Bosch Appliances Computer Hardware DVA 08K User Manual

Failed Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

4.2.1

4.2.2

4.2.3

4.3.2

4.4

I C Monitoring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

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Subsystem Connection and Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Basic Configuration Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

SCSI Connection Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

SCSI Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

SCSI Port on the Controller Rear Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

SCSI Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Host Connection Topolog y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7

Power On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Power On Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Power On Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Power On Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Power On Status Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

LCD Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Power Off Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Subsystem Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

General Notes on Component Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Replacing Controller Module Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Notes on Controller Module Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Removing the Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Replacing the Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Replacing or Upgrading Memory Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Memory Module Installation Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Selecting a Memory Modul e . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5

DIMM Module Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Replacing a Faulty BBU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Replacing a Failed PSU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Notes on PSU Module Maintenanc e . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7

Replacing the PSU Modul e . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7

Replacing a Failed Cooling Fan Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Notes on Cooling Fan Module Maintenanc e . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 0

Replacing a Cooling Fan Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Drive Tray Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Notes on Hard Drive Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Replacing a Failed Hard Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Appendix: Technical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Controller Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Drive Tray Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Power Supply Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Cooling Module Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

RAID Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Fault Tolerance Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Appendix: Spare Parts and Accessorie s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 0

Spare Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Spare Parts Overvie w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 0

Spare Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Controller Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Accessories and Optional Item s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1

Appendix: Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

SCSI Port: VHDCI Connector Pinouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

COM1 Cable: DB9 and Audio Jack Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Null Modem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Ethernet Port Pinouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Main Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

9.5

Index. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

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Warnings and Certifications

1.1

Warning

A shielded power cord is required in order to meet FCC emission limits and also to prevent

interference to nearby radio and television reception.

Use only shielded cables to connect I/O devices to this equipment. You are cautioned that

changes or modifications not expressly approved by the party responsible for compliance

could void your authority to operate the equipment.

1.2

Safety Precautions

Precautions and Instructions

•

Prior to powering on the subsystem, ensure that the correct power range is being used.

The RAID subsystems come with drive bays. Leaving any of these drive bays empty will

seriously affect the efficiency of the airflow within the enclosure, and will consequently

lead to the system overheating, which can cause irreparable damage.

If a module fails, leave it in place until you have a replacement unit and you are ready to

replace it.

•

Airflow Consideration: The subsystem requires an airflow clearance, especially at the

front and the rear side.

Handle subsystem modules using the retention screws, extraction levers, and the metal

frames/faceplates. Avoid touching PCB boards and connector pins.

To comply with safety, emission, or thermal requirements, none of the covers or replace-

able modules should be removed. Make sure that during operation, all enclosure modules

and covers are securely in place.

•

Be sure that the rack cabinet into which the subsystem chassis will be installed provides

sufficient ventilation channels and airflow circulation around the subsystem.

Provide a soft, clean surface to place your subsystem on before working on it. Servicing

on a rough surface may damage the exterior of the chassis.

If it is necessary to transport the subsystem, repackage all disk drives separately. If using

the original package material, other replaceable modules can stay within the enclosure.

ESD Precautions

Observe all conventional anti-ESD methods while handling system modules. The use of a

grounded wrist strap and an anti-static work pad are recommended. Avoid dust or debris in

your work area.

1.3

Certification

FCC Class B Radio Frequency Interference Statement

FCC (applies in the U.S. and Canada)

This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to Part 15 of the FCC Rules (47 CFR, Part 2, Part 15 and CISPR PUB. 22

Class B). These limits are designed to provide reasonable protection against harmful interfer-

ence when the equipment is operated in a residential installation. This equipment generates,

uses, and can radiate radio frequency energy and, if not installed and used in accordance with

this user’s manual, may cause harmful interference to radio communications. However, there

is no guarantee that interference will not occur in a particular installation. If this equipment

does cause harmful interference to radio or television reception, which can be determined by

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turning the equipment off and on, the user is encouraged to try to correct the interference by

one or more of the following measures:

•

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

•

Consult the dealer or an experienced radio/TV technician for help

This device complies with Part 15 of FCC Rules. Operation is subjected to the following two

conditions: 1) this device may not cause harmful interference, and 2) this device must accept

any interference received, including interference that may cause undesired operation.

This device is in conformity with the EMC.

(Certified Worldwide)

This device meets the requirements of the CB standard for electrical equipment with regard to

establishing a satisfactory level of safety for persons using the device and for the area sur-

rounding the apparatus. This standard covers only safety aspects of the above apparatus; it

does not cover other matters, such as style or performance.

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Introduction | en

Introduction

This manual covers the DVA-08K series of RAID subsystems.

With its basic hardware redundancy and the capability of fast I/O transfer, the 2U RAID SATA

subsystem is an ideal solution to meet the ever increasing demands for addition of storage

capacity. Despite its ease of use, the subsystem does not compromise data protection for

convenience. The subsystem’s embedded firmware offers the same protection and mainte-

nance functionalities as those designed for an enterprise-level RAID solution. The subsystems

provide unprecedented configuration flexibility and allow for the customization of storage

subsystems to meet specific demands. It is a rigorous and durable subsystem that can be eas-

ily configured and operated.

Fully featured RAID redundancy (which provides advanced data protection) ensures that the

complete range of RAID levels (RAID 0, 1(0+1), 3, 5, 10, 30 and 50) is supported by the con-

troller head. A long list of sophisticated firmware functions (dedicated/global hot-spares, bat-

tery protected disk cache, configurable reaction schemes against drive errors, remote and

real-time array monitoring, and more) further guarantees the overall availability of valuable

data.

IT managers using the RAID subsystems will be able to rapidly develop a comprehensive stor-

age array. And the modular nature of the subsystem minimizes the maintenance effort to use

the RAID appliance.

2.1

Product Overview

The subsystem comes with two (2) SCSI-320 host channels interfaced through four (4) VHDCI

68-pin SCSI ports. The subsystem comes in a 2U-profile rack-mountable chassis which houses

a RAID controller module featuring complete RAID configuration and data protection function-

ality. The subsystem’s operation is protected by redundant, hot-swappable power supplies

and cooling fan modules. Designed for a high level availability, all major components are hot-

replaceable including its Li-ION battery and the RAID-protected disk drives.

The subsystem supports high-density array capacity by its eight drive bays for SATA-II inter-

face disk drives. The subsystem facilitates large I/O transfer, over its dual PCI-X buses archi-

tecture, and transmission of block I/Os over flexible caching and a dedicated XOR engine. The

subsystem is ideal for direct-attached data storage, backup, and retrieval. It combines the

capabilities and block-level performance of RAID storage with the reliable SCSI transfer tech-

nologies.

Configured arrays are easily combined with multiple ID/LUNs that appear to the host ports,

turning massive capacity into manageable units for data-sharing in a heterogeneous environ-

ment.

The RAID 2U-profile, SCSI-to-SATA RAID storage comes in two different models. The only dif-

ference between the two models is the number of SATA-II drive bays.

SCSI Host Ports

Connectivity: The subsystem features a 320MB/s bandwidth from each of its SCSI host chan-

nels. The dual-stack VHDCI connectors on the rear panel facilitate the connection to multiple

host computers and combining the storage capacities of multiple RAID subsystems. Its back-

ward compatibility with older SCSI protocols requires minimum investment for upgrading

equipment. Storage volumes are associated with SCSI ID/LUNs on the host channels. The

subsystem firmware provides flexible configurations of storage volumes which include, logical

drives in supported RAID 0, 1 (0+1), 3, and 5 levels, logical volumes that consist of one or

more logical drives, and the logical partitions of the previously mentioned configurations.

These volumes then appear as SCSI targets over the host links.

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Channels: The SCSI ID/LUN mapping method enables users to associate a storage volume

with multiple IDs or LUNs on the host channels. The mapping method can easily cope with

host-side configurations such as clustered servers or high availability path redundancy. On the

drive side, all of the eight (8) SATA-II drives are connected each through a dedicated SATA

channel. Each drive channel is routed to an enclosure drive tray that is equipped with a stan-

dard SATA connector with of hot-swap capability. The methods used for assembling physical

drives, fault management, and status monitoring are identical to that used with Bosch’s long

line of RAID storage enclosures.

Active Components

The subsystem comes with:

•

A single RAID controller module

Two redundant, hot-swappable cooling modules

Dual redundant, hot-swappable, load-sharing power supplies

A module slot for a Li-ION battery module.

The front section of the enclosure houses eight (8) hot-swap drive bays for SATA-II or

backward compatible with SATA-I hard disk drives.

The subsystem is shown below:

Fig. 2.1 8-bay SATA RAID Subsystem

NOTICE!

On receiving and unpacking your subsystem, please check the package contents against the

included unpacking checklist. If any modules appear to be missing, please contact your sub-

system vendor immediately.

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2.2

Enclosure Chassis

2.2.1

Chassis Overview

The RAID subsystem comes in a 2U metal chassis. A backplane board divides the enclosure

internally into front and rear sections. The front section accommodates eight (8) drive trays

(with their associated hard drives) and the rear section accommodates two (2) PSU modules,

two (2) single-fan cooling modules, and a single RAID controller module. The two (2) forearm

handles on the front of the subsystem enable you to easily insert/extract the chassis into/from

a rack or cabinet. Pre-drilled mounting holes on the sides of the chassis allow you to attach

separately purchased slide rails.

Fig. 2.2 Top View of the RAID subsystem

CAUTION!

When working with the subsystem, it is important to use tools with extreme care. Do not place

tools or other items on top of the enclosure to help avoid damaging the chassis finish.

2.2.2

2.2.3

Physical Dimensions

The subsystem comes in a standard 2U, 19” chassis with the following dimensions:

•

Measured with forearm handles: 482mm x 88mm x 505mm (width x height x depth)

Measured without forearm handles: 446mm x 88mm x 490mm (width x height x depth)

Front Panel Overview

The front section of the subsystem features a 4 x 2 layout for eight (8) 3.5-inch disk drives and

a foldable LCD keypad panel. The front panels of the RAID subsystems described in this man-

ual are shown in Figure 2.3. A description of the front panel component is given below:

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Fig. 2.3 Front View

The front panel is designed to accommodate the following components:

•

Forearm handles with an LCD keypad panel: The LCD Panel mounted on the left handle

shows system information and provides local access to the firmware-embedded configu-

ration and monitoring utility.

•

Drive bays with drive tray canisters: The drive bays are used to house the subsystem hard

drives. The DVA-08K contains 8 drive bays with a blank plate covering the lower part of

the front panel.

2.2.4

Hard Drive Numbering

The subsystem is housed in an enclosure that is 4 bays wide and 2 bays high. When viewed

from the front, drive bays (slots) are numbered 1 to 8, from the left to the right, and then from

the top to the bottom.

Fig. 2.4 Drive Bays Numbering Sequence

2.2.5

Rear Panel Overview

The rear section of the subsystems are accessed through the rear panel and is reserved for a

single RAID controller module, one (1) battery backup unit (BBU), two (2) power supply units

(PSUs), and two cooling fan modules.

The subsystem rear view is shown in Figure 2.5. A description of the rear panel component is

given in the proceeding discussions:

Fig. 2.5 Rear View

The rear panel shown above is designed to accommodate the following components:

•

RAID controller module: The controller module contains a controller main board and a

pre-installed DDR DIMM module.

•

Power Supply Unit (PSU): The PSU is used to provide power to the subsystem.

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•

BBU module: A BBU provides the protective implementation to cached data; and, unless

deselected when purchasing the subsystems, is installed into the module slot located at

the upper left corner of the controller module.

Cooling fan module: The redundant cooling fan module is used to ventilate the subsystem

and to reduce the temperature within the subsystem.

NOTICE!

Each of the power supplies on the sides of the enclosure houses one cooling fan module in a

removeable canister. When a power supply is removed, the cooling module is also removed.

Therefore, replace the power supply unit as soon as possible whenever it becomes necessary.

Cooling fan modules can be independently removed from the chassis without affecting PSU

operation.

2.2.6

Backplane Board

An integrated backplane board separates the front and rear sections of the subsystem. The

PCB board provides traces for logic level signal traces and low voltage power paths. It con-

tains no user-serviceable components.

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2.3

Subsystem Components

All the active components on the subsystem can be accessed through either the front or rear

panel. The modular design of the active components facilitates their easy installation and

removal. Hot-swap mechanisms are incorporated to eliminate power surges and signal

glitches that might occur while removing or installing these modules.

2.3.1

LCD Panel

Fig. 2.6 Opening the Front Handle

The LCD panel shown in Figure 2.6 consists of a 16 characters x 2 rows LCD screen with push

buttons, a mute button, and LED status indicators. The LCD front panel provides full access to

all array configurations and monitoring. After powering up the subsystem, the initial screen

will show the subsystem model name. A different name can be manually assigned to the sub-

system or different drive arrays. This will enable easier identification in a topology consisting

of numerous arrays.

Fig. 2.7 Front Panel Retention Latch

To access drive bays in the left- or right-hand side column, first flip the retention latches (see

Figure 2.7) on the enclosure front handles, and then swing the handles to the left- and right-

hand sides. To close the handles (see Figure 2.8), swing the handles toward the system; gen-

tly press the handles until a click is heard. The latches will keep the handles in place.

Fig. 2.8 Closing the Front Handles

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2.3.2

Drive Trays

The subsystem comes with 8 drive trays (see Figure 2.9) designed to accommodate separately

purchased standard 1-inch pitch, 3.5-inch disk drives. The drive bays are accessed from the

enclosure front. Two LED’s on the front of the tray are used to indicate the drive status. A key-

lock on each drive tray secures the hard drive in place, while an easily accessible release but-

ton ensures fast and efficient drive hot-swapping.

Fig. 2.9 Drive Tray Front View

CAUTION!

Be careful not to warp, twist, or contort the drive tray in any way (e.g., by dropping it or rest-

ing heavy objects on it). The drive tray has been customized to fit into the drive bays in the

subsystem. If the drive bay superstructure is deformed or altered, the drive trays may not fit

into the drive bay.

2.3.3

The RAID Controller Module

The RAID controller module contains a main circuit board, a preinstalled 256MB capacity or

above DDR RAM DIMM module, and the necessary support interfaces. The controller module

contains no user-serviceable components. Except when replacing a faulty unit or installing/

upgrading the cache memory inside, the controller module should never be removed or

opened.

CAUTION!

Although the RAID controller can be removed, the only time you should touch the controller

itself is to replace the memory module or to install the memory module. The RAID controller is

built of sensitive components and unnecessary tampering can damage the controller.

Controller Module Interfaces

The subsystems provide external interfaces to host computers and management station(s)

through the RAID controller’s rear-side faceplate as shown in Figure 2.10.

Fig. 2.10 Controller Module Faceplate

•

Host Ports

SCSI-320 Host Ports: Two SCSI-320 host channels connect the subsystem to the host

computers equipped with SCSI-320 compatible adapters through the dual-stack VHDCI

connectors. The dual-stack connectors facilitate cascade connections for configurations

such as host clustering or cascading with another RAID subsystem.

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NOTICE!

This subsystems come with preset configurations for channel mode and channel ID settings,

and should be sufficient for most applications.

•

Ethernet Port

All controller modules on the subsystems come with a single 10/100BasedT RJ-45 Ether-

net port. The Ethernet port is used for local or remote management through the network

using the Bosch RAIDWatch GUI manager or Telnet protocol.

COM Port

All controller modules come with one RS-232C (audio jack) serial port. The serial port is

used for local access to the system-embedded configuration utility over the included

serial port cable.

DIMM Module

The controller module comes with a preinstalled 256MB capacity or above DDR RAM DIMM

module and can support a larger capacity up to 2GB. The DIMM module is mounted in an eas-

ily accessible location on the controller board. However, when the DIMM module is being

changed, the controller module must be removed from the subsystem chassis.

2.3.4

Battery Backup Unit

The Li-ION battery backup unit (BBU) module sustains cache memory for days after a power

failure. It is installed on the upper left corner of the controller module in the rear of subsystem

chassis. Please refer to Section 3 Hardware Installation for installation details.

Fig. 2.11 BBU Module

In accordance with international transportation regulations, the BBU module is only charged

to between 35% and 45% of its total capacity when shipped. Therefore, when powering on the

subsystem for the first time the BBU will begin to charge its batteries to their full capacity. It

normally requires approximately twelve (12) hours for the battery to be fully charged. If the

battery is not fully charged after twelve (12) hours (its LED is still flashing), there is a problem

with the BBU module and you should contact your subsystem vendor immediately. While the

battery is being charged, the LED on the BBU rear panel and the fifth LED on the controller

module will flash.

You can check the status of the battery’s charge via Bosch RAIDWatch Manager or the firm-

ware utility screen.

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2.3.5

Power Supply Units

The SATA-based RAID subsystems are equipped with two (2) redundant, hot-swappable, 2U,

350W power supply unit (PSUs) modules. The PSU is permanently mounted into a 2U high

(dual-level) bracket especially designed to house both the PSU and a cooling module mounted

underneath. PSUs can be found on either side of the controller module.

Each PSU comes with a single power socket for power cord plug-in and a single power switch

for you to turn the PSU on and off. Each PSU also comes with two embedded cooling fans to

provide sufficient airflow to keep the PSU cool. A single LED is used to indicate the PSU sta-

tus. A handle at the back of the PSU has been especially designed to enable you to remove the

PSU from the subsystem while the system is still online. This should only be done if the PSU

has failed and needs to be replaced.

NOTICE!

Hot-swapping the PSU also removes the cooling module at the lower slot.

A retention screw at the upper right corner of the PSU module is used to secure the PSU to

the enclosure. If the PSU needs to be removed, the retention screw must be removed first.

When installing a new PSU module, make sure that the retention screw has been firmly

secured.

Fig. 2.12 PSU Module

2.3.6

Cooling Fan Modules

The SATA-based RAID subsystem is equipped with two 1U single-fan, redundant, hot-swappa-

ble cooling modules shown in Figure 2.13. One 9.7cm fan is housed in each cooling module.

These modules have been designed to generate a cooling flow from the front to the rear of the

subsystem to extract the heat generated by the SATA hard drives. Two of the cooling fan mod-

ules are installed directly beneath the PSUs.

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Fig. 2.13 Top View of a Cooling Fan Module

Advanced Fault-Preventative Operation

The cooling fan modules support dual-speed operation modes that help to protect the subsys-

tem in the event of component failure or extreme working condition.

Intelligent Dual Speed Operation

The cooling fans operate with two rotation speeds. Under normal operating conditions, the

cooling fans run at the low speed, which is sufficient for maintaining efficient airflow across

components. Under the following conditions, cooling fans raise their rotation speed to

increase the airflow:

1. Component Failure: if another cooling fan module, a PSU, or a temperature sensor fails,

the remaining cooling fan(s) automatically raises its rotation speed.

2. Elevated Temperature: if the temperature breaches the upper threshold set for any of the

interior temperature sensors, the cooling fans automatically raises its rotation speed.

3. During the subsystem initialization stage, the cooling fans operate at the high speed and

return to lower speed once the initialization process is completed and no erroneous con-

dition is detected.

NOTICE!

There are two values set for the upper temperature thresholds. One is set for event notifica-

tion and the other triggering higher fan rotation speed. The preset value for event notification

can be changed using the firmware-embedded configuration utility, while the fan speed trig-

ger is not a user’s option.

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2.4

Subsystem Monitoring

The SATA-based RAID subsystem comes with a number of different monitoring methods that

provide you with continual updates on the status of the system and individual components.

The following monitoring features are included in the subsystem.

2.4.1

I²C Bus

The following subsystem elements are interfaced to the RAID controller over a non-user-ser-

viceable I²C bus:

•

Cooling fan modules

PSUs

Temperature sensors

2.4.2

LED Indicators

The following active components come with LEDs to indicate the status of the individual com-

ponents:

•

RAID controller

LCD panel

Cooling fan module

PSU module

BBU module

Drive trays

2.4.3

2.4.4

Firmware and Bosch RAIDWatch GUI

Firmware: The firmware is pre-installed software that is used to configure the subsystem. The

firmware can be accessed either through the LCD keypad panel or a terminal emulation pro-

gram running on a management computer that is connected to the subsystem’s serial port.

Bosch RAIDWatch: Bosch RAIDWatch is a premier Web-based graphical user interface (GUI)

that can be installed on a remote computer and is used to access the array through LAN or the

Internet. The manager communicates with the array via the connection of the existing host

interface or Ethernet link to the RJ-45 LAN port.

Audible Alarms

The subsystems come with audible alarms that are triggered when certain active components

fail or when certain (controller or subsystem) thresholds are exceeded. If you hear hastily

repeated beep tones from the subsystems it is imperative that you immediately determine and

rectify the problem.

Event notification messages indicate the completion of or the condition when proceeding with

array configuration tasks and are always accompanied by two or three successive and pro-

longed beeps.

CAUTION!

Failing to respond when a critical alarm is heard can lead to permanent damage of the subsys-

tem. When an audible alarm is heard, rectify the problem as soon as possible.

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2.5

Hot-Swappable Components

2.5.1

Hot-Swap Capabilities

The subsystem comes with a number of hot-swappable components. A hot-swap component

is one that can be exchanged while the subsystem is still online without affecting the opera-

tional integrity of the subsystem. These components should only be removed from the subsys-

tem when they are being replaced. At no other time should these components be removed

from the subsystem.

2.5.2

2.5.3

Components

The following components are all hot-swappable:

•

Power supply units (PSUs)

Cooling fan modules

Hard drives

BBU module

Normalized Airflow

Proper subsystem cooling is referred to as “normalized” airflow. Normalized airflow ensures

the sufficient cooling of the subsystem and is only attained when all components are properly

installed. Therefore, a failed component should only be hot-swapped when a replacement is

available. If a failed component is removed but not replaced, permanent damage to the sub-

system can result.

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Hardware Installation

This chapter gives detailed instructions on how to install the subsystem. When installing the

subsystem, it is necessary to mount the chassis into a rack or cabinet and to install hard

drives and drive trays. Installation into a rack or cabinet should occur before the hard drives or

drive trays are installed into the subsystem. Please confirm that you received all of the compo-

nents listed on the Unpacking List that came with the subsystem before proceeding with the

installation process.

CAUTION!

Please note that the installation instructions described in this chapter should be carefully fol-

lowed to prevent any difficulties and damages to your system.

3.1

Installation Prerequisites

•

Static free installation environment: The subsystems must be installed in a static-free

environment to minimize the possibility of electrostatic discharge (ESD) damage. (See

Section 1 Warnings and Certifications).

•

Component check: Before installing the subsystems, you should first check to see that

you have received all the required components. If any items appear damaged, contact

your vendor for a replacement.

•

Hard drives: Hard drives must be purchased separately prior to the subsystem installa-

tion.

Cabling:

–

The subsystems requires an external VHDCI-to-VHDCI SCSI round cable to connect

the subsystem to a host computer.

–

One (1) audio-jack-to-DB9 cable is provided to facilitate the connection of the COM1

port for local terminal emulation access to the array.

–

Two (2) power cords are provided for the power connections to the power sources.

The RJ-45 Ethernet cable for network management connection is a user-supplied

item.

•

Memory module: If you wish to change the pre-installed memory module, a separately

purchased module must be installed. Please contact your vendor for a different memory

module or consult the list of compatible modules.

Rack installation: The enclosure chassis can be installed into a rack cabinet using self-

purchased mounting rails. A printed copy of installation guide is provided with the slide

rails package.

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3.2

Safety Precautions

3.2.1

Precautions and Instructions

•

Be sure the correct power range (100-120 or 220-240VAC) is supplied by your rack cabi-

net, UPS device, or power outlet.

•

Thermal notice: All drive trays (even if they do not contain a hard drive) must be installed

into the enclosure. Leaving a drive bay or module slot open will severely affect the airflow

efficiency within the enclosure, and will consequently lead to system overheating. Keep a

faulty module in place until you have a replacement unit and you are ready to replace it.

An enclosure without disk drives can weigh over 25 kilograms. Two (2) people are

required to install or relocate the subsystem. To avoid damage to disk drives, drives

should be removed from the enclosure before moving the subsystem.

Handle the system modules by the retention screws, extraction levers, or the modules

metal frames/faceplates only. Avoid touching the PCB boards, connector pins, and sol-

dered surfaces.

•

Airflow considerations: The subsystem requires an airflow clearance especially on the

front and rear. For proper ventilation, a minimum of 2.5cm is required between the front

of the enclosure and rack cover; a minimum of 5cm is required between the enclosure

and end of the rack.

•

None of the covers or replaceable modules should be removed in order to maintain com-

pliance with safety, emission, or thermal requirements.

Always secure every enclosure module by its retaining screws or make sure it is held in

place by its latches.

Always make sure the subsystem has a safe electrical earth connection via power cords

or chassis ground by the rack cabinet.

Be sure that the rack cabinet in which the subsystem chassis is to be installed provides

sufficient ventilation channels and airflow circulation around the subsystem.

Provide a soft, clean surface to place your enclosure on before working on it. Servicing

the enclosure on a rough surface may damage the finish of the chassis.

If it is necessary to transport the subsystem, repackage all disk drives separately. If using

the original package material, all other modules can stay within the enclosure.

3.2.2

Static-Free Installation

The subsystem contains static-sensitive electronic components that can be damaged by

improper handling and electrostatic discharge (ESD). To prevent ESD damage to any of the

components, follow these precautions before touching or handling them:

•

Discharge the static electricity from your body by wearing an anti-static wristband or by

touching a grounded metal surface.

•

Avoid carpets, plastic, vinyl, and styrofoam in your work area.

Handle all components by holding their edges or metal frame. Avoid touching PCB boards

and connector pins.

3.2.3

BBU Warnings and Precautions

The BBU module sustains cache memory in the event of a power failure or in the unlikely event

if both PSUs have failed. Having the protection to cached data by a BBU is highly recom-

mended. The BBU provides additional data security and helps minimize the chance of data

loss during power outage.

•

Replace the BBU once it shows symptoms failing to hold the charge. Although the life

expectancy of a BBU is determined by the times it has been charged or discharged, a BBU

can approximately last for one year. If the battery recharge time is obviously longer than

the suggested 12 hours, or if the fault LED is lit, replace the battery.

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•

Install or replace the BBU module only with a BBU module supplied by your subsystem

vendor. Use of battery cells provided by another source will void our warranty.

Always dispose of discharged or used batteries in an ecologically responsible manner.

Dispose used BBUs at authorized battery disposal sites only.

Do not use nor leave the BBU near a heat source or direct sunlight. Heat can melt the

insulation and damage other safety features of battery cells, possibly leading it to acid

leak and result in flames or explosion.

•

Do not immerse the BBU in water nor allow it to get wet. Its protective features can be

damaged. Abnormal chemical reactions may occur, possibly causing functional defects,

acid leak, and other hazardous results.

•

Do not disassemble or modify the BBU. If disassembled, the BBU could leak acid, over-

heat, emit smoke, burst and/or ignite.

Do not pierce the BBU with a sharp object, strike it with a hammer, step on it, or throw it.

These actions could damage or deform it, internal short-circuiting can occur, possibly

causing functional defects, acid leaks, and other hazardous results.

If the BBU leaks, gives off a bad odor, generates heat, becomes discolored or deformed,

or in any way appears abnormal during use, recharging or storage, immediately remove it

from the subsystem and stop using it. If this is discovered when you first use the BBU,

return it to Bosch or your system vendor.

•

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3.3

General Installation Procedure

The following instructions can save installation time. Detailed, illustrated instructions for each

component are given in the following sections.

CAUTION!

To ensure that your system is correctly installed, please follow the steps outlined below. If you

follow these steps, installation will be fast and efficient. If you do not follow these steps, you

may have incorrectly installed the hardware.

1. Unpack: Unpack the subsystem and confirm that all the components on the Unpacking

Checklist have been included.

2. Rack/Cabinet installation: If the subsystem is going to be installed in a rack or cabinet, it

should be installed prior to installing the hard drives. Installing the subsystem into a rack

or cabinet requires at least two (2) people.

3. Install drive trays: After the hard drives have been installed into the drive trays, the drive

trays must be installed into the enclosure itself. (See Section 3.6 Drive Tray Installation)

4. Cable connection: Use the power cords that came with the subsystem to connect the

subsystem to the main power source. Use self-purchased SCSI cable to connect host

ports to servers.

5. Power up: Once the components have been properly installed and all cables are properly

connected, you can power up the subsystem and configure the RAID array. (See

Section 5.4 Power On)

3.3.1

Installation Procedure Flowchart

Table 3.1 shows a flowchart of the installation procedure. As you complete each step, check

off the “Done” box on the right. Please use this flowchart in conjunction with the instructions

that follow.

Step

Installation Procedure

Done

Unpack

See Section 3.4 Unpacking the Subsystem

See Section 3.5 Rackmounting

Rack/Cabinet Installation

Drive Tray Installation

Cable Connection

Power On

See Section 3.6 Drive Tray Installation

See Section 5.4 Power On

Table 3.1 Installation Procedure Flowchart

3.4

Unpacking the Subsystem

Use the unpacking checklist in your package to check packing contents. Carefully check the

items contained in each box before proceeding with installation.

NOTICE!

A detailed packing list can be found in your product shipping package or product CD.

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3.5

Rackmounting

The subsystem is easily installed into a standard 19-inch rack cabinet using the mounting

holes on the sides of chassis.

The enclosure chassis can be installed using self-purchased mounting rails.

3.5.1

Considerations for Installation Site and Chassis

•

Make sure you have an appropriate site location and cables prepared with adequate

lengths to connect to main power and other devices.

•

At least two people will be required to install the chassis. Disk drives should only be

installed after the chassis is properly mounted. The chassis can weigh about 24Kgs with-

out disk drives.

•

The following tools are necessary for mounting the chassis:

–

#4 Phillips-head screwdriver

Wrenches may be necessary, depending on the rack type

•

Use the included M5 or M6 screws for securing the chassis through its front mounting

ears.

More details about the use of optional slide rails are given in the Installation Guide that

came with the slide rail package.

3.5.2

Mounting Holes Positions

•

Integrators may design their own brackets or slide rails using the twenty-two (22) mount-

ing holes on the sides of chassis.

•

There are six (6) mounting holes with six (6) M4 nuts near the end of the chassis on each

side. Shown below are the locations of these mounting holes. (See the arrow marks in

Figure 3.2). See the next diagram for another group of mounting holes on a horizontal

line.

Fig. 3.1 Enclosure Side Mounting Holes (1)

•

Figure 3.2 shows holes that are designed for slide rail options. There are five (5) mount-

ing holes for #6-32 screws on the sides of the enclosure for use with slide rails purchased

separately from Bosch or other vendors.

•

For information on installing the chassis using the slide rails, please refer to the Installa-

tion Manual that came with the kit.

Fig. 3.2 Enclosure Side Mounting Holes (2)

•

Use M5 or M6 pan-head screws to secure the chassis to the front cabinet posts.

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3.6

Drive Tray Installation

Once the hard drives have been installed in the drive trays, the drive trays can be installed into

the subsystem.

WARNING!

All drive trays must be installed into the enclosure even if they do not contain a hard drive. If

the trays are not installed into the enclosure, the ventilation required for cooling will be dis-

turbed and the subsystem will overheat.

1. Make sure that the hard drive is secured to the drive tray. Make sure the key-lock is in the

unlocked position. The key-lock is unlocked if the groove on its face is in a horizontal ori-

entation. If the groove is in a vertical position, as shown in Figure 3.3, then the key-lock is

locked and the front flap on the drive tray cannot be opened.

Fig. 3.3 Front View of an Individual Drive Tray

2. Open the front flap on the drive tray. (See Figure 3.4). To open the flap, push the release

button on the front bezel. The front flap will open in an upward direction.

Fig. 3.4 Opening Drive Tray Front Flap

3. Align the drive tray with the slot in which you wish to insert it. Make sure that it is resting

on the rails inside the module slot. Once the drive tray is lined up with the slot, gently

slide it in. This should be done smoothly and gently.

4. Close the front flap on the drive tray. Make sure the front flap is closed properly. Closing

the front flap ensures that the drive tray is firmly connected to the corresponding connec-

tor on the backplane board. If the front flap is not closed properly, the connection

between the HDD and the subsystem will not be secure. DO NOT slam the drive tray into

place! The connector pins might be damaged. If the front flap is not closed properly, the

connection between the hard drive and the subsystem will not be secure.

5. Lock the flap into place by turning the key-lock until the groove on its face is pointing

down (vertical orientation). (See Figure 3.5)

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Fig. 3.5 Drive Tray Key-lock Rotation

6. Once all drive trays are installed, the RAID subsystem will poll the drive channels and rec-

ognize the drives and scan them in automatically.

7. When powered up, you should check the LEDs on drive bezels to ensure all drives are

receiving power and are functional. All drive LEDs should be solid green after the initial-

ization stage.

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Subsystem Monitoring

This chapter provides information on how to monitor the subsystem.

4.1

Subsystem Monitoring Overview

The subsystem is equipped with a variety of self-monitoring features that help to keep subsys-

tem managers informed of the subsystem operational status. These monitoring features pro-

vide vital feedback to help you maintain the operational integrity of the subsystem. Prompt

response to warnings and subsystem component failure notifications will ensure safe opera-

tion of the subsystem and help ensure the longevity of the subsystems.

Self-monitoring features include:

•

Firmware (FW): The RAID controllers in the subsystems come with pre-installed FW. The

FW can be accessed using either the LCD keypad panel or a PC running terminal software

through the RS-232C (audio jack) serial port. Device status information can be obtained

from the FW.

•

Bosch RAIDWatch: Bosch RAIDWatch is a fully integrated Java based Graphical User

Interface (GUI) that came with the subsystem and can be used to monitor and maintain

the subsystem using web browsers. Connection to a Bosch RAIDWatch station is made

using the existing Ethernet ports.

•

The Bosch RAIDWatch Panel View can be customized to show a direct, graphical repre-

sentation of the subsystem in the content panel of the Bosch RAIDWatch screen. Panel

View allows you to quickly determine the operational status of critical components.

Configuration Client: The powerful Configuration Client sub-module can be used to keep

you informed of system events via a variety of communication methods like email, LAN

broadcast, fax, pager, MSN messenger, ICQ, and SMS. The sub-module runs as an inde-

pendent program from Bosch RAIDWatch main program. The Configuration Client helps

prevent blind time and keeps you constantly informed as to the status of the storage

management subsystem.

•

LEDs: Device-status-indicating LEDs are placed on all of the subsystems’ active compo-

nents. These LEDs inform you of the integrity of a given component or a given link. You

should become familiar with the different LEDs on the subsystem and be aware of their

functions. (See Figure 4.2)

Audible Alarm: An audible alarm is present on the subsystem controller board and will be

triggered if any of a number of threatening events occurred. These events usually jeopar-

dize the functional and operational integrity of the controller board and must be heeded

at all times. Events such as a breaching of the temperature threshold will trigger the

alarm and if an onsite subsystem manager is present, the manager should, using either

the LCD panel or the PC hyper-terminal, determine the cause of the alarm and take the

appropriate corrective measures. (See Figure 4.3)

•

Inter-Integrated Circuit (I C): The I C bus monitors the operational integrity of the cool-

ing modules, sensors for RAID controller board/backplane temperature and voltage read-

ings.

Subsystem monitoring is a necessary part of subsystem management. If failure events or other

disruptive events are detected and reported, the subsystem managers must take the appropri-

ate action to rectify the problem. Failure to act in a properly specified manner to a system

event (like overheating) can cause severe and permanent damage to the subsystem.

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4.2

Status-indicating LEDs

4.2.1

Brief Overview of the LEDs

The following devices come with LEDs that inform subsystem managers about the operational

status of the component on which they are mounted. The RAID subsystem features status-

indicating LEDs distributed over the active components in the following ways:

Component

Drive Trays

LED(s) per Unit

Total LEDs

Definition

See Section 4.2.2 Drive Tray

LEDs

Controller Module

Ethernet Ports

BBU Module

See Section 4.2.3 Controller

Module LEDs

See Section 4.2.4 Ethernet

Port LEDs

See Section 4.2.5 BBU Module

LED

PSU Module

See Section 4.2.6 PSU LED

LCD Keypad Panel

See Section 4.2.7 LCD Keypad

Panel

Cooling Fan Module

See Section 4.2.8 Cooling Fan

Module LED

Table 4.1 LED Distribution

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4.2.2

Drive Tray LEDs

Two LED indicators are located on the right side of each drive tray. (See Figure 4.1) Refer to

Table 4.2 for LED definitions. When notified by a drive failure message, you should check the

drive tray indicators to find the correct location of the failed drive. Replacing the wrong drive

can cause fatal failure of a logical array.

Fig. 4.1 Drive Tray LEDs

LED Name

Drive Busy

Color

Status

Blue

ON indicates read/write activity on the drive.

OFF indicates there is no read/write activity on the drive.

Power Status

Red/

GREEN indicates that power is being supplied to the drive.

OFF indicates no power is being supplied to the drive or the

drive tray is not properly installed. .

Green

RED indicates drive failure or faults have occurred.

Table 4.2 Drive Tray LED Definitions

4.2.3

Controller Module LEDs

The rear-facing faceplate of the RAID controller module is shown in Figure 4.2. The rear-facing

faceplates on the two models look identical. The LEDs are numbered from 1 to 5. There are

two more LEDs on the Ethernet port. The definitions are shown in Table 4.3 below.

Fig. 4.2 Controller Faceplate

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LED

Name

Color

Green

Status

Controller Ready

ON: Indicates controller is active and

operating normally.

FLASHING: Indicates controller initial-

ization is taking place.

OFF: Controller is not ready for opera-

tion.

Hst_Bsy

Green

Amber

FLASHING: Activities on the host ports.

OFF: No activities on the host ports.

(Host Ports Busy)

Drv_Bsy

FLASHING: Activities on the drive side.

OFF: No activities on the drive side.

(Drive Busy)

C_Dirty

ON: Indicates that data is currently

being cached in memory or is being

held up by the BBU during a system

power loss.

(Cache Dirty)

BBU_Fail

Amber

ON: Indicates the BBU has failed and

cannot sustain cached data.

OFF: Indicates the BBU can sustain

cached data in memory.

FLASHING: The BBU is charging.

Table 4.3 Controller Module LED Definitions

4.2.4

Ethernet Port LEDs

The subsystem comes with a RS-232C audio jack serial port that can be used to assign a per-

manent IP to the subsystems. After a permanent IP address has been assigned, an Ethernet

cable can be used to connect the RJ-45 Ethernet port to a network hub or router. This enables

you to manage your subsystem locally or remotely over TCP/IP. See Figure 4.3 for the loca-

tions of the two LED indicators on Ethernet port. Refer to Table 4.4 for the LED definitions.

Fig. 4.3 Ethernet Port Indicators

Name

Link Status

LAN Activity

Color

Green

Color

ON: Indicates a valid connection to network

BLINKING: Indicates active transmissions

Table 4.4 Ethernet Port LED Definitions

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4.2.5

BBU Module LED

The BBU module has an LED on its faceplate. (See Figure 4.4) The function is the same as the

fifth LED on the controller module. The LED is off when the BBU is functioning normally and is

able to sustain the cache memory. The LED flashes to indicate the BBU is currently charging

its battery cells. If the LED is illuminating amber, the unit may have failed. Please contact your

system vendor to verify the problem.

Fig. 4.4 BBU Module LED

4.2.6

PSU LED

Fig. 4.5 PSU LED

Each PSU comes with a single LED located just above the power switch and just below the

retention screw (see Figure 4.5). The LED is used to indicate the operational status of the PSU

module. Please refer to the PSU LED definitions shown in Table 4.5.

Color

Status

Flashing Green

The power supply has not been turned on. The PSU module LED will

blink when the subsystem is connected to a power source but has not

been turned on.

Static Green

Static Red

The PSU is operating normally and experiencing no problems

The PSU has failed and is unable to continue providing power to the

subsystem.

OFF

The power cord is unplugged or the power cord is plugged but no

power is being supplied from the power source.

Table 4.5 PSU Module LED Definitions

4.2.7

LCD Keypad Panel

The LCD panel located on the front aluminum foldable handle comes with three status LEDs.

The LEDs are marked from top to bottom “PWR,” “BUSY” and “ATTEN” and are clearly seen in

Figure 4.6 below. The definitions of these LEDs are shown in Table 4.6. The mute button can

be used to stop the alarm until the next controller event occurs.

Fig. 4.6 LCD Keypad Panel

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Name

Color

Status

POWER

Blue

ON indicates that power is being supplied to the subsys-

tem.

OFF indicates that no power is being supplied to the sub-

system.

BUSY

White

Red

Flashing indicates that there is activity on the host/drive

channels.

OFF indicates that there is no activity on the host/drive

channels.

ATTENTION

ON indicates that one or more component failure/critical

events have occurred.

OFF indicates that the subsystem and all its components

are operating normally.

Table 4.6 LCD Panel LED Definitions

NOTICE!

The LCD panel ATTEN LED will be turned on during the power up process. The ATTEN LED will

be turned off after the boot up procedure is completed correctly.

4.2.8

Cooling Fan Module LED

The cooling fan module comes with a single status-indicating red LED shown in Figure 4.7.

LED definitions are given in Figure 4.7.

Fig. 4.7 Cooling Fan Module LED

RED

Status

OFF

The cooling fan module is operating normally.

The cooling fan module has failed and must be replaced.

Table 4.7 Cooling Fan Module LED Definitions

The subsystem has a novel approach to stabilizing the temperature within the subsystem:

When the sensors within the enclosure detect critical working conditions, such as high ambi-

ent temperature or the failure of any cooling or PSU module, the system will turn the cooling

fans to high speed to extract more heat. Once the ambient temperature cools down to normal

or the faulty module has been replaced, the cooling fans return to normal speed.

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4.3

Audible Alarm

Different subsystem environmental and operational parameters (i.e., temperature, etc.) have

been assigned a range of values between which they can fluctuate. If either the upper or lower

thresholds are exceeded, an audible alarm will automatically be triggered. The alarm will also

be triggered when an active component of the subsystem fails. If the subsystem manager is

onsite and hears the alarm, the manager will have to read the error message on the LCD

screen or the PC terminal in order to determine what has triggered the alarm. After determin-

ing what has occurred, the subsystem manager must take appropriate actions to rectify the

problem.

CAUTION!

When an alarm is triggered, it is necessary for you to determine the problem. If the audible

alarm is ignored and the problem is not rectified, unexpected damages may occur.

4.3.1

Default Threshold Values

NOTICE!

The threshold values listed below are used to trigger a warning event and sound the alarm. A

different value set is reserved for triggering the cooling fans to operate at a high rotation

speed. The fan speed value set is not user-configurable.

Table 4.8 shows the default threshold values for the subsystem. If any of these values are sur-

passed, the alarm will sound.

Upper Threshold

+3.6V

Lower Threshold

+2.9V

+3.3V

+5V

+5.5V

+13.2V

90ºC

80ºC

40ºC

+4.5V

+10.8V

5ºC

+12V

CPU Temperature

Board Temperature

5ºC

Enclosure Ambient

Temperature

0ºC

Table 4.8 Default Threshold Values

The controller self-monitoring thresholds in Table 4.8 are the default threshold values. The val-

ues set for the subsystem’s ambient temperature are pre-configured before shipping and can-

not be changed.

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4.3.2

Failed Devices

The audible alarm will be triggered if any of the following devices fail:

•

Cooling fan modules

PSU modules

BBU modules

Hard drives

Components on the RAID controller

NOTICE!

If the temperature exceeds a preset threshold, the BBU charger circuits will stop charging.

You will then receive a message that says “Thermal Shutdown/Enter Sleep Mode.” When the

temperature falls back within normal range, the battery will resume charging.

4.4

I C Monitoring

Module presence detection and the general working status of cooling fan and other modules

are monitored through an I C serial bus. If any of these modules fails, the failure will be

detected and you will be notified via the various methods described above.

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Subsystem Connection and Operation

This chapter introduces sample topologies, configuration options and server connections for

the RAID subsystems and discusses both the power on and power off procedures.

5.1

Basic Configuration Rules

When you are configuring your storage subsystem, follow these basic rules:

•

Using a mix of LVD and legacy devices, such as devices using single-ended signaling, is

not recommended. Use LVD terminators if all your devices support LVD signaling. Please

refer to the documentation provided with your SCSI devices to avoid possible conflicts.

When selecting the number of hard drives to be included in a logical configuration that

should be presented through the host channels, the transfer rates and the mechanical

performance of the hard disks should be considered. The combined bandwidth of the

two SCSI host channels is 640MB/s, sufficient for most applications. If properly config-

ured, combining subsystems or drive enclosures may increase the number of drives and

help to bring out the most of IOPs performance.

•

If you consider cascading multiple enclosures, considerations may include the character-

istics of your I/O load. Select the correct combination of optimization mode and a spe-

cific RAID level.

An optimal configuration is always a compromise among different factors. For instance, a

large array with many drive members may be more efficient, but the chance of failing a

member is also increased.

•

The drives in the same logical array should have the same capacity; it is preferred that all

the drives in the enclosure have the same capacity.

A spare drive should have a minimum capacity equivalent to the largest drive that is to be

replaced. If the capacity of the spare is less than the capacity of the drive to be replaced,

then the controller will not proceed with the failed drive rebuild.

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5.2

SCSI Connection Overview

The SCSI host ports connect to SCSI-320 host adapters (HBA) that comply with 320MB/s

transfer rate and SCSI-3 protocol, best capable of 64-bit/133MHz PCI operation. Connection

of the subsystem’s SCSI ports is flexible. For example, you may use the two VHDCI ports of a

dual-stacked connector to connect a host channel to two separate, clustered servers. If high

availability or path redundancy software is applied, a total of 4 VHDCI ports are available for

cross-linking to host adapters. As long as access contention is not of the concern, host con-

nection can be very flexible. In the following sections, configuration diagrams will be provided

to illustrate the possible uses of the subsystem in different application environments.

Note that these configurations are only recommendations and do not intend to impose limita-

tions such as the use of high availability software or cascading multiple enclosures. The same

configuration principles applies to the subsystem.

The RAID subsystems support 2 SCSI host channels and 2 dual-stack connectors featuring

support for SCSI-320 protocol (also known as Ultra-320), the latest iteration of the SCSI drive

interface standard. The SCSI-320 enables maximum data transfer rates up to 320MB/second

per channel from host computers to the subsystems or expansion systems. This is twice the

bandwidth as the Ultra160 standard, allowing you optimal performance and flexibility with

configuring storage applications.

5.2.1

5.2.2

SCSI Cables

One SCSI cable is required with each subsystem for host connection. If you wish to connect

the second host channel, a second cable is required. Use only high quality SCSI-320 cables

from a reputable manufacturer. To ensure optimum performance, it is necessary to use

proper, high quality SCSI-320 compatible cables. Failure to do so will result in downgraded

performance.

SCSI Port on the Controller Rear Panel

•

The SATA-based subsystem is equipped with two dual-stacked connectors on the back of

the enclosure. Each dual-stacked connector comes with two 68-pin VHDCI ports that is

specified as a “Channel # In” or “Channel # Out” port.

The SCSI ports are specified as “In” or “Out” for ease of identification. As long as each

device on a SCSI bus is assigned with a unique ID and the SCSI bus properly terminated,

there are no limitations with connecting a specific SCSI port to the host- or drive-side

devices.

Fig. 5.1 Dual-stacked Connectors on the Controller Faceplate

•

The subsystem requires an external VHDCI-to-VHDCI SCSI round cable to connect the

subsystem to a host adapter.

One (1) audio-jack-to-DB9 cable is provided to facilitate the connection of the COM1 port

for local terminal emulation access to the array.

•

Two (2) power cords are provided for the power connections to the power sources.

The RJ-45 Ethernet cable for network management connection is a user-supplied item.

Use straight-through Ethernet cables with RJ-45 plugs.

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5.2.3

SCSI Termination

Correct SCSI termination procedures require that the last device on the SCSI bus be termi-

nated. If the last device is not terminated or if devices other than the last are terminated,

erratic SCSI bus behavior may occur.

An auto-detection, on-board terminator is built into the DVA-08K. You do not need to install an

external terminator when a subsystem acts as the last device in the daisy chain configuration.

The on-board terminator default is enabled. If the subsystem is not the last device in the daisy

chain configuration, the terminator will be automatically disabled. Although it is not recom-

mended, if you prefer to disable the firmware setting for the on-board terminator using the

LCD keypad panel on the subsystem, RS232C terminal session, or Bosch RAIDWatch manage-

ment software, the auto-detection function is also disabled.

Typically, the host computer or host adapter (SCSI card inside the PC) is the first device and

some are already terminated. When installing the DVA-08K on a SCSI bus with other devices,

be sure to observe the above rules regarding all devices on the SCSI bus. Consult your host

computer and/or host adapter manual for additional information on correct termination pro-

cedures.

NOTICE!

It is recommended not to change the firmware default setting for the SCSI terminator so the

auto-detection function can operate.

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5.3

Host Connection Topology

Fig. 5.2 Cascaded Subsystems Connected to Two Host Computers

In the example shown in Figure 5.2, the SCSI ports are connected to different host computers.

This provides both path and host computer redundancy. If one of the host channels becomes

disconnected, or if the cable connecting one of the host ports to the host computer is dam-

aged, the second path can transmit data from the subsystem to one of the host computers.

Similarly, in the clustered hosts configuration, the same array can be accessed through differ-

ent data paths and downtime will be minimized.

To obtain more disk capacity, the “Out” ports are used to cascade another subsystem.

The host-side connection can be made as the following:

1. Directly to servers or workstations equipped with SCSI HBAs.

2. Connect two subsystems on the same host buses for a larger combined capacity.

3. Cross-link the host ports on subsystem(s) to clustered servers.

High availability configurations, such as clustering or redundant paths settings, can be applied

with adequate software control. The same logical array can be associated with two or more

different host IDs to facilitate access down through different HBAs.

Default Channel Settings

Model

DVA-08K

Host Channels

Drive Channels

Channel 0 and Channel 1

Channels 1 to 8, each dedicated to

one connected drive

Table 5.1 Default Channel Settings

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5.4

Power On

After installing all the components in the subsystem, connecting the host channels to the

host, and connecting the expansion cables to the expansion enclosures, the subsystem is

ready to be powered on.

5.4.1

Power On Checklist

BEFORE powering on the subsystem, please check the following:

•

Memory module: Memory module has been correctly installed on the controller board.

BBU modules: Ensure that the BBU modules have been installed correctly.

Hard drives: Hard drives have been correctly installed on the drive trays.

Drive trays: ALL the drive trays, whether or not they have a hard drive, have been installed

into the subsystem.

•

Cable connections: The host ports on the subsystem have been correctly connected to

host computer(s).

Power cables: The power cords have been connected to the PSU modules on the subsys-

tem and plugged into main power.

Ambient temperature: All the subsystem components have been acclimated to the sur-

rounding temperature.

5.4.2

Power On Sequence

When powering on the subsystem, please follow the steps below:

1. Power on any expansion enclosures if applied

If you connect any expansion enclosures to the subsystem, power on those expansion

enclosures before powering on the subsystem.

2. Power on the subsystem

The subsystem should be powered on before the host computers. The power on proce-

dure for the subsystem is described in Section 5.4.3 Power On Procedure.

3. Host computers

Host computers should be the last devices that are turned on. Please refer to the docu-

mentation that came with your host computers to see its own power on procedure.

5.4.3

Power On Procedure

1. Plug in all power cords to the power connectors located at the rear of the subsystem. Use

the power cables that came with the subsystem to connect the subsystem to the power

outlet, separate power sources, or UPS devices.

2. Turn on the power supply switches for both power supply units.

3. The subsystem is now turned on and the self-test will start automatically.

4. The “Power” LED on the front LCD panel will turn blue.

CAUTION!

Although the PSUs are redundant and a single PSU can provide sufficient power to the sys-

tem, it is advisable to turn both the power switches on. If only one PSU is operating and fails,

the whole system will shut down.

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5.4.4

Power On Status Check

Once the subsystem has been powered on, the status of the entire subsystem should be

checked to ensure that everything is running smoothly and that there are no complications or

malfunctions.

1. Controller module LEDs: The controller module LEDs should all flash green.

2. Drive tray LEDs: The LEDs of all the drive trays (that contain hard drives) should be con-

stantly lit green to indicate that the drives have successfully spun up and are ready for

I/Os.

3. LCD panel LEDs: The blue LED on the LCD panel should come on indicating that power is

being supplied to the system.

4. Firmware and Bosch RAIDWatch: The overall status of the system may be checked using

the terminal interface or the Bosch RAIDWatch GUI.

5. Audible alarm: If any errors occur during the initialization process, the onboard alarm will

sound in a hastily repeated manner.

Drive tray LEDs should normally start flashing during the initialization stage, indicating the

RAID controller unit is attempting to access the hard drives.

NOTICE!

The subsystem has been designed to run continuously. If a hot-replaceable component fails,

the fault can be corrected online.

5.4.5

LCD Screen

When powering on the subsystem, the following messages should appear on the front panel

LCD screen. Wait for the front panel LCD to show “READY” or “No Host LUN” before turning

on the host computer. Refer to Figure 5.3 on how to read the screens.

Fig. 5.3 The LCD Initial Screen

The LCD screen startup sequence is shown and described in the sequence below:

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This screen appears when the PSUs are turned

on.

Proceeding with controller self-test.

Self-test completed.

Verifying installed cache memory.

DVA-08K

System is ready. You can now start to config-

ure the subsystem.

DVA-08K

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5.5

Power Off Procedure

If you wish to power down the subsystem, please follow these steps:

NOTICE!

If you wish to power down the subsystem, please ensure that no time-consuming processes,

like “Regenerate Logical Drive Parity” or a “Media Scan,” are running.

1. Stop I/O access to the system

Stop all I/O accesses from the host computers to the subsystem. Please refer to the

related documentation of your host applications and operating system.

2. Disconnect the host

The host must be disconnected from the subsystem. To do this, disconnect the cables

from both the host and the subsystem.

3. Flush the cache

Use the “Shutdown Controller” function to flush all cached data. This prepares the RAID

subsystem to be powered down.

4. Turn off the power

Turn off the power switches at the power supply modules. Once the RAID subsystem has

been powered down, other devices that are connected to the subsystem can be powered

down.

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Subsystem Maintenance

Constant monitoring and maintenance of your SATA-based subsystems will minimize the

chance of system downtime and preserve the working integrity of the system for a longer

period of time. If any of the subsystem plug-in modules fails, they must be replaced as soon as

possible.

6.1

Overview

CAUTION!

Do not remove a failed component from the subsystem until you have a replacement on hand.

If you remove a failed component without replacing it, the internal airflow will be disrupted

and the system will overheat causing damage to the subsystem.

All of the following components can be replaced in case of failure:

1. Controller module – Section 6.2 Replacing Controller Module Components

2. Memory module – Section 6.3 Replacing or Upgrading Memory Modules

3. BBU module – Section 6.4 Replacing a Faulty BBU

4. PSU modules – Section 6.5 Replacing a Failed PSU Module

5. Cooling fan modules – Section 6.6 Replacing a Failed Cooling Fan Module

6. Hard drives – Section 6.7.2 Replacing a Failed Hard Drive

6.1.1

General Notes on Component Replacement

•

With the exception of the RAID controller module, all the components on the subsystems,

including the PSU modules, cooling fan modules, BBU, and drive trays are hot-swappable

and can be changed while the subsystem is still in operation.

•

Qualified technicians who are familiar with the subsystem should be the only ones who

make component replacements. If you are not familiar with the subsystems and not famil-

iar with RAID subsystem maintenance in general, it is strongly advised that you refer sub-

system maintenance to a suitably qualified maintenance technician.

•

Normalized airflow is directly dependent upon the presence of all subsystem compo-

nents. Even if a subsystem component fails, it should not be removed from the subsys-

tem until a replacement is readily at hand and can be quickly installed. Removing a

subsystem component without a replacement can lead to permanent subsystem damage.

When replacing any hot-swappable component, caution should be taken to ensure that

the components are handled in an appropriate manner. Rough or improper handling of

components can lead to irreparable damage.

•

When removing a controller module from the subsystem, ensure that the power has been

turned off and that all precautionary measures, without exception, are adhered to. The

controller board contains very sensitive components and can be easily damaged.

CAUTION!

When inserting a removable module, DO NOT USE EXCESSIVE FORCE! Forcing or slamming a

module can damage the pins on the module connectors either on the module itself or on the

backplane. Gently push the module until it reaches the end of module slot. Feel the contact

resistance and use slightly more force to ensure the module connectors are correctly mated. If

the module comes with extraction levers or retention screws, use them to secure the module.

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6.2

Replacing Controller Module Components

6.2.1

Overview

The controller module should never be removed unless the following replaceable components

need to be accessed:

•

Cache memory DIMM module: If a larger capacity DIMM module is required.

Controller module itself: If the controller module in a single-controller model fails, it is

necessary to power down the subsystem and replace the controller.

If a DIMM module or RAID controller fails, contact your vendor immediately for a replacement.

To replace any of these components, the controller module must first be removed from the

subsystem.

6.2.2

Notes on Controller Module Maintenance

•

The controller module contains a DIMM module. It is not recommended to re-use the

DIMM module extracted from a failed controller unless you have a similar RAID subsystem

that can be used to test the module. You can contact your vendor for sending the failed

controller in for repair.

When replacing the controller module, it must be remembered that the controller board

is one of the most sensitive components in the subsystem. All previously stipulated safety

precautions must be strictly adhered to. Failure to adhere to these precautions can result

in permanent damage to the controller board, resulting in lengthy delays.

Prior to replacing the controller module, it is imperative for your own safety to be sure no

power is being supplied to the system.

6.2.3

Removing the Controller Module

To remove the controller module:

1. Stop host I/Os or host applications to avoid losing data or causing data inconsistency.

2. Turn the subsystem power off: If possible power off the subsystem in the way described

in Chapter 4. If it is not possible to do this turn off both PSU modules and disconnect the

power cords.

3. Disconnect all cables: There may be a number of different cables attached to the control-

ler module. These cables could include SCSI cables for host connections, an RS-232C

(audio jack) cable for serial port connection, and an Ethernet cable for network connec-

tion. Prior to removing the controller module, all these cables should be removed.

4. Loosen the retention hand screws: Hard screws are located on both sides of the RAID

controller’s faceplate. Press these screws and use a Phillips screwdriver to loosen them

so that the controller can be removed from chassis. (See Figure 6.1)

Fig. 6.1 Loosen Controller Module Retention Screws

5. Pull the controller module out: Once the retention screws have been removed; gently pull

the controller module out of the subsystem chassis.

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6.2.4

Replacing the Controller Module

1. Remove the failed controller module.

2. Install a DIMM module on the new controller module.

3. Insert the replacement controller. Align the controller module with the module bay at the

rear of the subsystem. Gently slide the controller module in.

4. Fasten the hand screws. Once the controller module has been completely inserted into

the subsystem chassis, secure the controller module to the chassis by tightening the

hand screws at the sides of the controller rear panel.

5. Connect the controller module cables: Reconnect all of the cables that were previously

disconnected from the controller module. These may include SCSI cables for host and

expansion connections, an RS-232C (audio jack) cable for serial port connection, and an

Ethernet cable for network connection.

6. Power on: Once the new controller module has been properly installed and the cables

have been correctly connected, turn the subsystem power on.

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6.3

Replacing or Upgrading Memory Modules

6.3.1

Memory Module Installation Overview

•

The subsystems come with a pre-installed 256MB (or above) DDR RAM DIMM module on

the controller. The controller supports one memory module for the capacity up to 1GB. If

a DDR RAM DIMM modules with a different size is preferred or the original memory mod-

ule has failed in some way, the pre-installed module must be removed and replaced by a

new one. Replacement and installation instructions are described fully below.

The DIMM module is located on the controller board. The controller board is a sensitive

component and must be treated with care to avoid being damaged.

•

CAUTION!

The controller board in the module contains sensitive components. Please ensure that all anti-

static precautions stipulated above are strictly adhered to. Only qualified technicians can

replace a DIMM module.

6.3.2

Selecting a Memory Module

If the memory module mounted on the controller is going to be replaced, the following factors

should be considered when purchasing replacement modules.

•

Pre-installed DIMM module: The subsystem comes with a 256MB DDR RAM module pre-

installed on the controller board. If you wish to change the size of the DIMM, then a new,

separately purchased DIMM can be installed.

•

DDR RAM DIMM modules supported. The subsystems support DDR RAM DIMM modules

with the capacities ranging from 256MB to 1GB.

Installation consideration: When installing the DIMM module, it is necessary to handle the

controller module. The controller board is more susceptible to damage than the other

components and must therefore be handled with extreme care. All anti-static precautions

must be strictly adhered to.

•

Secure installation: When replacing the DIMM module, make sure that the new DIMM

module is firmly in place prior to installing the controller module. If the DIMM module is

not firmly in place, the subsystem will not run and the controller will need to be removed

and the DIMM module correctly installed.

Purchasing consideration: When purchasing a DDR RAM DIMM to install on the controller

board, contact your vendor for an updated list of certified modules.

6.3.3

DIMM Module Installation

CAUTION!

The pre-installed modules must be removed prior to installing new memory modules. Do this

with care. Sensitive components can be damaged during the process.

If a DIMM module fails or a DIMM module with a higher memory capacity is required, the

DIMM module must be replaced.

1. Remove the controller module.

2. Remove the previously installed DIMM module from the DIMM socket. To do this, push

the white module clips on the sides of the DIMM module down together. By doing this,

the previously installed modules will be ejected from the DIMM socket. (See Figure 6.2)

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Fig. 6.2 Push Back the Module Clips on the Sides of the DIMM Socket

3. Gently retrieve the DIMM module out of the DIMM socket. (See Figure 6.2)

4. Insert the DIMM module into the DIMM socket. Align the DIMM module with the DIMM

socket. Once aligned, gently push the DIMM module into the socket. The white clips on

the sides of the socket will close automatically and secure the DIMM module into the

socket.

Fig. 6.3 Insert the DIMM Module

5. Reinstall the controller module. After the DIMM module has been properly installed, the

controller module must be reinstalled. To do this, align the controller module with the

controller module bay. Then gently push the controller module in the controller bay.

Carefully push the controller until you feel the contact when the board edge connectors

are mated to the backplane. Do not use force. If unusual contact resistance is felt, try it

again. Next secure the controller module into the subsystem by fastening the hand

screws on the sides.

NOTICE!

When replacing a DIMM, the whole subsystem needs to be powered down. Therefore, when

replacing a DIMM, you should carefully select the time when the replacement will be made in

order to minimize the overall disruption to service.

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6.4

Replacing a Faulty BBU

NOTICE!

The BBU is hot-swappable and can be replaced while the subsystem is running. However, a

new module will only be recognized after a subsystem reset. Carefully select the time when

the reset will be made in order to minimize the overall disruption to service.

To replace a faulty BBU, please follow these steps:

1. Remove the faulty BBU module from the chassis. The BBU module is secured to the chas-

sis with two (2) spring screws. These screws must be loosened. To loosen, turn the

screws counterclockwise.

2. Install the new BBU module. After the faulty BBU module has been removed, the new

BBU module can be installed. To do this, align the BBU module with the empty slot, and

then gently push the BBU module into the slot.

3. Secure the BBU module to the enclosure. Tighten the two (2) spring screws on the back

of the BBU module.

4. Once the new BBU module is correctly installed into the subsystem, the LED should start

flashing, indicates the BBU is being charged. When the BBU is fully charged, the LED will

go off.

NOTICE!

The life expectancy of a BBU is approximately 500 cycles. Follow the procedures above to

replace an old BBU with a new BBU in order to maintain fault-tolerant subsystem functional-

ities.

6.5

Replacing a Failed PSU Module

6.5.1

Notes on PSU Module Maintenance

•

Two redundant PSU modules: The subsystem comes with two 350W, fully redundant, hot-

swappable PSU modules. These modules are accessed from the rear of the subsystem.

Immediate replacement: When a PSU fails, it should ideally be replaced immediately. Do

not remove the PSU module unless a replacement is readily available. Removing a PSU

without a replacement will cause severe disruptions to the internal airflow and the sub-

system will overheat, possibly causing irreparable damage to some of the subsystem

components.

•

PSU bracket: Each PSU module is permanently mounted in a two-level steel bracket, cre-

ating a single unit. The PSU is located in the upper level and a removable cooling fan

module is mounted in the lower level.

CAUTION!

Although the subsystems can operate using single PSU module, it is not advisable to run the

RAID subsystems with a single PSU module for an extended period of time.

6.5.2

Replacing the PSU Module

To replace a PSU, please follow these steps:

1. Turn off the PSU and remove the power cord: Turn of the power switches located on the

right side of each power supply module.

2. Once the power switches have been turned off, remove the power cables that connect

the subsystem to the main power. The power connector is found on the left side of each

power supply module.

3. Remove the retention screw: After the power cable has been removed from the power

connector, remove the retention screw at the upper right side of the PSU rear-end panel.

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The screw is located below the extraction lever, beside the LED indicator, and can be hid-

den from sight.

Fig. 6.4 PSU Parts Identification

4. Pull the extraction handle downward: Push the extraction lever at the back of the PSU

module downwards. This will dislodge the PSU module from the subsystem. Once dis-

lodged, gently pull the PSU module out of the subsystem.

CAUTION!

•

When a PSU is pulled out of the chassis, the fan module beneath the PSU is removed

from the chassis at the same time.

•

Do not remove the PSU module unless a replacement is readily available. Removing a PSU

without a replacement will cause severe disruptions to the internal airflow and the sub-

system will overheat, possibly causing irreparable damage to some of the subsystem

components.

•

It is recommended that the replacement procedure is completed in less than five (5) min-

utes to prevent the subsystem from overheating.

5. Remove the cooling module: To do this, push the clips on either side of the module rear

panel together. Then gently pull the cooling module out of the lower level of the PSU

bracket. (See Figure 6.5)

Fig. 6.5 Remove the Cooling Module

6. Reinstall the cooling module into the new PSU module: To do this, align the cooling mod-

ule with the lower level of the PSU bracket and gently slide the cooling module in.

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7. Insert the new PSU module into the subsystem: Once the previously removed cooling

module has been installed, insert the new PSU module into the subsystem. Make sure the

extraction lever is in its downright position so that the saddle notches on the lower edges

of the handle can lock on to the edge metal brackets along the chassis inner walls. Push

the PSU into the slot and pull the handle upwards to secure the module.

8. Reinsert the retention screw: If the PSU module is properly installed, the back end of the

module should be aligned with the enclosure’s rear panel. To firmly secure the PSUs into

place, reinsert the retention screw.

9. Reconnect the power cord and turn the power on: Plug the power cord into the socket on

the PSU module and turn the PSU module power switch on.

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6.6

Replacing a Failed Cooling Fan Module

6.6.1

Notes on Cooling Fan Module Maintenance

•

Redundant cooling fan modules: The subsystems are equipped with two redundant, hot-

swappable, single-blower cooling fan modules located in the lower PSU module slot.

These cooling fan modules control the internal operational temperature of the subsystem

and therefore their working integrity should be maintained at all times.

Detecting a failed cooling fan module: If a cooling fan module fails, you can be notified of

the failure by the LED located at the back of the module, an audible alarm, the terminal

event prompts, the Bosch RAIDWatch Panel View, or through the various methods by the

Configuration Client utility.

Replacing a cooling fan module: Once you are notified that a cooling fan module has

failed, it should be replaced as soon as possible. A failed cooling fan module should only

be removed from the subsystem when you have an immediately available replacement

module that can be installed as soon as the failed cooling fan module has been removed.

CAUTION!

•

The latches at the back of the cooling fan module secure the cooling fan module into the

enclosure. If these latches are broken, the warranty on the cooling fan module will be

void.

Although the cooling fan modules are fully redundant, it is not advisable to run the sub-

systems with any of the cooling fan modules missing. Whenever a cooling fan module

fails, the system is at risk of sustaining irreparable damage.

Keep a failed module in its enclosure bay until a replacement unit is in hand.

6.6.2

Replacing a Cooling Fan Module

The cooling fan modules are secured to the chassis with two black latches located on the rear

of the module. To replace the cooling fan module, please follow these steps:

1. To remove the cooling fan module: Squeeze both side latches towards the center of the

cooling fan module and gently withdraw the cooling fan module from the subsystem by

gently pulling on the silver handle at the bottom. (See Figure 6.6).

Fig. 6.6 Removing the Cooling Fan Module

CAUTION!

Forcing or slamming a module into place can damage the connector pins on the module itself

or that on the subsystem backplane.

2. Install the new cooling fan module: Line the new module up with the slot into which it

will be inserted and then gently push it into the chassis. The latches will hold the module

in place.

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6.7

Drive Tray Maintenance

6.7.1

Notes on Hard Drive Maintenance

•

Hot-swappable drive trays: The drive trays are all hot-swappable. If a hard drive fails, it

can be replaced while the subsystem is still running.

•

Forearm handles: If the hard drive is behind either the left or right forearm handle, make

sure that the locking mechanism on the side of the handle is first released prior to open-

ing the handle itself. (See Figure 6.7) The locking mechanism must also be released in

order to close the handle. Therefore, after the new drive has been installed, it will be nec-

essary to release the locking mechanism on the handle prior to closing it.

Fig. 6.7 Forearm Handle Locking Mechanism

•

Front flap mechanism: Do not leave a drive tray’s front flap open. The front flap and its

key-lock secure a drive tray to chassis slot. A disk drive operating with the half-open front

bezel may result in signal glitches and Data Compare Errors might ensue.

Remove drives slowly: Although the drive trays are designed to be hot-swappable, when

removing a drive tray from the subsystem, withdraw it from the chassis slowly. Removing

the drive tray too quickly may cause a drive I/O timeout.

Replacement on hand: If a hard drive has failed, make sure you have a replacement hard

drive readily available before removing the failed drive from the subsystem. Do not leave

the drive tray slot open for an extended period of time. If the drive tray slot is left unoccu-

pied for an extended period of time, the airflow will be disrupted and subsystem compo-

nents will overheat and may be permanently damaged.

6.7.2

Replacing a Failed Hard Drive

To replace a hard drive, please follow these steps:

CAUTION!

•

Handle hard drives with extreme care. Hard drives are very delicate. Dropping a drive

onto a hard surface (even from a short distance) and hitting or touching the circuits on

the drives with your tools may all cause damage to drives.

•

Observe all ESD prevention methods when handling hard drives.

Only use screws supplied with the drive canisters. Longer screws may damage the drive.

CAUTION!

The hard drives and drive trays should only be installed into the subsystem once the subsys-

tem has been mounted into a rack cabinet. If the hard drives are installed first, the subsystem

will be too heavy to place into position and the possible impact during installation may dam-

age your drives.

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Hard drives for the subsystem can be purchased separately. When purchasing the hard drives,

the following factors should be considered:

•

Capacity (MB/GB): Use drives with the same capacity. RAID arrays use a “least-common-

denominator” approach. The maximum capacity of each drive used in the array is the

maximum capacity of the smallest drive. Use drives of the same capacity.

Profile: The drive trays and bays of the system are designed for 3.5-inch wide x 1-inch

high hard drives. It is highly recommended that you do not try to use drives of any other

size.

Drive type: The subsystem can use either SATA-II or SATA-I hard drives.

1. Identify the drive tray that contains the hard drive that needs to be replaced.

CAUTION!

Replacing the wrong drive in an array can fatally fail a RAID configuration. You should identify

a failed drive from the Bosch RAIDWatch GUI screen, by checking the drive slot ID in the termi-

nal screen, by checking the LEDs on the drive tray panel, and/or use the identify/flash drive

function in firmware.

2. Open the front flap: Once the drive tray has been identified, push the release button at

the drive bezel. (See Figure 6.8) The front bezel will automatically be lifted and the drive

tray should be easily dislodged from the chassis.

Fig. 6.8 Front View of an Individual Drive Tray

3. Remove the drive tray. To remove the drive tray from the enclosure, the key-lock must be

unlocked. (See Figure 6.9) To do this, turn the key-lock on the front of the drive tray until

the groove on its face is in a horizontal orientation.

Fig. 6.9 Drive Tray Key-Lock Rotation

4. Remove the drive tray along with the hard drive in it. Once the drive tray is dislodged

from the chassis, gently and carefully withdraw the drive tray from the chassis.

5. Remove the hard drive from the drive tray: Loosen the four retention screws (two on each

side) to remove the hard drive from the drive tray.

6. Install the new hard drive:

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7. Place the SATA hard drive into the drive tray (as shown in Figure 6.10) making sure that

the hard drive is oriented in such a way that the drive’s SATA connector is facing the back

of the drive tray.

Fig. 6.10 Installing a SATA Hard Drive

8. Adjust the drive’s location until the mounting holes in the drive canister are aligned with

those on the hard drive. Secure the drive with four supplied 6/32 flathead screws. (See

Figure 6.10)

CAUTION!

Only use screws supplied with the drive canisters. Longer screws may damage the drive.

9. If the failed drive is a member of a RAID 1, 3, or 5 array, once it is replaced the subsystem

should immediately start to rebuild the array. The drive activity LEDs should start to flash.

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Appendix: Technical Specifications

Environmental Specifications

Humidity

5 to 95% (non condensing – operating and non-operating)

Temperature

Operating: 0º to 40ºC

Non-operating: -40º to 60ºC

Altitude

Sea level to 12,000ft – operating

Sea level to 20,000ft – non-operating

Power Requirements

Input Voltage

115VAC @ 6A

240VAC @ 3A with PFC

(auto-switching)

Frequency

47-63Hz

350W

Power Consumption

Dimensions

Height

w/o front handles

88mm

w/ front handles

88mm

Width

446mm

490mm

482mm

505mm

Length

Package dimensions: 344H x 600W x 670D mm

System Weight

Net weight: 23.5kg

Gross weight: 25.0kg (without disk drives)

EMI/EMC

FCC Class-B

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Safety Requirements

Shock

Half-sine

Operating: 5G peak, 11ms duration

Non-operating: 15G, 11ms, half-sine

Vibration

0.5oct/min

Operating

Non-operating

0.5oct/min

Warning Alarms

•

LCD screen messages

Audible alarms

System LEDs

Event notification via the Bosch RAIDWatch Manager (LAN broadcast, email, fax,

MSN, ICQ, SMS, and SNMP traps) and RS-232C terminal display

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7.1

Controller Specifications

7.1.1

Configuration

Specifications

RAID Levels

0, 1(0 + 1), 3, 5, 10, 30, 50, JBOD, and non-RAID disk spanning

Host OS independent; supports all major platforms

Host OS Compatibil-

ity

Host Interface

Host Channels

Drive Interface

2 SCSI-320 channels via 2 dual-stacked VHDCI connectors

2 pre-configured SCSI-320 host channels

Supports 8 channel connection to 3Gbps SATA-II disk drives,

SATA-I backward compatible

Drive Channels

All drive channels are pre-configured, routed through a back-end

PCB and cannot be changed

Caching Mode

Cache Memory

Write-through or Write-back

Pre-installed 256MB (or above) DDR RAM DIMM with/without

ECC, in one DIMM socket

Number of LUN’s

Up to 32 per host ID

Yes

Multiple Target IDs/

Host Channel

Firmware on Flash

Memory

Yes

7.1.2

Architecture

Specifications

IBM PowerPC 750CXr

CPU

Gigabit Ethernet

DIMM Slot

ASIC

One 10/100BasedT for local or remote management access

One 184-pin DDR DIMM module

64-bit chipset (ASIC266)

32Mbit (4MB)

Flash ROM

NVRAM

32KB with RTC

Hardware XOR

Real-time Clock

Yes

For event messages with time record tracking and scheduled

maintenance tasks, e.g., Media Scan.

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7.2

Drive Tray Specifications

Specifications

Height

Width

28mm

110mm

218.92mm

Yes

Depth

Key Lock

7.3

Power Supply Specifications

Specifications

350W

Nominal Power

DC Output

12.0V: 25A

5.0V: 25A

3.3V: 20A

Input Frequency

AC Input

47 to 63Hz

115VAC @ 6A or 240VAC @ 3A with PFC

Yes

Power Factor Correction

Hold-up Time

At least 16ms at 115/230VAC full load after a loss of

AC input

Over-temperature Protection

Cooling Fans

Auto shutdown when cooling is lost or elevated tem-

perature is detected; over-voltage protection is also

available.

Two fans for each unit (inside PSU)

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7.4

Cooling Module Specifications

Specifications

Speed

High or low rotation speed controlled by firmware

Max. Air Flow (each module)

High speed: 31.8 CFM

Low speed: 20.1 CFM

Input Power

Rated Voltage

Temperature

9/3.12W max.

DC 12V

Operating: -10 to +60ºC

Storage: -20 to +70ºC

7.5

RAID Management

Specifications

Configuration

LCD keypad panel

Text-based firmware-embedded utility over RS-232C connection

through the included audio jack-to-DB-9 serial cable

The Bosch RAIDWatch Manager program using Ethernet connec-

tion

Performance Monitor-

ing

Yes

Remote Control and

Monitoring

Yes

Event Notification

Yes (via Bosch RAIDWatch’s sub-modules, Configuration Client

or NPC)

Management Connec-

tion

In-band over Ethernet, or RS-232C

Configuration on Disk

Configuration data stored on disk drives for logical drive assem-

blies to exist after controller replacement; basic settings, e.g.,

channel mode settings, are stored on NVRAM

Failure Indicator

Via audible alarm, LCD keypad panel, Bosch RAIDWatch Man-

ager session, event notifications, or event prompts on terminal

emulation

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7.6

Fault Tolerance Management

Specifications

SATA drive SMART support

Battery Back-up Option

Yes

ISEMS (Bosch Simple Enclosure Management Service) via I C Interface

Automatic Drive Failure Detection

Yes

Regenerate Logical Drive Parity

Bad Block Reassignment

Automatic Rebuild upon Failed Drive Replacement

Automatic Rebuild on Spare Drives

Manual Clone of Suspected Failed Drive

Concurrent rebuild on Multiple Drives in a RAID (0 + 1) Logical Drive

Salvage the 2 Temporarily Failed Drive in a RAID 1, 3 or 5 Logical Drive

Yes

Salvage the 1 Temporarily Failed Drive in a RAID 0 Logical Drive

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Appendix: Spare Parts and Accessories

8.1

Spare Parts

8.1.1

Spare Parts Overview

Except the RAID controller module, all the active components in the subsystems can be

replaced while the system is running. If any of these components fails then it can, if config-

ured in a fully redundant mode, be hot-swapped. Spare parts for the subsystems can be

ordered separately. This section lists the model names for the different spare parts.

8.1.2

Spare Parts List

Table 8.1 lists the spare parts.

Model Name

DVA-ADTK-000A

Description

Drive tray, type-III bezel and type-II LED lightpipe.

Drive tray including 500 GB Hitachi SATA drive

Drive tray including 750 GB Hitachi SATA drive

DVA-ADTK-050A

DVA-ADTK-075A

DVA-SPKK-08A

Power supply module, E2U DDR-interface subsystems,

350W capacity.

DVA-SFAK-08A

Dual-speed version of cooling fan module: r 2U subsystems

Battery cell pack, Li-ION battery cells

DVA-SBBK-00A

Table 8.1 Spare Parts List

8.1.3

Controller Modules

Table 8.2 lists the control modules.

Model Name

Description

DVA-SCDK-08A

SCSI-to-SATA RAID controller module, 2 x SCSI-320

host channels, 8 x SATA II drive channels, 256MB DDR

RAM.

Table 8.2 Controller Module List

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8.2

Accessories and Optional Items

A number of accessory items are available for the RAID subsystem. Some of these accessory

items come with the subsystem; but if damaged or if more accessory items are needed, they

can be ordered separately. Available accessory items are listed below:

Model Name

DVA-ACON-HD68A

Description

SCSI external round cable, DB68-to-VHDCI

DVA-ACON-VD68A

External SCSI round cable, VHDCI-to-VHDCI

* One included in the shipping package

DVA-ACON-VD680A

External SCSI round cable, VHDCI-to-VHDCI (0,5 m)

* One included in the shipping package

DVA-ASRK-28A

Slide rails for 21"~28.5" deep racks

Slide rails for 23"~36" deep racks

DVA-ASRK-36A

Table 8.3 Accessories List

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Appendix: Pinouts

9.1

SCSI Port: VHDCI Connector Pinouts

The SCSI port connector pinouts comply with specifications in T10 Working Draft, Project

1365D, SCSI Parallel Interface-4.

* NC = No Connection, * GND = Ground,

* TPWR = Terminator Power

Name

SD12+

SD13+

SD14+

SD15+

SDP1+

SD0+

Name

SD12-

SD13-

SD14-

SD15-

SDP1-

SD0-

SD1+

SD1-

SD2+

SD2-

SD3+

SD3-

SD4+

SD4-

SD5+

SD5-

SD6+

SD6-

SD7+

SD7-

SDP0+

GND

SDP0-

GND

DIFSENS

TPWR

GND

TPWR

GND

SATN+

GND

SATN-

GND

SBSY+

SACK+

SRST+

SMSG+

SSEL+

SC_D+

SREQ+

SI_O+

SD8+

SBSY-

SACK-

SRST-

SMSG-

SSEL-

SC_D-

SREQ-

SI_O-

SD8-

Table 9.1 VHDCI Connector Pinouts

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Name

SD9+

Name

SD9-

SD10+

SD11+

SD10-

SD11-

Table 9.1 VHDCI Connector Pinouts (Cont.)

9.2

COM1 Cable: DB9 and Audio Jack Pinouts

Fig. 9.1 Serial Port Cable CN1 and CN2 Connectors

CN1 Pin Number

Pin Name

Ground

TXD

RXD

CN2 Pin Number

Pin Name

RXD

TXD

DTR

GND

DSR

RTS

CTS

Pin 4 and Pin 6 are shorted

Pin 7 and Pin 8 are shorted

Table 9.2 COM 1 Cable, RS-232C (Audio Jack) Pin Out Definitions

NOTICE!

A null modem is used for wire-swap and is necessary for connecting in between COM1CN2

and a PC serial port.

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9.3

9.4

Null Modem

Swap Pin 2 and Pin 3

Swap Pin 4 and Pin 6

Swap Pin 7 and Pin 8

Table 9.3 Null Modem Pinouts

Ethernet Port Pinouts

Fig. 9.2 LAN Port Pinouts

Pin Name

LAN_TXP

Pin Name

LAN_TXN

LAN_RXP

LAN_RXN

Table 9.4 Ethernet Port Pinouts

9.5

Main Power

IEC-type receptacle.

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Index | en

Index

components 18

airflow 20, 58

airflow clearance 20

I2C 26, 33

ambient Temperature 38

array identification 12

audible alarm 17, 26, 32

audio jack 63

I2C bus 17

input voltage 54

international transportation regulation 14

Internet SCSI 7

authorized battery disposal sites 21

iSCSI initiators 35

backplane 11

Key-Lock 52

BBU 10, 13, 38, 43

BBU module 14 , 30

BBU Module LED 30

BBU Warnings 20

blower 15

LAN Port LED 29

LCD 39

LCD Panel 10

LCD Screen 39

LED 17

Bosch RAIDWatch 17

cabinet installation 22

cabling 19

media scan 41

memory module 38

mini-SCSI connector 13

cached data 29

capacity 52

charge 14

component check 19

controller module 10 , 13 , 27 , 42 , 43

controller specifications 56

cooling fan module 10 , 11 , 15 , 27 , 31 , 42

cooling module specifications 58

CPU 56

normalized airflow 18, 42

null modem 63

package dimensions 54

path redundancy 37

power cable 38

power cord 15

power down 41

power on 38

DB9 63

DIMM 43

power socket 15

power supply specification s 57

power switch 15

PSU 10, 15, 42 , 47

PSU Bracket 47

PSU Module 27

DIMM modul e 43 , 46

DIMM socket 45

drive bay 10 , 52

drive IO timeout 51

drive tray 22, 24, 38, 52

drive trays 27

rack installation 19

rackmounting 23

rear brackets 23

ejection handle 48

electrostatic discharge 19

Ethernet link 17

Ethernet port 14 , 27 , 64

rear panel 10, 12

regenerating logical drive parity 41

retention screws 47

RJ-45 35

RJ-45 port 14

RS-232C (Audio Jack) serial port 14

firmware 17

front cabinet posts 23

front flap 24

front panel 9, 12

fully charged 47

SATA drives 52

SCSI cable 35

GUI 17

sensors 31

shutdown controller 41

startup sequence 39

static free 19

status check 39

straight-through 35

system dimensions 54

system weight 54

handles 51

hard drive 38, 42, 52

host connection 35, 37

host redundancy 37

hot-swap mechanism 12

hot-swappable 42

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terminal emulation program 17

terminal management 14

threshold values 32

under charge 29

ventilation clearance 20

warning alarms 55

XOR 56

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Germany

Telefon

Fax

+49 (89) 6290-0

+49 (89) 6290-1020

www.bosch-securitysystems.com

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