Sony Ericsson Modem GR64 User Manual

GR64 GSM/GPRS Modem  
Integrators Manual  
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Contents  
Overview...................................................................................................... 8  
1 Introduction ........................................................................................... 9  
1.1  
1.2  
1.3  
1.4  
1.5  
TARGET USERS.......................................................................................................... 9  
PREREQUISITES ......................................................................................................... 9  
MANUAL STRUCTURE................................................................................................ 9  
NOTATION ............................................................................................................. 10  
ACKNOWLEDGEMENTS............................................................................................ 10  
2 GR64 Wireless Modem.......................................................................... 11  
2.1  
2.2  
2.3  
ABOUT THE GR64 ................................................................................................... 11  
WIRELESS MODEMS IN A COMMUNICATION SYSTEM................................................. 12  
FEATURES............................................................................................................... 14  
2.3.1  
2.3.2  
TYPES OF MOBILE STATION.............................................................................. 14  
SHORT MESSAGE SERVICE ................................................................................ 14  
VOICE CALLS ................................................................................................... 15  
DATA .............................................................................................................. 15  
GPRS MULTI-SLOT SUPPORT............................................................................. 16  
SIM CARD........................................................................................................ 16  
POWER CONSUMPTION..................................................................................... 16  
OTHER FEATURES ............................................................................................ 17  
2.3.3  
2.3.4  
2.3.5  
2.3.6  
2.3.7  
2.3.8  
2.4  
2.4.1  
2.4.2  
SERVICE AND SUPPORT........................................................................................... 18  
WEB PAGES ...................................................................................................... 18  
AT COMMANDS MANUAL................................................................................. 18  
M2MPOWER APPLICATION GUIDE ..................................................................... 18  
DEVELOPER’S KIT............................................................................................. 18  
2.4.3  
2.4.4  
2.5  
2.6  
PRECAUTIONS......................................................................................................... 19  
GUIDELINES FOR SAFE AND EFFICIENT USE .............................................................. 19  
2.6.1  
2.6.2  
2.6.3  
2.6.4  
GENERAL USAGE .............................................................................................. 19  
RADIO FREQUENCY (RF) EXPOSURE AND SAR .................................................... 20  
PERSONAL MEDICAL DEVICES........................................................................... 20  
DISPOSAL OF OLD ELECTRONIC EQUIPMENT..................................................... 20  
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3 Abbreviations....................................................................................... 22  
Integrating the Wireless Modem ................................................................. 24  
4 Mechanical Description......................................................................... 25  
4.1  
4.2  
INTERFACE DESCRIPTION........................................................................................ 25  
PHYSICAL DIMENSIONS ........................................................................................... 27  
5 System Connector Interface.................................................................. 29  
5.1  
5.2  
5.3  
OVERVIEW .............................................................................................................. 29  
DEALING WITH UNUSED PINS................................................................................... 32  
GENERAL ELECTRICAL AND LOGICAL CHARACTERISTICS.......................................... 34  
5.3.1  
5.3.1.1  
5.3.1.2  
LEVEL SHIFTER INTERFACES.............................................................................. 34  
COMMON LEVEL SHIFTER INTERFACE............................................................ 34  
I2C LEVEL SHIFTER INTERFACE...................................................................... 36  
5.4  
5.4.1  
5.4.2  
GROUNDS............................................................................................................... 37  
ANALOGUE GROUND (AREF)............................................................................. 37  
COMMON GROUND (GND)................................................................................ 37  
5.5  
5.6  
REGULATED POWER SUPPLY INPUT (VCC)................................................................. 38  
VOLTAGE REFERENCE (VREF) ................................................................................... 39  
5.6.1  
5.6.2  
VREF AS AN OUTPUT........................................................................................ 39  
VREF AS AN INPUT ........................................................................................... 39  
5.7  
5.7.1  
5.7.2  
5.7.3  
BATTERY CHARGING INPUT (CHG_IN) ...................................................................... 41  
CHARGING PROCESS ........................................................................................ 42  
SERIES DIODE................................................................................................... 43  
BATTERY SELECTION........................................................................................ 43  
5.8  
5.8.1  
5.8.2  
POWERING THE MODULE ON AND OFF (ON/OFF) ..................................................... 47  
TURNING THE MODULE ON .............................................................................. 47  
TURNING THE MODULE OFF ............................................................................. 48  
5.9  
5.9.1  
5.9.2  
ANALOGUE AUDIO.................................................................................................. 50  
AUXILIARY AUDIO TO MOBILE STATION (AUXI).................................................. 51  
AUXILIARY AUDIO FROM MOBILE STATION (AUXO)............................................ 52  
MICROPHONE SIGNALS (MICIP, MICIN).............................................................. 52  
SPEAKER SIGNALS (EARP, EARN) ....................................................................... 53  
5.9.3  
5.9.4  
5.10  
PCM DIGITAL AUDIO (SSP) ................................................................................... 53  
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5.10.1 PCM DATA FORMAT......................................................................................... 53  
5.11  
SERIAL DATA INTERFACES ................................................................................... 55  
5.11.1 UART1............................................................................................................. 56  
5.11.2 SERIAL DATA SIGNALS (DTM1, DFM1)............................................................... 56  
5.11.2.1 SERIAL DATA FROM WIRELESS MODEM (DFM1) .............................................. 57  
5.11.2.2 SERIAL DATA TO WIRELESS MODEM (DTM1) .................................................. 57  
5.11.3 CONTROL SIGNALS (RTS1, CTS1, DTR1, DSR1, DCD1, RI).................................. 57  
5.11.3.1 HARDWARE FLOW CONTROL RTS1 AND CTS1 ............................................... 57  
5.11.3.2 REQUEST TO SEND (RTS1)............................................................................. 57  
5.11.3.3 CLEAR TO SEND (CTS1) ................................................................................ 58  
5.11.3.4 DATA TERMINAL READY (DTR1).................................................................... 58  
5.11.3.5 DATA SET READY (DSR1) .............................................................................. 58  
5.11.3.6 DATA CARRIER DETECT (DCD1) .................................................................... 58  
5.11.3.7 RING INDICATOR (RI).................................................................................... 58  
5.11.4 UART3 (DTM3, DFM3)...................................................................................... 59  
5.11.4.1 TRANSMITTED DATA (DTM3)........................................................................ 59  
5.11.4.2 RECEIVED DATA (DFM3)................................................................................ 59  
5.11.5 USB ................................................................................................................. 60  
5.11.6 SIM CARD INTERFACE ...................................................................................... 61  
5.11.7 SIM DETECTION (SIMDET)................................................................................. 62  
5.12  
SERVICE/PROGRAMMING..................................................................................... 62  
BUZZER............................................................................................................... 63  
LED..................................................................................................................... 63  
GENERAL PURPOSE IO.......................................................................................... 65  
5.13  
5.14  
5.15  
5.15.1 EMBEDDED APPLICATIONS ............................................................................... 66  
5.15.2 LED/IO6 CAPABILITIES ..................................................................................... 66  
5.15.3 ADC4 .............................................................................................................. 66  
5.16  
DIGITAL TO ANALOGUE CONVERTER – DAC ......................................................... 67  
ANALOGUE TO DIGITAL CONVERTERS (ADIN1, ADIN2, ADIN3, ADIN4).................. 67  
5.17  
5.18  
5.19  
5.20  
2
I C SERIAL CONTROL BUS .................................................................................... 69  
BURST TRANSMISSION (TX_ON)............................................................................ 70  
REAL TIME CLOCK............................................................................................... 70  
5.20.1 REAL TIME CLOCK BACKUP SUPPLY (VRTC) ....................................................... 71  
5.20.2 RTC ALARM (ALARM) ....................................................................................... 72  
5.20.2.1 ALARM OUTPUT FROM THE MODULE ............................................................ 72  
5.20.3 ALARM UTILIZATION AS A WAKE-UP................................................................. 73  
6 Antenna Connector .............................................................................. 74  
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7 Hints for Integrating the Wireless Modem............................................. 75  
7.1  
SAFETY ADVICE AND PRECAUTIONS ........................................................................ 75  
7.1.1  
GENERAL ......................................................................................................... 75  
SIM CARD............................................................................................................... 76  
ANTENNA............................................................................................................... 76  
INSTALLATION OF THE WIRELESS MODEM................................................................ 77  
7.2  
7.3  
7.4  
7.4.1  
7.4.1.1  
7.4.1.2  
7.4.1.3  
7.4.1.4  
7.4.2  
7.4.2.1  
7.4.2.2  
7.4.2.3  
7.4.2.4  
WHERE TO INSTALL THE WIRELESS MODEM....................................................... 77  
ENVIRONMENTAL CONDITIONS..................................................................... 77  
SIGNAL STRENGTH ....................................................................................... 77  
CONNECTION OF COMPONENTS TO WIRELESS MODEM.................................. 78  
NETWORK AND SUBSCRIPTION...................................................................... 78  
HOW TO INSTALL THE WIRELESS MODEM.......................................................... 78  
POWER SUPPLY............................................................................................. 78  
GROUNDS .................................................................................................... 78  
AUDIO.......................................................................................................... 79  
SOFTWARE UPGRADE.................................................................................... 79  
7.5  
7.5.1  
7.5.2  
ANTENNA............................................................................................................... 79  
GENERAL ......................................................................................................... 79  
ANTENNA TYPE................................................................................................ 79  
ANTENNA PLACEMENT..................................................................................... 80  
THE ANTENNA CABLE....................................................................................... 80  
POSSIBLE COMMUNICATION DISTURBANCES..................................................... 80  
7.5.3  
7.5.4  
7.5.5  
8 Embedded Applications........................................................................ 82  
8.1  
FEATURES............................................................................................................... 82  
8.2  
IMPLEMENTATION................................................................................................... 82  
8.2.1  
8.2.2  
LIMITATIONS ................................................................................................... 82  
M2MPOWER IDE (INTEGRATED DEVELOPMENT ENVIRONMENT).......................... 83  
9 TCP/IP Stack......................................................................................... 84  
9.1  
IMPLEMENTATION................................................................................................... 84  
10 Technical Data................................................................................... 85  
10.1  
10.2  
10.3  
MECHANICAL SPECIFICATIONS............................................................................. 85  
POWER SUPPLY VOLTAGE, NORMAL OPERATION................................................... 86  
RADIO SPECIFICATIONS ....................................................................................... 86  
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10.4  
10.5  
SIM CARD............................................................................................................ 86  
ENVIRONMENTAL SPECIFICATION ........................................................................ 87  
11 Regulatory Notices ............................................................................ 89  
Developers Kit............................................................................................ 90  
12 Introduction to the Universal Developer’s Kit..................................... 91  
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Overview  
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1 Introduction  
1.1 Target Users  
The GR64 wireless modems are designed to be integrated into machine-to-machine  
or man-to-machine communications applications.  
They are intended to be used by manufacturers, system integrators, applications  
developers and developers of wireless communications equipment.  
1.2 Prerequisites  
It is assumed that the person integrating the wireless modem into an application has  
a basic understanding of the following:  
GSM networking;  
Wireless communication and antennas (aerials)  
AT commands  
ITU-T standard V.24/V.28  
Micro controllers and programming  
Electronic hardware design  
1.3 Manual Structure  
This manual is composed of three parts.  
Part 1- Overview  
This section provides a broad overview of the Gx64 family and includes a list of  
abbreviations used in the manual.  
Part 2 - Integrating the Wireless modem  
This section describes each of the signals available on the GR64 wireless modem,  
along with mechanical information. The section also provides you with design  
guidelines and what is needed to commercialize an application from a regulatory  
point of view.  
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Part 3 – Developer’s Kit  
This section lists the contents of the Developer’s Kit and provides the information to  
setup and use the equipment.  
1.4 Notation  
The following symbols and admonition notation are used to draw the readers  
attention to notable, or crucially-important information.  
Note  
Draws the readers attention to pertinent, useful or interesting  
information  
NOTE  
Tip  
Provides advice, suggestions, guidance or recommendations which  
augment the formal text  
TIP  
Caution  
Cautionary information must be heeded, it draws the readers attention  
to the need for understanding, care or watchfulness in relation to the  
information provided  
CAUTION  
Warning  
Notes marked warning must be heeded, they alert readers to  
precautionary measures, risks, hazards or safety information which  
!
WARNING  
directly effects equipment function, warranty or personnel safety  
Danger  
This information must be heeded, it identifies information and  
cautionary behavior that otherwise ignored could result in catastrophic  
equipment failure, bodily injury or death  
DANGER  
1.5 Acknowledgements  
Parts of this document, including text passages, tables, and illustrations, are  
reproduced from copyright information by kind permission of Agere Systems Inc.  
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2 GR64 Wireless Modem  
2.1 About the GR64  
The Sony Ericsson Gx64 family of devices are Quad Band GSM/GPRS wireless modems  
operating in the GSM 850/900/1800/1900 bands.  
These products belong to a new generation of Sony Ericsson wireless modems, and  
are intended to be used in machine-to-machine applications and man-to-machine  
applications. They are used when there is a need to send and receive data (by SMS,  
CSD, or GPRS), and make voice calls over the GSM network.  
The GR64 conforms to the European Union (EU) Restriction of Hazardous Substances  
(RoHS) directive 2002/95/EC.  
The GR64 is available in four variants. Table 1: GR64 Variants lists the hardware and  
software features for each variant. The device is available in two hardware variants.  
Each hardware variant is available in two software variants. The first hardware variant  
(/10 and /30) is equipped with PCM compatible pins but does not have a USB  
interface or an integrated SIM card holder. The second hardware variant (/20 and  
/40) is equipped with a USB interface and an integrated SIM card holder, but does not  
have PCM compatible pins.  
Table 1: GR64 Variants  
PCM  
SIM Card  
Holder  
Embedded  
Applications  
Variant  
Compatible VREF Input  
PINS  
USB  
DPY 102 1494/10  
DPY 102 1494/20  
DPY 102 1494/30  
DPY 102 1494/40  
Yes  
No  
Yes  
No  
No  
Yes  
No  
No  
Yes  
No  
No  
No  
No  
Yes  
No  
Yes  
Yes  
Yes  
Yes  
Yes  
One software variant is designed to be controlled from a micro-controller situated on  
the host application. The other software variant offers the option to run applications  
embedded onto the module itself. When using the embedded application version the  
controlling script can be run internal to the module, with or without the use of an  
external control.  
A typical application, involves a micro-controller and a wireless modem, in which the  
micro-controller sends AT commands to the wireless modem via an RS232  
communications link.  
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2.2 Wireless modems in a Communication System  
Figure 2.2-1 and Figure 2.2-2 illustrate the main blocks of a wireless communication  
system using the wireless modem. Figure 2.2-1 shows the communication system  
when the script is embedded on the wireless modem and Figure 2.2-2 shows the  
communication system when a micro-controller is used. They also show the  
communication principles of the system and the interface between the wireless  
modem and the application. The definitions in the figures, as used elsewhere in this  
manual, are in accordance with the recommendations of 3GPP TS 27.007.  
The MS (mobile station) represents the wireless modem and SIM card. The wireless  
modem excluding SIM card, is known as the ME (mobile equipment).  
The DTE (data terminal equipment) is the controlling application. This can be either  
an external host or an internal embedded application.  
The DCE (data circuit terminating equipment) is the serial communication interface of  
the MS.  
MS  
GSM  
NETWORK  
SIM  
SIM  
GSM  
ENGINE  
DC  
POWER  
STATUS &  
RESPONSE  
EMBEDDED  
APPLICATION  
DCE  
DTE  
COMMAND  
& CONTROL  
Figure 2.2-1 Main Blocks in a Wireless System (embedded application)  
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MS  
GSM  
NETWORK  
SIM  
GR64  
SIM  
GSM  
ENGINE  
DC  
POWER  
STATUS &  
RESPONSE  
DTE  
DCE  
COMMAND  
& CONTROL  
Figure 2.2-2 Main Blocks in a Wireless System (external micro-controller)  
In accordance with the recommendations of ITU-T (International Telecommunication  
Union - Telecommunications Standardization Sector) V.24, the TE communicates with  
the MS over a serial interface.  
The functions of the wireless modem follow the recommendations provided by 3GPP  
(3rd Generation Partnership Project) and ITU-T. 3GPP is a collaboration agreement  
that was established in December 1998. The collaboration agreement brings  
together a number of telecommunications standards bodies which are known as  
Organizational Partners. The current Organizational Partners are ARIB, CCSA, ETSI,  
ATIS, TTA, and TTC.  
3GPP specifies a set of AT commands for controlling the GSM element of the wireless  
modem; these commands are supplemented by Sony Ericsson specific commands.  
To find out how to work with AT commands, see the AT Commands Manual.  
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2.3 Features  
The wireless modem performs a set of telecom services (TS) according to 3GPP  
release 99 and ITU-T. The functions of the wireless modem are implemented by  
issuing AT commands over a serial interface.  
2.3.1 Types of Mobile Station  
The GR64 is a fully Quad Band capable GSM/GPRS mobile station with the  
characteristics shown in the table below.  
Feature  
GSM850  
824-849  
869-894  
200kHz  
124  
E-GSM900  
880-915  
925-960  
200kHz  
174  
GSM1800  
1710-1785  
1805-1880  
200kHz  
374  
GSM1900  
1850-1910  
1930-1990  
200kHz  
299  
Tx  
Rx  
Frequency range (MHz)  
Channel spacing  
Number of channels  
Number of TD slots  
Duplex spacing  
GSM power class  
Modulation  
8
8
8
8
45MHz  
4 (2W)  
45MHz  
4 (2W)  
95MHz  
1 (1W)  
GMSK  
80MHz  
1 (1W)  
Receive sensitivity  
GPRS multi-slot class  
<-102dBm at antenna connector  
Class 10  
2.3.2 Short Message Service  
The wireless modem supports the following SMS services:  
Sending; MO (mobile-originated) with both PDU (protocol data unit) and text  
mode supported  
Receiving; MT (mobile-terminated) with both PDU and text mode supported  
CBM (cell broadcast message); a service in which a message is sent to all  
subscribers located in one or more specific cells in the GSM network (for example,  
traffic reports)  
SMS status report according to 3GPP TS 23.40  
The maximum length of a text mode SMS message is 160 characters using 7-bit  
encoding. The wireless modem supports up to six concatenated messages to extend  
this function. Concatenation is performed by the host application.  
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2.3.3 Voice Calls  
The wireless modem offers the capability of MO (mobile originated) and MT (mobile  
terminated) voice calls, as well as supporting emergency calls. Multi-party, call  
waiting and call divert features are available. Some of these features are network-  
operator specific.  
For the inter-connection of audio, the wireless modem offers both single ended and  
balanced analogue input and output lines. Direct interface to the digital PCM (pulse  
code modulation) bus used within the wireless modem is available, thus by-passing  
the internal analogue circuitry. The wireless modems support HR, FR, EFR and AMR  
vocoders.  
2.3.4 Data  
The wireless modem supports the following data protocols:  
GPRS (General Packet Radio Service)  
The wireless modem is a Class B terminal. The wireless modem is GPRS multi-slot  
class10 (4+2) enabled, capable of receiving at a maximum of four timeslots per  
frame (down link), and transmitting in two timeslots per frame (up link). See  
section 2.3.5 for multi-slot allocation by class.  
CSD (Circuit Switched Data)  
The GR64 wireless modem is capable of establishing a CSD communication at 9.6  
kbps over the air.  
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2.3.5GPRS Multi-Slot Support  
GSM Multi-slot classes supported by Gx64 devices  
Maximum slot allocation  
Downlink Uplink Active  
Multislot  
Class  
Allowable  
Configuration  
Max data rate  
8-12Kbps Send  
32-48Kbps Receive  
8-12Kbps Send  
32-48Kbps Receive  
16-24Kbps Send  
24-36Kbps Receive  
8
4
1
5
1 up; 4 down  
1 up; 4 down  
2 up; 3 down  
10  
4
2
5
2.3.6 SIM Card  
The GR64 supports an external SIM card through its system connector. A variant of  
the GR64 also supports an on-card SIM. For dual SIM support, automated SIM-  
switching is available. Both 3V and 1.8V SIM technology is supported. Older, 5V SIM  
technology is not supported.  
A mechanical variant of the GS64 also supports an on-card SIM. For dual SIM  
support, automated SIM-switching is available. Only one SIM is active at any one  
time, it is not possible to concurrently register on more than one network.  
2.3.7 Power Consumption  
Sleep Mode  
DRX 8  
Transmit  
Operation  
Feature  
Idle Mode  
17 mA  
Voice/CSD  
Data (GPRS)  
Voice/CSD  
GSM850 & E-GSM900  
1.6 mA  
1.6 mA  
2000 mA  
1450 mA  
GSM1800 & GSM1900  
16 mA  
Data (GPRS)  
The power consumption figures shown represent typical average current for  
maximum transmitted power, single uplink (transmit) slot, and single downlink  
(receive) slot. The module will consume more average power in different multi-slot  
configurations, the worst case being that of two uplink and three downlink slots.  
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2.3.8 Other Features  
The GR64 supports many other features, including:  
3GPP TS 27.010 multiplexing  
GPS interoperability  
SIM application tool kit, class 2 release 99 compliant  
On board TCP/IP stack  
In addition, customers have the option of a GS64 software variant which adds  
embedded application functionality.  
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2.4 Service and Support  
2.4.1 Web Pages  
Visit the Sony Ericsson M2M extranet web site for the following information:  
Where to buy wireless modems or for recommendations concerning accessories  
and components  
Local contact details for customer support in your region  
FAQs (frequently asked questions)  
Access to the Sony Ericsson extranet site requires a user account and password.  
Accounts can be arranged through your local account manager.  
The extranet web site address is:  
2.4.2 AT Commands Manual  
The AT Commands Manual provides users with all the AT commands that can be  
used with the wireless modem. AT commands appear in logical groups and contain  
the command, a description of its functionality and an example of use.  
2.4.3 M2mpower Application Guide  
The M2mpower Application Guide provides users with all the information they need  
to build an application using the M2mpower support environment. This manual is  
supplied as part of the M2mpower package.  
2.4.4 Developer’s Kit  
Sony Ericsson provides the developer’s kit to get you started quickly. The kit  
includes the following hardware which is required to begin the development of an  
application:  
This Integrator’s Manual  
Developer’s kit hardware  
Developer’s kit accessories  
Power supply  
RS232 cable  
Headset  
Antenna  
Make sure to order the M2M module(s) that are applicable to the needs of your  
organization. Also, ensure that you have computer or micro-controller. The AT  
command manual provides the necessary command and control reference to drive  
the module.  
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2.5 Precautions  
The wireless modems are ESD protected up to ±15kV on all 2.8V IO pins. All other  
pins are protected up to ±2kV. Integrators must follow electronic device handling  
precautions when working with any electronic device system to ensure no damage  
occurs to the host or the wireless modem. In the section ‘Integrating the Wireless  
modem’, users will find more information about safety and product care. Do not  
exceed the environmental and electrical limits as specified in ‘Technical Data’  
section.  
2.6 Guidelines for Safe and Efficient Use  
Users must follow the general usage outlined in this chapter before using the GR64  
for any purpose.  
2.6.1 General Usage  
Always treat the product with care and keep it in a clean and dust-free place.  
Do not expose the product to liquid.  
Avoid exposing the product to moisture or high humidity environments.  
Do not expose the product to extreme high or low temperatures beyond  
those specified for operation and storage.  
Do not expose the product to open flames or lit tobacco products.  
Do not drop, throw or try to bend the product.  
Do not paint the product.  
Do not use the product near medical equipment without requesting  
permission.  
Do not use the product when in, or around aircraft, or areas posted “turn off  
two-way radio”.  
Do not use the product in an area where a potentially explosive atmosphere  
exists.  
Do not place the product or install wireless equipment in the area above a  
vehicle’s air bag.  
Do not attempt to disassemble the product; only Sony Ericsson authorized  
personnel should perform servicing.  
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2.6.2 Radio Frequency (RF) exposure and SAR  
Your wireless modem device is a low-power radio transmitter and receiver  
(transceiver). When it is turned on, it emits low levels of radio frequency energy (also  
known as radio waves or radio frequency fields).  
Governments around the world have adopted comprehensive international safety  
guidelines, developed by scientific organizations, e.g. ICNIRP (International  
Commission on Non-Ionizing Radiation Protection) and IEEE (The Institute of  
Electrical and Electronics Engineers Inc.), through periodic and thorough evaluation  
of scientific studies. These guidelines establish permitted levels of radio wave  
exposure for the general population. The levels include a safety margin designed to  
assure the safety of all persons, regardless of age and health, and to account for any  
variations in measurements.  
Specific Absorption Rate (SAR) is the unit of measurement for the amount of radio  
frequency energy absorbed by the body when using a transceiver. The SAR value is  
determined at the highest certified power level in laboratory conditions, but the  
actual SAR level of the transceiver while operating can be well below this value. This  
is because the transceiver is designed to use the minimum power required to reach  
the network.  
The GR64 wireless modem device has been approved for applications where the  
antenna is located >20cm from the body. In all other configurations the integrator is  
responsible for meeting the local SAR regulations.  
Integrators of the GR64 wireless modem device are responsible for ensuring that they  
meet the SAR regulatory requirements of the countries in which they intend to  
operate the device, and that their documentation contains the relevant SAR  
declaration, certification information, and user guidance as appropriate.  
More information on radio frequency exposure and SAR can be found at  
2.6.3 Personal Medical Devices  
Wireless modem devices may affect the operation of cardiac pacemakers, hearing  
aids and certain other implanted equipment. If a minimum distance of 15 cm (6  
inches) is maintained between the GR64 module’s radiating antenna and a  
pacemaker, the risk of interference is limited. If the integrator’s application is likely  
to be situated in the vicinity of personnel, a suitable warning should be contained in  
the equipment manual to this effect.  
2.6.4 Disposal of Old Electronic Equipment  
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This symbol on the product or on its packaging indicates that this product shall not  
be treated as household waste. Instead it shall be handed over to an appropriate  
collection point for the recycling of electrical and electronic equipment. By ensuring  
this product is disposed of correctly, you will help prevent potential negative  
consequences for the environment and human health, which could otherwise be  
caused by inappropriate waste handling of this product. The recycling of materials  
will help to conserve natural resources. For more detailed information about  
recycling of this product, please contact your local city office, your household waste  
disposal service or the Sony Ericsson regional sales office.  
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3 Abbreviations  
Abbreviation  
AMR  
ATMS  
AFMS  
CBM  
CBS  
Explanation  
Adaptive Multi Rate  
Audio to Mobile Station  
Audio from Mobile Station  
Cell Broadcast Message  
Cell Broadcast Service  
CSD  
DCE  
DK  
Circuit Switched Data  
Data Circuit Terminating Equipment  
Developer’s Kit  
DTE  
DTMF  
EA  
Data Terminal Equipment  
Dual Tone Multi Frequency  
Embedded Application  
Enhanced Full Rate  
EFR  
EMC  
ETSI  
FR  
Electro-Magnetic Compatibility  
European Telecommunication Standards Institute  
Full Rate  
GPRS  
GPS  
GSM  
HR  
General Packet Radio Service  
Global Positioning System  
Global System for Mobile Communication  
Half Rate  
IDE  
IP  
Integrated Development Environment  
Internet Protocol  
International Telecommunication Union – Telecommunications  
(Standardization Sector)  
ITU-T  
LDO  
M2mpower  
ME  
Low-Dropout  
Sony Ericsson’s powerful support environment  
Mobile Equipment  
MMCX  
MO  
Micro Miniature Coax  
Mobile Originated  
MS  
Mobile Station  
MT  
Mobile Terminated  
Pulse Code Modulation  
Protocol Data Unit  
PCM  
PDU  
RF  
Radio Frequency  
RFU  
RLP  
RTC  
Reserved for Future Use  
Radio Link Protocol  
Real Time Clock  
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Abbreviation  
SDP  
Explanation  
Service Discovery Protocol  
Subscriber Identity Module  
Short Message Service  
Transport Control Protocol  
User Datagram Protocol  
SIM  
SMS  
TCP  
UDP  
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Integrating the Wireless  
Modem  
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4 Mechanical Description  
4.1 Interface Description  
The pictures below show the mechanical design of the wireless modem along with  
the positions of the different connectors and mounting holes. The wireless modem is  
protected with tin coated steel ASI 1008/1010 covers that meet the environmental  
and EMC requirements.  
wireless modem  
shielded circuits  
system connector  
Figure 4.1-1 Wireless modem viewed from below  
mounting hole &  
antenna connector  
ground connection  
integrated SIM holder  
Figure 4.1-2 Wireless modem, viewed from above (Integrated SIM holder variant)  
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Please note the following:  
Mounting holes positioned at the corners make it possible to securely bolt the  
wireless modem into your application.  
Keypad, display, microphone, speaker and battery are not part of the wireless  
modem.  
For the GR64 variant without an integrated SIM holder, the SIM card is mounted in  
the user application, external to the wireless modem (this is also an option for the  
integrated SIM holder variant).  
The GS64 variant without an integrated SIM holder has no components mounted  
on the top-side.  
The System Connector is a 60-pin, standard 0.05 in (1.27 mm) pitch type. The  
pins and their electrical characteristics are described in Section 5, together with  
the System Connector Interface.  
Information about the Antenna Connector is found in Section 6.  
Antenna Connector details are found in Section 6.  
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4.2 Physical Dimensions  
Figure 4.2-1 Dimensions of the Wireless modem (Integrated SIM variant)  
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Figure 4.2-2 Dimensions of the Wireless modem (Legacy variant)  
Measurements are given in millimeters. See also Technical Data, in Section 10.  
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5 System Connector Interface  
5.1 Overview  
Electrical connections to the wireless modem (except the antenna), are made through  
the System Connector Interface. The system connector is a 60-pin, standard 0.05 in  
(1.27 mm) pitch device.  
The system connector allows both board-to-board and board-to-cable connections  
to be made. Use a board-board connector to connect the wireless modem directly to  
a PCB, and a board-cable connector to connect the radio device via a cable. Surface  
mount mating connectors for the 60-pin system connector are available from Harwin  
(part number M50-3113022).  
Figure 5.1-1 below shows the numbering of the connector pins.  
A ground connection is provided at the mounting hole next to the RF connector on  
the wireless modem as shown below. Connect this ground point to the DGND pins of  
the wireless modem by the shortest, low-impedance path possible. The purpose of  
this connection is to allow any antenna ESD strikes to bypass the wireless modem’s  
internal ground path.  
ground connection  
pin 59  
pin 60  
pin 1  
pin 2  
Figure 5.1-1 Wireless modem, viewed from underneath  
The following table gives the pin assignments for the system connector interface and  
a short description for each signal.  
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Table 5.1-1 Pin Assignments  
PIN  
Connection  
Pin  
Name  
Direction Function  
Required  
1
2
3
4
5
6
7
8
9
VCC  
GND  
VCC  
GND  
VCC  
GND  
VCC  
GND  
VCC  
GND  
CHG_IN  
GND  
Input  
-
Input  
-
Input  
-
Input  
-
Input  
-
Input  
-
DC power  
Ground  
DC power  
Ground  
DC power  
Ground  
DC power  
Ground  
DC power  
Ground  
Battery charger power  
Ground  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
10  
11  
12  
Yes  
ADIN4  
GPIO5  
ON/OFF  
SIMVCC  
SIMDET  
SIMRST  
SIMDAT  
SIMCLK  
DAC  
GPIO1  
GPIO2  
GPIO3  
GPIO4  
VRTC  
ADIN1  
ADIN2  
ADIN3  
SDA  
Input  
In/Out  
Input  
Output  
Input  
Output  
In/Out  
Output  
Output  
In/Out  
In/Out  
In/Out  
In/Out  
Input  
Input  
Input  
Input  
In/Out  
Output  
Output  
Output  
In/Out  
Output  
In/Out  
In (Out)  
ADC Input 4  
13  
General purpose IO  
Device on/off control  
1.8V or 3.0V SIM card supply  
SIM presence detection  
SIM card reset signal  
SIM card data  
SIM card clock signal  
Pulse width modulated signal  
General purpose IO  
General purpose IO  
General purpose IO  
General purpose IO  
DC supply for real time clock  
ADC Input 1  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
Yes  
1
Yes  
1
Yes  
Yes  
Yes  
1
1
1
Yes  
ADC Input 2  
ADC Input 3  
2
I C data  
2
SCL  
I C clock signal  
BUZZER  
DSR1  
GPIO7  
LED  
GPIO6  
VREF  
Buzzer Output  
2
Data Set Ready (UART1)  
General purpose IO  
LED control signal  
General purpose IO  
Core voltage reference  
Yes  
32  
33  
34  
Yes  
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PIN  
Connection  
Pin  
Name  
Direction Function  
Required  
35  
36  
TX_ON  
RI  
GPIO8  
DTR1  
GPIO10  
DCD1  
GPIO11  
RTS1  
GPIO9  
CTS1  
GPIO12  
DTM1  
DFM1  
DTM3  
DFM3  
USBDP  
USBDN  
SSPDTM  
SSPDFM  
VUSB  
ALARM  
SSPFS  
SSPCLK  
MICIP  
MICIN  
EARP  
Output  
Output  
In/Out  
Input  
In/Out  
Output  
In/Out  
Input  
In/Out  
Output  
In/Out  
Input  
Output  
Input  
Output  
In/Out  
In/Out  
Input  
Output  
Input  
Output  
In/Out  
In/Out  
Input  
Transmit indication  
Ring Indicator  
General purpose IO  
Data Terminal Ready (UART1)  
General purpose IO  
Data Carrier Detect (UART1)  
General purpose IO  
Ready To Send (UART1)  
General purpose IO  
Clear To Send (UART1)  
General purpose IO  
Data To Module from host (UART1)  
Data From Module to host (UART1)  
Data To Module from host (UART3)  
Data From Module to host (UART3)  
USB data positive  
2
Yes  
37  
38  
39  
40  
2
Yes  
2
Yes  
3
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
Yes  
3
Yes  
4
Yes  
Yes  
4
USB data negative  
Serial PCM data to module from host  
Serial PCM data from module to host  
USB DC power  
RTC alarm  
Serial PCM frame synchronization  
Serial PCM clock  
Microphone input positive  
Microphone input negative  
Earpiece output positive  
Earpiece output negative  
Auxiliary audio from module to host  
Flash programming enable signal  
Auxiliary audio to module from host  
Analogue reference  
4
Yes  
Input  
Output  
Output  
Output  
Input  
Input  
-
EARN  
AUXO  
SERVICE  
AUXI  
AREF  
1
- These signals are required if the external SIM interface is used  
- These pin connections are required for sleep mode operation  
- At least one of these interfaces is required to be connected  
2
3, 4  
NOTE  
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5.2 Dealing with Unused pins  
Integrators applications may connect all of the GR64 signals pins, or just those  
necessary for minimal operation, or most commonly some other permutation. If  
GR64 signal pins are not connected to the host application you should terminate  
them in the following manner.  
Table 5.2-1 Unused Pin Termination  
Pin  
Name  
VCC  
Unused pin termination  
1, 3, 5, 7, 9  
2, 4, 6, 8, 10, 12 GND  
CHG_IN  
Must be connected  
Must be connected  
Leave Open  
11  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
ADIN4/GPIO5  
ON/OFF  
SIMVCC  
SIMDET  
SIMRST  
SIMDAT  
SIMCLK  
DAC  
GPIO1  
GPIO2  
GPIO3  
GPIO4  
VRTC  
ADIN1  
ADIN2  
ADIN3  
SDA  
SCL  
BUZZER  
DSR1/GPIO7  
LED/GPIO6  
VREF  
Ground  
Must be connected  
Leave Open  
Leave Open  
Leave Open  
Leave Open  
Leave Open  
Leave Open  
Connect to VREF  
Connect to VREF  
Connect to VREF  
Connect to VREF  
Leave Open  
Ground  
Ground  
Ground  
Leave Open  
Leave Open  
Leave Open  
Connect to VREF  
Connect to VREF  
Must be connected  
Leave Open  
Connect to VREF  
Connect to VREF  
Connect to VREF  
Connect to VREF  
Connect to VREF  
Connect to VREF  
Leave Open  
TX_ON  
RI/GPIO8  
DTR1/GPIO10  
DCD1/GPIO11  
RTS1/GPIO9  
CTS1/GPIO12  
DTM1  
DFM1  
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Pin  
Name  
Unused pin termination  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
DTM3  
DFM3  
USBDP  
USBDN  
SSPDTM  
SSPDFM  
VUSB  
ALARM  
SSPFS  
SSPCLK  
MICIP  
MICIN  
EARP  
EARN  
AUXO  
SERVICE  
AUXI  
Connect to VREF  
Leave Open  
Leave Open  
Leave Open  
Connect to VREF  
Leave Open  
Leave Open  
Leave Open  
Leave Open  
Leave Open  
Connect to AREF  
Connect to AREF  
Leave Open  
Leave Open  
Leave Open  
Ground  
Connect to AREF  
Leave Open  
AREF  
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5.3 General Electrical and Logical Characteristics  
The core digital IO is based upon 1.8V technology in the baseband chipset. All  
external IO signals undergo bi-directional level shifting on the physical module to  
provide flexibility to users of different voltage technology. An internal core IO  
regulator is used as a reference for the module-side logic, whilst the application  
(host-side) reference is fed by VREF in one of two implementations.  
In order to provide legacy users a migration path to GR64, the module IO is made  
compatible with 2.8V (or level-adapted 3.0V) controllers, popular in older technology  
applications.  
This arrangement is implemented in variant products DPY 102  
1494/10 & DPY 102 1494/30. In these products the 2.8V VREF is derived from an  
internal voltage regulator, distributed to the host-side level shifters and also output  
on the VREF signal pin.  
The arrangement differs in non-legacy variant GR64 products DPY 102 1494/20 &  
DPY 102 1494/40. In these products the internal voltage regulator is disconnected  
and the user application provides the VREF as a reference to the host-side level  
shifters.  
The range of VREF voltages is specified in sections 5.6.1 & 5.6.2.  
Many of the signals indicated in Table 5.1-1 are high-speed CMOS  
logic inputs or outputs powered by the 1.8V internal core regulators,  
and then subsequently level shifted at the system interface. All serial  
NOTE  
interfaces and general purpose IO fall in to this category.  
5.3.1 Level Shifter Interfaces  
Two different level shifter circuits are implemented in GR64. The ‘common’ interface  
2
is used on all level-shifted IO with the exception of the I C signals, SDA & SCL.  
5.3.1.1 Common Level Shifter Interface  
The common level shifter used within the GR64 is a Maxim MAX3001EEBP-T, which  
has a specified maximum data rate of 4Mbps. The level shifter has ESD protection to  
±15kV (HBM).  
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Figure 5.3-1 Common Level Shifter Circuit (VREF as an Output)  
The output impedance of the Maxim chip is 6kohm, so you must ensure that your  
application impedance to ground or supply is high enough to allow for full voltage  
swing. A minimum application impedance of 56kohm should be assumed. Similarly,  
where a GPIO is used as an input, your application driver output impedance must not  
exceed 680 ohm.  
The GR64 VREF can be configured as an output (to the host application) or an input  
(from the host application), as defined in section 5.6.  
Any GPIO that is used truly bi-directional cannot be open drain type on  
both sides. At least one side needs to be able to drive the signal both  
high and low.  
NOTE  
Table 5.3-1 Level shifter IO logic levels  
Parameter  
Min  
Nom  
Max  
Unit  
IO input voltage high threshold (VIHC)  
IO input voltage low threshold (VILC)  
IO output voltage high threshold (VOHC  
VREF-0.4  
V
V
V
V
0.4  
0.4  
)
VREF-0.4  
IO output voltage low threshold (VOLC  
)
The level shifter IO interfaces have typical input and output rise/fall times of 25ns.  
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5.3.1.2 I2C Level Shifter Interface  
2
Because of the nature of the I C interface signals, SDA (data) & SCL (clock), they  
utilize a different type of level-shifting technology to that of the ‘common’ IO. The  
2
I C level shifter IC uses an open drain construction with no direction pin, ideally  
2
suited to bi-directional low voltage (such as the GR64 1.8 V processor) I C port  
2
translation to the normal 3.3 V or 5.0 V I C-bus signal levels. Unlike the common  
2
level shifters, the I C level shifters have a very low (6.5ohm RDSON) resistance  
between input and output pins.  
2
The I C level shifters use VREF as the host-side voltage reference and the internal  
1.8V digital IO core as the module-side reference.  
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5.4 Grounds  
Pin  
Name  
Direction  
Function  
2
4
6
GND  
GND  
GND  
GND  
GND  
GND  
AREF  
-
-
-
-
-
-
-
Ground  
Ground  
Ground  
Ground  
8
10  
12  
60  
Ground  
Ground  
Analogue reference  
There are two ground connections in the wireless modem, AREF (analogue ground)  
and GND (digital ground). Pin assignments are shown in the table above.  
AREF and GND are connected at a single point inside the wireless  
modem, however they must not be joined together in the user  
application.  
NOTE  
5.4.1 Analogue Ground (AREF)  
AREF is the return signal, or analogue audio reference, for AUXI and AUXO. These  
two signals provide a single-ended auxiliary audio input (host to module) and output  
(module to host). AREF is connected to the common GND inside the wireless modem  
only. The application must not connect GND and AREF.  
Parameter  
Limit  
12.5  
Unit  
mA  
Maximum current (IMAX  
)
5.4.2 Common Ground (GND)  
GND is the reference, or return signal, for all system interface digital signals, radio  
section power, and is also the DC return for the power supply, VCC.  
To carry the high current drawn by the wireless modem, the user application circuitry  
should connect all GND pins together.  
Parameter  
Per Pin  
Total  
Unit  
Maximum current (IMAX  
Maximum average current (IAVG  
)
600  
100  
3600  
600  
mA  
mA  
)
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5.5 Regulated Power Supply Input (VCC)  
Pin  
Name  
Direction  
Function  
1
3
5
7
9
VCC  
VCC  
VCC  
VCC  
VCC  
Input  
Input  
Input  
Input  
Input  
DC power  
DC power  
DC power  
DC power  
DC power  
Power is supplied to the wireless modem VCC pins, from an external source.  
User application circuitry should connect all VCC pins together in to carry the current  
drawn by the wireless modem.  
The electrical characteristics for VCC are shown in the following table.  
Parameter  
Mode  
Limit  
VCC Supply voltage  
Nominal  
Min  
Max  
3.6 V  
3.2 V  
4.5 V  
Absolute maximum  
voltage range  
-0.3V to 6.5V  
<100mV @<200kHz  
<20mV @>200kHz  
200mV  
Maximum supply ripple  
Maximum allowable voltage drop Transmission burst  
2050 mA peak  
330mA average  
Full power (2W) transmit  
(single uplink slot)  
Maximum current consumed  
Stresses in excess of the absolute maximum limits can cause  
permanent damage to the device. These are absolute stress ratings  
only. Functional operation of the device is not implied at these or any  
other conditions in excess of those given in the operational sections of  
the data sheet. Exposure to absolute maximum ratings for extended  
periods can adversely affect device reliability.  
!
WARNING  
The wireless modem has insufficient internal capacitance to supply the  
large current peaks during GSM burst transmission - use the following  
general guidelines in designing the application power supply.  
Fit a low ESR electrolytic capacitor close to the wireless modem  
(>1,000 µF, with an ESR < 100 m)  
TIP  
Ensure power supply to wireless modem line resistance is < 200 mΩ  
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The module has approximately 40µF of internal capacitance across the  
VCC pins. During initial power-up the host power supply will have to  
charge this capacitance to the operating voltage. This initial in-rush  
current may exceed the module’s normal peak current, sometimes  
greater than an order of magnitude higher (depending upon the power  
supply design) for a short duration (generally a few microseconds).  
CAUTION  
5.6 Voltage Reference (VREF)  
Pin  
34  
Name  
VREF  
Direction  
Function  
Input (Output)  
Core voltage reference  
GR64 provides a voltage reference interface for user applications.  
Level shifters are integrated in the GR64 product. The integrated level shifters are  
referenced to an internal IO regulator on the module side and to an application  
voltage on the user side of the interface. There are two implementation of VREF,  
dependent upon the users’ GR64 variant;  
VREF as an output (DPY 102 1494/10 & DPY 102 1494/30 variants)  
VREF as an input (DPY 102 1494/20 & DPY 102 1494/40 variants)  
5.6.1 VREF as an Output  
The version of GR64 without an integrated SIM holder provides a 2.8V reference to  
the host side level shifter devices. This enables legacy users, and users of older  
interface technology to connect directly to the GR64’s IO. The same reference  
voltage is provided as an output on VREF. In this arrangement VREF can be used as a  
further level shifter reference in the users application circuits, or to power external  
circuits, since it has a 75mA current sourcing capability.  
VREF output  
Parameter  
Min  
Nom  
2.8  
Max  
Unit  
VREF output voltage  
VREF load current  
2.74  
2.86  
75  
V
mA  
5.6.2 VREF as an Input  
The version of GR64 with an integrated SIM holder provides a reference input to the  
host side level shifter devices. This enables users of varying technologies to connect  
directly to the GR64’s IO by providing a reference from their own application IO.  
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VREF Input  
Parameter  
Min  
1.8  
Typ  
0.1  
Max  
Unit  
VREF input voltage  
VREF load current  
5.2  
50  
V
µA  
Figure 5.6-1 Level shifter arrangement  
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5.7 Battery Charging Input (CHG_IN)  
Pin  
11  
Name  
Direction  
Input  
Function  
CHG_IN  
Battery charger power  
For battery powered applications, the GR64 provides a charge input (CHG_IN) pin to  
aid and support battery charging. A typical application would power the wireless  
modem directly from a battery source connected to VCC (pins 1, 3, 5, 7, 9) then  
provide a dc power source to the CHG_IN connection (pin 11). The GR64 can control  
an internal switching FET which creates a charging pathway to the battery. While  
power is provided at CHG_IN, the battery charge can be maintained. If the power  
should fail or be removed at CHG_IN, the application will be supported by the battery  
alone. When CHG_IN voltage returns, the battery charging and maintenance will  
commence once more.  
The GR64 module supports only one mode of charging, microprocessor supervised  
pulsed-charging. Also, the module only supports one battery cell type as standard.  
Users may, if they wish, develop charging algorithms and control through the Sony  
Ericsson M2mpower Embedded Applications. Users wishing to attempt charging of  
battery types not supported by the standard type, indicated in this document, do so  
at their own risk.  
Battery charging algorithms are unique to different battery types. Sony  
Ericsson Mobile Communications will not accept any responsibility or  
liability for damage, product failures, even death or injury occurring as  
DANGER  
a result of incompatible battery and charging algorithms being applied.  
Safety considerations must be taken into account when using the battery charge  
function of the GR64; for example, monitoring the temperature of the battery. If the  
temperature of the battery exceeds its specification limits, battery charging must be  
stopped immediately. If the battery temperature continues to rise the application  
should be suspended or the battery disconnected. Battery temperature can be  
monitored with a suitable detection circuit, using the GR64 ADC inputs.  
When charging Lithium batteries, the battery pack must have an  
internal protection circuit in accordance with the manufacturer's  
instructions.  
CAUTION  
During microprocessor supervised mode, the GR64 takes a current-limited voltage  
source at the CHG_IN pin to implement constant-current charging of a single Li-Ion  
cell connected to the VCC pins.  
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CHG_IN  
C1  
3.6V  
50mA  
CHARGE FET  
VCC  
D1  
+
-
MAX CURRENT  
DETECTION  
V
SINGLE  
REF1  
CELL Li-ION  
+
-
VOLTAGE  
SOURCE  
BATTERY  
TIMER  
CHARGER  
V
CONTROL  
REF2  
TO  
uPC  
SUI  
ADC  
ADIN1  
Figure 5.7-1 Typical application for pulse charging a battery  
5.7.1 Charging Process  
Figure 5.7-1 shows a typical battery charging implementation. The voltage source  
must be current limited (500 mA max). A reverse current protection diode prevents  
external fault conditions from draining the battery. A small (typ 10µF) capacitor  
should be placed close to the CHG_IN pin.  
In the application shown, a conditioning phase slowly raises the voltage of a deeply  
discharged battery cell to a level suitable for fast-charging. After cell conditioning is  
complete, the microprocessor uses the GR64’S ADC converter to monitor the cell’s  
status and uses the power management block to control the charge-FET.  
A charge request is initiated when an external voltage source is applied to the  
CHG_IN pin. However, before this request is passed to the microprocessor, CHG_IN is  
verified to be greater than VCC by 150 mV, and at least 3.7 V. If the latter criteria is  
not met, the module limits charging to the conditioning phase. If the former criteria  
is not met, the charge request is ignored and all charging is disabled. If the CHG_IN  
voltage exceeds the upper limit of 6.3 V it will be detected by the module, but  
charging is not inhibited. In this case, however, CHG_IN is outside the normal  
operating range of the device, so the software will not initiate charging if CHG_IN >  
6.3 V is detected.  
The delta between CHG_IN and VCC is continuously monitored; however, the valid to  
invalid detection has a delay of 46 ms. When CHG_IN exceeds VCC by 150 mV, it is  
considered to be at a valid relative level. It is considered to have an invalid relative  
level if it subsequently falls below VCC by 50 mV. If the relative voltage of CHG_IN  
goes invalid and remains invalid for the duration of the detection delay, charging is  
terminated.  
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As a safety precaution, the battery cell voltage must be at least 2.5 V before fast-  
charge is allowed to take place. If the battery cell voltage is less than 2.5 V, it is  
considered either deeply discharged or shorted. To protect a Li-ion cell from the  
damage that may occur if it is fast-charged from this state, a 3.6 V trickle-charge  
source is used to safely condition the battery cell. The conditioning charge current is  
limited to 50 mA, which for most Li-ion cells is 10% or less of the recommended CC  
fast-charge current. In most instances, the battery cell voltage will be greater than  
2.5 V at the time the charge request is initiated, resulting in the conditioning phase  
being skipped.  
There is always a small chance that the charge management block in  
the GR64 power management ASIC will malfunction or fail, which  
could lead to over-charging of the battery.  
It is strongly  
CAUTION  
recommended that any battery chosen for use with your application  
has its own additional integrated over-current and over-voltage  
protection.  
5.7.2 Series Diode  
When charging is disabled, the potential for rapid cell discharge through the body  
diode inherent in the Enhancement-mode charging FET, a Schottky diode must be  
placed in between the external source and the CHG_IN pin. The diode should have a  
forward current and power dissipation rating consistent with its intended use, and a  
maximum forward voltage drop of 0.6V.  
5.7.3 Battery Selection  
Whilst there are several rechargeable battery technologies commercially available,  
including Nickel Cadmium (NiCd), Nickel Metal Hydride (Ni-MH), Lithium-Polymer (Li-  
Polymer) and Lithium-Ion (Li-Ion), the only technology recommended and supported  
for use with the GS64 is Li-Ion. Li-Ion provides a good combination of high energy  
(3.7v) and long cycle life, which lead to low overall energy cost.  
The weight of lithium ion batteries is approximately one half compared with a nickel  
cadmium or nickel metal hydride battery of similar capacity. The volume of lithium  
ion batteries is 40 to 50% smaller than that of nickel cadmium, and 20 to 30% smaller  
than that of a nickel metal hydride.  
The lithium ion battery is free from the so-called memory effect, a phenomenon  
associated with nickel cadmium in which the apparent battery capacity decreases  
when shallow charge and discharge cycles are repeated.  
A single lithium ion cell has a voltage of 3.7V (mean value), which is equal to either  
three nickel cadmium or nickel-metal hydride cells connected in series. This voltage  
is close to the nominal VCC of the GR64 device.  
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Li-Ion batteries generally provide long storage life with few limiting condition, and  
offer problem-free charge after long storage. Under normal conditions, the lithium  
ion battery has a life of more than 500 charge/discharge cycles. Also, Li-Ion  
batteries have a slow self-discharge rate (typically 1.3% per month, compared with  
Ni-MH batteries which can exceed 50% per month).  
Lithium ion batteries are environmentally friendly, inasmuch as they do not contain  
any heavy metal pollution substances such as cadmium, lead, or mercury.  
There are many manufacturers of Li-Ion batteries worldwide. Sony Ericsson make no  
recommendations with regard to specific vendors, but here are some considerations  
for GR64 users which may prove to be useful in the selection process and  
implementation:  
Li-Ion batteries marketed for cellular (mobile) phone use may make a good  
choice  
battery manufacturers with heritage in supplying the cellular (mobile) phone  
industry could make a good choice, especially for high-volume requirements  
look carefully for batteries which are rated at temperatures that the GR64 is  
likely to operate at (many batteries are only specified for -20°C to +65°C  
operation which may not be sufficient)  
small form-factor (typically handset-sized) Li-Ion battery capacity varies  
considerably, some batteries are rated as high as 3200mAh (600mAh to  
1800mAH are more commonly available)  
weight is generally not a problem with typical GR64 user application, even so  
small form-factor Li-Ion batteries (up to 1800mAh) can vary between 10 to  
40 grams  
size is generally a factor of capacity, since larger capacity batteries naturally  
3
3
have more material/cells, and will range between 2750mm to 18000mm for  
small form-factor Li-Ion batteries  
the speed by which lithium-ion ages is governed by temperature and state-  
of-charge; high temperatures and deep discharge will effect useful life  
if possible avoid frequent full discharges because this puts additional strain  
on the battery, partial discharges with frequent recharges are better  
never short circuit the terminals of a Li-Ion battery  
do not expose Li-Ion batteries to moisture or rain  
monitor battery temperature during charging using a thermistor placed on or  
near the battery wired to an ADC input on the module  
Li-Ion batteries have a higher ESR (compared to Ni-Cd or Ni-MH), although  
this should not be a limiting factor for peak current delivery, any battery  
should be capable of at least 50% greater than the GR64 demands (~3A pk)  
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To determine battery life, on a full charge, the following rule of thumb can be  
applied:  
Standby time = Battery Capacity (mAh) / Idle current (mA)  
Call time (voice or data) = Battery Capacity (mAh) / Call current (mA)  
Example 1 – Standby time:  
A 600mAh rated Li-Ion battery, from fully charged (around 4.2V) to the module cut-  
off point (3.2V) will provide around 95% of its total charge capacity. For a standby  
(idle) current of 18mA, the module will typically provide  
600*0.95/18 = 32 hours standby time  
Example 2 – Call time:  
An 1800mAh rated Li-Ion battery fully charged, transmitting maximum power on a  
low-band (850/900MHz) channel may consume an average 320mA, therefore the  
module would typically provide  
1800*0.95/320 = 5 hours 20 mins call time  
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Example 3 – Typical Operation:  
A module performing periodic network data transfers and communicating intervallic  
status information to its host would spend its non-active periods in sleep mode. If  
the module spends 30 mins each day on call (320mA), 30 second each hour  
performing housekeeping, monitoring and status tasks (110mA), and sleeps (2.1mA)  
during the intervening periods, an 1800mAh rated Li-Ion battery fully charged would  
typically provide  
1800*0.95/([0.5hr*320]+[0.2hr*110]+[23.3hr*2.1]) = 7 days 6 hrs operation  
The above examples are given for guidance, the actual battery life will  
depend upon variables such as battery condition, number of previous  
charge/discharge cycles, operating temperature, series resistance  
CAUTION  
between battery and the module, and manufacturing tolerances  
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5.8 Powering the Module ON and OFF (ON/OFF)  
Pin  
14  
Name  
Direction  
Input  
Function  
ON/OFF  
Device on/off control  
5.8.1 Turning the Module On  
Figure 5.8-1 Power On timing  
The GR64 power ON sequence is shown above. The significant signals are VCC,  
ON/OFF and VREF, shown by solid lines. The other signals (in dashed lines) are  
internal to the module and are shown for reference purposes only.  
Initially, power is supplied to the VCC pins. The presence of power raises the  
ON/OFF through a pull-up resistor to VCC potential. In order to power the module,  
ON/OFF is pulled to ground. Once ON/OFF has been held low for 125ms (denoted by  
t1) the primary LDOs power up; the VREF signal comes from one of the primary LDOs.  
For module variants where VREF supplies a reference voltage to the host, it acts as a  
useful indicator that the baseband is powered.  
When the VREF is configured as an input, it cannot be used as a power  
indicator.  
NOTE  
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VREF exceeds it’s reset threshold approx 500µs later, then 250ms afterwards  
(denoted by t2) the RESET line goes high. The microprocessor can latch the power on  
state by setting the power keep (PWR_KEEP) high after the RESET goes high and  
before the power on (ON/OFF) signal is released.  
It is recommended that ON/OFF is held low for at least 450ms to guarantee  
completion of the power up sequence.  
5.8.2 Turning the Module Off  
VCC  
ON/OFF  
VREF  
reset threshold  
t3  
(RESET)  
(PWR_KEEP)  
power  
P_ON  
Power down  
removed  
pulled low  
sequence complete  
Figure 5.8-2 Power Down timing  
Powering the GR64 power down sequence is shown above. The significant signals  
are VCC, ON/OFF and VREF, shown by solid lines. The other signals (in dashed lines)  
are internal to the module and are shown for reference purposes only.  
With the module powered normally, ON/OFF is pulled-up to VCC potential. In order  
to power down the module, ON/OFF is pulled to ground. Once ON/OFF has been  
held low for at least 125ms the shut-down procedure begins. Although ON/OFF can  
be held low for longer, it will delay completion of the shut-down event. If the  
module is registered on a GSM network, the de-registration process will complete;  
this may last between 3 to 30 seconds. The power latch (PWR_KEEP) is released and  
approximately 70ms later the LDO outputs fall.  
For module variants where VREF is an output, the absence of VREF is a useful  
indicator that the network de-registration and shut-down is complete. Once VREF is  
no longer present, the application can safely remove VCC.  
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the RTC can continue to operate even though VCC is removed,  
provided that a sufficiently charged backup device is connected to the  
VRTC. Refer to section 5.18.1 for details.  
NOTE  
The relevant characteristics of the ON/OFF Power control interface are shown in the  
table below.  
Parameter  
Conditions  
Min  
Typ  
-25  
Max  
Unit  
Input low (0V), VCC = 3.6V  
Input high (VCC), VCC = 3.6V  
-60  
0
-12  
1
µA  
Input current  
µA  
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5.9 Analogue Audio  
Pin  
53  
54  
Name  
MICIP  
MICIN  
Direction  
Input  
Function  
Microphone input positive  
Microphone input negative  
Input  
55  
56  
57  
59  
60  
EARP  
EARN  
AUXO  
AUXI  
AREF  
Output  
Output  
Output  
Input  
-
Earpiece output positive  
Earpiece output negative  
Auxiliary audio from module to host  
Auxiliary audio to module from host  
Analogue reference  
The analogue audio signals comprise of two audio inputs to the module, and two  
audio output from the module. The Auxiliary interface signals are single-ended,  
whilst the MIC and EAR interface signals are differential. Analogue audio can be used  
for various configurations, including a car kit mode, portable hands free and  
speakerphone (with an additional output gain stage).  
Five audio profiles are available for GR64 users to configure various modes of  
operation. Each profile is factory set to represent different modes, typical of general  
usage. The customer can modify profiles to optimize acoustic performance to their  
specific application.  
The analogue inputs and outputs share common uplink and downlink chains which  
are multiplexed, and selectively switched by the user through AT-commands.  
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There five factory-set audio profiles as follows:  
Portable hands free  
Low-level is recommended.  
Handset  
Low-level is recommended.  
Car kit  
Low-level is recommended.  
Speakerphone  
High-level is recommended.  
Headset  
Low-level or High-level can be used with headset, depending on requirements.  
Portable hands free is the factory-set default profile. The modification, configuration,  
manipulation and storage of audio profiles is achieved with the AT*E2EAMS (Audio  
Profile Modification) and AT*E2APR (Audio Profile).  
5.9.1 Auxiliary Audio to Mobile Station (AUXI)  
AUXI is a single-ended auxiliary analogue audio input to the wireless modem.  
Internally, the signal is routed to the CODEC (COder/DECoder), where it is converted  
to digital audio and mapped to an internal bus.  
AUXI provides a DC bias when it is used as the microphone input in Portable Hands-  
free applications. All other sources must be AC-coupled to avoid attenuation of low  
frequencies, and to prevent incorrect biasing or damage to the AUXI input. Use a  
capacitor greater than the value shown in the table below.  
The AUXI input is a passive network followed by the transmit part of the CODEC.  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
max input gain  
min input gain  
-3dB cut-off  
142  
447  
300  
2.16  
1
158  
501  
178  
564  
mVrms  
mVrms  
Hz  
Input voltage full scale  
Frequency response  
Output dc bias level  
AC coupling capacitance  
3400  
2.64  
2.4  
V
µF  
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5.9.2 Auxiliary Audio from Mobile Station (AUXO)  
AUXO is a single-ended auxiliary analogue audio output from the wireless modem  
and may be used to drive a speaker or an earpiece. The interface has an internal  
100nF coupling capacitor; a load of 10kohm will provide a near full-scale output  
capability between 300 to 4300 Hz.  
The table below shows the audio signal levels for AUXO.  
Parameter  
Conditions  
Min  
Typ  
750  
Max  
840  
Unit  
Output voltage full scale RL =10kΩ  
Frequency response  
670  
225  
mVrms  
Hz  
-3dB cut-off (RL =10k)  
5.9.3 Microphone Signals (MICIP, MICIN)  
MICP and MICN are balanced differential microphone input pins. These inputs are  
compatible with an electret microphone. The microphone contains a FET buffer with  
an open drain output, which is supplied with at 2.4V ±10% relative to ground by the  
wireless modem as shown below.  
Figure 5.9-1 Microphone connections to the wireless modem  
The input low-noise amplifier stage is constructed out of standard low-noise op  
amps. External resistors set the gain of this stage.  
The input gain is scaled by the input resistors to be around 18, which provides  
optimal performance for many standard types of electret microphones. The module  
provides a microphone bias at 2.4V, and can supply at least 1mA of current.  
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Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
max input gain  
min input gain  
-3dB cut-off  
14  
45  
16  
50  
18  
56  
mVrms  
mVrms  
Hz  
Input voltage full scale  
Frequency response  
Output dc bias level  
300  
2.16  
3400  
2.64  
2.4  
V
5.9.4 Speaker Signals (EARP, EARN)  
EARP and EARN are the speaker output signals. These are differential-mode outputs.  
With a full-scale PCM input to the CODEC, 0 dB audio output gain setting, and a  
differential load RL = 30, the output voltage between EARP and EARN is 1.5 V rms.  
For load resistances less than 30, the full-scale output needs is limited using the  
modules internal programmable gain attenuator.  
The electrical characteristics are given in the table below.  
Parameter  
Conditions  
Min  
Typ  
1.5  
Max  
1.68  
Unit  
RL = 30Ω  
RL = 16 Ω  
RL = 8  
1.34  
1.41  
1.24  
Vrms  
Vrms  
Vrms  
Input voltage full scale  
Frequency response  
-3dB cut-off  
300  
3400  
Hz  
5.10PCM Digital Audio (SSP)  
Pin  
Name  
Direction  
Function  
48  
47  
51  
52  
SSPDFM  
SSPDTM  
SSPFS  
Output  
Input  
In/Out  
In/Out  
Serial PCM data from module to host  
Serial PCM data to module from host  
Serial PCM frame synchronization  
Serial PCM clock  
SSPCLK  
The SSP (Synchronous Serial Port) digital interface is configured to provide a PCM  
(digital) audio interface. This interface can be used to process PCM digital audio  
signals as an alternative to routing signals to the CODECs through the analogue  
uplink and downlink chains.  
5.10.1 PCM Data Format  
The PCM digital audio interface for GR64 is based upon the Texas Instruments SSI  
standard. The SSP is a versatile interface which can be programmed for different  
clock rates and data frame sizes between 4 to 16 bits.  
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PCMCLK (bit clock) and PCMSYNC (frame synchronization) are both generated by the  
DSP within the wireless modem. The DSP within the wireless modem in this instance  
is the master for all external PCM, so clocks and data from external devices must be  
synchronized to it.  
For standard GSM voice a 13-Bit PCM data word is embedded in a 16-bit word frame,  
as shown in Figure 5.10-1 below.  
sample LSB justified  
MSB  
D15  
LSB  
D0  
13-bit sample occupies these frame bits  
Figure 5.10-1 Typical 16-bit PCM Voice Sample Word Format  
Typical PCM data transfer is shown in the following figures.  
SSPCLK  
SSPFS  
SSPDTM  
Q
LSB  
LSB  
MSB  
MSB  
SSPDFM  
Q
Figure 5.10-2 PCM Frame format for a single transfer  
SSPCLK  
SSPFS  
LSB  
LSB  
LSB  
LSB  
MSB  
MSB  
MSB  
MSB  
SSPDTM  
SSPDFM  
Frame n-1  
Frame n  
Frame n+1  
Figure 5.10-3 PCM Frame format for a continuous transfer  
The PCM interface has a Slave mode, however the allocated DSP buffer size limits the  
maximum data rate available. A separate Application Note describing slave mode  
implementation can be obtained from Sony Ericsson through Customer Support.  
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5.11Serial Data Interfaces  
The serial channels consist of two UARTs and a USB port.  
communication links to the application or accessory units.  
These provide  
The serial channels can be used in differing configurations, depending upon the  
users requirements and application. However, the common configuration options are  
described:  
UART1 has full RS-232 functionality and is used for all on- and off –line  
communication (modem sleep & wake functional control is an integral component  
of this interface). Its intended use is that of the primary command (AT) interface.  
UART3 behaves as a general-purpose serial data link. It can be used for data  
logging and de-bugging purposes. A GPS device can be used with UART3 as part  
of an embedded application.  
The USB port provides a convenient general purpose peripheral (slave) port for use  
with host devices which have USB controllers.  
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5.11.1 UART1  
Pin  
Name  
Direction  
Function  
32  
36  
37  
38  
39  
40  
41  
42  
DSR1  
RI  
Output  
Output  
Input  
Output  
Input  
Output  
Input  
Output  
Data Set Ready (UART1)  
Ring Indicator  
Data Terminal Ready (UART1)  
Data Carrier Detect (UART1)  
Ready To Send (UART1)  
Clear To Send (UART1)  
Data To Module from host (UART1)  
Data From Module to host (UART1)  
DTR1  
DCD1  
RTS1  
CTS1  
DTM1  
DFM1  
UART1 is a full featured Universal Asynchronous Receiver Transmitter providing full-  
duplex asynchronous communication.  
UART1 has the following features:  
32 bytes of FIFO for both receive and transmit  
FIFO threshold interrupts  
1 start bit, 7 or 8 data bits, 1 optional parity bit, 1 or 2 stop bits  
Programmable baud rate  
Auto-configuration mode with auto-baud and auto-format operation  
Hardware flow control  
Software flow control.  
UART1 signals replicate a 9-pin RS232 (V.24) serial port. However, UART1 signal  
levels are not compliant with the RS232 (V.28) standard. Conversion between the  
wireless modem CMOS levels and RS232 levels can be achieved using a standard  
interface IC, such as the Maxim Integrated Products MAX3237. The relationship  
between the levels is shown in the following table:  
DTM, DFM  
RI,RTS,CTS,DSR,DTM,DCD  
RS232 level  
GR64 level  
1
0
OFF  
ON  
<-3V  
>+3V  
VREF-0.4V  
0.4V  
5.11.2 Serial Data Signals (DTM1, DFM1)  
The default baud rate of the UARTs is auto-baud. Baud rates of between 600 bauds  
to 460 kbauds are possible. The wireless modem also supports 3GPP TS 27.010  
multiplexing protocol, which starts when the appropriate command is sent.  
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5.11.2.1  
Serial Data From Wireless modem (DFM1)  
DFM1 is an output signal that the wireless modem uses to send data via UART1 to  
the host application.  
The electrical characteristics of this level-shifted signal are described in section  
5.3.1.  
5.11.2.2  
Serial Data To Wireless modem (DTM1)  
DTM1 is an input signal, used by the application to send data via UART1 to the  
wireless modem.  
The electrical characteristics of this level-shifted signal are described in section  
5.3.1.  
5.11.3 Control Signals (RTS1, CTS1, DTR1, DSR1, DCD1, RI)  
Depending upon the user application, some, all, or none of the control signals may  
be needed. Each of the control signals can alternatively be configured as a general  
purpose IO. When hardware flow control is not used in communications between the  
application and the wireless modem, some applications may require RTS and CTS to  
be connected to each other at the wireless modem. Users should familiarize  
themselves with the specific implementation of their UART.  
UART1 converted signals, together with GND, DTM1 and DFM1 form a 9-pin RS232  
data port.  
The electrical characteristics of these level-shifted signals are described in section  
5.3.1.  
5.11.3.1  
Hardware flow control RTS1 and CTS1  
RTS and CTS provide a hardware flow control mechanism.  
5.11.3.2  
Request to Send (RTS1)  
RTS is used to condition the DCE for data transmission. The default level is high by  
internal pull up. The application must pull RTS low to enable data transmission from  
the wireless modem. Similarly, the wireless modem asserts CTS low, indicating it is  
ready to receive data transmission from the host.  
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5.11.3.3  
Clear To Send (CTS1)  
CTS is asserted by the DCE to indicate that the host (DTE) may transmit data. When  
CTS is high, the host (DTE) is not permitted to transmit data. The table below shows  
the load characteristics for this signal.  
5.11.3.4  
Data Terminal Ready (DTR1)  
DTR indicates that the DTE is ready to receive data. It also acts as a hardware ‘hang-  
up’, terminating calls when switched high. The signal is active low. To define the  
exact behavior of DTR, use an AT&D command.  
5.11.3.5  
Data Set Ready (DSR1)  
DSR indicates that the DCE is ready to receive data. The signal is active low. To  
define the behavior, use an AT&S command.  
5.11.3.6  
Data Carrier Detect (DCD1)  
DCD indicates that the DCE is receiving a valid carrier (data signal) when low. To  
define the exact behavior of DCD use an AT&C command  
5.11.3.7  
Ring Indicator (RI)  
RI indicates that a ringing signal is being received by the DCE when low. To define  
the exact behavior of RI, use using the AT*E2SMSRI command, which includes the  
option of asserting the RI signal to flag an incoming SMS.  
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5.11.4 UART3 (DTM3, DFM3)  
Pin  
Name  
Direction  
Function  
43  
44  
DTM3  
DFM3  
Input  
Output  
Data To Module from host (UART3)  
Data From Module to host (UART3)  
UART 3 consists of a full duplex serial communication port with transmission and  
reception lines.  
Timing and electrical signals characteristics are the same as for UART1, DTM1 and  
DFM1, including the baud rate range and the capability to auto-baud.  
5.11.4.1  
Transmitted Data (DTM3)  
DTM3 is used by the application to send data to the wireless modem via UART3. It  
has the same electrical characteristics the equivalent signal in UART1.  
5.11.4.2  
Received Data (DFM3)  
DFM3 is used to send data to the application via UART3. It has the same electrical  
characteristics as the equivalent signal in UART1.  
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5.11.5 USB  
Pin  
Name  
Direction  
Function  
45  
46  
49  
USBDP  
USBDN  
VUSB  
In/Out  
In/Out  
Input  
USB data positive  
USB data negative  
USB DC power  
The USB interface is compliant with the USB2.0 standard for a full speed (12Mbps)  
endpoint device. Together with VUSB and GND it creates a standard USB 4-pin  
interface. VUSB (VBUS in the USB standard) is nominally 5.0V.  
USB is not available on legacy variant GR64 devices (DPY 102 1494/10  
& DPY 102 1494/30 products).  
On these products, the signal  
connections can be left un-terminated.  
NOTE  
The USB interface has the following features:  
Full-speed (12 Mbits/s) device operation  
16 unidirectional endpoints  
Each endpoint capable of supporting control, interrupt, isochronous and bulk  
transfer  
Programmable endpoint types and FIFO sizes and internal 1120-byte logical  
(2240-byte physical for dual-packet mode) shared FIFO storage allow a wide  
variety of configurations.  
Dual-packet mode of FIFOs reduces latency  
USB reset can be programmed to clear device address.  
Firmware ability to wake up and reset a suspended device  
8, 16, 32, and 64-byte FIFO sizes for non-isochronous transfers  
64, 256, 512, and 1024-byte FIFO sizes for isochronous transfers  
Firmware downloading  
Trace debug port for module diagnostics  
The USB interface supports 3GPP TS 27.010 multiplexing, and may be used as the  
primary AT-command interface.  
Internally, the USBDP line is pulled up by a 1.5K resistor, in accordance with the USB  
standard, to indicate that it’s a full-speed capable device to the USB controller.  
To implement successful applications using the GR64 USB interface, users should  
familiarize themselves with the USB specification.  
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5.11.6 SIM Card Interface  
Pin  
Name  
Direction  
Function  
15  
16  
17  
18  
19  
SIMVCC  
SIMDET  
SIMRST  
SIMDAT  
SIMCLK  
Output  
Input  
Output  
In/Out  
Output  
1.8V or 3.0V SIM card supply  
SIM presence detection  
SIM card reset signal  
SIM card data  
SIM card clock signal  
This interface allows the user to communicate with the smart (SIM) card in the user  
application. The GR64 offers alternative arrangements for accessing the SIM  
depending on which variant of the GR64 is used. Both variants provide this interface  
through the system connector, referred to as the external or remote SIM interface to  
distinguish it from the integrated SIM interface.  
The maximum distance between the SIM card holder and the wireless modem is  
70cm. SIM holders placed further than this distance may not meet the SIM interface  
performance specification.  
This SIM interface allows the use of 3 V and 1.8 V SIM cards (5V is unsupported). The  
wireless modem automatically detects the SIM type, switching the signal voltages  
accordingly.  
Min  
Typ  
Max  
Unit  
Signal Parameter  
SIM supply voltage  
Mode  
1.8V  
3.0V  
1.71  
2.75  
10  
1.8  
2.9  
1.89  
3.05  
50  
V
V
Short circuit current  
Quiescent Supply Current  
Output Capacitance  
Output Capacitor ESR  
mA  
µA  
µF  
V
V
V
V
V
V
V
V
V
V
V
V
SIMVCC  
SIMDAT  
3.0V  
20  
0.3  
0.01  
2
1.0  
0.7xSIMVCC  
0.7xSIMVCC  
1.8V  
3.0V  
High level input voltage (VIH)  
Low level input voltage (VIL)  
High level output voltage (VOH)  
Low level output voltage (VOL)  
High level output voltage (VOH)  
Low level output voltage (VOL)  
1.8V 0.2xSIMVCC  
3.0V 0.4  
1.8V 0.8xSIMVCC  
3.0V 0.8xSIMVCC  
1.8V  
0.4  
0.4  
3.0V  
1.8V 0.9xSIMVCC  
3.0V 0.9xSIMVCC  
1.8V  
SIMCLK  
SIMRST  
0.4  
0.4  
3.0V  
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5.11.7 SIM Detection (SIMDET)  
SIMDET is used to determine whether a SIM card has been inserted into or removed  
from the SIM card holder. You should normally wire it to the ‘card inserted switch’ of  
the SIM card holder, but different implementations are possible.  
When left open, an internal pull-up resistor maintains the signal high and means ‘SIM  
card missing’ to the wireless modem. When pulled low the radio device assumes a  
SIM card is inserted. SIMDET is a Digital IO signal input with characteristics defined in  
paragraph 5.3.1.  
In order to meet regulatory approval requirements, the SIMDET  
function must be implemented in the host application.  
NOTE  
5.12 Service/Programming  
Pin  
58  
Name  
Direction  
Input  
Function  
SERVICE  
Flash programming enable signal  
The SERVICE interface is flash programming enable input. The SERVICE pin is driven  
active high by the host application using either a logic control input or applying a dc  
voltage (common in legacy applications) to begin a flash download. This pin should  
be pulled low or grounded during normal use.  
The SERVICE signal drives an N-channel FET switch which has a resistive divider on  
the input.  
Figure 5.12-1 SERVICE Pin Interface  
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Signal  
Mode  
Value  
Minimum input voltage  
Maximum input voltage  
Maximum input voltage  
2.5  
12.0  
0.8  
V
V
V
Active High  
Inactive Low  
SERVICE  
There are two methods for updating the firmware in the GR64:  
Sony Ericsson Emma III and Updater. The Emma III system is a web  
based tool that accesses a Sony Ericsson server from which signed  
software can be downloaded. The Updater is a local application  
that downloads a signed image provided by SEMC.  
NOTE  
5.13Buzzer  
Pin  
31  
Name  
Direction  
Output  
Function  
BUZZER  
Buzzer Output  
Connecting the BUZZER signal to an inverting transistor-buffer followed by a  
piezoelectric transducer enables the wireless modem to play pre-programmed  
melodies or sounds.  
5.14 LED  
Pin  
33  
Name  
LED  
Direction  
Output  
Function  
LED control signal  
The LED interface is intended to operate a status LED, which can be programmed on  
and off, or for a particular blink sequence. The LED signal is derived from a standard  
GPIO and does not have sufficient drive capability to operate an LED directly, so it  
requires the user to implement some form of transistor circuit. A recommended  
implementation is shown below.  
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Figure 5.14-1 Recommended circuit for an LED  
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5.15 General Purpose IO  
Pin  
Name  
Default  
Alternate function  
21  
22  
23  
24  
13  
33  
32  
36  
39  
37  
38  
40  
GPIO1  
GPIO2  
GPIO3  
GPIO4  
GPIO5  
GPIO6  
GPIO7  
GPIO8  
GPIO9  
GPIO10  
GPIO11  
GPIO12  
GPIO1  
GPIO2  
GPIO3  
GPIO4  
ADIN4  
LED  
DSR1  
RI  
RTS1  
DTR1  
DCD1  
CTS1  
ADC Input 4  
LED control signal  
Data Set Ready (UART1)  
Ring Indicator  
Ready To Send (UART1)  
Data Terminal Ready (UART1)  
Data Carrier Detect (UART1)  
Clear To Send (UART1)  
All general purpose IO (GPIO) is programmable by the user. Some GPIO has alternate  
functionality already associated with it; this is indicated in the default column. GPIO  
which has alternate function is effectively multiplexed, so that the user chooses  
through AT commands the appropriate configuration for their application.  
GPIO is programmable for the following features:  
An input or output  
Level-sensitive or transition-sensitive  
Open drain or direct drive  
Polarity (inversion)  
Internal pull-up resistors  
If pins labeled in the table above are not being used for the indicated alternative  
function they may be used as general purpose inputs or outputs; they are not  
constrained to work in only one direction. All GPIO is level shifted on the GR64, and  
has the characteristics defined in paragraph 5.3.1.  
GPIO has a number of sharing (configuration) options. Sharing means that it is not  
feasible to operate all the alternative features concurrently, however, with care,  
dynamic switching from one feature to another is possible.  
Users should note that if flow control is required for UART1 then GPIOs 7 to 12  
inclusive cannot be configured for general purpose use.  
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Some GPIO is configured to provide a keyboard interface (details are covered in the  
next section).  
In the GR64, all IO undergoes level shifting to maintain backward compatibility with  
older interface technology. Users should not that GPIO that is used truly bi-  
directional cannot be open drain type on both sides. At least one side needs to be  
able to drive the signal both high and low.  
5.15.1Embedded Applications  
When a particular IO feature is required, the user sets the state of the relevant IO  
blocks by disabling one set before enabling others.  
The wireless modem checks the state of the IO when the user requests a new  
function. The new function is rejected if the current function is not released first.  
The states of GPIOn to GPIOm are retained for the next power up. For example,  
inputs remain as inputs and outputs remain as outputs. The voltage of a defined  
output pin will still drop to 0 Volts in the wireless modem power down state.  
5.15.2 LED/IO6 Capabilities  
The LED function pin can be used as a general purpose digital I/O when the flashing  
LED function is not required. However, this pin does not have an on-board pull-up  
resistor. It is required that an external pull-up or pull-down resistor be provided by  
the host circuitry when either not used or when used as a digital input.  
5.15.3 ADC4  
A further ADC input (in addition to the three dedicated pins) is created by  
multiplexing one of the GPIO signals (GPIO5).  
In order to use ADC4 as a GPIO interface you must insert a 1kohm series resistor  
between the host circuit and the module on this pin.  
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5.16 Digital to Analogue Converter – DAC  
Pin  
20  
Name  
DAC  
Direction  
Output  
Function  
Pulse width modulated signal  
The GPIOx has dual functionality. In addition of being a fully programmable GPIO it  
also has the capability of becoming a PWM output. This PWM can be used as a DAC  
by implementing an RC-filter followed by an optional buffer.  
Figure 5.16-1 Typical arrangement for adapting PWM for a DAC function  
5.17 Analogue to Digital Converters (ADIN1, ADIN2, ADIN3, ADIN4)  
Pin  
Name  
Direction  
Function  
26  
27  
28  
13  
ADIN1  
ADIN2  
ADIN3  
ADIN4  
Input  
Input  
Input  
Input  
ADC Input 1  
ADC Input 2  
ADC Input 3  
ADC Input 4/GPIO5  
ADC pins is converted and stored in a register inside the wireless modem. When the  
appropriate AT command is received by the wireless modem, the digital value stored  
in the register is read.  
The module has a single precision 10-bit ADC, shared by a number of functions  
within the module and also through the external interface connections (three  
dedicated, one shared). The ADC sharing arrangement is shown below.  
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Figure 5.17-1 ADC sharing arrangement  
ADC sampling frequency and sampling source selection can be set up and controlled  
with AT-commands by the user. ADC samples requires up to 5 clock (ADCLK) cycles  
to process. The ADC also performs some system-level sampling. These two factors  
limit the maximum practical sampling rate to around 20ksps.  
Min  
Typ  
10  
Max  
Unit  
Parameter  
Condition  
Resolution  
bit  
Hex  
lsb  
Coding: Unsigned Magnitude  
Differential Nonlinearity  
Integral Nonlinearity  
Full-scale Error  
000  
–1  
–10  
–3  
3FF  
1
10  
3
lsb  
%
Offset Error  
–14  
14  
lsb  
Conversion Gain*  
Conversion Intercept*  
Low-level Input Voltage  
High-level Input Voltage  
ADC Clock (ADCLK)  
ADC Conversion Time  
ADC Sample Delay  
421  
–9  
lsb/V  
lsb  
ADC output=000h  
ADC output=3FFh  
2.45  
260  
2.59  
390  
V
kHz  
ADCLK  
ADCLK  
325  
12  
5
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2
5.18 I C Serial Control Bus  
Pin  
Name  
Direction  
Function  
2
29  
30  
SDA  
SCL  
In/Out  
Output  
I C data  
2
I C clock  
2
The I C interface comprises two signals; data (SDA) and clock (SCL). Both SDA and  
SCL have pull-up resistors. Therefore, when the bus is free, both SDA and SCL are in  
a HIGH state.  
2
The GR64 implementation of I C supports only a single master mode, with the  
module being the master. The output stages of SDA and SCL must have an open-  
drain or open-collector to perform a wired-AND function. The wired-AND function  
2
provides the I C bus ability to perform clock synchronization on the SCL line. Due to  
the wired-AND function, the SCL line will be held LOW by the device with the longest  
LOW period. Therefore, the device with the shorter LOW period will be in a HIGH  
wait-state during this time.  
Clock synchronization can be used as a handshaking mechanism, to enable receivers  
2
to cope with fast data transfers. On a byte level, a slave (host application-side) I C  
device may be able receive a data transfer, but need time to store the byte received  
before it is ready to receive another byte. The slave/receiver will therefore hold the  
SCL line low, after sending the acknowledge bit following the byte received, thereby  
forcing the master into a wait state. Once the SCL is released by the slave/receiver,  
the wait state of the master will end. This feature of the I2C standard is known as  
clock-stretching and is supported by the GR64.  
The I2C interface supports Standard-mode (100kbps) and Fast-mode (400kbps). It  
also supports Normal (7-bit) addressing and Extended (10-bit) addressing.  
Fast-mode signal characteristics  
Min  
Typ  
Max  
400  
Unit  
Parameter  
SCL clock frequency  
0
1.3  
0.6  
0
kHz  
µs  
LOW period of the SCL clock  
HIGH period of the SCL clock  
Data hold time  
µs  
µs  
0.9  
Capacitive load for each bus line  
400  
pF  
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5.19 Burst Transmission (TX_ON)  
Pin  
35  
Name  
Direction  
Output  
Function  
TX_ON  
Transmit indication  
Burst transmission is the period during which the GSM transceiver is transmitting RF  
signals. TX_ON is an indicator that the module is transmitting.  
A typical application may use TX_ON to blank adjacent receiver circuitry as a means  
of protecting sensitive input stages. TX_ON is active HIGH.  
5.20 Real Time Clock  
The real-time clock (RTC) is driven by a 32.768 kHz clock from an internal crystal  
oscillator. The clock is divided by 32,768 to generate a clock with a 1 second period  
that increments a 29-bit seconds counter. In addition, it can generate interrupts at a  
programmed time. The following are the features of RTC:  
17-year time interval with 1 second resolution.  
Programmed time alarm interrupt  
Alarm output pin  
An RTC alarm can be set by loading an appropriate value into the seconds alarm  
register and enabling an interrupt via an AT-command.  
The RTC relies on an uninterrupted 1.5 V (nominal) power supply (VRTC), whether the  
module is powered off or on. The RTC alarm operates from the VRTC supply, and  
therefore utilize 1.5 V logic. Users have the responsibility to provide a backup  
battery to provide uninterrupted VRTC function when the module is powered down.  
RTC Accuracy  
Condition  
Max  
Unit  
Parameter  
RTC accuracy  
RTC accuracy  
Ambient (+25±2°C) operation  
Extreme temperatures  
Secs/month  
Secs/month  
52.6  
65.2  
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5.20.1Real Time Clock Backup Supply (VRTC)  
Pin  
25  
Name  
VRTC  
Direction  
Input  
Function  
DC supply for real time clock  
VRTC provides an input connection to the module which allows the user to power the  
real time clock (RTC) within the GR64 by way of a coin cell or charged capacitor.  
When the module is powered, an internal LDO regulator provides a 200µA source  
designed to supply the microprocessor’s RTC block. It is also intended to recondition  
a rechargeable coin cell that supplies the RTC module when the main battery is  
removed, or has insufficient energy. Because this LDO is always on, even when the  
module is powered down, it features very low quiescent current. It also offers  
reverse current protection, with low leakage, when the coin cell is powering the RTC  
block.  
The RTC LDO is primarily designed to charge manganese-silicon lithium batteries.  
Rechargeable coin cells with different chemical composition may also be charged,  
provided their charging requirements are consistent with the RTC LDO’s electrical  
characteristics. The VRTC output is nominally 1.5 V.  
VRTC LDO characteristics  
Min  
Typ  
1.5  
Max  
Unit  
Parameter  
Condition  
Output Voltage Tolerance  
Maximum Output Current  
Short-circuit Current Limit  
Output Resistance  
Line Regulation  
Off Reverse Leakage Current  
IOUT = 10 µA  
1.45  
200  
0.7  
1.55  
V
µA  
mA  
mV  
µA  
VRTC to GND  
IOUT = 10 µA  
IOUT = 10 µA  
1.6  
100  
2.9  
150  
5
75  
0.1  
1
In the backup condition the RTC block will function to as low as 1.1V on the VRTC  
pin. The RTC draws 10µA typically during powered backup (15µA max).  
Figure 5.20-1 shows the VRTC connectivity arrangement.  
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Figure 5.20-1 VRTC connection  
5.20.2RTC Alarm (ALARM)  
Pin  
50  
Name  
Direction  
Output  
Function  
ALARM  
RTC Alarm  
The Alarm output is logic output from the module which is supplied from the RTC  
circuitry block. This block is in turn supplied either from the main supply of the  
module or from a backup battery if the main supply is not available.  
5.20.2.1  
ALARM Output from the Module  
The ALARM time is set by the use of an AT-command. The output is normally at  
VRTC level and will go low for one second when the ALARM becomes active.  
Since the VRTC interface is operable down to 1.1V, transistor circuitry must be used  
on the host side. It is recommended that integrators use an FET to minimize current  
consumption. If a suitable FET, operating at the low voltage necessary, cannot be  
found then bi-polar must be used. The resistors shall be kept as high impedance as  
possible to minimize current consumption.  
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Figure 5.20-2 Typical host-side circuit for ALARM output  
VRTC is specified to work down to 1.1V across the environmental operating  
conditions of the GR64. Integrators may discover in controlled environments that the  
VRTC interface will function reliably as low as 0.8V, so best practice would be to  
design the circuitry to operate down to 0.7V.  
5.20.3 ALARM Utilization as a Wake-up  
The ALARM output can be used by the host application to wake up from standby or  
hibernation mode, but it can also be used to completely power up the host  
application. The example below shows how the ALARM output (marked Out on  
Figure 5.20-2, and In on Figure 5.20-3) triggers the enabling of the main power to  
the application. The application has a parallel hold transistor (V4), and a Start  
Button.  
Figure 5.20-3 Example of host wake-up circuit  
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6 Antenna Connector  
The wireless modem’s antenna connector allows transmission of the radio frequency  
(RF) signals from the wireless modem to an external customer supplied antenna. The  
connector is a micro-miniature coaxial MMCX through hole mounted socket.  
A number of suitable MMCX type, mating plugs are available from the following  
manufacturers:  
Amphenol  
Suhner  
IMS Connector Systems  
The nominal impedance of the antenna interface is 50 ohms.  
Feature  
GSM850  
824-894  
E-GSM900 GSM1800  
880-960 1710-1880 1850-1990  
30dBm (1W)  
GSM1900  
Frequency range (MHz)  
Maximum power  
33dBm (2W)  
33dBm (2W)  
50 ohms  
2.5:1 max  
30dBm (1W)  
Antenna Connector impedance  
Antenna VSWR  
To bypass the MMCX connector, a pair of PCB landing pads are  
available on the underside of the module. You can probe these pads or  
solder a coaxial cable directly to them. Sony Ericsson; however, cannot  
guarantee absolute performance when connecting to the antenna in  
this way due to the attenuation such a connection could potentially  
cause. When connecting in this way, proceed with care.  
NOTE  
5.20-4 RF Antenna Pad Dimensions  
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7 Hints for Integrating the Wireless Modem  
This chapter gives you advice and helpful hints on how to integrate the wireless  
modem into your application from a hardware perspective.  
Make sure you read and consider the information under the following headings  
before starting your integration work:  
Safety advice and precautions  
Installation of the wireless modem  
Antenna  
7.1 Safety Advice and Precautions  
7.1.1 General  
Always ensure that use of the wireless modem is permitted. The radio device may  
present a hazard if used in proximity to personal medical electronic devices. As a  
rule, the wireless modem must not be used in hospitals or onboard aircraft.  
You are responsible for observing your country’s safety standards, and where  
applicable the relevant wiring rules.  
Never use the wireless modem at a gas station, refueling point, blasting area or in  
any other environment where combustible vapors or explosives may be present.  
Operating the wireless modem close to other electronic devices, such as antennas,  
television sets, and radios may cause electromagnetic interference.  
Never try to dismantle the wireless modem yourself. There are no components inside  
the wireless modem that can be serviced by the user. If you attempt to dismantle the  
wireless modem, you may invalidate the warranty.  
To protect the power supply cables and meet the fire safety requirements, it is  
recommended that the electrical circuits are supplied with a power regulator. The  
power regulator should be placed as close to the terminals of the power supply as  
possible.  
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Do not connect any incompatible component or product to the module.  
Sony Ericsson does not warrant against defects, malfunction, non-  
conformities or deviation caused by the connection of incompatible  
components or products to the GR64.  
!
WARNING  
The connection/disconnection method for the development board is by means of the  
DC power jack. For this reason, the mains supply should be situated close to the  
development board and be easily accessible.  
7.2 SIM Card  
Before handling any SIM card, users should ensure that they are not charged with  
static electricity. Use proper precautions to avoid electrostatic discharges. The  
wireless modem must be switched off before the SIM card is installed or uninstalled.  
When the SIM card holder is opened, the SIM card connections lie exposed under the  
SIM card holder.  
CAUTION: Do not touch these connections! Failure to heed this advice may release an  
electrical discharge that could damage the wireless modem or the SIM card.  
When designing applications, the SIM card’s accessibility should be taken into  
account. Sony Ericsson recommends that users protect SIM card access by a PIN  
code. This will ensure that the SIM card cannot be used by an unauthorized person.  
7.3 Antenna  
If the antenna is to be mounted outside, consider the risk of lightning.  
Always follow the instructions provided by the antenna manufacturer.  
Never connect more than one wireless modem to a single antenna.  
The wireless modem can be damaged by radio frequency energy from the transmitter  
of another adjacent wireless transmitter.  
Like any mobile station, the antenna of the wireless modem emits radio frequency  
energy. To avoid EMI (electromagnetic interference), users must determine whether  
the application itself, or equipment in the application’s proximity, requires further  
protection against radio emission and the disturbances it might cause. Protection is  
secured either by shielding the surrounding electronics or by moving the antenna  
away from the electronics and the external signals cable.  
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The wireless modem and antenna may be damaged if either come into contact with  
ground potentials other than the one in the users application. Beware, ground  
potential are not always what they appear to be.  
In the final application, the antenna must be positioned more than 20 cm away from  
human bodies. When this rule cannot be applied, the application designer is  
responsible for providing the SAR measurement test report and declaration.  
Even if SAR measurements are not required, it is considered good practice to insert a  
warning in any manual produced, indicating it is a radio product and that care should  
be taken.  
7.4 Installation of the Wireless modem  
7.4.1 Where to Install the Wireless modem  
The following conditions need to be taken into consideration when designing your  
application as they might affect the wireless modem and its function:  
Environmental conditions  
Signal strength  
Connection of components to wireless modem  
Network and subscription  
7.4.1.1 Environmental Conditions  
The wireless modem must be installed so that the environmental conditions stated in  
the Technical Data chapter, such as temperature, humidity and vibration are  
satisfied. Additionally, the electrical specifications in the Technical Data section must  
not be exceeded.  
7.4.1.2 Signal Strength  
The wireless modem has to be placed in a way that ensures sufficient signal strength.  
To improve signal strength, the antenna can be moved to another position. Signal  
strength may depend on how close the wireless modem is to a radio base station.  
You must ensure that the location at which you intend to use the wireless modem, is  
within the network coverage area.  
Degradation in signal strength can be the result of a disturbance from another  
source, for example an electronic device in the immediate vicinity. More information  
about possible communication disturbances can be found in section 8.3.5, page 59.  
When an application is completed, you can verify signal strength by issuing the AT  
command AT+CSQ or AT*E2EMM. See the AT Commands Manual for further details.  
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Before installing the wireless modem, use an ordinary mobile  
telephone to check a possible location for it. In determining the  
location for the radio device and antenna, you should consider signal  
strength as well as cable length.  
TIP  
7.4.1.3 Connection of Components to Wireless modem  
The integrator is responsible for the final integrated system. Incorrectly designed or  
installed, external components may cause radiation limits to be exceeded. For  
instance, improperly made connections or improperly installed antennas can disturb  
the network and lead to malfunctions in the wireless modem or equipment.  
7.4.1.4 Network and Subscription  
Before the integrator’s application is used, the user must ensure that their chosen  
network provides the necessary telecommunication services. Integrators should  
contact their service provider to obtain the necessary information.  
Integrators intending to use SMS in the application should ensure this is included in  
their (voice) subscription.  
Similarly, integrators intending to use GPRS for data services should also ensure that  
this service is available on their network and in their account plan.  
Users should consider the choice of the supplementary services described in section  
2.3.2 Short Message Service, on page 14.  
7.4.2 How to Install the Wireless modem  
7.4.2.1 Power Supply  
Use a high-quality power supply cable with low resistance. This ensures that the  
voltages at the connector pins are within the allowed range, even during the  
maximum peak current. An electrolytic capacitor should be placed close to the power  
supply pins of the wireless modem to supply the peak currents during burst  
transmission. See 5.5 Regulated Power Supply Input (VCC), page 38.  
7.4.2.2 Grounds  
A ground connection is provided at the mounting hole next to the RF connector on  
the wireless modem (see Figure 5.1, page 19). Connect this ground point to the GND  
pins of the wireless modem by the shortest, low impedance path possible. The  
purpose of this connection is to allow any ESD picked up by the antenna to bypass  
the wireless modem’s internal ground path.  
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It is recommended that you use a cable with a maximum resistance of  
5 milliohm for the ground connection.  
AREFand GND are connected at a single point inside the wireless  
modem. They must not be joined together in your application.  
NOTE  
7.4.2.3 Audio  
Use a coupling capacitor in AUXI line if the application does not use the wireless  
modem’s bias voltage. See also Figure 5.9-1 Microphone connections to the wireless  
modem, page 52.  
7.4.2.4 Software Upgrade  
There are two ways of updating the firmware in the GR64. There is a web-based tool  
that can access a Sony Ericsson server from where SW can be downloaded. There also  
is an Updater, which is a local application that downloads an image provided by  
SEMC.  
7.5 Antenna  
7.5.1 General  
The antenna is the component in the users system that maintains the radio link  
between the network and the wireless modem. Since the antenna transmits and  
receives electromagnetic energy, its efficient function will depend on:  
Type of antenna (for example, circular or directional)  
Placement of the antenna  
Communication disturbances in the vicinity in which the antenna operates  
In the sections below, issues concerning antenna type, antenna placement, antenna  
cable, and possible communication disturbances are addressed.  
In any event, users should contact their local antenna manufacturer for additional  
information concerning antenna type, cables, connectors, antenna placement, and  
the surrounding area. Users should also determine whether the antenna needs to be  
grounded or not. Usually, a local antenna manufacturer should be able to design a  
special antenna suitable for the integrators application and environment.  
7.5.2 Antenna Type  
Users should ensure that they choose the right type of antenna for the wireless  
modem.  
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The antenna must be designed for the frequency bands deployed in the regions that  
the wireless modem is being used. For fixed locations this may be dual bands (for  
example E-GSM900/GSM1800 in Europe; GSM850/GSM1900 in North America). For  
applications which are mobile, users should consider whether three or all four GSM  
bands could be encountered.  
Other factors in choosing antenna are equally important:  
Impedance of the antenna and antenna cable must be 50 ohms at all frequencies  
being used  
Antenna output-power handling capability must be a minimum of 2 W  
Antenna VSWR value should be less than 3:1 to avoid damage to the radio device  
7.5.3 Antenna Placement  
The antenna should be placed away from electronic devices or other antennas. The  
recommended minimum distance between adjacent antennas, operating in a similar  
radio frequency band, is at least 50 cm.  
If signal strength is weak, it is useful to face a directional antenna at the closest radio  
base station. This can increase the strength of the signal received by the wireless  
modem.  
The wireless modem’s peak output power can reach 2 W. RF field strength varies  
with antenna type and distance. At 10 cm from the antenna the field strength may be  
up to 70 V/m and at 1m it will have reduced to 7 V/m.  
In general, CE-marked products for residential and commercial areas, and light  
industry can withstand a minimum of 3 V/m.  
7.5.4 The Antenna Cable  
Use 50 ohm impedance low-loss cable and high-quality 50 ohm impedance  
connectors (frequency range up to at least 2 GHz) to avoid RF losses. Ensure that the  
antenna cable is as short as possible.  
The effectiveness of the antenna, cable and connectors is determined by their  
quality. All connectors, adaptors and cables should be of the highest quality, lowest  
loss, lowest VSWR rating that is affordable to the user.  
Minimize the use of extension cables, connectors and adapters. Each additional  
cable, connector or adapter will result in additional loss of signal power.  
7.5.5 Possible Communication Disturbances  
Communication disturbances can adversely effect the quality of wireless links,  
including the following causes:  
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Noise can be caused by electronic devices and radio transmitters.  
Path-loss occurs as the strength of the received signal steadily decreases in  
proportion to the distance from the transmitter.  
Shadowing is a form of environmental attenuation of radio signals caused by hills,  
buildings, trees or even vehicles. This can be a particular problem inside  
buildings, especially if the walls are thick and reinforced.  
Multi-path fading is a sudden decrease or increase in the signal strength. This is  
the result of interference caused when direct and reflected signals reach the  
antenna simultaneously. Surfaces such as buildings, streets, vehicles, etc., can  
reflect signals.  
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8 Embedded Applications  
The wireless modem has the capability to store and run customer written code in the  
form of a script during the processor’s idle time, through the use of an on board  
interpreter.  
8.1 Features  
Main features of embedded applications are as follows:  
C-based scripting language (Sony Ericsson specific)  
Over the air upgrade of scripts (NOT GSM software)  
Library of intrinsic functions  
2 scripts can be stored in the memory at any time (but only 1 can be active)  
8.2 Implementation  
The wireless modem has up to 128k of space available for storage of two scripts in  
the scripting language and 100k of operating RAM. Structures included in this  
language are:  
If - then - else statements  
While loops  
For loops  
All hardware interfaces that are normally available to the wireless modem through  
the AT commands are available to the embedded application.  
Further drivers have been written such as M bus, keypad, SPI and I2C for use by the  
embedded application (EA) through the use of the I/O pins.  
8.2.1 Limitations  
Since the wireless modem is processing the script using its own memory, limitations  
are placed onto the scripts that are run.  
A direct comparison cannot be made to a fully compiled C program in terms of size,  
but a gauge of script size is that if each line were 128 characters long in the script  
then the script could be about 1600 lines long.  
Processing power is something that needs to be considered as the script is run as a  
low priority process within the software. However, controller mode stops GSM  
operation and provides all the processing power for the script to be run. See the  
M2mpower Application Guide for more details.  
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Code cannot be ported directly from an existing application and loaded directly onto  
the wireless modem. It must be re-written in the Sony Ericsson Mobile script  
language so that the wireless modem interpreter can function correctly.  
8.2.2 M2mpower IDE (Integrated Development Environment)  
The IDE is a Windows based package which allows the user to write, simulate, debug  
and download the application into a wireless modem with the embedded application  
(EA) software. The standard version is designed to run on Windows XP and 2000.  
The M2mpower Application Guide is available for implementing applications using  
the developer’s kit and the embedded application (EA) functionality.  
This is a required package to be able to implement an embedded application (EA).  
For further information please contact Sony Ericsson Mobile Communications  
customer support.  
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9 TCP/IP Stack  
An on board IP/TCP/UDP stack has been integrated into the software negating the  
need for the customer to implement one in their own code base.  
This is accessible by using an embedded application (see section 9) using intrinsic  
functions.  
9.1 Implementation  
The following types of commands allow various functions:  
Open/closing IP connections - Negotiates/closes an IP address with the web  
server.  
Send/Receive TCP packets - Performs all TCP operations to send and receive  
packets.  
Send/Receive UDP packets - Performs all UDP operations to send and receive  
packets.  
Resolve URL to an IP address - Similar to nslookup command in DOS When the  
unit is set up and controlled using the embedded applications.  
The embedded applications or an external application can generate data to be sent  
and pass it to the wireless modem for transmission.  
This effectively provides a transparent communication link from the application to an  
internet server over GPRS.  
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10 Technical Data  
10.1 Mechanical Specifications  
Refer to Figure 4.2-1 & Figure 4.2-2 for reference to mechanical features.  
Variant  
Mechanical Feature  
Value  
Length  
Width  
50 mm  
33 mm  
3.3 mm  
5.9 mm  
without SIM holder  
with SIM holder  
Thickness (see illustration below)  
Weight  
3.3  
Figure 10.1-1 Thickness of module variant without SIM holder  
5.9  
Figure 10.1-2 Thickness of module variant with SIM holder  
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10.2Power supply voltage, normal operation  
Parameter  
Mode  
Limit  
VCC Supply voltage  
Nominal  
Min  
Max  
3.6 V  
3.2 V  
4.5 V  
Absolute maximum  
voltage range  
-0.3V to 6.5V  
<100mV @<200kHz  
<20mV @>200kHz  
200mV  
Maximum supply ripple  
Maximum allowable voltage drop Transmission burst  
Maximum current consumed Full power (2W) transmit  
2250 mA (peak)  
2100 mA (avg)  
Stresses in excess of the absolute maximum limits can cause  
permanent damage to the device. These are absolute stress ratings  
only. Functional operation of the device is not implied at these or any  
other conditions in excess of those given in the normal Min & Max  
values stated. Exposure to absolute maximum ratings for extended  
periods can adversely affect device reliability.  
!
WARNING  
10.3 Radio specifications  
Feature  
GSM850  
824-894  
E-GSM900  
880-960  
GSM1800  
1710-1880 1850-1990  
GSM1900  
Frequency range (MHz)  
Maximum power  
Antenna impedance  
33dBm (2W) 33dBm (2W) 30dBm (1W) 30dBm (1W)  
50 ohms  
10.4 SIM card  
Parameter  
1.8V  
3.0V  
5.0V  
External SIM support  
Integrated SIM support (optional)  
Yes  
Yes  
Yes  
Yes  
No  
No  
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10.5Environmental Specification  
Test Case  
Test Summary  
Ref Standard  
Temp: max storage  
Humidity: nominal  
Duration: 16 hours  
Heat Test  
IEC 60068-2-2  
Temp: min storage  
Duration: 16 hours  
Cold Test  
IEC 60068-2-1  
IEC 60068-2-14  
Temp (low) : min storage  
Temp (high) : max storage  
2 hrs dwell at each extreme  
6 hrs transition between temps  
Duration: 5 cycles x 16 hours  
(80 hrs total)  
Temperature Cycling  
Temp (low) : min storage  
Temp (high) : max storage  
6 min dwell at each extreme  
0.5 to 3 min transition  
Thermal Shock Test  
IEC 60068-2-14  
IEC 60068-2-30  
Duration: 30 cycles (Group 2,3)  
Temp (low) : nominal ambient  
Temp (high) : max operating  
Humidity (high) : 95% ±5% RH  
Humidity (low) : 93% ±5% RH  
9 hr dwell at each temperature  
3 hr transition between temps  
Duration: 6 cycles x 24 hours  
(144 hrs total)  
Moist Heat Cyclic Test  
SIM insertion : 500 cycles  
System connector : 10,000 cycles  
Flips/Hinges : 1,000 cycles  
RF connector : 5,000  
Operational Durability  
Free Fall Test  
1/52 41-FEA 202 8370  
IEC 60068-2-32 Test Ed  
1m drop height on to concrete  
- all sides  
- all faces  
- all corners  
- any extended features  
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Test Case  
Test Summary  
Ref Standard  
Freq: 10-60 Hz, constant  
displacement ±0.35mm  
Freq : 60-500 Hz, constant  
acceleration 5 g  
Sweep velocity: 1 oct/min  
Sweeps: 5 per axis  
Sinusoidal Vibration  
IEC 60068-2-6  
Axis: 3 axis (x, y, z) per device  
Power Spectral Density:  
2
3
3
3
3
3
5 Hz  
0.10 m /s  
2
12 Hz 2.20 m /s  
2
20 Hz 2.20 m /s  
Random Vibration  
IEC 60068-2-34  
2
200 Hz 0.04 m /s  
2
500 Hz 0.04 m /s  
Duration : 2 hrs each axis  
Axis : 3 axis (x, y, z) per device  
Pulse shape: Half-sine  
Amplitude: 30 g±15%  
Duration:  
Axis:  
No. shocks: 3 each direction  
(18 total)  
6 ms  
±x, ±y, ±z  
IEC 60068-2-27  
Test Ea  
Mechanical Shock Test  
Mechanical force :  
50 N in ±x, -y, ±z directions  
100 N in +y (mating axis)  
Mixed Plug-in  
Connector  
1/152 41-FEA 202 8370  
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11 Regulatory Notices  
The GR64 described in this manual conforms to the Radio and Telecommunications  
Terminal Equipment (R&TTE) directive 99/5/EC with requirements covering EMC directive  
89/336/EEC and Low Voltage directive 73/23/EEC. The product fulfils the requirements  
according to 3GPP TS 51.010-1, EN 301 489-7 and EN60950.  
This device complies with Part 15 of the FCC rules. Operation is subject to the following two  
conditions:  
(1) This device may not cause harmful interference, and  
(2) The device must accept any interference received, including interference that may  
cause undesired operation.  
FCC ID PYB7BC051021  
IC: 4170B-BC051021  
This product has not yet received GCF or FCC approval  
Append Declaration  
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Developers Kit  
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12 Introduction to the Universal Developer’s Kit  
The Sony Ericsson M2M universal developer’s kit (UDK) is designed to get you started  
quickly. It contains all the hardware you will need to begin the development of an  
application.  
The only items you need to provide are; a wireless modem, a computer, a SIM card  
with a network subscription, and a knowledge of programming with AT commands.  
The main hardware of the UDK is an open board onto which you plug the wireless  
modem, using an adaptor board where necessary. Connectors, switches, jumpers  
and SIM card holder are provided to allow you to configure and access all the  
functions of the radio device.  
Two version of the UDK exists; the first-generation UDK is designed for legacy M2M  
products available during 2003 to 2005; a second-generation Universal Developers  
Kit Mk 2 is available for M2M products from 2006 onwards. Components, adaptor  
boards and peripheral interfaces are not inter-changeable between the two UDK  
products.  
A separate user manual describes the set-up and use of the UDK. This can be  
downloaded from the Sony Ericsson M2M Extranet web pages or obtained from your  
local sales support representative upon request.  
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