Texas Instruments Stereo Amplifier TPA3008D2 User Manual

TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
10-W STEREO CLASS-D AUDIO POWER AMPLIFIER  
FEATURES  
DESCRIPTION  
10-W/Channel Into an 16-Load From a  
The TPA3008D2 is a 10-W (per channel) efficient,  
class-D audio amplifier for driving bridged-tied stereo  
speakers. The TPA3008D2 can drive stereo speakers  
as low as 8 . The high efficiency of the TPA3008D2  
eliminates the need for external heatsinks when  
playing music.  
17-V Supply  
Up to 92% Efficient, Class-D Operation  
Eliminates Need For Heatsinks  
8.5-V to 18-V Single-Supply Operation  
Four Selectable, Fixed Gain Settings  
The gain of the amplifier is controlled by two gain  
select pins. The gain selections are 15.3, 21.2, 27.2,  
and 31.8 dB.  
Differential Inputs Minimizes Common-Mode  
Noise  
Space-Saving, Thermally Enhanced  
PowerPAD™ Packaging  
The outputs are fully protected against shorts to  
GND, VCC, and output-to-output shorts. A fault ter-  
minal allows short-circuit fault reporting and automatic  
recovery. Thermal protection ensures that the maxi-  
mum junction temperature is not exceeded.  
Thermal and Short-Circuit Protection  
With Auto Recovery Option  
Pinout Similar to TPA3000D Family  
APPLICATIONS  
LCD Monitors and TVs  
All-In-One PCs  
PVCC  
PVCC  
10 µF  
10 µF  
220 nF  
220 nF  
0.1 µF  
0.1 µF  
1 µF  
Shutdown/Mute  
Control  
VCLAMPR  
SHUTDOWN  
NC  
RINN  
Right Differential  
Inputs  
0.47 µF  
0.47 µF  
0.47 µF  
0.47 µF  
0.47 µF  
NC  
RINP  
AVCC  
AVCC  
V2P5  
LINP  
Left Differential  
Inputs  
NC  
LINN  
NC  
AGND  
10 µF  
0.1 µF  
TPA3008D2  
AVDDREF  
NC  
AVDD  
1 µF  
GAIN0  
GAIN1  
FAULT  
COSC  
Gain  
Control  
220 pF  
ROSC  
120 kΩ  
AGND  
VCLAMPL  
NC  
1 µF  
0.1 µF  
0.1 µF  
10 µF  
10 µF  
220 nF  
PVCC  
220 nF  
PVCC  
†Optional output filter for EMI suppression  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004, Texas Instruments Incorporated  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
AVAILABLE OPTIONS  
TA  
PACKAGED DEVICE  
48-PIN HTQFP (PHP)(1)  
-40°C to 85°C  
TPA3008D2PHP  
(1) The PHP package is available taped and reeled. To order a taped  
and reeled part, add the suffix R to the part number (e.g.,  
TPA3008D2PHPR).  
DC ELECTRICAL CHARACTERISTICS  
TA = 25°C, VCC = 12 V, RL = 8 (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
5
MAX  
UNIT  
mV  
V
Class-D output offset voltage  
(measured differentially)  
INN and INP connected together,  
Gain = 31.8 dB  
|VOO  
|
2
55  
V2P5  
AVDD  
2.5-V Bias voltage  
No load  
2.5  
5
IL = 10 mA, SHUTDOWN = 2 V,  
VCC = 8.5 V to 18 V  
+5-V internal supply voltage  
4.5  
5.5  
V
PSRR  
ICC  
Power supply rejection ratio  
Quiescent supply current  
VCC = 11.5 V to 12.5 V  
-76  
11  
dB  
SHUTDOWN = 2 V, no load  
22  
25  
mA  
Quiescent supply current in shut-  
down mode  
ICC(SD)  
SHUTDOWN = 0 V  
1.6  
µA  
High side  
600  
500  
1100  
15.3  
21.2  
27.2  
31.8  
16  
VCC = 12 V,  
Drain-source on-state resistance IO = 1 A,  
rDS(on)  
Low side  
mΩ  
TJ = 25°C  
Total  
1300  
16.2  
21.8  
27.8  
32.5  
GAIN0 = 0.8 V  
GAIN0 = 2 V  
GAIN0 = 0.8 V  
GAIN0 = 2 V  
14.6  
20.5  
26.4  
31.1  
GAIN1 = 0.8 V  
G
Gain  
dB  
GAIN1 = 2 V  
ton  
toff  
Turnon time  
Turnoff time  
C(V2P5) = 1 µF, SHUTDOWN = 2 V  
C(V2P5) = 1 µF, SHUTDOWN = 0.8 V  
ms  
µs  
60  
AC ELECTRICAL CHARACTERISTICS  
TA = 25°C, VCC = 12 V, RL = 8 , (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
200 mVPP ripple from 20 Hz to 1 kHz,  
Gain = 15.6 dB, Inputs ac-coupled to GND  
kSVR Supply voltage rejection ratio  
-70  
dB  
THD+N = 0.13%, f = 1 kHz, RL = 8 Ω  
5
THD+N = 10%, f = 1 kHz, RL = 8 Ω  
8.5  
THD+N = 0.16%, f = 1 kHz, RL = 16 ,  
VCC = 17 V  
PO  
Continuous output power  
W
5
THD+N = 10%, f = 1 kHz, RL = 16 ,  
VCC = 17 V  
10  
Total harmonic distortion plus  
noise  
THD+N  
Vn  
PO = 1 W, f = 1 kHz, RL = 8 Ω  
0.1%  
20 Hz to 22 kHz, A-weighted filter,  
Gain = 15.6 dB  
Output integrated noise floor  
Crosstalk  
-80  
-93  
dB  
dB  
PO = 1 W, RL = 8 , Gain = 15.6 dB,  
f = 1 kHz  
Maximum output at THD+N < 0.5%,  
f = 1 kHz, Gain = 15.6 dB  
SNR  
Signal-to-noise ratio  
97  
dB  
Thermal trip point  
Thermal hystersis  
150  
20  
°C  
°C  
3
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
FUNCTIONAL BLOCK DIAGRAM  
V2P5  
PVCC  
V2P5  
VClamp  
Gen  
VCLAMPR  
BSRN  
PVCCR(2)  
Gate  
Drive  
ROUTN(2)  
Deglitch  
and  
PWM  
Mode  
Logic  
PGNDR  
BSRP  
PVCCR(2)  
RINN  
Gain  
Adj.  
RINP  
V2P5  
Gate  
Drive  
ROUTP(2)  
PGNDR  
To Gain Adj.  
Blocks and  
Start-up Logic  
4
GAIN0  
GAIN1  
Gain  
Control  
FAULT  
V2P5  
SC  
Detect  
ROSC  
COSC  
Ramp  
Start-up and  
Protection  
Logic  
Biases  
Generator  
Thermal  
VDDok  
VCCok  
VDD  
and  
References  
AVCC  
AV REF  
DD  
AVDD  
AVCC  
5-V LDO  
AVDD  
PVCC  
AGND(2)  
VCLAMPL  
TTL Input  
Buffer  
(VCC Compl)  
SHUTDOWN  
VClamp  
Gen  
BSLN  
PVCCL(2)  
Gate  
Drive  
LOUTN(2)  
V2P5  
Deglitch  
and  
PWM  
Mode  
Logic  
PGNDL  
BSLP  
PVCCL(2)  
LINN  
LINP  
Gain  
Adj.  
Gate  
Drive  
LOUTP(2)  
PGNDL  
4
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
PHP PACKAGE  
(TOP VIEW)  
48 47 46 45 44 43 42 41 40 39 38 37  
1
2
3
4
5
6
7
8
9
10  
36  
35  
34  
33  
32  
VCLAMPR  
NC  
SHUTDOWN  
RINN  
RINP  
NC  
AV  
V2P5  
CC  
LINP  
NC  
LINN  
NC  
31  
30  
29  
28  
27  
26  
TPA3008D2  
AV REF  
AGND  
DD  
AV  
NC  
GAIN0  
GAIN1  
FAULT  
NC  
DD  
COSC  
ROSC  
11  
12  
AGND  
VCLAMPL  
25  
13 14 15 16 17 18 19 20 21 22 23 24  
5
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
TERMINAL FUNCTIONS  
PIN NAME  
AGND  
PIN NUMBER  
26, 30  
I/O  
DESCRIPTION  
-
-
Analog ground for digital/analog cells in core  
AVCC  
33  
High-voltage analog power supply, not connected internally to PVCCR or PVCCL  
5-V Regulated output for use by internal cells and GAIN0, GAIN1 pins only. Not  
specified for driving other external circuitry.  
AVDD  
29  
O
AVDDREF  
BSLN  
7
O
5-V Reference output—connect to gain setting resistor or directly to GAIN0, GAIN1.  
Bootstrap I/O for left channel, negative high-side FET  
13  
24  
48  
37  
28  
-
-
BSLP  
Bootstrap I/O for left channel, positive high-side FET  
BSRN  
BSRP  
-
Bootstrap I/O for right channel, negative high-side FET  
-
Bootstrap I/O for right channel, positive high-side FET  
COSC  
I/O  
I/O for charge/discharging currents onto capacitor for ramp generator.  
Short-circuit detect fault output.  
FAULT = high, short-circuit detected.  
FAULT = low, normal operation.  
FAULT  
11  
O
Status is reset when power is cycled or SHUTDOWN is cycled.  
GAIN0  
GAIN1  
LINN  
9
10  
I
I
Gain select least significant bit. TTL logic levels with compliance to AVDD.  
Gain select most significant bit. TTL logic levels with compliance to AVDD  
.
6
I
Negative audio input for left channel  
LINP  
5
I
Positive audio input for left channel  
LOUTN  
LOUTP  
16, 17  
20, 21  
O
O
Class-D 1/2-H-bridge negative output for left channel  
Class-D 1/2-H-bridge positive output for left channel  
8, 12, 31, 32,  
34, 35  
NC  
-
No internal connection  
PGNDL  
PGNDR  
18, 19  
42, 43  
-
-
Power ground for left channel H-bridge  
Power ground for right channel H-bridge  
Power supply for left channel H-bridge (internally connected to pins 22 and 23), not  
connected to PVCCR or AVCC  
PVCCL  
PVCCL  
PVCCR  
PVCCR  
14, 15  
22, 23  
38, 39  
46, 47  
-
-
-
-
.
Power supply for left channel H-bridge (internally connected to pins 14 and 15), not  
connected to PVCCR or AVCC  
.
Power supply for right channel H-bridge (internally connected to pins 46 and 47),  
not connected to PVCCL or AVCC  
.
Power supply for right channel H-bridge (internally connected to pins 38 and 39),  
not connected to PVCCL or AVCC  
.
RINP  
3
2
I
I
Positive audio input for right channel  
RINN  
Negative audio input for right channel  
ROSC  
ROUTN  
ROUTP  
27  
I/O  
O
O
I/O current setting resistor for ramp generator.  
44, 45  
40, 41  
Class-D 1/2-H-bridge negative output for right channel  
Class-D 1/2-H-bridge positive output for right channel  
Shutdown signal for IC (low = shutdown, high = operational). TTL logic levels with  
SHUTDOWN  
1
I
compliance to VCC  
.
VCLAMPL  
VCLAMPR  
V2P5  
25  
36  
4
-
-
Internally generated voltage supply for left channel bootstrap capacitors.  
Internally generated voltage supply for right channel bootstrap capacitors.  
2.5-V Reference for analog cells.  
O
Connect to AGND and PGND—should be the center point for both grounds. Internal  
resistive connection to AGND.  
Thermal Pad  
-
-
6
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
TYPICAL CHARACTERISTICS  
TABLE OF GRAPHS  
FIGURE  
THD+N  
THD+N  
Total harmonic distortion + noise  
Total harmonic distortion + noise  
Closed-loop response  
Output power  
vs Frequency  
1, 2, 3, 4  
5, 6  
7
vs Output power  
vs Supply voltage  
vs Output power  
vs Total output power  
vs Total output power  
vs Frequency  
8, 9  
10  
Efficiency  
Efficiency  
11  
VCC  
Supply current  
12  
Crosstalk  
13  
kSVR  
Supply ripple rejection ratio  
Commom-mode rejection ratio  
vs Frequency  
14  
CMRR  
vs Frequency  
15  
TOTAL HARMONIC DISTORTION + NOISE  
TOTAL HARMONIC DISTORTION + NOISE  
vs  
vs  
FREQUENCY  
FREQUENCY  
10  
10  
V
= 18 V,  
CC  
V
= 12 V,  
CC  
R = 16 W,  
Gain = 21.6 dB  
L
R = 16 W,  
Gain = 21.6 dB  
L
1
1
P
O
= 0.5 W  
0.1  
0.1  
0.01  
P
O
= 2.5 W  
P
O
= 1 W  
P
= 1 W  
O
0.01  
P
= 2.5 W  
O
P
O
= 0.5 W  
0.005  
20  
100  
1 k  
10 k 20 k  
1 k  
20  
100  
10 k 20 k  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 1.  
Figure 2.  
7
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
TOTAL HARMONIC DISTORTION + NOISE  
TOTAL HARMONIC DISTORTION + NOISE  
vs  
vs  
FREQUENCY  
FREQUENCY  
10  
10  
V
CC  
= 12 V,  
V
= 18 V,  
CC  
R = 8 W  
Gain = 21.6 dB  
R = 8 W,  
Gain = 21.6 dB  
L
L
1
1
P
O
= 2.5 W  
P
O
= 0.5 W  
0.1  
P
O
= 1 W  
0.1  
P
O
= 1 W  
P
O
= 2.5 W  
0.01  
P
O
= 5 W  
0.01  
0.005  
20  
100  
20  
100  
1 k  
10 k 20 k  
1 k  
10 k 20 k  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 3.  
Figure 4.  
TOTAL HARMONIC DISTORTION + NOISE  
TOTAL HARMONIC DISTORTION + NOISE  
vs  
vs  
OUTPUT POWER  
OUTPUT POWER  
20  
10  
10  
V
= 12 V,  
V
= 18 V,  
CC  
CC  
R = 8 W,  
R = 16 W,  
L
L
Gain = 21.6 dB  
Gain = 21.6 dB  
1
1
1 kHz  
0.1  
1 kHz  
0.1  
20 kHz  
20 Hz  
20 kHz  
20 Hz  
0.01  
0.01  
20m  
100 m 200 m  
1
2
10 20  
20m  
100 m 200 m  
1
2
10 20  
P
− Output Power − W  
P
− Output Power − W  
O
O
Figure 5.  
Figure 6.  
8
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
OUTPUT POWER  
vs  
SUPPLY VOLTAGE  
CLOSED-LOOP RESPONSE  
40  
12  
11  
10  
9
R = 16 W  
L
150  
100  
50  
36  
32  
28  
24  
20  
16  
12  
8
THD+N = 10%  
Gain  
8
7
Phase  
0
6
5
THD+N = 1%  
−50  
4
3
V
= 12 V,  
CC  
−100  
−150  
R = 8 Ω,  
Gain = 32 dB  
33 kHz, RC LPF  
L
2
4
1
0
0
10  
100  
1k  
10k  
80k  
10 11 12 13 14 15 16 17 18  
8
9
V
CC  
− Supply Voltage − V  
f − Frequency − Hz  
Figure 7.  
Figure 8.  
OUTPUT POWER  
vs  
SUPPLY VOLTAGE  
EFFICIENCY  
vs  
OUTPUT POWER  
12  
100  
V
CC  
= 18 V,  
R = 8 W  
L
R = 16 W  
L
11  
10  
90  
80  
9
8
7
70  
60  
50  
THD+N = 10%  
6
5
4
3
40  
30  
20  
10  
THD+N = 1%  
Power represented by dashed line  
may require external heatsinking  
2
0
8
9
10  
11  
12  
13  
14  
0
1
2
3
4
5
6
7
8
9
10  
V
CC  
− Supply Voltage − V  
P
O
− Output Power (Per Channel) − W  
Figure 9.  
Figure 10.  
9
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
EFFICIENCY  
SUPPLY CURRENT  
vs  
TOTAL OUTPUT POWER  
vs  
TOTAL OUTPUT POWER  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
2.0  
1.8  
1.6  
LC Filter,  
Resistive Load,  
Stereo Operation  
16 W  
8 W  
V
= 12 V,  
R = 8 W  
L
CC  
1.4  
1.2  
1
V
CC  
= 12 V,  
R = 16 W  
L
0.8  
0.6  
0.4  
0.2  
V
= 18 V,  
CC  
R = 16 W  
L
V
= 12 V,  
CC  
LC Filter,  
Resistive Load,  
Stereo Operation  
0
0
1
2
3
4
5
6
7
8
9
10 11 12  
0
2
4
6
8
10 12 14 16 18 20  
P
O
− Total Output Power − W  
P
O
− Total Output Power − W  
Figure 11.  
Figure 12.  
CROSSTALK  
vs  
FREQUENCY  
SUPPLY RIPPLE REJECTION RATIO  
vs  
FREQUENCY  
0
0
V
P
= 12 V,  
= 2.5 W,  
CC  
−10  
O
V
CC  
= 12 V,  
−10  
Gain = 21.6 dB  
R = 8W  
V
= 200 mV ,  
PP  
(RIPPLE)  
−20  
L
R = 8 W,  
L
−20  
−30  
−40  
−50  
Gain = 15.6 dB  
−30  
−40  
−50  
−60  
−70  
−60  
−70  
−80  
−90  
−80  
−90  
−100  
−100  
20  
100  
1 k  
10 k 20 k  
20  
100  
1 k  
10 k 20 k  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 13.  
Figure 14.  
10  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
COMMON-MODE REJECTION RATIO  
vs  
FREQUENCY  
0
V
CC  
= 12 V,  
Gain = 15.6 dB,  
R = 8 W,  
L
−10  
Output Referred  
−20  
−30  
−40  
−50  
−60  
−70  
20  
100  
1 k  
10 k 20 k  
f − Frequency − Hz  
Figure 15.  
11  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
APPLICATION INFORMATION  
*
*
1 nF  
1 nF  
PVCC  
220 nF  
PVCC  
220 nF  
10 mF  
0.1 mF  
10 mF  
0.1 mF  
1 mF  
Shutdown/Mute  
Control  
SHUTDOWN  
VCLAMPR  
RINN  
NC  
NC  
Right Differential  
0.47 mF  
0.47 mF  
0.47 mF  
0.47 mF  
0.47 mF  
Inputs  
RINP  
AVCC  
V2P5  
AVCC  
LINP  
Left Differential  
Inputs  
NC  
NC  
LINN  
0.1 mF  
10 mF  
TPA3008D2  
AVDDREF  
NC  
AGND  
AVDD  
COSC  
1 mF  
GAIN0  
GAIN1  
Gain  
Control  
220 pF  
ROSC  
120 kW  
Fault Reporting  
AGND  
FAULT  
NC  
VCLAMPL  
1 mF  
0.1 mF  
0.1 mF  
10 mF  
1 nF  
10 mF  
220 nF  
PVCC  
220 nF  
PVCC  
1 nF  
*
*
*
Chip ferrite bead (example: Fair-Rite 251206700743) shown for EMI suppression.  
Figure 16. Stereo Class-D With Differential Inputs  
12  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
APPLICATION INFORMATION (continued)  
CLASS-D OPERATION  
This section focuses on the class-D operation of the TPA3008D2.  
Traditional Class-D Modulation Scheme  
The traditional class-D modulation scheme, which is used in the TPA032D0x family, has a differential output  
where each output is 180 degrees out of phase and changes from ground to the supply voltage, VCC. Therefore,  
the differential prefiltered output varies between positive and negative VCC, where filtered 50% duty cycle yields  
0 V across the load. The traditional class-D modulation scheme with voltage and current waveforms is shown in  
Figure 17. Note that even at an average of 0 V across the load (50% duty cycle), the current to the load is high,  
causing high loss and thus causing a high supply current.  
OUTP  
OUTN  
+12 V  
Differential Voltage  
0 V  
Across Load  
−12 V  
Current  
Figure 17. Traditional Class-D Modulation Scheme's Output Voltage and Current Waveforms Into an  
Inductive Load With No Input  
TPA3008D2 Modulation Scheme  
The TPA3008D2 uses a modulation scheme that still has each output switching from 0 to the supply voltage.  
However, OUTP and OUTN are now in phase with each other with no input. The duty cycle of OUTP is greater  
than 50% and OUTN is less than 50% for positive output voltages. The duty cycle of OUTP is less than 50% and  
OUTN is greater than 50% for negative output voltages. The voltage across the load sits at 0 V throughout most  
of the switching period, greatly reducing the switching current, which reduces any I2R losses in the load.  
13  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
APPLICATION INFORMATION (continued)  
OUTP  
OUTN  
Output = 0 V  
Differential  
+12 V  
Voltage  
0 V  
Across  
−12 V  
Load  
Current  
OUTP  
OUTN  
Output > 0 V  
Differential  
Voltage  
Across  
Load  
+12 V  
0 V  
−12 V  
Current  
Figure 18. The TPA3008D2 Output Voltage and Current Waveforms Into an Inductive Load  
Efficiency: LC Filter Required With the Traditional Class-D Modulation Scheme  
The main reason that the traditional class-D amplifier needs an output filter is that the switching waveform results  
in maximum current flow. This causes more loss in the load, which causes lower efficiency. The ripple current is  
large for the traditional modulation scheme, because the ripple current is proportional to voltage multiplied by the  
time at that voltage. The differential voltage swing is 2 x VCC, and the time at each voltage is half the period for  
the traditional modulation scheme. An ideal LC filter is needed to store the ripple current from each half cycle for  
the next half cycle, while any resistance causes power dissipation. The speaker is both resistive and reactive,  
whereas an LC filter is almost purely reactive.  
The TPA3008D2 modulation scheme has little loss in the load without a filter because the pulses are short and  
the change in voltage is VCC instead of 2 x VCC. As the output power increases, the pulses widen, making the  
ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for most  
applications the filter is not needed.  
An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow  
through the filter instead of the load. The filter has less resistance than the speaker, which results in less power  
dissipation, therefore increasing efficiency.  
14  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
APPLICATION INFORMATION (continued)  
Effects of Applying a Square Wave Into a Speaker  
Audio specialists have advised for years not to apply a square wave to speakers. If the amplitude of the  
waveform is high enough and the frequency of the square wave is within the bandwidth of the speaker, the  
square wave could cause the voice coil to jump out of the air gap and/or scar the voice coil. A 250-kHz switching  
frequency, however, does not significantly move the voice coil, as the cone movement is proportional to 1/f2 for  
frequencies beyond the audio band.  
Damage may occur if the voice coil cannot handle the additional heat generated from the high-frequency  
switching current. The amount of power dissipated in the speaker may be estimated by first considering the  
overall efficiency of the system. If the on-resistance (rds(on)) of the output transistors is considered to cause the  
dominant loss in the system, then the maximum theoretical efficiency for the TPA3008D2 with an 8-load is as  
follows:  
R
8
L
Efficiency (theoretical, %) +  
  100% +  
  100% + 86%  
(8 ) 1.3)  
ǒ
ds(on)Ǔ  
R ) r  
L
(1)  
The maximum measured output power is approximately 8.5 W with an 12-V power supply. The total theoretical  
power supplied (P(total)) for this worst-case condition would therefore be as follows:  
P
O
8.5 W  
0.86  
P
+
+
+ 9.88 W  
(total)  
Efficiency  
(2)  
The efficiency measured in the lab using an 8-speaker was 81%. The power not accounted for as dissipated  
across the rDS(on) may be calculated by simply subtracting the theoretical power from the measured power:  
Other losses  
P
(measured)  
P
(theoretical)  
10.49  
9.88  
0.61 W  
(total)  
(total)  
(3)  
The quiescent supply current at 12 V is measured to be 22 mA. It can be assumed that the quiescent current  
encapsulates all remaining losses in the device, i.e., biasing and switching losses. It may be assumed that any  
remaining power is dissipated in the speaker and is calculated as follows:  
P
0.61 W  
(12 V 22 mA)  
0.35 W  
(dis)  
(4)  
Note that these calculations are for the worst-case condition of 8.5 W delivered to the speaker. Because the 0.35  
W is only 4% of the power delivered to the speaker, it may be concluded that the amount of power actually  
dissipated in the speaker is relatively insignificant. Furthermore, this power dissipated is well within the  
specifications of most loudspeaker drivers in a system, as the power rating is typically selected to handle the  
power generated from a clipping waveform.  
When to Use an Output Filter for EMI Suppression  
Design the TPA3008D2 without the filter if the traces from amplifier to speaker are short (< 50 cm). Powered  
speakers, where the speaker is in the same enclosure as the amplifier, is a typical application for class-D without  
a filter.  
Most applications require a ferrite bead filter. The ferrite filter reduces EMI around 1 MHz and higher (FCC and  
CE only test radiated emissions greater than 30 MHz). When selecting a ferrite bead, choose one with high  
impedance at high frequencies, but low impedance at low frequencies.  
Use a LC output filter if there are low frequency (<1 MHz) EMI-sensitive circuits and/or there are long wires from  
the amplifier to the speaker.  
When both an LC filter and a ferrite bead filter are used, the LC filter should be placed as close as possible to  
the IC followed by the ferrite bead filter.  
15  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
APPLICATION INFORMATION (continued)  
33 µH  
OUTP  
C
2
L
1
C
1
0.1 µF  
0.47 µF  
33 µH  
OUTN  
C
3
L
2
0.1 µF  
Figure 19. Typical LC Output Filter, Cutoff Frequency of 27 kHz, Speaker Impedance = 8 Ω  
Ferrite  
Chip Bead  
OUTP  
1 nF  
Ferrite  
Chip Bead  
OUTN  
1 nF  
Figure 20. Typical Ferrite Chip Bead Filter (Chip bead example: Fair-Rite 2512067007Y3)  
Gain setting via GAIN0 and GAIN1 inputs  
The gain of the TPA3008D2 is set by two input terminals, GAIN0 and GAIN1.  
The gains listed in Table 1 are realized by changing the taps on the input resistors inside the amplifier. This  
causes the input impedance (Zi) to be dependent on the gain setting. The actual gain settings are controlled by  
ratios of resistors, so the gain variation from part-to-part is small. However, the input impedance may shift by  
20% due to shifts in the actual resistance of the input resistors.  
For design purposes, the input network (discussed in the next section) should be designed assuming an input  
impedance of 26 k, which is the absolute minimum input impedance of the TPA3008D2. At the lower gain  
settings, the input impedance could increase as high as 165 kΩ  
Table 1. Gain Setting  
INPUT IMPEDANCE  
AMPLIFIER GAIN (dB)  
(k)  
TYP  
137  
88  
GAIN1  
GAIN0  
TYP  
15.3  
21.2  
27.2  
31.8  
0
0
1
1
0
1
0
1
52  
33  
INPUT RESISTANCE  
Each gain setting is achieved by varying the input resistance of the amplifier that can range from its smallest  
value, 33 k, to the largest value, 137 k. As a result, if a single capacitor is used in the input high-pass filter,  
the -3 dB or cutoff frequency changes when changing gain steps.  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
Z
f
C
i
Z
i
IN  
Input  
Signal  
The -3-dB frequency can be calculated using Equation 5. Use Table 1 for Zi values.  
1
f +  
2p Z C  
i
i
(5)  
INPUT CAPACITOR, CI  
In the typical application, an input capacitor (Ci) is required to allow the amplifier to bias the input signal to the  
proper dc level for optimum operation. In this case, Ci and the input impedance of the amplifier (Zi) form a  
high-pass filter with the corner frequency determined in Equation 6.  
−3 dB  
1
f
+
c
2pZ C  
i
i
f
c
(6)  
The value of Ci is important, as it directly affects the bass (low-frequency) performance of the circuit. Consider  
the example where Zi is 137 kand the specification calls for a flat bass response down to 20 Hz. Equation 6 is  
reconfigured as Equation 7.  
1
C +  
i
2pZ f  
c
i
(7)  
In this example, Ci is 58 nF; so, one would likely choose a value of 0.1 µF as this value is commonly used. If the  
gain is known and is constant, use Zi from Table 1 to calculate Ci. A further consideration for this capacitor is the  
leakage path from the input source through the input network (Ci) and the feedback network to the load. This  
leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom, especially  
in high gain applications. For this reason, a low-leakage tantalum or ceramic capacitor is the best choice. When  
polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most  
applications as the dc level there is held at 2.5 V, which is likely higher than the source dc level. Note that it is  
important to confirm the capacitor polarity in the application.  
For the best pop performance, CI should be less than or equal to 1µF.  
Power Supply Decoupling,CS  
The TPA3008D2 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling  
to ensure that the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also  
prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is  
achieved by using two capacitors of different types that target different types of noise on the power supply leads.  
For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR)  
ceramic capacitor, typically 0.1 µF placed as close as possible to the device VCC lead works best. For filtering  
lower frequency noise signals, a larger aluminum electrolytic capacitor of 10 µF or greater placed near the audio  
power amplifier is recommended. The 10-µF capacitor also serves as local storage capacitor for supplying  
current during large signal transients on the amplifier outputs.  
17  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
BSN and BSP Capacitors  
The full H-bridge output stages use only NMOS transistors. Therefore, they require bootstrap capacitors for the  
high side of each output to turn on correctly. A 220-nF ceramic capacitor, rated for at least 25 V, must be  
connected from each output to its corresponding bootstrap input. Specifically, one 220-nF capacitor must be  
connected from xOUTP to xBSP, and one 220-nF capacitor must be connected from xOUTN to xBSN. (See the  
application circuit diagram in Figure 16.)  
The bootstrap capacitors connected between the BSxx pins and corresponding output function as a floating  
power supply for the high-side N-channel power MOSFET gate drive circuitry. During each high-side switching  
cycle, the bootstrap capacitors hold the gate-to-source voltage high enough to keep the high-side MOSFETs  
turned on.  
VCLAMP Capacitors  
To ensure that the maximum gate-to-source voltage for the NMOS output transistors is not exceeded, two  
internal regulators clamp the gate voltage. Two 1-µF capacitors must be connected from VCLAMPL (pin 25) and  
VCLAMPR (pin 36) to ground and must be rated for at least 25 V. The voltages at the VCLAMP terminals vary  
with VCC and may not be used for powering any other circuitry.  
Internal Regulated 5-V Supply (AVDD  
)
The AVDD terminal (pin 29) is the output of an internally generated 5-V supply, used for the oscillator,  
preamplifier, and volume control circuitry. It requires a 1-µF capacitor, placed close to the pin, to keep the  
regulator stable.  
This regulated voltage can be used to control GAIN0 and GAIN1 terminals, but should not be used to drive  
external circuitry.  
Differential Input  
The differential input stage of the amplifier cancels any noise that appears on both input lines of the channel. To  
use the TPA3008D2 with a differential source, connect the positive lead of the audio source to the INP input and  
the negative lead from the audio source to the INN input. To use the TPA3008D2 with a single-ended source, ac  
ground the INP or INN input through a capacitor equal in value to the input capacitor on INN or INP and apply  
the audio source to either input. In a single-ended input application, the unused input should be ac grounded at  
the audio source instead of at the device input for best noise performance.  
SHUTDOWN OPERATION  
The TPA3008D2 employs a shutdown mode of operation designed to reduce supply current (ICC) to the absolute  
minimum level during periods of nonuse for power conservation. The SHUTDOWN input terminal should be held  
high (see specification table for trip point) during normal operation when the amplifier is in use. Pulling  
SHUTDOWN low causes the outputs to mute and the amplifier to enter a low-current state. Never leave  
SHUTDOWN unconnected, because amplifier operation would be unpredictable.  
For the best power-off pop performance, place the amplifier in the shutdown mode prior to removing the power  
supply voltage.  
USING LOW-ESR CAPACITORS  
Low-ESR capacitors are recommended throughout this application section. A real (as opposed to ideal) capacitor  
can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this resistor  
minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this resistance,  
the more the real capacitor behaves like an ideal capacitor.  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
SHORT-CIRCUIT PROTECTION AND AUTOMATIC RECOVERY FEATURE  
The TPA3008D2 has short-circuit protection circuitry on the outputs that prevents damage to the device during  
output-to-output shorts, output-to-GND shorts, and output-to-VCC shorts. When a short circuit is detected on the  
outputs, the part immediately disables the output drive. This is a latched fault and must be reset by cycling the  
voltage on the SHUTDOWN pin to a logic low and back to the logic high state for normal operation. This clears  
the short-circuit flag and allows for normal operation if the short was removed. If the short was not removed, the  
protection circuitry again activates.  
The fault terminal can be used for automatic recovery from a short-circuit event, or used to monitor the status  
with an external GPIO.  
THERMAL PROTECTION  
Thermal protection on the TPA3008D2 prevents damage to the device when the internal die temperature  
exceeds 150°C. There is a ±15 degree tolerance on this trip point from device to device. Once the die  
temperature exceeds the thermal set point, the device enters into the shutdown state and the outputs are  
disabled. This is not a latched fault. The thermal fault is cleared once the temperature of the die is reduced by  
20°C. The device begins normal operation at this point with no external system interaction.  
PRINTED-CIRCUIT BOARD (PCB) LAYOUT  
Because the TPA3008D2 is a class-D amplifier that switches at a high frequency, the layout of the printed-circuit  
board (PCB) should be optimized according to the following guidelines for the best possible performance.  
Decoupling capacitors—The high-frequency 0.1-µF decoupling capacitors should be placed as close to the  
PVCC (pins 14, 15, 22, 23, 38, 39, 46, and 47) and AVCC (pin 33) terminals as possible. The V2P5 (pin 4)  
capacitor, AVDD (pin 29) capacitor, and VCLAMP (pins 25 and 36) capacitor should also be placed as close  
to the device as possible. Large (10 µF or greater) bulk power supply decoupling capacitors should be  
placed near the TPA3008D2 on the PVCCL, PVCCR, and AVCC terminals.  
Grounding—The AVCC (pin 33) decoupling capacitor, AVDD (pin 29) capacitor, V2P5 (pin 4) capacitor, COSC  
(pin 28) capacitor, and ROSC (pin 27) resistor should each be grounded to analog ground (AGND, pins 26  
and 30). The PVCC decoupling capacitors should each be grounded to power ground (PGND, pins 18, 19,  
42, and 43). Analog ground and power ground may be connected at the PowerPAD, which should be used  
as a central ground connection or star ground for the TPA3008D2. Basically, an island should be created  
with a single connection to PGND at the PowerPAD.  
Output filter—The ferrite EMI filter (Figure 20) should be placed as close to the output terminals as possible  
for the best EMI performance. The LC filter (Figure 19) should be placed close to the outputs. The capacitors  
used in both the ferrite and LC filters should be grounded to power ground. If both filters are used, the LC  
filter should be placed first, following the outputs.  
PowerPAD—The PowerPAD must be soldered to the PCB for proper thermal performance and optimal  
reliability. The dimensions of the PowerPAD thermal land should be 5 mm by 5 mm (197 mils by 197 mils).  
The PowerPAD size measures 4,55 x 4,55 mm. Four rows of solid vias (four vias per row, 0,3302 mm or 13  
mils diameter) should be equally spaced underneath the thermal land. The vias should connect to a solid  
copper plane, either on an internal layer or on the bottom layer of the PCB. The vias must be solid vias, not  
thermal relief or webbed vias. For additional information, see the PowerPAD Thermally Enhanced Package  
application note, (SLMA002).  
For an example layout, see the TPA3008D2 Evaluation Module (TPA3008D2EVM) User Manual, (SLOU165).  
Both the EVM user manual and the PowerPAD application note are available on the TI Web site at  
19  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
BASIC MEASUREMENT SYSTEM  
This application note focuses on methods that use the basic equipment listed below:  
Audio analyzer or spectrum analyzer  
Digital multimeter (DMM)  
Oscilloscope  
Twisted-pair wires  
Signal generator  
Power resistor(s)  
Linear regulated power supply  
Filter components  
EVM or other complete audio circuit  
Figure 21 shows the block diagrams of basic measurement systems for class-AB and class-D amplifiers. A sine  
wave is normally used as the input signal because it consists of the fundamental frequency only (no other  
harmonics are present). An analyzer is then connected to the APA output to measure the voltage output. The  
analyzer must be capable of measuring the entire audio bandwidth. A regulated dc power supply is used to  
reduce the noise and distortion injected into the APA through the power pins. A System Two audio measurement  
system (AP-II) (Reference 1) by Audio Precision includes the signal generator and analyzer in one package.  
The generator output and amplifier input must be ac-coupled. However, the EVMs already have the ac-coupling  
capacitors, (CIN), so no additional coupling is required. The generator output impedance should be low to avoid  
attenuating the test signal, and is important because the input resistance of APAs is not high. Conversely, the  
analyzer-input impedance should be high. The output impedance, ROUT, of the APA is normally in the hundreds  
of milliohms and can be ignored for all but the power-related calculations.  
Figure 21(a) shows a class-AB amplifier system. It takes an analog signal input and produces an analog signal  
output. This amplifier circuit can be directly connected to the AP-II or other analyzer input.  
This is not true of the class-D amplifier system shown in Figure 21(b), which requires low-pass filters in most  
cases in order to measure the audio output waveforms. This is because it takes an analog input signal and  
converts it into a pulse-width modulated (PWM) output signal that is not accurately processed by some  
analyzers.  
20  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
Power Supply  
Analyzer  
20 Hz − 20 kHz  
Signal  
Generator  
APA  
RL  
(a) Basic Class−AB  
Power Supply  
Class-D APA  
Low-Pass RC  
Filter  
RL(A)  
Analyzer  
20 Hz − 20 kHz  
Signal  
Generator  
Low-Pass RC  
Filter  
(b) Filter-Free and Traditional Class-D  
(A)  
For efficiency measurements with filter-free class-D, R should be an inductive load like a speaker.  
L
Figure 21. Audio Measurement Systems  
The TPA3008D2 uses a modulation scheme that does not require an output filter for operation, but they do  
sometimes require an RC low-pass filter when making measurements. This is because some analyzer inputs  
cannot accurately process the rapidly changing square-wave output and therefore record an extremely high level  
of distortion. The RC low-pass measurement filter is used to remove the modulated waveforms so the analyzer  
can measure the output sine wave.  
DIFFERENTIAL INPUT AND BTL OUTPUT  
All of the class-D APAs and many class-AB APAs have differential inputs and bridge-tied load (BTL) outputs.  
Differential inputs have two input pins per channel and amplify the difference in voltage between the pins.  
Differential inputs reduce the common-mode noise and distortion of the input circuit. BTL is a term commonly  
used in audio to describe differential outputs. BTL outputs have two output pins providing voltages that are 180  
degrees out of phase. The load is connected between these pins. This has the added benefits of quadrupling the  
output power to the load and eliminating a dc blocking capacitor.  
A block diagram of the measurement circuit is shown in Figure 22. The differential input is a balanced input,  
meaning the positive (+) and negative (-) pins have the same impedance to ground. Similarly, the BTL output  
equates to a balanced output.  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
Evaluation Module  
Audio Power  
Amplifier  
Generator  
CIN  
Analyzer  
Low−Pass  
RC Filter  
RGEN  
RIN  
RIN  
ROUT  
ROUT  
RANA  
CANA  
RL  
VGEN  
CIN  
Low−Pass  
RC Filter  
RGEN  
RANA  
CANA  
Twisted-Pair Wire  
Twisted-Pair Wire  
Figure 22. Differential Input, BTL Output Measurement Circuit  
The generator should have balanced outputs, and the signal should be balanced for best results. An unbalanced  
output can be used, but it may create a ground loop that affects the measurement accuracy. The analyzer must  
also have balanced inputs for the system to be fully balanced, thereby cancelling out any common-mode noise in  
the circuit and providing the most accurate measurement.  
The following general rules should be followed when connecting to APAs with differential inputs and BTL outputs:  
Use a balanced source to supply the input signal.  
Use an analyzer with balanced inputs.  
Use twisted-pair wire for all connections.  
Use shielding when the system environment is noisy.  
Ensure that the cables from the power supply to the APA, and from the APA to the load, can handle the large  
currents (see Table 2).  
Table 2 shows the recommended wire size for the power supply and load cables of the APA system. The real  
concern is the dc or ac power loss that occurs as the current flows through the cable. These recommendations  
are based on 12-inch long wire with a 20-kHz sine-wave signal at 25°C.  
Table 2. Recommended Minimum Wire Size for Power Cables  
DC POWER LOSS  
(MW)  
AC POWER LOSS  
(MW)  
POUT (W)  
RL()  
AWG Size  
10  
4
4
8
8
18  
18  
22  
22  
22  
22  
28  
28  
16  
3.2  
2
40  
8
18  
3.7  
2.1  
1.6  
42  
8.5  
8.1  
6.2  
2
1
8
< 0.75  
1.5  
6.1  
CLASS-D RC LOW-PASS FILTER  
An RC filter is used to reduce the square-wave output when the analyzer inputs cannot process the pulse-width  
modulated class-D output waveform. This filter has little effect on the measurement accuracy because the cutoff  
frequency is set above the audio band. The high frequency of the square wave has negligible impact on  
measurement accuracy because it is well above the audible frequency range, and the speaker cone cannot  
respond at such a fast rate. The RC filter is not required when an LC low-pass filter is used, such as with the  
class-D APAs that employ the traditional modulation scheme (TPA032D0x, TPA005Dxx).  
The component values of the RC filter are selected using the equivalent output circuit as shown in Figure 23. RL  
is the load impedance that the APA is driving for the test. The analyzer input impedance specifications should be  
available and substituted for RANA and CANA. The filter components, RFILT and CFILT, can then be derived for the  
system. The filter should be grounded to the APA near the output ground pins or at the power supply ground pin  
to minimize ground loops.  
22  
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TPA3008D2  
SLOS435AMAY 2004REVISED JULY 2004  
Load  
RC Low-Pass Filters  
RFILT  
AP Analyzer Input  
CANA  
RANA  
CFILT  
VL= V  
IN  
RL  
VOUT  
RFILT  
CANA  
RANA  
CFILT  
To APA  
GND  
Figure 23. Measurement Low-Pass Filter Derivation Circuit-Class-D APAs  
The transfer function for this circuit is shown in Equation 8 where ωO = REQCEQ, REQ = RFILT || RANA and  
CEQ = (CFILT + CANA). The filter frequency should be set above fMAX, the highest frequency of the measurement  
bandwidth, to avoid attenuating the audio signal. Equation 9 provides this cutoff frequency, fC. The value of RFILT  
must be chosen large enough to minimize current that is shunted from the load, yet small enough to minimize the  
attenuation of the analyzer-input voltage through the voltage divider formed by RFILT and RANA. A rule of thumb is  
that RFILT should be small (~100 ) for most measurements. This reduces the measurement error to less than  
1% for RANA 10 k.  
R
ANA  
ǒ Ǔ  
R
)R  
V
ANA  
FILT  
OUT  
+
ǒ Ǔ  
V
w
IN  
1 ) jǒwOǓ  
(8)  
(9)  
Ǹ
f
+ 2   f  
C
MAX  
An exception occurs with the efficiency measurements, where RFILT must be increased by a factor of ten to  
reduce the current shunted through the filter. CFILT must be decreased by a factor of ten to maintain the same  
cutoff frequency. See Table 3 for the recommended filter component values.  
Once fC is determined and RFILT is selected, the filter capacitance is calculated using Equation 9. When the  
calculated value is not available, it is better to choose a smaller capacitance value to keep fC above the minimum  
desired value calculated in Equation 10.  
1
C
+
FILT  
2p   f   R  
C
FILT  
(10)  
Table 3 shows recommended values of RFILT and CFILT based on common component values. The value of fC  
was originally calculated to be 28 kHz for an fMAX of 20 kHz. CFILT, however, was calculated to be 57,000 pF, but  
the nearest values of 56,000 pF and 51,000 pF were not available. A 47,000-pF capacitor was used instead, and  
fC is 34 kHz, which is above the desired value of 28 kHz.  
Table 3. Typical RC Measurement Filter Values  
MEASUREMENT  
Efficiency  
RFILT  
1000 Ω  
100 Ω  
CFILT  
5,600 pF  
56,000 pF  
All other measurements  
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PACKAGE OPTION ADDENDUM  
26-Mar-2007  
PACKAGING INFORMATION  
Orderable Device  
TPA3008D2PHP  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
HTQFP  
PHP  
48  
48  
48  
48  
250 Green (RoHS & CU NIPDAU Level-4-260C-72 HR  
no Sb/Br)  
TPA3008D2PHPG4  
TPA3008D2PHPR  
TPA3008D2PHPRG4  
HTQFP  
HTQFP  
HTQFP  
PHP  
PHP  
PHP  
250 Green (RoHS & CU NIPDAU Level-4-260C-72 HR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-4-260C-72 HR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-4-260C-72 HR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
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PACKAGE MATERIALS INFORMATION  
5-Oct-2007  
TAPE AND REEL BOX INFORMATION  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
(mm)  
TPA3008D2PHPR  
PHP  
48  
SITE 60  
330  
16  
9.6  
9.6  
1.5  
12  
16  
Q2  
Pack Materials-Page 1  
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PACKAGE MATERIALS INFORMATION  
5-Oct-2007  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
TPA3008D2PHPR  
PHP  
48  
SITE 60  
346.0  
346.0  
33.0  
Pack Materials-Page 2  
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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
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Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
Automotive  
Broadband  
Digital Control  
Military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Optical Networking  
Security  
microcontroller.ti.com  
Telephony  
Low Power  
Wireless  
Video & Imaging  
Wireless  
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Copyright © 2007, Texas Instruments Incorporated  
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