Product Manual
®
Seagate Kinetic HDD
Standard model
ST4000NK0001
100764174
Rev. A
October 2014
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Contents
Seagate® Technology Support Services . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.0
2.0
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 About the Ethernet Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Drive Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
2.2
2.3
2.4
Formatted Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Recording and Interface Technology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Physical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4.1
2.4.2
2.4.3
Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Conducted Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Voltage Tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5
Environmental Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.5.1
2.5.2
2.5.3
2.5.4
2.5.5
Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Altitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Vibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.6
2.7
2.8
2.9
Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Test for Prominent Discrete Tones (PDTs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electromagnetic immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.9.1
Annualized Failure Rate (AFR) and Mean Time Between Failures (MTBF) . . . 12
2.10
Agency Certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.10.1
2.10.2
2.10.3
Safety certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
FCC verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.11
Environmental protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.11.1
2.11.2
European Union Restriction of Hazardous Substances (RoHS) Directive. . . . . 14
China Restriction of Hazardous Substances (RoHS) Directive . . . . . . . . . . . . . 14
2.12
2.13
Corrosive Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Product Warranty. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.0
Configuring and Mounting the Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1
3.2
3.3
Handling and Static-Discharge Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Drive Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Drive Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.0
5.0
Ethernet Enabled Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.1 SAS Connector Physical Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Key/Value Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.1
5.2
5.3
5.4
Host to Drive Data Transfer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Kinetic Protocol Data Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Kinetic Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Command Embedded Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
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Tables
Table 1. HDD Capacity Information ........................................................................................................... 7
Table 2. Recording and Interface Specifications ....................................................................................... 7
Table 3. Physical Characteristics ............................................................................................................... 7
Table 4. DC Power Requirements ............................................................................................................. 8
Table 5. Humidity Specifications .............................................................................................................. 10
Table 6. Altitude Specifications ................................................................................................................ 10
Table 7. Operating Vibration Specifications ............................................................................................. 10
Table 8. Non-Operating Vibration Specifications ..................................................................................... 10
Table 9. Fluid Dynamic Bearing (FDB) Motor Acoustics ......................................................................... 11
Table 10. Radio Frequency Environments ................................................................................................ 11
Table 11. AFR and MTBF Specifications ................................................................................................... 12
Table 12. Ethernet Enabled SAS Connector Pin Definitions ..................................................................... 20
Table 13. Kinetic PDU Structure ................................................................................................................ 22
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Figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Location of HDA Temperature Check Point 9
HDD Mounting Dimensions 17
SAS Device Plug Dimensions 18
Detailed SAS Device Plug Dimensions 19
SAS Connector Pin Locations 20
Kinetic Software Stack 21
Kinetic Protocol Data Unit Message Packet 22
Command Embedded Message 23
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®
Seagate Technology Support Services
For information regarding online support and services, visit: http://www.seagate.com/about/contact-us/technical-support/
Available services include:
•
•
•
Presales & Technical support
Global Support Services telephone numbers & business hours
Authorized Service Centers
For information regarding Warranty Support, visit: http://www.seagate.com/support/warranty-and-replacements/
For information regarding data recovery services, visit: http://www.seagate.com/services-software/data-recovery-services/
For Seagate OEM and Distribution partner portal, visit: http://www.seagate.com/partners/
For Seagate reseller portal, visit: http://www.seagate.com/partners/my-spp-dashboard/
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1.0 INTRODUCTION
This manual describes the functional, mechanical and interface specifications for the following:
Seagate® Kinetic HDD model drives:
Model Number
Seagate Instant Secure Erase (ISE)
ST4000NK0001
Yes
These drives provide the following key features:
• 5900 RPM spindle speed.
• High instantaneous (burst) data-transfer rates (up to 60MB per second).
• Perpendicular recording technology provides the drives with increased areal density.
• State-of-the-art cache and on-the-fly error-correction algorithms.
• Simple GetLog command usage to obtain logged data information stored in device.
• Supports Ethernet enabled SAS connectors (Connector pins shown in Table 4.1.1).
• State-free Key-Value Object Store with Remote Procedure Calls (RPC).
• Worldwide Name (WWN) capability uniquely identifies the drive.
• Easy communication via Kinetic Application Programming Interface libraries.
1.1
ABOUT THE ETHERNET INTERFACE
The Ethernet provides advantages over traditional SATA and SAS interfaces. The primary advantagesinclude:
• Connects storage directly into existing data center fabric
• Allows direct TCP/IP communication from any node in the network to the storage device
• Eliminates traditional storage server needs as protocol communication
• Retains the standard SAS hardware interface connector to provide system builder adaptability,
while enabling Ethernet
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2.0 DRIVE SPECIFICATIONS
Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal power.
For convenience, the phrases the drive and this drive are used throughout this manual to indicate the following drive
models:
Seagate SED model
ST4000NK0001
2.1
FORMATTED CAPACITY
Table 1: HDD Capacity Information
Model
Formatted capacity*
4TB
GuaranteedObjects
Bytes per Object
ST4000NK0001
3,906,250
Up to 1024KB
*One GB equals one billion bytes and 1TB equals one trillion bytes when referring to hard drive capacity. Accessible capacity may
vary depending on operating environment and formatting.
2.2
RECORDING AND INTERFACE TECHNOLOGY
Table 2: Recording and Interface Specifications
Interface
1-Gbps SGMII Ethernet
Recording method
Perpendicular
1807
Recording density, KBPI (Kb/in max)
Track density, KTPI (ktracks/in avg)
340
2
Areal density (Gb/in avg)
625
Spindle speed (RPM) (± 0.2%)
5900
Internal data transfer rate (Mb/s max)
Sustained data transfer rate (MiB/s)
I/O data-transfer rate (MB/s max)
1813
20 to 60
60
2.3
PHYSICAL CHARACTERISTICS
Table 3: Physical Characteristics
Weight: (maximum)
Kinetic 4TB Model
Cache buffer
608g (1.34 lb)
64MB (67,108,864B)
512 MB (536,870,912B)
Marvell ARMADA 370
RAM
Software-on-Chip
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2.4
POWER SPECIFICATIONS
• The drive receives DC power (+5V or +12V) through the Ethernet enabled SAS device connector.
• Three +12 volt pins provide power to the drive, 2 short and 1 long. The current return for the +12 volt power supply
is through the common ground pins. The supply current and return current must be distributed as evenly as possi-
ble among the pins.
• Three +5 volt pins provide power to the drive, 2 short and 1 long. The current return for the +5 volt power supply is
through the common ground pins. The supply current and return current must be distributed as evenly as possible
among the pins.
• Current to the drive through the long power pins may be limited by the system to reduce inrush current to the drive
during hot plugging.
2.4.1 Power consumption
• Power requirements for the drives are listed in Table 2.5.1.Typical power measurements are based on an average
of drives tested, under nominal conditions, using 5.0V and 12.0V input voltage at 25°C ambient temperature.
• Spinup power:
Spinup power is measured from the time of power-on to the time that the drive spindle reaches operating speed.
• Average Current Put / Get:
Drive operation consisted of continuous PUT / GET operations, 50/50 duty cycle.
Table 4: DC Power Requirements
1.0Gb Mode
Voltage
+5V
±5%
+12V
±10%
Regulation
Maximum Spin-up Power
Peak DC (Watts)
3
ꢀ
5.0
19.2
3.60
Average Power (Put/Get)
Typical DC (Watts)
3
ꢀ
4.25
2.4.2 Conducted Noise
Input noise ripple is measured at the host system power supply across an equivalent 80-ohm resistive load on the +12 volt
line or an equivalent 15-ohm resistive load on the +5 volt line.
Using 12-volt power, the drive is expected to operate with a maximum of 120 mV peak-to-peak square-wave injected noise
at up to 10MHz.
Using 5-volt power, the drive is expected to operate with a maximum of 100 mV peak-to-peak square-wave injected noise at
up to 10MHz.
Note
Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write current.
2.4.3 Voltage Tolerance
Voltage Tolerance (including noise):
• 5V ± 5%
• 12V ± 10%
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2.5
ENVIRONMENTAL LIMITS
Temperature and humidity values experienced by the drive must be such that condensation does not occur on any
drive part. Altitude and atmospheric pressure specifications are referenced to a standard day at 58.7°F (14.8°C).
Maximum wet bulb temperature is 82°F (28°C).
The recommended storage period:
Note
•
1 year under controlled conditions of 34°C 90%RH or less
• 90 days in uncontrolled storage conditions
2.5.1 Ambient Temperature
Operating
The drive meets the operating specifications over a 41°F to 140°F (5°C to 60°C) drive case temperature range with a
maximum temperature gradient of 36°F (20°C) per hour.
The maximum allowable drive case temperature is 60°C. See Figure 2.5.1 for HDA case temperature measurement
location
The MTBF specification for the drive assumes the operating environment is designed to maintain nominal case
temperature. The rated MTBF is based upon a sustained case temperature of 104°F (40°C). Occasional excursions in
operating temperature between the rated MTBF temperature and the maximum drive operating case temperature may
occur without impact to the rated MTBF. However, continual or sustained operation at case temperatures beyond the
rated MTBF temperature will degrade the drive MTBF and reduce product reliability.
Air flow may be required to achieve consistent nominal case temperature values. To confirm that the required cooling is
provided for the electronics and HDA, place the drive in its final mechanical configuration, and perform random write/
read operations. After the temperatures stabilize, measure the case temperature of the drive.
Non-operating
–40° to 158°F (–40° to 70°C) package ambient with a maximum gradient of 36°F (20°C) per hour. This specification
assumes that the drive is packaged in the shipping container designed by Seagate for use with drive.
Figure 1 Location of HDA Temperature Check Point
Note
Image is for reference only, may not represent actual drive
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2.5.2 Humidity
2.5.3 Altitude
2.5.4 Shock
Table 5: Humidity Specifications
Operating
5% to 90% non-condensing (30% per hour max)
5% to 95% non-condensing (30% per hour max)
Non-Operating
Table 6: Altitude Specifications
Operating
–304.80 m to 3048 m (–1000 ft. to 10,000+ ft.)
–304.80 m to 12,192 m (–1000 ft. to 40,000+ ft.)
Non-Operating
All shock specifications assume that the drive is mounted securely with the input shock applied at the drive mounting
screws. Shock may be applied in the X, Y or Z axis.
2.5.4.1 Operating Shock
These drives comply with the performance levels specified in this document when subjected to a maximum operating
shock of 70 Gs (read) and 40 Gs (write) based on half-sine shock pulses of 2 ms during read operations. Shocks should
not be repeated more than two times per second.
2.5.4.2 Non-Operating Shock
The non-operating shock level that the drive can experience without incurring physical damage or degradation in
performance when subsequently put into operation is 300 Gs based on a non-repetitive half-sine shock pulse of 2 ms
duration.
2.5.5 Vibration
All vibration specifications assume that the drive is mounted securely with the input vibration applied at the drive mounting
screws. Vibration may be applied in the X, Y or Z axis.
2.5.5.1 Operating Vibration
The maximum vibration levels that the drive may experience while meeting the performance standards specified in this
document are specified below.
Table 7: Operating Vibration Specifications
5Hz to 22Hz
0.25 Gs
22Hz to 350Hz
0.50 Gs
350Hz to 500Hz
0.25 Gs
20Hz – 1500 Hz *(RROV)
* Rotary Random Operating Vibration
12.5 rads/s2 with RVFF
All vibration specifications assume that the drive is mounted securely with the input vibration applied at the drive mounting
screws. Vibration may be applied in the X, Y or Z axis. Throughput may vary if improperly mounted.
2.5.5.2 Non-Operating Vibration
The maximum non-operating vibration levels that the drive may experience without incurring physical damage or
degradation in performance when subsequently put into operation are specified below.
Table 8: Non-Operating Vibration Specifications
10 Hz to 500 Hz Linear Random
4.9 Grms ref
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2.6
ACOUSTICS
Drive acoustics are measured as overall A-weighted acoustic sound power levels (no pure tones). All measurements
are consistent with ISO document 7779. Sound power measurements are taken under essentially free-field conditions
over a reflecting plane. For all tests, the drive is oriented with the cover facing upward.
For seek mode tests, the drive is placed in seek mode only.
The number of seeks per second is defined by the following equation:
Note
Number of seeks per second = 0.4 / (average latency + average access time)
Table 9: Fluid Dynamic Bearing (FDB) Motor Acoustics
Idle*
Put / Get Seek
4 Disks
2.3 bels (typical)
2.5 bels (max)
2.8 bels (typical)
3.0 bels (max)
(4TB)
*During periods of drive idle, some offline activity may occur, which may increase acoustic and power to operational levels.
TEST FOR PROMINENT DISCRETE TONES (PDTS)
2.7
Seagate follows the ECMA-74 standards for measurement and identification of PDTs. An exception to this process is the
use of the absolute threshold of hearing. Seagate uses this threshold curve (originated in ISO 389-7) to discern tone
audibility and to compensate for the inaudible components of sound prior to computation of tone ratios according to
Annex D of the ECMA-74 standards.
2.8
ELECTROMAGNETIC IMMUNITY
When properly installed in a representative host system, the drive operates without errors or degradation in performance
when subjected to the radio frequency (RF) environments defined in Table 2.9.1
Table 10: Radio Frequency Environments
Performance
level
Reference
standard
Test
Description
Electrostatic discharge Contact, HCP, VCP: ± 4 kV; Air: ± 8 kV
80MHz to 1,000MHz, 3 V/m,
B
EN61000-4-2: 95
EN61000-4-3: 96
ENV50204: 95
Radiated RF immunity
80% AM with 1kHz sine
A
900MHz, 3 V/m, 50% pulse modulation @ 200Hz
Electrical fast transient ± 1 kV on AC mains, ± 0.5 kV on external I/O
Surge immunity ± 1 kV differential, ± 2 kV common, AC mains
B
B
EN61000-4-4: 95
EN61000-4-5: 95
Conducted RF immunity 150kHz to 80MHz, 3 Vrms, 80% AM with 1kHz sine
0% open, 5 seconds
A
EN61000-4-6: 97
EN61000-4-11: 94
C
C
C
B
0% short, 5 seconds
Voltage dips, interrupts
40%, 0.10 seconds
70%, 0.01 seconds
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2.9
RELIABILITY
2.9.1 Annualized Failure Rate (AFR) and Mean Time Between Failures (MTBF)
The product shall achieve an Annualized Failure Rate (AFR) of 1.1% (MTBF of 800 thousand hours) when operated
a nominal power and typical case temperatures of 40°C. Operation at temperatures outside the specifications in Section
2.8 may increase the product AFR (decrease MTBF). AFR and MTBF are population statistics that are not relevant to
individual units.
AFR and MTBF specifications are based on the following assumptions for business critical storage system environments:
• 8760 power-on-hours per year.
• Operations at nominal voltages.
• Temperatures outside the specifications in Section 2.8 may reduce the product reliability.
• A workload rate below the average annualized specified limits. Operation at excessive I/O duty cycle may degrade
product reliability.
• The enterprise application environment of power-on-hours, temperature, and I/O duty cycle effects the product
AFR and MTBF.
Table 11: AFR and MTBF Specifications
Nonrecoverable read errors
Annualized Failure Rate
Load unload cycles
14
1 per 10 bits read, max
1.1% (nominal power, 40°C case temperature)
300,000 cycles
Average rate of <180TB/year
The MTBF specification for the drive assumes the I/O workload does not exceed the
Average Annualized Workload Rate Limit of <180TB/year. Workloads exceeding the
annualized rate may degrade the drive MTBF and impact product reliability. The Average
Annualized Workload Rate Limit is in units of TB per year, or TB per 8760 power on hours.
Workload Rate = TB transferred x (8760 / recorded power on hours).
Rated Workload
To determine the warranty for a specific drive, use a web browser to access the following
Warranty
From this page, click on the “Check to see if the drive is under Warranty” link. The following
are required to be provided: the drive serial number, model number (or part number) and
country of purchase.The system will display the warranty information for the drive.
Preventivemaintenance
None required.
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2.10 AGENCY CERTIFICATION
2.10.1 Safety certification
These products are certified to meet the requirements of UL60950-1, CSA60950-1 and EN60950 and so marked as to
the certify agency.
2.10.2 Electromagnetic compatibility
The Seagate Kinetic HDD hard drives are tested to a Class A standard per the CISPR 22 specification. Per the CISPR 22
specification “Class A ITE is a category of all other ITE which satisfies the class A ITE limits but not the class B ITE limits.
Warning – This is a class A product. In a domestic environment this product may cause radio interference in which case
the user may be required to take adequate measures.”
Drives are tested in representative end-user systems. Although CE-marked Seagate drives comply with the directives
when used in the test systems, we cannot guarantee that all systems will comply with the directives. The drive is
designed for operation inside a properly designed enclosure, with properly shielded I/O cable (if necessary) and
terminators on all unused IO ports. Computer manufacturers and system integrators should confirm EMC compliance and
provide CE marking for their products.
Korean RRL
If these drives have the Korean Communications Commission (KCC) logo, they comply with paragraph 1 of Article 11 of
the Electromagnetic Compatibility control Regulation and meet the Electromagnetic Compatibility (EMC)
Framework requirements of the Radio Research Laboratory (RRL) Communications Commission, Republic of Korea.
These drives have been tested and comply with the Electromagnetic Interference/Electromagnetic Susceptibility (EMI/
EMS) for Class A products. Drives are tested in a representative, end-user system by a Korean-recognized lab.
Australian Regulatory Compliance Mark (RCM)
If these models have the RCM marking, they comply with the Australia/New Zealand Standard AS/NZ CISPR22 and meet
the Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communications and Media
Authority (ACMA).
2.10.3 FCC verification
These drives are intended to be contained solely within an enclosure (not attached as an external device). As such, each
drive is considered to be a subassembly even when it is individually marketed to the customer. As a subassembly, no
Federal Communications Commission verification or certification of the device is required.
Seagate has tested this device in enclosures as described above to ensure that the total assembly (enclosure, disk
drive motherboard, power supply, etc.) does comply with the limits for a Class A ITE device.
Radio and television interference. This equipment generates and uses radio frequency energy and if not installed and
used in strict accordance with the manufacturer’s instructions, may cause interference to radio and television reception.
This equipment is designed to provide reasonable protection against such interference in a residential installation.
However there is no guarantee that interference will not occur in a particular installation. If this equipment does cause
interference to radio or television, which can be determined by turning the equipment on and off, users are encouraged to
try one or more of the followingcorrective measures:
• Reorient the receiving antenna.
• Move the device to one side or the other of the radio or TV.
• Move the device farther away from the radio or TV.
• Plug the computer into a different outlet so that the receiver and computer are on different branch outlets.
If necessary, users should consult the dealer or an experienced radio/television technician for additional suggestions.
Users may find helpful the following booklet prepared by the Federal Communications Commission: How to Identify and
Resolve Radio-Television Interference Problems. This booklet is available from the Superintendent of Documents, U.S.
Government Printing Office, Washington, DC 20402. Refer to publication number 004-000-00345-4.
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2.11 ENVIRONMENTAL PROTECTION
Seagate designs its products to meet environmental protection requirements worldwide, including regulations restricting
certain chemical substances.
2.11.1 European Union Restriction of Hazardous Substances (RoHS) Directive
The European Union Restriction of Hazardous Substances (RoHS) Directive, restricts the presence of chemical
substances including Lead, Cadmium, Mercury, Hexavalent Chromium, PBB and PBDE, in electronic products, effective
July 2006. This drive is manufactured with components and materials that comply with the RoHS Directive.
2.11.2 China Restriction of Hazardous Substances (RoHS) Directive
This product has an Environmental Protection Use Period (EPUP) of 20 years. The following table
contains information mandated by China's "Marking Requirements for Control of Pollution Caused
by Electronic InformationProducts" Standard.
"O" indicates the hazardous and toxic substance content of the part (at the homogeneous material level) is lower than
the threshold defined by the China RoHS MCV Standard.
"X" indicates the hazardous and toxic substance content of the part (at the homogeneous material level) is over the
threshold defined by the China RoHS MCV Standard.
2.12 CORROSIVE ENVIRONMENT
Seagate electronic drive components pass accelerated corrosion testing equivalent to 10 years exposure to light
industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM B845.
However, this accelerated testing cannot duplicate every potential application environment. Users should use caution
exposing any electronic components to uncontrolled chemical pollutants and corrosive chemicals, as the installation
environment can affect electronic drive component reliability. The silver, copper, nickel and gold films used in Seagate
products are especially sensitive to the presence of sulfide, chloride, and nitrate contaminants. Sulfur is found to be the
most damaging. In addition electronic components should never be exposed to condensing water on the surface of the
printed circuit board assembly (PCBA) or exposed to an ambient relative humidity greater than 95%. Materials used in
cabinet fabrication, such as vulcanized rubber, that can outgas corrosive compounds should be minimized or eliminated.
Replacing materials near circuitry with sulfide-free alternatives may extend the useful life of any electronic equipment.
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2.13 PRODUCT WARRANTY
Beginning on the date of shipment to the customer and continuing for the period specified in the purchase contract,
Seagate warrants that each product (including components and subassemblies) that fails to function properly under
normal use due to defect in materials or workmanship or due to nonconformance to the applicable specifications will be
repaired or replaced, a Seagate’s option and at no charge to the customer, if returned by customer at customer’s
expense to Seagate’s designated facility in accordance with Seagate’s warranty procedure. Seagate will pay for
transporting the repair or replacement item to the customer. For more detailed warranty information, refer to the
standard terms and conditions of purchase for Seagate products on the purchase documentation.
The remaining warranty for a particular drive can be determined by calling Seagate Customer Service at 1-800-468-3472.
Users can also determine remaining warranty using the Seagate web site (www.seagate.com). The drive serial number is
required to determine remaining warranty information.
Shipping
When transporting or shipping a drive, use only a Seagate-approved container. Keep the original box. Seagate
approved containers are easily identified by the Seagate Approved Package label. Shipping a drive in a non-approved
container voids the drivewarranty.
Seagate repair centers may refuse receipt of components improperly packaged or obviously damaged in transit. Contact
the authorized Seagate distributor to purchase additional boxes. Seagate recommends shipping by an air-ride carrier
experienced in handling computer equipment.
Storage
The maximum recommended storage period for the drive in a non-operational environment is 90 days. Drives should be
stored in the original unopened Seagate shipping packaging whenever possible. Once the drive is removed from the
Seagate original packaging the recommended maximum period between drive operation cycles is 30 days. During any
storage period the drive non-operational temperature, humidity, wet bulb, atmospheric conditions, shock, vibration,
magnetic and electrical field specifications should be followed.
Product Repair and Return Information
Seagate customer service centers are the only facilities authorized to service Seagate drives. Seagate does not sanction
any third-party repair facilities. Any unauthorized repair or tampering with the factory seal voids the warranty.
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3.0 CONFIGURING AND MOUNTING THE DRIVE
This section contains the specifications and instructions for configuring and mounting the drive.
3.1
HANDLING AND STATIC-DISCHARGE PRECAUTIONS
After unpacking, and before installation, the drive may be exposed to potential handling and electrostatic discharge (ESD)
hazards. Observe the following standard handling and static-discharge precautions:
•
Before handling the drive, put on a grounded wrist strap. Wear a grounded wrist strap throughout
the entire installation procedure.
•
•
•
•
Handle the drive by its edges or frame only.
The drive is extremely fragile—handle it with care. Do not press down on the drive top cover.
Always rest the drive on a padded, antistatic surface until users mount it in the computer.
Do not touch the connector pins or the printed circuit board.
Caution
• Do not remove the factory-installed labels from the drive or cover them with additional labels.
Removal voids the warranty. Some factory-installed labels contain information needed to service
the drive. Other labels are used to seal out dirt and contamination.
3.2
DRIVE MOUNTING
Users can mount the drive in any orientation using four screws in the side-mounting holes or four screws in the
bottom- mounting holes. Refer to Figure 3.2.1 for drive mounting dimensions. Follow these important mounting
precautions when mounting the drive:
• Allow a minimum clearance of 0.030 inches (0.76mm) around the entire perimeter of the drive for cooling.
• Use only 6-32 UNC mounting screws.
• The screws should be inserted no more than 0.150 inches (3.81mm) into the bottom or side mounting holes.
• Do not over tighten the mounting screws (maximum torque: 6 inch-lb).
Weight:
608g (1.34 lb)
These dimensions conform to the Small Form Factor Standard documented in
SFF-8301 and SFF-8323 found at www.sffcommittee.org
Note
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Figure 2 HDD Mounting Dimensions
Note
PCBA may not be representative of the actual PCBA on drive.
3.3
DRIVE CONFIGURATIONS
When the Kinetic drives are connected to the local network with DHCP server, IP addresses will be self-assigned to each
of the ports. Obtaining drive information, performing drive firmware updates, and other tools for drive configurations are
provided in the Kinetic Python tools Github Repository: https://github.com/Seagate/kinetic-py-tools.
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4.0 ETHERNET ENABLED INTERFACE
The Ethernet interface uses the standard SAS connector interface with repurposing of the pin outs. This section partially
describes the interface requirements as implemented on Kinetic drives. The connector is defined by and conforms to the
dimensions and specifications of SFF-8482 Rev 2.3.
4.1
SAS CONNECTOR PHYSICAL INTERFACE
Figures 4.1.1 and 4.1.2 provide the dimensions of the SAS connector. Details of the physical, electrical, and logical
characteristics are provided within this section.
Figure 3 SAS Device Plug Dimensions
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Figure 4 Detailed SAS Device Plug Dimensions
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Figure 4.1.3 shows the pin locations for the SAS connector pin and Table 4.1.1 represents the Ethernet Enabled SAS
Connector Pin Definitions for the Seagate Kinetic HDD.
Figure 5 SAS Connector Pin Locations
Table 12: Ethernet Enabled SAS Connector Pin Definitions
Segment
Pin
S1
Function
GROUND
RX0+
Comments
S2
Ethernet port 0
Ethernet port 0
S3
RX0-
S4
GROUND
TX0-
S5
Ethernet port 0
Ethernet port 0
S6
TX0+
S7
GROUND
GROUND
RX1+
Signal
S8
S9
Ethernet port 1
Ethernet port 1
S10
S11
S12
S13
S14
P1
RX1-
GROUND
TX1-
Ethernet port 1
Ethernet port 1
TX1+
GROUND
RESERVED
I2C CLOCK
I2C DATA
GROUND
GROUND
GROUND
+5V PRECHARGE
+5V
Reserved for internal use. Do not connect. 3.3V tolerant.
P2
3.3V tolerant
3.3V tolerant
P3
P4
P5
P6
P7
Power
P8
P9
+5V
P10
P11
P12
P13
P14
P15
GROUND
RESERVED
GROUND
+12V PRECHARGE
+12V
Reserved for internal use. Do not connect.
+12V
Notes
• All pins are in a single row, with a 1.27 mm (0.050”) pitch.
• There are three power pins for each voltage.
One pin from each voltage is used for pre-charge when installed in a blind-mate backplane configuration.
• All used voltage pins must be terminated.
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5.0 KEY/VALUE PROTOCOL
The protocol provides communication from the client applications to the Kinetic drive. The architecture for Kinetic storage
is shown in Figure 5.1.
Figure 6 Kinetic Software Stack
This section explains the Kinetic Protocol Data Unit. For more information about the Kinetic Protocol, please visit:
5.1
HOST TO DRIVE DATA TRANSFER
Host to drive data transfer is accomplished using three basic commands:
• put – Add the specified key/value object to the store
• get – Retrieve the key/value object associated with the specified key
• delete – Delete the key/value object that is associated with the specified key.
In addition to the basic commands, other key/value object operations are also supported:
• getNext – Gets the key/value object associated with the key that follows the specified key based on the
lexicographical ordering of keys
• getPrevious – Gets the key/value object associated with the key that precedes the specified key based on the
lexicographical ordering of keys
• getKeyRange – Get a list of keys in lexicographical order based on the specified key range
• getMetadata – Get metadata for the specified key
Host applications communicate with the Kinetic drives by sending Kinetic Protocol Data Units over a network using TCP.
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5.2
KINETIC PROTOCOL DATA UNIT
A Kinetic PDU is composed of five fields
1. PDU version
2. Kinetic Message length
3. value length
4. Kinetic Message
5. Value
Some PDUs have a null value. It is important to note that the value is not encoded in the Kinetic Message; it is a separate
field of the Kinetic PDU.
Specifically, a Kinetic PDU structure is shown in Table 5.2.1.
Table 13: Kinetic PDU Structure
Starting Offset
Type
Length
Description
PDU version:
0
Byte
1 Byte
currently hex 46, denoting the beginning of the message.
The number of bytes in the Kinetic Message field.
The maximum length for a Kinetic Message is 1 MiB
(2^20 bytes).
4-byte Big
Endian Integer
1
4 Bytes
4-byte Big
Endian Integer
The number of bytes in the value field.
The maximum length for a value is 1 MiB (2^20 bytes).
5
9
4 Bytes
<= 1 MiB
<= 1 MiB
Bytes
Bytes
The Kinetic Message.
The value.
9 + length of
Kinetic Message
Figure 5.2.1 shows a visual of how the Kinetic PDU is structured.
Figure 7 Kinetic Protocol Data Unit Message Packet
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5.3
KINETIC MESSAGE
The syntax and encoding of Kinetic Message is defined using Google Protocol Buffers and is specified by the file
kinetic.proto. The top-level message, Message, contains three embedded messages:
1. Messagetype
2. hmacAuth
3. command
5.4
COMMAND EMBEDDED MESSAGE
Command is transported as bytes for ease of calculating the HMAC.
The command bytes are interpreted by casting them as embedded message, Command, containing three embedded
messages:
1. Header – Contains metadata about type of message command, such as PUT, GET, and DELETE operations.
2. Body – Contains operation-specific information, such as key range information used for the GETKEYRANGE
operations.
3. Status – Contains information about whether an associated operation succeeded or failed.
This is shown graphically in Figure 5.4.1.
Figure 8 Command Embedded Message
As shown in Figure 5.4.1, the Header, Body, and Status messages are all members of the Command message.
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Seagate Technology LLC
AMERICAS Seagate Technology LLC 10200 South De Anza Boulevard, Cupertino, California 95014, United States, 408-658-1000
ASIA/PACIFIC Seagate Singapore International Headquarters Pte. Ltd. 7000 Ang Mo Kio Avenue 5, Singapore 569877, 65-6485-3888
EUROPE, MIDDLE EAST AND AFRICA Seagate Technology SAS 16-18 rue du Dôme, 92100 Boulogne-Billancourt, France, 33 1-4186 10 00
Publication Number: 100764174, Rev. A
October 2014
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