HP Hewlett Packard Server DL365 User Manual

HP ProLiant DL365 Server  
Maintenance and Service Guide  
Part Number 418289-005  
March 2008 (Fifth Edition)  
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Contents  
Contents  
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Contents  
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Customer self repair  
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow  
for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP  
service providers or service partners) identifies that the repair can be accomplished by the use of a CSR  
part, HP will ship that part directly to you for replacement. There are two categories of CSR parts:  
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these  
parts, you will be charged for the travel and labor costs of this service.  
Optional—Parts for which customer self repair is optional. These parts are also designed for  
customer self repair. If, however, you require that HP replace them for you, there may or may not be  
additional charges, depending on the type of warranty service designated for your product.  
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer  
warranty, HP requires that an authorized service provider replace the part. These parts are identified as  
"No" in the Illustrated Parts Catalog.  
Based on availability and where geography permits, CSR parts will be shipped for next business day  
delivery. Same day or four-hour delivery may be offered at an additional charge where geography  
permits. If assistance is required, you can call the HP Technical Support Center and a technician will help  
you over the telephone. HP specifies in the materials shipped with a replacement CSR part whether a  
defective part must be returned to HP. In cases where it is required to return the defective part to HP, you  
must ship the defective part back to HP within a defined period of time, normally five (5) business days.  
The defective part must be returned with the associated documentation in the provided shipping material.  
Failure to return the defective part may result in HP billing you for the replacement. With a customer self  
repair, HP will pay all shipping and part return costs and determine the courier/carrier to be used.  
For more information about HP's Customer Self Repair program, contact your local service provider. For  
the North American program, refer to the HP website (http://www.hp.com/go/selfrepair).  
Parts only warranty service  
Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only  
warranty service, HP will provide replacement parts free of charge.  
For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these  
parts, you will be charged for the travel and labor costs of this service.  
Réparation par le client (CSR)  
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client)  
afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant  
la période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut  
être effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces  
CSR:  
Customer self repair  
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Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à  
HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront  
facturés.  
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont  
également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous  
demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type  
de garantie applicable à votre produit.  
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la  
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit  
effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue  
illustré.  
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre  
situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le  
jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance  
téléphonique, appelez le Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de  
rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous  
devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation  
doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se  
réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte  
l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à  
utiliser.  
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus  
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP  
Service de garantie "pièces seules"  
Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de  
rechange fournies par HP ne sont pas facturées.  
Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez  
à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
Riparazione da parte del cliente  
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti  
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente  
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di  
assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente  
al cliente per la sostituzione. Vi sono due categorie di parti CSR:  
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida  
la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di  
componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP,  
potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.  
Customer self repair  
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NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare  
la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti  
sono identificate da un "No" nel Catalogo illustrato dei componenti.  
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il  
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un  
supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di  
un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP  
specifica se il cliente deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente  
difettoso, lo si deve spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni  
lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di  
spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio  
da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e  
resa e sceglie il corriere/vettore da utilizzare.  
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il  
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).  
Servizio di garanzia per i soli componenti  
La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di  
garanzia del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.  
Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione  
da parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di  
spedizione e di manodopera per il servizio.  
Customer Self Repair  
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und  
höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP  
Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden  
kann, sendet Ihnen HP dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien  
unterteilt:  
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie  
den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten  
für diesen Service berechnet.  
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für  
Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen  
lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen  
Garantiebedingungen zusätzliche Kosten anfallen.  
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des  
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog  
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.  
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag  
geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen  
einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center  
Customer self repair  
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anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-  
Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden  
muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines  
vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss  
mit der zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang  
enthalten ist. Wenn Sie das defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung  
stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf  
und bestimmt den Kurier-/Frachtdienst.  
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner  
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter  
Parts-only Warranty Service (Garantieservice  
ausschließlich für Teile)  
Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice  
ausschließlich für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile  
kostenlos zur Verfügung.  
Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den  
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen  
Service berechnet.  
Reparaciones del propio cliente  
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer  
Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de  
realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los  
proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el  
uso de un componente CSR, HP le enviará dicho componente directamente para que realice su  
sustitución. Los componentes CSR se clasifican en dos categorías:  
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si  
solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los  
gastos de desplazamiento y de mano de obra de dicho servicio.  
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos  
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo,  
si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del  
tipo de servicio de garantía correspondiente al producto.  
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para  
que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios  
autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra  
"No" en el catálogo ilustrado de componentes.  
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a  
su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega  
en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al  
Customer self repair  
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Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de  
materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos  
deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP,  
deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los  
componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje  
de envío. Si no enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En  
el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío  
y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.  
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase  
en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica,  
visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).  
Servicio de garantía exclusivo de componentes  
La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según  
las condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto  
sin cargo adicional alguno.  
Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes  
por parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que  
hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.  
Customer Self Repair  
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een  
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze  
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner)  
bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP  
dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee  
categorieën CSR-onderdelen:  
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze  
onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening  
gebracht.  
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn  
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te  
vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type  
garantieservice voor het product.  
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband  
met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden  
vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de  
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden  
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service  
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het  
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte  
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde  
Customer self repair  
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periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de  
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het  
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen.  
Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde  
onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.  
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma  
van HP. Informatie over Service Partners vindt u op de HP website  
Garantieservice "Parts Only"  
Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen  
van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.  
Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze  
onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening  
gebracht.  
Reparo feito pelo cliente  
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a  
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,  
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o  
reparo pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao  
cliente. Existem duas categorias de peças CSR:  
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua  
essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.  
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas  
para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a  
cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de  
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão  
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.  
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após  
o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode  
ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte  
técnico da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a  
peça CSR de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for  
necessário, é preciso enviar a peça com defeito à HP dentro do período determinado, normalmente  
cinco (5) dias úteis. A peça com defeito deve ser enviada com a documentação correspondente no  
material de transporte fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de  
reparo feito pelo cliente, a HP paga todas as despesas de transporte e de devolução da peça e  
determina a transportadora/serviço postal a ser utilizado.  
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Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com  
o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP  
Serviço de garantia apenas para peças  
A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos  
do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma  
taxa.  
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas  
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.  
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Illustrated parts catalog  
Mechanical components  
Item  
Description  
Spare part  
number  
Customer self  
repair (on  
page 5)  
1
2
Access panel  
431360-001  
431359-001  
Mandatory1  
Mandatory1  
Miscellaneous hardware kit  
a) Optical device blank*  
b) Air baffle  
c) HP Smart Array E200i battery tray  
d) HP Smart Array P400i battery tray  
e) Hard drive bezel blank  
f) Power supply blank  
3
4
Hard drive blank  
Front bezel  
392613-001  
Mandatory1  
a) Standard front bezel  
445865-001  
Mandatory1  
b) Universal front bezel*  
460692-001  
Mandatory1  
Illustrated parts catalog 16  
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Item  
Description  
Spare part  
number  
Customer self  
repair (on  
page 5)  
Rack mounting hardware  
5
6
Rack mounting hardware kit*  
Cable management arm*  
360104-001  
360105-001  
Mandatory1  
Mandatory1  
*Not shown  
1Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be  
charged for the travel and labor costs of this service.  
2Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,  
however, you require that HP replace them for you, there may or may not be additional charges, depending on the  
type of warranty service designated for your product.  
3No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires  
that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts  
Catalog.  
1Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP  
de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer  
ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.  
3No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour  
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé.  
Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré.  
1Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese  
addizionali a seconda del tipo di garanzia previsto per il prodotto.  
3No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono  
identificate da un “No” nel Catalogo illustrato dei componenti.  
1Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn  
Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.  
2Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für  
Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,  
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten  
anfallen.  
3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu  
erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit  
„No“ bzw. „Nein“ gekennzeichnet.  
1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a  
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de  
mano de obra de dicho servicio.  
2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos  
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que  
HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía  
correspondiente al producto.  
3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el  
usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la  
Illustrated parts catalog 17  
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sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de  
componentes.  
1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen  
te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.  
2Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn  
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.  
3No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de  
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze  
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas  
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.  
2Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa  
adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
3No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a  
garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a  
marca “No” (Não), no catálogo de peças ilustrado.  
Illustrated parts catalog 18  
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System components  
Item Description  
Spare part  
number  
Customer  
self repair  
(on page 5)  
7
System fan module  
412212-001  
412211-001  
412200-001  
Mandatory1  
Mandatory1  
Mandatory1  
8
Hot-plug power supply, 700-W  
PCIe riser board assembly  
Processor  
9
10  
a) 1.8-GHz, 95-W AMD Opteron™  
419473-001  
Optional2  
b) 2.4-GHz, 95-W AMD Opteron™*  
c) 2.6-GHz, 95-W AMD Opteron™*  
d) 2.8-GHz, 95-W AMD Opteron™*  
e) 1.8-GHz, 68-W AMD Opteron™*  
f) 2.1-GHz, 95-W AMD Opteron™*  
g) 2.2-GHz, 68-W AMD Opteron™*  
h) 2.2-GHz, 95-W AMD Opteron™*  
i) 2.4-GHz, 68-W AMD Opteron™*  
j) 2.6-GHz, 68-W AMD Opterton™*  
419478-001  
419480-001  
439749-001  
434949-001  
446384-103  
419477-001  
446384-102  
419479-001  
439750-001  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Illustrated parts catalog 19  
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Item Description  
Spare part  
number  
Customer  
self repair  
(on page 5)  
k) 3.0-GHz, 95-W AMD Opteron™*  
451810-001  
431356-001  
Optional2  
Optional2  
11  
12  
Heatsink with grease and alcohol swab  
Boards  
HP Smart Array controllers  
a) HP Smart Array E200i Controller, integrated SAS  
b) HP Smart Array P400i Controller, integrated SAS  
412205-001  
412206-001  
Mandatory1  
Mandatory1  
13  
14  
15  
16  
System board with processor cages  
SAS backplane  
431355-001  
412201-001  
412202-001  
431358-001  
Optional2  
Optional2  
Mandatory1  
Optional2  
Multibay media backplane  
HP Systems Insight Display, LEDs, and power button assembly,  
with cable  
Media devices  
17  
Multibay drives  
a) CD-RW combo drive, removable multibay, IDE, 24X  
399959-001  
Mandatory1  
b) DVD-ROM+RW drive, removable multibay, 8X*  
c) Diskette drive, removable multibay*  
Memory  
397928-001  
399396-001  
Mandatory1  
Mandatory1  
18  
DIMM, PC2-5300 registered DDR2  
a) 512-MB*  
430449-001  
Mandatory1  
b) 1-GB*  
c) 2-GB*  
d) 4-GB*  
Hard drives  
430450-001  
432668-001  
432670-001  
Mandatory1  
Mandatory1  
Mandatory1  
19  
20  
SAS hard drives  
a) 36-GB, 10,000-rpm  
376596-001  
Mandatory1  
b) 72-GB, 10,000-rpm*  
c) 146-GB, 10,000-rpm*  
376597-001  
432320-001  
405419-001  
Mandatory1  
Mandatory1  
Mandatory1  
60-GB SATA hard drive, 5,400-rpm*  
BBWC  
21  
22  
23  
24  
25  
26  
HP Smart Array E200i battery pack  
307132-001  
398648-001  
412800-001  
413486-001  
405836-001  
405835-001  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
HP Smart Array P400i battery pack  
HP Smart Array E200i memory module, 64-MB*  
HP Smart Array E200i memory module, 128-MB*  
HP Smart Array P400i memory module, 256-MB*  
HP Smart Array P400i memory module, 512-MB*  
Illustrated parts catalog 20  
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Item Description  
Miscellaneous  
Spare part  
number  
Customer  
self repair  
(on page 5)  
27  
28  
29  
30  
SAS cable*  
408763-001  
409124-001  
142258-001  
234556-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Smart Array battery cable*  
AC power cord*  
Battery, 3.3-V, lithium*  
*Not shown  
1Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be  
charged for the travel and labor costs of this service.  
2Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,  
however, you require that HP replace them for you, there may or may not be additional charges, depending on the  
type of warranty service designated for your product.  
3No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires  
that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts  
Catalog.  
1Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP  
de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer  
ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.  
3No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour  
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé.  
Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré.  
1Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese  
addizionali a seconda del tipo di garanzia previsto per il prodotto.  
3No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono  
identificate da un “No” nel Catalogo illustrato dei componenti.  
1Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn  
Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.  
2Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für  
Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,  
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten  
anfallen.  
3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu  
erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit  
„No“ bzw. „Nein“ gekennzeichnet.  
1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a  
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de  
mano de obra de dicho servicio.  
2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos  
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que  
HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía  
correspondiente al producto.  
Illustrated parts catalog 21  
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3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el  
usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la  
sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de  
componentes.  
1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen  
te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.  
2Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn  
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.  
3No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de  
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze  
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas  
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.  
2Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa  
adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
3No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a  
garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a  
marca “No” (Não), no catálogo de peças ilustrado.  
Illustrated parts catalog 22  
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Removal and replacement procedures  
Required tools  
You need the following items for some procedures:  
T-10 Torx screwdriver  
T-15 Torx screwdriver  
Diagnostics Utility  
Safety considerations  
Before performing service procedures, review all the safety information.  
Preventing electrostatic discharge  
To prevent damaging the system, be aware of the precautions you need to follow when setting up the  
system or handling parts. A discharge of static electricity from a finger or other conductor may damage  
system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the  
device.  
To prevent electrostatic damage:  
Avoid hand contact by transporting and storing products in static-safe containers.  
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.  
Place parts on a grounded surface before removing them from their containers.  
Avoid touching pins, leads, or circuitry.  
Always be properly grounded when touching a static-sensitive component or assembly.  
Symbols on equipment  
The following symbols may be placed on equipment to indicate the presence of potentially hazardous  
conditions.  
This symbol indicates the presence of hazardous energy circuits or electric shock  
hazards. Refer all servicing to qualified personnel.  
WARNING: To reduce the risk of injury from electric shock hazards, do not open this  
enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.  
Removal and replacement procedures 23  
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This symbol indicates the presence of electric shock hazards. The area contains no  
user or field serviceable parts. Do not open for any reason.  
WARNING: To reduce the risk of injury from electric shock hazards, do not open this  
enclosure.  
This symbol on an RJ-45 receptacle indicates a network interface connection.  
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment,  
do not plug telephone or telecommunications connectors into this receptacle.  
This symbol indicates the presence of a hot surface or hot component. If this surface is  
contacted, the potential for injury exists.  
WARNING: To reduce the risk of injury from a hot component, allow the surface to  
cool before touching.  
This symbol indicates that the component exceeds the recommended weight for one  
individual to handle safely.  
14.06 - 17.92 kg  
31.00 - 39.50 lb  
WARNING: To reduce the risk of personal injury or damage to the equipment,  
observe local occupational health and safety requirements and guidelines for manual  
material handling.  
These symbols, on power supplies or systems, indicate that the equipment is supplied  
by multiple sources of power.  
WARNING: To reduce the risk of injury from electric shock, remove all power cords  
to completely disconnect power from the system.  
Server warnings and cautions  
Before installing a server, be sure that you understand the following warnings and cautions.  
WARNING: To reduce the risk of electric shock or damage to the equipment:  
Do not disable the power cord grounding plug. The grounding plug is an important safety  
feature.  
Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all  
times.  
Unplug the power cord from the power supply to disconnect power to the equipment.  
Do not route the power cord where it can be walked on or pinched by items placed against  
it. Pay particular attention to the plug, electrical outlet, and the point where the cord  
extends from the server.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
Removal and replacement procedures 24  
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Preparation procedures  
To access some components and perform certain service procedures, you must perform one or more of the  
following procedures:  
Extend the server from the rack (on page 25).  
If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack  
cabinet, you can use the locking feature of the rack rails to support the server and gain access to  
internal components.  
For more information about telco rack solutions, refer to the RackSolutions.com website  
Power down the server (on page 25).  
If you must remove a server from a rack or a non-hot-plug component from a server, power down the  
server.  
Remove the server from the rack (on page 26).  
If the rack environment, cabling configuration, or the server location in the rack creates awkward  
conditions, remove the server from the rack.  
Extend the server from the rack  
NOTE: If the optional cable management arm option is installed, you can extend the server  
without powering down the server or disconnecting peripheral cables and power cords. These  
steps are only necessary with the standard cable management solution.  
1.  
2.  
3.  
4.  
Power down the server (on page 25).  
Disconnect all peripheral cables and power cords.  
Loosen the front panel thumbscrews.  
Extend the server on the rack rails until the server rail-release latches engage.  
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack  
is adequately stabilized before extending a component from the rack.  
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-  
release latches and sliding the server into the rack. The sliding rails could pinch your fingers.  
5.  
6.  
After performing the installation or maintenance procedure, slide the server into the rack:  
a. Slide the server fully into the rack.  
b. Secure the server by tightening the thumbscrews.  
Connect the peripheral cables and power cords.  
Power down the server  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some  
internal circuitry remain active until AC power is removed.  
Removal and replacement procedures 25  
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IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.  
1.  
2.  
3.  
Back up the server data.  
Shut down the operating system as directed by the operating system documentation.  
If the server is installed in a rack, press the UID LED button on the front panel. Blue LEDs illuminate on  
the front and rear panels of the server.  
4.  
Press the Power On/Standby button to place the server in standby mode. When the server activates  
standby power mode, the system power LED changes to amber.  
5.  
6.  
If the server is installed in a rack, locate the server by identifying the illuminated rear UID LED button.  
Disconnect the power cords.  
The system is now without power.  
Remove the server from the rack  
To remove the server from an HP, Compaq branded, telco, or third-party rack:  
1.  
2.  
3.  
Power down the server (on page 25).  
Extend the server from the rack (on page 25).  
Disconnect the cabling and remove the server from the rack. For more information, refer to the  
documentation that ships with the rack mounting option.  
4.  
Place the server on a sturdy, level surface.  
Hard drive blanks  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
Remove the component as indicated.  
To replace the component, reverse the removal procedure.  
Removal and replacement procedures 26  
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Hot-plug SAS or SATA hard drives  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
Remove the component as indicated.  
To replace the component, reverse the removal procedure.  
Front bezel  
1.  
Power down the server (on page 25).  
2.  
3.  
Extend the server from the rack (on page 25).  
Remove all hard drives ("Hot-plug SAS or SATA hard drives" on page 27) and hard drive blanks  
4.  
5.  
Remove the serial label pull tab by extending it out, and then pressing on the underside to release it  
from the chassis.  
Remove the T-10 Torx screws located on the top of the bezel.  
Removal and replacement procedures 27  
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6.  
Remove the T-10 Torx screws located on the sides of the bezel.  
7.  
8.  
Gently push on the two tabs located at the top of the bezel  
Rotate the bezel away from the server and remove the bezel.  
To replace the component, reverse the removal procedure.  
Hard drive bezel blanks  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
1. Remove hard drives 1 and 2 ("Hot-plug SAS or SATA hard drives" on page 27).  
Removal and replacement procedures 28  
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2.  
Remove the hard drive bezel blank.  
To replace the component, reverse the removal procedure.  
Hot-plug power supply  
WARNING: To reduce the risk of electric shock, do not disassemble the power supply or  
attempt to repair it. Replace it only with the specified spare part.  
CAUTION: Do not attempt to remove and replace a power supply as a hot-plug procedure  
unless both bays are populated with power supplies.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
1.  
2.  
Unfasten the cable management solution to access the power supply bays.  
Disconnect the power cord.  
Removal and replacement procedures 29  
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3.  
Remove the power supply.  
To replace the component, reverse the removal procedure.  
Power supply blank  
Remove the component as indicated.  
To replace the component, reverse the removal procedure.  
Access panel  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
Removal and replacement procedures 30  
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CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
To remove the component:  
1.  
Power down the server if the standard cable management solution is installed ("Power down the  
NOTE: If the optional cable management arm is installed, you can extend the server and  
perform hot-plug installation or maintenance procedures without powering down the server.  
2.  
3.  
Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove  
Lift up on the hood latch handle and remove the access panel.  
To replace the component, reverse the removal procedure.  
Air baffle  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove  
3.  
4.  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle.  
To install the component, reverse the removal procedure.  
Fan module  
The server has three fan modules.  
Removal and replacement procedures 31  
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To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle ("Air baffle" on page 31).  
Remove the fan module.  
To replace the component, reverse the removal procedure.  
IMPORTANT: After installing the fan module, firmly press the top of the module connectors to  
ensure the connectors are seated properly.  
Battery tray  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove  
3.  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle ("Air baffle" on page 31).  
Remove fan module 2 ("Fan module" on page 31).  
Remove the battery tray.  
Removal and replacement procedures 32  
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o
HP Smart Array E200i battery tray  
o
HP Smart Array P400i battery tray  
To replace the component, reverse the removal procedure.  
Battery pack  
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or  
remove the battery pack while an array capacity expansion, RAID level migration, or stripe  
size migration is in progress.  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove  
Removal and replacement procedures 33  
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3.  
4.  
5.  
6.  
7.  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle ("Air baffle" on page 31).  
Remove fan module 2 ("Fan module" on page 31).  
Remove the battery tray ("Battery tray" on page 32).  
Remove the battery pack.  
o
HP Smart Array E200i battery pack  
o
HP Smart Array P400i battery pack  
To replace the component, reverse the removal procedure.  
Multibay blank or device  
To remove the component:  
1.  
Power down the server (on page 25).  
Removal and replacement procedures 34  
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NOTE: Access to the ejector button is intentionally restricted. To eject the optical device, push  
the ejector button with a small flat object such as a key or pen.  
2.  
Eject the device or blank.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To replace the component, reverse the removal procedure.  
Multibay backplane assembly  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove  
3.  
4.  
5.  
6.  
7.  
8.  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle ("Air baffle" on page 31).  
Remove fan module 3 ("Fan module" on page 31).  
Disconnect the cable from the multibay backplane.  
Remove any device in the multibay ("Multibay blank or device" on page 34).  
Remove the two T-15 Torx multibay backplane assembly screws.  
Removal and replacement procedures 35  
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9.  
Remove the multibay backplane assembly.  
10. Remove the multibay backplane board from the assembly.  
To replace the component, reverse the removal procedure.  
SAS backplane  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove  
3.  
4.  
5.  
6.  
7.  
8.  
Remove the access panel ("Access panel" on page 30).  
Remove all SAS or SATA hard drives ("Hot-plug SAS or SATA hard drives" on page 27).  
Remove any device in the multibay ("Multibay blank or device" on page 34).  
Remove the air baffle ("Air baffle" on page 31).  
Remove all fan modules ("Fan module" on page 31).  
Remove the integrated array controller battery tray ("Battery tray" on page 32) (with battery and  
cable, if applicable.)  
9.  
Remove the multibay backplane assembly ("Multibay backplane assembly" on page 35).  
Removal and replacement procedures 36  
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10. Disconnect the power and data cables from the SAS backplane.  
11. Remove the three T-15 Torx screws from the backplane.  
12. Remove the backplane.  
To replace the component, reverse the removal procedure.  
Systems Insight Display  
The Systems Insight Display is an assembly that includes the front panel LEDs, Power On/Standby button,  
and a cable.  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove  
3.  
Remove the access panel ("Access panel" on page 30).  
Removal and replacement procedures 37  
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4.  
5.  
6.  
7.  
8.  
9.  
Remove the front bezel ("Front bezel" on page 27).  
Remove the air baffle ("Air baffle" on page 31).  
Remove fan module 3 ("Fan module" on page 31).  
Remove the multibay backplane assembly ("Multibay backplane assembly" on page 35).  
Disconnect the Systems Insight Display cable.  
Remove the T-15 Torx screw that secures the Systems Insight Display.  
10. Remove the Systems Insight Display.  
To replace the component, reverse the removal procedure.  
PCI riser board assembly  
To remove the component:  
Removal and replacement procedures 38  
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CAUTION: To prevent damage to the server or expansion boards, power down the server and  
remove all AC power cords before removing or installing the PCI riser board assembly.  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle ("Air baffle" on page 31).  
Remove the PCI riser board assembly:  
a. Disconnect any external cables connected to any existing expansion boards.  
b. Loosen the four PCI riser board assembly thumbscrews.  
c. Lift the assembly to unseat the PCI riser boards and remove the assembly.  
To replace the component, reverse the removal procedure.  
PCI-X or PCI Express expansion board  
To remove the component:  
1.  
2.  
3.  
4.  
5.  
Power down the server (on page 25).  
Extend the server from the rack, if applicable ("Extend the server from the rack" on page 25).  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle ("Air baffle" on page 31).  
Remove the PCI riser board assembly ("PCI riser board assembly" on page 38).  
Removal and replacement procedures 39  
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6.  
Remove any expansion board installed in the assembly.  
To replace the component, reverse the removal procedure.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all PCI slots have either an expansion slot cover or an expansion board installed.  
PCI Express riser board  
To remove the component:  
1.  
2.  
3.  
4.  
5.  
6.  
7.  
Power down the server (on page 25).  
Extend the server from the rack, if applicable ("Extend the server from the rack" on page 25).  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle ("Air baffle" on page 31).  
Remove the PCI riser board assembly ("PCI riser board assembly" on page 38).  
Remove all expansion boards. ("PCI-X or PCI Express expansion board" on page 39)  
Remove the two screws securing the riser board to the riser board assembly.  
Removal and replacement procedures 40  
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8.  
Remove the full-length PCI Express riser board from the riser board assembly.  
To replace the component, reverse the removal procedure.  
Integrated HP Smart Array E200i Controller or HP  
Smart Array P400i Controller  
To remove the component:  
1.  
2.  
3.  
4.  
5.  
Power down the server (on page 25).  
Extend the server from the rack (on page 25).  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle ("Air baffle" on page 31).  
Disconnect all cables from the integrated array controller.  
Removal and replacement procedures 41  
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6.  
Disconnect the backplane power cable from the system board.  
7.  
Turn the quarter-turn fasteners and lift the integrated array controller away from the system board.  
To replace the component, reverse the removal procedure.  
DIMMs  
To remove the component:  
1.  
2.  
3.  
4.  
5.  
Power down the server (on page 25).  
Extend the server from the rack (on page 25).  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle ("Air baffle" on page 31).  
Open the DIMM slot latches.  
Removal and replacement procedures 42  
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6.  
Remove the DIMM.  
To replace the component, reverse the removal procedure.  
Heatsink  
To remove the component:  
1.  
2.  
3.  
4.  
5.  
6.  
Power down the server (on page 25).  
Extend the server from the rack (on page 25).  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle ("Air baffle" on page 31).  
Open the heatsink retaining latches.  
Remove the heatsink.  
To replace the heatsink:  
Removal and replacement procedures 43  
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1.  
2.  
Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol  
to evaporate before continuing.  
Apply new grease to the top of the processor in one of the following patterns to ensure even  
distribution.  
CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the  
heatsink is removed from the processor after it has been installed.  
3.  
Install the heatsink.  
4.  
5.  
Install the air baffle ("Air baffle" on page 31).  
Install the access panel ("Access panel" on page 30).  
Processor  
The server supports single- and dual-processor operation. With two processors installed, the server  
supports boot functions through the processor installed in processor socket 1.  
Removal and replacement procedures 44  
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The server uses embedded PPMs as DC-to-DC converters to provide the proper power to each processor.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: To avoid damage to the processor and system board, only authorized personnel  
should attempt to replace or install the processor in this server.  
CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or  
cache sizes. Refer to the label on the processor heatsink for a description of the processor.  
CAUTION: To avoid damage to the system board:  
Do not touch the processor socket contacts.  
Always install the processor socket cover after removing the processor from the socket.  
Do not tilt or slide the processor when lowering the processor into the socket.  
CAUTION: To avoid damage to the processor:  
Handle the processor only by the edges.  
Do not touch the bottom of the processor, especially the contact area.  
CAUTION: To help avoid damage to the processor and system board, do not install the  
processor without using the processor installation tool.  
CAUTION: Removal of the processor or heatsink renders the thermal layer between the  
processor and heatsink useless. A new heatsink must be ordered and installed before  
reinstalling the processor.  
IMPORTANT: Processor socket 1 must be populated at all times or the server does not function.  
To remove a processor:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle ("Air baffle" on page 31).  
Open the heatsink retaining latches.  
Removal and replacement procedures 45  
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6.  
Remove the heatsink.  
7.  
Open the processor retaining latch and the processor socket retaining bracket.  
Removal and replacement procedures 46  
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8.  
Using your fingers, remove the failed processor.  
IMPORTANT: Be sure the replacement processor remains inside the processor installation tool.  
9.  
If the processor has separated from the installation tool, carefully re-insert the processor in the tool.  
10. Align the processor installation tool with the socket and install the spare processor.  
CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides  
on the processor and socket to properly align the processor with the socket.  
Removal and replacement procedures 47  
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11. Press down firmly until the processor installation tool clicks and separates from the processor, and  
then remove the processor installation tool.  
Removal and replacement procedures 48  
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12. Close the processor retaining latch and the processor socket retaining bracket.  
13. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to  
evaporate before continuing.  
14. Apply all the grease to the top of the processor in one of the following patterns to ensure even  
distribution.  
Removal and replacement procedures 49  
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15. Install the heatsink.  
16. Install the air baffle ("Air baffle" on page 31).  
17. Install the access panel ("Access panel" on page 30).  
18. Slide the server into the rack.  
19. Power up the server.  
System battery  
If the server no longer automatically displays the correct date and time, you may need to replace the  
battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.  
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium  
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not  
properly handled. To reduce the risk of personal injury:  
Do not attempt to recharge the battery.  
Do not expose the battery to temperatures higher than 60°C (140°F).  
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.  
Replace only with the spare designated for this product.  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove  
3.  
4.  
Remove the access panel ("Access panel" on page 30).  
Locate the battery on the system board ("System board components" on page 70).  
Removal and replacement procedures 50  
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5.  
Remove the battery.  
IMPORTANT: Replacing the system board battery resets the system ROM to its default  
configuration. After replacing the battery, reconfigure the system through RBSU.  
To replace the component, reverse the removal procedure.  
For more information about battery replacement or proper disposal, contact an authorized reseller or an  
authorized service provider.  
System board  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: To avoid damage to the processor and system board, only authorized personnel  
should attempt to replace or install the processor in this server.  
CAUTION: To prevent possible server malfunction and damage to the equipment,  
multiprocessor configurations must contain processors with the same part number.  
CAUTION: To avoid damage to the system board:  
Do not touch the processor socket contacts.  
Always install the processor socket cover after removing the processor from the socket.  
Do not tilt or slide the processor when lowering the processor into the socket.  
CAUTION: To avoid damage to the processor:  
Handle the processor only by the edges.  
Do not touch the bottom of the processor, especially the contact area.  
Removal and replacement procedures 51  
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CAUTION: To help avoid damage to the processor and system board, do not install the  
processor without using the processor installation tool.  
CAUTION: Removal of the processor or heatsink renders the thermal layer between the  
processor and heatsink useless. A new heatsink must be ordered and installed before  
reinstalling the processor.  
IMPORTANT: Processor socket 1 must be populated at all times or the server does not function.  
IMPORTANT: If upgrading processor speed, update the system ROM before installing the  
processor.  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove  
3.  
4.  
5.  
6.  
7.  
Remove the access panel ("Access panel" on page 30).  
Remove all power supplies ("Hot-plug power supply" on page 29).  
Remove the air baffle ("Air baffle" on page 31).  
Remove the three fan modules. ("Fan module" on page 31)  
Disconnect all cables connected to the system board ("System board components" on page 70). For  
additional information, see "Cabling" ("Cabling" on page 58).  
8.  
9.  
Remove the PCI riser board assembly ("PCI riser board assembly" on page 38).  
10. Remove all DIMMs ("DIMMs" on page 42).  
11. Remove the heatsink ("Heatsink" on page 43).  
Removal and replacement procedures 52  
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12. For each installed processor, open the processor retaining latch and the processor socket retaining  
bracket on the failed system board.  
13. For each installed processor, use your fingers to remove the processor from the failed system board.  
CAUTION: To avoid damage to the system board:  
Do not touch the processor socket contacts.  
Always install the processor socket cover after removing the processor from the socket.  
Do not tilt or slide the processor when lowering the processor into the socket.  
CAUTION: To avoid damage to the processor:  
Handle the processor only by the edges.  
Do not touch the bottom of the processor, especially the contact area.  
Removal and replacement procedures 53  
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14. Remove the failed system board.  
To replace the system board:  
1.  
2.  
Install the spare system board in the server before installing the processor.  
Prepare the processor socket on the spare system board.  
a. Remove the processor socket protective cover.  
Removal and replacement procedures 54  
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b. Open the processor retaining latch and the processor socket retaining bracket.  
3.  
4.  
Install the processor socket cover onto the processor socket of the failed system board.  
Install the processor on the spare system board.  
CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides  
on the processor and socket to properly align the processor with the socket. Refer to the server  
hood label for specific instructions.  
CAUTION: Always install the processor parallel to the system board to avoid damage to the  
pins.  
Removal and replacement procedures 55  
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5.  
Close the processor retaining latch and the processor socket retaining bracket.  
6.  
7.  
Clean the old thermal grease from the processor and heatsink with the alcohol swab. Allow the  
alcohol to evaporate before continuing.  
Apply grease to the top of the processor in one of the following patterns to ensure even distribution.  
CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the  
heatsink is removed from the processor after it has been installed.  
8.  
9.  
Install the heatsink ("Heatsink" on page 43).  
IMPORTANT: To ensure proper cooling, be sure the correct processor air baffle (on page 31)  
is installed at all times.  
Install all components removed from the failed system board.  
IMPORTANT: Install all components with the same configuration that was used on the failed  
system board.  
Removal and replacement procedures 56  
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10. Install all power supplies ("Hot-plug power supply" on page 29).  
11. Install the access panel ("Access panel" on page 30).  
12. Power up the server.  
After you replace the system board, you must re-enter the server serial number and the product ID.  
1.  
2.  
3.  
During the server startup sequence, press the F9 key to access RBSU.  
Select the Advanced Options menu.  
Select Serial Number. The following warning is displayed:  
Warning: The serial number should ONLY be modified by qualified service  
personnel. This value should always match the serial number located on  
the chassis.  
4.  
5.  
6.  
Press the Enter key to clear the warning.  
Enter the serial number.  
Select Product ID. The following warning is displayed.  
Warning: The Product ID should ONLY be modified by qualified service  
personnel. This value should always match the Product ID located on the  
chassis.  
7.  
8.  
9.  
Enter the product ID and press the Enter key.  
Press the Esc key to close the menu.  
Press the Esc key to exit RBSU.  
10. Press the F10 key to confirm exiting RBSU. The server will automatically reboot.  
Removal and replacement procedures 57  
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Cabling  
Cabling overview  
This section provides guidelines that help you make informed decisions about cabling the server and  
hardware options to optimize performance.  
For information on cabling peripheral components, refer to the white paper on high-density deployment at  
CAUTION: When routing cables, always be sure that the cables are not in a position where  
they can be pinched or crimped.  
Array controller cabling  
Depending on the primary controller installed, various cabling configurations exist:  
HP Smart Array E200i Controller cabling (on page 58)  
HP Smart Array P400i Controller cabling (on page 59)  
PCI Smart Array controller cabling (on page 59)  
Battery pack cabling (on page 60)  
HP Smart Array E200i Controller cabling  
CAUTION: When routing cables, use the cable trough between fan modules 1 and 2. Be sure  
the cables do not interfere with fan module installation. Be sure to route the cables around the  
DIMM connectors so as not to interfere with DIMM installation.  
Cabling 58  
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HP Smart Array P400i Controller cabling  
CAUTION: When routing cables, use the cable trough between fan modules 1 and 2. Be sure  
the cables do not interfere with fan module installation. Be sure to route the cables around the  
DIMM connectors so as not to interfere with DIMM installation.  
PCI Smart Array controller cabling  
CAUTION: When routing cables, use the cable trough between fan modules 1 and 2. Be sure  
the cables do not interfere with fan module installation. Be sure to route the cables around the  
DIMM connectors so as not to interfere with DIMM installation.  
IMPORTANT: When using a PCI array controller, be sure to remove the integrated array  
controller.  
Cabling 59  
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Battery pack cabling  
HP Smart Array E200i Controller battery pack cabling  
Cabling 60  
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HP Smart Array P400i Controller battery pack cabling  
Cabling 61  
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Diagnostic tools  
Troubleshooting resources  
The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and  
comprehensive courses of action for fault isolation and identification, error message interpretation, issue  
resolution, and software maintenance on ProLiant servers and server blades. This guide includes problem-  
specific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a  
language:  
Array Diagnostic Utility  
The HP Array Diagnostics Utility is a web-based application that creates a report of all HP storage  
controllers and disk drives. This report provides vital information to assist in identifying faults or conditions  
that may require attention. ADU can be accessed from the SmartStart CD or downloaded from the HP  
HP Instant Support Enterprise Edition  
ISEE is a proactive remote monitoring and diagnostic tool to help manage your systems and devices, a  
feature of HP support. ISEE provides continuous hardware event monitoring and automated notification to  
identify and prevent potential critical problems. Through remote diagnostic scripts and vital system  
configuration information collected about your systems, ISEE enables fast restoration of your systems.  
Install ISEE on your systems to help mitigate risk and prevent potential critical problems.  
For more information on ISEE, refer to the HP website  
To download HP ISEE, visit the HP website (http://www.hp.com/hps/hardware/hw_downloads.html).  
For installation information, refer to the HP ISEE Client Installation and Upgrade Guide  
Diagnostic tools 62  
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HP Insight Diagnostics survey functionality  
HP Insight Diagnostics (on page 64) provides survey functionality that gathers critical hardware and  
software information on ProLiant servers.  
This functionality supports operating systems that may not be supported by the server. For operating  
systems supported by the server, see the HP website (http://www.hp.com/go/supportos).  
If a significant change occurs between data-gathering intervals, the survey function marks the previous  
information and overwrites the survey data files to reflect the latest changes in the configuration.  
Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can  
be installed through the HP PSP.  
NOTE: The current version of SmartStart provides the memory spare part numbers for the  
server. To download the latest version, see the HP website (http://www.hp.com/support).  
HP ROM-Based Setup Utility  
RBSU is a configuration utility embedded in ProLiant servers that performs a wide range of configuration  
activities that can include the following:  
Configuring system devices and installed options  
Enabling and disabling system features  
Displaying system information  
Selecting the primary boot controller  
Configuring memory options  
Language selection  
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD  
Integrated Management Log  
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each  
event with 1-minute granularity.  
You can view recorded events in the IML in several ways, including the following:  
From within Survey Utility  
From within operating system-specific IML viewers  
o
o
o
For NetWare: IML Viewer  
For Windows®: IML Viewer  
For Linux: IML Viewer Application  
From within the iLO 2 user interface  
From within HP Insight Diagnostics (on page 64)  
Diagnostic tools 63  
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For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack.  
Automatic Server Recovery  
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such  
as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System  
Management driver, also known as the Health Driver, is loaded. When the operating system is  
functioning properly, the system periodically resets the timer. However, when the operating system fails,  
the timer expires and restarts the server.  
ASR increases server availability by restarting the server within a specified time after a system hang or  
shutdown. At the same time, the HP SIM console notifies you by sending a message to a designated  
pager number that ASR has restarted the system. You can disable ASR from the HP SIM console or  
through RBSU.  
HP Systems Insight Manager  
HP SIM is a web-based application that allows system administrators to accomplish normal administrative  
tasks from any remote location, using a web browser. HP SIM provides device management capabilities  
that consolidate and integrate management data from HP and third-party devices.  
IMPORTANT: You must install and use HP SIM to benefit from the Pre-Failure Warranty for  
processors, SAS and SCSI hard drives, and memory modules.  
For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or  
the HP SIM website (http://www.hp.com/go/hpsim).  
HP Insight Diagnostics  
HP Insight Diagnostics is a proactive server management tool, available in both offline and online  
versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify  
server installations, troubleshoot problems, and perform repair validation.  
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the  
OS is not running. To run this utility, launch the SmartStart CD.  
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and  
other related data needed for effective server management. Available in Microsoft® Windows® and  
Linux versions, the utility helps to ensure proper system operation.  
For more information or to download the utility, refer to the HP website  
Web-Based Enterprise Service  
WEBES enables administrators to manage hardware events proactively, either locally or online. The  
service provides real-time multiple event analysis, crash analysis, and notification, locally through SMTP  
and remotely through ISEE for OpenVMS, Tru64, and Microsoft® Windows® operating system binary  
error logs.  
For more information, refer to the HP website (http://h18000.www1.hp.com/support/svctools/).  
Diagnostic tools 64  
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Open Services Event Manager  
OSEM is a standalone tool that performs real-time reactive and proactive service event filtering, analysis,  
and notification. The tool gathers event data from SNMP traps or information provided over an HTTP  
interface and notifies an administrator or HP through SMTP and ISEE.  
For more information, refer to the HP website (http://h18000.www1.hp.com/support/svctools/).  
Diagnostic tools 65  
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Component identification  
Front panel components  
Item  
1
Description  
Hard drive bay 5 (optional)*  
Hard drive bay 6 (optional)*  
Multibay drive bay  
HP Systems Insight Display  
USB connector  
2
3
4
5
6
Video connector  
7
Hard drive bay 4  
8
Hard drive bay 3  
9
Hard drive bay 2  
10  
11  
Hard drive bay 1  
Serial pull tab  
*An optional controller is required when the server is configured with six hard drives.  
Component identification 66  
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Front panel LEDs and buttons  
Item  
Description  
Status  
1
Power On/Standby button  
and system power LED  
Green = System is on.  
Amber = System is shut down, but power is still applied.  
Off = Power cord is not attached, power supply failure has  
occurred, no power supplies are installed, facility power is not  
available, or disconnected power button cable.  
2
3
UID button/LED  
Blue = Identification is activated.  
Flashing blue = System is being remotely managed.  
Off = Identification is deactivated.  
Internal health LED  
Green = System health is normal.  
Amber = System health is degraded. To identify the component in  
a degraded state, see "HP Systems Insight Display and LEDs (on  
page 71)."  
Red = System health is critical. To identify the component in a  
critical state, see "HP Systems Insight Display and LEDs (on page  
71)."  
Off = System health is normal (when in standby mode).  
Green = Power supply health is normal.  
4
5
External health LED  
(power supply)  
Amber = Power redundancy failure occurred.  
Off = Power supply health is normal when in standby mode.  
Green = Network link exists.  
NIC 1 link/activity LED  
Flashing green = Network link and activity exist.  
Off = No link to network exists.  
If power is off, the front panel LED is not active. View the LEDs on  
the RJ-45 connector for status by referring to the rear panel LEDs  
Component identification 67  
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Item  
Description  
Status  
6
NIC 2 link/activity LED  
Green = Network link exists.  
Flashing green = Network link and activity exist.  
Off = No link to network exists.  
If power is off, the front panel LED is not active. View the LEDs on  
the RJ-45 connector for status by referring to the rear panel LEDs  
Rear panel components  
Item  
1
Description  
PCI Express expansion slot 1, low-profile, half-length  
PCI Express expansion slot 2  
Power supply bay 2  
Power supply bay 1  
NIC 2 connector  
2
3
4
5
6
NIC 1 connector  
7
Keyboard connector  
Mouse connector  
8
9
Video connector  
10  
11  
12  
13  
Serial connector  
USB connector  
USB connector  
iLO 2 NIC connector  
Component identification 68  
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Rear panel LEDs and buttons  
Item  
Description  
Status  
1
iLO 2 NIC activity  
LED  
Green = Activity exists.  
Flashing green = Activity exists.  
Off = No activity exists.  
Green = Link exists.  
2
3
iLO 2 NIC link  
LED  
Off = No link exists.  
10/100/1000  
Green = Activity exists.  
Flashing green = Activity exists.  
Off = No activity exists.  
Green = Link exists.  
NIC 1 activity LED  
4
5
10/100/1000  
NIC 1 link LED  
10/100/1000  
NIC 2 activity LED  
Off = No link exists.  
Green = Activity exists.  
Flashing green = Activity exists.  
Off = No activity exists.  
Green = Link exists.  
6
7
10/100/1000  
NIC 2 link LED  
UID button/LED  
Off = No link exists.  
Blue = Identification is activated.  
Flashing blue = System is being managed  
remotely.  
Off = Identification is deactivated.  
Green = Normal  
8
9
Power supply 2  
LED  
Off = System is off or power supply has failed  
Green = Normal  
Power supply 1  
LED  
Off = System is off or power supply has failed  
Component identification 69  
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System board components  
Item  
1
Description  
System battery  
2
NMI jumper  
3
System maintenance switch (SW1)  
Internal USB connector  
Multibay connector  
4
5
6
Power switch connector  
DIMM slots (1-4)  
7
8
Fan module 3 connectors  
Fan module 2 connectors  
DIMM slots (5-8)  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
Fan module 1 connectors  
SFF hard drive backplane power connector  
Integrated Smart Array controller connector  
Power supply connector 1  
Power supply connector 2  
Processor socket 2  
Processor socket 1 (populated)  
PCI riser board connector 2  
PCI riser board connector 1  
Component identification 70  
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System maintenance switch  
Position  
Default  
Function  
S1  
Off  
Off = iLO 2 security is enabled.  
On = iLO 2 security is disabled.  
Off = System configuration can be modified.  
On = System configuration is locked and cannot be modified.  
Reserved  
S2  
Off  
S3  
S4  
S5  
Off  
Off  
Off  
Reserved  
Off = Power-on password is enabled.  
On = Power-on password is disabled.  
Off = Normal  
S6  
Off  
On = ROM treats system configuration as invalid.  
Reserved  
S7  
S8  
Off  
Off  
Reserved  
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase  
all system configuration settings from both CMOS and NVRAM.  
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to  
properly configure the server or data loss could occur.  
NMI jumper  
The NMI jumper allows administrators to perform a memory dump before performing a hard reset. Crash  
dump analysis is an essential part of eliminating reliability problems, such as hangs or crashes in OSs,  
device drivers, and applications. Many crashes can freeze a system, requiring you to do a hard reset.  
Resetting the system erases any information that would support root cause analysis.  
Systems running Microsoft® Windows® experience a blue-screen trap when the OS crashes. When this  
happens, Microsoft® recommends that system administrators perform an NMI event by temporarily  
shorting the NMI header with a jumper. The NMI event enables a hung system to become responsive  
again.  
HP Systems Insight Display and LEDs  
The display provides status for all internal LEDs and enables diagnosis with the access panel installed.  
Component identification 71  
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To view the LEDs, access the HP Systems Insight Display.  
LED  
Status  
Normal  
Failure  
Off  
Amber  
For additional information about these LEDs, see "HP Systems Insight Display LEDs and internal health LED  
combinations (on page 72)."  
NOTE: The HP Systems Insight Display LEDs represent the system board layout.  
HP Systems Insight Display LEDs and internal health  
LED combinations  
When the internal health LED on the front panel illuminates either amber or red, the server is experiencing  
a health event. Combinations of illuminated system LEDs and the internal health LED indicate system  
status.  
The front panel health LEDs indicate only the current hardware status. In some situations, HP SIM may  
report server status differently than the health LEDs because the software tracks more system attributes.  
HP Systems Insight  
Internal health  
Status  
Display LED and color LED color  
Processor failure, socket X Red  
One or more of the following conditions may exist:  
(amber)  
Processor in socket X has failed.  
Processor X is required yet not installed in the socket.  
Processor X is unsupported.  
Amber  
Processor in socket X is in a pre-failure condition.  
Processor failure, both  
sockets (amber)  
Red  
Processor types are mismatched.  
Component identification 72  
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HP Systems Insight  
Internal health  
Status  
Display LED and color LED color  
PPM failure (amber)  
Red  
Red  
Integrated PPM has failed.  
DIMM failure, slot X  
One or more of the following conditions may exist:  
(amber)  
DIMM in slot X has failed.  
DIMM in slot X is an unsupported type, and no valid  
memory exists in another bank.  
Amber  
One or more of the following conditions may exist:  
DIMM in slot X has reached single-bit correctable  
error threshold.  
DIMM in slot X is in a pre-failure condition.  
DIMM in slot X is an unsupported type, but valid  
memory exists in another bank.  
DIMM failure, all slots  
(amber)  
Red  
No valid or usable memory is installed in the system.  
Overtemperature (amber) Amber  
The health driver has detected a cautionary temperature  
level.  
Red  
The server has detected a critical temperature level.  
Riser interlock (amber)  
Fan module (amber)  
Fan module (amber)  
Red  
The PCI riser board assembly is not seated properly.  
A redundant fan has failed.  
Amber  
Red  
The minimum fan requirements are not being met in one  
or more of the fan modules. One or more fans have failed  
or are missing.  
SAS and SATA device numbers  
Four hard drive configuration  
Component identification 73  
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Six hard drive configuration  
SAS and SATA hard drive LEDs  
Item  
1
Description  
Fault/UID LED (amber/blue)  
Online LED (green)  
2
Component identification 74  
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SAS and SATA hard drive LED combinations  
Online/activity  
LED (green)  
Fault/UID LED  
(amber/blue)  
Interpretation  
On, off, or flashing Alternating amber  
and blue  
The drive has failed, or a predictive failure alert has been  
received for this drive; it also has been selected by a  
management application.  
On, off, or flashing Steadily blue  
The drive is operating normally, and it has been selected by a  
management application.  
On  
Amber, flashing  
regularly (1 Hz)  
A predictive failure alert has been received for this drive.  
Replace the drive as soon as possible.  
On  
Off  
The drive is online, but it is not active currently.  
Flashing regularly Amber, flashing  
(1 Hz) regularly (1 Hz)  
Do not remove the drive. Removing a drive may terminate the  
current operation and cause data loss.  
The drive is part of an array that is undergoing capacity  
expansion or stripe migration, but a predictive failure alert has  
been received for this drive. To minimize the risk of data loss, do  
not replace the drive until the expansion or migration is  
complete.  
Flashing regularly Off  
(1 Hz)  
Do not remove the drive. Removing a drive may terminate the  
current operation and cause data loss.  
The drive is rebuilding, or it is part of an array that is undergoing  
capacity expansion or stripe migration.  
Flashing irregularly Amber, flashing  
regularly (1 Hz)  
The drive is active, but a predictive failure alert has been  
received for this drive. Replace the drive as soon as possible.  
Flashing irregularly Off  
The drive is active, and it is operating normally.  
Off  
Steadily amber  
A critical fault condition has been identified for this drive, and  
the controller has placed it offline. Replace the drive as soon as  
possible.  
Off  
Off  
Amber, flashing  
regularly (1 Hz)  
A predictive failure alert has been received for this drive.  
Replace the drive as soon as possible.  
Off  
The drive is offline, a spare, or not configured as part of an  
array.  
Component identification 75  
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Fan locations  
Item  
1
Description  
Fan module 1  
Fan module 2  
Fan module 3  
2
3
Component identification 76  
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Specifications  
Environmental specifications  
Specification  
Temperature range*  
Operating  
Value  
10°C to 35°C (50°F to 95°F)  
-40°C to 70°C (-40°F to 158°F)  
Shipping  
Maximum wet bulb temperature 28°C (82.4°F)  
Relative humidity  
(noncondensing)**  
Operating  
10% to 90%  
5% to 95%  
Non-operating  
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to  
3048 m (10,000 ft) is applicable. No direct sunlight allowed.  
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for  
storage corresponds to a pressure minimum of 70 KPa.  
Server specifications  
Specification  
Dimensions  
Height  
Value  
4.32 cm (1.70 in)  
Depth  
69.22 cm (27.25 in)  
42.62 cm (16.78 in)  
17.92 kg (39.50 lb)  
Width  
Weight (maximum: two  
processors, two power  
supplies, six hard drives)  
Weight (minimum: one  
processor, one power supply,  
no hard drives)  
14.51 kg (32.00 lb)  
14.06 kg (31.00 lb)  
Weight (no drives installed)  
Input requirement  
Rated input voltage  
Rated input frequency  
Rated input current  
Rated input power  
BTUs per hour  
100 VAC to 240 VAC  
50 Hz to 60 Hz  
7.1A (at 120 VAC); 3.5A (at 240 VAC)  
852 W  
2910 (at 120 VAC); 2870 (at 240 VAC)  
Power supply output  
Specifications 77  
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Specification  
Value  
Rated steady-state power  
700 W  
Hot-plug power supply calculations  
For hot-plug power supply specifications and calculators to determine electrical and heat loading for the  
server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.com/configurator/).  
DDR2 SDRAM DIMM specifications  
CAUTION: Be sure to install DIMMs in the proper configuration. Refer to the Documentation  
CD.  
Item  
Description  
Size*  
Width  
512-MB, 1-GB, 2-GB, 4-GB  
64 bits  
*Use only 512-MB, 1-GB, 2-GB, or 4-GB, 72-bit wide, 1.8-V, PC2-5300 Unbuffered ECC DDR2 DIMMs. Use HP  
DDR2 DIMMs only.  
1.44-MB diskette drive specifications  
Specification  
Dimensions  
Height  
Value  
12.7 mm (0.5 in)  
96 mm (3.8 in)  
130 mm (5.1 in)  
Green = On  
Width  
Depth  
LEDs (front panel)  
Read/write capacity per  
diskette  
High density  
1.44 MB  
720 KB  
Low density  
Drives supported  
Drive height  
1
One-third height  
300 rpm  
Drive rotation  
Transfer rate  
High  
500 Kb/s  
250 Kb/s  
512  
Low  
Bytes/sector  
Sectors per track (high/low)  
Tracks per side (high/low)  
Access times  
18/9  
80/80  
Specifications 78  
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Specification  
Value  
Track-to-track (high/low)  
Average (high/low)  
Setting time  
3 ms/6 ms  
169 ms/94 ms  
15 ms  
Latency average  
Cylinders (high/low)  
Read/write heads  
100 ms  
80/80  
2
CD-ROM drive specifications  
Specification  
Value  
Disk formats  
CD-ROM (modes 1 and 2); mixed mode (audio and data combined); CD-DA;  
Photo CD (single/multiple-session), CD-XA ready; CDi ready  
Capacity  
Block size  
550 MB (mode 1, 12 cm)  
640 MB (mode 2, 12 cm)  
2368, 2352 bytes (mode 0)  
2352, 2340, 2336, 2048 bytes (mode 1)  
2352, 2340, 2336, 2048 bytes (mode 2)  
Dimensions  
Height  
12.7 mm (0.50 in)  
132.08 mm (5.20 in)  
132.08 mm (5.20 in)  
0.34 kg (0.75 lb)  
Depth  
Width  
Weight  
Data transfer rate  
Sustained  
150 KB/s (sustained 1X), 1500/3600 KB/s (10X to 24X)  
16.6 MB/s  
Burst  
Access times (typical)  
Full stroke  
300 ms  
Random  
140 ms  
Diameter  
12 cm, 8 cm (4.70 in, 3.15 in)  
1.2 mm (0.05 in)  
1.6 µm (6.3 × 10-7 in)  
128 KB  
Thickness  
Track pitch  
Cache/buffer  
Startup time  
Stop time  
< 10 s  
< 5 s (single); < 30 s (multisession)  
Laser parameters  
Type  
Semiconductor laser GaAs  
700 ± 25 nm  
Wave length  
Divergence angle  
Output power  
53.5° ± 1.5°  
0.14 mW  
Specifications 79  
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Specification  
Operating conditions  
Temperature  
Value  
5°C to 45°C (41°F to 118°F)  
5% to 90%  
Humidity  
DVD-ROM drive specifications  
Specification  
Value  
Disk formats  
DVD (single and double layer), DVD-5, DVD-9, DVD-10, DVD-R, CD-ROM Mode  
1 & 2, CD-DA, CD-XA (Mode 2, Form 1 & 2), CD-I (Mode 2, Form 1 & 2), CD-I  
ready, CD-Bridge, CD-R, PhotoCD (single and multi-session)  
Capacity  
4.7 GB (DVD-5), 8.5 GB (DVD-9), 9.4 GB (DVD10), 550 Mb (Mode 1, 12 cm),  
640 Mb (Mode 2, 12 cm), 180 Mb (8 cm)  
Block size  
2352 bytes (mode 0)  
2352, 2340, 2336, 2048 bytes (mode 1)  
2352, 2340, 2336, 2048 bytes (mode 2)  
2048 bytes (DVD)  
Dimensions  
Height  
12.7 mm (0.50 in)  
132.08 mm (5.20 in)  
132.08 mm (5.20 in)  
0.34 kg (0.75 lb)  
Depth  
Width  
Weight  
Data transfer rate  
Sustained  
4463 - 10,800 KB/s (8X CAV DVD mode), 150 KB/s (sustained 1X CD-ROM),  
1552 3600 KB/s (24X CAV CD-ROM)  
Burst  
16.6 MB/s with DMA support  
Access times (typical)  
Full stroke  
<200 ms CD  
<300 ms DVD  
Random  
<110 ms CD  
<180 ms DVD  
Diameter  
Thickness  
Track pitch  
12 cm, 8 cm (4.70 in, 3.15 in)  
1.2 mm (0.05 in)  
0.74 µm (3.15 × 10-7 in) DVD-ROM  
1.6 µm (6.3 × 10-7 in) CD-ROM  
Cache/buffer  
Startup time  
Stop time  
128 KB  
< 10 s  
< 5 s (single); < 30 s (multisession)  
Laser parameters  
Type  
Semiconductor laser GaAs  
700 ± 25 nm  
Wave length  
Divergence angle  
Output power  
53.5° ± 1.5°  
0.14 mW  
Specifications 80  
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Specification  
Operating conditions  
Temperature  
Value  
5°C to 45°C (41°F to 118°F)  
5% to 90%  
Humidity  
SAS hard drive specifications  
Item  
36-GB SAS drive  
36,420 MB  
25.4 mm (1.0 in)  
SAS  
72-GB SAS drive  
73,408 MB  
25.4 mm (1.0 in)  
SAS  
146-GB SAS drive  
146,815 MB  
25.4 mm (1.0 in)  
SAS  
Capacity  
Height  
Interface  
Transfer rate  
Rotational speed  
Bytes per sector  
Logical blocks  
Operating temperature  
3 Gb/sec  
3 Gb/sec  
3 Gb/sec  
15,000 rpm  
512  
15,000 rpm  
512  
15,000 rpm  
512  
71,132,959  
143,374,737  
286,749,487  
10º to 35ºC (50º to 95ºF) 10º to 35ºC (50º to 95ºF) 10º to 35ºC (50º to 95ºF)  
SATA hard drive specifications  
Item  
80-GB SATA  
160-GB SATA  
250-GB SATA  
500-GB SATA  
500,107 MB  
Capacity  
Height  
80,026 MB  
160,041 MB  
250,059 MB  
2.611 cm (1.028  
in)  
2.611 cm (1.028  
in)  
2.611 cm (1.028  
in)  
2.611 cm (1.028 in)  
Interface  
Serial ATA  
1.5 Gb/sec  
7,200 rpm  
512  
Serial ATA  
1.5 Gb/sec  
7,200 rpm  
512  
Serial ATA  
1.5 Gb/sec  
7,200 rpm  
512  
Serial ATA  
1.5 Gb/sec  
7,200 rpm  
512  
Transfer rate  
Rotational speed  
Bytes per sector  
Logical blocks  
156,301,488  
5º to 55ºC  
(41º to 131ºF)  
312,581,808  
5º to 55ºC  
(41º to 131ºF)  
488,397,168  
5º to 55ºC  
(41º to 131ºF)  
976,773,168  
5º to 55ºC  
(41º to 131ºF)  
Operating  
temperature  
Specifications 81  
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Acronyms and abbreviations  
ABEND  
abnormal end  
ASR  
Automatic Server Recovery  
BBWC  
battery-backed write cache  
DDR  
double data rate  
IML  
Integrated Management Log  
NIC  
network interface controller  
NVRAM  
non-volatile memory  
OSEM  
Open Services Event Manager  
PCI Express  
Peripheral Component Interconnect Express  
PCI-X  
peripheral component interconnect extended  
PPM  
processor power module  
PSP  
ProLiant Support Pack  
Acronyms and abbreviations 82  
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RBSU  
ROM-Based Setup Utility  
SAS  
serial attached SCSI  
SATA  
serial ATA  
SFF  
small form-factor  
SIM  
Systems Insight Manager  
UID  
unit identification  
USB  
universal serial bus  
Acronyms and abbreviations 83  
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Index  
A
E
additional information 62  
ADU (Array Diagnostic Utility) 62  
electrostatic discharge 23  
environmental requirements 77  
environmental specifications 77  
array controller, cabling 58, 59  
array controller, removing 41  
Array Diagnostic Utility (ADU) 62  
ASR (Automatic Server Recovery) 64  
Automatic Server Recovery (ASR) 64  
extending server from rack 25  
external health LED 67  
F
fan modules 31  
features 66  
B
backplane, SAS 35  
front panel buttons 67  
front panel LEDs 67  
battery-backed write cache battery pack 33, 60  
bezel, front 27  
H
hard drive LEDs 74, 75  
C
hard drives, determining status of 74, 75  
cabling, battery pack 60  
cabling, controller 58, 59  
cautions 24  
CD-ROM drive 79  
component identification 66, 74  
components, mechanical 16  
components, system 19  
connectors 66, 67  
HP Insight Diagnostics 63, 64  
HP ProLiant Essentials Foundation Pack 64  
HP Systems Insight Manager, overview 64  
I
CSR (customer self repair) 5  
customer self repair (CSR) 5  
iLO connector 71  
IML (Integrated Management Log) 63  
Insight Diagnostics 63, 64  
integrated array controller 41  
Integrated Management Log (IML) 63  
D
diagnostic tools 62, 64  
diagnostics utility 64  
DVD-ROM drive 80  
L
LED, iLO NIC 69  
Index 84  
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system components 19  
LEDs, hard drive 74, 75  
LEDs, NIC 67, 69  
LEDs, power button/LED board 67  
LEDs, unit identification (UID) 67  
system maintenance switch 71  
system power LED 67, 71  
Systems Insight Display 71  
Systems Insight Display LEDs 71, 72  
Systems Insight Manager 64  
M
T
management tools 62  
mechanical components 16  
multibay backplane assembly 35  
multibay blank, removing 34  
multibay/SAS backplane, removing 35  
troubleshooting 62  
U
utilities, deployment 63  
N
NIC LEDs 67  
W
P
PCI array controllers, cabling 58  
PCI riser board assembly 38  
power LEDs, system 67  
Power On/Standby button 25, 67  
power supply blank 30  
PPM failure LEDs 73  
processor 44  
R
RBSU (ROM-Based Setup Utility) 63  
S
safety considerations 23  
SAS backplane 36  
SAS hard drive 27  
SAS hard drive LEDs 74, 75  
SATA drives 73  
SATA hard drive LEDs 74, 75  
specifications, environmental 77  
specifications, server 77, 78  
static electricity 23  
symbols on equipment 23  
system board 51  
system board components 71  
Index 85  
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