NXP Semiconductors Stereo Amplifier TFA9810 User Manual

TFA9810  
Stereo full-bridge audio amplifier 2 x 12 W  
Rev. 03 — 20 February 2008  
Product data sheet  
1. General description  
The TFA9810 is a two-channel power comparator for high-efficiency class D audio  
amplifier systems. It contains two full-bridge Bridge-Tied Load (BTL) power stages, drive  
logic, protection control logic and full differential input comparators. By using this power  
comparator a compact closed-loop self-oscillating digital amplifier system or open-loop  
system can be built. The TFA9810 does not require a heat sink and operates using an  
asymmetrical supply voltage.  
2. Features  
I Stereo full-bridge power comparator for class D audio amplifier applications  
I No external heat sink required  
I Operating voltage range: asymmetrical from 8 V to 20 V  
I Thermally protected  
I Zero dead-time switching  
I Current-limiting (no audible interruptions)  
3. Applications  
I Self-oscillating or open-loop class D audio amplifier applications  
I Flat-panel television sets  
I Flat-panel monitors  
I Multimedia systems  
I Wireless speakers  
I High-end CRT television sets  
4. Quick reference data  
Table 1.  
Quick reference data  
Tamb = 25 °C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified  
Symbol  
Parameter  
Condition  
Min  
Typ  
12  
Max Unit  
VP  
Ioff  
Iq  
supply voltage  
off-state current  
quiescent current  
VP = VDDPx VSSPx  
off mode  
8
-
20  
V
110  
35  
200  
45  
µA  
mA  
with load, filter and  
snubbers connected  
-
ηpo  
output power  
efficiency  
output power  
2 x 9 W into 8 ;  
Po = Po(nom)  
87  
89  
-
%
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
6. Block diagram  
TFA9810  
27 BOOT1P  
V
DDP1  
25  
DRIVER  
HIGH  
26 OUT1P  
CONTROL  
LOGIC  
V
DDA1  
4
DRIVER  
LOW  
V
SSP1  
30  
IN1P  
IN1N  
2
3
COMPARATOR 1  
STABI1  
29 BOOT1N  
V
SSA1  
5
V
DDP1  
DRIVER  
HIGH  
10  
DIAG  
PROTECTION  
28 OUT1N  
CONTROL  
LOGIC  
OVP  
UVP  
OCP  
OTP  
ODP  
WP  
DRIVER  
LOW  
V
SSP1  
31  
11  
6
TEST  
STAB1  
SO/OL  
REFERENCE  
22 BOOT2P  
ENABLE  
CDELAY  
7
8
V
24  
DDP2  
DRIVER  
HIGH  
OUT2P  
23  
CONTROL  
LOGIC  
DRIVER  
LOW  
V
DDA2 13  
V
19  
20  
SSP2  
IN2P 15  
IN2N 14  
STABI2  
COMPARATOR 2  
BOOT2N  
V
DDP2  
V
SSA2  
12  
DRIVER  
HIGH  
OUT2N  
STAB2  
21  
18  
CONTROL  
LOGIC  
DRIVER  
LOW  
V
SSP2  
HEATSPREADER  
1
16 17  
32  
9
n.c.  
010aaa016  
V
SSD(HW)  
Fig 1. Block diagram  
TFA9810_3  
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Product data sheet  
Rev. 03 — 20 February 2008  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
7. Pinning information  
7.1 Pinning  
1
2
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
V
V
SSD(HW)  
SSD(HW)  
IN1P  
STAB1  
3
IN1N  
V
SSP1  
4
V
BOOT1N  
OUT1N  
BOOT1P  
OUT1P  
DDA1  
5
V
SSA1  
6
SO/OL  
7
ENABLE  
CDELAY  
n.c.  
8
V
V
DDP1  
DDP2  
TFA9810  
SO32  
9
10  
11  
12  
13  
14  
15  
16  
DIAG  
OUT2P  
TEST  
BOOT2P  
OUT2N  
BOOT2N  
V
SSA2  
V
DDA2  
IN2N  
V
SSP2  
IN2P  
STAB2  
V
V
)
SSD(HW  
SSD(HW)  
010aaa017  
Fig 2. Pin configuration  
The SO32 package has four corner leads. These leads (1, 16, 17, and 32) are internally  
connected to the die pad and must be connected to VSSA in the application. Together with  
the applied copper area on the Printed Circuit Board (PCB) these leads determine the  
ambient temperature, which affects the thermal resistance of the junction.  
7.2 Pin description  
Table 3.  
Symbol  
VSSD(HW)  
Pin description  
Pin  
Description  
1, 16, 17, Negative digital supply voltage and handle wafer  
32  
IN1P  
2
Positive input comparator channel 1  
IN1N  
3
Negative input comparator channel 1  
VDDA1  
VSSA1  
SO/OL  
ENABLE  
CDELAY  
n.c.  
4
Positive analog supply voltage channel 1  
Negative analog supply voltage channel 1  
SO/OL input enables self-oscillating / open-loop configuration  
Enable input to switch between SLEEP and OPERATING  
CDELAY input determines the switch on/off timing  
Not connected  
5
6
7
8
9
DIAG  
10  
11  
12  
13  
Diagnostic output; open drain  
TEST  
VSSA2  
VDDA2  
Test signal input; for testing purposes only  
Negative analog supply voltage channel 2  
Positive analog supply voltage channel 2  
TFA9810_3  
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Product data sheet  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
Table 3.  
Pin description …continued  
Description  
Symbol  
IN2N  
Pin  
14  
15  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
Negative input comparator channel 2  
Positive input comparator channel 2  
IN2P  
STAB2  
VSSP2  
Decoupling of internal 11 V regulator for channel 2 drivers  
Negative power-supply voltage channel 2  
Bootstrap high-side driver negative output channel 2  
Negative output channel 2  
BOOT2N  
OUT2N  
BOOT2P  
OUT2P  
VDDP2  
Bootstrap high-side driver positive output channel 2  
Positive output channel 2  
Positive supply voltage power channel 2  
Positive power supply voltage channel 1  
Positive output channel 1  
VDDP1  
OUT1P  
BOOT1P  
OUT1N  
BOOT1N  
VSSP1  
Bootstrap high-side driver positive output channel 1  
Negative output channel 1  
Bootstrap high-side driver negative output channel 1  
Negative supply voltage power channel 1  
Decoupling of internal 11 V regulator for channel 1 drivers  
STAB1  
8. Functional description  
8.1 General  
The TFA9810 is a dual-switching power comparator. It is the main building block for a  
stereo high-efficiency Class D audio power amplifier system. It contains two full-bridge  
BTL power stages, drive logic, protection-control logic and full differential input  
comparators and references (see Figure 1). By using this power comparator a compact  
closed-loop self-oscillating digital amplifier system or open-loop system can be built. A  
second-order low-pass filter converts the Pulse Width Modulation (PWM) output signal  
into an analog audio signal across the speaker.  
8.2 Interfacing  
The pins ENABLE and SO/OL control the operating mode of the TFA9810. Both the  
ENABLE and the SO/OL pins refer to VSSD(HW)  
.
When the SO/OL pin is connected to VSSA the TFA9810 is in self-oscillating mode: when  
the SO/OL pin is floating the TFA9810 is in open-loop mode.  
The TEST pin needs to be connected to VDDA in both situations.  
Table 4.  
SO/OL connections  
Interfacing  
SO/OL connected to  
VSSD(HW)  
Configuration  
Self-oscillating  
Open-loop  
Open  
The device has two modes: SLEEP and OPERATING.  
TFA9810_3  
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Product data sheet  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
In SLEEP mode the TFA9810 is not biased and has a very low supply current.  
When the TFA9810 is set to OPERATING mode the device is started via the start-up  
sequence, which provides a pop-free start-up behavior. After start-up the reference  
voltages STAB are present and the outputs start switching.  
Table 5.  
Start-up  
Interfacing  
ENABLE [V]  
Mode  
ENABLE < 0.8 V  
ENABLE > 3 V  
SLEEP  
OPERATING  
8.3 Input comparators  
The input stages have a differential input and are optimized for low noise and low offset.  
This results in maximum flexibility in the application.  
8.3.1 Operating in self-oscillating configuration  
The inputs (IN1P, IN1N, IN2P, IN2N) of the comparators are internally set to a voltage level  
of 0.5VP, but only during the start-up sequence. In operating mode the inputs are  
high-ohmic.  
8.3.2 Operating in open-loop configuration  
No internal voltages are applied to the inputs. The input pins (IN1P, IN1N, IN2P, IN2N) are  
pulled down to VSSA level by internal resistors.  
8.4 Diagnostic  
The DIAG output is an open-drain output. The maximum current is 2 mA. Whenever one  
of the protections is triggered the DIAG output is activated low. The DIAG output refers to  
VSSD  
.
8.5 Protections  
Overtemperature, overcurrent, overvoltage, undervoltage, overdissipation sensors, and  
window protection are included in the TFA9810. When one of these sensors exceeds its  
threshold level either the output power stage is switched off and the outputs (OUT1N,  
OUT1P, OUT2N, OUT2P) become floating, or the TFA9810 shuts down and starts up  
immediately.  
OverTemperature Protection (OTP)  
If the junction temperature (Tj) exceeds a threshold level of about 150 °C then the  
outputs become floating. The device will start switching again after 5 µs and when the  
temperature is below 150 °C. This is thermal limitation without audible interruptions.  
OverCurrent Protection (OCP)  
If the output current exceeds the maximum output current threshold level the output  
becomes floating. The device will start switching again after 5 µs. This is current  
limitation without audible interruptions.  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
OverVoltage Protection (OVP)  
When the supply voltage applied to the TFA9810 exceeds the maximum supply  
voltage threshold level the device will shut down. The device will restart when the  
supply voltage is within the operating range.  
UnderVoltage Protection (UVP)  
When the supply voltage applied to the TFA9810 falls below the minimum supply  
voltage threshold level the device will shut down. The device will restart when the  
supply voltage is within the operating range.  
OverDissipation Protection (ODP)  
The ODP in the TFA9810 is a combination of two protections. Exceeding a  
temperature threshold level of 135 °C an internal pre-warning is generated. When an  
overcurrent is detected during the pre-warning the device will shut down. When the  
ENABLE pin is high the TFA9810 will restart automatically. The restart sequence  
(switch-off switch-on) will take 200 ms to 500 ms.  
Window Protection (WP)  
During start-up, if one of the outputs is shorted to VSS or VDD the device will not start.  
This is an effective measure to protect the device against shorts between the outputs  
(before the filter) and the ground or supply lines. The supply must be switched off prior  
to removing any short. The WP protects the device against failure during board  
assembly.  
Table 6.  
Overview protections  
Protections  
Symbol  
OTP  
Condition  
Tj > 150 °C  
IO > IORM  
VP > 20 V  
VP < 8 V  
DIAG  
LOW  
LOW  
LOW  
LOW  
Outputs  
Floating  
Floating  
Floating  
Floating  
Floating  
Recovering  
Automatic, after 5 µs and Tj < 150 °C  
Automatic, after 5 µs and IO < IORM  
Restart (switch-off switch-on when VP < 20 V)  
Restart (switch-off switch-on when VP > 8 V)  
Restart (switch-off switch-on when  
OCP  
OVP  
UVP  
ODP  
Tj > 135 °C and IO > IORM LOW  
Tj < 135 °C or IO < IORM  
)
WP  
OUTX > VDDA - 1 V or  
OUTX < VSSA + 1 V  
LOW  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
8.6 Start-up sequence  
V
P
ENABLE  
STAB1  
CDELAY  
V IN x  
FLOATING  
FLOATING  
PWM  
PWM  
OUT x  
AUDIO  
AUDIO  
AUDIO  
DIAG  
SLEEP  
START-UP  
OPERATING  
FAULT RESTART  
OPERATING  
SHUT-DOWN  
SLEEP  
010aaa018  
Fig 3. Start-up sequence  
9. Internal circuitry  
1,16, 17, 32  
V
DDA  
22 V  
V
SSA  
010aaa024  
Fig 4. Internal circuitry 0001  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
V
DDA1  
2
135 k  
5.5 V  
V
SSA  
hvp  
135 kΩ  
5.5 V  
3
V
SSA1  
010aaa025  
Fig 5. Internal circuitry 0002  
4
5
22 V  
010aaa026  
Fig 6. Internal circuitry 0003  
V
DDA1  
V
DDA1  
50 µA  
110 kΩ  
6
V
SSA1  
V
SSA  
010aaa027  
Fig 7. Internal circuitry 0004  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
V
DDA1  
3 kΩ  
7
250 nA  
V
SSA  
010aaa028  
Fig 8. Internal circuitry 0005  
V
DDA1  
2 nA  
8
200 nA  
5 kΩ  
DISCHARGE  
V
SSA1  
010aaa029  
Fig 9. Internal circuitry 0006  
V
DDA1  
10  
V
V
SSA1  
SSD  
010aaa030  
Fig 10. Internal circuitry 0007  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
V
DDA1  
11  
13 kΩ  
V
SSA1  
010aaa031  
Fig 11. Internal circuitry 0008  
Fig 12. Internal circuitry 0009  
V
DDA2  
14  
5.5 V  
130 kΩ  
hvp  
V
SSA2  
130 kΩ  
5.5 V  
15  
V
SSA2  
010aaa033  
Fig 13. Internal circuitry 0010  
V
DDA2  
100 mA  
18  
12 V  
V
SSD  
010aaa034  
Fig 14. Internal circuitry 0011  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
24  
19  
23.5 V  
010aaa035  
Fig 15. Internal circuitry 0012  
20  
12 V  
OUT2N  
010aaa036  
Fig 16. Internal circuitry 0013  
V
DDP2  
21  
V
SSP2  
010aaa037  
Fig 17. Internal circuitry 0014  
22  
12 V  
OUT2P  
010aaa038  
Fig 18. Internal circuitry 0015  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
V
DDP2  
23  
V
SSP2  
010aaa039  
Fig 19. Internal circuitry 0016  
25  
23.5 V  
30  
010aaa040  
Fig 20. Internal circuitry 0017  
V
DDP1  
26  
V
SSP1  
010aaa041  
Fig 21. Internal circuitry 0018  
Fig 22. Internal circuitry 0019  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
V
DDP1  
28  
V
SSP1  
010aaa043  
Fig 23. Internal circuitry 0020  
29  
12 V  
OUT1N  
010aaa044  
Fig 24. Internal circuitry 0021  
V
DDA1  
100 mA  
31  
12 V  
V
SSD  
010aaa045  
Fig 25. Internal circuitry 0022  
10. Limiting values  
Table 7.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter Conditions Min  
Max  
+23  
-
Unit  
V
VP  
supply voltage  
asymmetrical 0.3  
IORM  
Tj  
repetitive peak output current  
junction temperature  
storage temperature  
ambient temperature  
maximum power dissipation  
3
A
-
+150  
+150  
+85  
2.5  
°C  
°C  
°C  
W
Tstg  
Tamb  
Pmax  
55  
40  
-
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
Table 7.  
Limiting values …continued  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
DIAG  
Min  
Max  
Unit  
V
Vx  
voltage on pin x  
VSS 0.3  
12  
+12  
IN1P - IN1N  
IN2P - IN2N  
all other pins  
+12  
V
12  
+12  
V
VSS 0.3  
1500  
VDD + 0.3  
+1500  
V
Vesd  
electrostatic discharge voltage  
VINX with  
respect to  
other pins  
V
all other pins  
2000  
+2000  
V
11. Thermal characteristics  
Table 8.  
Symbol  
Rth(j-a)  
Characteristics  
Parameter  
Conditions  
Min  
Typ  
41  
Max  
44  
-
Unit  
K/W  
K/W  
thermal resistance  
from junction to  
ambient  
SO32. JEDEC test board  
-
SO32. Two-layer application  
board  
-
44  
Ψj-lead  
thermal  
SO32  
30  
K/W  
characterization  
parameter from  
junction to lead  
Ψj-top  
thermal  
SO32  
4
8
K/W  
characterization  
parameter from  
junction to top of  
package  
[1] Measured in a JEDEC high K-factor test board (standard EIA/JESD 51-7) in free air with natural convection.  
[2] Strongly depends on where the measurement is taken on the case.  
12. Characteristics  
12.1 Static characteristics  
Table 9.  
Static characteristics  
Tamb = 25 °C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Supply voltage  
VP  
Ioff  
Iq  
supply voltage  
VP = VDDPx VSSPx  
8
-
12  
20  
V
off-state current  
quiescent current  
off mode  
110  
35  
200  
45  
µA  
mA  
with load, filter, and snubbers  
connected  
-
ENABLE input  
VIL  
VIH  
LOW-level input voltage with respect to VSSD  
HIGH-level input voltage with respect to VSSD  
0.3  
-
-
+0.8  
VP  
V
V
3
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
Table 9.  
Static characteristics …continued  
Tamb = 25 °C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified  
Symbol  
II  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
input current  
VI = 5 V  
-
1
20  
µA  
SO/OL input  
VIL  
LOW-level input voltage with respect to VSSD  
HIGH-level input voltage with respect to VSSD  
-
-
0.4  
4.5  
V
V
VIH  
3
4
STABI  
VSTABI  
voltage on pin STABI  
with respect to VSS  
10  
11  
12  
V
Comparator full-differential input stage  
Voffset(i)(eq) equivalent input offset  
voltage  
-
-
-
-
-
1
mV  
µV  
V
20 Hz < f < 20 kHz  
-
15  
Vcm  
IIB  
common mode voltage  
input bias current  
VSSA + 3  
-
VDDA 1  
1
µA  
OverTemperature Protection (OTP)  
Tprot protection temperature  
OverVoltage Protection (OVP)  
150  
20  
-
-
°C  
Vth(ovp)  
overvoltage protection  
threshold voltage  
level internal fixed  
21.5  
23  
V
UnderVoltage Protection (UVP)  
VP(uvp)  
undervoltage protection level internal fixed  
supply voltage  
7
3
7.5  
3.5  
8
-
V
A
OverCurrent Protection (OCP)  
IO(ocp)  
overcurrent protection  
output current  
Window Protection (WP)  
VO output voltage  
high level  
low level  
-
-
VDDA 1  
-
-
V
V
VSSA + 1  
[1] Current limiting concept: in overcurrent condition no interruption of the audio signal in case of impedance drop.  
12.2 Dynamic characteristics  
Table 10. Dynamic characteristics  
Tamb = 25 °C; VP = 12 V; RL = 8 ; Figure 33 unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
PWM output  
tr  
tf  
rise time  
fall time  
-
-
10  
10  
-
-
ns  
ns  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
Table 10. Dynamic characteristics …continued  
Tamb = 25 °C; VP = 12 V; RL = 8 ; Figure 33 unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
60  
Max  
Unit  
ns  
tresp  
response time  
transition PWM output from  
LOW to HIGH  
-
-
-
-
50  
ns  
VI = 70 mV  
VI = 3.3 V  
transition PWM output from  
HIGH to LOW  
-
-
60  
50  
-
-
ns  
ns  
VI = 70 mV  
VI = 3.3 V  
tw(min)  
RDSon  
minimum pulse width PWM output  
-
-
60  
-
ns  
drain-source on-state  
resistance  
0.28  
0.35  
ηpo  
output power  
efficiency  
output power 2 x 9 W into 8 .  
Po = Po(nom)  
87  
89  
-
%
[1] High-side and low-side power switch have the same series resistance.  
[2] Output power measured across the loudspeaker load. Output power is measured indirectly via RDSon  
.
12.3 AC characteristics measured in a typical application  
Table 11. AC characteristics measured in typical application  
Tamb = 25 °C; VP = 12 V; RL = 8 Ω; fosc = 550 kHz; Figure 33 unless otherwise specified.  
Symbol  
VP  
Parameter  
Conditions  
Min  
Typ  
12  
Max  
20  
-
Unit  
V
supply voltage  
RMS output power  
VP = VDDPx VSSPx  
8
-
Po(RMS)  
RL = 8 ; VP = 12 V;  
9.5  
W
THD = 10 %; Two channel  
driven; no heat sink required.  
Po  
output power  
VP = 12 V; RL = 8 Ω  
THD = 10 %  
8.5  
6.5  
-
9.5  
7.5  
12  
-
-
-
W
W
W
THD = 1 %  
VP = 14 V; RL = 8 ;  
THD = 10 %; thermally limited  
VP = 16 V; RL = 8 ;  
-
15  
-
W
W
W
%
THD = 10 %; thermally limited  
VP = 12 V; RL = 6 ;  
THD = 10 %; thermally limited  
-
12  
-
VP = 12 V; RL = 4 ;  
THD = 10 %; thermally limited  
-
15  
-
THD+N  
ηpo  
total harmonic  
distortion-plus-noise  
Po is 1 W; f = 1 kHz; AES17  
brick-wall filter  
-
0.04  
89  
0.1  
-
output power  
efficiency  
Po = 9 W  
87  
19  
-
%
Gv(cl)  
Vn(o)  
closed-loop voltage  
gain  
VI = 100 mV (RMS); fi = 1 kHz  
19.7  
150  
21  
-
dB  
µV  
output noise voltage  
Inputs shorted;  
AES17 brick-wall filter  
TFA9810_3  
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Product data sheet  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
Table 11. AC characteristics measured in typical application …continued  
Tamb = 25 °C; VP = 12 V; RL = 8 Ω; fosc = 550 kHz; Figure 33 unless otherwise specified.  
Symbol  
S/N  
Parameter  
Conditions  
Min  
-
Typ  
96  
Max  
Unit  
dB  
signal-to-noise ratio  
Vo = 10 V (RMS); gain 20 dB  
-
-
SVRR  
supply voltage ripple Vripple = 2 V(p-p); fi= 1 kHz  
rejection  
34  
45  
dB  
αcs  
channel separation  
Po = 1 W; fi = 1 kHz  
55  
70  
-
dB  
[1] Minimum value determined by R5, R10, R17, R22 equalling +1 % and R7, R14, R18, R20 equalling 1 %.  
13. Quality specification  
In accordance with SNW-FQ-611-E, ‘if this type is used as an audio amplifier’. The  
number of the quality specification can be found in the Quality Reference Handbook. The  
handbook can be ordered using the code 9398 510 63011.  
14. Application information  
14.1 Output power estimation  
For BTL configuration the output power just before clipping can be estimated using  
2
RL  
× VP  
-----------------------------------------------------  
RL + 2 × (RDSon + Rs)  
--------------------------------------------------------------------------------  
2 × RL  
BTL : Po0.5 %  
=
(1)  
Where,  
VP = supply voltage (VDDPx VSSPx) [V]  
RL = load resistance []  
RDSon = drain-source on-state resistance []  
Rs = series resistance []  
Po0.5 % = output power at the THD level of 0.5 % [W]  
The output power at 10 % THD can be estimated by using Equation 2:  
P
= 1.25 × Po0.5 %  
(2)  
o10 %  
Figure 26 and Figure 27 below show the estimated output power at THD = 0.5 % and  
THD = 10 % as a function of the BLT supply voltage for different load impedances.  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
010aaa019  
(3)  
25  
20  
15  
10  
5
P
(W)  
o
(2)  
(1)  
0
8
12  
16  
20  
V
(V)  
P
(1) RL = 4 Ω  
(2) RL = 6 Ω  
(3) RL = 8 Ω  
Fig 26. BTL output power as function of supply voltage: THD = 0.5 %. 3 A  
010aaa020  
30  
(3)  
P
o
(W)  
(2)  
20  
(1)  
10  
0
8
12  
16  
20  
V
(V)  
P
(1) RL = 4 Ω  
(2) RL = 6 Ω  
(3) RL = 8 Ω  
Fig 27. BTL output power as function of supply voltage: THD = 10 %. 3 A  
14.2 Output current limiting  
The peak output current is internally limited above a level of 3 A minimum. During normal  
operation the output current should not exceed this threshold level of 3 A, otherwise the  
output signal will be distorted. The peak output current in BTL can be estimated using  
VP  
I max ≤  
3 A  
(3)  
-----------------------------------------------------  
O
RL + 2 × (RDSon + Rs)  
Where:  
VP = supply voltage (VDDPx VSSPx) [V].  
TFA9810_3  
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Product data sheet  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
RL = load resistance [].  
RDSon = drain-source on-state resistance [].  
Rs = series resistance [].  
Example:  
A 4 speaker in BTL configuration can be used up to a supply voltage of 12 V without  
running into current limiting. Current limiting (clipping) will avoid audio holes, but it causes  
a sound distortion similar to voltage clipping.  
14.3 Speaker configuration and impedance  
For a flat-frequency response (second-order Butterworth filter) it is necessary to change  
the low-pass filter components LLC and CLC according to the speaker configuration and  
impedance. Table 12 shows the practical required values:  
Table 12. Filter component values  
Configuration  
Impedance []  
LLC [µF]  
10  
CLC [nF]  
1500  
BTL  
4
6
8
16  
1000  
22  
680  
14.4 Differential input  
For a high common-mode rejection ratio and a maximum of flexibility in the application,  
the audio inputs of the application are fully differential.  
The input configuration for a differential-input application is illustrated in Figure 28.  
OUT1P  
+
IN1P  
AUDIO  
DSP  
IN1N  
V
SS  
OUT1N  
010aaa021  
Fig 28. Input configuration for differential input  
14.5 Single-ended input  
When using an audio source with a single-ended ‘out’, it is important to connect the IN1N  
from the application board to the VSS/GND of the audio source (e.g. Audio DSP).  
The input configuration for single-ended ‘in’ application is illustrated in Figure 29.  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
OUT1P  
+
IN1P  
IN1N  
AUDIO  
DSP  
OUT1N  
010aaa022  
Fig 29. Input configuration for single-ended input  
14.6 Curves measured in a typical application  
010aaa197  
+30  
G
v
(dB)  
+25  
+20  
+15  
+10  
(1)  
(2)  
2  
1  
2
10  
10  
1
10  
10  
f (Hz)  
i
VP = 12 V, Vi = 100 mV  
(1) OUT1  
(2) OUT2  
Fig 30. Gain as a function of frequency  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
010aaa195  
10  
THD+N  
(%)  
1
1  
10  
(2)  
(1)  
2  
10  
2
3
4
5
10  
10  
10  
10  
10  
f (Hz)  
i
VP = 12 V, RL = 8 , Po = 1 W  
(1) OUT1  
(2) OUT2  
Fig 31. Total harmonic distortion + noise as a function of frequency  
010aaa196  
10  
THD+N  
(%)  
1
1  
10  
(1)  
(2)  
2  
10  
10  
2  
1  
10  
1
10  
P
(W)  
o
VP = 12 V, RL = 8 , fi = 1 kHz  
(1) OUT1  
(2) OUT2  
Fig 32. Total harmonic distortion as a function of output power  
14.7 Typical application diagram TFA9810  
The typical application diagram with the TFA9810 supplied from an asymmetrical supply is  
shown in Figure 33.  
TFA9810_3  
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1
12 V  
12 V  
12 V  
VP J1  
L1  
BEAD  
L2  
BEAD  
C2  
220 µF  
R3  
10 Ω  
C32  
220 µF  
C33  
100 nF  
C1  
220 µF  
2
SW1  
C3  
100 nF  
C31  
100 nF  
ENABLE  
GND  
GND  
C4  
100 nF  
C5  
100 nF  
OUT1  
GND  
GND  
GND  
V
V
V
V
DDP2  
n.c DDP1  
DDA1  
DDA2  
R5  
100 kΩ  
4
2
13  
9 25 24  
L3  
22 µH  
C6  
1 µF  
OUT1+  
R7  
R6  
R31  
OUT1P  
IN1P  
IN1N  
2
1
26  
J3  
10 kΩ  
10 kΩ  
10 kΩ  
C9  
220 nF  
2
C8  
IN1  
J2  
220 pF  
C27  
470 pF  
C12  
BOOT1P  
BOOT1N  
C11  
47 pF  
R27  
10 Ω  
27  
29  
680 nF  
C10  
220 pF  
C7  
1 µF  
GND  
R10  
R11  
R32  
10 kΩ  
3
GND  
GND  
C13  
R28  
10 Ω  
C28  
470 pF  
10 kΩ  
10 kΩ  
680 nF  
C14  
J4  
R14  
100 kΩ  
220 nF  
C15  
330 nF  
1
OUT1N  
STABI1  
28  
31  
18  
CDELAY  
SO/OL  
L4  
22 µH  
OUT1  
8
6
OUT1−  
GND  
OUT1+  
C16  
Snubber network  
(Optional)  
1µF  
GND  
TFA9810  
GND  
STABI2  
ENABLE  
DIAG  
7
C17  
OUT2−  
1µF  
OUT2+  
10  
L5  
GND  
22 µH  
V
2
OUT2P  
11, TEST  
DDA2  
23  
22  
20  
R17  
J6  
C19  
220 nF  
100 kΩ  
C18  
C20  
680 nF  
C29  
470 pF  
R29  
10 Ω  
BOOT2P  
BOOT2N  
1 µF  
R18  
R19  
R33  
IN2P  
IN2N  
1
15  
10 kΩ  
10 kΩ  
10 kΩ  
C21  
2
IN2  
J5  
220 pF  
GND  
GND  
C22  
68 pF  
R30  
10 Ω  
C23  
680 nF  
C30  
470 pF  
C24  
220 pF  
C25  
220 nF  
C26  
1 µF  
GND  
R22  
R23  
R34  
10 kΩ  
OUT2N  
1
14  
21  
OUT2  
10 kΩ  
10 kΩ  
L6  
22 µH  
OUT2−  
5
12  
1
16  
17 32  
30 19  
J7  
R26  
100 kΩ  
R100  
22 Ω  
GND  
V
V
V
V
V
V
V
V
SSA1  
SSA2 SSD SSD SSD SSD SSP1 SSP2  
OUT2+  
010aaa023  
GND  
Fig 33. Typical application diagram TFA9810  
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1
12 V  
12 V  
12 V  
VP J1  
L1  
BEAD  
L2  
BEAD  
C2  
220 µF  
R3  
10 Ω  
C32  
220 µF  
C33  
100 nF  
C1  
220 µF  
2
SW1  
C3  
100 nF  
C31  
100 nF  
ENABLE  
GND  
GND  
C4  
100 nF  
C5  
100 nF  
OUT1−  
GND  
GND  
GND  
V
V
V
V
DDP2  
n.c DDP1  
DDA1  
DDA2  
R5  
100 kΩ  
4
2
13  
9 25 24  
L3  
22 µH  
C6  
1 µF  
OUT1+  
R7  
R6  
R31  
OUT1P  
IN1P  
IN1N  
2
1
26  
J3  
10 kΩ  
10 kΩ  
10 kΩ  
C9  
220 nF  
2
C8  
IN1  
J2  
220 pF  
C27  
470 pF  
C12  
680 nF  
BOOT1P  
BOOT1N  
C11  
47 pF  
R27  
10 Ω  
27  
29  
C10  
220 pF  
C7  
1 µF  
GND  
R10  
R11  
R32  
10 kΩ  
3
GND  
GND  
C13  
680 nF  
R28  
10 Ω  
C28  
470 pF  
10 kΩ  
10 kΩ  
C14  
220 nF  
J4  
STAB1  
R14  
100 kΩ  
1
OUT1N  
STAB1  
R35  
200 kΩ  
CDELAY  
28  
31  
18  
C15  
4.7 µF  
L4  
22 µH  
OUT1  
OUT1−  
GND  
8
6
OUT1+  
C16  
1µF  
SO/OL  
Snubber network  
(Optional)  
GND  
TFA9810  
STAB2  
ENABLE  
DIAG  
7
GND  
C17  
1µF  
OUT2+  
OUT2−  
10  
11  
L5  
22 µH  
GND  
V
2
OUT2P  
DDA2  
23  
22  
20  
R17  
100 kΩ  
J6  
C19  
220 nF  
C18  
1 µF  
C20  
680 nF  
C29  
470 pF  
R29  
10 Ω  
BOOT2P  
BOOT2N  
R18  
R19  
10 kΩ  
R33  
IN2P  
IN2N  
1
15  
10 kΩ  
10 kΩ  
C21  
2
IN2  
J5  
220 pF  
GND  
GND  
C22  
68 pF  
R30  
10 Ω  
C23  
680 nF  
C30  
470 pF  
C24  
220 pF  
C25  
220 nF  
C26  
1 µF  
GND  
R22  
R23  
R34  
10 kΩ  
OUT2N  
1
14  
5
21  
OUT2  
10 kΩ  
10 kΩ  
L6  
22 µH  
OUT2−  
12  
V
1
16  
17 32  
30 19  
J7  
R26  
100 kΩ  
R100  
22 Ω  
GND  
V
V
V
V
V
V
V
SSA1  
SSA2 SSD SSD SSD SSD SSP1 SSP2  
OUT2+  
010aaa431  
GND  
Fig 34. Typical application diagram TFA9810 with externally adjusted switch-on time  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
14.8 Typical application: bill of materials  
Table 13. Typical application: bill of materials  
Item  
1
Quantity  
Reference  
C1, C2.  
Part  
Description  
2
5
2
4
4
4
1
4
1
1
1
3
2
2
2
220 µF/35 V  
100 nF/50 V  
1 µF/50 V  
1 µF/25 V  
220 pF/25 V  
220 nF/25 V  
47 pF/25 V  
680 nF/25 V  
330 nF/25 V  
68 pF/25 V  
1000 µF/25 V  
Screw terminal  
CINCH  
General purpose 85 °C, diameter 8 mm  
SMD 0805 X7R  
SMD 1206 X7R  
MKT  
2
C3, C4, C5, C31, C33.  
C16, C17.  
C6, C7, C18, C26  
C8, C10, C21, C24.  
C9, C14, C19, C25.  
C11  
3
4
5
SMD 0402 NP0  
SMD 0805 X7R  
SMD 0402 NP0  
MKT  
6
7
8
C12, C13, C20, C23.  
C15  
9
SMD 0805 X7R  
SMD 0402 NP0  
CE12-02R  
10  
11  
12  
13  
14  
15  
C22.  
C32  
J1, J3, J6.  
J2, J5.  
Two pins  
CINCH  
J4, J7  
Jumper  
Closed on demo board only  
L1, L2.  
BEAD  
SMD 1206 Würth Elektronik  
DC < 0.5 10 MHz > 80 Ω  
16  
4
L3, L4, L5, L6.  
22 µH  
8RDY TOKO A7040HN-220M,  
11RHBP TOKO A7503CY-220M or Sagami  
7311NA-220M  
17  
18  
5
4
R3  
10 / 0.25 W / 5 %  
SMD 1206  
SMD 0603  
R5, R14, R17, R26.  
100 k / 0.1 W /  
1 % for 20 dB  
200 k / 0.1 W /  
1 % for 26 dB  
19  
12  
R6, R7, R10, R11, R18,  
R19, R22, R23, R31, R32,  
R33, R34.  
10 k / 0.1 W / 1 %  
SMD 0603  
20  
21  
1
1
SW1  
U1  
PCB switch  
TFA9810T  
Secme 090320901  
SOT287-1 (SO32) NXP Semiconductors  
14.9 Snubber network  
Table 14. Snubber network: bill of materials  
Item Quantity Reference Part  
Footprint  
1
2
4
4
C27, C28, C29, C30 470 pF, 25 V SMD 0805 X7R  
R27, R28, R29, R30 10 / 0.25 W / SMD 1206  
5 %  
15. Test information  
General Quality Specification for General Applications, Power management and  
RF Power. Document SNW-FQ-611 refers.  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
16. Package outline  
SO32: plastic small outline package; 32 leads; body width 7.5 mm  
SOT287-1  
D
E
A
X
c
y
H
v
M
A
E
Z
17  
32  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
16  
1
w M  
detail X  
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
E
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
max.  
0.3  
0.1  
2.45  
2.25  
0.49  
0.36  
0.27 20.7  
0.18 20.3  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.2  
1.0  
0.95  
0.55  
mm  
2.65  
0.25  
0.01  
1.27  
0.05  
1.4  
0.25  
0.01  
0.25  
0.01  
0.1  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.02 0.011 0.81  
0.01 0.007 0.80  
0.30  
0.29  
0.419  
0.394  
0.043 0.047  
0.016 0.039  
0.037  
0.022  
inches  
0.1  
0.004  
0.055  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
00-08-17  
03-02-19  
SOT287-1  
MO-119  
Fig 35. Package outline SOT287-1 (SO23)  
TFA9810_3  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
17. Revision history  
Table 15. Revision history  
Document ID  
TFA9810_3  
Release date  
20080220  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
TFA9810_2  
Modifications:  
Figure 33 has been updated.  
Figure 34 has been added.  
TFA9810_2  
TFA9810_1  
20070831  
Preliminary data sheet  
-
-
TFA9810_1  
-
20070815  
Preliminary data sheet  
TFA9810_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 February 2008  
27 of 29  
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TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
18. Legal information  
18.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
18.2 Definitions  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
18.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
18.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
19. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: [email protected]  
TFA9810_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 February 2008  
28 of 29  
Download from Www.Somanuals.com. All Manuals Search And Download.  
           
TFA9810  
NXP Semiconductors  
Audio amplifier 2 x 12 W  
20. Contents  
application. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2008.  
All rights reserved.  
For sales office addresses, please send an email to: [email protected]  
Date of release: 20 February 2008  
Document identifier: TFA9810_3  
Download from Www.Somanuals.com. All Manuals Search And Download.  
 

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