Seagate Laptop ST4000NK0001 User Guide

Product Manual  
®
Seagate Kinetic HDD  
Standard model  
ST4000NK0001  
100764174  
Rev. A  
October 2014  
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Contents  
Seagate® Technology Support Services . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1.0  
2.0  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
1.1 About the Ethernet Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Drive Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
2.1  
2.2  
2.3  
2.4  
Formatted Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Recording and Interface Technology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Physical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
2.4.1  
2.4.2  
2.4.3  
Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Conducted Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Voltage Tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
2.5  
Environmental Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
2.5.1  
2.5.2  
2.5.3  
2.5.4  
2.5.5  
Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Altitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Vibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.6  
2.7  
2.8  
2.9  
Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Test for Prominent Discrete Tones (PDTs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Electromagnetic immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
2.9.1  
Annualized Failure Rate (AFR) and Mean Time Between Failures (MTBF) . . . 12  
2.10  
Agency Certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
2.10.1  
2.10.2  
2.10.3  
Safety certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
FCC verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
2.11  
Environmental protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
2.11.1  
2.11.2  
European Union Restriction of Hazardous Substances (RoHS) Directive. . . . . 14  
China Restriction of Hazardous Substances (RoHS) Directive . . . . . . . . . . . . . 14  
2.12  
2.13  
Corrosive Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Product Warranty. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
3.0  
Configuring and Mounting the Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
3.1  
3.2  
3.3  
Handling and Static-Discharge Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Drive Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Drive Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
4.0  
5.0  
Ethernet Enabled Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
4.1 SAS Connector Physical Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Key/Value Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
5.1  
5.2  
5.3  
5.4  
Host to Drive Data Transfer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Kinetic Protocol Data Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Kinetic Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Command Embedded Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
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Tables  
Table 1. HDD Capacity Information ........................................................................................................... 7  
Table 2. Recording and Interface Specifications ....................................................................................... 7  
Table 3. Physical Characteristics ............................................................................................................... 7  
Table 4. DC Power Requirements ............................................................................................................. 8  
Table 5. Humidity Specifications .............................................................................................................. 10  
Table 6. Altitude Specifications ................................................................................................................ 10  
Table 7. Operating Vibration Specifications ............................................................................................. 10  
Table 8. Non-Operating Vibration Specifications ..................................................................................... 10  
Table 9. Fluid Dynamic Bearing (FDB) Motor Acoustics ......................................................................... 11  
Table 10. Radio Frequency Environments ................................................................................................ 11  
Table 11. AFR and MTBF Specifications ................................................................................................... 12  
Table 12. Ethernet Enabled SAS Connector Pin Definitions ..................................................................... 20  
Table 13. Kinetic PDU Structure ................................................................................................................ 22  
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Figures  
Figure 1.  
Figure 2.  
Figure 3.  
Figure 4.  
Figure 5.  
Figure 6.  
Figure 7.  
Figure 8.  
Location of HDA Temperature Check Point 9  
HDD Mounting Dimensions 17  
SAS Device Plug Dimensions 18  
Detailed SAS Device Plug Dimensions 19  
SAS Connector Pin Locations 20  
Kinetic Software Stack 21  
Kinetic Protocol Data Unit Message Packet 22  
Command Embedded Message 23  
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®
Seagate Technology Support Services  
For information regarding online support and services, visit: http://www.seagate.com/about/contact-us/technical-support/  
Available services include:  
Presales & Technical support  
Global Support Services telephone numbers & business hours  
Authorized Service Centers  
For information regarding Warranty Support, visit: http://www.seagate.com/support/warranty-and-replacements/  
For information regarding data recovery services, visit: http://www.seagate.com/services-software/data-recovery-services/  
For Seagate OEM and Distribution partner portal, visit: http://www.seagate.com/partners/  
For Seagate reseller portal, visit: http://www.seagate.com/partners/my-spp-dashboard/  
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1.0 INTRODUCTION  
This manual describes the functional, mechanical and interface specifications for the following:  
Seagate® Kinetic HDD model drives:  
Model Number  
Seagate Instant Secure Erase (ISE)  
ST4000NK0001  
Yes  
These drives provide the following key features:  
• 5900 RPM spindle speed.  
• High instantaneous (burst) data-transfer rates (up to 60MB per second).  
• Perpendicular recording technology provides the drives with increased areal density.  
• State-of-the-art cache and on-the-fly error-correction algorithms.  
• Simple GetLog command usage to obtain logged data information stored in device.  
• Supports Ethernet enabled SAS connectors (Connector pins shown in Table 4.1.1).  
• State-free Key-Value Object Store with Remote Procedure Calls (RPC).  
• Worldwide Name (WWN) capability uniquely identifies the drive.  
• Easy communication via Kinetic Application Programming Interface libraries.  
1.1  
ABOUT THE ETHERNET INTERFACE  
The Ethernet provides advantages over traditional SATA and SAS interfaces. The primary advantagesinclude:  
• Connects storage directly into existing data center fabric  
• Allows direct TCP/IP communication from any node in the network to the storage device  
• Eliminates traditional storage server needs as protocol communication  
• Retains the standard SAS hardware interface connector to provide system builder adaptability,  
while enabling Ethernet  
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2.0 DRIVE SPECIFICATIONS  
Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal power.  
For convenience, the phrases the drive and this drive are used throughout this manual to indicate the following drive  
models:  
Seagate SED model  
ST4000NK0001  
2.1  
FORMATTED CAPACITY  
Table 1: HDD Capacity Information  
Model  
Formatted capacity*  
4TB  
GuaranteedObjects  
Bytes per Object  
ST4000NK0001  
3,906,250  
Up to 1024KB  
*One GB equals one billion bytes and 1TB equals one trillion bytes when referring to hard drive capacity. Accessible capacity may  
vary depending on operating environment and formatting.  
2.2  
RECORDING AND INTERFACE TECHNOLOGY  
Table 2: Recording and Interface Specifications  
Interface  
1-Gbps SGMII Ethernet  
Recording method  
Perpendicular  
1807  
Recording density, KBPI (Kb/in max)  
Track density, KTPI (ktracks/in avg)  
340  
2
Areal density (Gb/in avg)  
625  
Spindle speed (RPM) (± 0.2%)  
5900  
Internal data transfer rate (Mb/s max)  
Sustained data transfer rate (MiB/s)  
I/O data-transfer rate (MB/s max)  
1813  
20 to 60  
60  
2.3  
PHYSICAL CHARACTERISTICS  
Table 3: Physical Characteristics  
Weight: (maximum)  
Kinetic 4TB Model  
Cache buffer  
608g (1.34 lb)  
64MB (67,108,864B)  
512 MB (536,870,912B)  
Marvell ARMADA 370  
RAM  
Software-on-Chip  
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2.4  
POWER SPECIFICATIONS  
• The drive receives DC power (+5V or +12V) through the Ethernet enabled SAS device connector.  
• Three +12 volt pins provide power to the drive, 2 short and 1 long. The current return for the +12 volt power supply  
is through the common ground pins. The supply current and return current must be distributed as evenly as possi-  
ble among the pins.  
• Three +5 volt pins provide power to the drive, 2 short and 1 long. The current return for the +5 volt power supply is  
through the common ground pins. The supply current and return current must be distributed as evenly as possible  
among the pins.  
• Current to the drive through the long power pins may be limited by the system to reduce inrush current to the drive  
during hot plugging.  
2.4.1 Power consumption  
• Power requirements for the drives are listed in Table 2.5.1.Typical power measurements are based on an average  
of drives tested, under nominal conditions, using 5.0V and 12.0V input voltage at 25°C ambient temperature.  
• Spinup power:  
Spinup power is measured from the time of power-on to the time that the drive spindle reaches operating speed.  
• Average Current Put / Get:  
Drive operation consisted of continuous PUT / GET operations, 50/50 duty cycle.  
Table 4: DC Power Requirements  
1.0Gb Mode  
Voltage  
+5V  
±5%  
+12V  
±10%  
Regulation  
Maximum Spin-up Power  
Peak DC (Watts)  
3
5.0  
19.2  
3.60  
Average Power (Put/Get)  
Typical DC (Watts)  
3
4.25  
2.4.2 Conducted Noise  
Input noise ripple is measured at the host system power supply across an equivalent 80-ohm resistive load on the +12 volt  
line or an equivalent 15-ohm resistive load on the +5 volt line.  
Using 12-volt power, the drive is expected to operate with a maximum of 120 mV peak-to-peak square-wave injected noise  
at up to 10MHz.  
Using 5-volt power, the drive is expected to operate with a maximum of 100 mV peak-to-peak square-wave injected noise at  
up to 10MHz.  
Note  
Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write current.  
2.4.3 Voltage Tolerance  
Voltage Tolerance (including noise):  
• 5V ± 5%  
• 12V ± 10%  
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2.5  
ENVIRONMENTAL LIMITS  
Temperature and humidity values experienced by the drive must be such that condensation does not occur on any  
drive part. Altitude and atmospheric pressure specifications are referenced to a standard day at 58.7°F (14.8°C).  
Maximum wet bulb temperature is 82°F (28°C).  
The recommended storage period:  
Note  
1 year under controlled conditions of 34°C 90%RH or less  
• 90 days in uncontrolled storage conditions  
2.5.1 Ambient Temperature  
Operating  
The drive meets the operating specifications over a 41°F to 140°F (5°C to 60°C) drive case temperature range with a  
maximum temperature gradient of 36°F (20°C) per hour.  
The maximum allowable drive case temperature is 60°C. See Figure 2.5.1 for HDA case temperature measurement  
location  
The MTBF specification for the drive assumes the operating environment is designed to maintain nominal case  
temperature. The rated MTBF is based upon a sustained case temperature of 104°F (40°C). Occasional excursions in  
operating temperature between the rated MTBF temperature and the maximum drive operating case temperature may  
occur without impact to the rated MTBF. However, continual or sustained operation at case temperatures beyond the  
rated MTBF temperature will degrade the drive MTBF and reduce product reliability.  
Air flow may be required to achieve consistent nominal case temperature values. To confirm that the required cooling is  
provided for the electronics and HDA, place the drive in its final mechanical configuration, and perform random write/  
read operations. After the temperatures stabilize, measure the case temperature of the drive.  
Non-operating  
–40° to 158°F (–40° to 70°C) package ambient with a maximum gradient of 36°F (20°C) per hour. This specification  
assumes that the drive is packaged in the shipping container designed by Seagate for use with drive.  
Figure 1 Location of HDA Temperature Check Point  
Note  
Image is for reference only, may not represent actual drive  
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2.5.2 Humidity  
2.5.3 Altitude  
2.5.4 Shock  
Table 5: Humidity Specifications  
Operating  
5% to 90% non-condensing (30% per hour max)  
5% to 95% non-condensing (30% per hour max)  
Non-Operating  
Table 6: Altitude Specifications  
Operating  
–304.80 m to 3048 m (–1000 ft. to 10,000+ ft.)  
–304.80 m to 12,192 m (–1000 ft. to 40,000+ ft.)  
Non-Operating  
All shock specifications assume that the drive is mounted securely with the input shock applied at the drive mounting  
screws. Shock may be applied in the X, Y or Z axis.  
2.5.4.1 Operating Shock  
These drives comply with the performance levels specified in this document when subjected to a maximum operating  
shock of 70 Gs (read) and 40 Gs (write) based on half-sine shock pulses of 2 ms during read operations. Shocks should  
not be repeated more than two times per second.  
2.5.4.2 Non-Operating Shock  
The non-operating shock level that the drive can experience without incurring physical damage or degradation in  
performance when subsequently put into operation is 300 Gs based on a non-repetitive half-sine shock pulse of 2 ms  
duration.  
2.5.5 Vibration  
All vibration specifications assume that the drive is mounted securely with the input vibration applied at the drive mounting  
screws. Vibration may be applied in the X, Y or Z axis.  
2.5.5.1 Operating Vibration  
The maximum vibration levels that the drive may experience while meeting the performance standards specified in this  
document are specified below.  
Table 7: Operating Vibration Specifications  
5Hz to 22Hz  
0.25 Gs  
22Hz to 350Hz  
0.50 Gs  
350Hz to 500Hz  
0.25 Gs  
20Hz – 1500 Hz *(RROV)  
* Rotary Random Operating Vibration  
12.5 rads/s2 with RVFF  
All vibration specifications assume that the drive is mounted securely with the input vibration applied at the drive mounting  
screws. Vibration may be applied in the X, Y or Z axis. Throughput may vary if improperly mounted.  
2.5.5.2 Non-Operating Vibration  
The maximum non-operating vibration levels that the drive may experience without incurring physical damage or  
degradation in performance when subsequently put into operation are specified below.  
Table 8: Non-Operating Vibration Specifications  
10 Hz to 500 Hz Linear Random  
4.9 Grms ref  
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2.6  
ACOUSTICS  
Drive acoustics are measured as overall A-weighted acoustic sound power levels (no pure tones). All measurements  
are consistent with ISO document 7779. Sound power measurements are taken under essentially free-field conditions  
over a reflecting plane. For all tests, the drive is oriented with the cover facing upward.  
For seek mode tests, the drive is placed in seek mode only.  
The number of seeks per second is defined by the following equation:  
Note  
Number of seeks per second = 0.4 / (average latency + average access time)  
Table 9: Fluid Dynamic Bearing (FDB) Motor Acoustics  
Idle*  
Put / Get Seek  
4 Disks  
2.3 bels (typical)  
2.5 bels (max)  
2.8 bels (typical)  
3.0 bels (max)  
(4TB)  
*During periods of drive idle, some offline activity may occur, which may increase acoustic and power to operational levels.  
TEST FOR PROMINENT DISCRETE TONES (PDTS)  
2.7  
Seagate follows the ECMA-74 standards for measurement and identification of PDTs. An exception to this process is the  
use of the absolute threshold of hearing. Seagate uses this threshold curve (originated in ISO 389-7) to discern tone  
audibility and to compensate for the inaudible components of sound prior to computation of tone ratios according to  
Annex D of the ECMA-74 standards.  
2.8  
ELECTROMAGNETIC IMMUNITY  
When properly installed in a representative host system, the drive operates without errors or degradation in performance  
when subjected to the radio frequency (RF) environments defined in Table 2.9.1  
Table 10: Radio Frequency Environments  
Performance  
level  
Reference  
standard  
Test  
Description  
Electrostatic discharge Contact, HCP, VCP: ± 4 kV; Air: ± 8 kV  
80MHz to 1,000MHz, 3 V/m,  
B
EN61000-4-2: 95  
EN61000-4-3: 96  
ENV50204: 95  
Radiated RF immunity  
80% AM with 1kHz sine  
A
900MHz, 3 V/m, 50% pulse modulation @ 200Hz  
Electrical fast transient ± 1 kV on AC mains, ± 0.5 kV on external I/O  
Surge immunity ± 1 kV differential, ± 2 kV common, AC mains  
B
B
EN61000-4-4: 95  
EN61000-4-5: 95  
Conducted RF immunity 150kHz to 80MHz, 3 Vrms, 80% AM with 1kHz sine  
0% open, 5 seconds  
A
EN61000-4-6: 97  
EN61000-4-11: 94  
C
C
C
B
0% short, 5 seconds  
Voltage dips, interrupts  
40%, 0.10 seconds  
70%, 0.01 seconds  
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2.9  
RELIABILITY  
2.9.1 Annualized Failure Rate (AFR) and Mean Time Between Failures (MTBF)  
The product shall achieve an Annualized Failure Rate (AFR) of 1.1% (MTBF of 800 thousand hours) when operated  
a nominal power and typical case temperatures of 40°C. Operation at temperatures outside the specifications in Section  
2.8 may increase the product AFR (decrease MTBF). AFR and MTBF are population statistics that are not relevant to  
individual units.  
AFR and MTBF specifications are based on the following assumptions for business critical storage system environments:  
• 8760 power-on-hours per year.  
• Operations at nominal voltages.  
Temperatures outside the specifications in Section 2.8 may reduce the product reliability.  
• A workload rate below the average annualized specified limits. Operation at excessive I/O duty cycle may degrade  
product reliability.  
• The enterprise application environment of power-on-hours, temperature, and I/O duty cycle effects the product  
AFR and MTBF.  
Table 11: AFR and MTBF Specifications  
Nonrecoverable read errors  
Annualized Failure Rate  
Load unload cycles  
14  
1 per 10 bits read, max  
1.1% (nominal power, 40°C case temperature)  
300,000 cycles  
Average rate of <180TB/year  
The MTBF specification for the drive assumes the I/O workload does not exceed the  
Average Annualized Workload Rate Limit of <180TB/year. Workloads exceeding the  
annualized rate may degrade the drive MTBF and impact product reliability. The Average  
Annualized Workload Rate Limit is in units of TB per year, or TB per 8760 power on hours.  
Workload Rate = TB transferred x (8760 / recorded power on hours).  
Rated Workload  
To determine the warranty for a specific drive, use a web browser to access the following  
Warranty  
From this page, click on the “Check to see if the drive is under Warranty” link. The following  
are required to be provided: the drive serial number, model number (or part number) and  
country of purchase.The system will display the warranty information for the drive.  
Preventivemaintenance  
None required.  
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2.10 AGENCY CERTIFICATION  
2.10.1 Safety certification  
These products are certified to meet the requirements of UL60950-1, CSA60950-1 and EN60950 and so marked as to  
the certify agency.  
2.10.2 Electromagnetic compatibility  
The Seagate Kinetic HDD hard drives are tested to a Class A standard per the CISPR 22 specification. Per the CISPR 22  
specification “Class A ITE is a category of all other ITE which satisfies the class A ITE limits but not the class B ITE limits.  
Warning – This is a class A product. In a domestic environment this product may cause radio interference in which case  
the user may be required to take adequate measures.”  
Drives are tested in representative end-user systems. Although CE-marked Seagate drives comply with the directives  
when used in the test systems, we cannot guarantee that all systems will comply with the directives. The drive is  
designed for operation inside a properly designed enclosure, with properly shielded I/O cable (if necessary) and  
terminators on all unused IO ports. Computer manufacturers and system integrators should confirm EMC compliance and  
provide CE marking for their products.  
Korean RRL  
If these drives have the Korean Communications Commission (KCC) logo, they comply with paragraph 1 of Article 11 of  
the Electromagnetic Compatibility control Regulation and meet the Electromagnetic Compatibility (EMC)  
Framework requirements of the Radio Research Laboratory (RRL) Communications Commission, Republic of Korea.  
These drives have been tested and comply with the Electromagnetic Interference/Electromagnetic Susceptibility (EMI/  
EMS) for Class A products. Drives are tested in a representative, end-user system by a Korean-recognized lab.  
Australian Regulatory Compliance Mark (RCM)  
If these models have the RCM marking, they comply with the Australia/New Zealand Standard AS/NZ CISPR22 and meet  
the Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communications and Media  
Authority (ACMA).  
2.10.3 FCC verification  
These drives are intended to be contained solely within an enclosure (not attached as an external device). As such, each  
drive is considered to be a subassembly even when it is individually marketed to the customer. As a subassembly, no  
Federal Communications Commission verification or certification of the device is required.  
Seagate has tested this device in enclosures as described above to ensure that the total assembly (enclosure, disk  
drive motherboard, power supply, etc.) does comply with the limits for a Class A ITE device.  
Radio and television interference. This equipment generates and uses radio frequency energy and if not installed and  
used in strict accordance with the manufacturer’s instructions, may cause interference to radio and television reception.  
This equipment is designed to provide reasonable protection against such interference in a residential installation.  
However there is no guarantee that interference will not occur in a particular installation. If this equipment does cause  
interference to radio or television, which can be determined by turning the equipment on and off, users are encouraged to  
try one or more of the followingcorrective measures:  
• Reorient the receiving antenna.  
• Move the device to one side or the other of the radio or TV.  
• Move the device farther away from the radio or TV.  
• Plug the computer into a different outlet so that the receiver and computer are on different branch outlets.  
If necessary, users should consult the dealer or an experienced radio/television technician for additional suggestions.  
Users may find helpful the following booklet prepared by the Federal Communications Commission: How to Identify and  
Resolve Radio-Television Interference Problems. This booklet is available from the Superintendent of Documents, U.S.  
Government Printing Office, Washington, DC 20402. Refer to publication number 004-000-00345-4.  
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2.11 ENVIRONMENTAL PROTECTION  
Seagate designs its products to meet environmental protection requirements worldwide, including regulations restricting  
certain chemical substances.  
2.11.1 European Union Restriction of Hazardous Substances (RoHS) Directive  
The European Union Restriction of Hazardous Substances (RoHS) Directive, restricts the presence of chemical  
substances including Lead, Cadmium, Mercury, Hexavalent Chromium, PBB and PBDE, in electronic products, effective  
July 2006. This drive is manufactured with components and materials that comply with the RoHS Directive.  
2.11.2 China Restriction of Hazardous Substances (RoHS) Directive  
This product has an Environmental Protection Use Period (EPUP) of 20 years. The following table  
contains information mandated by China's "Marking Requirements for Control of Pollution Caused  
by Electronic InformationProducts" Standard.  
"O" indicates the hazardous and toxic substance content of the part (at the homogeneous material level) is lower than  
the threshold defined by the China RoHS MCV Standard.  
"X" indicates the hazardous and toxic substance content of the part (at the homogeneous material level) is over the  
threshold defined by the China RoHS MCV Standard.  
2.12 CORROSIVE ENVIRONMENT  
Seagate electronic drive components pass accelerated corrosion testing equivalent to 10 years exposure to light  
industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM B845.  
However, this accelerated testing cannot duplicate every potential application environment. Users should use caution  
exposing any electronic components to uncontrolled chemical pollutants and corrosive chemicals, as the installation  
environment can affect electronic drive component reliability. The silver, copper, nickel and gold films used in Seagate  
products are especially sensitive to the presence of sulfide, chloride, and nitrate contaminants. Sulfur is found to be the  
most damaging. In addition electronic components should never be exposed to condensing water on the surface of the  
printed circuit board assembly (PCBA) or exposed to an ambient relative humidity greater than 95%. Materials used in  
cabinet fabrication, such as vulcanized rubber, that can outgas corrosive compounds should be minimized or eliminated.  
Replacing materials near circuitry with sulfide-free alternatives may extend the useful life of any electronic equipment.  
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2.13 PRODUCT WARRANTY  
Beginning on the date of shipment to the customer and continuing for the period specified in the purchase contract,  
Seagate warrants that each product (including components and subassemblies) that fails to function properly under  
normal use due to defect in materials or workmanship or due to nonconformance to the applicable specifications will be  
repaired or replaced, a Seagate’s option and at no charge to the customer, if returned by customer at customer’s  
expense to Seagate’s designated facility in accordance with Seagate’s warranty procedure. Seagate will pay for  
transporting the repair or replacement item to the customer. For more detailed warranty information, refer to the  
standard terms and conditions of purchase for Seagate products on the purchase documentation.  
The remaining warranty for a particular drive can be determined by calling Seagate Customer Service at 1-800-468-3472.  
Users can also determine remaining warranty using the Seagate web site (www.seagate.com). The drive serial number is  
required to determine remaining warranty information.  
Shipping  
When transporting or shipping a drive, use only a Seagate-approved container. Keep the original box. Seagate  
approved containers are easily identified by the Seagate Approved Package label. Shipping a drive in a non-approved  
container voids the drivewarranty.  
Seagate repair centers may refuse receipt of components improperly packaged or obviously damaged in transit. Contact  
the authorized Seagate distributor to purchase additional boxes. Seagate recommends shipping by an air-ride carrier  
experienced in handling computer equipment.  
Storage  
The maximum recommended storage period for the drive in a non-operational environment is 90 days. Drives should be  
stored in the original unopened Seagate shipping packaging whenever possible. Once the drive is removed from the  
Seagate original packaging the recommended maximum period between drive operation cycles is 30 days. During any  
storage period the drive non-operational temperature, humidity, wet bulb, atmospheric conditions, shock, vibration,  
magnetic and electrical field specifications should be followed.  
Product Repair and Return Information  
Seagate customer service centers are the only facilities authorized to service Seagate drives. Seagate does not sanction  
any third-party repair facilities. Any unauthorized repair or tampering with the factory seal voids the warranty.  
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3.0 CONFIGURING AND MOUNTING THE DRIVE  
This section contains the specifications and instructions for configuring and mounting the drive.  
3.1  
HANDLING AND STATIC-DISCHARGE PRECAUTIONS  
After unpacking, and before installation, the drive may be exposed to potential handling and electrostatic discharge (ESD)  
hazards. Observe the following standard handling and static-discharge precautions:  
Before handling the drive, put on a grounded wrist strap. Wear a grounded wrist strap throughout  
the entire installation procedure.  
Handle the drive by its edges or frame only.  
The drive is extremely fragile—handle it with care. Do not press down on the drive top cover.  
Always rest the drive on a padded, antistatic surface until users mount it in the computer.  
Do not touch the connector pins or the printed circuit board.  
Caution  
• Do not remove the factory-installed labels from the drive or cover them with additional labels.  
Removal voids the warranty. Some factory-installed labels contain information needed to service  
the drive. Other labels are used to seal out dirt and contamination.  
3.2  
DRIVE MOUNTING  
Users can mount the drive in any orientation using four screws in the side-mounting holes or four screws in the  
bottom- mounting holes. Refer to Figure 3.2.1 for drive mounting dimensions. Follow these important mounting  
precautions when mounting the drive:  
• Allow a minimum clearance of 0.030 inches (0.76mm) around the entire perimeter of the drive for cooling.  
• Use only 6-32 UNC mounting screws.  
• The screws should be inserted no more than 0.150 inches (3.81mm) into the bottom or side mounting holes.  
• Do not over tighten the mounting screws (maximum torque: 6 inch-lb).  
Weight:  
608g (1.34 lb)  
These dimensions conform to the Small Form Factor Standard documented in  
SFF-8301 and SFF-8323 found at www.sffcommittee.org  
Note  
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Figure 2 HDD Mounting Dimensions  
Note  
PCBA may not be representative of the actual PCBA on drive.  
3.3  
DRIVE CONFIGURATIONS  
When the Kinetic drives are connected to the local network with DHCP server, IP addresses will be self-assigned to each  
of the ports. Obtaining drive information, performing drive firmware updates, and other tools for drive configurations are  
provided in the Kinetic Python tools Github Repository: https://github.com/Seagate/kinetic-py-tools.  
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4.0 ETHERNET ENABLED INTERFACE  
The Ethernet interface uses the standard SAS connector interface with repurposing of the pin outs. This section partially  
describes the interface requirements as implemented on Kinetic drives. The connector is defined by and conforms to the  
dimensions and specifications of SFF-8482 Rev 2.3.  
4.1  
SAS CONNECTOR PHYSICAL INTERFACE  
Figures 4.1.1 and 4.1.2 provide the dimensions of the SAS connector. Details of the physical, electrical, and logical  
characteristics are provided within this section.  
Figure 3 SAS Device Plug Dimensions  
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Figure 4 Detailed SAS Device Plug Dimensions  
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Figure 4.1.3 shows the pin locations for the SAS connector pin and Table 4.1.1 represents the Ethernet Enabled SAS  
Connector Pin Definitions for the Seagate Kinetic HDD.  
Figure 5 SAS Connector Pin Locations  
Table 12: Ethernet Enabled SAS Connector Pin Definitions  
Segment  
Pin  
S1  
Function  
GROUND  
RX0+  
Comments  
S2  
Ethernet port 0  
Ethernet port 0  
S3  
RX0-  
S4  
GROUND  
TX0-  
S5  
Ethernet port 0  
Ethernet port 0  
S6  
TX0+  
S7  
GROUND  
GROUND  
RX1+  
Signal  
S8  
S9  
Ethernet port 1  
Ethernet port 1  
S10  
S11  
S12  
S13  
S14  
P1  
RX1-  
GROUND  
TX1-  
Ethernet port 1  
Ethernet port 1  
TX1+  
GROUND  
RESERVED  
I2C CLOCK  
I2C DATA  
GROUND  
GROUND  
GROUND  
+5V PRECHARGE  
+5V  
Reserved for internal use. Do not connect. 3.3V tolerant.  
P2  
3.3V tolerant  
3.3V tolerant  
P3  
P4  
P5  
P6  
P7  
Power  
P8  
P9  
+5V  
P10  
P11  
P12  
P13  
P14  
P15  
GROUND  
RESERVED  
GROUND  
+12V PRECHARGE  
+12V  
Reserved for internal use. Do not connect.  
+12V  
Notes  
• All pins are in a single row, with a 1.27 mm (0.050”) pitch.  
• There are three power pins for each voltage.  
One pin from each voltage is used for pre-charge when installed in a blind-mate backplane configuration.  
• All used voltage pins must be terminated.  
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5.0 KEY/VALUE PROTOCOL  
The protocol provides communication from the client applications to the Kinetic drive. The architecture for Kinetic storage  
is shown in Figure 5.1.  
Figure 6 Kinetic Software Stack  
This section explains the Kinetic Protocol Data Unit. For more information about the Kinetic Protocol, please visit:  
5.1  
HOST TO DRIVE DATA TRANSFER  
Host to drive data transfer is accomplished using three basic commands:  
put – Add the specified key/value object to the store  
get – Retrieve the key/value object associated with the specified key  
delete – Delete the key/value object that is associated with the specified key.  
In addition to the basic commands, other key/value object operations are also supported:  
getNext – Gets the key/value object associated with the key that follows the specified key based on the  
lexicographical ordering of keys  
getPrevious – Gets the key/value object associated with the key that precedes the specified key based on the  
lexicographical ordering of keys  
getKeyRange – Get a list of keys in lexicographical order based on the specified key range  
getMetadata – Get metadata for the specified key  
Host applications communicate with the Kinetic drives by sending Kinetic Protocol Data Units over a network using TCP.  
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5.2  
KINETIC PROTOCOL DATA UNIT  
A Kinetic PDU is composed of five fields  
1. PDU version  
2. Kinetic Message length  
3. value length  
4. Kinetic Message  
5. Value  
Some PDUs have a null value. It is important to note that the value is not encoded in the Kinetic Message; it is a separate  
field of the Kinetic PDU.  
Specifically, a Kinetic PDU structure is shown in Table 5.2.1.  
Table 13: Kinetic PDU Structure  
Starting Offset  
Type  
Length  
Description  
PDU version:  
0
Byte  
1 Byte  
currently hex 46, denoting the beginning of the message.  
The number of bytes in the Kinetic Message field.  
The maximum length for a Kinetic Message is 1 MiB  
(2^20 bytes).  
4-byte Big  
Endian Integer  
1
4 Bytes  
4-byte Big  
Endian Integer  
The number of bytes in the value field.  
The maximum length for a value is 1 MiB (2^20 bytes).  
5
9
4 Bytes  
<= 1 MiB  
<= 1 MiB  
Bytes  
Bytes  
The Kinetic Message.  
The value.  
9 + length of  
Kinetic Message  
Figure 5.2.1 shows a visual of how the Kinetic PDU is structured.  
Figure 7 Kinetic Protocol Data Unit Message Packet  
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5.3  
KINETIC MESSAGE  
The syntax and encoding of Kinetic Message is defined using Google Protocol Buffers and is specified by the file  
kinetic.proto. The top-level message, Message, contains three embedded messages:  
1. Messagetype  
2. hmacAuth  
3. command  
5.4  
COMMAND EMBEDDED MESSAGE  
Command is transported as bytes for ease of calculating the HMAC.  
The command bytes are interpreted by casting them as embedded message, Command, containing three embedded  
messages:  
1. Header – Contains metadata about type of message command, such as PUT, GET, and DELETE operations.  
2. Body – Contains operation-specific information, such as key range information used for the GETKEYRANGE  
operations.  
3. Status – Contains information about whether an associated operation succeeded or failed.  
This is shown graphically in Figure 5.4.1.  
Figure 8 Command Embedded Message  
As shown in Figure 5.4.1, the Header, Body, and Status messages are all members of the Command message.  
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Seagate Technology LLC  
AMERICAS Seagate Technology LLC 10200 South De Anza Boulevard, Cupertino, California 95014, United States, 408-658-1000  
ASIA/PACIFIC Seagate Singapore International Headquarters Pte. Ltd. 7000 Ang Mo Kio Avenue 5, Singapore 569877, 65-6485-3888  
EUROPE, MIDDLE EAST AND AFRICA Seagate Technology SAS 16-18 rue du Dôme, 92100 Boulogne-Billancourt, France, 33 1-4186 10 00  
Publication Number: 100764174, Rev. A  
October 2014  
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