GSM TELEPHONE
SGH-T519
GSM TELEPHONE
CONTENTS
1. Safety Precautions
2. General Introduction
3. Specification
4. Product Funtion
5. Circuit Description
6. Test Command & Test Procedure
7. Array course control
8. Exploded View and its Parts list
9. MAIN Electrical Parts List
10. Flow Chart of Troubleshooting and
Circuit Diagrams
11. PCB Diagrams
12. Block Diagrams
13. Reference data
Contents
9. MAIM Electrical parts list
10. Flow Chart of Troubleshooting and Circuit Diagrams
10-1. Baseband
10-1-1. Power on ..............................................................................10-1
10-1-2. Initial ....................................................................................10-3
10-1-3. Sim Part ...............................................................................10-4
10-1-4. Charging Part ........................................................................10-5
10-1-5. Microphone Part .....................................................................10-7
10-1-6. Speaker Part .........................................................................10-9
10-1-7. Camera Part ........................................................................10-13
10-2. RF
10-2-1. GSM850/EGSM900 RX ..........................................................10-15
10-2-2. PCS RX ...............................................................................10-16
10-2-3. DCS RX ...............................................................................10-17
10-2-4. GSM850/EGSM900 TX ...........................................................10-18
10-2-5. DCS/PCS TX ........................................................................10-19
10-2-6. BLUETOOTH .........................................................................10-20
11. PCB Diagrams
12. Block Diagrams
12-1. RF Solution Block Diagram ..........................................................12-1
12-2. Base Band Solution Block Diagram ..............................................12-2
13. Reference data
ⓒ
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
Samsung Electronics Co.,Ltd.
Code No.: GH68-12034A
2006. 08. Rev.1.0
1. Safety Precautions
1-1. Repair Precaution
●
Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test,
because specipicty of cellular phone is sensitive for surrounding interference(RF noise).
●
Be careful to use a kind of magnetic object or tool,
because performance of parts is damaged by the influence of manetic force.
●
Surely use a standard screwdriver when you disassemble this product,
otherwise screw will be worn away.
●
Use a thicken twisted wire when you measure level.
A thicken twisted wire has low resistance, therefore error of measurement is few.
●
Repair after separate Test Pack and Set because for short danger (for example an
overcurrent and furious flames of parts etc) when you repair board in condition of
connecting Test Pack and tuning on.
●
Take specially care of soldering, because Land of PCB is small and weak in heat.
●
Surely tune on/off while using AC power plug, because a repair of battery charger is
dangerous when tuning ON/OFF PBA and Connector after disassembing charger.
●
Don't use as you pleases after change other material than replacement registered on
SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
1-1
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Safety Precautions
1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easilly by static electricity. Such parts are called by
ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
●
Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity
prevention string on wrist.
●
Use earthed soldering steel when you connect or disconnect ESD.
●
Use soldering removing tool to break static electricity. otherwise ESD will be damaged by
static electricity.
●
Don't unpack until you set up ESD on product. Because most of ESD are packed by box
and aluminum plate to have conductive power,they are prevented from static electricity.
●
You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or a circuit board.
1-2
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2. General Introduction
The SGH-T519 Quad Band phone functions as digital phone working in GSM
(Global System for Mobile communications)850,EGSM900, DCS1800 and
PCS(PersonalCommunication System)1900 modes.
<Specification>
●
Dimension
Weight
LCD
R/F band
Vocoder
Antenna
SIM
: 113 x 50 x 8.6 mm (with Standard Battery)
: 76g (with Standard Battery)
: LCD 260K TFT Color LCD (176 x 220) 1.93"
: GSM850 / EGSM 900 / DCS1800 / PCS1900
: EFR + FR + HR + AMR
: Fixed type
: 3 Voltage operation
: VER 1.0
●
●
●
●
●
●
●
BLUETOOTH
<GPRS/EGPRS Factor>
●
MS Class
GPRS Phase
Multi-slot
SMG
Coding scheme
Power class
:
:
:
:
:
Class B
GSM Phase II+
GPRS/EGPRS Class 10 (2 Up-link, 4 Down-link, 5 Sum)
SMG #31
CS1 - CS4(GPRS), MCS5 - MCS9(EGPRS) support
●
●
●
●
●
:
GSM850
- Class 4 (2W)
EGSM900 - Class 4 (2W)
DCS1800 - Class 1 (1W)
PCS1900 - Class 1 (1W)
●
●
●
WAP 2.0 Browser
SIM AT(Application Toolkit)
40 Polyphonic Ringtone
< Basic Package >
●
Handset + Standard Battery + TA + User Guide + Handstrap
< Option Item >
●
Travel Adapter
●
Ear Microphone
●
Bluetooth Headset
●
Bluetooth Hands Free Kit
●
Car Charger/Adapter
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3. Specification
3-1. GSM General Specification
GSM850
EGSM900
DCS1800
PCS1900
Freq. Band[MHz]
Uplink/Downlink
824~849
869~894
880~915
925~960
1710~1785
1805~1880
1850~1910
1930~1990
0~124&
ARFCN range
Tx/Rx spacing
128~251
45 MHz
512~885
95 MHz
512~810
80 MHz
975~1023
45 MHz
270.833 Kbps
3.692 us
270.833 Kbps
3.692 us
270.833 Kbps
3.692 us
270.833 Kbps
3.692 us
GPRS
Mod. Bit
rate/
812.5 Kbps
3.692 us
812.5 Kbps
3.692 us
812.5 Kbps
3.692 us
812.5 Kbps
3.692 us
Bit Period
EDGE
Time Slot
Period/Frame Period
576.9 us
4.615 ms
576.9 us
4.615 ms
576.9 us
4.615 ms
576.9 us
4.615 ms
GPRS
Modulation
EDGE
0.3 GMSK
8 PSK
0.3 GMSK
8 PSK
0.3 GMSK
8 PSK
0.3 GMSK
8 PSK
GPRS 33 dBm~5 dBm 33 dBm~5 dBm 30 dBm~0 dBm 30 dBm~0 dBm
MS Power
EDGE
GPRS
EDGE
27~5 dBm
5~19(class4)
8~19(class E2)
-102 dBm
8
27~5 dBm
5~19(class4)
8~19(class E2)
-102 dBm
8
26~0 dBm
0~15(class1)
2~15(class E2)
-100 dBm
8
26~0 dBm
0~15(class1)
2~15(class E2)
-102 dBm
8
Power Level
Sensitivity
TDMA Mux
Cell Radius
35 Km
35 Km
2 Km
2 Km
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Specification
3-2. GSM TX power class
TX
TX
TX
TX
Power
control
level
Power
control
level
Power
control
level
Power
control
level
PCS1900
GSM850
EGSM900
DCS1800
0
1
30±3 dBm
28±3 dBm
26±3 dBm
24±3 dBm
22±3 dBm
20±3 dBm
18±3 dBm
16±3 dBm
14±3 dBm
12±4 dBm
10±4 dBm
8±4 dBm
6±4 dBm
4±4 dBm
2±5 dBm
0±5 dBm
5
33±2 dBm
31±2 dBm
29±2 dBm
27±2 dBm
25±2 dBm
23±2 dBm
21±2 dBm
19±2 dBm
17±2 dBm
15±2 dBm
13±2 dBm
11±2 dBm
9±2 dBm
0
1
30±3 dBm
28±3 dBm
26±3 dBm
24±3 dBm
22±3 dBm
20±3 dBm
18±3 dBm
16±3 dBm
14±3 dBm
12±4 dBm
10±4 dBm
8±4 dBm
6±4 dBm
4±4 dBm
2±5 dBm
0±5 dBm
5
33±2 dBm
6
6
31±2 dBm
29±2 dBm
27±2 dBm
25±2 dBm
23±2 dBm
21±2 dBm
19±2 dBm
17±2 dBm
15±2 dBm
13±2 dBm
11±2 dBm
9±2 dBm
2
7
2
7
3
8
3
8
4
9
4
9
5
10
11
12
13
14
15
16
17
18
19
5
10
11
12
13
14
15
16
17
18
19
6
6
7
7
8
8
9
9
10
11
12
13
14
15
10
11
12
13
14
15
7±2 dBm
7±2 dBm
5±2 dBm
5±2 dBm
3-2
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Specification
3-3. EDGE TX Power Level
TX
TX
TX
TX
Power
control
level
Power
control
level
Power
control
level
Power
control
level
GSM850
EGSM900
DCS1800
PCS1900
8
27±3 dBm
25±3 dBm
23±3 dBm
21±3 dBm
19±3 dBm
17±3 dBm
15±3 dBm
13±3 dBm
11±5 dBm
9±5 dBm
7±5 dBm
5±5 dBm
8
27±3 dBm
25±3 dBm
23±3 dBm
21±3 dBm
19±3 dBm
17±3 dBm
15±3 dBm
13±3 dBm
11±5 dBm
9±5 dBm
7±5 dBm
5±5 dBm
2
3
26±3 dBm
24±3 dBm
22±3 dBm
20±3 dBm
18±3 dBm
16±3 dBm
14±3 dBm
12±4 dBm
10±4 dBm
8±4 dBm
6±4 dBm
4±4 dBm
2±5 dBm
0±5 dBm
2
3
26±3 dBm
24±3 dBm
22±3 dBm
20±3 dBm
18±3 dBm
16±3 dBm
14±3 dBm
12±4 dBm
10±4 dBm
8±4 dBm
6±4 dBm
4±4 dBm
2±5 dBm
0±5 dBm
9
9
10
11
12
13
14
15
16
17
18
19
10
11
12
13
14
15
16
17
18
19
4
4
5
5
6
6
7
7
8
8
9
9
10
11
12
13
14
15
10
11
12
13
14
15
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4. Product Function
Main Function
-1.3 Megapixel Camera and Camcorder
®
-Bluetooth Wireless Technology
-Instant Messageing capability
-Multimedia capability
-Fun & Apps featureprovides My Files, music player, games,
alarms, calendar, task list, calculator, world time, unit conversion, timer,
and stopwatch.
4-1
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5. Circuit Description
< RF Circuit Description of SGH-T519 >
1. FEM (F100)
==> Switching Tx, Rx path for GSM850, EGSM900, DCS1800 and PCS1900
controlled by logic.
Integration of GSM850, EGSM900, DCS1800 and PCS1900 RX SAW Filters.
To convert Electromagnetic Field Wave to Acoustic Wave and the pass the specific
frequency band.
- for filtering the frequency band 824 ~ 849 / 869 ~ 894 MHz
- for filtering the frequency band 880 ~ 915 / 925 ~ 960 MHz
- for filtering the frequency band 1710 ~ 1785 / 1805 ~ 1880 MHz
- for filtering the frequency band 1850 ~ 1910 / 1930 ~ 1990 MHz
2. FEM Control Logic
==> Truth Table
VC1
VC2
VC3
GSM850 Rx Mode
EGSM900
L
L
L
L
H
L
L
H
L
L
H
L
L
L
L
GSM850/EGSM900 Tx Mode
DCS/PCS Rx Mode
DCS/PCS Tx Mode
3. VC-TCXO(TCX400)
==> To generate the 26 MHz reference clock to drive the logic and RF.
4. SKY74137 (UCD100)
==> The sky74137 is a RF tranceiver IC for GS850, EGSM900 DCS1800
and PCS1900 quardband cellular systems, and incorporates EDGE tranceiver
capabillity, and integrates most of the low power silicon functions of a tranceiver.
The receive path implements a direct downconversion architecture. The transceiver
consists of four integrated Low Noise Amplifiers (LNAs), a quadrature demodulator,
selectable baseband filter bandwidths, and lowdroop DC Offset Correction (DCOC)
sequencer.
- RX Function
Four LNAs which support different bands of operation have separated differential
inputs. The LNA outputs feed into a quadrature demodulator that down-converts
the RF signals directly to baseband. The baseband I and Q paths consist of
cascaded amplifiers and low pass filter sections. All baseband filtering is provided
on-chip using no external capacitors.
5-1
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Circuit Description
- TX Function
The device implements Skyworks Polar Loop transmit architecture. This architecture
autonomously splits the amplitude and phase within the device using the traditional
analog In-Phase and Quadrature (I/Q) signals. The filter-saving advantage of the
translation-loop approach is embedded in the architecture. Also included is an AM loop
that provides both signal AM and power level control. The transmitter is provided a
coupled feedback signal from the PA and downconverts it to an IF. Following an IF VGA,
this feedback signal is fed to both loops. The reference for both loops is a transmit IF
signal produced by an I/Q modulator
5. POWER AMP (PAM400)
The module consists of a EGSM850/900 PA block and a DCS1800/PCS1900 PA block,
Both PA blocks share common power supply pins to distribute current. The subsystem
consists of two parts : a Power Amplifier Control (PAC) block, and an Integrated Coupler.
To select GSM900/850 and GMS1800/1900 as determined from the Band Select
(BAND_SEL) signal. SKY77331 contains band select switching circuitry to select GSM
(BAND_SEL is low) and DCS/PCS (BAND_SEL is HIGH) as determined from the Band
Select (BAND_SEL) signal. The BAND_SEL pad selects the PA output (DPCS_OUT or
GSM_OUT) while the Power Control (VPC) controls the level of output power. The
integrated power amplifier control (PAC) function provides envelope amplitude control by
reducing sensitivity to input drive, temperature, power supply, and process variation.
< Baseband Circuit description of SGH-D407 >
1. CSP2750 (UCD301)
==> The CSP2750 has two major logical components power management and
conversion signal processing.
The PSC component is responsible for all power-related functionality, including the
following;
Power management for RF, BB and ancillary devices within the GSM/GPRS
●
●
Battery-charge management
●
Reset control
●
SIM card voltage-level shifting
The CSP component is responsible for the following ;
●
Intraframe event scheduling
●
Voice band processing, including voice band ADC and DAC
●
Analog baseband processing, including baseband ADC and DAC
●
Providing RF interface for Trident digital baseband device
●
Transmitter Power control
●
Automatic frequency control
●
A5 ciphering
●
Low-power sleep mode and wake-up control
5-2
The CSP2750 has the following major physical components;
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Circuit Description
●
●
●
●
●
Timing and control unit
RF serial interface
Low-power sleep mode controller
Baseband Transmitter / Receiver
Voice input and output
2. WM8955L(UCD401)
==> The WM8955L is a low power, high quality stereo DAC with intergrated headphone
and loudspwaker amplifiers, designed to reduce external component
requirements in portable digital audio application.
Ω
The on-chip headsphone amplifiers can deliver 40mW into a 16 load. Advanced
on-chip digital signal processing performs bass and treble tone comtrol.
The WM8955L can operate as a master or a slave, and include an on-chip PLL. It
can use most master clock frequencies commonly found in portable systems,
including USB,GSM, CDMA or PDC clocks, or standard 256fs, clock rates.
Different audio sample rates such as 48khz, 44.1khz, 8khz and many other are
supported.
The WM8955L operates on supply voltages from 1.8V up to 3.6V, although the
digital core can operates on a separate supply down to 1.42V, saving power.
Different section of the chip can also be powered down under software control.
3. HPE(UCP201)
==> The Trident-HPE digital baseband processor is a complete system IC designed for
wireless terminals that includes two digital signal processor(DSP) cores
optimized for low-power communications applications and a powerful,
highperformance,
industry-standard microcontroller core along with a rich set of peripherals.
The Trident-HPE digital baseband processor achieves best-in-class signal processing
performance while maintaining the efficient software code density, low power
consumption, and small physical size required for GSM/GPRS terminals
ARM946E-S microcontroller core;
●
●
101 MHz system bus, 16 kbyte instruction and 16kbyte data caches.
8 kbyte tightly coupled zero wait-state instruction and 4kbyte tightly coupled zero wait-
state data memory
●
●
direct memory access controller for transparent transfer between memory and
peripherals.
External Memory interface with asynchronous burst mode support
5-3
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Circuit Description
●
Synchronous serial port supporting
●
●
●
Programmable 48-bit general-purpose IO unit, keyboard interface, programmable interval
timer and real-time clock.
SD/MMC controller that supports interfacing to secure digital/multimedia memory card.
●
Two DSP16000 dual-MAC DSP cores; Up to 404 million MACs per second at 101 MHz.
Memory complement;
- DSP0 : 144K X 16-bit ROM, 40k X 16-bit RAM.
- DSP1 : 96K X 16-bit ROM, 16k X 16-bit RAM.
JTAG boundary scan and integrated H/W developement system Low power;
Ultralow leakage process technology for best-in-class standby
power
●
●
Flexible power management modes to allow for maximum active power management
Interprocessor communication hardware support between ARM, DSP0 and DSP1.
Supported by Trident-HPE digital baseband processor software and hardware
developement tools as well as industry standard ARM software and hardware
developement tools Two on-chip, programmable, PLL clock synthesizers;
- one for ARM and DSP, the other one for USB.
5-4
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6. Test Command & Test Procedure
6-1. Calibration Equipment
- HP 8960
- DC Power Supply
- Test Jig
- Configuration
HP8960
RF
DC POWER SUPPLY
GPIB
+
--
P C
TEST JIG
GPIB
Serial
Serial
6-2. Calibration Program
- Samsung internal software
6-1
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Test Command & Test Procedure
6-3. Tx Power Tune up Procedure
- GMSK
1) Procedure:
a. Calibraion equipment HP8960 and the cell phone are connected
through RF cable.
b. Target power ( required power level according to the specification
which should be set by calibration program) is set to equipment as
power level (ex: GSM 5 level is 32.5 dBm).
c. Activate phone in Tx_Mode_Only.
d. HP8960 equipment measures transmitted power through rf test cable
from the phone and reports measured level to calibration program.
e. The program compares measured power with the target power.
f. The calibration program decides power code which is defined in
advance in the program and writes the codes to the flash memory in
the phone.
2) Target value is defined according to the value of GSM specification.
See the TX power level definition table below.
3) Target values of the peak level of the phone are set normally in
conducted mode
- GSM850 5 level : 32.5dBm
- EGSM900 5 level : 32.5dBm
- DCS 0 level : 29.5dBm
- PCS 0 level : 29.5dBm (Tolerance : -2dB ~ +1dB )
4) Accuracy
All the TX level from the phone after tuned-up satisfy the GSM
specification
5) TX ramp mask specification applied to the calibration program :
6-2
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Test Command & Test Procedure
- 8PSK
1) Procedure:
a. Calibraion equipment HP8960 and the cell phone are connected
through RF cable.
b. Target power ( required power level according to the specification
which should be set by calibration program) is set to equipment as
power level (ex: GSM 8 level is 27 dBm).
c. Activate phone in Cont_8psk_Tx_Mode_Only.
d. HP8960 equipment measures transmitted power through rf test cable
from the phone and reports measured level to calibration program.
e. The program compares measured power with the target power.
f. The calibration program decides power code which is defined in
advance in the program and writes the codes to the flash memory in
the phone.
2) Target value is defined according to the value of EGPRS specification.
6-3
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Test Command & Test Procedure
See the TX power level definition table below.
3) Target values of the peak level of the phone are set normally in
conducted mode
- GSM850 8 level : 27dBm
- EGSM900 8 level : 27dBm
- DCS 2 level : 26dBm
- PCS 2 level : 26dBm (Tolerance : -2dB ~ +1dB )
4) Accuracy
All the TX level from the phone after tuned-up satisfy the EGPRS
specification
5) TX ramp mask specification applied to the calibration program :
6-4
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7. Array course control
Test Jig (GH80-03307A)
Test Cable (GH39-00478A)
RF Test Cable (GH39-00397A)
7-1
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Array course control
Software Downloading
7-1. Downloading Binary Files
• Two binary files for downloading T519.
T
–
519XXYY.s3 : Main source code binary.
7-2. Pre-requsite for Downloading
• Downloader Program(OptiFlash.exe)
• T519 Mobile Phone
• Data Cable
• Binary files
7-2
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Array course control
7-3. S/W Downloader Program
1. Load the binary download programꢀby executing the “OptiFlash.exe”
2. Select the “Options” -> “Settings” -> “Generic” ->
“Specify hardware platform”.ꢀ
Choose hardware platform for the downloader file setting.ꢀ
Set the everything else as the default values which are shown below
7-3
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Array course control
3. Select the COM port when the download cable is connected
Up to 64 ports are supported. Additionally you can select the maximum
transfer speed OptiFlash will use to communicate with the phone.
However, OptiFlash will use a slower speed if either the PC’s or the
phone’s serial hardware is incapable of handling the selected speed.
7-4
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Array course control
4. Select the“Flash&Verify” -> “Browse”ꢀ
Set the directory path and choose the latest s/w binary, for example
“T519XXYY.s3”,ꢀfor the downloader binary setting.
In case of D407 the reserved regions are not a necessity.
(It is defined in platform.def file)
7-5
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Array course control
5. Click “OK” button then press “Flash”.ꢀ
(Before pressing ‘Flash’ button, push the button ‘*’and ‘END’ at the
same time. Then press ‘Flash’.)ꢀ
Downloader will upload the binary file as below for the downloading. ꢀ
6. When downloading is finished successfully, there is a “All is well”
message. ꢀ
7. After finishing downloading, Certain memory resets should be done to
guarantee the normal performance.ꢀ
8. Confirm the downloaded version name and etc. :ꢀ
*#1234#ꢀ
Full Reset : ꢀ
*2767*3855#
7-6
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P
8. Exploded View and its artslist
8-1. Cellular phone Exploded View
QME01
QCK01
QFR01
QSD01
QVO01
QRF03
QMI03
QCR06
QKP01
QLC01
QFL06
QCA02
QMP01
QVK01
QAN02
QCA01
QME03
QRE01
QCW01
QBA01
QBA00
QCR06
QSC01
QSC02
QRF01
8-3
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Exploded view and its Part list
8-2. Cellular phone Parts list
QAN02
QBA00
QBA01
QCA01
QCA02
QCK01
QCR04
QCR06
QCR06
QCW01
QFL06
QFR01
QKP01
QLC01
QME01
QME03
QMI03
QMI05
QMP01
QRE01
QRF01
QRF03
QSC01
QSC02
QSD01
QVK01
QVO01
INTENNA-SGHT519
ASSY CASE-BATT
GH42-01022A
GH98-02621B
GH43-02612A
GH59-03182A
GH59-03176A
GH98-00889B
6001-001479
6001-001155
6001-001155
GH72-30568A
GH98-01899A
GH98-01888B
GH98-01901B
GH07-01002A
GH59-03177A
GH59-03183A
GH73-07779A
GH98-01889B
GH82-02168A
GH98-01900B
GH72-33517B
GH72-30563B
GH72-33519B
GH72-33526B
GH72-30562B
GH59-03175A
GH98-00890B
INNER BATTERY PACK-800MAH, BLK
UNIT-CAMERA
UNIT-CAMERA KEY
ASSY KEY-CAMERA
SCREW-MACHINE
SCREW-MACHINE
SCREW-MACHINE
PMO-WINDOW CAMERA
ASSY CASE-CARRIER LOWER
ASSY CASE-FRONT
ASSY KEYPAD-MAIN(CHE/BLK)
LCD-M/S SGHT519
UNIT-EL KEY PBA
UNIT-SPK_MOT FPCB
RMO-RUBBER MIC HOLDER
ASSY CASE-MIC SUB
A/S MATERIAL ASSY-PBA MAIN
ASSY CASE-REAR
PMO-COVER RF
PMO-COVER EAR JACK
PMO-COVER SCREW L
PMO-COVER SCREW R
PMO-COVER MICRO SD
UNIT-VOLUME KEY
ASSY KEY-VOLUME
8-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Exploded view and its Part list
CBF INTERFACE-DATA LINK CABLE
GH39-00514A
GH44-01174A
GH59-02499A
GH74-26613B
GH81-05218A
GH81-05937A
GH73-07778A
GH73-07780A
GH73-07922A
GH73-08343A
GH74-25950A
GH74-25951A
GH74-26377A
GH74-26380A
GH74-26382A
GH74-26717A
GH74-27607A
GH74-27608A
GH74-28264A
GH74-28265A
GH73-08571A
GH74-22928A
GH68-05914A
GH81-04637A
GH72-30564B
GH74-21012A
GH68-05914A
GH73-07780A
GH74-21905A
6902-000634
GH68-01335D
GH68-12700A
GH69-04523E
GH69-04535A
GH46-00247A
GH68-13488A
CHARGER-SGHD820 TA (LTA)
UNIT-EARPHONE(BLK)
MPR-VINYL BOHO T MAIN WINDOW
AS-LCD WINDOW TAPE
AS-LCD WINDOW
RMO-RUBBER LCD CONN
RMO-RUBBER EAR JACK
RMO-RUBBER BGA
RMO-RUBBER CSP
MPR-TAPE CAMERA KEY
MPR-TAPE VOLUME KEY
MPR-SPONGE BT
MPR-TAPE, 3X3XT3.5, W290TCNG
MPR-TAPE, 8X6XT0.25, ABSORBER
MPR-SPONGE BD
MPR-TAPE LCD FRONT
MPR-INSU TAPE
MPR-TAPE
MPR-TAPE BRAKET B
RMO-RUBBER BATTERY
MPR-VINYL BOHO KEYPAD
LABEL(R)-WATER SOAK T_MOBILE
AS-TAPEKEYPAD
PMO-DECORATION REAR
MPR-VINYL BOHO REAR
LABEL(R)-WATER SOAK T_MOBILE
RMO-RUBBER EAR JACK
MPR-VINYL BOHO MAIN WINDOW
BAG PE
LABEL(P)-IMEI
LABEL(R)-MAIN(LTN)
BOX-UNIT(VMT)
CUSHION-CASE(MEXC)
S/W CD-SAMSUNG PC STUDIO 3.0
MANUAL USERS-LTN SPANISH
8-3
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Disassembly and Assembly instructions
8-3. Disassembly
1
2
1.Unscrew 4 points of a rear.
1.Disjoint a top of the rear with a tool.
※
※
caution
caution
1. Be careful not to do damage and scratch the phone.
1. Be careful not to do damage and scratch the phone.
3
4
1.Remove both side keys,then detach the EL
KEY FPCB CONNECTOR.
1.Lift up a board carefully and detach a PBA.
※
※
caution
caution
1. Be careful not to cut both side keys and damage to camera
connector pins
1. Be careful not to cut both side keys and damage to camera
connector pins
5
6
1.Detach a PBA Ass'y from LCD Module.
※
caution
1.Remove a camera and SPK/MOT connector.
※
1.Be careful not to do damage to intenna and scratch the
LCD.
caution
1. Be careful not to damage to camera connector pins
8-4
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Disassembly and Assembly instructions
7
1. Detach a LCD from LCD braket.
※
caution
1. Be careful not to do damage and scratch the phone.
8-5
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Disassembly and Assembly instructions
8-4. Assembly
1
2
1. Attach an EL sheet 2. Attach a key pad
2. Press a camera
window.
1. Attach a rear deco.
and camera window
A. Remove a adhesive tape of EL sheet.
B. Attach a EL sheet
A. Examine the surface of rear,and attach a
rear deco. and camera window.
B. Press a camera window.
C. Attach a mic cover
D. Attach a key pad
E. Press a key pad
- Pressure kgf : 6 ± 1 kgf/cm2
- Pressure kgf : 6 ± 1 kgf/cm2
3
2. Place a SPK_MOT FPCB
1. Attach a SPK_MOT FPCB
Place part printed +,-into a groove
Connection part
of SPK and MOT
F-PCB
Remove a
adhesive tape
Base line when
가
Place F-PCB
inside Intenna
attaching SPK F-PCB
A. Connect SPK and MOT with FPCB and paste another FPBC along the baseline.
B. Place SPK_MOT F-PCB inside intenna.
8-6
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Disassembly and Assembly instructions
4
1. Examnine the surface of
2. Place LCD and sponge
CARRIER LOWER
CAMERA SPONGE
LCD place hole
SHORT PREVENTION TAPE
Baseline
ABSORBER
Attach keeping away from
soldering part.
completion
A.Place a LCD inserting LCD connector on the front of CARRIER LOWER.
B.Place a LCD into place hole of CARRIER LOWER correctly.
C.Press carefully the top (SAMSUNG logo) and bottom( T-Mobile logo) of LCD .
D.Attach a LCD sponge to CARRIER LOWER along the base line (the right side and bottom)
5
1. Soler side keys and stick a friction tape
A. Solder side keys with soldering jig.
B. Stick a friction tape along the baseline.
8-5
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Disassembly and Assembly instructions
6
1. Place a PBA
Press the connector horizontally to a
PBA
A. Press carefully the top of PBA with your right hand grasping CARRIER LOWER with your
left hand.
B. Press both sides of PBA until it clicks into the CARRIER LOWER.
(Grasp the edge of LCD during work)
C. Press the LCD connector to the CARRIER LOWER horizontally.
7
1. Place the intenna
A.Press the intenna until it clicks into the PBA
B.Put the SPK CONNECTER horizontally
C.Place the soldering part of INTENNA to a groove
8-6
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Disassembly and Assembly instructions
8
1. Solder the intenna
2. Place the camera
A. Solder the intenna with soldering jig
B. Place the camera into a groove of CARRIER LOWER.
C. Press carefully after placing camera module.
9
1.Place the PBA side keys
A. Place the PBA on the FRONT.
B. Remove the camera protection film.
C. Place side keys into place.
8-5
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Disassembly and Assembly instructions
10
1. Remove the protection film inside
CAMERA WINDOW
3. SCREW
2. Place the REAR
Locker No.1
Locker No.2
A. Place the top of a REAR and press down until it clicks into the Front
B.Press the Locker No.1 and Locker No.2
C.SCREW.(4 POINT)
8-6
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
9. MAIN Electrical Parts List
SEC CODE
Design LOC
D401
Discription
DIODE-SWITCHING
DIODE-ZENER
DIODE-ZENER
DIODE-ZENER
DIODE-SCHOTTKY
DIODE-TVS
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
0401-001141
0403-001411
0403-001511
0403-001547
0404-001245
0406-001167
0406-001190
0406-001190
0406-001210
0406-001210
0406-001210
0406-001223
0406-001223
0406-001241
0406-001241
0406-001254
0406-001254
0406-001254
0406-001254
0406-001254
0406-001254
0406-001254
0406-001254
0406-001254
0406-001254
0504-000168
0801-002529
0801-002958
0801-002958
1001-001371
1002-001441
1003-001716
1108-000068
1201-002240
1201-002368
1203-003663
1203-003688
ZD406
ZD301
ZD402
D302
U201
ZD403
ZD404
ZD203
ZD400
ZD401
ZD310
ZD311
ZD303
ZD304
ZD305
ZD306
ZD307
ZD308
ZD309
ZD407
ZD408
ZD409
ZD410
ZD411
Q301
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
TR-DIGITAL
U300
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-ANALOG SWITCH
IC-D/A CONVERTER
IC-EL DRIVER
IC-MCP
U101
U204
U402
UCD401
U305
UME201
U401
IC-AUDIO AMP
IC-POWER AMP
IC-BATTERY
PAM101
U304
Q100
IC-POSI.FIXED REG.
9-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
SEC CODE
Design LOC
Q401
Q402
U405
Q400
Q403
U202
UCD301
U302
U404
U203
UCD100
U301
V402
V403
VR200
V306
V307
V309
V310
V311
V312
R439
R440
R101
R102
R321
R433
R402
R418
R412
R425
R205
R216
R430
R431
R441
R122
Discription
IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-POWER SUPERVISOR
IC-POWER SUPERVISOR
IC-DC/DC CONVERTER
IC-DC/DC CONVERTER
IC-TRANSCEIVER
IC-TRANSCEIVER
THERMISTOR-NTC
VARISTOR
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
1203-003737
1203-003737
1203-003737
1203-003767
1203-003787
1203-003789
1203-004119
1203-004164
1203-004172
1205-002272
1205-002944
1404-001165
1405-001082
1405-001082
1405-001082
1405-001108
1405-001108
1405-001108
1405-001108
1405-001108
1405-001108
2007-000137
2007-000138
2007-000139
2007-000139
2007-000140
2007-000140
2007-000141
2007-000141
2007-000142
2007-000142
2007-000148
2007-000148
2007-000148
2007-000148
2007-000148
2007-000157
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
9-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
SEC CODE
Design LOC
R428
R429
R105
R106
R114
R135
R136
R225
R227
R305
R410
R411
R452
R453
R213
R214
R436
R220
R319
R301
R442
R400
R415
R201
R100
R445
R446
R226
R228
R447
R421
R426
R111
R300
R315
R437
R438
Discription
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
2007-000157
2007-000157
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000172
2007-000172
2007-000172
2007-000242
2007-000690
2007-000775
2007-000831
2007-001119
2007-001119
2007-001284
2007-001290
2007-001290
2007-001290
2007-001292
2007-001292
2007-001320
2007-007107
2007-007107
2007-007134
2007-007142
2007-007311
2007-007312
2007-007312
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
9-3
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
SEC CODE
Design LOC
R304
R104
R403
R409
R316
R310
R109
R217
R401
R408
R420
R423
R215
R115
R125
R137
R117
R427
R200
R202
R306
R320
R322
R449
R413
R414
R416
R210
R219
R221
R222
R223
R224
R229
R230
R231
R309
Discription
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
2007-007316
2007-007317
2007-007468
2007-007468
2007-007489
2007-007590
2007-007741
2007-007741
2007-007741
2007-007741
2007-007741
2007-007741
2007-007798
2007-008045
2007-008045
2007-008045
2007-008052
2007-008054
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008419
2007-008419
2007-008419
2007-008483
2007-008483
2007-008483
2007-008483
2007-008483
2007-008483
2007-008483
2007-008483
2007-008483
2007-008483
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
9-4
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
SEC CODE
Design LOC
R312
R314
R317
R404
R235
R120
R116
R419
R112
R124
R127
R130
R318
R450
R451
R123
R406
R407
R443
R444
R218
R424
R417
R434
R435
R422
R302
R308
R432
R126
C312
C200
C203
C204
C208
C209
C210
Discription
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
2007-008483
2007-008483
2007-008483
2007-008483
2007-008486
2007-008516
2007-008531
2007-008531
2007-008542
2007-008542
2007-008542
2007-008542
2007-008542
2007-008542
2007-008542
2007-008587
2007-008588
2007-008588
2007-008672
2007-008672
2007-008786
2007-009084
2007-009115
2007-009117
2007-009117
2007-009166
2007-009167
2007-009170
2007-009170
2007-009314
2203-000233
2203-000254
2203-000254
2203-000254
2203-000254
2203-000254
2203-000254
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
9-5
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
SEC CODE
Design LOC
C213
C214
C216
C217
C232
C233
C332
C128
C102
C222
C223
C447
C450
C452
C417
C418
C454
C107
C310
C311
C402
C406
C407
C415
C303
C359
C120
C121
C426
C360
C448
C449
C335
C443
C444
C445
C446
Discription
C-CER,CHIP
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
2203-000254
2203-000254
2203-000254
2203-000254
2203-000254
2203-000254
2203-000254
2203-000311
2203-000330
2203-000330
2203-000330
2203-000438
2203-000438
2203-000438
2203-000550
2203-000550
2203-000628
2203-000812
2203-000812
2203-000812
2203-000812
2203-000812
2203-000812
2203-000812
2203-001072
2203-001153
2203-002677
2203-002677
2203-002709
2203-002982
2203-003019
2203-003019
2203-005061
2203-005061
2203-005061
2203-005061
2203-005061
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
9-6
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
SEC CODE
Design LOC
C451
C453
C405
C413
C206
C207
C221
C224
C225
C228
C230
C231
C302
C422
C455
C110
C136
C305
C308
C309
C324
C325
C326
C327
C328
C329
C330
C331
C115
C100
C300
C126
C124
C218
C439
C440
C111
Discription
C-CER,CHIP
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
2203-005061
2203-005061
2203-005481
2203-005481
2203-005482
2203-005482
2203-005482
2203-005482
2203-005482
2203-005482
2203-005482
2203-005482
2203-005482
2203-005482
2203-005482
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005725
2203-005731
2203-005732
2203-005736
2203-005808
2203-005819
2203-006048
2203-006048
2203-006121
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
9-7
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
SEC CODE
Design LOC
C306
C212
C333
C334
C404
C109
C129
C134
C135
C408
C219
C339
C205
C314
C400
C401
C118
C119
C133
C142
C116
C138
C304
C321
C410
C456
C108
C112
C432
C364
C113
C122
C137
C139
C201
C211
C215
Discription
C-CER,CHIP
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
2203-006121
2203-006137
2203-006137
2203-006137
2203-006137
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006257
2203-006257
2203-006260
2203-006260
2203-006260
2203-006260
2203-006305
2203-006305
2203-006305
2203-006305
2203-006324
2203-006324
2203-006324
2203-006324
2203-006348
2203-006348
2203-006361
2203-006361
2203-006361
2203-006377
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
9-8
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
SEC CODE
Design LOC
C301
C307
C340
C421
C424
C409
C130
C132
C229
C313
C316
C318
C319
C336
C367
C412
C416
C419
C420
C423
C427
C428
C430
C431
C433
C434
C338
C390
C220
C388
C389
C411
C363
C315
C317
C358
C429
Discription
C-CER,CHIP
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006466
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006626
2203-006626
2203-006636
2203-006642
2203-006642
2203-006681
2203-006708
2203-006824
2203-006824
2203-006824
2203-006824
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
9-9
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
SEC CODE
Design LOC
C435
C441
C442
C343
C345
C202
C106
C457
C458
C403
C459
C460
C414
C438
TA302
C425
L402
Discription
C-CER,CHIP
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
2203-006824
2203-006824
2203-006824
2203-006825
2203-006825
2203-006838
2203-006846
2404-001348
2404-001348
2404-001352
2404-001352
2404-001352
2404-001381
2404-001381
2404-001381
2404-001406
2703-001868
2703-001868
2703-002199
2703-002205
2703-002269
2703-002597
2703-002597
2703-002597
2703-002597
2703-002700
2703-002700
2703-002709
2703-002734
2703-002749
2703-002794
2703-002824
2703-002910
2703-003064
2703-003064
2801-004285
2801-004466
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
CRYSTAL-SMD
CRYSTAL-SMD
L403
L106
L103
L107
L104
L105
L108
L109
L110
L111
L302
L304
L303
L114
L200
L102
L407
L408
OSC401
OSC201
9-10
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
SEC CODE
2809-001293
2901-001377
2901-001377
2901-001377
2901-001377
2911-000051
3301-001158
3301-001158
3301-001208
3301-001534
3301-001659
3705-001421
3709-001427
3709-001447
3710-002363
3711-005550
3711-005643
3711-005659
3711-005728
3711-006256
4202-001169
4302-001158
4709-001372
GH09-00044A
GH13-00038A
Design LOC
TCX101
F301
Discription
OSCILLATOR-VCTCXO
FILTER-EMI SMD
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
F302
FILTER-EMI SMD
F303
FILTER-EMI SMD
F304
FILTER-EMI SMD
F100
DUPLEXER-FEM
L405
BEAD-SMD
L406
BEAD-SMD
L112
BEAD-SMD
F401
BEAD-SMD
L404
BEAD-SMD
RFS101
CN201
SIM301
IFC400
HDC401
HDC301
HDC300
HDC302
BTC400
ANT102
BAT300
MOD100
UCP201
U400
CONNECTOR-COAXIAL
CONNECTOR-CARD EDGE
CONNECTOR-CARD EDGE
SOCKET-INTERFACE
HEADER-BOARD TO BOARD
HEADER-BOARD TO BOARD
HEADER-BOARD TO BOARD
HEADER-BOARD TO BOARD
HEADER-BATTERY
ANTENNA-CHIP
BATTERY-LI(2ND)
BLUETOOTH MODULE
IC MICOM
IC ASIC-SGHE380
9-11
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10. Flow Chart of Troubleshooting
10-1.Baseband
10-1-1. Power ON
'Power ON' Does not work
Check the current consumption
Current consumption
NO
Download again
≥
100mA ?
YES
Check the V bat. voltage
NO
≥
Voltage
3.3V ?
YES
Charge the Battery
Check the pins of UCD301
①
NO
≥
Check UCD301 and C316
C316
1.8V ?
YES
NO
C318 and C315 = 2.8V?
YES
②
NO
C312=1.5V?
YES
Check UCD301 and C312
Check the clock signal
NO
Check the clock generation
circuit (TCX101, U101 pin#4)
at pin #3 of TCX101 or C129
≥
Freq.=26MHz,Vrms 300mV
YES
Check the Initial operation
END
10-1
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Flow Chart of Troubleshooting
VCCA_2.9V
VCCD_1.8V
VCCD_2.9V
VBAT
VCCD_2.9V
C300
C301
C303
C302
C304
EAR_CHECK
DSP_DB(0:15)
C11
J13
VDD34
VDD12
DSP_DB(15)
DSP_DB(14)
D2
N9
DB15
UP_CLK
SIMCLK
D3 DB14
E3 DB13
E2
R10
P10
J11
UP_RST
UP_IO
SIM_IO
SIMRST
DSP_DB(13)
DSP_DB(12)
DSP_DB(11)
DSP_DB(10)
SIMDATA
DB12
VRTC_1.5V
SIM_IO
SIM_RST
SIM_CLK
F3 DB11
F2 DB10
F1 DB9
K11
K14
SIM_RST
SIM_CLK
DSP_DB(9)
DSP_DB(8)
DSP_DB(7)
F4
K12
DB8
VSIM
VSIM
G4 DB7
G3 DB6
H5
J6
J5
K3
K2
H11
G12
G13
F13
VRTC
DSP_DB(6)
DSP_DB(5)
DSP_DB(4)
DSP_DB(3)
LED2_DRV
LED1_DRV
RING_DRV
VCCD_1.8V_EN
VCCB_2.9V
VRF_2.9V
VCCD_2.9V
DSP_AB(0:8)
DB5
DB4
DB3
DB2
VCCA_2.9V
F15
C12
A14
VIB_DRV
VLDO_7
VLDO_6
DSP_DB(2)
DSP_DB(1)
DSP_DB(0)
R300
DB1
DB0
AB8
AB7
K1
K5
K7
M1
C9
VL5S_B
VL5S_A
VLDO_5
VL4S_B
D10
B10
B11
DSP_AB(8)
DSP_AB(7)
DSP_AB(6)
DSP_AB(5)
UCD301
AB6
AB5
AB4
DCS_TX_EN
GSM_TX_EN
M2
N2
N1
A12
B12
A13
J12
BAT300
VL4S_A
VLDO_4
VLDO_3
VLDO_2
DSP_AB(4)
DSP_AB(3)
DSP_AB(2)
DSP_AB(1)
AB3
AB2
AB1
AB0
L5
P1
K6
L3
L2
R3
G11
F14
VLDO_1
VACC
DSP_AB(0)
I|O
RWN
RESETN_CSP
VBAT
DSP_IO
C312
K8
L8
N7
M7
CSN_PSC
SCLK_PSC
SDO_PSC
SDI_PSC
DSP_RWN
UP_CS
FLASH_RESET
UP_SCLK
UP_SDO
UP_SDI
C313
C314
C315
C316
C317
C318
C319
E6
OCTL0
OCTL1
OCTL2
PCS_RX_EN
BAND_SEL
MOD_SEL
TX_EN
C5
F5
E5
E14
E13
E11
F12
D14
R318
VEXT
VBAT
CH_BDRV
OCTL3
OCTL4
OCTL5
OCTL6
C321
A4
G6
B3
A3
VCCB_2.9V
XOENA
CH_ISEN
CH_RES
SX_EN
PAC_EN
ICHRG
OCTL7
U301
R301
RX_EN
D15
E10
A10
E9
ADC_AUX2
ADC_AUX1
VREF
B1
A2
C1
SERLE1
SERLE2
SERDA
SERCK
SERLE
SERDAT
SERCLK
CREF
C2
H10
RTC_ALMN
C332
C333
R302
C334
R304
AFC
VAPC
RTCALARM
C335
VBAT
R305
RTX_IP
RTX_IN
RTX_QP
RTX_QN
INTRQ
PWR_KEEP
RST
PSW1_BUF
PWR_ON
JIG_ON
DSP_INT
C336
CLK13M_MC
XOENAQ
CLK32K
10-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
10-3
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This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
10-1-2. Initial
Initial Failure
Check the UCD301
(If it has some problem,
it has to be replaced.)
NO
NO
The voltage at the C316=1.8V?
The voltage at the C315=2.8V?
YES
Check the UCD301
(If it has some problem,
it has to be replaced.)
The voltage at the C216
" Low --> High" ?
YES
①
There is 32.768KHz wave
form at the C222, C223 ?
NO
NO
Check the UCP201
Check the UCD301
YES
The voltage is 2.8V
at the C317,C313,C315,C318 ?
YES
NO
NO
LCD Display OK ?
YES
Check the LCD module
Check the Audio part
Sound operation OK ?
YES
END
10-4
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
VCCD_1.6V
VCCD_1.8V
VRTC_1.5V
VCCD_1.6V
C202
C203
C232
C233
R201
C212
C213
C204
C205
CLK13M_TR
TR_RST
R205
A(0:25)
A(0)
A(1)
B7
A_A0
C8 A_A1
D8 A_A2
A6 A_A3
C6
C5
D7
E7
TDO T12
TDI V14
TCK U14
A(2)
A(3)
A(4)
A(5)
A(6)
A(7)
A(8)
A(9)
A(10)
N12
N11
V12
N15
A_A4
A_A5
A_A6
A_A7
CKO_IACK
IOBIT1_PIO06
IOBIT0_PIO05
SPFS1_PIO15
PCM_FSYNC
PCM_TXD
PCM_RXD
PCM_FCLK
DSP_INT
C4 A_A8
C2 A_A9
A3
SPTXD1_I2SD_PIO16 N16
SPRXD1_PIO17 M17
M18
SPCLK1_PIO18
A_A10
A(11)
A(12)
A(13)
A(14)
B3 A_A11
B1 A_A12
INT0 T15
IO W6
RWN V6
DSP_IO
DSP_RWN
DSP_DB(0:15)
D6
A_A13
DSP_DB(15)
D5 A_A14
D3 A_A15
E8 A_A16
F8 A_A17
E6 A_A18
D_D15 P11
D_D14 N10
D_D13 N9
D_D12 N8
D_D11 P9
P8
D_D10
D_D9 R9
D_D8 T9
A(15)
A(16)
DSP_DB(14)
DSP_DB(13)
DSP_DB(12)
DSP_DB(11)
DSP_DB(10)
DSP_DB(9)
A(17)
A(18)
A(19)
A(20)
D2
A_A19
E4 A_A20
E3 A_A21
A(21)
A(22)
A(23)
DSP_DB(8)
DSP_DB(7)
DSP_DB(6)
F5
F4
F3
F2
T8
U8
V8
R8
A_A22
A_A23
A_A24
D_D7
D_D6
D_D5
D_D4
UCP201
A(24)
A(25)
DSP_DB(5)
DSP_DB(4)
DSP_DB(3)
DSP_DB(2)
D(0:15)
PIO35_A_A25_BOOTSEL
D(0)
D(1)
D(2)
D(3)
A8 A_D0
E9 A_D1
F9 A_D2
D_D3 T7
D_D2 R7
D_D1 T6
DSP_AB(0:8)
DSP_DB(1)
DSP_DB(0)
G10
U6
D_D0
A_D3
D(4)
D(5)
D(6)
D(7)
G11 A_D4
D_A8 R6
D_A7 N6
D_A6 V4
D_A5 T5
D_A4 U4
D_A3 V3
W3
D_A2
D_A1 W2
D_A0 V1
DSP_AB(8)
DSP_AB(7)
DSP_AB(6)
DSP_AB(5)
F11 A_D5
E11 A_D6
G12 A_D7
D11 A_D8
E12 A_D9
D(8)
D(9)
DSP_AB(4)
DSP_AB(3)
DSP_AB(2)
DSP_AB(1)
D(10)
D(11)
C12
A_D10
A12 A_D11
F12 A_D12
D(12)
D(13)
D(14)
D(15)
DSP_AB(0)
D12
E13 A_D14
D13
D14 A_WEN
B14
V16
A_D13
TEST3
TEST2 T14
U15
VCCD_1.8V
A_D15
TEST1
CPTSTSTOP_CKO T17
T13
CP_WEN
CP_OEN
TP215
A_OEN
ATDO_PWM2
CP_TDO
CP_TDI
CP_TCK
CP_TMS
E14 PIO30_WAITN
H14 FLASHRSTN
A14 A_CS0N
ATDI_RTS1 L5
ATCK_CTS1 M4
ATMS_PIO45 K12
T_FLASH_ON
FLASH_RESET
ROM1_CS
R216
C15
P12
A_CS1N
PIO31_IRQ6
PIO00_IRQ5 P16
ROM2_CS
CARD_DETECT
G14 A_CS2N
J14 A_CS3N
BATTERY_OPEN_CHECK
IRQ4
P18
P17
M19
MV3020_INT
D15
A_CS4N
IRQ3
IRQ2
RAM1_CS
C16 A_CS5N
F15 A_CS6N
B17 A_CS7N
H16
A_BE0N
A17 A_BE1N
JACK_INT
INTRQ
TP216
IRQ1 M16
MV3020_CS
PIO47
J16
KEY_EL_EN
USB_CON
R14
PIO34
PIO33
LOWER_BYTE
UPPER_BYTE
U18
WM_SDIN
SIMCLK
WM_SCLK
SIMDATA
EAR_SWITCH
SIMRST
WM_CSB
ASW_SPEAKER
USB_SUSP
USB_DET
CAM_IC_RST
USB_VPO
USB_VMO
USB_OEN
USB_DATA
UP_SCLK
CHG_DET
DACPW_ON
LCD_BRIGHTNESS
XOENAQ
PWR_KEEP
CLK32K
RTCALARM
OSC201
UP_SDO
UP_SDI
UP_CS
1
2
BT_EN
AMP_EN
C222
C223
DEBUG_RTS
DEBUG_TXD
DEBUG_RXD
DEBUG_CTS
CRE
MCI_DAT0_EN
CHG_ON
VIB_EN
MCI_DAT_EN
MCI_CMD_EN
SDS_TXD
SDS_RXD
KEY_COL(0:4)
KEY_COL(0)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
MCI_DAT0
MCI_CMD
MCI_CLK
PSW1_BUF
KEY_ROW(0:4)
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_ROW(4)
10-5
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
10-1-3. Sim Part
"Insert SIM" is displayed on the LCD
NO
The voltage is 2.8V at C306?
YES
Check the UCD301
Is there any signal
NO
Check the UCD301 & UCP201
pin C305, C308, C309?
YES
Check the SIM Card
END
10-6
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Flow Chart of Troubleshooting
ZD302
CH3
CH2
4
3
CH4
CH5
VN
5
6
2
1
CH1
SIM301
6
1
2
1
2
6
VSIM
SIM_RST
SIM_CLK
5
4
5
3
3
4
SIM_IO
7
8
12 12
11 11
7
8
C305
9
9
10 10
C306 C307 C308 C309
G G G G
16 15 14 13
10-7
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Flow Chart of Troubleshooting
10-1-4. LCD Display part
LCD display is abnormal
Check LCD connection
and replace LCD
Check LCD
NO
YES
pin#14 of HDC302
is high?
LCD Backlight is on?
YES
Check HDC302
NO
YES
pin#7 of U404
is high?
①
NO
Check C218
NO
NO
C218 > 3.5V?
Recharge Bat.
YES
pin#6 of U404
is high?
Check UCP201
②
YES
CHeck U404
NO
C338, C340 is 2.9V?
YES
Check UCD301
③
NO
NO
pin#4 of ZD304
is LOW?
Check U400
YES
Are there anysignal
at pin#6 of ZD304?
YES
④
IS there any
YES
Replace or resolve
F301, F302, F303, F304
problem at F301,
F302, F303, F304
NO
Check U400
10-8
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Flow Chart of Troubleshooting
VCCD_2.9V
VCCD_2.9V
1
2
3
6
5
4
ZD304
R320
1 1
3 3
5 5
2
4
6
2
LCD_DATA(4)
LCD_DATA(3)
LCD_DATA(2)
LCD_DATA(1)
LCD_DATA(0)
4
6
8
10
LCD_DATA(13)
7 7
9 9
11 11
13 13
8
10
12
14
LCD_DATA(14)
LCD_DATA(15)
12
14
16
LED+_13.5V
15 15
17 17
19 19
21 21
16
18
20
22
LCD_DATA(12)
LCD_DATA(11)
LCD_DATA(10)
LCD_DATA(9)
LCD_DATA(8)
LCD_DATA(7)
LCD_DATA(6)
LCD_DATA(5)
18
20
22
24
MLCD_CS
LCD_ADS
LCD_WEN
23 23
25 25
27 27
24
26
28
26
28
30
HDC302
29
30
29
C338
C339
C340
VBAT
L200
U404
CAP
R215
1
2
3
4
8
7
6
5
SW
GND
GND
GND
LED
CTRL
VIN
LED+_13.5V
R217
C219
LCD_BRIGHTNESS
R218
C218
C220
10-9
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Flow Chart of Troubleshooting
F304
F303
OUT1
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
OUT1
OUT2
OUT3
OUT4
IN1
IN2
IN3
IN4
IN1
IN2
IN3
IN4
LCD_DATA(5)
LCD_DATA(6)
LCD_DATA(7)
LCD_DATA(8)
LCD_D(5)
LCD_D(6)
LCD_D(7)
LCD_D(8)
LCD_DATA(9)
LCD_DATA(10)
LCD_DATA(11)
LCD_DATA(12)
LCD_D(9)
LCD_D(10)
LCD_D(11)
LCD_D(12)
OUT2
OUT3
OUT4
GND GND
GNDGND
9
10
9
10
F301
F302
5
6
7
8
1
5
6
7
8
1
2
3
4
OUT1
OUT2
OUT3
OUT4
IN1
OUT1
OUT2
OUT3
OUT4
IN1
IN2
IN3
IN4
LCD_DATA(15)
LCD_DATA(14)
LCD_DATA(13)
LCD_DATA(4)
LCD_D(15)
LCD_D(14)
LCD_D(13)
LCD_D(4)
LCD_DATA(3)
LCD_DATA(2)
LCD_DATA(1)
LCD_DATA(0)
LCD_D(3)
2
3
4
IN2
IN3
IN4
LCD_D(2)
LCD_D(1)
LCD_D(0)
GND GND
GND GND
9
10
9
10
10-10
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Flow Chart of Troubleshooting
10-1-5. Microphone Part
Micro-phone does not work
①
NO
Is the connection status of
HDC300 O.K?
Reconnect connector of HDC300
YES
Check the DC bias voltage on
Mic path.
②
Solder the microphone again
or Replace
NO
NO
The voltage of C406 is
about 2.2V±10%?
R406, R415, R418, R425
YES
Is microphone OK?
YES
Check UCD301
END
10-11
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Flow Chart of Troubleshooting
HDC300
EL_PWR
EL_PWR
KEY_COL(0)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
PWR_ON
20
19
17
15
13
20
18
16
14
19
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_ROW(4)
18
16
14
17
15
13
12
10
11
9
12
10
8
11
9
7
8
6
4
2
7
5
3
1
MIC-
6
4
2
5
3
1
MIC+
C310
C311
V306 V307 V311
V309 V310
10-12
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Flow Chart of Troubleshooting
10-1-6. Speaker Part
There is no sound from speaker
①
NO
Is the connector
HDC401 O.K?
Reconnect HDC401
YES
yes
Check & Replace
L402, L403, HDC401
Are there any signal at
L405, L406?
NO
NO
NO
Are there any signal at
R437, R438?
Check UCP201
R442 is high?
YES
②
NO
The voltage at
L404 >3.7V??
Check & replace L404
③
YES
Check & replace U401
The type of sound from the speaker
is Melody, Mp3?
YES
NO
Are there any signal
at the pin #15, 16 of UCD401?
Are there any signal
at the pin #3,9 of U402?
NO
YES
YES
Pin #2 of UCD401
is Low?
NO
NO
YES
Check UCP201
④
NO
Check and replace
U402 & R427
Are there any signal
at the pin #5,6,7 of UCD401?
NO
YES
Check UCP201
The frequency at R433
is 13MHz?
NO
⑤
YES
Check U101,
R124, C140
C453 = 3.3V?
YES
NO
⑥
Check Q401
C445 & C446 = 1.8V?
NO
⑦
Check U302
⑧
Replace UCD401
10-13
Replace UCD401
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Flow Chart of Troubleshooting
VRF_2.9V
U101
VCC
1
2
6
NC
A
5
NC
13M_BUF
R124
C133
C136
R123
R125
3
4
GND
Y
CLK13M_TR
CLK13M_MC
CLK13M_WM
C137
R126
C140
VCCD_1.8V_EN
VBAT
VCCD_1.8V
U302
SW
PGND
L303
1
2
10
9
VIN
AVIN
R314
3 EN
MODE/SYNC
8
4
7
NC
NC
AGND
C362
5
6
VOUT
C365
GND
11
10-14
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Flow Chart of Troubleshooting
10-15
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Flow Chart of Troubleshooting
10-1-7. Receiver Part
There is no sound from receiver.
NO
Replace the Connection
Is the connection of HDC401 OK?
YES
or change receiver module
NO
Are there any signal
NO
Are there any signal
at L407, L408 ?
at R445, R446 ?
YES
YES
Check UCD301
①
Change receiver module
Replace L407, L408
END
10-16
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Flow Chart of Troubleshooting
10-17
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Flow Chart of Troubleshooting
10-1-8. Camera part
Camera function does not work
①
②
NO
NO
Is the connect HDC301 ok?
YES
Connect the HDC301
C452 IS HIGH?
YES
Check U400
③
Check
Q400
NO
YES
Pin #1 of Q400 IS HIGH?
Pin #3 of Q400 = 1.5V?
YES
NO
Check Bat.
④
NO
NO
Check
Q401
Pin #1 of Q403 = High?
Pin #3 of Q403 = 2.8V?
YES
Check Bat.
⑤
Replace OSC401
and check U400
NO
Pin#3 of OSC401 is 24MHz?
YES
NO
Is that clock signal at the
pin #23 of HDC301?
YES
⑥
NO
Check
U400
Pin#24 of HDC301 is High?
END
10-18
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Flow Chart of Troubleshooting
VCAMIO_2.8V
VCAM_1.5V VCAMA_2.8V
HDC301
1
2
2
4
1
3
3
5
7
4
6
8
CAM_D(0)
CAM_D(1)
CAM_D(2)
CAM_D(3)
CAM_D(4)
CAM_D(5)
CAM_D(6)
CAM_D(7)
6
8
10
5
7
9
10
9
VSYNC
HREF
11
13
15
12
14
16
11
12
14
16
13
15
17
PCLK
CAM_SCL
CAM_SDA
17
19
21
23
18 18
20
22
24
20
22
24
19
21
23
MCLK
CAM_RESET
NCNC
25 26
ZD303
10-19
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Flow Chart of Troubleshooting
10-20
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This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
10-1-9. Mp3 part
There is no MP3 sound from Earphone
Are there any signal
at the pin #5,7 of IFC400?
YES
Replace the Earphone
NO
①
YES
YES
YES
Are there any signal
at R410, R411?
Check & Replace ZD403
NO
②
Are there any signal
at the pin #10,13 of UCD401?
Check & Replace C457, C458
NO
③
Are there any signal
at the C407, 417?
Check C416, 417
NO
④
NO
NO
Are there any signal
at the PIN #5,6,7?
Check U302
Check Q401
C445 & C446 =1.8V ?
YES
YES
⑤
⑥
NO
Check UCP201
C445 =3.3V ?
YES
END
10-21
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Flow Chart of Troubleshooting
2 0 4 V
0 1 4 D Z
9 0 4 D Z
8 0 4 D Z
7 0 4 D Z
3 0 4 V
1 0 4 D Z
0 0 4 D Z
D D V
D D V
D D V
D D V
D D V
S S V
S S V
D D V
D N G
-
N I O N O M
2 T U O L
+ N I O N O M
2 T U O R
D N G P H
R N I E N I
L
L
L N I E N I
E D O M
1 T U O L
1 T U O R
B S C
3 T U O
N I D S
T U O O N O M
D N G L L P
K L C S
D N G
D N G
D N G
10-22
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Flow Chart of Troubleshooting
10-23
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Flow Chart of Troubleshooting
10-24
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Flow Chart of Troubleshooting
10-2. RF
10-2-1. GSM900 RX
Continuous RX ON
RF Input : 62 CH
AMP : -50dBm
①
NO
NO
NORMAL CONDITION
Catch the channel ?
Check soldered status of
L103, C101, C104, L101
YES
②
F100 Check
RFS101, C100
Resolder or Change
≥
Pin #17
-65dBm ?
YES
③
NO
NO
F100 Check
F100 Resolder or Change
≥
Pin #5,6
-65dBm ?
YES
④
UCD100 Check
Check soldered status of
L108, L109, C121
≥
Pin#6,7
-65dBm ?
YES
NO
NO
UCD100 Check
Pin#27 =1.8V ?
CHECK UCD301
YES
⑤
UCD100 Check
Pin#34 =Clean 2.8V?
C113, UCD301
Check or resolder
YES
UCD100 Check
Pin#35,36,37,38=100mV?
NO
YES
⑦
UCD100 Check
Pin #21 : 26MHz ?
Vpp : 1.1V?
TCX101 Check
Pn#3 : Freq =26MHz,
Vpp=1.2V?
NO
NO
TCX101
Check & resolder
YES
YES
⑥
UCD100
Change or resolder
UCD100
Check & resolder
Check UCD301
10-25
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Flow Chart of Troubleshooting
10-26
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Flow Chart of Troubleshooting
10-2-2. GSM1800 RX
Continuous RX ON
RF Input : 62 CH
AMP : -50dBm
①
NO
NO
NORMAL CONDITION
Catch the channel ?
Check soldered status of
L103, C101, C104, L101
YES
②
F100 Check
RFS101, C100
Resolder or Change
≥
Pin #17
-65dBm ?
YES
③
NO
NO
F100 Check
F100 Resolder or Change
≥
Pin #3,4
-65dBm ?
YES
④
UCD100 Check
Check soldered status of
R135, R136, L106
≥
Pin#8,9
-65dBm ?
YES
NO
NO
UCD100 Check
Pin#27 =1.8V ?
CHECK UCD301
YES
⑤
UCD100 Check
Pin#34 =Clean 2.8V?
C113, UCD301
Check or resolder
YES
UCD100 Check
Pin#35,36,37,38=100mV?
NO
YES
⑦
UCD100 Check
Pin #21 : 26MHz ?
Vpp : 1.1V?
TCX101 Check
Pn#3 : Freq =26MHz,
Vpp=1.2V?
NO
NO
TCX101
Check & resolder
YES
YES
⑥
UCD100
Change or resolder
UCD100
Check & resolder
Check UCD301
10-27
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Flow Chart of Troubleshooting
10-2-3. GSM1900 RX
Continuous RX ON
RF Input : 62 CH
AMP : -50dBm
①
NO
NO
NORMAL CONDITION
Catch the channel ?
Check soldered status of
L103, C101, C104, L101
YES
②
F100 Check
RFS101, C100
Resolder or Change
≥
Pin #17
-65dBm ?
YES
③
NO
NO
F100 Check
F100 Resolder or Change
≥
Pin #1,2
-65dBm ?
YES
④
UCD100 Check
Check soldered status of
L110, L111, L107
≥
Pin#10,11 -65dBm ?
YES
NO
NO
UCD100 Check
Pin#27 =1.8V ?
CHECK UCD301
YES
⑤
UCD100 Check
Pin#34 =Clean 2.8V?
C113, UCD301
Check or resolder
YES
UCD100 Check
Pin#35,36,37,38=100mV?
NO
YES
⑦
UCD100 Check
Pin #21 : 26MHz ?
Vpp : 1.1V?
TCX101 Check
Pn#3 : Freq =26MHz,
Vpp=1.2V?
NO
NO
TCX101
Check & resolder
YES
YES
⑥
UCD100
Change or resolder
UCD100
Check & resolder
Check UCD301
10-28
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This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
10-2-4. GSM850 RX
Continuous RX ON
RF Input : 62 CH
AMP : -50dBm
①
NO
NO
NORMAL CONDITION
Catch the channel ?
Check soldered status of
L103, C101, C104, L101
YES
②
F100 Check
RFS101, C100
Resolder or Change
≥
Pin #17
-65dBm ?
YES
③
NO
NO
F100 Check
F100 Resolder or Change
≥
Pin #7,8
-65dBm ?
YES
④
UCD100 Check
Check soldered status of
L104, L105, C120
≥
Pin#4,5
-65dBm ?
YES
NO
NO
UCD100 Check
Pin#27 =1.8V ?
CHECK UCD301
YES
⑤
UCD100 Check
Pin#34 =Clean 2.8V?
C113, UCD301
Check or resolder
YES
UCD100 Check
Pin#35,36,37,38=100mV?
NO
YES
⑦
UCD100 Check
Pin #21 : 26MHz ?
Vpp : 1.1V?
TCX101 Check
Pn#3 : Freq =26MHz,
Vpp=1.2V?
NO
NO
TCX101
Check & resolder
YES
YES
⑥
UCD100
Change or resolder
UCD100
Check & resolder
Check UCD301
10-29
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Flow Chart of Troubleshooting
10-2-5. GSM850 / GSM900 TX
①
NO
NO
F100
Pin#13 = High?
F100 Pin#17
About 2~3 dBm?
UCD301
Check / Change
YES
YES
Level of
F100 Pin#12 is
4~5dBm ?
RFS101, C100
Check / Change
NO
YES
②
F100
Check & Change
NO
C108
= 3.7V?
Check the
Battery Block
YES
③
NO
NO
Level of
PAM101
Pin #6 is
1.2V?
YES
Check
Check UCD301 TXP
UCD100 pin#3
is high?
YES
④
R104
Check & Resolder
YES
PAM101
pin#12
About -5 dBm?
NO
①
NO
PAM101 pin#1
High ?
Check UCD301
YES
⑤
Change PAM101
⑥
NO
UCD100 Check
C113, UCD301
Check or resolder
≥
Pin#34
2.8V ?
YES
⑦
TCX101 Check
Pn#1 : Freq=26MHz,
Vpp=1.2V?
NO
NO
UCD100 Check
TCX101
Check & resolder
Pin #21 : 26MHz ?
Vpp : 1.2V?
YES
YES
⑧
NO
UCD100 Pin
#38, = 1.7V?
UCD100
Check & resolder
YES
⑤
⑨
Change PAM101
Check U102
10-30
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Flow Chart of Troubleshooting
10-31
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Flow Chart of Troubleshooting
10-2-6. DCS1800 & PCS1900 TX
①
NO
NO
F100
Pin#11 = High?
F100 Pin#17
About 2~3 dBm?
UCD301
Check / Change
YES
YES
Level of
F100 Pin#10 is
4~5dBm ?
RFS101, C100
Check / Change
NO
YES
②
F100
Check & Change
NO
C108
= 3.7V?
Check the
Battery Block
YES
③
NO
NO
Level of
PAM101
Pin #6 is
1.2V?
YES
Check
Check UCD301 TXP
UCD100 pin#3
is high?
YES
④
R104
Check & Resolder
YES
PAM101
pin#12
About -5 dBm?
NO
①
NO
PAM101 pin#1
High ?
Check UCD301
YES
⑤
Change PAM101
⑥
NO
UCD100 Check
C113, UCD301
Check or resolder
≥
Pin#34
2.8V ?
YES
⑦
TCX101 Check
Pn#1 : Freq=26MHz,
Vpp=1.2V?
NO
NO
UCD100 Check
TCX101
Check & resolder
Pin #21 : 26MHz ?
Vpp : 1.2V?
YES
YES
⑧
NO
UCD100 Pin
#38, = 1.7V?
UCD100
Check & resolder
YES
⑤
⑨
Change PAM101
Check U102
10-32
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Flow Chart of Troubleshooting
2 1 1 L
3
C C V
N O M O
A N E G
2 3
3 3
L
I
D V
E N U T X
4 3
5 3
0 2
9 1
P I _ X T |
_ X T |
P
I
F U B X | Z H M 6 2 _ Z H M 3 1
M
I
M I
J
D A F P L
6 3
7 3
8 1
7 1
M Q _ X T | M Q
P Q _ X T | P Q
N P M O C
P P M O C
8 3
9 3
6 1
5 1
B L X T
B H X T
D N G
C P A V
N I
F R X T
C C V
A N E X R
0 4
1 4
4 1
3 1
4
2 1
1
2
3
4
G
A
C
G
10-33
SAMSUNG Proprietary-Contents may change without notice
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11. PCB Diagrams
HDC401
ANT101
ANT100
U406
HDC301
ZD303
PAM101
U101TCX101
ZD203
U204
U202
U404
BAT300
ZD302
TP208
TP200
TP203 TP201 TP202 TP204TP205TP206
HDC300
V309
V310
V312
ZD310
V311
V307
V306
V403
V402
U304
ZD404
SIM301
Q301
G3
G4
11-1
SAMSUNG Proprietary-Contents may change without notice
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PCB Diagrams
TP301
ZD407
Q400
Q403
Q402
D401
ZD408
ZD400
OSC401
UME201
UCP201
TP216
TP215
ZD307
ZD308
ZD309
Q401
UCD401
ZD306
ZD305
MOD100
U301
Q100
U402
U300
F301
BTC400
F302 F303F304
11-2
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12. Block Diagrams
12-1
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13. Reference data
13-1. Reference Abbreviate
AAC: Advanced Audio Coding.
AVC : Advanced Video Coding.
BER : Bit Error Rate
BPSK: Binary Phase Shift Keying
CA : Conditional Access
CDM : Code Division Multiplexing
C/I : Carrier to Interference
DMB : Digital Multimedia Broadcasting
EN : European Standard
ES : Elementary Stream
ETSI: European Telecommunications Standards Institute
MPEG: Moving Picture Experts Group
PN : Pseudo-random Noise
PS : Pilot Symbol
QPSK: Quadrature Phase Shift Keying
RS : Reed-Solomon
SI : Service Information
TDM : Time Division Multiplexing
TS : Transport Stream
13-1
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