Huawei Technologies Cell Phone MG323 User Manual

Application Block Diagram

2.1 About This Chapter

This chapter gives a general description of the MG323 module and provides:



Function Overview





Circuit Block Diagram

2.2 Function Overview

Table 2-1 Feature

Feature

Description

Working bands Four supported frequency bands: GSM850 MHz/900 MHz/1800

MHz/1900 MHz

Maximum

transmission

power

GSM850 Class 4 (2 W)

EGSM900 Class 4 (2 W)

DCS1800 Class 1 (1 W)

PCS1900 Class 1 (1 W)

< –107 dBm

Receiver

sensitivity

Operating

Temperature

Normal operating temperature: –20°C to +70°C

Extended operating temperature^[1]: –30°C to +75°C

Ambient

–40°C to +85°C

temperature for

storage

Power voltage

3.3 V to 4.8 V (3.8 V is recommended.)

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Feature

Description

Power-off current: 50 µA

Power

consumption

(current)

Average

standby current

DRX=2

DRX=5

DRX=9

< 3.0 mA

< 2.5 mA

< 2.0 mA

GPRS Class 10 (maximum): 455 mA

GSM/GPRS Phase2/2+

Protocols

AT commands

See the HUAWEI MG323 Series Wireless Module AT Command

Interface Specification.

Application

interface (50-

pin B2B

UART1 (supporting 8-wire UART)

One standard Subscriber Identity Module (SIM) card interface

(Class B or Class C)

connector)

Interfaces for two analog audio channels

Power Interface

Network status light-emitting diode (LED) control interface

Hirose U.FL-R-SMT-1(80) 50 Ω antenna connector

Antenna pad

Antenna

interface

Voice services

SMS

Two analog voice channels

New message alert, text message receiving, and text message

sending

Management of text messages: read messages, delete

messages, storage status, and message list

Support for the protocol data unit (PDU) mode

GPRS CLASS 10

GPRS

Encoding schemes: CS 1, CS 2, CS 3, and CS 4

Maximum downlink transmission rate: 85.6 kbps

Maximum uplink transmission rate: 42.8 kbps

Packet Broadcast Control Channel (PBCCH)

Embedded with TCP/IP protocols, supporting multiple links

CSD data services at the maximum rate of 9.6 kbit/s

Circuit

Switched Data

(CSD) data

services



Physical

features

Dimensions (L × W × H): 35 mm × 32.5 mm × 3.05 mm



Weight: 5.8 g

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Feature

Description

Certification

information

Restriction of the use of certain Hazardous Substances (RoHS),

European Conformity (CE), Federal Communications

Commission (FCC), CMIIT, China Compulsory Certification

(CCC), GCF (GSM Certification Forum)

[1]:The temperatures outside of the range –20°C to +70°C; the module might slightly deviate

from 3GPP TS 45.005 specifications.

2.3 Application Block Diagram

Figure 2-1 shows the application block diagram of the MG323 module.

Figure 2-1 Application block diagram of the MG323 module

2.4 Circuit Block Diagram

The circuit block diagram and major functional units of the MG323 module contain

the following parts:



Baseband controller

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

Power management



Multi-chip package (MCP) memory



Radio frequency (RF) transceiver

26 MHz clock

32 kHz clock

RF front-end modules

Receive filter

Figure 2-2 Circuit block diagram of the MG323 module

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Power-On and Power-Off Time Sequence

3.1 About This Chapter

This chapter mainly describes the external application interfaces of the MG323

module, including:



B2B Connector Interface



Power Interface

Signal Control Interface

UART Interface

SIM Card Interface

Audio Interface

3.2 B2B Connector Interface

The MG323 module uses a 50-pin B2B connector as its external interface. For details

about the model and dimensions of the B2B connector, see “6.3 Dimensions of the

B2B Connector”.

Figure 3-1 shows the sequence and definitions of pins on the 50-pin B2B signal

interface of the MG323 module.

Figure 3-1 Sequence and definitions of pins on the B2B signal interface

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Table 3-1 Definitions of pins on the B2B connector

Pin Pin Name

I/O Description

DC Characteristics (V)

No.

Normal

MUX

Min.

Tpy.

Max

SIM_CLK

Clock signal of the SIM

card

1.80/2.90

INTEAR_N

AO Negative pole of the

output of handset

speaker

VSIM

Power supply of the

SIM card

1.80/2.90

INTEAR_P

AO Positive pole of the

output of handset

speaker

SIM_DATA

EXTEAR_P

I/O

Data signal of the SIM

card

1.80/2.90

AO Positive pole of the

output of headset

speaker

SIM_RST

Reset signal of the SIM

card

1.80/2.90

EXTEAR_N

AO Negative pole of the

output of headset

speaker

Not connected, please

keep this pin open

INTMIC_N

Negative pole of the

input of handset

microphone

GND

Ground

INTMIC_P

Positive pole of the

input of handset

microphone

Not connected, please

keep this pin open

EXTMIC_P

Positive pole of the

input of headset

microphone

Not connected, please

keep this pin open

EXTMIC_N

Negative pole of the

input of headset

microphone

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Pin Pin Name

I/O Description

DC Characteristics (V)

No.

Normal

MUX

Min.

Tpy.

Max

Not connected, please

keep this pin open

GND

Ground

Not connected, please

keep this pin open

TERM_ON

Power on/power off

control

internal

pulled up

Not connected, please

keep this pin open

RESET

Hardware reset

–0.40

2.80

3.20

Not connected, please

keep this pin open

UART1_DCD

LED_STATUS

DCE data carrier detect –0.40

2.80

3.20

Network status

indication

–0.40

Not connected, please

keep this pin open

Not connected, please

keep this pin open

UART1_CTS

UART1_RD

DCE clear to send

DCE transmit data

–0.40

2.85

3.25

Not connected, please

keep this pin open

Not connected, please

keep this pin open

UART1_DTR

DCE data terminal

ready

–0.40

2.80

3.20

UART1_TD

UART1_RTS

VCOIN

DCE receive data

–0.40

2.80

2.85

3.00

3.20

3.25

3.15

DCE request to send

Standby power input of 2.00

the RTC

UART1_DSR

DCE data set ready

–0.40

2.80

3.20

Not connected, please

keep this pin open

UART1_RING

DCE ring indicator

–0.40

2.80

3.20

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Pin Pin Name

I/O Description

DC Characteristics (V)

No.

Normal

MUX

Min.

Tpy.

Max

Not connected, please

keep this pin open

External power output

Ground

VIO

2.70

2.80

2.95

GND

VBAT

GND

VBAT

GND

VBAT

GND

VBAT

GND

VBAT

Power supply input

Ground

3.30

3.80

4.80

Power supply input

Ground

3.30

3.80

4.80

Power supply input

Ground

3.30

3.80

4.80

Power supply input

Ground

3.30

3.80

4.80

Power supply input

3.30

3.80

4.80



P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital

signal output; AI indicates pins for analog signal input; AO indicates pins for analog signal

input.

The NC (Not Connected) pins are internally connected to the module. Therefore, these pins

should not be used, otherwise they may cause problems. Please contact us for more

details about this information.

3.3 Power Interface

3.3.1 Overview

The power supply part of the B2B interface of the MG323 module contains:



VBAT interface for the power supply

VCOIN interface for the standby power supply of the real-time clock (RTC)

VIO interface for external power output

T a ble 3-2 lists the definitions of the pins on the power supply interface.

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Table 3-2 Definitions of the pins on the power supply interface

Pin No.

Signal Name

VBAT

I/O Description

42, 44, 46, 48, 50

41, 43, 45, 47, 49

Pins for Power supply input

GND

VCOIN

Pin for standby power input of

the RTC

VIO

Pin for external power output

3.3.2 VBAT Interface

When the MG323 module works normally, power is supplied through the VBAT pins

and the voltage ranges from 3.3 V to 4.8 V (typical value: 3.8 V). The 50-pin B2B

connector provides five VBAT pins and five GND pins for external power input. To

ensure that the MG323 module works normally, all the pins must be used efficiently.

When the MG323 module is used for different external applications, pay special

attention to the design for the power supply. When the MG323 module transmits

signals at the maximum power, the transient current may reach the transient peak

value of about 2.0 A due to the differences in actual network environments. In this

case, the VBAT voltage greatly drops. Make sure that the voltage does not decrease

below 3.3 V in any case. Otherwise, exceptions such as restart of the MG323 module

may occur.

A low-dropout (LDO) regulator or switch power with current output of more than 2 A is

recommended for external power supply. Furthermore, At least five 220 µF storage

capacitors should be connected in parallel at the power interface of the MG323

module. In addition, to reduce the impact of channel impedance on voltage drop, you

are recommended to try to shorten the power supply circuit of the VBAT interface.

It is recommended to employ a ferrite bead in series on VBAT power circuit to

improve the EMI performance. And the rated current of the ferrite bead is required at

least 2 A.

Figure 3-2 shows the recommended power circuit of MG323 module.

Figure 3-2 Recommended power circuit of MG323 module

Module

(DCE)

VBAT

10 μF

100 nF 220 μF 220 μF

220 μF

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3.3.3 VCOIN Interface

VCOIN is an interface for standby power input of the RTC in the MG323 module. If

the VBAT interface is ready for power supply, it on priority supplies the RTC with

power. If the VBAT interface is not ready, the VCOIN interface provides standby

power input for the RTC. In this case, the MG323 module needs 5 µA to maintain the

RTC function.

You can use an external battery to supply power through the VCOIN interface. The

recommended voltage is 3 V. You can also use an external capacitor if you do not

use a battery. The capacitance determines the duration of the RTC when the VBAT

interface is not ready.

The MG323 module supports charging external standby batteries. When the VBAT

voltage is 3.8 V, the charging current is about 0.6 mA (typical value). Figure 3-3

shows two types of circuits for your reference.

Figure 3-3 VCOIN interface circuit

3.3.4 VIO Interface

Through the VIO interface, the MG323 module can supply 2.8 V power externally

with an output current of 10 mA (typical value) for external level conversion or other

applications.

If the MG323 module is in sleep mode, the VIO interface is in the low power

consumption state (< 500 µA). If the MG323 module is in power down mode, the VIO

is in the disabled state. If VIO pin is not in use, disconnect the pin and make sure it is

not grounded.

3.4 Power-On and Power-Off Time Sequence

3.4.1 Overview

The power-on, power-off, and reset control parts of the B2B interface of the MG323

module includes power-on/power-off interface signal (TERM_ON) and the hardware

reset interface signal (RESET). T a ble 3-3 lists the definitions of the interface pins.

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Table 3-3 Definitions of pins of the power-on/power-off and reset interfaces

Pin No.

Signal Name I/O

Description

TERM_ON

RESET

Pin for controlling power-on and power-off

Pin for resetting the hardware

3.4.2 Power-On Time Sequence



Make sure that the MG323 module is powered on at the voltage and operating

temperature in the recommended range. Otherwise, the module may get

damaged or work improperly.



External application interfaces must be powered on after the module is powered

on.

You can power on the MG323 module through the TERM_ON interface. The software

will report relevant information according to the actual settings after the module is

powered on. For example, the AT command automatically reports ^SYSSTART[1]. In

this case, the external VIO interface is enabled and supplies 2.8 V power.

[1] For specific setting information about the power-on/power-off software, see the HUAWEI

MG323 Series Wireless Module AT Command Interface Specification.

Figure 3-4 shows the power-on time sequence.

Figure 3-4 Power-on time sequence

250 ms (min)

VBAT

High-Z

TERM_ON

Sampling period used to

select Vgpio/Vmem

6.6 ms

6.3 ms

2.8 V

VIO

2.3 V

io is set

Fetch Ext

Code

130 ms

HW Power-Key

Init SW Debouncing SW

Nominal

185 ms

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

Fetch Ext Code in the figure is a file system in the MG323 module.



Before powering on the MG323, make sure that TERM_ON is in High-Z condition.

3.4.3 Power-Off Time Sequence

The MG323 module supports power-off through the TERM_ON interface or the

AT^SMSO command. Figure 3-5 shows the power-off time sequence.

Figure 3-5 Power-off time sequence



The processing of the power-off event depends on the normal stop time of the file system

in the MG323 module. The processing varies with the capacity of the file system.



Do not suddenly turn off the VBAT power when the module is working. It is recommended

to power-off the module before turning off the VBAT power.

3.4.4 RESET

The MG323 module supports hardware reset function. If the software of the MG323

module stops responding, you can reset the hardware through the RESET signal.

After the hardware is reset, the software starts powering on the module and reports

relevant information according to the actual settings. For example, the AT command

automatically reports ^SYSSTART. In this case, the external VIO interface is enabled

and supplies 2.8 V power.

3.5 Signal Control Interface

3.5.1 Overview

The signal control part of the B2B interface in the MG323 module consists of:



Power-on/off (TERM_ON) pin

Hardware reset (RESET) pin

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

Network status LED (LED_STATUS) pin

T a ble 3-4 lists the pins on the signal control interface.

Table 3-4 Pins on the signal control interface

Pin No.

Signal Name

TERM_ON

RESET

I/O

Description

Pin for controlling power-on and power-off

Pin for resetting the hardware

Pin for network status LED

LED_STATUS

3.5.2 Input Signal Control Pins

The MG323 module implements power-on and power-off and resets the hardware

through the input signal control pins.

The TERM_ON pin is used to implement power-on and power-off. If the TERM_ON

pin is pulled down for 1 second to 2 seconds, the module is powered on; if the

TERM_ON pin is pulled down for 1 second to 2 seconds again, the module is

powered off.

The RESET pin is used to reset the hardware. When the software stops responding,

the RESET pin can be pulled down for at least 10 ms to reset the hardware.

As the RESET and TERM_ON signals are relatively sensitive, it is recommended that

you install a 10 nF capacitor near the RESET and TERM_ON pins of the B2B

interface for filtering. In addition, when you design a circuit on the PCB of the

interface board, it is recommended that the circuit length not exceed 20 mm and that

the circuit be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge.

Furthermore, you need to wrap the area adjacent to the signal wire with a ground

wire. Otherwise, the module may be reset due to interference.

Figure 3-6 shows the connections of the TERM_ON and RESET pins.

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Figure 3-6 Connections of the TERM_ON and RESET pins

RESET

2.2 kΩ

10 nF

HUAWEI Module

(Modem)

Application Device

(Host）

TERM_ON

2.2 kΩ

10 nF

3.5.3 Output Signal Control Pin

The MG323 module provides a network status LED pin LED_STATUS. The pulse

signal output through this pin controls the status LED on the user interface board to

display the network status.

Different blinking modes of the status LED indicate different network status. T a ble 3-5

describes the status of the LED_STATUS pin.

Table 3-5 Status of the LED_STATUS pin

Working or Network Status

Output Status of the LED_STATUS Pin

Sleep mode

A low-level signal is output continuously.

Network-searching or non-network

status (including the case when the

SIM card is not inserted and the case

when the PIN number is unblocked)

A high-level signal is output for 0.1s in a

period of 1s.

Registered with a 2G network

GPRS data service

Voice call

A high-level signal is output for 0.1s in a

period of 3s.

A high-level signal is output for 0.1s in a

period of 0.125s.

A high-level signal is output

continuously.

In practical application, the LED_STATUS pin cannot be directly used to drive the

status LED. The LED_STATUS pin needs to be used with a triode. To select a

suitable current-limiting resistor for the LED, check the actual voltage drop and rated

current of the LED. Figure 3-7 shows the driving circuit.

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Figure 3-7 Driving circuit

3.6 UART Interface

3.6.1 Overview

The MG323 module provides the UART1 (8-wire UART) interface for one

asynchronous communication channel. As the UART1 interface supports signal

control through standard modem handshake, AT commands are entered and serial

communication is performed through the UART1 interface. The UART1 has the

following features:



Full-duplex



Baud rate clock generated by the system clock



Direct memory access (DMA) transmission



Baud rate ranging from 9600 bit/s to 230400 bit/s (115200 bit/s by default)



Self-adapted baud rate ranging from 9600 bit/s to 115200 bit/s

T a ble 3-6 lists the UART1 interface signals.

Table 3-6 UART1 interface signals

Pin No. Signal Name

Description

Feature

Direction

UART1_RD

DCE transmit

data

The data terminal

equipment (DTE)

receives serial

data.

Data circuit-

terminating

equipment

(DCE) to DTE

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Pin No. Signal Name

Description

Feature

Direction

UART1_TD

DCE receive

data

The DTE transmits

serial data.

DTE to DCE

UART1_RING DCE ring

indicator

The DCE notifies

the DTE of a

remote call.

DCE to DTE

UART1_DTR

UART1_RTS

DCE data

terminal ready

The DTE is ready.

DTE to DCE

DCE request to The DTE requests

send

the DCE to send

data.

UART1_DSR

UART1_CTS

DCE data set

ready

The DCE is ready.

DCE to DTE

DCE clear to

send

The DCE has

switched to the

data receiving

mode.

UART1_DCD

DCE data

carrier detect

A data link is set

up.

DCE to DTE

3.6.2 Circuit Recommended for the UART Interface

Figure 3-8 shows the connection of the UART1 interface in the MG323 module (DCE)

with the host (DTE).

Figure 3-8 Connection of the UART1 interface in the MG323 module (DCE) with the

host (DTE)

When an MG323 module receives an SM (Short Message), a low-level signal is

output through the RING (pin 38) for 1s, as shown in Figure 3-9 .

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Figure 3-9 The signal through the RING after the MG323 receives an SM

When an MG323 Module receives a voice call, a periodical low level signal for 1s and

a high level signal for 4s are output by RING, as shown in Figure 3-10 .

Figure 3-10 The signal through the RING after the MG323 receives a voice call



For detailed application of the MG323 UART1 interface, see HUAWEI Module UART Serial

Port Design Guide.

The maximum level of UART1_DCD, UART1_RING, UART1_DSR and UART1_DTR

signals is 3.2 V, and the maximum level of UART1_TD, UART1_RD, UART1_CTS and

UART1_RTS signals is 3.25 V. Therefore, if the UART signals need to be connected the

signal with 3.3 V, a level conversion curcuit is required.



UART1 interface must be powered on after the module is powered on to avoid the wind

blow in which may cause the module cannot work properly.

The level of RS-232 Transceivers must match that of the MG323 module.

3.7 SIM Card Interface

3.7.1 Overview

The MG323 module provides a SIM card interface complying with the ISO 7816-3

standard and supports automatic detection of a Class B SIM card or a Class C SIM

card. T a ble 3-7 lists the SIM card interface signals.

Table 3-7 SIM card interface signals

Pin No.

Signal Name

SIM_CLK

VSIM

I/O

Description

Clock signal of the SIM card

Power supply of the SIM card

Data signal of the SIM card

Reset signal of the SIM card

SIM_DATA

SIM_RST

I/O

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Pin No.

Signal Name

I/O

Description

GND

Ground signal of the SIM card

3.7.2 Circuit Recommended for the SIM Card Interface

As the MG323 module is not equipped with a SIM card socket, you need to place a

SIM card socket on the user interface board. The SIM card signals are transmitted

outwards through the 50-pin B2B connector interface. Figure 3-11 shows the circuit of

the SIM card interface.

Figure 3-11 Circuit of the SIM card interface

ESD protection

HUAWEI Module

(Modem)

VSIM

SIM_RST

SIM Card

SIM_CLK

SIM_DATA

GND

Socket

33 pF 33 pF

33 pF

0.1µF

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

To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic

compatibility (EMC) authentication, the SIM card socket should be placed near the

B2B connector interface (it is recommended that the PCB circuit connecting the

B2B connector interface and the SIM card socket not exceed 100 mm), because a

long circuit may lead to wave distortion, thus affecting signal quality.



It is recommended that you wrap the area adjacent to the SIM_CLK and

SIM_DATA signal wires with a ground wire. The GND pin of the SIM card socket

and the GND pin of the SIM card must be well connected to the power GND pin

supplying power to the MG323 module.

A 0.1 µF capacitor or a 0.22 µF capacitor is placed between the VSIM and GND

pins in parallel. Three 33 pF capacitors are placed respectively between the

SIM_DATA and GND pins, the SIM_RST and GND pins, and the SIM_CLK and

GND pins in parallel to filter interference from RF signals.



You do not need to pull the SIM_DATA pin up during design as a 15 kΩ resistor is

used to connect the SIM_DATA pin to the VSIM pin.

It is recommended to take electrostatic discharge (ESD) protection measures near

the SIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance

less than 10 pF must be placed as close as possible to the SIM socket, and the

Ground pin of the ESD protection component is well connected to the power

Ground pin that supplies power to the MG323 module.

3.8 Audio Interface

The MG323 module provides two types of audio interfaces: one is for handsets, the

other is for headsets. The audio interfaces of the MG323 module support input from

handset microphones and headset microphones, and provide output that supports 32

Ω handsets and 16 Ω headsets. Differential signal lines are recommended for the

microphone interface and the speaker interface. Single-ended signal lines are not

recommended. The reception gain can be adjusted by using software.

Figure 3-12 External circuit for 32 Ω handsets/16 Ω headsets

HUAWEI Module

(Modem)

ferrite bead

INTEAR_P/

EXTEAR_P

100 pF

ferrite bead

INTEAR_N/

EXTEAR_N

Speaker

33 pF

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33 pF capacitors are added for filtering radio frequency interference.

Figure 3-13 External circuit for the microphone interface

33 pF capacitors are added for filtering radio frequency interference.

It is recommended that ESD components be added to the external circuit of the audio

interface to protect the module.

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4.1 About This Chapter

An RF connector or an antenna pad can be used as the connection method of an

antenna interface. When the MG323 module works properly, only one of the

preceding connection methods is used. In addition, the antenna interface must be

used with coaxial cables with 50 Ω characteristic impedance.

4.2 Antenna Installation

The MG323 module supports the following two antenna connection methods: buckled

RF connector U.FL-R-SMT-1(80) manufactured by Hirose, and antenna pad. It is

recommended that you use the buckled RF connector.

When the MG323 module works properly, only one antenna connection method can

be used; otherwise, the RF performance may deteriorate.

If a buckled RF connector is used, it is recommended that you use a 50 Ω coaxial

cable in the U.FL series. The height of the connector increases by 0.8 mm when this

cable is used.

If an antenna pad is used, you need to connect the coaxial cable core to the pad. In

addition, you need to connect the shield ground of the coaxial cable to the reference

ground near the pad. You can choose a suitable direction to weld the RF cable to

meet the installation requirements according to the actual application.

When trying to shorten the opening between the coaxial cable core and the shield

ground, you also need to prevent a short circuit.

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The properties of major materials of the MG323 module are as follows:



PCB: FR4



Antenna pad: cheminal nickel-gold pad

4.3 Coaxial Cable and RF Connector

The U.FL-R-SMT-1(80) RF connector manufactured by Hirose is used as the antenna

interface in the MG323 module. Figure 4-1 shows the RF connector dimensions.

Figure 4-1 RF connector dimensions

T a ble 4-1 lists the major specifications of the RF connector.

Table 4-1 Major specifications of the RF connector

Rated Condition

Environmental

Condition

Type Material

Frequency

range

Direct current

(DC) to 6 GHz

Temperature –40°C

Shell

Phosphor and copper

plated with silver

range

+90°C

Characteristic

impedance

50 Ω

Cable core Gold-plated copper

wire

Insulating

material

Socket: liquid crystal

polyester (LCP)

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You can visit http://www.hirose.com for more information about the specifications of

the U.FL-R-SMT-1(80) RF connector.

It is recommended that you use the Hirose coaxial cable with the RF

connector. Figure 4-2 shows the specifications of the coaxial cable working with the

RF connector.

Figure 4-2 Specifications of the coaxial cable working with the RF connector

You can visit http://www.hirose.com for more detailed information about the coaxial

cable working with the RF connector.

Figure 4-3 shows the connection between the RF connector and the U.FL-LP-040

cable.

Figure 4-3 Connection between the RF connector and the U.FL-LP-040 cable

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4.4 ESD Protection for the Antenna Interface

In practical application, pay attention to the ESD protection for the antenna interface

of the MG323 module. Incorrect operation may result in permanent damage to the RF

components.

Figure 4-4 shows the ESD protection circuit recommended for the antenna interface.

Figure 4-4 ESD protection circuit recommended for the antenna interface

HUAWEI Module

(Modem)

RF switch

It is recommended that you pay attention to the junction capacitance of the TVS

diode when you choose the model of the TVS diode. Ensure that the junction

capacitance of the TVS diode is lower than 1 pF.

4.5 RF Specifications of the Antenna Interface

T a ble 4-2 lists the RF specifications of the antenna interface in the MG323 module.

Table 4-2 RF specifications of the antenna interface in the MG323 module

Specification

Minimum Typical Maximum Unit

Value

Uplink frequency range

GSM 850

824

849

MHz

(Mobile station to base transceiver

station)

E-GSM 900

GSM 1800

880

915

1710

1785

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Specification

Minimum Typical Maximum Unit

Value

1850

869

Value

1910

894

GSM 1900

GSM 850

MHz

dBm

Downlink frequency range

(Base transceiver station to mobile

station)

E-GSM 900

GSM 1800

GSM 1900

GSM 850

925

960

1805

1930

1880

1990

Transmission power range

E-GSM 900

dBm

GSM 1800

GSM 1900

GSM 850

dBm

Number of carrier frequencies

124

174

374

299

E-GSM 900

GSM 1800

GSM 1900

GSM 850

Duplex spacing

MHz

kHz

E-GSM 900

GSM 1800

GSM 1900

Carrier spacing

200

Multiplex and duplex modes

Frequency division duplexing–time division

multiple access (FDD-TDMA)

Time slots of each TDMA frame

Frame duration

4.615

577

µs

Time slot duration

Modulation scheme

Gaussian minimum shift keying (GMSK)

Receiver sensitivity

GSM-850

–108.5

–108

dBm

EGSM-900

GSM-1800

GSM-1900

dBm

–108

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4.6 Specifications of the Antenna Interface

T a ble 4-3 lists the recommended specifications of the antenna interface.

Table 4-3 Recommended specifications of the antenna interface

Working bands

Port impedance

824 MHz–960 MHz and 1710 MHz–1990 MHz

50 Ω

Voltage standing

< 3:1

wave ratio (VSWR)

Maximum gain

Antenna efficiency

Polarization

> 2.5 dBi

> 40% @824 MHz–960 MHz; 50% @1710 MHz–1990 MHz

Linear polarization

Pattern

Omnidirectional

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Extreme Working Conditions

5.1 About This Chapter

This chapter describes the electrical and reliability features of the interfaces in the

MG323 module, including:





Operating and Storage T e mperatures and Humidity



Electrical Criteria of Application Interfaces



Power Supply Features



Reliability Features



ESD Features

5.2 Extreme Working Conditions

T a ble 5-1 lists the extreme working conditions for the MG323 module. Using the

MG323 module beyond these conditions may result in permanent damage to the

module.

Table 5-1 Extreme working conditions for the MG323 module

Symbol

VBAT

Specification

Minimum Value Maximum Value Unit

External power voltage

–0.40

6.00

3.15

VCOIN

Input voltage of standby 2.00

power for the RTC

V_I

Digital pin voltage

–0.40

V_I+0.40

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V_Iis 2.85 V or 2.8 V, which is the voltage of the digital I/O pin. For the details about V_I,please

see T a ble 3-1 .

5.3 Operating and Storage Temperatures and Humidity

T a ble 5-2 lists the operating and storage temperatures and humidity for the MG323

module.

Table 5-2 Operating and storage temperatures and humidity for the MG323 module

Specification

Minimum Value

Maximum Value

Unit

Normal operating

temperatures

–20

°C

Extended temperatures^[1]

–30

–20

°C

Ambient temperature for

storage

–40

Moisture

[1]:The temperatures outside of the range –20°C to +70°C; the module might slightly deviate

from 3GPP TS 45.005 specifications.

5.4 Electrical Criteria of Application Interfaces

T a ble 5-3 lists the sequence numbers of pins and definitions of signals on the 50-pin

B2B interface of the MG323 module.

Table 5-3 Sequence numbers of pins and definitions of signals on the B2B interface

Pin No. Signal Name

Pin No.

Signal Name

INTEAR_N

INTEAR_P

EXTEAR_P

EXTEAR_N

INTMIC_N

SIM_CLK

VSIM

SIM_DATA

SIM_RST

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Pin No. Signal Name

Pin No.

Signal Name

INTMIC_P

EXTMIC_P

EXTMIC_N

GND

TERM_ON

RESET

UART1_DCD

LED_STATUS

UART1_CTS

UART1_RD

UART1_DTR

UART1_RTS

UART1_DSR

UART1_RING

VIO

UART1_TD

VCOIN

GND

VBAT

T a ble 5-4 lists electrical features (typical values) measured when no external device

is connected to the MG323 module through the 50-pin B2B interface.

Table 5-4 Electrical features of application interfaces

Function

Signal Name I/O Waveform and

Level

Remarks

Power supply VBAT

interface

V_I=3.30 V to 4.80 Pins 42, 44, 46, 48, and 50 are power supply

pins used to supply the MG323 module with

power. When the module transmits signals at

the maximum power, the transient current can

reach about 2 A, which may result in VBAT

voltage great drop. The VBAT power voltage

for the MG323 module should not be lower

than 3.3 V.

V_Itypical=3.80 V

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Function

Signal Name I/O Waveform and

Level

Remarks

GND

Pins 41, 43, 45, 47, and 49 are power GND

pins.

External

power voltage

interface

VIO

V_omin=2.70 V

_otype=2.80 V

Pin 40 is a pin for supplying external devices

with power from the MG323 module. Ensure

that the external peaks and burst do not

damage the VIO interface.

V_omax=2.95 V

I_omax=10.00 mA

If the MG323 module is in Sleep mode, the

VIO pin is in the enabled low consumption

state (< 500 uA). If the MG323 module is in

Power Down mode, the VIO pin is in the

disabled state.

This pin can be left open if it is not used.

Interface for

standby

power input of

the RTC

VCOIN

V_omax=3.00 V

Pin 35 is a pin for standby power input of the

RTC. When the VBAT is not ready for power

supply, the RTC can be supplied with power

through an external coin battery or capacitor.

_Imin=2.00 V

V_Itype=3.00 V

V_Imax=3.15 V

This pin can be left openif it is not used.

I_Itype=5.00 μA at

VBAT=0 V

Power pin

Reset pin

TERM_ON

RESET

V_ILmax=0.40 V

Pin 20 is a pin for powering on the module.

Low level is effective.

The signal can be

detected when

low level keeps

effective for one

second or more.

V_ILmax=0.40 V

Pin 22 is a pin for restarting the module. Low

level is effective.

The signal can be

detected when

low level keeps

effective for 10

milliseconds or

more.

This pin can be left open if it is not used.

Signal of the LED_STATU

V_oHmin=2.70 V

Pin 25 is a pin for controlling the network

status LED.

network

status LED

This pin can be left open if it is not used.

SIM card

interface

(Class B)

SIM_RST

SIM_DATA

V_oHmin=2.32 V

V_oLmax=0.58 V

Reset signal of the SIM card

I/O V_oHmin=2.03 V

_oLmax=0.40 V

Data signal of the SIM card

V_ILmax=0.58 V

V_IHmin=2.03 V

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Function

Signal Name I/O Waveform and

Level

Remarks

SIM_CLK

V_oHmin=2.03 V

_oLmax=0.58 V

Clock signal of the SIM card

Power voltage of the SIM card

VSIM

V_oHmax=3.00 V

V_otype=2.90 V

V_oHmin=2.75 V

GND

GND of the SIM card

SIM card

interface

(Class C)

SIM_RST

V_oHmin=1.44 V

V_oLmax=0.36 V

Reset signal of the SIM card

SIM_DATA

I/O V_oHmin=1.26 V

_oLmax=0.3 V

Data signal of the SIM card

V_ILmax=0.36 V

V_IHmin=1.26 V

SIM_CLK

VSIM

V_oHmin=1.26V

Clock signal of the SIM card

Power voltage of the SIM card

_oLmax=0.36V

V_oHmax=1.95 V

_otype=1.80 V

V_oHmin=1.65 V

GND

GND of the SIM card

UART1

communicatio

n interface

UART1_RD

UART1_TD

_oLmax=0.10 V

_oHmin=2.70 V

This interface can be used to transmit AT

commands and data.

V_ILmax=0.40 V

V_IHmin=2.40 V

UART1_RIN

UART1_DSR O

UART1_RTS I

UART1_DTR I

UART1_CTS O

UART1_DCD O

Analog audio EXTMIC_N

interface

Negative end of differential headset MIC input

through channel 2

EXTMIC_P

Positive end of differential headset MIC input

through channel 2

INTMIC_P

Positive end of differential handset MIC input

through channel 1

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Function

Signal Name I/O Waveform and

Level

Remarks

INTMIC_N

EXTEAR_N

EXTEAR_P

INTEAR_P

INTEAR_N

Negative end of differential handset MIC input

through channel 1

Negative end of differential speaker output

through channel 2

Positive end of differential speaker output

through channel 2

Positive end of differential speaker audio

output through channel 1

Negative end of differential speaker audio

output through channel 1

NC pin

Pins 9, 13, 15, 17, 19, 21, 23, 26, 27, 30, 31,

and 39 are internal pins. These pins need to

be left floating when they are used.

P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal

output; AI indicates pins for analog signal input; AO indicates pins for analog signal output.

5.5 Power Supply Features

5.5.1 Input Power Supply

T a ble 5-5 lists the requirements for input power of the MG323 module.

Table 5-5 Requirements for input power of the MG323 module

Parameter

VBAT

Minimum Value Typical Value

Maximum Value Unit

3.30

2.00

3.80

3.00

4.80

3.15

VCOIN

5.5.2 Working Current

T a ble 5-6 lists the working current of the MG323 module.

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Table 5-6 Working current of the MG323 module

Working Mode

Typical value

Unit

Remark

Power-off mode

50.00

µA

VBAT is powered on, yet the

module is in power-off state.

Sleep mode

1.50

0.89

0.85

50.00

MFRMS=2

MFRMS=5

MFRMS=9

MFRMS=5

Idle mode



Current in the sleep mode indicates that module enters in the sleep mode (AT+CFUN=0),

and the serial port cannot be used.



The typical values are the average of some test samples.

In idle mode, the module is registered to the network; no voice or data service is ongoing

and the serial port can be used.

Table 5-7 Working current of the MG323-B module (for GPRS mode)

Band

Typical Unit PCL

value

Configuration

GPRS850

242

438

136

220

252

455

138

225

185

340

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

GPRS900

GPRS1800

GPRS1900

127

181

336

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Configuration

Band

Typical Unit PCL

value

1 Up/1 Down

2 Up/1 Down

123

The typical values are the average of some test samples.

5.6 Reliability Features

T a ble 5-8 lists the test conditions and results of the mechanical reliability of the

MG323 module.

Table 5-8 Test conditions and results of the mechanical reliability of the MG323 module

Item

Test Condition

Standard

Low-temperature

storage

Temperature: –40ºC±2ºC

Test duration: 24 h

IEC60068

High-temperature

storage

Temperature: 85ºC±2ºC

Test duration: 24 h

IEC60068

Low-temperature

working

Temperature: –30ºC±2ºC

Test duration: 24 h

High-temperature

working

Temperature: 75ºC±2ºC

Test duration: 24 h

Damp heat cycling

High temperature: 55ºC±2ºC

Low temperature: 25ºC ±2ºC

Humidity: 95%

Repetition times: 4

Test duration: 12 h+12 h

Temperature shock

Low temperature: –40ºC±2ºC

High temperature: 85ºC±2ºC

Temperature change interval: < 30s

Test duration: 15 min

IEC60068

Repetition times: 100

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Item

Test Condition

Temperature: –40º ±2°C

Standard

Condensation test

IEC60068

Time for keeping condensed: 2 h

Recovery temperature: 25ºC±2°C

Recovery time: 5 min

Repetition times: 6

Dust test

Dust density: 2 kg/m³

Dust type: dry talcum powder

Size requirement: < 75 µm

Duration: 8 h

IEC60068

Salty fog test

Temperature: 35°C

Density of the NaCl solution: 5±1%

Spraying interval: 8 h

Duration of exposing the module to

the temperature of 35°C: 16 h

Sun exposure

Sine vibration

Radiation strength: 1120 W/m²

Duration: 20 h

IEC60068

Repetition time: 3

Frequency range: 5 Hz to 200 Hz

Acceleration: 10 m/s²

Frequency scan rate: 1 oct/min

Test period: 3 axial directions. Five

circles for each axial direction.

Shock test

Clash test

Half-sine wave shock

IEC60068

Peak acceleration: 300 m/s²

Shock duration: 11 ms

Test period: 6 axial directions. One

shock for each axial direction.

Half-sine wave

Peak acceleration: 180 m/s²

Pulse duration: 6 ms

Repetition time: 6 directions. 1000

times for each direction.

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Item

Test Condition

First case: 0.3 m in height. Drop the

Standard

Drop test

IEC60068

MG323 module on the marble

terrace with one surface facing

downwards twice. Six surfaces

should be tested.

Second case: 0.8 m in height. Drop

the MG323 module on the marble

terrace with one surface facing

downwards twice. Six surfaces

should be tested.

5.7 ESD Features

Pay great attention to ESD protection when using the MG323 module. To ensure that

the working reference GND is connected to the MG323 module and user interface

board properly, you are recommended not to spray a coated insulation on the

structure fixing hole (connecting with the main reference GND of the user interface

board) and connect the hole with the MG323 module through the metal fastener or

other low-resistance fastener. For specific installation method and fastener

specification, see “6.4 MG323 Module Installation Description."

T a ble 5-9 lists the test results of the ESD performance of the MG323 module

according to the EN61000-4-2 standard.

Table 5-9 ESD performance

ESD Test Standard

Contact Discharge

Air Discharge

EN61000-4-2

±4 kV

±8 kV

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Dimensions of the B2B Connector

6.1 Overview

This chapter describes the dimensions of the MG323 module, including:



Dimensions





MG323 Module Installation Description



Specification Selection for Fasteners

6.2 Dimensions

Dimensions (L x W x H): 35 mm x 32.5 mm x 3.05 mm

Figure 6-1 shows the dimensions.

Weight: 5.8 g

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Figure 6-1 Dimensions of the MG323 module (unit: mm)

6.3 Dimensions of the B2B Connector

The MG323 module uses the 50-pin B2B connector whose model is DF12C(3.0)-

50DS-0.5V(81) and whose pin spacing is 0.5 mm to work with the connector DF12E

(3.0)-50DP-0.5V (81) of the DF12 series (both connectors are manufactured by

Hirose). For specific models, access http://www.hirose.com .

Figure 6-2 DF12C (manufactured by Hirose) used on the MG323 module

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Figure 6-3 DF12E (manufactured by Hirose) recommended to be used with the MG323

module on the user interface board

Table 6-1 Ordered connector model and DF12 product series working with the MG323

module

Item

Model

Stacking

Height (mm)

HRS Number

537-0694-9-81

537-0834-6-**

Connector model used

with the MG323 module

DF12C(3.0)-50DS- 3.0

0.5V(81)

Connector model

DF12E(3.0)-50DP- 3.0

recommended to be used 0.5V(81)

on the user interface

board

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Figure 6-4 Dimensions of the connector used on the MG323 module (unit: mm)

6.4 MG323 Module Installation Description

Three structure fixing holes (diameter: 2 mm) are reserved in the MG323 module.

The holes are not sprayed with a coated insulation and connected with the main

reference GND of the module, as shown in Figure 6-5 .

Figure 6-5 Structure fixing hole

You can insert machine screws through the structure fixing holes and metal fasteners

and fasten with nuts to firmly connect the MG323 module to the user interface board

[1]. The metal fastener is placed between the MG323 module and user interface

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board and functions as a brace and connects the MG323 module and user interface

board through the reference GND. Below the user interface board, the nuts are used

to fasten the screws. Figure 6-6 shows the MG323 module installation.

Figure 6-6 MG323 module installation

[1]: Pay great attention to ESD protection when using the MG323 module. To ensure that the

working reference GND is connected to the MG323 module and user interface board properly,

you are recommended not to spray a coated insulation on the structure fixing hole (connecting

with the main reference GND of the user interface board) and connect the hole with the

MG323 module through the metal fastener or other low-resistance fastener.

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6.5 Specification Selection for Fasteners

To ensure that the MG323 module is firmly fixed on the interface board when using

the MG323 module, you are recommended to you use the M1.6 or M1.8 machine

screw. You can also customize the screws. The fastener components in the following

figures are recommended. The machine screw dimensions are M1.6×7.5×3.0×1.0. It

is recommended that you plate gold on the metal fastener. Figure 6-7 shows the

specific dimensions for the fastener components.

Figure 6-7 Machine screw dimensions

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