®
Intel 631xESB/632xESB I/O
Controller Hub for Embedded
Applications
Thermal and Mechanical Design Guidelines
February 2007
Order Number: 315263-001
Contents—Intel® 6321ESB ICH
Contents
1.0 Introduction..............................................................................................................5
Design Flow........................................................................................................5
Definition of Terms..............................................................................................7
Reference Documents..........................................................................................7
2.0 Packaging Technology ...............................................................................................9
3.0 Thermal Specifications ............................................................................................11
Die Case Temperature .......................................................................................11
4.0 Thermal Simulation ................................................................................................. 12
5.0 Thermal Solution Requirements............................................................................... 13
Characterizing the Thermal Solution Requirement.................................................. 13
6.0 Thermal Metrology .................................................................................................. 16
7.0 Reference Thermal Solution..................................................................................... 19
Heatsink Performance........................................................................................ 19
7.5.1 Heatsink Orientation............................................................................... 23
7.5.2 Mechanical Interface Material................................................................... 24
7.5.3 Thermal Interface Material....................................................................... 24
7.5.4 Heatsink Clip ......................................................................................... 25
7.5.5 Clip Retention Anchors............................................................................25
8.0 Reliability Guidelines...............................................................................................26
Thermal Solution Component Suppliers ................................................................... 27
A.1 Torsional Clip Heatsink Thermal Solution .............................................................. 27
Mechanical Drawings...............................................................................................28
Figures
9
Thermal Design Process..............................................................................................6
Zero Degree Angle Attach Heatsink Modifications .........................................................17
Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity and Target
at 65C Local-Ambient ...............................................................................................20
11 Torsional Clip Heatsink Board Component Keepout ....................................................... 23
12 Torsional Clip Heatsink Assembly ............................................................................... 24
13 Torsional Clip Heatsink Assembly Drawing................................................................... 29
14 Torsional Clip Heatsink Drawing ................................................................................. 30
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Intel® 6321ESB ICH—Revision History
15 Heat Sink Foam Gasket Drawing.................................................................................31
16 Torsional Clip Drawing ..............................................................................................32
Tables
Reliability Guidelines.................................................................................................26
Revision History
Date
Revision Description
001 Initial public release.
February 2007
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Introduction—Intel® 6321ESB ICH
1.0
Introduction
As the complexity of computer systems increases, so do the power dissipation
requirements. Care must be taken to ensure that the additional power is properly
dissipated. Typical methods to improve heat dissipation include selective use of
ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the
Intel® 6321ESB I/O Controller Hub.
• Describe a reference thermal solution that meets the specification of Intel®
6321ESB I/O Controller Hub in Embedded applications.
Properly designed thermal solutions provide adequate cooling to maintain the Intel®
6321ESB I/O Controller Hub component die temperatures at or below thermal
specifications. This is accomplished by providing a low local-ambient temperature,
ensuring adequate local airflow, and minimizing the die to local-ambient thermal
resistance. By maintaining the Intel® 6321ESB I/O Controller Hub component die
temperature at or below the specified limits, a system designer can ensure the proper
functionality, performance, and reliability of the chipset. Operation outside the
functional limits can degrade system performance and may cause permanent changes
in the operating characteristics of the component.
The simplest and most cost-effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel® 6321ESB I/O
Controller Hub component only. For thermal design information on other chipset
components, refer to the respective component datasheet.
1.1
Design Flow
To develop a reliable, cost-effective thermal solution, several tools have been provided
and the tools appropriate for each step.
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Intel® 6321ESB ICH—Introduction
Figure 1.
Thermal Design Process
Step 1: Thermal
Simulation
y Thermal Model
y Thermal Model User's Guide
Step 2: Heatsink Selection
y Thermal Reference
y Mechanical Reference
Step 3: Thermal Validation
y Thermal Testing Software
y Software User's Guide
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Introduction—Intel® 6321ESB ICH
1.2
Definition of Terms
Table 1.
Definition of Terms
Term
Definition
Bond line thickness. Final settled thickness of the
thermal interface material after installation of
heatsink.
BLT
Flip Chip Ball Grid Array. A ball grid array packaging
technology where the die is exposed on the package
substrate.
FCBGA
The chipset component that integrates an Ultra ATA
100 controller, six Serial ATA host controller ports,
one EHCI host controller supporting eight external
USB 2.0 ports, LPC interface controller, flash BIOS
interface controller, PCI/PCI-X interface controller,
PCI Express interface, BMC controller, Azalia / AC'97
digital controller, integrated LAN controller, an ASF
controller and a ESI for communication with the MCH.
Intel® 6321ESB I/O Controller Hub
Linear Feet Per Minute. A measure of airflow emitted
from a forced convection device, such as an axial fan
or blower.
LFM
Memory controller hub. The chipset component that
contains the processor interface, the memory
interface, and the South Bridge Interface.
MCH
Maximum die temperature allowed. This temperature
is measured at the geometric center of the top of the
package die.
Tcase-max
Tcase-min
Minimum die temperature allowed. This temperature
is measured at the geometric center of the top of the
package die.
Thermal Design Power. Thermal solutions should be
designed to dissipate this target power level. TDP is
not the maximum power that the chipset can
dissipate.
TDP
Case-to-ambient thermal characterization parameter.
A measure of the thermal solution thermal
performance including the TIM using total package
power. Defined as (TCASE – TLA) / Total Package
Power.
ΨCA
Note: Heat source must be specified when using Ψ
calculations.
Case-to-Sink thermal characterization parameter. A
measure of the thermal interface material
performance using total package power. Defined as
(TCASE - TSINK)/ Total Package Power.
ΨCS
Note: Heat source must be specified when using Ψ
calculations.
Sink-to-Ambient thermal characterization parameter.
A measure of the heat sink performance using total
package power. Defined as (TSINK - TLA)/Total
Package Power.
ΨSA
Note: Heat source must be specified when using Ψ
calculations.
1.3
Reference Documents
The reader of this specification should also be familiar with material and concepts
presented in the following documents:
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Intel® 6321ESB ICH—Introduction
Table 2.
Referenced Documents
Title
Location
Intel® 631xESB / 632xESB I/O Controller Hub Datasheet
Intel® 631xESB / 632xESB I/O Controller Hub Specification Update
Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical
Design Guide
Reference# 31307301
V) Thermal Mechanical Design Guidelines
Intel® 6700PXH 64-bit PCI Hub (PXH) Datasheet
BGA/OLGA Assembly Development Guide
Various system thermal design suggestions
1.
Unless otherwise specified, these documents are available through your Intel field sales
representative. Some documents may not be available at this time.
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Packaging Technology—Intel® 6321ESB ICH
2.0
Packaging Technology
The Intel® 6321ESB I/O Controller Hub component uses a 40 mm x 40 mm, 10-layer
Figure 2.
Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View)
Die
Keepout
Area
Handling
Exclusion
Area
19.49mm.
10.78mm.
6.17mm.
ESB2
Die
20.19mm. 13.99mm.
26.0mm. 30.0mm. 40.0mm.
3.10mm.
26.0mm.
30.0mm.
40.0mm.
Figure 3.
Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)
Substrate
Decoup
2.535 ± 0.123 mm
Die
Cap
0.84 ± 0.05 mm
2.100 ± 0.121 mm
0.7 mm Max
0.20
See note 4.
0.20 –C–
Seating Plane
0.435 ± 0.025 mm
See note 3
See note 1.
Notes:
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave
(bowl shaped) orientation after reflow
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Intel® 6321ESB ICH—Packaging Technology
Figure 4.
Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View)
AT
A
R
A
AP
N
AM
AL
AK
AJ
A
H
AG
AF
AE
A
D
A
C
AB
AA
W
U
R
N
L
40 + 0.05
- A -
Y
V
T
P
M
K
H
F
19.11
J
G
E
35X 1.092
C
A
B
A
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34 36
11 13 15 17 19 21 23 25 27 29 31 33 35
1
3
5
7
9
35X
1.092
19.11
B
40 + 0.05
0.2
C
A
Notes:
1.
2.
3.
All dimensions are in millimeters.
All dimensions and tolerances conform to ANSI Y14.5M-1994.
Package Mechanical Requirements
The Intel® 6321ESB I/O Controller Hub package has an exposed bare die which is
capable of sustaining a maximum static normal load of 15-lbf. The package is NOT
capable of sustaining a dynamic or static compressive load applied to any edge of the
bare die. These mechanical load limits must not be exceeded during heatsink
installation, mechanical stress testing, standard shipping conditions and/or any other
use condition.
Notes:
1.
2.
3.
The heatsink attach solutions must not include continuous stress onto the chipset package with the
exception of a uniform load to maintain the heatsink-to-package thermal interface.
These specifications apply to uniform compressive loading in a direction perpendicular to the bare die/
IHS top surface.
These specifications are based on limited testing for design characterization. Loading limits are for the
package only.
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Thermal Specifications—Intel® 6321ESB ICH
3.0
Thermal Specifications
3.1
Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the Intel® 6321ESB I/O
Controller Hub component to consume maximum power dissipation for sustained time
periods. Therefore, in order to arrive at a more realistic power level for thermal design
purposes, Intel characterizes power consumption based on known platform benchmark
applications. The resulting power consumption is referred to as the Thermal Design
Power (TDP). TDP is the target power level that the thermal solutions should be
designed to. TDP is not the maximum power that the chipset can dissipate.
poor heat transfer capability into the board and have minimal thermal capability
without a thermal solution. Intel recommends that system designers plan for a heatsink
when using the Intel® 6321ESB I/O Controller Hub component.
3.2
Die Case Temperature
To ensure proper operation and reliability of the Intel® 6321ESB I/O Controller Hub
component, the die temperatures must be at or between the maximum/minimum
thermal solutions are required to maintain these temperature specifications. Refer to
Chapter 6.0 for guidelines on accurately measuring package die temperatures.
Table 3.
Intel® 6321ESB I/O Controller Hub Thermal Specifications
Parameter
Tcase_max
Value
Notes
105°C
5°C
Tcase_min
TDP
12.4W
Note:
These specifications are based on silicon characterization; however, they may be
updated as further data becomes available.
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Intel® 6321ESB ICH—Thermal Simulation
4.0
Thermal Simulation
Intel provides thermal simulation models of the Intel® 6321ESB I/O Controller Hub
component and associated user's guides to aid system designers in simulating,
analyzing, and optimizing their thermal solutions in an integrated, system-level
environment. The models are for use with the commercially available Computational
Fluid Dynamics (CFD)-based thermal analysis tool Flotherm* (version 5.1 or higher) by
Flomerics, Inc*. These models are also available in IcePak* format. Contact your Intel
field sales representative to order the thermal models and user's guides.
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Thermal Solution Requirements—Intel® 6321ESB ICH
5.0
Thermal Solution Requirements
5.1
Characterizing the Thermal Solution Requirement
The idea of a “thermal characterization parameter” Ψ (the Greek letter psi), is a
convenient way to characterize the performance needed for the thermal solution and to
compare thermal solutions in identical situations (i.e., heating source, local ambient
conditions, etc.). The thermal characterization parameter is calculated using total
package power, whereas actual thermal resistance, θ (theta), is calculated using actual
power dissipated between two points. Measuring actual power dissipated into the heat
sink is difficult, since some of the power is dissipated via heat transfer into the package
and board.
The case-to-local ambient thermal characterization parameter (Ψ ) is used as a
CA
measure of the thermal performance of the overall thermal solution. It is defined by
Equation 1. Case-to-Local Ambient Thermal Characterization Parameter (Ψ
)
CA
T
– T
CASE
LA
-------------------------
Ψ
=
CA
TDP
The case-to-local ambient thermal characterization parameter, Ψ , is comprised of
CA
Ψ
Ψ
, the thermal interface material (TIM) thermal characterization parameter, and of
, the sink-to-local ambient thermal characterization parameter:
CS
SA
Equation 2. Case-to-Local Ambient Thermal Characterization Parameter (Ψ
)
CA
Ψ
= Ψ + Ψ
CS SA
CA
Ψ
is strongly dependent on the thermal conductivity and thickness of the TIM
CS
between the heat sink and device package.
Ψ
is a measure of the thermal characterization parameter from the bottom of the
SA
heat sink to the local ambient air. Ψ is dependent on the heat sink material, thermal
SA
conductivity, and geometry. It is also strongly dependent on the air velocity through
characterization parameters.
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Intel® 6321ESB ICH—Thermal Solution Requirements
Figure 5.
Processor Thermal Characterization Parameter Relationships
TA
ΨSA
ΨCS
HEATSINK
ΨCA
TIM
TS
TC
Device
Example 1. Calculating the Required Thermal Performance
The cooling performance, Ψ is defined using the thermal characterization parameter
CA,
previously described. The process to determine the required thermal performance to
cool the device includes:
1. Define a target component temperature T
and corresponding TDP.
CASE
2. Define a target local ambient temperature, T .
LA
needed to cool the device.
The following provides an example of how you might determine the appropriate
performance targets.
Assume:
• TDP = 12.4 W and T
= 105° C
CASE
• Local processor ambient temperature, T = 65° C.
LA
configuration:
T
– T
105 – 65
------------------------- ---------------
= 3.23°
C
W
CASE
LA
---
Ψ
=
=
CA
TDP
12.4
To determine the required heat sink performance, a heat sink solution provider would
need to determine Ψ performance for the selected TIM and mechanical load
CS
configuration. If the heat sink solution were designed to work with a TIM material
CS
the heat sink is:
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Thermal Solution Requirements—Intel® 6321ESB ICH
C
W
---
Ψ
= Ψ
– Ψ
= 3.23 – 0.35 = 2.88°
CS
SA
CA
If the local ambient temperature is relaxed to 45° C, the same calculation can be
carried out to determine the new case-to-ambient thermal resistance:
T – T
105 – 45
C
W
C
LA
----------------- --------------
= 4.84°
---
Ψ
=
=
CA
TDP
12.4
It is evident from the above calculations that a reduction in the local ambient
temperature has a significant effect on the case-to-ambient thermal resistance
requirement. This effect can contribute to a more reasonable thermal solution including
reduced cost, heat sink size, heat sink weight, and a lower system airflow rate.
®
6321ESB I/O Controller Hub in one configuration using a TDP of 12.4 W. Further
calculations would need to be performed for different TDPs. Since the results are based
on air data at sea level, a correction factor would be required to estimate the thermal
performance at other altitudes.
Table 4.
Required Heat Sink Thermal Performance (Ψ
)
CA
Device
ΨCA (º C/W) at TLA = 45º C
ΨCA (º C/W) at TLA = 65º C
Intel® 6321ESB I/O Controller
Hub @ 12.4 W
4.84
3.23
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Intel® 6321ESB ICH—Thermal Metrology
6.0
Thermal Metrology
The system designer must make temperature measurements to accurately determine
the thermal performance of the system. Intel has established guidelines for proper
techniques to measure the Intel® 6321ESB I/O Controller Hub die temperatures.
®
performance and evaluation.
6.1
Die Case Temperature Measurements
®
To ensure functionality and reliability, the Tcase of the Intel 6321ESB ICH must be
maintained at or between the maximum/minimum operating range of the temperature
the die corresponds to Tcase. Measuring Tcase requires special care to ensure an
accurate temperature measurement.
Temperature differences between the temperature of a surface and the surrounding
local ambient air can introduce errors in the measurements. The measurement errors
could be due to a poor thermal contact between the thermocouple junction and the
surface of the package, heat loss by radiation and/or convection, conduction through
thermocouple leads, and/or contact between the thermocouple cement and the
heatsink base. For maximize measurement accuracy, only the 0° thermocouple attach
approach is recommended.
6.1.1
Zero Degree Angle Attach Methodology
1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the
bottom of the heatsink base.
2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered
hole to one edge of the heatsink. The slot should be parallel to the heatsink fins
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The
cutouts should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to
the center of the top surface of the die using a high thermal conductivity cement.
During this step, ensure no contact is present between the thermocouple cement
and the heatsink base because any contact will affect the thermocouple reading. It
6. Attach heatsink assembly to the MCH and route thermocouple wires out through
the milled slot.
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Thermal Metrology—Intel® 6321ESB ICH
Figure 6.
Thermal Solution Decision Flowchart
Start
Attach
thermocouples
using recommended
metrology. Setup
the system in the
desired
Run the Power
program and
monitor the
device die
Attach device
to board
using normal
reflow
Tdie >
Specification?
No
temperature.
process.
configuration.
End
Select
Heatsink
Heatsink
Required
Yes
001240
Figure 7.
Zero Degree Angle Attach Heatsink Modifications
Note: Not to scale.
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Reference Thermal Solution—Intel® 6321ESB ICH
7.0
Reference Thermal Solution
Intel has developed one reference thermal solution to meet the cooling needs of the
Intel® 6321ESB I/O Controller Hub component under operating environments and
specifications defined in this document. This chapter describes the overall requirements
for the Torsional Clip Heatsink reference thermal solution including critical-to-function
dimensions, operating environment, and validation criteria. Other chipset components
may or may not need attached thermal solutions, depending on your specific system
local-ambient operating conditions.
7.1
7.2
Operating Environment
®
The Intel 6321ESB ICH reference thermal solution was designed assuming a
maximum local-ambient temperature of 65°C. The minimum recommended airflow
velocity through the cross section of the heatsink fins is 150 linear feet per minute
(LFM). The approaching airflow temperature is assumed to be equal to the local-
ambient temperature. The thermal designer must carefully select the location to
measure airflow to obtain an accurate estimate. These local-ambient conditions are
based on a 55°C external-ambient temperature at sea level. (External-ambient refers
to the environment external to the system.)
Heatsink Performance
Figure 9 depicts the measured thermal performance of the reference thermal solution
versus approach air velocity. Since this data was measured at sea level, a correction
factor would be required to estimate thermal performance at other altitudes.
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Intel® 6321ESB ICH—Reference Thermal Solution
Figure 9.
Torsional Clip Heatsink Measured Thermal Performance Versus Approach
Velocity and Target at 65C Local-Ambient
8.000
7.000
Thermal Target
6.000
Simulation results with
EOLife TIMperformance
5.000
4.000
3.000
2.000
1.000
0.000
0
50
100
150
200
250
300
350
400
LFM through fin area
7.3
Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed
®
When using heatsinks that extend beyond the Intel® 6321ESB I/O Controller Hub
between the heatsink and motherboard cannot exceed 2.46 mm (0.10 in.) in height.
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Reference Thermal Solution—Intel® 6321ESB ICH
Figure 10.
Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O
Controller Hub
ESB2
Passive
Heatsink
Die + TIM
FCBGA + Solder Balls
Motherboard
42.30 mm
Passive
Heatsink
7.4
Board-Level Components Keepout Dimensions
The location of holes pattern and keepout zones for the reference thermal solution are
pattern as that of the Intel® E7500/E7501/E7505 chipset.
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Intel® 6321ESB ICH—Reference Thermal Solution
7.5
Torsional Clip Heatsink Thermal Solution Assembly
®
The reference thermal solution for the Intel 6321ESB ICH component is a passive
heatsink with thermal interface. It is attached using a clip with each end hooked
solution assembly and associated components. The torsional clip and the clip retention
anchor are the same as the one used on the Intel® E7500/E7501/E7505 and 3100
chipset reference thermal solutions.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are
Component Suppliers” contains vendor information for each thermal solution
component.
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Reference Thermal Solution—Intel® 6321ESB ICH
Figure 11.
Torsional Clip Heatsink Board Component Keepout
Note: Same Keepout zones as Intel ® 3100 Chipset
7.5.1
Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be
aligned with the direction of the heatsink fins.
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Intel® 6321ESB ICH—Reference Thermal Solution
Figure 12.
Torsional Clip Heatsink Assembly
7.5.2
7.5.3
Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
Thermal Interface Material
A Thermal Interface Material (TIM) provides improved conductivity between the die and
heatsink. The reference thermal solution uses Honeywell* PCM45F, 0.254 mm (0.010
in.) thick, 15 mm x 15 mm (0.59 in. x 0.59 in.) square.
Note:
Unflowed or "dry" Honewell PCM-45F has a material thickness of 0.010 inch. The
flowed or "wet" Honeywell PCM-45F has a material thickness of ~0.003 inch after it
reaches its phase change temperature.
7.5.3.1
Effect of Pressure on TIM Performance
As mechanical pressure increases on the TIM, the thermal resistance of the TIM
decreases. This phenomenon is due to the decrease of the bond line thickness (BLT).
BLT is the final settled thickness of the thermal interface material after installation of
heatsink. The effect of pressure on the thermal resistance of the Honeywell PCM45 F
Intel provides both End of Line and End of Life TIM thermal resistance values of
Honeywell PCM45F. End of Line and End of Life TIM thermal resistance values are
obtained through measurement on a Test Vehicle similar to the Intel® 631xESB/
632xESB I/O's physical attributes using an extruded aluminum heatsink. The End of
Line value represents the TIM performance post heatsink assembly while the End of
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Reference Thermal Solution—Intel® 6321ESB ICH
Life value is the predicted TIM performance when the product and TIM reaches the end
of its life. The heatsink clip provides enough pressure for the TIM to achieve End of Line
2
thermal resistance of 0.345 °C x in /W and End of Life thermal resistance of 0.459°C
2
in /W.
Table 5.
Honeywell PCM45 F TIM Performance as a Function of Attach Pressure
Thermal Resistance (°C × in2)/W
Pressure on IHS(psi)
End of Line End of Life
End of Line End of Life
2.18
0.391
0.345
0.551
0.459
4.35
Note: All measured at 50ºC.
7.5.4
7.5.5
Heatsink Clip
The reference solution uses a wire clip with hooked ends. The hooks attach to wire
mechanical drawing of the clip.
Clip Retention Anchors
For Intel® 6321ESB I/O Controller Hub-based platforms that have very limited board
space, a clip retention anchor has been developed to minimize the impact of clip
retention on the board. It is based on a standard three-pin jumper and is soldered to
the board like any common through-hole header. A new anchor design is available with
45° bent leads to increase the anchor attach reliability over time. See Appendix A,
“Thermal Solution Component Suppliers” for the part number and supplier information.
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Intel® 6321ESB ICH—Reliability Guidelines
8.0
Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
Table 6.
Reliability Guidelines
Test (1)
Requirement
Pass/Fail Criteria (2)
Mechanical Shock
50 g, board level, 11 msec, 3 shocks/axis
Visual Check and Electrical Functional Test
7.3 g, board level, 45 min/axis, 50 Hz to
2000 Hz
Random Vibration
Temperature Life
Visual Check and Electrical Functional Test
Visual Check
85°C, 2000 hours total, checkpoints at
168, 500, 1000, and 2000 hours
Thermal Cycling
Humidity
-5°C to +70°C, 500 cycles
Visual Check
Visual Check
85% relative humidity, 55°C, 1000 hours
Notes:
1.
It is recommended that the above tests be performed on a sample size of at least twelve assemblies
from three lots of material.
Additional pass/fail criteria may be added at the discretion of the user.
2.
§ §
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Thermal Solution Component Suppliers—Intel® 6321ESB ICH
Appendix A Thermal Solution Component Suppliers
A.1
Torsional Clip Heatsink Thermal Solution
Intel Part
Number
Supplier
Part
Contact Information
Wendy Lin
510-770-8566, x211
Wendy@coolermaster.com
(Part Number)
AdvancedTCA* and
Embedded Form Factor Heat
Sink
ECB-00306-01-GP
(Aluminum)
N/A
N/A
Paula Knoll
858-705-1274
Honeywell*
PCM45F
Thermal Interface
(PCM45F)
Harry Lin (USA)
714-739-5797
Monica Chih (Taiwan)
866-2-29952666, x131
Heatsink Attach Clip
A69230-001
CCI/ACK
Foxconn*
Bob Hall (USA)
503-693-3509, x235
Heat Sink Attach Clip
Solder-Down Anchor
A69230-001
A13494-005
Julia Jiang (USA)
408-919-6178
Foxconn
(HB96030-DW)
Note: The enabled components may not be currently available from all suppliers. Contact the supplier
directly to verify time of component availability.
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Intel® 6321ESB ICH—Mechanical Drawings
Appendix B Mechanical Drawings
Table 7.
Mechanical Drawing List
Drawing Description
Figure Number
Torsional Clip Heatsink Assembly Drawing
Torsional Clip Heatsink Drawing
Heat Sink Foam Gasket Drawing
Torsional Clip Drawing
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