Intel Executive Desktop Motherboard BOXDQ77KB User Manual

Executive Series  
®
Intel Desktop Board  
DQ77KB  
Executive Series  
Thin Mini-ITX Form Factor  
proDucT BrIeF  
Intel® Desktop Board DQ77KB  
Executive Series  
Features and  
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9
5
11  
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1
Supports the 2nd and 3rd Generation  
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9
1 Full Length PCI Express* Mini Card(supports  
mSATA) and 1 Half Length PCI Express*  
Mini Card (supports wireless Intel® AMT) slots  
Intel® CoreTM vProTM processors and  
other Intel® processors in the  
LGA1155 package , up to 65W  
4 USB 3.0 ports: 4 back panel ports – 2 ports  
12  
2
3
Intel® Q77 Express Chipset PCH  
support high current  
Dual-Channel DDR3 with two connectors  
for 1600/1333 MHz memory support:  
Supports 1.2V to 1.8V memory voltage  
control for maximum DIMM compatibility  
10 5 USB 2.0 ports: 5 ports via internal headers  
2
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8
11 eDP*, LVDS, DisplayPort* and HDMI*:  
Support tripal independent display capability  
for multiple display support  
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4
4
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4 SATA ports (2 SATA 6.0 Gb/s;  
2 SATA 3.0 Gb/s): Facilitates high-speed  
storage and data transfers at up to 6.0 Gb/s  
12 Serial and Custom Solutions headers  
13 Thin Mini-ITX form factor  
Dual Integrated 10/100/1000 Network  
Connection: Enables link aggregation  
and improves Ethernet throughput  
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3
Audio3: Audio subsystem with two  
analog audio outputs (2 + 2 independent  
multi-streaming)  
7
PCI Express* 3.0 x4 connector  
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10  
13  
6.7” (17cm)  
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5
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11  
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3
Intel® Desktop Board DQ77KB  
Executive Series  
Technical  
PROCESSOR  
Processor Support  
• Intel® Core™ i7 and Intel® Core™ i5 processors and other  
• Intel® processors in the LGA1155 package.  
• Supports Intel® 64 architecture4  
MEMORY MODES  
Dual- or single-channel operation support  
MEMORY VOLTAGE  
1.2 V to 1.8 V  
EMC REGULATIONS (tested in representative chassis)  
united States  
FCC 47 CFR Part 15, Subpart B  
Canada  
MECHANICAL BOARD STYLE  
• Thin Mini-ITX  
ICES-003 Class B  
CHIPSET  
• Intel® Q77 express chipset  
• Intel® Q77 Platform Controller Hub (PCH)  
Europe  
BOARD SIZE  
• 6.7” × 6.7” (17 cm × 17 cm)  
(EMC Directive 2004 / 108 / EC) EN 55022 and EN 55024  
PERIPHERAL CONNECTIVITY  
Australia / New Zealand  
4 SATA ports (2 SATA 6.0 Gb/s; 2 SATA 3.0 Gb/s)  
Dual Integrated 10/100/1000 Network Connection  
4 Super-Speed USB 3.0 ports (4 back panel ports)  
5 Hi-Speed USB 2.0 ports (5 internal headers)  
BASEBOARD POWER REQUIREMENTS  
• Thin Mini-ITX 19 V  
EN 55022 Class B  
INTEL® PRO 10/100/1000 NETWORK CONNECTION  
Low-power design  
Japan  
VCCI V-3, V-4 Class B  
ENVIRONMENT  
OPERATING TEMPERATURE  
EXPANSION CAPABILITIES  
One PCI Express* 3.0 x4 connector  
0° C to +55° C  
South Korea  
KN-22 and KN-24  
One Full-length PCI Express* Mini Card slot – supports mSATA  
One Half-length PCI Express* Mini Card slot – supports  
wireless Intel® AMT  
STORAGE TEMPERATURE  
-20°C to +70°C  
Taiwan  
CNS 13438 Class B  
HEADERS  
REGULATIONS AND SAFETY STANDARDS  
UNITED STATES AND CANADA  
CSA / UL 60950-1, First Edition (Binational Standard)  
SYSTEM MEMORY  
Memory capacity  
One serial port header  
International  
CISPR 22 Class B  
Custom Solutions header  
Digital microphone (DMIC) header  
Stereo speaker header  
Two 204-pin SODIMM connectors supporting up to two double-sided  
SODIMMs (16 GB5 max)  
EUROPE  
ENVIRONMENTAL COMPLIANCE EUROPE  
Europe  
(Low Voltage Directive 2006 / 95 / EC) EN 60950-1  
Memory Types  
Europe RoHS (Directive 2002/95/EC) china  
China RoHS (MII Order # 39)  
DDR3 16006/ 1333 SDRAM memory support  
Non-ECC Memory  
INTERNATIONAL  
IEC 60950-1  
JUMPERS AND FRONT-PANEL CONNECTORS  
Jumpers  
Single configuration jumper design  
Jumper access for BIOS maintenance mode  
5
System resources and hardware (such as PCI and PCI Express*) require physical  
memory address locations that can reduce available addressable system memory.  
This could result in a reduction of as much as 1 GB or more of physical addressable  
memory being available to the operating system and applications, depending on  
the system configuration and operating system.  
1
Intel® Turbo Boost Technology – maximum single-core turbo frequency (GHz). Intel  
turbo Boost Technology requires a PC with a processor with Intel Turbo boost  
Technology capability. Intel Turbo Boost Technology performance varies depending  
on hardware,software, and overall system configuration. Check with your PC  
manufacturer on whether your system delivers Intel Turbo Boost Technology. See  
Intel® Hyper-Threading Technology requires a computer system with a processor  
supporting HT Technology and an HT Technology-enabled chipset, BIOS, and  
operating system. Performance will vary depending on the specific hardware and  
Intel® High Definition Audio requires a system with an appropriate Intel® chipset  
and a motherboard with an appropriate codec and the necessary drivers installed.  
System sound quality will vary depending on actual implementation, controller,  
codec, drivers, and speakers. For more information about Intel® HD Audio, refer to  
64-bit computing on Intel® architecture requires a computer system with a  
processor,chipset, BIOS, operating system, device drivers, and applications enabled  
for Intel® 64 architecture. Processors will not operate (including 32-bit operation)  
without an Intel 64 architecture-enabled BIOS. Performance will vary depending on  
nology/intel64/index.htm for more information.  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®  
PRODUCTS.NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY  
INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS  
PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL  
ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR  
IMPLIEDWARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING  
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,  
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER  
INTELLECTUAL PROPERTY RIGHT.  
Intel products are not intended for use in medical, life-saving, or life-sustaining  
applications.  
Intel may make changes to specifications and product descriptions at any  
time, without notice.  
6
WARNING: Altering PC memory frequency, voltage and/or latency may: (i) reduce  
system stability and useful life of the system, memory and processor; (ii) cause the  
processor and other system components to fail; (iii) cause reductions in system  
performance; (iv) cause additional heat or other damage; and (v) affect system  
data integrity. Intel has not tested, and does not warranty, the operation of the  
memory beyond its specifications. Intel assumes no responsibility that the memory,  
including if used with altered clock frequencies and/or voltages, will be fit for any  
particular  
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3
All products, dates, and figures specified are preliminary based on current expectations,  
and are subject to change without notice. Availability in different channels may vary.  
4
Actual Intel® Desktop Board may differ from the image shown.  
Intel, the Intel logo, Intel Core, Pentium, and Celeron are trademarks of Intel Corporation  
in the U.S. and other countries.  
* Other names and brands may be claimed as the property of others.  
Copyright© 2012, Intel Corporation 05/12/ST/MED/PDF 327431-001  

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