Intel Tray Mobile Core I7 4800mq 2 7g CW8064701471001 User Manual

Overclocking Unlocked Intel®  
CoreProcessors for High  
Performance Gaming and  
Content Creation  
Michael Moen – Sr. System Engineer, Intel Corporation  
Dan Ragland – Sr. System Engineer, Intel Corporation  
JJ Guerrero – Sr. Technical Marketing Specialist, Asus  
AIOS001  
Risk Reminder  
WARNING: Altering clock frequency and/or voltage  
may: (i) reduce system stability and useful life of the  
system and processor; (ii) cause the processor and other  
system components to fail; (iii) cause reductions in system  
performance; (iv) cause additional heat or other damage; and  
(v) affect system data integrity. Intel has not tested, and does  
not warranty, the operation of the processor beyond its  
specifications. Intel assumes no responsibility that the  
processor, including if used with altered clock frequencies  
and/or voltages, will be fit for any particular purpose. For more  
information, visit:  
3
Agenda  
Overclocking Theory and Trends  
High-end Desktop Overclocking Architecture  
Overclocking Design Tips  
Desktop and Mobile Overclocking Architecture  
Harnessing Overclocking  
Summary  
4
Defining Overclocking  
What is Overclocking (OC)?  
– The process of increasing clock rates beyond  
specification  
Why Overclock?  
– Increase performance for compute intensive tasks,  
e.g., transcode, gaming, rendering  
– Compete, Promote, Socialize  
How is this done?  
– Obtain a motherboard optimized for Intel® unlocked  
processors  
– Change unlocked ratios or platform clock frequency  
– Increase voltage on relevant interfaces  
– Improve cooling on overclocked/overvoltaged  
components  
5
Overclocking Theory  
General Principles  
The Rule: Maximize frequency, minimize voltage/current and  
maximize heat dissipation to meet personal stability requirements  
What  
Benefits  
How  
Processor Rendering, Music, Photo  
Increase Power Limits and Max  
Current  
Raise Core voltage  
Increase active Core ratios  
Cores  
and Video editing,  
Transcode, Gaming  
Physics, AI, Compute  
Intensive  
Processor Gaming frame rates,  
Integrated Media Transcode  
Graphics  
Increase Power Limits and Max  
Current  
Raise pGfx voltage  
Raise pGfx max ratio  
(pGfx)†  
Memory  
Processor Graphics  
performance,  
Increase memory ratio  
Raise memory IO voltage  
Sound engineering, Photo Change timings  
and Video editing  
Increase system agent voltage  
Platform  
Base Clock  
All of the above  
Increase all domain voltages  
Reduce weakest domain  
frequency via ratios  
† pGfx utilizes Intel® Iris™ Pro., Intel® Iris , or Intel® HD Graphics  
6
Observed Frequency Trends in OC  
Q: How much OC can I expect from my CPU?  
A: There are many factors  
– Every CPU is designed to meet nominal requirements with  
intentional guardband – not specifically for OC  
– Overclocking is the act of tapping into the intentional guardband  
+ design conservatism + Si process conservatism  
– This changes with each CPU process stepping, architecture change  
and overall design targets  
HEDT = High End Desktop. Today this includes Socket LGA2011.  
This data was collected from overclocking forums and should be considered approximate for illustrative purposes only.  
7
Agenda  
Overclocking Theory and Trends  
High-end Desktop Overclocking Architecture  
Overclocking Design Tips  
Desktop and Mobile Overclocking Architecture  
Harnessing Overclocking  
Summary  
8
Intel® Corei7 Desktop Processors Based on  
Socket LGA2011 with Intel® X79 Express Chipset  
C
Core Frequency  
– Unlocked Intel® Turbo Boost  
Technology limits†  
Processor  
Memory  
M
1
2
3
Memory  
– Unlocked core ratios up to 63 in  
100MHz increments†  
4
5
6
C
PCIE  
– Programmable voltage offset  
PEG  
P
M
• Memory Ratio  
DMI  
D
– Unlocked memory controller  
– Granularity in 266MHz steps  
– Ratios supported up to 2400Hz  
R
• DMICLK (aka BCLK)  
– Fine Grain range ± 5-7%  
– BCLK ratios = 1.0, 1.25, 1.67  
DMI  
R
D
×1  
• PEG and DMI Ratios  
– PEG/DMI ratios = 80/50, 64/40,  
48/30  
P
DB1200  
– Ratio option must reflect selected  
BCLK coarse ratio  
CK505  
~
R
P
D
Example : Core Freq x 1.25  
at 64/40 x 1.25  
requires PEG/DMI ratios  
R
to keep at 8 GHz/5 GHz nominal  
9
Only some processors enable part or all of these features. Consult processor documentation for details.  
Intel® Corei7 Desktop Processors Based on  
Socket LGA2011 with Intel® X79 Express Chipset  
Feature Overview  
SKU  
i7-4960X  
6/15M  
i7-4930K  
6/12M  
i7-4820K  
4/10M  
Cores/Cache  
Turbo Ratio Overrides (100MHz  
Steps)†  
Up to 63  
Up to 63  
Up to 63  
PL1, PL2, Tau, ICCMax Overrides  
Yes  
Yes  
Yes  
Real-time Core Overclocking (in  
OS)  
DDR Frequency Overrides  
(266MHz Steps)  
Up to 2400  
Up to 2400  
Up to 2400  
DDR Timing Overrides  
Enhanced Ratio Enhanced Ratio Enhanced Ratio  
Coarse BCLK Ratios supported  
with PEG, DMI ratios  
Support (1.0,  
1.25, 1.67)  
Support (1.0,  
1.25, 1.67)  
Support (1.0,  
1.25, 1.67)  
† Memory ratio not fuse limited, but support above 2400 via ratio not  
guaranteed. Use BCLK for higher frequencies.  
10  
Agenda  
Overclocking Theory and Trends  
High-end Desktop Overclocking Architecture  
Overclocking Design Tips  
Desktop and Mobile Overclocking Architecture  
Harnessing Overclocking  
Summary  
11  
Overclocking Design Tips  
What board designers consider for unlocked  
Processors  
COLLABORATION  
Work closely with Intel to understand the platform architecture and gauge  
hardware requirements. This helps to define customized overclocking  
options for different segments.  
POWER DESIGN  
Ensuring that onboard power delivery circuitry is capable of exceeding  
processor power requirements under extreme loading conditions.  
CIRCUITRY DESIGN  
Tuning of trace layouts and platform microcode to extend overclocking  
headroom for CPU and DRAM.  
CUSTOM SETUP  
Utilize customized hardware to mitigate platform overclocking obstacles.  
PRODUCT DEVELOPMENT  
Develop software and hardware solutions to provide automated overclocking  
features.  
These recommendations are the sole opinion of an expert overclocker based on experience. Intel does not endorse or support these recommendations. Intel  
has not tested, and does not warranty, the operation of the processor beyond its specifications  
12  
Overclocking Design Tips  
How enthusiast board/system designs  
influence overclockability  
High Quality Components  
Long-life solid polymer & MLCC Capacitors  
High current MOSFETs  
Low DCR inductors  
Advanced digital buck controllers  
More copper in power plane  
Efficient Cooling Through Layout Design  
Careful Analysis of Signal Integrity:  
Tight control of trace impedance on PCB, more  
layers, shorter lengths & length matching  
Tuning of MRC to improve signal margins and  
memory compatibility  
Dedicated hardware and software solutions:  
Hardware and software features that allow real-  
time changes to overclocking parameters and  
improve system stability for smooth overclocking  
experience  
Intuitive UEFI  
Intuitive layout with customizable menus,  
overclocking profiles (presets and user configured)  
and extensive auto-rules for all parameters  
OC recovery with low-level UEFI flashing  
capabilities  
13  
Live Demo:  
Optimization of Core, Memory and  
BCLK to achieve visibly better  
performance experience on  
content creation with a Intel®  
Core™ i7-4960X Extreme Edition  
Processor  
14  
Agenda  
Overclocking Theory and Trends  
High-end Desktop Overclocking Architecture  
Overclocking Design Tips  
Desktop and Mobile Overclocking Architecture  
Harnessing Overclocking  
Summary  
15  
Next Generation Intel Haswell Microarchitecture  
×C  
Core Frequency  
– Unlocked Intel® Turbo Boost  
Technology limits†  
CPU  
Memory  
– Unlocked core ratios up to 80 in  
100MHz increments†  
– Programmable voltage via iVR  
×M  
1
2
4
Memory  
×C  
3
×G  
• Graphics Frequency (pGfx)  
– Unlocked Intel® HD Graphics limits†  
PCIe*  
×P  
PEG  
pGfx  
– Unlocked graphics ratios up to 60 in  
50MHz increments  
×G  
×D  
DMI  
– Programmable voltage via iVR  
×M  
• Memory Ratio  
DMICLK/BCLK  
– Unlocked memory controller  
– Options for 200 and 266MHz steps †  
– Logical ratios up to 2933MHz†  
DMI  
×D  
OC  
BCLK  
• DMICLK (aka BCLK)  
– Unlocked PCH clock controller (1MHz  
increments upwards of 200MHz)  
Non-OC  
100MHz  
×P ×D  
PCIe  
• PEG and DMI Ratios  
– Variable ratios (must reflect selected  
BCLK frequency)†  
PCIe = PCI Express*  
Only some processors enable part or all of these features.  
16  
OC VR Design on Legacy Platforms  
VCORE  
VPLL  
VGFX  
VIO  
CPU  
VSA  
External VRs  
External VRs  
In current generation platforms, CPU VRs are on the  
motherboard  
Often, a separate VR exists for each rail to the CPU  
Voltage margining is accomplished using platform VRs  
4th Generation Intel ® Coreprocessor  
changes this dramatically with integrated  
voltage regulation  
17  
Next Generation Intel Haswell Microarchitecture  
Voltage Planes for Performance Tuning  
DDR  
VDDQ  
Core  
VCCIN  
1.5V Nom  
for DDR3  
Cores  
<=1.65V  
for XMP  
Last Level Cache  
System  
Agent  
PCIe*  
DMI  
1.35V  
Nom for  
DDR3L  
Ring  
pGfx  
pGfx  
IOA,IOD  
VSA, VIOA,  
VIOD: Up  
to 500mV  
Offset V  
from  
SA  
VCCIN: SVID 1.8V Nom up to 2.3V+, static V up to 3.04V  
VCORE: dynamic additional V, static V up to 2.0 V  
VRING: dynamic additional V, static V up to 2.0 V  
nominal  
VGT: dynamic additional V, static V up to 2.0 V  
PCIe* = PCI Express*  
18  
Next Generation Intel Haswell Microarchitecture  
Voltage Override Modes  
Fused V/f  
Interpolation V/f  
Interpolation  
(adaptive) in the  
overclocking  
region  
Default V/f curve  
(SVID operation)  
freq  
freq  
Offset V/f  
Override V/f  
Positive /  
Negative offset  
applied to the  
entire curve.  
Important for  
mainstream  
overclocking.  
Override applied  
to the entire  
curve.  
Important for  
extreme OC.  
freq  
freq  
iVR provides flexibility consistent with all  
margining modes generally supported by  
current generation external VR designs  
19  
Next Generation Intel Haswell Microarchitecture  
Clock Tree  
BCLK @100, 125 or 167  
MHz +/1 5-7%  
Single BCLK input comes  
from PCH in <1MHz steps  
DR  
Acceptable input to CPU  
limited by PIC Express*  
(PCIe) and DMI PLL interface:  
100MHz x ±5-7% PEG/DMI @ 5:5  
125MHz x ±5-7% PEG/DMI @ 5:4  
System  
167MHz x ±5-7% PEG/DMI @ 5:3  
Agent  
Cache  
Frequency Relationships  
f(GT) = BCLK/2*GT Ratio  
f(Core) = BCLK*Core Ratio  
f(Ring) = BCLK*Ring Ratio  
f(DDR) = BCLK*1.33*DDR Ratio  
-Or-  
PCIe*  
DMI  
pGf
f(DDR) = BCLK*1.00*DDR Ratio  
20  
Enhanced BCLK Capabilities  
Key Differences Between Generations  
Intel® Corei7  
processors on  
LGA2011  
3rd Gen Intel Core Next Gen Intel  
processors on  
LGA1155  
Haswell  
Microarchitecture  
BCLK multipliers  
{1.0,1.25,1.67} input  
to CPU  
CPU adjusts PEG/DMI  
ratios {5:5,5:4,5:3}  
based on BCLK multi  
None  
Select CPU PEG/DMI  
ratios of {5:5,5:4,5:3}  
depending on what  
clock frequency you  
request from PCH  
Coarse  
Adjustment  
PCH output ± 5-7%  
around frequency  
points 100MHz,  
External clock device  
output adjustment ± 5- adjustment ± 5-7%  
PCH output  
Fine  
7% over nominal  
over nominal 100MHz  
100MHz  
125MHz, 167MHz  
168 MHz  
(non-continuous)  
116.95 MHz  
>167 MHz  
(non-continuous)  
Range Peak  
Observed  
4th Generation Intel Core processors deliver BCLK  
overclocking experience consistent with current  
generation high-end platforms based on LGA2011  
† This data was collected from overclocking forums and should be considered approximate for illustrative purposes only.  
21  
Next Generation Intel Haswell Microarchitecture  
Available Performance Tuning Ratios  
Core  
Turbo  
DDR Ratios  
Ratios†  
DDR  
266MHz Steps  
up to 2933MHz  
Core ratios up  
to 80  
System  
Agent  
PCIe*  
DMI  
Cores  
200MHz steps  
up to 2800MHz  
Unlocked Turbo  
Limits  
Timing  
Overrides  
Last Level Cache  
Current Limit  
Override  
Manual or can  
be automated  
through XMP  
1.3  
Graphics ratios  
up to 60  
PEG  
DMI  
Ratios  
pGfx  
Ratios†  
Ring  
pGfx  
Ratios†  
Ring Ratios up  
to 80  
Ring Ratio  
typically <=  
Core or GT  
BIOS sets based on requested BCLK f  
100MHz: 80/50 (PEG/DMI Ratios)  
125MHz: 64/40  
PEG, DMI  
Ratios  
† = Changeable at OS Level  
167MHz: 48/30  
PCIe* = PCI Express*  
22  
Desktop: 4th Generation Intel® Corei7/i5  
Processors Based on Socket LGA 1150  
Unlocked “K”  
Intel® Z87 Express Chipset  
Intel H87 Express Chipset  
Others  
Unlocked  
Processors:  
Turbo Ratio Overrides  
DDR Frequency Overrides  
Fine BCLK Overrides  
Intel® Corei7  
Processors  
4770K  
1
1
2
Intel Core i5  
Processors  
4670K  
Coarse BCLK Ratios  
iVR Overvoltage  
This includes Intel Core i3, Intel®  
Pentium™, and Intel® Celeron™  
PL1, PL2, Tau, ICCMax Overrides  
DDR Timing Overrides  
pGfx Ratio Overrides  
1 Actual Fine BCLK frequency adjustments  
will be limited. ~5%  
2 Coarse BCLK Ratios (1.0, 1.25, 1.67)  
are unlocked with K SKU processors only  
Note: Actual overclocking results will vary  
and capabilities are subject to change.  
Turbo ratios and power, pGfx Ratios, iVR voltages are updateable real-time in OS  
Fine BCLK, DDR timings are changeable real-time over very small range  
Larger changes can be made with reset. BCLK range highly limited.  
DDR Frequency requires reset  
23  
Mobile: 4th Generation Intel® Core™  
Processor Overclocking†  
Summary:  
Core overclocking on select Intel® Corei7 SKUs  
Graphics and memory overclocking on all Intel Core i7 and Core i5 based -H, -M, and -U series processors  
Turbo  
Ratio  
Overrides  
iVR Over-  
voltage  
BCLK  
BCLK  
DDR Ratio & Processor  
Coarse(1)  
Fine(1)  
Timing  
Gfx Ratio  
Overrides  
Overrides  
-H and  
i7-4930MX  
Unlimited  
6 bins  
6 bins  
4 bins  
4 bins  
2 bins  
2 bins  
2 bins  
None  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
No  
Yes  
Yes  
No  
Yes  
No  
Yes  
Yes  
No  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
No  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
No  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
No  
-M Series i7-4900MQ  
i7-4950HQ  
i7-4800MQ  
i7-4850HQ  
i7-4702MQ  
i7-4700MQ  
i7-4750HQ  
i5  
No  
No  
i3  
None  
No  
-U Series i7-4600U  
4 bins  
4 bins  
4 bins  
None  
Yes  
Yes  
Yes  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
Yes  
Yes  
Yes  
Yes  
No  
Yes  
Yes  
Yes  
Yes  
No  
i7-4650U  
i7-4558U  
i5  
i3  
None  
No  
-Y Series All  
None  
No  
No  
No  
No  
No  
1 Requires Intel HM87 or QM87 chipsets and results will vary.  
Actual overclocking results will vary and capabilities are subject to change.  
24  
Live Demo:  
Mobile Overclocking using the  
Intel® Core™ i7-4950HQ processor  
in the Clevo W740SU Notebook  
25  
Agenda  
Overclocking Theory and Trends  
High-end Desktop Overclocking Architecture  
Overclocking Design Tips  
Desktop and Mobile Overclocking Architecture  
Harnessing Overclocking  
Summary  
26  
Intel® Extreme Memory Profile (Intel® XMP)  
Expansion of the standard DDR3 memory  
specification. Enables speeds, latencies  
outside of JEDEC Specification.  
– Easy, robust, overclocking solution designed  
to take advantage of the unlocked capability  
of Intel® CoreProcessors  
– Predefined and tested Intel XMP profiles can  
be loaded via BIOS or a specific operating  
system-level tuning application  
Intel® XMP compliant DIMMs available  
– Supports all Intel Core i7, i5 Processors †  
– Corsair*, G.Skil*, Kingston*, Patriot*, Crucial*  
and others  
– XMP Ready: Module has been programmed  
Select XMP  
profile via  
System boots  
with highest  
supported  
with an uncertified profile GOOD  
enabled BIOS  
or tuning app  
and profile and  
reset  
– XMP Certified: Module has passed supplier  
test and submission process for specific CPU  
and motherboard BEST  
JEDEC defined  
parameters by  
default  
– Certifications posted at:  
†CPU must support unlocked memory multiplier and be paired with  
correct chipset. Intel XMP is overclocking  
27  
Intel® Extreme Tuning Utility (Intel® XTU)  
Simple-to-use  
Windows*  
application  
Exposes CPU and  
PCH knobs for  
performance  
tuning by user  
Real-time  
adjustment of key  
settings without  
rebooting1  
Version 4.2 now  
available for  
download from  
Intel or other  
motherboard  
suppliers †  
†Motherboard BIOS must be configured correctly to work with XTU. Contact your motherboard supplier for more information.  
1
Available select 3rd and 4th Generation Intel® CoreProcessor SKUs.  
28  
Intel® XTU and HWBot.org*  
Combined Features  
Upload/Download overclocking  
settings reliably  
Export/Import XTU overclocking  
settings  
Compare benchmark scores and  
configurations with others  
Link other benchmark scores to XTU  
profiles  
Compete with others for higher  
scores  
Integrated with existing social  
networks: Facebook* and Twitter*  
29  
Live Demo:  
Intel® Extreme Tuning Utility  
v4.2 with AppTune Beta  
Feature using a Intel® Core™  
i7-4770K Processor  
30  
Live Demo:  
SSD Overclocking Technology  
31  
Agenda  
Overclocking Theory and Trends  
High-end Desktop Overclocking Architecture  
Overclocking Design Tips  
Desktop and Mobile Overclocking Architecture  
Harnessing Overclocking  
Summary  
32  
Summary  
Intel® Corei7 Processors based on Socket LGA2011 offer  
Core, DDR and BCLK overclocking experience on processors  
with the highest core count and memory capacity  
Desktop and Mobile 4th Generation Intel Core processors offer  
select SKUs with unlocked core, memory and graphics ratios  
Real-time overclocking offers an improved user experience for  
content creation and gaming users  
The AppTune beta feature, in Intel® Extreme Tuning Utility v4.2,  
is an exciting new way to tune system performance dynamically  
and uniquely for each specific application  
Intel has not tested, and does not warranty, the operation of  
the processor beyond its specifications  
For designers wanting to develop overclocking platforms,  
documentation is available under NDA that details all tuning  
knobs. Contact your Intel field representative.  
33  
Legal Disclaimer  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR  
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT  
AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY  
WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL  
PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY,  
OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.  
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in  
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APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND  
THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES  
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OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF  
ITS PARTS.  
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the  
absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future  
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The  
information here is subject to change without notice. Do not finalize a design with this information.  
The products described in this document may contain design defects or errors known as errata which may cause the product to  
deviate from published specifications. Current characterized errata are available on request.  
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.  
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be  
obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm  
Haswell and other code names featured are used internally within Intel to identify products that are in development and not yet  
publicly announced for release. Customers, licensees and other third parties are not authorized by Intel to use code names in  
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Intel, Core, Look Inside and the Intel logo are trademarks of Intel Corporation in the United States and other countries.  
*Other names and brands may be claimed as the property of others.  
Copyright ©2013 Intel Corporation.  
34  
Legal Disclaimer  
Overclocking Disclaimer WARNING: Altering clock frequency and/or voltage may: (i) reduce system stability and useful  
life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in  
system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not  
tested, and does not warranty, the operation of the processor beyond its specifications. Intel assumes no responsibility  
that the processor, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose.  
For more information, visit Overclocking Intel Processors.  
Overclocked Memory Warning: Altering PC memory frequency and/or voltage may (i) reduce system stability and use  
life of the system, memory and processor; (ii) cause the processor and other system components to fail; (iii) cause  
reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data  
integrity. Intel assumes no responsibility that the memory, included if used with altered clock frequencies and/or  
voltages, will be fit for any particular purpose. Check with memory manufacturer for warranty and additional details.  
Overspeed Protection Removed Warning: Altering clock frequency and/or voltage may (i) reduce system stability and  
useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause  
reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data  
integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications.  
Processor Numbering Notice: Intel processor numbers are not a measure of performance. Processor numbers  
differentiate features within each processor family, not across different processor families: Go to:  
Intel® Turbo Boost Technology requires a system with Intel Turbo Boost Technology. Intel Turbo Boost Technology and  
Intel Turbo Boost Technology 2.0 are only available on select Intel® processors. Consult your PC  
manufacturer. Performance varies depending on hardware, software, and system configuration. For more information,  
35  
Risk Factors  
The above statements and any others in this document that refer to plans and expectations for the third quarter, the year and  
the future are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,”  
“expects,” “intends,” “plans,” “believes,” “seeks,” “estimates,” “may,” “will,” “should” and their variations identify forward-looking  
statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking  
statements. Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors  
could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers  
the following to be the important factors that could cause actual results to differ materially from the company’s expectations.  
Demand could be different from Intel's expectations due to factors including changes in business and economic conditions;  
customer acceptance of Intel’s and competitors’ products; supply constraints and other disruptions affecting customers; changes  
in customer order patterns including order cancellations; and changes in the level of inventory at customers. Uncertainty in global  
economic and financial conditions poses a risk that consumers and businesses may defer purchases in response to negative  
financial events, which could negatively affect product demand and other related matters. Intel operates in intensely competitive  
industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product  
demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of  
Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors,  
including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and  
Intel’s ability to respond quickly to technological developments and to incorporate new features into its products. The gross  
margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation,  
including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the  
timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in  
unit costs; defects or disruptions in the supply of materials or resources; product manufacturing quality/yields; and impairments  
of long-lived assets, including manufacturing, assembly/test and intangible assets. Intel's results could be affected by adverse  
economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate,  
including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in  
currency exchange rates. Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset  
impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits. Intel’s  
results could be affected by the timing of closing of acquisitions and divestitures. Intel's results could be affected by adverse  
effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory  
matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues, such as the litigation and  
regulatory matters described in Intel's SEC reports. An unfavorable ruling could include monetary damages or an injunction  
prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel’s  
ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property. A detailed  
discussion of these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the company’s  
most recent reports on Form 10-Q, Form 10-K and earnings release.  
Rev. 7/17/13  
36  

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