Sigma Universal Remote SQC 122c User Manual

SQC-122c  
Thin Film Deposition Controller  
User’s Guide  
Version 2.0  
© Copyright Sigma Instruments, Inc. 1999 - 2002  
Sigma  
instruments  
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Warranty Information  
This Sigma Instruments product is warranted against defects in material and  
workmanship for a period of 1 year from the date of shipment, when used in accordance  
with the instructions in this manual. During the warranty period, Sigma Instruments will,  
at its option, either repair or replace products that prove to be defective.  
Limitation of Warranty  
Defects from, or repairs necessitated by, misuse or alteration of the product, or any  
cause other than defective materials or workmanship are not covered by this warranty.  
NO OTHER WARRANTIES ARE EXPRESSED OR IMPLIED, INCLUDING BUT NOT  
LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS  
FOR A PARTICULAR PURPOSE. UNDER NO CIRCUMSTANCES SHALL SIGMA  
INSTRUMENTS BE LIABLE FOR CONSEQUENTIAL OR OTHER DAMAGES  
RESULTING FROM A BREACH OF THIS LIMITED WARRANTY, OR OTHERWISE.  
Return Policy  
The purchaser may return this product in new condition within 30 days after shipment  
for any reason. In case of return, purchaser is liable and responsible for all freight  
charges in both directions.  
Sigma Instruments  
120 Commerce Drive, Unit 1  
Fort Collins, CO 80524 USA  
970-416-9660  
970-416-9330 (fax)  
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Table of Contents  
Chapter 1  
Quick Start  
1.0 Introduction................................................................................................1-1  
1.1 Thin Film Process Overview........................................................................1-1  
1.2 System Connections...................................................................................1-2  
1.3 Front Panel................................................................................................1-3  
1.4 Rear Panel ................................................................................................1-4  
1.5 Installation.................................................................................................1-5  
1.6 Process Setup ...........................................................................................1-6  
1.7 Depositing a Film .......................................................................................1-8  
Chapter 2  
Operation  
2.0 Introduction................................................................................................2-1  
2.1 Definitions..................................................................................................2-1  
2.2 Defining a Film...........................................................................................2-1  
2.3 Defining a Process.....................................................................................2-5  
2.4 Sensor Setup.............................................................................................2-7  
2.5 Source Setup.............................................................................................2-10  
2.6 Running a Process.....................................................................................2-11  
2.7 Loop Tuning...............................................................................................2-15  
2.8 Troubleshooting .........................................................................................2-17  
Chapter 3  
Menus  
3.0 Introduction................................................................................................3-1  
3.1 Main Menu.................................................................................................3-2  
3.2 Next Menus ...............................................................................................3-4  
3.3 Quick Setup Menu......................................................................................3-5  
3.4 Process Menus ..........................................................................................3-7  
3.5 Film Menus................................................................................................3-11  
3.6 System Parameters Menu...........................................................................3-18  
3.7 I/O Setup...................................................................................................3-21  
Chapter 4  
Options  
4.0 Introduction................................................................................................4-1  
4.1 Options Cards............................................................................................4-1  
4.2 Full Rack Extender Installation....................................................................4-1  
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Appendix  
A. Material Parameters  
B. Specifications  
C. I/O Connections  
D. Handheld Remote Controller  
E. Declaration of Conformity  
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Chapter 1  
Quick Start  
1.0 Introduction  
The SQC-122c is a multi-channel quartz crystal monitor and deposition controller. It  
measures up to six 1MHz to 6 MHz quartz crystal sensors, and controls two evaporation  
sources. Twenty-five processes, consisting of 250 layers and 25 materials, can be  
stored for easy retrieval. Eight process control relays, and eight digital inputs are easily  
configured to support a broad range of external functions, including source pocket  
rotation.  
The SQC-122c can also be controlled via the standard RS-232 interface and Windows  
control program. An optional handheld remote power control is also available.  
Note: The SQC-122 (color display) replaces our original (monochrome) SQC-122.  
Operation and programming of the two models are identical.  
This chapter will aid you in the initial setup and operation of your system. Please review  
the entire manual for detailed operational, programming, and safety information.  
1.1 Thin Film Process Overview  
The SQC-122c stores the recipes, and provides the operating functions, required to  
control thin film deposition processes. A typical thin film deposition cycle is shown  
below.  
The cycle can be broken into three distinct phases: pre-conditioning (ramp/soak),  
deposition, and post-conditioning (feed/idle). During pre-conditioning, power is supplied  
in steps to prepare the evaporation source for deposition. Once the material is near the  
desired deposition rate, material deposition begins. During deposition, the PID loop  
adjusts the evaporation source power as required to maintain the desired deposition  
rate. When the desired thickness is reached, the evaporation source is set to idle  
power. At this point the process may be complete, or deposition of another film layer  
may begin.  
1-1  
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Chapter 1  
Quick Start  
1.2 Front Panel  
SoftKeys  
Control Knob Remote Jack  
Front Panel Controls  
SoftKeys  
Provide access to instrument operations and setup menus.  
The functions of the SoftKeys change to adapt to different  
operations and are displayed on the left of the screen.  
Control  
Knob  
Used to adjust values and select menu items. Pushing the  
control knob stores the current setting and moves to the next.  
Remote  
Jack  
Connection jack for the optional handheld remote control  
module. See Appendix D.  
1-2  
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Chapter 1  
Quick Start  
1.3 Rear Panel  
Manufactured By  
SQC-122c Deposition Controller  
Serial No.  
Sigma  
100-120/200-240 V~  
?
instruments  
50/60 Hz  
25 VA  
Sensor 3 Sensor 4  
Output 3 Output 4  
I/O 9-16  
I/O 1-8  
Sensor 1 Sensor 2  
Output 1 Output 2  
Fuse T.5A 250V  
RS-232  
Rear Panel Connections  
Sensor 1 & 2  
Output 1 & 2  
Connects to quartz crystal sensor remote oscillator.  
Connects the SQC-122c output to your evaporation supply  
control input.  
I/O (1-8)  
RS-232  
Connects 8 relays and 8 digital inputs to external equipment for  
process control. See Appendix C for connections.  
Connects to computer for programming and data acquisition.  
Sensor 3 & 4  
Output 3 & 4  
I/O 9-16  
This option card is available only on SQC-222 controllers.  
Contact Sigma for upgrade information.  
Measurement ground terminal useful for common system and  
cable grounding.  
Power Input and  
Fuse  
WARNING: For continued protection, replace fuses with the  
proper type and rating.  
WARNING: Use removable power cords only of the specified  
type and rating, attached to a properly grounded receptacle.  
1-3  
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Chapter 1  
Quick Start  
1.4 System Connections  
Sensor  
In-Vac  
Cable  
Source  
Shutter  
Feedthrough  
Evaporation Supply  
B N C  
Cables  
6" BNC Cable  
Oscillator  
Output Control Input  
Ground Wire  
This section identifies typical system components and their connection:  
System Components  
Sensor  
Holds the quartz crystal used to measure rate and thickness.  
Crystals must be replaced occasionally.  
In-Vac Cable  
Feedthrough  
A coaxial cable that connects the sensor to the feedthrough.  
Provides isolation between vacuum and atmosphere for  
electrical and cooling lines.  
6” BNC Cable  
Oscillator  
Provides a flexible connection from the feedthrough to the  
oscillator. Keep this cable as short as possible.  
Contains the electronics to operate the quartz crystal. Total  
cable length to the crystal should be under 40”.  
Sensor Input  
BNC Cable  
Connects the oscillator to the SQC-122c input. Lengths up to  
100’ are acceptable.  
Control Output  
BNC Cable  
Connects the SQC-122c output to the evaporation source’s  
control voltage input. Keep the length below 10’.  
Ground Wire  
A wire, typically braided, that connects the vacuum system to  
the SQC-122c ground terminal.  
1-4  
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Chapter 1  
Quick Start  
1.5 Installation  
WARNING: Care should be exercised to route SQC-122c cables as far as practical from  
other cables that carry high voltages or generate noise. This includes other line voltage  
cables, wires to heaters that are SCR-controlled, and cables to source power supplies  
that may conduct high transient currents during arc down conditions.  
Rack  
Installation  
The SQC-122c occupies a 5.25” high, half-rack space. An  
optional installation kit is available to adapt to a full rack (see  
Chapter 4). Install the unit in a 19” rack with the supplied  
hardware.  
Power  
Connection  
The SQC-122c automatically detects mains voltages of 100-  
120 and 200-240VAC, 50/60Hz.  
WARNING: Verify that the power cable provided is connected to  
a properly grounded mains receptacle.  
Sensor Input  
Connections  
Connect the BNC cables and oscillators from your vacuum  
chamber feedthrough to the desired SQC-122c sensor inputs.  
Source Output  
Connections  
Connect the BNC cables from the SQC-122c output  
connectors to your evaporation supply control input.  
Digital I/O  
Connections  
Refer to Appendix C for details on wiring digital I/O to the SQC-  
122c Relay I/O connectors.  
Computer  
Connection  
If you would like to use the Windows software to collect data or  
program the SQC-122c, attach a 9 pin straight-thru cable from  
the RS-232 connector to your computer’s serial port.  
1-5  
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Chapter 1  
Quick Start  
1.6 Process Setup  
Follow these steps to build a process from the main (also called “power up”) screen.  
Note: If you are prompted for a password, use the switches along the left of the screen  
to enter the password. The top switch is “1”, the bottom switch is “6”. If you forget the  
password, see the System Parameters section for password setup.  
Power  
On  
Move the rear panel power switch to the On (|) position. The  
SQC-122c will briefly display its initialization information, then  
go to normal operating mode.  
Select  
Press the Quick Setup SoftKey to view the quick setup  
Quick Setup  
parameters for the current process.  
If no Quick Setup option is visible, no processes are defined in  
the SQC-122c. In that case, press Film Menu, then scroll the  
cursor until an <Empty> film is selected. Press Create to  
create a new film, then press Main Screen. Now press  
Process Menu, then Create, then Edit. Select Insert Layer,  
scroll to your new film and press Enter. Now press Prev Menu  
twice to return to the Main Menu.  
THICKNESS(kA)  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Next  
Menu  
0.000  
100.0  
Quick  
Setup  
50.0  
Process  
Menu  
Film  
Menu  
0.0  
0.0  
12.5  
25.0  
37.5  
50.0  
Power (% vs. Time)  
System  
Params  
PHASE: Stopped  
Process: My Process 1  
Layer: 1 of 1  
Run Time: 0:00:00  
Final Thick: 0.1011  
Layer Rate : 11.1  
Start  
Film : Aluminum  
Main Screen  
1-6  
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Chapter 1  
Quick Start  
Edit Mode  
To edit a setting in any menu, turn the control knob to scroll to  
the desired setting, then press the Edit SoftKey.  
In Edit mode, the cursor moves to the setting value and the  
SoftKey functions change to show:  
Next: Store the parameter and move to next parameter for  
editing.  
Cancel: Stop editing and return the selected parameter to its  
previous value.  
Enter: Stop editing and save values for selected parameter.  
In Edit mode, adjust the control knob to set the desired  
parameter value.  
Edit  
Layer 1  
Spend some time navigating through the Quick Setup  
parameters and editing values. When you are comfortable, be  
sure your values for Layer 1 match those shown below.  
THICKNESS(kA)  
0.000  
RATE(A/s)  
0.0  
POWER( %)  
0.0  
Exit to  
Main  
My Process 1 -> Layer 1 ->  
Parameter  
Value  
Units  
Init Rate  
Fnl Thk  
11.1  
0.101  
A/s  
kA  
Edit  
P Term  
I Term  
D Term  
Sensor 1  
Sensor 2  
Output  
50  
None  
Sec.  
Sec.  
On/Off  
On/Off  
0.7  
0.0  
On  
On  
Next  
Layer  
Out1  
76.0  
Out1/Out2  
%
%
Max. Power  
Slew Rate  
Material  
10.0  
Copper  
Quick Setup Menu  
Exit to Main  
Press Exit to Main to return to the main screen.  
1-7  
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Chapter 1  
Quick Start  
1.7 Depositing a Film  
If you have followed this Quick Start chapter, you are ready to deposit a film.  
Note: You can simulate the steps below, without actually depositing a film, by going to  
the System Parameters Menu and selecting Simulate Mode ON. Simulate mode is  
useful for testing processes before applying power to the evaporation supply. See  
Section 3.6 for System Parameters Menu information.  
Verify Output  
Operation  
From the Main Menu, press the Next Menu SoftKey. Then,  
press Auto/Manual to display Manual/Auto. Slowly turn the  
control knob to increase the control voltage to your evaporation  
supply. Verify that the Power(%) reading in the display upper  
right-hand corner approximates the actual output of your  
evaporation supply. If not, check your hookup (1.5), and refer  
to Scale Voltage (3.6).  
Verify Sensor  
Operation  
Press Next Menu until the Switch Displays option is shown.  
Press Switch Displays to display Sensor 1 and Sensor 2 in  
the lower status section of the screen. At least one sensor  
should be ON and display a % life of over 50%. If not, check  
your sensor connections (1.5), and refer to Min/Max Frequency  
(3.6).  
Enter  
Press the Next Menu key twice to display the output screen.  
Auto Mode  
Press Manual/Auto until Auto/Manual is displayed.  
Show  
Press Next Menu once more. Press the Next Graph SoftKey  
Power Graph  
until the graph shows Power (% vs. Time).  
Start  
Press the Start key to start the deposition process. Graphing  
Process  
of the output power should start.  
Caution: Observe the output power versus your evaporation  
supply’s actual output. If there is a problem, press the Stop  
SoftKey immediately.  
If the rate and thickness readings do not match your expectations, refer to Appendix A  
for information on Density and Z-Factor, and Section 2.4 for Tooling.  
Please take time to review the remainder of this manual for detailed operational,  
programming, and safety information.  
1-8  
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Chapter 1  
Quick Start  
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1-9  
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Chapter 2  
Operation  
2.0 Introduction  
This chapter describes common tasks associated with operating the SQC-122c. It  
assumes that you understand basic operation of the menus and parameter setup as  
described in Chapter 1. Detailed definitions of unfamiliar setup parameters can be  
found under the appropriate menu description in Chapter 3.  
2.1 Definitions  
Several terms will be used repeatedly throughout this manual. It is important that you  
understand each of these terms.  
Material: A physical material to be deposited. A database of approximately 100  
materials is stored in the SQC-122c, and additional materials may be added using the  
setup software. Three parameters completely define a material: Name, Density, and Z-  
Factor. A table of common materials, their density, and Z-Factor is listed in Appendix A.  
Film: A film describes in detail how a material will be deposited. It includes the material  
definition and all of the preconditioning, deposition, and post conditioning variables  
necessary to accurately deposit the material. Because the film definition does not  
include rate and thickness information, a film can be used in several different  
processes. The SQC-122c stores up to 25 films.  
Layer: Layers are the basic building blocks of processes. A layer consists of a film and  
the thickness and rate that it be deposited in a process.  
Process: A deposition process is a sequence of layers (i.e. films, materials) to be  
deposited. The SQC-122c can store up to 25 processes, consisting of a total of 250  
layers.  
2.2 Defining a Film  
A film is a material to be deposited, plus all of its associated setup parameters. Keep in  
mind that a film can be used in multiple processes. Editing a film’s parameters will  
cause changes to every process where the film is used.  
To define a film, select Film Menu on the main screen. A list of 25 films (or <Empty>)  
will be displayed. To define a new film, scroll to <Empty> and press Create. A new  
Film# is added to the list of existing films (you can use the SQC-122c setup software  
later to assign descriptive film names). Press Edit to display the parameters for this  
film.  
2-1  
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Chapter 2  
Operation  
The most commonly modified parameters are shown on the first film parameters screen.  
Additional parameters can be accessed by pressing Film Conds (film conditioning) or  
Deposit Controls.  
THICKNESS(kA)  
0.000  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Exit to  
Main  
My Process 1  
Editing: Aluminum  
Parameter  
Value  
Units  
Prev  
Menu  
P Term  
I Term  
50  
None  
Sec.  
0.7  
D Term  
0.0  
On  
On  
Sec.  
Edit  
Sensor 1  
Sensor 2  
On/Off  
On/Off  
Film  
Film Tooling  
Output  
100  
Conds.  
%
Out1  
1
Out1/Out2  
Deposit  
Controls  
Pocket  
Max Power  
76.0  
Slew Rate  
10.0  
%
Crystal Quality  
Disabled  
Film Edit Menu  
Scroll to the end of the list (Z-Factor), then scroll back up to Material. Press Edit to  
scroll through the list of available materials. Notice that the Density and Z-Factor are  
updated automatically as a new material appears.  
Select the desired material and press Enter. You could change the Density and Z-  
Factor for the selected material now, but it is unlikely those values are wrong. To add a  
material name that is not listed, you must use the SQC-122c setup software.  
Once the material is selected, set up the source parameters. Scroll to Output and  
select the SQC-122c rear panel output that is connected to the source evaporation  
supply. If a source pocket indexer is being used, assign it also.  
Now assign the Max Power and Slew Rate appropriate for this material and your power  
supply. For now, set both to 100%. Set them to lower values later if you find that small  
power changes cause excessively large changes in deposition rate.  
The SQC-122c can use multiple sensors to measure a film’s deposition rate and  
thickness. If multiple sensors are selected, an average of the sensors is used. Set  
each sensor that will be used to measure this film to ON. Alternately, you might want to  
use a dual shuttered sensor in case of crystal failures. See the Film Menu section of  
Chapter 3 for instructions on setting up a primary/secondary dual sensor.  
2-2  
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Chapter 2  
Operation  
The PID parameters control the response of the SQC-122c to changes in deposition  
rate. These values are unique to each deposition chamber setup, and to a lesser extent  
to each material.  
The P Term is proportional (or gain), the % process rate change divided by the % input  
power change. The I Term (integral) sums the rate deviations over time to more  
accurately achieve the rate setpoint. The D Term (derivative) speeds response to  
sudden changes in rate. Volumes have been written on determining the proper PID  
settings. See the section on Loop Tuning later in this chapter for a common PID loop  
tuning procedure. For now, you should probably leave these values at their defaults.  
Press Film Conds to enter the film conditioning menu. Film preconditioning is used to  
prepare a material for deposition. When the film deposition is complete, post  
conditioning ramps power down to an idle level. It may also ramp power to a level  
appropriate for wire feeding new material. Refer to the Thin Film Process Overview in  
Chapter 1 for an illustration of pre and post conditioning.  
THICKNESS(kA)  
0.000  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Exit to  
Main  
My Process 1  
Editing: Aluminum  
Parameter  
Value  
Units  
Prev  
Menu  
Ramp1 Power  
Ramp1 Time  
50  
%
0.7  
h:mm:ss  
Soak1 Time  
Ramp2 Power  
Ramp2 Time  
0.0  
h:mm:ss  
%
Edit  
On  
On  
h:mm:ss  
h:mm:ss  
%
Soak2 Time  
Feed Power  
Ramp Time  
Out1  
75.0  
10.0  
h:mm:ss  
h:mm:ss  
%
Feed Time  
Idle Power  
Ramp Time  
0:00:00  
2.90  
0.950  
h:mm:ss  
Film Conditioning Menu  
Set the Ramp 1 Power and Time to values that will slowly bring the material to a near  
molten state. Set the Soak 1 Time to a value that will allow the material to  
homogeneously achieve the state. Ramp 2 is used to slowly bring the material to a  
power level that nearly matches the desired deposition power. Use Soak 2 to hold the  
material at that level until deposition (i.e. rate control) begins.  
If you use wire feed to replenish material after deposition, set the Feed Power and times  
as required. Idle typically ramps output power back toward zero at the end of a  
process.  
2-3  
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Chapter 2  
Operation  
From the Film Conds menu, press Prev Menu to return to the main Film Params menu.  
Now press Deposit Controls. The Deposit Controls menu contains parameters that  
modify operation during the deposition phase.  
THICKNESS(kA)  
0.000  
Current: Process 1  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Exit to  
Main  
EDITING: Film 1  
Parameter  
Shutter Delay  
Capture  
Value  
Units  
Prev  
Menu  
h:mm:ss  
%
0:01:00  
20.0  
(Ignore, Stop, Hold)  
Control Error  
Setting  
Edit  
Hold  
Error  
18.0  
%
%
Rate Sampling  
Setting  
(Cont,Time,Acc based)  
Undefined  
0.0  
Accuracy Based  
Deposition Controls Menu  
Shutter delay causes the SQC-122c to delay opening the shutter until the process has  
stabilized at the desired deposition rate. The time value is the maximum amount of time  
to wait, before an error is sensed. Capture is the % rate deviation that must be  
achieved to open the shutter and go to the Deposit phase. Capture will override the  
shutter delay if accuracy is reached. Set Shutter Delay and Capture to zero to disable  
this feature.  
If the SQC-122c is unable to maintain the desired deposition rate (for example, out of  
material or a bad sensor), one of three actions is possible. Keep trying (Ignore), set  
power to zero to halt deposition (Stop), or maintain constant power (Hold) and  
extrapolate thickness from the last good rate reading. Until your process is known and  
stable, it is best to leave the Control Error setting on Ignore.  
Rate sampling can extend sensor life in high rate processes. Select Cont (continuous)  
to disable rate sampling. A Time selection closes the shutter for a fixed time, then  
opens the shutter for a fixed time to sample the rate. Acc Based (accuracy based)  
sampling closes the shutter for a fixed time, then opens the shutter until the desired rate  
is achieved. Rate Sampling assumes a very stable process!  
Each film parameter has been set. Press Exit to Main to return to the Main Screen.  
2-4  
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Chapter 2  
Operation  
2.3 Defining a Process  
A process is a sequence of film layers deposited to achieve a particular thin film  
characteristic. A few processes, each consisting of a few layers, may be adequate for a  
production facility. For research or laboratory use, the SQC-122c can store up to 25  
processes to a total of 250 layers.  
You should define each of the films that will make up the layers of the process before  
starting process definition. See the previous section for instructions on defining films.  
To define a process, select Process Menu on the main screen. A list of 25 processes  
(or <Empty>) will be displayed. To define a new process, scroll to <Empty> and press  
Create. A new Process# is added to the list of existing processes (use the SQC-122c  
setup software to assign descriptive process names). Press Select, then Edit to  
display the sequence of layers and films that comprise the selected process.  
To add a layer, scroll to the desired location in the layer sequence, and press Insert  
Layer. Select a film for this layer from the list and press Enter. Once a film is assigned  
to a process layer, you cannot change the film. Instead, cut the layer, then insert a new  
layer and select the desired film. To edit a layer, highlight it, then press Edit.  
THICKNESS(kA)  
0.000  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Exit to  
Main  
My Process 1  
Layer 1 ->  
Parameter  
Value  
Units  
Prev  
Menu  
Init. Rate  
5.0  
A/s  
kA  
0.500  
Fnl Thk  
Time Setpoint  
0:01:00  
0.400  
Auto  
h:mm:ss  
kA  
Edit  
Thickness Limit  
Start Mode  
Man/Auto  
Ramp1  
Enabled  
En/Dis  
Start Thickness  
Ramp Time  
0.150  
kA  
h:mm:ss  
0:00:30  
New Rate  
Ramp2  
3.5  
A/s  
Disabled  
En/Dis  
Layer Edit Menu  
Remember that most setup parameters are set in the Films Menu, and apply to every  
instance where the film is used. The layer parameters pertain only to this instance of  
the film, in this process.  
2-5  
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Chapter 2  
Operation  
Initial Rate and Final Thickness are the main process setpoints for this layer of material.  
Keep in mind that the SQC-122c zeroes thickness at the beginning of each layer. It is  
not a cumulative value.  
Time Setpoint and Thickness Limit are arbitrary values that will activate a relay when  
they are reached.  
Start mode allows you to have this layer start immediately on completion of the previous  
layer, Auto mode. Manual mode waits for a user signal via the front panel, RS-232, or  
digital input to start the layer.  
Rate Ramps allow the deposition rate to change over time, under PID control. Each  
rate ramp has a starting thickness, an elapsed time to ramp to the new rate, and a new  
rate setpoint. Each process layer can have up to two rate ramps.  
Press Prev Menu to return to the list of layers, or Exit to Main to return to the Main  
Screen.  
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Chapter 2  
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2.4 Sensor Setup  
The theory of operation for a quartz crystal sensor is quite simple. The sensor initially  
oscillates at its natural frequency, typically 6MHz. As material is deposited on the  
substrate, it is also deposited on the sensor. Depending on the density of the deposited  
material, and the amount of material deposited, the sensor’s frequency will drop from its  
initial frequency. The rate and thickness can be calculated from this frequency shift.  
Sensor setup involves selecting the sensor(s) to be used, setting the Min/Max crystal  
frequencies, and adjusting the Tooling Factor. Sensors are assigned to each film, as  
described in Section 2.2, Defining a Film. See Section 3.5 for information on setting up  
dual shuttered sensors.  
In the System Params menu, Max Frequency is the initial frequency of a new crystal,  
typically 6.0e+06 Hz (6 MHz). Due to manufacturing tolerances, some crystals may  
oscillate above 6MHz initially, which would be detected as a sensor error. Setting the  
Max Frequency slightly above the nominal value, to say 6.1MHz, will avoid this problem  
with no effect on instrument accuracy.  
Min Frequency is the frequency where the SQC-122c will flag a sensor as bad. For a  
6MHz crystal, the Min Frequency is typically 5 MHz.  
Crystal failure is often predicted by brief periods of “mode hopping,” where the crystal  
briefly makes an abrupt change in frequency, or stops oscillating altogether. Some  
materials will cause crystals to fail or mode hop well before 5MHz. It is good practice to  
set the Min Frequency to a value that indicates crystal failure well before most crystals  
actually fail.  
To better determine impending crystal failure, Crystal Quality and Stability parameters  
are also available for each Film. See Chapter 3, Film Menus for more information on  
setting Crystal Quality and Stability.  
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Sensor Tooling, also found in the System Params menu, adjusts for the difference in  
measured deposition rate between the sensor and the substrate being coated.  
Substrate  
Substrate  
Tooling  
Over 100%  
Tooling  
Under 100%  
In the illustration above (left), the sensor will measure less rate or thickness than is  
actually deposited on the substrate because of its positioning. In the right illustration,  
the sensor will measure high. Tooling is the ratio of the actual substrate deposition rate  
or thickness, to that measured by the sensor.  
Let’s assume that at the end of deposition the sensor measures a thickness of 1.000  
kA. But, suppose the actual substrate is deposited to 1.100 kA thickness (as  
determined by some other means, such as a stylus profilometer). Then the tooling for  
this sensor would be:  
(1.100 / 1.000) x 100 = 110  
A simple rule to remembers is: If the rate/thickness reading is low, then increase the  
tooling value. If the rate/thickness reading is high, then lower the tooling value.  
Xtal Tool 1 and 2 adjust the tooling for each individual sensor. It is particularly important  
when using sensor averaging to balance multiple sensors so that their measurements  
match.  
System Tooling applies to the overall Rate and Thickness measurements of all sensors.  
It is sometimes used to adjust for some systematic difference in the actual vs. measured  
readings. In general, Crystal Tooling (Xtal Tool 1 and 2) should be used instead.  
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Once the sensor parameters are set, test your sensor setup to assure reliable readings  
at the SQC-122c. A typical single sensor setup is shown below:  
On the SQC-122c, press Next Menu until the Sensor Info option is shown, then press  
Sensor Info.  
Any connected sensor (whether programmed On or Off) should display its frequency  
and % remaining life, as defined by Min and Max Frequency setup. For a new sensor,  
the value should be near 100%. If the % Life is 0.00% or jumps around, check your  
cabling and the installation of the sensor in its holder.  
Sigma supplies a small 5.5MHz “test crystal adapter” with each oscillator. If the % Life  
reading is not correct, remove the 6” BNC that is connected to your feedthrough at the  
oscillator. Connect the test crystal and adapter to the oscillator connector labeled  
feedthrough. For a typical setup of 6MHz Max Frequency and 5MHz Min Frequency,  
the % life display should be near 50%.  
More information on locating system and sensor problems is described in the  
Troubleshooting section, later in this chapter.  
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Chapter 2  
Operation  
2.5 Source Setup  
The SQC-122c controls deposition rate by varying the control voltage to an external  
evaporation (source) supply. The previous illustration for sensor wiring also shows  
source supply wiring.  
The SQC-122c control voltage output range is set in the Systems Params menu. For  
the supply connected to Output 1, set Scale 1 to the control voltage that corresponds to  
100% output on the source supply. The SQC-122c uses 0 volts as 0% output, and the  
programmed value as 100% output. Scale values from –10 volts to 10 volts are  
possible.  
If you find that very small changes in control voltage yield large changes in deposition  
rate, you can lower the Scale value to decrease the dynamic range. Also, each Film  
has a Max Power and Slew Rate parameter that may be used to customize response to  
that film.  
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2.6 Running a Process  
Once a Process is defined with the desired Layers, and the sensors and source supply  
are properly connected, the deposition process is ready to run. The next section, on  
Loop Tuning, describes a method for initial process startup and optimization. This  
section describes the steps to select, start, and stop a process.  
Note: It is best (and safest!) to place the SQC-122c in Simulate mode when a process  
is first run. If the bottom SoftKey does not show Start Simulate, press System Params  
and turn Simulate ON.  
To select a process, the status bar must be showing Phase: Stopped. If any other  
phase is displayed, press the Abort SoftKey.  
Press Process Menu, then use the scroll knob to highlight the desired process. If the  
third SoftKey shows Edit when a process is highlighted, then it is already the current  
process. Otherwise, press Select to set the highlighted process as the current process.  
You can press Edit to review the current process layers and their associated films.  
Press Main Screen to return to the main operating screen.  
Press Quick Setup to review the most commonly adjusted parameters for the first layer  
of the process. Press Next Layer to review each layer in the current process.  
THICKNESS(kA)  
0.000  
My Process 1 -> Layer 1-> Aluminum  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Exit to  
Main  
Parameter  
Value  
Units  
Init Rate  
Fnl Thk  
11.1  
A/s  
kA  
0.101  
P Term  
50  
None  
Edit  
I Term  
0.7  
0.0  
On  
On  
Sec.  
D Term  
Sec.  
Prev  
Layer  
Sensor 1  
Sensor 2  
Output  
On/Off  
On/Off  
Next  
Out1  
Out1/Out2  
Layer  
Max. Power  
76.0  
%
%
10.0  
Slew Rate  
Material  
Aluminum  
Quick Setup Menu  
Press Exit to Main to return to the main operating screen.  
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While we’re on the Main Menu screen, and before starting the selected process, let’s  
cover the capabilities of the Next Menu screens.  
Press Next Menu once to view the first Next Menu screen. This screen provides two  
important operator functions: Zero Thickness and Auto/Manual mode.  
The Zero SoftKey can be used to zero the thickness reading at any time. It is not  
normally needed, since the SQC-122c automatically zeroes the thickness at the  
beginning of each layer. It is, however, useful when simulating a process and when  
operating in Manual mode.  
The Auto/Manual key alternates between Automatic (PID) output control and Manual  
(user) output control. Auto/Manual indicates the process is in automatic control, and a  
key press will change to Manual control. Manual/Auto indicates Manual control; a key  
press changes to Automatic mode.  
In Manual mode, the SQC-122c immediately starts the deposition phase for the current  
layer, whether the process was stopped or running. However, the PID loop is disabled  
and output power is controlled by the front panel control knob.  
In Manual Mode, you will usually display the Rate Graph, then manually adjust the  
output power to achieve the desired deposition rate. It is easy to exceed a layer’s Final  
Thickness setpoint in Manual mode, so watch the Thickness reading carefully. Manual  
mode is particularly useful for determining preconditioning power levels, and loop gain  
(discussed later in Loop Tuning).  
Moving from Manual mode to Auto mode places the SQC-122c into automatic (PID)  
control. The PID control loop will try to achieve rate setpoint, so there may be a rapid  
change in output power.  
Press Next Menu again to view the second Next Menu screen.  
Next Graph selects which of three available graphs is displayed. The Power Graph is  
useful during preconditioning. The Rate graph shows the response of the control loop  
to process changes, such as when moving from preconditioning to deposition. The  
Rate Deviation Graph shows the performance of the control system during deposition.  
The SQC-122c automatically displays the most useful graph for each phase of  
deposition.  
Switch Displays toggles the process data display in the lower portion of the screen  
between two different process displays.  
Sensor Info replaces the graph with a detailed display of sensor information.  
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Enough preliminaries, let’s start the process!  
Press Start from any of the main screen menus to start deposition. If the first layer  
Start mode was programmed as Manual, you will need to press the Start Layer SoftKey  
now to start the layer.  
Note: Don’t confuse Manual and Auto Start mode with the Manual/Auto SoftKey.  
Manual Start is a Process setup parameter that tells the SQC-122c to wait for operator  
intervention before starting a Layer.  
THICKNESS(kA)  
RATE(A/s)  
0.3  
POWER(%)  
45.0  
Next  
Menu  
0.057  
100.0  
Zero  
50.0  
Auto /  
Manual  
0.0  
0.0  
12.5  
25.0  
37.5  
50.0  
Stop  
Power (% vs. Time)  
Layer  
PHASE: Soak 2  
Process: My Process 1  
Layer: 1 of 4  
Run Time: 0:00:45  
Final Thick: 1.100  
Layer Rate : 8.00  
Abort  
Film : Film1  
Preconditioning  
When Start is pushed, the process starts with the first layer preconditioning phase.  
When preconditioning is complete, the deposition phase begins. The deposition phase  
ends when Final Thickness is reached for the layer, then Feed and Idle phases run (if  
programmed).  
If the second layer is Auto Start, its cycle begins immediately when the first layer is  
complete. If the second Layer is Manual Start, or it’s the last layer in the process, the  
process halts and waits for operator intervention.  
While the process is running, a Stop Layer SoftKey is shown (see above). Pressing  
Stop Layer temporarily halts the current layer and displays two restart options, Start  
Nxt Layer and Restart Layer.  
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THICKNESS(kA)  
RATE(A/s)  
7.8  
POWER(%)  
55.3  
Next  
Menu  
0.824  
100.0  
Zero  
50.0  
Auto /  
Manual  
Start Nxt  
Layer  
0.0  
0.0  
40.0  
80.0  
120  
160.0  
Restart  
Layer  
Rate (A/s vs. Time)  
PHASE: Stop Layer  
Process: My Process 1  
Layer: 1 of 4  
Run Time: 0:01:45  
Final Thick: 1.100  
Layer Rate : 8.00  
Abort  
Film : Film1  
Layer Stopped  
Restart Layer repeats the stopped layer, beginning with preconditioning. Start Nxt  
Layer skips the remainder of the current layer and immediately starts the next layer.  
Note: Pressing the Abort SoftKey at any time completely aborts the process. You can  
only restart the process at Layer 1!  
Spend some time in Simulate mode verifying that the process sequences through each  
phase of each layer as expected. If not, use the Quick Setup, Process, and Film menus  
to make corrections.  
Because the process is being “simulated,” some parameters will not be correct for your  
process (particularly, PID). However, you can become familiar with the effect of each  
parameter in this simulated process. Also practice using the Next Menu options,  
especially Auto/Manual modes.  
Once you have verified the process in Simulate Mode, you may return to the System  
Params menu and turn Simulate OFF to start testing your process. Use the next  
section to finalize the loop PID settings.  
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Chapter 2  
Operation  
2.7 Loop Tuning  
This section will help you adjust your control loop PID parameters to achieve a stable  
deposition process. Keep in mind that there is no “best” way to determine PID  
parameters, and no one set of settings that are “best.”  
Setup System Parameters: Be sure that the output Scale and crystal Min/Max  
Frequency parameters are accurate for your system. All Tooling parameters are best  
set to 100% for now. A Period of .25 seconds is also a good starting point. Simulate  
should be OFF.  
Create a One-Layer Test Process: Create a new film with all default values. Create a  
new process that has the new film as its only layer, and select it as the current process.  
In the Quick Setup menu set Init Rate to your desired rate and Final Thickness to a  
large value, say 10X your desired Final Thickness. Select the proper Sensor(s), Output,  
and Material. Set Max Power to 100% and Slew rate to 100%.  
Test the Setup: Press Auto/Manual to start the layer in Manual mode. Slowly turn the  
control knob to a power of 10%, and verify that your power supply output is about 10%  
of full scale. Continue to turn the control knob until a Rate(A/s) above 0 is shown.  
Again, verify that the power supply output agrees with the SQC-122c Power(%) reading.  
If the readings don’t agree, check your wiring and process setup. In particular, verify  
that the System Parameters output scale agrees with your power supply input  
specifications.  
Determine Open Loop Gain: Slowly adjust the control knob until the Rate(A/s) reading  
approximately matches your desired rate (Init Rate in the Quick Setup menu). Record  
the desired rate Power(%) reading as PWRDR. Slowly lower the power until the  
Rate(A/s) reading is just at (or near) zero. Record the zero rate Power(%) reading as  
PWR0R.  
Determine Open Loop Response Time: Calculate 1/3 of your desired rate (RATE1/3),  
and 2/3 of the desired rate (RATE2/3) for this layer. Slowly increase the power until  
Rate(A/s) matches RATE1/3. Get ready to record the loop’s response to an input  
change. Quickly adjust Power(%) to PWRDR. Measure the time for the Rate (A/s)  
reading to reach RATE2/3. You may want to do this several times to get an average  
response time reading. Displaying the Rate graph will also help. Twice the measured  
time is the step response time, TIMESR. TIMESR is typically .7 to 1.5 seconds for E-  
Beam evaporation, 5 to 20 seconds for thermal evaporation.  
Return the output power to 0%, then press Manual/Auto to return to Auto mode. Follow  
these steps to set the loop PID parameters:  
Set PID Values: In the Quick Setup menu set P=25, I= TIMESR, D=0. Exit the Quick  
Setup menu. Press Start and observe the Power graph. The power should rise from  
0%, and stabilize near PWRDR with little ringing or overshoot. If there is more than  
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Chapter 2  
Operation  
about 10% overshoot, lower the P Term. If the time to reach PWRDR is very slow,  
increase the P Term. A lower I Term will increase response time, a higher value will  
eliminate ringing and setpoint deviations. It is unlikely you will need any D Term.  
Continue to Start the process and adjust PID until steady-state response is smooth and  
the step response is reasonably controlled. You don’t need to totally eliminate ringing  
during the step if the steady-state response is smooth, preconditioning will minimize  
step changes.  
Set Preconditioning: The power level you recorded as PWR0R is the power where  
deposition just begins. That’s a good value for Ramp 1 power. PWRDR, or slightly less,  
is a good value for Ramp 2 Power. This will eliminate a large step change when  
entering the deposition phase.  
Once PID terms are established for a material, they will typically be similar for other  
materials. Only the P Term and preconditioning power levels may need adjustment.  
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Chapter 2  
Operation  
2.8 Troubleshooting  
Most SQC-122c problems are caused by defective crystals or improper film setup,  
particularly incorrect PID settings for the control loop. Follow the procedures below to  
identify and correct common problems.  
2.8.1 No Readings, or Erratic Readings from Sensors:  
Disconnect the deposition source supply. This eliminates the possibility that a noisy  
source, or poor loop tuning, are causing an unstable PID loop.  
Verify that the sensors, oscillator and cabling are connected as shown in Section 1.5.  
Assure that a good ground connection has been made to the SQC-122c chassis.  
Replace the quartz crystal. Crystals sometimes fail unexpectedly, or exhibit erratic  
frequency shifts before total failure. Depending on the material, crystals may fail well  
before the typical 5MHz value. If you find that crystals consistently fail early, you may  
want to set Min Frequency in the System Menu to a value higher then 5 MHz.  
In the System Menu, assure that Simulate Mode is OFF, and Frequency Min/Max are  
set properly for your crystals (typically Freq Min=5.0 MHz, Freq Max=6.0 MHz). Some  
manufacturer's crystals exceed 6MHz when new. Setting Frequency Max to 6.1 Hz will  
correct that problem, with no bearing on instrument accuracy.  
Press Film Menu, Edit, and assure that the proper sensors are enabled. Press Exit to  
Main, then Next Menu until the Sensor Info SoftKey shows. Press Sensor Info to show  
sensor frequency and % Life.  
While not depositing, observe the % Life display for each active sensor. The value  
should be stable, between 20% and 100%.  
If the % Life reading is zero or unstable: Recheck the wiring from the sensor to the  
SQC-122c, and verify that the SQC-122c is properly grounded. Also check that the  
crystal is seated properly in the sensor head.  
Swap the sensor to the other SQC-122c input. If both SQM-122 inputs show zero or  
unstable readings, the problem is almost certainly a wiring or sensor problem.  
If the % Life is less than 50%: Replace the crystal and assure that % Life is near  
100%, very stable. If % Life is not near 100%, check the Frequency Min/Max limits.  
If the problem is not corrected: Referring to Section 1.5, disconnect the 6” M/F BNC  
cable from the external oscillator module. A 5.5 MHz test crystal and BNC barrel  
adapter is supplied with each oscillator. Attach the test crystal to the oscillator  
Sensor connector. The display should read about 5.5 MHz, very stable. If not,  
contact Sigma Instruments technical support.  
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When the frequency reading is stable, reconnect the source supply. Start the  
deposition process in Manual mode with 0% output. The % Life readings should remain  
stable.  
Slowly raise the % Output until a rate reading is displayed above the graph. As material  
is deposited on the crystal, the % Life reading should remain stable, or drop slowly and  
consistently. If not, check your source supply for erratic output. Also assure that the  
sensor is not too close to the source (particularly in sputtering).  
2.8.2 Incorrect Rate or Thickness Measurement:  
First, complete the procedures in Section 2.8.1 to assure reliable sensor operation.  
Set the Xtal Tooling as described in the System Menu section of Chapter 3. Incorrect  
Xtal Tooling values will cause consistently low or high rate/thickness values for every  
material.  
Once the Xtal Tooling is set, set Film Tooling in the Film Menu to 100 unless you are  
certain that another value is needed for a specific film.  
Verify that the Density and Z-Factor values match those in the Materials Parameters  
Appendix. If the material is not listed, check a materials handbook. Density has a  
significant effect on rate/thickness calculations.  
Z-Factor corrects for stresses as a crystal is coated. If readings are initially accurate,  
but deteriorate as crystal life drops below 60-70%, you need to adjust the Z-Factor or  
replace crystals more frequently. The relationship between Z-Factor and Acoustic  
Impedance is discussed in the Materials Appendix.  
2.8.3 Poor Rate Stability:  
First, be sure that a stable rate can be achieved in Manual mode, as explained in  
Section 2.8.1. Once a stable rate is achieved in Manual mode, follow the Loop Tuning  
procedures of Section 2.7.  
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Chapter 3  
Menus  
3.0 Introduction  
SQC-122c operation during deposition is accomplished by pressing one of the six  
SoftKeys along the left of the display. Five menus provide access to all programmable  
and operating functions:  
Main  
Menu  
The Main Menu is displayed at power up. It provides the  
SoftKey functions and display information necessary to run a  
thin film deposition.  
On the Main Menu, you can view additional sub-menus by  
repeatedly pressing the Next Menu SoftKey. These sub-  
menus are discussed in Section 3.2.  
Quick Setup  
Menu  
Provides immediate access to the most commonly adjusted  
parameters for the current process and layer.  
Process  
Menu  
A process is a sequence of layers of deposited film(s). Each  
layer in a process has a specific film, final thickness, and  
deposition rate(s) associated with it. These are accessed from  
the Process Menu.  
Film  
Menu  
A film is basically a material plus the setup information  
necessary to deposit that material. Settings on the Film Menu  
include pre/post conditioning, deposition error controls, and the  
physical chamber setup for that material.  
System  
Parameters  
Menu  
System parameters control the overall operation of the SQC-  
122c. Tooling, crystal frequency, and operating modes are  
examples of settings found on the System Parameters Menu.  
The remainder of this chapter provides a detailed explanation of each menu and its  
settings.  
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Chapter 3  
Menus  
3.1 Main Menu  
The default, power-up Main Screen display is shown below.  
THICKNESS(kA)  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Next  
Menu  
0.000  
100.0  
Quick  
Setup  
50.0  
Process  
Menu  
Film  
Menu  
0.0  
0.0  
12.5  
25.0  
37.5  
50.0  
Power (% vs. Time)  
System  
Params  
PHASE: Stopped  
Process: My Process 1  
Layer: 1 of 25  
Run Time: 0:00:00  
Final Thick: 0.1011  
Layer Rate : 11.1  
Start  
Film : Aluminum  
Main Screen  
The measured Thickness, Rate, and output Power values are always displayed along  
the top of the screen.  
The graph displays either Rate, Rate Deviation, or output Power. The next section of  
the manual describes graph selection.  
The status bar below the graph displays the current deposition phase. In Manual mode,  
Manual Power is displayed in the status bar. In Auto mode, the status bar will  
automatically sequence through the pre-condition, deposit, and feed/idle phases for  
each layer, as defined by the Process setup.  
Below the status bar, important settings for the current process are shown. The next  
section explains other parameters that can be displayed in this screen area.  
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Menus  
The Main Screen SoftKeys undergo subtle changes based on the current process  
status. The table below describes the function of each of the possible SoftKeys on the  
Main Screen.  
Next  
Menu  
Displays additional Main Menu options as described in Section  
3.2.  
Quick  
Setup  
Displays the Quick Setup Menu of commonly changed process  
values.  
Process  
Menu  
Create, delete, and edit up to 25 processes. Also used to  
select the currently active process. When a process is running,  
this selection is not available.  
Film  
Menu  
Create, delete, and edit up to 25 films. A film is basically a  
material, and may appear in several processes.  
System  
Params  
Sets system-wide operating parameters. Also used to “map”  
the 8 digital inputs and 8 relays to process functions.  
Start  
Layer  
Each layer in a process can be defined as auto start or manual  
start. Auto start layers begin immediately on completion of the  
previous layer. Manual start layers wait for the operator to  
press the Start Layer SoftKey.  
Restart / StartNxt  
Layer  
During deposition, it may be necessary to halt a layer to correct  
a problem. These two SoftKeys allow the operator to either  
restart the current layer or skip to the next layer.  
Stop  
Layer  
Temporarily halts deposition. Deposition is restarted with the  
Restart or Start Nxt keys.  
Start/Abort  
Starts or aborts sequencing through the current process layers  
and deposition cycles. Abort sets both outputs to zero, and  
abandons the current process.  
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Menus  
3.2 Next Menu Screens  
The Next Menu SoftKey provides access to two sub-menus of the Main Menu that  
control display and operating mode preferences.  
THICKNESS(kA)  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
THICKNESS(kA)  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Next  
Menu  
Next  
Menu  
0.000  
0.000  
100.0  
100.0  
Next  
Graph  
Zero  
50.0  
50.0  
Auto /  
Switch  
Displays  
Manual  
Sensor  
Info  
0.0  
0.0  
0.0  
0.0  
12.5  
25.0  
37.5  
50.0  
12.5  
25.0  
37.5  
50.0  
Power (% vs. Time)  
Power (% vs. Time)  
PHASE: Stopped  
PHASE: Stopped  
Run #: 1  
Source: 1  
Run #: 1  
5-16-00  
8:22:39  
Source: 1  
Max Pow:: 100.00 %  
Slew: 100.00 %  
5-16-00  
Max Pow:: 100.00 %  
Slew: 100.00 %  
Start  
Start  
8:22:39  
Next Menu Screens  
Zero  
Zeros the thickness reading. Useful for resetting or extending  
the current deposition layer.  
Auto /  
Manual  
Toggles between Auto and Manual power control. When  
Auto/Manual is shown, output power is set by the SQC-122c to  
achieve the programmed deposition rate. When Manual/Auto  
is shown, the control knob sets the output power.  
Next  
Graph  
Cycles through options for the main display. Choose between  
Rate, Rate Deviation, and Power graphs.  
Switch  
Displays  
Toggles between data display options at the bottom of the  
SQC-122c screen. Note the differences between the screens  
above, and the Main Menu screen in the previous section.  
Sensor Info  
Replaces the graph with the sensor information screen:  
THICKNESS(kA)  
0.000  
RATE(A/s)  
0.0  
POWER( %)  
0.0  
Next  
Menu  
Sensor # Enable  
Frequency  
Life  
1
2
ON  
ON  
5.543210 MHz  
5.654321 MHz  
54.32 %  
65.43 %  
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3.3 Quick Setup Menu  
The Quick Setup Menu provides access to the most commonly adjusted parameters for  
the current process and layer.  
THICKNESS(kA)  
RATE(A/s)  
POWER(%)  
0.0  
Exit to 
0.000  
0.0  
Main  
My Process 1 -> Layer 1-> Aluminum  
Parameter  
Value  
Units  
11.1  
0.101  
Init Rate  
A/s  
kA  
Fnl Thk  
P Term  
50  
None  
Edit  
I Term  
0.7  
Sec.  
0.0  
On  
On  
Sec.  
On/Off  
On/Off  
D Term  
Prev  
Layer  
Sensor 1  
Sensor 2  
Next  
Output  
Out1  
Out1/Out2  
Layer  
76.0  
%
Max. Power  
10.0  
Slew Rate  
%
Material  
Aluminum  
Quick Setup Menu  
Exit to Main  
Returns to the Main Menu.  
Edit  
Selects the highlighted parameter for edit. SoftKey functions  
change to:  
Next: Store parameter and move to next for editing.  
Cancel: Stop editing and undo changes to selected parameter.  
Enter: Stop editing and save values for selected parameter.  
Control Knob: Turn to adjust value. Push to store value and  
move to next parameter.  
Prev Layer  
Next Layer  
Displays the parameters for the previous layer in the process.  
Displays the parameters for the next layer in the process.  
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Quick Setup parameters are described below:  
Initial Rate: The beginning rate of deposition for this layer.  
Final Thickness: The desired final thickness of this layer. The deposition phase of this  
layer will end when this thickness is reached.  
P Term: Sets the gain of the control loop. High gains yield more responsive (but  
potentially unstable) loops. Try a value of 50, then gradually increase/decrease the  
value to respond to step changes in rate setpoint.  
I Term: The integral term controls the time constant of the loop response. A small I  
term, say .5 to 1 seconds, will smooth the response of most loops.  
D Term: The differential term causes the loop to respond quickly to changes. Use 0 or  
a very small value to avoid oscillations.  
Sensor 1: Allows quartz crystal Sensor 1 to be turned on or off for the selected layer. If  
more than one sensor is assigned to a layer, their readings are averaged. If multiple  
sensors are assigned to a layer, and one fails, it is excluded from measurements.  
Sensor 2-6: Allows quartz crystal Sensor 2 to be turned on or off. If the four sensor  
option card is installed, Sensor 3 to 6 are also visible.  
Output: Selects the control voltage output that is active for the selected layer.  
Max Power: The maximum output power allowed for the selected output. The Scale  
output voltage is a function of the deposition power supply input specifications, and is  
set in the System Parameters menu. Max Power controls the maximum power that can  
be used by this process layer.  
Slew Rate: The maximum power change allowed on an output, per second. If power or  
rate ramps exceed this value, an error will occur.  
Material: Selects a material assigned to this film. As materials change, their density  
and Z-Factor are updated.  
Density: Sets the density for this material. Material density has a significant impact on  
deposition calculations.  
Z-Factor: Sets the Z-factor, an empirically determined measure of a material’s effect on  
quartz crystal frequency change. Z-Factor is the ratio of the acoustic impedance of the  
sensor to that of the deposited material. It is used to match the acoustic (oscillation)  
properties of the material to the quartz sensor. If you know the “acoustic impedance” of  
your material, divide it by 8.83 (the acoustic impedance of SiO2) to obtain the material’s  
Z-Factor.  
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3.4 Process Menus  
There are several tiers of Process Menus. The first menu (shown below) selects the  
current process. The current process is the process that is ready to run, and also the  
process that is selected for editing.  
THICKNESS(kA)  
0.000  
My Process 1 -> Layer 1 -> Aluminum  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Main  
Screen  
Scroll Processes with Knob  
Prev  
Menu  
1. My Process 1  
2. My Process 2  
3. My Process 3  
4. My Process 4  
5. My Process 5  
6. My Process 6  
7. My Process 7  
8. My Process 8  
9. My Process 9  
10. My Process 10  
11. My Process 11  
Edit  
Delete  
Process Select Menu  
Main Screen  
Returns to the Main Menu.  
Prev  
Menu  
Steps back through the sequence of process menus: Process  
Select <–> Layer Select <–> Layer Edit. On the topmost  
Process Menu, returns to the Main Menu.  
Select /  
Edit  
Select sets the highlighted process as the current process.  
Edit displays the Layer Select Menu for the current process.  
Delete  
Deletes the highlighted process and all of its layers.  
Control Knob  
Scrolls through the list of processes. When pressed, selects or  
begins editing the highlighted process.  
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The second Process Menu shows the sequence of layers that will be deposited in the  
current process.  
THICKNESS(kA)  
0.000  
My Process 2 -> Layer 2 -> Aluminum  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Main  
Screen  
Layer  
Film  
Prev  
Menu  
Layer 1  
Layer 2  
Aluminum  
AluminumOxide  
Edit  
Cut /  
Paste  
Insert  
Layer  
Layer Select Menu  
Returns to the Main Menu.  
Returns to the Process Select Menu.  
Main Screen  
Prev  
Menu  
Edit  
Displays the Layer Edit Menu for the highlighted layer (see  
next page).  
Cut /  
Paste  
Used to develop the sequence of layers in a process. The  
highlighted layer may be Cut (removed from the process) or  
Copied to the clipboard. The layer on the clipboard can then  
be Pasted anywhere in the list of layers.  
Insert  
Layer  
Shows the list of 25 films. Select a film, then press Enter to  
insert the film as a new layer.  
Control Knob  
Scrolls through the list of layers in the Layer Select Menu, and  
through the list of films in the Insert Layer mode. When  
pressed, begins editing of the highlighted layer.  
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Each layer consists of a film (i.e. a material), plus the deposition rate and thickness that  
are desired for this layer. The Layer Edit Menu provides access to these layer  
parameters:  
THICKNESS(kA)  
0.000  
My Process 2 -> Layer 2 -> AluminumOxide  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Exit to  
Main  
Parameter  
Value  
Units  
Prev  
Menu  
Init Rate  
9.9  
A/s  
kA  
Fnl Thk  
9.000  
Time Setpoint  
0:00:00  
0.000  
h:mm:ss  
A
Edit  
Thickness Limit  
Start Mode  
Ramp 1  
Manual  
Enabled  
4.500  
Auto/Man.  
En/Dis  
kA  
Start Thkness  
Ramp Time  
New Rate  
0:10:00  
99.0  
h:mm:ss  
A/s  
Ramp 2  
Disabled  
En/Dis  
Edit Layer Menu  
Exit to Main  
Returns to the Main Menu.  
Prev Menu  
Edit  
Returns to the Layer Select Menu.  
Selects the highlighted parameter for edit. SoftKey functions  
change to:  
Next: Store parameter and move to next for editing.  
Cancel: Stop editing and undo changes to selected parameter.  
Enter: Stop editing and save values for selected parameter.  
Control Knob: Turn to adjust value. Push to store value and  
move to next parameter.  
Control Knob  
Scrolls through the list of layer parameters.  
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A description of each parameter on the Layer Edit Menu follows:  
Initial Rate: The beginning rate of deposition for this layer.  
Final Thickness: The desired final thickness of this layer. The deposition phase of this  
layer will end when this thickness is reached.  
Time Setpoint: Sets an arbitrary time, after deposition begins, when the time setpoint  
relay is activated.  
Thickness Limit: Sets an arbitrary thickness when the thickness limit relay is activated.  
Start Mode: Determines whether a layer begins automatically upon completion of the  
previous layer. If Manual start is selected, the previous layer ends at its idle power and  
waits for the user to push the Start button.  
Ramp 1: During the deposition of a layer, it may be desirable to change the deposition  
rate. For example, you may want to deposit slowly at first, then increase the rate once  
an initial thickness is reached. Enabling rate ramps provides that capability. Once  
enabled, these parameters are added to the list.  
Start Thickness: The deposited thickness at which the new rate will begin.  
Ramp Time: Time allowed for the rate to change from initial rate to new rate.  
New Rate: The rate of deposition, which is reached at the end of Ramp 1.  
Ramp 2: Two rate ramps are available for each layer. The start thickness for Ramp 2  
should be greater than the start thickness for Ramp 1.  
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3.5 Film Menus  
Each film has certain characteristics that determine how it should be deposited. The  
Film Menus allow you to set parameters that regulate the deposition of each film in a  
certain process.  
THICKNESS(kA)  
0.000  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Main  
Screen  
My Process 1  
Editing:  
Scroll Films with Knob  
Prev  
Menu  
1. Film 1  
2. Film 2  
3. Film 3  
4. Film 4  
5. Film 5  
6. Film 6  
7. Film 7  
8. Film 8  
9. Film 9  
10. Film 10  
11. Film 11  
Edit  
Delete  
Film Select Menu  
Main Screen  
Returns to the Main Menu.  
Prev  
Menu  
Steps back through the film menus: Film Select <–> Film Edit  
<-> Film Conds/Deposit Controls. On the topmost Film Menu,  
returns to the Main Menu.  
Edit  
Displays the Film Edit Menu for the highlighted film.  
Delete  
Deletes the highlighted film. (Note: Films cannot be deleted if  
they are used in any process.)  
Control Knob  
Scrolls through the list of films. When pressed, begins editing  
of the highlighted film.  
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The material to be deposited is the most significant film parameter. However, a film  
definition also includes the setup parameters shown below:  
THICKNESS(kA)  
0.000  
RATE(A/s)  
0.0  
POWER( %)  
0.0  
Exit to  
Main  
My Process 1  
Editing: Aluminum  
Parameter  
Value  
Units  
Prev  
Menu  
P Term  
I Term  
D Term  
50  
None  
Sec.  
0.7  
0.0  
Sec.  
On/Off  
On/Off  
%
Edit  
Sensor 1  
On  
On  
100  
Sensor 2  
Film  
Conds.  
Film Tooling  
Output  
Out1  
1
Out1/Out2  
Deposit  
Pocket  
Controls  
Max Power  
Slew Rate  
Crystal Quality  
76.0  
%
%
10.0  
Disabled  
Film Edit Menu  
Exit to Main  
Returns to the Main Menu.  
Prev  
Returns to the Film Select Menu.  
Menu  
Edit  
Selects the highlighted parameter for edit. SoftKey functions  
change to:  
Next: Store parameter and move to next for editing.  
Cancel: Stop editing and undo changes to selected parameter.  
Enter: Stop editing and save values for selected parameter.  
Control Knob: Turn to adjust value. Push to store value and  
move to next parameter.  
Film Conds.  
Displays pre/post conditioning settings (See 2.6).  
Displays deposition control settings (See 2.2).  
Scrolls through the list of film parameters.  
Deposit Controls  
Control Knob  
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The Film Conds SoftKey displays these additional film conditioning settings: (Refer to  
section 2.2 for definitions).  
THICKNESS(kA)  
0.000  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Exit to  
Main  
My Process 1 Editing: Aluminum  
Parameter  
Value  
Units  
Prev  
Menu  
Ramp1 Power  
Ramp1 Time  
50  
%
0.7  
h:mm:ss  
Soak1 Time  
Ramp2 Power  
Ramp2 Time  
0.0  
h:mm:ss  
%
Edit  
On  
On  
h:mm:ss  
h:mm:ss  
%
Soak2 Time  
Feed Power  
Ramp Time  
Feed Time  
Out1  
75.0  
10.0  
h:mm:ss  
h:mm:ss  
%
0:00:00  
2.90  
Idle Power  
Ramp Time  
0.950  
h:mm:ss  
Film Conditioning Menu  
Returns to the Main Menu.  
Returns to the Film Edit Menu.  
Exit to Main  
Prev Menu  
Edit  
Selects the highlighted parameter for edit. SoftKey functions  
change to:  
Next: Store parameter and move to next for editing.  
Cancel: Stop editing and undo changes to selected parameter.  
Enter: Stop editing and save values for selected parameter.  
Control Knob: Turn to adjust value. Push to store value and  
move to next parameter.  
Control Knob  
Scrolls through the list of film conditioning parameters.  
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The Deposit Controls SoftKey displays these additional film settings: (Refer to section  
2.2 for deposition control definitions.)  
THICKNESS(kA)  
0.000  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Exit to  
Main  
Current: Process 1  
EDITING: Film 1  
Parameter  
Value  
Units  
Prev  
Menu  
Shutter Delay  
Capture  
0:01:00  
h:mm:ss  
%
20.0  
(Ignore, Stop, Hold)  
Control Error  
Setting  
Edit  
Hold  
Error  
18.0  
%
%
Rate Sampling  
Setting  
(Cont,Time,Acc based)  
Undefined  
0.0  
Accuracy Based  
Deposition Controls Menu  
Returns to the Main Menu.  
Returns to the Film Edit Menu.  
Exit to Main  
Prev Menu  
Edit  
Selects the highlighted parameter for edit. SoftKey functions  
change to:  
Next: Store parameter and move to next for editing.  
Cancel: Stop editing and undo changes to selected parameter.  
Enter: Stop editing and save values for selected parameter.  
Control Knob: Turn to adjust value. Push to store value and  
move to next parameter.  
Control Knob  
Scrolls through the list of deposition control parameters.  
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A description of each film parameter follows:  
P Term: The proportional term sets the gain of the control loop. High gains yield more  
responsive (but potentially unstable) loops. Try a value of 50, then gradually  
increase/decrease the value to respond to step changes in rate setpoint.  
I Term: The integral term controls the time constant of the loop response. A small I  
term, say .5 to 1 seconds, will smooth the response of most loops.  
D Term: The differential term causes the loop to respond quickly to changes. Use 0 or  
a very small value to avoid oscillations.  
Sensor 1: Allows quartz crystal Sensor 1 to be used for the selected film. If both  
sensors are assigned to a film, their readings are averaged. If two sensors are  
assigned to a film, and one fails, it is excluded from measurements.  
Note: If a relay is assigned to Dual Crystal Shutter in the I/O Setup Menu, Sensor 1  
becomes the primary sensor and Sensor 2 a secondary sensor. Sensor 1 is used until  
a crystal fail condition occurs. When Sensor 1 fails, measurement automatically  
switches to Sensor 2. Sensor 2 will be used until the process completes or is aborted.  
The next process run will return to Sensor 1.  
Film Tooling: Compensates for sensor sensitivity to the selected material. Use Xtal  
Tooling in the System Params menu to compensate for each sensor individually.  
Output: Selects the control voltage output that is active for the selected layer.  
Pocket: Indicates which pocket (1-8) should be used. For this parameter to have an  
effect, you must assign the Pocket Relays and Pocket Ready input in System  
Parameters I/O setup (see section 3.7).  
Max Power: The maximum output power allowed for the selected output. The Scale  
output voltage is a function of the deposition power supply input specifications, and is  
set in the System Parameters menu. Max Power controls the maximum power that can  
be used by this process layer.  
Slew Rate: The maximum power change allowed on an output, per second. If power or  
rate ramps exceed this value, an error will occur.  
Crystal Quality: The maximum allowed rate deviation, from the rolling average of the  
previous 16 rate readings. Each time the rate deviation exceeds the selected percent  
value, a counter is incremented. Each time the deviation is within the selected value,  
the counter is decremented (to 0 minimum). If the counter reaches 100 during a  
process, the process is aborted. Crystal Quality settings from 0 to 9 indicate:  
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0
Disabled  
30.0%  
25.0%  
20.0%  
15.0%  
5
6
7
8
9
12.5%  
10.0%  
7.5%  
5.0%  
2.5%  
1
2
3
4
Note: The Crystal Quality setting is very sensitive to PID loop tuning. It is best to leave  
Crystal Quality disabled until you are confident of your process and PID settings.  
Crystal Stability: As material is deposited on the crystal, the frequency normally  
decreases. However arcing, mode hopping, or external stresses may cause the crystal  
frequency to increase. If the accumulated value of these positive frequency shifts (or a  
single large positive shift) exceeds a threshold during a process, a crystal fail condition  
is indicated.  
0
1
2
3
4
Disabled  
5000 Hz (1250 Hz single shift)  
1000 Hz  
500 Hz  
400 Hz  
5
6
7
8
9
200 Hz  
200 Hz (100Hz single shift)  
100 Hz  
100 Hz (50Hz single shift)  
25Hz  
Xtal Fail Mode: Programs the action when the last sensor assigned to a film fails.  
Selecting Halt stops the process. When Timed Power is selected, the instrument uses  
the last valid rate, thickness, and power readings to calculate the time required to reach  
final thickness. The power is fixed at the last valid reading and deposition continues for  
the calculated time. Because there are no sensor readings, this is only a rough  
estimate. The more stable the process, the more accurate the estimate.  
Material: Selects a material assigned to this film. As materials change, their density  
and Z-Factor are updated.  
Density: Sets the density for this material. Material density has a significant impact on  
deposition calculations.  
Z-Factor: Sets the Z-Factor, an empirically determined measure of a material’s effect  
on quartz crystal frequency change.  
Ramp 1: Ramp power sets the power level desired at the end of the ramp phase, in %  
of Scale 1,2. Ramp time sets the time to ramp linearly from the initial power to the Ramp  
power. Soak time sets the time the output remains at the ramp power level.  
Ramp 2: Ramp 2 functions are the same as Ramp 1. Typically, Ramp 2 power is set  
near the power level required to achieve the desired initial deposition rate.  
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Feed: The feed phase holds output power at the level and time required to wire feed  
new material.  
Idle: Idle power ramps output power back to zero, or holds the material at a state that is  
ready for deposition (usually the same as Ramp 2 power).  
Shutter Delay: It is often desirable to obtain deposition control before the substrate  
shutter opens. Enabling shutter delay requires that the system reach a specific capture  
accuracy before the shutter opens. If the capture accuracy is not reached within the  
shutter delay time, the process halts. Otherwise, the substrate shutter opens and  
deposition begins when control accuracy has been maintained for 5 seconds. The  
thickness reading is zeroed at the end of the shutter delay period.  
Capture: The control accuracy (%) that must be reached to end the shutter delay.  
Control Error: If the control loop cannot maintain the desired deposition rate, due to  
loss of source material, excess rate ramps, or equipment malfunction, a control error  
occurs. The error condition can be ignored, the process stopped (output power to 0%),  
or the output power held at the same level as when the error occurred. If hold is  
selected, PID control is abandoned, but the process will continue to be monitored for  
thickness setpoint.  
Rate Sampling: Rate sampling can extend the life of crystals. With rate sampling, the  
deposition rate is sampled for a period of time, then the sensor shutter is closed. Power  
is then held at the same level as the final power setting during the sample period.  
? Continuous selects no sampling, the sensor shutter remains open during deposition.  
? Time based sampling opens the shutter for a fixed period of time, then closes it for a  
? fixed time.  
? Accuracy based sampling opens and closes the shutter at the rate required to  
maintain the desired accuracy during the hold phase.  
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3.6 System Parameters Menu  
The System Parameters Menu contains settings that affect the basic operation of the  
SQC-122c. System parameters generally pertain to the physical setup of your vacuum  
system equipment.  
THICKNESS(kA)  
0.000  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Exit to  
Main  
My Process 1 -> Layer 1 -> Aluminum  
Parameter  
Value  
Units  
Period  
.25  
Sec  
%
System Tooling  
100  
Xtal Tool 1  
100  
%
Edit  
Xtal Tool 2  
100  
Off  
%
Simulate Mode  
Min Frequency  
Max Frequency  
On/Off  
I / O  
Setup  
5.0e+06  
6.0e+06  
2.5  
Hz  
Hz  
Volts  
Volts  
Scale 1  
Scale 2  
2.6  
Contrast  
1.5  
%
Dev Graph Limit  
20.0  
Edit System Params Menu  
Exit to Main  
Returns to the Main Menu.  
Edit  
Selects the highlighted parameter for edit. SoftKey functions  
change to:  
Next: Store parameter and move to next for editing.  
Cancel: Stop editing and undo changes to selected parameter.  
Enter: Stop editing and save values for selected parameter.  
Control Knob: Turn to adjust value. Push to store value and  
move to next parameter.  
I / O Setup  
Displays menu for mapping of inputs and outputs.  
Scrolls through the list of system parameters.  
Control Knob  
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Descriptions of each System Parameter follows:  
Period: Sets the measurement period between .1 second (10 readings per second) and  
1 second. A longer period gives higher reading accuracy, especially in low rate and low  
density applications.  
Period  
Frequency  
(seconds)  
Resolution (Hz)  
.1  
.25  
.5  
.75  
1
.3  
.12  
.06  
.04  
.03  
System Tooling: Adjusts for overall sensor deposition rates that differ from the  
measured substrate deposition rate.  
Xtal Tool 1-2: Adjusts for sensor deposition rates that differ from the measured  
substrate deposition rate, because of sensor location. If the rate/thickness reading is  
low, then increase the tooling value. If the rate/thickness reading is high, then lower the  
tooling value  
Simulate Mode: Normal mode uses the quartz crystals as inputs to the SQC-122c for  
PID calculations and source output control. Simulate mode simulates the quartz  
crystals based on the crystal frequencies set on this. Simulate mode is useful for  
debugging process recipes.  
Min/Max Frequency: The frequency values for the quartz crystal sensors used as  
inputs to the SQC-122c. The maximum frequency should be set to the frequency of a  
new crystal, typically 6MHz. Sensor readings outside the min/max values cause an  
error.  
Scale 1 -2: The input voltage required by the deposition source power supply to  
produce 100% output power. Positive or negative Scale 1,2 values are possible.  
Pocket Relay: Select Single to assign a single relay to each source pocket. Select  
Multi to allow relays to represent the BCD encoded value of the selected pocket.  
For example, assume that a film has its Pocket parameter set to 3. In I/O Setup, set  
Relay 1, 2, & 3 to Pocket 1, 2, & 3. Then if this parameter is set to Single, Relay 3 will  
close when deposition begins. If this parameter is set to Multi then Relays 1 & 2 will  
close (representing a binary 3).  
Dev Graph Limit: Sets the upper limit for the Rate Deviation graph Y axis.  
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Rate Alarm Low: Sets the % deviation below rate setpoint that causes an audible  
alarm.  
Rate Alarm High: Sets the % deviation above rate setpoint that causes an audible  
alarm. The tone of the high rate alarm is lower than that of the low rate alarm.  
Password Enable: If Password is enabled, the Quick Start, Film and System Menus  
require a password. The Process Menu can be used to select a process, but a  
password is required to make any changes on the Process Menu.  
Password: If password is enabled, this parameter sets the sequence of SoftKeys to  
press to enter menus. Press the desired sequence to set the password. Holding down  
the top and bottom switch while powering up the SQC-122c sets the password to  
“1111.”  
System Time: Sets the SQC-122c clock to your local time. System time is battery  
backed up. Does not compensate for daylight savings time.  
System Date: Sets the SQC-122c date to your local time. System date is battery  
backed up.  
3-20  
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Chapter 3  
Menus  
3.7 I/O Setup  
The I / O Setup SoftKey displays a menu allowing you to map the eight digital inputs  
and the eight digital outputs.  
THICKNESS(kA)  
0.000  
My Process 1 -> Layer 1 -> Aluminum  
RATE(A/s)  
0.0  
POWER(%)  
0.0  
Exit to  
Main  
Parameter  
Value  
Prev  
Menu  
Input 1  
Input 2  
Input 3  
Input 4  
Input 5  
Input 6  
Input 7  
Input 8  
Relay 1  
Relay 2  
Relay 3  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
Edit  
I / O Mapping Menu  
Exit to Main  
Returns to the Main Menu.  
Prev Menu  
Edit  
Returns to the System Parameters Menu.  
Selects the highlighted parameter for edit. SoftKey functions  
change to:  
Next: Store parameter and move to next for editing.  
Cancel: Stop editing and undo changes to selected parameter.  
Enter: Stop editing and save value for selected parameter.  
Control Knob: Turn to adjust value. Push to store value and  
move to next parameter.  
Control Knob  
Scrolls through the list of inputs and relays.  
3-21  
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Chapter 3  
Menus  
In the I/O Setup Menu, any number of “events” can be mapped to the eight digital inputs  
and eight relay outputs. Options are set by selecting a relay or input and then turning  
the control knob to select the desired setting. The following explains each event:  
Relays  
Explanation (closes when)  
Source 1 Shutter  
Source 2 Shutter  
Sensor 1 Shutter  
Sensor 2 Shutter  
All Crystal Fail  
Sensor 1 Fail  
Sensor 2 Fail  
PreCond Phase  
Deposit Phase  
SoakHold Phase  
Process Active  
Stopped  
Deposit phase for films set to Output 1.  
Deposit phase for films set to Output 2.  
Shutter Delay and Deposit phases of films set to Sensor 1.  
Shutter Delay and Deposit phases of films set to Sensor 2.  
All sensors assigned to this film have failed.  
Sensor 1 is assigned to this film, and has failed.  
Sensor 2 is assigned to this film, and has failed.  
Process is in Ramp1, Soak1, Ramp2, or Soak2 phase.  
Process is in Deposit phase.  
Process is in Soak/Hold phase.  
Process is running (not stopped).  
Process is stopped (not running).  
Manual Mode  
Max Power  
Time Setpoint  
Thickness Setpoint  
Final Thickness  
Pocket 1-8  
Process is in Manual mode (not under PID control).  
Active output is at maximum power (out of material?).  
The process has been in Deposit phase the indicated time.  
Thickness setpoint reached. Resets on start of next Layer.  
Final thickness reached. Resets on start of next Layer.  
Source pocket # (Single Mode) or BCD bit # (Multi mode)  
Primary sensor in a dual sensor has failed.  
This relay is not assigned to any event.  
Dual Crystal Shutter  
None  
Inputs  
Explanation (high input causes)  
Abort the process. Can only restart at Layer 1.  
Start the process at Layer 1.  
Stop the active layer.  
Abort Process  
Start Process  
Stop Layer  
Restart Layer  
Start Next Layer  
Soak Hold  
Force Final Thickness  
Zero Thickness  
Zero Time  
Start Process 1-25  
Pocket Ready  
None  
Start the active layer.  
Start the next layer.  
Delay the start of deposition.  
End deposition.  
Reset thickness reading to zero.  
Reset time setpoint counter to zero.  
Start the selected process.  
The source indexer is on the desired pocket.  
This input is not assigned.  
3-22  
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Chapter 3  
Menus  
This page left blank for your notes.  
3-23  
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Chapter 4  
Options  
4.0 Introduction  
This section covers the installation of optional accessories.  
4.1 Option Card  
No option cards are available for the SQC-122c, although the rear panel has locations  
for an expansion card. To expand the SQC-122c, the unit can be upgraded to an  
SQC-222. Contact Sigma for information on this factory-only upgrade.  
4.2 Full Rack Extender Installation  
The Full Rack Extender option (PN 900-007) mounts a single SQC-122c into a full width  
19” rack space.  
Follow the steps below to assemble the extender and mount the SQC-122c:  
Remove SQC-122c Determine on which side of the SQC-122c you want to attach  
Mounting Ear  
the rack extender. If a rack mount ear is attached to the  
SQC-122c on that side, remove the two 10-32 flat head  
screws that mount the ear, then remove the rack mount ear.  
Assemble the extender “box” using the eight 6-32 flat head  
screws, two end panels, and two main panels. Thread two  
socket head captive panel screws from the inside of one side  
of the extender. Continue to thread the captive screws until  
their threads are completely exposed on one side.  
Assemble the  
Extender  
Attach the Extender Place the extender next to the SQC-122c, and thread the  
captive screws into the SQC-122c threaded holes that were  
previously used to mount the rack ear. Tighten the captive  
screws to secure the extender to the SQC-122c.  
Attach the Mounting Attach the mounting ear previously removed from the SQC-  
Ears  
122c to the extender using the same10-32 flat head screws. If  
rack mount ears were not already attached to the SQC-122c,  
attach the other mounting ear also.  
Mount the  
SQC-122c  
Slide the entire assembly into an empty 5 ¼” high 19” rack  
mount space. Secure the assembly with four 10-32 rack  
screws (not supplied).  
4-1  
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Appendix  
A. Material Parameters  
Material  
Aluminum  
Aluminum Oxide  
Antimony  
Arsenic  
Barium  
Beryllium  
Bismuth  
Bismuth Oxide  
Boron  
Cadmium  
Cadmium Selenium  
Cadmium Sulfide  
Cadmium Teluridium  
Calcium  
Calcium Fluoride  
Carbon Diamond  
Carbon Graphite  
Cerium Fluoride  
Cerium Oxide  
Chromium  
Chromium Oxide  
Cobalt  
Copper  
Copper Sulfide  
Copper Sulfide B  
Copper Sulfide A  
Dysprosium  
Erbium  
Density ZFactor  
Material  
Magnesium Fluoride  
Manganese  
Manganese Sulfide  
Mercury  
Molybdenum  
Neodymium Fluoride  
Neodymium Oxide  
Nickel  
Niobium  
Niobium Oxide  
Palladium  
Platinum  
Potassium Chloride  
Rhenium  
Density ZFactor  
2.73  
3.97  
6.62  
5.73  
3.5  
1.08  
1
0.768  
0.966  
2.1  
3
7.2  
1
0.377  
0.94  
0.74  
0.257  
1
3.99  
13.46  
10.2  
6.506  
7.24  
8.91  
8.57  
4.47  
12  
21.4  
1.98  
21.04  
12.41  
7.54  
3
1.85  
9.8  
8.9  
0.543  
0.79  
1
1
0.331  
0.493  
1
2.54  
8.64  
5.81  
4.83  
5.85  
1.55  
3.18  
3.52  
2.25  
6.16  
7.13  
7.2  
5.21  
8.71  
8.93  
4.6  
5.8  
5.6  
8.54  
9.05  
7.89  
5.93  
5.31  
5.35  
19.3  
13.1  
9.63  
8.8  
0.389  
0.682  
1
1.02  
0.98  
2.62  
0.775  
0.22  
3.26  
1
0.357  
0.245  
2.05  
0.15  
0.21  
0.89  
0.91  
0.864  
0.712  
1.07  
0.87  
0.529  
1.18  
1.32  
4.8  
Rhodium  
Samarium  
Scandium  
Selenium  
4.82  
2.32  
2.2  
1
Silicon  
0.305  
1
Silicon Dioxide  
Silicon Oxide  
Silver  
Silver Bromide  
Silver Chloride  
Sodium  
Sodium Chloride  
Sulfur  
Tantalum  
Tantalum Oxide  
Tellurium  
Terbium  
Thallium  
Thorium Fluoride  
Tin  
2.13  
10.5  
6.47  
5.56  
0.97  
2.17  
2.07  
16.6  
8.2  
0.343  
0.437  
0.82  
0.67  
0.69  
0.6  
0.74  
0.67  
0.593  
1.59  
0.516  
.381  
0.36  
1
0.58  
0.841  
0.769  
1
0.129  
0.349  
0.92  
1
1.57  
2.29  
0.262  
0.3  
Gadolinium  
Gallium  
Gallium Arsenide  
Germanium  
Gold  
Hafnium  
Hafnium Oxide  
Holnium  
6.25  
8.27  
11.85  
6.32  
7.3  
0.9  
0.66  
1.55  
1
0.724  
0.628  
1
Titanium  
4.5  
4.9  
Titanium Oxide  
Titanium Oxide IV  
Tungsten  
Tungsten Carbide  
Uranium  
Vanadium  
Ytterbium  
Yttrium  
Yttrium Oxide  
Zinc  
Indium  
7.3  
4.26  
19.3  
15.6  
18.7  
5.96  
6.98  
4.34  
5.01  
7.04  
5.61  
5.26  
4.09  
5.6  
0.4  
Indium Intimnide  
Indium Oxide  
Iridium  
5.76  
7.18  
22.4  
7.86  
6.17  
5.94  
6.51  
11.3  
7.5  
0.163  
0.151  
0.238  
0.53  
1.13  
0.835  
1
0.514  
0.556  
0.722  
0.775  
1.001  
Iron  
Lanthanum  
Lanthanum Fluoride  
Lanthanum Oxide  
Lead  
Lead Sulfide  
Lithium  
1
1.13  
0.566  
5.9  
0.774  
1.61  
Zinc Oxide  
Zinc Selenide  
Zinc Sulfide  
Zirconium Oxide  
0.53  
2.64  
1.74  
Lithium Fluoride  
Magnesium  
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Appendix  
B. Specifications  
Measurement  
Number of Sensors  
Frequency Range  
Frequency Accuracy  
Frequency Resolution  
Rate Accuracy  
2
4.0 MHz to 6.0 MHz  
.01% @ 2 readings/sec.  
.06 Hz @ 2 readings/sec  
.5% typical  
Rate Resolution  
.01/.1 ?/s  
Thickness Accuracy  
Thickness Resolution  
Measurement Period  
.5% typical  
1 ?  
.1 to 1 sec.  
Source  
Number of Sources  
Control Voltage  
Resolution  
2
0 to ±10V into 2k? load  
15 bits  
Digital I/O  
Digital Inputs  
Functions  
8
User Programmed (See Chapter 3)  
5VDC, non-isolated  
Input Rating  
Relay Outputs  
Functions  
Relay Rating  
8
User Programmed (See Chapter 3)  
30Vrms or 30VDC, 2A maximum  
General Specifications  
Mains Power Supply  
100-120/200-240~, ±10% nominal  
50/60 Hz  
Power Consumption  
Operating & Transportation  
Environment  
25W  
0?C to 50?C  
0 to 80% RH non-condensing  
0 to 2,000 meters  
Indoor Use Only  
Class 1 Equipment (Grounded Type)  
Suitable for Continuous Operation  
Ordinary Protection (not protected  
? against harmful ingress of moisture)  
Pollution Degree II  
Installation (Overvoltage) Category II  
? for transient overvoltages  
-40?C to 70?C  
5.23 in. x 8.4 in. x 10.0 in.  
132.8mm x 213.4m x 254.0mm  
4 pounds (1.8 kg)  
Storage Environment  
Rack Dimensions (HxWxD)  
Weight  
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Appendix  
Display  
Graphs  
Rate, Deviation, Power  
Readouts  
Thickness, Rate, Power  
Process Parameters (a Process is a sequence of layers)  
# Processes  
25  
# Films  
25  
# Layers (total all processes)  
250  
Layer Parameters (Layer is a Film, plus these values)  
Initial Rate  
Final Thickness  
Time Setpoint  
Thickness Limit  
Start Mode  
# Rate Ramps  
0.0 to 999.9 ?/sec.  
0.0 to 999.9 ?  
0 to 30000 sec.  
0.0 to 999.9 ?  
Auto/Manual  
2
Rate Ramp Start  
Rate Ramp Time  
New Rate  
0.0 to 999.9 ?  
0 to 1000 sec.  
0.0 to 999.9 ?/sec.  
Film Parameters (Film is a Material, plus these values)  
Material  
Density  
Z-Factor  
P Term  
100 stored  
0.40 to 99.99 gm/cm3  
0.100 to 9.900  
1 to 9999  
I Term  
D Term  
Sensor (1,2)  
0 to 99.9 sec.  
0 to 99.9 sec.  
On/Off  
Output  
1 or 2  
Pocket  
1 to 8  
Max Power  
Slew Rate  
Crystal Quality  
0.0 to 100.0 %  
0.0 to 100.0 %/sec.  
Disabled to 30%  
Disabled to 5000 Hz  
Halt or Timed Power  
0 to 30000 sec.  
0.0 to 100.0 %  
0 to 200 sec.  
0.0 to 30.0 %  
Ignore/Stop/Hold  
0 to 30.0 %  
Continuous/Time/Accuracy  
10.0 to 999.0 sec.  
10.0 to 999.0 sec.  
Crystal Stability  
Crystal Fail Mode  
Ramp1, Ramp2, Feed Ramp, Feed, Idle Ramp Time  
Soak1, Soak2, Feed, Idle Power  
Shutter Delay Time  
Shutter Delay Error  
Control Error  
Control Error Setting  
Rate Sampling  
Sample Time  
Hold Time  
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Appendix  
C. I/O Connections  
A 25 pin D-sub connector, located on the rear of the SQC-122c, provides Input/Output  
connections. Refer to Section 3.6 for relay and input functional assignments.  
Inputs can be activated either by connecting to a switch and shorting to Ground, or they  
can be driven by a TTL compatible signal.  
WARNING: These are not isolated inputs! The voltage level applied must be limited to  
between 0 and +5 volts with respect to Ground.  
WARNING: Output relays are rated for 30Vrms or 30VDC, at 2A maximum. Proper  
fusing, and adequate wiring insulation and separation, should be provided to assure  
these limits are not exceeded.  
The pin assignments for the rear panel mounted I/O connector are shown below:  
1
13  
25  
14  
I/O Connector Wiring  
Relay  
Pins  
14,15  
1,2  
3,4  
5,6  
Input  
Pins  
16  
17  
18  
19  
20  
21  
22  
23  
24  
Relay 1  
Relay 2  
Relay 3  
Relay 4  
Relay 5  
Relay 6  
Relay 7  
Relay 8  
Input 1  
Input 2  
Input 3  
Input 4  
Input 5  
Input 6  
Input 7  
Input 8  
Ground  
7,8  
9,10  
11,12  
13,25  
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Appendix  
A Y adapter cable can be used to provide compatibility with older (non color) models of  
the SQC-122, as shown below. Contact Sigma for information on purchasing this  
adapter, or other custom I/O cables.  
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Appendix  
D. Handheld Remote Controller  
The Handheld Controller provides the capability of adjusting output power remotely  
when the SQC-122c is in Manual Mode.  
ABORT  
Sigma  
?
instruments  
Handheld Controller  
To use the handheld controller, attach the cable from the handheld controller to the  
Remote jack on the SQC-122c front panel. Select a Process using the SQC-122c front  
panel SoftKeys. Press Next Menu until the Auto/Manual SoftKey is displayed. Press  
Auto/Manual to change to Manual power mode (SoftKey shows Manual/Auto). Press  
Start to begin the film deposition.  
You can now use either the front panel Control Knob or the Handheld Controller to  
adjust output power. Pressing Abort on the handheld controller stops the layer and  
returns output power to 0%.  
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Appendix  
E. EC Declaration of Conformity  
Manufacturer’s Name: Sigma Instruments  
Manufacturer’s Address: 1318 Duff Drive  
Fort Collins, CO 80524 USA  
declares that the product:  
Product Name:  
Deposition Rate Controller  
SQC-122c  
Product Model:  
Product Options: All Options  
conforms to the following Directives:  
73/23/EEC (93/68/EEC)  
89/336/EEC  
Low Voltage Directive  
Electromagnetic Compatibility Directive  
uses the following standards:  
EN 61010-1  
Safety of Electrical Equipment for  
Measurement, Control, and Laboratory Use  
Generic Standard for Emissions  
Radiated and Conducted Emissions (Class A)  
Generic Standard for Immunity  
Electrostatic Discharge  
Radiated RF Electro-Magnetic Field  
Electrical Fast Transient/Burst  
Conducted RF  
EN 50081-2  
EN 55011  
EN 50082-2  
EN 61000-4-2  
EN 61000-4-3  
EN 61000-4-4  
EN 61000-4-6  
ENV 50204  
Radiated RF  
and complies with the Essential Health and Safety Requirements.  
Gary L. Halcomb  
President  
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