Dell STUDIO XPSTM 8100 User Manual

Dell™ Studio XPS™ 8100:  
Comprehensive Specifications  
This document provides information that you may need when setting up,  
updating drivers for, and upgrading your computer.  
NOTE: Offerings may vary by region. For more information regarding the configuration  
of your computer, click Start  
Help and Support and select the option to view  
information about your computer.  
Processor  
®
Type  
Intel Core™ i7-870  
Intel Core i7-860  
Intel Core i7-750  
Intel Core i5-670  
Intel Core i5-661  
Intel Core i5-660  
Intel Core i5-650  
Intel Core i3-540  
Intel Core i3-530  
32 KB  
L1 cache  
L2 cache  
256 KB/core  
Drives and Devices  
Externally accessible  
• two 5.25-inch bays for SATA  
DVD+/-RW Super Multi Drive or  
Blu-ray Disc™ combo or Blu-ray  
Disc RW drive  
Internally accessible  
Wireless (optional)  
two 3.5-inch bays for SATA hard drives  
®
WiFi/Bluetooth wireless technology  
Expansion Bus  
PCI Express  
• Gen2 x1 slot bi-directional speed —  
500 MB/s  
• Gen2 x16 slot bi-directional speed —  
16 GB/s  
PCI  
32-bit speed — 33 MHz  
1.5 Gbps and 3.0 Gbps  
• high speed — 480 Mbps  
• full speed — 12 Mbps  
• low speed — 1.2 Mbps  
SATA 2.0  
USB 2.0  
Memory Card Reader  
Cards supported  
• CompactFlash (CF) card  
• Smart Media (SM) card  
• xD-Picture (xD) card  
• Memory Stick (MS) card  
• Memory Stick Duo card  
• Memory Stick PRO Duo card  
• Memory Stick PRO (MSPRO) card  
• Memory Stick PRO HG  
(MSPRO HG) card  
• SecureDigital (SD) card  
• SecureDigital Card (SDHC) 2.0  
• MultiMedia Card (MMC)  
• MicroDrive (MD)  
Video  
®
Integrated  
Discrete  
Intel Graphics Media Accelerator HD  
PCI Express x16 card  
Audio  
Type  
Integrated 7.1 channel, High Definition  
audio with S/PDIF support  
System Board Connectors  
Memory  
four 240-pin connectors  
one 124-pin connector  
two 36-pin connectors  
one 164-pin connector  
one 24-pin EPS 12V connector  
(ATX-compatible)  
PCI  
PCI Express x1  
PCI Express x16  
Power (system board)  
Processor fan  
one 4-pin connector  
System Board Connectors (continued)  
Chassis fan  
one 3-pin connector  
five 9-pin connectors  
Front USB connector  
Front audio connector  
one 9-pin connector for 2-channel stereo  
sound and microphone  
SATA  
four 7-pin connectors  
one 5-pin connector  
S/PDIF out  
External Connectors  
Network adapter  
USB  
RJ45 connector  
two top-panel, two front-panel, and four  
back-panel USB 2.0-compliant  
connectors  
Audio  
top panel — one headphone and one  
microphone connector  
back panel — six connectors for 7.1  
support  
S/PDIF  
eSATA  
IEEE 1394a  
HDMI  
DVI  
one S/PDIF (optical) connector  
one back-panel connector  
one back-panel 6-pin serial connector  
19-pin connector  
24-pin connector  
Expansion Slots  
PCI  
Connectors  
one  
Connector size  
Connector data width (maximum)  
PCI Express x1  
Connectors  
124-pin connector  
32 bit  
two  
Connector size  
36-pin connector  
Expansion Slots (continued)  
Connector data width (maximum)  
PCI Express x16  
1 PCI Express lane  
Connectors  
one  
Connector size  
164-pin connector  
16 PCI Express lane  
Connector data width (maximum)  
Power  
DC Power Supply  
Wattage  
350 W  
Maximum heat dissipation  
1836 BTU/hr  
NOTE: Heat dissipation is calculated by using the power supply wattage rating.  
Input voltage  
115/230 VAC  
50/60 Hz  
8 A/4 A  
Input frequency  
Rated output current  
Battery  
Coin-cell battery  
3-V CR2032 lithium coin cell  
Physical  
Height  
Width  
Depth  
407.75 mm (16.02 inches)  
185.81 mm (7.31 inches)  
454.67 mm (17.90 inches)  
10.18 kg (22.40 lb)  
Weight  
Computer Environment  
Temperature range:  
Operating  
10°C to 35°C (50°F to 95°F)  
-40°C to 65°C (-40°F to 149°F)  
20% to 80% (non-condensing)  
Storage  
Relative humidity  
Computer Environment (continued)  
Maximum vibration (using a random-vibration spectrum that simulates user  
environment):  
Operating  
Storage  
0.25 GRMS  
2.2 GRMS  
Maximum shock (measured with hard drive in head-parked position and a 2-ms  
half-sine pulse):  
Operating  
Half-Sine Pulse: 40G for 2 ms with a  
change in velocity of 20 in/s (51 cm/s)  
Storage  
Half-Sine Pulse: 50G for 26 ms with a  
change in velocity of 320 in/s (813 cm/s)  
Altitude (maximum):  
Operating  
-15.2 to 3048 m (-50 to 10,000 ft)  
-15.2 to 10,668 m (-50 to 35,000 ft)  
Storage  
Airborne contaminant level  
G2 or lower as defined by ISA-S71.04-  
1985  
____________________  
Information in this document is subject to change without notice.  
© 2009 Dell Inc. All rights reserved.  
Reproduction of these materials in any manner whatsoever without the written permission of Dell Inc. is  
strictly forbidden.  
Trademarks used in this text: Dell, the DELL logo, Studio XPS are trademarks of Dell Inc.; Intel is a  
registeredtrademarkand Core isatrademarkofIntelCorporationintheU.S. andothercountries; Microsoft,  
Windows, and Windows start button logo are either trademarks or registered trademarks of Microsoft  
Corporation in the United States and/or other countries.  
Other trademarks and trade names may be used in this document to refer to either the entities claiming the  
marks and names or their products. Dell Inc. disclaims any proprietary interest in trademarks and trade  
names other than its own.  
Model: D03M series  
Type: D03M001  
October 2009  
Rev. A00  

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