Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP ProBook 450 G1 Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
included
Item Description
Notes
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Mother Board, SD Board, USB Board, ODD board,
Function Board
5
Batteries
All types including standard alkaline and lithium coin
or button style batteries Main battery, RTC battery
2
0
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries NO
Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas
than 100 sq cm
discharge lamps Panel
Cathode Ray Tubes (CRT)
NO
NO
NO
0
0
0
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
NO
NO
NO
0
0
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. NO
0
Components and waste containing asbestos
Components, parts and materials containing
NO
NO
0
0
EL-MF877-00
Page
1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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Disassembly Process-1
Take off the battery package from system bottom side. Release DIMM/HDD door
knob and take off DIMM/HDD door.
+
Loose HDD & ODD module screws and take off HDD & ODD module from system.
Loose WLAN/WWAN screws and take off WLAN/WWAN,DIMM module from
system.
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Disassembly Process-2
+
Loose KB module screw, and then take off KB module.
+
Loose L-case to U-case screws on bottom side & U-case to L-case screw on top side,
and take off U-case from system.
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Disassembly Process-3
+
Loose the screw of the speaker ,power board, function board, touchpad module,
FPR, SD board ,and USB board then take off them.
Loose screw of hinge to L-case, take off LCD
module from L-case.
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Disassembly Process-4
+
Loose screw of MB to U-case, take off MB.
Loose screw of thermal module from MB, take off
thermal module
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Disassembly Process-5
+
Loose screw and screw mylar, take off hinge cover and lcd bezel.
Loose LCD & Hinge screw, take off LCD , hinge
and panel.
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