Bosch Appliances Home Security System DVA 12T User Manual

RAID Subsystem DVA-12T  
DVA-12T iSCSI Premium Series  
en Installation Manual  
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Table of Contents | en  
3
Cooling Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Default Threshold Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
5.1  
5.2  
Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Host Connection Topologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
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en | Table of Contents  
RAID Subsystem DVA-12T | Installation Manual  
Drive Tray Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
Main Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
9.3  
10  
Index. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
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Warnings and Certifications | en  
5
1
Warnings and Certifications  
1.1  
Warning  
A shielded power cord is required in order to meet FCC emission limits and also to prevent  
interference with nearby radio and television reception.  
Use only shielded cables to connect I/O devices to this equipment. You are cautioned that  
changes or modifications not expressly approved by the party responsible for compliance  
could void your authority to operate the equipment.  
1.2  
Safety Precautions  
Precautions and Instructions  
Prior to powering on the subsystem, ensure that the correct power range is being used.  
The RAID subsystem comes with 12 drive bays. Leaving any of these drive bays empty will  
greatly affect the efficiency of the airflow within the enclosure, and will consequently  
lead to the system overheating, which can cause irreparable damage.  
If a module fails, leave it in place until you have a replacement unit and you are ready to  
replace it.  
Airflow Consideration: The subsystem requires an airflow clearance, especially at the  
front and rear. The airflow direction is from front to back.  
Handle subsystem modules using the retention screws, eject levers, and the metal  
frames/face plates. Avoid touching PCB boards and connector pins.  
To comply with safety, emission, or thermal requirements, none of the covers or replace-  
able modules should be removed. Make sure that all enclosure modules and covers are  
securely in place during operation.  
Be sure that the rack cabinet into which the subsystem chassis will be installed provides  
sufficient ventilation channels and airflow circulation around the subsystem.  
Provide a soft, clean surface to place your subsystem on before working on it.  
Servicing on a rough surface may damage the exterior of the chassis.  
If it is necessary to transport the subsystem, repackage all drives separately.  
Dual redundant controller models come with two controller modules that must be  
installed into the subsystem. Single controller modules come with a single controller  
module and a metal sheet is placed over the lower controller bay at the rear of the sub-  
system. Since single controller modules cannot be upgraded, this metal sheet should  
NEVER be removed.  
ESD Precautions  
Observe all conventional anti-ESD methods while handling system modules. The use of a  
grounded wrist strap and an anti-static work pad are recommended. Avoid dust and debris in  
your work area.  
1.3  
Certification  
FCC (applies in the U.S. and Canada)  
FCC Class B Radio Frequency Interference Statement  
This equipment has been tested and found to comply with the limits for a Class B digital  
device, pursuant to Part 15 of the FCC Rules (47 CFR, Part 2, Part 15 and CISPR PUB. 22  
Class B). These limits are designed to provide reasonable protection against harmful interfer-  
ence when the equipment is operated in a residential installation. This equipment generates,  
uses, and can radiate radio frequency energy and, if not installed and used in accordance with  
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RAID Subsystem DVA-12T | Installation Manual  
this user’s guide, may cause harmful interference to radio communications. However, there is  
no guarantee that interference will not occur in a particular installation. If this equipment does  
cause harmful interference to radio or television reception, which can be determined by turn-  
ing the equipment off and on, you are encouraged to try to correct the interference by one or  
more of the following measures:  
Reorient or relocate the receiving antenna.  
Increase the separation between the equipment and receiver.  
Connect the equipment into an outlet on a circuit different from that to which the  
receiver is connected.  
Consult the dealer or an experienced radio/TV technician for help.  
This device complies with Part 15 of FCC Rules. Operation is subject to the following two con-  
ditions: 1) this device may not cause harmful interference, and 2) this device must accept any  
interference received, including interference that may cause undesired operation.  
This device is in conformity with the EMC.  
CB  
(Certified Worldwide)  
This device meets the requirements of the CB standard for electrical equipment with regard to  
establishing a satisfactory level of safety for persons using the device and for the area sur-  
rounding the apparatus. This standard covers only safety aspects of the above apparatus; it  
does not cover other matters, such as style or performance.  
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Introduction | en  
7
2
Introduction  
This hardware manual briefly introduces the DVA 12 T iSCSI-to-SATA-II storage subsystem  
shown in Figure 2.1.  
2.1  
Product Overview  
The RAID subsystem comes with two (2) Ethernet host ports capable of large I/O transfers  
over iSCSI packets. The subsystems come in a 2U-profile rack-mountable chassis which  
houses a RAID controller module featuring complete RAID configuration and maintenance  
functionality. The subsystem’s operation is protected by redundant hot-swappable power sup-  
plies and cooling fan modules. Designed for high level of availability, all major components are  
hot-replaceable including its Li-ION battery, and the RAID-protected disk drives.  
The iSCSI storage supports the connection to network initiators compatible with the IETF  
iSCSI standard (RFC 3720).  
The subsystem facilitates data packaging, using the Internet SCSI (iSCSI) protocols, and  
transmission of block I/Os over LANs. The subsystem is ideal for location-independent data  
storage, backup, and retrieval. It combines the capabilities and block-level performance of  
RAID storage with the high-speed, low-cost, and long-distance Ethernet networking technolo-  
gies.  
Configured arrays are easily combined with multiple ID/LUNs on host ports, turning massive  
capacity into manageable units for data-sharing in a heterogeneous environment.  
Fig. 2.1 RAID Subsystem DVA-12T  
This high-density subsystem supports up to twelve (12) hot swappable, SATA-II hard drives in  
a 2U-profile chassis. The subsystem is powered by the RAID controller board featuring the lat-  
est ASIC266 ASIC as the XOR engine and a pre-installed 1 GB DDR RAM DIMM module.  
The controller board is housed in a metal canister and is referred to as the “controller mod-  
ule.” The controller module is comprised of a PCB board, a rear faceplate, and a metal canis-  
ter. The controller module is accessed through the rear of the subsystem with the help of two  
hand screws. An battery backup unit (BBU) can be installed in the upper left side of the con-  
troller module (when viewed from the rear of the subsystem). The BBU is hot swappable and  
is accessed through the rear of the subsystem enclosure.  
Two (2) RJ-45 connectors connect the RAID controller to network switches or Ethernet ports  
of independent devices. Three (3) hot-swappable cooling modules protect the subsystem  
from overheating, and two (2) hot-swappable power supply unit (PSU) modules provide con-  
stant power to the subsystem. The modular nature of the subsystem and the easy accessibility  
to all major components ensure the ease of the subsystem maintenance.  
A maximum of 31 units can be connected to the subsystem.  
iSCSI Host Ports  
Connectivity: - The iSCSI host ports are capable of 2 GBps Ethernet with full duplex transmis-  
sion. Storage volumes are associated with simulated ID/LUNs on the host channels. These vol-  
umes then appear as iSCSI targets over the network. The connection of these host ports is  
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RAID Subsystem DVA-12T | Installation Manual  
identical with connecting Ethernet network devices either point-to-point to iSCSI initiators or  
using Ethernet switches.  
Other Concerns: - Subnet, gateway, and other access control mechanisms can be applied with  
the iSCSI port connection.  
The RAID subsystem supports connection through Ethernet networks to servers (iSCSI initia-  
tors) using iSCSI HBAs or SCSI packet processing software compliant with the IETF iSCSI  
standard (RFC 3720).  
Channels: - The SCSI-like ID/LUN mapping method enables users to associate storage volumes  
with simulated IDs or LUNs on the host channels. On the drive side, all of the twelve (12)  
SATA drives are connected each through a dedicated SATA channel. Each drive channel is  
routed to an enclosure drive tray that is equipped with a standard SATA connector with hot-  
swap capability. The methods used for assembling physical drives, fault management, and sta-  
tus monitoring are identical to that used with the traditional RAID storage.  
NOTICE!  
On receiving and unpacking your subsystem, please check the package contents against the  
included Unpacking Checklist. If any modules are missing, please contact your subsystem ven-  
dor immediately.  
i
2.2  
Enclosure Chassis  
2.2.1  
Chassis Overview  
The RAID storage subsystem chassis is a 2U metal chassis that is divided into front and rear  
sections. Key components are respectively accessed through front and rear panels. The pre-  
drilled mounting holes in the sides of the 2U RAID subsystem enclosure allow you to attach  
separately purchased slide rails so that you can install the enclosure into a standard 19-inch  
rack or enclosure cabinet.  
NOTICE!  
Components accessed through the front panel are referred to as “Front Panel Components”  
and components accessed through the rear panel are referred to as “Rear Panel Compo-  
nents.”  
i
Fig. 2.2 Locations of Key Components  
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Introduction | en  
9
2.2.2  
Front Panel Overview  
The front section of the subsystem features a 4x3 layout for twelve (12) 3.5-inch drives. The  
two (2) handles on the front of the subsystem enable you to easily insert/extract the chassis  
into/from a rack or cabinet. The front panel of the RAID subsystem described in this manual is  
shown in Figure 2.3. A description of each front panel component is given below:  
Fig. 2.3 RAID Subsystem Front View  
The front panel shown in Figure 2.3 accommodates the following components:  
Drive bays with drive tray canisters: The drive bays house the hard drives.  
Forearm handles: The subsystem has right and left handles for easier rackmounting and  
handling.  
2.2.3  
Hard Drive Numbering  
The front section of the RAID subsystem enclosure houses twelve (12) hard drives in a 4x3  
configuration as shown in Figure 2.4. When viewed from the front, the drive bays (slots) are  
numbered 1 to 12 from left to right, from top to bottom.  
Fig. 2.4 Hard Drive Numbering  
2.2.4  
Rear Panel Overview  
The rear section of the RAID subsystem is accessed through the rear panel and is reserved for  
a single RAID controller module, one (1) BBU, two (2) power supply units (PSUs), and three  
(3) cooling modules.  
A rear view is of the subsystem is shown below. Descriptions of each rear panel component  
are given below:  
Fig. 2.5 RAID Subsystem Rear View  
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The rear panel shown in Figure 2.5 accommodates the following components:  
RAID controller module: A controller board and a DDR RAM DIMM module are housed in  
the controller module to provide the system RAID functionalities. (See Section 2.3.3 The  
RAID Controller Module)  
BBU module: An BBU module sustains cache memory during a power shortage to prevent  
data loss. (See Section 2.3.6 BBU)  
PSU modules: The hot-swappable PSUs provide power to the subsystem. A power switch  
is located on the right of each PSU to turn the system on and off. (See  
Section 2.3.7 Power Supply Units)  
Cooling modules: The redundant cooling modules ventilate the subsystem to reduce the  
temperature within the subsystem. (See Section 2.3.8 Cooling Modules)  
2.2.5  
Backplane Board  
An internal backplane board separates the front and rear sections of the RAID subsystem. The  
PCB board consists of traces for logic level signals and low voltage power paths. It contains  
no user-serviceable components.  
CAUTION!  
When inserting a removable module, DO NOT USE EXCESSIVE FORCE! Forcing or slamming a  
module can damage the pins on the module connectors either on the module itself or on the  
backplane. Gently push the module until it reaches the end of module slot. Feel the contact  
resistance and use slightly more pressure to ensure the module connectors are correctly  
mated. If the module comes with reject levers or retention screws, use them to secure the  
module.  
2.3  
Subsystem Components  
The RAID subsystem houses many active components and most of them can be accessed  
through either the front or rear panel. The modular design of the active components facilitates  
their easy installation and removal. Hot-swap mechanisms are incorporated to eliminate  
power surges and signal glitches that might occur while removing or installing these modules.  
2.3.1  
Front Handles  
Fig. 2.6 Handles  
A left and a right handle are installed on the front side of the chassis. Each handle has a  
release latch to secure the position of the handle when closed. (See Figure 2.6) To access  
drive bays in the left or right column behind the handles, first flip the release latch on the  
enclosure front handles, and then swing the handles to the left and right sides, respectively.  
(See Figure 2.7) To close the handles, swing the handles toward the system; gently press the  
handles until a click is heard. The latches will keep the handles in place.  
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Introduction | en  
11  
Fig. 2.7 Opening One of the Front Handles  
2.3.2  
Drive Trays  
Fig. 2.8 Drive Tray Front View  
The RAID subsystem comes with twelve (12) drive trays (see Figure 2.8) designed to accom-  
modate separately purchased, standard 1-inch pitch, 3.5-inch disk drives. The drive bays are  
easily accessible from the front of the enclosure. Two (2) LEDs on the front of the tray indi-  
cate the drive status. A key-lock on each drive tray secures the hard drive in place, while an  
easily accessible release button ensures fast and efficient drive hot-swapping.  
CAUTION!  
Be careful not to warp, twist, or contort the drive tray in any way (e.g., by dropping it or rest-  
ing heavy objects on it). The drive tray has been customized to fit into the drive bays in the  
RAID subsystem. If the drive bay superstructure is deformed or altered, the drive trays may  
not fit into the drive bay.  
2.3.3  
The RAID Controller Module  
The RAID controller module contains a main circuit board, a preinstalled 1 GB capacity (or  
above) DDR RAM DIMM module, and the controller module interfaces. The controller module  
contains no user-serviceable components. Except when installing/upgrading the cache mem-  
ory inside, the controller module should never be removed or opened.  
CAUTION!  
Although the RAID controller can be removed, the only time you should touch the controller  
itself is to install the memory modules. The RAID controller is built of sensitive components  
and unnecessary tampering can damage the controller.  
The heart of the RAID controller subsystem is the iSCSI-to-SATA controller board. The control-  
ler comes with two (2) Ethernet host ports. The subsystem connects to the host through RJ-  
45 connectors, while the connectors are also ready to connect to one or more network  
switches, enabling access to your storage volumes in complex configurations such as data-  
sharing or network zoning.  
The docking connector at the rear of the controller board connects the controller module to  
the backplane board. A DDR RAM DIMM socket is strategically placed in an easily accessible  
location on the controller board for easy insertion of the DDR RAM DIMM module.  
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2.3.4  
Controller Module Interfaces  
All external interfaces that connect to external devices are located on the controller module  
rear panel shown below. The interfaces are listed below.  
Fig. 2.9 Controller Module Interfaces – 2-port version  
Host ports: Two (2) Gigabit Ethernet host ports (simulated and  
indicated as CH0 and CH1 in the diagram shown above) connect the RAID subsystem to  
the networked iSCSI initiators through two (2) RJ-45 connectors.  
COM port: The controller module comes with one (1) COM port.  
This port is used for local access to the firmware embedded  
configuration utility from a management computer.  
LED indicators: Five (5) LED indicators illustrate the system  
statuses for system monitoring. Please see Section 4 Subsystem Monitoring for more  
information.  
Hand screws: Two (2) hand screws located in the sides of the controller rear panel pro-  
vide easy controller module installation and secure the controller module in place.  
2.3.5  
2.3.6  
DIMM Module  
The controller module comes with a preinstalled 1 GB capacity or above DDR RAM DIMM mod-  
ule. The DIMM module is placed in an easily accessed location on the controller board. How-  
ever, when the DIMM module is being changed, the controller module must be removed from  
the subsystem chassis.  
BBU  
An Li-ION battery backup unit (BBU) module (see Figure 2.10) can sustain cache memory for  
days after a power failure. If you purchased a BBU, it will be installed on the upper left side of  
the controller module in the rear of subsystem chassis.  
Fig. 2.10 BBU Module  
In accordance with international transportation regulations, the BBU module is only charged  
to between 35% and 45% of its total capacity when shipped. Therefore, when powering on the  
subsystem for the first time (see Section 5.3 Power On) the BBU will begin to charge its batter-  
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Introduction | en  
13  
ies to their full capacity. It normally requires approximately twelve (12) hours for the battery  
to be fully charged. If the battery is not fully charged after twelve (12) hours, there is a prob-  
lem with the BBU module and you should contact your subsystem vendor immediately. While  
the battery is being charged, the LED on the BBU rear panel and the sixth LED on the rear  
panel of the controller module will flash. (See Section 4.2.5 BBU Module LED and  
Section 4.2.6 PSU LEDsfor details on the LED indicators.)  
You can check the status of the battery’s charge via RAIDWatch or the firmware utility screen.  
2.3.7  
Power Supply Units  
The RAID subsystem is equipped with two (2) redundant, hot-swappable, 350W PSUs, which  
are accessed through the rear of the enclosure. The PSU is permanently mounted into a 2U  
(dual-level) bracket especially designed to house both the PSU and a cooling module, which is  
mounted in the lower part of the 2U bracket.  
NOTICE!  
Hot-swapping the PSU also removes the cooling module at the lower slot.  
i
As shown in Figure 2.11, each PSU comes with a single power socket for power cord plug-in,  
and a power switch on the right to turn the subsystem on and off. Two (2) embedded cooling  
fans provide sufficient airflow to keep the PSU cool. A single LED indicates the PSU status.  
When any power supply failure occurs, such as over-voltage or fan failure, the LED shines red.  
A handle at the back of the PSU has been especially designed to enable you to remove the  
PSU from the subsystem while the subsystem is online. This should only be done if the PSU  
has failed and needs to be replaced.  
A retention screw at the top of the PSU module secures the PSU to the enclosure. To remove  
the PSU, the retention screw must be removed first. When installing a new PSU module, make  
sure that the retention screw has been firmly secured.  
Fig. 2.11 PSU Module  
For the PSU specifications, please refer to Section 8 Spare Parts and Accessories.  
2.3.8  
Cooling Modules  
The two subsystem models are all equipped with three (3) 1U, single-fan, hot-swappable cool-  
ing modules. They are installed in the cooling module slots located underneath the controller  
module and PSU modules (see Figure 2.12.) The cooling fans operate at two (2) fan speed lev-  
els. When the subsystem is running in normal ambient temperature, the fans operate at the  
lower speed. When the upper temperature threshold is exceeded, the fans automatically raise  
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their rotation speed to generate more cooling air to extract the heat generated by the hard  
drives.  
Fig. 2.12 Cooling Module  
2.4  
Subsystem Monitoring  
The RAID subsystem comes with a number of different monitoring methods that provide you  
with continual updates on the status of the system and individual components. The following  
monitoring features are included in the subsystem.  
2.4.1  
I2C bus  
2
The following elements are interfaced to the RAID controller over a non-user-serviceable I C  
bus:  
Cooling modules  
Temperature sensors (for detecting the temperature of the backplaneboard and control-  
ler board)  
2.4.2  
LED Indicators  
The following active components come with LEDs to indicate the status of the individual com-  
ponent:  
RAID controller (9 LEDs)  
BBU module (1 LED)  
Cooling modules (1 LED on each module)  
PSU modules (1 LED on each module)  
Drive trays (2 LEDs on each tray)  
2.4.3  
2.4.4  
Firmware (FW)  
The firmware is pre-installed software used to configure the subsystem. The latest firmware  
functionalities include Task Scheduler, Intelligent Drive Handling, and Media Scan. Media  
Scan handles low quality drives in both the degraded mode and during the rebuild process.  
Maintenance tasks will then be performed on an entire array or specific hard drives. Various  
options are user-configurable such as priority, start time, and execution intervals.  
Audible Alarms  
The RAID subsystem comes with audible alarms that are triggered when certain active compo-  
nents fail or when pre-configured (RAID controller or subsystem) thresholds are exceeded.  
Whenever you hear an audible alarm from the RAID subsystem, it is imperative that you deter-  
mine the cause and rectify the problem immediately.  
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Introduction | en  
15  
Event notification messages indicate the completion or status of array configuration tasks and  
are always accompanied by two (2) or three (3) successive and prolonged beeps.  
CAUTION!  
Failing to respond when an audible alarm is heard can lead to permanent damage of the RAID  
subsystem. When an audible alarm is heard, rectify the problem as soon as possible.  
2.5  
Hot-swappable Components  
2.5.1  
Hot-swap Capabilities  
The RAID subsystem comes with a number of hot-swappable components. A hot-swap compo-  
nent is one that can be exchanged while the subsystem is still online without affecting the  
operational integrity of the subsystem. These components should only be removed from the  
subsystem when they are being replaced. At no other time should these components be  
removed from the subsystem.  
2.5.2  
2.5.3  
Components  
The following components are hot-swappable:  
Power supply units (PSUs)  
Cooling modules  
BBU module  
Hard drives  
Normalized Airflow  
Proper subsystem cooling is referred to as “normalized” airflow. Normalized airflow ensures  
the sufficient cooling of the subsystem and is only attained when all components are properly  
installed. Therefore, a failed component should only be hot-swapped when a replacement is  
available. If a failed component is removed but not replaced, permanent damage to the sub-  
system can result.  
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3
Hardware Installation  
3.1  
Introduction  
This chapter gives detailed instructions on how to install the subsystem. When installing the  
subsystem, it is necessary to mount the chassis into a rack or cabinet and to install hard  
drives and drive trays. Installation into a rack or cabinet should occur before the hard drives or  
drive trays are installed into the subsystem. Please confirm that you received all of the compo-  
nents listed on the Unpacking List that came with the subsystem before proceeding with the  
installation process.  
CAUTION!  
Please note that the installation instructions described in this manual should be carefully fol-  
lowed to prevent any difficulties and damages to your system.  
3.2  
Installation Prerequisites  
1. Static-free installation environment: The RAID subsystem must be installed in a static-free  
environment to minimize the possibility of electrostatic discharge (ESD) damage. (See  
Section 3.3.2 Static-free Installation )  
2. Component check: Before installing the RAID subsystem, you should first check to see  
that you have received all the required components. (See Section 3.5 Unpacking the Sub-  
system) If any items appear damaged, contact your vendor for a replacement.  
3. Cabling: The RAID models all come with one (1) audio-jack-to-DB9 cable to facilitate the  
connection of the COM port for terminal emulation management. Two (2) power cords  
are provided for the power connections to the power sources. The RJ-45 cables for host  
and external devices connections are user-supplied. Please see Section 5 Subsystem Con-  
nection and Operation for sample topologies and configuration options.  
4. Memory module: If you wish to change the pre-installed memory module, a separately pur-  
chased module must be installed. (See Section 6.3 DIMM Module Replacement)  
5. Rack installation: The enclosure chassis can be installed into rack cabinet using separately  
purchased mounting rails, rear-attached brackets, or Bosch’s slide rails (see  
Section 3.6 Rack/Cabinet Installation).  
3.3  
Safety Precautions  
3.3.1  
Precautions and Instructions  
1. Be sure the correct power range (100-120 or 220-240VAC) is supplied by your rack cabi-  
net or power outlet.  
2. Thermal notice: All drive trays (even if they do not contain a hard drive) must be installed  
into the enclosure. Leaving a drive bay or module slot open will severely affect the airflow  
efficiency within the enclosure, and will consequently lead to system overheating. Keep a  
faulty module in place until you have a replacement unit and you are ready to replace it.  
3. An enclosure without disk drives can weigh over 24 kilograms. Two (2) people are  
required to install or relocate the subsystem. Drives should be removed from the enclo-  
sure before moving the subsystem.  
4. Airflow considerations: The subsystem requires an airflow clearance especially on the  
front and rear. For proper ventilation, a minimum of 2.5cm is required between the front  
of the enclosure and rack cover; a minimum of 5cm is required between the enclosure  
and end of the rack.  
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5. Handle the system modules by the retention screws, eject levers, or the modules metal  
frames/face plates only. Avoid touching the PCB boards and connector pins.  
6. None of the covers or replaceable modules should be removed in order to maintain com-  
pliance with safety, emission, or thermal requirements.  
7. Always secure every enclosure module by its retaining screws or make sure it is held in  
place by its latches.  
8. Always make sure the subsystem has a safe electrical earth connection via power cords  
or chassis ground by the rack cabinet.  
9. Be sure that the rack cabinet in which the subsystem chassis is to be installed provides  
sufficient ventilation channels and airflow circulation around the subsystem.  
10. Provide a soft, clean surface to place your enclosure on before working on it. Servicing  
the enclosure on a rough surface may damage the finish of the chassis.  
11. If it is necessary to transport the subsystem, repackage all disk drives separately.  
3.3.2  
Static-free Installation  
Static electricity can damage the system’s electronic components. To prevent ESD damage to  
any of the components, follow these precautions before touching or handling them:  
Discharge the static electricity accumulated in your body by wearing an anti-static wrist-  
band.  
Avoid carpets, plastic, vinyl, and styrofoam in your work area.  
Handle all components by holding their edges or metal frames. Avoid touching the  
exposed circuitry on PCB boards and connector pins.  
3.4  
General Installation Procedure  
Following all the instructions provided below can save subsystem installation time. Detailed,  
illustrated instructions for each component are given in the following sections.  
1. Unpack: Unpack the subsystem and confirm that all the components on the Unpacking  
Checklist have been included. (See Section 3.5 Unpacking the Subsystem)  
2. Rack/Cabinet installation: If the subsystem is going to be installed in a rack or cabinet, it  
should be installed prior to installing the hard drives. Installing the subsystem into a rack  
or cabinet requires at least two (2) people. (See Section 3.6 Rack/Cabinet Installation)  
3. Install drive trays: After the hard drives have been installed into the drive trays, the drive  
trays must be installed into the enclosure itself. (See Section 3.7 Drive Tray Installation)  
4. Cable connection: Use the power cables that came with the subsystem to connect the  
subsystem to the main power source. Use self-purchased RJ-45 cables (see  
Section 5 Subsystem Connection and Operation for more details) to connect host ports to  
the network or external devices.  
5. Power up: Once the components have been properly installed and all cables are properly  
connected, you can power up the subsystem and configure the RAID array. (See  
Section 5.3 Power On)  
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Installation Procedure Flowchart  
Table 3.1 shows a flowchart of the installation procedure. As you complete each step, check  
off the “Done” box on the right. Please use this flowchart in conjunction with the instructions  
that follow.  
Installation Procedure  
Done  
1
2
5
6
7
Unpack  
See Section 3.7 Drive Tray Installation  
Rack/Cabinet Installation  
Drive Tray Installation  
Cable Connection  
Power On  
See Section 5.3 Power On  
Table 3.1 Installation Procedure Flowchart  
3.5  
Unpacking the Subsystem  
Use the Unpacking Checklist in your package to verify package contents. Carefully check the  
items contained in each box before proceeding with installation.  
NOTICE!  
A detailed packing list can be found in your product shipping package or product CD.  
i
3.6  
Rack/Cabinet Installation  
The 2U RAID subsystem has been designed to fit into a standard cabinet or rack. Two (2) slide  
rails are available for installing the subsystem into a rack or cabinet (see  
Section 8.2 Accessories). The subsystem should be installed in the rack or cabinet before the  
hard drives and the drive trays are installed. If the drive trays with the associated hard drives  
are installed, the subsystem will be too heavy to mount into a rack or cabinet. When installing  
the subsystem into a rack or cabinet it is advisable that three (3) people assist in the mount-  
ing process.  
To install the subsystem into a rack or cabinet, please refer to the installation instructions that  
came with the slide rails.  
3.7  
Drive Tray Installation  
Once the hard drives have been installed in the drive trays, the drive trays can be installed into  
the RAID subsystem.  
CAUTION!  
All drive trays must be installed into the enclosure even if they do not contain a hard drive. If  
the trays are not installed into the enclosure, the ventilation required for cooling will not be  
normalized and the subsystem will overheat.  
1. All drive trays must be installed into the enclosure even if they do not contain a hard  
drive. If the trays are not installed into the enclosure, the ventilation required for cooling  
will not be normalized and the subsystem will overheat. Make sure the key-lock is in the  
unlocked position, i.e., the groove on its face is in a horizontal orientation. If the groove is  
in a vertical position, then the key-lock is locked and the front flap on the drive tray can-  
not be opened.  
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Fig. 3.1 Front View of an Individual Drive Tray  
2. Open the front flap on the drive tray. (See Figure 3.2) Push the release button on the front  
of the drive tray. The front flap will open in an upward direction.  
Fig. 3.2 Drive Tray Front Flap  
3. Align the drive tray with the slot in which you wish to insert it. Make sure that it is resting  
on the rails inside the enclosure. Once the drive tray is lined up with the slot, gently slide  
it in. This should be done smoothly and gently. (See Figure 3.3)  
Fig. 3.3 Installing a Drive Tray  
4. Close the front flap on the drive tray. Make sure the front flap is closed properly to ensure  
that the SATA connector at the back of the drive tray is firmly connected to the corre-  
sponding connector on the backplane board. If the front flap is not closed properly, the  
connection between the hard drive and the subsystem will not be secure.  
5. Lock the flap into place by turning the key-lock until the groove on its face is pointing  
down (vertical orientation). (See Figure 3.4)  
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Fig. 3.4 Drive Tray Key-lock Rotation  
6. Once the drive tray is inserted, the RAID subsystem will recognize the drive and scan it in  
automatically.  
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4
Subsystem Monitoring  
4.1  
Subsystem Monitoring Overview  
The RAID subsystem is equipped with a variety of self-monitoring features that help to keep  
subsystem managers informed of the subsystem operational status. These monitoring fea-  
tures provide vital feedback to help you maintain the operational integrity of the subsystem.  
Prompt response to warnings and subsystem component failure notifications will improve the  
overall operation of the subsystem and help ensure the longevity of the RAID subsystem.  
Self-monitoring features include:  
Firmware (FW): The controller in the RAID subsystem comes with preinstalled firmware,  
which can be accessed using a PC hyper-terminal connected through the RAID sub-  
system’s COM port. Device status information can be obtained from the FW configuration  
utility.  
RAIDWatch: RAIDWatch is a fully integrated, Java-based,  
Graphical User Interface (GUI) that came with the subsystem and can be used to monitor  
and maintain the subsystem using your web browsers. Connection to RAIDWatch is made  
using the existing Ethernet ports.  
The RAIDWatch Panel View can be customized to show a direct, graphical representation  
of the RAID subsystem in the content panel of the RAIDWatch screen. Panel View allows  
you to quickly determine the operational status of critical components.  
Bosch RAIDWatch Server: The Bosch RAIDWatch Server is a powerful module that runs as  
an independent program from RAIDWatch and can be installed redundantly on different  
hosts. It is used for event notification via email, fax, LAN broadcast, SNMP traps, MSN  
Messenger, ICQ, SMS (Short Message Service), and the configuration utility screen. The  
Configuration Client helps prevent blind time and keeps you constantly informed as to  
the status of the storage management subsystem. Instructions on how to activate the  
Configuration Client functionality are given in the RAIDWatch User’s Manual.  
LEDs: Device-status-indicating LEDs are located on all active components. These LEDs  
inform you of the integrity of a given component or a given link. You should become famil-  
iar with the different LEDs that are present on the subsystem and be aware of their func-  
tions. (See Section 4.2 Status-indicating LEDs)  
Audible alarm: An audible alarm is present on the subsystem  
controller board and will be triggered if any of a number of threatening events occurred.  
These events usually jeopardize the functional and operational integrity of the controller  
board and must be heeded at all times. Events such as a breaching of the temperature  
threshold will trigger the alarm. If a subsystem manager is present, the manager should  
use the PC hyper-terminal to determine the cause of the alarm and take the appropriate  
corrective measures. (See Section 4.3 Audible Alarm)  
Inter-Integrated Circuit (I2C): The I2C bus monitors the  
operational integrity of the cooling modules, RAID controller board temperature and volt-  
age readings.  
Subsystem monitoring is a necessary part of subsystem management. If failure events or other  
disruptive events are detected and reported, the subsystem managers must take the appropri-  
ate action to rectify the problem. Failure to act in a properly specified manner to a system  
event (like overheating) can cause severe and permanent damage to the subsystem.  
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4.2  
Status-indicating LEDs  
4.2.1  
Brief Overview of the LEDs  
The following devices all come with LEDs that inform subsystem managers about the opera-  
tional status of the component on which they are mounted. The RAID subsystem has status-  
indicating LEDs distributed over the active components in the following ways:  
Component  
Drive Trays  
LEDs per Unit  
Total LEDs  
Definition  
2
9
24  
9
See Section 4.2.2 Drive Tray LEDs  
Controller  
Module  
See Section 4.2.3 Controller Module  
LEDs  
Ethernet Ports  
2
1
4 (2 ports)  
1
See Section 4.2.4 Ethernet Port LEDs  
See Section 4.2.5 BBU Module LED  
BBU Module  
(if BBU is  
installed)  
PSU Module  
1
2
3
See Section 4.2.6 PSU LEDs  
Cooling Module 1  
See Section 4.2.7 Cooling Module  
LEDs  
Table 4.1  
4.2.2  
Drive Tray LEDs  
Two (2) LED indicators are located on the right side of each drive tray. (See Figure 4.1) Refer  
to Table 4.2 for the LED definitions. When notified by a drive failure message, you should  
check the drive tray indicators to find the correct location of the failed drive. Replacing the  
wrong drive can fail two members of a logical array and thus render the array data unrecover-  
able.  
Fig. 4.1 Drive Tray LEDs  
Name  
Color  
Status  
Drive Busy  
Blue  
FLASHING indicates data is being written to or read from the drive.  
The drive is busy.  
OFF indicates that there is no activity on the drive.  
Power Status Green/ GREEN indicates that a drive is installed in the drive tray  
Red RED indicates that there is a drive failure.  
Table 4.2 3-2: Drive Tray LED Definitions  
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4.2.3  
Controller Module LEDs  
The rear panel of the controller module is shown in Figure 4.2. The LEDs on the controller’s  
faceplate that can be accessed from the rear of the enclosure are numbered from 1 to 6. The  
definitions are shown in Table 4.3.  
Fig. 4.2 LEDs on the Controller Module  
LED  
Name  
Ready  
Color  
Status  
1
Green  
FLASHING indicates controller initialization is taking place.  
ON indicates the controller is active and operating nor-  
mally.  
OFF indicates the controller is not ready for operation.  
2
3
Hst_Bsy (Host Green  
Busy)  
FLASHING indicates there is activity on the host ports.  
OFF indicates there is no activity on the host ports.  
Drv_Bsy (Drive Green  
Busy)  
FLASHING indicates there is activity on the drive side.  
OFF indicates there is no activity on the drive side.  
4
5
N/A  
-
Currently not defined  
C_Dirty (Cache Amber ON indicates that data is currently being cached in memory  
Dirty)  
or is being held up by the BBU during a system power loss.  
6
BBU_Fail  
Amber ON indicates the BBU has failed and cannot sustain the  
cache memory.  
OFF indicates the BBU can sustain cached data in memory.  
FLASHING indicates the BBU is charging.  
Table 4.3 Controller Module LED Definitions  
4.2.4  
Ethernet Port LEDs  
Two (2) host ports, which provide two (2) connection speeds, are on the rear of the controller  
module. Shielded or non-shielded, Cat6 straight-through Ethernet cables can be used to con-  
nect the RJ-45 ports to the network. Two (2) LEDs located on each Ethernet port indicate the  
Ethernet connection speed and status. See Figure 4.3 for the locations of the two (2) LED  
indicators. Refer to Table 4.4 for the LED definitions.  
Fig. 4.3 LAN Indicators  
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Name  
Color  
Status  
Speed LED  
Green  
ON indicates the connection speed is running at 1Gigabit per  
second  
OFF indicates the connection speed is running at 10/100Mb per  
second  
Status LED  
Green  
ON indicates currently connected to a LAN  
FLASHING indicates active transmission  
Table 4.4 LAN Port LED Definitions  
4.2.5  
BBU Module LED  
The BBU module has an LED on the right side of the rear panel. (See Figure 4.4) The function  
is the same as the sixth LED on the controller module. The LED is off when the BBU is func-  
tioning normally and is able to sustain the cache memory. The LED flashes to indicate the BBU  
is charging. If the LED is illuminating amber, please re-charge the BBU or contact your system  
vendor to verify the problem.  
Fig. 4.4 BBU Module LED  
4.2.6  
PSU LEDs  
Each PSU comes with a single LED at the back (see Figure 4.5), located just above the power  
switch that turns on the subsystem. This LED indicates the operational status of the PSU mod-  
ule. Please refer to the PSU LED definitions shown in Table 4.5.  
Fig. 4.5 PSU Module LED  
Color  
Status  
Flashing Green The power supply has not been turned on. The PSU module LED will blink  
when the subsystem is connected to a power source but not yet turned on.  
Static Green  
Static Red  
OFF  
The PSU is operating normally and experiencing no problem.  
The PSU has failed and is unable to provide power to the subsystem.  
The PSU is not turned on. The PSU module LED will remain off even if the  
power cable has been plugged in but the power switch is not turned on.  
Table 4.5 PSU Module LED Definitions  
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4.2.7  
Cooling Module LEDs  
Each cooling module has one (1) red LED on the back. The LED corresponds to the single fan  
in the cooling module. (See Figure 4.6) When the LED is on, it indicates the fan has failed.  
When the LED is off, it indicates the fan is functioning properly.  
Fig. 4.6 Cooling Module LEDs an Cooling Fan Locations  
The subsystem has a novel approach to stabilizing the temperature within the subsystem:  
When the intelligent sensors on the backplane detect higher temperature, such as high ambi-  
ent temperature or the failure of any cooling or PSU module, the system will turn the cooling  
fans to high speed to extract more heat. Once the ambient temperature cools down to normal  
or the cooling or PSU modules have been replaced, the cooling fans will return to low speed.  
4.3  
Audible Alarm  
Different controller environmental and operational parameters (like temperature, etc.) have  
been assigned a range of values between which they can fluctuate. If either the upper or lower  
thresholds are exceeded, an audible alarm will automatically be triggered. The alarm will also  
be triggered when an active component on the RAID subsystem fails. If the RAID subsystem  
manager is onsite and hears an alarm, the manager must read the error message on the PC  
terminal or RAIDWatch screen to determine what has triggered the alarm. After determining  
what has occurred, the RAID subsystem manager must take appropriate actions to rectify the  
problem.  
CAUTION!  
If an alarm is triggered it is necessary for you to determine the problem. If the audible alarm is  
ignored and the problem is not rectified, unexpected damages may occur.  
4.3.1  
Default Threshold Values  
Table 4.6 shows the default threshold values for the RAID subsystem. If any of these values are  
surpassed, the alarm will sound:  
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Upper Threshold  
+3.6V  
Lower Threshold  
+3.3V  
+5V  
+2.9V  
+5.5V  
+13.2V  
95ºC  
80ºC  
+4.5V  
+10.8V  
5ºC  
+12V  
CPU Temperature  
Controller Board  
Temperature  
5ºC  
Enclosure Ambient  
Temperature  
40ºC  
0ºC  
Table 4.6 Default Threshold Values  
The thresholds in Table 4.6 are default threshold values and may be changed.  
4.3.2  
Failed Devices  
If any of the following components fails, the audible alarm will be triggered:  
RAID controller module  
Cooling fan modules  
PSU modules  
BBU module  
Hard disk drives  
NOTICE!  
When the temperature exceeds a preset threshold, the controller’s charger circuits will stop  
charging. You will then receive a message that says “Thermal Shutdown/Enter Sleep Mode.”  
When the temperature falls back within normal range, the battery will resume charging.  
i
4.4  
I2C Monitoring  
2
The operating status of PSU and cooling fan modules are collected through an I C serial bus. If  
either of these modules fails, the failure will be detected and you will be notified through the  
various methods described above.  
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5
Subsystem Connection and Operation  
5.1  
Cabling  
Following are the requirements on the type of cables used to connect the subsystem’s iSCSI  
host ports:  
Gigabit Ethernet network cables.  
Cat6 type cables or better performance types.  
Straight-through Ethernet cables with RJ-45 plugs.  
Use of cross-over cables can also automatically be detected and re-routed for a valid con-  
nection.  
Connection can be made directly to iSCSI initiators or through Gigabit Ethernet switches, to  
servers equipped with an iSCSI HBA, and then to client stations with a normal NIC or iSCSI  
HBA. The subsystem presents its logical capacity volumes through SCSI-like IDs and LUN’s,  
and these volumes appear as iSCSI targets through the network.  
NOTICE!  
All cables must be handled with care. Make sure Ethernet cables do not run parallel with  
power cords. To prevent interference within a rack system, the cable routing path must be  
carefully planned and they must not be bent.  
i
5.2  
Host Connection Topologies  
The RAID subsystem provides two Gigabit Ethernet ports. The host-side connection can be  
made as the following:  
Directly attached to the VIP X1600 encoder unit  
Connection through Ethernet Switch  
Network configurations, such as subnet or VLAN settings, can be applied as long as perma-  
nent IPs are available with the subsystem’s iSCSI host ports. Automatic assignment methods,  
such as DHCP, are not recommended for configuring the iSCSI connection. RAIDWatch need  
to access the array over standard TCP/IP and RAIDWatch may not recognize an array if port  
IPs have been changed.  
Channel Default Settings  
Model  
Host Channels  
CH0 and CH1  
Drive Channels  
RAID subsystem  
Channels 2 to 13, each dedi-  
cated to one connected drive  
Table 5.1 Subsystem’s Default Channel Settings  
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5.2.1  
Direct-Attached, Single Connection  
In the configuration shown in Figure 5.1, the iSCSI drive is attached directly to the VIP X1600  
encoder unit. The advantage of this configuration is recording traffic is not loaded onto the  
network. Furthermore, a general network failure will not affect the recording.  
NOTICE!  
There is no traffic in the network. In case of net failure recording will not be interrupted.  
i
Fig. 5.1 Sample Topology: Multiple Servers Each with Single Connection  
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5.2.2  
Connection through an Ethernet Switches  
In the configuration shown in Figure 5.2 all codecs and cameras are connected via an Ethernet  
Switch. This is a standard configuration for using IP cameras and codecs sharing the same  
iSCSI drive.  
A maximum of 31 units can be connected. In this case, a unit is defined by having one (1) IP  
address, so e.g. a unit can be either a VIP X1, a Dinion IP camera or one VIP X1600 module.  
Fig. 5.2 Connection through an Ethernet Switch  
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5.3  
Power On  
Once all the components have been installed in the RAID subsystem, the iSCSI ports have  
been connected to the network, power on the network devices, the subsystem, and then  
power on the servers/iSCSI initiators.  
5.3.1  
Check List  
Before powering on the RAID subsystem, please check the following:  
Memory Modules – Memory modules have been correctly installed on the controller  
boards. You may skip this if you have not changed the pre-installed module.  
BBU Modules – If used, that the BBU modules have been installed correctly.  
Hard Drives – Hard drives have been correctly installed on the drive trays.  
Drive Trays – ALL the drive trays, whether or not they have a hard drive, have been  
installed into the subsystem.  
Cable Connections – The iSCSI ports on the subsystem have been correctly connected to  
the initiator or the Ethernet network.  
Power Cords – The power cords have been connected to the PSU modules on the sub-  
system and plugged into main power.  
Ambient Temperature – All the subsystem components have been acclimated to the sur-  
rounding temperature.  
5.3.2  
Power On Procedure  
When powering on the RAID subsystem, please follow these steps.  
1. Power on the network connection devices.  
These devices include the Ethernet switches, iSCSI routers, and any other such devices  
that have been connected to the RAID subsystem. Please refer to the documentation that  
came with your network device to see the power on procedure.  
2. Power on the RAID subsystem.  
The RAID subsystem should only be powered on after all the network connection devices  
have been powered on first. Consult your network administrators for proper network  
configurations. The power on procedure for the RAID subsystem is described below.  
3. Power on the initiators.  
The servers or iSCSI initiators should be the last devices that are turned on. Please refer  
to the documentation that came with your initiator systems to see their own power on  
procedures.  
5.3.3  
Power On Enclosure  
To power on the subsystem, turn on the two power switches located on the rear panel of the  
subsystem. (See Figure 5.33) Each switch controls a single PSU, therefore make sure that  
both switches are turned on. There is no limitation on which PSU should be powered on first.  
Fig. 5.3 RAID Subsystem Power Switches  
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NOTICE!  
Although the PSUs are redundant and a single PSU can provide sufficient power to the sys-  
tem, it is advisable to turn both of the power switches on. If only one PSU is operating and  
fails, system operation will be terminated.  
i
5.3.4  
Power On Status Check  
Once the subsystem has been powered on, the status of the entire subsystem should be  
checked to ensure that everything is running smoothly and that there are no complications or  
malfunctions.  
Controller Module LEDs – The controller ready, Host Ports Active, and Device Ports  
Active LEDs should all flash green.  
Drive Tray LEDs – The green LED for all the drive trays (that contain hard drives) should  
light up, showing that there is power.  
Firmware and RAIDWatch – The overall status of the system may be checked using the  
embedded firmware utility or the RAIDWatch GUI screen.  
Audible Alarm - If any errors occur during the initialization process, the onboard alarm will  
sound in a hastily repeated manner.  
Drive tray LEDs should normally start flashing right after power-on, indicating the RAID control  
units are attempting to access the hard drives.  
NOTICE!  
The subsystem has been designed to run continuously. Even if a component failure occurs the  
fault can be corrected online.  
i
5.4  
Power Off Procedure  
To power down the RAID subsystem, please follow these steps:  
NOTICE!  
When powering down the RAID subsystem, please ensure that no time-consuming processes,  
like a “Logical Drive Parity Regeneration” or a “Media Scan,” are taking place.  
i
1. Stop I/O access to the system.  
Stop all I/O accesses to the RAID subsystem. Please refer to the related documentation  
of your applications.  
2. Flush the cache.  
Locate the Cache_Dirty LED on the back of controller module to check if there is still  
cached data in memory. Use the Shutdown Controller function to flush all cached data.  
This prepares the RAID subsystem to be safely powered down.  
3. Turn off the power.  
Turn off the power switches at the top of the rear panel of the RAID subsystem. Once the  
RAID subsystem has been powered down, other devices connected to the subsystem may  
be powered down.  
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6
Subsystem Maintenance and Upgrading  
6.1  
Overview  
6.1.1  
Maintenance  
Constant monitoring and maintenance of your RAID subsystem will minimize subsystem down-  
time and preserve the working integrity of the system for a longer period of time. If any of the  
subsystem components fail, they must be replaced as soon as possible.  
CAUTION!  
Do not remove a failed component from the subsystem until you have a replacement on hand.  
If you remove a failed component without replacing it, the internal airflow will be disrupted  
and the system will overheat causing damage to the subsystem.  
1. Controller module – Section 6.2 Replacing Controller Module Components  
3. BBU module - Section 6.4 Replacing a Faulty BBU Module  
5. Cooling fan modules – Section 6.6 Cooling Module Maintenance  
6. Hard drives – Section 6.7 Replacing a Failed Hard Drive  
6.1.2  
General Notes on Component Replacement  
With the exception of the RAID controller module, all of the components on the RAID sub-  
system, including the PSU modules, cooling modules, and drive trays, are hot-swappable  
and can be replaced while the subsystem is still in operation  
Qualified techniciens who are familiar with the RAID subsystem should be the only ones  
who make component replacements. If you are not familiar with the RAID subsystem and/  
or with RAID subsystem maintenance in general, it is strongly advised that you refer sub-  
system maintenance to a suitably qualified maintenance technicien.  
Normalized airflow is directly dependent upon the presence of all subsystem compo-  
nents. Even if a subsystem component fails, it should not be removed from the sub-  
system until a replacement is readily at hand and can be quickly installed. Removing a  
subsystem component without replacing it can lead to permanent subsystem damage.  
When replacing any hot-swappable component, caution should be taken to ensure that  
the components are handled in an appropriate manner. The rough or improper handling  
of components can lead to irreparable damage.  
When, if necessary, removing a RAID controller module from the subsystem, ensure that the  
power has been turned off and that all precautionary measures, without exception, are  
adhered to. The controller board is very sensitive and can be easily damaged.  
CAUTION!  
When inserting a removable module, DO NOT USE EXCESSIVE FORCE! Forcing or slamming a  
module can damage the pins on the module connectors either on the module itself or on the  
backplane. Gently push the module until it reaches the end of module slot. Feel the contact  
resistance and use slightly more force to ensure the module connectors are correctly mated. If  
the module comes with reject levers or retention screws, use them to secure the module.  
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6.2  
Replacing Controller Module Components  
The controller module consists of the components shown below:  
DIMM Module  
The DIMM module can be replaced when the DIMM module fails or if a larger capacity  
DIMM module is required.  
Controller Module  
If the controller module in a single controller model fails, it is necessary to power the sys-  
tem down and replace the controller.  
6.2.1  
Controller Module Maintenance Overview  
The controller module contains a DIMM module. When replacing the controller  
module, these components can be removed and used on the new controller module if  
they are undamaged.  
When replacing the controller module, you must remember that the controller board  
is one of the most sensitive components in the RAID subsystem. All previously stipulated  
safety precautions (see Section 3 Hardware Installation) must be strictly adhered to. Fail-  
ure to adhere to these precautions can result in permanent damage to the controller  
board.  
For your own safety and that of the subsystem, make sure that no power is being  
supplied to the system prior to replacing the controller module.  
6.2.2  
Removing the Controller Module  
1. Turn off the subsystem. If possible power off the subsystem in the way described in  
Section 5 Subsystem Connection and Operation. If it is not possible to do this turn off both  
PSU modules and disconnect the power cords.  
2. Disconnect all cables that are connected to the controller module you wish to replace.  
These include the Ethernet cables connected to the network, and any cable connected to  
the RS-232C audio jack connector.  
3. Loosen the retention hand screws. Hand screws are located on both sides of the RAID  
controller faceplate. Press these screws and loosen them so that the controller can be  
removed from chassis.  
Fig. 6.1 Loosening the Hand Screws from the Controller Module  
4. Remove the controller module. Gently pull the controller module out of the subsystem.  
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6.2.3  
Replacing the Controller Module  
If the controller module has failed, it must be replaced. To replace a failed controller module:  
1. Remove the failed controller module. (See Section 6.2.2 Removing the Controller Module)  
If the DIMM module is undamaged it can be removed (See Section 6.3 DIMM Module  
Replacement) and reused on the new controller module.  
2. Install a DIMM module on the new controller module. (See Section 6.3 DIMM Module  
Replacement)  
3. Insert the controller module. Align the controller module with the controller module bay  
at the rear of the subsystem. Gently slide the controller module in.  
4. Fasten the hand screws. Once fully inserted secure the controller module to the sub-  
system by fastening the hand screws.  
5. Re-attach all the cables that were removed. These include the cables that connect to the  
network or iSCSI initiators that were previously attached to the iSCSI ports, and any  
cable that was attached to the RS-232C audio jack connector.  
6. Power up the system.  
6.3  
DIMM Module Replacement  
The subsystem comes with a pre-installed 1 GB (or above) DDR RAM DIMM module on the  
controller. If DDR RAM DIMM modules with a different size need to be used or the original  
memory module is damaged in some way, the pre-installed modules must be removed and the  
new ones installed. Replacement and installation instructions are described fully below.  
The DIMM module is located on the controller board. The controller board is a sensitive com-  
ponent and must be treated with care to avoid being damaged.  
CAUTION!  
The pre-installed modules must be removed prior to installing new memory modules. Do  
this with care. Sensitive components can be damaged during the process.  
The controller board in the controller module is a sensitive item. Please ensure that all  
anti-static precautions stipulated above are strictly adhered to. Only qualified techniciens  
should replace the DIMM module.  
6.3.1  
DIMM Module Considerations  
If the memory module on the subsystem controller module is going to be replaced, the follow-  
ing factors must be considered when purchasing replacement DIMM modules:  
Pre-installed DIMM module: The RAID comes with a 1 GB DDR RAM DIMM module pre-  
installed on the controller board. If you wish to change the size of the DIMM, then a new,  
separately purchased DIMM must be installed.  
Purchasing considerations: When purchasing a DDR RAM DIMM to install on the  
controller board, contact your vendor for an updated list of certified modules.  
DDR RAM DIMM modules supported: The RAID subsystem supports DDR RAM DIMM  
modules with memory capacities from 1 GB.  
Installation considerations: When installing the DIMM module, it is necessary to  
handle the controller module. The controller board is more susceptible to damage than  
the other components and must therefore be handled with extreme care. ALL anti-static  
precautions specified in Section 3.3 Safety Precautions must be strictly adhered to.  
Secure installation: When replacing the DIMM module, make sure that the new  
DIMM module is firmly in place prior to installing the controller module. If the DIMM mod-  
ule is not firmly in place, the subsystem will not run and the controller will need to be  
removed and the DIMM module correctly installed.  
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6.3.2  
DIMM Module Replacement Procedure  
NOTICE!  
If you are going to replace or upgrade a DIMM module, please follow the instructions below. If  
you do not want to replace or upgrade a DIMM module and would like to install a controller  
module, please see Section 6.2.3 Replacing the Controller Module.  
i
If a DIMM module fails or if a DIMM module with a higher memory capacity is required, the  
onboard DIMM module must be replaced. To replace the DIMM module:  
1. Remove the controller module. See Section 6.2.3 Replacing the Controller Module.  
2. Remove the previously installed DIMM module from the DIMM socket. To do this, push  
the white module clips on either side of the DIMM module down. By doing this, the previ-  
ously installed modules will be ejected from the DIMM socket. (See Figure 6.2)  
Fig. 6.2 Push Back the Module Clips on the Sides of the DIMM Module  
3. Gently pull the DIMM module out of the DIMM socket. (See Figure 6.2)  
4. Insert the DIMM module into the DIMM socket. Align the DIMM module with the DIMM  
socket. Once aligned, gently push the DIMM module into the socket. The white clips on  
the sides of the socket will close automatically and secure the DIMM module into the  
socket.  
Fig. 6.3 Insert the DIMM Module  
5. Reinstall the controller module. After the DIMM module has been properly installed, the  
controller module must be reinstalled. To do this, align the controller module with the  
controller module bay. Then gently push the controller module in the controller bay.  
Carefully push the controller until you feel the contact when the board edge connectors  
are mated to the backplane. Do not use force. If unusual contact resistance is felt, try it  
again. Next secure the controller module into the subsystem by fastening the hand  
screws on the sides.  
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6.4  
Replacing a Faulty BBU Module  
The BBU module is installed in the rear panel of the subsystem above the controller module. It  
consists of a battery cell pack enclosed in a metal bracket and connects directly to the back-  
plane board.  
6.4.1  
BBU Warnings and Precautions  
Install or replace the BBU supplied by your subsystem vendors only. Use of battery cells  
provided otherwise will void our warranty.  
Always dispose of discharged or used batteries in an ecologically responsible manner.  
Dispose used BBU at authorized battery disposal sites only.  
Do not use nor leave the BBU near a heat source. Heat can melt the insulation and dam-  
age other safety features of battery cells, possibly leading it to acid leak, and result in  
flames or explosion.  
Do not immerse the BBU in water nor allow it to get wet. Its protective features can be  
damaged. Abnormal chemical reactions may occur, possibly causing functional defects,  
acid leak, and other hazardous results.  
Do not disassemble or modify the BBU. If disassembled, the BBU could leak acid, over-  
heat, emit smoke, burst and/or ignite.  
Do not pierce the BBU with a sharp object, strike it with a hammer, step on it, or throw it.  
These actions could damage or deform it, internal short-circuiting can occur, possibly  
causing functional defects, acid leak, and other hazardous results.  
If the BBU leaks, gives off a bad odor, generates heat, becomes discolored or deformed,  
or in any way appears abnormal during use, recharging or storage, immediately remove it  
from the subsystem and stop using it. If this is discovered when you first use the BBU,  
return it to Bosch or your system vendor.  
6.4.2  
Procedure  
NOTICE!  
The BBU is hot-swappable and can be replaced while the subsystem is running. However, a  
new module will only be recognized after a subsystem reset. Carefully select the time when  
the reset will be made in order to minimize the overall disruption to service.  
i
1. Remove the faulty BBU module from the chassis. The BBU module is secured to the chas-  
sis with two (2) spring screws. These screws must be loosen. To loosen, turn the screws  
counterclockwise. (See Figure 6.4)  
Fig. 6.4 Remove the Metal Sheet Retention Screws  
2. Install the new BBU module. After the faulty BBU module has been removed, the new  
BBU module can be installed. To do this, align the BBU module with the empty slot, and  
then gently push the BBU module into the slot. (See Figure 6.5)  
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Fig. 6.5 Install the BBU Module  
3. Secure the BBU module to the enclosure. Tighten the two (2) retention screws as shown  
above on the back of the BBU module.  
4. Once the new BBU module is correctly installed into the subsystem, the LED should start  
flashing, indicates the BBU is being charged. When the BBU is fully charged, the LED will  
light amber constantly.  
NOTICE!  
The life expectancy of a BBU is approximately 500 cycles. Follow the procedures above to  
replace an old BBU with a new BBU in order to maintain fault-tolerant subsystem functional-  
ities. We recommend replacing the BBU yearly.  
i
6.5  
Replacing a Failed PSU Module  
6.5.1  
PSU Module Overview  
Two redundant PSU modules: The RAID subsystem comes with two fully redundant, hot-  
swappable PSU modules. These modules are located at the rear of the subsystem.  
Immediate replacement: When a PSU fails, it should ideally be replaced immediately. Do  
not remove the PSU module unless a replacement is readily available. Removing a PSU  
without a replacement will cause severe disruptions to the internal airflow and the sub-  
system will overheat, possibly causing irreparable damage to some of the subsystem  
components.  
NOTICE!  
Although the subsystem can operate using single PSU module, it is not advisable to run the  
RAID subsystem with a single PSU module for an extended period of time.  
i
6.5.2  
i
Replacing the PSU Module  
NOTICE!  
Before you insert a new PSU, be sure that it has the same warning label on its extraction lever  
as that shown on the lever of a remaining PSU. Double-check to avoid mixing a similar yet dif-  
ferent PSU of another series.  
To replace a PSU, please follow these steps:  
1. Turn off the PSU. The power switch is located at the rear of the PSU. (See Figure 6.6)  
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Fig. 6.6 PSU Parts Identification  
Fig. 6.7 Removing the PSU Retention Screw  
2. Once the power switch has been turned off, remove the power cable that connects the  
RAID subsystem to the main power. The power cable socket is found on the left-hand  
side of the module.  
3. After the power cable has been removed from the socket, remove the retention screw at  
the top right-hand side of the PSU. (See Figure 6.8).  
4. Remove the PSU module. Push the extraction lever at the back of the PSU module down-  
wards. This will dislodge the PSU module from the subsystem. Once dislodged gently pull  
the PSU module out of the subsystem. (See Figure 6.8).  
Fig. 6.8 Removing the PSU Module  
5. Remove the cooling module. To do this, push the clips on either side of the cooling mod-  
ule rear panel together. Then gently pull the cooling module out of the lower level of the  
PSU bracket. (See Figure 6.9)  
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Fig. 6.9 Remove the Cooling Module  
6. Reinstall the cooling module into the new PSU module. To do this, align the cooling mod-  
ule with the lower level of the PSU bracket and gently slide the cooling module in.  
7. Reinstall the PSU module. After the cooling module has been reinstalled, align the PSU  
module with the empty bay from which the faulty module was removed. Gently slide the  
replacement PSU module into the subsystem.  
8. Insert the cooling module.  
9. Plug the PSU cable into the PSU module socket. Turn the power switch on.  
6.6  
Cooling Module Maintenance  
6.6.1  
Cooling Module Overview  
Redundant cooling modules: The RAID subsystem is equipped with redundant, hot-swap-  
pable, single-fan cooling modules. Two are located below the PSU modules. The third is  
located below the controller module. These cooling modules control the internal opera-  
tional temperature of the subsystem and therefore their working integrity should be  
maintained at all times.  
Detecting a failed cooling fan module: If a cooling module fails, you can be notified  
of the failure by the LED located at the back of the module, an audible alarm, the firm-  
ware, the RAIDWatch Panel View, or the Configuration Client utility.  
Replacing a cooling module: When you are notified that a cooling module has failed,  
it should be replaced as soon as possible. A failed cooling module should only be  
removed from the subsystem when you have a replacement module that can be installed  
as soon as the failed cooling module has been removed.  
NOTICE!  
The latches at the back of the cooling module secure the cooling fan module into the enclo-  
sure. If these latches are broken, the warranty on the cooling fan module will be void.  
i
6.6.2  
Replacing a Cooling Module  
CAUTION!  
Although the cooling fan modules are fully redundant, it is not advisable to run the RAID sub-  
system with one or two cooling modules for an extended period of time. Whenever a cooling  
module fails, the system is at risk of sustaining irreparable damage.  
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To replace a cooling module, please follow these instructions:  
1. Remove the cooling module. Two (2) clips secure the cooling module to the subsystem. To  
remove the cooling module push these clips together and gently pull the cooling module  
out of the enclosure. (See Figure 6.10)  
Fig. 6.10 Removing the Cooling Module  
2. Forcing or slamming a module into place can damage the pins on the module connectors  
either on the module itself or on the connectors of system backplane.  
3. Install the new cooling module. To do this, align the replacement cooling module with the  
bay from which the faulty one was removed. Then gently slide the new cooling module  
into the enclosure subsystem.  
6.7  
Replacing a Failed Hard Drive  
Hard drives for the subsystem can be purchased separately. When purchasing the hard drives,  
the following factors should be considered:  
Capacity (MB/GB): Use drives with the same capacity. RAID arrays use a “least-common-  
denominator” approach. The maximum capacity of each drive used in the array is the maxi-  
mum capacity of the smallest drive. Choose big drives with the same storage capacity.  
Profile: The drive trays and bays of the system are designed for 3.5-inch wide x 1-inch-high  
hard drives. It is highly recommended that you do not try to use drives of any other size.  
Drive type: The RAID subsystem described in this manual can use SATA-I or SATA-II hard  
drives. Please ensure that you purchase the correct hard drives.  
CAUTION!  
The hard drives and drive trays should only be installed into the subsystem after the sub-  
system has been mounted into a rack cabinet. If the hard drives are installed first, the  
subsystem will be too heavy to lift and the possible impact during installation may dam-  
age your drives.  
Handle hard drives with extreme care. Hard drives are very delicate. Dropping a drive  
onto a hard surface (even from a short distance) and hitting or touching the circuits on  
the drives with your tools may cause damage to the drives.  
Observe all ESD prevention methods when installing drives.  
Only use screws supplied with the drive canisters. Longer screws may damage the drive.  
6.7.1  
Hard Drive Maintenance Overview  
Hot-swappable drive trays: The drive trays are all hot-swappable. If a hard drive fails, it  
can be replaced while the subsystem is still running.  
Open flap: Once the flap on the drive tray has been opened, the drive tray must be  
removed from the subsystem. Failure to remove the drive tray from the subsystem after  
the flap has been opened may result in signal glitches and Data Compare Errors might  
ensue.  
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Remove drives slowly: When removing a drive tray, withdraw it from the enclosure slowly.  
If the drive tray is removed too quickly a drive I/O timeout might occur.  
Replacement on-hand: Before removing a failed hard drive from the subsystem, make  
sure you have a replacement hard drive readily available. Do not leave the drive tray slot  
open for an extended period of time. If the drive tray slot is left unoccupied for an  
extended period of time, the airflow within chassis will be disrupted and subsystem com-  
ponents will overheat and may become permanently damaged.  
6.7.2  
Replacing a Hard Drive  
When a hard drives fails, it needs to be replaced. To replace a hard drive, please follow these  
steps:  
CAUTION!  
The hard drive is fragile; please always handle with extreme care. Do not drop the hard drive;  
always be slow, gentle and careful when putting down a hard drive. Only handle the hard drive  
by the edges, avoid touching any components or connectors.  
1. Identify the drive tray that contains a faulty drive that needs to be replaced.  
CAUTION!  
Replacing the wrong drive in an array can fatally fail a RAID configuration. You should identify  
a failed drive from the RAIDWatch GUI screen, by checking the drive slot ID in the terminal  
screen, by checking the LEDs on the drive tray panel, and/or use the identify/flash drive func-  
tion of firmware.  
2. Open the front flap. To open the front flap, push the release button at the front of the  
drive tray. (See Figure 6.11) The drive tray front flap will automatically be lifted and the  
drive tray will be dislodged from the chassis.  
Fig. 6.11 Front View of an Individual Drive Tray  
3. Remove the drive tray. To remove the drive tray from the enclosure, the key-lock must be  
unlocked. (See Figure 6.12) To do this, turn the key-lock on the front of the drive tray  
until the groove on its face is in a horizontal orientation.  
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Fig. 6.12 Drive Tray Key-Lock Rotation  
4. Remove the drive tray with the hard drive. Once the drive tray is dislodged from the chas-  
sis, gently and carefully withdraw the drive tray with hard drive from the chassis.  
5. Remove the retention screws. The hard drive is secured to the drive tray with four (4)  
retention screws (two on each side.) To remove the hard drive, these retention screws  
must be removed. (See Figure 6.13)  
Fig. 6.13 Removing the SATA Hard Drive  
6. Install the new hard drive.  
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Specifications | en  
43  
7
Specifications  
7.1  
Technical Specifications  
Environmental Specifications  
5 to 95% (non condensing – operating and non-operating)  
Humidity  
Temperature  
Operating: 0º to 40ºC  
Non-operating: -40º to 60ºC  
Altitude  
Sea level to 12,000ft  
Power Requirements  
Input Voltage  
115VAC @ 6A  
240VAC @ 3A with PFC  
(auto-switching)  
Frequency  
47-63Hz  
Power Consumption  
1197 BTU/hour (350W)  
Dimensions  
Height  
w/o front handles  
88mm  
w/ front handles  
88mm  
Width  
446mm  
482mm  
505mm  
Length  
490mm  
Package dimensions  
344H x 600W x 670D mm  
System Weight  
Net weight: 23.5kg  
Gross weight: 25.0kg (without drives)  
EMI/EMC  
Safety Requirements  
Shock  
FCC Class-B  
CE  
UL  
CB  
Half-sine  
Square  
Operating: 10G peak, 11ms duration  
Non-operating: 100G, 180 in/sec 240G, 2ms, half-sine  
240G, 2ms, half-sine  
Vibration  
Operating  
5 to 500Hz, 0.2G, X/Y/Z  
5 to 500Hz, 1.0G, X/Y/Z  
Non-operating  
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Warning Alarms  
Audible alarms  
System LEDs  
Event notification via the RAIDWatch Manager (LAN broadcast, email, fax, MSN, ICQ,  
SMS, and SNMP traps) and RS-232C terminal screen  
7.2  
Controller Specifications  
Specification  
0, 1(0 + 1), 3, 5, 10, 30, 50, JBOD, and non-RAID disk spanning  
RAID Levels  
Host O/S Compatibility Host O/S independent; determined by iSCSI offload utilities and  
hardware  
Host Interface  
Host Channels  
Drive Interface  
RJ-45 Gigabit Ethernet  
2 pre-configured host channels  
Supports up to 12 channels of 3Gbps SATA-II, SATA-I backward  
compatible  
Drive Channels  
Cache Mode  
All drive channels are pre-configured and cannot be changed  
Write-through, write-back, adaptive write policy  
Cache Memory  
Pre-installed 1 GB (or above) DDR RAM DIMM with/without ECC,  
registered; in one DIMM socket  
Number of LUN’s  
Up to 32 per host ID  
Yes  
Multiple Target IDs/  
Host Channel  
Firmware on Flash  
Memory  
Yes  
Specification  
CPU  
600MHz PowerPC 750FX  
Intel 82546 x 1  
Gigabit Ethernet Chip  
Controllers  
DIMM Slot  
One 184-pin DDR DIMM module  
32Mbit (4MB)  
Flash ROM  
NVRAM  
32KB with RTC  
Hardware XOR  
Real-time Clock  
Yes  
For event messages with time record  
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Specifications | en  
45  
7.3  
Drive Tray Specifications  
Specification  
Height  
Width  
28mm  
110mm  
Depth  
218.92mm  
Yes  
Key Lock  
7.4  
Power Supply Specifications  
Specification  
Nominal Power  
DC Output  
350W  
12.0V: 25A  
5.0V: 25A  
3.3V: 20A  
Input Frequency  
AC Input  
47 to 63Hz  
115VAC @ 6A or 240VAC @ 3A with PFC  
Power Factor Correc- Yes  
tion  
Hold-up Time  
At least 16ms at 115/230VAC full load after a loss of AC input  
Over-temperature  
Protection  
Auto shutdown when lost cooling or exceeded ambient tempera-  
ture; over-voltage protection is also available.  
Cooling Fans  
Two fans for each unit (inside PSU)  
7.5  
Cooling Module Specifications  
Specification  
High or low rotation speed controlled by firmware  
Max. Air Flow (each High speed: 31.8 CFM  
Speed  
module)  
Low speed: 20.1 CFM  
9/3.12W max.  
Input Power  
Rated Voltage  
Temperature  
DC 12V  
Operating: -10 to +60ºC  
Storage: -20 to +70ºC  
7.6  
RAID Management  
Specification  
Configuration  
Text-based firmware-embedded utility over RS-232C  
through the included audio jack-to-DB-9 serial cable  
The RAIDWatch Manager program using Ethernet  
connection  
Performance Monitoring Yes  
Remote Control and  
Monitoring  
Yes  
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46 en | Specifications  
RAID Subsystem DVA-12T | Installation Manual  
Event Broadcast/Alert  
Yes (via RAIDWatch sub-modules, the Configuration Client utility or  
NPC)  
Event Notification  
Yes (via RAIDWatch sub-modules, Configuration Client or NPC)  
In-band over Ethernet, or RS-232C  
Hardware Connection  
Configuration on Disk  
Configuration data stored on disks for logical drive assemblies to  
exist after controller replacement; basic settings, e.g., channel  
mode settings, are stored on NVRAM  
Failure Indicator  
Via alarm, LCD panel, RAIDWatch Manager session, or terminal  
emulation  
7.7  
Fault Tolerance Management  
Specification  
Battery Back-up Option  
Yes  
Yes  
Yes  
Yes  
Yes  
Automatic Drive Failure Detection  
Automatic Rebuild on Spare Drives  
Regenerate Logical Drive Parity  
Bad Block Reassignment  
Automatic Rebuild upon Failed Drive Replace- Yes  
ment  
Manual Clone of Suspected Failed Drive  
Yes  
Yes  
Concurrent Rebuild on Multiple Drives in a  
RAID (0 + 1) Logical Drive  
nd  
Yes  
Yes  
Salvage the 2 Temporarily Failed Drive in a  
RAID 1, 3 or 5 Logical Drive  
st  
Salvage the 1 Temporarily Failed Drive in a  
RAID 0 Logical Drive  
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Spare Parts and Accessories | en  
47  
8
Spare Parts and Accessories  
8.1  
Spare Parts  
Spare parts that come with the subsystem are listed in Table 8.1.  
Model Name Description  
DVA-SCIK-12A iSCSI-to-SATA II RAID controller module, 2x 1 Gigabit  
Ethernet Host channels, 12 x SATA drive channels,  
1 GB DDR RAM.  
DVA-ADTK-000A  
DVA-ADTK-050A  
DVA-SPKK-08A  
Drive tray, Type-III bezel and Type-II LED lightpipe  
Drive tray including 500 GB Hitachi SATA drive  
Power supply module, 2U DDR-interface subsystems,  
350W capacity  
DVA-SFAK-08A  
Dual-speed version of cooling fan module: 2U sub-  
systems  
Table 8.1 Spare Parts Shipped with the Subsystem  
8.2  
Accessories  
The Accessories and their model names are listed in Table 8.2.  
Model Name  
DVA-ASRK-28A  
Description  
Slide rails for 533 mm to 724 mm deep racks  
(21" to 28.5")  
DVA-ASRK-36A  
Slide rails for 647 mm to 914 mm deep racks  
(25.5" to 36")  
Table 8.2 Accessories Shipped with the Subsystem  
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48 en | Pin Outs  
RAID Subsystem DVA-12T | Installation Manual  
9
Pin Outs  
9.1  
COM1 Cable: DB9 and Audio Jack Pin Outs  
Table 9.1 RS-232C (Audio Jack) Pin Outs  
COM 1 Cable: Connects a PC running a terminal emulation program  
CN1 Pin Number  
Pin Name  
1
2
3
Ground  
TXD  
RXD  
CN2 Pin Number  
Pin Name  
1
2
3
4
5
6
7
8
9
NC  
RXD  
TXD  
DTR  
GND  
DSR  
RTS  
CTS  
NC  
Pin 4 and Pin 6 are shorted  
Pin 7 and Pin 8 are shorted  
Table 9.2 COM 1 Cable, RS-232C (Audio Jack) Pin Out Definitions  
NOTICE!  
A null modem is used for wire-swap and is necessary for connecting in between COM1CN2  
and a PC serial port.  
i
9.2  
Ethernet Port Pin Outs  
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Pin Outs | en  
49  
Fig. 9.1 LAN Port Pin Outs  
Pin  
Pin Name  
LAN_TXP  
Pin  
5
Pin Name  
N2  
1
2
3
4
LAN_TXN  
LAN_RXP  
N2  
6
LAN_RXN  
N1  
7
8
N1  
Table 9.3 Ethernet Port Pin Outs  
9.3  
Main Power  
IEC-type receptacle.  
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50 en | Pin Outs  
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RAID Subsystem DVA-12T | Installation Manual  
Index | en  
51  
10  
Numerics  
2U bracket 13  
Index  
CPU 44  
D
DB9 48  
DDR 7,10  
Device-status-indicating LED 21  
DIMM 34  
DIMM socket 11,35  
drive bay 9  
A
Air Flow 45  
Airflow 16  
airflow clearance 16  
anti-static precautions 34  
ASIC 7  
audible alarm 14,25,26  
Audio Jack 48  
drive bays 11,40  
Drive Busy 22  
drive tray 18,30,40,41  
Drive Tray LED 22  
Drive Tray LEDs 22,31  
drive tray slot 41  
Drive Trays 22  
audio jack serial port 12  
audio jacks 33,34  
B
drive trays 11,17,32,40  
Drv_Bsy 23  
battery backup unit 7  
BBU 7,30,32,36  
BBU module 10,12,24  
BBU Warnings 36  
BBU_Fail 23  
E
electrostatic discharge 16  
ESD damage 17  
Ethernet cables 33  
Ethernet Port 48  
Ethernet port 23  
Ethernet Ports 22  
Ethernet ports 7  
C
C_Dirty 23  
cabinet 16  
Cabling 16,27  
event notification 15  
extraction lever 38  
capacity 40  
F
failed hard drive 41  
fan failure 13  
Cat6 27  
charge 12  
chassis 8  
Check List  
COM 1 Cable 48  
COM port 12  
fan speed 13  
Firmware 21,31  
firmware 14  
front flap 19,40  
front panel 9,10  
fully charged 37  
component check 16  
Component Replacement 32  
component replacements 32  
controller board 32,33  
Controller Initialization 23  
Controller Module 22  
controller module 7,11,32,33,34  
Controller Module LEDs 23,31  
controller module maintenance 33  
controller module, removal 33  
controller module, replace 34  
Controller Specifications 44  
Cooling Module 22  
cooling module 10,13,25,32,38,39,40  
Cooling Module LEDs 25  
cooling module maintenance 39  
cooling module slot 13  
Cooling Module Specifications 45  
cooling modules 32  
G
Gigabit Ethernet Chip 44  
groove 18  
H
hand screws 7,12,33  
handling 32  
hard drive 40,41  
hard drive failure 40  
Hard drive numbering 9  
hard drives 30,32  
hard drives, replacing 41  
host ports 11,12  
hot-swap mechanism 10  
hot-swappable 32  
Hst_Bsy 23  
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52 en | Index  
RAID Subsystem DVA-12T | Installation Manual  
PSU 9,10,13,24,37  
PSU LEDs 24  
PSU Module 22  
PSU module 32  
PSU module maintenance 37  
I
I2C 21,26  
I2C bus 14  
Input Voltage 43  
internal airflow 37  
Internet SCSI 7  
R
rack 16  
irreparable damage 37  
iSCSI HBA 27  
iSCSI initiators 34  
iSCSI ports 34  
iSCSI standard 7,8  
rack cabinet 16  
Rackmounting 18  
RAID Controller 11  
RAID controller module 32  
RCC Channel 8  
K
Ready 23  
Key-Lock 42  
rear panel 9,10  
rear view 9  
L
LAN 7  
LED 14  
left handle 9  
redundant cooling modules 39  
release button 11,19  
release latch 10  
right handle 9  
M
main power 38  
maintenance 32  
memory capacity 12  
Monitoring 21  
monitoring 32  
monitoring methods 14  
RJ-45 7,23,27  
RJ-45 cable 17  
RJ-45 connector 11  
RS-232C 33,34  
S
safety precaution 16  
SATA drives 40  
N
SATA-II 7  
SATA-II drives 40  
self-monitoring features 21  
sensors 25  
network 33  
network switches 7  
normalized airflow 15,32,41  
Null modem 48  
O
slide rails 18  
Spare Parts 47  
Speed LED 24  
static electricity 17  
static free 16  
over-voltage 13  
P
PC hyper-terminal 21  
permanent damage 33  
power cable 38  
Status LED 24  
power cable socket 38  
power cords 30  
power down 31  
Power Off Procedure 31  
power on  
Status-indicating LEDs 22  
stipulated safety precautions 33  
Straight-through 27  
subsystem components 32,41  
subsystem downtime 32  
System Dimensions 43  
System Weight 43  
status check 31  
power on enclosure 30  
power outlet 16  
power range 16  
Power Status 22  
T
Temperature sensors 14  
thermal notice 16  
threshold values 25  
Power supply 47  
Power Supply Specifications 45  
power supply unit 9  
power switch 10,30,38  
V
ventilation clearance 16  
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Index | en  
53  
W
Warning Alarms 44  
X
XOR 44  
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54 en | Index  
RAID Subsystem DVA-12T | Installation Manual  
F.01U.027.798 | V1 | 2006.06  
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Bosch Security Systems  
Robert-Koch-Straße 100  
D-85521 Ottobrunn  
Germany  
Telefon  
Fax  
+49 (89) 6290-0  
+49 (89) 6290-1020  
© Bosch Security Systems, 2006  
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