response. An  
automated model will take the sensitivity calibration of the load cells and convert the  
mV output into pounds.  
3.  
4.  
5.  
With the test equipment listed above, it is possible to automate data recording and  
control with a 6101-PCI card (GPIB) added to the scanner, allowing it to be connected  
to a PC running LabVIEW* or Vishay's StrainSmart* software.  
IMPORTANT: In addition to just a zeroing of the force reading at no applied load, it is  
important to calibrate the load cells against known loads. Load cells tend to drift.  
Contact your load cell vendor for calibration tools and procedure information.  
When measuring loads under thermal stress (bake for example), load cell thermal  
capability must be checked, and the test setup must integrate any hardware used along  
with the load cell. For example, the Model 13 load cells are temperature compensated  
up to 71°C, as long as the compensation package (spliced into the load cell's wiring) is  
also placed in the temperature chamber. The load cells can handle up to 121 °C  
(operating), but their uncertainty increases according to 0.02% rdg/°F.  
Clip force measurement machine is recommended to be calibrated before usage.  
Standard weights should be used to check for preload cell accuracy and consistency.  
6.  
44  
Thermal and Mechanical Design Guidelines  
 
Heatsink Clip Load Metrology  
A.3  
Test Procedure Examples  
The following procedure is for a generic z-clip solution using the clip force time0  
measurement machine at room temperature:  
1. Install anchors onto top plate. Anchor can be secured using epoxy or glue.  
2. Fasten top plate onto the clip force measurement machine. Place package  
simulator on top of the preload cell as well.  
3. Place the heatsink (remove any TIM material) on top of the package simulator.  
Power on the clip force measurement machine.  
4. Install the z-clip and record down the measured preload. Make sure measurement  
is taken after the reading stabilized. Remove the z-clip and repeat 2 times (in  
total 3 times) to ensure consistency.  
5. Repeat step4 for remaining clip samples. Recommended minimum samples are  
10 z-clip samples.  
Figure 19. Top Plate and Package Simulator Fasten onto Clip Force Measurement  
Machine  
Thermal and Mechanical Design Guidelines  
45  
 
Heatsink Clip Load Metrology  
Figure 20. Anchors Installed and Glued Down the BTX Base Plate – for reference only  
§
46  
Thermal and Mechanical Design Guidelines  
 
Intel® Enabled Boxed Processor Thermal Solution Information  
Appendix B Intel® Enabled Boxed  
Processor Thermal  
Solution Information  
This appendix includes supplier information for Intel enabled vendors.  
Table 6 lists suppliers that produce Intel® Boxed Processor thermal solution E21953-  
001 components. The part numbers listed below identifies these reference  
components. End-users are responsible for the verification of the Intel enabled  
component offerings with the supplier. OEMs and System Integrators are responsible  
for thermal, mechanical, and environmental validation of these solutions.  
Table 6. Intel® Boxed Processor Thermal Solution Providers  
4.  
S 5.  
upplier  
Part 6.  
Description  
Par 7.  
t Number  
Con 38.  
tact  
Phone  
9.  
Email  
40. C  
41. CPU  
Heats  
42. E21  
953-  
43. Moni  
ca  
44. +886-2-  
2995-2666  
ext. 1131  
45. monic  
a_chih  
@ccic.  
com.t  
w
C
I
ink  
Asse  
mbly  
001  
Chih  
46. Cind  
47. +886-2-  
2995-2666  
ext. 1140  
48. cindy_  
zhang  
@ccic.  
com.t  
w
y
Zha  
ng  
These vendors and devices are listed by Intel as a convenience to Intel's general  
customer base, but Intel does not make any representations or warranties whatsoever  
regarding quality, reliability, functionality, or compatibility of these devices. This list  
and/or these devices may be subject to change without notice.  
§
Thermal and Mechanical Design Guidelines  
47  
 
Intel® Enabled Boxed Processor Thermal Solution Information  
48  
Thermal and Mechanical Design Guidelines  
Mechanical Drawings  
Appendix C Mechanical Drawings  
The following table lists the mechanical drawings included in this appendix. These  
drawings refer to the reference thermal mechanical enabling components for the  
processor.  
Note: Intel reserves the right to make changes and modifications to the design as  
necessary.  
49.  
Drawing Description  
50.  
Page  
Number  
51. Motherboard Keep-out Footprint Definition and Height  
Restrictions for Enabling Components  
52. 50  
53. Reference Clip E21952-001  
54. 51  
56. 52  
58. 53  
55. Reference Heatsink D96271-001  
57. Intel® Boxed Processor Thermal Solution E21953-001  
Thermal and Mechanical Design Guidelines  
49  
 
Mechanical Drawings  
Figure 21. Motherboard Keep-out Footprint Definition and Height Restrictions for  
Enabling Components  
50  
Thermal and Mechanical Design Guidelines  
 
Mechanical Drawings  
Figure 22. Reference Clip E21952-001  
Thermal and Mechanical Design Guidelines  
51  
 
Mechanical Drawings  
Figure 23. Reference Heatsink D96271-001  
52  
Thermal and Mechanical Design Guidelines  
 
Mechanical Drawings  
Figure 24. Intel® Boxed Processor Thermal Solution E21953-001  
§
Thermal and Mechanical Design Guidelines  
53  
 

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