Product Manual
®
Momentus XT
ST750LX003
ST500LX003
100665905
Gen-2
Rev. D
September 2011
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Contents
Seagate Technology support services. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
About the Serial ATA interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Drive specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Specification summary table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Formatted capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
LBA mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Solid State Hybrid feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.8
Default logical geometry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Physical organization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Recording and interface technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Seek time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Start/stop times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Conducted noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Voltage tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Power-management modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Environmental specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Temperature gradient. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Relative humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Wet bulb temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Altitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Vibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Electromagnetic immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Agency certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Safety certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
FCC verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Environmental protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Corrosive environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Configuring and mounting the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Handling and static-discharge precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Configuring the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Serial ATA cables and connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Drive mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Serial ATA (SATA) interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Hot-Plug compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Serial ATA device plug connector pin definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Supported ATA commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.3.3
Identify Device command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Set Features command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
S.M.A.R.T. commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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List of Figures
Figure 3.
Typical +5V only startup and operation current profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Attaching SATA cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Mounting dimensions—top, side and end view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
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1.0
Seagate Technology support services
SEAGATE ONLINE SUPPORT and SERVICES
For information regarding products and services, visit http://www.seagate.com/www/en-us/about/contact_us/
Available services include:
Presales & Technical support
Global Support Services telephone numbers & business hours
Authorized Service Centers
For information regarding Warranty Support, visit
http://www.seagate.com/www/en-us/support/warranty_&_returns_assistance
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2.0
Introduction
This manual describes the functional, mechanical and interface specifications for the following Seagate
Momentus® XT model drives:
ST750LX003
ST500LX003
These drives provide the following key features:
• 7200-RPM spindle speed.
• 32MB buffer.
• Quiet operation. Fluid Dynamic Bearing (FDB) motor.
• High instantaneous (burst) data-transfer rates (up to 6Gbs).
• Perpendicular recording technology.
• State-of-the-art cache and on-the-fly error-correction algorithms.
• Addition of NAND Flash memory to enhance drive performance.
• Native Command Queuing (NCQ) with command ordering.
• Full-track multiple-sector transfer capability without local processor intervention.
• 800 Gs nonoperating shock and 350 Gs of operating shock @ 2ms.
• SeaTools diagnostic software performs a drive self-test that eliminates unnecessary drive returns.
• Support for S.M.A.R.T. drive monitoring and reporting.
• Support for Read Multiple and Write Multiple commands.
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2.1
About the Serial ATA interface
The Serial ATA interface provides several advantages over the traditional (parallel) ATA interface. The primary
advantages include:
• Easy installation and configuration with true plug-and-play connectivity. It is not normally necessary to set
any jumpers or other configuration options.
• Thinner and more flexible cabling for improved enclosure airflow and ease of installation.
• Scalability to higher performance levels.
In addition, Serial ATA makes the transition from parallel ATA easy by providing legacy software support. Serial
ATA was designed to allow you to install a Serial ATA host adapter and Serial ATA disc drive in your current
system and expect all of your existing applications to work as normal.
The Serial ATA interface connects each disc drive in a point-to-point configuration with the Serial ATA host
adapter. There is no master/slave relationship with Serial ATA devices like there is with parallel ATA. If two
drives are attached on one Serial ATA host adapter, the host operating system views the two devices as if they
were both “masters” on two separate ports. This essentially means both drives behave as if they are Device 0
(master) devices.
Note. The host adapter may, optionally, emulate a master/slave environment to host software where two
devices on separate Serial ATA ports are represented to host software as a Device 0 (master) and
Device 1 (slave) accessed at the same set of host bus addresses. A host adapter that emulates a
master/slave environment manages two sets of shadow registers. This is not a typical Serial ATA
environment.
The Serial ATA host adapter and drive share the function of emulating parallel ATA device behavior to provide
backward compatibility with existing host systems and software. The Command and Control Block registers,
PIO and DMA data transfers, resets, and interrupts are all emulated.
The Serial ATA host adapter contains a set of registers that shadow the contents of the traditional device regis-
ters, referred to as the Shadow Register Block. All Serial ATA devices behave like Device 0 devices. For addi-
tional information about how Serial ATA emulates parallel ATA, refer to the “Serial ATA: High Speed Serialized
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3.0
Drive specifications
Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal
power.
3.1
Specification summary table
The specifications listed in this table are for quick reference. For details on specification measurement or defi-
nition, see the appropriate section of this manual.
Table 1:
Drive specifications
Drive specification
ST750LX003
ST500LX003
Formatted GB (512 bytes/sector)*
Guaranteed sectors
750
500
1,465,149,168
976,773,168
Bytes per sector
4K emulation @ 512
Physical read/write heads
Discs
4
2
Cache (MB)
32
Recording density in BPI (bits/in max)
Track density TPI (tracks/in max)
Areal density (Gb/in2 max)
Spindle speed (RPM)
1778k
317k
563.6
7200
4.20
1.23
6.0
Average latency (ms)
Internal transfer rate (Gb/s max)
I/O data transfer rate (Gb/s max)
ATA data-transfer modes supported
SATA 1.0, Serial ATA Revision 2.6
PIO modes 0–4
Multiword DMA modes 0–2
Ultra DMA modes 0–6
Height (max)
9.5 ± 0.2 mm (0.370 ± .008 in)
Width (max)
69.85 ± 0.25 mm (2.750 ± 0.010 in)
Length (max)
100.30 ± 0.25 mm (3.949 ± 0.010 in)
Weight (max)
115 g (0.253 lb)
Power-on to ready (sec typical)
Standby to ready (sec typical)
5.0
3.5
Track-to-track seek time, read (msec typical) 1.5
Average seek, read (ms typical)
Average seek, write (ms typical)
Startup current, +5V amps (max)
Read power (watts typical)
11.0
13.0
1.2
3.3
4
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Table 1:
Drive specifications
Drive specification
ST750LX003
ST500LX003
Write power (watts typical)
3.2
Idle mode, low power (watts typical)
Standby mode (watts typical)
Sleep mode (watts typical)
1.1
0.6 ***
0.6 ***
+5V ± 5%
Voltage tolerance (including noise)
Ambient temperature (°C)
0 to 60 (operating)
–40 to 70 (nonoperating)
Temperature gradient (°C per hour max)
Relative humidity
20 (operating), 35 (nonoperating)
5% to 95% (operating and nonoperating
30% per hour max
Relative humidity gradient
Wet bulb temperature (°C max)
37.7 (operating)
40 (nonoperating)
Altitude, operating
–304.8 m to 3048 m (–1000 ft to 10,000+ ft)
Altitude, nonoperating
(meters below mean sea level, max)
–304.8 m to 12,192 m (–1000 ft to 40,000+ ft)
Shock, operating (Gs max at 2 ms)
Shock, nonoperating (Gs max at 2 ms)
Shock, nonoperating (Gs max at 1 ms)
Shock, nonoperating (Gs max at 0.5 ms)
Vibration, operating
350
800
1000
1000
1.0 G (0 to peak, 5–500 Hz)
5 Gs (0 to peak, 5–500 Hz)
Vibration, nonoperating
Drive acoustics, sound power (bels)
Idle**
2.3 (typical)
2.5 (max)
Performance seek
2.6 (typical)
2.7 (max)
Nonrecoverable read errors
Annualized Failure Rate (AFR)
Load/Unload (U/UL) cycles
1 per 1014 bits read
0.5%
25°C, 50% relative humidity
600,000 software-controlled power on/off cycles
50,000 hard power on/off cycles
32°C, 80% relative humidity
5°C, 80% relative humidity
5°C, 10% relative humidity
55°C, 16% relative humidity
600,000 software-controlled power on/off cycles
50,000 hard power on/off cycles
Warranty
To determine the warranty for a specific drive, use a web browser to access the following
From this page, click on the “Verify Your Warranty” link. You will be asked to provide the
drive serial number, model number (or part number) and country of purchase. The sys-
tem will display the warranty information for your drive.
Supports Hotplug operation per
Yes (requires COMRESET from host after a hotplug event)
Serial ATA Revision 2.6 specification
*One Gbyte equals one billion bytes when referring to hard drive capacity. Accessible capacity may vary depending on operating environment
and formatting.
**During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and
power to operational levels.
***Typical notebooks will pull power to the drive when entering S3 and S4; while in the S3 and S4 states, drive sleep and drive standby
modes will not contribute to battery power consumption.
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3.2
Formatted capacity
Model
Formatted capacity*
Guaranteed sectors
1,465,149,168
Bytes per sector
ST750LX003
ST500LX003
750GB
500GB
4K emulated @ 512
976,773,168
*One GB equals one billion bytes when referring to hard drive capacity. Accessible capacity may vary depending on operating environment
and formatting.
3.2.1
LBA mode
When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1,
where n is the number of guaranteed sectors as defined above.
See Section 5.3.1, "Identify Device command" (words 60-61 and 100-103) for additional information about 48-
bit addressing support of drives with capacities over 137GB.
3.2.2
Solid State Hybrid feature
The Solid State Hybrid feature utilizes the addition of NAND Flash memory to enhance the performance of the
drive. Short random accesses to the NAND Flash are faster than disc accesses due to the elimination of seek
and rotational latencies and therefore it is used to store more frequently accessed data. The Momentus XT
uses a proprietary algorithm which monitors drive activity and determines the optimum data to maintain in the
NAND Flash for peak responsiveness. The Solid State Hybrid feature is self contained in the drive firmware
and functions independent of the host hardware or operating system. There are no special host system
requirements. Momentus XT can be installed in any standard SATA environment and will automatically opti-
mize.
Specifics of the Solid State Hybrid Feature:
• Powerful ECC correction on data read from the NAND Flash.
• Maintains a list of defective NAND Flash blocks and maps them out of use.
• Additional bad blocks added during use will be added to the list of defective blocks and taken out of use.
• Storage functionality is preserved with no data loss with any wear out of the NAND Flash.
• No user intervention required.
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3.3
Default logical geometry
Cylinders
Read/write heads
Sectors per track
63
16,383
16
LBA mode
When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1,
where n is the number of guaranteed sectors as defined above.
3.4
Physical organization
Drive model
Read/write heads
Number of discs
750GB
500GB
4
2
3.5
Recording and interface technology
Interface
Serial ATA (SATA)
Recording method
Perpendicular
Recording density BPI (bits/in max)
Track density TPI (tracks/in max)
1778k
317k
2
Areal density (Gb/in max)
563.6
Spindle speed (RPM) ( 0.2%)
Maximum Internal transfer rate (Gb/s)
I/O data-transfer rate (Gb/s max)
Interleave
7200
1.23
6.0
1:1
Cache buffer - ST750LX003 and ST500LX003
32MB (32,768KB)
3.6
Physical characteristics
Drive specification
Height
(mm)
(in)
9.50 ± 0.20
0.370 ± 0.008
Width
(mm)
(in)
69.85 ± 0.25
2.750 ± 0.010
Length
(mm)
(in)
100.30 ± 0.25
3.949 ± 0.010
Typical weight
115 g
0.253 lb
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3.7
Seek time
Seek measurements are taken with nominal power at 25°C ambient temperature. All times are measured using
drive diagnostics. The specifications in the table below are defined as follows:
• Track-to-track seek time is an average of all possible single-track seeks in both directions.
• Average seek time is a true statistical random average of at least 5000 measurements of seeks between
random tracks, less overhead.
Table 2:
Typical seek times
Typical seek times (ms)
Track-to-track
Read
2.0
Average
11.0
4.20
Average latency
Note. These drives are designed to consistently meet the seek times represented in this manual. Physical
seeks, regardless of mode (such as track-to-track and average), are expected to meet the noted
values. However, due to the manner in which these drives are formatted, benchmark tests that
include command overhead or measure logical seeks may produce results that vary from these
specifications.
3.8
Start/stop times
Max @ 25°C
Time to ready
Typical
5.0
Power-on to Ready (sec)
Standby to Ready (sec)
5.5
4.0
3.5
Note. Time-to-ready may be longer than normal if the drive power is removed without going through
normal OS powerdown procedures.
3.9
Power specifications
The drive receives DC power (+5V) through a native SATA power connector.
3.9.1 Power consumption
Power requirements for the drives are listed in the table on page 8. Typical power measurements are based on
an average of drives tested, under nominal conditions, at 25°C ambient temperature.
• Spinup power
Spinup power is measured from the time of power-on to the time that the drive spindle reaches operating speed.
• Seek mode
During seek mode, the read/write actuator arm moves toward a specific position on the disc surface and does
not execute a read or write operation. Servo electronics are active. Seek mode power is measured based on
three random seek operations every 100 ms. This mode is not typical.
• Read/write power and current
Read/write power is measured with the heads on track, based on three 63 sector read or write operations
every 100 ms.
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• Idle mode power
Idle mode power is measured with the drive up to speed, with servo electronics active and with the heads in
a random track location.
• Standby mode
During Standby mode, the drive accepts commands, but the drive is not spinning, and the servo and read/
write electronics are in power-down model
Table 3:
DC power
Power dissipation
Spinup (max)
Read
+5V input average (25° C)
1.2A
3.3W
3.2W
2.4W
1.2W
1.1W
0.6W
0.6W
Write
Idle, performance*
Idle, active*
Idle, low power mode*
Standby
Sleep
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and
power to operational levels.
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3.9.2
Conducted noise
Input noise ripple is measured at the host system power supply across an equivalent 15-ohm resistive load on
the +5V line.
Using 5V power, the drive is expected to operate with a maximum of 100mV peak-to-peak square-wave
injected noise at up to 10 MHz.
Note. Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write
current.
3.9.3
Voltage tolerance
Voltage tolerance (including noise):
5V 5%
3.9.4
Power-management modes
The drive provides programmable power management to provide greater energy efficiency. In most systems,
you can control power management through the system setup program. The drive features the following
power-management modes:
Table 4:
Power management modes
Power modes
Active (operating)
Idle, performance
Idle, active
Heads
Spindle
Rotating
Rotating
Rotating
Rotating
Stopped
Stopped
Buffer
Tracking
Tracking
Floating
Parked
Parked
Parked
Full power
Self refresh—low power
Self refresh—low power
Self refresh—low power
Self refresh—low power
Self refresh—low power
Idle, low power
Standby
Sleep
• Active mode
The drive is in Active mode during the read/write and seek operations.
• Idle mode
The buffer remains enabled, and the drive accepts all commands and returns to Active mode any time disc
access is necessary.
• Standby mode
The drive enters Standby mode when the host sends a Standby Immediate command. If the host has set the
standby timer, the drive can also enter Standby mode automatically after the drive has been inactive for a
specifiable length of time. The standby timer delay is established using a Standby or Idle command. In Standby
mode, the drive buffer is in Self Refresh Low Power mode, the heads are parked and the spindle is at rest.
The drive accepts all commands and returns to Active mode any time disc access is necessary.
• Sleep mode
The drive enters Sleep mode after receiving a Sleep command from the host. In Sleep mode, the drive buffer
is in Self Refresh Low Power mode, the heads are parked and the spindle is at rest. The drive leaves Sleep
mode after it receives a Hard Reset or Soft Reset from the host. After receiving a reset, the drive exits Sleep
mode and enters Standby mode with all current translation parameters intact.
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• Idle and Standby timers
Each time the drive performs an Active function (read, write or seek), the standby timer is reinitialized and
begins counting down from its specified delay times to zero. If the standby timer reaches zero before any
drive activity is required, the drive makes a transition to Standby mode. In both Idle and Standby mode, the
drive accepts all commands and returns to Active mode when disc access is necessary.
3.10
Environmental specifications
This section provides the temperature, humidity, shock, and vibration specifications for Momentus XT drives.
3.10.1 Ambient temperature
Ambient temperature is defined as the temperature of the environment immediately surrounding the drive.
Actual drive case temperature should not exceed 65°C (149°F) within the operating ambient conditions.
Above 1000 feet (305 meters), the maximum temperature is derated linearly by 1°C every 1000 feet.
Operating:
0°C to 60°C (32°F to 140°F)
Nonoperating:
–40°C to 70°C (–40°F to 158°F)
3.10.2
Temperature gradient
Operating
20°C per hour (68°F per hour max), without condensation
35°C per hour (95°F per hour max), without condensation
Nonoperating
3.10.3
Relative humidity
Operating
5% to 95% noncondensing (30% per hour max)
5% to 95% noncondensing (30% per hour max)
Nonoperating
3.10.4
Wet bulb temperature
Operating
37.7°C (99.8°F max)
40°C (104°F max)
Nonoperating
3.10.5
Altitude
Operating
–304.8 m to 3,048 m (–1000 ft to 10,000+ ft)
–304.8 m to 12,192 m (–1000 ft to 40,000+ ft)
Nonoperating
3.10.6
Shock
All shock specifications assume that the drive is mounted securely with the input shock applied at the drive
mounting screws. Shock may be applied in the X, Y or Z axis.
3.10.6.1
Operating shock
These drives comply with the performance levels specified in this document when subjected to a maximum
operating shock of 350 Gs based on half-sine shock pulses of 2 ms. Shocks should not be repeated more than
one time per axis.
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3.10.6.2
Nonoperating shock
The nonoperating shock level that the drive can experience without incurring physical damage or degradation
in performance when subsequently put into operation is 800 Gs based on a nonrepetitive half-sine shock pulse
of 2 ms duration.
The nonoperating shock level that the drive can experience without incurring physical damage or degradation
in performance when subsequently put into operation is 1000 Gs based on a nonrepetitive half-sine shock
pulse of 1 ms duration.
The nonoperating shock level that the drive can experience without incurring physical damage or degradation
in performance when subsequently put into operation is 1000 Gs based on a nonrepetitive half-sine shock
pulse of 0.5 ms duration.
3.10.7
Vibration
All vibration specifications assume that the drive is mounted securely with the input vibration applied at the
drive mounting screws. Vibration may be applied in the X, Y or Z axis.
3.10.7.1
Operating vibration
The maximum vibration levels that the drive may experience while meeting the performance standards speci-
fied in this document are specified below.
5–500 Hz
1.0 Gs (0 to peak). Max displacement may apply below 10 Hz.
3.10.7.2
Nonoperating vibration
The maximum nonoperating vibration levels that the drive may experience without incurring physical damage or degrada-
tion in performance when subsequently put into operation are specified below.
5–500 Hz:
5 Gs (0 to peak). Max displacement may apply below 22 Hz.
3.11
Acoustics
Drive emission of sound is measured consistent with the ECMA-74 and its referenced standards. Testing is
conducted at room temperature (approximately 25°C). Emission levels are reported as the total A-weighted
sound power levers for steady state, idle, and active seeks modes of operation.
Table 5:
Drive A-weighted Sound Power Levels (SWL, BA)
Idle*
Performance seek
2.3 bels (typ)
2.5 bels (max)
2.6 bels (typ)
2.7 bels (max)
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and
power to operational levels.
Test for Prominent Discrete Tones (PDTs)
Seagate follows the ECMA-74 standards for measurement and identification of PDTs. An exception to this pro-
cess is the use of the absolute threshold of hearing. Seagate uses the lower limit for the threshold curve* to
discern tone audibility and to compensate for the inaudible components of sound prior to computation of tone
ratios according to Annex D of the ECMA-74 standards.
*Defined as the median curve given by ISO 389-7 (Tf curve) minus 10dB at all frequencies.
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3.12
Electromagnetic immunity
When properly installed in a representative host system, the drive operates without errors or degradation in
performance when subjected to the radio frequency (RF) environments defined in the following table:
Table 6:
Radio frequency environments
Performance
level
Reference
standard
Test
Description
Electrostatic discharge
Radiated RF immunity
Contact, HCP, VCP: 4 kV; Air: 8 kV
B
A
EN 61000-4-2: 95
80 to 1,000 MHz, 3 V/m,
80% AM with 1 kHz sine
900 MHz, 3 V/m, 50% pulse modulation @ 200 Hz
EN 61000-4-3: 96
ENV 50204: 95
Electrical fast transient
Surge immunity
1 kV on AC mains, 0.5 kV on external I/O
1 kV differential, 2 kV common, AC mains
B
B
A
EN 61000-4-4: 95
EN 61000-4-5: 95
EN 61000-4-6: 97
Conducted RF immunity
150 kHz to 80 MHz, 3 Vrms, 80% AM with 1 kHz
sine
Power Frequency H-field
immunity
1 A/m, 50Hz/60Hz, 3 axes
A
EN 61000-4-8: 97
EN 61000-4-11: 94
Voltage dips, interrupts
30% Reduction for 25 cycles
>95% Reduction for 250 cycles
>95%, 0.5 cycles
C
C
B
3.13
Reliability
Measurement type
Nonrecoverable read errors
Specification
14
1 per 10 bits read, max.
Annualized Failure Rate (AFR)
Load/Unload (U/UL)
0.5%
25°C, 50% relative humidity
600,000 software-controlled power on/off cycles
50,000 hard power on/off cycles
32°C, 80% relative humidity
5°C, 80% relative humidity
5°C, 10% relative humidity
55°C, 16% relative humidity
600,000 software-controlled power on/off cycles
50,000 hard power on/off cycles
Warranty
To determine the warranty for a specific drive, use a web browser to access the
following web page:
From this page, click on the “Verify Your Warranty” link. You will be asked to pro-
vide the drive serial number, model number (or part number) and country of pur-
chase. The system will display the warranty information for your drive.
14
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3.14
Agency certification
Safety certification
3.14.1
The drives are recognized in accordance with UL 60950-1 and CSA C22.2 (950) and meet all applicable sec-
tions of IEC 60950-1 and EN60950-1 as tested by TUV North America.
3.14.2
Electromagnetic compatibility
Hard drives that display the CE mark comply with the European Union (EU) requirements specified in the Elec-
tromagnetic Compatibility Directive (89/336/EEC). Testing is performed to the levels specified by the product
standards for Information Technology Equipment (ITE). Emission levels are defined by EN 55022, Class B and
the immunity levels are defined by EN 55024.
Seagate uses an independent laboratory to confirm compliance with the EC directives specified in the previous
paragraph. Drives are tested in representative end-user systems. Although CE-marked Seagate drives comply
with the directives when used in the test systems, we cannot guarantee that all systems will comply with the
directives. The drive is designed for operation inside a properly designed enclosure, with properly shielded I/O
cable (if necessary) and terminators on all unused I/O ports. Computer manufacturers and system integrators
should confirm EMC compliance and provide CE marking for their products.
Korean BCC
If these drives have the Korea Ministry of Information and Communication (MIC) logo, they comply with para-
graph 1 of Article 11 of the Electromagnetic Compatibility control Regulation and meet the Electromagnetic
Compatibility (EMC) Framework requirements of the Broadcasting Communications Center (BCC) Ministry of
Information and Communication Republic of Korea.
These drives have been tested and comply with the Electromagnetic Interference/Electromagnetic Susceptibil-
ity (EMI/EMS) for Class B products. Drives are tested in a representative, end-user system by a Korean-recog-
nized lab.
• Certificate number: STX-MomentusXT (B)
• Trade name or applicant: Seagate Technology LLC
• Date of certificate: March 18, 2010
• Manufacturer/nationality: USA and China
Australian C-Tick (N176)
If these models have the C-Tick marking, they comply with the Australia/New Zealand Standard AS/NZS3548
1995 and meet the Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communi-
cation Authority (ACA).
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3.14.3
FCC verification
These drives are intended to be contained solely within a personal computer or similar enclosure (not attached
as an external device). As such, each drive is considered to be a subassembly even when it is individually mar-
keted to the customer. As a subassembly, no Federal Communications Commission verification or certification
of the device is required.
Seagate Technology LLC has tested this device in enclosures as described above to ensure that the total
assembly (enclosure, disc drive, motherboard, power supply, etc.) does comply with the limits for a Class B
computing device, pursuant to Subpart J, Part 15 of the FCC rules. Operation with noncertified assemblies is
likely to result in interference to radio and television reception.
Radio and television interference. This equipment generates and uses radio frequency energy and if not
installed and used in strict accordance with the manufacturer’s instructions, may cause interference to radio
and television reception.
This equipment is designed to provide reasonable protection against such interference in a residential installa-
tion. However, there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause interference to radio or television, which can be determined by turning the equipment on and off,
you are encouraged to try one or more of the following corrective measures:
• Reorient the receiving antenna.
• Move the device to one side or the other of the radio or TV.
• Move the device farther away from the radio or TV.
• Plug the computer into a different outlet so that the receiver and computer are on different branch outlets.
If necessary, you should consult your dealer or an experienced radio/television technician for additional sug-
gestions. You may find helpful the following booklet prepared by the Federal Communications Commission:
How to Identify and Resolve Radio-Television Interference Problems. This booklet is available from the Super-
intendent of Documents, U.S. Government Printing Office, Washington, DC 20402. Refer to publication num-
ber 004-000-00345-4.
3.15
Environmental protection
Seagate designs its products to meet environmental protection requirements worldwide, including regulations
restricting certain chemical substances.
3.15.1
European Union Restriction of Hazardous Substances (RoHS)
Seagate designs its products to meet environmental protection requirements worldwide, including regulations
restricting certain chemical substances. A new law, the European Union Restriction of Hazardous Substances
(RoHS) Directive, restricts the presence of chemical substances, including Lead, Cadmium, Mercury,
Hexavalent Chromium, PBB and PBDE, in electronic products, effective July 2006. This drive is manufactured
with components and materials that comply with the RoHS Directive.
16
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3.15.2
China Restriction of Hazardous Substances (RoHS) Directive
This product has an Environmental Protection Use Period (EPUP) of 20 years. The following
table contains information mandated by China's "Marking Requirements for Control of Pollution
Caused by Electronic Information Products" Standard.
"O" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is lower
than the threshold defined by the China RoHS MCV Standard.
“O”
RoHS MCV
表示该部件（于同类物品程度上）所含的危险和有毒物质低于中国
标准所定义的门槛值。
"X" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is over
the threshold defined by the China RoHS MCV Standard.
“X”
RoHS MCV
表示该部件（于同类物品程度上）所含的危险和有毒物质超出中国
标准所定义的门槛值。
3.16
Corrosive environment
Seagate electronic drive components pass accelerated corrosion testing equivalent to 10 years exposure to
light industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM
B845. However, this accelerated testing cannot duplicate every potential application environment.
Users should use caution exposing any electronic components to uncontrolled chemical pollutants and corro-
sive chemicals as electronic drive component reliability can be affected by the installation environment. The sil-
ver, copper, nickel and gold films used in Seagate products are especially sensitive to the presence of sulfide,
chloride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic components
should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or
exposed to an ambient relative humidity greater than 95%. Materials used in cabinet fabrication, such as vulca-
nized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of any
electronic equipment may be extended by replacing materials near circuitry with sulfide-free alternatives.
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4.0
Configuring and mounting the drive
This section contains the specifications and instructions for configuring and mounting the drive.
4.1
Handling and static-discharge precautions
After unpacking, and before installation, the drive may be exposed to potential handling and electrostatic dis-
charge (ESD) hazards. Observe the following standard handling and static-discharge precautions:
Caution:
• Keep the drive in the electrostatic discharge (ESD) bag until you are ready for installation to limit the drive’s
exposure to ESD.
• Before handling the drive, put on a grounded wrist strap, or ground yourself frequently by touching the metal
chassis of a computer that is plugged into a grounded outlet. Wear a grounded wrist strap throughout the entire
installation procedure.
• Handle the drive only by its edges or frame.
• The drive is fragile—handle it with care. Do not press down on the drive top cover.
• Always rest the drive on a padded, antistatic surface until you mount it in the computer.
• Do not touch the connector pins or the printed circuit board.
• Do not remove the factory-installed labels from the drive or cover them with additional labels. Removal voids
the warranty. Some factory-installed labels contain information needed to service the drive. Other labels are
used to seal out dirt and contamination.
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4.2
Configuring the drive
Each drive on the Serial ATA interface connects in a point-to-point configuration with the Serial ATA host
adapter. There is no master/slave relationship because each drive is considered a master in a point-to-point
relationships. If two drives are attached on one Serial ATA host adapter, the host operating system views the
two devices as if they were both “masters” on two separate ports. This means both drives behave as if they are
Device 0 (master) devices.
4.3
Serial ATA cables and connectors
The Serial ATA interface cable consists of four conductors in two differential pairs, plus three ground connec-
tions. The cable size may be 30 to 26 AWG with a maximum length of one meter (39.37 inches). See Table 7
for connector pin definitions. Either end of the SATA signal cable can be attached to the drive or host.
For direct backplane connection, the drive connectors are inserted directly into the host receptacle. The drive
and the host receptacle incorporate features that enable the direct connection to be hot pluggable and blind
mateable.
For installations which require cables, you can connect the drive as illustrated in Figure 2.
SATA interface connector
Power connector
SATA interface cable
Power cable
Figure 2. Attaching SATA cabling
Each cable is keyed to ensure correct orientation.
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4.4
Drive mounting
You can mount the drive using four screws in the side-mounting holes or four screws in the bottom-mounting
holes. See Figure 3 for drive mounting dimensions. Follow these important mounting precautions when mount-
ing the drive:
• Allow a minimum clearance of 0.030 inches (0.76 mm) around the entire perimeter of the drive for cooling.
• Use only M3 UNC mounting screws.
• Do not overtighten the mounting screws (maximum torque: 4.0 inch-lb).
• Four (4) threads (0.080 inches) minimum screw engagement recommended.
Figure 3. Mounting dimensions—top, side and end view
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5.0
Serial ATA (SATA) interface
These drives use the industry-standard Serial ATA interface that supports FIS data transfers. It supports ATA
programmed input/output (PIO) modes 0–4; multiword DMA modes 0–2, and Ultra DMA modes 0–6. The drive
also supports the use of the IORDY signal to provide reliable high-speed data transfers.
For detailed information about the Serial ATA interface, refer to the “Serial ATA: High Speed Serialized AT
Attachment” specification.
5.1
Hot-Plug compatibility
Momentus XT drives incorporate connectors which enable you to hot plug these drives in accordance with the
Serial ATA: High Speed Serialized AT Attachment specification revision 2.0. This specification can be down-
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5.2
Serial ATA device plug connector pin definitions
Table 7: Serial ATA connector pin definitions
Segment Pin
Function
Ground
A+
Definition
S1
S2
S3
S4
S5
S6
2nd mate
Differential signal pair A from Phy
A-
Ground
B-
2nd mate
Differential signal pair B from Phy
B+
Signal
S7
Ground
2nd mate
Key and spacing separate signal and power segments
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
V33
3.3V power
V33
3.3V power
V33
3.3V power, pre-charge, 2nd mate
1st mate
Ground
Ground
Ground
V5
2nd mate
2nd mate
5V power, pre-charge, 2nd mate
5V power
V5
Power
V5
5V power
Ground
Reserved
2nd mate
The pin corresponding to P11 in the backplane receptacle connector is also reserved
The corresponding pin to be mated with P11 in the power cable receptacle connector
shall always be grounded
P12
P13
P14
P15
Ground
V12
1st mate.
12V power, pre-charge, 2nd mate
12V power
V12
V12
12V power
1. All pins are in a single row, with a 1.27 mm (0.050”) pitch.
2. The comments on the mating sequence apply to the case of backplane blindmate connector only. In this
case, the mating sequences are:
• the ground pins P4 and P12.
• the pre-charge power pins and the other ground pins.
• the signal pins and the rest of the power pins.
3. There are three power pins for each voltage. One pin from each voltage is used for pre-charge when
installed in a blind-mate backplane configuration.
4. All used voltage pins (Vx) must be terminated.
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5.3
Supported ATA commands
The following table lists Serial ATA standard commands that the drive supports. For a detailed description of
ATA-standard commands names
Device Configuration Restore
Device Configuration Freeze Lock
Device Configuration Identify
Device Configuration Set
Download Microcode
Execute Device Diagnostics
Flush Cache
Command code (in hex)
B1h/C0h
B1h/C1h
B1h/C2h
B1h/C3h
92h
90h
E7h
Flush Cache Extended
Identify Device
EAh
ECh
91h
Initialize Device Parameters
Read Buffer
E4h
Read DMA
C8h
Read DMA Extended
Read DMA without Retries
Read Long with Retries
Read Long without Retries
Read Multiple
25h
C9h
22h
23h
C4h
Read Multiple Extended
Read Native Max Address
Read Native Max Address Extended
Read Sectors
29h
F8h
27h
20h
Read Sectors Extended
Read Sectors without Retries
Read Verify Sectors
24h
21h
40h
Read Verify Sectors Extended
Read Verify Sectors without Retries
Seek
42h
41h
70h
Set Features
EFh
Set Max Address
F9h
Note: Individual Set Max commands are identi-
fied by the value placed in the Set Max Fea-
tures register as defined to the right.
Address:
Password:
Lock:
00
01
02
03
04
H
H
H
H
H
Unlock:
Freeze Lock:
Set Multiple Mode
C6h
S.M.A.R.T. Disable Operations
B0h/D9h
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ATA-standard commands names
S.M.A.R.T. Enable/Disable Autosave
S.M.A.R.T. Enable Operations
S.M.A.R.T. Enable/Disable Auto Offline
S.M.A.R.T. Enable One Attribute Modification
S.M.A.R.T. Execute Offline
S.M.A.R.T. Free Fall Protection Host Interface
S.M.A.R.T. Read Attribute Thresholds
S.M.A.R.T. Read Data
Command code (in hex)
B0h/D2h
B0h/D8h
B0h/DBh
B0h/E0h
B0h/D4h
FEh
B0h/D1h
B0h/D0h
B0h/D5h
B0h/DAh
B0h/D3h
B0h/D7h
B0h/E1h
B0h/D6h
E8h
S.M.A.R.T. Read Log Sector
S.M.A.R.T. Return Status
S.M.A.R.T. Save Attribute Values
S.M.A.R.T. Write Attribute Thresholds
S.M.A.R.T. Write Attribute Values
S.M.A.R.T. Write Log Sector
Write Buffer
Write DMA
CAh
Write DMA Extended
35h
Write DMA without Retries
Write Long with Retries
Write Long without Retries
Write Multiple
CBh
32h
33h
C5h
Write Multiple Extended
Write Sectors
39h
30h 31h
,
Write Sectors Extended
ATA-standard power-management commands
Check Power Mode
34h
E5h
E3h
E1h
E6h
E2h
E0h
Idle
Idle Immediate
Sleep
Standby
Standby Immediate
ATA-standard security commands
Security Set Password
F1h
F2h
F3h
F4h
F5h
F6h
Security Unlock
Security Erase Prepare
Security Erase Unit
Security Freeze Lock
Security Disable Password
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5.3.1
Identify Device command
The Identify Device command (command code EC ) transfers information about the drive to the host following
H
power up. The data is organized as a single 512-byte block of data, whose contents are shown in the table on
page 27. All reserved bits or words should be set to zero. Parameters listed with an “x” are drive-specific or
The following commands contain drive-specific features that may not be included in the Serial ATA specifica-
tion.
Word
Description
Value
0C5A
Configuration information:
• Bit 15: 0 = ATA; 1 = ATAPI
• Bit 7: removable media
• Bit 6: removable controller
• Bit 0: reserved
H
0
1
Number of logical cylinders
16,383
2
ATA-reserved
0000
16
H
3
Number of logical heads
4
Retired
0000
0000
H
5
Retired
H
6
Number of logical sectors per logical track: 63
Retired
003F
H
H
7–9
10–19
20
0000
Serial number: (20 ASCII characters, 0000 = none)
ASCII
H
Retired
Retired
Obsolete
0000
0400
0000
x.xx
H
H
H
21
22
23–26
Firmware revision (8 ASCII character string, padded with
blanks to end of string)
27–46
47
Drive model number: (40 ASCII characters, padded with
blanks to end of string)
ST750LX003
ST500LX003
(Bits 7–0) Maximum sectors per interrupt on Read multiple
and Write multiple (16)
8010
H
48
49
Reserved
0000
H
Standard Standby timer, IORDY supported and may be
disabled
2F00
H
50
ATA-reserved
0000
0200
0200
0007
H
H
H
H
51
PIO data-transfer cycle timing mode
Retired
52
53
Words 54–58, 64–70 and 88 are valid
Number of current logical cylinders
Number of current logical heads
Number of current logical sectors per logical track
Current capacity in sectors
54
xxxx
xxxx
xxxx
xxxx
xxxx
H
55
H
H
H
H
56
57–58
59
Number of sectors transferred during a Read Multiple or
Write Multiple command
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Word
Description
Value
60–61
Total number of user-addressable sectors
ST750LX003 = 0FFFFFFFh
ST500LX003 = 0FFFFFFFh
This field contains a value that is one greater than the total
number of user-addressable sectors. The maximum value
that shall be placed in this field is 0FFFFFFFh. The
0FFFFFFFh value applies to all capacities over 137GB
62
63
Retired
0000
H
Multiword DMA active and modes supported
(see note following this table)
xx07
H
64
65
Advanced PIO modes supported (modes 3 and 4 supported)
0003
0078
H
Minimum multiword DMA transfer cycle time per word
(120 ns)
H
66
Recommended multiword DMA transfer cycle time per word
(120 ns)
0078
H
67
68
69–74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
Minimum PIO cycle time without IORDY flow control (240 ns)
Minimum PIO cycle time with IORDY flow control (120 ns)
ATA-reserved
00F0
H
H
H
H
H
H
H
H
0078
0000
0000
0508
0000
0048
0040
Queue depth
Serial ATA capabilities
ATA-reserved
Serial ATA features supported
Serial ATA features enabled
Major version number
003E
H
H
Minor version number
0000
Command sets supported
Command sets supported
Command sets support extension
Command sets enabled
306B
H
H
H
H
4001
4000
30xx
Command sets enabled
0001
4000
H
H
H
Command sets enable extension
Ultra DMA support and current mode
(see note following this table)
xx7F
89
Security erase time
0000
0000
H
H
90
Enhanced security erase time
Master password revision code
Hardware reset value (see description following this table)
Auto acoustic management setting
ATA-reserved
92
FFFE
H
93
xxxx
xxxx
H
94
H
95–99
100–103
0000
H
Total number of user-addressable LBA sectors
These words are required for drives that support
the 48-bit addressing feature.
ST750LX003 = 1,465,149,168
ST500LX003 = 976,773,168
Maximum value: 0000FFFFFFFFFFFFh.
104–118
ATA-reserved
0000
H
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Word
Description
Value
119
Free Fall Protection support (bit 5)
1 = Free Fall Protection supported
0 = Free Fall Protection not supported
120
Free Fall Protection enable/disable (bit 5)
1 = Free Fall Protection feature is enabled
0 = Free Fall Protection feature is disabled
121–127
128
ATA-reserved
Security status
Seagate-reserved
ATA-reserved
Integrity word
0000
0001
H
H
129–159
160–254
255
xxxx
H
0000
xxA5
H
H
Note. See the bit descriptions below for words 63, 88, 93 and 94 of the Identify Drive data:
Description (if bit is set to 1)
Bit
0
Word 63
Multiword DMA mode 0 is supported.
Multiword DMA mode 1 is supported.
Multiword DMA mode 2 is supported.
Multiword DMA mode 0 is currently active.
Multiword DMA mode 1 is currently active.
Multiword DMA mode 2 is currently active.
Word 88
1
2
8
9
10
Bit
0
Ultra DMA mode 0 is supported.
Ultra DMA mode 1 is supported.
Ultra DMA mode 2 is supported.
Ultra DMA mode 3 is supported.
Ultra DMA mode 4 is supported.
Ultra DMA mode 5 is supported
Ultra DMA mode 6 is supported
Ultra DMA mode 0 is currently active.
Ultra DMA mode 1 is currently active.
Ultra DMA mode 2 is currently active.
Ultra DMA mode 3 is currently active.
Ultra DMA mode 4 is currently active.
Ultra DMA mode 5 is currently active.
Ultra DMA mode 6 is currently active.
Word 93
1
2
3
4
5
6
8
9
10
11
12
13
14
Bit
13
1 = 80-conductor cable detected, CBLID above VIH
0 = 40-conductor cable detected, CBLID below VIL
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5.3.2
Set Features command
This command controls the implementation of various features that the drive supports. When the drive receives
this command, it sets BSY, checks the contents of the Features register, clears BSY and generates an inter-
rupt. If the value in the register does not represent a feature that the drive supports, the command is aborted.
Power-on default has the read look-ahead and write caching features enabled. The acceptable values for the
Features register are defined as follows:
Table 8:
Set Features command values
02
03
Enable write cache (default).
H
H
Set transfer mode (based on value in Sector Count register).
Sector Count register values:
00 Set PIO mode to default (PIO mode 2).
H
01 Set PIO mode to default and disable IORDY (PIO mode 2).
H
08 PIO mode 0
H
09 PIO mode 1
H
0A PIO mode 2
H
0B PIO mode 3
H
0C PIO mode 4 (default)
H
20 Multiword DMA mode 0
H
21 Multiword DMA mode 1
H
22 Multiword DMA mode 2
H
40 Ultra DMA mode 0
H
41 Ultra DMA mode 1
H
42 Ultra DMA mode 2
H
43 Ultra DMA mode 3
H
44 Ultra DMA mode 4
H
45 Ultra DMA mode 5
H
46 Ultra DMA mode 6
H
55
82
Disable read look-ahead (read cache) feature.
Disable write cache
H
H
AA
Enable read look-ahead (read cache) feature (default).
Report full capacity available
H
F1
H
Note. At power-on, or after a hardware or software reset, the default values of the features are as indi-
cated above.
5.3.3
S.M.A.R.T. commands
S.M.A.R.T. provides near-term failure prediction for disc drives. When S.M.A.R.T. is enabled, the drive moni-
tors predetermined drive attributes that are susceptible to degradation over time. If self-monitoring determines
that a failure is likely, S.M.A.R.T. makes a status report available to the host. Not all failures are predictable.
S.M.A.R.T. predictability is limited to the attributes the drive can monitor. For more information on S.M.A.R.T.
commands and implementation, see the Draft ATA-8 Standard.
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SeaTools diagnostic software activates a built-in drive self-test (DST S.M.A.R.T. command for D4 ) that elimi-
H
nates unnecessary drive returns. The diagnostic software ships with all new drives and is also available at:
This drive is shipped with S.M.A.R.T. features disabled. You must have a recent BIOS or software package that
supports S.M.A.R.T. to enable this feature. The table below shows the S.M.A.R.T. command codes that the
drive uses.
Table 9:
S.M.A.R.T. commands
Code in features register
S.M.A.R.T. command
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
S.M.A.R.T. Read Data
H
H
H
H
H
H
H
H
H
H
Vendor-specific
S.M.A.R.T. Enable/Disable Attribute Autosave
S.M.A.R.T. Save Attribute Values
S.M.A.R.T. Execute Off-line Immediate (runs DST)
S.M.A.R.T. Read Log Sector
S.M.A.R.T. Write Log Sector
Vendor-specific
S.M.A.R.T. Enable Operations
S.M.A.R.T. Disable Operations
S.M.A.R.T. Return Status
DA
H
Note. If an appropriate code is not written to the Features Register, the command is aborted and 0x04
(abort) is written to the Error register.
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D
Index
density 4
Diagnostics 22
dimensions 19
Discs 4
dissipation 9
A
ACA 14
Address 22
AFR 13
Altitude 11
E
Electromagnetic Compatibility Directive (89/336/EEC)
Australia/New Zealand Standard AS/NZS3548 1995
ESD 17
EU 14
European Union Restriction of Hazardous Substanc-
es 15
B
bels 5
BPI 4
C
Cache 4
cache 7
capacity 6
certification 14
compatibility 14
connectors 18
F
features 2
G
Gbytes 6
geometry 7
gradient 5
current 4
cycles 13
Cylinders 7
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H
handling 17
heads 7
Height 4
height 7
humidity 5
O
I
Identify 22
P
IEC950 14
Interface 7
Power-on to Ready 8
interface 20
Interleave 7
ITE 14
Q
K
R
L
latency 4
Length 4
length 7
Load/Unload 13
M
master/slave 3
Microcode 22
mounting 19
N
noise 10
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Reliability 13
Standby to Ready 8
Start/stop times 8
static-discharge 17
resistance 10
Retries 22
RF 13
RPM 4
T
timers 11
RRL 14
S
TPI 4
S.M.A.R.T. 23
sector 6
U
sectors 6
Seek 22
V
Vibration 12
Shock 11
W
Warranty 13
Weight 4
weight 7
Width 4
width 7
Spinup 9
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Seagate Technology LLC
AMERICAS Seagate Technology LLC 10200 South De Anza Boulevard, Cupertino, California 95014, United States, 408-658-1000
ASIA/PACIFIC Seagate Singapore International Headquarters Pte. Ltd. 7000 Ang Mo Kio Avenue 5, Singapore 569877, 65-6485-3888
EUROPE, MIDDLE EAST AND AFRICA Seagate Technology SAS 16-18 rue du Dôme, 92100 Boulogne-Billancourt, France, 33 1-4186 10 00
Publication Number: 100665905, Rev. D
September 2011
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