TEA5880TS
Integrated FM stereo radio IC for host processor tuning in
handheld applications
Rev. 02 — 26 April 2004
Preliminary data sheet
1. General description
The TEA5880TS stereo FM radio IC dramatically reduces the printed-circuit board area
(only 100 mm2) needed to integrate FM radio functionality into portable devices. This
makes it invaluable for any application where space is at a premium.
Relying on a system host processor for radio tuning, the TEA5880TS is ideally suited for
powerful devices such as PDAs, notebooks, portable CD and MP3 players.
2. Features
■ No alignments necessary
■ Complete adjustment-free stereo decoder; no external crystal required
■ Fully integrated MPX VCO circuit
■ Fully integrated low IF selectivity and demodulation
■ The full integration level means no or few external components required
■ No external FM discriminator needed due to full integration
■ Built-in adjacent channel interference total reduction (no 114 kHz, no 190 kHz)
■ The level of the incoming signal at which the radio must lock is software programmable
■ Due to new tuning concept, the tuning is independent of the channel spacing
■ Very high sensitivity due to integrated low noise RF input amplifier
■ RF Automatic Gain Control (AGC) circuit
■ Standby mode for power-down, no power switch circuitry required
■ 2.7 V minimum supply voltage
■ MPX output for RDS
■ 3-wire bus
■ In combination with the host, fast, low power operation of preset mode, manual search,
automatic search and automatic store are possible
■ Host can be in Sleep mode after tuning; a minute retuning is recommended to
compensate for temperature and voltage fluctuations
■ Covers all Japanese, European and US bands.
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
Table 1:
Quick reference data …continued
VCCA = VCCD
Symbol Parameter
Conditions
Min
Typ
Max
Unit
THD
total harmonic distortion VRF = 1 mV; left = right; ∆f = 75 kHz;
mod = 1 kHz; BAF = 300 Hz to 15 kHz
-
0.7
1.5
%
f
VRF = 1 mV; left = right; ∆f = 22.5 kHz;
mod = 1 kHz; BAF = 300 Hz to 15 kHz
-
-
0.2
0.7
-
%
f
integrated de-emphasis
50/75
µs
DEEM
4. Ordering information
Table 2:
Ordering information
Type number Package
Name
Description
plastic shrink small outline package; 24 leads; body width 5.3 mm
Version
SOT340-1
TEA5880TS
SSOP24
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
3 of 27
xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx
xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x
MICROCONTROLLER
reserved
LR1
17
V
V
LL1
20
R/W
6
CLOCK
8
DATA
7
CC1
CC1
18
19
21
QUADRATURE
OSCILLATOR
TUNING
SYSTEM
DIGITAL
INTERFACE
LEVEL VOLTAGE
GENERATOR
1
2
RFIN
10
11
AUDL
AUDR
QUADRATURE
MIXER
STEREO
DECODER
DE-EMPHASIS
DE-EMPHASIS
15 kHz
SELECTIVITY
DEMODULATOR
MIXER
50/75 µs
RFGND
9
MPX
TEA5880TS
POWER
SWITCH
STABILISATOR
5
4
3, 13, 24
GND
12
LED
14, 15, 16, 22, 23
001aaa665
V
V
n.c.
CCA
CCD
Fig 1. Block diagram.
Depending on the antenna design the filter components at pins 1 and 2 may not be necessary. The only two remaining coils connected to pin
17 to 20 can be replaced by printed-circuit board traces that will fit underneath the TEA5880TS resulting in a design without any external
components; see Section 14 for details on the printed-circuit board coils.
xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx
xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x
MICROCONTROLLER
reserved
LR1
17
V
V
LL1
20
R/W
6
CLOCK
8
DATA
7
CC1
CC1
18
19
21
QUADRATURE
OSCILLATOR
TUNING
SYSTEM
DIGITAL
INTERFACE
LEVEL VOLTAGE
GENERATOR
10
11
AUDL
AUDR
RFIN
QUADRATURE
MIXER
STEREO
DECODER
DE-EMPHASIS
DE-EMPHASIS
15 kHz
SELECTIVITY
DEMODULATOR
MIXER
50/75 µs
RFGND
9
MPX
TEA5880TS
POWER
SWITCH
STABILISATOR
5
4
3, 13, 24
GND
12
LED
14, 15, 16, 22, 23
001aaa666
V
V
n.c.
CCA
CCD
Fig 2. Block diagram (no external components).
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
6. Pinning information
6.1 Pin description
Table 3:
Symbol
RFIN
RFGND
GND
VCCD
VCCA
R/W
Pin description
Pin
1
Description
RF input
2
RF ground
3
ground
4
digital supply voltage
analog supply voltage
digital read/write command input
bidirectional digital data line
digital data clock line input
FM MPX signal output
audio left channel output
audio right channel output
stereo LED output
ground
5
6
DATA
CLOCK
MPX
AUDL
AUDR
LED
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
GND
n.c.
not connected
n.c.
not connected
n.c.
not connected
LR1
coil right
VCC1
VCC1
LL1
internal analog voltage
internal analog voltage
coil left
reserved
n.c.
reserved for testing use
not connected
n.c.
not connected
GND
ground
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
6 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
RFIN
RFGND
GND
1
2
3
4
5
6
7
8
9
24 GND
23 n.c.
22 n.c.
V
21 reserved
20 LL1
CCD
V
CCA
R/W
DATA
CLOCK
MPX
19
18
V
V
CC1
CC1
TEA5880TS
17 LR1
16 n.c.
15 n.c.
14 n.c.
13 GND
AUDL 10
AUDR 11
LED 12
001aaa667
Fig 3. Pin configuration.
7. Functional description
7.1 FM quadrature mixer
The FM quadrature mixer converts FM RF (76 MHz to 108 MHz) to an IF of 110 kHz. The
FM quadrature mixer provides inherent image rejection.
7.2 Quadrature oscillator
The internally tuned LC VCO provides the Local Oscillator (LO) signal for the FM
quadrature mixer. The VCO frequency range is 150 MHz to 217 MHz.
7.3 Selectivity
Fully integrated I and Q channel IF filter.
7.4 Demodulator
The FM quadrature demodulator is an integrated PLL demodulator.
7.5 Level voltage generator and analog-to-digital converter
The level voltage is analog-to-digital converted with 3 bits and output via the data line.
7.6 IF counter
The IF counter outputs a 16-bit count result via the data line.
7.7 Mute
The digital interface controls the audio mute and output level.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
7 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
7.8 Stereo decoder
The PLL stereo decoder is adjustment free. The stereo decoder can be switched to mono
via the digital interface.
8. Digital interface (3-wire bus)
The TEA5880TS has a 3-wire bus with read/write, clock and data line.
The register set of the TEA5880TS can be accessed via the digital interface.
Table 4:
Digital interface pins
Pin number Name
Type
Description
Remark
Pin 6
R/W
input
LOW is read from TEA5880TS;
HIGH is write to TEA5880TS
Pin 8
Pin 7
CLOCK
DATA
input
clock
rising edge
input/output bidirectional data
R/W
stereo LED
OUTPUT
SOURCE
stereo clock
IF OSC
SELECTOR
FM OSC
CLOCK
R/W
15 BITS SIPO (SERIAL IN PARALLEL OUT)
4 bits data 11 bits data
CONTROL
REGISTER A
control bits
control bits
control bits
DATA
ADDRESS
DECODER
CONTROL
REGISTER B
CONTROL
REGISTER C
REST OF THE
REGISTERS
control bits
R/W
COUNTER 1 (16 bits)
16 bits data
STATUS REGISTER
16 bits data
1-bit data
enable
counter 1
16 BITS PISO (PARALLEL IN SERIAL OUT)
CLOCK R/W
001aaa668
Fig 4. Digital interface block diagram.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
8 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
8.1 Register description
Table 5:
Address
0000b
TEA5880TS registers description
Register name
VADC
Access
Operation
Data width
11 bits
Clocks
15
write only
write only
write only
write only
VADC register
control register C
control register A
0001b
CTRL_C
11 bits
15
0010b
CTRL_A
11 bits
15
0011b
OSC_STEREO
oscillator stereo
decoder clock
11 bits
15
0100b
0101b
0110b
0111b
-
CTRL_B
CAP_FM
OSC_IF
write only
write only
write only
write only
read only
read only
control register B
capacitor bank FM
oscillator IF
11 bits
11 bits
11 bits
11 bits
16 bits
16 bits
15
15
15
15
15
15
OSC_FM
STATUS
COUNTER
oscillator FM
status register
counter register
-
Table 6:
Bit
VADC - (address 0h) bit description
Symbol
Description
14 to 11
10 to 6
5
-
address bits
VADC2[4:0] controls the width filter
-
not applicable; should be written to logic 0
4 to 0
VADC1[4:0] controls the center filter
Table 7:
Bit
CTRL_C - (address 1h) bit description [1]
Symbol
Description
14 to 11
10 and 9
8
-
-
-
-
-
address bits
reserved for production test; should be written to logic 0
reserved for swapping counters1 and 2; should be written to logic 0
not applicable; should be written to logic 0
7 to 4
3 to 1
reserved for time delay selection (counter 2); application should keep
0
-
reserved for enable counter 2; should be written to logic 0
[1] The application should write logic 0 to this register at start-up to ensure that the device functions correctly.
Table 8:
Value
000b
001b
010b
011b
100b
101b
110b
111b
Time delay selection
Decimal
Stop value
count 2
0
1
2
3
4
5
6
7
count 8
count 32
count 128
count 512
count 2048
count 8192
count 32768
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
9 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
Table 9:
Bit
CTRL_A - (address 2h) bit description
Symbol
Description
14 to 11
10 to 7
-
address bits
OUTPUT_
SELECT[3:0]
selects an internal circuit as output for measurement purpose;
6
5
STE_PMUTE
mutes the stereo PLL when set to logic 1; this bit should be
set during calibration of the stereo decoder clock and should be
cleared during normal operation
DEM_PMUTE
mutes the demodulator PLL when set to logic 1; this bit
should be set during calibration of the IF frequency and should
be cleared during normal operation
4
3
2
1
0
STE_INT_OFF#
turns off the stereo integrator loop when set to logic 0
enables measurement when set to logic 0
mutes the audio when set to logic 1
EN_MEAS#
AMUTE
FM
-
enables the FM circuitry when set to logic 1
reserved for AM circuitry; should be written to logic 0
Table 10: Description of OUTPUT_SELECT bits
Symbol
Value
0000b
0001b
0010b
0011b
0100b
0101b
0110b
0111b
1000b
1001b
Decimal Output selected
OS-NONE
0
no output selected
FM oscillator
OS_FM_OSC
OS_NA2
1
2
not defined
OS_CNT2_RDY_NA
OS_NA4
3
reserved for counter 2 ready output
not defined
4
OS_STEREO_DEC
OS_NA6
5
stereo decoder clock
not defined
6
OS_STEREO_LED
OS_NA8
7
stereo LED
8
not defined
OS_IF_OSC
9
IF oscillator
OS_INTERRUPT_NA 1010b
10
11
reserved for interrupt output
OS_PISO
1011b
PISO output (reading STATUS / COUNTER
register)
OS_NA12
OS_RDS_NA
OS_NA14
OS_NA15
1100b
1101b
1110b
1111b
12
13
14
15
not defined
reserved for RDS output
not defined
not defined
Bit
Symbol Description
address bits
SO[10:0] 11-bit digital-to-analog converter for adjusting the stereo decoder clock
14 to 11
10 to 0
-
[1] The frequency is decreased when increasing the content of this register.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
10 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
Table 12: CTRL_B - (address 4h) bit description
Bit Symbol Description
14 to 11 -
address bits
10
L_CNT
latch counter: a transition from logic 1 to logic 0 will latch the
COUNTER register into the PISO (reading the PISO hereafter will read
the COUNTER register)
9
L_STS
-
latch status: a transition from logic 1 to logic 0 will latch the STATUS
register into the PISO (reading the PISO hereafter will read the STATUS
register)
8 to 6
reserved for output level control; should be written with 4 (100b);
5
4
DEEMP
de-emphasis: logic 1 is 75 µs (USA), logic 0 is 50 µs (Europe, Japan)
PISO_CLR
a transition from logic 1 to logic 0 will clear the PISO; the PISO should
be clear before reading the STATUS/COUNTER register
3
2
1
0
CNT_RST
CNT1_EN
-
a transition from logic 1 to logic 0 will clear both counter 1 and counter 2
counter 1 enabled (counting mode) when set to logic 1
should be written to logic 0
MONO
mono mode when set to logic 1, stereo mode when set to logic 0
Table 13: Description of output level control register bits
Value
0000b
0001b
0010b
0011b
0100b
0101b
0110b
Decimal
Output level
12 mV
0
1
2
3
4
5
6
20 mV
35 mV
60 mV
100 mV
170 mV
200 mV
Bit
Symbol
Description
14 to 11 -
address bits
10
-
reserved for capacitor extra current; this bit should be written to logic 1
by any access to the CAP_FM to ensure that the device functions
properly
9 to 8
7 to 0
-
reserved, should be written to logic 0
FC[7:0]
FM capacitor bank switches for adjusting the FM (RF) frequency in big
steps. Every bit, when set, will switch on a capacitor with a weight
according to its position i.e. bit 0 has weight 1, bit 1 has weight 2, bit 2
has weight 4 etc, bit 6 has weight 64, except for bit 7, which also has the
same weight as bit 6; there is thus only 71⁄2 effective bits; this means
that the value range 0 to 127 will switch on different capacitors the value
range 128 to 191 switches on the same capacitors as range 64 to 127,
the value range 192 to 255 will switch on different capacitors (an
overlapped range of 64 values caused when FC[7:6] = 01b or 10b)
[1] The frequency is decreased when increasing the content of this register (more capacitors).
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
11 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
Bit Symbol Description
14 to 11 - address bits
10 to 0 IFO[10:0] 11-bit digital-to-analog converter for adjusting the IF frequency
[1] The frequency is decreased when increasing the content of this register.
Bit
Symbol Description
address bits
14 to 11 -
10 to 0 FO[10:0] 11-bit digital-to-analog converter for adjusting the FM frequency in fine steps;
this register is used in combination with the CAP_FM register to set a FM
frequency
[1] The frequency is increased when increasing the content of this register.
Bit
Symbol Description
15 to 9 FS[6:0]
field strength, indicated by the amount of bits set:
0 bits set = < 10 dBµV
1 bit set = 10 dBµV to 20 dBµV
2 bits set = 20 dBµV to 30 dBµV
3 bits set = 30 dBµV to 40 dBµV
4 bits set = 40 dBµV to 50 dBµV
5 bits set = 50 dBµV to 60 dBµV
6 bits set = 60 dBµV to 70 dBµV
7 bits set = > 70 dBµV
8
-
not applicable; always read as logic 1
chip revision; the revision for TEA5880TS is 100b
not applicable; always read as logic 1
reserved for production test
7 to 5
R[2:0]
4 to 3
-
-
-
-
2
1
0
not applicable; always read as logic 1
reserved for production test
[1] This register does not have an address. To read the status register, latch its content into the PISO (using
L_STS bit in control register B) then read out the PISO.
Bit
Symbol
Description
15 to 0 CNT[15:0] pulses counted during the period that the counter is enabled and the NR/W
line the 3 wire bus is low
[1] This register does not have an address. To read the counter register, latch its content into the PISO (using
L_CNT bit in control register B) then read out the PISO.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
12 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
8.2 Accessing the TEA5880TS
Access to the TEA5880TS can be achieved via the 3-wire bus. At the host side, the R/W
and CLOCK are output signals, while the DATA signal is bidirectional.
When powered up, the host should initialize the 3-wire bus in the host read mode as
follows:
1. Set (at host side) the DATA line into input mode
2. R/W set to LOW
3. CLOCK set to LOW.
Note: Use the following sequence for changing read/write mode:
1. To change from host read mode to host write mode proceed as follows:
a. Keep the CLOCK signal LOW
b. Set the R/W signal to HIGH (write mode)
c. Set the DATA pin (of the application controller) into output mode.
2. To change from host write mode to host read mode proceed as follows:
a. Keep the CLOCK signal LOW
b. Set the DATA pin (of the application controller) into input mode
c. Set R/W to LOW (input mode).
8.3 Writing to the TEA5880TS
Writing to the TEA5880TS is achieved with a 15-bit data pattern:
• D[14:11]: 4-bit register address
• D[10:0]: 11-bit register data.
The data pattern is sent serially to the TEA5880TS as follows:
1. Drive R/W pin HIGH to set the TEA5880TS in input mode
2. Drive the DATA pin to correct level
3. Generate positive edge of CLOCK (driving CLOCK into LOW-to-HIGH transition)
4. Delay some time to meet the data hold time requirement
5. Driving CLOCK into HIGH-to-LOW transition
6. Repeat step (2) to (5) 15 times to shift the 15-bit data pattern into the TEA5880TS
7. Drive R/W pin LOW; this signals the TEA5880TS to latch the data into the correct
register.
Note: The application should shift the LSB out first.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
13 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
8.4 Reading from the TEA5880TS
Only the status or the counter register can be read from the TEA5880TS.
These are 16-bit registers and can be read serially as follow:
1. Select OS_PISO (parallel in, serial out) as output (control register A,
OUTPUT_SELECT bits)
2. Clear the PISO (control register B, PISO_CLR bit, pulse HIGH-to-LOW transition)
3. Latch the counter register (control register B, L_CNT bit, pulse HIGH-to-LOW
transition) or the status register (control register B, L_STS bit, pulse HIGH-to-LOW
transition) into the PISO
4. Drive R/W pin LOW to set the TEA5880TS in output mode
5. Read the first bit at pin DATA
6. Generate positive CLOCK pulse (LOW-to-HIGH transition)
7. Delay for a period of time to meet the data set-up time requirement
8. Read the data bit at pin DATA
9. Drive CLOCK into HIGH-to-LOW transition
10.Repeat step (6) to (9) 15 times to shift the remaining 15 bits of data out of the chip
Note: The TEA5880TS will shift the MSB out first.
8.5 Measuring frequency with the TEA5880TS
The three frequencies: IF, stereo decoder clock and FM can be measured by using the
counter register and a software timing window. This is achieved as follows:
1. Select the output to be measured (control register A, OUTPUT_SELECT bits, select
OS_STEREO_DEC, OS_IF_OSC or OS_FM_OSC output)
2. Enable measure mode (clear EN_MEAS# bit of control register A)
3. Reset the counter (control register B, CNT_RST bit, pulse HIGH-to-LOW transition)
4. Start the counter on the TEA5880TS (control register B, set CNT1_EN bit); at the
moment the R/W signal goes LOW the counter starts
5. Wait time t
6. To stop the counter, first set the R/W signal HIGH, then disable the counter in the
TEA5880TS (control register B, clear CNT1_EN bit)
7. Read the pulse count n from the counter register of the TEA5880TS
8. Restore the measure mode
9. Restore the output select bits.
Note: The measuring window begins at the moment the R/W signal is driven LOW (point
4) and ends when the R/W signal is driven HIGH (point 6).
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
14 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
The IF and stereo decoder frequency can be calculated using the equation f = n/t, and the
FM frequency can be calculated using the equation f = (n/t) x 256.
Note: The precision of ‘f’ depends on the following:
• The duration of t. 1 pulse wrong at t = 1 ms results in more deviation than at t = 32 ms
• The precision of the measuring window: calculate with t = 32 ms gives other ‘f’ values
than with t = 32 ms. In the application care should be taken to have an accurate
measuring window t.
8.6 Initialize the TEA5880TS
After power-up, the TEA5880TS needs to be initialized as follows:
• Control register A: STE_PMUTE = 1; DEM_PMUTE = 1; AMUTE = 1; FM = 1; other
bits = 0
• Control register B: CNT_RST = 1; PISO_CLR = 1; MONO = 1; DEEMP = 1 (for
Europe); Bit [8:6] = 100b; other bits = 0
• Control register C: All bits = 0
• VADC register: VADC1 = 26 (decimal), this value should not be changed hereafter;
VADC2 = 18 (decimal), this value should not be changed hereafter
• Calibrate the IF frequency at 110 kHz
• Calibrate the stereo decoder clock at 37.5 kHz (to reduce the initialization time,
calibration of the stereo decoder clock can be postponed until the stereo mode is
selected).
9. Timing diagrams
R/W
CLOCK
1
11
15
LSB
MSB LSB
MSB
DATA
11-bit data
4-bit address
001aaa669
Fig 5. Writing data.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
15 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
R/W
CLOCK
0
15
DATA LSB
MSB
16-bit data
001aaa670
Fig 6. Reading data.
enable FM OSC at output source selector
enable internet clock
set 16-bit counter clear
reset 16-bit counter clear
enable 16-bit counter to count
timing width 8 ms to 100 ms
disable 16-bit counter
enable PISO at output source
001aaa671
Fig 7. Measuring sequence.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
16 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
10. Limiting values
Table 19: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCCD
VCCA
Tstg
Parameter
Conditions
Min
Max
+5
Unit
V
digital supply voltage
analog supply voltage
storage temperature
ambient temperature
−0.3
−0.3
−55
+8
V
+150
+75
°C
°C
°C
V
Tamb
VCCA = VCC(VCO) = VCCD = 3 V
VCCA = VCC(VCO) = VCCD = 5 V
−10
−40
+85
Vesd
electrostatic discharge voltage
for all pins
−200
−2000
+200
+2000
V
[1] Machine model (R = 10 Ω, C = 200 pF, 75 µH).
[2] Human body model (R = 1.5 kΩ, C = 100 pF).
11. Thermal characteristics
Table 20: Thermal characteristics
Symbol
Parameter
Conditions
Typ
<tbd>
Unit
K/W
Rth(j-a)
thermal resistance from junction to ambient in free air
12. Characteristics
Table 21: Digital input AC values
Symbol
Digital inputs
VIH
Parameter
Conditions
Min
Typ
Max
Unit
HIGH-level input voltage
LOW-level input voltage
IOH = 500 µA
1.4
-
-
-
-
V
V
VIL
0.6
Digital outputs
Isink (L)
LOW-level sink current
500
-
-
-
-
µA
VOL
LOW-level output voltage
IOL = 500 µA
0.6
V
Timing
fclk
clock input
-
-
-
-
1
-
MHz
ns
tCLK(H)
clock HIGH time
clock LOW time
495
495
tCLK(L)
-
ns
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
17 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
001aaa673
20
dB
(1)
0
−20
−40
−60
(2)
(3)
(4)
(5)
−10
30
70
110
RFIN (dBµV)
(1) Mono signal.
(2) Mono noise.
(3) Stereo left.
(4) Stereo right.
(5) Stereo noise.
Fig 8. Signal characteristics.
001aaa674
5
THD
(%)
4
3
2
1
0
−10
30
70
110
RFIN (dBµV)
THD = 30 %.
Fig 9. Total harmonic distortion.
13. Components list
No external components necessary.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
18 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
14. Printed-circuit board layout for SSOP24 package
The printed-circuit board traces from LL1 to VCC1 and from VCC1 to LR1 as shown in
Figure 10, are to create two inductors, each of approximately 38 nH. These inductors,
together with internal capacitors, form part of the LC oscillator to determine the FM tuning
band. If the value of the inductors becomes much greater than 38 nH, the whole FM
tuning band (normally from 76 MHz to 108 MHz) will be shifted lower. If the value of the
inductors becomes much smaller than 38 nH, the whole FM tuning band (normally from
76 MHz to 108 MHz) will be shifted higher.
If the layout of the two inductance traces is not preferred, two SMD inductors can be used
to replace the two printed-circuit board inductance traces as an alternative. The layout of
the two SMD inductors should be as close to the pins as possible.
RFIN
GND
n.c.
RFGND
GND
n.c.
V
V
CCD
reserved
LL1
CCA
R/W
V
CC1
V
DATA
CLOCK
MPX
CC1
LR1
n.c.
3.5 mm
AUDL
AUDR
LED
n.c.
n.c.
GND
3.5 mm
001aaa675
(1) Width of printed-circuit board trace = 0.15 mm; spacing between printed-circuit board
trace = 0.15 mm.
(2) Pins 14, 15, 16, 21, 22 and 23 are not connected.
Fig 10. Printed-circuit board layout.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
19 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
15. Application information
FM antenna
RFIN
1
2
24
23
22
21
20
19
18
17
16
15
14
13
3
V
CCD
4
(1)
100 nF
V
LL1
V
5
CCA
R/W
DATA
CLOCK
MPX
V
6
CC1
(1)
TEA5880FM
100 nF
7
CC1
LR1
8
9
10
11
12
AUDL
AUDR
LED
001aaa672
(1) optional.
Fig 11. Application diagram.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
20 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
16. Package outline
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
D
E
A
X
v
c
H
M
A
y
E
Z
24
13
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
12
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
0.8
0.4
mm
2
0.65
1.25
0.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT340-1
MO-150
Fig 12. Package outline.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
21 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
17. Soldering
17.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
17.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
• below 225 °C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called
thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
17.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
22 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or
265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
17.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.
17.5 Package related soldering information
Table 22: Suitability of surface mount IC packages for wave and reflow soldering methods
Package [1]
Soldering method
Wave
Reflow[2]
BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,
SSOP..T[3], TFBGA, USON, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable[4]
suitable
PLCC[5], SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended[5] [6]
not recommended[7]
not suitable
suitable
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L[8], PMFP[9], WQCCN..L[8]
suitable
not suitable
[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
23 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
24 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
18. Revision history
Table 23: Revision history
Document ID
Release date Data sheet status
20040426 Preliminary data sheet
Change notice Order number
9397 750 13022
Supersedes
TEA5880_2
-
-
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
25 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
19. Data sheet status
Level Data sheet status[1] Product status[2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
[2]
Please consult the most recently issued data sheet before initiating or completing a design.
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
20. Definitions
21. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
22. Contact information
9397 750 13022
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 — 26 April 2004
26 of 27
TEA5880TS
Philips Semiconductors
Integrated FM stereo radio IC for host processor tuning
23. Contents
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
converter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
14
Printed-circuit board layout for SSOP24
package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 26 April 2004
Document order number: 9397 750 13022
Published in The Netherlands
|