Philips Network Card TDA8001 User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA8001  
Smart card interface  
1996 Dec 12  
Product specification  
Supersedes data of 1995 Feb 01  
File under Integrated Circuits, IC02  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
QUICK REFERENCE DATA  
SYMBOL  
VDD  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
6.7  
TYP.  
MAX.  
18  
UNIT  
V
IDD  
supply current  
idle mode; VDD = 12 V  
active modes; unloaded  
4.5  
6
32  
45  
5.0  
4.72  
6.5  
5.25  
mA  
mA  
V
Vth2  
Vth4  
VCC  
threshold voltage on VSUP  
threshold voltage on VDD  
card supply voltage  
V
including static and dynamic  
loads on 100 nF capacitor  
4.75  
V
ICC  
card supply current  
operating  
detection  
limitation  
150  
100  
200  
30  
mA  
mA  
mA  
V
VH  
high voltage supply for  
VPP  
VPP  
card programming  
including static and dynamic  
P 2.5%  
P + 2.5% V  
voltage (only at TDA8001 loads on 100 nF capacitor  
and TDA8001T)  
(P = 5, 12.5, 15 and 21 V)  
IPP  
SR  
programming current  
(read or write mode)  
operating  
detection  
limitation  
75  
50  
100  
mA  
mA  
mA  
slew rate on VCC and VPP maximum load capacitor 150 nF −  
(rise and fall)  
0.38  
V/µs  
tde  
deactivation cycle duration  
clock frequency  
75  
100  
125  
8
µs  
MHz  
W
fclk  
Ptot  
0
continuous total power  
dissipation  
TDA8001; Tamb = +70 °C;  
see Fig.10  
0.92  
TDA8001T; Tamb = +70 °C;  
see Fig.11  
2
W
Tamb  
operating ambient  
temperature  
0
+70  
°C  
1996 Dec 12  
3
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
BLOCK DIAGRAM  
V
V
GND1  
12  
DELAY  
16  
SUP  
15  
DD  
13  
17  
18  
ALARM  
ALARM  
22  
VOLTAGE  
SUPERVISOR  
MAIN  
SUPPLY  
CVNC  
28  
26  
3
4
I/O(µC)  
I/O  
PROTECTIONS  
AND  
ENABLE  
RSTIN  
RST  
TDA8001  
9
8
PRES  
PRES  
LOGIC  
19  
2
OFF  
INTERNAL  
CLOCK  
PROTECTIONS  
DETECT  
14  
5
V
20  
27  
CC  
CMDVCC  
CMD7  
V
CC  
GENERATOR  
25  
23  
GND2  
CMD3.5  
CLOCK  
CIRCUITRY  
CLOCK  
ENABLE  
CLK  
24  
CLKOUT2  
6
VPP12.5  
V
10  
PP  
7
V
PP  
GENERATOR  
VPP15  
VPP21  
21  
OSCILLATOR  
1
11  
MBH813  
XTAL  
V
H
Fig.1 Block diagram.  
1996 Dec 12  
4
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
PINNING  
PIN  
SYMBOL  
DESCRIPTION  
TDA8001  
TDA8001A  
TDA8001T TDA8001AT  
XTAL  
DETECT  
I/O  
1
2
1
2
crystal connection  
card extraction open collector output (active LOW)  
data line to/from the card  
3
3
RST  
4
4
card reset output  
CLK  
5
5
clock output to the card  
VPP12.5  
n.c.  
6
6
control input for applying the 12.5 V programming voltage (active LOW)  
not connected  
VPP15  
n.c.  
7
7
control input for applying the 15 V programming voltage (active LOW)  
not connected  
PRES  
PRES  
VPP  
8
8
card presence contact input (active LOW)  
card presence contact input (active HIGH)  
card programming voltage output  
9
9
10  
n.c.  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
not connected  
VH  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
HIGH voltage supply for VPP generation  
ground 1  
GND1  
VDD  
positive supply voltage  
VCC  
card supply output voltage  
VSUP  
voltage supervisor input  
DELAY  
ALARM  
ALARM  
OFF  
external capacitor connection for delayed reset timing  
open-collector reset output for the microcontroller (active HIGH)  
open-collector reset output for the microcontroller (active LOW)  
open-collector interrupt output to the microcontroller (active LOW)  
control input for applying supply voltage to the card (active LOW)  
control input for applying the 21 V programming voltage (active LOW)  
not connected  
CMDVCC  
VPP21  
n.c.  
21  
22  
CVNC  
22  
internally generated 5 V reference, present when VDD is on; to be  
decoupled externally (100 nF)  
CMD3.5  
or CDMTC  
23  
24  
23  
24  
control input for having the crystal frequency divided-by-4 at pin CLK  
CLKOUT2  
clock output to the microcontroller, or any other R4590  
(crystal frequency divided by two)  
GND2  
RSTIN  
25  
26  
27  
25  
26  
27  
ground 2  
card reset input from the microcontroller (active HIGH)  
control input for having the crystal frequency divided by 2 at pin CLK  
CMD7  
or CDMS  
I/O(µC)  
28  
28  
data line to/from the microcontroller  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
handbook, halfpage  
handbook, halfpage  
XTAL  
DETECT  
I/O  
1
2
28 I/O(µC)  
XTAL  
1
2
28 I/O(µC)  
27  
26  
DETECT  
I/O  
27  
26  
CMD7 or CDMS  
RSTIN  
CMD7 or CDMS  
RSTIN  
3
3
4
25 GND2  
4
25 GND2  
RST  
RST  
CLK  
5
24  
23  
5
24  
23  
CLK  
CLKOUT2  
CLKOUT2  
VPP12.5  
n.c.  
6
6
CMD3.5 or CDMTC  
CMD3.5 or CDMTC  
7
22 CVNC  
7
22 CVNC  
VPP15  
PRES  
PRES  
n.c.  
PRES  
PRES  
n.c.  
TDA8001  
TDA8001T  
TDA8001A  
TDA8001AT  
8
21  
20  
19  
18  
8
21  
20  
19  
18  
VPP21  
CMDVCC  
OFF  
n.c.  
9
9
CMDVCC  
OFF  
V
10  
11  
10  
11  
PP  
V
H
V
H
ALARM  
ALARM  
GND1 12  
17 ALARM  
16 DELAY  
GND1 12  
17 ALARM  
16 DELAY  
V
V
V
V
13  
14  
13  
14  
DD  
CC  
DD  
CC  
V
V
SUP  
15  
15  
SUP  
MBH811  
MBH812  
Fig.2 Pin configuration.  
Fig.3 Pin configuration.  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
CMD3.5 and internal ENRST are sampled in order to give  
the first clock pulse the correct width, and to avoid false  
pulses during frequency change.  
FUNCTIONAL DESCRIPTION  
Power supply  
The circuit operates within a supply voltage range of  
6.7 to 18 V. VDD and GND are the supply pins. All card  
contacts remain inactive during power up or down.  
The CLKOUT2 pins may be used to clock a  
microcontroller or an other TDA8001. The signal 12 fxtal is  
available when the circuit is powered up.  
POWER UP  
State diagram  
The logic part is powered first and is in the reset condition  
until VDD reaches Vth1. The sequencer is blocked until VDD  
Once activated, the circuit has six possible modes of  
operation:  
reaches Vth4 + Vhys4  
.
Idle  
Activation  
Read  
POWER DOWN  
When VDD falls below Vth4, an automatic deactivation of  
the contacts is performed.  
Write  
Deactivation  
Fault.  
Voltage supervisor  
This block surveys the 5 V supply of the microcontroller  
(VSUP) in order to deliver a defined reset pulse and to avoid  
any transients on card contacts during power up or down  
of VSUP. The voltage supervisor remains active even if VDD  
is powered-down.  
Figure 6 shows the way these modes are accessible.  
IDLE MODE  
After reset, the circuit enters the IDLE state. A minimum  
number of circuits are active while waiting for the  
microcontroller to start a session.  
POWER ON  
All card contacts are inactive  
As long as VSUP is below Vth2 + Vhys2 the capacitor CDEL  
,
connected to pin DELAY, will be discharged. When VSUP  
rises to the threshold level, CDEL will be recharged.  
ALARM and ALARM remain active, and the sequencer is  
I/O(µC) is high impedance  
Voltage generators are stopped  
Oscillator or XTAL input is running, delivering CLKOUT2  
Voltage supervisors are active.  
blocked until the voltage on the DELAY line reaches Vth3  
.
POWER DOWN (see Fig.4)  
The DETECT line is HIGH if a card is present (PRES and  
PRES active) and LOW if a card is not present. The OFF  
line is HIGH if no hardware problem is detected.  
If VSUP falls below Vth2, CDEL will be discharged, ALARM  
and ALARM become active, and an automatic deactivation  
of the contacts is performed.  
ACTIVATION SEQUENCE  
Clock circuitry (see Fig.5)  
From the IDLE mode, the circuit enters the ACTIVATION  
mode when the microcontroller sets the CMDVCC line  
(active LOW). The I/O(µC) signal must not be LOW.  
The internal circuitry is activated, the internal clock starts  
and the sequence according to ISO7816 is performed:  
The clock signal (CLK) can be applied to the card in two  
different methods:  
1. Generation by a crystal oscillator: the crystal, or the  
ceramic resonator (4 to 16 MHz) is connected to the  
XTAL pin.  
VCC rises from 0 to 5 V  
2. Use of a signal frequency (up to 20 MHz), already  
present in the system and connected to the XTAL pin  
via a 10 nF capacitor (see Fig.14). In both cases the  
frequency is first divided-by-two.  
VPP rises from 0 to 5 V and I/O is enabled  
CLK and RST are enabled.  
The time interval between steps 1 and 2 is 16 µs, and  
64 µs between steps 2 and 3 (see Fig.7).  
If CMD7 (respectively CMD3.5) is LOW, the clock signal  
(its frequency again divided by two) is enabled and  
buffered before being fed to the CLK pin.  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
The circuit returns to the IDLE mode on the next rising  
edge of the clock.  
READ MODE  
When the activation sequence is completed and, after the  
card has replied its Answer-to-Reset, the TDA8001 will be  
in the READ mode. Data is exchanged between the card  
and the microcontroller via the I/O line.  
PROTECTIONS  
Main fault conditions are monitored by the circuit:  
Short-circuit or overcurrent on VCC  
Short-circuit or overcurrent on VPP  
Card extraction during transaction  
Overheating problem  
WRITE MODE  
Cards with EPROM memory need a programming voltage  
(VPP). When it is required to write to the internal memory  
of the card, the microcontroller sets one of the VPP12.5,  
VPP15 and VPP21 lines LOW, according to the  
VSUP drop-out  
programming value given in the Answer-to-Reset.  
VPP rises from 5 V to the selected value with a typical slew  
rate of 0.38 V/µs. In order to respect the ISO 7816 slopes,  
the circuit generates VPP by charging and discharging an  
internal capacitor. The voltage on this capacitor is then  
amplified by a power stage gain of 5, powered via an  
external supply pin VH (30 V max).  
VDD drop-out.  
When one of these fault conditions is detected, the circuit  
pulls the interrupt line OFF to its active LOW state and  
returns to the FAULT mode. The current on I/O is internally  
limited to 5 mA.  
FAULT MODE (see Fig.9)  
DEACTIVATION SEQUENCE (see Fig.8)  
When a fault condition is written to the microcontroller via  
the OFF line, the circuit initiates a deactivation sequence.  
After the deactivation sequence has been completed, the  
OFF line is reset to its HIGH state after the microcontroller  
has reset the CMDVCC line HIGH.  
When the session is completed, the microcontroller sets  
the CMDVCC line to its HIGH state. The circuit then  
executes an automatic deactivation sequence by counting  
the sequencer back:  
RST falls to LOW and CLK is stopped  
I/O(µC) becomes high impedance and VPP falls to 0 V  
VCC falls to 0 V.  
V
V
+ V  
hys2  
th2  
th2  
V
SUP  
V
th3  
V
DELAY  
t
d
ALARM  
MGG818  
Fig.4 Alarm and delay as a function of VSUP (CDEL fixes the pulse width).  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
ENCLK  
QH  
S
S
CDMS  
QI  
S
S
QE  
CDMTC  
QD  
D
Q
Q
QB  
CK  
QA  
QG  
QF  
D
Q
Q
QC  
CLK  
D
Q
Q
QAA  
CK  
QCA  
CK  
XTAL  
CMD7 or CDMS = Z Z 1 1 0 0  
CMD3.5 or CDMTC = 1 0 1 0 1 0  
CLK = 2 4 0 4 2 4  
QBA  
1/2 CLKOUT  
QB  
QC  
QD  
ENCLK  
QF  
CLK  
MGG827  
Fig.5 Clock circuitry.  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
ACTIVATION  
IDLE  
PDOWN  
FAULT  
WRITE  
READ  
DEACTIVATION  
MGG820  
Fig.6 State diagram.  
0
1
2
3
OFF  
PRES  
DETECT  
CMDVCC  
VEILLE  
(INTERNAL)  
INTERNAL  
CLOCK  
V
CC  
I/O  
V
PP  
CMD3.5  
CLK  
ENRST  
(INTERNAL)  
RSTIN  
RST  
MGG828  
t
2
t
act  
Fig.7 Activation sequence.  
1996 Dec 12  
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Product specification  
Smart card interface  
TDA8001  
3
2
1
0
CMDVCC  
VEILLE  
(INTERNAL)  
INTERNAL  
CLOCK  
V
CC  
I/O  
V
PP  
CMD3.5  
CLK  
ENRST  
(INTERNAL)  
RSTIN  
RST  
MGG829  
t
de  
Fig.8 Deactivation sequence.  
3
2
1
0
PRES  
DETECT  
CMDVCC  
VEILLE  
(INTERNAL)  
INTERNAL  
CLOCK  
V
CC  
I/O  
V
PP  
CMD3.5  
CLK  
ENRST  
(INTERNAL)  
RSTIN  
RST  
MGG830  
t
de  
Fig.9 Deactivation after a card extraction during write mode.  
11  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VDD  
PARAMETER  
CONDITIONS  
MIN.  
MAX. UNIT  
supply voltage  
0.3  
0
18  
V
V
Vx1  
voltage on pins VPP21, VPP15, VPP12.5, PRES,  
PRES, CMDVCC, OFF, ALARM, DETECT and RSTIN  
VDD  
VH  
voltage on pin VH  
0
0
0
0
0
30  
V
V
V
V
V
VPP  
VSUP  
Vx2  
Vx3  
voltage on pin VPP  
VH  
voltage on pin VSUP  
12  
voltage on pins ALARM and DELAY  
VSUP  
6.0  
voltage on pins XTAL, I/O(µC), CLKOUT2, CMD7,  
CMD3.5 and CVNC  
Vx4  
Ptot  
voltage on pins I/O, RST, CLK and VCC  
continuous total power dissipation  
duration < 1 ms  
TDA8001;  
0
7.0  
2
V
W
T
amb = +70 °C; note 1;  
see Fig.10  
TDA8001T;  
0.92  
W
Tamb = +70 °C; note 1;  
see Fig.11  
Tstg  
Ves  
storage temperature  
55  
6  
+150  
+6  
°C  
kV  
electrostatic voltage on pins I/O, VCC, VPP, RST, CLK,  
PRES and PRES  
electrostatic voltage on other pins  
2  
+2  
kV  
Note  
1. Ptot = VDD × (IDD(unloaded) + Isignals) + ICC × (VDD VCC) + max.{(VH VPP) × IPP(read) + (VH VPP) × IPP(write)  
}
+ VH ×IH(unloaded) + VSUP × ISUP + (VDD CVNC) × ICVNC, where ‘signals’ means all signal pins, except supply pins.  
1996 Dec 12  
12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
MBE256  
MBE255  
4
3
handbook, halfpage  
handbook, halfpage  
P
tot  
P
tot  
(W)  
(W)  
3
2
2
1
0
1
0
50  
0
50  
100  
150  
( C)  
50  
0
50  
100  
150  
( C)  
o
o
T
T
amb  
amb  
Fig.10 Power derating curve (DIP28).  
Fig.11 Power derating curve (SO28).  
HANDLING  
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.  
Method 3015 (HBM 1500 , 100 pF) 3 pulses positive and 3 pulse negative on each pin referenced to ground.  
THERMAL CHARACTERISTICS  
SYMBOL  
Rth j-a  
PARAMETER  
VALUE  
UNIT  
thermal resistance from junction to ambient in free air  
SOT117-1  
SOT136-1  
30  
70  
K/W  
K/W  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
CHARACTERISTICS  
VDD = 12 V; VH = 25 V; VSUP = 5 V; Tamb = 25 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Supply  
VDD  
supply voltage  
6.7  
20  
22  
35  
18  
38  
42  
55  
V
IDD  
supply current  
idle mode; VDD = 8 V  
idle mode; VDD = 18 V  
active mode; unloaded  
30  
34  
45  
3.0  
mA  
mA  
mA  
V
Vth1  
threshold voltage for power-on  
reset  
4.0  
Vth4  
threshold voltage on VDD (falling)  
hysteresis on Vth4  
6.0  
50  
6.5  
V
Vhys4  
200  
mV  
Voltage supervisor  
VSUP  
ISUP  
Vth2  
voltage supply for the supervisor  
4.5  
10  
5.0  
1.8  
V
input current at VSUP  
2.4  
4.72  
80  
mA  
V
threshold voltage on VSUP (falling)  
hysteresis on Vth2  
Vhys2  
Vth3  
mV  
V
threshold voltage on DELAY  
output current at DELAY  
2.35  
5  
6
2.65  
2  
IDEL  
pin grounded (charge)  
µA  
mA  
V
VDEL = 4 V (discharge)  
VDEL  
voltage on pin DELAY  
3.5  
ALARM, ALARM (open-collector outputs)  
IOH  
VOL  
IOL  
HIGH level output current on  
pin ALARM  
VOH = 5 V  
IOL = 2 mA  
VOL = 0 V  
IOH =2 mA  
25  
0.4  
25  
µA  
V
LOW level output voltage on  
pin ALARM  
LOW level output current on  
pin ALARM  
µA  
V
VOH  
HIGH level output voltage on  
pin ALARM  
VSUP 1  
td  
delay between VSUP and ALARM CDEL = 47 nF; see Fig.4  
ALARM pulse width CDEL = 47 nF  
15  
10  
50  
µs  
ms  
tpulse  
Interrupt lines OFF and DETECT (open-collector)  
IOH  
HIGH level output current  
LOW level output voltage  
VOH = 5 V  
IOL = 1 mA  
25  
µA  
V
VOL  
0.4  
Logic inputs (CMDVCC, VPP21, VPP15, VPP12.5, CMD7, CMD3.5, PRES, PRES and RSTIN); note 1  
VIL  
VIH  
IIL  
LOW level input voltage  
HIGH level input voltage  
LOW level input current  
1.5  
0.8  
10  
V
V
VIL = 0 V  
µA  
1996 Dec 12  
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Product specification  
Smart card interface  
TDA8001  
SYMBOL  
IIH  
Reset output to the card (RST)  
PARAMETER  
CONDITIONS  
VIH = 5 V  
MIN.  
TYP.  
MAX.  
UNIT  
HIGH level input current  
10  
µA  
VIDLE  
VOL  
output voltage in IDLE  
LOW level output voltage  
HIGH level output voltage  
0.4  
0.45  
VCC  
VCC  
2
V
IOL = 200 µA  
IOH =200 µA  
IOH =10 µA  
RST enabled; see Fig.7  
V
VOH  
4.3  
V
VCC 0.7  
V
tRST  
delay between RSTIN and RST  
µs  
Clock output to the card (CLK)  
VIDLE  
VOL  
output voltage in IDLE  
LOW level output voltage  
HIGH level output voltage  
0.4  
0.4  
VCC  
VCC  
VCC  
14  
V
IOL = 200 µA  
IOH =200 µA  
IOH =20 µA  
V
VOH  
2.4  
V
0.7VCC  
V
IOH =10 µA  
VCC 0.7  
45  
V
tr  
tf  
δ
rise time  
fall time  
CL = 30 pF; note 2  
CL = 30 pF; note 2  
CL = 30 pF; note 2  
ns  
ns  
%
14  
duty factor  
55  
Card programming voltage (VPP  
)
VPP  
output voltage  
idle mode  
0.4  
V
V
V
V
read mode  
write mode; IPP < 50 mA P 2.5%(3)  
IPP/t < 40 mA/100 ns;  
note 4  
VCC 4%  
VCC + 4%  
P + 2.5%(3)  
P + 2.5%(3)  
P 2.5%(3)  
IPP  
SR  
output current  
slew rate  
active; from 0 to P (3)  
VPP shorted to GND  
up or down  
50  
100  
0.5  
mA  
mA  
0.3  
0.4  
V/µs  
High voltage input (VH)  
VH  
IH  
input voltage  
4
30  
6
V
input current at VH  
idle mode; active mode;  
unloaded  
mA  
P = 5 V  
5
9
mA  
mA  
mA  
mA  
V
P = 12.5 V  
P = 15 V  
P = 21 V  
6.5  
7
10.5  
11  
8
12  
2.2  
VHVPP  
voltage drop  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Card supply voltage (VCC  
)
VCC  
output voltage  
idle mode; active mode  
ICC < 100 mA  
4.75  
0.4  
V
V
V
5.25  
5.25  
IPP/t < 100 mA/100 ns; 4.75  
note 4  
ICC  
SR  
output current  
slew rate  
VCC from 0 to 5 V  
VCC shorted to GND  
up or down  
100  
200  
0.5  
mA  
mA  
0.3  
0.4  
V/µs  
5 V reference output voltage (CVNC)  
VCVNC  
ICVNC  
output voltage at pin CVNC  
output current at pin CVNC  
4.5  
5.0  
5.5  
V
50  
mA  
Crystal connection (XTAL)  
Rxtal(neg)  
negative resistance at pin XTAL  
2 MHz < fi < 16 MHz;  
note 5  
300  
Vxtal  
fxtal  
DC voltage at pin XTAL  
resonant frequency  
external frequency  
3.0  
4
4.0  
16  
20  
V
MHz  
MHz  
0
Clock output (CLKOUT2)  
fCLKOUT2 frequency on CLKOUT2  
VOL  
1
8
MHz  
V
LOW level output voltage  
HIGH level output voltage  
IOL = 2 mA  
IOH =200 µA  
IOH =10 µA  
CL = 15 pF; note 2  
CL = 15 pF; note 2  
0.4  
25  
60  
VOH  
3.0  
4.0  
V
V
tr, tf  
rise and fall times  
duty factor  
ns  
%
δ
40  
Data line [I/O, I/O(µC)]  
VOH  
HIGH level output voltage on  
pin I/O  
4.5 V < VSUP < 5.5 V;  
4.5 V < VI/O(µC) < 5.5 V;  
IOH =20 µA  
4.5 V < VSUP < 5.5 V;  
4.5 V < VI/O(µC) < 5.5 V;  
IOH = 200 µA  
4.0  
2.4  
VCC + 0.1  
V
V
VOL  
IIL  
LOW level output voltage on  
pin I/O  
II/O = 1 mA;  
I/O(µC) grounded  
I/O(µC) grounded  
100  
mV  
µA  
V
LOW level input current on  
pin I/O(µC)  
HIGH level output voltage on  
pin I/O(µC)  
LOW level output voltage on  
pin I/O(µC)  
LOW level input current on pin I/O I/O grounded  
500  
VSUP + 0.2  
70  
VOH  
VOL  
IIL  
4.5 V < VI/O < 5.5 V  
4.0  
II/O(µC) = 1 mA;  
I/O grounded  
mV  
µA  
500  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
0.4  
UNIT  
VIDLE  
voltage on pin I/O outside a  
session  
V
ZIDLE  
Rpu  
impedance on pin I/O(µC)  
10  
8
MΩ  
kΩ  
µs  
outside a session  
internal pull-up resistance  
between pin I/O and VCC  
10  
12  
0.5  
tr, tf  
rise and fall times  
Ci = Co =30 pF  
Protections  
Tsd  
shut-down local temperature  
shut-down current at VCC  
shut-down current at VPP  
current limitation on pin I/O  
3
135  
150  
75  
5
°C  
ICC(sd)  
mA  
mA  
mA  
IPP(sd)  
II/O(lim)  
from I/O to I/O(µC)  
Timing  
tact  
tde  
t3  
activation sequence duration  
deactivation sequence duration  
see Fig.7  
see Fig.8  
110  
100  
µs  
µs  
µs  
start of the window for sending  
CLK to the card  
70  
t5  
end of the window for sending  
CLK to the card  
80  
µs  
tst  
maximum pulse width on  
CMDVCC before VCC starts rising  
30  
µs  
Notes  
1. Pins CMDVCC, VPP21, VPP15, VPP12.5, CMD7, CMD3.5 and PRES are active LOW; pins RSTIN and PRES are  
active HIGH.  
t1  
2. The transition time and duty cycle definitions are shown in Fig.12; δ =  
.
--------------  
t1 + t2  
3. P is the card programming voltage set by pin VPP12.5, VPP15 or VPP21.  
4. The tests for dynamic response of both VPP and VCC are performed at 1 Hz, 10 kHz, 100 kHz and 1 MHz, with a  
capacitive load of 100 nF.  
5. This condition ensures proper starting of the oscillator with crystals having a series resistance up to 100 .  
t
t
f
r
V
OH  
90%  
90%  
1.5 V  
10%  
10%  
V
OL  
MBH856  
t
t
2
1
Fig.12 Definition of transition times.  
17  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
INTERNAL PIN CONFIGURATION  
V
SUP  
XTAL  
100  
µA  
100  
µA  
V
CC  
100  
µA  
DETECT  
V
CC  
100  
µA  
I/O(µC)  
5 V  
I/O  
CMD7  
as VPP12.5  
as VPP12.5  
100  
µA  
V
V
CC  
CC  
5 kΩ  
100 Ω  
RSTIN  
GND2  
RST  
CLKOUT2  
TDA8001  
V
DD  
V
CC  
V
CC  
10 kΩ  
CMD3.5  
as VPP12.5  
50 Ω  
CLK  
CVNC  
VPP21  
1350  
as VPP12.5  
as VPP12.5  
CMDVCC  
OFF  
650  
20  
µA  
1.25 V  
VPP12.5  
ALARM  
V
SUP  
V
SUP  
VPP15  
PRES  
PRES  
ALARM  
DELAY  
as VPP12.5  
as VPP12.5  
as VPP12.5  
100  
µA  
2.5 V  
2.5  
µA  
V
H
2.5 V  
V
PP  
20  
µA  
100  
µA  
20  
µA  
V
H
GND1  
V
SUP  
V
DD  
4690  
1.25 V  
V
5310  
as VPP12.5  
CC  
MBE257  
Fig.13 Internal pin configuration.  
18  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
APPLICATION INFORMATION  
+5 V  
to 8805  
micro-  
controller  
(1)  
100 nF  
12 V 25 V  
(2)  
V
RST  
V
CVNC  
V
V
H
DD  
ALARM ALARM  
OFF  
SUP  
DD  
PRES  
PRES  
INT0  
DETECT  
I/O(µC)  
CMDVCC  
VPP15  
100 nF  
V
C1  
C2  
C3  
C4  
C5  
CC  
RST  
CLK  
PORT  
1
VPP12.5  
VPP21  
TDA8001  
RSTIN  
12 V  
25 V  
10  
µF  
CMD7  
PORT  
2
CMD3.5  
XTAL1  
XTAL2  
V
C6  
C7  
10  
µF  
PP  
100 nF  
CLKOUT2  
GND2  
I/O  
80C52  
MICRO-  
CONTROLLER  
GND  
C8  
CARD  
SOCKET  
GND  
DELAY  
GND1  
XTAL  
MGG831  
47 nF  
1 kΩ  
14 MHz  
47 nF  
(1) The capacitor should be placed as close as possible to the IC.  
(2) If pin VH is not connected to 25 V, it should be connected to VDD  
.
Fig.14 Application in a pay TV decoder.  
19  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
PACKAGE OUTLINES  
handbook, full pagewidth  
DIP28: plastic dual in-line package; 28 leads (600 mil)  
SOT117-1  
D
M
E
A
2
A
L
A
1
c
e
w M  
Z
b
1
(e )  
1
b
M
H
28  
15  
pin 1 index  
E
1
14  
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
max.  
A
A
Z
(1)  
(1)  
1
2
UNIT  
mm  
b
b
c
D
E
e
e
L
M
M
w
1
1
E
H
min.  
max.  
max.  
1.7  
1.3  
0.53  
0.38  
0.32  
0.23  
36.0  
35.0  
14.1  
13.7  
3.9  
3.4  
15.80  
15.24  
17.15  
15.90  
5.1  
0.51  
4.0  
2.54  
0.10  
15.24  
0.60  
0.25  
0.01  
1.7  
0.013  
0.009  
0.066  
0.051  
0.020  
0.014  
1.41  
1.34  
0.56  
0.54  
0.15  
0.13  
0.62  
0.60  
0.68  
0.63  
inches  
0.20  
0.020  
0.16  
0.067  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-01-14  
SOT117-1  
051G05  
MO-015AH  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
SO28: plastic small outline package; 28 leads; body width 7.5 mm  
SOT136-1  
D
E
A
X
c
y
H
v
M
A
E
Z
28  
15  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
14  
w
detail X  
e
M
b
p
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
max.  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30  
0.10  
2.45  
2.25  
0.49  
0.36  
0.32  
0.23  
18.1  
17.7  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.1  
1.0  
0.9  
0.4  
mm  
2.65  
1.27  
0.050  
1.4  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.019 0.013 0.71  
0.014 0.009 0.69  
0.30  
0.29  
0.42  
0.39  
0.043 0.043  
0.016 0.039  
0.035  
0.016  
inches 0.10  
0.055  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
91-08-13  
95-01-24  
SOT136-1  
075E06  
MS-013AE  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
Several techniques exist for reflowing; for example,  
SOLDERING  
Introduction  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
WAVE SOLDERING  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
DIP  
SOLDERING BY DIPPING OR BY WAVE  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
The package footprint must incorporate solder thieves at  
the downstream end.  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
REPAIRING SOLDERED JOINTS  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
REPAIRING SOLDERED JOINTS  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C.  
When using a dedicated tool, all other leads can be  
soldered in one operation within 2 to 5 seconds between  
270 and 320 °C.  
SO  
REFLOW SOLDERING  
Reflow soldering techniques are suitable for all SO  
packages.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
1996 Dec 12  
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Philips Semiconductors  
Product specification  
Smart card interface  
TDA8001  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 Dec 12  
23  
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Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
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Tel. +61 2 9805 4455, Fax. +61 2 9805 4466  
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Tel. +64 9 849 4160, Fax. +64 9 849 7811  
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Tel. +43 1 60 101, Fax. +43 1 60 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Belgium: see The Netherlands  
Brazil: see South America  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 689 211, Fax. +359 2 689 102  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 247 9145, Fax. +7 095 247 9144  
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Tel. +852 2319 7888, Fax. +852 2319 7700  
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Tel. +65 350 2538, Fax. +65 251 6500  
Colombia: see South America  
Slovakia: see Austria  
Czech Republic: see Austria  
Slovenia: see Italy  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. +45 32 88 2636, Fax. +45 31 57 1949  
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Tel. +27 11 470 5911, Fax. +27 11 470 5494  
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South America: Rua do Rocio 220, 5th floor, Suite 51,  
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Tel. +55 11 821 2333, Fax. +55 11 829 1849  
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Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427  
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Hungary: see Austria  
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Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722  
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Indonesia: see Singapore  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
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Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
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Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,  
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
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Uruguay: see South America  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Vietnam: see Singapore  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 625 344, Fax.+381 11 635 777  
Middle East: see Italy  
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,  
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1996  
SCA52  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
537021/1200/02/pp24  
Date of release: 1996 Dec 12  
Document order number: 9397 750 01384  
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