HP Hewlett Packard All in One Printer 16500B User Manual

Errata

16500B/16501A Logic Analysis System Service Guide

Title & Document Type:

16500-97011

Manual Part Number:

August 1994

Revision Date:

HP References in this Manual

This manual may contain references to HP or Hewlett-Packard. Please note that Hewlett-

Packard's former test and measurement, semiconductor products and chemical analysis

businesses are now part of Agilent Technologies. We have made no changes to this

manual copy. The HP XXXX referred to in this document is now the Agilent XXXX.

For example, model number HP8648A is now model number Agilent 8648A.

About this Manual

We’ve added this manual to the Agilent website in an effort to help you support your

product. This manual provides the best information we could find. It may be incomplete

or contain dated information, and the scan quality may not be ideal. If we find a better

copy in the future, we will add it to the Agilent website.

Support for Your Product

Agilent no longer sells or supports this product. You will find any other available

product information on the Agilent Test & Measurement website:

www.tm.agilent.com

Search for the model number of this product, and the resulting product page will guide

you to any available information. Our service centers may be able to perform calibration

if no repair parts are needed, but no other support from Agilent is available.

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HP 16500B/16501A Logic Analysis System

The HP 16500B is the mainframe of the Logic Analysis System, and the HP 16501A is

the expansion frame. The HP 16500B/16501A is of modular structure using plug-in

cards with a wide range of data acquisition and stimulus capabilities.

Features

Some of the main features of the HP 16500B/16501A are as follows:

• Modular mainframe with five card slots

• Expansion frame, which expands the total system card slots to ten

• Touchscreen user interface

• 86 Mbyte hard disk drive

• High-density 3.5-inch flexible disk drive

• Color monitor

• Intermodule triggering and time correlation of acquired data

• HP-IB, RS-232C or optional LAN interfaces for hardcopy output to a printer or

controller interface

Service Strategy

The service strategy for this instrument is the replacement of defective assemblies.

This service guide contains information for finding a defective assembly by testing

and servicing the HP 16500B/16501A.

This instrument can be returned to Hewlett-Packard for all service work, including

troubleshooting. Contact your nearest Hewlett-Packard Sales Office for more details.

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The HP 16500B Logic Analysis System

iii

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In This Book

This book is the service guide for the HP 16500B/16501A Logic Analysis System and is divided

into eight chapters.

Chapter 1 contains information about the instrument and includes accessories for the

instrument, specifications and characteristics of the instrument, and a list of the equipment

required for servicing the instrument.

Chapter 2 tells how to prepare the instrument for use.

Chapter 3 gives instructions on how to test the performance of the instrument.

Chapter 4 contains calibration instructions for the instrument.

Chapter 5 contains self-tests and flowcharts for troubleshooting the instrument.

Chapter 6 tells how to replace the instrument and assemblies of the instrument, and how to

return them to Hewlett-Packard.

Chapter 7 lists replaceable parts, shows an exploded view, and gives ordering information.

Chapter 8 explains how the instrument works and what the self-tests are checking.

This book also contains information about the HP 16500L interface module when using an

expansion frame or an external monitor. For information about using the interface module

with a local area network, refer to the manuals for the HP 16500L.

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Contents

1 General Information

Accessories 1–2

Specifications 1–3

Characteristics 1–3

Recommended Test Equipment 1–6

2 Preparing for Use

To inspect the logic analysis system 2–2

To apply power 2–3

To operate the user interface 2–3

To set the line voltage 2–4

To degauss the display 2–5

To clean the logic analysis system 2–5

To test the logic analysis system 2–5

To install modules 2–6

To install the HP 16500L interface module 2–7

To connect the HP 16501A Expansion Frame 2–9

To connect an external monitor 2–10

3 Testing Performance

To perform the power-up tests 3–3

To perform the self-tests 3–4

4 Calibrating and Adjusting

To prepare the instrument 4–3

To access the test patterns 4–4

To adjust geometry 4–5

To adjust focus, landing, and convergence 4–6

To adjust white balance 4–13

5 Troubleshooting

To use the flowcharts 5–2

To check the power-up self-tests 5–18

To run the self-tests 5–19

To check the video signals 5–22

To check the power supply LEDs 5–23

To check the power supply voltages 5–24

To test the flexible disk drive voltages 5–25

To test the hard disk drive voltages 5–27

To test the expansion frame interface 5–29

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Contents

6 Replacing Assemblies

To remove and replace the

Optional modules or filler panels 6–3

Covers 6–4

Flexible disk drive 6–5

Power supply 6–6

Rear fan 6–8

Side fan 6–9

HP 16500L interface module 6–10

Hard disk drive 6–12

Microprocessor board (CPU) 6–13

SIMM memory 6–14

Expansion interface board 6–15

Mother board 6–16

Front-panel board 6–18

Color display assembly 6–19

To return assemblies 6–22

7 Replaceable Parts

Replaceable Parts Ordering 7–2

Replaceable Parts List Description 7–3

HP 16500B Exploded View and Replaceable Parts 7–4

HP 16501A Exploded View and Replaceable Parts 7–9

8 Theory of Operation

Block-Level Theory 8–3

The HP 16500B Logic Analysis System 8–3

The Microprocessor Board 8–6

The Power-Up Routine 8–9

The Power-Up Screen 8–9

Power-Up Self-Tests 8–10

Power-Up Tasks 8–10

The System Configuration Menu 8–12

Self-Tests Description 8–13

Power-Up Self-Tests 8–13

Functional Performance Verification Tests 8–15

HP-IB 8–18

RS-232C 8–19

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Accessories 1–2

Specifications 1–3

Characteristics 1–3

Recommended Test Equipment 1–6

General Information

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General Information

This chapter lists the accessories, the specifications and characteristics, and the

recommended test equipment.

Accessories

The following accessories are supplied with the HP 16500B/16501A Logic Analysis System.

Accessories Supplied

Qty

Training Kit

Setting Up The System Guide

User’s Reference

Programming Reference

Service Guide

RS-232C Loopback Connector

Power cord

Disk pouch containing backup composite software

Feeling Comfortable With Logic Analyzers

Feeling Comfortable with Digitizing Oscilloscopes

Filler Panels

Quantity depends on how many modules are

ordered with the HP 16500B/16501A

Accessories Available

Other accessories available for the HP 16500B/16501A Logic Analysis System are listed in the

Accessories for HP Logic Analyzers brochure.

1–2

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General Information

Specifications

The specifications are the performance standards against which the product is tested. There

are no specifications for the HP 16500B or the HP 16501A.

Characteristics

These characteristics are not specifications, but are included as additional information. The

following characteristics are typical for the HP 16500B/16501A system.

Hard Disk Drive

Capacity 86 Mbyte unformatted; Formatted as a Microsoft DOS disk drive IDE Interface

Bus.

Flexible Disk Drive

Programmability

Capacity 1.44 Mbyte formatted Microsoft DOS or LIF supported.

Instrument settings and operating modes, including automatic measurements, may be

remotely programmed via RS-232C, HP-IB (IEEE-488), or optional HP 16500L (Ethernet).

Hardcopy Output

Printers Supported HP ThinkJet, HP QuietJet, HP LaserJet, HP PaintJet, HP Deskjet,

HP Deskjet C, Epson and Epson-compatible (for example, Epson FX-80) via RS-232C or

HP-IB.

RS-232C Configurations Protocols: XON/XOFF, Hardware; Data bits: 8; Stop bits: 1, 1

1/2, 2; Parity: none, odd, or even; Baud rates: 110, 300, 600, 1200, 2400, 4800, 9600, 19200.

HP-IB Interface Functions SH1, AH1, T5, TE0, L3, LE0, SR1, RL1, PP1, DC1, DT1, C0

and E2.

Input/Output

Rear Panel BNCs:

Port-in

User selectable: TTL, ECL or user defined; Zin = 4 kΩ ; Maximum Vin = -6.0 V at

1.5 mA to +6 V at 1.6 mA.

Port-out

Output signal is active high, TTL output level, high > 2 V into 50 Ω, low < 0.4 V

into 50 Ω.

Intermodule Bus (IMB) Run Control Oscilloscope, timing, state, and pattern generation can be armed by Group

Characteristics

Run. Modules can run concurrently or be armed in series. Each module can arm one or

more modules.

Mixed Display Mode Any timing or oscilloscope waveform displays can be mixed.

State listings can be included with waveforms in the State/Timing Mixed Mode display.

Acquiring Data for Mixed Displays To obtain a mixed display, multiple modules must

be armed through the IMB. To include state listings in mixed mode displays, state time

tagging must be on.

1–3

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General Information

Characteristics

Time Interval Accuracy Between Modules Equals the sum of the channel-to-channel

time interval accuracies of each module used in the measurement, for a deskewed

measurement.

Time Correlation Resolution 2 ns (500 MHz).

Operating

Temperature

Environment

Instrument

Disk Media

Probes and Cables

0 °C to 50 °C (+32 °F to 122 °F).

10 °C to 40 °C (+50 °F to 104 °F).

0 °C to 65 °C (+32 °F to 149 °F).

Humidity

Instrument

up to 95% relative humidity at 40 °C (104 °F).

Disk media and hard drive

8% to 80% relative humidity at 40 °C (104 °F).

Altitude Up to 4600 m (15 000 ft). Hard drive to 300 m (10,000 ft.).

Vibration

Operating Random vibration 5-500Hz, 10 minutes per axis, ~ 2.41 g (rms).

Non-operating Random vibration 5-500Hz, 10 minutes per axis, ~ 2.4 g (rms); and

swept sine resonant search, 5-500Hz, 0.75g (0-peak), 5 minute dwell at 4 resonances

per axis.

Weight

HP 16500B

Net 18.1 kg (40 lbs) + [0.7 kg (1.6 lbs) x number of optional cards installed].

Shipping 25.9 kg (57 lbs) + [3.6 kg (8 lbs) x number of optional cards installed].

HP 16501A

Net 12.2 kg (27 lbs) + [0.7 kg (1.6 lbs) x number of optional cards installed].

Shipping 19.9 kg (44 lbs) + [3.6 kg (8 lbs) x number of optional cards installed].

Power Requirements HP 16500B 115 V/230 V, -22% to +10%, 48 to 66 Hz, 475 W max.

HP 16501A 115 V/230 V, -22% to +10%, 48 to 66 Hz, 420 W max.

1–4

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General Information

Characteristics

Dimensions

Refer to the following figure for dimensional detail.

Dimensional Detail

1–5

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General Information

Recommended Test Equipment

Equipment Required

Equipment

Critical Specifications

Recommended

Model/Part

Use^*

Oscilloscope

Voltmeter

RS-232C Loopback

Connector

100 MHz Bandwidth

HP 54600A

HP 3478A

HP Part Number

01650-63202

*A = Adjustment P = Performance Tests

T = Troubleshooting

1–6

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To inspect the logic analysis system 2–2

To apply power 2–3

To operate the user interface 2–3

To set the line voltage 2–4

To degauss the display 2–5

To clean the logic analysis system 2–5

To test the logic analysis system 2–5

To install modules 2–6

To install the HP 16500L interface module 2–7

To connect the HP 16501A Expansion Frame 2–9

To connect an external monitor 2–10

Preparing for Use

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Preparing For Use

This chapter gives you instructions for preparing the logic analysis system for use.

Power Requirements

The logic analysis system mainframe requires a power source of either 115 Vac or 230

Vac, –22 % to +10 %, single phase, 48 to 66 Hz, 475 W maximum power.

The logic analysis system expansion frame requires a power source of either 115 Vac

or 230 Vac, –22 % to +10 %, single phase, 48 to 66 Hz, 420 W maximum power.

Operating Environment

The operating environment is listed in chapter 1. Note the noncondensing humidity

limitation. Condensation within the instrument can cause poor operation or

malfunction. Provide protection against internal condensation.

The logic analysis system will operate at all specifications within the temperature and

humidity range given in chapter 1. However, reliability is enhanced when operating it

within the following ranges:

• Temperature: +20 °C to +35 °C (+68 °F to +95 °F)

• Humidity: 20% to 80% noncondensing

Storage

Store or ship the logic analysis system in environments within the following limits:

• Temperature: -40 °C to + 75 °C

• Humidity: Up to 90% at 65 °C

• Altitude: Up to 15,300 meters (50,000 feet)

Protect the system from temperature extremes which cause condensation on the

instrument.

To inspect the logic analysis system

1 Inspect the shipping container for damage.

If the shipping container or cushioning material is damaged, keep them until you have

checked the contents of the shipment and checked the instrument mechanically and

electrically.

Hazardous voltages exist in this instrument. To avoid electrical shock, do not apply power to

a damaged instrument.

W AR N I N G

2–2

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Preparing for Use

To apply power

2 Check the supplied accessories.

Accessories supplied with the logic analysis system are listed in "Accessories" in chapter 1.

3 Inspect the product for physical damage.

Check the logic analysis system and the supplied accessories for obvious physical or

mechanical defects. If you find any defects, contact your nearest Hewlett-Packard Sales

Office. Arrangements for repair or replacement are made, at Hewlett-Packard’s option,

without waiting for a claim settlement.

To apply power

1 Check that the line voltage selector, located on the rear panel, is on the correct

setting and the correct fuse is installed.

See also, "To set the line voltage" in this chapter.

2 Connect the power cord to the instrument and to the power source.

This instrument is equipped with a three-wire power cable. When connected to an

appropriate ac power outlet, this cable grounds the instrument cabinet. The type of power

cable plug shipped with the instrument depends on the country of destination. Refer to

chapter 7, "Replaceable Parts," for option numbers of available power cables.

3 Turn on the instrument line switch located on the rear panel, then turn on the power

standby switch located on the front panel.

To operate the user interface

• To select a field on the mainframe screen, use the touchscreen.

For more information about the logic analysis system interface, refer to the

HP 16500B/16501A Logic Analysis System User’s Reference.

• To set the HP-IB address or to configure for RS-232C, refer to the

HP 16500B/16501A Logic Analysis System User’s Reference.

2–3

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Preparing for Use

To set the line voltage

When shipped from HP, the line voltage selector is set and an appropriate fuse is installed for

operating the instrument in the country of destination. To operate the instrument from a

power source other than the one set, perform the following steps.

1 Turn the front panel power switch to the STBY position, then turn the power switch

to the Off position. Remove the power cord from the instrument.

2 Replace the main fuse with a 5 A/250 V fuse for 230 V operation, or a 10 A/125 V fuse

for 115 V operation.

3 Set the rear panel line select switch for the desired voltage.

4 Reconnect the power cord, turn on the rear panel power switch, then continue

normal operation.

5 If your system includes an HP 16501A Expansion Frame, repeat this procedure for it.

The expansion frame has only one power switch, and that switch is located on the rear panel.

Line Voltage Selection

2–4

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Preparing for Use

To degauss the display

• If the mainframe has been subjected to strong magnetic fields, the CRT might

become magnetized and display data might become distorted. To correct this

condition, degauss the CRT with a conventional, external-television-type degaussing

coil.

To clean the logic analysis system

• With the instrument turned off and unplugged, use mild soap and water to clean the

front and cabinet of the system. Harsh soap might damage the water-base paint.

To test the logic analysis system

The logic analysis system does not require calibration or adjustment.

• If you require a test to initially accept the operation, perform the self-tests in

chapter 3, "Testing Performance."

• If the logic analysis system does not operate correctly, go to the beginning of

chapter 5, "Troubleshooting."

2–5

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Preparing for Use

To install modules

The following steps give general instructions for installing modules into the mainframe or the

expansion frame of the system.

Electrostatic discharge can damage electronic components. Use grounded wriststraps and

mats when performing any service to modules.

C AU T I O N

1 Turn off the frame power switch, then unplug the power cord. Disconnect any input

or output connections.

2 Plan your module configuration.

Refer to the manuals of individual modules for configuration information.

3 Loosen the thumb screws.

Cards or filler panels below the slots intended for installation do not have to be removed.

Starting from the top, loosen the thumb screws on filler panels and cards that need to be

moved.

4 Starting from the top, pull the cards and filler panels that need to be moved halfway

out.

All multicard modules will be cabled together. To prevent damage to the cables and

connectors, pull these cards out together.

5 Remove the cards and filler panels.

Remove the cards or filler panels that are in the slots intended for the module installation.

Some modules for the logic analysis system require calibration if you move them to a different

slot. Refer to the manuals of individual modules for calibration information.

6 Install the module.

You may need to push all other cards into the card cage, but not completely in, to get them

out of the way for installing the module.

Refer to the manuals of individual modules for cabling information.

7 Slide the complete module into the frame, but not completely in.

Each card is firmly seated and tightened one at a time in step 9.

8 Position all cards and filler panels so that the endplates overlap.

9 Seat the cards and tighten the thumbscrews.

Starting with the bottom card, firmly seat the cards into the backplane connector of the

mainframe. Keep applying pressure to the center of the card endplate while tightening the

thumbscrews finger-tight. Repeat this for all cards and filler panels starting at the bottom and

moving to the top.

For correct air circulation, filler panels must be installed in all unused card slots. Correct air

circulation keeps the instrument from overheating. Keep any extra filler panels for future use.

C AU T I O N

See Also

10 Plug in the system, then turn it on.

When you turn on the power switch, the logic analysis system performs power-up tests. After

the power-up tests are complete, the screen will show your system configuration.

Service Guides for the individual modules.

2–6

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Preparing for Use

To install the HP 16500L interface module

The HP 16500L interface module is required to connect the HP 16501A Expansion Frame to

the HP 16500B mainframe.

Hazardous voltages exist on the power supply, the CRT, and the CRT driver board of the

HP 16500B mainframe. To avoid electrical shock, disconnect the power from the instrument

before performing the following procedures. After disconnecting the power, wait at least six

minutes for the capacitors on the power supply board and the CRT driver board to discharge

before servicing the instrument. However, if the AC LED on the power supply has any

illumination, a significant charge remains on the power supply capacitors.

W AR N I N G

C AU T I O N

Electrostatic discharge can damage electronic components. Use grounded wriststraps and

mats when performing any service to this module or to the HP 16500B Logic Analysis System.

For correct orientation of the cables, match the slots on the cable connectors and on the

board connectors.

1 Remove power from the HP 16500B mainframe, then remove the optional modules,

the four rear feet, and the top and bottom covers of the mainframe.

2 Remove the sheetmetal plate on the rear of the mainframe covering the slot where

the HP 16500L interface module will be installed.

With the interface module installed, you will not use the plate. Save the plate to use in case

the interface module is removed.

3 Remove the cable connecting the CRT module to the CPU board.

To release the cable, push the tabs on the board connector to the outside of the connector.

With the interface module installed, you will not use this cable. Save the cable to use in case

the interface module is removed.

If you need more room to replace the CRT cable, you can remove the hard disk drive. Removing

the hard disk is not necessary, but gives you more room for replacing the CRT cable. The hard

disk is connected with four screws.

4 Connect one end of the new 40-pin cable to the CRT module.

Push the cable connector into the board connector until the tabs lock in the cable.

If you removed the hard disk drive, replace it before going to the next step.

2–7

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Preparing for Use

To install the HP 16500L interface module

5 Slide the interface module into the mainframe through the slot in the rear panel.

6 Install the screws connecting the interface module to the mainframe.

Two screws through the top of the interface module connect it to the sheetmetal plate, and

four screws through the rear plate of the interface module connect it to the rear panel of the

mainframe.

7 Connect the end of the 40-pin CRT cable to the interface module.

8 Connect the 80-pin cable to the CPU board and to the interface module.

a Slide the 80-pin cable halfway through the rear slot of the card cage between the

interface module and the CPU board.

b Connect the cable to the CPU board.

c Connect the cable to the interface module.

9 Connect the 10-pin cable to the CPU board and to the interface module.

10 Replace the top and bottom covers, the optional modules, and the rear feet of the

mainframe.

11 Turn on the system.

a Connect a power cord to the frame.

b Turn on the line switch located on the rear panel the frame.

c Turn on the power standby switch located on the front panel of the mainframe.

When the power-up tests are complete, the mainframe screen shows "Ethernet" in the

Communications menu.

2–8

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Preparing for Use

To connect the HP 16501A Expansion Frame

The HP 16501A Expansion Frame includes an interface cable and requires an HP 16500L

interface module to connect to the HP 16500B mainframe. To install the expansion frame,

you need to install the interface module into the mainframe, then connect the cable from the

module to the expansion frame.

Electrostatic discharge can damage electronic components. Use grounded wriststraps and

mats when performing any service to this card.

C AU T I O N

1 Turn off the mainframe power switch, then unplug the power cord. Disconnect any

input connections.

2 Verify that the line select switch located on the rear panel of the expansion frame is

in the off position.

3 Install the HP 16500L interface module into the mainframe.

The procedure for installing the HP 16500L is on page 2–7.

4 Connect the interface cable to the expansion frame and to the interface module in

the mainframe.

To ensure correct insertion, the 68-pin "D" connectors on each end of the interface cable are

asymmetric in shape. They only fit into their respective ports on the cards when oriented to

match the shape of the ports.

When connecting the interface cable, you will hear two clicks. Make sure the cable connector

is properly seated into the port by pulling the connector without pressing the release tabs. If

the connector is properly seated, it will remain connected to the port.

5 Turn on the system.

a Connect a power cord to each frame.

b Turn on the line switch located on the rear panel of each frame.

c Turn on the power standby switch located on the front panel of the mainframe.

When the power-up tests are complete, the mainframe screen shows "Master

Frame" in a blue field.

2–9

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Preparing for Use

To connect an external monitor

The following tables define the signal available for external monitors at the HP 16500L

connector and pin numbers.

HP 16500L Output Signal For External Monitors

Horizontal deflection (fh)

Vertical deflection (fv)

Resolution

25.0 kHz

59.95 Hz

576 x 368 x dots x lines (WxH)

0.714 VP-P, positive

75 ohm , analog

RGB video

Impedance

External Sync Signal

H TTL, negative 3.2 µS;

W TTL, negative, 120 µS

Connector Pins

Pin number

Signal

Pin number

Signal

Red

6,7,8,10

Ground

Green

Blue

Horizontal Sync

Vertical Sync

1 Connect your monitor to the HP 16500L interface module installed into the

HP 16500B mainframe.

2 If your monitor needs adjusting, follow the manufacturer’s instructions.

Connector for

external monitor

2–10

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To perform the power-up tests 3–3

To perform the self-tests 3–4

Testing Performance

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Testing Performance

To ensure the logic analysis system is operating correctly, you can perform software

tests (self-tests) on the system. Directions for performing the software tests are

given in this chapter.

This chapter normally tells you how to test the performance of the logic analysis

system against the specifications listed in chapter 1. Because there are no

specifications for the HP 16500B/16501A, there are no performance verification tests.

Self-Tests

The self-tests listed in this chapter check the functional operation of the mainframe

and the expansion frame. Self-tests for the optional modules installed in the frames

are listed in the individual module Service Guides.

There are two types of self-tests: self-tests that automatically run at power-up, and

self-tests that you select on the screen. For descriptions of the tests, refer to chapter

8, "Theory of Operation."

Perform the self-tests as an acceptance test when receiving the logic analysis system

or when the logic analysis system is repaired.

If a test fails, refer to chapter 5, "Troubleshooting."

Test Interval

There is no recommended test interval for the HP 16500B mainframe or the

HP 16501A expansion frame. However, each of the HP 16500-series option modules

has performance verification tests and therefore require a periodic verification of

specifications. Refer to the Service Guides of the individual modules for more

information.

The Logic Analysis System Interface

To select a field on the HP 16500B screen, use the touchscreen. For more

information about the logic analysis system interface, refer to the

HP 16500B/16501A Logic Analysis System User’s Reference.

3–2

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Testing Performance

To perform the power-up tests

The logic analysis system automatically performs power-up tests when you apply power to the

instrument. The revision number of the boot ROM shows in the upper-right corner of the

screen during these power-up tests. As each test completes, either "passed" or "failed" prints

on the screen in front of the name of each test.

1 Disconnect all inputs, then insert a formatted disk into the flexible disk drive.

2 Let the instrument warm up for a few minutes, then cycle power by turning off then

turning on the power switch.

If the instrument is not warmed up, the power-up test screen will complete before you can

view the screen.

3 As the tests complete, check if they pass or fail.

The Flexible Disk Test reports No Disk if a disk is not in the disk drive.

If a power-up self-test fails, refer to chapter 5, "Troubleshooting."

Performing Power-Up Self-Tests

passed

ROM Test

RAM Test

Interrupt Test

Display Test

HIL Controller Test

Front-Panel Test

Touchscreen Test

Correlator Test

Hard Disk Test

Flexible Disk Test

Loading Module Files

3–3

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Testing Performance

To perform the self-tests

The self-tests verify the correct operation of the logic analysis system. Self-tests can

be performed all at once or one at a time. While testing the performance of the logic

analysis system, run the self-tests all at once.

1 If you just did the power-up self-tests, go to step 2.

If you did not just do the power-up self-tests, disconnect all inputs, then turn on the

power switch. Wait until the power-up tests are complete.

2 In the System Configuration menu, select Configuration, then select Test.

3 Select the box labeled Load Test System.

4 Select Test System, then select Mainframe Test from the pop-up menu.

3–4

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Testing Performance

To perform the self-tests

5 Install a formatted disk that is not write protected into the flexible disk drive.

Connect an RS-232C loopback connector onto the RS-232C port.

6 Select All System Tests.

You can run all tests at one time by running All System Tests. To see more details about each

test, you can run each test individually. This step shows how to run all tests at once.

The status of the tests will change from Untested to Passed or Failed. If a test fails, refer to

chapter 5, "Troubleshooting."

The Color Display Test is not normally needed. The screens are primarily used when the

color display assembly requires adjusting. For the adjustment procedure, refer to chapter 4,

"Calibrating and Adjusting."

7 Exit the mainframe tests.

a In the Mainframe Test menu, select Mainframe Test, then select Test System.

b Select Configuration, then select Exit Test in the pop-up menu.

c Select the field close to the center of the screen to exit the test system and to load the

mainframe operating system.

After the operating system is loaded, the System Configuration menu is displayed.

3–5

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3–6

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To prepare the instrument 4–3

To access the test patterns 4–4

To adjust geometry 4–5

To adjust focus, landing, and convergence 4–6

To adjust white balance 4–13

Calibrating and Adjusting

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Calibrating and Adjusting

This chapter normally gives you instructions for calibrating and adjusting the logic

analysis system. Because the HP 16500B/16501A requires no calibration, only

adjustment instructions are included.

Adjustments

The only adjustments to the logic analysis system are adjustments to the color CRT

monitor assembly.

Use the following procedures to adjust the CRT module to compensate for magnetic

influences causing misconvergence.

Hazard voltages exist on the power supply, the CRT, and the CRT driver board. To avoid

electrical shock, read and follow the Safety and Warning considerations at the end of this

manual before performing adjustment procedures.

W AR N I N G

Adjustment Interval

DO NOT PERFORM THESE ADJUSTMENTS AS A PART OF ROUTINE

CALIBRATIONS. The following procedures are provided only for the few extreme

cases where either the earth’s magnetic field or the user’s environment cause an

unusable display due to misconvergence that cannot be corrected by degaussing the

entire CRT screen.

DO NOT perform the procedures in this chapter before first degaussing the CRT

screen using the rear-panel degaussing switch. In extreme cases of magnetism, it

may be necessary to degauss the CRT using a conventional external television-type

degaussing coil.

Adjustment Personnel

It is recommended that these adjustments be performed only by qualified personnel

who are familiar with color CRT convergence procedures.

Equipment Required

The instrument firmware supplies the display patterns necessary for adjustment.

The only tool required is a nonmetallic adjustment tool:

• Sony Part Number 4-367-065-01

• HP Part Number 8710-1355

4–2

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Calibrating and Adjusting

To prepare the instrument

1 Remove the rear feet and the covers from the mainframe.

2 Before starting the adjustments, mark the position where the potentiometers are set.

This helps in returning the adjustments to their original positions if it becomes necessary to

restart the procedure.

3 During any of the following CRT adjustments, the CRT module must face west.

4 Use the following chart to guide you with the CRT adjustment procedure.

The following CRT adjustments are broken down into adjustment groups. The adjustment

group sequence must be followed in order because of interaction and dependency. The

adjustment group sequence is shown in the adjustment flow diagram below. There will be

cases where not all of the adjustments groups will be used. For example, if the Geometry

Adjustment Group corrects the problem, this will be the only group used.

Colo

CRT

Mod

ule

Adju

stme

Flow

Diag

ram

4–3

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Calibrating and Adjusting

To access the test patterns

Some procedures on the following pages ask you to access test patterns. This procedure tells

you how to access them and how to exit the test.

1 In the System Configuration menu, touch Configuration, then select Test in the

pop-up menu.

2 Touch the field near the center of the screen to load the Test System.

3 In the Test System Configuration menu, touch Test System, then select Mainframe

Test in the pop-up menu.

The screen displays the Mainframe Test menu.

4 Touch the Color Display Test field to display the first test pattern, which is the

white, cross-hatch pattern.

5 Touch Continue to see the next test pattern.

With every touch of the Continue field, the next test pattern will be displayed. When

Continue is selected from the black raster pattern, the Mainframe Test menu will be displayed.

Notice that the status of the Display field changes to Tested.

6 To exit the test system, touch the Mainframe Test field, then touch the Test System.

Touch Configuration, select test, then touch the field near the center of the screen to

exit the test system.

4–4

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Calibrating and Adjusting

To adjust geometry

1 Display the white cross-hatch test pattern on the CRT.

From the Color Display Test menu, select the white, cross-hatch pattern.

2 Preset the front panel brightness control, the top of the two controls to the left of

the display, maximum clockwise.

3 Preset the front panel contrast control, the bottom of the two controls to the left of

the display, to the mechanical center.

4 Preset H.SUB SHIFT (RV006) and V.SUB SHIFT (RV008), located on the bottom PC

board, to the mechanical centers.

All of the following adjustment potentiometers are located on the PC board on the left side of

the display.

5 Adjust the display size. Measure with a flexible ruler.

Adjust H.SIZE (RV504) for a 161 mm (6.34 in.) width.

•

Adjust V.HEIGHT (RV50) for a 120.5 mm (4.74 in.) height.

•

6 Center the pattern.

Adjust V.CENT (RV510) for vertical centering.

•

Adjust H.CENT (RV503) for horizontal centering.

•

7 Adjust PIN AMP (RV506) to eliminate pincushion distortion in the vertical lines of

the cross-hatch pattern as shown in the next figure.

8 Remove the left, bottom rail of the mainframe.

The left, bottom rail must be removed in order to access the next adjustment.

9 Adjust PIN PHASE (RV505) to eliminate pin phase distortion in the vertical lines of

the cross-hatch pattern as shown in the next figure.

10 Reinstall the bottom rail.

11 Adjust TOP PIN (RV511) so that the top horizontal line is parallel with the center

horizontal line.

12 Adjust BOTTOM PIN (RV512) so that the bottom horizontal line is parallel with the

center horizontal line.

4–5

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Calibrating and Adjusting

To adjust focus, landing, and convergence

Once you have started, you will have to do all three of the procedures in this group: the focus,

the landing, and the convergence adjustments.

Initial Preparation

1 Loosen the deflection yoke clamp screw.

2 Remove the rear and side fans.

Refer to chapter 6, "Replacing Assemblies."

Focus Adjustment

Geometry adjustments must be performed before making the focus adjustment.

1 Display the white, cross-hatch test pattern on the display.

From the Color Display Test menu, select the white, cross-hatch pattern.

2 Adjust FOCUS (RV701), located on the rear PC board, for best overall focus.

4–6

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Calibrating and Adjusting

To adjust focus, landing, and convergence

Landing Adjustment

1 Turn the front panel BRIGHTNESS control fully clockwise.

2 Degauss the CRT by momentarily pressing the DEGAUSS switch located on the

instrument rear panel.

In some cases, the user’s environment or shipping environment may have caused high levels of

magnetization in the CRT. In this case, to completely degauss the CRT you may need to use a

conventional television-type degaussing coil.

3 Set the purity magnet tabs to the mechanical center. Refer to the next figure.

4 Display a green raster test pattern on the display.

From the Color Display Test menu, select the green raster.

In the next steps, while moving the deflection yoke forward and rearward, rotate the yoke as

necessary to keep the edges of the raster parallel to the sides of the display.

6 Move the deflection yoke rearward until the left edge of the raster turns red and the

right side of the raster turns blue.

Red

Green

Blue

7 Adjust the purity magnets until green is in the center of the raster with red and blue

bands evenly distributed on the sides.

4–7

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Calibrating and Adjusting

To adjust focus, landing, and convergence

8 Move the deflection yoke forward until the entire raster is green.

Landing adjustment is easier if the yoke is moved all the way forward and then moved back

until the raster is completely green.

9 Using the Color Purity key, replace the green raster with red and then blue raster,

each time checking for proper landing adjustment (color purity of each).

10 If the landing is not correct in step 9, repeat steps 6 through 9 for the best

compromise.

Purity control

corrects this area

Deflection yoke

position corrects

these areas

11 If the landing is not correct in step 10, readjust purity magnets for best landing of

each color.

12 When the landing adjustment is complete, tighten the deflection yoke clamp screw

just enough to keep the yoke from moving. DO NOT over tighten or you might

damage the CRT.

4–8

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Calibrating and Adjusting

To adjust focus, landing, and convergence

Static Convergence

1 Temporarily disconnect the power from the instrument.

2 Remove the PC board shield cover from the rear of the Color CRT Module by prying

evenly on all four sides.

3 Reapply power.

4 Display the white, cross-hatch test pattern on the CRT.

From the Color Display Test menu, select the white, cross-hatch pattern.

5 Preset front panel brightness control, the top of the two controls to the left of the

display, maximum clockwise.

6 Preset front panel contrast control, the bottom of the two controls to the left of the

display, to the mechanical center.

7 Check the four dots which are located around the center intersection of the

cross-hatch pattern for coincidence of the blue, red, and green dots. If the dots are

not coincident, adjust H.STAT (RV703) located on the rear PC board to obtain

horizontal coincidence and V.STAT (RV803) located on the bottom PC board to

obtain vertical coincidence.

V.STAT

Center dot

H.STAT

Due to interaction, the BEAM LANDING will need to be readjusted if either the H.STAT or

V.STAT adjustments are made. Once the BEAM LANDING is re-adjusted, repeat step 7 above

if necessary to obtain the center screen coincidence of the dots.

4–9

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Calibrating and Adjusting

To adjust focus, landing, and convergence

Dynamic Convergence

1 Display the white, cross-hatch test pattern on the CRT.

From the Color Display Test menu, select the white, cross-hatch test pattern.

2 Adjust Y BOW (RV805) located on the bottom PC board to eliminate red, green, and

blue bowing at the top and bottom of the center vertical line.

3 Adjust Y CROSS (RV804) located on the bottom PC board to eliminate red, green,

and blue orthogonal misalignment at the top and bottom of the center vertical line.

4–10

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Calibrating and Adjusting

To adjust focus, landing, and convergence

4 Adjust V TOP (RV801) and V BOTTOM (RV802) to obtain coincidence of the red,

blue, and green at the intersection of the top and bottom horizontal lines with the

center vertical line. The VTOP and VBOTTOM adjustments are located on the

bottom PC board. Use the next two figures for V TOP and V BOTTOM respectively.

4–11

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Calibrating and Adjusting

To adjust focus, landing, and convergence

5 Adjust H.AMP (RV807) located on the bottom PC board for equal amounts of

misconvergence at the right and left sides of the screen.

6 Adjust H.TILT (RV806) located on the bottom PC board for coincidence of red,

green, and blue at the right and left sides of the screen.

7 If you are finished with the CRT adjustments, replace the fans.

If you need to adjust the white balance, which is the next procedure, you will

replace the fans after completing that procedure.

4–12

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Calibrating and Adjusting

To adjust white balance

1 Provide a blank display on the CRT.

From the Color Display Test menu, select a blank (colorless) raster.

2 Preset the front panel brightness and contrast controls to their mechanical centers.

3 On the bottom PC board, set the following adjustments to their mechanical centers.

SUB BRT (RV901)

•

SUB CONT (RV902)

•

4 On the bottom PC board, set the following adjustments to their mechanical centers.

G. DRIVE (RV921)

•

B. DRIVE (RV931)

•

R. DRIVE (RV911)

•

5 On the rear PC board, set the following adjustments fully counterclockwise.

G. BKG (RV721)

•

B. BKG (RV731)

•

R. BKG (RV711)

•

6 Adjust the SCREEN (RV702) located on the rear PC board until either the red, green,

or blue raster just starts to become visible. Note which color becomes visible first

and do not adjust the background control (BKG) for that color in the next step.

7 Adjust the other two background controls for the best white balance.

8 From the Color Display Test menu, select the white raster test pattern.

9 Set the front panel brightness control to maximum.

10 On the bottom PC board, adjust the DRIVE controls (RV921, RV931 and RV911) for

the best white balance.

For a white balance reference, use an average piece of white photocopy paper and compare

the white on the CRT to the paper.

11 Repeat steps 1-3 followed by 6-10 until satisfied with the white balance.

Essentially, from this point the procedure is as follows:

a With a blank screen, the front panel brightness set to center, and SCREEN (RV702) set

for minimum background, adjust the BKG controls (G.-RV721, B.-RV731, and

R.-RV711) for the best white balance.

b With a white raster and the front panel brightness set to maximum, adjust the DRIVE

controls (G.-RV921, B.-RV931, and R.-RV911) for best white balance.

c Repeat until satisfied with the white balance.

12 Replace the side and rear fans.

Refer to chapter 6, "Replacing Assemblies."

4–13

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4–14

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To use the flowcharts 5–2

To check the power-up self-tests 5–18

To run the self-tests 5–19

To check the video signals 5–22

To check the power supply LEDs 5–23

To test the power supply voltages 5–24

To test the flexible disk drive voltages 5–25

To test the hard disk drive voltages 5–27

To test the expansion frame interface 5–29

Troubleshooting

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Troubleshooting

This chapter helps you troubleshoot the logic analysis system to find defective

assemblies. The troubleshooting consists of flowcharts, self-test instructions, and

tests. This information is not intended for component-level repair.

If you suspect a problem, start at the top of the first flowchart. During the

troubleshooting instructions, the flowcharts will direct you to perform other tests.

The other tests are located in this chapter after the flowcharts.

The service strategy for this instrument is the replacement of defective assemblies.

This instrument can be returned to Hewlett-Packard for all service work, including

troubleshooting. Contact your nearest Hewlett-Packard Sales Office for more details.

Electrostatic discharge can damage electronic components. Use grounded wriststraps and

mats when you perform any service to this instrument or to the cards in it.

C AU T I O N

To use the flowcharts

Flowcharts are the primary tool used to isolate defective assemblies. The flowcharts refer to

other tests to help isolate the trouble. The circled letters on the charts indicate connections

with the other flowcharts. Start your troubleshooting at the top of the first flowchart.

5–2

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Troubleshooting

To use the flowcharts

Main Troubleshooting Flowchart 1

5–3

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Troubleshooting

To use the flowcharts

Note: The HP 16500L

is in the System

Configuration menu if

"Master Frame" is in a

blue field and

"Ethernet" is in the

Communications field.

Main Troubleshooting Flowchart 2

5–4

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Troubleshooting

To use the flowcharts

Color Module Troubleshooting Flowchart 3

5–5

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Troubleshooting

To use the flowcharts

Color Module Troubleshooting Flowchart 3A (continued)

5–6

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Troubleshooting

To use the flowcharts

Power-Up Troubleshooting Flowchart 4

5–7

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Troubleshooting

To use the flowcharts

System Start Troubleshooting Flowchart 5

5–8

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Troubleshooting

To use the flowcharts

Mainframe Tests Troubleshooting Flowchart 6

5–9

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Troubleshooting

To use the flowcharts

Power Supply Troubleshooting Flowchart 7

5–10

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Troubleshooting

To use the flowcharts

HIL Troubleshooting Flowchart 8

5–11

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Troubleshooting

To use the flowcharts

Flexible Disk Drive Troubleshooting Flowchart 9

5–12

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Troubleshooting

To use the flowcharts

Hard Disk Drive Troubleshooting Flowchart 10

5–13

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Troubleshooting

To use the flowcharts

RS-232C Troubleshooting Flowchart 11

5–14

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Troubleshooting

To use the flowcharts

Intermodule Troubleshooting Flowchart 12

5–15

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Troubleshooting

To use the flowcharts

Expansion Frame Troubleshooting Flowchart 13

5–16

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Troubleshooting

To use the flowcharts

Note: Compare the

specifications of the

monitor against the

specifications of the

video signal as a way

to determine

compatibility (ability

to synch). Video

signal specifications

are listed in "To

connect an external

monitor" in chapter 2.

External Monitor Troubleshooting Flowchart 14

5–17

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Troubleshooting

To check the power-up self-tests

The logic analysis system automatically performs power-up self-tests when you apply power

to the instrument. The revision number of the operating system shows in the upper-right

corner of the screen during these power-up tests. As each test completes, either "passed" or

"failed" appears on the screen in front of the name of each test.

1 Disconnect all inputs, then insert a formatted disk into the flexible disk drive.

2 Let the instrument warm up for a few minutes, then cycle the power by turning off

and turning on the power switch.

If the instrument is not warmed up, the power-up test screen will complete before you can

view the screen.

3 As the tests complete, check if they pass or fail, then return to the flowcharts.

The Flexible Disk Test reports No Disk if a disk is not in the disk drive. Refer to the tables

below for the screen listing after the tests are complete and for power-up error messages.

Power-Up Self-Test Screen Listing

Performing Power-Up Self-Tests

passed

ROM Test

passed

RAM Test

passed

Interrupt Test

Display Test

passed

HIL Controller Test

Front-Panel Test

Touchscreen Test

Correlator Test

Hard Disk Test

Flexible Disk Test

passed

Loading Module Files

Error Messages at Power-Up

Message

Cause

Remedy

FATAL ERRORS ENCOUNTERED,

BOOT HALTED

A power-up test failed.

Follow the troubleshooting

flowcharts.

SYSTEM DISK NOT FOUND

The mainframe operating system

cannot be found on the hard disk

drive.

Install the operating system

software onto the hard disk drive.

Touchscreen power-up test

impaired

The touchscreen operation is

impaired.

Follow the troubleshooting

flowcharts. The touchscreen might

still operate with a minimal loss of

functionality.

See Also

"The Power-Up Routine" in chapter 8.

5–18

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Troubleshooting

To run the self-tests

Self-tests identify the correct operation of major, functional subsystems of the instrument.

You can run all self-tests without accessing the interior of the instrument. If a self-test fails,

the troubleshooting flowcharts instruct you to change a part of the instrument.

1 If you just did the power-up self-tests, go to step 2.

If you did not just do the power-up self-tests, disconnect all inputs, then turn on the

power switch. Wait until the power-up tests are complete.

2 In the System Configuration menu, select Configuration, then select Test.

3 Select the box labeled Load Test System.

4 Select Test System, then select Mainframe Test from the pop-up menu.

5–19

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Troubleshooting

To run the self-tests

5 Select ROM Test. The ROM Test screen is displayed.

You can run all tests at one time by running All System Tests. To see more details about each

test, you can run each test individually. This example shows how to run an individual test.

6 Select Run, then select Single.

To run a test continuously, select Repetitive. Select Stop to halt a repetitive test.

For a Single run, the test runs one time, and the screen shows the results.

5–20

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Troubleshooting

To run the self-tests

7 To exit the ROM Test, select Done. Note that the status changes to Passed or Failed.

8 Install a formatted disk that is not write-protected into the flexible disk drive.

Connect an RS-232C loopback connector onto the RS-232C port. Run the remaining

All System Tests in the same manner.

The Color Display Test is not part of this troubleshooting. The Color Display Test is used in

chapter 4, "Calibrating and Adjusting," to adjust the color display.

The Option Board Test is used later in this chapter to check signals to the HP 16501A

Expansion Frame.

9 Exit the mainframe tests.

a Select Done from any test screen.

b Select Mainframe Test, then select Test System in the pop-up menu.

c Select Configuration, then select Exit Test in the pop-up menu.

d Select the box near the center of the screen to exit the test system.

10 If you are performing the self-tests as part of the troubleshooting flowchart, return

to the flowchart.

5–21

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Troubleshooting

To check the video signals

Refer to chapter 6, "Replacing Assemblies," for instructions on how to remove or replace

covers and assemblies.

Hazard voltages exist on the power supply, the CRT, and the CRT driver board. This

procedure is to be performed by service-trained personnel aware of the hazards involved,

such as fire and electrical shock.

W AR N I N G

1 Turn off the instrument, then remove the bottom cover.

2 On the color assembly, disconnect the cable that connects the microprocessor

board to the color display assembly.

3 Turn on the instrument, then wait for it to power up.

4 Probe the cable for the horizontal sync, vertical sync, and display data signals.

The horizontal and vertical sync signals are TTL levels that resemble the figure.

The display data signals have a baseline of approximately −1.7 V and vary in amplitude from

the baseline voltage to approximately 125 mV, depending on the characteristics of the colors

displayed.

5 Reconnect the cable, then return to the color display assembly flowchart.

Cable Pin Numbers

Pin Numbers

Signal

Vertical Sync

Horizontal Sync

Red Display Data

Green Display Data

Blue Display Data

Sync Signals

Vertical

Horizontal

5–22

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Troubleshooting

To check the power supply LEDs

Refer to chapter 6, "Replacing Assemblies," for instructions to remove or replace covers and

assemblies.

Hazard voltages exist on the power supply, the CRT, and the CRT driver board. This

procedure is to be performed by service-trained personnel aware of the hazards involved,

such as fire and electrical shock.

W AR N I N G

1 Turn off the instrument, then remove the top cover.

2 Apply power to the instrument.

3 Check the power supply LEDs.

4 Note problems with the power supply, then return to the power supply flowchart.

5–23

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Troubleshooting

To check the power supply voltages

Refer to chapter 6, "Replacing Assemblies," for instructions to remove or replace covers and

assemblies.

Hazard voltages exist on the power supply, the CRT, and the CRT driver board. This

procedure is to be performed by service-trained personnel aware of the hazards involved,

such as fire and electrical shock.

W AR N I N G

1 Turn off the instrument, disconnect the power cord, then remove the top cover.

2 Apply power to the instrument.

3 Using a DVM, measure the power supply voltages.

4 Note problems with the power supply, then return to the power supply flowchart.

Power Supply Voltages

Supply/Signal

Voltage

Supply/Signal

Voltage

1-5

5 volt

+5 V

Ground sense

Power valid

0 V

+5 volt remote sense

+3.5 volt

+5 V

7-9

+3.5 V

−3.25 volt remote sense

−3.25 volt

−3.25 V

+3.5 volt remote sense

+12 volt

+3.5 V

+12 V

24-30

−3.25 V

+2.5 V

−5.2 volt current limit

−5.2 volt remote sense

−12 volt

−12 V

−5.2 V

Not connected

33-37

−5.2 volt

Remote on/off

−5.2 V

+12 V

14-20

Ground

0 V

5–24

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Troubleshooting

To test the flexible disk drive voltages

Refer to chapter 6, "Replacing Assemblies," for instructions to remove or replace covers and

assemblies.

Hazard voltages exist on the power supply, the CRT, and the CRT driver board. This

procedure is to be performed by service-trained personnel aware of the hazards involved,

such as fire and electrical shock.

W AR N I N G

Equipment Required

Equipment

Critical Specification

Recommended

Model/Part

Digitizing Oscilloscope

> 100 MHz Bandwidth

HP 54600A

1 Turn off the instrument, then remove the power cable. Remove the instrument

cover and the flexible disk drive.

2 Reconnect the disk drive cable to the rear of the disk drive. Turn the disk drive over

so that the solder connections of the cable socket are accessible.

3 Connect the power cable, then turn on the instrument.

4 In the Mainframe Test menu, select the Flexible Disk Test. Insert a disk that has

enough available bytes to run the test in the disk drive, then select Run-Repetitive.

Refer to "To run the self-tests" in this chapter if you need help accessing the test menu.

5–25

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Troubleshooting

To test the flexible disk drive voltages

5 Check for the following voltages and signals using an oscilloscope.

Disk Drive Voltages

Signal

Description

Signal

Description

Signal Description

Ground

Write Gate

Ground

Disk Change

Ground

Motor On

Ground

Direction

Ground

Step

Track 00

Ground

High Density

Write Protect

Ground

+5 V

Read Data

Ground

Index

+5 V

Ground

Write Data

Ground

Side Select

Ground

Drive Select

+5 V

Ready

6 Select Stop, and turn off the logic analyzer. Remove the power cable.

7 Disconnect the disk drive cable and reinstall the disk drive in the mainframe.

8 Reconnect the disk drive cable and install the cover on the mainframe.

5–26

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Troubleshooting

To test the hard disk drive voltages

Refer to chapter 6, "Replacing Assemblies," for instructions to remove or replace covers and

assemblies.

Hazard voltages exist on the power supply, the CRT, and the CRT driver board. This

procedure is to be performed by service-trained personnel aware of the hazards involved,

such as fire and electrical shock.

W AR N I N G

Equipment Required

Equipment

Critical Specification

Recommended

Model/Part

Digitizing Oscilloscope

> 100 MHz Bandwidth

HP 54600A

1 Turn off the instrument, then remove the power cable. Remove both the top and

bottom covers of the mainframe and set the mainframe on its side with the strap

handle facing up.

2 If an HP 16500L module is installed, then remove it from the mainframe.

a Disconnect the three cables plugged into the HP 16500L by reaching through the top

of the mainframe and removing the plugs.

b Remove the screws attaching the HP 16500L to the mainframe. Refer to chapter 6 for

more complete instructions to remove the HP 16500L.

3 Remove the four screws holding the hard disk drive and let the hard disk drive hang

by the power and the data cables. Do not let the hard disk drive contact the CPU

board.

4 Connect the power cable and apply power to the mainframe. When the hard disk

drive begins spinning, ensure the disk drive does not contact the CPU board. When

the mainframe has powered up, enter the Test System.

5 When the System Test menu appears, select Mainframe Test, then select Disk Test.

When the disk test menu appears, select Run-Repetitive.

6 Using an oscilloscope, check for activity on the pins. Probe the voltages on the hard

disk drive circuit board where the data cable connector is soldered. Pin 1 of the

connector is marked on the circuit board and is on the side of the connector closest

to the power cable.

5–27

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Troubleshooting

To test the hard disk drive voltages

Disk Drive Voltages

Signal Description

Reset

Ground

Data

+5 V

Data

Ground

Data

Interrupt Request

Data

Ground

Address

(connector key pin)

Address

Ground

Write Strobe

Ground

Read Strobe

Ground

I/O Cycle Extend

7 If the hard disk drive signals appear as indicated, then the hard disk drive should be

replaced. If the signals do not appear, then either the data cable or the CPU board is

suspect. J12 of the CPU board can be probed in the same manner as described

above to check for the same signals.

8 Select Stop, and turn off the mainframe. Remove the power cable and replace the

faulty assembly.

9 Reassemble the mainframe.

5–28

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Troubleshooting

To test the expansion frame interface

This procedure is used during troubleshooting to isolate a failed interface component, the

interface cable, the expansion frame interface card, or the HP 16500L. The Option Board Test

in the performance verification software generates bit patterns across the data, address, and

strobe lines of the interface. Isolation is done by using an oscilloscope to check activity on the

address and data buses and the strobe signal lines.

Refer to chapter 6, "Replacing Assemblies," for instructions to remove or replace covers and

assemblies.

Hazard voltages exist on the power supply, the CRT, and the CRT driver board. This

procedure is to be performed by service-trained personnel aware of the hazards involved,

such as fire and electrical shock.

W AR N I N G

Equipment Required

Equipment

Critical Specification

Recommended

Model/Part Number

Oscilloscope

100MHz Bandwidth

HP 54600A

Before beginning this procedure, verify that the HP 16500L interface is properly installed and that

the expansion frame interface card and interface cable are properly seated.

Set up the Expansion Frame

1 Remove power from the HP 16500B system and unplug the power cords from both

the mainframe and the expansion frame.

2 Set the expansion frame on its side with the strap handle facing up. Remove the

bottom cover from the expansion frame.

3 Plug the power cords into both the mainframe and expansion frame, then apply

power.

4 In the System Configuration menu, select Configuration. Select Test , then touch the

box to load the test system.

5 Select Test, then select Mainframe Tests in the pop-up menu. Select Option Board

Tests, then select Run-Repetitive.

5–29

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Troubleshooting

To test the expansion frame interface

Test the Expansion Interface Card

1 Ground the oscilloscope probe to the metal portion of the frame near the rear panel

of the expansion frame and check for TTL activity on the following pins.

U7 pins 11 through 18

•

U8 pins 2 through 9

•

U9 pins 5 through 9

•

If there is TTL activity on all of the pins indicated, then the signal paths from the

mainframe CPU board and the end of the expansion frame interface card are

considered working. Go to the next step.

If one or more of the signal lines do not show activity, then go to "Test the

Mainframe CPU Board" on the next page.

2 With the oscilloscope probe still grounded to the expansion frame, probe the

following pins.

U7 pins 2 through 9

•

U8 pins 11 through 18

•

U9 pins 11 through 15

•

If all of the signal lines show TTL activity, then go to the next step.

If one or more of the signal lines do not show TTL activity, then replace the

expansion frame interface board.

Bottom Side of Expansion Interface Card

5–30

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Troubleshooting

To test the expansion frame interface

3 Remove the probe ground from the frame, and reattach the probe ground to the

metal portion of the expansion frame near the front panel.

4 Probe the following pins.

U1 pins 2 through 9

•

U2 pins 2 through 9

•

U3 pins 5 through 9

•

If all of the signal lines show TTL activity, then go to the next step.

If one or more of the signal lines do not show TTL activity, then replace the

expansion frame interface board.

5 With the oscilloscope probe still grounded to the frame, probe the following pins.

U1 pins 11 through 18

•

U2 pins 11 through 18

•

U3 pins 11 through 15

•

If one or more of the signal lines do not show TTL activity, then replace the

expansion frame interface board.

Bottom Side of Expansion Interface Card

5–31

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Troubleshooting

To test the expansion frame interface

Test the Mainframe CPU Board

1 Remove power from the HP 16500B system and unplug the power cords from both

the mainframe and the expansion frame.

2 Reinstall the bottom cover on the expansion frame. Set the mainframe on its side

with the strap handle facing up, then remove the bottom cover.

3 Plug the power cords into both the mainframe and expansion frame, then apply

power.

4 In the System Configuration menu, select Configuration. Select Test, then touch the

box to load the test system.

5 Select Test, then select Mainframe Tests. Select Option Board Tests, then select

Run-Repetitive.

6 Ground the oscilloscope probe to the metal portion of the frame near the rear panel

of the mainframe and check for TTL activity on the following pins. Reference

designator J10 is indicated on the bottom side of the CPU board.

J10 pins 11 through 18

•

J10 pins 21 through 28

•

J10 pins 48 through 50

•

If there is TTL activity on all of the pins indicated, then the mainframe CPU board is

operational.

If one or more of the signal pins on the expansion frame interface board did not

show TTL activity, then the HP 16500L or the interface cable are suspect. Using an

ohm meter, check continuity of the interface cable.

If the interface cable is good, then replace the HP 16500L circuit board.

7 Remove power from the HP 16500B system, and unplug the power cords from both

the mainframe and expansion frame. Replace the faulty components, then

reassemble the mainframe.

5–32

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To remove and replace the

Optional modules or filler panels 6-3

Covers 6–4

Flexible disk drive 6–5

Power supply 6–6

Rear fan 6–8

Side fan 6–9

HP 16500L interface module 6–10

Hard disk drive 6–12

Microprocessor board (CPU) 6–13

SIMM memory module 6–14

Expansion interface board 6–15

Mother board 6–16

Front-Panel board 6–18

Color display assembly 6–19

To return assemblies 6–22

Replacing Assemblies

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Replacing Assemblies

This chapter contains the instructions for removing and replacing the assemblies of

the logic analysis system. Also in this chapter are instructions for returning

assemblies.

Hazardous voltages exist on the power supply, the CRT, and the CRT driver board. To avoid

electrical shock, disconnect the power from the instrument before performing the following

procedures. After disconnecting the power, wait at least six minutes for the capacitors on

the power supply board and the CRT driver board to discharge before servicing the

instrument. However, if the AC LED on the power supply has any illumination, a significant

charge remains on the power supply capacitors.

W AR N I N G

Damage can occur to electronic components if you remove or replace assemblies when the

instrument is on or when the power cable is connected. Never attempt to remove or install

any assembly with the instrument on or with the power cable connected.

C AU T I O N

Replacement Strategy

These replacement procedures are organized as if disassembling the complete

instrument, from the first assembly to be removed to the last. Some procedures say

to remove other assemblies of the instrument, but do not give complete instructions.

Refer to the procedure for that specific assembly for the instructions.

Electrostatic discharge can damage electronic components. Use grounded wriststraps and

mats when performing any service to this logic analyzer.

C AU T I O N

Tools Required

#10, #15, #25 TORX screwdrivers

#2 posidrive screwdriver

8-mm nut driver

6–2

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Replacing Assemblies

To remove and replace optional modules or filler panels

1 To reconfigure your system later in this procedure, note the configuration of your

system.

Some modules for the Logic Analysis System require calibration if you move them to a

different slot.

2 Starting from the top, loosen the thumb screws on filler panels and cards in the

mainframe or the expansion frame. Starting from the top, pull the cards and filler

panels out.

All multicard modules will be cabled together. To prevent damage to the cables and

connectors, pull all multicard modules out together.

3 To replace the modules, reposition all cards and filler panels so that the endplates

overlap properly.

4 Firmly seat the bottom card into the backplane connector of the mainframe. Keep

applying pressure to the center of the card endplate while tightening the thumb

screws finger tight. Repeat for all cards and filler panels in a bottom to top order.

For correct air circulation, filler panels must be installed in all unused card slots. Correct air

circulation keeps the instrument from overheating. Keep any extra filler panels for future use.

See Also

Service Guides for each individual module.

6–3

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Replacing Assemblies

To remove and replace the covers

There are four outside covers on the HP 16500B and on the HP 16501A, a top cover, a bottom

cover, and two side covers.

When removing the covers, note where the shielding braid is located. If the shielding braid

separates from the covers, reinstall it when replacing the covers. The shielding braid helps

the instrument meet EMI (electromagnetic interference) specifications.

1 Remove the four rear feet.

The screws connecting the feet to the frame are accessible through the holes in the end of the

feet.

2 Remove the top and bottom covers.

To remove the covers, loosen the screw in the rear of the covers. If a captive screw was used,

loosening the screw will pull the cover back. When the screw is completely loose from the

frame, slide the cover off. To remove the bottom cover, turn the instrument on its side, then

loosen the screw in the rear of the bottom cover.

3 Remove the side strap handle and side covers.

To remove the side strap handle, remove the two strap retaining screws. Slide the strap

handle cover off.

Note that the handle is rounded on the side closest to the instrument. Reinstall the handle

with the same side toward the instrument.

To remove a side cover, loosen the screw in the rear of the cover. (The side cover with a

strap handle will not have a rear screw.) If a captive screw was used, loosening the screw will

pull the cover back. When the screw is completely loose from the frame, slide the cover off.

4 Replace the covers by reversing this procedure.

6–4

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Replacing Assemblies

To remove and replace the flexible disk drive

HP 16500B

1 Using previous procedures, remove the following assemblies:

Top cover

•

2 Remove the two disk drive mounting screws.

3 Slide the flexible disk drive assembly toward the rear panel until the assembly is out

of the instrument.

4 Disconnect the control cable for the disk drive.

5 Remove the mounting bracket from the bottom of the assembly.

6 Reverse this procedure to replace the flexible disk drive.

6–5

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Replacing Assemblies

To remove and replace the power supply

Hazardous voltages exist on the power supply. To avoid electrical shock, disconnect the

power from the instrument before performing the following procedures. After disconnecting

the power, wait at least six minutes for the capacitors on the power supply board to

discharge before servicing the instrument. However, if the AC LED on the power supply has

any illumination, a significant charge remains on the capacitors.

W AR N I N G

HP 16500B

1 Using previous procedures, remove the following assemblies:

Top cover

•

Flexible disk drive assembly

•

Optional module card or filler panel in the top slot of the card cage

•

2 Remove the power supply rear panel.

3 Disconnect the color display to power supply cable from the power supply.

4 Remove the four power supply mounting screws.

5 Pull the power supply towards the rear panel of the mainframe until the power

supply disconnects from the mother board connector.

6 Lift the front end of the power supply and guide it out of the mainframe.

7 Reverse this procedure to install the replacement power supply.

Before pushing the power supply into place, make sure that it is properly aligned with the

front connector of the mother board and with the rail guides of the card cage.

HP 16501A

1 Using previous procedures, remove the following assemblies:

Top cover

•

Optional module card or filler panel in the top slot of the card cage

•

2 Remove the power supply rear panel.

3 Remove the four power supply mounting screws.

4 Pull the power supply towards the rear panel of the expansion frame until the power

supply disconnects from the mother board connector.

5 Lift the front end of the power supply and guide it out of the expansion frame.

6 Reverse this procedure to install the replacement power supply.

Before pushing the power supply into place, make sure that it is properly aligned with the

front connector of the mother board and with the rail guides of the card cage.

6–6

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Replacing Assemblies

To remove and replace the power supply

6–7

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Replacing Assemblies

To remove and replace the rear fan

HP 16500B and HP 16501A

1 Using previous procedures, remove the following assemblies:

Top cover

•

2 Remove the rear fan shroud mounting screws.

3 Remove the complete rear fan assembly from the rear panel of the instrument.

4 Disconnect the rear fan power cable.

5 Remove the rear fan mounting screws and remove the fan from the fan shroud.

6 Reverse this procedure to install the replacement rear fan.

Make sure that the fan power cable is dressed under and between the fans and that the cable

polarity is observed.

6–8

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Replacing Assemblies

To remove and replace the side fan

HP 16500B and HP 16501A

1 Using previous procedures, remove the following assemblies:

Top cover and side cover

•

2 Remove the four side fan mounting screws.

3 Reach through the top of the instrument and disconnect the fan power cable, then

remove the fan.

4 Reverse this procedure to install the replacement side fan.

Make sure that the fan power cable is dressed under and between the fans and that the cable

polarity is observed.

6–9

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Replacing Assemblies

To remove and replace the HP 16500L interface module

HP 16500B and HP 16500L

1 Using previous procedures, remove the following assemblies:

Top cover

•

2 If your system includes an expansion frame, disconnect the interface cable from the

HP 16500L interface module by pressing the release tabs on either side of the cable

connector while pulling the connector away from the card.

3 Disconnect the cable from the HP 16500L interface module to the CRT monitor and

the two cables from the HP 16500L interface module to the CPU card.

4 Remove the two screws connecting the HP 16500L interface module to the sheet

metal plate and the four screws connecting the HP 16500L interface module to the

mainframe rear panel.

5 Slide the card out the back of the mainframe.

6 Insert the replacement card in the back of the mainframe, then install the screws

and connect the cables.

The module serial number is located on the module rear panel. If you need to keep the same

serial number with your system, then remove the rear panel from the old interface module and

install it on the replacement module. The module rear panel is connected to the module circuit

board with four screws.

6–10

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Replacing Assemblies

To remove and replace the HP 16500L interface module

7 If your system includes an expansion frame, connect the interface cable from the

expansion frame to the HP 16500L interface module located in the HP 16500B

mainframe.

In order to ensure correct connection of the interface cable, the 68-pin "D" connectors on the

cable are asymmetric in shape. They only fit into the ports on the cards when oriented to

match the shape of the ports.

When reconnecting the interface cable, make sure the cable connector is properly seated into

the port on the expansion interface card by pulling the cable connector without pressing the

release tabs. If the connector is properly seated, it will remain connected to the port.

6–11

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Replacing Assemblies

To remove and replace the hard disk drive

HP 16500B

1 Using previous procedures, remove the following assemblies:

Top and bottom covers

•

HP 16500L interface module

•

2 Reaching in from the top of the instrument, remove the four screws connecting the

hard disk drive to the bracket.

3 Reaching in from the bottom of the instrument, remove the hard disk drive.

4 Disconnect the two cables from the hard disk drive to the CPU board.

5 Reverse this procedure to install the replacement hard disk drive.

Verify that the jumper on the underside of the hard disk is in the E1 position.

The replacement hard disk might be fastened to a mounting bracket when received. Before

installing the hard disk, remove the mounting bracket If the replacement hard disk is an

exchange assembly, attach the mounting bracket to the faulty disk drive before returning it to

Hewlett-Packard. If the replacement disk drive is a new assembly, discard the mounting

bracket.

6–12

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Replacing Assemblies

To remove and replace the microprocessor board (CPU)

HP 16500B

1 Using previous procedures, remove the following assemblies:

Top cover and left, rear foot

•

All optional modules and filler panels

•

2 Disconnect the cables from the microprocessor board.

3 Remove the two screws connecting the microprocessor to the rear panel.

4 Carefully slide the microprocessor board out of the mainframe.

5 Reverse this procedure to install the replacement microprocessor board.

6–13

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Replacing Assemblies

To remove and replace a SIMM memory

HP 16500B

1 Using previous procedures, remove the following assemblies:

Microprocessor (CPU) board

•

2 Hold the release tabs away from the SIMM (single inline memory module), then pull

the module out.

3 Reverse this procedure to install the replacement SIMM.

Slide the SIMM module into the connector at an angle, then push it down parallel to the

microprocessor board.

6–14

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Replacing Assemblies

To remove and replace the expansion interface board

HP 16501A

1 Using previous procedures, remove the following assemblies:

Bottom cover

•

All optional modules and filler panels

•

2 Disconnect the interface cable by pressing the release tabs on either side of the

cable connector while pulling the cable connector away from the board.

3 Disconnect the two cables on the expansion interface board. One cable is

connected to the front-panel LED and one cable is connected to the mother board.

4 Remove the two screws connecting the expansion interface board to the rear panel

of the expansion frame.

5 Carefully slide the expansion interface board out of the expansion frame.

6 Reverse this procedure to install the replacement expansion interface board.

In order to ensure correct connection of the interface cable, the 68-pin "D" connectors on the

cable are asymmetric in shape. They only fit into the ports on the boards when oriented to

match the shape of the ports.

When reconnecting the interface cable, make sure the cable connector is properly seated into

the port on the expansion interface board by pulling the cable connector without pressing the

release tabs. If the connector is properly seated, it will remain connected to the port.

6–15

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Replacing Assemblies

To remove and replace the mother board

HP 16500B

1 Using previous procedures, remove the following assemblies:

Top and bottom covers

•

Power supply

•

Microprocessor board

•

All optional modules and filler panels

•

2 Set the frame so that the bottom of the frame is facing up. This is to gain access to

the fan power cable and the front-panel cable.

3 Disconnect the fan power cable and the front-panel cable from the mother board.

4 Remove the six mother board mounting screws, then lift the mother board out of the

mainframe.

5 Reverse this procedure to install the replacement mother board.

HP 16501A

1 Using previous procedures, remove the following assemblies:

Top and bottom covers

•

Power supply

•

Expansion interface board

•

All optional modules and filler panels

•

2 Set the frame so that the bottom of the frame is facing up. This is to gain access to

the fan power cable and the front-panel cable.

3 Disconnect the fan power cable from the mother board.

4 Remove the six mother board mounting screws, then lift the mother board out of the

expansion frame.

5 Reverse this procedure to install the replacement mother board.

6–16

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Replacing Assemblies

To remove and replace the mother board

6–17

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Replacing Assemblies

To remove and replace the front-panel board

HP 16500B

1 Remove the top trim from the front frame.

2 Disconnect the two cables from the front-panel board.

One cable is connected to the color display assembly and one cable is connected to the

mother board.

3 Remove the screws connecting the front-panel assembly to the top and bottom of

the frame.

4 Remove the front-panel assembly by pushing on the back of the assembly from

inside the instrument.

5 Carefully remove the shield from the assembly.

The shield is very fragile and must be replaced if it is bent or damaged in any way.

6 Remove the bezel from the front-panel board.

7 Remove the RPG knob and the two CRT control knobs by pulling them away from

the front-panel.

8 Remove the screws connecting the front-panel board to the front-panel, then remove

the front-panel board.

9 Reverse this procedure to install the replacement front-panel board.

6–18

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Replacing Assemblies

To remove and replace the color display assembly

HP 16500B

The color display assembly replacement procedure consists of three sections:

Removing the assembly from the mainframe.

Transferring parts to the replacement assembly.

Installing the assembly in the mainframe.

Removing the color display assembly from the mainframe

1 Using previous procedures, remove the following assemblies:

All covers

•

Front-panel assembly

•

2 Disconnect the color display to microprocessor cable from the microprocessor

board. Disconnect the color display to power supply cable from the power supply.

If an HP 16500L is installed, disconnect the cable from the color display to the HP 16500L.

3 Remove the screws that connect the rear mounting bracket on the display assembly

to the side of the mainframe.

4 Remove the screws that connect the color display to the top and bottom of the front

frame.

5 Remove the screws that connect the center board guide to the front frame. Move

the sheet metal nuts, located on the center board guide, so that the display assembly

can clear the mainframe.

6 Slide the complete color display assembly forward out of the mainframe. To prevent

damage to the assembly cables, make sure that they also clear the frame.

6–19

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Replacing Assemblies

To remove and replace the color display assembly

Transferring parts to the replacement assembly

The purpose of this procedure is to transfer the mechanical parts from the old assembly to the

replacement assembly.

1 Remove the rear mounting bracket from the rear support bracket. Remove the rear

support bracket from the color display assembly.

2 Attach the rear support bracket to the replacement assembly, using the two

thread-forming screws. Do not overtighten.

3 Attach the frame mounting bracket to the rear support bracket. Install the hardware

in the following sequence: screw, flat washer, rubber washer. Do not tighten the

hardware.

4 Remove the four bracket nuts connecting the front mounting brackets to the old

assembly, then remove the front mounting brackets. Reinstall the bracket nuts on

the old assembly.

5 Remove the four bracket nuts from the replacement assembly. Using the four

bracket nuts, install both front mounting brackets on the replacement display

assembly. The upper bracket is identified by the notch on one edge.

6 Disconnect the flat microprocessor cable, the power cable, and the front-panel

control cable from the old assembly, noting the location of the cables. Connect the

cables to the replacement assembly.

6–20

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Replacing Assemblies

To remove and replace the color display assembly

Installing the replacement color display assembly

1 Carefully slide the color display assembly most of the way into the mainframe. To

prevent damage to the cables, make sure that they clear the mainframe.

2 Connect the color display to power supply cable to the power supply. Slide the

display assembly completely into the mainframe.

3 Attach the display assembly to the front frame with four screws (two on the top

casting and two on the bottom casting). Do not tighten the screws.

4 Move the sheet metal nuts, located on the front tabs of the center board guide, so

that the holes in the sheet metal nuts and the tabs line up. Attach the front tabs of

the center board guide to the front frame.

5 Reinstall the front-panel assembly, connecting the front-panel cables. Make sure the

front-panel assembly is properly seated before tightening the hardware.

6 Push the display assembly forward, until it is properly seated against the front-panel

assembly. Tighten the four display assembly mounting screws in the front frame.

7 Attach the rear mounting bracket of the display assembly to the side frame, then

tighten the mounting bracket screws. To prevent damage to the rubber washers, do

not overtighten the screws.

8 Tighten all of the display assembly mounting hardware. Reconnect the flat color

display to microprocessor cable to the microprocessor board.

If an HP 16500L is installed, connect the cable from the color display assembly to the

HP 16500L.

9 Reinstall all covers.

6–21

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Replacing Assemblies

To return assemblies

Before shipping the logic analysis system or assemblies to Hewlett-Packard, contact your

nearest Hewlett-Packard sales office for additional details.

1 Write the following information on a tag and attach it to the part to be returned.

Name and address of owner

•

Model number

•

Serial number

•

Description of service required or failure indications

•

2 Remove accessories from the logic analysis system.

Only return accessories to Hewlett-Packard if they are associated with the failure symptoms.

3 Package the logic analysis system or assemblies.

You can use either the original shipping containers, or order materials from an HP sales office.

For protection against electrostatic discharge, package the logic analyzer in electrostatic

material.

C AU T I O N

4 Seal the shipping container securely, and mark it FRAGILE.

6–22

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Replaceable Parts Ordering 7–2

Replaceable Parts List 7–3

HP 16500B Exploded View and Replaceable Parts 7–4

HP 16501A Exploded View and Replaceable Parts 7–9

Replaceable Parts

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Replaceable Parts

This chapter contains information for identifying and ordering replaceable parts for

your logic analysis system.

Replaceable Parts Ordering

Parts listed

To order a part on the list of replaceable parts, quote the Hewlett-Packard part number,

indicate the quantity desired, and address the order to the nearest Hewlett-Packard Sales

Office.

Parts not listed

To order a part not on the list of replaceable parts, include the model number and serial

number of the module, a description of the part (including its function), and the number of

parts required. Address the order to your nearest Hewlett-Packard Sales Office.

Direct mail order system

Within the USA, Hewlett-Packard can supply parts through a direct mail order system. The

advantages to the system are direct ordering and shipment from the HP Part Center in

Mountain View, California. There is no maximum or minimum on any mail order. (There is a

minimum amount for parts ordered through a local Hewlett-Packard Sales Office when the

orders require billing and invoicing.) Transportation costs are prepaid (there is a small

handling charge for each order) and there are no invoices.

In order for Hewlett-Packard to provide these advantages, a check or money order must

accompany each order. Mail order forms and specific ordering information are available

through your local Hewlett-Packard Sales Office. Addresses and telephone numbers are

located in a separate document at the back of the Service Guide.

Exchange Assemblies

Some assemblies are part of an exchange program with Hewlett-Packard. The exchange

program allows you to exchange a faulty assembly with one that has been repaired and

performance verified by Hewlett-Packard.

After you receive the exchange assembly, return the defective assembly to Hewlett-Packard.

A United States customer has 30 days to return the defective assembly. If you do not return

the defective assembly within the 30 days, Hewlett-Packard will charge you an additional

amount. This amount is the difference in price between a new assembly and that of the

exchange assembly. For orders not originating in the United States, contact your nearest

Hewlett-Packard Sales Office for information.

See Also

"To return assemblies" in chapter 6.

7–2

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Replaceable Parts

Replaceable Parts List Description

The replaceable parts list is organized by reference designation.

The exploded view does not show all of the parts in the replaceable parts list.

Information included for each part on the list consists of the following:

Reference designator

•

Hewlett-Packard part number

•

Total quantity included with the instrument (Qty)

•

Description of the part

•

Reference designators used in the parts list are as follows:

A Assembly

•

E Miscellaneous Electrical Part

•

F Fuse

•

H Hardware

•

MP Mechanical Part

•

W Cable

•

7–3

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Replaceable Parts

HP 16500B Exploded View and Replaceable Parts

Exploded view of the HP 16500B External Parts

7–4

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Replaceable Parts

HP 16500B Exploded View and Replaceable Parts

HP 16500B Replaceable Parts

Ref.

Des.

HP Part

Number

QTY

Description

Exchange Assemblies

16500-69512

16500-69509

D2329-69001

16500-69500

2095-0001

Front-panel circuit board (exchange)

Microprocessor board assembly (exchange)

Hard disk drive (exchange)

Power supply (exchange)

Color monitor assembly (exchange)

1MX36 SIMM module (exchange)

D2156-69001

External Parts

2110-0010

2110-0395

Fuse - 5 amp for 230 Vac operation

Fuse - 10 amp for 115 Vac operation

0515-1384

0515-1444

Screw M5 X 0.8 10 MM-LG (side handle)

Screw M3.5 X 0.6 25.4MM_LG (back feet)

MP3

MP4

MP13

MP21

MP25

0363-0125

1460-1345

16500-04102

5001-0541

5041-8801

RFI strip - fingers (top and bottom covers)

Tilt stand

Top cover

Side trim (front frame)

Feet - front (bottom cover)

MP26

MP27

MP28

MP29

MP30

54110-40502

5041-8802

5041-8822

5041-8819

5041-8820

Feet - back

Top trim strip (frame)

Feet - rear (bottom cover)

Strap handle cap - front

Strap handle cap - rear

MP31

MP32

MP33

MP34

MP37

5062-3704

5062-3847

5062-3822

5062-3747

8160-0551

Strap handle

Cover - left side (with handle)

Cover - right side (without handle)

Cover - bottom

EMI shielding - braided

8120-1521

8120-1703

8120-0696

8120-1692

8120-2296

8120-2957

8120-4600

8120-4754

Power cord - United States (7.5 ft)

Power cord (Option 900-UK)

Power cord (Option 901-Austl)

Power cord (Option 902-Eur)

Power cord (Option 906-Swit)

Power cord (Option 912-Den)

Power cord (Option 917-Africa)

Power cord (Option 918-Japan)

01660-84501

0515-1245

0510-1253

Accessory pouch

Replacement screw for top and bottom covers

Replacement retaining ring for top and bottom covers

7–5

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Replaceable Parts

HP 16500B Exploded View and Replaceable Parts

Exploded View of the HP 16500B

7–6

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Replaceable Parts

HP 16500B Exploded View and Replaceable Parts

HP 16500B Replaceable Parts

Ref.

Des.

HP Part

Number

QTY

Description

Internal Parts

16500-66501

16500-66509

0950-2169

Mother board assembly

Microprocessor board assembly

Flexible disk drive

D2329-60003

0950-1853

2090-0251

1818-4703

Hard disk drive

Power supply assembly

Color CRT module assembly

1MX36 SIMM module

3160-0829

Fan - tubeaxial

0515-0372

0515-0433

0515-0435

0515-0664

0515-0943

Screw M3 X 0.5 8MM-LG

Screw M4 X 0.7 10MM-LG (rear panel, center rib)

Screw M4 X 0.7 14MM-LG (center rib, power supply)

Screw M3 X 0.5 12MM-LG (color monitor bracket, CPU board)

Screw M4 X 0.7 12MM-LG (color monitor to frame, front-panel to frame)

0515-1403

0535-0105

0515-1363

0624-0520

2510-0332

Screw M4 X 0.7 6MM-LG 90-Deg FH (frame)

Nut - sheet metal M4 (side card guide, center rib)

Screw (flexible disk drive bracket)

H10

H11

H12

Screw TPG 6-19 .5-IN-LG (side card guide, center rib)

Screw Mach 8-32 (fans)

H13

H14

H15

H16

2190-0763

2950-0043

3050-0188

3050-1238

Washer FL MTLCH NO. 6 .14-IN-ID .5-IN-OD (CPU to rear panel)

Nut - hex 3/8-32-THD .094-IN-THK (RPG)

Washer - spcr 3/8-IN .385-IN-ID (RPG)

Washer - FL NM 9/64 .149-IN-ID .478-IN-OD (color monitor bracket)

H17

H19

0515-0641

2360-0462

Screw (color monitor bracket)

Screw 6-32 0.25in Pan (hard drive)

MP2

MP7

MP8

MP9

MP10

16500-00204

3160-0092

Rear panel

Grill - rear fan

16500-01212

16500-01213

16500-01205

Bracket - flexible disk

Bracket - fan/disk

Bracket - color module top

MP11

MP12

MP14

MP15

MP16

16500-01206

16500-01207

16500-04701

16500-23101

16500-23102

Bracket - color module bottom

Fan shroud - rear

Mother board bracket

Card guide - side

Card guide - center

MP20

MP22

MP23

MP24

MP35

16500-61202

5021-8407

5021-5808

5021-5837

54110-01210

Power supply cover - rear panel

Frame - front

Frame - rear

Strut - corner

Bracket - color module rear

MP36

MP38

MP39

54110-04702

16500-04105

16500-00605

Support - color module rear

Cover plate

Shield - flexible disk drive

16500-61601

16500-61602

16500-61609

16500-61604

16500-61605

Cable - mother board to front panel

Cable - CPU to color module

Cable - CPU to flexible disk drive (34 cond)

Cable - fan power

Cable - front panel to color module

7–7

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Replaceable Parts

HP 16500B Exploded View and Replaceable Parts

HP 16500B Replaceable Parts

Ref.

Des.

HP Part

Number

QTY

Description

16500-61606

16500-61611

16500-61612

16500-61613

Cable - power supply to color module

Cable - hard drive (40 cond)

Cable - hard drive power

W10

Cable - CRT 10/40 (10 cond/40 pin, CRT to CPU)

Front-Panel Assembly Parts

16500-66512

Board assembly - front panel

0515-0372

0535-0106

MSPH M3 8 SMS10

H10

Nut - sheetmetal (clips)

MP1

16500-40203

16500-00601

16500-42202

16500-47402

Front panel

MP5

Static shield

Touch screen bezel

RPG knob

MP17

MP18

MP40

MP41

MP42

MP43

16500-94311

16500-47401

5041-4944

Front panel label

CRT control knob

Keycap

16500-44701

Switch spacer (power switch)

Miscellaneous

16500-40502

01650-63202

Filler panel

RS-232C loopback connector

HP 16500L Replaceable Parts

Refer to the HP 16500L Administrator’s and Service Guide.

7–8

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Replaceable Parts

HP 16501A Exploded View and Replaceable Parts

Exploded view of the HP 16501A

7–9

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Replaceable Parts

HP 16501A Exploded View and Replaceable Parts

HP 16501A Replaceable Parts

Ref.

Des.

HP Part

Number

QTY

Description

Exchange Assemblies

A4 16500-69500

Power supply assembly (exchange)

External Parts

2110-0010

2110-0395

MP1

MP2

MP3

MP4

MP5

16501-00201

16501-00203

0363-0125

Front-panel

Rear panel

FRI strip-fingers (top and bottom covers)

1460-1345

Tile stand

Sub-panel

16501-00202

MP7

16500-00603

16500-01207

16500-04102

5001-0541

Fan screen (rear)

Fan shroun (rear)

Top cover

MP12

MP13

MP21

MP22

Side trim-front frame

Frame-front

5021-8407

MP23

MP24

MP25

MP26

MP27

5021-5808

5021-5837

5041-8801

54110-40502

5041-8802

Frame-rear

Strut-corner

Feet-front (bottom cover)

Feet-back

Top trim strip-frame

MP28

MP29

MP30

MP31

MP32

5041-8822

5041-8819

5041-8820

5062-3704

5062-3847

Feet-rear (bottom cover)

Strap handle cap-front

Strap handle cap-rear

Strap handle

Cover-left side (with handle)

MP33

MP34

MP37

5062-3822

5062-3747

8160-0551

Cover-right side (without handle)

Cover-bottom

EMI shielding-braided

8120-1521

Power cord-United States (7.5 ft)

Electrical Assemblies

16501-66501

16500-66501

0950-1853

Expansion interface board

Mother board

Power supply assembly

3160-0429

Fan-tubeaxial

98735-61601

16501-61604

16501-61603

16500-61604

Cable assembly-interface

Cable assembly-ribbon (mother board to expansion interface board)

Cable assembly-LED

Cable-fan power

7–10

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Replaceable Parts

HP 16501A Exploded View and Replaceable Parts

HP 16501A Replaceable Parts

Ref.

Des.

HP Part

Number

QTY

Description

Internal Parts

0515-0372

0515-0433

0515-0435

0515-0664

0515-0943

Screw M3 X 0.5 8MM-LG

Screw M4 X 0.8 15MM-LG

Screw M4 X 0.7 14MM-LG

Screw M3 X 0.5 12MM-LG

Screw M4 X 0.7 12MM-LG

0515-1384

0515-1403

0515-1444

0535-0105

Screw M5 X 0.8 10MM-LG

Screw M4 X 0.7 6MM-LG 90-DEG FH

Screw M3.5 X 0.6 25.4MM-LG (back Feet)

Nut Sheet Metal M4

H11

H12

H18

H19

H20

0624-0520

2510-0332

0400-0001

0535-0031

1400-0611

Screw TPG 6-19 .5-IN-LG

Screw M3 0.5 X 20 (fan)

Grommet

Nut

Cable clamp

MP6

MP8

MP9

MP14

MP15

16501-01201

16501-40501

1400-0560

Fan bracket

Module panel (expansion interface board)

CL-SET-LED-MTG (LED clamp set)

Strut-mother board

16500-04701

16500-23101

Card guide-side

MP16

MP20

MP46

16500-23102

16500-61202

16501-94301

Card guide-center

Power supply cover-rear panel

Label-ID (expansion interface board)

Miscellaneous

16500-40502

Filler panel

7–11

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7–12

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Block-Level Theory 8–3

The HP 16500B Logic Analysis System 8–3

The Microprocessor Board 8–6

The Power-Up Routine 8–9

The Power-Up Screen 8–9

Power-Up Self-Tests 8–10

Power-Up Tasks 8–10

The System Configuration Menu 8–12

Self-Tests Description 8–13

Power-Up Self Tests 8–13

Functional Performance Verification Tests 8–15

HP-IB 8–18

RS-232C 8–19

Theory of Operation

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Theory of Operation

This chapter tells the theory of operation for the logic analysis system and describes

the self-tests. The information in this chapter is to help you understand how the

logic analysis system operates and what the self-tests are testing. This information is

not intended for component-level repair.

8–2

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Block-Level Theory

The block-level theory is divided into two parts: theory for the logic analysis system

and theory for the microprocessor board. A block diagram is shown with each theory.

The HP 16500B Logic Analysis System

The Logic Analysis System

8–3

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Theory of Operation

The HP 16500B Logic Analysis System

System Overview Theory

HP 16500B

The HP 16500B is the mainframe for the Logic Analysis System.

Microprocessor Board The microprocessor board contains all the interface circuitry

for managing data flow between the mainframe components and the optional boards. The

microprocessor used is a Motorola 68EC030.

Mother Board Located on the mother board are the intermodule bus and the fan speed

control circuit. The mother board consists of seven card slots: five are used for the

optional acquisition and stimulus boards, one for the microprocessor board, and one for

the power supply. The only active components on the mother board are for the fan speed

control circuit. The heat-sensing thermistor for the fan speed control circuit is located on

the microprocessor board.

Flexible Drive The flexible disk drive uses 3.5-inch, double-sided, double-density disks.

All of the disk drive control circuitry is located on the microprocessor board.

Hard Disk Drive The hard disk drive, located beneath the rear fans, is an 85 Mbyte

DOS-formatted high-reliability drive. The disk drive circuitry is located on the

microprocessor board and on the hard disk drive assembly.

Color Module The color module display is an eight-plane color system. Each plane has

a resolution of 576 pixels by 368 lines. The display is non-interlacing and is refreshed

every 1/60 of a second (not synchronized to the ac line). The horizontal and vertical sync

signals are generated by the CRT controller located on the microprocessor board. Color

information for the display is generated on the microprocessor board. The display RAM

and the color palette are also located on the microprocessor board.

Front-Panel Board The front-panel board is based on the Hewlett-Packard Human

Interface Link (HP-HIL) and consists of the touchscreen system, the front-panel control

knob, the optional mouse, and the optional keyboard. All of the touchscreen and knob

circuitry of the HP-HIL is located on the front-panel board and the controller for the link

is located on the microprocessor board.

Power Supply The power supply provides the following regulated voltages:

-12.0 Vdc

+12.0 Vdc

+120 Vdc

+5.0 Vdc

-5.2 Vdc

+3.5 Vdc

-3.25 Vdc

The +120.0 V supply is used only by the color module. Current limiting, overvoltage

protection, and thermal shutdown are provided for all supplies.

8–4

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Theory of Operation

The HP 16500B Logic Analysis System

HP 16501A

The HP 16501A is the expansion frame for the Logic Analysis System. The expansion frame

components include the following:

Expansion Interface Board

•

Interface Cable

•

Mother Board

•

Power Supply

•

To connect the expansion frame to the mainframe, you must install an HP 16500L interface

module into the mainframe. The interface cable connects the expansion frame to the

HP 16500L in the mainframe.

The HP 16501A is an extension of the backplane of the HP 16500B mainframe. After you turn

on the mainframe, the HP 16500B microprocessor board looks for a HP 16500L interface

module. If it is present and if the interface cable connects the two frames, the microprocessor

board establishes a link between the backplanes of the two frames, which then are displayed

as a ten-slot system.

The HP 16501A power supply is identical to the HP 16500B power supply. When power is

applied to the HP 16500B, a relay allows the power supply in the HP 16501A to turn on. An

LED on the front-panel indicates that the expansion frame has turned on.

8–5

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Theory of Operation

The Microprocessor Board

8–6

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Theory of Operation

The Microprocessor Board

Microprocessor Board Theory

The microprocessor board contains the system memory, all of the interfaces for the

mainframe peripherals, the intermodule bus monitor, and the option board module interface.

Microprocessor and System ROM & RAM

The processing engine of the HP 16500B microprocessor board is a Motorola 68EC030

microprocessor. The 68EC030 is supported by 128 Kbytes of ROM and 8 Mbytes of single

inline memory module (SIMM) RAM. Stored in ROM are the power-up routines for the

mainframe including the power-up self tests and the disk drive instructions. The HIL driver is

also resident in system ROM.

Supply Voltage Supervisor

The Supply Voltage Supervisor (SVS) monitors the main power supply bus and ensures a

smooth power-up of the microprocessor system. The SVS also ensures a graceful recovery of

the system in case the line voltage drops below nominal levels.

During power-up, the SVS asserts the microprocessor L_RESET pin when the supply voltage

stabilizes. Because the voltage on the main power supply bus is affected by abnormal line

voltages, the SVS asserts the microprocessor L_HALT pin during a low line voltage condition.

When the line voltage returns to a nominal value, the L_RESET pin is then asserted by the

SVS and the HP 16500B will reboot.

Interrupt Control

The Interrupt Control circuit manages the interrupt signals asserted by the peripheral devices.

When an interrupt is received, the Interrupt Control circuit encodes the interrupt signal from

the peripheral device to the microprocessor as a prioritized microprocessor interrupt.

Address Area Decoder and Peripheral Decoder

The mainframe peripheral interfaces link the microprocessor data and address busses with the

system peripherals. The system peripherals are then selected by the microprocessor through

the address area decoder and peripheral decoder. The peripheral decoder selects all

peripherals including the HIL interface, the HP-IB and RS-232C interfaces, the color palette,

the hard disk drive interface, and the flexible disk drive interface. The address area decoder

enables access to system ROM, the display RAM, peripherals, and the HP 16500L interface

module.

Real Time Clock

The Real Time Clock provides time information to the HP 16500B microprocessor system.

The time information is used to place a time stamp on files stored on both the hard and

flexible disk drives. Time information may also be used by certain option modules to time

stamp acquired data. For more information regarding the option modules, refer to the User’s

Guide of the specific module.

Ethernet LAN Interface

Using line drivers, the Ethernet LAN Interface links the microprocessor address and data bus

with the LAN controller IC on the HP 16500L Interface Module. Consult the HP 16500L

Administrator’s and Service Guide for more information regarding the HP 16500L Interface

Module.

8–7

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Theory of Operation

The Microprocessor Board

HIL Interface

The Hewlett-Packard Human Interface Link (HP-HIL) is the interface between the

microprocessor and the HP 16500B front panel. In the write mode, the interface controller

serializes the 8-bit data and transmits the data to the devices on the link. In the read mode,

the data is fed to the interface controller in serial format and to the microprocessor in parallel

format.

HP-IB and RS-232C Interface

The HP 16500B interfaces to HP-IB as defined by IEEE Standard 488.2. The interface

consists of two octal transceivers and an HP-IB controller. The controller relieves the

microprocessor of the task of maintaining HP-IB protocol. The two transceivers provide data

and control signal transfer between the bus and the controller.

The RS-232C interface is compatible with standard RS-232C protocol. The interface consists

of a controller, an input buffer and an output buffer. The controller serializes parallel data

from the microprocessor for transmission. In the receive mode, the controller converts

incoming serial data to parallel data for the microprocessor. The controller also generates all

the different baud rates and formats available with the mainframe. The input and output

buffers transfer data and control signals to and from the RS-232C communication lines.

Display RAM, Color Palette, and CRT Control

The HP 16500B CRT display is driven by a Color Palette and CRT Control supported by

256 KBytes of video RAM. A single RAMDAC functions as the Color Palette for the

eight-plane color monitor. RGB signals are provided by the RAMDAC. The RAMDAC sends

an analog signal of 0.0 to -1.0 Volts for each of the primary colors (Red, Blue, Green) to the

color module. Horizontal and vertical sync signals are provided by a CRT controller.

Hard Disk Drive Interface

The Hard Disk Drive Interface is made up of two octal transceivers and three buffers. The

octal transceivers link the hard disk drive’s 16-bit data I/O port with the microprocessor data

bus. The buffers link the hard disk drive’s control signals with both the address bus of the

microprocessor and the peripheral interface signals so that the hard disk drive resides at a

virtual address in read and write modes. The hard disk drive controller resides on the hard

disk drive.

Flexible Disk Drive Interface

The main components of the Flexible Disk Drive Interface are the disk drive controller and

buffers. The disk drive controller provides the interface between the microprocessor and the

flexible disk drive. The controller also performs all functions necessary to write or read data

to or from the disks. Data directed to the disk drive from the microprocessor is serialized by

the disk drive controller.

The buffers link the microprocessor data bus with certain flexible disk drive control signals.

The flexible disk drive informs the microprocessor through the data bus whether a flexible

disk has been changed and whether the flexible disk drive is ready to read from or write to a

flexible disk. The microprocessor can also inform the flexible disk drive to format a flexible

disk with a high-density format.

Module Interface and Correlator

The Module Interface provides microprocessor access to the acquisition and stimulus option

modules that are plugged into the mainframe. The Correlator provides the means for

time-aligning module trace data on the mainframe display.

8–8

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The Power-Up Routine

When power is applied to the HP 16500B Logic Analysis System mainframe, a series

of tasks called the power-up routine is performed to initialize and to verify operation

of the mainframe. The mainframe monitor reports the progress and status of the

power-up routine. Each of the tasks of the power-up routine is added to the monitor

display as the task is being performed.

The following figure shows all of the tasks and possible status reporting fields that

can be displayed on the monitor.

The Power-Up Screen

Model Number and ROM Version

The field in the upper right corner of the display shows the mainframe model number and the

version of ROM installed on the CPU board. The ROM version number is important because

the ROM code must be compatible with the version of the operating system which is stored on

the hard disk drive. The ROM and operating system versions are compatible when the

operating system version number is the same as or higher than the ROM version number.

"*"

The "*" next to the ROM version number indicates that one of the disk drives is spinning. The

"*" only appears when the boot code in ROM accesses a disk drive.

8–9

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Theory of Operation

Power-Up Self-Tests

All of the power-up self tests are performed to verify the operation of the HP 16500B

mainframe. If any of the self-tests fail, then the power-up routine is halted and the FATAL

ERRORS ENCOUNTERED, BOOT HALTED message appears.

For more information about the individual self-tests, refer to "Self-Tests Description" later in

this chapter.

If any power-up self-test fails, refer to chapter 5, "Troubleshooting."

Power-Up Tasks

During the power-up routine, messages on the screen display tasks that are being performed.

The following paragraphs explain the tasks.

Loading System File

The operating system of the HP 16500B mainframe is being uploaded from the disk drive into

system RAM.

SYSTEM DISK NOT FOUND appears only when the mainframe operating system cannot be

found on the hard disk drive. The HP 16500B mainframe power-up routine will not go any

further until a mainframe operating system is present and is recognized. In this case, remove

power from the instrument and install the flexible disk containing the mainframe operating

system in the flexible disk drive. When the System Configuration menu appears, the hard disk

drive directory can be checked to see if the mainframe operating system is present and

recognized and has the correct version number.

Loading Module Files

The operating system of each of the installed modules is being uploaded from the disk drive

into system RAM.

The module operating systems are loaded beginning with the module in slot A, the top-most

module. Then, the operating system of the module in slot B is loaded, and so on.

Consequently, only the operating systems of the installed modules will be loaded into RAM.

The operating systems of modules not installed will not be uploaded from the disk drive.

The System Configuration menu will show if an installed module did not have its operating

system loaded. The message UNRECOGNIZED MODULE appears in place of the module

name next to the slot designations on the left side of the System Configuration menu.

Loading Software Options

Software options, for example the System Performance Analysis package, are being loaded

into system RAM.

The Configuration menu of the module using the software options will show if the software

option was installed. If the option was installed, it will appear in the module configuration

menu pop-up. Refer to the User’s Guide the software option for more information.

8–10

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Theory of Operation

Power-Up Tasks

Initializing and Calibrating Modules

The installed modules are initialized and stored calibration factors are uploaded from either

the disk drive or module NV-RAM into system RAM. The configuration menu of the module

using the calibration factors will show if the calibration factors have been successfully loaded.

In some cases, a message appears the first time the module is entered. In other cases, the

operation of the module changes until a software calibration is performed to reload calibration

factors. Refer to the User’s Guide and Service Guide of the individual modules for more

information.

Autoloading Configurations

The configuration file autoload flag was detected on the disk and configuration files are being

loaded into the modules. The autoload flag was set during a previous session with the

HP 16500B Logic Analysis System. Usually a configuration is autoloaded as a shortcut if the

module configuration file is used repeatedly.

8–11

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Theory of Operation

The System Configuration Menu

When the power-up routine is complete and the HP 16500B is operational, the System

Configuration menu is displayed. The names of the installed modules appear in fields on the

left side of the display. The fields correspond to the slot into which the module is installed.

UNRECOGNIZED MODULE

If a module field appears with the label UNRECOGNIZED MODULE, then the operating

system of the module was not uploaded from the disk drive into system RAM. One of three

things can cause an unrecognized module: the operating system file is not on the disk drive,

the operating system file is corrupted, or there is not enough RAM memory in the mainframe.

Insufficient RAM memory shows up as a number of recognized modules grouped together in

the lower slots of the mainframe or expansion frame with recognized modules in the upper

slots.

Touchscreen power-up test failed

If the touchscreen power-up self test found the touchscreen operation impaired, then a

red-bar error message "Touchscreen power-up test failed" appears at the top of the screen.

This is not a fatal error and only communicates that the touchscreen will operate with a

minimal loss of functionality.

Master Frame

If the label Master Frame appears in a blue field, then an expansion frame is recognized and

up to five more modules are present. The modules in the expansion frame can be seen by

touching the field labeled Master Frame. If the label Master Frame appears as text only, then

the HP 16500B mainframe does not recognize an expansion frame.

Ethernet

If an HP 16500L interface module is installed, the HP 16500B can be configured to work with

an Ethernet network. Network statistics can be viewed by touching the field configuration

labeled Ethernet in the Communications menu of the System Configuration menu, then

touching Ethernet Statistics. Refer to the manuals for the HP 16500L interface module for

more information.

8–12

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Self-Tests Description

The self-tests identify the correct operation of the major sub-systems in the

HP 16500B Logic Analysis System mainframe. The self-tests are not intended for

component-level diagnostics.

Two types of tests are performed on the HP 16500B mainframe: the power-up

self-tests and the functional performance verification tests.

The power-up self-tests are performed when power is applied to the instrument.

When the power-up self- tests are completed and the mainframe sub-systems are

determined to be operational, the system configuration menu is displayed.

The functional performance verification tests are run using a separate operating

system, the performance verification (PV) operating system. The PV operating

system resides on the hard disk drive and can be accessed through the System Test

menu.

A third type of test, parametric performance verification (parametric PV), is not

performed on the HP 16500B mainframe. However, parametric PV is performed on

the modules installed in the mainframe. Consult the individual Service Guides for

each of the modules for more information about parametric performance verification.

Power-Up Self-Tests

The HP 16500B power-up tests check the mainframe circuitry only. None of the option

modules are tested at power-up. The tests run every time power is applied to the instrument

and the results of the tests are reported on the screen.

If a disk is not installed in the disk drive, the advisory "no disk" is added to the Flexible Disk

Tests.

If any of the self-tests fail, then the power-up routine is halted and the FATAL ERRORS

ENCOUNTERED, BOOT HALTED message appears. A failure indicates that one of the

mainframe sub-systems is seriously impaired to the point that reliable operation is not

possible, or that a sub-systems is non-operational. The mainframe hardware would require

servicing before the mainframe can be used.

If any power-up self-test fails, refer to chapter 5, "Troubleshooting."

The power-up tests perform the following circuit checks: ROM Test, RAM Test, Interrupt

Test, Display Test, HIL Controller Test, Front-panel Test, Touchscreen Test, Correlator Test,

Hard Disk Test, and Flexible Disk Test.

ROM Test

The ROM Test performs a checksum of both ROMs and compares the checksum value to a

stored value. The test responses are "passed," "impaired," or "failed." If the message

"impaired" is displayed, only one of the ROMs on the microprocessor board is defective. If the

message "failed" is displayed, both ROMs are defective. For ROM Test failures, you can

suspect a faulty microprocessor board.

8–13

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Theory of Operation

Power-Up Self-Tests

RAM Test

The RAM Test performs an abbreviated read/write test at various memory locations. The test

returns a pass or fail message. For RAM Test failures, first you can suspect a faulty SIMM

module, then you can suspect a faulty microprocessor board.

Interrupt Test

The Interrupt Test checks the microprocessor interrupts (interrupts 1 thorough 7). This test

returns a pass or fail message. If any interrupts are active, the test fails. For Interrupt Test

failures, you can suspect a faulty microprocessor board.

Display Test

The Display Test checks the display RAM and the CRT controller. During the RAM test, the

entire address range is checked. The CRT controller ensures that an End-Of-Frame interrupt

is generated. The test will report a fail message if either the display RAMs or the controller

tests fail. For Display Test failures, you can suspect a faulty microprocessor board.

HIL Controller Test

The HIL Controller Test checks the HIL interface circuitry on the microprocessor board to

verify that the microprocessor board can talk to the front-panel board. This test reports a

pass or fail message. For HIL Test failures, you can suspect a faulty microprocessor board.

Front-Panel Test

The Front-Panel Test checks the front-panel circuitry for correct operation and reports a pass

or fail message. For Front-Panel Test failures, verify the continuity and connection of the

cable from the microprocessor board to the front-panel board. If a problem is not found with

the cable, you can suspect a faulty front-panel board.

Touchscreen Test

The Touchscreen Test checks for light pulses between LED (light emitting diode) pairs and

returns a pass, fail, or an impair message.

The impair message indicates that the touchscreen is faulty, but the instrument can still be

operated. If two to four LED pairs of the touchscreen system are defective, then the impair

message is displayed. The touchscreen can still be used to operate the instrument, except for

the touch-sensitive areas controlled by the faulty LED pairs.

The fail message indicates that the touchscreen is faulty and cannot be used to operate the

instrument. The fail message is displayed if five or more LED pairs of the touchscreen system

are defective. If the Touchscreen Test fails, you can still operate the instrument by using a

mouse.

If a mouse is connected and the Touchscreen Test fails (meaning there are five or more

defective LED pairs), then the impair message is displayed instead of the fail message and the

mouse can be used to operate the instrument. To obtain true Touchscreen Test results,

disconnect the mouse before performing the test.

For Touchscreen Test failures, clean the screen and the surrounding area and move any

objects blocking the screen at power-up. Verify the continuity and connection of the cable

from the microprocessor board to the front-panel board. If a problem is not found with the

cable and the Touchscreen Test still fails after cleaning the instrument, you can suspect a

faulty front-panel board.

8–14

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Theory of Operation

Functional Performance Verification Tests

Correlator Test

The correlator test verifies that the intermodule bus time correlator on the microprocessor

board is functioning properly. If the correlator is functioning, then intermodule

measurements can be time-correlated to within 2 ns. This test reports either a pass or fail

message. For Correlator Test failures, you can suspect a faulty microprocessor board.

Hard Disk Test

The Hard Disk Test reads the hard disk to see if the format is recognized. If the format is not

recognized the test is considered to have failed for the hard disk drive.

Possible problems causing a fail message include the following:

A damaged or disconnected disk drive data cable.

•

A damaged or disconnected disk drive power cable.

•

Hard disk drive is not formatted.

•

A faulty disk drive.

•

Faulty microprocessor interface circuitry to the disk drive.

•

Flexible Disk Test

The Flexible Disk Test reads the flexible disk to identify the format. If the format cannot be

identified, the test is considered to have failed for the disk drive. If a flexible disk cannot be

detected, the message "no disk" is displayed instead of the pass or fail message. This

power-up disk test only checks a few tracks.

Possible problems causing a fail message include the following:

A damaged or disconnected disk drive cable.

•

Wrong disk formatting or no disk formatting.

•

A faulty disk drive.

•

Faulty microprocessor interface circuitry to the disk drive.

•

For Flexible Disk Test failures, verify the continuity and connection of the disk drive cable

and use formatted disks.

Functional Performance Verification Tests

The following paragraphs briefly describe each mainframe test. After a test is run, the status

advisory for each test changes from UNTESTED to PASSED or FAILED. Except for the Color

Display Test and the All System Tests, when a test is selected from the Mainframe Test

screen, a test screen for that specific test is displayed.

If a mainframe test fails, refer to chapter 5, "Troubleshooting."

ROM Test

This test checks the mainframe ROM on the microprocessor board. The test computes a

checksum for the ROM and compares it to a stored value. For ROM Test failures, you can

suspect a faulty microprocessor board.

8–15

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Theory of Operation

Functional Performance Verification Tests

RAM Test

This test checks the mainframe RAM on the microprocessor board. The test performs a

non-destructive pattern write/read at every location. The initial RAM contents are restored

after the test. For RAM Test failures, first you can suspect a faulty SIMM module, then you

can suspect a faulty microprocessor board.

HP-IB Test

The HP-IB Test checks the basic interface functions of the HP-IB port. Only the internal

portions of the port circuitry is tested. For HP-IB Test failures, you can suspect a faulty

microprocessor board.

RS-232C Test

This test checks the basic interface functions of the RS-232C port. Both internal and external

portions of the port circuitry are tested. In order for the RS-232C test to pass, the RS-232C

loopback connector must be installed on the microprocessor board rear panel. For RS-232C

Test failures, verify the connection of the RS-232C loopback connector, then you can suspect

a faulty microprocessor board.

HIL Test

The HIL Test consists of three parts: the HIL controller test, the front-panel test, and the

touchscreen test. All three tests return a pass or a fail message. This test cannot be run

repetitively. Every time the Run field is touched the HIL test sequence is repeated.

The HIL controller test checks the control circuitry on the microprocessor board. For HIL

controller test failures, you can suspect a faulty microprocessor board.

The front-panel test checks the front-panel circuitry for correct operation. For front-panel

test failures, verify the connection and continuity of the front-panel to microprocessor board

cable. If a problem is not found with the cable, then you can suspect a faulty front-panel

board.

The touchscreen test checks for light pulses between LED (light emitting diode) pairs. For

Touchscreen Test failures, clean the screen and the surrounding area and move any objects

blocking the screen when you turn on the mainframe. Verify the continuity and connection of

the cable from the microprocessor board to the front-panel board. If a problem is not found

with the cable and the Touchscreen Test still fails after cleaning the instrument, you can

suspect a faulty front-panel board.

Disk Test

This test checks both the flexible disk drive and the hard disk drive. The drive controllers are

checked and the correct disk format is verified for both drives. Portions from each sector are

read and verified, and a test file is written, read, and then erased. Because track sparing is not

implemented, a failure in any sector or track constitutes a failure of the disk drive media.

A failure of the flexible disk drive will occur if:

A disk is not inserted in the flexible disk drive.

•

An unformatted disk is inserted in the flexible disk drive.

•

A write-protected disk is inserted in the flexible disk drive.

•

8–16

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Theory of Operation

Functional Performance Verification Tests

Possible problems causing a failed message in either the flexible disk drive or hard disk drive

include the following:

A damaged or disconnected disk drive cable.

•

Wrong disk formatting or no disk formatting.

•

The disk write-protect tab set to the write-protect position.

•

A faulty disk drive.

•

Faulty microprocessor board interface circuitry to the disk drive.

•

For Flexible Disk Test failures, verify the continuity and connection of the disk drive cables,

use formatted disks, and set the write protect tab on the disks to the unprotected position.

Intermodule Test

The Intermodule Test checks the functions of the intermodule timing correlation. This test

fails if there are any connections on the input BNC. For Intermodule Test failures in a

mainframe, you can suspect a faulty microprocessor board. For Intermodule Test failures in a

mainframe connected to an expansion frame, you can suspect a faulty mainframe interface

module.

The Intermodule Test screen shows the mainframe and expansion frame card slots and the

card identification code of the module located in each slot.

Color Display Test

The Color Display Test puts screen patterns and color screens on the monitor. This test is

mainly used to check for color purity. Usually, the purity problem can be solved using a

degaussing coil. If some pixels are not colored, then there is probably a problem with the

Display RAM on the microprocessor board. For Color Display Test failures, degauss the

display. Refer to chapter 2, "Preparing for Use," for degaussing instructions. If the Color

Display Test still fails, you can suspect a faulty microprocessor board or a faulty color display

monitor.

Option Board Test

The Option Board Test is used during troubleshooting to check the data and control signals

through the HP 16501A expansion frame components. This test also verifies the functionality

of the HP 16500L LAN interface module. Refer to the manuals for the HP 16500L for more

information about the LAN interface tests.

All System Tests

The All System Test will perform all the tests listed on the screen on the Mainframe Test

menu, except for the Color Display Test and the Expander Test. When the tests are

complete, the status advisory for each test changes from UNTESTED to PASSED or FAILED.

The status advisory for the Color Display Test and for the Expander Test remains UNTESTED

and the status advisory for the All System Tests changes from UNTESTED to TESTED.

8–17

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HP-IB

The Hewlett-Packard Interface Bus (HP-IB) is Hewlett-Packard’s implementation of

IEEE Standard 488-1978, "Standard Digital Interface for Programming

Instrumentation." HP-IB is a carefully defined interface that simplifies the integration

of various instruments and computers into systems. The interface makes it possible

to transfer messages between two or more HP-IB compatible devices. HP-IB is a

parallel bus of 16 active signal lines divided into three functional groups according to

function.

Eight signal lines, called data lines, are in the first functional group. The data lines

are used to transmit data in coded messages. These messages are used to program

the instrument function, transfer measurement data, and coordinate instrument

operation. Input and output of all messages, in bit parallel-byte serial form, are also

transferred on the data lines. A 7-bit ASCII code normally represents each piece of

data.

Data is transferred by means of an interlocking "Handshake" technique which permits

data transfer (asynchronously) at the rate of the slowest active device used in that

transfer. The data byte control lines coordinate the handshaking and form the

second functional group.

The remaining five general interface management lines (third functional group) are

used to manage the devices connected to the HP-IB. This includes activating all

connected devices at once, clearing the interface, and other operations.

The following figure shows the connections to the HP-IB connector located on the

rear panel.

HP-IB Interface Connector

8–18

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RS-232C

The logic analysis system interfaces with RS-232C communication lines through a

standard 25 pin D connector. The logic analysis system is compatible with RS-232C

protocol. When a hardwire handshake method is used, the Data Terminal Ready

(DTR) line, pin 20 on the connector, is used to signal if space is available for more

data in the logical I/O buffer. Pin outs of the RS-232C connectors are listed in the

following table.

RS-232C Signal Definitions

Number

Function

RS-232C

Standard

Signal Direction and Level

Protective Ground

Not applicable

Transmitted Data (TD)

Data from Mainframe

High = Space = "0" = +12 V

Low = Mark = "1" = –12 V

Received Data (RD)

Request to Send (RTS)

Clear to Send (CTS)

Data Set Ready (DSR)

Data to Mainframe

High = Space = "0" = +3 V to +25 V

Low = Mark = "1" = –3 V to –25 V

Signal from Mainframe

High = ON = +12 V

Low = OFF = –12 V

Signal to Mainframe

High = ON = +3 V to +12 V

Low = OFF = –3 V to –25 V

Signal to Mainframe

High = ON = +3 V to +25 V

Low = OFF = –3 V to –25 V

Signal Ground

Not applicable

Data Carrier Detect (DCD)

Signal to Mainframe

High = ON = +3 V to +25 V

Low = OFF = –3 V to –25 V

Data Terminal Ready (DTR)

Data Signal Rate Selector

Signal from Mainframe

High = ON = +12 V

Low = OFF = –12 V

CH/CI

Signal from Mainframe

Always High = ON = +12 V

8–19

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Warning

Safety Symbols

Packard Company 1987-1994

• Before turning on the

instrument, you must connect the

protective earth terminal of the

instrument to the protective

conductor of the (mains) power

cord. The mains plug shall only be

inserted in a socket outlet

Instruction manual symbol: the

product is marked with this symbol

when it is necessary for you to

refer to the instruction manual in

order to protect against damage to

the product.

Reproduction, adaptation, or

translation without prior written

permission is prohibited, except as

allowed under the copyright laws.

provided with a protective earth

contact. You must not negate the

protective action by using an

extension cord (power cable)

without a protective conductor

(grounding). Grounding one

conductor of a two-conductor

outlet is not sufficient protection.

Restricted Rights Legend

Use, duplication, or disclosure by

the U.S. Government is subject to

restrictions set forth in

Hazardous voltage symbol.

subparagraph (C) (1) (ii) of the

Rights in Technical Data and

Computer Software Clause in

DFARS 252.227-7013.

Hewlett-Packard Company, 3000

Hanover Street, Palo Alto, CA

94304 U.S.A.

• Only fuses with the required

rated current, voltage, and

specified type (normal blow, time

delay, etc.) should be used. Do not

use repaired fuses or

short-circuited fuseholders. To do

so could cause a shock of fire

hazard.

Earth terminal symbol: Used to

indicate a circuit common

connected to grounded chassis.

Rights for non-DOD U.S.

Government Departments and

Agencies are set forth in FAR

52.227-19(c)(1,2).

W A R NI N G

The Warning sign denotes a

hazard. It calls attention to a

procedure, practice, or the like,

which, if not correctly performed

or adhered to, could result in

personal injury. Do not proceed

beyond a Warning sign until the

indicated conditions are fully

understood and met.

• Service instructions are for

trained service personnel. To avoid

dangerous electric shock, do not

perform any service unless

qualified to do so. Do not attempt

internal service or adjustment

unless another person, capable of

rendering first aid and

Document Warranty

The information contained in this

document is subject to change

without notice.

Hewlett-Packard makes no

warranty of any kind with

regard to this material,

including, but not limited to,

the implied warranties of

merchantability or fitness for a

particular purpose.

Hewlett-Packard shall not be liable

for errors contained herein or for

damages in connection with the

furnishing, performance, or use of

this material.

resuscitation, is present.

• If you energize this instrument

by an auto transformer (for voltage

reduction), make sure the common

terminal is connected to the earth

terminal of the power source.

C A U T I O N

The Caution sign denotes a hazard.

It calls attention to an operating

procedure, practice, or the like,

which, if not correctly performed

or adhered to, could result in

damage to or destruction of part or

all of the product. Do not proceed

beyond a Caution symbol until the

indicated conditions are fully

understood or met.

• Whenever it is likely that the

ground protection is impaired, you

must make the instrument

inoperative and secure it against

any unintended operation.

Safety

This apparatus has been designed

and tested in accordance with IEC

Publication 348, Safety

• Do not operate the instrument

in the presence of flammable

gasses or fumes. Operation of any

electrical instrument in such an

environment constitutes a definite

safety hazard.

Requirements for Measuring

Apparatus, and has been supplied

in a safe condition. This is a Safety

Class I instrument (provided with

terminal for protective earthing).

Before applying power, verify that

the correct safety precautions are

taken (see the following warnings).

In addition, note the external

markings on the instrument that

are described under "Safety

Symbols."

• Do not install substitute parts or

perform any unauthorized

modification to the instrument.

• Capacitors inside the instrument

may retain a charge even if the

instrument is disconnected from

its source of supply.

• Use caution when exposing or

handling the CRT. Handling or

replacing the CRT shall be done

only by qualified maintenance

personnel.

Hewlett-Packard

P.O. Box 2197

1900 Garden of the Gods Road

Colorado Springs, CO 80901

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