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1
Toshiba Personal Computer
TECRA M4
Maintenance Manual
TOSHIBA CORPORATION
File Number 960-521
[CONFIDENTIAL]
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Preface
This maintenance manual describes how to perform hardware service maintenance for the
Toshiba Personal Computer TECRA M4, referred to as TECRA M4 in this manual.
The procedures described in this manual are intended to help service technicians isolate
faulty Field Replaceable Units (FRUs) and replace them in the field.
SAFETY PRECAUTIONS
Four types of messages are used in this manual to bring important information to your
attention. Each of these messages will be italicized and identified as shown below.
DANGER: “Danger” indicates the existence of a hazard that could result in death or
serious bodily injury, if the safety instruction is not observed.
WARNING: “Warning” indicates the existence of a hazard that could result in bodily
injury, if the safety instruction is not observed.
CAUTION: “Caution” indicates the existence of a hazard that could result in property
damage, if the safety instruction is not observed.
NOTE: “Note” contains general information that relates to your safe maintenance
service.
Improper repair of the computer may result in safety hazards. Toshiba requires service
technicians and authorized dealers or service providers to ensure the following safety
precautions are adhered to strictly.
‰ Be sure to fasten screws securely with the right screwdriver. Be sure to use the PH
Point size “0” and “1” screwdrivers complying with the ISO/DIS 8764-1:1996. If a
screw is not fully fastened, it could come loose, creating a danger of a short circuit,
which could cause overheating, smoke or fire.
‰ If you replace the battery pack or RTC battery, be sure to use only the same model
battery or an equivalent battery recommended by Toshiba. Installation of the wrong
battery can cause the battery to explode.
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The manual is divided into the following parts:
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Hardware Overview describes the Satellite R10 system unit and each
FRU.
Troubleshooting Procedures explains how to diagnose and resolve
FRU problems.
Test and Diagnostics describes how to perform test and diagnostic
operations for maintenance service.
Replacement Procedures describes the removal and replacement of the
FRUs.
Appendices The appendices describe the following:
‰ Handling the LCD module
‰ Board layout
‰ Pin assignment
‰ Keyboard scan/character codes
‰ Key layout
‰ Wiring Diagrams
‰ BIOS Rewrite Procedures
‰ EC/KBC Rewrite Procedures
‰ Reliability
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Conventions
This manual uses the following formats to describe, identify, and highlight terms and
operating procedures.
Acronyms
On the first appearance and whenever necessary for clarification acronyms are enclosed in
parentheses following their definition. For example:
Read Only Memory (ROM)
Keys
Keys are used in the text to describe many operations. The key top symbol as it appears on
the keyboard is printed in boldface type.
Key operation
Some operations require you to simultaneously use two or more keys. We identify such
operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause
(Break) means you must hold down Ctrl and at the same time press Pause (Break). If
three keys are used, hold down the first two and at the same time press the third.
User input
Text that you are instructed to type in is shown in the boldface type below:
DISKCOPY A: B:
The display
Text generated by the Satellite R10 that appears on its display is presented in the type face
below:
Format complete
System transferred
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Table of Contents
Chapter 1
Hardware Overview
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
Features...................................................................................................................... 1-1
2.5-inch Hard Disk Drive......................................................................................... 1-11
Optical Drive............................................................................................................ 1-13
Keyboard.................................................................................................................. 1-26
TFT Color Display................................................................................................... 1-27
Power Supply........................................................................................................... 1-29
Batteries ................................................................................................................... 1-32
AC Adapter .............................................................................................................. 1-35
Chapter 2
Troubleshooting Procedures
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
Troubleshooting......................................................................................................... 2-1
Troubleshooting Flowchart........................................................................................ 2-2
Power Supply Troubleshooting.................................................................................. 2-6
System Board Troubleshooting................................................................................ 2-17
USB 3.5” FDD Troubleshooting.............................................................................. 2-33
2.5” HDD Troubleshooting...................................................................................... 2-36
Keyboard Troubleshooting ...................................................................................... 2-41
Display Troubleshooting.......................................................................................... 2-42
Touch Pad Troubleshooting..................................................................................... 2-44
2.10 Selectable bay(optical drive) Troubleshooting ........................................................ 2-45
2.11 Modem Troubleshooting.......................................................................................... 2-46
2.12 Bluetooth Troubleshooting ...................................................................................... 2-47
2.13 LAN Troubleshooting.............................................................................................. 2-50
2.14 Sound Troubleshooting............................................................................................ 2-51
2.15 SD Card Slot Troubleshooting................................................................................. 2-52
2.16 Tablet Pen Troubleshooting..................................................................................... 2-53
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2.17 Wireless LAN Troubleshooting............................................................................... 2-55
Chapter 3 Tests and Diagnostics
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
The Diagnostic Test................................................................................................... 3-1
Executing the Diagnostic Test ................................................................................... 3-4
Setting of the hardware configuration........................................................................ 3-8
Heatrun Test............................................................................................................. 3-11
Subtest Names.......................................................................................................... 3-12
System Test.............................................................................................................. 3-14
Memory Test............................................................................................................ 3-16
Keyboard Test.......................................................................................................... 3-17
Display Test ............................................................................................................. 3-18
3.10 Floppy Disk Test...................................................................................................... 3-21
3.11 Printer Test............................................................................................................... 3-23
3.12 Async Test ............................................................................................................... 3-25
3.13 Hard Disk Test......................................................................................................... 3-26
3.14 Real Timer Test........................................................................................................ 3-29
3.15 NDP Test.................................................................................................................. 3-31
3.16 Expansion Test......................................................................................................... 3-32
3.17 CD-ROM/DVD-ROM Test ..................................................................................... 3-34
3.18 Error Code and Error Status Names......................................................................... 3-35
3.19 Hard Disk Test Detail Status.................................................................................... 3-38
3.20 Only One Test.......................................................................................................... 3-40
3.21 Head Cleaning.......................................................................................................... 3-48
3.22 Log Utilities ............................................................................................................. 3-49
3.23 Running Test............................................................................................................ 3-51
3.24 Floppy Disk Drive Utilities...................................................................................... 3-52
3.25 System Configuration .............................................................................................. 3-57
3.26 Wireless LAN Test Program (Intel-made b/g)......................................................... 3-59
3.27 Wireless LAN Test Program (Intel-made a/b/g)...................................................... 3-63
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program .................................................. 3-68
3.29 Sound Test Program................................................................................................. 3-82
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3.30 SETUP ....................................................................................................................3-88
Chapter 4 Replacement Procedures
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
Overview...................................................................................................................4-1
Battery pack ..............................................................................................................4-8
PC card/SD card......................................................................................................4-10
Memory module......................................................................................................4-12
HDD........................................................................................................................4-14
Selectable bay module ............................................................................................4-16
Keyboard.................................................................................................................4-19
Bottom cover assembly...........................................................................................4-21
Battery latch assembly/Selectable bay lock............................................................4-23
4.10 QI button assembly/PC card slot brace...................................................................4-25
4.11 Bluetooth module....................................................................................................4-27
4.12 MDC/Modem cable ................................................................................................4-29
4.13 Wireless LAN card .................................................................................................4-32
4.14 Fan/CPU..................................................................................................................4-34
4.15 DC-IN jack..............................................................................................................4-39
4.16 Penholder/RTC battery ...........................................................................................4-40
4.17 LCD harness holder ................................................................................................4-42
4.18 Mic (L) cable guide................................................................................................ 4-45
4.19 QI board/CN board ................................................................................................ 4-47
4.20 System board...........................................................................................................4-49
4.21 PC card slot cover ...................................................................................................4-51
4.22 Speaker....................................................................................................................4-52
4.23 Microphone/Front panel..........................................................................................4-53
4.24 Lens holder..............................................................................................................4-57
4.25 Touch pad................................................................................................................4-58
4.26 LCD unit & FL inverter..........................................................................................4-59
4.27 Application switch board........................................................................................4-63
4.28 LCD latch assembly................................................................................................4-64
4.29 Digitizer ..................................................................................................................4-65
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4.30 LCD harnesses & Wireless LAN/Bluetooth antennas............................................4-71
4.31 Hinge switch Board.................................................................................................4-76
4.32 Fluorescent Lamp....................................................................................................4-77
Appendices
Appendix A
Appendix B
Appendix C
Appendix D
Appendix E
Appendix F
Appendix G
Appendix H
Appendix I
Handling the LCD Module ....................................................................... A-1
Board Layout ............................................................................................ B-1
Pin Assignment ......................................................................................... C-1
Keyboard Scan/Character Codes .............................................................. D-1
Key Layout.................................................................................................E-1
Wiring Diagrams........................................................................................F-1
BIOS Rewrite Procedures......................................................................... G-1
EC/KBC Rewrite Procedures.................................................................... H-1
Reliability....................................................................................................I-1
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Chapter 1
Hardware Overview
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1 Hardware Overview
1
Hardware Overview
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1 Hardware Overview
Chapter 1
Contents
1.1
1.2
1.3
Features...................................................................................................................... 1-1
2.5-inch Hard Disk Drive......................................................................................... 1-11
Optical Drive............................................................................................................ 1-13
1.3.1
1.3.2
1.3.3
1.3.4
DVD-ROM Drive............................................................................... 1-13
DVD-ROM & CD-R/RW Drive ........................................................ 1-16
DVD Super Multi Drive..................................................................... 1-19
DVD Super Multi Drive (Double-layer) ............................................ 1-22
1.4
1.5
Keyboard.................................................................................................................. 1-26
TFT Color Display................................................................................................... 1-27
1.5.1
1.5.2
LCD Module ...................................................................................... 1-27
FL Inverter Board............................................................................... 1-28
1.6
1.7
Power Supply........................................................................................................... 1-29
Batteries ................................................................................................................... 1-32
1.7.1
1.7.2
1.7.3
Main Battery....................................................................................... 1-32
Battery Charging Control................................................................... 1-33
RTC Battery ....................................................................................... 1-34
1.8
AC Adapter.............................................................................................................. 1-35
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1 Hardware Overview
Figures
Figure 1-1
Figure 1-2
Figure 1-3
Figure 1-4
Figure 1-5
Figure 1-6
Figure 1-7
Figure 1-8
Figure 1-9
Front of the computer..................................................................................... 1-5
System units configuration ............................................................................ 1-6
System Block Diagram .................................................................................. 1-7
2.5-inch HDD............................................................................................... 1-11
DVD-ROM drive ......................................................................................... 1-13
DVD-ROM & CD-R/RW drive................................................................... 1-16
DVD Super Multi drive ............................................................................... 1-19
DVD Super Multi drive (Double-layer)....................................................... 1-22
Keyboard...................................................................................................... 1-26
Figure 1-10 LCD module................................................................................................. 1-27
Tables
Table 1-1
Table 1-2
Table 1-3
Table 1-4
Table 1-5
Table 1-6
Table 1-7
Table 1-8
Table 1-9
Table 1-10
Table 1-11
Table 1-12
Table 1-13
Table 1-14
Table 1-15
Table 1-16
2.5-inch HDD Specifications....................................................................... 1-11
DVD-ROM drive outline dimensions.......................................................... 1-13
DVD-ROM drive specifications .................................................................. 1-14
DVD-ROM & CD-R/RW drive outline dimensions.................................... 1-16
DVD-ROM & CD-R/RW drive specifications............................................ 1-17
DVD Super Multi drive outline dimensions................................................ 1-19
DVD Super Multi drive specifications ........................................................ 1-20
DVD Super Multi drive (Double-layer) outline dimensions ....................... 1-22
DVD Super Multi drive (Double-layer) specifications................................ 1-23
LCD module specifications (14.1 TFT)....................................................... 1-27
FL inverter board specifications .................................................................. 1-28
Power supply output specifications ............................................................. 1-30
Battery specifications................................................................................... 1-32
Time required for charges of main battery .................................................. 1-33
Data preservation time................................................................................. 1-33
RTC battery charging/data preservation time.............................................. 1-34
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1 Hardware Overview
Table 1-17
AC adapter specifications ............................................................................ 1-35
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1.1 Features
1 Hardware Overview
1
Features
1.1 Features
The TECRA M4 is an ultra thin and lightweight tablet PC realizing cable-less environment
on a table by wireless function with a Intel ® Mobile Pentium ®-M processor realizing high
performance.
‰ Microprocessor
Microprocessor that is used will be different of the model.
¾ Intel ® Mobile Pentium ®-M Processor
1.60GHz (Processor Number ; 730)
1.73GHz (Processor Number ; 740)
1.86GHz (Processor Number ; 750)
2.00GHz (Processor Number ; 760)
2.13GHz (Processor Number ; 770)
PPV: 0.748 to 1.308
L1 cache : 64KB (32KB(Code) + 32KB(Data))
L2 cache : 2MB
‰ Chipset
Equipped with Intel 915PM as North Bridge, Intel ICH6-M as South Bridge and
Texas Instrument PCI7411ZHK as Card Controller.
‰ GPU Controller
Equipped with a nVIDIA MEP43L with 64MB/128MB.
‰ Memory
Two DDR2 SO-DIMM slots support DDR2 400 or DDR2 533. Memory modules can
be installed to a maximum of 2GB (2,048MB). Memory modules of 256MB, 512MB
and 1GB sizes are available.
‰ HDD
Single SATA 40/60/80/100GB internal drive. 2.5-inch x 9.5mm height
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1 Hardware Overview
1.1 Features
‰ Selectable Bay
Supporting hot-swap with DVD-ROM drive, DVD-ROM & CD-R/RW drive, DVD
Super Multi drive, 2nd HDD adapter and 2nd battery.
‰ USB FDD
3.5 inch USB FDD supports 720KB/1.44MB formats.
‰ Display
Display swivels automatically 0/90/180/270 degrees by display driver. LCD and CRT
can be displayed at the same time.
LCD Built-in 14.1 inch, 16M colors, SXGA+ (1,400×1,050 dots), thin type low
temperature poly-silicon TFT color display.
External monitor Supported via an RGB connector
Video-out Supported via an S-Video connector
‰ Digitizer
Digitizer is installed at the rear of LCD unit. The supplied tablet pen enables pen
computing.
‰ Tablet pen / Reserve pen
Tablet pen / Reserve pen can be used as a mouse by touching the display softly with
the pen tip. Tablet button on the side of the pen corresponds to the right click of the
mouse. Erase button on the pen tail can be used as an eraser depending on the
application.
‰ Keyboard
Keyboard has 85(US)/86(UK)-key with a pointing stick (AccuPoint) and supports
Windows key and Hot key.
‰ Touch pad
Touch pad is installed as a pointing device.
‰ Batteries
The computer has two batteries: a rechargeable Lithium-Ion main battery pack and an
RTC battery (that backs up the Real Time Clock and CMOS memory).
1-2
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1 Hardware Overview
‰ USB (Universal Serial Bus)
Three USB ports are usable. The ports comply with the USB2.0 standard, which
enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also
supported.
‰ PC card slot
The PC card slot (PCMCIA) accommodates one 5mm Type II card. (Based on PC
Card Standard, supporting CardBus)
‰ SD card slot
A SD Card Slot can accommodate Secure Digital flash memory cards with various
capacities. Supporting memory card and I/O card.
‰ Sound system
The sound system is equipped with the following features:
- Built-in stereo speakers
- Built-in monaural microphone
- Stereo Headphone jack (3.5mm mini headphone jack)
- External microphone jack (3.5mm mini microphone jack)
‰ Switch/Button
Windows Security tablet button, ESC/Rotation button, Cross Function button,
Toshiba Application button and Wireless communication switch are available.
‰ Internal Modem
The internal modem is equipped as a modem daughter card (MDC).
The internal modem provides capability for data and fax communication and supports
ITU-T V.90 standard. For data reception it operates at 56Kbps and for data
transmission it operates at 33.6Kbps. For fax transmission, it operates at 14,4Kbps.
The speed of data transfer and fax depends on analog telephone line condition. It has
an RJ11 modem jack for connecting to a telephone line.
‰ LAN
The internal LAN supports 10/100Mbit or Gigabit Ethernet.
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1 Hardware Overview
1.1 Features
‰ Wireless LAN
Wireless LAN Card can be equipped with mini-PCI slot. Based on IEEE802.11b/g,
a/b/g with 2.45GHz/5.0GHz Dual-band antenna.
‰ i.LINK (IEEE1394)
This port enables high-speed data transfer directly from external devices such as
digital video cameras.
‰ Docking port
Advanced Port Replicator III and Tablet Multi Dock II can be connected through
docking port on the bottom.
‰
‰
Infrared port
The infrared port is compatible with Fast infrared (FIR) standards enabling wireless
4 Mbps, 1.152 Mbps, 115.2 kbps, 57.6 kbps, 38.4 kbps, 19.2 kbps or 9.6 kbps data
transfer with Infrared Data Association (IrDA) 1.1 compatible external devices.
Bluetooth
The computer is equipped with Bluetooth (V1.2) communications standard that
enables wireless connection between electronic devices such as computers and
printers. It supports wireless communication switch.
1-4
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1.1 Features
1 Hardware Overview
Figure 1-1 shows the front of the computer and Figure 1-2 shows the system units
configuration.
Figure 1-1 Front of the computer
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1 Hardware Overview
1.1 Features
Figure 1-2 System units configuration
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1.1 Features
1 Hardware Overview
Figure 1-3 shows the system block diagram.
Figure 1-3 System Block Diagram
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1 Hardware Overview
1.1 Features
The PC contains the following components.
‰ CPU
¾ Intel ® Mobile Pentium ®-M Processor
1.60GHz (Processor Number ; 730)
1.73GHz (Processor Number ; 740)
1.86GHz (Processor Number ; 750)
2.00GHz (Processor Number ; 760)
2.13GHz (Processor Number ; 770)
Core voltage : 0.748 to 1.308
FSB
: 533MHz
L1 cache
L2 cache
Support
: 64KB [32KB (Code) + 32KB (Data)]
: 2MB
: Geyservile III , Deeper Sleep Mode
‰ Memory
Two DDR2 SO-DIMM slots support DDR2 400/DDR2 533 Memory modules in
256MB, 512 MB and 1GB can be installed to a maximum of 2GB (2,048MB).
1.8V operation
240 pin, SO Dual In-line Memory Modules (SO-DIMM)
Supports PC3200/PC4300
‰ BIOS ROM (Flash memory)
8Mbit
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1.1 Features
1 Hardware Overview
‰ PCI chipset
This gate array incorporates the following elements and functions
Intel 915PM (North Bridge)
-
-
-
-
-
-
Dothan Processor System Bus Support
System Memory Interface
Memory Control: supports DDR333, DDR2-400/DDR2-533 2Gbmax.
Graphics I/F: x16 PCI Express Based Graphics I/F
DMI(Direct Media Interface)
1,257-ball, 40.0×37.5×2.6mm, FC-BGA package
Intel ICH6-M (South Bridge)
DMI(Direct Media Interface)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
PCI Express I/F (4 ports)
PCI Bus I/F Rev2.3（7 PCI REQ/GNT Pairs）
Integrated Serial ATA Host Controller (2 Prots,150MB/S)
Integrated IDE Controller（Ultra ATA 100/66/33）
AC’97 2.3 codecs
USB 1.1/2.0 Controller 8 ports (EHCI: Enhanced Host Controller)
Built-in LAN controller (WfM 2.0 & IEEE 802.3 compliance)
Power Management (ACPI 2.0 compliance)
SMBus2.0 controller
FWH interface (BIOS)
LPC interface (EC/KBC, Super I/O)
IRQ controller
Serial Interrupt Function
Suspend/Resume control
Built –in RTC
GPIO
609-ball, 31×31mm, micro BGA Package
PC Card Controller (Texas Instruments-made PCI7411ZHK)
-
-
-
-
-
PCI interface
CardBus/Ultra Media controller
SD card controller
IEEEE1394 controller
288-ball (16x16x1.4) BGA package
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1 Hardware Overview
1.1 Features
‰ GPU controller (Internal graphic controller)
-
-
-
-
VRAM 64/128MB
PCI Express interface
LCD I/F LVDS 2ch
S-video support
‰ Batteries
The main battery is a detachable lithium-ion main battery (10.8V, 4700mAh, 6 cell)
and the RTC battery is a lithium ion battery (2.4V-16mAh).
‰ Modem controller
Supported by MDC. Using of the secondary AC97 Line
‰ LAN controller (Marvell made)
Controls LAN and supports 10/100Mbit or Gigabit Ethernet.
‰ Other main system chips
- EC/KBC (Mitsubishi-made LPC microcontroller M306KAFCLRP)
- PSC (Toshiba-made TMP87PM48UG)
- Temperature sensor (ADM-made ADM1032ARMZ)
- Acceleration sensor (ST Micro-made LIS3L02AQ)
- Super I/O (SMSC-made LPC47N217-JN)
- SOUND CODEC (ADM-made AD1981B)
- AMP (Matsushita-made MM1667XHFE) + HP AMP (MAX4410)
- CLK Generator (ICS-made ICS950812CGLFT)
1-10
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1.2 2.5-inch Hard Disk Drive
1 Hardware Overview
1.2 2.5-inch Hard Disk Drive
A compact, high-capacity SATA HDD with a height of 9.5mm contains a 2.5-inch magnetic
disk and magnetic heads.
Figure 1-4 shows a view of the 2.5-inch HDD and Tables 1-1 list the specifications.
Figure 1-4 2.5-inch HDD
Table 1-1 2.5-inch HDD Specification (1/2)
Specifications
Items
FUJITU
FUJITU
FUJITU
G8BC0001R410
G8BC0001R610
G8BC0001R810
Outline
Width (mm)
70
9.5
dimensions Height (mm)
Depth (mm)
100
Weight (g)
99 max.
Storage size (formatted)
Speed (RPM)
40GB
60GB
5,400
80GB
Data transfer rate
Media
53.9MB/s max
Host
1.5Gb/s (Serial-ATA Generation-1)
Data buffer size (MB)
8
Average random seek time
(ms) Read
12
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1 Hardware Overview
1.2 2.5-inch Hard Disk Drive
Table 1-1 2.5-inch HDD Specifications(2/2)
Specifications
Items
TOSHIBA
HDD2D30BZK01
Outline
Width (mm)
100
9.5
dimensions Height (mm)
Depth (mm)
69.85
98
Weight (g)
Storage size (formatted)
Speed (RPM)
100GB
5400
Data transfer speed (MB/s)
Internal
Host
236.1-456.0
150
Data buffer size (MB)
8
Access time (ms)
Average seek time
Track to Track
Max seek
12
2
22
1-12
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1.3 Optical Drive
1 Hardware Overview
1.3 Optical Drive
1.3.1 DVD-ROM Drive
The DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD-
ROM and CD-R/RW and DVD-RAM (read-only).
The DVD-ROM drive is shown in Figure 1-5. The dimensions and specifications of the
DVD-ROM & CD-R/RW drive are described in Table 1-2, Table 1-3.
Figure 1-5 DVD-ROM drive
Table 1-2 DVD-ROM drive outline dimensions
Specifications
Items
TSST
TEAC
G8BC0002B410
G8BC0002E410
Outline
Width (mm)
128.0
12.7
128±0.2
12.7±0.2
126.1
dimensions Height (mm)
Depth (mm)
129.4
180
Weight (g)
170
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1.3 Optical Drive
Table 1-3 DVD-ROM drive specifications (1/2)
Drive Specification
Parameter
TSST (G8CC0002B410)
DVD-ROM(Single-L) MAX 8x(CAV) [MAX 10816KB/s]
DVD-ROM(Double-L) MAX 6x(CAV) [MAX 8112KB/s]
DVD-R/-RW MAX 4x(CAV) [MAX 5408KB/s]
DVD+R/+RW MAX 4x(CAV) [MAX 5408KB/s]
DVD-RAM(Ver2.1) MAX 2x(ZCLV) [MAX 2704KB/s]
CD(Mode1) MAX 24x(CAV) [MAX 3600KB/s]
CD(Mode2) MAX 24x(CAV) [MAX 4104KB/s]
CD-DA(Mode1) MAX 10x(CLV) [MAX 1500KB/s]
CD-DA(Mode2) MAX 10x(CLV) [MAX 1710KB/s]
Read
Data transfer
speed
PIO mode16.7 MB/s PIO-MODE4 supported
DMA mode16.7 MB/s MultiwordDMA-MODE2 supported
Ultra DMA mode 33.3 MB/s UltraDMA-MODE2 supported
ATAPI interface
(MB/s)
CD-ROM
DVD-ROM
DVD-RAM
110 (Random)
110 (Random)
140 (Random)
256KByte
Access time
(ms)
Buffer memory
CD-DA, CD+(E)G, CD-MIDI, CD-TEXT, CD-ROM,
CD-ROM XA, CD-I, CD-I Bridge(Photo-CD, Video-CD),
Multi-session CD(Photo-CD, CD-EXTRA, CD-R,
CD-RW, Portfolio),CD-R, CD-RW
CD
Supported disk
format
DVD-ROM (DVD-5, DVD-9, DVD-10, DVD-18),
DVD-R (Ver1.0, Ver2.1), DVD-RW (Ver1.0, Ver1.1),
DVD+R, DVD+RW, DVD-RAM (Version2.1)
DVD
1-14
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Table 1-3 DVD-ROM drive specifications (2/2)
Drive Specification
Parameter
TEAC (G8CC0002E410)
DVD-ROM MAX 8x(CAV) [MAX 4594KB/s]
DVD-VIDEO MAX 4x(CAV) [MAX 2297KB/s]
DVD-R/RW MAX 8x(CAV) [MAX 4594KB/s]
DVD-RAM(4.7GB) MAX 5x(CAV) [MAX 3246KB/s]
DVD-RAM(2.6GB) MAX 2.5x(CAV) [MAX 1626KB/s]
CD(Mode1) MAX 24x(CAV) [MAX 5137KB/s]
CD(Mode2) MAX 20x(CAV) [MAX 4280KB/s]
CD-RW MAX 24x(CLV) [MAX 5137KB/s]
Read
Data transfer
speed
PIO mode16.7 MB/s PIO-MODE4 supported
DMA mode16.7 MB/s MultiwordDMA-MODE2 supported
Ultra DMA mode 33.3 MB/s UltraDMA-MODE2 supported
ATAPI interface
(MB/s)
CD-ROM
120 (Random)
130 (Random)
256K
Access time
(ms)
DVD-ROM
Buffer memory
CD-DA, CD-ROM MODE1, CD-ROM MODE2,
Multi-session CD, Video-CD, Enhanced CD,
CD-TEXT, Photo-CD, addressing Method 2
CD
Supported disk
format
DVD-ROM
DVD-R (General, Authoring, Single/Multi-boarder),
DVD-Video, DVD-RW (Single/Multi-boarder, Packet),
DVD-RAM (4.7GB, 2.6GB),
DVD
DVD+R/RW (Single/Multi-boarder, Packet)
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1.3 Optical Drive
1.3.2 DVD-ROM & CD-R/RW Drive
The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-
inch) CD/DVD-ROM and CD-R/RW.
The DVD-ROM & CD-R/RW drive is shown in Figure 1-6. The dimensions and
specifications of the DVD-ROM & CD-R/RW drive are described in Table 1-4, Table 1-5.
Figure 1-6 DVD-ROM & CD-R/RW drive
Table 1-4 DVD-ROM & CD-R/RW drive outline dimensions
Parameter
Maker (code)
Standard value
PCC
(G8CC0001X411)
TEAC
(G8CC0001Y411)
Width (mm)
Height (mm)
Depth (mm)
Mass (g)
128
Outline
12.7 (excluding projections)
dimensions
129.0
190±10
1-16
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Table 1-5 DVD-ROM & CD-R/RW drive specifications (1/2)
Drive Specification
Parameter
PCC (G8CC0001X411)
DVD-ROM MAX 8x(CAV) [MAX 10800 KB/s]
CD-ROM MAX 24x(CAV) [MAX 3600 KB/s]
Read
Write
CD-R
CD-RW
4x/8x(CLV), 16x(PCAV), MAX24x(CAV)
4x(CLV)
Data transfer
speed
High Speed CD-RW
Ultra Speed CD-RW
4x/8x/10x(CLV)
10x(CLV), MAX24x(CAV)
PIO mode16.6 MB/s PIO MODE4 supported
DMA mode16.6 MB/s Multiword MODE2 supported
Ultra DMA mode 33.3 MB/s Ultra DMA MODE2
ATAPI interface
(MB/s)
CD-ROM
150 (Random)
180 (Random)
2MB
Access time
(ms)
DVD-ROM
Buffer memory
CD-DA,CD-ROM,CD-ROM XA
Photo CD, CD-Extra(CD+), CD-text
CD
Supported disk
format
DVD-R (DVD-R Multi-boarder supported)
DVD-RW(Ver.1.1), DVD-Video, DVD+R, DVD+RW,
DVD-RAM(2.6GB/4.7GB)
DVD
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1.3 Optical Drive
Table 1-5 DVD-ROM & CD-R/RW drive specifications (2/2)
Drive Specification
Parameter
TEAC (G8CC0001Y411)
DVD-ROM MAX 8x(CAV) [MAX 10800 KB/s]
CD-ROM MAX 24x(CAV) [MAX 3600 KB/s]
Read
Write
CD-R
CD-RW
4x/10x(CLV), 16x(CAV), MAX 24x(CAV)
4x(CLV)
Data transfer
speed
High Speed CD-RW
Ultra Speed CD-RW
4x/10x(CLV), 10x(CAV)
10x(CLV), MAX 24x(CAV)
PIO mode16.6 MB/s PIO MODE4 supported
DMA mode16.6 MB/s Multiword MODE2 supported
Ultra DMA mode 33.3 MB/s Ultra DMA MODE2
ATAPI interface
(MB/s)
CD-ROM
90 (Random)
110 (Random)
2MB
Access time
(ms)
DVD-ROM
Buffer memory
CD-DA,CD-ROM,CD-ROM XA
Photo CD, CD-Extra(CD+), CD-text
CD
Supported disk
format
DVD-R (DVD-R Multi-boarder supported)
DVD-RW(Ver.1.2), DVD-Video, DVD+R, DVD+RW,
DVD-RAM(2.6GB/4.7GB)
DVD
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1.3 Optical Drive
1 Hardware Overview
1.3.3 DVD Super Multi Drive
The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch)
CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RAM.
The DVD Super Multi drive is shown in Figure 1-7. The dimensions and specifications of the
DVD Super Multi drive are described in Table 1-6, Table 1-7.
Figure 1-7 DVD Super Multi drive
Table 1-6 DVD Super Multi drive outline dimensions
Parameter
Standard value
Maker
PCC
PCC
(G8CC00021410)
(G8CC0002F412)
Width (mm)
128
128
Outline
dimensions
Height (mm)
12.7 (excluding
projections)
12.7 (excluding
projections)
Depth (mm)
Mass (g)
129.0
129.0
210±10
190±10
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1.3 Optical Drive
Table 1-7 DVD Super Multi drive specifications (1/2)
Drive Specification
Parameter
PCC (G8CC00021410)
DVD-ROM MAX 8x(CAV) [MAX 10800 KB/s]
CD-ROM MAX 24x(CAV) [MAX 3600 KB/s]
Read(KB/s)
CD-R
CD-RW
4x/8x (CLV), 24x (ZCLV)
4x (CLV)
High Speed CD-RW
Ultra Speed CD-RW
4x/8x/10x (CLV)
10x (CLV)
Data transfer
speed
Write
DVD-R
DVD-RW 1x/2x (CLV), MAX 4x (CLV)
DVD+R 2.4x (CLV), MAX 8x (CLV)
1x/2x (CLV), MAX 8x (CLV)
DVD+RW 2.4x (CLV), MAX 4x (CLV)
DVD-RAM 3x (ZCLV) (4.7GB/9.4GB)
PIO mode 16.6 MB/s (PIO MODE4 supported)
DMA mode 16.6 MB/s (Multi-ward MODE2 supported)
Ultra DMA mode 33.3 MB/s(Ultra DMA MODE2 supported)
ATAPI interface
(MB/s)
CD-ROM
150 (Random)
180 (Random)
2MB
Access time
(ms)
DVD-ROM
Buffer memory
CD-DA, CD-ROM, CD-ROM XA,
Photo CD, CD-Extra(CD+), CD-text
CD
Supported disk
format
DVD-R, DVD-RW (Ver1.1),
DVD Video, DVD+R, DVD+RW,
DVD-RAM (2.6GB/4.7GB)
DVD
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Table 1-7 DVD Super Multi drive specifications (2/2)
Drive Specification
Parameter
PCC(G8CC0002F412)
DVD-ROM MAX 8x(CAV) [MAX 10800 KB/s]
CD-ROM MAX 24x(CAV) [MAX 3600 KB/s]
Read(KB/s)
CD-R 4x/8x (CLV), 24x (ZCLV)
CD-RW 4x (CLV)
High Speed CD-RW 4x/8x/10x (CLV)
Ultra Speed CD-RW 10x (CLV)
DVD-R 1x/2x (CLV), MAX 8x (CLV)
DVD-RW 1x/2x (CLV), MAX 4x (ZCLV)
DVD+R 2.4x (CLV), MAX 8x (ZCLV)
DVD+RW 2.4x (CLV), MAX 4x (ZCLV)
DVD-RAM 3x (ZCLV) (4.7GB/9.4GB)
Data transfer
speed
Write
PIO mode 16.6 MB/s (PIO MODE4 supported)
DMA mode 16.6 MB/s (Multi-ward MODE2 supported)
Ultra DMA mode 33.3 MB/s(Ultra DMA MODE2 supported)
ATAPI interface
(MB/s)
CD-ROM
150 (Random) (typ.)
180 (Random) (typ.)
2MB
Access time
(ms)
DVD-ROM
Buffer memory
CD-DA, CD-ROM, CD-ROM XA,
Photo CD, CD-Extra(CD+), CD-text
CD
Supported disk
format
DVD-R, DVD-RW (Ver1.1),
DVD Video, DVD+R, DVD+RW,
DVD-RAM (2.6GB/4.7GB)
DVD
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1.3 Optical Drive
1.3.4 DVD Super Multi Drive (Double-layer)
The DVD Super Multi drive (Double-layer) accommodates either 12 cm (4.72-inch) or 8 cm
(3.15-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW, DVD-RAM and DVD+R (Double-
layer).
The DVD Super Multi drive (Double-layer) is shown in Figure 1-8. The dimensions and
specifications of the DVD Super Multi drive (Double-layer) are described in Table 1-8, Table
1-9.
Figure 1-8 DVD Super Multi drive (Double-layer)
Table 1-8 DVD Super Multi drive (Double-layer) outline dimensions
Parameter
Maker
Standard value
PCC
PCC
TEAC
(G8CC00021411)
(G8CC0002F411)
(G8C0002G421)
Width (mm)
Height (mm)
128
128
128
Outline
dimensions
12.7 (excluding
projections)
12.7 (excluding
projections)
12.7 (excluding
projections)
Depth (mm)
Mass (g)
129.0
129.0
129.4(excluding
the eject button)
210±10
190±10
220 or less
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Table 1-9 DVD Super Multi drive (Double-layer) specifications (1/3)
Drive Specification
Parameter
PCC (G8CC00021411)
DVD-ROM MAX 8x(CAV) [MAX 10800 KB/s]
CD-ROM MAX 24x(CAV) [MAX 3600 KB/s]
Read(KB/s)
CD-R
CD-RW
4x/8x(CLV), 24x (ZCLV)
4x(CLV)
High Speed CD-RW
Ultra Speed CD-RW
4x/8x/10x(CLV)
10x(CLV)
Data transfer
speed
DVD-R
DVD-RW 1x/2x(CLV), MAX 4x(ZCLV)
DVD+R 2.4x(CLV), MAX 8x(ZCLV)
1x/2x(CLV), MAX 8x(ZCLV)
Write
DVD+R Double Layer 2.4x(CLV)
DVD+RW 2.4x(CLV), MAX 4x(ZCLV)
DVD-RAM 3x(ZCLV) (4.7GB/9.4GB)
PIO mode 16.6 MB/s (PIO MODE4 supported)
DMA mode 16.6 MB/s (Multi-ward MODE2 supported)
Ultra DMA mode 33.3 MB/s(Ultra DMA MODE2 supported)
ATAPI interface
(MB/s)
CD-ROM
150 (Random)
180 (Random)
2MB
Access time
(ms)
DVD-ROM
Buffer memory
CD-DA, CD-ROM, CD-ROM XA,
Photo CD, CD-Extra(CD+), CD-text
CD
Supported disk
format
DVD-R, DVD-RW (Ver1.1),
DVD Video, DVD+R, DVD+RW,
DVD-RAM (2.6GB/4.7GB)
DVD+R DL
DVD
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1.3 Optical Drive
Table 1-9 DVD Super Multi drive (Double-layer) specifications (2/3)
Drive Specification
Parameter
PCC(G8CC0002F411)
DVD-ROM MAX 8x(CAV) [MAX 10800 KB/s]
CD-ROM MAX 24x(CAV) [MAX 3600 KB/s]
Read(KB/s)
CD-R 4x/8x (CLV), 24x (ZCLV)
CD-RW 4x (CLV)
High Speed CD-RW 4x/8x/10x (CLV)
Ultra Speed CD-RW 8x/10x (CLV)
DVD-R 1x/2x (CLV), MAX 8x (ZCLV)
DVD-RW 1x/2x (CLV), MAX 4x (ZCLV)
Data transfer
speed
Write
DVD+R
2.4x(CLV), MAX 8x(ZCLV)
DVD+R Double Layer 2.4x(CLV)
DVD+RW 2.4x (CLV), MAX 4x (ZCLV)
DVD-RAM 2x/3x (ZCLV) (4.7GB/9.4GB)
PIO mode 16.6 MB/s (PIO MODE4 supported)
DMA mode 16.6 MB/s (Multi-ward MODE2 supported)
Ultra DMA mode 33.3 MB/s(Ultra DMA MODE2
supported)
ATAPI interface
(MB/s)
CD-ROM
150 (Random) (typ.)
180 (Random) (typ.)
2MB
Access time
(ms)
DVD-ROM
Buffer memory
CD-DA, CD-ROM, CD-ROM XA,
Photo CD, CD-Extra(CD+), CD-text
CD
Supported disk
format
DVD-R(3.9GB), DVD-RW (Ver1.1,Ver1.2),
DVD Video, DVD+R, DVD+RW,
DVD-RAM (2.6GB/4.7GB)
DVD+R DL
DVD
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Table 1-9 DVD Super Multi drive (Double-layer) specifications (3/3)
Drive Specification
Parameter
TEAC(G8C0002G421)
DVD-ROM MAX 8x(CAV)
CD-ROM MAX 24x(CAV)
Read(KB/s)
CD-R
4x/10x(CLV), 10-24x (ZCLV)
CD-RW
DVD-R
10x (CLV), 4x(CLV)
2-8x (ZCLV), 1/2x(CLV)
Data transfer
speed
Write
DVD-RW 2 4x(CLV), 1/2x (CLV)
DVD+R 2.4-8x(CLV), 2.4x (CLV)
DVD+R Double Layer 2.4x(CLV)
DVD+RW 2.4-4x(ZCLV), 2.4x (CLV)
PIO mode 16.6 MB/s (PIO MODE4 supported)
DMA mode 16.6 MB/s (Multi-ward MODE2 supported)
Ultra DMA mode 33.3 MB/s(Ultra DMA MODE2 supported)
ATAPI interface
(MB/s)
CD-ROM
130 (average)
130 (average)
8MB
Access time
(ms)
DVD-ROM
Buffer memory
CD-DA, CD-ROM, CD-ROM XA,
Photo CD, Enhanced CD, CD-text
CD
Supported disk
format
DVD-ROM, DVD-R(General, Authoring), DVD-RW,
DVD Video, DVD+R, DVD+RW,
DVD-RAM (2.6GB/4.7GB)
DVD
DVD+R L
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1 Hardware Overview
1.4 Keyboard
1.4 Keyboard
The keyboard is mounted 85(US)/86(UK) keys that consist of character key and control key,
and in conformity with ASCII. The keyboard is connected to membrane connector on the
system board and controlled by the keyboard controller.
Figure1-9 is a view of the keyboard.
See Appendix E about a layout of the keyboard.
Figure 1-9 Keyboard
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1.5 TFT Color Display
1 Hardware Overview
1.5 TFT Color Display
The TFT color display consists of a LCD module and FL inverter board.
1.5.1 LCD Module
The LCD module used for the TFT color display uses a backlight as the light source and can
display images and characters of 16M colors with 1,400x1,050 resolution.
Figure 1-10 shows a view of the LCD module and Table 1-10 lists the specifications.
Figure 1-10 LCD module
Table 1-10 LCD module specifications (14.1 TFT)
Specifications
Item
G33C0002P110
Number of Dots
1,400 (W) x 1,050 (H)
0.204 (H) x 0.204 (V)
Dot spacing (mm)
Display range (mm)
Outline dimensions
285.6 (H) x 214.2 (V)
299 (w) x 229 (H) x 7.7 (D)
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1.5 TFT Color Display
1.5.2 FL Inverter Board
The FL inverter board supplies a high frequency current to illuminate the LCD module FL.
Table 1-11 lists the FL inverter board specifications.
Table 1-11 FL inverter board specifications
Specifications
Item
G71C00011110
Voltage (V)
Power (W)
Voltage (V)
Power
5 (DC)
7
Input
750 (r.m.s)
5.0W / 7VA
Output
Current (mA)
(f=70KHz)
6.00 (r.m.s)
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1.6 Power Supply
1 Hardware Overview
1.6 Power Supply
The power supply supplies different voltages to the system board.
The power supply microcontroller has the following functions.
1. Judges that the DC power supply (AC adapter) is connected to the computer.
2. Detects DC output and circuit malfunctions.
3. Controls the battery icon, and DC IN icon.
4. Turns the battery charging system on and off and detects a fully charged battery.
5. Turns the power supply on and off.
6. Provides more accurate detection of a low battery.
7. Calculates the remaining battery capacity.
8. Controls the transmission of the status signal of the main battery.
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1.6 Power Supply
Table 1-12 lists the power supply output specifications.
Table 1-12Power supply output specifications (1/2)
Power supply （Yes/No）
Name
Power OFF Power OFF
Voltage
[V]
No
battery
(Suspend
mode)
(Boot
mode)
Object
1.308 -
0.748
PPV
No
No
No
CPU
PTV
1R5-P1V
1R8-B1V
2R5-P2V
MR0R9-BOV
0R9-P0V
1CH1R5-S1V
ICH-S3V
ICH-S5V
1R2-P1V
1R9-P1V
PGV
1.05
1.5
1.8
2.5
0.9
0.9
1.5
3.3
5
No
No
No
No
No
No
No
No
No
No
No
No
No
No
No
No
CPU, MCH, ICH6-M
CPU, MCH, ICH6-M
MCH, DDR2-SDRAM
MCH, ICH6-M
MCH, DDR2-SDRAM
DDR2-SDRAM
ICH6-M
Yes
No
No
No
Yes
No
No
No
Yes
Yes
Yes
No
Yes
Yes
Yes
No
ICH6-M
ICH6-M
1.2
1.9
1.2
GPU
No
No
GPU
No
No
GPU
Clock Generator,
Thermal Sensor, GMCH,
SDRAM(SPD), ICH6-M,
PCI7411, Mini-PCI , TPM,
FWH, AD1981B, Super I/O,
FIR, GPU, LCD,
P3V
3.3
No
No
No
Accelerometer
PCI17411, PC card power,
IEEE1394, Mini-PCI, MDC
E3V
3.3
Yes
Yes/No
No
LAN-E3V
3.3
2.5
1.2
Yes
Yes
Yes
Yes/No
Yes/No
Yes/No
No
No
No
LAN power
LAN power
LAN power
LAN2R5-E2V
LAN1R2-E1V
ICH6-M，EC/KBC,
Accelerometer
S3V
3.3
Yes
Yes
No
CRT, ICH6-M, SeleBay
power, FL inverter, HDD, KB,
PAD, Parallel, Mini PCI,
Bluetooth power,
P5V
5
No
No
No
Dock power
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1.6 Power Supply
1 Hardware Overview
Table 1-12 Power supply output specifications (2/2)
Power supply （Yes/No）
Name
Power OFF Power OFF
No
battery
Voltage[V]
(Suspend
mode)
(Boot
mode)
Object
SND-P5V
A4R7-P4V
5
No
No
No
No
Amp
AD1981B, Amp,
Microphone Amp, Line In,
Line out
4.7
No
No
PC Card power, USB
power
E5V
M5V
5
5
Yes
Yes
No
No
No
Temperature reset IC,
LEDs, Dock (PnP ID
EEPROM)
Yes
MCV
R3V
5
Yes
Yes
Yes
Yes
No
PSC
2.0 -3.6
Yes
ICH6-M(RTC)
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1.7 Batteries
1.7 Batteries
The PC has the following two batteries.
‰ Main battery
‰ Real time clock (RTC) battery
Table 1-13 lists the specifications for these two batteries.
Table 1-13 Battery specifications
Battery Name
Battery Element
Output Voltage
Capacity
G71C0004S110
Main battery
Lithium ion (6 cell)
10.8 V
4,700 mAh
G71C0004S210
P71035009115
Real time clock
(RTC) battery
Nickel hydrogen
2.4V
16mAh
1.7.1 Main Battery
The main battery is the primary power supply for the computer when the AC adapter is not
connected. In standby (instant recovery) mode, the main battery maintains the current status
of the computer.
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1.7 Batteries
1 Hardware Overview
1.7.2 Battery Charging Control
Battery charging is controlled by a power supply microprocessor. The power supply
microprocessor controls power supply and detects a full charge when the AC adapter and
battery are connected to the computer.
‰ Quick Battery Charge
When the AC adapter is connected, normal charging is used while the system is
turned on and quick charge is used while the system is turned off or in standby mode.
Table 1-14 lists the main battery charging time.
Table 1-14 Time required for charges of main battery
Charging Time
Battery Capacity
Main (4700mAh)
Second (3600mAh)
Normal charge
about 5.5 to 13.0
about 4.0 to 9.5
Quick charge
about 3.0
about 3.0
Quick battery charge is stopped in the following cases.
1. The main battery is fully charged
2. The main battery is removed
3. Main battery or AC adapter voltage is abnormal
4. Charging current is abnormal
Data preservation time
When turning off the power in being charged fully, the preservation time is as
following Table 1-15.
Table 1-15 Data preservation time
Condition
Standby mode
preservation time
About 5 days
Main (4700mAh)
Boot mode
About 40 days
About 4 days
Standby mode
Boot mode
Second
(3600mAh)
About 30 days
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1.7 Batteries
1.7.3 RTC Battery
The RTC battery provides the power supply to maintain the date, time, and other system
information in memory. Table 1-16 lists the battery charging time and data preservation
times.
Table 1-16RTC battery charging/data preservation time
Time
Charging
time
AC adapter or main battery in use
(Power ON)
about 8 hours
about 30 days
Data preservation time (when fully charged)
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1.8 AC Adapter
1 Hardware Overview
1.8 AC Adapter
The AC adapter is also used to charge the battery.
Table 1-17 lists the AC adapter specifications.
Table 1-17 AC adapter specifications
Specification
Parameter
G71C00043210
G71C00049210
Input rated voltage
Input frequency range
Input current
100V/240V
47Hz to 63Hz
1.5A or less (100VAC 5A load)
1.25A or less (240VAC 5A load)
Output rated voltage
Output current
DC 15V
0A to 5.0A (Constant voltage mode)s
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1.8 AC Adapter
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Chapter 2
Contents
2.1
2.2
2.3
Troubleshooting......................................................................................................... 2-1
Troubleshooting Flowchart........................................................................................ 2-2
Power Supply Troubleshooting.................................................................................. 2-6
Procedure 1
Procedure 2
Procedure 3
Procedure 4
Procedure 5
Power Supply Icon Check...................................................... 2-7
Error Code Check .................................................................. 2-9
Connection Check................................................................ 2-15
Quick Charge Check............................................................ 2-15
Replacement Check ............................................................. 2-16
2.4
System Board Troubleshooting................................................................................ 2-17
Procedure 1
Procedure 2
Procedure 3
Procedure 4
Message Check .................................................................... 2-18
Debug Port (D port) Check on Boot Mode.......................... 2-20
Diagnostic Test Program Execution Check......................... 2-32
Replacement Check ............................................................. 2-32
2.5
2.6
USB 3.5” FDD Troubleshooting.............................................................................. 2-33
Procedure 1
Procedure 2
Procedure 3
FDD Head Cleaning Check ................................................. 2-33
Diagnostic Test Program Execution Check......................... 2-34
Connector Check and Replacement Check.......................... 2-35
2.5” HDD Troubleshooting...................................................................................... 2-36
Procedure 1
Procedure 2
Procedure 3
Procedure 4
Procedure 5
Partition Check..................................................................... 2-36
Message Check .................................................................... 2-37
Format Check....................................................................... 2-38
Diagnostic Test Program Execution Check......................... 2-39
Connector Check and Replacement Check.......................... 2-40
2.7
Keyboard Troubleshooting ...................................................................................... 2-41
Procedure 1
Procedure 2
Diagnostic Test Program Execution Check......................... 2-41
Connector Check and Replacement Check.......................... 2-41
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2.8
Display Troubleshooting.......................................................................................... 2-42
Procedure 1
Procedure 2
Procedure 3
Procedure 4
External Monitor Check....................................................... 2-42
Diagnostic Test Program Execution Check......................... 2-42
Connector and Cable Check................................................. 2-43
Replacement Check ............................................................. 2-43
2.9
Touch Pad Troubleshooting..................................................................................... 2-44
Procedure 1
Procedure 2
Procedure 3
Diagnostic Test Program Execution Check......................... 2-44
Connector and Cable Check................................................. 2-44
Replacement Check ............................................................. 2-44
2.10 Selectable bay(optical drive) Troubleshooting........................................................ 2-45
Procedure 1
Procedure 2
Diagnostic Test Program Execution Check......................... 2-45
Connector Check and Replacement Check.......................... 2-45
2.11 Modem Troubleshooting.......................................................................................... 2-46
Procedure 1
Procedure 2
Diagnostic Test Program Execution Check......................... 2-46
Connector Check and Replacement Check.......................... 2-46
2.12 Bluetooth Troubleshooting ...................................................................................... 2-47
Procedure 1
Procedure 2
Procedure 3
Diagnostic Test Program Execution Check......................... 2-47
Connection Check................................................................ 2-48
Replacement Check ............................................................. 2-49
2.13 LAN Troubleshooting.............................................................................................. 2-50
Procedure 1
Procedure 2
Diagnostic Test Program Execution Check......................... 2-50
Connector Check and Replacement Check.......................... 2-50
2.14 Sound Troubleshooting............................................................................................ 2-51
Procedure 1
Procedure 2
Procedure 3
Diagnostic Test Program Execution Check......................... 2-51
Connector Check.................................................................. 2-51
Replacement Check ............................................................. 2-51
2.15 SD Card Slot Troubleshooting................................................................................. 2-52
Procedure 1
Procedure 2
Check on Windows XP Tablet PC Edition.......................... 2-52
Connector check and Replacement Check........................... 2-52
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2.16 Tablet Pen Troubleshooting..................................................................................... 2-53
Procedure 1
Procedure 2
Procedure 3
Check on Windows XP Tablet PC Edition.......................... 2-53
Tablet pen replacement Check............................................. 2-53
Connector Check and Replacement Check.......................... 2-54
2.17 Wireless LAN Troubleshooting............................................................................... 2-55
Procedure 1
Procedure 2
Procedure 3
Transmitting/Receiving Check ............................................ 2-55
Check of Antennas connection ............................................ 2-56
Replacement Check ............................................................. 2-56
Figures
Figure 2-1
Figure 2-2
Troubleshooting flowchart............................................................................. 2-3
A set of tool for debug port test ................................................................... 2-20
Tables
Table 2-1
Table 2-2
Table 2-3
Table 2-4
Table 2-5
Battery icon.................................................................................................... 2-7
DC IN icon..................................................................................................... 2-7
Debug port (Boot mode) error status ........................................................... 2-22
FDD error code and status ........................................................................... 2-34
2.5” HDD error code and status................................................................... 2-39
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2.1 Troubleshooting
2 Troubleshooting
2
2.1 Troubleshooting
Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is
causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.)
The FRUs covered are:
1. Power supply
2. System board
3. 3.5” USB FDD
4. 2.5” HDD
9. Modem
10. Bluetooth
11. LAN
12. Sound
5. Keyboard
13. SD card slot
14. Tablet pen
15. Wireless LAN
6. Display
7. Touch pad
8. Optical drive
The Detailed replacement procedures are given in Chapter 4. Test Program operations are
described in Chapter 3.
NOTE: After replacing the System board or CPU, it is necessary to execute the subtest 01
Initial configuration of 3.3 Setting of the hardware configuration in Chapter 3.
The following tools are necessary in addition to tools described in Chapter 3 for implementing
the Diagnostics procedures:
1. Phillips screwdrivers
2. Toshiba MS-DOS system FD
3. Debug test cable (for debug port test)
4. RS-232C cross-cable (for debug port test)
5. Test board (for debug port test)
6. External monitor (for display check)
There are following two types of connections in the figures of board and module connection in
and after 2.3 Power Supply Troubleshooting.
(1) Cable connection is described as a line in the figures.
(2) Pin connection is described as an arrow in the figure.
<e.g> Connection of modem
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2.2 Troubleshooting Flowchart
2.2 Troubleshooting Flowchart
Use the flowchart in Figure 2-1 as a guide for determining which FRU malfunctions. Before
going through the flowchart steps, check the following:
‰ Make sure that Toshiba Windows® XP Tablet PC Edition is installed on the hard disk.
Other operating systems can cause the computer malfunction.
‰ Make sure all optional equipment is removed from the computer.
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2 Troubleshooting
Figure 2-1 Troubleshooting flowchart (1/2)
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2.2 Troubleshooting Flowchart
Figure 2-1 Troubleshooting flowchart (2/2)
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2.2 Troubleshooting Flowchart
2 Troubleshooting
If the diagnostics program cannot detect an error, the problem may occur intermittently. The
Test program should be executed several times to isolate the problem. Check the Log Utilities
function to confirm which diagnostic test detected an error(s), and perform the appropriate
troubleshooting procedures as follows:
1. If an error is detected on the System test, Memory test, ASYNC test, Real timer test,
NDP test or expansion test, perform the System board Troubleshooting Procedures in
Section 2.4.
2. If an error is detected on the Keyboard, perform the Keyboard Troubleshooting
Procedures in Section 2.7.
3. If any trouble is detected on the Display, perform the Display Troubleshooting
Procedures in Section 2.8.
4. If any trouble is detected on the Floppy disk, perform the USB FDD Troubleshooting
Procedures in Section 2.5.
5. If any trouble is detected on the Hard disk, perform the HDD Troubleshooting
Procedures in Section 2.6.
6. If any trouble is detected on the Touch pad, perform the Touch Pad Troubleshooting
Procedures in Section 2.9.
7. If any trouble is detected on the Selectable bay, perform the Selectable bay
Troubleshooting Procedures in Section 2.10.
8. If any trouble is detected on the modem test, perform the Modem Troubleshooting
Procedures in Section 2.11.
9. If any trouble is detected on the Bluetooth, perform the Bluetooth Troubleshooting
Procedures in Section 2.12.
10. If any trouble is detected on the LAN, perform the LAN Troubleshooting Procedures
in Section 2.13.
11. If any trouble is detected on the sound test, perform the Sound Troubleshooting
Procedures in Section 2.14.
12. If any trouble is detected on the SD card slot, perform the SD Card Slot
Troubleshooting Procedures in Section 2.15.
13. If any trouble is detected on the Tablet pen, perform the Tablet Pen Troubleshooting
Procedures in Section 2.16.
14. If any trouble is detected on the Wireless LAN, perform the Wireless LAN
Troubleshooting Procedures in Section 2.17.
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2 Troubleshooting
2.3 Power Supply Troubleshooting
2.3 Power Supply Troubleshooting
The power supply controller controls many functions and components. To determine if the
power supply is functioning properly, start with Procedure 1 and continue with the other
Procedures as instructed. The procedures described in this section are:
Procedure 1: Power Supply Icon Check
Procedure 2: Error Code Check
Procedure 3: Connection Check
Procedure 4: Quick Charge Check
Procedure 5: Replacement Check
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2 Troubleshooting
Procedure 1
Power Supply Icon Check
The following two icons indicate the power supply status:
‰ Battery icon
‰ DC IN icon
The power supply controller uses the power supply status with the Battery icon and the DC IN
icon as listed in the tables below.
Table 2-1 Battery icon
Battery icon
Power supply status
Lights orange
Battery is charged and the external DC is input. It has no relation
with ON/OFF of the system power.
Lights green
Battery is fully charged and the external DC is input. It has no
relation with ON/OFF of the system power.
Blinks orange
The battery level is low while the system power is ON.
(even intervals)
Flashes orange
The battery level is low and the power is turned on only with the
(at being switched on) battery.
Doesn’t light Any condition other than those above.
Table 2-2 DC IN icon
DC IN icon
Power supply status
Lights green
Blinks orange
Doesn’t light
DC power is being supplied from the AC adapter.
Power supply malfunction* 1
Any condition other than those above.
*1 When the power supply controller detects a malfunction, the DC IN icon blinks
orange. It shows an error code.
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2.3 Power Supply Troubleshooting
When icons are blinking, perform the following procedure.
1. Remove the battery pack and the AC adapter and cut off the power supply to the
computer by force.
2. Re-attach the battery pack and the AC adapter.
If icons are still blinking after the operation above, check the followings:
Check 1 If the DC IN icon blinks orange, go to Procedure 2.
Check 2 If the DC IN icon does not light, go to Procedure 3.
Check 3 If the battery icon does not light orange or green, go to Procedure 4.
CAUTION: Use a recommended AC adapter (G71C00043210 or G71C00049210).
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2 Troubleshooting
Procedure 2
Error Code Check
If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The
blink pattern indicates an error as shown below.
‰ Start
Off for 2 seconds
‰ Error code (8 bit)
“1”
“0”
On for one second
On for half second
On for half second
Interval between data bits
The error code begins with LSB (Least Significant bit)
Example: Error code 11h (Error codes are given in hexadecimal format.)
Check 1 Convert the DC IN icon blink pattern into the hexadecimal error code and
compare it to the tables below. Then go to Check 2.
‰ Error code
Error code
1*h
Power supply of error detected
DC Power (AC Adapter)
1st battery
2*h
3*h
2nd battery
4*h
S3V output (P60V)
1R5-C1V output (P61)
1R5-C1V output (P62)
PPV output (P63)
PGV output (P64)
PTV output (P65)
1R9-B1V output (P66)
PGV output (P63)
E3V output (P64)
PTV output (P65)
1R9-B1V output (P66)
5*h
6*h
7*h
8*h
9*h
A*h
B*h
C*h
D*h
E*h
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‰ DC power supply (AC adapter)
Error code Meaning
10h
11h
12h
13h
14h
AC Adapter output voltage is over 16.5V.
Dock output voltage is over 16.5V.
Current from the DC power supply is over 7.0A.
Current from the DC power supply is over 0.5A when there is no load.
Abnormal current has been sensed 0[A].
‰ First Battery
Error code Meaning
20h
21h
22h
23h
Overvoltage is detected. (This is not supported.)
Main battery charge current is over 7.00A.
Main battery discharge current is over 3.9A when there is no load.
Main battery charge current is over 3.9A when AC adapter is not
connected.
24h
25h
Abnormal current has been sensed 0[A].
Main battery charge current is over 0.3A.
‰ Second Battery
Error code Meaning
30h
31h
32h
33h
Overvoltage is detected. (This is not supported.)
Second battery charge current is over 7.00A.
Second battery discharge current is over 3.9A when there is no load.
Second battery charge current is over 3.9A when AC adapter is not
connected.
34h
35h
Abnormal current has been sensed 0[A].
Second battery charge current is over 0.3A.
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2 Troubleshooting
‰ S3V output (P60)
Error code Meaning
40h
45h
S3V voltage is 2.81V or less when the computer is powered on/off.
S3V voltage is 2.81V or less when the computer is booting up.
(CV support)
‰ 1R5-C1V output (P61)
Error code Meaning
50h
51h
52h
53h
54h
55h
1R5-C1V voltage is over 1.80V when the computer is powered on/off.
1R5-C1V voltage is 1.275V or less when the computer is powered on.
1R5-C1V voltage is 1.275V or less when the computer is booting up.
1R5-C1V voltage is 1.275V or less when the computer is suspended.
1R5-C1V voltage is abnormal during shutdown (CV support)
1R5-C1V voltage is 1.275V or less when the computer is booting up.
(CV support)
‰ １R5-C1V output (P62)
Error code Meaning
60h
61h
62h
63h
64h
65h
1R5-C1V voltage is over 2.16V when the computer is powered on/off.
1R5-C1V voltage is 1.275V or less when the computer is powered on.
1R5-C1V voltage is 1.275V or less when the computer is booting up.
1R5-C1V voltage is 1.275V or less when the computer is suspended.
1R5-C1V voltage is abnormal during shutdown (CV support)
1R5-C1V voltage is 1.275V or less when the computer is booting up.
(CV support)
‰ PPV output (P63 : MUX_CH0)
Error code Meaning
70h
71h
72h
73h
PPV voltage is over 1.80V when the computer is powered on/off.
PPV voltage is 0.56V or less when the computer is powered on.
PPV voltage is 0.56V or less when the computer is booting up.
PPV voltage is 0.56V or more when the computer is powered off.
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2.3 Power Supply Troubleshooting
‰ PGV output (P64)
Error code Meaning
80h
81h
82h
83h
84h
PGV voltage is over 6.00V when the computer is powered on/off.
PGV voltage is 4.5V or less when the computer is powered on.
PGV voltage is 4.5V or less when the computer is booting up.
PGV voltage is 4.5V or more when the computer is powered off.
PGV voltage is 4.5V or less when the computer is suspended.
‰ PTV output (P65)
Error code Meaning
90h
91h
92h
93h
94h
PTV voltage is over 1.26V when the computer is powered on/off.
PTV voltage is 0.89V or less when the computer is powered on.
PTV voltage is 0.89V or less when the computer is booting up.
PTV voltage is 0.89V or more when the computer is powered off.
PTV voltage is 0.89V or less while the computer is suspended.
‰ 1R9-B1V output (P66)
Error code Meaning
A0h
A1h
A2h
A3h
A4h
1R9-B1V voltage is over 2.4V when the computer is powered on/off.
1R9-B1V voltage is 1.53V or less when the computer is powered on.
1R9-B1V voltage is 1.53V or less when the computer is booting up.
1R9-B1V voltage is 1.53V or more when the computer is powered off.
1R9-B1V voltage is 1.53V or less while the computer is suspended.
‰ PGV output (P63 : MUX_CH1)
Error code Meaning
B0h
B1h
B2h
B3h
PGV voltage is over 1.62V when the computer is powered on.
PGV voltage is 0.68V or less when the computer is powered on.
PGV voltage is 0.68V or less when the computer is booting up.
PGV voltage is 0.68V or more when the computer is powered off.
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2 Troubleshooting
‰ E3V output (P64)
Error code Meaning
C0h
C1h
C2h
C3h
C4h
E3V voltage is over 3.96V when the computer is powered on.
E3V voltage is 2.81V or less when the computer is powered on.
E3V voltage is 2.81V or less when the computer is booting up.
E3V voltage is 2.81V or more when the computer is powered off.
E3V voltage is 2.81V or less while the computer is suspended.
‰ PTV output (P65 : MUX_CH1)
Error code Meaning
D0h
D1h
D2h
D3h
D4h
PTV voltage is over 1.26V when the computer is powered on.
PTV voltage is 0.89V or less when the computer is powered on.
PTV voltage is 0.89V or less when the computer is booting up.
PTV voltage is 0.89V or more when the computer is powered off.
PTV voltage is 0.89V or less while the computer is suspended.
‰ 1R9-B1V output (P66 : MUX_CH1)
Error code Meaning
E0h
E1h
E2h
E3h
E4h
1R9-B1V voltage is over 2.4V when the computer is powered on.
1R9-B1V voltage is 1.53V or less when the computer is powered on.
1R9-B1V voltage is 1.53V or less when the computer is booting up.
1R9-B1V voltage is 1.53V or more when the computer is powered off.
1R9-B1V voltage is 1.53V or less while the computer is suspended.
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2.3 Power Supply Troubleshooting
Check 2 In the case of error code 10h or 12h:
‰ Make sure the AC adapter and AC power cord are firmly plugged into the DC
IN 15 V socket and wall outlet. If the cables are connected correctly, go to the
following step:
‰ Connect a new AC adapter and AC power cord. If the error still exists, go to
Procedure 5.
Check 3 In the case of error code 21h:
‰ Go to Procedure 3.
Check 4 For any other errors, go to Procedure 5.
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2 Troubleshooting
Procedure 3
Connection Check
The wiring diagram related to the power supply is shown below:
Any of the connectors may be disconnected. Perform starting from Check 1.
Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC
IN 15 V socket and wall outlet. If these cables are connected correctly, go to Check
2.
Check 2 Replace the AC adapter and the AC power cord with new ones.
• If the DC IN icon does not light, go to Procedure 5.
• If the battery icon does not light, go to Check 3.
Check 3 Make sure the battery pack is installed in the computer correctly. If the battery is
properly installed and the battery icon still does not light, go to Procedure 4.
Procedure 4
Quick Charge Check
Check if the power supply controller charges the battery pack properly. Perform the following
procedures:
Check 1 Make sure the AC adapter is firmly plugged into the DC IN socket.
Check 2 Make sure the battery pack is properly installed to the PC. If the battery is properly
installed, go to Check 3.
Check 3 The battery pack may be completely discharged. Wait a few minutes to charge the
battery pack while connecting the battery pack and the AC adapter to the PC. If the
battery pack is still not charged, go to Check 4.
Check 4 The battery’s temperature is too high or low. Return the temperature to normal
operating condition. If the battery pack is still not charged, go to Check 5.
Check 5 Replace the battery pack with a new one. If the battery pack is still not charged, go
to Procedure 5.
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2.3 Power Supply Troubleshooting
Procedure 5
Replacement Check
The power is supplied to the System board by the AC adapter. If either the AC adapter or the
System board was damaged, perform the following Checks.
To disassemble the computer, follow the steps described in Chapter 4.
Check 1 Replace the AC adapter with a new one. If power is not supplied properly to the
PC, perform Check 2.
Check 2 Replace the System board with a new one.
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2.4 System board Troubleshooting
This section describes how to determine if the System board is defective. Start with Procedure
1 and continue with the other procedures as instructed. The procedures described in this
section are:
Procedure 1: Message Check
Procedure 2: Debug port (D port) Check on Boot Mode
Procedure 3: Diagnostic Test Program Execution Check
Procedure 4: Replacement Check
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Procedure 1
Message Check
When the power is turned on, the system performs the Initial Reliability Test (IRT) installed
in the BIOS ROM. The IRT tests each IC on the System board and initializes it.
‰ If an error message is shown on the display, perform Check 1.
‰ If there is no error message, go to Procedure 2.
‰ If MS-DOS or Windows XP Tablet PC Edition is properly loaded, go to Procedure 4.
Check 1 If one of the following error messages is displayed on the screen, press the F1 key
as the message instructs. These errors occur when the system configuration
preserved in the RTC memory (CMOS type memory) is not the same as the actual
configuration or when the data is lost.
If you press the F1 key as the message instructs, the SETUP screen appears to set
the system configuration. If any other error message is displayed, perform Check 2.
(a)*** Bad HDD type ***
Check system. Then press [F1] key ......
(b)*** Bad configuration ***
Check system. Then press [F1] key ......
(c)*** Bad memory size ***
Check system. Then press [F1] key ......
(d)*** Bad time function ***
Check system. Then press [F1] key ......
(e)*** Bad check sum (CMOS) ***
Check system. Then press [F1] key ......
(f)*** Bad check sum (ROM) ***
Check system. Then press [F1] key ......
(g)RTC battery is low or CMOS checksum is inconsistent
Press [F1] key to set Date/Time
Check 2 If the following error message is displayed on the screen press any key as the
message instructs.
The following error message appears when data stored in RAM under the resume
function is lost because the battery has become discharged or the System board is
damaged. Go to Procedure 3.
WARNING: RESUME FAILURE.
PRESS ANY KEY TO CONTINUE.
If any other error message is displayed, perform Check 3.
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Check 3 The IRT checks the System board. When the IRT detects an error, the system stops
or an error message appears.
If one of the following error messages (1) through (17), (22) or (23) is displayed,
go to Procedure 5.
If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures
in Section 2.7.
If error message (19), (20) or (21) is displayed, go to the 2.5” HDD
Troubleshooting Procedures in Section 2.6.
(1) PIT ERROR
(2) MEMORY REFRESH ERROR
(3) TIMER CH.2 OUT ERROR
(4) CMOS CHECKSUM ERROR
(5) CMOS BAD BATTERY ERROR
(6) FIRST 64KB MEMORY ERROR
(7) FIRST 64KB MEMORY PARITY ERROR
(8) VRAM ERROR
(9) SYSTEM MEMORY ERROR
(10) SYSTEM MEMORY PARITY ERROR
(11) EXTENDED MEMORY ERROR
(12) EXTENDED MEMORY PARITY ERROR
(13) DMA PAGE REGISTER ERROR
(14) DMAC #1 ERROR
(15) DMAC #2 ERROR
(16) PIC #1 ERROR
(17) PIC #2 ERROR
(18) KBC ERROR
(19) HDC ERROR
(20) HDD #0 ERROR
(21) HDD #1 ERROR
(22) TIMER INTERRUPT ERROR
(23) RTC UPDATE ERROR
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Procedure 2
Debug Port (D port) Check on Boot Mode
Check the D port status by a debug port test. The tool for debug port test is shown below.
Figure 2-2 A set of tool for debug port test
The test procedures are follows;
1. Connect the debug test cable to the connector CN3400 of the System board. For
disassembling the PC to connect the test cable, refer to Chapter 4.
2. Connect the debug port test cable and RS-232C cross-cable to the test board.
3. Connect the RS-232C cross-cable to the PC that displays the results.
4. Boot the computer in MS-DOS mode.
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5. Execute GETDPORT.COM in the text menu in CPU REAL mode. (Insert the FD for
starting D port into FDD and input “FD starting drive:>dport”.)
The D port status is displayed in the following form;
6. When the D port status is FFFFh (normal status), go to Procedure 3.
7. When the D port status falls into any status in Table 2-3, execute Check 1.
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Table 2-3 Debug port (Boot mode) error status (1/10)
D port status
Inspection items
Details
Permission of A20 and Clear of
software reset bit
Prohibition of APIC
Initialization of MCHM, ICHM
Initialization of Super I/O
Initialization of debug port
Dummy read of 3rd Bus data
Setting of printer port (for models
supporting printer)
PIT CH0 initialization (for
HOLD_ON)
F000h
BIOS rewrite factor flag
initialization
CHECK SUM CHECK
Transition to protected mode
Boot block checksum (skipped when
returned to S3)
Halts when error occurs
Checksum other than boot block (skip
when returned to S3)
EC/KBC rewrite check
F001h
If “rewrite” is requested, go to “BIOS rewrite
process”.
Transition of process to system
BIOS IRT when returned to S3
Key input
When a key is pressed, check if it is Tilde
key or Tab key.
Initialization of SC
BIOS rewrite request check
F002h
F006h
Halts when error occurs. Dport=F1B3h or
B4h
If Checksum check error occurred on
except Boot Block or rewrite is required by
user, go to “BIOS rewrite process”.
Transits to system BIOS IRT.
BIOS rewrite process
F007h
Initialization of ICHM. D31
DRAM configuration
Permission of cache (L1 cache only)
Memory clear
Transits to real mode and copies BIOS to
RAM.
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Table 2-3 Debug port (Boot mode) error status (2/10)
D port status
Inspection items
Details
F009h
Saving key scan code
Setting TASK_1ms_TSC
Controlling fan
Initializing sound items (for
BEEP)
Enabling system speaker
Releasing mute
Making the volume max
Blinks green (cycle:2s, on:1s, off:1s)
When BIOS, EC/KBC rewriting
is requested
When BIOS ROM is abnormal
Blinks orange (cycle:2s, on:1s, off:1s)
When BIOS renewal is
prohibited
Blinks 8 second cycle (On:4s, Off:4s). Beeps
30 second and halts Dport=F1BBh.
Key input
Temporary prohibition of USB
Beeps.
Waiting for key input
FDC reset
Reading CHGBIOSA.EXE /
CHGFIRMA.EXE
Setting parameters for 2HD(1.44MB)
Reading of first sector, If it is the data of
1.44MB (2HD), the media type is definite.
Setting of parameters for 2DD (720KB)
Retrieval of “CHGBIOSA.EXE” from the root
directory.
Calculation of directory start head and
sector
Read 1 sector of the root directory
Retrieval of entry of “CHGBIOSA.EXE”
/“CHGFIRMA.EXE” from the sector read.
Reading of EXE header of “CHGBIOSA.EXE”
and “CHGFIRMA.EXE”
Key input when error occurred.
Execution of “CHGBIOSA.EXE” and
“CHGFIRMA.EXE”
(F007h)
F100h
Renewal of micro code (Model
supporting HTT)
Prohibition of cache
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Table 2-3 Debug port (Boot mode) error status (3/10)
D port status
Inspection items
Details
(F100h)
Initialization of H/W (before DRAM
recognition)
Initialization of MCHM
Initialization of ICH6M.D31.Func0
Initialization of ICH6M.D31.Func1
Initialization of ICH6M.D31.Func1/2
Initialization of USB controller
Initialization of ICH6M.D31.Func3
Initialization of ICH6 AC97 Audio
Initialization of TI controller
Initialization of PIT channel 1
(Setting the refresh interval to “30μs”)
F101h
F102h
When unsupported memory is connected,
the system beeps and halts.
When DRAM size = 0, halts.
Checking DRAM type and size (at
cold boot)
When it can not be used as stack area,
halts.
Testing the stack area of SM-RAM
Configuring cache memory
Permission of L1/L2 cache
memory
Checking the access of a CMOS
(Only in Cold Boot)
When error is detected, halts
Examining the battery level of
CMOS
Checksum check of CMOS
Initializing data in CMOS (1)
(Setting of boot status and IRT busy flag,
The rest bits are set to 0)
Setting up of IRT status
Storing the size of DRAM
F103h
Branch of resuming (only in Cold
Boot)
When a CMOS error is detected, it does
not resume.
If “resume status code” is not set, no
resume occurs.
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Table 2-3 Debug port (Boot mode) error status (4/10)
D port status
Inspection items
Details
(F103h)
Resume error check
S3 recovery error (ICH)
SM-RAM checksum check
Resume error 7AH
Resume error 73H
Memory configuration change check
Resume error 73H
Checksum check of system BIOS RAM area
Resume error 79H
Checksum check of expansion memory
Resume error 76H
Checksum check of PnP RAM
Resume error 77H
To resume process (RESUME_MAIN)
Returns the CPU clock to “Low”
Prohibition of all SMIs
To resume error process
Clears resume status
Returns to ROM
Forwards the area of C0000h to EFFFFh to PCI
(prohibition of DRAM)
Sets resume error request
Halts, when error occurred
Copying ROM/RAM of
system BIOS
F105h
SMRAM initialization
Check if CPU corresponds
to Hyper Threading
Initialization of APIC
WakeUp factor check
SMRAM base rewriting
and CPU state map
saving for BIOS
Permission of SMI based
on ASMI
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Table 2-3 Debug port (Boot mode) error status (5/10)
D port status
Inspection items
Details
F106h
Initialization of devices which
need initialization before PCI
bus initialization
PIT test (at Cold boot only) and initialization
Setting of test pattern to channel 0 of PIT#0
Check whether the set test pattern can be
read.
Initialization of PIT channel 0 (Setting of timer
interruption interval to 55ms)
Initialization of PIT channel 2(Setting of the
sound generator frequency to 664Hz)
Test of PIT channel 1 (Check whether the refresh
signal works properly in 30 micro-s refresh
interval.) The system halts when the time is out.
Test of PIT channel 2 (Check whether the
speaker gate works properly)
CPU clock measurement
Check of parameter block A
Permission of SMI except auto-off function
Control of excess of rated input power
Battery discharge current control (1CmA)
AC adapter rated over current control
Dividing procedures for time measuring by IRT
Setting for clock generator
Checking parameter tab lock A
CPU Initialization
Updating micro-code
Judging of CPU type
Geyserville support check
Setting of CPU clock to “high"
F107h
Saving memory configuration
to buffer
Reading of EC version
Update of flash ROM type
Judging of destination (Japan
or except Japan) based on
DMI data
CMOS default setting check
Sets default setting if bad battery or bad
checksum (ROM, CMOS) is detected.
ACPI table initialization (for
execution of option ROM)
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Table 2-3 Debug port (Boot mode) error status (6/10)
D port status
Inspection items
Details
(F107h)
Initialization of devices which Setting operation mode of IDE device
need initialization before PCI
Setting operation mode of AC’97/Azalia
bus initialization
Initialization of temperature control information
KBC initialization
VGA display off, Reset control
Sound initialization
PC multi-box status acquisition
HC initialization, USB device connection recognition
and initialization
Recognizing an initializing of SD memory card
Control of built-in LAN permission/prohibition
PIC initialization
PIC test
Password Initialization
F108h
F109h
PCI bus initialization
(connection of DS Bus)
Initialization of LAN
information
Check of WakeUp factor
Task generation for waiting
INIT_PCI completion
CMOS data initialization (2)
PnP initialization
Setting of setup items
Waiting for the completion of
Multi-box status check
H/W setting based on
resource
F10AH
Task generation for waiting
PnP resource making
completion
Serial interruption control
(before use of interruption) (for models supporting
YEBISU)
PnP H/W initialization
PC card slot initialization
SIO initialization (for models supporting SIO)
FIR initialization (for models supporting FIR)
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Table 2-3 Debug port (Boot mode) error status (7/10)
D port status
Inspection items
Details
Making of work for automatic configuration
Acquisition of PCI IRQ
(F10Ah)
PCI automatic configuration
Configuration
Saving of VGA configuration result
F10Bh
Task generation for waiting
PCI_CONFIGURATION
completion
Initialization of H/W needed after
PCI configuration
Printer port setting (for models supporting
printer)
HDD initialization sequence start
FDD initialization sequence start (for models
supporting built-in FDD)
Enabling power off
Output code generation
FIRST_64KB_CHECK
INIT_INT_VECTOR
F10Ch
F10Dh
F10Eh
F10Fh
(Check of first 64KB memory)
(Initialization of vectors)
(Initialization of NDP)
INIT_NDP
INIT_SYSTEM
(Initialization of system)
Storing of CMOS error status to
IRT_ERR_STS_BUF
Timer initialization start
EC initialization & Reading of battery
information
Update of system BIOS (Update of EDID
information for LCD)
F110h
INIT_DISPLAY (Waiting for VGA
chip initialization completion, VGA
BIOS initialization)
F111h
F113h
F114h
F115h
F116h
Calling VGA BIOS
DISP_LOGO
Displaying logo
SYS_MEM_CHECK (boot mode)
EXT_MEM_CHECK (boot mode)
Check of convention memory
Check of exception in the protected mode
Dport=F117h when error occurs
Exception check in the protected
mode
INIT_SYS_MEM (reboot mode)
CHK_DMA_PAGE (boot mode)
CHECK_DMAC (boot mode)
Initialization of conventional memory
Check of DMA Page Register
Check of DMAC
F118h
F119h
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Table 2-3 Debug port (Boot mode) error status (8/10)
D port
status
Inspection items
Details
F11Ah
F11Bh
INIT_DMAC (boot mode)
Initialization of DMAC
CHECK_PRT (for models
supporting printer)
Check of printer port existence
F11Ch
F11Dh
CHECK_SIO (for models
supporting SIO)
Check of SIO
Waiting for FDD initialization completion (for models
supporting built-in FDD)
BOOT_PASSWORD
(password check)
(In Reboot Mode)
Waiting for HDD initialization completion
Check of key input during IRT (waiting for
KBC initialization completion)
ATA priority initialization
(In Boot Mode)
BM loading process (for models supporting
fingerprint authentication)
Initialization of BM (for models supporting
fingerprint authentication)
Check of key input during IRT (waiting for KBC
initialization completion)
Input of password
I/O LOCK process (for models supporting
I/O lock)
Opening BM (for models supporting
fingerprint authentication)
F11Eh
F11Fh
EX_IO_ROM_CHECK
PRE_BOOT_SETUP
Check of option I/O ROM
Saving of value in 40:00h
(for SIO saving/restoring)
Setting of font address for resume password
Setting of repeat parameter for USB KB
Final check of key input during IRT
Storing of T_SHADOW_RAM_SIZE
Update of system resource just before booting
Rewriting of memory map data of INT15h E820h
function
Waiting for AC-Link initialization completion
Renewal of table for DMI
Copying ACPI table to uppermost of extension
memory
Waiting for completion of BIOS rewriting of PSC
version
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Table 2-3 Debug port (Boot mode) error status (9/10)
D port status
Inspection items
Details
(F11Fh)
Waiting for completion of initialization of Serial port
(for models supporting SIO)
Waiting for completion of setting clock generator
When error occurred, halts at Dport=F120h
Cancel of NMI Mask
TIT check sum
Clear of the IRT flag of Runtime side
Update of check sum of Runtime side
Hibernation branch (for models supporting BIOS
Hibernation)
Initialization of Bluetooth (for models supporting
Bluetooth)
Check of existence of target maintenance card
Prohibition of unused PC card
Setting Wakeup status data for ACPI
HW initialization just before booting, Waiting for
initialization completion
Notifies the DVI connection status to VGA BIOS
(for models supporting DVI)
Setting of battery save mode
Setting of date
Waiting for Bluetooth initialization completion
(for models supporting Bluetooth)
Update of DMI Wakeup factor, Update of SM-BIOS
structure table
PCI device configuration space close
Cache control
Process for CPU
Make the CPU clock to be set by SETUP
Waiting of motor-off completion of disabled HDD
Final decision of USB FDD drive information
Post processing of PRE_BOOT_SETUP
Clear of PWRBTN_STS
Enabling POWER Button
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Table 2-3 Debug port (Boot mode) error status (10/10)
D port status
F121h
Inspection items
Details
Clear of IRT status
Update of check sum of
Runtime side
FFFFh
End
Check 1 If the D port is status F11Dh or F11Fh is displayed, go to “HDD Trouble shooting
Procedure in Section 2.6.
Check 2 If any other D port status error code is displayed, perform Procedure 3.
D port error code is as follows:
Error code
F117h
Contents
Exception error
F120h
Clock generator error
SC initialization error
BIOS update error
F11B3h/F11B4h
F1BBh
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Procedure 3
Diagnostic Test Program Execution Check
Execute the following tests from the Diagnostic Test Menu. These tests check the System
board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform
these tests.
1. System test
2. Memory test
3. Keyboard test
4. Display test
5. Floppy Disk test
6. Printer test
7. ASYNC test
8. Hard Disk test
9. Real Timer test
10. NDP test
11. Expansion test
12. CD-ROM/DVD-ROM test
13. Wireless LAN test
14. LAN/Modem/Bluetooth/IEEE1394 test
15. Sound test
If an error is detected during these tests, go to Procedure 4.
Procedure 4
Replacement Check
The System board connectors may be disconnected. Disassemble the computer following the
steps described in Chapter 4, Replacement Procedures and perform Check 1.
Check 1 Visually check for the following:
a) Cracked or broken connector housing
b) Damaged connector pins
If connectors are in good condition, but there is still a problem, go to Check 2.
Check 2 The System board may be damaged. Replace the System board with a new one
following the steps described in Chapter 4, Replacement Procedures.
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2 Troubleshooting
2
2.5 USB 3.5” FDD Troubleshooting
This section describes how to determine if the USB 3.5” FDD is functioning properly.
Perform the steps below starting with Procedure 1 and continuing with the other procedures as
required.
Procedure 1: FDD Head Cleaning Check
Procedure 2: Diagnostic Test Program Execution Check
Procedure 3: Connector Check and Replacement Check
Procedure 1
FDD Head Cleaning Check
FDD head cleaning is one option available in the Diagnostic Program.
Insert the Diagnostics Disk in the USB floppy disk drive, turn on the computer and run the test.
And then clean the FDD heads using the cleaning kit. If the FDD still does not function
properly after cleaning, go to Procedure 2.
Detailed operation is given in Chapter 3, Tests and Diagnostics.
If the test program cannot be executed on the computer, go to Procedure 3.
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2.5 USB 3.5” FDD Troubleshooting
Procedure 2
Diagnostic Test Program Execution Check
Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to
Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures.
Make sure the floppy disk is formatted correctly and that the write protect tab is disabled.
Floppy disk drive test error codes and their status names are listed in Table 2-4. If any other
errors occur while executing the FDD diagnostics test, go to Check 1.
Table 2-4 FDD error code and status
Code
Status
01h
02h
03h
04h
06h
08h
09h
10h
20h
40h
60h
80h
Bad command
Address mark not found
Write protected
Record not found
Media replaced
DMA overrun error
DMA boundary error
CRC error
FDC error
Seek error
FDD not drive
Time out error (Not ready)
Write buffer error
Data compare error
EEh
FFh
Check 1 If the following message is displayed, disable the write protect tab on the floppy
disk by sliding the write protect tab to “write enable”. If any other message appears,
perform Check 2.
Write protected
Check 2 Make sure the floppy disk is formatted correctly. If it is, go to Procedure 3.
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Procedure 3
Connector Check and Replacement Check
The USB FDD connector may be disconnected from the connector on the System board.
Check visually that the connector is connected firmly.
Check 1 Make sure the USB FDD cable is firmly connected to the CN4611 (port 3) or
CN4610 (port 0) of the System board, or CN4620 (port 5) of the CN board.
If the connection is loose, reconnect firmly and repeat Procedure 2. If there is still
an error, go to Check 2.
Check 2 The USB FDD may be defective or damaged. Replace it with a new one. If the
FDD is still not functioning properly, perform Check 3 when the USB FDD is
connected to CN4620 (port 5) or Check 5 when the USB FDD is connected to
CN4611/CN4610 (port 3/0).
Check 3 The connection between the CN board and the System board may be loose.
Reconnect the cable between them firmly. If the FDD is still not functioning
properly, perform Check 4.
Check 4 The CN board may be defective or damaged. Replace it with a new one. If the
FDD is still not functioning properly, perform Check 5.
Check 5 Replace the System board with a new one following the steps in Chapter 4,
Replacement Procedures.
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2.6 2.5” HDD Troubleshooting
2.6 2.5” HDD Troubleshooting
This section describes how to determine if the 2.5” HDD is functioning properly. Perform the
steps below starting with Procedure 1 and continuing with the other procedures as required.
Procedure 1: Partition Check
Procedure 2: Message Check
Procedure 3: Format Check
Procedure 4: Diagnostic Test Program Execution Check
Procedure 5: Connector Check and Replacement Check
CAUTION: The contents of the 2.5” hard disk will be erased when the 2.5” HDD
troubleshooting procedures are executed. Transfer the contents of the hard disk to floppy
disks or other storage drive(s). For the backup, refer to the User’s Manual.
Procedure 1
Partition Check
Insert the Toshiba MS-DOS system disk and start the computer. Perform the following
checks:
Check 1 Type C: and press Enter. If you cannot change to drive C, go to Check 2. If you
can change to drive C, go to Procedure 2.
Check 2 Type FDISK and press Enter. Choose Display Partition Information from the
FDISK menu. If drive C is listed in the Display Partition Information, go to Check
3. If drive C is not listed, return to the FDISK menu and choose the option to
create a DOS partition or a logical DOS drive on drive C. If the problem still exists,
go to Procedure 2.
Check 3 If drive C is listed as active in the FDISK menu, go to Check 4. If drive C is not
listed as active, return to the FDISK menu and choose the option to set the active
partition for drive C. Then go to Procedure 2.
Check 4 Remove the system disk from the FDD and reboot the computer. If the problem
still exists, go to Procedure 2. Otherwise, the HDD is operating normally.
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2.6 2.5” HDD Troubleshooting
2 Troubleshooting
Procedure 2
Message Check
When the power is turned on, the system performs the Initial Reliability Test (IRT) installed
in the BIOS ROM. When the test detects an error, an error message is displayed on the screen.
Make sure of no floppy disk in the FDD. Turn on the computer and check the message on the
screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check
1 below and perform the other checks as instructed.
Check 1 If any of the following messages appear, go to Procedure 3. If the following
messages do not appear, perform Check 2.
HDC ERROR
or
HDD #X ERROR(After 5 seconds this message will disappear.)
Check 2 If either of the following messages appears, go to Check 3. If the following
messages do not appear, perform Check 4.
Insert system disk in drive
Press any key when ready .....
or
Non-System disk or disk error
Replace and press any key when ready
Check 3 Using the SYS command of the MS-DOS, transfer the system to the 2.5” HDD. If
the system is not transferred, go to Procedure 3. Refer to the MS-DOS Manual for
detailed operation.
If the following message appears on the display, the system program has been
transferred to the HDD.
System Transferred
If an error message appears on the display, perform Procedure 3.
Check 4 The 2.5” HDD, HD board and the connector of the System board may be
disconnected (Refer to the steps described in Chapter 4, Replacement Procedures
for disassembling the PC.). Reconnect them firmly. If they are firmly connected,
go to Procedure 3.
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2.6 2.5” HDD Troubleshooting
Procedure 3
Format Check
The computer’s 2.5” HDD is formatted using the MS-DOS FORMAT program or the physical
format program of the test program. To format the 2.5” HDD, start with Check 1 below and
perform the other steps as required.
Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test
program, refer to the Chapter 3.
Check 1 Format the 2.5” HDD using MS-DOS FORMAT command. Type as FORMAT
C:/S/U.
If the 2.5” HDD can not be formatted, perform Check 2.
Check 2 Using the MS-DOS FDISK command, set the 2.5” HDD partition. If the partition
is not set, go to Check 3. If it is set, format the 2.5” HDD using MS-DOS
FORMAT command.
Check 3 Using the Diagnostic Disk, format the 2.5” HDD with a format option (physical
format). If the 2.5” HDD is formatted, set the 2.5” HDD partition using MS-DOS
FDISK command.
If you cannot format the 2.5” HDD using the Tests and Diagnostic program, go to
Procedure 4.
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2.6 2.5” HDD Troubleshooting
2 Troubleshooting
Procedure 4
Diagnostic Test Program Execution Check
The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the
Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about
the HDD test program.
If an error is detected during the HDD test, an error code and status will be displayed. The
error codes and statuses are described in Table 2-5. If an error code is not displayed but the
problem still exists, go to Procedure 5.
Table 2-5 2.5” HDD error code and status
Code
01h
Status
Bad command
Address mark not found
Record not found
HDC not reset
Drive not initialized
HDC overrun error (DRQ)
DMA boundary error
Bad sector error
Bad track error
ECC error
02h
04h
05h
07h
08h
09h
0Ah
0Bh
10h
11h
20h
40h
80h
AAh
BBh
CCh
E0h
EEh
DAh
ECC recover enable
HDC error
Seek error
Time out error
Drive not ready
Undefined error
Write fault
Status error
Access time out error
No HDD
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2.6 2.5” HDD Troubleshooting
Procedure 5
Connector Check and Replacement Check
The HDD is connected to the System board with a HDD cable. The connecting portions may
be loose. Disassemble the computer following the steps described in Chapter 4, Replacement
Procedures and perform the following checks to check the connecting portions:
Check 1 Make sure the HDD cable is firmly connected to the connector CN1900 of the
System board and HDD.
If connection is loose, reconnect firmly and repeat Procedure 4. If there is still an
error, go to Check 2.
Check 2 The 2.5” HDD may be damaged. Replace it with a new one and check the
operation. If the problem still exists, perform Check 3.
Check 3 The System board may be damaged. Replace it with a new one following the
instructions in Chapter 4, Replacement Procedures.
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2.7 Keyboard Troubleshooting
2 Troubleshooting
2.7 Keyboard Troubleshooting
To determine if the computer’s keyboard is functioning properly, perform the following
procedures. Start with Procedure 1 and continue with the other procedures as instructed.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector Check and Replacement Check
Procedure 1
Diagnostic Test Program Execution Check
Execute the Keyboard Test in the Diagnostic Program. Refer to Chapter 3, Tests and
Diagnostics for more information on how to perform the test program.
If an error occurs, go to Procedure 2. If an error does not occur, the keyboard is functioning
properly.
Procedure 2
Connector Check and Replacement Check
The keyboard or System board may be disconnected or damaged. Disassemble the computer
following the steps described in Chapter 4, Replacement Procedures and perform the
following checks:
Check 1 Make sure the keyboard cable is firmly connected to the connector CN3230 on the
System board.
If the connection is loose, reconnect the cable firmly and repeat Procedure 1. If
there is still an error, go to Check 2.
Check 2 The keyboard may be damaged. Replace it with a new one following the
instructions in Chapter 4, Replacement Procedures. If the problem still exists,
perform Check 3.
Check 3 The System board may be damaged. Replace it with a new one following the
instructions in Chapter 4, Replacement Procedures.
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2.8 Display Troubleshooting
2.8 Display Troubleshooting
This section describes how to determine if the computer’s display is functioning properly.
Start with Procedure 1 and continue with the other procedures as instructed.
Procedure 1: External Monitor Check
Procedure 2: Diagnostic Test Program Execution Check
Procedure 3: Connector and Cable Check
Procedure 4: Replacement Check
Procedure 1
External Monitor Check
Connect an external monitor to the computer’s external monitor port, and then boot the
computer. The computer automatically detects the external monitor.
If the external monitor works correctly, the internal LCD may be damaged. Go to Procedure 3.
If the same problem as the internal monitor appears on the external monitor, the System board
may be damaged. Go to Procedure 2.
Procedure 2
Diagnostic Test Program Execution Check
The Display Test program is stored on the Diagnostics disk. Insert the Diagnostics disk in the
USB floppy disk drive, turn on the computer and run the test. Refer to Chapter 3, Tests and
Diagnostics for details.
This program checks the display controller on the System board. If an error is detected, go to
Procedure 3.
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2.8 Display Troubleshooting
2 Troubleshooting
Procedure 3
Connector and Cable Check
The LCD module is connected to the System board through the LCD/FL cable. Also, the FL
inverter is connected the System board through the LCD/FL cable. The cable may be firmly
disconnected the board or damaged. Disassemble the computer following the steps described
in Chapter 4, Replacement Procedures. If the connection is loose, reconnect the cable firmly
and repeat Procedure 2. If there is still an error, go to Procedure 4.
Procedure 4
Replacement Check
(1)
(2)
If characters or graphics are not displayed on the internal display, perform Check 1.
If characters or images are displayed on the internal display but the display is not
normal, perform Check 2.
(3)
If characters or images are displayed on the internal display but the display is dark (the
back-light does not light), perform Check 5.
Check 1 The display ON/OFF switch may be damaged. Remove the display ON/OFF
switch and repeat Procedure 4. If there is still an error, go to Check 2.
Check 2 The LCD/FL cable may be damaged. Replace the damaged cable with a new one
and repeat Procedure 4. If there is still an error, go to Check 3.
Check 3 The LCD module may be damaged. Replace it with a new one and repeat
Procedure 4. If there is still an error, go to Check 4.
Check 4 The FL inverter may be damaged. Replace it with a new one and repeat Procedure
4. If there is still an error, go to Check 5.
Check 5 The FL tube may be damaged. Replace it with a new one and repeat Procedure 4.
If there is still an error, go to Check 6.
Check 6 The display controller of the System board may be damaged. Replace the System
board with a new one.
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2.9 Touch pad Troubleshooting
2.9 Touch pad Troubleshooting
To determine whether the Touch pad is faulty or not, perform the following procedures:
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector and Cable Check
Procedure 3: Replacement Check
Procedure 1
Diagnostic Test Program Execution Check
Execute the test for Touch pad in ONLY ONE test in the Diagnostic Program. Refer to
Chapter 3, Tests and Diagnostics, for more information on how to perform the test program.
If an error occurs, go to Procedure 2. If an error does not occur, the Touch pad keyboard is
functioning properly.
Procedure 2
Connector and Cable Check
The Touch pad is connected to the connector CN3240 on the System board with a flexible
cable. This cable may have come off the connector of the touch pad or of the System board.
Disassemble the computer and check the cable connections. See Chapter 4 for the disassembly
procedure. If the cable has come off, connect firmly it and make sure the operation. If there is
still an error, go to Procedure 3.
Procedure 3
Replacement Check
Check 1 The Touch pad may be damaged. Replace it with a new one and repeat Procedure 1.
If there is still an error, go to Check 2.
Check 2 The System board may be damaged. Replace the System board with a new one
according to the procedure in Chapter 4.
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2.10 Selectable bay (optical drive) Troubleshooting
2 Troubleshooting
2.10 Selectable bay (optical drive) Troubleshooting
The Selectable bay can be installed in this model and the Selectable bay optical drive is
installed as standard. Here explains the troubleshooting for the optical drive.
To check if the optical drive is defective or not, follow the troubleshooting procedures below
as instructed.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector Check and Replacement Check
Procedure 1
Diagnostic Test Program Execution Check
Prepare the tools before the test. (Refer to tools for implementing the Diagnostics procedures
on Chapter 3.)
Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program. Refer to Chapter 3, Tests
and Diagnostics for more information on how to perform the test program.
If any error is detected by the test, go to Procedure 2.
Procedure 2
Connector Check and Replacement Check
The optical drive may be disconnected from the System board or faulty. Disassemble the
computer following the steps described in Chapter 4 and perform the following checks:
Check 1 Make sure the optical drive is firmly connected to the connector CN1801 on the
System board.
If the connection is loose, reconnect it firmly and return to Procedure 1. If there is
still an error, perform Check 2.
Check 2 The optical drive may be faulty. Replace the optical drive with a new one
following the steps in Chapter 4. If the problem still occurs, perform Check 3.
Check 3 The System board may be faulty. Replace it with new one following the
instructions in Chapter 4.
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2.11 Modem Troubleshooting
2.11 Modem Troubleshooting
To check if the modem is defective or malfunctioning, follow the troubleshooting procedures
below as instructed.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector Check and Replacement Check
Procedure 1
Diagnostic Test Program Execution Check
Execute the Modem test program available as part of the maintenance test program. This
program checks the modem. See Chapter 3 for information on how to perform the test.
If any error is detected by the test, go to Procedure 2.
Procedure 2
Connector Check and Replacement Check
The Modem jack (RJ11) is mounted on the System board and MDC is connected to the
System board. If the modem malfunctions, the connection may be bad or the MDC or System
board might be faulty.
Disassemble the computer following the steps described in Chapter 4 and perform the
following checks:
Check 1 Make sure the MDC is firmly connected to the CN3000 and the MDC cable is
connected to the CN3001 on the System board.
If any connector is disconnected, connect it firmly and return to Procedure 1. If
there is still an error, perform Check 2.
Check 2 The MDC may be faulty. Replace it with a new one following the steps in Chapter
4. If the modem is not still working properly, perform Check 3.
Check 3 The System board may be faulty. Replace it with a new one following the
instructions in Chapter 4.
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2.12 Bluetooth Troubleshooting
2 Troubleshooting
2.12 Bluetooth Troubleshooting
This section describes how to determine if the Bluetooth in the computer is functioning
properly. Perform the steps below starting with Procedure 1 and continuing with the other
procedures as required.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connection Check
Procedure 3: Replacement Check
Procedure 1
Diagnostic Test Program Execution Check
Make sure the wireless switch on the left side of the computer is turned “On”. If it is not, slide
the switch toward the back of the computer to turn it on.
Check 1 Execute Bluetooth test program. Perform the test following the instructions
described in Chapter 3, Bluetooth Test Program. You will need a second computer
that can communicate by the Bluetooth.
If the computer passes the test, the function is correctly working. If the computer
does not pass the test, go to check 2.
Check 2 The Bluetooth module may be defective or damaged. Replace it with a new one.
Then perform the test program again.
If the computer still does not pass the test, go to Procedure 2.
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2.12 Bluetooth Troubleshooting
Procedure 2
Connection Check
The Bluetooth functional wiring diagram is shown below:
Any of the connections may be disconnected. Disassemble the computer following the steps
described in Chapter 4, Replacement Procedures, and perform the following checks:
Check 1 Make sure the flexible cable is firmly connected to connector on the Bluetooth
module and CN4400 on the CN board. If the connector is disconnected, connect it
firmly and perform Procedure 1. If the Bluetooth module is still not functioning
properly, perform Check 2.
Check 2 Make sure the Bluetooth antenna cable (brown) is firmly connected to the
Bluetooth module. If the Bluetooth antenna cable is disconnected, connect it firmly
and perform Procedure 1. If the Bluetooth function is still not functioning properly,
perform Check 3.
Check 3 Make sure the cable is firmly connected to CN9520 on the CN board and CN9502
on the System board. If the flexible cable is disconnected, connect it firmly and
perform Procedure 1. If the Bluetooth function is still not functioning properly, go
to procedure 3.
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2.12 Bluetooth Troubleshooting
2 Troubleshooting
Procedure 3
Replacement Check
The Bluetooth antenna, Bluetooth module, CN board and System board are connected to the
circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement
Procedures, for instructions on how to disassemble the computer and then perform the
following checks:
Check 1 Any of the cables may be defective or damaged. Replace the cable with a new one
following the steps in Chapter 4, Replacement Procedures. If the Bluetooth is still
not functioning properly, perform Check 2.
Check 2 The Bluetooth module may be defective or damaged. Replace the Bluetooth
module with a new one following the steps in Chapter 4, Replacement Procedures.
If the Bluetooth is still not functioning properly, perform Check 3.
Check 3 The CN board may be defective or damaged. Replace the CN board with a new
one following the steps in Chapter 4, Replacement Procedures. If the Bluetooth is
still not functioning properly, perform Check 4.
Check 4 The Bluetooth antenna may be defective or damaged. Replace the Bluetooth
antenna with a new one following the steps in Chapter 4, Replacement Procedures.
If the Bluetooth is still not functioning properly, perform Check 5.
Check 5 The System board may be defective or damaged. Replace the System board with a
new one following the steps in Chapter 4, Replacement Procedures.
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2.13 LAN Troubleshooting
2.13 LAN Troubleshooting
To check if the computer’s LAN is defective or malfunctioning, follow the troubleshooting
procedures below as instructed.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector Check and Replacement Check
Procedure 1
Diagnostic Test Program Execution Check
To check the LAN function, execute the Sound/LAN/Modem test program subtest 04 (LAN
test). See Chapter 3 for information on how to perform the test.
If any error is detected by the test, go to Procedure 2.
Procedure 2
Connector Check and Replacement Check
The LAN function is installed on the System board and the RJ45 jack and the controller is
mounted on the System board. If the LAN malfunctions, the System board might be faulty.
Disassemble the computer following the steps described in Chapter 4 and replace the System
board.
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2.14 Sound Troubleshooting
2 Troubleshooting
2.14 Sound Troubleshooting
To check if the sound function is defective or malfunctioning, follow the troubleshooting
procedures below as instructed.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector Check
Procedure 3: Replacement Check
Procedure 1
Diagnostic Test Program Execution Check
Execute the Sound test program available as part of the maintenance test program. See
Chapter 3 for information on how to perform the test.
If any error is detected by the test, go to Procedure 2
Procedure 2
Connector Check
The speaker, internal microphones, external microphone and headphone are connected to the
System board shown in the following figure. These connections may be loose or cables may
come off. Disassemble the computer referring to the steps described in Chapter 4 and make
sure each connection. If there is still an error, perform Procedure 3.
Procedure 3
Replacement Check
Check 1 If the external speaker or headphone is not working properly, it may be faulty.
Replace it with a new one. If there is still an error, perform Check 2.
Check 2 If the speaker or internal microphones is not working properly, it may be faulty.
Replace it with a new one following the step in Chapter 4. If there is still an error,
go to Check 3.
Check 3 The System board may be faulty. Replace it with a new one following the step in
Chapter 4.
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2.15 SD Card Slot Troubleshooting
2.15 SD Card Slot Troubleshooting
To check if the SD card slot is good or no good, follow the troubleshooting procedures below
as instructed.
Procedure 1: Check on Windows XP Tablet PC Edition
Procedure 2: Connector Check and Replacement Check
Procedure 1
Check on Windows XP Tablet PC Edition
Insert an SD card into the slot. Check if the installed Windows XP Tablet PC Edition
recognizes automatically the SD card and the data in the SD card can be read.
If the card is not recognized or data are not read, go to Procedure 2.
Procedure 2
Connector Check and Replacement Check
The SD card is connected to the connector IS2130 of the connector board.
Check 1 The SD card and the System board may be disconnected. Make sure the SD card is
firmly inserted to the IS2130 of the System board. If the SD card is still not
functioning properly, perform Check 2.
Check 2 The SD card may be faulty. Replace it with a new one following the step in
Chapter 4. If the problem continues, perform Check 3.
Check 3 The System board may be faulty. Replace it with a new one following the step in
Chapter 4.
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2.16 Tablet Pen Troubleshooting
2 Troubleshooting
2.16 Tablet Pen Troubleshooting
To check if the Tablet Pen is defective or not, follow the troubleshooting procedures below as
instructed.
CAUTION: Use the Tablet Pen supplied to this model.
Procedure 1: Check on Windows XP Tablet PC Edition
Procedure 2: Tablet pen replacement Check
Procedure 3: Connector Check and Replacement Check
Procedure 1
Check on Windows XP Tablet PC Edition
This procedure checks if the tablet pen is working properly by using the function of Windows
XP Tablet Edition.
Check 1 Make sure the mouse cursor is following the tablet pen when you move the pen on
the display. If it does not work properly, go to Procedure 2.
Check 2 Make sure the “click” function works properly when you tap (touch) the display
with the tablet pen. If it does not work properly, go to Procedure 2.
When both the functions work correctly, the tablet pen is not defective.
Procedure 2
Tablet pen replacement Check
Check 1 The core of the tablet pen might be worn out. Replace the core with a new one
following the steps in the User’s manual, and check the tablet pen is working
properly. If there is still an error, go to Check 2.
Check 2 The tablet pen might be defective. Replace the tablet pen with a new one and check
if the tablet pen is working properly. If there is still an error, execute Procedure 3.
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2 Troubleshooting
2.16 Tablet Pen Troubleshooting
Procedure 3
Connector Check and Replacement Check
The Digitizer and LCD are connected to the System board as below.
Check 1 The Digitizer may be disconnected. Make sure the Digitizer is connected to the
CN9540 on the System board. If there is still an error, go to Check 2.
Check 2 The LCD might be disconnected. Make sure the LCD is connected to the CN5501
on the System board. If there is still an error, go to Check 3.
Check 3 The Digitizer, the LCD or the System board may be defective. Replace it with a
new one following the steps in Chapter 4. Then check the tablet pen is working
properly.
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2.17 Wireless LAN Troubleshooting
2 Troubleshooting
2.17 Wireless LAN Troubleshooting
To check if the Wireless LAN is defective or not, follow the troubleshooting procedures
below as instructed.
Procedure 1: Transmitting/Receiving Check
Procedure 2: Check of Antenna connection
Procedure 3: Replacement Check
Procedure 1
Transmitting/Receiving Check
Make sure the wireless communication switch on the computer is turned ON. If it is not, turn
ON.
Check 1 Execute test program for the wireless LAN function to check the
transmitting/receiving function of the wireless LAN. You will need another
computer that can communicate by the wireless LAN.
If the computer passes the test, the function is correctly working.
If the computer does not pass the test, perform Procedure 2.
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2 Troubleshooting
2.17 Wireless LAN Troubleshooting
Procedure 2
Check of Antenna connection
The wireless LAN functional wiring diagram is shown below:
Any of the connections may be disconnected. Disassemble the computer following the steps
described in Chapter 4, and perform the following checks:
Check 1 The wireless LAN card and the System board may be disconnected. Make sure the
wireless LAN card is firmly connected to the CN2200 of the System board.
If the board connector is disconnected, connect it firmly and return to Procedure 1.
If there is still an error, go to Check 2.
Check 2 Make sure the wireless LAN antennas (black and white) are firmly connected to
the Wireless LAN card. If the antennas are disconnected, connect firmly then
return to Procedure 1. If there is still an error, perform Procedure 3.
Procedure 3
Replacement Check
Check if the wireless LAN card and the System board are connected properly. If they are
properly connected but there is stall an error, any of these components may be damaged.
Disassemble the computer following the steps described in Chapter 4 and replace the board
with a new one.
Check 1 The wireless LAN card may be defective or damaged. Disassemble the computer
following the steps described in Chapter 4 and replace the board with a new one. If
there is still an error go to Check 2.
Check 2 The wireless LAN antennas may be defective or damaged. Disassemble the
computer following the steps described in Chapter 4 and replace the board with a
new one. If there is still an error go to Check 3.
Check 3 The System board may be defective or damaged. Disassemble the computer
following the steps described in Chapter 4 and replace the board with a new one.
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Chapter 3
Tests and Diagnostics
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3 Tests and Diagnostics
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3 Tests and Diagnostics
Chapter 3 Contents
3.1
The Diagnostic Test................................................................................................... 3-1
3.1.1
3.1.2
3.1.3
Diagnostics menu ................................................................................. 3-1
H/W (Hardware) initial information setting tool.................................. 3-3
Heatrun test program............................................................................ 3-3
3.2
Executing the Diagnostic Test ................................................................................... 3-4
3.2.1
3.2.2
3.2.3
Diagnostics menu (T&D)..................................................................... 3-5
H/W initial information setting tool..................................................... 3-7
Heatrun test program............................................................................ 3-7
3.3
3.4
3.5
3.6
3.7
3.8
3.9
Setting of the hardware configuration ....................................................................... 3-8
Heatrun Test............................................................................................................. 3-11
Subtest Names.......................................................................................................... 3-12
System Test.............................................................................................................. 3-14
Memory Test............................................................................................................ 3-16
Keyboard Test.......................................................................................................... 3-17
Display Test ............................................................................................................. 3-18
3.10 Floppy Disk Test...................................................................................................... 3-21
3.11 Printer Test............................................................................................................... 3-23
3.12 Async Test ............................................................................................................... 3-25
3.13 Hard Disk Test......................................................................................................... 3-26
3.14 Real Timer Test........................................................................................................ 3-29
3.15 NDP Test.................................................................................................................. 3-31
3.16 Expansion Test......................................................................................................... 3-32
3.17 CD-ROM/DVD-ROM Test ..................................................................................... 3-34
3.18 Error Code and Error Status Names ........................................................................ 3-35
3.19 Hard Disk Test Detail Status ................................................................................... 3-38
3.20 Only One Test.......................................................................................................... 3-40
3.20.1 Program Description .......................................................................... 3-40
3.20.2 Operations .......................................................................................... 3-40
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3 Tests and Diagnostics
3.21 Head Cleaning.......................................................................................................... 3-48
3.21.1 Function Description.......................................................................... 3-48
3.21.2 Operations .......................................................................................... 3-48
3.22 Log Utilities ............................................................................................................. 3-49
3.22.1 Function Description.......................................................................... 3-49
3.22.2 Operations .......................................................................................... 3-50
3.23 Running Test............................................................................................................ 3-51
3.23.1 Function Description.......................................................................... 3-51
3.23.2 Operations .......................................................................................... 3-51
3.24 Floppy Disk Drive Utilities...................................................................................... 3-52
3.24.1 Function Description.......................................................................... 3-52
3.24.2 Operations .......................................................................................... 3-53
3.25 System Configuration .............................................................................................. 3-57
3.25.1 Function Description.......................................................................... 3-57
3.25.2 Operations .......................................................................................... 3-58
3.26 Wireless LAN Test Program (Intel-made b/g)......................................................... 3-59
3.27 Wireless LAN Test Program (Intel-made a/b/g)...................................................... 3-63
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program .................................................. 3-68
3.28.1 LAN test ............................................................................................. 3-68
3.28.2 Modem test......................................................................................... 3-71
3.28.3 Bluetooth test...................................................................................... 3-72
3.28.4 IEEE1394 test..................................................................................... 3-81
3.29 Sound Test Program................................................................................................. 3-82
3.29.1 Sound (Standard) test ......................................................................... 3-82
3.29.2 Sound (Legacy) test............................................................................ 3-84
3.29.3 CD Sound (Standard) test................................................................... 3-85
3.29.4 CD Sound (Legacy) test ..................................................................... 3-87
3.30 SETUP ..................................................................................................................... 3-88
3.30.1 Function Description.......................................................................... 3-88
3.30.2 Accessing the SETUP Program.......................................................... 3-90
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Figures
Figure 3-1
Name and positions of each side.................................................................. 3-45
Tables
Table 3-1
Table 3-2
Table 3-3
Table 3-4
Table 3-5
Table 3-6
Table 3-7
Subtest names............................................................................................... 3-12
Error codes and error status names.............................................................. 3-35
HDC status register contents........................................................................ 3-38
Error register contents.................................................................................. 3-39
Error message............................................................................................... 3-74
Error code for Bluetooth test (BD_ADDR)................................................. 3-75
Error code for Bluetooth test (BD_ADDR of the DUT).............................. 3-79
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3.1 The Diagnostic Test
3 Tests and Diagnostics
3
3.1 The Diagnostic Test
This chapter explains how to use the Diagnostic Test programs to test the functions of the
computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic
Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program
Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
The Hardware Initial information Setting Tool consists of some programs that write the
hardware information or displays the current information of the computer. It is also included
in one of Diagnostic Disks.
The heatrun test is automatic test program that executes the some tests successively.
NOTE: Before starting the diagnostics, be sure to follow these steps:
1. Check all cables are connected firmly.
2. Exit any application and close Windows.
3. Check if “ALL Device” is selected in the item [Device Config.] in SETUP
menu. After checking the diagnostics, be sure to select “Setup by OS”.
3.1.1 Diagnostics menu
The DIAGNOSTIC MENU consists of the following functions.
‰ DIAGNOSTIC TEST
‰ ONLY ONE TEST
‰ HEAD CLEANING
‰ LOG UTILITIES
‰ RUNNING TEST
‰ FDD UTILITIES
‰ SYSTEM CONFIGURATION
‰ EXIT TO MS-DOS
The DIAGNOSTIC TEST MENU contains the following functional tests.
‰ SYSTEM TEST
‰ MEMORY TEST
‰ KEYBOARD TEST
‰ DISPLAY TEST
‰ FLOPPY DISK TEST
‰ PRINTER TEST
‰ ASYNC TEST
‰ HARD DISK TEST
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3.1 The Diagnostic Test
‰ REAL TIMER TEST
‰ NDP TEST
‰ EXPANSION TEST
‰ CD-ROM/DVD-ROM TEST
Other tests are:
‰ Wireless LAN TEST (Wireless LAN test disk)
‰ LAN/Modem/Bluetooth/IEEE1394 TEST (LAN/Modem/Bluetooth/IEEE1394 test
disk)
‰ Sound TEST (Sound test disk)
You will need the following equipment to perform some of the Diagnostic test programs.
‰ USB FDD
‰ The Diagnostic Disks
(T&D for maintenance, LAN/Modem/Bluetooth/IEEE1394 test disk for maintenance,
Wireless LAN test disk for maintenance and Sound test disk for maintenance)
‰ A formatted working disk (Floppy disk test)
‰ A cleaning kit to clean the floppy disk drive heads (Head Cleaning)
‰ An external CRT monitor supporting monitor ID (Expansion test)
‰ A CD test media TOSHIBA CD-ROM TEST DISK or ABEX TEST CD-ROM
(Sound test)
‰ A DVD test media (DVD-ROM TEST DISK TSD-1) (Sound test)
‰ A music CD (Sound test)
‰ A CD-RW test media (CD-ROM/DVD-ROM test)
‰ A USB test module (USB test )
‰ A USB cable (USB test)
‰ LAN wraparound connector (LAN test)
‰ Module cable and RJ11 connector checker (Modem test)
‰ Headphones (Sound test)
‰ A microphone (Sound test)
‰ A PC for wraparound test (Wireless LAN test/Bluetooth test/IEEE1394 test)
‰ PC card wraparound connector (Expansion test)
‰ RS-232C wraparound connector (Async test)
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3.1 The Diagnostic Test
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3.1.2 H/W (Hardware) initial information setting tool
The H/W initial information setting tool consists of the following programs.
‰ Initial configuration
‰ DMI information save
‰ DMI information recovery
‰ System configuration display
‰ E2PROM test (MAC/GUID/DMI)
You will need the following equipment to perform some of the programs.
‰ The Diagnostics Disk (Main T&D)
3.1.3 Heatrun test program
The heatrun test starts automatically after the selection.
You will need the following equipment to perform this program.
‰ The Diagnostics Disk (Main T&D)
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3.2 Executing the Diagnostic Test
3.2 Executing the Diagnostic Test
To start the DIAGNOSTIC PROGRAM, follow these steps:
1. Insert the Diagnostics disk in the floppy disk drive.
2. Release the lock of the power switch and turn on the computer with pressing the F12.
Select the FDD in the display for selecting booting unit. Then, press Enter and the
following menu appears.
Microsoft Windows XX Startup Menu
---------------------------------------------------------
1. Repair Main (T&D)
2. Repair initial config set
3. Repair Heatrun (T&D)
Enter a choice: 1
To start the Diagnostics menu (T&D), press 1 and Enter .
To start the H/W initial information setting tool, press 2 and Enter.
To start the Heatrun test, press 3 and Enter.
NOTE: When replacing the System board, be sure to execute the following procedures.
(1) Before replacing the System board, execute subtest03 “DMI information
save” in 3.3 Setting of the hardware configuration in order to save the DMI
information from System board to floppy disk.
(2) After replacing the System board, execute the subtest04 “DMI information
recovery” and subtest08 “System configuration display” in 3.3 Setting of the
hardware configuration in order to copy the DMI information and system
information from the floppy disk.
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3.2 Executing the Diagnostic Test
3 Tests and Diagnostics
3.2.1 Diagnostics menu (T&D)
After pressing 1 and Enter in the startup menu, the following menu appears.
TOSHIBA personal computer Common DIAGNOSTICS
Version X.XX (c) copyright TOSHIBA Corp. 20XX
DIAGNOSTICS MENU :
1 - DIAGNOSTIC TEST
2 – ONLY ONE TEST
3 -
4 - HEAD CLEANING
5 - LOG UTILITIES
6 - RUNNING TEST
7 - FDD UTILITIES
8 - SYSTEM CONFIGURATION
9 - EXIT TO MS-DOS
NOTE: To exit the DIAGNOSTIC TEST MENU, press the Esc key. If a test program is in
progress, press Ctrl + Break to exit the test program. If a test program is in
progress, press Ctrl + C to stop the test program.
Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU
will appear:
TOSHIBA personal computer Common DIAGNOSTICS
version X.XX (c) copyright TOSHIBA Corp. 20XX
DIAGNOSTIC TEST MENU :
1 - SYSTEM TEST
2 - MEMORY TEST
3 - KEYBOARD TEST
4 - DISPLAY TEST
5 - FLOPPY DISK TEST
6 - PRINTER TEST
7 – ASYNC TEST
8 - HARD DISK TEST
9 - REAL TIMER TEST
10 - NDP TEST
11 - EXPANSION TEST
12 - CD-ROM/DVD-ROM TEST
88 - ERROR RETRY COUNT SET [FDD & HDD]
99 - EXIT TO DIAGNOSTICS MENU
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3 Tests and Diagnostics
3.2 Executing the Diagnostic Test
Functions 1 through 12 are the Diagnostic Tests. Function 88 sets the floppy disk
drive and hard disk drive error retry count (0-255).
To exit the submenu of the Diagnostic Test and returns to the Diagnostics Menu, set
the highlight bar to function 99 and press Enter.
Select the option you want to execute and press Enter. When you select 1- SYSTEM
TEST, the following message will appear:
SYSTEM TEST NAME XXXXXX xxxxxxx DIAGNOSTIC TEST VX.XX
[Ctrl]+[Break] : test end
[Ctrl]+[C]
: key stop
SUB-TEST : XX
PASS COUNT : XXXXX
WRITE DATA : XX
ADDRESS
ERROR COUNT : XXXXX
READ DATA : XX
: XXXXXXSTATUS
: XXX
SUB-TEST MENU :
01 - ROM checksum
02 – Fan ON/OFF
03 - Geyserville
04 - Quick charge
05 - DMI read
99 - Exit to DIAGNOSTIC TEST MENU
NOTE: The menu displayed by your computer may be slightly different from the one
shown above.
Select the desired subtest number from the subtest menu and press Enter. The following
message will appear:
TEST LOOP : YES (or NO)
ERROR STOP : YES (or NO)
Use the right and left arrow keys to move the cursor to the desired option.
Selecting YES of TEST LOOP increases the pass counter by one, each time the test cycle
ends and restarts the test cycle.
Selecting NO returns the process to the subtest menu after the test is complete.
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3.2 Executing the Diagnostic Test
3 Tests and Diagnostics
Use the up and down arrow keys to move the cursor to “ERROR STOP”.
Use the right and left arrow keys to move the cursor to the desired option and press Enter.
Selecting YES of ERROR STOP stops the test program when an error is found and displays
the operation guide on the right side of the display screen as shown below:
ERROR STATUS NAME [[ HALT OPERATION ]]
1: Test end
2: Continue
3: Retry
These three selections have the following functions respectively:
1. Terminates the test program and exits to the subtest menu.
2. Continues the test.
3. Restarts the test from the error.
Selecting NO keeps the test running even if an error is found. When an error occurred, the
error status is displayed and one error is added to the error counter.
Table 3-1 in section 3.5 describes the function of each test on the subtest menu. Table 3-2 in
section 3.18 describes the error codes and error status for each error.
3.2.2 H/W initial information setting tool
After selecting this test, the following menu appears in the display.
##################################################################
######
H/W initial information setting tool VX.XX
######
##################################################################
*
*
*
*
*
1
3
4
8
9
Initial configuration
DMI information save
DMI information recovery
System configuration display
E2PROM test (MAC/GUID/DMI)
*
*
*
*
*
******************************************************************
... Press test number [1-3,4,8,9] ?
For more details on this test, refer to the section 3.3.
3.2.3 Heatrun test program
Heatrun test starts executing the same subtest as 3.23 Running Test.
For more details on this test, refer to the section 3.4.
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3.3 Setting of the hardware configuration
3.3 Setting of the hardware configuration
To execute this program, select 2-Repair initial config setin the startup menu,
press Enter and follow the directions on the screen. The H/W initial information setting tool
consists of four subtests. Move the highlight bar to the subtest you want to execute and press
Enter.
Subtest 01
Initial configuration
This subtest executes the following items and shows their contents in the
display. When an item ends normally, the program proceeds automatically to
the next one. When an error is found, the program stops and waits for key
input. (After solving the problem, the program executes the item again.)
Setting of the CPU set table
Setting of the microcode
Setting of the EHSS
Inputting and writing of DMI information
When the DMI information is displayed, the following messages
appear in order. Input each information. (If you do not replace the
PCB, the DMI information should not be changed.)
1. “Enter Model Name ?” is displayed. Input the computer’s model
name and press Enter. (e.g. PORTEGE)
2. “Enter Version Number ?” is displayed. Input the computer’s
version number and press Enter. (e.g. PC18070C313S)
3. “Enter Serial Number ?” is displayed. Input the computer’s serial
number and press Enter. (e.g. 12345678)
4. “Enter Model Number ?” is displayed. Input the computer’s sales
model number and press Enter. (e.g. PP200-AAAAA)
5. “Enter Bundle Number ?” is displayed. Input the computer’s
PCN/Bundle number and press Enter.
(e.g. PMSREQ3Q34H/S0123456789)
6. “Write data OK (Y/N) ?” is displayed. To write the DMI
information to the Flash ROM, press Y, and then Enter.
7. “Create DMIINFO TXT (Y/N) ?” is displayed. Press Y, then the
DMI information (text data) is written to the Floppy disk, etc.
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3.3 Setting of the hardware configuration
3 Tests and Diagnostics
Setting of the HWSC
Setting of the UUID
Display of the DMI information (including UUID)
Setting of DVD region code (Yes/No)
After completion of the above settings, H/W configuration & DMI
information are appeared in order. Check the contents and press Enter.
Following message appears in the display. Press any key, then return to the
H/W initial information setting tool menu.
+------------------------------------------------+
+ It switches off the power on automatically. +
+------------------------------------------------+
Press any key to continue...
Subtest 03
DMI information save
NOTE: Before replacing the System board, be sure to execute this subtest and save the
DMI information to the floppy disk.
This is one of tools to copy the DMI information to a new PCB after
replacing.
This subtest saves all the DMI data in a floppy disk.
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3 Tests and Diagnostics
3.3 Setting of the hardware configuration
Subtest 04
DMI information recovery
NOTE: 1. After replacing the System board, be sure to execute this subtest and copy the
DMI information to a new System board.
2. Since the data of UUID is updated every time when this subtest, DMI
information recovery, is done, the saved UUID data is not written.
This is one of tools to copy the DMI information to a new PCB after
replacing.
This subtest writes all the DMI data in the floppy disk into the new PCB.
Subtest 08
System configuration display
This subtest displays the information of the system configuration.
Confirm the contents and press Enter.
For more details on the system configuration information, refer to 3.25
“System configuration”.
Subtest 09
E2PROM test (MAC/GUID/DMI)
It checks whether the MAC address, GUID of IEEE1394 and DMI
information are written.
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3.4 Heatrun Test
3 Tests and Diagnostics
3.4 Heatrun Test
To execute this program, select 3-Repair heatrunin the startup menu, press Enter.
After selecting the test, the same subtests as 3.23 RUNNING TEST are executed
successively.
For more details on the procedure and test content, refer to RUNNING TEST.
When the heatrun test ends, following message appears in the display.
************************************************
HEATRUN TEST END
************************************************
Press any key to continue...
Press any key and return to the startup menu.
NOTE: The test result (Errorlog.txt) is stored in the floppy disk. The result is displayed in
the same way as 3.22 LOG UTILITIES. For more detail in the display, refer to
LOG UTILITIES.
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3.5 Subtest Names
3.5 Subtest Names
Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU.
Table 3-1 Subtest names (1/2)
No.
Test Name
SYSTEM
Subtest No.
Subtest Name
ROM checksum
1
01
02
03
04
05
01
02
03
04
05
Fan ON/OFF
Geyserville
Quick charge
DMI read
Conventional memory
Protected mode
Protected mode (cache off)
Cache memory (on/off)
Stress
2
MEMORY
3
4
KEYBOARD
DISPLAY
Pressed key code display
01
01
02
03
04
05
06
07
VRAM read/write for VGA
Gradation for VGA
Gradation for LCD
Gradation & Mode test for VGA
All dot on/off for LCD
“H” pattern display
LCD brightness
5
FLOPPY DISK
01
02
03
04
05
Sequential read
Sequential read/write
Random address/data
Write specified address
Read specified address
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3.5 Subtest Names
3 Tests and Diagnostics
Table 3-1 Subtest names (2/2)
No.
Test Name
Subtest No.
Subtest Name
6
PRINTER
01
02
03
01
02
03
Ripple pattern
Function
Wraparound
FIR/SIR point to point (send)
FIR/SIR point to point (receive)
Wrap around (on board)
7
8
ASYNC
HARD DISK
01
02
03
04
05
06
07
08
09
Sequential read
Address uniqueness
Random address/data
Cross talk & peak shift
Partial read
Write specified address
Read specified address
Sequential write
W-R-C specified address
9
REAL TIMER
01
02
03
Real time
Backup memory
Real time carry
10
11
NDP
01
NDP
EXPANSION
01
03
PCMCIA wraparound
RGB monitor ID
12
CD-ROM
/DVD-ROM
01
02
03
04
Sequential read
Read specified address
Random address/data
RW 1point W/R/C
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3.6 System Test
3.6 System Test
To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and
follow the directions on the screen. Move the highlight bar to the subtest you want to execute
and press Enter.
Subtest 01
ROM checksum
This subtest executes a checksum test of the BIOS ROM (range: F0000h to
FFFFFh, 64KB) on the System board.
Subtest 02
Fan ON/OFF
This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
The following message will appear.
Fan number select (1;FAN#1(CPU), 2;FAN#2(GPU), 0; FAN#1)?
To check the CPU fan, press 1 and Enter.
To check the GPU fan, press 2 and Enter.
To check both CPU fan and GPU fan, press 0 and Enter.
The following message will appear.
*** Test Fan Revolution 0000RPM start
Make sure the fan does not rotate, then press Enter.
The following message will appear.
*** Test Fan Revolution Low speed Start
Make sure the fan rotates at low speed, then press Enter.
The following message will appear.
*** Test Fan Revolution High speed Start
Make sure the fan rotates at high speed, then press Enter.
After a while, the fan rotating will stop.
Geyserville
Subtest 03
If the CPU supports Gerserville (SpeedStep), this Subtest checks that the CPU
operating clock speed can be changed.
Subtest 04
Quick charge
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3.6 System Test
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This subtest checks the status for the quick charge.
DMI read
Subtest 05
This subtest displays the information in the Flash-ROM in the following
format.
*** DMI Data Display Ver X.XX ***
Model Name
: XXXXXXXXXXX
Version Number : XXXXXXXXXXXX
Serial Number : XXXXXXXX
Model Number
UUID Number
: XXXXXX-XXXXX
: XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX
Press [Enter] to EXIT
To exit this subtest and return to the SYSTEM test menu, press Enter.
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3.7 Memory Test
3.7 Memory Test
To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter
and follow the directions on the screen. Move the highlight bar to the subtest you want to
execute and press Enter.
Subtest 01
Conventional memory
This subtest writes a constant data to conventional memory (0 to 640 KB),
then reads the new data and compares the result with the original data.
Subtest 02
Protected mode
NOTE: The CONFIG.SYS file must be configured without expanded memory manager
programs such as EMM386.EXE, EMM386.SYS or QEMM386.SYS. Also, the
HIMEM.SYS must be deleted from the CONFIG.SYS file.
This subtest writes constant data and address data (from 1MB to maximum
MB), and reads the new data and compares the result with the original data.
Subtest 03
Subtest 04
Protected mode (cache off)
This subtest executes the same way as the subtest02 with the cache off.
Cache memory (on/off)
To test the cache memory, a pass-through write-read comparison of ‘5Ah’
data is run repeatedly to the test area ('7000':'Program size' to '7000':'7FFF' (32
KB)) to check the hit-miss ratio (on/off status) for CPU cache memory. One
test takes 3 seconds.
Number of misses < Number of hits → OK
Number of misses ≥ Number of hits → Fail
Subtest 05
Stress
Data (from 1MB to the maximum MB) is written from the 16KB write buffer
to the 16KB read buffer and compared the data in the buffers. The read buffer
starts from 0001 and the comparison is continued with the following read
buffer addresses: 0001, 0003, 0005, 0007, 0009, 000b, 000d and 000f.
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3.8 Keyboard Test
3 Tests and Diagnostics
3.8 Keyboard Test
To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter
and follow the directions on the screen. Move the highlight bar to the subtest you want to
execute and press Enter.
Subtest 01
Pressed key code display
When a key is pressed, the scan code, character code, and key top name are
displayed on the screen in the format shown below. The Ins Lock, Caps
Lock, Num Lock, Scroll Lock, Alt, Ctrl, Left Shift, and Right Shift
keys are displayed in reverse screen mode when pressed. The scan codes,
character codes, and key top names are shown in Appendix D.
KEYBOARD TEST IN PROGRESS 302000
Scan code
Character code =
Keytop
Ins Lock Caps Lock Num Lock
=
=
Scroll Lock
Alt
Ctrl
Left Shift Right Shift
PRESS [Enter] KEY
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3 Tests and Diagnostics
3.9 Display Test
3.9 Display Test
To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter
and follow the directions on the screen. Move the highlight bar to the subtest you want to
execute and press Enter.
Subtest 01
VRAM read/write for VGA
This subtest writes the constant data (AAh and 55h) to the video RAM. The
data is read and compared to the original data.
Subtest 02
Gradation for VGA
This subtest displays four colors: red, green, blue and white from left to right
across the screen from black to maximum brightness. The display below
appears on the screen, when this subtest is executed.
To exit this subtest and return to the DISPLAY TEST menu, press Enter.
Subtest 03
Gradation for LCD
This subtest displays bands of gradations for mixed colors, then for red, green,
and blue. Next, it displays eight solid colors full screen: red, semi-red, green,
semi-green, blue, semi-blue, white, and semi-white. Each color displays for
three seconds.
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3.9 Display Test
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Subtest 04
Gradation & Mode test for VGA
This subtest displays gradations for following modes. To change the mode,
press Enter.
[Mode 12]
[Mode 13]
[Mode 3]
[Mode 111 640*480 64K]
[Mode 112 640*480 16M]
[Mode 114 800*600 64K]
[Mode 115 800*600 16M]
[Mode 117 1024*768 64K]
[Mode 118 1024*768 16M]
The display below appears on the screen when this subtest is executed.
(Display example: Mode 12)
To exit this subtest and return to the DISPLAY TEST menu, press Enter after
displaying the Mode 118.
Subtest 05
All dot on/off for LCD
This subtest displays an all-white screen then an all-black screen. The display
changes automatically every three seconds, then returns to the DISPLAY
TEST menu.
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3 Tests and Diagnostics
3.9 Display Test
Subtest 06
“H” pattern display
This subtest displays a full screen of “H” patterns.
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
To exit this subtest and return to the DISPLAY TEST menu, press Enter.
NOTE: The last row may not be completely filled. This condition does not indicate on
error.
Subtest 07
LCD brightness
The LCD brightness changes in the following order:
Super-Bright —> Bright —> Semi-Bright —> Bright —> Super-Bright
After displaying with Super-Bright of LCD brightness, return to the
DISPLAY TEST menu.
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3.10 Floppy Disk Test
3 Tests and Diagnostics
3.10 Floppy Disk Test
CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove
the Diagnostics Disk and insert the work disk into the FDD. The contents of
the floppy disk will be erased.
To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press
Enter and follow the directions displayed on the screen. After selecting the Floppy Disk
Test from the DIAGNOSTIC TEST MENU, messages to execute the test drive number,
media type and test start truck will be displayed successively. Answer each question with an
appropriate response to execute the test.
1. The following message will appear. Select the media mode and start track to be tested,
then press Enter.
Test start track
(Enter:0/dd:00-79) ?
2. The Floppy Disk test contains five subtests that test the FDD.
The floppy disk test menu will appear after you select FDD test parameters.
FLOPPY DISK
XXXXXXX
XXX DIAGNOSTIC TEST VX.XX
[Ctrl]+[Break] : test end
[Ctrl]+[C]
: key stop
SUB-TEST : XX
PASS COUNT : XXXXX
WRITE DATA : XX
ERROR COUNT : XXXXX
READ DATA
: XX
: XXX
ADDRESS
: XXXXXX STATUS
SUB-TEST MENU :
01 - Sequential read
02 - Sequential read/write
03 - Random address/data
04 - Write specified address
05 - Read specified address
99 - Exit to DIAGNOSTIC TEST MENU
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3 Tests and Diagnostics
3.10 Floppy Disk Test
Select the number of the subtest you want to execute and press Enter. The following
message will appear during the floppy disk test.
xxx DIAGNOSTIC TEST VX.XX
[Ctrl]+[Break] : test end
FLOPPY DISK IN PROGRESS XXXXXXX
[Ctrl]+[C]
: key stop
SUB-TEST : XX
PASS COUNT : XXXXX
ERROR COUNT : XXXXX
READ DATA : XX
: XXXXXX STATUS : XXX
WRITE DATA : XX
ADDRESS
When the subtest 04 or 05 is selected, the following messages will appear on the screen.
Select the test data (subtest 04 only), track number and head number you want to test.
Test data
Track No.
Head No.
?? (subtest 04 only)
??
?
Subtest 01
Sequential read
This subtest performs a Cyclic Redundancy Check (CRC) that continuously
reads all the tracks (track: 0 to 39/0 to 79) on a floppy disk.
Subtest 02
Sequential read/write
This subtest continuously writes data pattern B5ADADh to all the tracks
(track: 0 to 39/0 to 79) on a floppy disk. The data is then read and compared
to the original data.
Subtest 03
Random address/data
This subtest writes random data to random addresses on all tracks (track: 0 to
39/0 to 79) on a floppy disk. The data is then read and compared to the
original data.
Subtest 04
Subtest 05
Write specified address
This subtest writes the data specified by an operator to a specified track, head,
and address.
Read specified address
This subtest reads data from a track, head, and address specified by an
operator.
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3.11 Printer Test
3 Tests and Diagnostics
3.11 Printer Test
CAUTION: Printer Test is not supported for this model.
To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and
follow the directions on the screen. The following messages will appear after selecting the
Printer Test from the DIAGNOSTIC TEST MENU. Answer each of the questions with an
appropriate response to execute the test.
NOTE: An IBM compatible printer must be connected to the system to execute this test.
Also, printer port wraparound connector must be connected.
The following message will appear, after selecting the subtest 01 to 03 of the printer test:
channel#1 = XXXXh
channel#2 = XXXXh
channel#3 = XXXXh
Select the channel number (1-3) ?
The printer I/O port address is specified by the XXXXh number. The computer supports
three printer channels. Select the printer channel number, and press Enter to execute the
selected subtest.
Subtest 01
Ripple Pattern
This subtest prints characters for codes 20h through 7Eh line-by-line while
shifting one character to the left at the beginning of each new line.
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3 Tests and Diagnostics
3.11 Printer Test
Subtest 02
Function
This subtest is for IBM compatible printers, and tests the following functions:
Normal print
Double-width print
Compressed print
Emphasized print
Double-strike print
All characters print
This subtest prints the various print types shown below:
Subtest 03
Wraparound
NOTE: To execute this subtest, a printer wraparound connector must be connected to the
computer’s printer port.
This subtest checks the output and bi-directional modes of the data control
and status lines through the parallel port wraparound connector
(34M741986G01). (Both output and bi-directional modes are tested.)
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3.12 Async Test
3 Tests and Diagnostics
3.12 Async Test
To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and
follow the directions displayed on the screen. Move the highlight bar to the subtest you want
to execute and press Enter.
Subtest 01 and 02 require the following data format:
Method:
Speed:
Data:
Asynchronous
38400BPS
8 bits and one parity bit (EVEN)
Data pattern: 20h to 7Eh
Subtest 01
FIR/SIR point to point (send)
NOTE: To execute subtests 01 and 02, each computer must have access to the other
computer’s infrared port.
This subtest sends 20h through 7Eh data to the receive side, then receives the
sent data and compares it to the original data through the FIR/SIR port.
Subtest 02
Subtest 03
FIR/SIR point to point (receive)
This subtest is used with subtest 01 described above. This subtest receives the
data from the send side, then sends the received data through the FIR/SIR
port.
Wraparound (on board)
NOTE: To execute this subtest, an RS-232C wraparound connector must be connected to
the RS-232C port.
This subtest checks the data send/receive function through the wraparound
connector.
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3 Tests and Diagnostics
3.13 Hard Disk Test
3.13 Hard Disk Test
To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter,
and follow the directions on the screen.
CAUTION: When executing subtest02, 03, 04, 06, 08 and 09, the message [The hard disk
will be destroyed.] will be displayed. The contents of the hard disk will be
erased when these tests are executed. Before running the test, the customer
should transfer the contents of the hard disk to floppy disk or another hard
disk. If the customer has not or cannot perform the back-up, create back-up
disks as described below.
Check to see if the Microsoft Create System Disks Tools (MSCSD.EXE) still
exists in the System Tools Folder. (This tool can be used only once.) If it
exists, use it to back up the pre-installed software, then use the Backup
utility in the System Tools folder to back up the entire disk, including the
user’s files.
Refer to the operating system instructions.
When a 2nd HDD is installed, the following messages will appear after selecting the hard
disk test from the DIAGNOSTIC TEST MENU.
Test drive number select
(1:HDD#1, 2:HDD#2, 0:HDD#1&2) ?
1. Input the number of HDD test and press Enter.
2. This message is used to select the error dump operation when a data compare error is
detected. Select 1 or 2.
Data compare error dump (1:no, 2:yes)
3. This message is used to select whether or not the HDD status is displayed on the
screen. The HDC status is described in section 3.19. Select 1 or 2.
Detail status display (1:no, 2:yes)
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3.13 Hard Disk Test
3 Tests and Diagnostics
4. The Hard Disk Test message will appear after you respond to the Detail Status
prompt. Select the number of the subtest you want to execute and press Enter. The
following message will appear during each subtest.
XXX DIAGNOSTIC TEST VX.XX
[Ctrl]+[Break] : test end
HARD DISK TEST XXXXXXX
[Ctrl]+[C]
: key stop
SUB TEST
: XX
PASS COUNT : XXXXX
WRITE DATA : XX
ERROR COUNT : XXXXX
READ DATA
STATUS
: XX
: XXX
ADDRESS
: XXXXXX
The first three digits of the ADDRESS indicate which cylinder is being tested, the
fourth digit indicates the head and the last two digits indicate the sector.
The first digit of the STATUS number indicates the drive being tested and the last
two digits indicate the error status code as explained in table 3-2 of the section 3.18.
Subtest 01
Sequential read
This subtest is a sequential reading of all the tracks on the HDD starting at
track 0. When all the tracks on the HDD have been read, the test starts at the
maximum track and reads the tracks on the HDD sequentially back to track 0.
Subtest 02
Address uniqueness
This subtest writes unique address data to each sector of the HDD track-by-
track. The data written to each sector is then read and compared with the
original data. There are three ways the HDD can be read:
1. Forward sequential
2. Reverse sequential
3. Random
Subtest 03
Random address/data
This subtest writes random data in a random length to random addresses. This
data is then read and compared to the original data.
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3 Tests and Diagnostics
3.13 Hard Disk Test
Subtest 04
Cross talk & peak shift
This subtest writes eight types of worst pattern data (listed below) to a
cylinder, then reads the data while moving from cylinder to cylinder. (Test the
data interference in the neighbor track)
Worst pattern data
Cylinder
‘B5ADAD’
‘4A5252’
‘EB6DB6’
‘150449’
’63B63B’
‘9C49C4’
‘2DB6DB’
‘D25044’
0 cylinder
1 cylinder
2 cylinder
3 cylinder
4 cylinder
5 cylinder
6 cylinder
7 cylinder
Subtest 05
Partial read
This subtest reads 1GB data that is in minimum, middle and maximum
address of the HDD area.
Subtest 06
Subtest 07
Write specified address
This subtest writes specified data to a specified cylinder and head on the
HDD.
Read specified address
This subtest reads data, which has been written to a specified cylinder and
head on the HDD.
Subtest 08
Subtest 09
Sequential write
This subtest writes specified 2-byte data to all of the cylinders on the HDD.
W-R-C specified address
This subtest writes data to a specified cylinder and head on the HDD, then
reads the data and compares it to the original data.
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3.14 Real Timer Test
3 Tests and Diagnostics
3
3.14 Real Timer Test
To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter
and follow the directions on the screen. Move the highlight bar to the subtest you want to
execute and press Enter.
Subtest 01
Real time
A new date and time can be input during this subtest. To execute the real time
subtest, follow these steps:
1. Select subtest 01 and the following messages will appear:
Current date : XX-XX-XXXX
Current time : XX:XX:XX
Enter new date:
PRESS [ENTER] KEY TO EXIT TEST
2. If the current date is not correct, input the correct date at the “Enter new
date” prompt and press Enter.
3. The date is updated and the following messages will appear:
Current date : XX-XX-XXXX
Current time : XX:XX:XX
Enter new time:
PRESS [ENTER] KEY TO EXIT TEST
4. If the current time is not correct, input the correct time in 24-hour format.
To enter “:”, press Shift + ;. The time is updated.
To exit the test, press Enter.
Subtest 02
Backup memory
This subtest checks the following backup memories:
Writes 1-bit of “on” data (01h through 80h) to address 0Eh through 7Fh
Writes 1-bit of “off” data (FEh through 7Fh) to address 0Eh through 7Fh
Writes the data pattern AAh and 55h to the address 0Eh to 7Fh
Then the subtest reads and compares this data with the original data.
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3 Tests and Diagnostics
3.14 Real Timer Test
Subtest 03
Real time carry
CAUTION: When this subtest is executed, the current date and time are erased.
This subtest checks the real time clock increments. Make sure the date and
time are displayed in the following format:
Current date : 12-31-1999
Current time : 23:59:58
The real time increments are automatically executed and the following is
displayed:
Current date : 01-01-2000
Current time : 00:00:00
PRESS [Enter] KEY TO EXIT TEST
To exit the test, press Enter.
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3.15 NDP Test
3 Tests and Diagnostics
3.15 NDP Test
To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and
follow the directions on the screen.
Subtest 01
NDP
This test checks the following functions of NDP:
‰ Control word
‰ Status word
‰ Bus
‰ Addition
‰ Multiplication
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3 Tests and Diagnostics
3.16 Expansion Test
3.16 Expansion Test
To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press
Enter and follow the directions on the screen.
Subtest 01
PCMCIA wraparound
CAUTION: PCMCIA wraparound test is not supported for this model.
NOTE: To execute this subtest, the PC card wraparound connector is required.
This subtest checks the following signal line of the PC card slot:
‰ Address line
‰ REG#, CE#1, CE#2 line
‰ Data line
‰ Speaker line
‰ Wait line
‰ BSY#, BVD1 line
This subtest is executed in the following order:
Sub#
Address
Good
Bad
Contents
Address line
REG#, CE#1, CE#2
nn=A0, 90, 80, 00
01
00001
00001
nn
nn
xx
xx
02
00002
ww
rr
Data line
ww=write data, rr=read
data
03
04
05
00003
00004
00005
––
40,80
nn
––
xx
xx
Speaker line
Wait line (40<xx<80)
Other lines (BSY#, BVD1)
NN=21, 00
NOTE: When selecting the subtest number01, the following message will appear:
Test slot number select (1:slot0, 2:slot1, 0:slot0&1)?
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3.16 Expansion Test
3 Tests and Diagnostics
Subtest 02
RGB monitor ID
NOTE: To execute this subtest, an external monitor with monitor ID function is
required.
Connect the external monitor to the PC for the test of ID acquisition.
The judgment of acquisition is based on the panel data. In simultaneous
display mode or internal display mode, in which the panel data is acquired,
this subtest will fail. Therefore, make sure only the external display is selected
when executing this subtest.
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3 Tests and Diagnostics
3.17 CD-ROM/DVD-ROM Test
3.17 CD-ROM/DVD-ROM Test
To execute the CD-ROM/DVD-ROM test, select 12 from the DIAGNOSTICS TEST
MENU, press Enter and follow the directions on the screen.
NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01
or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the
subtest 04, use a CD-RW media on the market.
Subtest 01
Sequential read
This subtest is a sequential reading of one-block units (2K bytes) of all the
logical addresses.
Subtest 02
Subtest 03
Read specified address
This subtest reads one-block data from a specified address.
Random address/data
This subtest reads one-block data and multi-block data from random addresses
200 times.
Subtest 04
RW 1point W/R/C
This subtest writes, reads and compares data at one point on a CD-RW media.
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3.18 Error Code and Error Status Names
3 Tests and Diagnostics
3.18 Error Code and Error Status Names
Table 3-2 lists the error codes and error status names for the Diagnostic Test.
Table 3-2 Error codes and error status names (1/3)
Device name
Common
Error code
Error status name
Data Compare Error
FF
ROM - CHECKSUM ERROR
System
01
03
04
05
06
07
08
09
10
ROM - SERIAL ID WRITE ERROR
ROM - NOT SUPPORTED PS-SYSTEM
ROM - SENSING ERROR(AC-ADAPT)
ROM - SENSING ERROR(1st Batt)
ROM - SENSING ERROR(2nd Batt)
ROM - THORMISTOR ERROR(1)
ROM - THORMISTOR ERROR(2)
ROM - THORMISTOR ERROR(3)
Memory
01
02
DD
RAM - PARITY ERROR
RAM - PROTECTED MODE NO CHANGE
RAM - CACHE MEMORY ERROR
Keyboard
FE
FD
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
EF
ED
USB - GET DESCR.ERROR (FIRST)
USB - SET ADDRESS ERROR
HUB - GET DESCR.ERROR(Top 8B)
HUB - GET DESCR.ERROR (Whole)
HUB - SET CONFIGURATION ERROR
HUB - GET DESCR.ERROR(DESCR.)
HUB - SET FEATURE ERROR(P ON)
HUB - GET STATUS ERROR
HUB - SET FEATURE ERROR(RESET)
HUB - CLEAR FEATURE ERROR
HUB - CLEAR FEATURE1 ERROR
HUB - SET FEATURE ERROR(Enab.)
HUB - CLEAR FEATURE2 ERROR
USB - OVER CURRENT ERROR
USB - GET DESCR.ERROR(SECOND)
Display
EE
VRAM SIZE NOT SUPPORT
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3 Tests and Diagnostics
3.18 Error Code and Error Status Names
Table 3-2 Error codes and error status names (2/3)
Device name
FDD
Error code
Error status name
01
02
03
04
08
09
10
20
40
80
60
06
EE
FDD - BAD COMMAND ERROR
FDD - ADDRESS MARK NOT FOUND
FDD - WRITE PROTECTED
FDD - RECORD NOT FOUND
FDD - DMA OVERRUN ERROR
FDD - DMA BOUNDARY ERROR
FDD - CRC ERROR
FDD - FDC ERROR
FDD - SEEK ERROR
FDD - TIME OUT ERROR
FDD - NOT DRIVE ERROR
FDD - MEDIA REMOVED
FDD - WRITE BUFFER ERROR
Printer
01
08
10
20
40
80
PRT - TIME OUT
PRT – FAULT
PRT - SELECT LINE
PRT - OUT OF PAPER
PRT - POWER OFF
PRT - BUSY LINE
ASYNC
01
02
04
08
10
20
40
80
88
05
06
RS232C - [DTR ON] TIME OUT
RS232C - [CTS ON] TIME OUT
RS232C - [RX READY] TIME OUT
RS232C - [TX FULL] TIME OUT
RS232C - PARITY ERROR
RS232C - FRAMING ERROR
RS232C - OVERRUN ERROR
RS232C - LINE STATUS ERROR
RS232C - MODEM STATUS ERROR
SIR - TIME OUT ERROR
FIR - TIME OUT ERROR
HDD
05
07
09
0B
BB
08
01
02
04
10
20
40
80
11
AA
HDD - HDC NOT RESET ERROR
HDD - DRIVE NOT INITIALIZE
HDD - DMA BOUNDARY ERROR
HDD - BAD TRACK ERROR
HDD - UNDEFINED ERROR
HDD - OVERRUN ERROR (DRQ ON)
HDD - BAD COMMAND ERROR
HDD - ADDRESS MARK NOT FOUND
HDD - RECORD NOT FOUND ERROR
HDD - ECC ERROR
HDD - HDC ERROR
HDD - SEEK ERROR
HDD - TIME OUT ERROR
HDD - ECC RECOVER ENABLE
HDD - DRIVE NOT READY
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3.18 Error Code and Error Status Names
3 Tests and Diagnostics
Table 3-2 Error codes and error status names (3/3)
Device name
(HDD)
Error code
Error status name
HDD - WRITE FAULT
HDD - STATUS ERROR
HDD - BAD SECTOR
HDD - ACCESS TIME ERROR
HDD - NO HDD
HDD - DMA CRC ERROR
CC
E0
0A
EE
DA
12
NDP
01
02
03
04
05
06
NDP - NO CO-PROCESSOR
NDP - CONTROL WORD ERROR
NDP - STATUS WORD ERROR
NDP - BUS ERROR
NDP - ADDITION ERROR
NDP - MULTIPLAY ERROR
EXPANSION
C1
C3
C4
C5
C6
C7
C8
CB
CC
CE
CF
ADDRESS LINE ERROR
CE#1 LINE ERROR
CE#2 LINE ERROR
DATA LINE ERROR
WAIT LINE ERROR
BSY# LINE ERROR
BVD1 LINE ERROR
ZV-Port ERROR
NO PCMCIA
CARD TYPE ERROR
ZV-CONT# ERROR
CD-ROM
/DVD-ROM
01
02
03
04
05
06
09
11
20
40
80
90
B0
BAD COMMAND
ILLEGAL LENGTH
UNIT ATTENTION
MEDIA CHANGE REQUEST
MEDIA DETECTED
ADDITIMAL SENSE
BOUNDARY ERROR
CORRECTED DATA ERROR
DRIVE NOT READY
SEEK ERROR
TIME OUT
RESET ERROR
ADDRESS ERROR
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3 Tests and Diagnostics
3.19 Hard Disk Test Detail Status
3.19 Hard Disk Test Detail Status
When an error occurs in the hard disk test, the following message is displayed:
HDC status = XXXXXXXX
Detailed information about the hard disk test error is displayed on the screen by an eight-
digit number. The first four digits represent the hard disk controller (HDC) error status
number and the last four digits are not used.
The hard disk controller error status is composed of two bytes; the first byte displays the
contents of the HDC status register in hexadecimal form and the second byte displays the
HDC error register.
The contents of the HDC status register and error register are listed in Tables 3-3 and 3-4.
Table 3-3 HDC status register contents
Bit
Name
Description
7
BSY
(Busy)
“0” … HDC is ready.
“1” … HDC is busy.
6
5
4
3
2
1
0
DRY
(Drive ready)
“0” … Hard disk drive is not ready to accept any command.
“1” … Hard disk drive is ready.
DWF
(Drive write fault)
“0” … DWF error is not detected.
“1” … Write fault condition occurred.
DSC
“0” … The hard disk drive heads are not settled over a track.
“1” … The hard disk drive heads are settled over a track.
(Drive seek complete)
DRQ
(Data request)
“0” … Drive is not ready for data transfer.
“1” … Drive is ready for data transfer.
COR
(Corrected data)
“0” … Not used
“1” … Correctable data error is corrected.
IDX
(Index)
“0” … Not used
“1” … Index is sensed.
ERR
“0” … Normal
(Error)
“1” … The previous command was terminated with an error.
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3.19 Hard Disk Test Detail Status
3 Tests and Diagnostics
Table 3-4 Error register contents
Bit
Name
Description
7
BBK
“0” … Not used
(Bad block mark)
“1” … A bad block mark is detected.
6
UNC
“0” … There is no uncorrectable data error.
(Uncorrectable)
“1” … Uncorrectable data error has been detected.
5
4
——
Not used
IDN
“0” … Not used
(Identification)
“1” … There is no ID field in the requested sector.
3
2
——
Not used
ABT
“0” … Not used
(Abort)
“1” … Illegal command error or command abort.
1
TK0
(Track 0)
“0” … The hard disk found track 0 during a recalibrate
command.
“1” … The hard disk could not find track 0 during a
recalibrate command.
0
——
Not used
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3 Tests and Diagnostics
3.20 Only One Test
3.20 Only One Test
3.20.1 Program Description
This program tests the unique functions of this model.
3.20.2 Operations
Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears
in the display.
#############################################################
########
Only One Test Menu (XXXXXXXXX)
#######
#############################################################
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
2
3
4
5
6
7
Pressed Key Display
Touch Pad
Kill Switch
USB
LED
Acceleration sensor
Button
9
Common Test
*************************************************************
.... Press test number
[1-7, 9]
Input the subtest number you want to test and press Enter.
To return to the DIAGNOSTIC TEST menu, select 9 and press Enter.
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3.20 Only One Test
3 Tests and Diagnostics
ubtest 01
Pressed key display
When you execute this subtest, the keyboard layout is drawn on the display as
shown below. When any key is pressed, the corresponding key on the screen
changes to the key character that was pressed. Holding a key down enables
the auto-repeat function which causes the key’s display character to blink.
Press Del + Enter to end the test.
IF TEST OK, Press [Dell][Enter]key
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3 Tests and Diagnostics
3.20 Only One Test
Subtest 02
Touch Pad/IPS
This subtest checks the functions of the pointing stick as shown below.
A) Touch Pad/IPS stick pressure sensing direction and parameter.
B) Touch Pad/IPS switch function check.
This test reports the pointing stick motion response from the IPS and IPS
switch. When the stick is pressed towards the upper left, the <DIRECTION>
display changes according to the following illustration. If an IPS switch is
pressed, the <LAT> displays appear on the right side one by one. The
parameters appear on the center of the display. To exit this subtest, press the
four IPS switches at the same time.
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3.20 Only One Test
3 Tests and Diagnostics
Subtest 03
Kill Switch
This subtest checks if the Wireless communication switch works properly.
If the test is started with the switch ON, the following message appears in the
display.
Kill switch is set to a start position (OFF)
Slide the switch to OFF position. Then, the following message appears in the
display.
KILL SWITCH ON !!
Slide the switch to ON position. Then, the following message appears in the
display.
KILL SWITCH OFF !!
After Sliding the switch to OFF position, the screen returns to the Only One
Test menu automatically.
Subtest 04
USB
NOTE: When executing this subtest, USB test module and USB cable must be
connected.
This subtest checks if USB ports work properly.
The following menu appears in the display.
###############################################################
########
USB Port Select (XXXXXXXXX)
######
###############################################################
*
*
*
*
*
*
*
*
* 0
* 1
* 2
*
Port 0 (Back)
Port 1 (Left side back)
Port 2 (Left side front)
* 9
*
EXIT to Only One Menu
***************************************************************
.... Press test number[0-2, 9] ?
Connect the USB test module and USB cable to the computer.
Input the test port number and press Enter.
OKmessage appears in the display if the test ends without an error.
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3 Tests and Diagnostics
3.20 Only One Test
NGmessage appears in the display if an error is found during the test. Confirm
the connection of cable, and then execute the test again.
Press 9 and Enter to return to Only One Test menu.
LED
Subtest 05
This subtest checks if each LED lights properly.
The following message appears in the display in order. Follow the instructions
in the display to execute the test.
[HDD Access LED test]
Confirm the LED of HDD status blinks properly.
Press any key and following message appears in the display.
[Caps/Num/Overlay BT/W-LAN LED test]
(1) Press [Caps Lock ] key ! ...Caps
(2) Press [Fn + F10 ] key ! ...Arrow
(3) Press [Fn + F11 ] key ! ...Num
(4) Slide [BT/W-LAN switch L&R]!
(on/off)
(on/off)
(on/off)
(on/off)
Confirm corresponding LED lights properly.
Press Enter and following message appears in the display.
Check [DC-IN]&[Power]&[Main Battery] LED= Green/Orange
Check if the each LED lights in the same color shown in the display (Message
switches Green <-> Orange).
Press Enter to return to the Only One Test menu.
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3.20 Only One Test
3 Tests and Diagnostics
Subtest 06
Acceleration sensor
This subtest detects and corrects the each axis (X, Y, Z).
NOTE: Make sure that this subtest is executed on the following condition:
1. Flat desk with vertical plane to get the stability of machine.
2. Prevent the machine from shake or shock.
<Example>
Set the machine
against the vertical plane
Vertical plane
with the Front upward
Flat desk
The figure below shows the name and position of each side.
Top
(heaven surface)
Back
Right side
Front
Left side
Figure 3-1 Name and positions of each side
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3 Tests and Diagnostics
3.20 Only One Test
When this subtest is selected, the following message appears in the display.
The heaven surface establishes in the upper direction
Press [Enter] key
NOTE: Be sure to execute the test with the display panel opened.
Set the machine on the flat desk. Then press Enter to detect the data on this
setting of machine. The following message appears in the display.
The back establishes in the upper direction
Press [Enter] key
Set the machine against the vertical plane on the flat desk with the back of
machine upward. Then press Enter to detect the data on this setting of
machine. The following message appears in the display.
The right establishes in the upper direction
Press [Enter] key
Set the machine against the vertical plane on the flat desk with the right side
of machine upward. Then press Enter to detect the data on this setting of
machine. The following message appears in the display.
The front establishes in the upper direction
Press [Enter] key
Set the machine against the vertical plane on the flat desk with the front of
machine upward. Then press Enter to detect the data on this setting of
machine. The following message appears in the display.
The left establishes in the upper direction
Press [Enter] key
Set the machine against the vertical plane on the flat desk with the left side of
machine upward. Then press Enter to detect the data on this setting of
machine.
When there is no defective during the all checks above, the following message
appears in the display. Then press Enter and return to the Only One Test
menu.
** Setting OK! **
Press [Enter] key
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3.20 Only One Test
3 Tests and Diagnostics
When a defective is found during the each check above, the following
message appears in the display. The test is halted at the point when the
defective is found.
** Setting ERROR! **
Press [Enter] key
Press Enter and return to the Only One Test menu. Then execute the test
again.
Subtest 07
Button
This subtest checks if the buttons in the following figure work properly.
ESC/Rotation Button
Windows Security Button
Cross Function Button
The following message appears in the display.
Press [Windows Security Button] key
Press Windows security button. Then the following message appears in the
display.
Press [Escape/Rotation Button] key
Press Escape/Rotation button. Then the following message appears in the
display.
Press [Cross Function Button] key
Press Cross Function button. If the test ends successfully, the screen returns to
the ONLY ONE TEST menu automatically.
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3 Tests and Diagnostics
3.21 Head Cleaning
3.21 Head Cleaning
3.21.1 Function Description
This function cleans the heads in the FDD by executing a series of head load/seek and read
operations. A cleaning kit is necessary to perform this program.
3.21.2 Operations
1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the
following messages:
DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX
Mount cleaning disk(s) on drive(s).
Press any key when ready.
2. Remove the Diagnostics Disk from the FDD, then insert the cleaning disk and press
Enter.
3. When the “cleaning start” message appears, the FDD head cleaning has begun.
4. The display automatically returns to the DIAGNOSTIC MENU when the program is
completed.
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3.22 Log Utilities
3 Tests and Diagnostics
3.22 Log Utilities
3.22.1 Function Description
This function logs error information generated while a test is in progress and stores the
results in RAM. This function can store data on a floppy disk, or output the data to a printer
or the display.
The error information is displayed in the following order:
1. Error count (CNT)
2. Test name, Subtest number (TS-No)
3. Pass count (PASS)
4. Error status (STS)
5. FDD/HDD or memory address (ADDR)
6. Write data (WD)
7. Read data (RD)
8. HDC status (HSTS)
9. Error status name (ERROR STATUS NAME)
If the power switch is turned off, the error information will be lost.
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3 Tests and Diagnostics
3.22 Log Utilities
3.22.2 Operations
1. Select 5 and press Enter in the DIAGNOSTIC MENU, the error information is
displayed in the following format:
XXXXX ERRORS
CNT TS-NOPASS STS ADDR
WD RD HSTS [ERROR STATUS NAME]
001 FDD 02 0000 103 0000100 00 0000 FDD-WRITE PROTECTED
001 FDD 01 0000 180 0000100 00 0000 FDD-TIME OUT ERROR
Address
HDC status
Read data
Write data
Error status
Pass count
Test name
Error status name
Error count
[[1:Next,2:Prev,3:Exit,4:Clear,5:Print,6:FD Log Read,7:FD Log Write]]
2. The error information displayed on the screen can be manipulated by the following
number keys:
The 1 key scrolls the display to the next page.
The 2 key scrolls the display to the previous page.
The 3 key returns to the Diagnostic Menu.
The 4 key erases all error log information in RAM.
The 5 key outputs the error log information to a printer.
The 6 key reads the log information from a floppy disk.
The 7 key writes the log information to a floppy disk.
3. In the case of “error retry OK,” a capital “R” will be placed at the beginning of the
error status. However, it is not added to the error count.
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3.23 Running Test
3 Tests and Diagnostics
3.23 Running Test
3.23.1 Function Description
This function automatically executes the following tests in sequence:
1. System test (subtest 01)
2. Memory test (subtests 01, 02, 06)
3. Display test (subtest 01)
4. Real timer test (subtest 02)
5. HDD test (subtests 01)
The system automatically detects the number of floppy disk drives connected to the computer
for the FDD test.
3.23.2 Operations
1. Select 6 from the DIAGNOSTIC MENU and press Enter, the following messages
for selectable tests will appear in the display in order.
FDD write/read test (Y/N)?
Printer wrap around test (Y/N)?
Serial wrap around test (Y/N)?
CD-ROM/DVD-ROM test (Y/N)?
2. To execute the test, press Y and Enter. To cancel the test, press N and Enter. If you
select the selectable tests, follow the instruction message in the display.
3. After selecting the selectable tests, the running test starts automatically. To terminate
the program, press Ctrl + Break.
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3 Tests and Diagnostics
3.24 Floppy Disk Drive Utilities
3.24 Floppy Disk Drive Utilities
3.24.1 Function Description
This function formats the FDD, copies the floppy disk and displays the dump list for both the
FDD and HDD.
1. FORMAT
NOTE: This program is only for testing a floppy disk drive. It is different from the
Toshiba MS-DOS FORMAT command.
This program can format a floppy disk in the following formats:
(a) 2DD: Double-sided, double-density, double-track, 96/135 TPI, MFM mode,
512 bytes, 9 sectors/track.
(b) 2HD: Double-sided, high-density, double-track, 96/135 TPI, MFM mode, 512
bytes, 18 sectors/track.
2. COPY
This program copies data from a source floppy disk to a target floppy disk.
3. DUMP
This program displays the contents of the floppy disk and the designated sectors of
the hard disk on the display.
4. HDD ID READ
This program reads the hard disk ID and displays hard disk model number.
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3.24 Floppy Disk Drive Utilities
3 Tests and Diagnostics
3.24.2 Operations
1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the
following message:
[ FDD UTILITIES ]
1 - FORMAT
2 - COPY
3 - DUMP
4 – HDD-ID READ
9 - EXIT TO DIAGNOSTICS MENU
2. FORMAT program
(a) Selecting FORMAT displays the following message:
DIAGNOSTICS - FLOPPY DISK FORMAT : VX.XX
Drive number select (1:A, 2:B) ?
(b) Select a drive number to display the following message:
Type select (0:2DD, 3:2HD) ?
(c) Select a media/drive type number and press Enter. A message similar to the
one below will be displayed:
Warning : Disk data will be destroyed.
Insert work disk into drive A:
Press any key when ready.
(d) Remove the Diagnostics Disk from the FDD, insert the work disk and press
any key.
The following message will be displayed when the FDD format is executed:
[ FDD TYPE ] : TRACK = XXX
[ FDD TYPE ] : HEAD = X
[ FDD TYPE ] : SECTOR = XX
Format start
[[track, head = XXX X]]
After the floppy disk is formatted, the following message will appear:
Format complete
Another format (1:Yes/2:No) ?
(e) Typing 1 displays the message from step (c) above. Typing 2 returns the test
to the DIAGNOSTIC MENU.
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3 Tests and Diagnostics
3.24 Floppy Disk Drive Utilities
3. COPY program
(a) When COPY is selected, the following message appears:
FLOPPY DISK FORMAT & COPY : VX.XX
Type select (0:2DD,3:2HD) ?
(b) Selecting a media/drive type number will display a message similar to the one
below:
Insert source disk into drive A:
Press any key when ready.
(c) Remove the Diagnostics Disk from the FDD, insert the source disk and press
any key. The following message will appear, indicating the program has
started.
[ FDD TYPE ] : TRACK
= XXX
[ FDD TYPE ] : HEAD = X
[ FDD TYPE ] : SECTOR = XX
Copy start
[[ track,head = XXX X ]]
(d) The following message will appear.
Insert target disk into drive A:
Press any key when ready.
(e) Remove the source disk from the FDD, then insert a formatted work disk and
press any key. The following message will appear and start copying to the
target disk.
[[ track,head = XXX X ]]
(f) When the amount of data is too large to be copied in one operation, the
message from step (b) is displayed again. After the floppy disk has been
copied, the following message will appear:
Copy complete
Another copy (1:Yes/2:No) ?
(g) To copy another disk, type 1 and the message from step (a) is displayed again.
Entering 2 returns the test program to the DIAGNOSTIC MENU.
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3.24 Floppy Disk Drive Utilities
3 Tests and Diagnostics
4. DUMP program
(a) When DUMP is selected, the following message appears:
DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX
Drive type select (1:FDD, 2:HDD) ?
(b) Select a drive type. If 2:HDDis selected, the display will go to step (h). If
1:FDDis selected, the following message will appear:
Select drive number (1:A, 2:B) ?
(c) Select a drive number and the following message will be displayed.
Format type select (1:2DD, 3:2HD) ?
(d) If 3:2HDis selected, the following message will appear. Select a media mode.
2HD media mode (1:1.20MB, 2:1.44MB, 3:1.23MB)?
(e) The following message will appear:
Insert source disk into drive A:
Press any key when ready.
(f) Insert a source disk and press any key and the following message will appear:
—— Max. address ——
[Track ] = XXXX
[Head ] = XX
[Sector] = XX
Track number ????
(g) Set the track number, head number and sector number you want to dump. The
system will access the disk and dump a list. Then the message shown in (k)
will appear.
(h) The following message will appear when selecting 2:HDDin (a).
Select drive number (1:C, 2:D) ?
(i) Select a drive number and the following message will be displayed.
---Max. address ---
[LBA ] = XXXXXXXXX
LBA number ????????
(j) Set the LBA number you want to dump. The system will access the disk and
dump a list.
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3 Tests and Diagnostics
3.24 Floppy Disk Drive Utilities
(k) The following message will appear. To finish the dump, select 3.
Press number key (1:up,2:down,3:end) ?
(l) The following message will appear. Selecting 2 returns to the FDD
UTILITIES MENU.
Another dump (1:Yes,2:No) ?
5. HDD ID READ program
Selecting HDD ID displays the following HDD ID configuration:
[HDD ID Read (VX.XX)] [Drive #1] [Drive #2]
Model No.
= XXXXXXX
= YYYYYYY
Press Enter to return to the FDD UTILITIES MENU.
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3.25 System Configuration
3 Tests and Diagnostics
3
3.25 System Configuration
3.25.1 Function Description
The System Configuration program contains the following configuration information for the
computer:
1. Processor Type [Code/L2 cache]
2. Chip set [VRAM]
3. BIOS ROM version [1st ID, 2nd ID]
4. Boot ROM version
5. EC/KBC version
6. PS Microprocessor version
7. SVP parameter version [Panel/Manufacture code/Product code]
8. Microcode revision [Processor number]
9. Total Memory Size [Conventional memory]
10. Battery code
11. HWSC
12. FSB [Voltage]
13. The number of printer ports
14. The number of ASYNC ports
15. Math co-processors
16. Floppy Disk Drive [Track/Head/Sector]
17. Hard Disk Drive [Sector/Drive size/Manufacture code]
18. Optical Disk Drive [Maker/Drive type/Manufacture code/Product code]
19. T&D total version
20. Date/Time
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3 Tests and Diagnostics
3.25 System Configuration
3.25.2 Operations
Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system
configuration appears in the display.
System Configuration Display : Ver X.XX [Machine Name ???]
* - Processor Type
* - Chip set
* - BIOS ROM Version
* - BOOT ROM Version
* - EC/KBC Version
* - PS Micom Version
* - SVP Par. Version
* - Microcode Revision = VX.XX
* - Total Memory Size = XXXXXXMB (Conventional Memory = XXXKB)
* - Battery Code
* - HWSC
* - FSB
= XXXXXX-XXXXXMHz
= XXXXXX
Code = XX
L2 Cache = XXXXXKB
VRAM = XXXXXXMB
= VX.XX
= VX.XX
= VX.XX
= VX.XX
= VX.XX
1st ID = XXH, 2nd ID = XXH
(Panel=XXXXXXXXX, Manu=XXXX, Prod=XXXX)
(Processor=XXXh)
= XXXXXXXXXXXX
= XXXXXXX
= XXXXXMHz (Voltage = XEh)
LPT1 = XXXX LPT2 = XXXX LPT3 = XXXX
COM1 = XXXX COM2 = XXXX COM3 = XXXX
* - X Printer Adapter
* - X ASYNC Adapter
* - X Math CO-Processor
* - X Floppy Disk Drive(s) Track = XX Head = XX, Sector = XX
* - X Hard Disk Drive(s) #1 Sectors = XXXXXXXXXX (XXXGB) [XXXXXXXXXXXXXXXXX]
#2 Sectors = XXXXXXXXXX (XXXGB) [XXXXXXXXXXXXXXXXX]
* - ODD Drive
= XXXX XXXXXXXX XXXXXXXXX [XXXXXXXXXXXX]
* - T&D Total Version = VX.XX
Press [Enter] Key
[Date = XXXX-YY-ZZ, XX:YY:ZZ]
Press Enter to return to the DIAGNOSTIC MENU.
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3.26 Wireless LAN Test Program (Intel-made b/g)
3 Tests and Diagnostics
3.26 Wireless LAN Test Program (Intel-made b/g)
This section describes how to perform the wireless LAN transmitting-receiving test (Intel-
made Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for
wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO
DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS
MENU, select 9 - EXIT TO MS-DOS.
Insert the Diagnostics disk for wireless LAN test into the Floppy Disk Drive. Turn on the
power while pressing U.
The following menu appears in the display.
******Intel Calexico 11b/g Card Maintenance test Menu*******
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1 : SKU check of Module
2 : MAC Address Check
3 : Antenna Check & communication test of 11b mode *
*
4 : Communication test of 11g mode
*
*
*
*
*
5 : All the tests of Calexico 11g Card
(SKU & MAC Check, 11b/g communication test)
******************************************************
SELECT TEST No, (1-5) :
To execute the subtest, input the subtest number and press Enter.
Subtest01
SKU check of Module
This subtest displays SKU information on the wireless LAN card installed.
Selecting this subtest, following message will appear in the display. Confirm
if the right information on the wireless LAN card is described.
*************************************************************
*
*
*
*
*
*
*
*
*
*
Module : Intel Calexico 802.11b/g (MoW)
G-code : G36C0000X310
PBA No. : C55369
*************************************************************
If a defective is found during the test, NG message will appear in the display.
Press any key and return to the test menu.
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3 Tests and Diagnostics
3.26 Wireless LAN Test Program (Intel-made b/g)
When a defective is detected in the test, following typical cause is considered.
• Connection of wireless LAN card
• Using a wrong wireless LAN card (Using unspecified card)
• Defective wireless LAN card
Checking the connection, execute the subtest again.
MAC Address Check
Subtest02
This subtest displays the MAC address. Selecting this subtest, following
message will appear in the display.
*************************************************************
MAC = XXXXXXXXXXXX
*************************************************************
*************************************************************
*
*
*
*
*
*
MAC Address Check : OK !!
*************************************************************
Press any key and return to the test menu.
If a defective is found during the test, following message will appear in the
display.
*************************************************************
ERROR: MAC all 0
MAC = XXXXXXXXXXXX
*************************************************************
*************************************************************
*
*
*
*
*
*
MAC Address Check : NG !!
*************************************************************
Press any key and return to the test menu.
When a defective is detected in the test, following typical cause is considered.
• Connection of wireless LAN card
• Defective wireless LAN card
• Disappearance of MAC address data
Checking the connection, execute the subtest again.
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3.26 Wireless LAN Test Program (Intel-made b/g)
3 Tests and Diagnostics
Subtest03
Antenna check & communication test of 11b mode
Caution: To execute subtest 03-05, use another computer (with Calexico wireless LAN
card) that can communicate by the wireless LAN as a responder machine to
perform those tests. Access points are also required. (Access point for 802.11b
and 802.11g)
Be sure to turn the wireless communication switch ON before executing
wireless LAN communication test. (The wireless communication LED lights
orange.)
Release the write-protection of floppy disk for the test.
Setting the responder machine
Connect the responder machine to the access points (for 802.11b and 802.11g) with a cross
cable and turn on the access points.
Insert the floppy disk containing the wireless LAN test program into the FDD of the
responder machine and turn on the responder machine.
This subtest checks the connection and communication of wireless LAN
antenna of Calexico 802.11b mode.
After finishing the test, OK message will appear in the display. Press any key
and return to the test menu.
When a defective is found during the test, NG message will appear in the
display. Press any key and following message will appear in the display.
Check which antenna (Main/Aux) is defective.
*************************************************************
*
*
*
*
*
*
Main Antenna Test : NG !!
*************************************************************
Press any key and return to the test menu.
When a defective is detected in the test, following typical cause is considered.
• Connection of wireless LAN card
• Connection of wireless LAN antenna cable (Main/Aux)
• Condition of wireless LAN communication (Interference/obstruction)
• Defective wireless LAN card
Checking the connection and condition, execute the subtest again.
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3 Tests and Diagnostics
3.26 Wireless LAN Test Program (Intel-made b/g)
Subtest04
Communication test of 11g mode
This subtest checks the communication of wireless LAN antenna of Calexico
802.11g mode.
After finishing the test, OK message will appear in the display. Press any key
and return to the test menu.
When a defective is found during the test, NG message will appear in the
display. Press any key and following message will appear in the display.
*************************************************************
*
*
*
*
*
*
11g Communication Test : NG !!
*************************************************************
Press any key and return to the test menu.
When a defective is detected in the test, following typical cause is considered.
• Connection of wireless LAN card
• Connection of wireless LAN antenna cable (Main)
• Condition of wireless LAN communication (Interference/obstruction)
• Defective wireless LAN card
Checking the connection and condition, execute the subtest again.
All the tests of Calexico 11g Card
Subtest05
This subtest checks SKU information, MAC address, connection and
communication of wireless LAN antenna of Calexico 802.11b/g card. The test
stops at when a defective is found. For more details, refer to each subtest.
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3.27 Wireless LAN Test Program (Intel-made a/b/g)
3 Tests and Diagnostics
3.27 Wireless LAN Test Program (Intel-made a/b/g)
This section describes how to perform the wireless LAN transmitting-receiving test (Intel-
made Calexico 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for
wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO
DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS
MENU, select 9 - EXIT TO MS-DOS.
Insert the Diagnostics disk for wireless LAN test into the Floppy Disk Drive. Turn on the
power while pressing U.
The following menu appears in the display.
***********************************************************
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
Intel Calexico2 11a/g Maintenance T&D Menu
*
*
*
*
*
*
1 : SKU check of Module
2 : MAC Address Check
3 : Antenna Check & communication test of 11b mode *
*
4 : Communication test of 11a mode
*
*
*
*
*
*
*
5 : Communication test of 11g mode
6 : All the tests of Calexico2 11a/g Card
(SKU & MAC Check, 11a/b/g communication test)
***********************************************************
SELECT TEST No, (1-6) :
To execute the subtest, input the subtest number and press Enter.
Subtest01
SKU check of Module
This subtest displays SKU information on the wireless LAN card installed.
Selecting this subtest, following message will appear in the display. Confirm
if the right information on the wireless LAN card is described.
*************************************************************
*
*
*
*
*
*
*
*
*
*
Module : Intel Calexico 802.11a/g (MoW)
G-code : G36C00018510
PBA No. : C67287
*************************************************************
Press any key and return to the test menu.
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3 Tests and Diagnostics
3.27 Wireless LAN Test Program (Intel-made a/b/g)
If a defective is found during the test, NG message will appear in the display.
Press any key and following message will appear in the display.
*************************************************************
*
*
*
*
*
*
*
*
*
*
SKU NG !!
Other Card or Module not found
*************************************************************
Press any key and return to the test menu.
When a defective is detected in the test, following typical cause is considered.
• Connection of wireless LAN card
• Using a wrong wireless LAN card (Using unspecified card)
• Defective wireless LAN card
Checking the connection, execute the subtest again.
MAC Address Check
Subtest02
This subtest displays the MAC address. Selecting this subtest, following
message will appear in the display.
*************************************************************
MAC = XXXXXXXXXXXX
*************************************************************
*************************************************************
*
*
*
*
*
*
MAC Address Check : OK !!
*************************************************************
Press any key and return to the test menu.
If a defective is found during the test, following message will appear in the
display.
*************************************************************
ERROR: MAC all F
MAC = XXXXXXXXXXXX
*************************************************************
*************************************************************
*
*
*
*
*
*
MAC Address Check : NG !!
*************************************************************
Press any key and return to the test menu.
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3.27 Wireless LAN Test Program (Intel-made a/b/g)
3 Tests and Diagnostics
When a defective is detected in the test, following typical cause is considered.
• Connection of wireless LAN card
• Defective wireless LAN card
• Disappearance of MAC address data
Checking the connection, execute the subtest again.
Antenna check & communication test of 11b mode
Subtest03
Caution: To execute subtest 03-06, use another computer (with Calexico wireless LAN
card) that can communicate by the wireless LAN as a responder machine to
perform those tests. Access points are also required. (Access point for 802.11a,
802.11b and 802.11g )
Be sure to turn the wireless communication switch ON before executing
wireless LAN communication test. (The wireless communication LED lights
orange.)
Release the write-protection of floppy disk for the test.
Setting the responder machine
Connect the responder machine to the access points (for 802.11a, 802.11b and 802.11g) with
a cross cable and turn on the access points.
Insert the floppy disk containing the wireless LAN test program into the FDD of the
responder machine and turn on the responder machine.
This subtest checks the connection and communication of wireless LAN
antenna of Calexico 802.11b mode.
After finishing the test, OK message will appear in the display. Press any key
and return to the test menu.
When a defective is found during the test, NG message will appear in the
display. Press any key and following message will appear in the display.
Check which antenna (Main/Aux) is defective.
*************************************************************
*
*
*
*
*
*
Aux Antenna Test : NG !!
*************************************************************
Press any key and return to the test menu.
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3 Tests and Diagnostics
3.27 Wireless LAN Test Program (Intel-made a/b/g)
When a defective is detected in the test, following typical cause is considered.
• Connection of wireless LAN card
• Connection of wireless LAN antenna cable (Main/Aux)
• Condition of wireless LAN communication (Interference/obstruction)
• Defective wireless LAN card
Checking the connection and condition, execute the subtest again.
Communication test of 11a mode
Subtest04
This subtest checks the communication of wireless LAN antenna of Calexico
802.11a mode.
After finishing the test, OK message will appear in the display. Press any key
and return to the test menu.
When a defective is found during the test, NG message will appear in the
display. Press any key and following message will appear in the display.
*************************************************************
*
*
*
*
*
*
11a Communication Test : NG !!
*************************************************************
Press any key and return to the test menu.
When a defective is detected in the test, following typical cause is considered.
• Connection of wireless LAN card
• Connection of wireless LAN antenna cable (Main)
• Condition of wireless LAN communication (Interference/obstruction)
• Defective wireless LAN card
Checking the connection and condition, execute the subtest again.
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3.27 Wireless LAN Test Program (Intel-made a/b/g)
3 Tests and Diagnostics
Subtest05
Communication test of 11g mode
This subtest checks the communication of wireless LAN antenna of Calexico
802.11g mode.
For more details on procedure and contents of this subtest, refer to Subtest04
Communication test of 11a mode.
Subtest06
All the tests of Calexico 11a/ g Card
This subtest checks SKU information, MAC address of Calexico 802.11a/b/g
card, antenna connection and communication test of Calexico 802.11b card
and communication test of Calexico 802.11a and Calexico 802.11g. The test
stops at when a defective is found. For more details, refer to each subtest.
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3 Tests and Diagnostics
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the
test program.
Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on
the power. The following message will appear:
Microsoft Windows XX Startup Menu
----------------------------------
1. LAN
2. Modem
3. Bluetooth
4. IEEE1394
Enter a choice:
Press the number you want to test and press Enter.
NOTE: It is impossible to go back to startup menu once you choose the test. Therefore,
LAN/Modem/Bluetooth/IEEE1394 test can not be executed successively.
3.28.1
LAN test
To execute LAN test, press 1 and Enter. The following message will appear:
####################################################################
######### i82562 ICHx Gbe (i82540) Diagnostics program
#####
####################################################################
*
*
*
*
*
*
* 1 ............ (i82562 + ICHx)
*
* 2 ............ (Gbe)
*
********************************************************************
.... Press test number[1-2] ?
Press the number you want to test and press Enter.
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3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
3 Tests and Diagnostics
Subtest01
(i82562 + ICHx)
This subtest checks the operation of mini-PCI I/F by the loopback test in the
chip.
The following message will appear:
[LAN transmit & receive test !]
COMPLETED Repeat count =
Error count =
00000
00000
LOOPBACK TEST
100Mbps Auto-negotiation TxRx Test
Destination Address
Source Address
= xxxxxxxxxxxx
= xxxxxxxxxxxx
** 100Base-TX Full-Duplex **
< TRANSMIT >
< RECEIVE >
NOTE: The menu displayed by your computer may be slightly different from the one
shown above.
If a defective is found, NG message will appear in the display.
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3 Tests and Diagnostics
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
Subtest02
(Gbe)
CAUTION: Gigabit Ethernet test is not supported for this model.
This subtest checks the operation of mini-PCI I/F by the loopback test in the
chip. Select 2 to execute and press Enter.
The following message will appear:
Testing adapter...hit <ESC> to abort.
*
External Loopback Test...PASSED
Testing completed.
*
*
Loopback Test Complete
*
*
* 1000Base Auto-negotiation TxRx Test
*
* CE Test Complete
NOTE: The menu displayed by your computer may be slightly different from the one
shown above.
If a defective is found, NG message will appear in the display.
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3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
3 Tests and Diagnostics
3.28.2
Modem test
For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the
dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki
Seisakusyo)” for the tests.
To execute Modem test, press 2 and Enter. Following message will appear:
[Modem loopback test !]
ICHx MDC Test Program with Modem Sound (Line Test)
Version X.X
* Scorpio Modem Initialize
* Digital Loopback Test
:OK
:OK
* RJ11 Connector Check (LED) :(Operator’s Check!!)
NOTE: The menu displayed by your computer may be slightly different from the one
shown above.
RJ11 Connection Check (LED) (Operator’s Check LED) test will be executed, and the
following message will appear:
...Press Key (Y = OK , N =NG)
If the color in the LED of the connection checker is orange, press Y, otherwise, press N.
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3 Tests and Diagnostics
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
3.28.3
Bluetooth test
CAUTION: Bluetooth test is not supported for this model.
To execute this test, input 3 and press Enter.
Note: Use another computer that can communicate by the Bluetooth as a reference
machine to perform this test.
Insert a floppy disk containing the test program into the target machine and turn on the target
machine. The following Bluetooth test menu will appear:
######################################################################
####
Bluetooth sub system test program VX.XX
####
######################################################################
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1....BD_ADDR check
3... Communications test (DUT mode)
T....communications test (TEST mode)
**********************************************************************
....Press test number [1, 3, T] ? _
Press 1 or 3 key to perform the corresponding subtest. To quit the Bluetooth test program,
eject the floppy disk and turn the computer off while the menu above is displayed.
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3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
3 Tests and Diagnostics
Subtest01
BD_ADDR check
This subtest checks the BD_ADDR functions. When the Bluetooth test menu
is displayed, press 1 to select the test and press Enter. The following message
will appear:
-----------------------------------------------------------------------------
Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
-----------------------------------------------------------------------------
Initializing …
When the machine has passed the test, it displays BD_ADDR. If BD_ADDR
has no problem, the following message is displayed.
-----------------------------------------------------------------------------
Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
-----------------------------------------------------------------------------
My BD_ADDR = XXXXXXXXXXXX [h]
PPPPPP
A
SSSSS
SSSSS
SSSSS
SSSSS
P
P
P
A A
S
S S
S
S
P A
A S
PPPPPP A
A SSSSS
P
P
P
AAAAAAA
S
S
S
A
A
A S
A SSSSS
S S
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3 Tests and Diagnostics
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
If the target machine has any problem, it displays Error CODE. The following
message is displayed.
-----------------------------------------------------------------------------
Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
-----------------------------------------------------------------------------
My BD_ADDR = XXXXXXXXXXXX [h]
FFFFFF
A
III
I
L
F
A A
L
F
A
A
I
L
FFFFFF A
A
I
L
F
F
F
AAAAAAA
I
L
A
A
A
A
I
L
III
LLLLLLL
Table 3-5 Error message
Message
Contents
Invalid BD_ADDR (all 00)
Invalid BD_ADDR (all FF)
Invalid BD_ADDR (bit0=1)
Invalid BD_ADDR (bit1=1)
Invalid BD_ADDR (define in the file)
0x000000000000
0xFFFFFFFFFFFF
bit40=1b
bit41=1b
Defined BD_ADDR
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3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
3 Tests and Diagnostics
If the machine detects a malfunction, it indicates the error code as shown
below.
The error code begins with the least significant digit.
Error code
Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2)
Error code
Meaning
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0a
0x0b
0x0c
0x0d
0x0e
0x0f
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
0x19
0x1a
0x1b
0x1c
0x1d
0x1e
0x1f
Unknown HCI Command.
No Connection.
Hardware Failure.
Page Timeout.
Authentication Failure.
Key Missing.
Memory Full.
Connection Timeout.
Max Number Of Connections.
Max Number Of SCO Connections To A Device.
ACL Connection already exists.
Command Disallowed.
Host Rejected due to limited resources.
Host Rejected due to security reasons.
Host Rejected due to remote device is only a personal device.
Host Timeout.
Unsupported Feature or Parameter Value.
Invalid HCI Command Parameters.
Other End Terminated Connection: Used Ended Connection.
Other End Terminated Connection: Low Resources.
Other End Terminated Connection: About to Power Off.
Connection Terminated by Local Host.
Repeated Attempts.
Paring Not Allowed.
Unknown LMP PDU.
Unsupported Remote Feature.
SCO Offset Rejected.
SCO Interval Rejected.
SCO Air Mode Rejected.
Invalid LMP Parameters.
Unspecified Error.
** See the Specification of the Bluetooth System for details.
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3 Tests and Diagnostics
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2)
Error code
Meaning
0x20
0x21
0x22
0x23
0x24
0x25
0x26
0x27
0x28
0x29
0x2a
0x2b
0x2c
0x2d
0x2e
0x2f
Unsupported LMP Parameter Value.
Role Change Not Allowed.
LMP Response Timeout.
LMP Error Transaction Collision.
LMP PDU Not Allowed.
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
** See the Specification of the Bluetooth System in detail.
Subtest03
Communication test (DUT mode)
This subtest checks the Bluetooth communication functions. Preparing the tester machine for
the Bluetooth test program. Insert a floppy disk containing the test program into the tester
machine and turn on the tester machine. The Bluetooth test menu will appear:
Press 3 to select the test and press Enter in the target machine. The following message will
appear:
When the test begins, the machine displays BD_ADDR of the DUT. The progress bar
stops when the test is completed. The following message is displayed.
-----------------------------------------------------------------------------
Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
-----------------------------------------------------------------------------
+----------------------+
|
DUT
|
BD_ADDR of the DUT = XXXXXXXXXXXXX [h]
+----------------------+
Ready>>>>>>>>>>>>>>>>>>>>>>
<- Progress Bar
[ESC] : Stop
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3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
3 Tests and Diagnostics
When the Bluetooth test menu is displayed, press T to select the test and press Enter in the
test machine. The following message will appear:
-----------------------------------------------------------------------------
Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
-----------------------------------------------------------------------------
+------------------+
|
|
|
|
Tester
|
|
+------------------+
[ESC]:Finish Tester [SPACE]:Start
Is DUT ready?
Then press Space to start the Bluetooth communication test.
When the machine has passed the test, it displays BD_ADDR of the DUT. If the connection
with the tester is completed, the progress bar stops. The following message is shown.
-----------------------------------------------------------------------------
Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
-----------------------------------------------------------------------------
+----------------------+
|
DUT
|
BD_ADDR of the DUT = XXXXXXXXXXXXX [h]
+----------------------+
CCCC
CCCC
OOO
OOO
M
M PPPPPP L
EEEEEE TTTTTTT EEEEEEE DDDDD
C
C
C O
O MM
MM P
P L
P L
E
T
E
E
D
D
D
D
C
C
C
O
O
O M M M M P
E
T
T
T
T
T
D
D
D
O M M M PPPPPP L
EEEEEE
EEEEEEE D
O
O M
O M
M
M P
M P
M P
L
L
E
E
E
E
D
D
C O
LLLLLLL EEEEEE
EEEEEEE DDDDD
Testing is finished
A>_
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3 Tests and Diagnostics
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
If the target machine has any problem, the following message “INCOMPLETE” is displayed
with the Error Code.
-----------------------------------------------------------------------------
Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
-----------------------------------------------------------------------------
+----------------------+
|
DUT
|
BD_ADDR of the DUT = XXXXXXXXXXXXX [h]
+----------------------+
III N
N
CCCC
CCCC
OOO
OOO
M
M PPPPPP L
EEEEEE TTTTTTT EEEEEEE
I
NN
N N
N C
C O
O MM
MM P
P L
P L
E
T
E
I
I
I
I
N C
O
O
O M M M M P
E
T
T
T
T
T
E
N N N C
O M M M PPPPPP L
EEEEEE
EEEEEEE
N
N
N N C
NN C
N
O
O M
O M
M
M P
M P
M P
L
L
E
E
E
C O
E
III N
LLLLLLL EEEEEE
EEEEEEE
Testing is finished
_Press any key to continue. . .
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3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
3 Tests and Diagnostics
If the machine detects a malfunction, it indicates the error code as shown below.
The error code begins with the least significant digit.
Error code
Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2)
Error code
Meaning
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0a
0x0b
0x0c
0x0d
0x0e
0x0f
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
0x19
0x1a
0x1b
0x1c
0x1d
0x1e
0x1f
Unknown HCI Command.
No Connection.
Hardware Failure.
Page Timeout.
Authentication Failure.
Key Missing.
Memory Full.
Connection Timeout.
Max Number Of Connections.
Max Number Of SCO Connections To A Device.
ACL Connection already exists.
Command Disallowed.
Host Rejected due to limited resources.
Host Rejected due to security reasons.
Host Rejected due to remote device is only a personal device.
Host Timeout.
Unsupported Feature or Parameter Value.
Invalid HCI Command Parameters.
Other End Terminated Connection: Used Ended Connection.
Other End Terminated Connection: Low Resources.
Other End Terminated Connection: About to Power Off.
Connection Terminated by Local Host.
Repeated Attempts.
Paring Not Allowed.
Unknown LMP PDU.
Unsupported Remote Feature.
SCO Offset Rejected.
SCO Interval Rejected.
SCO Air Mode Rejected.
Invalid LMP Parameters.
Unspecified Error.
** See the Specification of the Bluetooth System in detail.
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3 Tests and Diagnostics
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2)
Error code
Meaning
0x20
0x21
0x22
0x23
0x24
0x25
0x26
0x27
0x28
0x29
0x2a
0x2b
0x2c
0x2d
0x2e
0x2f
Unsupported LMP Parameter Value.
Role Change Not Allowed.
LMP Response Timeout.
LMP Error Transaction Collision.
LMP PDU Not Allowed.
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
Not Exist
** See the Specification of the Bluetooth System in detail.
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3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program
3 Tests and Diagnostics
3.28.4
IEEE1394 test
To execute this test, input 4 and press Enter.
NOTE:
Use another computer that can communicate by IEEE1394 (i. Link) cable as a
reference machine to perform this test.
The following menu will appear:
********************************************************************
********
IEEE1394[XXXXX] Diagnostics program
**************
********************************************************************
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1 ....(Transmit & Receive test)
2 ....(Responder set)
3 ....(1394 GUID Display)
********************************************************************
.... Press test number[1-3] ?
To execute the TEST, select the test number you want to execute and press Enter.
Subtest01
Transmit & Receive test
NOTE:
Before executing subtest 01, be sure to execute subtest 02 in the responder
machine.
This program checks the data transporting between responder machine and
target machine and compare them with the original data through the
IEEE1394 cable.
Subtest02
Subtest03
Responder set
This program is executed in the responder machine to initialize the responder
machine with the IEEE1394 cable connected to the target machine before
executing subtest 01.
IEEE1394 GUID Display
This program checks the GUID of IEEE1394.
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3.29 Sound Test program
3
Tests and Diagnostics
3.29 Sound Test program
This section describes how to perform the Sound test. To execute the sound test, refer to the
following description.
Insert the test program disk for Sound test in the floppy disk drive and turn on the power. The
following message will appear:
#################################################################
######
WSS, Sound blaster pro Diagnostics program
#######
#################################################################
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1 ............ Sound (Standard)
2 ............ Sound (Legacy)
3 ............ CD Sound (Standard)
4 ............ CD Sound (Legacy)
---It outputs at the speaker and lineout---
***************************************************************
.... Press test number[1-4] ?
Input the test number and press Enter.
3.29.1 Sound (Standard)
To execute the Sound (Standard) test, press 1 and Enter. The following menu will appear in
the display.
################################################################
######
ICH4-M + AD1981A Diagnostics program
######
################################################################
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1 ............( Microphone recording & play )
2 ............( Sine wave )
3 ............( Line IN recording & play )
9 ............Exit to Main
****************************************************************
.. Press test number[1-3, 9] ?
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To return to the Sound test menu, Press 9 and Enter. Then following message will appear in
the display.
***********************************
******** May I Restart ? *******
***********************************
Press any key to continue…
After pressing any key, the machine starts rebooting and sound test menu will appear in the
display.
Subtest01
Microphone recording & play
This subtest checks the function of the CODEC A/D, D/A converter.
When this subtest is selected, the following message will appear.
[Recording & play test !]
And the following message will appear.
DOS/4GW Protected Mode Run-time Version X.XX
Copyright (c) Tenberry Software, Inc. XXXX
After this message appears, display stops briefly. In this timing, sound is
recorded from internal microphone.
After the recording is completed, the computer plays back the sound recorded
after the following message.
STACWAVE Version X.XX
Build data: XXX XX XXXX at XX:XX:XX
Loading “mic.wav”.
NOTE:
The message in the display might have slight difference from those above.
The display returns to the Sound (Standard) test menu after the test ends.
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3.29 Sound Test program
Subtest02
Sine Wave
This subtest is executed by loading the COM file (ADSIN.COM). The
program expands sine wave data table from 16KB to 64KB, and creates the
play data. Then it transfers the data between the DMA and the CODEC to
play the sine wave. (It sounds like a continuous beep). By using wave
measurable devices such as an oscilloscope, the data can be measured as a
sine wave.
When the subtest is executed, the sine wave is played while expanding sine
wave from 16KB to 64KB.
The display returns to the Sound (Standard) test menu after the test ends.
Line IN recording & play
Subtest03
This subtest executes the same test as the subtest01 by recorded sound from
the different port (Line-in port).
For more details on the subtest, refer to the subtest01 Microphone recording &
play.
The display returns to the Sound (Standard) test menu after the test ends.
3.29.2 Sound (Legacy)
To execute the Sound (Legacy) test, select 2 and press Enter.
CAUTION: Sound (Legacy) test is not supported in this model.
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3.29.3 CD Sound (Standard)
To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media
(TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the
test media can not be prepared). Following menu appears in the display.
For details on use of test media, refer to (1) Test media (Toshiba-made test media).
For details on use of audio CD on the market, refer to (2) Audio CD.
(1) Test media (Toshiba-made test media)
xxxxxxx DIAGNOSTIC TEST VX.XX
[Ctrl]+[Break] : test end
CD/DVD TEST IN PROGRESS XXXXXXXX
[Ctrl]+[C]
: key stop
SUB-TEST : XX
PASS COUNT : XXXXX
WRITE DATA : XX
ERROR COUNT: XXXXX
READ DATA : XX
STATUS : XXX
ADDRESS
: XXXXXX
01 – Japanese Narration
02 – English Narration
03 – Test Tone A (100Hz – 20Hz)
04 - Test Tone B (400Hz – 3KHz L-R)
Drive # = 0, ATAPI status =00
Command = XX
[[Block address = XXXXXXXX]]
[[Block length = XXXXXXXX]]
Final : Block address = XXXXXXXXX
Subtest01
Japanese Narration
Selected this subtest, narration in Japanese starts and following message
appears in the display.
Play start CD sound !
Press any key <Play stop>.
Press any key and stop the narration. Then return to the CD Sound (Standard)
test menu.
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3.29 Sound Test program
Subtest02
English Narration
Selected this subtest, narration in English starts.
For more details on the procedure, refer to the subtest01.
Test Tone A
Subtest03
Caution: Before starting subtest03, be sure to set the sound at proper volume.
This subtest plays sine wave while changing its table from 100Hz to 20Hz.
Return to the CD Sound (Standard) menu after the test ends.
Subtest 04
Test Tone B
This subtest plays sine wave while changing its table from 400Hz to 3KHz
and also changing the channel from left speaker to right speaker.
Return to the CD Sound (Standard) menu after the test ends.
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(2) Audio CD
Insert an audio CD and the following menu appears in the display.
xxxxxxx DIAGNOSTIC TEST VX.XX
[Ctrl]+[Break] : test end
CD/DVD TEST IN PROGRESS XXXXXXXX
[Ctrl]+[C]
: key stop
SUB-TEST : XX
PASS COUNT : XXXXX
WRITE DATA : XX
ERROR COUNT: XXXXX
READ DATA : XX
STATUS : XXX
ADDRESS
: XXXXXX
CD Sound track number (01-98 : Track) ?
Drive # = 0, ATAPI status =00
Command = XX
[[Block address = XXXXXXXX]]
[[Block length = XXXXXXXX]]
Final : Block address = XXXXXXXXX
Select the track number you want to test and press Enter twice.
The following message appears in the display and selected track is played.
Play start CD sound !
Press any key <play stop>
After pressing any key, the music stops and the display returns to the selection menu of the
track number.
NOTE:
When the CD-ROM test is executed, “ALL DEVICE” must be selected in the
[Device Config.] of the BIOS SETUP. If the “ALL DEVICE” is not selected,
music can not be played.
3.29.4 CD Sound (Legacy)
To execute the CD Sound (Legacy) test, select 4 and press Enter.
CAUTION: Sound (Legacy) test is not supported in this model.
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3.30 SETUP
3.30 SETUP
3.30.1 Function Description
This program displays the current system setup information as listed below:
1. Memory
2. System Date/Time
3. Battery
(a) Battery Save Mode
(b) PCI Express Link ASPM
4. Password
5. HDD Password
(a) HDD
(b) HDD Password Mode
(c) User Password
(d) Master Password
6. Boot Priority
(a) Boot Priority
(b) HDD Priority
7. Others
(a) Dynamic CPU Frequency Mode
(b) EXECUTE-Disable Bit Capability
(c) Auto Power On
(d) Diagnostic Mode
(e) Stanby
8. Configuration
9. I/O port
10. Drives I/O
(a) Built-in HDD
(b) Selected Bay
11. PCI Bus
12. Security Controller
(a) TPM
(b) Clear TPM Owner
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13. Display
(a) Power On Display
(b) LCD Display Stretch
(c) TV type
14. Peripheral
(a) Internal Pointing Device
(b) Parallel Port Mode
15. LEGACY EMULATION
(a) USB KB/Mouse Legacy Emulation
(b) USB-FDD Legacy Emulation
(c) USB Memory BIOS Support Type
16. PCI LAN
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3.30 SETUP
3.30.2 Accessing the SETUP Program
Selecting 0 from the DIAGNOSTICS MENU and pressing Enter displays the followings:
NOTE: (*1) This item is displayed only when a Tablet Multi Dock II is connected.
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Moving Within the SETUP Menu and Changing Values
1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between
items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the
two pages.
2. Press either the Space bar or Back Space to change the value.
Accepting Changes and Exiting the SETUP Window
1. Press End to accept the changes you made.
If the changed item does not require the system to reboot, the following message is
displayed:
Are you sure? (Y/N)
If the changed item requires the system to reboot, the following message is displayed:
Are you sure? (Y/N)
The changes you made will cause the system to reboot.
2. To make other changes, press N. Repeat the steps above.
3. To accept the changes, press Y.
NOTE: You can press Esc to quit at any time without saving changes. SETUP asks you
to confirm that you do not want to save your changes. When SETUP is displayed
at the next time, the current configuration appears.
The Factory Preset Configuration
When you access SETUP, the current configuration is displayed.
1. To show the factory preset configuration, press Home.
2. To accept the default settings, press End and then press Y.
NOTE: When you execute the default setting, the following settings are not changed:
Password
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3.30 SETUP
SETUP Options
The SETUP screen is divided into 15 functionally related groups. This section describes each
group and its options.
1. Memory
This group of options displays the computer’s memory.
This field displays the total amount of memory installed and is automatically
calculated by the computer. You cannot change this value.
2. System Date/Time
Sets the date and time.
System Date
System Time
Sets date.
Sets time.
3. Battery
(a) Battery Save Mode
This option is used to select Full Power, Low Power or User Setting of the
battery save mode. When you select the battery save mode, the followings will
appear.
Full Power The following shows full power settings.
Low Power The following shows low power settings.
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NOTE: Display of the LCD Brightness will be changed in the condition below:
(*1) Operating the battery
(*2) Using the AC adapter
User Setting
Use this option to set the battery save parameters on
the sub-window, BATTERY SAVE OPTIONS.
Battery Save Options
Processing Speed
This feature changes the CPU processing speed.
High
Low
CPU operates at 1.6/1.73/1.87/2.0/2.13GHz (Pentium-M),
(Default in Full Power Mode)
CPU operates at half processing speed.
(Default in Low Power Mode)
CPU Sleep Mode
Use this option to enable or disable the CPU sleep function.
Enabled
Disabled
Enables sleep mode. (Default)
Disables sleep mode.
LCD Brightness
Use this option to set the level of LCD brightness.
Super-Bright
Bright
Full brightness for maximum visibility.
Full brightness for high visibility.
Semi-Bright
Less than full brightness for saving power.
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3.30 SETUP
Cooling Method
Maximum Performance
If the CPU becomes too hot, the fan turns on
automatically in a high speed to cool down the
CPU.
Performance
If the CPU becomes too hot, the fan turns on
automatically. When the CPU temperature falls
to a normal range, the fan turns off.
Battery optimized
If the CPU becomes too hot, the processing
speed is lowered. If the temperature is still too
high, the fan turns on. When the CPU
temperature falls to a normal range, the fan is
turned off and the processing speed is increased.
NOTE: Too hot condition may cause defect on the CPU. When the hot condition
continues, the power is automatically turned off in resume mode.
(b) PCI Express Link ASPM
This option sets the power saving function of the PCI Express.
Auto
Saves power consumption, when the PCI Express device is
not used while the battery is working. (Default)
Disabled
Enabled
Disables the power saving function and gives priority to the
performance.
Saves power consumption, when the PCI Express device is
not used.
4. Password
This option sets or resets the user password for power on and instant security
(Fn+F1).
Registered
The user password has been registered.
The user password has not been registered.
Not registered
For details on setting the user password, refer to the User’s Manual.
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5. HDD Password
This option registers, resets or changes the HDD password.
(a) HDD
Hard disk for setting the password.
Built-in HDD
The password is set to Built-in HDD. (This cannot be
changed.)
(b) HDD Password Mode
This item registers HDD Password and can be selected only for registering
HDD password. To change HDD Password Mode when HDD Password is
registered, delete the registered HDD Password first, and then register new
password.
User Only
Sets only User HDD Password (Default)
Master+User
Sets Master HDD Password and User HDD Password
(c) User Password
This item sets User password.
For details on setting user password, refer to the User’s Manual.
(d) Master Password
This item sets the Master HDD password.
This can be set, only when Master+User is set in the HDD password Mode.
For details, refer to the User’s Manual.
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3.30 SETUP
6. Boot Priority
(a) Boot Priority
Use this option to set the priority for booting of the computer and the priority
for the HDD for booting.
FDD→HDD→CD-ROM→LAN: The computer looks for bootable files in
the following order: FDD, HDD, CD-
ROM (*1) and LAN
HDD→CD-ROM→LAN→FDD: The computer looks for bootable files in
the following order: HDD, CD-ROM,
LAN and FDD.
FDD→CD-ROM→LAN→HDD: The computer looks for bootable files in
the following order: FDD, CD-ROM,
LAN and HDD.
CD-ROM→LAN→HDD→FDD: The computer looks for bootable files in
the following order: CD-ROM, LAN,
HDD and FDD.
CD-ROM→LAN→FDD→HDD: The computer looks for bootable files in
the following order: CD-ROM, LAN,
FDD and HDD.
HDD→FDD→CD-ROM→LAN: The computer looks for bootable files in
the following order: HDD, FDD, CD-
ROM and LAN. (Default)
NOTE: CD-ROM refers to an Optical drive.
NOTE: When a floppy disc drive is not connected, it boots up from SD memory card
in spite of selecting FDD.
(b) HDD Priority
Use this option to set the starting method from hard disk drive.
Built-in HDD → Second HDD
: Detecting boot command from Built-in HDD first and then second HDD
(Default)
Second HDD → Built-in HDD
: Detecting boot command from Second HDD and then Built-in HDD
Built-in HDD → Second HDD→USB
: The priority is set as Built-in HDD → Second HDD→USB.
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Second HDD → Built-in HDD→USB
: The priority is set as Second HDD → Built-in HDD→USB.
Built-in HDD → USB → Second HDD
: The priority is set as Built-in HDD → USB → Second HDD.
Second HDD → USB → Built-in HDD
: The priority is set as Second HDD → USB → Built-in HDD.
USB → Built-in HDD → Second HDD
: The priority is set as USB → Built-in HDD → Second HDD.
USB → Second HDD → Built-in HDD
: The priority is set as USB → Second HDD → Built-in HDD.
NOTE: If the boot command can not be detected from the prior HDD, booting
target changes to other devices.
Some modules may not be displayed.
7. Others
Whether or not you need to configure the computer with these options depends
primarily on the kind of software or peripherals you use.
(a) Dynamic CPU Frequency Mode
Use this option to choose a setting from the followings. When the CPU of the
computer is Celeron-M, this option is not displayed.
Dynamically Switchable
Enables Pentium-M processor featuring Intel SpeedStep
technology. (Default)
Always High
Always Low
Disables Pentium-M processor featuring Intel
SpeedStep technology and always runs the processor at
its maximum speed.
Disables Pentium-M processor featuring Intel
SpeedStep technology and always runs the processor at
its default speed.
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(b) EXECUTE-Disable Bit Capability
Selects the function to reports whether the CPU Execute-Disable Bit is
available or not to OS. The Execute-Disable Bit Capability is a function that
strengthens the security to protect PC from the buffer overflow attack by a
computer virus and an illegal access.
Available
Make the Execute-Disable Bit Capability usable.
(Available)
Not Available
Disables the Execute-Disable Bit Capability.
(Not Available) (Default)
(c) Auto Power On
This option displays setting for Auto Power On.
Disabled
Enabled
Indicates auto power on is not set.
Indicates auto power on is set.
When “Enabled” is selected, the following sub-window appears.
OPTIONS
Alarm Time
Alarm Date Option
Wakeup on LAN
= 00:00:00
= Disabled
= Disabled
Set the parameters for the Auto Power On (automatic power on) function in
the “OPTIONS” window. To set the time, use Space or BackSpace. Press
↓ to move the cursor to the right and ↑ to move the cursor to the left when
you set the date and time.
For the Alarm Time, set the time to turn on the power automatically. The
“second” cannot be set. When it is set to “Disabled”, the time to turn on
automatically is not set.
For the Alarm Date Option, set the date to turn on the power automatically.
When it is set to “Disabled”, the time to turn on automatically is not set.
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The Ring Indicator is displayed only when the computer is in Resume mode
and this function cannot be used for a PC card-type modem. When any
modem is not installed, it is not displayed.
NOTE: 1. Do not remove the AC adapter and battery pack at the same time when you
use this feature. If you do so, data saved by the resume function will be lost.
You must also reset this option.
2. If you have set a password and the computer boots by the Auto Power On
function and Standby is on, the computer will start with the instant security
function enabled. The password = message is not displayed; however, you
must enter the password to use the computer.
3. This option is enabled only once, the setting is reset, after booting up.
(d) Diagnostic Mode
This option sets whether the BIOS Setup Diagnostic test is enabled.
Disabled
Enabled
The Diagnostic test is disabled
The Diagnostic test is enabled.
(e) Standby
Use this option to set the start speed of operation from standby mode.
Normal
Fast
Normal speed of start to Windows operation. (Default)
Quick start to Windows operation. It consumption more
electricity than normal mode. It lights orange during
standby mode.
NOTE: You can not choose standby mode with the setting [Fast] when the PC is running
with battery.
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3.30 SETUP
8. Configuration
This option lets you set the device configuration.
All Devices
BIOS sets all devices.
Setup by OS
Initializes devices, which is needed to load an operating
system. Operating system initializes other devices.
NOTE: (1) When using installed OS, selecting “Setup by OS” is recommended.
(2) When executing test programs, be sure to select “ALL Devices”.
9. I/O port
(a) Parallel
This option sets the interrupt request level (IRQ) and I/O port base address for
the parallel port. When the “Parallel Port Mode” is set to Std. Bi-direct, the
options are:
LPT setting
LPT 1
Interrupt level
I/O address
378H
7
5
7
LPT 2
278H
LPT 3
3BCH
Not Used
Disables port
When the “Parallel Port Mode” (see settings below) is set to ECP, the DMA
channel can also be set to 1 or 3. The default is 3.
LPT setting
LPT 1
Interrupt level
I/O address DMA channel
7
378H
278H
3BCH
3 (Parallel port default)
LPT 2
5
3
3
LPT 3
7
Not Used
Disables the port
When you select one of the above options, except for Not Used, a sub window
similar to the one below appears to let you set the DMA. The options for this
setting are Channel 1and Channel 3 (Default).
OPTIONS
DMA
= Channel 3 (Default)
For most printers, the port should be set to ECP. With some other parallel
devices, the setting should be Std. Bi-Direct.
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10. Drives I/O
This option displays the address and interrupt level for hard disk drive and optical
disk drive. It is for information only and cannot be changed.
Built-in HDD
Select Bay
This item cannot be changed.
This item cannot be changed.
11. PCI Bus
This option displays the interrupt level for the Card Bus in the computer. It is for
information only and cannot be changed.
PCI BUS
= IRQ10, IRQ11
12. Security Controller
(a) TPM
Disables the security controller called TPM (Trusted Platform Module).
When the cursor is on the Enable (Disable) and the Space is pressed,
message is displayed and the PC waits Y or N key input by the user.
When Y is pressed, it is sets to Enable (Disable). After changing, the cursor
could not be moved on the TPM tem. This option can be changed after
rebooting.
Disabled
Enabled
Disables the TPM. (Default)
Enables the TPM.
(b) Clear TPM Owner
This is not displayed when the TPM is set to Disabled. This is executed,
when the PC is disposed or the owner of the PC changes.
When the cursor is on this item and the Space is pressed, message is
displayed and the PC waits Y, E, S and Enter key inputs by the user.
When Y, E, S and Enter keys are pressed, the data is disposed.
After changing, the display of TPM item is changed to Disabled and this item
becomes not displayed and the cursor could not be moved on the TPM item.
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3.30 SETUP
13. Display
This group of options configures the computer’s display.
(a) Power On Display
This option is used to select the display when booting up.
Auto-Selected
Selects an external monitor if one is connected.
Otherwise it selects the internal LCD. (Default)
LCD +Analog RGB Selects both the internal LCD and the external CRT for
simultaneous display.
System LCD only
Selects only internal LCD display even if the external
monitor is connected.
NOTE: When starting the computer in Standby or Hibernation, the last configuration is
saved. If data does not appear on the display you are using after starting in
Standby or Hibernation, press Fn+F5 to change the active display device.
When an external CRT display, which does not support SVGA mode is connected
and “LCD+AnalogRGB” is selected, the external display is not displayed.
(b) LCD Display Stretch
LCD Display Stretch enables or disables a larger display area of the screen.
Enabled
Disabled
Enables the LCD display stretch feature. (Default)
Disables the LCD display stretch feature.
(c) TV type
This option allows you to select the type of TV.
NTSC (Japan)
; TV in Japanese system
; TV in the U.S. system
; TV in Europe etc. system
NTSC (US)
PAL
14. Peripheral
Use this option to select the peripheral’s mode.
(a) Internal Pointing Device
This option enables or disables the touch pad
Enabled
Disabled
Enables the touch pad. (Default)
Disables the touch pad.
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(b) Parallel Port Mode
The options in this tab are ECP and Standard Bi-directional.
ECP
Sets the port mode to Extended Capabilities Port (ECP). For
most printers, the port should be set to ECP. (Default)
Std. Bi-Direct.
This setting should be used with some other parallel devices.
15. LEGACY EMULATION
(a) USB KB/Mouse Legacy Emulation
This option sets the Legacy support condition of the USB keyboard and the USB
mouse.
Enabled
Enables LEGACY support. (Default)
USB keyboard/USB mouse are available without the driver.
Disabled
Disables LEGACY support
(b) USB-FDD Legacy Emulation
This option sets the Legacy support condition of the USB floppy disk drive.
When a computer is FDD built-in model, this option is not displayed.
Enabled
Enables LEGACY support. (Default)
USB floppy disk is available without the driver.
Disabled
Disables LEGACY support
(c) USB Memory BIOS Support Type
This option sets the type of the USB memory as a startup device.
HDD Sets the type of the USB memory to be equivalent to the HDD (Default).
(Based on the [HDD] order in the [Boot Priority Options] item. The
order with respected to the other HDD can be set in the [HDD Priority
Options] item.)
FDD
Sets the type of the USB memory to be equivalent to the FDD.
(Based on the [HDD] order in the [Boot Priority Options] item.)
16. PCI LAN
This option sets the Enable / Disable of the built-in LAN functions.
Enabled
Disabled
Enables built-in LAN functions. (Default)
Disables built-in LAN functions.
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3 Tests and Diagnostics
3.30 SETUP
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Replacement Procedures
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4
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4 Replacement Procedures
Chapter 4
Contents
4.1
Overview...................................................................................................................4-1
Safety Precautions...............................................................................................4-2
Before You Begin ...............................................................................................4-3
Disassembly Procedure.......................................................................................4-4
Assembly Procedure ...........................................................................................4-5
Tools and Equipment ..........................................................................................4-5
Screw Tightening Torque ...................................................................................4-6
Grip Color .........................................................................................................4-6
Screw Notation....................................................................................................4-7
Battery pack ..............................................................................................................4-8
PC card/SD card......................................................................................................4-10
4.3.1 PC card.....................................................................................................4-10
4.3.2 SD card.....................................................................................................4-11
Memory module......................................................................................................4-12
HDD........................................................................................................................4-14
Selectable bay module ............................................................................................4-16
Keyboard.................................................................................................................4-19
Bottom cover assembly...........................................................................................4-21
Battery latch assembly/Selectable bay lock............................................................4-23
4.9.1 Battery latch assembly .............................................................................4-23
4.9.2 Selectable bay lock ..................................................................................4-24
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10 QI button assembly/PC card slot brace...................................................................4-25
4.10.1 QI button assembly ................................................................................4-25
4.10.2 PC card slot brace ..................................................................................4-26
4.11 Bluetooth module....................................................................................................4-27
4.12 MDC/Modem cable ................................................................................................4-29
4.13 Wireless LAN card .................................................................................................4-32
4.14 Fan/CPU..................................................................................................................4-34
4.14.1 Fan..........................................................................................................4-34
4.14.2 CPU........................................................................................................4-36
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4 Replacement Procedures
4.15 DC-IN jack..............................................................................................................4-39
4.16 Penholder/RTC battery ...........................................................................................4-40
4.16.1 Pen holder ..............................................................................................4-40
4.16.2 RTC battery............................................................................................4-41
4.17 LCD harness holder ................................................................................................4-42
4.18 Mic (L) cable guide................................................................................................ 4-45
4.19 QI board/CN board ................................................................................................ 4-47
4.19.1 QI board .................................................................................................4-47
4.19.2 CN board................................................................................................4-48
4.20 System board...........................................................................................................4-49
4.21 PC card slot cover ...................................................................................................4-51
4.22 Speaker....................................................................................................................4-52
4.23 Microphone/Front panel..........................................................................................4-53
4.23.1 Microphone............................................................................................4-54
4.23.2 Front panel .............................................................................................4-55
4.24 Lens holder..............................................................................................................4-57
4.25 Touch pad................................................................................................................4-58
4.26 LCD unit & FL inverter..........................................................................................4-59
4.27 Application switch board........................................................................................4-63
4.28 LCD latch assembly................................................................................................4-64
4.29 Digitizer ..................................................................................................................4-65
4.30 LCD harnesses & Wireless LAN/Bluetooth antennas............................................4-71
4.31 Hinge switch Board.................................................................................................4-76
4.32 Fluorescent Lamp....................................................................................................4-77
4.32.1 Replacing the 14.1 inch SXGA+ TMD fluorescent Lamp ....................4-78
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Figures
Figure 4-1 Removing the battery pack.................................................................................4-8
Figure 4-2 Removing the PC card .....................................................................................4-10
Figure 4-3 Removing the SD card .....................................................................................4-11
Figure 4-4 Removing the memory module........................................................................4-12
Figure 4-5 Removing the HDD FPC .................................................................................4-14
Figure 4-6 Removing the HDD holder ..............................................................................4-15
Figure 4-7 Removing the selectable bay module...............................................................4-16
Figure 4-8 Removing the plastic frame .............................................................................4-17
Figure 4-9 Removing the keyboard ...................................................................................4-19
Figure 4-10 Removing the touch pad cable.......................................................................4-21
Figure 4-11 Removing the bottom cover assembly ...........................................................4-22
Figure 4-12 Removing the battery latch assembly ............................................................4-23
Figure 4-13 Removing the selectable bay lock..................................................................4-24
Figure 4-14 Removing the QI button assembly.................................................................4-25
Figure 4-15 Removing the PC card slot brace...................................................................4-26
Figure 4-16 Removing the Bluetooth module ...................................................................4-27
Figure 4-17 Removing the MDC.......................................................................................4-29
Figure 4-18 Removing the Modem cable ..........................................................................4-30
Figure 4-19 Removing the Wireless LAN card .................................................................4-32
Figure 4-20 Removing the fan ...........................................................................................4-34
Figure 4-21 Removing the heat sink..................................................................................4-36
Figure 4-22 Removing the CPU ........................................................................................4-37
Figure 4-23 Applying silicon grease..................................................................................4-38
Figure 4-24 Removing the DC-IN jack .............................................................................4-39
Figure 4-25 Removing the penholder ................................................................................4-40
Figure 4-26 Removing the RTC battery ............................................................................4-41
Figure 4-27 Removing the LCD harness holder................................................................4-43
Figure 4-28 Removing the Mic (L) cable guide ................................................................4-45
Figure 4-29 Removing the QI board..................................................................................4-47
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Figure 4-30 Removing the CN board.................................................................................4-48
Figure 4-31 Removing the system board...........................................................................4-49
Figure 4-32 Removing the PC card slot cover...................................................................4-51
Figure 4-33 Removing the speaker....................................................................................4-52
Figure 4-34 Removing the microphone .............................................................................4-54
Figure 4-35 Removing the front panel...............................................................................4-55
Figure 4-36 Removing the lens holder...............................................................................4-57
Figure 4-37 Removing the touch pad.................................................................................4-58
Figure 4-38 Removing the LCD mask...............................................................................4-59
Figure 4-39 Removing the LCD unit.................................................................................4-60
Figure 4-40 Removing the LCD unit holder......................................................................4-61
Figure 4-41 Removing the FL inverter..............................................................................4-61
Figure 4-42 Removing the application switch board.........................................................4-63
Figure 4-43 Removing the LCD latch assembly................................................................4-64
Figure 4-44 Removing the digitizer...................................................................................4-70
Figure 4-45 Removing the cover assembly .......................................................................4-72
Figure 4-46 Removing the hinge assembly .......................................................................4-73
Figure 4-47 Arranging the wireless LAN antenna cables..................................................4-74
Figure 4-48 Removing the hinge switch board..................................................................4-76
Figure 4-49 to 4-59 Replacing 14 inch TMD fluorescent lamp (1) to (11)............4-78 to 4-88
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4.1 Overview
4 Replacement Procedures
4
Replacement Procedures
4.1 Overview
This chapter describes the procedure for removing and replacing the field replaceable units
(FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one.
The chart below provides a guide as to which other FRUs must be removed before a
particular FRU can be removed. The numbers in the chart indicate the relevant section
numbers in this manual.
In all cases when removing an FRU, the battery pack must also be removed. When repairing
an FRU that is the potential cause of a computer fault, use the chart to determine the order in
which FRUs need to be removed.
Chart Notation
The chart shows the case for the
following example:
Removing the Wireless LAN
module
All FRUs down to the “4.12 MDC/
Modem cable” unit immediately
above the Mini PCI module must be
removed.
Similarly, as this requires the
removal of all the units from “4.3 PC
card/SD card” to “4.8 Bottom cover
assembly” must be also removed.
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4 Replacement Procedures
4.1 Overview
Safety Precautions
Please read the following safety instructions before disassembling the computer and always
follow the instructions while working on the computer.
Danger: 1. In the case of the battery, always use authentic parts or equivalent parts
approved by Toshiba. Other batteries may have different specifications that
are incompatible with the computer and may result in fire or explosion.
Due to the risk of alkali fluid leaks, never attempt to heat or disassemble the
battery. Similarly, due to the risk of explosion, never expose the battery to
flame.
2. Some parts including the power supply and FL inverter generate high
voltages. If you need to turn on the power while disassembling the computer,
do not touch any connectors or other components due to the risk of electric
shock. Also, do not disassemble individual parts when performing routine
maintenance.
Warning:1. To prevent electric shock, turn off the power and unplug the AC adapter from
the power source.
2. As the battery installed to the computer is typically already charged, the risk
of electric shock remains even when the AC adapter is unplugged from the
socket. To prevent electric shock, always take off any metal jewelry or
accessories such as necklaces, bracelets or rings before working on the
computer. Never work with wet or moist hands.
3. Take care not to injury yourself on any edges or corners.
Caution: 1. Confirm that replacement parts have compatible specifications before
replacing on the computer. Never use incorrect parts as these may cause
faults on the computer.
2. To prevent internal damage such as short circuits or burning, do not allow
any screws, paper clips, or other metal objects to fall into the computer.
When removing screws, always replace with the same size screw. Ensure that
all screws are fully tightened. Loose screws may result in short circuits
leading to overheating, smoke or flame.
3. To prevent electric shock, check that you have disconnected all cables from a
part before removing the part.
4. When connecting to the AC power supply, use only an AC adapter and cable
approved by Toshiba.
5. To prevent electric shock, ensure that all replacement parts are compatible
with the computer and that all cables and connectors are securely connected.
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4.1 Overview
4 Replacement Procedures
Before You Begin
Take note of the following points before starting work. Always remove the AC adapter and
battery pack before commencing any of the procedures. The procedure for removing the
battery pack is described in section “4.2. Battery Pack”.
1. Do not disassemble the computer unless it is operating abnormally.
2. Use the designated tools.
3. Ensure that the environment for working on and storing parts does not contain any of
the following.
Dust or dirt
Static electricity
Extremely hot, cold, or humid conditions
4. Perform the diagnostic tests described in Chapter 2 to determine which FRU is the
cause of the fault.
5. Do not perform any unnecessary work. Always work in accordance with the
disassembly and re-assembly procedures in this manual.
6. Keep parts removed from the computer in a safe place away from the computer where
they will not be damaged or interfere with your work.
7. Disassembling requires the removal of a large number of screws. Keep removed
screws in a safe place such that you can determine which screws belong to which part.
8. When reassembling, ensure that you use the correct screws and fit parts in the correct
position. Screw sizes are noted in the text and figures.
9. As all parts have sharp edges and corners, take care not to cut yourself.
10. After replacing an FRU, check that the computer and replaced part operate correctly.
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4 Replacement Procedures
4.1 Overview
Disassembly Procedure
Three main types of cable connector are used.
•
•
•
Pressure plate connector
Spring connector
Normal pin connector
When disconnecting a pressure plate connector, lift up the tag on one side of the plastic
pressure plate on the connector and pull the cable out from the connector. When reconnecting
a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert
the cable into the connector. Press down on both sides of the pressure plate such that both
sides of the plate and connector are at the same height and that the cable is fixed in the
correct position. Pull the cable to ensure that it is securely connected. If the cable is
disconnected from the connector, reconnect it making sure that you lift the pressure plate
high enough to insert fully the cable.
For spring connectors, lifting up the stopper frees the cable and allows it to be pulled out. To
reconnect, hold the stopper in the up position and insert the cable, then lower the stopper to
secure the cable.
For back flip connectors, lifting up the flip plate frees the cable and allows it to be pulled out.
To reconnect, hold the flip plate in the up position and insert the cable, then lower the flip
plate to secure the cable.
Normal pin connectors are used for all other cables. Simply pull out or push in these
connectors to disconnect or reconnect.
Pressure plate connector
Spring connector
Back flip connector
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4.1 Overview
4 Replacement Procedures
Assembly Procedure
After the computer has been disassembled and the part that caused the fault has been repaired
or replaced, the computer must be reassembled.
Take note of the following general points when assembling the computer.
Take your time and follow the instructions carefully. Hurrying the assembly work
will only introduce new problems.
Check that all cables and connectors are securely connected.
Before fastening FRUs or other parts in place, ensure that no cables are caught on
screws or the FRU.
Check that all latches are securely closed.
Ensure that you have installed all FRUs correctly and do not have any screws left
over. Using an incorrect screw may damage the thread or screw head and result in the
FRU not being securely fastened in place.
After installing FRUs, check that the computer operates correctly.
Tools and Equipment
For your safety and the safety of the people around you, it is important that you use
Electrostatic Discharge (ESD) equipment. Correctly utilizing of the equipment increases the
percentage of successful repairs and saves on the cost of damaged or destroyed parts. The
following equipment is required for disassembly and assembly.
One Philips screwdriver with type 0 bit (for THIN HEAD screws)
One Philips screwdriver with type 1 bit (for screws other than above)
Tweezers (for lifting screws)
ESD mats (lay on work table or floor)
An ESD wrist strap and heel grounder
Anti-static carpet or flooring
A pair of needle-nose pliers
Air-ionizers in highly static sensitive areas
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4.1 Overview
Antenna coaxial cable disconnector
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4.1 Overview
4 Replacement Procedures
Screw Tightening Torque
Use the following torque when tightening screws.
Caution: Overtightening may damage screws or parts. Undertightening may allow screws
to loosen (and possibly fall out) causing a short circuit or other damage.
Note:To tighten screws quickly and accurately, an electric screwdriver is recommended.
M2 (2mm)
0.167 N•m (1.7 kgf •cm)
0.294 N•m(3.0 kgf•cm)
0.549 N•m(5.6 kgf•cm)
M2.5 (2.5mm)
M3 (3mm)
Note:To prevent damage to THIN HEAD screws, use type 0 pit philips screwdriver. Use,
however, the PH point size “1” screwdriver for screws fixing the expansion memory
slot cover and the keyboard. Press along the axis of the screwdriver while turning
the screw. This is because the contact area between the screw and driver is less than
for a pan head screw (standard pan-shaped screw head).
Grip Color
Some screws have a colored grip area to help you determine the length of the screw.
Even numbered length screws: Brown
Odd numbered length screws: White
Special length screw: Blue
“Special length screw” means screws whose length is indicated in an integral number to the
first decimal places such as 2.5 mm, 2.6 mm and so on.
Grip area
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4 Replacement Procedures
4.1 Overview
Screw Notation
To make maintenance of the computer easier, markings of the kinds of the screws including
the types and lengths of the screws are indicated on the computer body.
Format:
Screw shape + Screw length (mm)
Screw shape
B: Bind screw
F: Flat head screw
S: Super thin head screw
T: Tapping screw
U: Other screws (Unique screws: pan head, stud, etc.)
Example: B6 ... 6mm BIND screw
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4.2 Battery pack
4 Replacement Procedures
4.2 Battery pack
Removing the battery pack
The following describes the procedure for removing the battery pack. (See Figure 4-1.)
Caution: Take care not to short circuit the terminals when removing the battery pack.
Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery
pack.
1. Turn off the power of the computer.
2. Disconnect the AC adapter and all other external devices from the computer.
3. Turn the computer upside down.
4. Release the battery lock switch.
5. Pull out the battery pack while sliding the battery latch toward the arrow pointing.
Battery pack
Battery latch
Battery lock switch
Figure 4-1 Removing the battery pack
Note:Dispose of the used battery pack in accordance with the laws and ordinances of
your local authority.
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4 Replacement Procedures
4.2 Battery pack
Installing the battery pack
The following describes the procedure for installing the battery pack. (See Figure 4-1.)
Caution: There is a danger that the lithium ion battery pack may explode if not fitted,
operated, handled, or disposed correctly. Dispostickerways the used batteries
pack in accordance with the laws and ordinances of your local authority. Use
only the batteries approved by Toshiba.
Note:
Check visually the battery terminals and clean off any dirt with a dry cloth.
1. Turn off the power of the computer.
2. Disconnect the AC adapter and all other external devices from the computer.
3. Inset the connector of the battery pack to the connector of the computer. Press the
battery pack until the battery is locked.
4. Slide the battery lock into the lock position.
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4.3 PC card/SD card
4 Replacement Procedures
4.3 PC card/SD card
4.3.1 PC card
Removing the PC card
The following describes the procedure for removing the PC card. (See Figure 4-2.)
Caution: Insert or remove the PC card in accordance with any instructions in the PC
card manual or the manuals of the computer system you are using.
1. Turn the computer upside down.
2. Push the ejection button. It will pop out when you release it. Press it once more to
eject the PC card.
3. Pull out the PC card and remove it.
4. Push in the ejection button again.
Eject button
PC card
Figure 4-2 Removing the PC card
Installing the PC card
The following describes the procedure for installing the PC card. (See Figure 4-2.)
1. Make sure the eject button does not stick out.
2. Insert the PC card carefully to ensure a firm connection.
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4 Replacement Procedures
4.3 PC card/SD card
4.3.2 SD card
Removing the SD card
The following describes the procedure for removing the SD card. (See Figure 4-3.)
Caution: Insert or remove the SD card in accordance with any instructions in the SD card
manual or the manuals of the computer system you are using.
1. Push the SD card. It will pop out partly when you release, so pull out the card.
SD card
Figure 4-3 Removing the SD card
Installing the SD card
The following procedure describes the procedure for installing the SD card. (See Figure
4-3.)
1. Insert the SD card and press it until it securely connected.
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4.4 Memory module
4 Replacement Procedures
4.4 Memory module
Caution: The power must be turned off when you remove the memory module. Removing
the memory module with the power on risks damaging the module or the
computer itself.
Do not touch the memory module terminals. Any dirt on the terminals may cause
memory access problems.
Never press hard or bend the memory module.
Removing the memory module
To remove the memory module(s), confirm that the computer is in boot mode. Then perform
the following procedure. (See Figure 4-4.)
1. Turn the computer upside down.
2. Loosen the screw (with e-ring) fixing the memory slot cover.
3. Remove the memory slot cover.
4. Open the left and right latches and remove the memory module(s).
Memory slot cover
Screw (with e-ring)
Latch
Latch
Memory module
Figure 4-4 Removing the memory module
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4 Replacement Procedures
4.4 Memory module
Installing the memory module
To install the memory module(s), confirm that the computer is in boot mode. Then perform
the following procedure. (See Figure 4-4.)
1. Insert the memory module into the connector of the computer slantwise (terminal
side first) and press it to connect firmly.
Caution: The power must be turned off when you insert the memory module. Inserting the
memory module with the power on risks damaging the module or the computer
itself.
Never press hard or bend the memory module.
When installing the memory module, be careful not to insert the memory module
into the expansion memory slot (inner slot).
2. Install the memory slot cover.
3. Secure the screw (with e-ring) to fix the memory slot cover.
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4.5 HDD
4 Replacement Procedures
4.5 HDD
Removing the HDD
The following describes the procedure for removing the HDD. (See Figure 4-5 and 4-6.)
Caution: Take care not to press on the top or bottom of the HDD. Pressure may cause
data loss or damage to the device.
1. Turn the computer upside down.
2. Loosen the screw (with e-ring) fixing the HDD slot cover and remove the HDD slot
cover.
3. Pull out the HDD assembly from the connector CN1900 of HDD cable.
Note:When removing the HDD assembly, be careful not to tear the laminate. If the
laminate is torn, replace it with a new one.
HDD slot cover
Screw (with e-ring)
HDD assembly
CN1900
Figure 4-5 Removing the HDD FPC
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4 Replacement Procedures
4.5 HDD
4. Remove the following screws fixing the HDD holder.
• M3.0x4.0S
FLAT BIND screw
x4
5. Detach the HDD holder from the HDD.
HDD holder
(HDD frame and laminate)
M3.0x4.0S FLAT BIND
M3.0x4.0S
FLAT BIND
HDD
Figure 4-6 Removing the HDD holder
Installing the HDD
The following describes the procedure for installing the HDD. (See Figure 4-5 and 4-6.)
CAUTION: HDD frame and laminate can not be reused. If you detach the laminate
package from HDD frame, be sure to use a new HDD frame and laminate
package when replacing.
1. Install the HDD holder to the HDD and secure it with the following screws.
• M3.0x4.0S
FLAT BIND screw
x4
2. Connect the HDD to the connector CN1900 of the HDD cable.
3. Insert the HDD assembly into the HDD slot of computer.
4. Install the HDD slot cover and secure it with the screw (with e-ring).
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4.6 Selectable bay module
4 Replacement Procedures
4.6 Selectable bay module
Removing the selectable bay module
The following describes the procedure for removing the selectable bay module. (See Figure
4-7 and 4-8.)
1. Turn the computer upside down.
2. Move the following screw (if the screw is secured in the lock screw hole) from lock
position to unlock position.
• M2.5x4.0B
FLAT BIND screw
x1
3. Pull out the selectable bay module from the selectable bay while sliding the lever.
M2.5x4.0B FLAT BIND
Unlock position
Lock position
Lever
Selectable bay module
Figure 4-7 Removing the selectable bay module
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4 Replacement Procedures
4.6 Selectable bay module
4. Remove the following screws securing the plastic brace and the OD board and
remove them.
• M2.0x8.0S
BIND screw
x2
5. Remove the following screws securing the plastic frame and remove it.
• M2.0x3.0S
S-THIN FLAT BIND screw
x5
M2.0x3.0S
S-THIN FLAT BIND
Plastic frame
OD board
Plastic brace
M2.0x8.0S BIND
M2.0x3.0S S-THIN FLAT BIND
Figure 4-8 Removing the plastic frame
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4.6 Selectable bay module
4 Replacement Procedures
Installing the selectable bay module
The following describes the procedure for installing the selectable bay module. (See Figure
4-7 and 4-8.)
1. Install the plastic frame to the selectable bay module and secure them with following
screws.
• M2.0x3.0S
S-THIN FLAT BIND screw
x5
2. Install the OD board and plastic brace to the selectable bay module and secure them
with following screws.
• M2.0x8.0S
BIND screw
x2
3. Insert the selectable bay module into the selectable bay of the computer.
4. Turn the following screw (if you want to lock the selectable bay) from unlock
position to lock position.
• M2.5x4.0B
FLAT BIND screw
x1
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4 Replacement Procedures
4.7 Keyboard
4.7 Keyboard
Removing the keyboard
The following describes the procedure for removing the keyboard. (See Figure 4-9.)
1. Turn the computer face up.
2. Open the display.
3. Insert your nails in the slot of both sides of the keyboard holder and lift it up.
4. Remove the following screws securing the keyboard.
• M2.5x2.8B
FLAT BIND screw
x2
5. Lift the top edge of the keyboard and bring the edge to the front to lay on the
computer. Unlock the connector and disconnect the keyboard flexible cable from the
connector CN3230 on the system board.
6. Remove the keyboard.
Keyboard holder
M2.5x2.8B FLAT BIND
M2.5x2.8B
FLAT BIND
Keyboard
CN3230
Figure 4-9 Removing the keyboard
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4.7 Keyboard
4 Replacement Procedures
Installing the keyboard
The following describes the procedure for installing the keyboard. (See Figure 4-9.)
1. Put the keyboard on the palm rest as its face is down. Connect the keyboard flexible
cable to CN3230 on the system board and lock the connector.
Caution: 1. When replacing the keyboard with new one, adhere a sheet of insulator to
the back of keyboard in the position shown in the following figure.
2. Do not reuse the insulator adhered on the keyboard. Be sure to use new
one.
Insulator
2. Hook the bottom edge of the keyboard to the palm rest. Place the keyboard on the
computer and secure it with the following screws.
• M2.5x2.8B
FLAT BIND screw
x2
3. Fit to install the keyboard holder.
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4 Replacement Procedures
4.8 Bottom cover assembly
4.8 Bottom cover assembly
Removing the bottom cover assembly
The following describes the procedure for removing the bottom cover assembly. (See Figure
4-10 and 4-11.)
1. Disconnect the touch pad cable from the connector CN3240 on the system board.
CN3240
Touch pad cable
Figure 4-10 Removing the touch pad cable
2. Close the display and turn the computer upside down.
3. Remove the following screws securing the bottom cover assembly.
• M2.0x6.0B
FLAT BIND screw
FLAT BIND screw
x20 (Described as (6) in figure)
x2 (Described as (4) in figure)
• M2.0x4.0B
4. Pull up to remove the bottom cover assembly from the computer.
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4.8 Bottom cover assembly
4 Replacement Procedures
(4)
(6)
(6)
(6)
(6)
(6)
(6)
(6)
(4)
(6)
(6)
(6)
(6)
(6)
(6)
(6)
(6)
(6)
(6)
(6)
(6)
(6)
Figure 4-11 Removing the bottom cover assembly
Installing the bottom cover assembly
The following describes the procedure for installing the bottom cover assembly. (See Figure
4-10 and 4-11.)
1. Install the bottom cover assembly to the computer.
Note:Install the bottom cover assembly from the i.LINK (IEEE1394) slot first.
2. Secure the bottom cover assembly with the following screws
• M2.0x6.0B
FLAT BIND screw
x20 (Described as (6) in figure)
• M2.0x4.0B
S-THIN FLAT BIND screw x2 (Described as (4) in figure)
3. Turn over the computer and open the display.
4. Connect the touch pad cable to the connector CN3240 on the system board.
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4 Replacement Procedures
4.9 Battery latch assembly / Selectable bay lock
4.9 Battery latch assembly / Selectable bay lock
4.9.1 Battery latch assembly
Removing the battery latch assembly
The following describes the procedure for removing the battery latch assembly. (See Figure
4-12.)
1. Remove the following screw securing the battery latch assembly.
• M2.5x4.0B
FLAT BIND screw
x1
2. Pull up to remove the battery latch assembly from the bottom cover assembly.
M2.5x4.0B FLAT BIND
Battery latch assembly
Figure 4-12 Removing the battery latch assembly
Installing the battery latch assembly
The following describes the procedure for installing the battery latch assembly. (See Figure
4-12.)
1. Install the battery latch assembly to the bottom cover assembly.
2. Secure the battery latch assembly with the following screw.
• M2.5x4.0B
FLAT BIND screw
x1
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4.9 Battery latch assembly / Selectable bay lock
4 Replacement Procedures
4.9.2 Selectable bay lock
Removing the Selectable bay lock
The following describes the procedure for removing the selectable bay lock. (See Figure 4-
13.)
1. Release the tabs (2 points) and detach the Selectable bay lock A.
2. Remove the Selectable bay lock B from the bottom cover assembly.
Selectable bay lock B
Selectable bay lock A
tab
Figure 4-13 Removing the selectable bay lock
Installing the selectable bay lock
The following describes the procedure for installing the selectable bay lock. (See Figure 4-
13.)
1. Install the Selectable bay lock B to the bottom cover assembly and Selectable bay
lock A form the back, then hook the tabs (2 points).
Caution: Selectable bay lock has different shapes of tabs for each side (2 points).
Therefore, be sure to fit their shapes for installation.
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4 Replacement Procedures
4.10 QI button assembly / PC card slot brace
4.10 QI button assembly / PC card slot brace
4.10.1 QI button assembly
Removing the QI button assembly
The following describes the procedure for removing the QI button assembly. (See Figure 4-
14.)
1. Remove the following screw securing the QI button assembly and remove the QI
button assembly.
• M2.5x4.0B
FLAT BIND screw
x1
M2.5x4.0B FLAT BIND
QI button assembly
Figure 4-14 Removing the QI button assembly
Installing the QI button assembly
The following describes the procedure for installing the QI button assembly. (See Figure 4-
14.)
1. Install the QI button assembly to the slot of bottom cover assembly and secure it
with the following screw.
• M2.5x4.0B
FLAT BIND screw
x1
Note:When installing the QI button assembly, be sure to fit the button portion to the slot
of bottom cover assembly.
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4.10 QI button assembly / PC card slot brace
4 Replacement Procedures
4.10.2 PC card slot brace
Removing the PC card slot brace
The following describes the procedure for removing the PC card slot brace. (See Figure 4-
15.)
1. Remove the following screws securing the PC card slot brace and remove the PC
card slot brace.
• M2.5x4.0B
FLAT BIND screw
x2
M2.5x4.0B FLAT BIND
PC card slot brace
Figure 4-15 Removing the PC card slot brace
Installing the PC card slot brace
The following describes the procedure for installing the PC card slot brace. (See Figure
4-15.)
1. Install the PC card slot brace to the bottom cover assembly.
2. Secure the PC card slot brace with the following screws.
• M2.5x4.0B
FLAT BIND screw
x2
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4 Replacement Procedures
4.11 Bluetooth module
4.11 Bluetooth module
Removing the Bluetooth module
To remove the Bluetooth module, follow the steps below. (See Figure 4-16.)
CAUTION: Do not try to remove the Bluetooth module with the computer turned on.
You can damage the computer or Bluetooth module. Do not touch the
connectors on the Bluetooth module on the computer. Debris on the
connectors may cause Bluetooth access problems.
1. Remove the following screw to remove the Bluetooth module.
•
M2×3S
S-FLAT HEAD screw
×1
2. Disconnect the Bluetooth cable (black) from the Bluetooth module using an antenna
coaxial cable disconnector.
3. Disconnect the flexible cable from the Bluetooth module.
Flexible cable
M2×3S S-FLAT HEAD
Bluetooth module
Bluetooth cable
Figure4-16 Removing the Bluetooth module
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4.11 Bluetooth module
4 Replacement Procedures
Installing the Bluetooth module
To install the Bluetooth module, follow the steps below. (See Figure 4-16.)
1. Connect the flexible cable to the Bluetooth module.
2. Connect the Bluetooth cable (black) to the Bluetooth module.
3. Secure the Bluetooth module with the following screw.
•
M2×3S
S-FLAT HEAD screw
×1
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4 Replacement Procedures
4.12 MDC / Modem cable
4.12 MDC / Modem cable
Removing the MDC / Modem cable
The following describes the procedure for removing the MDC / Modem cable. (See Figure 4-
17 and 4-18.)
1. Remove the following screws securing the MDC.
• M2.0x4.0Z
BIND screw
x2
2. Pull up the MDC straight and remove it from the connector CN3000 on the system
board.
3. Disconnect the Modem cable from the connector of MDC.
M2.0x4.0Z BIND
MDC
Modem cable
CN3000
Figure 4-17 Removing the MDC
4. Pull out the Modem cable from the guide of mini PCI cover.
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4.12 MDC / Modem cable
4 Replacement Procedures
5. Remove the following screw and disconnect the drain cable 1 from the stud of
system board.
• M2.0x4.0Z
BIND screw
or
x1
x1
• M2.0x4.0B
LH STICK
6. Peel off the glass tape and open the insulators and pull out the Modem cable from
the insulators.
7. Remove the following screw and disconnect the drain cable 2 from the stud of hinge
assembly.
• M2.0x4.0Z
BIND screw
x1
8. Disconnect and remove the Modem cable from the connector CN3001 on the system
board.
Modem cable
CN3001
Glass Tape
M2.0x4.0Z BIND
or
M2.0x4.0B LH STICK
Insulator
M2.0x4.0Z
BIND
Drain cable 1
Drain cable 2
Figure 4-18 Removing the Modem cable
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4 Replacement Procedures
4.12 MDC / Modem cable
Installing the MDC / Modem cable
The following describes the procedure for installing an MDC / Modem cable. (See Figure 4-
17 and 4-18.)
1. Connect the Modem cable to the connector CN3001 on the system board.
2. Secure the drain cable 2 to the stud of hinge assembly with the following screw.
• M2.0x4.0Z
BIND screw
x1
3. Arrange the Modem cable inside the insulators and close the insulators.
4. Arrange the Modem cable along the guide of mini PCI cover.
5. Secure the drain cable 1 to the stud of system board with the following screw.
• M2.0x4.0Z
or
BIND screw
x1
• M2.0x4.0B
LH STICK
x1
6. Connect the Modem cable to the connector of MDC.
7. Install the MDC to the connector CN3000 on the system board and secure it with the
following screws.
• M2.0x4.0Z
BIND screw
x2
8. Stick the glass tape on the Modem cable.
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4.13 Wireless LAN card
4 Replacement Procedures
4.13 Wireless LAN card
Removing the Wireless LAN card
The following describes the procedure for removing the Wireless LAN card. (See Figure 4-
19.)
1. Disconnect the speaker cable from the connector CN6150 on the system board and
pull out the cable from the guide of mini PCI cover.
2. Remove the following screws securing the mini PCI cover and remove the mini PCI
cover.
• M2.0x4.0Z
BIND screw
x1
3. Disconnect the wireless LAN antenna cables from the connectors on the wireless
LAN card.
4. Open the left and right latches securing the wireless LAN card and remove the
wireless LAN card from the connector of mini PCI.
M2.0x4.0Z BIND
Mini PCI cover
Speaker cable
CN6150
Wireless LAN card
Figure 4-19 Removing the Wireless LAN card
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4 Replacement Procedures
4.13 Wireless LAN card
Installing the Wireless LAN card
The following describes the procedure for removing the wireless LAN card. (See Figure 4-
19.)
1. Insert the wireless LAN card slantwise into the connector of mini PCI. Press the
wireless LAN card until it hooks surely.
2. Connect the wireless LAN antenna cables to the connectors of wireless LAN card.
(White cable to MAIN connector, Black cable to AUX connector)
3. Secure the mini PCI cover with the following screws.
• M2.0x4.0Z
BIND screw
x1
4. Arrange the speaker cable along the guide of mini PCI cover and connect the speaker
cable to the connector CN6150 on the system board.
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4.14 Fan/CPU
4 Replacement Procedures
4.14 Fan/CPU
4.14.1 Fan (Fan0 / Fan1)
Removing the Fan0 / Fan1
The following describes the procedure for removing the fan. (See Figure 4-20.)
1. Disconnect the fan cable from the connector CN8770 (for fan0)/CN8780 (for fan1)
on the system board.
2. Remove the following screws securing the fan and remove the Fan0 / Fan1.
• M2.5x4.0B
FLAT BIND screw
x2 (each)
Guide
M2.5x4.0B
FLAT BIND
M2.5x4.0B FLAT BIND
Fan1
Fan0
CN8770
CN8780
Figure 4-20 Removing the fan
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4 Replacement Procedures
4.14 Fan/CPU
Installing the Fan0 / Fan1
The following describes the procedure for installing the fan. (See Figure 4-20.)
1. Install the fan while fitting the screw holes and secure it with the following screws.
• M2.5x4.0B
FLAT BIND screw
x2 (each)
2. Hook the fan cable to the guide and connect it to the connector CN8770 (for
Fan0)/CN8780 (for Fan1) on the system board.
Caution: When laying the fan cable, be careful on the points shown in the following
figure.
Bring the remaining cable
to the connector portion.
Do not let the wire out of
the memory connector
side.
Fix the cables with a glass tape so that they
could not be on top of each other.
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4.14 Fan/CPU
4 Replacement Procedures
4.14.2 CPU
Removing the CPU
The following describes the procedure for removing the CPU. (See Figure 4-21 and 4-22.)
1. Remove the following screws securing the CPU hold plate in the reverse order of the
number (3→1) on the CPU hold plate and remove the CPU hold plate.
• M2.0x4.0B
BIND screw
x3
2. Remove the heat sink on the CPU.
M2.0x4.0B BIND
M2.0x4.0B BIND
Heat sink
CPU hold plate
Figure 4-21 Removing the heat sink
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4 Replacement Procedures
4.14 Fan/CPU
3. Unlock the CPU by rotating counterclockwise the cam on the CPU socket by 180
degrees with a flat-blade driver.
Figure 4-22 Removing the CPU
4. Remove the CPU.
Installing the CPU
The following describes the procedure for installing the CPU. (See Figure 4-21 to 4-23.)
1. Make sure that the cam of the CPU socket is in the unlock (OPEN) position.
2. Install the CPU on the CPU socket and check the CPU is installed on the right
position.
3. Lock the CPU by rotating clockwise the cam on the CPU socket by 180 degrees with
a flat-blade driver.
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4.14 Fan/CPU
4 Replacement Procedures
4. If there is already silicon grease on the CPU and FIN, clean it with a cloth.
Using a special applicator, apply silicon grease so that the CPU chip on the CPU is
completely covered.
Note: Apply the silicon grease enough to cover the chip surface using the
special applicator.
Figure 4-23 Applying silicon grease
5. Install the heat sink on the CPU.
6. Install the CPU hold plate and secure it with the following screws in the order of the
number (1→3) on the CPU hold plate.
• M2.0x4.0B
BIND screw
x3
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4 Replacement Procedures
4.15 DC-IN jack
4.15 DC-IN jack
Removing the DC-IN jack
The following describes the procedure for removing the DC-IN jack. (See Figure 4-24.)
1. Pull up the DC-IN jack straight from the slot of cover assembly.
2. Disconnect the DC-IN jack from the connector CN8800 on the system board
DC-IN jack
CN8800
Figure 4-24 Removing the DC-IN jack
Installing the DC-IN jack
The following describes the procedure for installing the DC-IN jack. (See Figure 4-24.)
1. Connect the DC-IN jack to the connector CN8800 on the system board.
2. Install the DC-IN jack by fitting guide of slot of cover assembly.
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4.16 Penholder / RTC battery
4 Replacement Procedures
4.16 Penholder / RTC battery
4.16.1 Penholder
Removing the Penholder
The following describes the procedure for removing the Penholder. (See Figure 4-25.)
1. Disconnect the RTC batter cable from the connector CN9990 on the system board.
2. Remove the following screws securing the Penholder and remove the Penholder
from the cover assembly.
• M2.0x4.0B
FLAT BIND screw
x2
M2.0x4.0B FLAT BIND
Penholder
RTC battery cable
CN9990
Figure 4-25 Removing the Penholder
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4 Replacement Procedures
4.16 Penholder / RTC battery
Installing the Penholder
The following describes the procedure for installing the Penholder. (See Figure 4-25.)
1. Install the Penholder to the cover assembly and secure it with the following screws.
• M2.0x4.0B
FLAT BIND screw
x2
Caution: When installing the Penholder, be careful not to catch the wireless LAN antenna
cables and speaker cable arranged on the cover assembly.
2. Connect the RTC batter cable to the connector CN9990 on the system board.
4.16.2 RTC battery
Removing the RTC battery
The following describes the procedure for removing the RTC battery. (See Figure 4-26.)
1. Pull out the RTC batter cable from the guide of Penholder.
2. Remove the RTC battery from the slot of Penholder.
RTC battery
RTC battery cable
Penholder
Figure 4-26 Removing the RTC battery
Installing the RTC battery
The following describes the procedure for installing the RTC battery. (See Figure 4-26.)
1. Install the RTC battery to the slot of Penholder.
2. Arrange the RTC battery cable to the guide of Penholder.
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4 Replacement Procedures
4.17 LCD harness holder
4
Replacement Procedures
4.17 LCD harness holder
Removing the LCD harness holder
The following describes the procedure for removing the LCD harness holder. (See Figure 4-
27.)
1. Disconnecting the USB harness from the connector CN4612 on the system board and
from CN4621 on the CN board, turn up the insulator and pull out the USB harness
from the guide of LCD harness holder.
2. Disconnect the LCD harness from the connector CN5501 on the system board and
pull out the LCD harness from the LCD harness holder.
3. Disconnecting the CN board harness from the connector CN9502 on the system
board and from the connector CN9520 on the CN board, pull out the CN board
harness from the guide of LCD harness holder.
4. Disconnecting the QI board cable from the connector CN9521 on the CN board and
from the connector CN9530 on the QI board, pull out the QI board cable from the
guide of LCD harness holder.
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4.17 LCD harness holder
4 Replacement Procedures
5. Remove the following screws securing and remove the LCD harness holder.
• M2.5x6.0B FLAT BIND screw
x2
QI board cable
CN9521
CN9530
Insulator
CN board harness
(Connected to CN9502)
M2.5x6.0B
FLAT BIND
USB harness
(to CN4612)
LCD harness
(Connected to CN5501)
CN board harness
(to CN9520)
USB harness
(Connected to CN4621)
Figure 4-27 Removing the LCD harness holder
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4 Replacement Procedures
4.17 LCD harness holder
Installing the LCD harness holder
The following describes the procedure for installing the LCD harness holder (See Figure 4-
27).
1. Install the LCD harness holder to the cover assembly by fitting the boss and secure
it with the following screws.
• M2.5x6.0B FLAT BIND screw
x2
2. Connecting the QI board cable to the connector CN9521 on the CN board and to the
connector CN9530 on the QI board, arrange the QI board cable along the guide of
LCD harness holder.
3. Connecting the CN board harness to the connector CN9502 on the system board and
to the connector CN9520 on the CN board, arrange the CN board harness along the
guide of LCD harness holder.
NOTE: When connecting the CN board harness, make sure that the connector with core
side is connected to the CN board.
4. Connect the LCD harness to the connector CN5501 on the system board and arrange
the LCD harness along the guide of LCD harness holder.
5. Connecting the USB harness to the connector CN4612 on the system board and to
the connector CN4621 on the CN board, arrange the USB harness along the guide of
LCD harness holder under the insulator.
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4.18 Mic (L) cable guide
4 Replacement Procedures
4.18 Mic (L) cable guide
Removing the Mic (L) cable guide
The following describes the procedure for removing the Mic (L) cable guide. (See Figure 4-
28.)
1. Disconnect the Mic (L) cable from the connector CN6060 on the system board and
pull it out from the Mic (L) cable guide.
2. Disconnect the HDD cable from the connector CN1900 on the system board.
3. Remove the following screws and Mic (L) cable guide.
• M2.5x6.0B FLAT BIND screw
x2
M2.5x6.0B
FLAT BIND
HDD cable
Mic. L cable guide
M2.5x6.0B
FLAT BIND
CN6060
Mic. L cable
CN1900
Figure 4-28 Removing the Mic (L) cable guide
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4 Replacement Procedures
4.18 Mic (L) cable guide
Installing the Mic (L) cable guide
The following describes the procedure for installing Mic (L) cable guide (See Figure 4-28).
1. Connect the HDD cable from the connector CN1900 on the system board.
Caution: When laying the HDD cable, be careful on the points shown in the following
figure.
Fix the mated portion
with a sheet of insulator.
Let not the cables out of the
guides.
2. Install the Mic (L) cable guide to the system board and secure it with the following
screws.
• M2.5x6.0B FLAT BIND screw
x1
3. Connecting the Mic (L) cable to the connector CN6060 on the system board, arrange
the cable along the Mic (L) cable guide.
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4.19 QI board / CN board
4 Replacement Procedures
4.19 QI board / CN board
4.19.1 QI board
Removing the QI board
The following describes the procedure for removing the QI board. (See Figure 4-29.)
1. Remove the following screws securing the QI board.
• M2.5x6.0B FLAT BIND screw
x1
2. Pull up the QI board straight and remove the QI board from the cover assembly.
M2.5x6.0B FLAT BIND
QI board
Figure 4-29 Removing the QI board
Installing the QI board
The following describes the procedure for installing the QI board. (See Figure 4-29.)
1. Install the QI board to the cover assembly and secure it with the following screws.
• M2.5x6.0B FLAT BIND screw
x1
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4 Replacement Procedures
4.19 QI board / CN board
4.19.2 CN board
Removing the CN board
The following describes the procedure for removing the CN board. (See Figure 4-30.)
1. Remove the following screws securing the CN board.
• M2.5x6.0B FLAT BIND screw
x2
2. Pull up to remove the CN board from the cover assembly.
M2.5x6.0B FLAT BIND
CN board
Figure 4-30 Removing the CN board
Installing the CN board
The following describes the procedure for installing the CN board. (See Figure 4-30.)
1. Install the CN board to the cover assembly and secure it with the following screws.
• M2.5x6.0B FLAT BIND screw
x2
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4.19 QI board / CN board
4 Replacement Procedures
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4 Replacement Procedures
4.20 System board
4.20 System board
Removing the system board
The following describes the procedure for removing the system board. (See Figure 4-31.)
1. Disconnect the Mic (R) cable from the connector CN6061 on the system board
2. Disconnect the rotation sensor cable from the connector CN3280 on the system
board
3. Disconnect the digitizer cable from the connector CN9540 on the system board
4. Remove the following screws securing the system board.
• M2.5x6.0B FLAT BIND screw
x1
5. Remove the system board from the cover assembly while pulling it up toward arrow
pointing.
Rotation sensor cable
(Connected to CN3280)
M2.5x6.0B FLAT BIND
Mic (R) cable
(Connected to CN6061)
Digitizer cable
(to CN9540)
System board
Figure 4-31 Removing the system board
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4.20 System board
4 Replacement Procedures
Installing the system board
The following describes the procedure for installing the system board. (See Figure 4-31.)
1. Install the system board to the cover assembly and secure it with the following screw.
• M2.5x6.0B FLAT BIND screw
x1
NOTE: When installing the system board, be careful not to catch the Mic (L&R) cable,
rotation sensor cable and digitizer cable between the system board and cover
assembly. Also confirm that these cables are not hidden under the system board.
2. Connect the digitizer cable to the connector CN9540 on the system board.
3. Connect the rotation sensor cable to the connector CN3280 on the system board.
4. Connect the Mic (R) cable to the connector CN6061 on the system board.
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4 Replacement Procedures
4.21 PC card slot cover
4.21 PC card slot cover
Removing the PC card slot cover
The following describes the procedure for removing the PC card slot cover. (See Figure 4-
32.)
1. Lift the insulator and remove the following screws securing the PC card slot cover.
• M2.0x3.0S S-THIN FLAT BIND screw
x2
2. Release the hook (2 points) and remove the PC card slot cover.
M2.0x3.0S
S-THIN FLAT BIND
Insulator
Hook
PC card slot cover
Figure 4-32 Removing the PC card slot cover
Installing the PC card slot cover
The following describes the procedure for installing the PC card slot cover. (See Figure 4-
32.)
1. Secure the hook (2 points) and install the PC card slot cover.
2. Secure the PC card slot cover with the following screws.
• M2.0x3.0S S-THIN FLAT BIND screw
x2
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4.22 Speaker
4 Replacement Procedures
4.22 Speaker
Removing the speaker
The following describes the procedure for removing the speaker. (See Figure 4-33.)
1. Turn up the guide insulator.
2. Pull out the speaker cable from the ferrite sheet of cover assembly.
3. Pull out the speaker from the slot of cover assembly.
Guide insulator
Speaker (R)
<White & Green cable>
Guide insulator
Speaker cable
Ferrite sheet
Speaker (L)
<Red & Black cable>
Figure 4-33 Removing the speaker
Installing the speaker
The following describes the procedure for installing the speaker. (See Figure 4-33.)
1. Install the speaker to the slot of cover assembly.
NOTE: When installing the speaker, confirm the right installation of right and left
speaker. (Right = White and Green cable, Left = Red and Black cable).
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4 Replacement Procedures
4.22 Speaker
2. Arrange the speaker cable along the guide insulator.
Caution: Arrange the speaker cable as shown in the following figure. Do not let the
cables out of the frame rib.
Insert the two cables of antennas into the two ferrite-sheets and let them within
the rib.
Antenna cable
Ferrite sheet
3. Stick the guide insulator over the guide of speaker cable.
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4.23 Microphone / Front panel
4 Replacement Procedures
4.23 Microphone / Front panel
4.23.1 Microphone
Removing the microphone
The following describes the procedure for removing the microphone. (See Figure 4-34.)
1. Remove the following screws securing the both right and left Mic holder.
• M2.5x4.0B FLAT BIND screw
x2 (x1 for each side)
2. Pull up the Mic holder straight and remove the mic holder from the cover assembly.
3. Remove the microphone from the slot of cover assembly.
M2.5x4.0B FLAT BIND
Microphone
Mic holder (R)
M2.5x4.0B FLAT BIND
Mic holder (L)
Figure 4-34 Removing the microphone
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4 Replacement Procedures
4.23 Microphone / Front panel
Installing the microphone
The following describes the procedure for installing the microphone. (See Figure 4-34.)
1. Fitting the microphone to the shapes of slot, install the microphone to the cover
assembly.
2. Install the Mic holder to the cover assembly while fitting it to the slit of cover
assembly and secure them with the following screws.
• M2.5x4.0B FLAT BIND screw
x2 (x1 for each side)
4.23.2 Front panel
Removing the front panel
The following describes the procedure for removing the front panel. (See Figure 4-35.)
1. Remove the following screws and front panel from the cover assembly.
• M2.5x6.0B FLAT BIND screw
x2
2. Detach the display latch from the front panel.
M2.5x6.0B FLAT BIND
Front panel
Display latch
Figure 4-35 Removing the front panel
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4.23 Microphone / Front panel
4 Replacement Procedures
Installing the front panel
The following describes the procedure for installing the front panel. (See Figure 4-35.)
1. Install the display latch to the front panel.
2. Install the front panel to the cover assembly and secure it with the following screws.
• M2.5x6.0B FLAT BIND screw
x2
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4 Replacement Procedures
4.24 Lens holder
4.24 Lens holder
Removing the lens holder
The following describes the procedure for removing the lens holder. (See Figure 4-36.)
1. Remove the following screw securing the lens holder.
• M2.5x4.0B S-THIN FLAT BIND screw
x1
2. Remove the lens holder from the cover assembly.
M2.5x4.0B S-THIN FLAT BIND
Lens holder
Figure 4-36 Removing the lens holder
Installing the lens holder
The following describes the procedure for installing the lens holder. (See Figure 4-36.)
1. Install the lens holder to the cover assembly.
2. Secure the lens holder with the following screw.
• M2.5x4.0B S-THIN FLAT BIND screw
x1
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4.25 Touch pad
4 Replacement Procedures
4.25 Touch pad
Removing the touch pad
The following describes the procedure for removing the touch pad. (See Figure 4-37.)
1. Peel the insulator.
2. Remove the following screws securing the touch pad.
• M2.0x4.0S S-THIN FLAT BIND screw
x2
3. Remove the touch pad holder and touch pad from the cover assembly.
4. Peel off the glass tape and disconnect the touch pad cable from the touch pad.
M2.0x4.0B S-THIN FLAT BIND
Glass tape
Touch pad cable
Touch pad
Touch pad holder
Figure 4-37 Removing the touch pad
Installing the touch pad
The following describes the procedure for installing the touch pad (See Figure 4-37.).
1. Connect the touch pad cable to the touch pad and stick the glass tape.
2. Install the touch pad and touch pad holder to the cover assembly.
3. Secure the touch pad with the following screws and stick the insulator.
• M2.0x4.0B S-THIN FLAT BIND screw
x2
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4 Replacement Procedures
4.26 LCD unit & FL inverter
4.26 LCD unit & FL inverter
Removing the LCD unit & FL inverter
The following describes the procedure for removing the LCD unit & FL inverter. (See Figure
4-38 to 4-41.)
NOTE: When replacing the LCD unit, do not give the hinge portion a strong press. It may
cause the breakage of the hinge assembly.
Also, Use a stand or something under the LCD part to keep the LCD part level
while replacing it.
1. Peel off the mask seals (6 points) from the LCD mask.
2. Remove the following screws securing the LCD mask.
• M2.5x6.0S FLAT BIND screw
x6
3. Laying down the LCD unit and the cover assembly flat, release the latches to remove
the LCD mask.
4. Remove the cross function button from the application switch board.
NOTE: When removing the LCD mask, be careful not to lose the cross function button
because the button is easily removed.
Cross function button
LCD mask
M2.5x6.0S FLAT BIND
M2.5x6.0S FLAT BIND
Figure 4-38 Removing the LCD mask
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4.26 LCD unit & FL inverter
4 Replacement Procedures
5. Turn up the insulator and disconnect the HV cable from the connector of FL inverter.
6. Remove the following screws securing the LCD unit.
• M2.5x4.0B FLAT BIND screw
x4
7. With the bottom edge of the LCD unit on the display cover, raise the top edge of the
LCD unit.
NOTE: When putting the LCD unit on the display cover, lay a mat or something under the
LCD unit to protect the computer and the LCD from a scratch or breakage.
8. Peeling off the copper tape and glass tape and disconnect the LCD harness and
digitizer harness from the connectors on the back of LCD unit.
9. Remove the LCD unit from the display cover.
M2.5x4.0B FLAT BIND
Glass tape
Insulator
M2.5x4.0B
FLAT BIND
HV cable
LCD harness
Digitizer harness
Copper
tape
M2.5x4.0B FLAT BIND
Figure 4-39 Removing the LCD unit
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4 Replacement Procedures
4.26 LCD unit & FL inverter
10. Remove the following screws securing the LCD unit holder.
• M2.5x4.0S FLAT BIND screw
x8
M2.5x4.0SFLAT BIND
M2.5x4.0S
FLAT BIND
Figure 4-40 Removing the LCD unit holder
11. Pull up the FL inverter while peeling off the double-sided tape.
CAUTION: The removed FL inverter is not reusable. Therefore when installing the FL
inverter, it must be a new one.
12. Disconnect the inverter harness and remove the FL inverter from the display cover.
FL inverter
Inverter harness
Figure 4-41 Removing the FL inverter
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4.26 LCD unit & FL inverter
4 Replacement Procedures
Installing the LCD unit & FL inverter
The following describes the procedure for installing the LCD unit & FL inverter. (See Figure
4-38 to 4-41.)
1. Connecting the inverter harness to the connector of FL inverter, install the FL
inverter to the display cover.
CAUTION: The FL inverter once removed from the computer is not reusable. When
installing the FL inverter, be sure to use a new one.
2. Install the following screws securing the LCD unit holder.
• M2.5x4.0S FLAT BIND screw
x8
3. Standing the LCD unit on the display cover, connect digitizer harness and LCD
harness on the back of LCD unit.
4. Stick the copper tape and glass tapes on the each connector.
5. Install the LCD unit on the display cover and secure it with the following screws.
• M2.5x4.0B FLAT BIND screw
x4
6. Connect the HV cable to the connector of FL inverter and stick the insulator.
7. Set the cross function button to the application switch board by fitting the cross slit
of the button.
8. Install the LCD mask to the display cover while securing the latches.
NOTE: When installing the LCD mask, wipe the LCD with a soft cloth and make the back
of the LCD mask clean with an ionizer.
And also, confirm that the cross function button is installed.
9. Secure the LCD mask with the following screws and stick the mask seals (6 points).
• M2.5x6.0S FLAT BIND screw
x6
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4 Replacement Procedures
4.27 Application switch board
4.27 Application switch board
Removing the application switch board
The following describes the procedure for removing the application switch board. (See
Figure 4-42.)
1. Remove the following screws securing the application switch board and pull up the
application switch board.
• M2.5x4.0B FLAT BIND screw
x1
2. Disconnect the switch harness from the connector CN9510 on the application switch
board.
M2.5x4.0B FLAT BIND
Switch harness
Application switch board
CN9510
Figure 4-42 Removing the application switch board
Installing the application switch board
The following describes the procedure for installing the application switch board. (See Figure
4-42.)
1. Connect the switch harness to the connector CN9510 on the application switch board.
2. Install the application switch board to the display cover and secure it with the
following screws.
• M2.5x4.0B FLAT BIND screw
x1
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4.28 LCD latch assembly
4 Replacement Procedures
4.28 LCD latch assembly
Removing the LCD latch assembly
The following describes the procedure for removing the LCD latch assembly. (See Figure 4-
43.)
1. Remove the following screw and LCD latch assembly from the display cover.
• M2.5x4.0B FLAT BIND screw
x1
LCD latch assembly
M2.5x4.0B FLAT BIND
Figure 4-43 Removing the LCD latch assembly
Installing the LCD latch assembly
The following describes the procedure for installing the LCD latch assembly. (See Figure 4-
43.)
1. Install the LCD latch assembly and secure it with the following screw.
• M2.5x4.0B FLAT BIND screw
x1
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4 Replacement Procedures
4.29 Digitizer
4.29 Digitizer
Caution: Read following instructions before handling the Digitizer.
Do not carry the LCD module by holding the FL cable in one’s hand because it may result
to cut the FL cable, and cause display function failure or lighting failure.
Be careful to use the bezel guide.
There is a portion where the bezel is sticking out because of the digitizer guide. Do not
press and rub the portion with bare hands or it may result cut your finger.
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4.29 Digitizer
4 Replacement Procedures
Do not make any scratches on the B/L and TAB by the edge of the digitizer when installing
the digitizer because it may result to break the TAB or make scratches on the B/L and
cause display function failure.
Do not pull up the PCB hardly when installing the digitizer because it may result to give
stress on the TAB or PCB and cause the display function failure.
Make sure that three latches fit the digitizer securely.
If the latches are not locked securely, it may result to move the digitizer and give stress on
the TAB or PCB and cause the display function failure.
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4 Replacement Procedures
4.29 Digitizer
Do not turn up the digitizer because it may result to give stress on the TAB or PCB and
cause the display function failure.
Do not put any instrument on the LCD module because it may result to make scratch on
the cell, polarization sheet or B/L and break the TAB and may cause the display function
failure.
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4.29 Digitizer
4 Replacement Procedures
Do not hold, press and rub the TAB because it may result to break the TAB and cause the
display function failure.
Make sure to put the LCD module on the flat place. If the LCD module is put on the
uneven place, it may result to break the TAB, make scratch on the B/L or polarization
sheet and cause the display function failure.
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4 Replacement Procedures
4.29 Digitizer
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4.29 Digitizer
4 Replacement Procedures
Removing the Digitizer
The following describes the procedure for removing the digitizer. (See Figure 4-44.)
1. Remove the following screws securing the digitizer.
• M2.0x3.0Z BIND screw
x3
2. Slide out the digitizer toward the arrow pointing.
M2.0x3.0Z BIND
M2.0x3.0Z BIND
Digitizer
Figure 4-44 Removing the digitizer
Installing the digitizer
The following describes the procedure for installing the digitizer. (See Figure 4-44.)
1. Slide the digitizer into the back pocket of LCD.
Caution: When replacing the digitizer, fit the digitizer into the back of LCD toward the
arrow pointing.
2. Secure the digitizer with the following screws.
• M2.0x3.0Z BIND screw
x3
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4 Replacement Procedures
4.30 LCD harnesses & Wireless LAN/Bluetooth antennas
4.30 LCD harnesses & Wireless LAN/Bluetooth antennas
Removing the LCD harnesses & Wireless LAN/Bluetooth antennas
The following describes the procedure for removing the LCD harness & wireless
LAN/Bluetooth antennas. (See Figure 4-45 and 4-46.)
1. Pull out the wireless LAN antenna cables / Bluetooth antenna cable from the guide.
2. Remove the following screws and LCD harness holder.
• M2.5x2.8B FLAT BIND screw
x1
3. Remove the following screws and digitizer harness holder.
• Unique screw
• M2.5x6.0S PSP TIGHT screw
4. Remove the following screws securing the hinge assembly.
CPU stud screw
x1
x1
• M2.5x6.0B FLAT BIND screw
• M2.5x6.0S PSP TIGHT screw
x1
x1
5. Remove the hinge rear cover from the hinge assembly.
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4.30 LCD harnesses & Wireless LAN/Bluetooth antennas
4 Replacement Procedures
6. Detach the cover assembly from the display cover.
LCD harness holder
M2.5x6.0B FLAT BIND
M2.5x2.8B FLAT BIND
M2.5x6.0S PSP TIGHT
Glass tape
M2.5x6.0S PSP TIGHT
CPU stud
Digitizer harness holder
Hinge assembly
Hinge rear cover
Figure 4-45 Removing the cover assembly
7. Remove the LCD harness ground plate from the display cover.
8. Remove the following screws and LCD harness hold plate from the display cover.
• M2.5x6.0B FLAT BIND screw
9. Remove the following screws securing the hinge assembly.
• M2.5x6.0B FLAT BIND screw
x2
x2
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4 Replacement Procedures
4.30 LCD harnesses & Wireless LAN/Bluetooth antennas
10. Detaching the hinge assembly from the display cover, remove the hinge cap from the
hinge assembly.
M2.5x6.0B FLAT BIND
LCD harness
LCD harness ground plate
hold plate
M2.5x6.0B FLAT BIND
Hinge cap
LCD harness
Digitizer harness
Figure 4-46 Removing the hinge assembly
11. Pull out the LCD harness through the hole of hinge assembly.
12. Pull out the digitizer harness through the hole of hinge assembly
13. Pull out the wireless LAN antenna cables/Bluetooth antenna cable through the
hole of hinge assembly
14. Peel off seven acetate tapes on the cables.
15. Peel off the acetate tapes and wireless LAN antennas/Bluetooth antenna and
remove them from the display cover.
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4.30 LCD harnesses & Wireless LAN/Bluetooth antennas
4 Replacement Procedures
Installing the LCD harnesses & Wireless LAN/Bluetooth antennas
The following describes the procedure for installing the LCD harness & wireless
LAN/Bluetooth antennas (See Figure 4-45 to 4-47.)
1. Stick the wireless LAN antennas / Bluetooth antenna on the display cover and
arrange their cables.
2. Stick the acetate tape (10 points) on the display cover.
Acetate tape
Wireless LAN antenna
Bluetooth antenna
Acetate tape
Acetate tape
Figure 4-47 Arranging the wireless LAN antenna cables
3. Pass the LCD harness through the hole of hinge assembly.
4. Pass the digitizer harness through the hole of hinge assembly.
5. Pass the wireless LAN antenna cables/Bluetooth antenna cable through the hole of
hinge assembly.
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4 Replacement Procedures
4.30 LCD harnesses & Wireless LAN/Bluetooth antennas
6. Installing the hinge cap to the hinge assembly, secure the hinge assembly to the
display cover with the following screws.
• M2.5x6.0B FLAT BIND screw
x2
Caution: Before installing the hinge cap, confirm the right arrangement of each harnesses
and cables.
7. Arranging the LCD harness on the display cover, secure the LCD harness hold plate
with the following screws.
• M2.5x6.0B FLAT BIND screw
x2
8. Arranging the digitizer harness on the display cover, install the digitizer harness
ground plate.
9. Install the cover assembly and hinge rear cover to the display cover.
10. Secure the cover assembly to the hinge assembly with the following screws.
• M2.5x6.0B FLAT BIND screw
x1
x1
• M2.5x6.0S PSP TIGHT screw
11. Install the digitizer harness holder to the hinge assembly and secure it with the
following screws.
• Unique screw CPU stad
x1
x1
• M2.5x6.0S PSP TIGHT screw
12. Install the LCD harness holder to the hinge assembly and secure it with the following
screws
• M2.5x2.8B FLAT BIND screw
x1
13. Arrange the wireless LAN antenna cables / Bluetooth antenna cable along the guide
of cover assembly.
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4.31 Hinge Switch Board
4 Replacement Procedures
4.31 Hinge Switch Board
Removing the hinge switch board
The following describes the procedure for removing the hinge switch board. (See Figure 4-
48.)
1. Remove the following screws and hinge switch board.
• M2.5x3.0B FLAT BIND screw
x2
2. Remove the plate placed under the hinge switch board.
M2.5x3.0B
FLAT BIND
Hinge switch board
Figure 4-48 Removing the hinge switch board
Installing the hinge switch board
The following describes the procedure for installing hinge switch board. (See Figure 4-48.)
1. Install the plate fitting to the bosses on the hinge assembly.
2. Install the hinge switch board and secure it with the following screws.
• M2.5x3.0B FLAT BIND screw
x2
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4.32 Fluorescent lamp
4 Replacement Procedure
4
4.32 Fluorescent lamp
This system uses LCD modules from the following suppliers. The procedure for replacing
the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure.
Type
Part No.
Supplier
Section
14.1-inch (SXGA+)
G33C0002P110
TMD
4.32.1
NOTE: - When working with a LCD module, always use a flat, grounded table.
- Handle the backlight unit in the environment without dust, such as on the clean
bench. Keep the worktable free from any screws or other material that may
scratch the LCD surface.
- Use an anti-static or protective sheet.
- When replacing the FL unit, cover with a finger protector or similar to prevent
soiling or scratching the LCD panel.
- Be careful when handling the lamp. Excessive force may break the lamp.
- Be careful not to soil or deform the lamp reflector.
- Make sure that the power of the LCD module is turned off before connecting or
disconnecting cables and connectors.
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4 Replacement Procedure
4.32 Fluorescent lamp
4.32.1 Replacing the 14.1 Inch SXGA+ TMD Fluorescent lamp
The following describes the procedure for replacing the fluorescent lamp (See Figure 4-49 to
4-59).
Disassembling Fluorescent lamp
Peeling off the tapes and insulation sheets
1. Turn the back of module up and place it on a flat surface that is free of foreign
objects.
Make sure no dirt on the face to protect the surface of the LCD module from damage.
Put a protection sheet (e.g. soft cloth) on the face.
2. In the order (1), (2), remove two bezel tape and the tape for fixing insulation sheet
(with the tape on the insulation side attached).
CAUTION: 1. Be careful not to damage the FPC, PCB, B/L reflection sheet.
2. Do not remove the insulation sheet to reuse it.
3. Do not damage the TAB and PCB when removing the double –sided
tape of the insulation sheet.
Tape on the side of insulation sheet
(2) Tape fixing the insulation sheet
(1) Bezel tape
Figure 4-49 Replacing 14.1 Inch TMD fluorescent lamp (1)
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4.32 Fluorescent lamp
4 Replacement Procedure
Removing the screws
1. Spread out the insulation sheet without detaching it from the side of the bezel.
2. Remove the four screws (1).
CAUTION: 1. To unfasten the screws, use an insert bit of point size 0 for Philips
screwdrivers.
2. Do not remove the insulation sheet to reuse it.
(1)
(1)
(1)
(1)
Figure 4-50 Replacing 14.1 Inch TMD fluorescent lamp (2)
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4 Replacement Procedure
4.32 Fluorescent lamp
Removing the bezel
1. Without removing the insulation tape, turn the face of module up.
2. Release the four latches of the bezel and frame (two positions on each side). With
holding up the bezel from the lower side (FL lamp side), release the three latches on
the top to remove the bezel from the cell. (The bezel is reused.)
CAUTION: 1. Do not damage the latches and FPC.
2. When removing the bezel, be careful not to deform the bezel.
Release the three latches on the top to remove the bezel from the cell.
Bezel
Release the
latches on the
Release
the
latch on
the
side.
Hold up he lower side of bezel up.
Figure 4-51 Replacing 14.1 Inch TMD fluorescent lamp (3)
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4.32 Fluorescent lamp
4 Replacement Procedure
Opening the PCB
1. Spread out the PCB horizontally.
CAUTION: Be careful not to damage the FPC.
Figure 4-52 Replacing 14.1 Inch TMD fluorescent lamp (4)
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4 Replacement Procedure
4.32 Fluorescent lamp
Removing the cell with PCB
1. Remove the cell with PCB from the backlight unit as shown bellow.
2. Completely remove the double-sided tape remaining on the reverse side of the cell.
CAUTION: 1. A portion of the upper side of cell is adhered to the frame with the
double-sided tape. Remove the cell gently, taking care not to damage it.
2. Do not remove the ray-shield tape on the upper, lower, right and left of
face and back of cell.
3. Be careful not to damage the FPC.
Ray-shield tape on the back
Remove cell
while removing
double sided tape.
Ray-shield tape on the back
Ray-shield tape
on the back
Ray-shield tape
on the back
Figure 4-53 Replacing 14.1 Inch TMD fluorescent lamp (5)
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4.32 Fluorescent lamp
4 Replacement Procedure
Assembling Fluorescent lamp
Check of the backlight replaced
1. Check the following items
Do not let the sheet on
and not let the sheet out
of the frame.
Figure 4-54 Replacing 14.1 Inch TMD fluorescent lamp (6)
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4 Replacement Procedure
4.32 Fluorescent lamp
Assembling the cell with PCB
1. Remove the parting paper from the double-sided tape on the backlight unit.
2. Turn the backlight on.
3. Check that the backlight is free of dust, foreign objects, or damage. Perform this
check also for the reverse side of the cell. Then install the cell with PCB in the
backlight unit.
CAUTION: 1. Align the top left corner of the cell with the corresponding corner of the
backlight unit.
2. Be careful not to damage the FPC.
Remove the
parting paper on
the double-side
Align the top
left corner of
the backlight
unit.
Figure 4- 55 Replacing 14.1 Inch TMD fluorescent lamp (7)
4-84
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4.32 Fluorescent lamp
4 Replacement Procedure
Folding the FPC/PCB
1. Fold down the FPC (PCB) toward the reverse side of the backlight unit.
CAUTION: 1. Be careful not to damage the FPC.
2. The screw hole shall be seen.
The screw hole of plastic
frame shall be seen
through the hole of GND-
CU.
The screw hole of plastic
frame shall be seen
through the hole of GND-
CU.
Figure 4-56 Replacing 14.1 Inch TMD fluorescent lamp (8)
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4 Replacement Procedure
4.32 Fluorescent lamp
Setting the bezel
1. Fit the bezel into the frame from the lamp side. ((1) in the bellow figure)
2. Hook the four (two positions on each side) latches on the side. ((2) in the bellow
figure)
3. Fit the bezel hooking the three latches on the upper side (FPC side). ((3) in the bellow
figure)
CAUTION: Be careful not to damage the cell, FPC and B/L.
(3) Hook the latch on the upper side and fit the bezel.
(2) Hook
latches on the
side.
(2) Hook
latches on the
side.
(1) Fit
the bezel
from the
lamp
side.
Figure 4-57 Replacing 14.1 Inch TMD fluorescent lamp (9)
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4.32 Fluorescent lamp
4 Replacement Procedure
Fasten screws of the PCB and bezel
1. Fasten four screws. ((1) in the bellow figure)
CAUTION: 1. The tightening torque must be 0.176Ｎ m (1.8kgf･cm) for all the screws.
2. Use an insert bit of point size 0 for the Philips screwdrivers.
(1)
(1)
(1)
(1)
Figure 4-58 Replacing 14.1 Inch TMD fluorescent lamp (10)
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4 Replacement Procedure
4.32 Fluorescent lamp
Attaching the tapes and insulation sheet
1. Attach the double sided-tape of PCB insulation sheet.
2. Attach the tape for fixing insulation sheet and two bezel tapes.
CAUTION: When attaching tape and insulation sheet, be careful not to damage the
PCB, cell and B/L.
Insulation sheet
Tape for fixing the insulation sheet
Bezel tape
Figure 4-59 Replacing 14.1 Inch TMD fluorescent lamp (11)
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Appendices
Appendix
Contents
Appendix A Handling the LCD Module......................................................................... A-1
Appendix B Board Layout................................................................................................B-1
B.1
B.2
B.3
B.4
B.5
System Board Front View..............................................................................B-1
System Board Back View..............................................................................B-3
CN Board Front and Back View....................................................................B-5
QI Board Front and Back View .....................................................................B-6
SW Board Front and Back View ...................................................................B-7
Appendix C Pin Assignment............................................................................................ C-1
System Board
C.1
C.2
C.3
C.4
C.5
C.6
C.7
C.8
C.9
CN1440 Memory 1 connector (200-pin) ..................................................... C-1
CN1460 Memory 2 connector (200-pin) ..................................................... C-4
CN1801 Select bay I/F connector (72-pin).................................................. C-7
CN1900 HDD I/F connector (11-pin).......................................................... C-8
CN2110 PC card I/F connector (70-pin)...................................................... C-8
IS2130 SD card I/F connector (12-pin) ....................................................... C-9
CN2200 Mini PCI I/F connector (124-pin) ............................................... C-10
CN2300 Docking I/F connector (240-pin)................................................. C-12
CN3000 MDC I/F connector (30-pin) ....................................................... C-15
C.10 CN3230 Keyboard connector (34-pin) ...................................................... C-16
C.11 CN3240 PAD connector (8-pin)................................................................ C-16
C.12 CN3280 Panel sensor connector (3-pin).................................................... C-17
C.13 CN3400 Debugging connector (4-pin) ...................................................... C-17
C.14 J4100 Network I/F connector (14-pin) ...................................................... C-17
C.15 CN4200 IEEE1394 connector (4-pin) ....................................................... C-18
C.16 CN4610 USB1 connector (Port 0) (4-pin)................................................. C-18
C.17 CN4611 USB2 connector (Port 3) (4-pin)................................................. C-18
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C.18 CN4612 USB3 connector (Port 6) (6-pin)................................................. C-18
C.19 CN5501 LCD connector (20-pin).............................................................. C-19
C.20 CN6060 Internal microphone (left) connector (2-pin)............................... C-19
C.21 CN6061 Internal microphone (right) connector (2-pin) ............................ C-19
C.22 J6070 External microphone connector (6-pin) .......................................... C-20
C.23 CN6150 Speaker connector (4-pin) ........................................................... C-20
C.24 J6310 Headphone connector (6-pin).......................................................... C-20
C.25 CN8800 DC-IN connector (4-pin)............................................................. C-20
C.26 CN8810 1st battery connector (10-pin) ...................................................... C-21
C.27 CN9990 RTC battery connector (3-pin) .................................................... C-21
C.28 CN8770 Fan0 connector (3-pin)................................................................ C-21
C.29 CN8780 Fan1 connector (3-pin)................................................................ C-22
C.30 CN9502 CN Board I/F connector (40-pin)................................................ C-22
C.31 CN9540 Digitizer switch I/F connector (40-pin)....................................... C-23
CN Board
C.32 CN4400 Bluetooth I/F connector (20-pin)................................................ C-24
C.33 CN4621 USB I/F connector (for relay of port 6) (6-pin)........................... C-24
C.34 CN4620 USB I/F connector (port 6) (4-pin)............................................. C-25
C.35 CN5320 CRT I/F connector (15-pin)......................................................... C-25
C.36 CN5340 S-VIDEO I/F connector (4-pin) .................................................. C-25
C.37 CN9521 QI board I/F connector (2-pin).................................................... C-26
C.38 CN9523 MG board I/F connector (3-pin).................................................. C-26
C.39 CN9520 System board I/F connector (40-pin)........................................... C-27
QI Board
C.40 CN9530 CN board I/F connector (2-pin)................................................... C-28
SW Board
C.41 CN9510 System board I/F connector (12-pin)........................................... C-28
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Appendices
Appendix D Keyboard Scan/Character Codes.............................................................. D-1
Appendix E Key Layout ...................................................................................................E-1
Appendix F Wiring Diagrams..........................................................................................F-1
Appendix G BIOS Rewrite Procedures..........................................................................G-1
Appendix H EC/KBC Rewrite Procedures ....................................................................H-1
Appendix I Reliability.......................................................................................................I-1
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Appendices
Figures
Figure B-1
Figure B-2
Figure B-3
Figure B-4
Figure B-5
System board layout (front) ...........................................................................B-1
System board layout (back) ...........................................................................B-3
CN board layout.............................................................................................B-5
QI board layout ..............................................................................................B-6
SW board layout ............................................................................................B-7
Figure E-1
Figure E-2
Key layout (UK) ............................................................................................E-1
Key layout (US).............................................................................................E-1
Figure F-1
Figure F-2
Figure F-3
LAN Loopback Connector.............................................................................F-1
RS-232C Cable (9-pin to 9-pin).....................................................................F-1
RS-232C Cable (9-pin to 25-pin)...................................................................F-2
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Appendices
Tables
Table B-1
Table B-2
Table B-3
Table B-4
Table B-5
System board (front) .....................................................................................B-2
System board (back) .....................................................................................B-4
CN board........................................................................................................B-5
QI board .........................................................................................................B-6
SW board .......................................................................................................B-7
System Board
Table C-1
Table C-2
Table C-3
Table C-4
Table C-5
Table C-6
Table C-7
Table C-8
Table C-9
Memory 1 connector (200-pin)..................................................................... C-1
Memory 2 connector (200-pin)..................................................................... C-4
Select bay I/F connector (72-pin) ................................................................. C-7
HDD I/F connector (11-pin) ......................................................................... C-8
PC card I/F connector (70-pin) ..................................................................... C-8
SD card I/F connector (12-pin)..................................................................... C-9
Mini PCI I/F connector (124-pin)............................................................... C-10
Docking I/F connector (240-pin) ................................................................ C-12
MDC I/F connector (30-pin)....................................................................... C-15
Table C-10 Keyboard connector (34-pin)...................................................................... C-16
Table C-11 PAD connector (8-pin)................................................................................ C-16
Table C-12 Panel sensor connector (3-pin).................................................................... C-17
Table C-13 Debugging connector (4-pin)...................................................................... C-17
Table C-14 Network I/F connector (14-pin).................................................................. C-17
Table C-15 IEEE1394 connector (4-pin)....................................................................... C-18
Table C-16 USB1 connector (Port 0) (4-pin)................................................................. C-18
Table C-17 USB2 connector (Port 3) (4-pin)................................................................. C-18
Table C-18 USB3 connector (Port 6) (6-pin)................................................................. C-18
Table C-19 LCD connector (20-pin).............................................................................. C-19
Table C-20 Internal microphone (left) connector (2-pin).............................................. C-19
Table C-21 Internal microphone (right) connector (2-pin)............................................ C-19
Table C-22 External microphone connector (6-pin)...................................................... C-20
Table C-23 Speaker connector (4-pin)........................................................................... C-20
Table C-24 Headphone connector (6-pin) ..................................................................... C-20
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Appendices
Table C-25 DC-IN connector (4-pin)............................................................................. C-20
Table C-26 1st battery connector (10-pin)...................................................................... C-21
Table C-27 RTC battery connector (3-pin).................................................................... C-21
Table C-28 Fan0 connector (3-pin)................................................................................ C-21
Table C-29 Fan1 connector (3-pin)................................................................................ C-22
Table C-30 CN Board I/F connector (40-pin)................................................................ C-22
Table C-31 Digitizer switch I/F connector (40-pin) ...................................................... C-23
CN Board
Table C-32 Bluetooth I/F connector (20-pin) ................................................................ C-24
Table C-33 USB I/F connector (for relay of port 6) (6-pin).......................................... C-24
Table C-34 USB I/F connector (port 6) (4-pin)............................................................. C-25
Table C-35 CRT I/F connector (15-pin) ........................................................................ C-25
Table C-36 S-VIDEO I/F connector (4-pin).................................................................. C-25
Table C-37 QI board I/F connector (2-pin).................................................................... C-26
Table C-38 MG board I/F connector (3-pin) ................................................................. C-26
Table C-39 System board I/F connector (40-pin).......................................................... C-27
QI Board
Table C-40 CN board I/F connector (2-pin) .................................................................. C-28
SW Board
Table C-41 System board I/F connector (12-pin).......................................................... C-28
Table D-1
Table D-2
Table D-3
Table D-4
Table D-5
Table D-6
Table D-7
Scan codes (set 1 and set 2) ......................................................................... D-1
Scan codes with left Shift key....................................................................... D-5
Scan codes in Numlock mode....................................................................... D-6
Scan codes with Fn key................................................................................. D-6
Scan codes in overlay mode.......................................................................... D-7
No. 124 Key scan code ................................................................................. D-7
No. 126 Key scan code ................................................................................. D-8
Table I-1
MTBF..............................................................................................................I-1
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Appendix A Handling the LCD Module
Appendices
Appendix A
Appendix A Handling the LCD Module
Precautions for handling the LCD module
The LCD module can be easily damaged during assembly or disassembly. Observe the
following precautions when handling the LCD module:
1. When installing the LCD module in the LCD cover, be sure to seat it so that it is
properly aligned and maximum visibility of the display is maintained.
2. Be careful to align the holes at the four corners of the LCD module with the
corresponding holes in the LCD cover before securing the module with screws.
Do not force the module into place, because stress can affect its performance.
Also, the panel’s polarized surface is easily scarred, so be careful when handling it.
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Appendices
Appendix A Handling the LCD Module
3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty,
try breathing on the surface to create a light condensate and wipe it again.
If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to
a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel.
4. If water or other liquid is left on the panel’s surface for a long period, it can change
the screen’s tint or stain it. Be sure to quickly wipe off any liquid.
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Appendix A Handling the LCD Module
Appendices
5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object,
which could cause breakage or cracks.
6. CMOS-LSI circuits are used in the module, so guard against damage from
electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the
module.
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Appendix A Handling the LCD Module
7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods.
8. Do not store the module at temperatures below specifications. Cold can cause the
liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
A-4
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Appendix A Handling the LCD Module
Appendices
10. If you transport the module, do not use packing material that contains epoxy resin
(amine) or silicon glue (alcohol or oxime). These materials can release gas that can
damage the panel’s polarization.
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Appendix A Handling the LCD Module
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Appendix B Board Layout
Appendices
Appendix B
Appendix B Board Layout
B.1
System Board Front View
(C)
(D)
(E)
(A)
(I)
(B)
(J)
(H)
(G)
(F)
Figure B-1 System board layout (front)
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Appendix B Board Layout
Table B-1 System board (front)
Mark
Number
Part’s name
(A)
(B)
(C)
(D)
(E)
(F)
(G)
(H)
(I)
IS2130
IC8972
CN3400
CN3230
CN3240
J6310
SD card slot
PSC
Debug port (D port) connector
Keyboard connector
Touch pad connector
Headphone jack
J6070
External microphone jack
PC card connector
ICH6-M
CN2110
IC1600
IC3200
(J)
EC/KBC
B-2
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Appendix B Board Layout
Appendices
B.2
System board Back View
(V)
(X)
(W)
(R)
(U)
(T)
(Y)
(S)
(Q)
(M)
(P)
(A)
(B)
(K)
(O)
(N)
(Z)
(D)
(C)
(L)
(F)
(E)
(J)
(I)
(H)
(G)
Figure B-2 System board layout (back)
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Appendix B Board Layout
Table B-2 System board (back)
Mark
Number
Name
(A)
(B)
(C)
(D)
(E)
(F)
(G)
(H)
(I)
CN4611
CN4610
CN2200
CN4200
CN1900
CN6150
CN6060
CN6061
CN3000
CN8810
IC1200
USB connector 2
USB connector 1
Mini PCI connector
IEEE1394 connector
HDD I/F connector
Speaker connector
Internal microphone (left) connector
Internal microphone (right) connector
MDC connector
(J)
Battery connector
AlvisioPM
(K)
(L)
CN9990
CN8770
CN4612
CN1801
CN5501
CN9502
CN2300
CN1440, CN1460
CN3280
CN3001
J4100
RTC battery connector
Fan1 connector
(M)
(N)
(O)
(P)
(Q)
(R)
(S)
(T)
(U)
(V)
(W)
(X)
(Y)
(Z)
USB connector 3
Selectable bay connector
LCD connector
CN board I/F connector
Docking connector
Memory connector
Panel sensor connector
RJ11 relay connector
Network jack
CN9540
CN8800
CN8770
IS1050
Digitizer connector
DC IN connector
FAN0 connector
CPU
B-4
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Appendix B Board Layout
Appendices
B.3
CN Board Front and Back View
<Front layout>
<Back layout>
(A)
(B)
(G)
(C)
(F)
(E)
(D)
Figure B-3 CN board layout
Table B-3 CN Board
Mark
(A)
Number
CN9520
CN4621
CN9521
CN4620
CN5320
CN5340
CN4400
Name
System board I/F connector
USB 1 relay connector
QI board I/F connector
USB 2 connector
(B)
(C)
(D)
(E)
CRT connector
(F)
S-VIDEO connector
Bluetooth connector
(G)
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Appendices
Appendix B Board Layout
B.4
QI Board Front and Back View
<Front layout>
(A)
<Back layout>
Figure B-4 QI Board layout
Table B-4 QI Board
Mark
Number
CN9530
Name
CN board I/F connector
(A)
B-6
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Appendix B Board Layout
Appendices
B.5
SW Board Front and Back View
<Front layout>
(A)
<Back layout>
(E)
(D)
(C)
(B)
Figure B-5 SW Board layout
Table B-5 SW Board
Mark
(A)
Number
Name
CN9510
S3293
S3292
S3291
S3290
System board I/F connector
Direction button
ESC button
(B)
(C)
(D)
(E)
SAS button
POWER-ON switch
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Appendices
Appendix B Board Layout
B-8
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Appendix. C Pin Assignment
Appendices
Appendix. C
Pin Assignment
Appendix C Pin Assignment
System Board
C.1 CN1440 Memory 1 connector (200-pin)
Table C-1 Memory 1 connector (200-pin) (1/3)
Pin No.
Signal Name
I/O
Pin No.
Signal Name
I/O
1
MRREF-B0V
GND
-
-
2
GND
BDQ05-B1P
BDQ04-B1P
GND
-
I/O
I/O
-
3
4
5
BDQ07-B1P
BDQ06-B1P
GND
I/O
I/O
-
6
7
8
9
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
BDM0-B1P
GND
I/O
-
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
BDQS0-B1N
BDQS0-B1P
GND
I/O
I/O
-
BDQ01-B1P
BDQ00-B1P
GND
I/O
I/O
-
BDQ03-B1P
BDQ02-B1P
GND
I/O
I/O
-
BDQ12-B1P
BDQ13-B1P
GND
I/O
I/O
-
BDQ11-B1P
BDQ09-B1P
GND
I/O
I/O
-
BDM1-B1P
GND
I/O
-
BDQS1-B1N
BDQS1-B1P
2R5-B2V
BDQ09-B1P
BDQ14-B1P
GND
I/O
I/O
-
MCK3-B1P
MCK3-B1N
GND
O
O
-
I/O
I/O
-
BDQ15-B1P
BDQ10-B1P
GND
I/O
I/O
-
GND
-
GND
-
BDQ16-B1P
BDQ17-B1P
GND
I/O
-
BDQ21-B1P
BDQ17-B1P
GND
I/O
I/O
-
-
BDQS2-B1N
BDQS2-B1P
GND
I/O
I/O
-
NC
-
BDM2-B1P
GND
I/O
-
BDQ23-B1P
I/O
BDQ19-B1P
I/O
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Appendices
Appendix. C Pin Assignment
Table C-1 Memory 1 connector (200-pin)(2/3)
Pin No.
Signal Name
BDQ22-B1P
I/O
Pin No.
58
Signal Name
BDQ20-B1P
I/O
57
I/O
I/O
59
61
GND
-
I/O
I/O
-
60
62
GND
-
BDQ30-B1P
BDQ28-B1P
GND
ADQ24-B1P
BDQ25-B1P
GND
I/O
63
64
I/O
-
65
66
67
BDM3-B1P
NC
I/O
-
68
BDQS3-B1N
BDQS3-B1P
GND
I/O
I/O
-
69
70
71
GND
-
72
73
BDQ26-B1P
BDQ27-B1P
GND
I/O
I/O
-
74
BDQ29-B1P
BDQ31-B1P
GND
I/O
I/O
-
75
76
77
78
79
MCKE2-B1P
1R8-B1V
NC
O
-
80
MCKE3-B1P
1R8-B1V
NC
O
-
81
82
83
-
84
-
85
BBS2-B1P
1R8-B1V
BMA12-B1P
BMA09-B1P
BMA08-B1P
1R8-B1V
BMA05-B1P
BMA03-B1P
BMA01-B1P
1R8-B1V
BMA10-B1P
BBS0-B1P
BWE-B1N
1R8-B1V
BCAS-B1N
MCS3-B1N
1R8-B1V
MODT3-B1P
GND
O
-
86
NC
-
87
88
1R8-B1V
BMA11-B1P
BMA07-B1P
BMA06-B1P
1R8-B1V
BMA04-B1P
BMA02-B1P
BMA00-B1P
1R8-B1V
BBS1-B1P
BRAS-B1N
MCS2-B1N
1R8-B1V
MODT2-B1P
BMA13-B1P
1R8-B1V
NC
-
89
O
O
O
-
90
O
O
O
I
91
92
93
94
95
96
97
O
O
O
-
98
O
O
O
-
99
100
102
104
106
108
110
112
114
116
118
120
122
124
126
128
101
103
105
107
109
111
113
115
117
119
121
123
125
127
O
O
I
O
I
O
-
-
O
O
-
O
I/O
-
O
-
-
GND
-
BDQ32-B1P
BDQ33-B1P
GND
I/O
I/O
-
BDQ36-B1P
BDQ37-B1P
GND
I/O
I/O
-
C-2
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Appendix. C Pin Assignment
Appendices
Table C-1 Memory 1 connector (200-pin) (3/3)
Pin No.
Signal Name
I/O
Pin No.
Signal Name
I/O
129
131
133
135
137
139
141
143
145
147
149
151
153
155
157
159
161
163
165
167
169
171
173
175
177
179
181
183
185
187
189
191
193
195
197
199
1T
BDQS4-B1N
BDQS4-B1P
GND
I/O
I/O
-
130
132
134
136
138
140
142
144
146
148
150
152
154
156
158
160
162
164
166
168
170
172
174
176
178
180
182
184
186
188
190
192
194
196
198
200
2T
BDM4-B1P
GND
O
-
BDQ38-B1P
ADQ39-B1P
GND
I/O
I/O
-
BDQ34-B1P
BDQ35-B1P
GND
I/O
I/O
-
BDQ44-B1P
BDQ45-B1P
GND
I/O
I/O
-
BDQ40-B1P
BDQ41-B1P
GND
I/O
I/O
-
BDQS5-B1N
BDQS5-B1P
GND
I/O
I/O
-
BDM5-B1P
GND
O
-
BDQ43-B1P
BDQ42-B1P
GND
I/O
I/O
-
BDQ46-B1P
BDQ47-B1P
GND
I/O
I/O
-
BDQ48-B1P
BDQ54-B1P
GND
I/O
I/O
-
BDQ52-B1P
BDQ53-B1P
GND
I/O
I/O
-
NC
-
MCK4-B1P
MCK4-B1N
GND
O
GND
-
O
BDQS6-B1N
BDQS6-B1P
GND
I/O
I/O
-
-
ADM6
O
GND
-
BDQ51-B1P
BDQ5%-B1P
GND
I/O
I/O
-
BDQ50-B1P
BDQ49-B1P
GND
I/O
I/O
-
BDQ57-B1P
BDQ60-B1P
GND
I/O
I/O
-
BDQ56-B1P
BDQ61-B1P
GND
I/O
I/O
-
BDM7-B1P
GND
O
BDQS7-B1N
BDQS7-B1P
GND
I/O
I/O
-
-
BDQ58-B1P
BDQ59-B1P
GND
I/O
I/O
-
BDQ62-B1P
ADQ63-B1P
GND
I/O
I/O
-
SMBDAT-P3P
SMBCLK-P3P
P3V
I/O
I/O
-
GND
-
GND
-
GND
-
GND
-
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Appendices
Appendix. C Pin Assignment
C.2 CN1460 Memory 2 connector (200-pin)
Table C-2 Memory 2 connector (200-pin)(1/3)
Pin No.
Signal Name
I/O
Pin No.
Signal Name
I/O
1
MRREF-B0V
GND
-
2
GND
-
I/O
I/O
-
3
-
4
ADQ04-B1P
ADQ05-B1P
GND
5
ADQ00-B1P
ADQ01-B1P
GND
I/O
I/O
-
6
7
8
9
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
ADM0-B1P
GND
I/O
-
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
ADQS0-B1N
ADQS0-B1P
GND
I/O
I/O
-
ADQ02-B1P
ADQ07-B1P
GND
I/O
I/O
-
ADQ03-B1P
ADQ06-B1P
GND
I/O
I/O
-
ADQ12-B1P
ADQ13-B1P
GND
I/O
I/O
-
ADQ08-B1P
ADQ09-B1P
GND
I/O
I/O
-
ADM1-B1P
GND
I/O
-
ADQS1-B1N
ADQS1-B1P
2R5-B2V
ADQ14-B1P
ADQ15-B1P
GND
I/O
I/O
-
MCK0-B1P
MCK0-B1N
GND
O
O
-
I/O
I/O
-
ADQ10-B1P
ADQ11-B1P
GND
I/O
I/O
-
GND
-
GND
-
ADQ16-B1P
ADQ17-B1P
GND
I/O
-
ADQ20-B1P
ADQ21-B1P
GND
I/O
I/O
-
-
ADQS2-B1N
ADQS2-B1P
GND
I/O
I/O
-
NC
-
ADM2-B1P
GND
I/O
-
ADQ23-B1P
ADQ22-B1P
GND
I/O
I/O
-
ADQ19-B1P
ADQ18-B1P
GND
I/O
I/O
-
ADQ24-B1P
ADQ25-B1P
GND
I/O
I/O
-
ADQ29-B1P
ADQ28-B1P
GND
I/O
I/O
-
ADM3-B1P
I/O
ADQS3-B1N
I/O
C-4
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Appendix. C Pin Assignment
Appendices
Table C-2 Memory 2 connector (200-pin)(2/3)
Pin No.
Signal Name
I/O
Pin No.
Signal Name
I/O
69
71
NC
-
-
70
72
ADQS3-B1P
GND
I/O
-
GND
73
ADQ27-B1P
BDQ26-B1P
GND
I/O
I/O
-
74
ADQ30-B1P
ADQ31-B1P
GND
I/O
I/O
-
75
76
77
78
79
MCKE0-B1P
1R8-B1V
O
-
80
MCKE1-B1P
1R8-B1V
NC
O
-
81
82
83
NC
-
84
-
85
ABS2-B1P
1R8-B1V
O
-
86
NC
-
87
88
1R8-B1V
AMA11-B1P
AMA07-B1P
AMA06-B1P
1R8-B1V
AMA04-B1P
AMA02-B1P
AMA00-B1P
1R8-B1V
ABS1-B1P
ARAS-B1N
MCS0-B1N
1R8-B1V
MODT0-B1P
AMA13-B1P
1R8-B1V
NC
-
89
AMA12-B1P
AMA09-B1P
AMA08-B1P
1R8-B1V
O
O
O
-
90
O
O
O
I
91
92
93
94
95
96
97
AMA05-B1P
AMA03-B1P
AMA01-B1P
1R8-B1V
O
O
O
-
98
O
O
O
-
99
100
102
104
106
108
110
112
114
116
118
120
122
124
126
128
130
132
134
136
138
140
101
103
105
107
109
111
113
115
117
119
121
123
125
127
129
131
133
135
137
139
AMA10-B1P
ABS0-B1P
AWE-B1N
1R8-B1V
O
O
I
O
I
O
-
-
ACAS-B1N
MCS1-B1N
1R8-B1V
O
O
-
O
I/O
-
MODT1-B1P
GND
O
-
-
GND
-
ADQ32-B1P
ADQ33-B1P
GND
I/O
I/O
-
ADQ36-B1P
ADQ37-B1P
GND
I/O
I/O
-
ADQS4-B1N
ADQS4-B1P
GND
I/O
I/O
-
ADM4-B1P
GND
O
-
ADQ38-B1P
ADQ35-B1P
GND
I/O
I/O
-
ADQ34-B1P
ADQ39-B1P
GND
I/O
I/O
-
ADQ40-B1P
I/O
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Appendices
Appendix. C Pin Assignment
Table C-2 Memory 2 connector (200-pin )(3/3)
Pin No.
Signal Name
ADQ45-B1P
ADQ41-B1P
GND
I/O
I/O
I/O
-
Pin No.
142
144
146
148
150
152
154
156
158
160
162
164
166
168
170
172
174
176
178
180
182
184
186
188
190
192
194
196
198
200
2T
Signal Name
ADQ44-B1P
GND
I/O
I/O
-
141
143
145
147
149
151
153
155
157
159
161
163
165
167
169
171
173
175
177
179
181
183
185
187
189
191
193
195
197
199
1T
ADQS5-B1N
ADQS5-B1P
GND
I/O
I/O
-
ADM5-B1P
GND
O
-
ADQ42-B1P
ADQ43-B1P
GND
I/O
I/O
-
ADQ46-B1P
ADQ47-B1P
GND
I/O
I/O
-
ADQ48-B1P
ADQ49-B1P
GND
I/O
I/O
-
ADQ52-B1P
ADQ53-B1P
GND
I/O
I/O
-
NC
-
MCK1-B1P
MCK1-B1N
GND
O
GND
-
O
ADQS6-B1N
ADQS6-B1P
GND
I/O
I/O
-
-
ADM6-B1P
GND
O
-
ADQ55-B1P
ADQ51-B1P
GND
I/O
I/O
-
ADQ54-B1P
ADQ50-B1P
GND
I/O
I/O
-
ADQ56-B1P
ADQ57-B1P
GND
I/O
I/O
-
ADQ60-B1P
ADQ61-B1P
GND
I/O
I/O
-
ADM7-B1P
GND
O
ADQS7-B1N
ADQS7-B1P
GND
I/O
I/O
-
-
ADQ58-B1P
ADQ59-B1P
GND
I/O
I/O
-
ADQ52-B1P
ADQ53-B1P
GND
I/O
I/O
-
SMBDAT-P3P
SMBCLK-P3P
P3V
I/O
I/O
-
GND
-
GND
-
GND
-
GND
-
C-6
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Appendix. C Pin Assignment
Appendices
C.3 CN1801 Select bay I/F connector (72-pin)
Table C-3 Select bay I/F connector (72-pin)
Pin No.
Signal Name
GND
I/O
PinNo.
Signal Name
GND
I/O
1
-
-
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
-
O
-
2
GND
PIORDY-P3P
(CSEL)
3
N.C.
-
4
N.C.
-
PDDACK
GND
I
5
GND
-
-
6
N.C.
-
IRQ15
O
-
7
IDRSTB-P5N
GND
I
N.C.
8
-
PDA1-P3P
S8-P5V
I
9
GND
-
I
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
PDD07-P3P
PDD08-P3P
PDD06-P3P
PDD09-P3P
PDD05-P3P
PDD10-P3P
GND
I/O
I/O
I/O
I/O
I/O
I/O
-
S8-P5V
I
S8-P5V
I
PDA0-P3P
PDA2-P3P
PDCS1-P3N
PDCS3-P3N
CDRLED-P5N
GND
I
I
I
I
O
-
GND
-
PDD04-P3P
PDD11-P3P
PDD03-P3P
PDD12-P3P
PDD02-P3P
PDD13-P3P
S8-P5V
I/O
I/O
I/O
I/O
I/O
I/O
I
MSSTS2-S3N
MSSTS1-S3N
MSSTS0-S3N
GND
I
I
I
-
DBT20V-S5N.
PSDA-S5P.
BT2VD
O
I
-
S8-P5V
I
PSCL-S5P.
BTMP2
O
I
PDD01-P3P
PDD14-P3P
PDD00-P3P
PDD15-P3P
GND
I/O
I/O
I/O
I/O
-
CDCHG2-S5P
GND
I
-
GND
-
N.C.
-
GND
-
GND
-
PDDREQ-P3P
GND
O
-
N.C.
-
GND
-
PDIOW-P3N
GND
I
GND
-
-
PDIOR-P3N
I
PVBAT2
-
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Appendices
Appendix. C Pin Assignment
C.4 CN1900 HDD I/F connector (11-pin)
Table C-4 HDD I/F connector (11-pin)
Pin No.
Signal Name
I/O
PinNo.
Signal Name
I/O
1
3
SATAT0-P3P
GND
O
-
2
4
SATAT0-P3N
SATAR0-P3N
GND
O
I
5
SATAR0-P3P
P3V
I
6
-
7
-
8
GND
-
9
P5V
-
10
GND
-
11
1T
3T
GND
GND
-
-
2T
4T
GND
GND
-
-
GND
C.5 CN2110 PC card I/F connector (70-pin)
Table C-5 PC card I/F connector (70-pin)) (1/2)
Pin No.
Signal Name
GND
I/O
PinNo.
Signal Name
I/O
1
-
2
ACAD00-EYP
ACAD03-EYP
ACAD07-EYP
ACAD09-EYP
ACAD12-EYP
ACCBE1-EYN
ACPERR-EYN
ACINT-EYN
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
-
3
ACAD01-EYP
ACAD05-EYP
I/O
I/O
4
5
6
7
ACCBEO-EYN I/O
8
9
ACAD11-EYP
ACAD14-EYP
ACPAR-EYP
ACGNT-EYN
I/O
I/O
I/O
I/O
10
12
14
16
18
20
22
24
26
28
30
32
34
11
13
15
17
19
21
23
25
27
29
31
33
MCVCCA-EYV I/O
MCVPPA-EYV
ACIRDY-EYN
ACAD18-EYP
ACAD21-EYP
ACAD23-EYP
ACAD25-EYP
ACAD27-EYP
ACD02-EYP
GND
ACCLK-EYP
ACCBE2-EYN
ACAD20-EYP
ACAD22-EYP
ACAD24-EYP
ACAD26-EYP
ACAD29-EYP
ACCLKR-EYN
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
C-8
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Appendices
Table C-5 PC card I/F connector (70-pin) (2/2)
Pin No.
35
Signal Name
GND
I/O
PinNo.
36
Signal Name
ACCD1-E3N
ACAD04-EYP
ACD14-EYP
ACAD10-EYP
ACAD13-EYP
I/O
I/O
I/O
I/O
I/O
I/O
-
37
ACAD02-EYP
ACAD06-EYP
ACAD08-EYP
ACVS1-E3P
I/O
I/O
I/O
38
39
40
41
42
43
I/O
44
45
47
49
51
53
55
57
59
61
63
65
67
69
ACAD15-EYP
ACA18-EYP
ACSTOP-EYN
MCVCCA-EYV
ACTRDY-EYN
ACAD17-EYP
ACVS2-E3P
ACSERR-EYN
ACCBE3-EYN
ACSTSC-EYP
ACAD30-EYP
ACCD2-E3N
GND
I/O
I/O
I/O
I
46
48
50
52
54
56
58
60
62
64
66
68
70
ACAD16-EYP
ACLOCK-EYN
ACDEVS-EYN
MCVPPA-EYV
ACFRAM-EYN
ACAD19-EYP
ACRST-EYN
ACREQ-EYN
ACAUDI-EYP
ACAD28-EYP
ACAD31-EYP
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
I/O
I/O
I/O
I/O
I/O
O
I/O
I/O
-
I/O
O
-
GND
-
C.6 IS2130 SD card I/F connector (12-pin)
Table C-6 SD card I/F connector (12-pin))
Pin No.
Signal Name
I/O
PinNo.
Signal Name
I/O
1
3
SDAT3-E3P
GND
I/O
-
2
4
SDCMD-E3P
SD-E3V
I/O
I
5
SDCLK-E3P
SDAT0-E3P
SDAT2-E3P
SDWP-E3P
I
6
GND
-
7
I/O
I/O
O
8
SDAT1-E3P
SDCD-E3N
GND
I/O
O
-
9
10
12
11
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Appendices
Appendix. C Pin Assignment
C.7 CN2200 Mini PCI I/F connector (124-pin)
Table C-7 Mini PCI I/F connector (124-pin) (1/2)
Pin No.
Signal Name
N.C.
I/O
PinNo.
Signal Name
N.C.
I/O
1
-
2
-
-
3
N.C.
-
4
N.C.
5
N.C.
-
6
N.C.
-
7
N.C.
-
8
N.C.
-
9
N.C.
-
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
N.C.
-
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
N.C.
-
N.C.
-
WLON-S3N
GND
I
N.C.
-
-
N.C.
-
PIRQD-P3N
P3V
I
I
P5V
I
PIRQG-P3N
N.C.
O
-
N.C.
-
GND
-
E3V
I
X33MPC-P3P
GND
I
PCIRS3-P3N
P3V
O
I
-
PREQ2-P3N
P3V
I
PGNT2-P3N
GND
O
-
I
AD31-P3P
AD29-P3P
GND
I/O
I/O
-
PME-S3N
N.C.
O
-
AD30-P3P
P3V
I/O
I
AD27-P3P
AD25-P3P
N.C.
I/O
I/O
-
AD28-P3P
AD26-P3P
AD24-P3P
AD21-P3P
GND
I/O
I/O
I/O
I/O
-
CBE3-P3N
AD23-P3P
GND
I
I/O
-
AD21-P3P
AD19-P3P
GND
I/O
I/O
-
AD22-P3P
AD20-P3P
PAR-P3P
AD18-P3P
AD16-P3P
GND
I/O
I/O
O
I/O
I/O
-
AD17-P3P
CBE2-P3N
IRDY-P3N
P3V
I/O
I/O
I/O
I
FRAME-P3N
TDRY-P3N
STOP-P3N
P3V
I/O
I/O
I/O
I
CLKRUN-P3N
SERR-P3N
GND
I/O
I/O
-
C-10
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Appendix. C Pin Assignment
Appendices
Table C-7 Mini PCI I/F connector (124-pin) (2/2)
Pin No.
71
Signal Name
PERR-P3N
CBE1-P3N
AD14-P3P
GND
I/O
PinNo.
72
Signal Name
DEVSEL-P3N
GND
I/O
I/O
I/O
73
I
74
-
75
I/O
76
AD15-P3P
AD13-P3P
AD11-P3P
GND
I/O
77
-
78
I/O
79
AD12-P3P
AD10-P3P
GND
I/O
80
I/O
81
I/O
82
-
83
-
84
AD09-P3P
CBE0-P3N
P3V
I/O
85
AD08-P3P
AD07-P3P
P3V
I/O
86
O
87
I/O
88
I
89
-
90
AD06-P3P
AD04-P3P
AD02-P3P
AD00-P3P
N.C.
I/O
91
AD05-P3P
N.C.
I/O
92
I/O
93
-
94
I/O
95
AD03-P3P
P5V
I/O
96
I/O
-
97
I
I/O
-
98
99
AD01-P3P
GND
100
102
104
106
108
110
112
114
116
118
120
122
124
N.C.
-
101
103
105
107
109
111
113
115
117
119
121
123
GND
-
N.C.
-
GND
-
N.C.
-
N.C.
-
N.C.
-
N.C.
-
N.C.
-
N.C.
-
N.C.
-
N.C.
-
GND
-
GND
-
N.C.
-
N.C.
-
GND
-
N.C.
-
GND
-
GND
-
N.C.
-
N.C.
-
N.C.
-
E3V
I
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Appendices
Appendix. C Pin Assignment
C.8 CN2300 Docking I/F connector (240-pin)
Table C-8 Docking I/F connector (240-pin) (1/4)
Pin No.
Signal Name
DSKDC
I/O
Pin No.
Signal Name
GND
I/O
A1
A3
1
I
A2
A4
2
-
DSKDC
I
GND
-
DCOUT
I
DCOUT
I
3
DOCDT1-S3N
N.C.
O
4
P5V
I
5
-
6
N.C.
-
7
GND
-
8
PHYRST-E3N
GND
I-
9
DPCONF-S5P
GND
O
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
-
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
-
DDCACK-P3P
DGREEN-PXP
DVSYNC-P3P
Reserved
I/O
DRED-PXP
DBLUE-PXP
(DVISC-P3P)
GND
I
I
I
I
I/O
-
-
(DVI-PRTCT2)
(DVITX2-P3P)
(DVITX1-P3P)
(DVITX0-P3P)
GND
-
(DVI-PRTCT1)
(DVITX2-P3N)
(DVITX1-P3N)
(DVITX0-P3N)
GND
-
-
-
-
-
-
-
-
-
(DVITXC-P3P)
(DVIDET-S3N)
Reserved
I
(DVITXC-P3N)
(DVIPD0)
(QSWON-B3P)
GND
-
-
-
-
-
(DIRQD-S3N)
(PCM2SP-B3P)
(DADOO-P3P)
(DADO0-P3P)
(DADO6-P3P)
(XDPCI-P3P)
(DAD11-P3P)
(DAD11-P3P)
(DINTA-P3N)
VOID
-
-
-
(DPMRST-S3N)
GND
-
-
-
-
(DADO2-P3P)
GND
-
-
-
-
(DAD09-P3P)
GND
-
-
-
-
-
-
(DAD15-P3P)
VOID
-
-
BIDDP-PXP
VOID
I/O
-
BIDDN-PXN
VOID
I/O
-
MDMRNG-E3P
DCOUT
I/O
-
MDMTIP-E3P
DCOUT
I/O
-
C-12
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Appendix. C Pin Assignment
Appendices
Table C-8 Docking I/F connector (240-pin) (2/4)
Pin No.
Signal Name
I/O
Pin No.
Signal Name
IF-P5V
I/O
63
65
EJCTRQ-S3N
(EXMSDT-P5P)
GND
I/O
64
66
I
-
-
(EXKBDT-P5P)
GND
-
67
68
-
69
DILSON-S3P
GND
I/O
-
70
(NVPCNF-S3P)
DDCADA-P3P
GND
O
71
72
I/O
73
GND
-
74
-
75
GND
-
76
DHSYNC-P3P
(DVI_PRTCT3)
(DVITX5-P3P)
(DVITX4-P3P)
(DVITX3-P3P)
(DVI16)
I
77
(DVISD-P3P)
GND
-
78
-
79
-
80
-
81
(DVITX5-P3N)
(DVITX4-P3N)
(DVITX3-P3N)
(DVI17)
-
82
-
83
-
84
-
85
-
86
-
87
-
88
GND
-
89
GND
-
90
(DOC_ON_LED1)
(DOC_ON_LED2)
(DVI_PRTCT4)
(DSMI-B3P)
(DCKRUN-P3N)
(DADO1-P3P)
(DADO3-P3P)
(DADO7-P3P)
(DADO8-P3P)
(DAD12-P3P)
(DAD14-P3P)
(DPAR-P3P)
VOID
-
91
Reserved
(DVIPD1)
(DCADIO-S3P)
GND
-
92
-
93
-
94
-
95
-
96
-
97
-
98
-
99
(PME-S3P)
GND
100
102
104
106
108
110
112
114
116
118
120
122
124
126
128
130
132
134
136
138
-
101
103
105
107
109
111
113
115
117
119
121
123
125
127
129
131
133
135
137
-
-
-
-
-
-
-
(DADO5-P3P)
GND
-
-
(DAD10-P3P)
GND
-
-
(DCBE1-P3N)
VOID
-
-
BIDCN-EXN
BIDCP-EXP
VOID
I/O
VOID
-
I/O
VOID
-
-
VOID
-
I
DCOUT
I
I/O
I
DCOUT
DSSCL-S5P
M5V
IF-P5V
I
DTPA-E3P
DTPB-E3P
(USBOC1-E5N)
(USBON2-E5N)
SNDMUT-S3N
DOUTL-PXP
DINR-PXN
I/O
I/O
-
GND
-
(USBON1-E5N)
GND
-
-
I
(USBOC2-E5N)
DMBCHG-S3P
DINL-PXP
-
I
O
I/O
I/O
I/O
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Appendices
Appendix. C Pin Assignment
Table C-8 Docking I/F connector (240-pin) (3/4)
Pin No.
Signal Name
GND
I/O
Pin No.
Signal Name
I/O
139
141
143
145
147
149
151
153
155
157
159
161
163
165
167
169
171
173
175
177
179
181
183
185
187
189
191
193
195
197
199
201
203
205
207
209
211
-
140
142
144
146
148
150
152
154
156
158
160
162
164
166
168
170
172
174
176
178
180
182
184
186
188
190
192
194
196
198
200
202
204
206
208
210
212
PWRSW-S3N
(DSR-PYP)
(RING-PYP)
PDB07-P5P
GND
O
(DCD-PYP)
(TXD-EYN)
PE-P5P
-
-
-
-
O
I/O
PDB06-P5P
GND
I/O
-
-
PDB04-P5P
PDB02-P5P
STROB-P5N
(DAD30-P3P)
(DAD28-P3P)
(DAD24-P3P)
(DIDSL-P3P)
(DAD20-P3P)
(DCBE0-P3N)
(DAD16-P3P)
(DCBE2-P3N)
(DSTOP-P3N)
VOID
I/O
PDB01-P5P
PDB00-P5P
(DPGNT-P3N)
GND
I/O
I/O
I/O
I
-
-
-
-
(DAD26-P3P)
GND
-
-
-
-
(DAD22-P3P)
GND
-
-
-
-
(DAD18-P3P)
GND
-
-
-
-
(DTRDY-P3N)
GND
-
-
-
-
P3V
I
VOID
-
VOID
-
N.C.
-
BIDAP-PXP
DCOUT
O
BIDAN-PXN
DCOUT
O
I
I
DSSDA-S5P
Reserved
GND
I/O
IF-P5V
I
-
DTPA-E3N
DTPB-E3N
USBP1-S3N
USBP2-S3P
DOUTR-PXP
DOUTL-PXN
DINR-PXP
(RXD-PYN)
(CTS-PYP)
SELCT-P5P
ACK-P5N
I/O
I/O
I/O
I/O
I/O
I/O
I/O
-
-
USBP1-S3P
GND
I/O
-
USBP2-S3N
DOUTR-PXN
DINL-PXN
GND
I/O
-
-
-
(RTS-EYP)
(DTR-EYP)
BUSY-P5P
PDB05-P5P
GND
-
-
-
O
O
-
O
I/O
-
GND
PDB03-P5P
PINIT-P5N
I/O
I
SLIN-P5N
I
C-14
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Appendix. C Pin Assignment
Appendices
Table C-8 Docking I/F connector (240-pin) (4/4)
Pin No.
Signal Name
I/O
Pin No.
Signal Name
I/O
213
215
217
219
221
223
225
227
229
231
233
235
237
239
ERROR-P5N
(DPREQ-P3N)
GND
O
-
214
216
218
220
222
224
226
228
230
232
234
236
238
240
AUTFD-P5N
(DAD31-P3P)
(DAD29-P3P)
(DAD25-P3P)
(DCBE23-P3N)
(DAD21-P3P)
(DCPCLR-P3P)
(DAD17-P3P)
(DFRAME-P3N)
(DDEVSL-P3N)
ACT-P3N
I
-
-
-
(DAD27-P3P)
GND
-
-
-
-
(DAD23-P3P)
GND
-
-
-
-
(DAD19-P3P)
GND
-
-
-
-
(DIRDY-P3N)
GND
-
-
-
O
O
-
LINK-P3N
VOID
O
-
DOCDT2-S3N
VOID
BIDBP-PXP
I
BIDBN-PXN
I
C.9 CN3000 MDC I/F connector (30-pin)
Table C-9 MDC I/F connector (30-pin)
Pin No.
Signal Name
N.C.
I/O
PinNo.
Signal Name
GND
I/O
1
-
-
-
-
-
-
-
-
I
2
-
-
3
GND
4
N.C.
5
N.C.
6
N.C.
-
7
N.C.
8
GND
-
9
N.C.
10
12
14
16
18
20
22
24
26
28
30
N.C
-
11
13
15
17
19
21
23
25
27
29
N.C.
N.C
-
N.C.
N.C
-
GND
E3V
I
E3V
N.C
-
GND
-
-
I
GND
-
N.C.
M97SY2-P3P
N.C
I
M97OT2-P3P
M97RS2-S3N
GND
-
I
M97IN2-E3P
GND
O
-
-
-
GND
X97BC2-P3P
I/O
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Appendices
Appendix. C Pin Assignment
C.10 CN3230 Keyboard connector (34-pin)
Table C-10 Keyboard connector (34-pin)
Pin No.
Signal Name
I/O
PinNo.
Signal Name
I/O
1
NUMLED-P5N
CAPLED-P5N
KBSC00-S3N
KBSC02-S3N
KBSC04-S3N
KBSC06-S3N
KBSC07-S3N
KBSC09-S3N
KBRT02-S3N
KBSC10-S3N
KBRT04-S3N
KBSC12-S3N
KBRT06-S3N
KBSC14-S3N
P5V
I
2
ARWLED-P5N
P5V
I
3
I
4
I
5
O
O
O
O
O
O
O
O
O
O
O
O
I
6
KBSC01-S3N
KBSC03-S3N
KBSC05-S3N
KBRT00-S3N
KBSC08-S3N
KBRT01-S3N
KBRT03-S3N
KBSC11-S3N
KBRT05-S3N
KBSC13-S3N
KBRT07-S3N
KBSC15-S3N
SP-P5V
O
O
O
O
O
O
O
O
O
O
O
O
I
7
8
9
10
12
14
16
18
20
22
24
26
28
30
32
34
11
13
15
17
19
21
23
25
27
29
31
33
SPX-PXP
I
SP-GND
I
SPY-PXP
I
P5V
I
C.11 CN3240 PAD connector (8-pin)
Table C-11 PAD connector (8-pin)
Pin No.
Signal Name
I/O
PinNo.
Signal Name
I/O
1
3
5
7
SP-P5V
O
O
2
4
6
8
SPX-PXP
SP-GND
IPDCLK-P5P
P5V
O
O
SPY-PXP
SP-GND
-
I/O
I
IPDDAT-P5P
I/O
C-16
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Appendix. C Pin Assignment
Appendices
C.12 CN3280 Panel sensor connector (3-pin)
Table C-12 Panel sensor connector (3-pin)
Pin No.
Signal Name
GND
GND
I/O
Pin No.
2
Signal Name
PNLTRN-S3N
I/O
O
1
3
-
-
C.13 CN3400 Debugging connector (4-pin)
Table C-13 Debugging connector (4-pin)
Pin No.
Signal Name
P3V
DBGTX-P3P
I/O
Pin No.
Signal Name
DBGRX-P3P
GND
I/O
O
-
1
3
-
I
2
4
C.14 J4100 Network I/F connector (14-pin)
Table C-14 Network I/F connector (14-pin)
Pin No.
Signal Name
I/O
Pin No.
Signal Name
I/O
A1
A3
A5
A7
A9
A11
B1
1T
BIDAP-PXP
BIDBP-PXP
BIDCN-PXP
BIDDP-PXP
LNK-P3N
I
A2
A4
BIDAN-PXN
BIDCP-PXP
BIDBN-PXN
BIDDN-PXN
P3V
I
I
-
-
A6
I
-
A8
-
I
I
A10
A12
B2
I
I
ACT-P3N
P3V
MDMTIP-E3P
GND
I/O
-
MDMRNG-E3P
GND
I/O
-
2T
TECRA M4 Maintenance Manual (960-521)
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Appendices
Appendix. C Pin Assignment
C.15 CN4200 IEEE1394 connector (4-pin)
Table C-15 IEEE1394 connector (4-pin)
Pin No.
Signal Name
I/O
Pin No.
Signal Name
I/O
1
3
TPB0-E3N
TPA0-E3N
I/O
I/O
2
4
TPB0-E3P
TPA0-E3P
I/O
I/O
C.16 CN4610 USB1 connector (Port 0) (4-pin)
Table C-16 USB1 connector (Port 0) (4-pin)
Pin No.
Signal Name
USBOPS-E5V
USBP0-S3P
I/O
Pin No.
Signal Name
USBP0-S3N
GND
I/O
1
3
I
I
2
4
I
-
C.17 CN4611 USB2 connector (Port 3) (4-pin)
Table C-17 USB2 connector (Port 3) (4-pin)
Pin No.
Signal Name
USBOPS-E5V
USBP3-S3P
I/O
Pin No.
Signal Name
USBP3-S3N
GND
I/O
1
3
I
I
2
4
I
-
C.18 CN4612 USB3 connector (Port 6) (6-pin)
Table C-18 USB3 connector (Port 6) (6-pin)
Pin No.
Signal Name
GND
I/O
Pin No.
Signal Name
GND
I/O
1
3
5
-
I
2
4
6
-
I
USBP6-S3N
GND
USBP6-S3P
GND
-
-
C-18
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Appendix. C Pin Assignment
Appendices
C.19 CN5501 LCD connector (20-pin)
Table C-19 LCD connector (20-pin)
Pin No.
Signal Name
GND
I/O
Pin No.
Signal Name
GND
I/O
1
3
-
2
-
I
I
I
I
I
I
I
I
-
TXCK0-PYP
TXCK0-PYN
TXDT0-PYP
TXDT0-PYN
TXDT2-PYN
TXDT2-PYP
TXDT1-PYN
TXDT1-PYP
GND
I
I
I
I
I
I
I
I
-
4
TXCK1-PYP
TXCK1-PYN
TXDT5-PYN
TXDT5-PYP
TXDT4-PYN
TXDT4-PYP
TXDT6-PYN
TXDT6-PYP
GND
5
6
7
8
9
10
12
14
16
18
20
11
13
15
17
19
C.20 CN6060 Internal microphone (left) connector (2-pin)
Table C-20 Internal microphone (left) connector (2-pin)
Pin No.
1
Signal Name
(IMICL-PXP)
I/O
O
Pin No.
2
Signal Name
A-GND
I/O
-
C.21 CN6061 Internal microphone (right) connector (2-pin)
Table C-21 Internal microphone (right) connector (2-pin)
Pin No.
1
Signal Name
(IMICR-PXP)
I/O
O
Pin No.
2
Signal Name
A-GND
I/O
-
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Appendices
Appendix. C Pin Assignment
C.22 J6070 External microphone connector (6-pin)
Table C-22 External microphone connector (6-pin)
Pin No.
Signal Name
A-GND
I/O
Pin No.
Signal Name
A-GND
I/O
1
2
3
-
4
5
6
I
I
(MICIN)
O
O
(A4R7-P4V)
(MICBIS-P2V)
(MICBIS-P2V)
O
C.23 CN6150 Speaker connector (4-pin)
Table C-23 Speaker connector (4-pin)
Pin No.
Signal Name
I/O
Pin No.
Signal Name
I/O
1
3
SP OUT (L-)
SP OUT (R+)
I
I
2
4
SP OUT (L+)
SP OUT (R-)
I
I
C.24 J6310 Headphone connector (6-pin)
Table C-24 Headphone connector (6-pin)
Pin No.
Signal Name
A-GND
I/O
Pin No.
Signal Name
I/O
1
3
5
-
I
I
2
4
6
HEADL-PXP
A-GND
I
-
-
HEADR-PXP
(A4R7-P4V)
N.C.
C.25 CN8800 DC-IN connector (4-pin)
Table C-25 DC-IN connector (4-pin)
Pin No.
Signal Name
PVL
GND
I/O
Pin No.
Signal Name
PVL
GND
I/O
1
3
O
-
2
4
O
-
C-20
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Appendix. C Pin Assignment
Appendices
C.26 CN8810 1st battery connector (10-pin)
Table C-26 1st battery connector (10-pin)
Pin No.
Signal Name
(PVBL1)
I/O
Pin No.
Signal Name
BTMP1
I/O
1
3
5
7
9
I
I
I
-
-
2
4
I
I
I
I
-
(DCHG)
PSCL-S5P
GND
(M5V)
6
PSDA-S5P
DBT10V-S5N
GND
8
GND
10
C.27 CN9990 RTC battery connector (3-pin)
Table C-27 RTC battery connector (3-pin)
Pin No.
Signal Name
R3V
I/O
Pin No.
2
Signal Name
N.C.
I/O
-
1
3
O
O
-
R3V
1T
GND
2T
GND
-
C.28 CN8770 Fan0 connector (3-pin)
Table C-28 Fan0 connector (3-pin)
Pin No.
Signal Name
(P5V)
FANG0-P3P
I/O
Pin No.
2
Signal Name
GND
I/O
-
1
3
I
I
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Appendices
Appendix. C Pin Assignment
C.29 CN8780 Fan1 connector (3-pin)
Table C-29 Fan1 connector (3-pin)
Pin No.
Signal Name
(P5V)
FANG0-P3P
I/O
Pin No.
2
Signal Name
GND
I/O
-
1
3
I
I
C.30 CN9502 CN Board I/F connector (40-pin)
Table C-30 CN Board I/F connector (40-pin)
Pin No.
Signal Name
GND
I/O
Pin No.
Signal Name
GND
I/O
1
-
-
I
2
-
-
I
3
GND
4
GND
5
RED-PXP
GND
6
TVLUMA-PXP
TV-GND
7
-
I
8
-
I
9
GREEN-PXP
GND
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
TVCHRO-PXP
TV-GND
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
-
I
-
I
BLUE-PXP
GND
SHSYNC-P3P
SVSYNC-P3P
CRTSCL-P5P
CRTSDA-P5P
GND
-
I
I
PVON-S5P
E5V
I
-
I
I
GPBTNA-S3N
GND
-
-
-
-
-
-
I
GND
GND
GND
PNLOFF-S3N
USB1PS-E5V
USB1PS-E5V
BTMDL-P3N
BT-P3V
GND
I
USBP4-S3N
USBP4-S3P
GND
I
I
-
O
I
-
O
-
BTRST-P3P
WCHCLK-P3P
GND
WCHDAT-P3P
GND
-
C-22
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Appendix. C Pin Assignment
Appendices
C.31 CN9540 Digitizer switch I/F connector (40-pin)
Table C-31 Digitizer switch I/F connector (40-pin)
Pin No.
Signal Name
GND
I/O
Pin No.
Signal Name
GND
I/O
1
2
-
-
-
-
-
-
-
-
-
-
-
O
I
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
-
I
GND
DGDTR-P3N
DGRTS-P3N
DGRXD-P3P
DGTXD-P3P
GND
3
GND
I
4
GND
O
I
5
GND
6
GND
-
7
GND
PCIRS1-S3N
P3V
I
8
GND
I
9
GND
GND
-
10
11
12
13
14
15
16
17
18
19
20
GND
PWRSW-S3N
GND
O
-
GND
PNL2-P3P
BRT1-P5P
BRT2DA-S3P
BRT0-P5P
FL-P5V
PNL-P3V
FL-P5V
PNL-P3V
FL-P5V
KBRT00-S3N
KBRT01-S3N
KBRT02-S3N
KBRT03-S3N
KBRT04-S3N
KBRT05-S3N
KBRT06-S3N
GND
O
O
O
O
O
O
O
-
I
I
I
I
I
I
I
KBSC16-S3N
I
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Appendices
Appendix. C Pin Assignment
CN board
C.32 CN4400 Bluetooth I/F connector (20-pin)
Table C-32 Bluetooth I/F connector (20-pin)
Pin No.
Signal Name
GND
I/O
Pin No.
Signal Name
N.C.
I/O
1
3
-
O
-
2
4
-
-
BTMDL-P3N
N.C.
N.C.
5
6
N.C.
-
7
N.C.
-
8
BTRST-S3P
N.C.
I
9
N.C.
-
10
12
14
16
18
20
2T
-
11
13
15
17
19
1T
GND
-
N.C.
-
(GND)
N.C.
I
WCHCLK-P3P
USBP4-S3P
WCHDAT-P3P
BT-P3V
GND
O
I/O
I
-
USBBP4-S3N
N.C.
I/O
-
-
GND
-
-
C.33 CN4621 USB I/F connector (for relay of port 6) (6-pin)
Table C-33 USB I/F connector (for relay of port 6) (6-pin)
Pin No.
Signal Name
GND
I/O
Pin No.
Signal Name
GND
I/O
1
3
5
-
I/O
-
2
4
6
-
I/O
-
- side
GND
+ side
GND
C-24
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Appendix. C Pin Assignment
Appendices
C.34 CN4620 USB I/F connector (port 6) (4-pin)
Table C-34 USB I/F connector (port 6) (4-pin)
Pin No.
Signal Name
I/O
Pin No.
Signal Name
+ side
I/O
1
3
USB1PS-E5V
- side
I
I/O
-
2
4
I/O
GND
GND
-
-
1T
3T
GND
2T
GND
-
C.35 CN5320 CRT I/F connector (15-pin)
Table C-35 CRT I/F connector (15-pin)
Pin No.
Signal Name
MRED-PXP
MBLUE-PXP
GND
I/O
PinNo.
Signal Name
MGREEN-PXP
N.C
I/O
1
3
I
I
-
-
I
-
I
I
2
4
I
-
-
-
-
I
5
6
VGAGND
GND
7
GND
8
9
DDC-P5V
N.C
10
12
14
GND
11
13
15
CRTSDA-P5P
SVSYNC-P3P
SHSYNC-P3P
CRTSCL-P5P
I
C.36 CN5340 S-VIDEO I/F connector (4-pin)
Table C-36 S-VIDEO I/F connector (4-pin)
Pin No.
Signal Name
GND
I/O
Pin No.
Signal Name
GND
I/O
1
3
-
I
2
4
-
I
LUMINA-PYP
GND
CHROMA-PYP
GND
1T
3T
-
-
2T
4T
-
-
GND
GND
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Appendices
Appendix. C Pin Assignment
C.37 CN9521 QI board I/F connector (2-pin)
Table C-37 QI board I/F connector (2-pin)
Pin No.
1
Signal Name
I/O
I
Pin No.
2
Signal Name
GND
I/O
-
GPBTNA-S3N
C.38 CN9523 MG board I/F connector (3-pin)
Table C-38 MG board I/F connector (3-pin)
Pin No.
Signal Name
PNLOFF-S3N
GND
I/O
Pin No.
2
Signal Name
N.C.
I/O
-
1
3
I
-
C-26
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Appendix. C Pin Assignment
Appendices
C.39 CN9520 System board I/F connector (40-pin)
Table C-39 System board I/F connector (40-pin)
Pin No.
Signal Name
GND
I/O
Pin No.
Signal Name
GND
I/O
1
-
-
I
2
-
-
I
3
GND
4
GND
5
MRED-PXP
GND
6
TVLUMA-PXP
TV-GND
7
-
I
8
-
I
9
MGREEN-PXP
GND
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
TVCHRO-PXP
TV-GND
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
-
I
-
I
MBLUE-PXP
GND
SHSYNC-P3P
SVSYNC-P3P
CRTSCL-P5P
CRTSDA-P5P
GND
-
I
I
PVON-S5P
E5V
I
-
I
I
GPBTNA-S3N
GND
-
-
-
-
-
-
I
GND
GND
GND
PNLOFF-S3N
USB1PS-E5V
USB1PS-E5V
BTMDL-P3N
BT-P3V
GND
I
USBP4-S3N
USBP4-S3P
GND
I
I
-
O
I
-
O
-
BTRST-P3P
WCHCLK-P3P
GND
WCHDAT-P3P
GND
-
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Appendices
Appendix. C Pin Assignment
QI board
C.40 CN9530 CN board I/F connector (2-pin)
Table C-40 CN board I/F connector (2-pin)
Pin No.
1
Signal Name
I/O
I
Pin No.
2
Signal Name
GND
I/O
-
GPBTNA-S3N
SW board
C.41 CN9510 System board I/F connector (12-pin)
Table C-41 System board I/F connector (12-pin)
Pin No.
Signal Name
PWRSW-S3N
GND
I/O
I
Pin No.
Signal Name
KBRT03-S3N
KBRT04-S3N
KBRT05-S3N
KBRT06-S3N
GND
I/O
O
O
O
O
-
1
2
3
4
5
6
7
8
-
KBSC16-S3N
KBRT00-S3N
KBRT01-S3N
KBRT02-S3N
I
9
O
O
O
10
11
12
GND
-
C-28
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Appendix D Keyboard Scan/Character Codes
Appendices
Appendix D
Keyboard Scan/Character Codes
Appendix D Keyboard Scan/Character Codes
Table D-1 Scan codes (set 1 and set 2) (1/4)
Cap
No.
Code set 1
Code set 2
Break
Note
Keytop
Make
Break
Make
01
02
03
04
05
06
07
08
09
10
11
12
13
‘ ~
1 !
29
02
03
04
05
06
07
08
09
0A
0B
0C
0D
A9
82
83
84
85
86
87
88
89
8A
8B
8C
8D
0E
16
1E
26
25
2E
36
3D
3E
46
45
4E
55
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
0E
16
1E
26
25
2E
36
3D
3E
46
45
4E
55
2 @
3 #
4 $
5 %
6 ^
7 &
8 *
*2
*2
*2
*2
9 (
0 )
- _
= +
15
16
17
18
19
20
21
22
23
24
25
26
27
28
BkSp
Tab
Q
0E
0F
10
11
12
13
14
15
16
17
18
19
1A
1B
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
66
0D
15
1D
24
2D
2C
35
3C
43
44
4D
54
5B
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
66
0D
15
1D
24
2D
2C
35
3C
43
44
4D
54
5B
W
E
R
T
Y
U
*2
*2
*2
*2
I
O
P
[ {
] }
TECRA M4 Maintenance Manual (960-521)
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Appendices
Appendix D Keyboard Scan/Character Codes
Table D-1 Scan codes (set 1 and set 2) (2/4)
Cap
No.
Code set 1
Code set 2
Break
Note
Keytop
Make
Break
Make
29
30
31
32
33
34
35
36
37
38
39
40
41
\ |
2B
3A
1E
1F
20
21
22
23
24
25
26
27
28
AB
BA
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
5D
58
1C
1B
23
2B
34
33
3B
42
4B
4C
52
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
5D
58
1C
1B
23
2B
34
33
3B
42
4B
4C
52
*5
Caps Lock
A
S
D
F
G
H
J
*2
*2
*2
*2
K
L
; :
‘ “
43
44
45
Enter
1C
2A
56
9C
AA
D6
5A
12
61
F0
F0
F0
5A
12
61
*3
Shift (L)
No.102
key
46
47
48
49
50
51
52
53
54
55
Z
X
2C
2D
2E
2F
30
31
32
33
34
35
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
1A
22
21
2A
32
31
3A
41
49
4A
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
1A
22
21
2A
32
31
3A
41
49
4A
C
V
B
N
M
*2
*2
*2
*2
, <
. >
/ ?
57
Shift (R)
36
B6
59
F0
59
D-2
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Appendix D Keyboard Scan/Character Codes
Appendices
Table D-1 Scan codes (set 1 and set 2) (3/4)
Cap
No.
Code set 1
Code set 2
Break
Note
Keytop
Make
Break
Make
58
Ctrl
1D
9D
14
F0
14
*3
*3
60
61
62
Alt (L)
Space
38
39
B8
B9
11
29
F0
F0
11
29
11
ALT (R)
E0 38
E0 B8 E0 11
E0
F0
75
76
Ins
E0 52
E0 53
E0 D2 E0 70
E0 D3 E0 71
E0
E0
F0
F0
70
71
*1
*1
Del
79
80
81
E0 4B E0 CB E0 6B E0
F0
F0
F0
6B
6C
69
*1
*1
*1
←
Home
End
E0 47
E0 4F
E0 C7 E0 6C E0
E0 CF E0 69
E0
83
84
85
86
E0 48
E0 50
E0 49
E0 51
E0 C8 E0 75
E0 D0 E0 72
E0
E0
F0
F0
F0
F0
75
72
7D
7A
*1
*1
*1
*1
↑
↓
PgUp
PgDn
E0 C9 E0 7D E0
E0 D1 E0 7A E0
89
E0 4D E0 CD E0 74
E0
F0
74
*1
→
110
112
113
114
115
116
117
118
119
120
121
Esc
F1
F2
F3
F4
F5
F6
F7
F8
F9
F10
01
3B
3C
3D
3E
3F
40
41
42
43
44
81
BB
BC
BD
BE
BF
C0
C1
C2
C3
C4
76
05
06
04
0C
03
0B
83
0A
01
09
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
76
05
06
04
0C
03
0B
83
0A
01
09
*3
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Appendices
Appendix D Keyboard Scan/Character Codes
Table D-1 Scan codes (set 1 and set 2) (4/4)
Cap
No.
Code set 1
Make Break
Code set 2
Break
Note
Keytop
Make
78
122
123
124
F11
F12
57
58
*6
D7
D8
*6
F0
F0
*6
78
07
*3
07
*6
*3
*6
PrintSc
126
Pause
*7
*7
*7
*7
*7
*4
202
203
204
Fn
—
—
—
—
1F E0
2F E0
Win
App
E0
E0
5B E0 DB E0
5D E0 DD E0
F0
F0
1F
2F
Notes:
1. * Scan codes differ by mode.
2. * Scan codes differ by overlay function.
3. * Combination with the Fn key makes different codes.
4. * Fn key does not generate a code by itself.
5. * This key corresponds to key No. 42 in a 102-key model.
6. * Refer to Table D-6, No. 124 key scan code.
7. * Refer to Table D-7, No. 126 key scan code.
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Appendix D Keyboard Scan/Character Codes
Appendices
Table D-2 Scan codes with left Shift key
Cap
No.
Key
top
Code set 1
Code set 2
Make
Break
Make
Break
55
75
76
79
80
81
83
84
85
86
89
203
204
/
E0 AA E0 35 E0 B5 E0 2A E0 F0 12 E0 4A E0 F0 4A E0 12
E0 AA E0 52 E0 D2 E0 2A E0 F0 12 E0 70 E0 F0 70 E0 12
E0 AA E0 53 E0 D3 E0 2A E0 F0 12 E0 71 E0 F0 71 E0 12
E0 AA E0 4B E0 CB E0 2A E0 F0 12 E0 6B E0 F0 6B E0 12
INS
DEL
←
Home E0 AA E0 47 E0 C7 E0 2A E0 F0 12 E0 6C E0 F0 6C E0 12
End
↑
E0 AA E0 4F E0 CF E0 2A E0 F0 12 E0 69 E0 F0 69 E0 12
E0 AA E0 48 E0 C8 E0 2A E0 F0 12 E0 75 E0 F0 75 E0 12
E0 AA E0 50 E0 D0 E0 2A E0 F0 12 E0 72 E0 F0 72 E0 12
↓
PgUp E0 AA E0 49 E0 C9 E0 2A E0 F0 12 E0 7D E0 F0 7D E0 12
PgDn E0 AA E0 51 E0 D1 E0 2A E0 F0 12 E0 7A E0 F0 7A E0 12
E0 AA E0 4D E0 CD E0 2A E0 F0 12 E0 74 E0 F0 74 E0 12
E0 AA E0 5B E0 DB E0 2A E0 F0 12 E0 1F E0 F0 1F E0 12
E0 AA E0 5D E0 DD E0 2A E0 F0 12 E0 2F E0 F0 2F E0 12
→
Win
App
Note : The table above shows scan codes with the left Shift key. In combination with the
right Shift key, scan codes are changed as listed below:
With left Shift
With right Shift
Set 1
Set 2
E0 AA __________ E0 B6
E0 2A ___________ E0 36
E0 F0 12 ________ E0 F0 59
E0 12 ___________ E0 59
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Appendices
Appendix D Keyboard Scan/Character Codes
Table D-3 Scan codes in Numlock mode
Cap
Key
top
Code set 1
Code set 2
No.
Make
Break
Make
Break
75
76
INS
DEL
←
E0 2A E0 52 E0 D2 E0 AA E0 12 E0 70 E0 F0 70 E0 F0 12
E0 2A E0 53 E0 D3 E0 AA E0 12 E0 71 E0 F0 71 E0 F0 12
E0 2A E0 4B E0 CB E0 AA E0 12 E0 6B E0 F0 6B E0 F0 12
79
80
Home E0 2A E0 47 E0 C7 E0 AA E0 12 E0 6C E0 F0 6C E0 F0 12
81
End
↑
E0 2A E0 4F E0 CF E0 AA E0 12 E0 69 E0 F0 69 E0 F0 12
E0 2A E0 48 E0 C8 E0 AA E0 12 E0 75 E0 F0 75 E0 F0 12
E0 2A E0 50 E0 D0 E0 AA E0 12 E0 72 E0 F0 72 E0 F0 12
83
84
↓
85
PgUp E0 2A E0 49 E0 C9 E0 AA E0 12 E0 7D E0 F0 7D E0 F0 12
PgDn E0 2A E0 51 E0 D1 E0 AA E0 12 E0 7A E0 F0 7A E0 F0 12
86
89
E0 2A E0 4D E0 CD E0 AA E0 12 E0 74 E0 F0 74 E0 F0 12
E0 2A E0 5B E0 DB E0 AA E0 12 E0 1F E0 F0 1F E0 F0 12
E0 2A E0 5D E0 DD E0 AA E0 12 E0 2F E0 F0 2F E0 F0 12
→
203
204
Win
App
Table D-4 Scan codes with Fn key
Cap
Code set 1
Make Break
Code set 2
Break
No.
Keytop
Make
5A
43
58
ENT
CTRL
E0
E0
E0
1C
1D
38
E0
E0
E0
9C
9D
B8
E0
E0
E0
E0
E0
E0
F0
F0
F0
5A
14
11
14
11
60
LALT
121
122
123
ARROW
NUMERIC
Scrl
45
45
46
C5
77
77
7E
F0
F0
F0
77
77
7E
C5
C5
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Appendix D Keyboard Scan/Character Codes
Appendices
Table D-5 Scan codes in overlay mode
Cap
No.
Keytop
Code set 1
Break
Code set 2
Break
Make
47
Make
6C
75
08
09
10
11
23
24
25
26
37
38
39
40
52
54
55
7
8
9
0
U
I
(7)
C7
C8
C9
B7
CB
CC
CD
CA
CF
D0
D1
CE
D2
D3
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
F0
6C
75
7D
7C
6B
73
74
7B
69
72
7A
79
70
71
(8)
(9)
(*)
48
49
7D
7C
6B
73
37
(4)
(5)
(6)
(–)
(1)
(2)
(3)
(+)
(0)
(.)
4B
4C
4D
4A
4F
50
O
P
J
K
L
;
74
7B
69
72
51
7A
79
4E
52
M
.
70
53
71
/
(/)
E0
35
E0
B5
40
4A
E0
F0
4A
Table D-6 No.124 key scan code
Key
top
Shift
Code set 1
Code set 2
Make
Break
Make
Break
Prt Sc Common E0 2A E0 37 E0 B7 E0 AA E0 12 E0 7C E0 F0 7C E0 F0 12
E0 37
E0 37
54
E0 B7
E0 B7
D4
E0 7C
E0 7C
84
E0 F0 7C
E0 F0 7C
F0 B4
Ctrl +
Shift +
Alt +
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Appendices
Appendix D Keyboard Scan/Character Codes
Table D-7 No.126 key scan code
Key
top
Shift
Code set 1
Make
Code set 2
Make
Pause Common* E1 1D 45 E1 9D C5 E1 14 77 E1 F0 14
Ctrl* E0 46 E0 C6 E0 7E E0 F0 7E
F0 77
*: This key generates only make codes.
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Appendix. E Key Layout
Appendices
Appendix. E
Key Layout
Appendix E Key Layout
Figure E-1 Key layout (UK)
Figure E-2 Key layout (US)
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Appendices
Appendix. E Key Layout
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Appendix F Wiring Diagrams
Appendices
Appendix F
Appendix F Wiring Diagrams
F.1 LAN Loopback Connector
Figure F-1 LAN loopback Connector
F.2 RS-232C Cable (9-pin to 9-pin)
Figure F-2 RS-232C cable (9-pin to 9-pin)
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Appendices
Appendix F Wiring Diagrams
F.3 RS-232C Cable (9-pin to 25-pin)
Figure F-3 RS-232C cable (9-pin to 25-pin)
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Appendix G BIOS Rewrite Procedures
Appendices
Appendix G BIOS Rewrite Procedures
This Appendix explains how to rewrite the system BIOS program when you update the
system BIOS.
Tools
To rewrite the BIOS, you need the following tool:
‰ BIOS rewriting disk for the computer that has renewed BIOS data.
Rewriting the BIOS
Note: 1. Connect the AC adaptor to the computer when you rewrite the BIOS.
2. Do not turn off the power while you are rewriting the BIOS.
If the rewrite fails, it might be impossible to start up the computer.
3. If you fail to rewrite BIOS, then when you next turn on the power, a message
may be displayed that the contents of the BIOS have been damaged. In this
case, insert the BIOS rewriting disk and the BIOS will be rewritten.
1. Set the system to boot mode.
2. Turn off the power to the computer.
3. Remove the external cable and PC card.
4. Connect a USB FDD and insert the BIOS rewriting disk into either the USB FDD.
5. Turn on the power while holding down the
The BIOS rewriting starts.
key (US) or
key (UK).
6. When the process is completed, eject the BIOS rewriting disk and the system is reset.
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Appendices
Appendix G BIOS Rewrite Procedures
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Appendix H EC/KBC Rewrite Procedures
Appendices
Appendix H
Appendix H EC/KBC Rewrite Procedures
This Appendix explains how to rewrite the EC/KBC system program when you update the
EC/KBC system.
Tools
To rewrite the EC/KBC, you need the following tool:
‰ EC/KBC rewriting disk for the computer
Rewriting the EC/KBC
NOTE: 1. Rewrite the EC/KBS only when instructed by a diagnostic disk release
notice.
2. Be sure to connect both battery and AC adapter to the computer when you
rewrite the EC/KBC.
3. Do not turn off the power while you are rewriting the EC/KBC.
If the rewrite fails, it might be impossible to start up the computer.
4. If you fail to rewrite EC/KBC, then when you next turn on the power, a
message may be displayed that the content of the EC/KBC has been erased.
In this case, insert the EC/KBC rewriting disk, and the EC/KBC will be
rewritten.
5. The time of rewriting EC/KBC depends on the conditions of the computer or
ICs. The computer is not hung up. Allow sufficient time. Never reboot or
turn off the power to the computer before the rewriting is completed.
1. Set the system to boot mode.
2. Turn off the power to the computer.
3. Remove the external cable and PC Card.
4. Connect a USB FDD and insert the EC/KBC rewriting disk into the USB FDD.
5. Turn on the power while holding down the Tab key. The EC/KBC rewriting starts.
6. When the EC/KBC rewrite is completed, the system is automatically turned off.
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Appendices
Appendix H EC/KBC Rewrite Procedures
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Appendix I Reliability
Appendices
Appendix I
Appendix I Reliability
The following table shows MTBF (Mean Time between Failures).
Table I-1 MTBF
MTBF
Time (hours)
5,141
System
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Appendices
Appendix I Reliability
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