PRODUCT MANUAL
ST1.3 Series
ST612712DEG
ST612712DE
ST610712DEG
ST610712DE
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
Rev. C
February 2007
Contents
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Drive care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Handling precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Drive specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Power, access times and acoustics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Formatted capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Default logical geometry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recording and interface technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Time to ready. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Power specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Conducted noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Voltage tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power-management modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Environmental specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Temperature gradient. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Altitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Vibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Electromagnetic immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Agency certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Safety certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
FCC verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Configuring and mounting the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Handling and static discharge precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Drive installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Mounting considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Interface description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.1 Connector interface signals and connector pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Supported ATA commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Identify Device command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Set Features command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.0
Seagate Technology support services. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
ST1.3 Series Product Manual, Rev. C
i
ii
ST1.3 Series Product Manual, Rev. C
List of Figures
ST1.3 Series IDE interface (ZIF connector) disc drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
ST1.3 Series breather hole location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
ST1.3 Series improper handling example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Typical 3.3V startup and operation current profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Location where tri-axial accelerometer will be placed on ST1.3 Series drives . . . . . . . . . . . . 12
Drive axis definition for ST1.3 Series drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
ST1.3 Series proper handling example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
ST1.3 Series improper handling example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
ST1.3 Series mechanical dimensions—top, bottom, side and end view . . . . . . . . . . . . . . . . 23
Figure 10. ST1.3 Series Area for Protective Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 11. ST1.3 Series Mounting Drive using FPC with Multiple Bends . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 12. ST1.3 Series ZIF connector with Groove for FPC with Tab . . . . . . . . . . . . . . . . . . . . . . . . . . 24
ST1.3 Series Product Manual, Rev. C
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iv
ST1.3 Series Product Manual, Rev. C
1.0
Introduction
This manual describes the functional, mechanical and interface specifications for the following Seagate® ST1.3
Series drives:
• ST612712DE-12GB, ST610712DE-10GB, ST680712DE-8GB and ST660712DE-6GB disc drives with a ZIF
(zero insertion force) connector using an IDE interface.
• ST612712DEG-12GB, ST610712DEG-10GB, ST680712DEG-8GB and ST660712DEG-6GB disc drives
with a ZIF (zero insertion force) connector using an IDE interface. These models incorporate an additional
free-fall sensor for robust drop performance.
These drives provide the following key features.
• 3,600-RPM spindle speed and a 2-Mbyte buffer combined for superior read/write performance.
• Quiet operation. Fluid Dynamic Bearing (FDB) motor.
• Giant magnetoresistive (GMR) recording heads and EPRML technology, which provide the drives with
increased areal density.
• State-of-the-art cache and on-the-fly error-correction algorithms.
• 2.0K Gs nonoperating shock, and 300 Gs operating shock.
• SeaTools™ diagnostic software performs a drive self-test that eliminates unnecessary drive returns.
Figure 1.
ST1.3 Series IDE interface (ZIF connector) disc drive
ST1.3 Series Product Manual, Rev. C
1
1.1
Disclaimer
Seagate Technology LLC makes no warranties whatsoever, including any warranty of merchantability, non-
infringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specifi-
cation or sample. Seagate may not be held liable for any direct, indirect, incidental, special, exemplary, or con-
sequential damages (including, but not limited to, loss of use, data, or profits; procurement of substitute goods
or services; or business interruptions) however caused and on any theory of liability, whether in contract, strict
liability, or tort (including negligence or otherwise) arising in any way from the use of this kit, even if advised of
the possibility of such damage.
1.2
Drive care
Do not use the ST1.3 Series disc drives outside of the ranges of environmental conditions found in Section 2.8,
"Environmental specifications." Doing so may void the warranty of the ST1.3 Series disc drive.
1.3
Handling precautions
• Do not cover or seal the breather hole! Covering or sealing the breather hole may result in loss of data.
Figure 2.
ST1.3 Series breather hole location
• Do not apply any force to the drive during handling or installation.
• When handling the drive, wear an wrist strap that is properly grounded to prevent damage from electrostatic
discharge (ESD).
• Handle the drive carefully by the edges. Do not touch any exposed printed circuit board or the top cover.
• The drive is fragile—handle it with care. Do not press down on the top cover or attempt to use a pen to write
on the drive’s label. Do not apply more than 0.2 kg of force to the top cover.
Figure 3.
ST1.3 Series improper handling example
• Do not drop the drive.
• Do not expose the drive to wet conditions.
• Do not place the drive near a strong magnetic field.
• Do not expose the drive to extreme temperatures.
• The drive may become hot during operation. Be careful when removing the drive from the host device
immediately after operation.
2
ST1.3 Series Product Manual, Rev. C
2.0
Drive specifications
Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal
power. For convenience, the phrases the drive and this drive are used throughout this manual to indicate
ST612712DE, ST612712DEG, ST610712DE, ST610712DEG, ST680712DE, ST680712DEG, ST660712DE
and ST660712DEG model drives.
2.1
Power, access times and acoustics
The specifications listed in this table are for quick reference. For details on specification measurement or defi-
nition, see the appropriate section of this manual.
Table 1:
Specifications
ST612712DEG ST610712DEG ST680712DEG ST660712DEG
Drive specification
ST612712DE
ST610712DE
ST680712DE
ST660712DE
Formatted Gbytes
12.0
10.0
8.0
6.0
Guaranteed sectors
23,438,016
19,533,024
15,625,008
11,719,008
Physical heads
2/1
Physical discs
1
Bytes per sector (logical)
512
Cache (Mbytes)
2
Recording density, BPI (bits/inch max)
Track density. TPI (tracks/inch max)
Areal density (Gbits/inch2 max)
Spindle speed (RPM)
933,000
140,000
130.6
3,600
Internal data transfer rate OD (Mbits/sec max)
Sustained data transfer rate OD (Mbytes/sec)
I/O data-transfer rate (Mbytes/sec max)
ATA data-transfer modes supported
130.0
10.2
66.7 (UDMA 4)
PIO modes 0–4;
Multiword DMA modes 0-2;
Ultra DMA modes 0–4
Height (max)
5.1 mm (0.2009 inches)
Width
40.0 +/-0.2 mm (1.5748 +/-0.008 inches)
Length
30.0 +/-0.2 mm (1.1811 +/-0.008 inches)
Weight
13.6 gm - 0.3000 lb. (typ)
Average latency (msec)
8.3
Power-on to ready (sec typical / max) (without retry)
Standby to ready (sec typical / max) (without retry)
1.0 / 2.5
1.0 / 2.5
330 mA
Startup current 3.3v (peak)
(maximum RMS in 10ms window)
Seek power (typical 3.3V)
154 mA
ST1.3 Series Product Manual, Rev. C
3
Table 1:
Specifications
ST612712DEG ST610712DEG ST680712DEG ST660712DEG
Drive specification
ST612712DE
ST610712DE
ST680712DE
ST660712DE
Read/write power (typical 3.3V)
Performance idle mode (typical 3.3V)
Low power idle mode (typical 3.3V)
Standby/Sleep mode (typical 3.3V)
Voltage tolerance (including noise)
Ambient temperature
230/240 mA
140 mA
77 mA
13 mA
3.3V ± 5%
0° to 60°C (operating)
–40° to 70°C (nonoperating)
Temperature gradient (°C per hour max)
Relative humidity (noncondensing)
20°C (operating)
30°C (nonoperating)
5% to 90% (operating)
5% to 95% (nonoperating)
Relative humidity gradient
30% per hour max
Wet bulb temperature (°C max)
33°C (operating)
40°C (nonoperating)
Altitude, operating
–60.98 m to 3,048 m (–200 ft to 10,000+ ft)
Altitude, nonoperating (below mean sea level, max)
Shock, operating (Gs max at 1 msec)
Shock, nonoperating (Gs max at 1 msec)
–60.98 m to 12,192 m (–200 ft to 40,000+ ft)
300
2000
Vibration, operating
1.0 Gs (0 to peak, 10–500 Hz) @ 2 oct/min sweep rate
(max displacement may apply below 10 hz)
Vibration, nonoperating
5.0 Gs (0 to peak, 10–500 Hz) @ 0.5 oct/min sweep rate
(max displacement may apply below 22 hz)
Drive acoustics, sound power (bels)
Idle (typical / max)
1.6/ 1.9
1.7 / 2.0
Operational (typical / max)
Nonrecoverable read errors
Load/Unload (LUL) cycles (25°C)
14
1 per 10 bits read
300,000 software-controlled power on/off cycles
20,000 hard power on/off cycles
Warranty
Per agreement
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ST1.3 Series Product Manual, Rev. C
2.2
Formatted capacity
Model
Formatted capacity Guaranteed sectors Bytes per sector
ST612712DEG
ST612712DE
12.0 Gbytes
10.0 Gbytes
8.0 Gbytes
6.0 Gbytes
23,438,016
19,533,924
15,625,008
11,719,008
512
512
512
512
ST610712DEG
ST610712DE
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
2.3
Default logical geometry
Model
Cylinders Read/write heads Sectors per track
ST612712DEG
ST612712DE
ST610712DEG
ST610712DE
16,383
16
63
ST680712DEG
ST680712DE
ST660712DEG
ST660712DE
LBA mode
When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1,
where n is the number of guaranteed sectors as defined above.
ST1.3 Series Product Manual, Rev. C
5
2.4
Recording and interface technology
Technology
Interface
Specification
Seagate (ZIF) Flex Connector (35-way)
Recording method
Perpendicular Magnetic Recording
Recording density BPI (bits/inch max)
Track density TPI (tracks/inch max)
933,000
140,000
130.6
2
Areal density (Gbits/inch max)
Spindle speed (RPM) (± 0.2%)
Internal data-transfer rate OD (Mbits/sec max)
Sustained data transfer rate OD (Mbytes/sec max)
I/O data-transfer rate (Mbytes/sec max)
Interleave
3,600
130.0
10.2
66.7 (UDMA 4)
1:1
Cache buffer
All models
2 Mbytes (2,048 Kbytes)
2.5
Physical characteristics
Height
Width
(mm)
(inches)
5.1 (max)
0.2007 (max)
(mm)
(inches)
40.0 +/-0.2
1.5748 +/-0.008
Length
(mm)
(inches)
30.0 +/-0.2
1.1811 +/-0.008
Typical weight
(grams)
(pounds)
13.6 (typ)
0.030 (typ)
Interface Connector
Seagate (ZIF) Flex Connector (35-way)
2.6
Time to ready
Time to ready
Typical
1.0
Max (without retry)
Power-On to Ready (sec)
Standby to Ready (sec)
2.5
2.5
1.0
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ST1.3 Series Product Manual, Rev. C
2.7
Power specifications
The drive receives DC power (+3.3V) through the ZIF (IDE interface) connector for ST612712DE,
ST612712DEG, ST610712DE, ST610712DEG, ST680712DEG, ST680712DE, ST660712DEG and
ST660712DE models.
2.7.1
Power consumption
Power requirements for the drives are listed in the table on page 8. Typical power measurements are based on
an average of drives tested, under nominal conditions, using +3.3V input voltage at 25°C ambient temperature.
• Spinup power
Spinup power is measured from the time of power-on to the time that the drive spindle reaches operating speed.
• Seek mode
During seek mode, the read/write actuator arm moves toward a specific position on the disc surface and does
not execute a read or write operation. Servo electronics are active. Seek mode power is measured based on
three random seek operations every 100 msecs. This mode is not typical.
• Read/write power and current
Read/write power is measured with the heads on track, at the moment while the head is writing/reading
from/to disc. It is performed with 100 percent duty cycle of write/read operation.
• Low power idle mode
Spindle motor is working normally with actuator unloaded to the parked position.
• Standby mode / Sleep mode
During Standby mode, the drive accepts commands, but the drive is not spinning, and the servo and read/
write electronics are in power-down mode.
ST1.3 Series Product Manual, Rev. C
7
Table 2:
DC power
ST1.3 Series Power Consumption (W)
Max current the average of the peak value in 10ms window
Average 3.3V (mA)
Max 3.3V (mA)
Current
270
180
190
240
230
154
140
77
330
300
200
300
300
161
147
86
Spinup
Load/Unload current
Write
Read
Seek
Performance idle
Low power idle
Standby/Sleep
13
18
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and
power to operational levels.
2.7.1.1
Typical current profile
Figure 4.
Typical 3.3V startup and operation current profile
8
ST1.3 Series Product Manual, Rev. C
2.7.2
Conducted noise
Input noise ripple is measured at the host system power supply across an equivalent 15-ohm resistive load on
the +3.3 volt line.
Using 3.3-volt power, the drive is expected to operate with a maximum of 70 mV peak-to-peak square-wave
injected noise at up to 20 MHz.
Note. Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write
current.
2.7.3
Voltage tolerance
Voltage tolerance (including noise):
3.3V ± 5%
ST1.3 Series Product Manual, Rev. C
9
2.7.4
Power-management modes
The drive provides programmable power management to provide greater energy efficiency. The drive features
the following power-management modes:
Table 3:
Power-management modes
Power modes
Active (operating)
Idle, performance
Idle, low power
Standby/Sleep
Heads
Spindle
Rotating
Rotating
Stopped
Stopped
Buffer
Tracking
Tracking
Parked
Parked
Enabled
Enabled
Disabled
Disabled
• Active mode
The drive is in Active mode during the read/write and seek operations.
• Low power idle mode
Drive enters Low Power Idle mode from Performance Idle mode when the Advanced Power Management
Level is set between FDh and 80h, and the Idle timer is reached at 2 seconds (default setting is 2 seconds).
Disc is not spinning and heads are parked and drive accepts all commands and returns to Active mode any
time disc access is necessary.
• Performance idle mode
The buffer remains enabled, and the drive accepts all commands and returns to Active mode any time disc
access is necessary.
• Standby/Sleep mode
The drive enters Standby mode when the host sends a Standby Immediate command. If the host has set the
standby timer, the drive can also enter Standby mode automatically after the drive has been inactive for a
specifiable length of time. The standby timer delay is established using a Standby or Idle command. In Standby
mode, the drive buffer is disabled, the heads are parked and the spindle is at rest. The drive accepts all
commands and returns to Active mode any time disc access is necessary.
• Standby timers
Each time the drive performs an Active function (such as read, write or seek), the standby timer is reinitialized
and begins counting down from its specified delay times to zero. If the standby timer reaches zero before any
drive activity is required, the drive makes a transition to Standby mode. In both Idle and Standby mode, the
drive accepts all commands and returns to Active mode when disc access is necessary.
10
ST1.3 Series Product Manual, Rev. C
2.8
Environmental specifications
Ambient temperature
2.8.1
Ambient temperature is defined as the temperature of the environment immediately surrounding the drive.
Actual drive case temperature should not exceed 70°C (158°F) within the operating ambient conditions. Case
temperature of the drive operating at 60°C ambient may hit a maximum of 70°C at certain parts of the casing.
Above 1,000 feet (305 meters), the maximum temperature is derated linearly by 1°C every 1000 feet.
Operating
0° to 60°C (32° to 140°F)
(70°C max case temperature)
Nonoperating
–40° to 70°C (–40° to 158°F)
2.8.2
Temperature gradient
Operating
20°C per hour (36°F per hour max), without condensation
30°C per hour (54°F per hour max), without condensation
Nonoperating
2.8.3
Humidity
2.8.3.1
Relative humidity
Operating 5% to 90% noncondensing (30% per hour max)
Nonoperating 5% to 95% noncondensing (30% per hour max)
2.8.3.2
Wet bulb temperature
[1] Operating: Wet bulb temperature is calculated by the operating Temperature and the Relative Humidity levels.
[2] Nonoperating: Wet bulb temperature is calculated by the nonoperating Temperature and the Relative Humidity levels.
2.8.4
Altitude
Operating
–60.98 m to 3,048 m (–200 ft to 10,000+ ft)
–60.98 to 12,192 m (–200 ft to 40,000+ ft)
Nonoperating
ST1.3 Series Product Manual, Rev. C
11
2.8.5
Shock
All shock measurements in this section are carried out at drive level. For all linear shock test, operating or non-
operating, the input shock level shall be measured at the frame of the disk drive at the specific location indi-
Figure 5.
Location where tri-axial accelerometer will be placed on ST1.3 Series drives
All shock test will cover all the 6 directions, +/- x, y and z axes. The drive axis definition in shown in Figure 6
below.
Figure 6.
2.8.5.1
Drive axis definition for ST1.3 Series drives
Operating shock
The drive will be subjected to 10 shocks for each direction. During the shocks, there must be a minimum delay
of 3 seconds between shock pulses. Soft errors and automatic retries are allowed during the test. No data loss
or permanent damage occurs during a half sine shock pulse of:
300 Gs, 1 msec
2.8.5.2
Nonoperating shock
The nonoperating shock level that the drive can experience without incurring any physical damage when sub-
sequently put into operation is 2000 Gs. The same applies for shock levels of 2000 Gs, 1 msec pulse duration
on fresh drives for each level.
2.8.6
Vibration
All vibration specifications assume that the drive is mounted securely in a fixture that does not have fixture
resonances in the frequency test range.
12
ST1.3 Series Product Manual, Rev. C
2.8.6.1
Operating sweep sine vibration
The following lists the maximum operating sweep sine vibration levels that the drive may experience while
meeting the performance standards specified. It will consist of a forward and backward sweep from 10 Hz to
500 Hz to 10 Hz. The drive will operate without a hard error while being subjected to the following vibration
levels.
10 Hz to 500 Hz @ 2 oct/min
1.0 Gs (0 to pk). Maximum displacement may apply below 10 Hz.
2.8.6.2
Operating random vibration
The test consists of 30 minutes of random vibration using the power spectral density (PSD) levels specified in
the table below. The vibration test level is 0.67 Gs RMS. The drive will operate without a hard error while being
subjected to the following vibration levels.
Table 4:
Operating random vibration profile
Frequency (Hz)
G2/Hz
17
45
1.1 x E-03
1.1 x E-03
8.0 x E-03
8.0 x E-03
1.0 x E-03
1.0 x E-03
5.0 x E-04
5.0 x E-04
48
62
65
150
200
500
2.8.6.3
Nonoperating sweep sine vibration
The following table lists the maximum nonoperating sweep sine vibration levels that the drive may experience
while meeting the performance standards specified. It will consist of a forward and backward sweep from 5 Hz
to 500 Hz to 5 Hz. The drive will not incur any physical damage when subsequently put into operation.
10 Hz to 500 Hz @ 0.5 oct/min
5 Hz to 10 Hz
5.0 Gs (0 to pk). Maximum displacement may apply below 22 Hz.
25.4 mm peak to peak displacement.
ST1.3 Series Product Manual, Rev. C
13
2.8.6.4
Nonoperating random vibration
The test consists of 15 minutes of random vibration using the power spectral density (PSD) levels specified in
the table below. The vibration test level is 3.01 Gs RMS. The drive will not incur any physical damage when
subsequently put into operation.
Table 5:
Nonoperating random vibration profile.
Frequency (Hz)
G2/Hz
2.5
5
1.0 x E-03
3.0 x E-02
1.8 x E-02
1.8 x E-02
40
500
2.8.6.5
Corrosive environment
Seagate electronic drive components pass accelerated corrosion testing equivalent to ten years of exposure to
light industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM
B845. However, this accelerated testing cannot duplicate every potential application environment.
Users should use caution exposing any electronic components to uncontrolled chemical pollutants and corro-
sive chemicals as electronic drive component reliability can be affected by the installation environment. The sil-
ver, copper, nickel and gold films used in Seagate products are especially sensitive to the presence of sulfide,
chloride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic components
should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or
exposed to an ambient relative humidity greater than 95 percent. Materials used in cabinet fabrication, such as
vulcanized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of
any electronic equipment may be extended by replacing materials near circuitry with sulfide-free alternatives.
14
ST1.3 Series Product Manual, Rev. C
2.9
Acoustics
Drive acoustics are measured as overall A-weighted acoustic sound power levels (no pure tones). Discrete
tone penalties are added to the A-weighted sound power (LW) with the following formula only when determin-
ing compliance:
LWt(spec) == LW + 0.1Pt + 0.3 < 4.0 (Bels)
where
LW = A-weighted sound power level
pt == Value of discrete tone penalty [==dLt-6.0 (dBA)]
dLt = Tone-to-noise ratio taken in accordance with ISO 7779.
All measurements are consistent with ISO document 7779. Sound power measurements are taken under
essentially free-field conditions over a reflecting plane. For all tests, the drive is oriented with the cover facing
upward.
Note. For seek mode tests, the drive is placed in seek mode only. The number of seeks per second is defined
by the following equation:
(Number of seeks per second = 0.4 / (average latency + average access time)
Table 6:
Drive level acoustics
Acoustic mode
Idle
Operational
1.6 bels (typ)
1.7 bels (max)
1.9 bels (typ)
2.0 bels (max)
2.10
Electromagnetic immunity
When properly installed in a representative host system, the drive operates without errors or degradation in
performance when subjected to the radio frequency (RF) environments defined in the following table:
Table 7:
Electromagnetic immunity
Performance
level
Reference
standard
Test
Description
Radiated RF immunity
80 to 1,000 MHz, 3 V/m,
80% AM with 1 kHz sine
900 MHz, 3 V/m, 50% pulse modulation @ 200
Hz
A
EN 61000-4-3: 96
ENV 50204: 95
Electrical fast transient
Surge immunity
± 1 kV on AC mains, ± 0.5 kV on external I/O
± 1 kV differential, ± 2 kV common, AC mains
B
B
A
EN 61000-4-4: 95
EN 61000-4-5: 95
EN 61000-4-6: 97
Conducted RF immunity
150 kHz to 80 MHz, 3 Vrms, 80% AM with 1
kHz sine
Voltage dips, interrupts
0% open, 5 seconds
0% short, 5 seconds
40%, 0.10 seconds
70%, 0.01 seconds
C
C
C
B
EN 61000-4-11: 94
ST1.3 Series Product Manual, Rev. C
15
2.11
Reliability
Measurement type
Specification
14
Nonrecoverable read errors
1 per 10 bits read, max.
Load/Unload (LUL) cycles (25°C)
300,000 software-controlled power on/off cycles
20,000 hard power on/off cycles
Power On Hours (POH)
Warranty
500 hours
Per agreement
16
ST1.3 Series Product Manual, Rev. C
2.12
Agency certification
Safety certification
2.12.1
The drives are recognized in accordance with UL60950-1, CAN/CSA-C22.2 No.60950-1, EN60950 and IEC
60950.
2.12.2
Electromagnetic compatibility
Hard drives that display the CE mark comply with the European Union (EU) requirements specified in the Elec-
tromagnetic Compatibility Directive (89/336/EEC). Testing is performed to the levels specified by the product
standards for Information Technology Equipment (ITE). Emission levels are defined by EN 55022, Class B and
the immunity levels are defined by EN 55024.
Seagate uses an independent laboratory to confirm compliance with the EC directives specified in the previous
paragraph. Drives are tested in representative end-user systems. Although CE-marked Seagate drives comply
with the directives when used in the test systems, we cannot guarantee that all systems will comply with the
directives. The drive is designed for operation inside a properly designed enclosure, with properly shielded I/O
cable (if necessary) and terminators on all unused I/O ports. Computer manufacturers and system integrators
should confirm EMC compliance and provide CE marking for their products.
Korean RRL
If these drives have the Korea Ministry of Information and Communication (MIC) logo, they comply with para-
graph 1 of Article 11 of the Electromagnetic Compatibility control Regulation and meet the Electromagnetic
Compatibility (EMC) Framework requirements of the Radio Research Laboratory (RRL) Ministry of Information
and Communication Republic of Korea.
These drives have been tested and comply with the Electromagnetic Interference/Electromagnetic Susceptibil-
ity (EMI/EMS) for Class B products. Drives are tested in a representative, end-user system by a Korean-recog-
nized lab.
• EUT name (model numbers): ST612712DE, ST612712DEG, ST610712DE, ST610712DEG, ST680712DEG,
ST680712DE, ST660712DEG and ST660712DE
Certificate numbers:
ST612712DEG, ST612712DE, ST610712DEG, ST610712DE
ST680712DEG, ST680712DE, ST660712DEG and ST660712DE
STX-S103 (B)
• Trade name or applicant: Seagate Technology LLC
• Manufacturing date: July 2006
• Manufacturer/nationality: Seagate Technology International
Australian C-Tick (N176)
If these models have the C-Tick marking, they comply with the Australia/New Zealand Standard AS/NZS3548
1995 and meet the Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communi-
cation Authority (ACA).
2.12.3
European Union Restriction of Hazardous Substances (RoHS) Directive
Seagate designs its products to meet environmental protection requirements worldwide, including regulations
restricting certain chemical substances. A new law, the European Union Restriction of Hazardous Substances
(RoHS) Directive, will restrict the presence of chemical substances, including Lead (Pb), in electronic products,
effective July 2006. The Directive's requirements have not been finalized. This drive is manufactured with com-
ponents and materials that are expected to comply with the RoHS Directive when the Directive takes effect.
ST1.3 Series Product Manual, Rev. C
17
2.12.4
2.12.4
China Restriction of Hazardous Substances (RoHS) Directive
中国限制危险物品的指令
This product has an Environmental Protection Use Period (EPUP) of 20 years. The following
table contains information mandated by China's "Marking Requirements for Control of Pollution
Caused by Electronic Information Products" Standard.
"O" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is lower
than the threshold defined by the China RoHS MCV Standard.
“O"表示该部件（于同类物品程度上）所含的危险和有毒物质低于中国RoHS MCV标准所定义的门槛值。
"X" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is over
the threshold defined by the China RoHS MCV Standard.
“X "表示该部件（于同类物品程度上）所含的危险和有毒物质超出中国RoHS MCV标准所定义的门槛值。
2.12.5
FCC verification
These drives are intended to be contained solely within a personal computer or similar enclosure (not attached
as an external device). As such, each drive is considered to be a subassembly even when it is individually mar-
keted to the customer. As a subassembly, no Federal Communications Commission verification or certification
of the device is required.
Seagate Technology LLC has tested this device in enclosures as described above to ensure that the total
assembly (enclosure, disc drive, motherboard, power supply, etc.) does comply with the limits for a Class B
computing device, pursuant to Subpart J, Part 15 of the FCC rules. Operation with noncertified assemblies is
likely to result in interference to radio and television reception.
Radio and television interference. This equipment generates and uses radio frequency energy and if not
installed and used in strict accordance with the manufacturer’s instructions, may cause interference to radio
and television reception.
This equipment is designed to provide reasonable protection against such interference in a residential installa-
tion. However, there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause interference to radio or television, which can be determined by turning the equipment on and off,
you are encouraged to try one or more of the following corrective measures:
• Reorient the receiving antenna.
• Move the device to one side or the other of the radio or TV.
• Move the device farther away from the radio or TV.
• Plug the computer into a different outlet so that the receiver and computer are on different branch outlets.
18
ST1.3 Series Product Manual, Rev. C
If necessary, you should consult your dealer or an experienced radio/television technician for additional sug-
gestions. You may find helpful the following booklet prepared by the Federal Communications Commission:
How to Identify and Resolve Radio-Television Interference Problems. This booklet is available from the Super-
intendent of Documents, U.S. Government Printing Office, Washington, DC 20402. Refer to publication num-
ber 004-000-00345-4.
ST1.3 Series Product Manual, Rev. C
19
20
ST1.3 Series Product Manual, Rev. C
3.0
Configuring and mounting the drive
This section contains the specifications and instructions for configuring and mounting the drive.
3.1
Handling and static discharge precautions
After unpacking, and before installation, the drive may be exposed to potential handling and electrostatic dis-
charge (ESD) hazards. Observe the following standard handling and static-discharge precautions:
Caution:
• Keep the drive in the electrostatic discharge (ESD) bag until you are ready for installation to limit the drive’s
exposure to ESD.
• Before handling the drives, put on a grounded wrist strap, or ground yourself frequently by touching the metal
chassis of a computer that is plugged into a grounded outlet. Wear a grounded wrist strap throughout the entire
installation procedure.
• Handle the drive only by its edges or frame.
Bend Radius
Corners
Drive ZIF Connector
Drive Base Plate
Mounting
Drive HDA Cover
Host ZIF Connector
Rubber to be at least
1mm thick. For better
shock protection,
thicker rubber is
better.
Host PCB
Figure 7.ST
1.3 Series
proper
handling example
• The drive is fragile—handle it with care. Do not press down
on the drive top cover or attempt to use a pen to write on
the drive’s label.
• Do not apply more than 0.2 kg of force to the top cover.
ST1.3 Series Product Manual, Rev. C
21
Figure 8.
ST1.3 Series improper handling example
• Always rest the drives on a padded, antistatic surface until you mount it in the system.
• Do not remove the factory-installed labels from the drive or cover them with additional labels. Removal voids
the warranty. Some factory-installed labels contain information needed to service the drive. Other labels are
used to seal out dirt and contamination.
• If provided, store drive in the protective casing when not in use.
• Turn the power off before installing or removing the drive.
• Do not cover the breather hole with any type of label, sticker, or impede the flow of air at any time.
3.2
Drive installation
Follow these installation precautions when inserting the drive:
• Follow instructions for the installation of data storage devices, provided with your device’s user manual.
• Do not obstruct the breather hole on the drive (see Figure 4).
22
ST1.3 Series Product Manual, Rev. C
3.3
Mounting considerations
• Use an elastic mounting material to protect drives so as to ensure that more shock can be absorbed.
• There are no guides along the side for mounting. Instead, refer to figure on areas (refer to Figure 10, high-
lighted in blue) where the mounting material can rest on.
• The drive can be operated in any orientation but horizontal or vertical orientation is preferred.
• Allow a minimum clearance of 0.030 inches (0.76 mm) around the entire perimeter of the drive for cooling,
with the exception of the mounting edges for better airflow.
• Our recommendation is to make as few bends on the flex cable as possible, the ideal being a flat cable. This
• The FPC may be bent in order to improve suspension of the disk. In case the system design warrants bend-
ing, care should be taken to maximize the radius.
• Mounting materials are available from many third-party vendors.
• The ZIF connector on ST1.3 has a groove for FPC with tab (refer to Figure 12), for better retention.
Measurements made for horizontal retention force using FPC with tab versus FPC without tab is
17.44 N vs. 7.69 N.
• The ZIF connector has a specification of 5 insertion cycles.
Figure 10. ST1.3 Series Area for Protective Mounting
Figure 11. ST1.3 Series Mounting Drive using FPC with Multiple Bends
Figure 12. ST1.3 Series ZIF connector with Groove for FPC with Tab
24
ST1.3 Series Product Manual, Rev. C
4.0
Interface description
These drives use the industry-standard ATA task file interface that supports 16-bit data transfers. It supports
ATA programmed input/output (PIO) modes 0–4; multiword DMA modes 0–2, and Ultra DMA modes 0–4. The
drive also supports the use of the IORDY signal to provide reliable high-speed data transfers.
For detailed information about the 35-way ZIF (IDE interface) connector, please contact your local Seagate
representative.
4.1
Connector interface signals and connector pins
The following table summarizes the signals on the 35-way ZIF (zero insertion force) IDE interface connector.
For a detailed description of these signals, please contact your local Seagate representative.
Table 8:
35-way ZIF (IDE interface) connector signals
In, Out
Type
Pin
Num
Signal
Name
1
2
GND
D10
Ground
Data bus bit 10
3
D09
Data bus bit 09
4
D02
Data bus bit 02
5
D08
Data bus bit 08
6
D01
Data bus bit 01
7
Res
Reserved. Do not connect
Data bus bit 0
8
D00
9
Res
Reserved. Do not connect
Address bus bit 0
DMA Acknowledge
Address bus bit 1
DMA Request
10
11
12
13
14
A00
DMACK-
A01
DMARQ
A02
Address bus bit 2
I/O Ready
15
IORDY
DMA ready during Ultra DMA data-in bursts
DMA strobe during Ultra DMA data-out bursts
16
17
18
19
20
RESET-
Res
Hard Reset
Reserved. Do not connect
3.3V Voltage supply to drive
3.3V Voltage supply to drive
Interrupt request
VCC
VCC
IRQ
I/O Write
Stop during DMA data bursts
21
IOWR-
ST1.3 Series Product Manual, Rev. C
25
Table 8:
35-way ZIF (IDE interface) connector signals
I/O Read
22
IORD-
DMA ready during Ultra DMA data-in bursts
DMA strobe during Ultra DMA data-out bursts
23
24
25
26
27
28
29
30
31
32
33
34
35
CS1-
CS0-
D15
D07
D14
D06
D13
D05
D12
D04
D11
D03
GND
Chip select 1
Chip select 0
Data bus bit 15
Data bus bit 07
Data bus bit 14
Data bus bit 06
Data bus bit 13
Data bus bit 05
Data bus bit 12
Data bus bit 04
Data bus bit 11
Data bus bit 03
Ground
Note. For ST1.3 Series, drive is operating in master-mode only, and the DASP# (Drive Active/Slave
Present) that is commonly used to drive LED light to indicate drive activity is not available.
26
ST1.3 Series Product Manual, Rev. C
4.1.1
Supported ATA commands
The following table lists ATA-standard commands that the drive supports. For a detailed description of the ATA
commands, refer to ATA version 7 specification, Volume 1. (www.t13.org).
Table 9:
Supported commands
Does command cause drive to
transition to active mode? [1]
Command name
Command code (in hex)
ATA-standard commands
Check Power Mode
Download Microcode
Flush Cache
Identify Device
Idle
98 E5
H,
H
92
X
X
H
E7
H
EC
H
97 E3
X
X
X
X
X
X
X
X
H,
H
H
H
Idle Immediate
Read DMA
95 E1
H,
C8 C9
H,
Read Multiple
Read Sectors
Seek
C4
H
20 21
H,
H
7X
H
Set Features
Set Multiple Mode
Sleep
EF
C6
H
H
99 E6
H,
H
Smart
B0h
X
X
X
X
X
X
Standby
96 E2
H, H
Standby Immediate
Write DMA
94 E0
H, H
CA CB
H,
H
Write Multiple
Write Sectors
C5
H
30 31
H,
H
[1] ‘X’ indicates: If the drive is in Standby mode, it will cause the drive to spin up to Active mode in order to
execute the command.
ST1.3 Series Product Manual, Rev. C
27
4.1.2
Identify Device command
The Identify Device command (command code EC ) transfers information about the drive to the host following
H
power up. The data is organized as a single 512-byte block of data, whose contents are shown in the table on
page 28. All reserved bits or words should be set to zero. Parameters listed with an “x” are drive-specific or
The following commands contain drive-specific features that may not be included in the Draft ATA-7 Standard.
Word
ATA specification
Value
Configuration information:
• Bit 15: 0 = ATA; 1 = ATAPI
• Bit 7: removable media
• Bit 6: removable controller
• Bit 0: reserved
0
848A
H
1
Number of logical cylinders
ATA-reserved
16,383
2
0000
16
H
3
Number of logical heads
Retired
4-5
6
0000
H
Number of logical sectors per logical track
Retired
003F
H
H
7-9
10–19
20
0000
Serial number: (20 ASCII characters, 0000 = none)
ASCII
H
Retired
0003
0100
0004
x.xx
H
H
H
21
Retired
22
Obsolete
23–26
Firmware revision (8 ASCII character string, padded with blanks to end of string)
ST612712DEG,
ST612712DE,
ST610712DEG,
ST610712DE,
ST680712DEG,
ST680712DE,
ST660712DEG,
ST660712DE
Drive model number:
(40 ASCII characters, padded with blanks to end of string)
27–46
47
(Bits 7–0) Maximum sectors per interrupt on Read multiple and Write multiple (16)
Reserved
8010
0000
H
H
48
49
Standard Standby timer, IORDY supported and may be disabled
ATA-reserved
0B00
H
H
H
H
H
50
0000
0200
0200
0007
51
PIO data-transfer cycle timing mode
Retired
52
53
Words 54-58, 64–70 and 88 valid
Number of current logical cylinders
Number of current logical heads
54
xxxx
xxxx
xxxx
xxxx
H
55
H
H
H
56
Number of current logical sectors per logical track
Current capacity in sectors
57-58
28
ST1.3 Series Product Manual, Rev. C
Word
ATA specification
Value
0100
59
Number of sectors transferred during a Read Multiple or Write Multiple command
H
Total number of user-addressable LBA sectors available
60–61
capacity xxxx
H
62
Retired
0000
H
63
Multiword DMA active and modes supported (see note following this table)
Advanced PIO modes supported (modes 3 and 4 supported)
Minimum multiword DMA transfer cycle time per word (120 nsec)
Recommended multiword DMA transfer cycle time per word (120 nsec)
Minimum PIO cycle time without IORDY flow control (240 nsec)
Minimum PIO cycle time with IORDY flow control (120 nsec)
ATA-reserved
xx07
H
64
0003
0078
0078
H
H
H
65
66
67
00F0
H
H
H
H
H
68
0078
0000
0000
0000
69–74
75
Queue depth
76-79
80
ATA-reserved
Major version number
00F0
H
H
81
Minor version number
0000
82
Command sets supported
746B
H
H
H
H
H
H
H
83
Command sets supported
5109
4000
7469
1009
4000
84
Command sets supported extension
Command sets enabled
85
86
Command sets enabled
87
Command sets enabled extension
Ultra DMA support and current mode (see note following this table)
Security erase time
88
xx1F
89
0000
0000
4040
0000
H
H
H
H
90
Enhanced security erase time
91
Advanced power management value
Master password revision code
92
93
Hardware reset value
400D
H
94
Auto acoustic management setting
ATA-reserved
8080
0000
H
95-99
H
H
Total number of user-addressable LBA sectors available for
48-bit addressing feature (48-bit addressing not supported)
100-103
0000
104–127
128
ATA-reserved
Security status
Seagate-reserved
ATA-reserved
Integrity word
0000
0001
H
H
129–159
160-254
255
xxxx
H
0000
H
H
xxA5
ST1.3 Series Product Manual, Rev. C
29
Note. See the bit descriptions below for words 63 and 88 of the Identify Drive data:
Description (if bit is set to 1)
Bit
0
Word 63
Multiword DMA mode 0 is supported.
Multiword DMA mode 1 is supported.
Multiword DMA mode 2 is supported.
Multiword DMA mode 0 is currently active.
Multiword DMA mode 1 is currently active.
Multiword DMA mode 2 is currently active.
1
2
8
9
10
Bit
0
Word 88
Ultra DMA mode 0 is supported.
Ultra DMA mode 1 is supported.
Ultra DMA mode 2 is supported.
Ultra DMA mode 3 is supported.
Ultra DMA mode 4 is supported.
Ultra DMA mode 0 is currently active.
Ultra DMA mode 1 is currently active.
Ultra DMA mode 2 is currently active.
Ultra DMA mode 3 is currently active.
Ultra DMA mode 4 is currently active.
1
2
3
4
8
9
10
11
12
30
ST1.3 Series Product Manual, Rev. C
4.1.3
Set Features command
This command controls the implementation of various features that the drive supports. When the drive receives
this command, it sets BSY, checks the contents of the Features register, clears BSY and generates an inter-
rupt. If the value in the register does not represent a feature that the drive supports, the command is aborted.
Power-on default has the read look-ahead and write caching features enabled. The acceptable values for the
Features register are defined as follows:
Table 10:
Feature
Features register values
Description
02
03
Enable Write Cache.
H
H
Used for Set transfer mode Command.
Sector Count register values:
00
01
08
09
Set PIO mode to default (PIO mode 2).
Set PIO mode to default and disable IORDY (PIO mode 2).
PIO mode 0
H
H
H
H
PIO mode 1
0A
PIO mode 2
H
0B
PIO mode 3
H
0C
PIO mode 4
H
20
21
22
40
41
42
43
44
Multiword DMA mode 0
Multiword DMA mode 1
Multiword DMA mode 2
Ultra DMA mode 0
H
H
H
H
H
H
H
H
Ultra DMA mode 1
Ultra DMA mode 2
Ultra DMA mode 3
Ultra DMA mode 4
05
55
66
82
85
Enable advanced power management
H
H
H
H
H
Disable read look-ahead (read cache) feature.
Disable Power On Reset (POR) establishment of defaults at Soft Reset.
Disable write cache.
Disable Advanced Power Management
AA
Enable read look-ahead (read cache) feature.
Enable Power On Reset (POR) establishment of defaults at soft reset
H
CC
H
ST1.3 Series Product Manual, Rev. C
31
32
ST1.3 Series Product Manual, Rev. C
5.0
Seagate Technology support services
Internet
For information regarding Seagate products and services, visit www.seagate.com. Worldwide support is
available 24 hours daily by email for your questions.
Presales Support:
Technical Support:
Warranty Support:
mySeagate
my.seagate.com is the industry's first Web portal designed specifically for OEMs and distributors. It provides
self-service access to critical applications, personalized content and the tools that allow our partners to
manage their Seagate account functions. Submit pricing requests, orders and returns through a single,
password-protected Web interface-anytime, anywhere in the world.
spp.seagate.com
spp.seagate.com supports Seagate resellers with product information, program benefits and sales tools. You
may register for customized communications that are not available on the web. These communications contain
product launch, EOL, pricing, promotions and other channel-related information. To learn more about the
benefits or to register, go to spp.seagate.com, any time, from anywhere in the world.
Seagate Service Centers
Presales Support
Our Presales Support staff can help you determine which Seagate products are best suited for your specific
application or computer system, as well as product availability and compatibility.
Technical Support
Seagate technical support is available to assist you online at support.seagate.com or through one of our call
centers. Have your system configuration information and your “ST” model number available.
SeaTDD™ (+1-405-324-3655) is a telecommunications device for the deaf (TDD). You can send questions or
comments 24 hours daily and exchange messages with a technical support specialist during normal business
hours for the call center in your region.
ST1.3 Series Product Manual, Rev. C
33
Customer Service Operations
Warranty Service
Seagate offers worldwide customer support for Seagate products. Seagate distributors, OEMs and other direct
customers should contact their Seagate Customer Service Operations (CSO) representative for warranty-
related issues. Resellers or end users of drive products should contact their place of purchase or Seagate
warranty service for assistance. Have your serial number and model or part number available.
Data Recovery Services
Seagate offers data recovery services for all formats and all brands of storage media. Our data recovery
services labs are currently located throughout the world. . Additional information, including an online request
form and data loss prevention resources, is available at http://services.seagate.com/index.aspx
Authorized Service Centers
Seagate Service Centers are available on a global basis for the return of defective products. Contact your
customer support representative for the location nearest you.
USA/Canada/Latin America support services
For an extensive list of telephone numbers to technical support, presales and warranty service in USA/
Global Customer Support
Presales, Technical, and Warranty Support
Call Center
USA, Canada,
and Mexico
Toll-free
Direct dial
1-800-SEAGATE
+1-405-324-4700
Data Recovery Services
Call Center
Toll-free
Direct dial
FAX
USA, Canada,
and Mexico
1-800-475-01435
+1-905-474-2162
1-800-475-0158
+1-905-474-2459
Europe, the Middle East and Africa Support Services
For an extensive list of telephone numbers to technical support, presales and warranty service in Europe, the
Asia/Pacific Support Services
For an extensive list of telephone numbers to technical support, presales and warranty service in Asia/Pacific,
34
ST1.3 Series Product Manual, Rev. C
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ST1.3 Series Product Manual, Rev. C
35
36
ST1.3 Series Product Manual, Rev. C
errors 16
Index
A
acoustics 15
altitude 11
F
frequency 15
G
GMR 1
B
BPI 6
H
C
handling 21
heads 1
height 6
humidity 11
certification 17
I
commands 27
interface 6
interference 18
compliance 17
consumption 8
C-Tick 17
interleave 6
Introduction 1
D
K
density 6
disclaimer 2
L
length 6
E
M
modes 25
enclosures 18
EPRML 1
ST1.3 Series Product Manual, Rev. C
37
SeaTools 1
sectors 5
Seek 27
Seeking 8
shock 12
N
noise 9
signals 25
sound 15
O
specifications 3
Spinup 8
Standby/Sleep 8
subassembly 18
P
pins 25
PIO 25
precautions 22
T
temperature 11
timers 10
R
tort 2
V
Vibration 12
voltage 9
register 31
reliability 16
resistance 9
W
Warranty 16
warranty 2
weight 6
width 6
RF 15
S
38
ST1.3 Series Product Manual, Rev. C
40
ST1.3 Series Product Manual, Rev. C
Seagate Technology LLC
920 Disc Drive, Scotts Valley, California 95066-4544, USA
Publication Number: 100409345, Rev. C, Printed in U.S.A.
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