Samsung Computer Hardware DDR3 User Guide

General Information  
DDR3 SDRAM  
DDR3 SDRAM Product Guide  
October 2009  
Memory Division  
October 2009  
Download from Www.Somanuals.com. All Manuals Search And Download.  
General Information  
DDR3 SDRAM  
2. DDR3 SDRAM Component Product Guide  
Package & Power,  
Density  
Banks  
Part Number  
Org.  
VDD Voltage  
PKG  
Avail.  
Note  
Temp. (-C/-L) & Speed  
K4B1G0446D  
K4B1G0846D  
HC(L)F7/F8/H9  
256M x 4  
128M x 8  
78 + 4 ball  
FBGA  
HC(L)F7/F8/H9  
1Gb D-die  
8Banks  
1.5V  
Now  
96 + 4 ball  
FBGA  
K4B1G1646D  
HC(L)F7/F8/H9  
64M x 16  
K4B1G0446E  
K4B1G0846E  
HC(L)F7/F8/H9/K0  
HC(L)F7/F8/H9/K0  
256M x 4  
128M x 8  
78 ball  
FBGA  
1.5V  
96 ball  
FBGA  
1Gb E-die  
1Gb F-die  
2Gb B-die  
2Gb C-die  
8Banks  
8Banks  
8Banks  
8Banks  
K4B1G1646E  
HC(L)F7/F8/H9/K0  
64M x 16  
Now  
Now  
Now  
Now  
K4B1G0446E  
K4B1G0846E  
K4B1G0446F  
K4B1G0846F  
K4B1G0446F  
K4B1G0846F  
K4B2G0446B  
K4B2G0846B  
HYF7/F8/H9/K0  
HYF7/F8/H9/K0  
HC(L)F8/H9  
256M x 4  
128M x 8  
256M x 4  
128M x 8  
256M x 4  
128M x 8  
512M x 4  
256M x 8  
78 ball  
FBGA  
1.35V  
1.5V  
HC(L)F8/H9  
78 ball  
FBGA  
HY(L)F8/H9  
1.35V  
HY(L)F8/H9  
HC(L)F7/F8/H9  
HC(L)F7/F8/H9  
78 ball  
FBGA  
1.5V  
96 ball  
FBGA  
K4B2G1646B  
HC(L)F7/F8/H9  
128M x 16  
K4B2G0446B  
K4B2G0846B  
K4B2G0446C  
K4B2G0846C  
K4B2G0446C  
K4B2G0846C  
K4B2G0446D  
K4B2G0846D  
K4B2G0446E  
K4B2G0846E  
K4B4G0446B  
K4B2G0846B  
HYF7/F8/H9  
512M x 4  
256M x 8  
512M x 4  
256M x 8  
512M x 4  
256M x 8  
512M x 4  
256M x 8  
512M x 4  
256M x 8  
1G x 4  
78 ball  
FBGA  
1.35V  
1.5V  
1.35V  
1.5V  
1.5V  
1.5V  
HYF7/F8/H9  
HC(L)F8/H9  
HC(L)F8/H9  
78 ball  
FBGA  
HY(L)F8/H9  
HY(L)F8/H9  
MC(L)F7/F8/H9  
MC(L)F7/F8/H9  
MC(L)F7/F8/H9  
MC(L)F7/F8/H9  
MC(L)F7/F8/H9  
MC(L)F7/F8/H9  
78 ball  
FBGA  
DDP 2Gb D-die  
DDP 2Gb E-die  
DDP 4Gb B-die  
8Banks  
8Banks  
8Banks  
Now  
Now  
Now  
78 ball  
FBGA  
78 ball  
FBGA  
512M x 8  
* Note : 1.35V product is 1.5V operatable.  
October 2009  
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General Information  
DDR3 SDRAM  
3. DDR3 SDRAM Module Ordering Information  
1
2
3
4
5
6
7
8
9
10  
11  
12  
M X X X B X X X X X X X - X X X  
Memory Module  
DIMM Type  
Data bits  
Speed  
Temp & Power  
PCB Revision  
DRAM Component Type  
Depth  
Package  
# of Banks in Comp. & Interface  
Bit Organization  
Component Revision  
1. Memory Module : M  
8. Component Revision  
:
:
:
:
:
:
:
M
B
D
1st Gen.  
3rd Gen.  
5th Gen.  
A
C
E
2nd Gen.  
4th Gen.  
6th Gen.  
8th Gen.  
2. DIMM Type  
F : 7th Gen.  
G
3 : DIMM  
4 : SODIMM  
9. Package  
:
:
:
:
Z
H
J
FBGA(Lead-free)  
FBGA(Lead-free & Halogen-free)  
FBGA(Lead-free, DDP)  
3. Data Bits  
71 : x64 204pin Unbuffered SODIMM  
78 : x64 240pin Unbuffered DIMM  
91 : x72 240pin ECC unbuffered DIMM  
92 : x72 240pin VLP Registered DIMM  
93 : x72 240pin Registered DIMM  
M
FBGA(Lead-free & Halogen-free, DDP)  
10. PCB Revision  
0 : None  
1 : 1st Rev.  
2 : 2nd Rev.  
4 : 4th Rev.  
3 : 3rd Rev.  
S : Reduced Layer  
4. DRAM Component Type  
B : DDR3 SDRAM (1.5V VDD)  
11. Temp & Power  
5. Depth  
C
Y
: Commercial Temp.( 0°C ~ 85°C) & Normal Power  
: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)  
32 : 32M  
64 : 64M  
28 : 128M  
56 : 256M  
51 : 512M  
1G : 1G  
2G : 2G  
33 : 32M (for 128Mb/512Mb)  
65 : 64M (for 128Mb/512Mb)  
29 : 128M (for 128Mb/512Mb)  
57 : 256M (for 512Mb/2Gb)  
52 : 512M (for 512Mb/2Gb)  
1K : 1G (for 2Gb)  
12. Speed  
F7 : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)  
2K : 2G (for 2Gb)  
F8 : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)  
H9: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)  
: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)  
K0  
6. # of Banks in comp. & Interface  
7 : 8Banks & SSTL-1.5V  
Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),  
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)  
7. Bit Organization  
0 : x 4  
3 : x 8  
4 : x16  
October 2009  
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General Information  
DDR3 SDRAM  
4. DDR3 SDRAM Module Product Guide  
4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)  
240Pin DDR3 Unbuffered DIMM  
Comp.  
Version  
Internal  
Banks  
Org.  
Density  
Part Number  
Speed  
Raw Card  
Composition  
Rank  
PKG  
Height  
Avail.  
Note  
78 + 4 ball  
FBGA  
M378B2873DZ1  
CF8/H9  
128M x 8  
*
8 pcs 1Gb D-die  
128Mx 64  
1GB  
A(1Rx8)  
8
8
1
30mm  
Now  
M378B2873EH1  
M378B2873FHS  
CF8/H9/K0  
CF8/H9  
128M x 8  
128M x 8  
*
*
8 pcs 1Gb E-die  
8 pcs 1Gb F-die  
78 ball  
FBGA  
78 + 4 ball  
FBGA  
M391B2873DZ1  
CF8/H9  
128M x 8  
*
9 pcs 1Gb D-die  
128Mx 72  
256Mx 64  
1GB  
2GB  
D(1Rx8)  
1
30mm  
30mm  
Now  
Now  
M391B2873EH1  
M391B2873FH0  
CF8/H9/K0  
CF8/H9/K0  
128M x 8  
128M x 8  
*
*
9 pcs 1Gb E-die  
9 pcs 1Gb F-die  
78 ball  
FBGA  
78 + 4 ball  
FBGA  
M378B5673DZ1  
CF8/H9  
128M x 8 * 16 pcs 1Gb D-die  
B(2Rx8)  
A(1Rx8)  
E(2Rx8)  
8
8
2
1
2
M378B5673EH1  
M378B5673FH0  
M378B5773CHS  
CF8/H9/K0  
CF8/H9/K0  
CF8/H9/K0  
128M x 8 * 16 pcs 1Gb E-die  
128M x 8 * 16 pcs 1Gb F-die  
78 ball  
FBGA  
256M x 8  
*
8 pcs 2Gb C-die  
78 + 4 ball  
FBGA  
M391B5673DZ1  
CF8/H9  
128M x 8 * 18 pcs 1Gb D-die  
M391B5673EH1  
M391B5673FH0  
M391B5773CH0  
M378B5273BH1  
M378B5273CH0  
M391B5273BH1  
M391B5273CH0  
CF8/H9/K0  
CF8/H9/K0  
CF8/H9/K0  
CF8/H9  
128M x 8 * 18 pcs 1Gb E-die  
128M x 8 * 18 pcs 1Gb F-die  
256Mx 72  
2GB  
8
30mm  
Now  
78 ball  
FBGA  
D(1Rx8)  
B(2Rx8)  
256M x 8  
*
9 pcs 2Gb C-die  
1
2
256M x 8 * 16 pcs 2Gb B-die  
256M x 8 * 16 pcs 2Gb C-die  
256M x 8 * 18 pcs 2Gb B-die  
256M x 8 * 18 pcs 2Gb C-die  
78 ball  
FBGA  
512Mx 64  
512Mx 72  
4GB  
4GB  
8
8
30mm  
30mm  
Now  
Now  
CF8/H9/K0  
CF8/H9  
78 ball  
FBGA  
E(2Rx8)  
2
CF8/H9/K0  
4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)  
240Pin DDR3 Unbuffered DIMM  
Comp.  
Version  
Internal  
Banks  
Org.  
Density  
Part Number  
Speed  
Raw Card  
Composition  
Rank  
PKG  
Height  
Avail.  
Note  
M391B2873EH1  
M391B2873FH0  
M391B5673EH1  
M391B5673FH0  
M391B5773CH0  
M391B5273BH1  
M391B5273CH0  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
128M x 8  
128M x 8  
*
*
9 pcs 1Gb E-die  
9 pcs 1Gb F-die  
78 ball  
FBGA  
128Mx 72  
1GB  
D(1Rx8)  
8
1
30mm  
Now  
128M x 8 * 18 pcs 1Gb E-die  
128M x 8 * 18 pcs 1Gb F-die  
E(2Rx8)  
D(1Rx8)  
E(2Rx8)  
8
8
8
2
1
2
78 ball  
FBGA  
256Mx 72  
512Mx 72  
2GB  
4GB  
30mm  
30mm  
Now  
Now  
256M x 8  
*
9 pcs 2Gb C-die  
256M x 8 * 18 pcs 2Gb B-die  
256M x 8 * 18 pcs 2Gb C-die  
78 ball  
FBGA  
* Note : 1.35V product is 1.5V operatable.  
October 2009  
Download from Www.Somanuals.com. All Manuals Search And Download.  
General Information  
DDR3 SDRAM  
4.3 204Pin DDR3 SoDIMM (1.5V Product)  
204Pin DDR3 SODIMM  
Composition  
Comp.  
Version  
Internal  
Banks  
Org.  
Density  
Part Number  
Speed  
Raw Card  
Rank  
PKG  
Height Avail.  
Note  
96 + 4 ball  
FBGA  
M471B2874DZ1  
CF8/H9  
A(2Rx16)  
64M x 16 * 8 pcs 1Gb D-die  
128M x 8 8 pcs 1Gb E-die  
8
2
78 ball  
FBGA  
M471B2873EH1  
M471B2874EH1  
M471B2873FHS  
CF8/H9  
CF8/H9  
CF8/H9  
B(1Rx8)  
A(2Rx16)  
B(1Rx8)  
*
8
8
8
1
2
1
128Mx 64  
1GB  
30mm  
Now  
64M x 16 * 8 pcs 1Gb E-die  
64M x 16 * 8 pcs 1Gb F-die  
96 ball  
78 ball  
FBGA  
78 + 4 ball  
FBGA  
M471B5673DZ1  
CF8/H9  
128M x 8 * 16 pcs 1Gb D-die  
F(2Rx8)  
8
2
M471B5673EH1  
M471B5673FH0  
M471B5773CHS  
M471B5273BH1  
M471B5273CH0  
CF8/H9  
CF8/H9  
CF8/H9  
CF8/H9  
CF8/H9  
128M x 8 * 16 pcs 1Gb E-die  
128M x 8 * 16 pcs 1Gb F-die  
256Mx 64  
512Mx 64  
2GB  
4GB  
30mm  
30mm  
Now  
Now  
78 ball  
FBGA  
B(1Rx8)  
F(2Rx8)  
256M x 8  
*
8 pcs 2Gb C-die  
8
8
1
2
256M x 8 * 16 pcs 2Gb B-die  
256M x 8 * 16 pcs 2Gb C-die  
78 ball  
FBGA  
4.4 204Pin DDR3 SoDIMM (1.35V Product)  
204Pin DDR3 SODIMM  
Comp.  
Composition  
Internal  
Banks  
Org.  
Density  
Part Number  
Speed  
Raw Card  
Rank  
PKG  
Height  
Avail.  
Note  
Version  
78 ball  
FBGA  
M471B2873EH1  
M471B2874EH1  
M471B2873FHS  
YF8/H9  
YF8/H9  
YF8/H9  
B(1Rx8)  
A(1Rx16)  
B(1Rx8)  
128M x 8  
64M x 16 * 8 pcs 1Gb E-die  
128M x 8 8 pcs 1Gb F-die  
*
8 pcs 1Gb E-die  
8
8
8
1
2
1
128Mx 64  
1GB  
96 ball  
30mm  
Now  
78 ball  
FBGA  
*
M471B5673EH1  
M471B5673FH0  
M471B5773CHS  
M471B5273BH1  
M471B5273CH0  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
128M x 8 * 16 pcs 1Gb E-die  
128M x 8 * 16 pcs 1Gb F-die  
F(2Rx8)  
B(1Rx8)  
F(2Rx8)  
8
8
8
2
1
2
78 ball  
FBGA  
256Mx 64  
512Mx 64  
2GB  
4GB  
30mm  
30mm  
Now  
Now  
256M x 8  
*
8 pcs 2Gb C-die  
256M x 8 * 16 pcs 2Gb B-die  
256M x 8 * 16 pcs 2Gb C-die  
78 ball  
FBGA  
* Note : 1.35V product is 1.5V operatable.  
October 2009  
Download from Www.Somanuals.com. All Manuals Search And Download.  
General Information  
DDR3 SDRAM  
4.5 240Pin DDR3 Registered DIMM (1.5V Product)  
240Pin DDR3 Registered DIMM  
Comp.  
Version  
Internal  
Banks  
Org.  
Density  
Part Number  
Speed  
Raw Card  
Composition  
Rank  
PKG  
Height Avail.  
Note  
78 + 4 ball  
FBGA  
M393B2873DZ1  
CF8/H9  
128M x 8  
*
9 pcs  
1Gb D-die  
128Mx 72  
1GB  
A(1Rx8)  
8
1
30mm  
Now  
M393B2873EH1  
M393B2873FH0  
CF8/H9  
CF8/H9  
128M x 8  
128M x 8  
*
*
9 pcs  
9 pcs  
1Gb E-die  
1Gb F-die  
78 ball  
FBGA  
78 + 4 ball  
FBGA  
M393B5673DZ1  
CF8/H9  
128M x 8  
*
18 pcs 1Gb D-die  
2
2
1
1
4
4
2
2
B(2Rx8)  
C(1Rx4)  
H(4Rx8)  
E(2Rx4)  
M393B5673EH1  
M393B5673FH0  
CF8/H9  
CF8/H9  
128M x 8  
128M x 8  
*
*
18 pcs 1Gb E-die  
18 pcs 1Gb F-die  
78 ball  
FBGA  
256Mx 72  
2GB  
8
30mm  
Now  
78 + 4 ball  
FBGA  
M393B5670DZ1  
CF8/H9  
256M x 4  
*
18 pcs 1Gb D-die  
M393B5670EH1  
M393B5670FH0  
CF8/H9  
CF8/H9  
256M x 4  
256M x 4  
*
*
18 pcs 1Gb E-die  
18 pcs 1Gb F-die  
78 ball  
FBGA  
78 + 4 ball  
FBGA  
M393B5173DZ1  
CF7/F8  
128M x 8  
*
36 pcs 1Gb D-die  
M393B5173EH1  
M393B5173FH0  
CF7/F8  
CF7/F8  
128M x 8  
128M x 8  
*
*
36 pcs 1Gb E-die  
36 pcs 1Gb F-die  
78 ball  
FBGA  
78 + 4 ball  
FBGA  
M393B5170DZ1  
CF8/H9  
256M x 4  
*
36 pcs 1Gb D-die  
512Mx 72  
4GB  
8
30mm  
Now  
M393B5170EH1  
M393B5170FH0  
M393B5273BH1  
M393B5273CH0  
M393B5270BH1  
M393B5270CH0  
CF8/H9  
CF8/H9  
CF8/H9  
CF8/H9  
CF8/H9  
CF8/H9  
256M x 4  
256M x 4  
256M x 8  
256M x 8  
512M x 4  
512M x 4  
*
*
*
*
*
*
36 pcs 1Gb E-die  
36 pcs 1Gb F-die  
18 pcs 2Gb B-die  
18 pcs 2Gb C-die  
18 pcs 2Gb B-die  
18 pcs 2Gb C-die  
78 ball  
FBGA  
B(2Rx8)  
C(1Rx4)  
2
1
DDP  
x 4  
M393B1G70DJ1  
M393B1G70EM1  
CF7/F8  
CF7/F8  
*
*
36 pcs 1Gb D-die  
36 pcs 1Gb E-die  
512M  
F(4Rx4)  
4
DDP  
x 4  
512M  
78 ball  
FBGA  
1Gx 72  
8GB  
8
8
30mm  
30mm  
Now  
Now  
M393B1K73BH1  
M393B1K73CH0  
M393B1K70BH1  
M393B1K70CH0  
CF7/F8  
CF7/F8  
CF8/H9  
CF8/H9  
256M x 8  
256M x 8  
512M x 4  
512M x 4  
*
*
*
*
36 pcs 2Gb B-die  
36 pcs 2Gb C-die  
36 pcs 2Gb B-die  
36 pcs 2Gb C-die  
H(4Rx8)  
E(2Rx4)  
4
2
DDP  
x 4  
M393B2K70BM1  
M393B2K70CM0  
CF7/F8  
CF7/F8  
*
*
36 pcs 2Gb B-die  
36 pcs 2Gb C-die  
1G  
78 ball  
FBGA  
2Gx 72  
16GB  
F(4Rx4)  
4
DDP  
x 4  
1G  
October 2009  
Download from Www.Somanuals.com. All Manuals Search And Download.  
General Information  
DDR3 SDRAM  
4.6 240Pin DDR3 Registered DIMM (1.35V Product)  
240Pin DDR3 Registered DIMM  
Comp.  
Version  
Internal  
Banks  
Org.  
Density  
Part Number  
Speed  
Raw Card  
Composition  
Rank  
PKG  
Height Avail.  
Note  
M393B2873EH1  
M393B2873FH0  
M393B5673EH1  
M393B5673FH0  
M393B5670EH1  
M393B5670FH0  
M393B5773CH0  
M393B5173EH1  
M393B5173FH0  
M393B5170EH1  
M393B5170FH0  
M393B5273BH1  
M393B5273CH0  
M393B5270BH1  
M393B5270CH0  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF7/F8  
YF7/F8  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
128M x 8  
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
9 pcs  
1Gb E-die  
1Gb F-die  
1Gb E-die  
1Gb F-die  
1Gb E-die  
1Gb F-die  
2Gb C-die  
1Gb E-die  
1Gb F-die  
1Gb E-die  
1Gb F-die  
2Gb B-die  
2Gb C-die  
2Gb B-die  
2Gb C-die  
78 ball  
FBGA  
128Mx 72  
1GB  
A(1Rx8)  
8
8
1
30mm  
Now  
128M x 8  
128M x 8  
128M x 8  
256M x 4  
256M x 4  
512M x 4  
128M x 8  
128M x 8  
256M x 4  
256M x 4  
256M x 8  
256M x 8  
512M x 4  
512M x 4  
9 pcs  
18 pcs  
18 pcs  
18 pcs  
18 pcs  
9 pcs  
B(2Rx8)  
2
1
78 ball  
FBGA  
256Mx 72  
2GB  
30mm  
Now  
C(1Rx4)  
A(1Rx8)  
H(4Rx8)  
8
36 pcs  
36 pcs  
36 pcs  
36 pcs  
18 pcs  
18 pcs  
18 pcs  
18 pcs  
8
8
8
8
4
2
2
1
E(2Rx4)  
B(2Rx8)  
C(1Rx4)  
78 ball  
FBGA  
512Mx 72  
4GB  
30mm  
Now  
DDP  
x 4  
M393B1G70EM1  
M393B1G70FM0  
YF7/F8  
YF7/F8  
*
*
36 pcs  
36 pcs  
1Gb E-die  
1Gb F-die  
Now  
512M  
F(4Rx4)  
8
4
DDP  
x 4  
Nov. ’09  
512M  
78 ball  
FBGA  
1Gx 72  
8GB  
30mm  
30mm  
M393B1K73BH1  
M393B1K73CH0  
M393B1K70BH1  
M393B1K70CH0  
YF7/F8  
YF7/F8  
YF8/H9  
YF8/H9  
256M x 8  
256M x 8  
512M x 4  
512M x 4  
*
*
*
*
36 pcs  
36 pcs  
36 pcs  
36 pcs  
2Gb B-die  
2Gb C-die  
2Gb B-die  
2Gb C-die  
H(4Rx8)  
E(2Rx4)  
8
8
4
2
Now  
DDP  
x 4  
M393B2K70BM1  
M393B2K70CM0  
YF7/F8  
YF7/F8  
*
*
36 pcs  
36 pcs  
2Gb B-die  
2Gb C-die  
Now  
1G  
78 ball  
FBGA  
2Gx 72  
16GB  
F(4Rx4)  
8
4
DDP  
x 4  
Nov. ’09  
1G  
* Note : 1.35V product is 1.5V operatable.  
October 2009  
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General Information  
DDR3 SDRAM  
4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)  
240Pin DDR3 VLP Registered DIMM  
Comp.  
Version  
Internal  
Banks  
Org.  
Density  
Part Number  
Speed  
Raw Card  
Composition  
Rank  
PKG  
Height  
Avail. Note  
78 + 4 ball  
FBGA  
M392B2873DZ1  
CF8/H9  
128M x 8  
*
9 pcs  
1Gb D-die  
128Mx 72  
1GB  
K(1Rx8)  
8
1
18.75mm  
Now  
M392B2873EH1  
M392B2873FH0  
CF8/H9  
CF8/H9  
128M x 8  
128M x 8  
*
*
9 pcs  
9 pcs  
1Gb E-die  
1Gb F-die  
78 ball  
FBGA  
78 + 4 ball  
FBGA  
M392B5673DZ1  
CF8/H9  
128M x 8  
*
18 pcs  
1Gb D-die  
L(2Rx8)  
2
M392B5673EH1  
M392B5673FH0  
CF8/H9  
CF8/H9  
128M x 8  
128M x 8  
*
*
18 pcs  
18 pcs  
1Gb E-die  
1Gb F-die  
78 ball  
FBGA  
78 + 4 ball  
FBGA  
256Mx 72  
2GB  
M392B5670DZ1  
CF8/H9  
256M x 4  
*
18 pcs  
1Gb D-die  
8
18.75mm  
Now  
M(1Rx4)  
K(1Rx8)  
1
1
M392B5670EH1  
M392B5670FH0  
CF8/H9  
CF8/H9  
256M x 4  
256M x 4  
*
*
18 pcs  
18 pcs  
1Gb E-die  
1Gb F-die  
78 ball  
FBGA  
78 ball  
FBGA  
M392B5773CH0  
M392B5170DJ1  
M392B5170EM1  
M392B5170FM0  
M392B5173FM0  
CF8/H9  
CF8/H9  
CF8/H9  
CF8/H9  
CF7/F8  
128M x 8  
*
*
*
*
*
9 pcs  
18 pcs  
18 pcs  
18 pcs  
18 pcs  
1Gb F-die  
1Gb D-die  
1Gb E-die  
1Gb F-die  
1Gb F-die  
DDP  
x 4  
512M  
Now  
DDP  
x 4  
N(2Rx4)  
2
512M  
DDP  
x 4  
512M  
Dec. ’09  
78 ball  
FBGA  
512Mx 72  
4GB  
8
18.75mm  
DDP  
x 8  
V(4Rx8)  
L(2Rx8)  
4
2
256M  
M392B5273BH1  
M392B5273CH0  
M392B5270BH1  
M392B5270CH0  
CF8/H9  
CF8/H9  
CF8/H9  
CF8/H9  
256M x 8  
256M x 8  
512M x 4  
512M x 4  
*
*
*
*
18 pcs  
18 pcs  
18 pcs  
18 pcs  
2Gb B-die  
2Gb C-die  
2Gb B-die  
2Gb C-die  
Now  
Now  
M(1Rx4)  
V(4Rx8)  
1
4
DDP  
x 8  
M392B1K73BM1  
M392B1K73CM0  
M392B1K70BM1  
M392B1K70CM0  
CF7/F8  
CF7/F8  
CF8/H9  
CF8/H9  
*
*
*
*
18 pcs  
18 pcs  
18 pcs  
18 pcs  
2Gb B-die  
2Gb C-die  
2Gb B-die  
2Gb C-die  
512M  
DDP  
x 8  
512M  
78 ball  
FBGA  
1Gx 72  
8GB  
8
18.75mm  
DDP  
x 4  
1G  
N(2Rx4)  
2
DDP  
x 4  
1G  
October 2009  
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General Information  
DDR3 SDRAM  
4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)  
240Pin DDR3 VLP Registered DIMM  
Comp.  
Version  
Internal  
Banks  
Org.  
Density  
Part Number  
Speed  
Raw Card  
Composition  
Rank  
PKG  
Height  
Avail.  
Note  
M392B2873EH1  
M392B2873FH0  
M392B5673EH1  
M392B5673FH0  
M392B5670EH1  
M392B5670FH0  
M392B5773CH0  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
128M x 8  
128M x 8  
*
*
9 pcs  
9 pcs  
1Gb  
1Gb  
E-die  
F-die  
E-die  
F-die  
E-die  
F-die  
C-die  
78 ball  
FBGA  
128Mx 72  
1GB  
K(1Rx8)  
8
8
1
18.75mm  
Now  
128M x 8 * 18 pcs 1Gb  
128M x 8 * 18 pcs 1Gb  
256M x 4 * 18 pcs 1Gb  
256M x 4 * 18 pcs 1Gb  
L(2Rx8)  
M(1Rx4)  
2
1
78 ball  
FBGA  
256Mx 72  
2GB  
18.75mm  
Now  
8
K(1Rx8)  
N(2Rx4)  
512M x 4  
*
9 pcs  
2Gb  
DDP  
512M  
M392B5170EM1  
YF8/H9  
x 4 * 18 pcs 1Gb  
E-die  
8
8
2
4
Now  
M392B5173FM0  
M392B5170FM0  
M392B5273BH1  
M392B5273CH0  
M392B5270BH1  
M392B5270CH0  
YF7/F8  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
YF8/H9  
V(4Rx8)  
N(2Rx4)  
256M x 8 * 18 pcs 1Gb  
512M x 4 * 18 pcs 1Gb  
256M x 8 * 18 pcs 2Gb  
256M x 8 * 18 pcs 2Gb  
512M x 4 * 18 pcs 2Gb  
512M x 4 * 18 pcs 2Gb  
F-die  
F-die  
B-die  
C-die  
B-die  
C-die  
Dec. ’09  
78 ball  
FBGA  
512Mx 72  
4GB  
18.75mm  
8
8
2
1
L(2Rx8)  
M(1Rx4)  
Now  
DDP  
M392B1K73BM1  
M392B1K73CM0  
M392B1K70BM1  
M392B1K70CM0  
YF7/F8  
YF7/F8  
YF8/H9  
YF8/H9  
x 8 * 18 pcs 2Gb  
512M  
B-die  
C-die  
B-die  
C-die  
Now  
Nov. ’09  
Now  
V(4Rx8)  
N(2Rx4)  
8
8
4
2
DDP  
x 8 * 18 pcs 2Gb  
512M  
78 ball  
FBGA  
1Gx 72  
8GB  
18.75mm  
DDP  
x 4 * 18 pcs 2Gb  
1G  
DDP  
x 4 * 18 pcs 2Gb  
1G  
Nov. ’09  
* Note : 1.35V product is 1.5V operatable.  
October 2009  
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General Information  
DDR3 SDRAM  
5. RDIMM RCD Information  
5.1 RCD Identification in JEDEC Description in Module Label  
5.2 Label Example  
4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0  
0920  
M393B5170EH1-CH9  
Made in Korea  
5.3 RCD Information  
- Example  
Voltage  
Vendor  
Inphi  
Revision  
GS04 B2  
Module P/N  
JEDEC Description On Label  
4GB 2Rx4 PC3-10600R-09-10-E1-P0  
M393B5170EH1-CH9  
M393B5170EH1-CH9  
M393B5170EH1-YF8  
M393B5170EH1-YF8  
1.5V  
IDT  
Inphi  
IDT  
LV DDR3 B0  
LV GS02 C0  
LV DDR3 B0  
4GB 2Rx4 PC3-10600R-09-10-E1-D2  
4GB 2Rx4 PC3L-8500R-07-10-E1-P1  
4GB 2Rx4 PC3L-8500R-07-10-E1-D2  
1.35V  
October 2009  
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General Information  
DDR3 SDRAM  
78 + 4Ball FBGA for 1Gb D-die (x4/x8)  
9.00 ± 0.10  
A
0.80 x 10 = 8.00  
#A1 INDEX MARK  
B
(Datum A)  
(Datum B)  
0.80 1.60  
11 10 9  
4.00  
9.00 ± 0.10  
#A1  
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05  
(0.95)  
82 - 0.45 Solder ball  
(Post Reflow 0.05 ± 0.05)  
MOLDING AREA  
1.10 ± 0.10  
(1.90)  
0.2  
M
A B  
Top  
Bottom  
: Support Ball  
96 + 4Ball FBGA for 1Gb D-die (x16)  
9.00 ± 0.10  
A
0.80 x 10 = 8.00  
#A1 INDEX MARK  
B
0.80 1.60  
11 10 9  
4.00  
9.00 ± 0.10  
#A1  
8
7
6
5
4
3
2
1
A
B
C
D
E
F
(Datum A)  
(Datum B)  
G
H
J
K
L
M
N
P
R
T
0.35 ± 0.05  
(0.95)  
100 - 0.45 Solder ball  
(Post Reflow 0.05 ± 0.05)  
MOLDING AREA  
1.10 ± 0.10  
(1.90)  
0.2  
M
A B  
Top  
Bottom  
: Support Ball  
October 2009  
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General Information  
DDR3 SDRAM  
78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)  
7.50 ± 0.10  
A
0.80 x 8 = 6.40  
#A1 INDEX MARK  
(Datum A)  
(Datum B)  
0.80 1.60  
3.20  
7.50 ± 0.10  
#A1  
B
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05  
(0.95)  
78 - 0.45 Solder ball  
(Post Reflow 0.05 ± 0.05)  
0.2 A B  
MOLDING AREA  
1.10 ± 0.10  
(1.90)  
M
Top  
Bottom  
96Ball FBGA for 1Gb E-die (x16)  
7.50 ± 0.10  
A
0.80 x 8 = 6.40  
#A1 INDEX MARK  
0.80 1.60  
3.20  
7.50 ± 0.10  
#A1  
B
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
(Datum A)  
(Datum B)  
G
H
J
K
L
M
N
P
R
T
0.35 ± 0.05  
(0.95)  
96 - 0.45 Solder ball  
(Post Reflow 0.05 ± 0.05)  
0.2 A B  
MOLDING AREA  
1.10 ± 0.10  
(1.90)  
M
Top  
Bottom  
October 2009  
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General Information  
DDR3 SDRAM  
78Ball FBGA for 2Gb B-die (x4/x8)  
9.00 ± 0.10  
A
#A1 INDEX MARK  
B
(Datum A)  
(Datum B)  
0.80 1.60  
3.20  
9.00 ± 0.10  
#A1  
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05  
(0.95)  
78 - 0.45 Solder ball  
(Post Reflow 0.50 ± 0.05)  
0.2 A B  
MOLDING AREA  
1.10 ± 0.10  
(1.90)  
M
TOP VIEW  
BOTTOM VIEW  
96Ball FBGA for 2Gb B-die (x16)  
9.00 ± 0.10  
A
#A1 INDEX MARK  
0.80 1.60  
3.20  
9.00 ± 0.10  
#A1  
B
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
(Datum A)  
(Datum B)  
G
H
J
K
L
M
N
P
R
T
0.35 ± 0.05  
(0.95)  
96 - 0.45 Solder ball  
(Post Reflow 0.50 ± 0.05)  
0.2 A B  
MOLDING AREA  
1.10 ± 0.10  
(1.90)  
M
TOP VIEW  
BOTTOM VIEW  
October 2009  
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General Information  
DDR3 SDRAM  
78Ball DDP for 1Gb D-die (x4)  
10.50 ± 0.10  
A
0.80 x 8 = 6.40  
#A1 INDEX MARK  
B
(Datum A)  
(Datum B)  
0.80 1.60  
4.00  
10.50 ± 0.10  
#A1  
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05  
82 - 0.45 Solder ball  
(Post Reflow 0.50 ± 0.05)  
0.2 A B  
1.40 ± 0.10  
M
Top  
Bottom  
78Ball DDP for 1Gb E-die (x4/x8)  
9.00 ± 0.10  
A
0.80 x 8 = 6.40  
#A1 INDEX MARK  
B
(Datum A)  
(Datum B)  
0.80 1.60  
3.20  
3
9.00 ± 0.10  
#A1  
9
8
7
6
5
4
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05  
78 - 0.45 Solder ball  
(Post Reflow 0.50 ± 0.05)  
0.2 A B  
1.40 ± 0.10  
M
Top  
Bottom  
October 2009  
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General Information  
DDR3 SDRAM  
78Ball DDP for 2Gb B-die (x4/x8)  
10.00 ± 0.10  
A
0.80 x 8 = 6.40  
#A1 INDEX MARK  
B
(Datum A)  
(Datum B)  
0.80 1.60  
3.20  
10.00 ± 0.10  
#A1  
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05  
78 - 0.45 Solder ball  
(Post Reflow 0.50 ± 0.05)  
0.2 A B  
1.40 ± 0.10  
M
Top  
Bottom  
October 2009  
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General Information  
DDR3 SDRAM  
x64/x72 240pin DDR3 SDRAM Unbuffered DIMM  
Units : Millimeters  
133.35 ± 0.15  
128.95  
N/A  
(for x64)  
SPD  
ECC  
(for x72)  
(2)  
2.50  
54.675  
A
B
Max 4.0  
47.00  
71.00  
N/A  
(for x64)  
ECC  
(for x72)  
1.270 ± 0.10  
5.00  
2x 2.10 ± 0.15  
0.80 ± 0.05  
0.2 ± 0.15  
3.80  
1.50±0.10  
1.00  
2.50  
Detail A  
Detail B  
October 2009  
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General Information  
DDR3 SDRAM  
x64 204pin DDR3 SDRAM Unbuffered SODIMM  
Units : Millimeters  
0.10 M C A B  
67.60  
63.60  
Max 3.8  
1.00 ± 0.10  
24.80  
21.00  
A
B
39.00  
2X 1.80  
0.10 M C A B  
(OPTIONAL HOLES)  
2X 4.00 ± 0.10  
0.10 M C A B  
0.60  
0.45 ± 0.03  
1.65  
4.00 ± 0.10  
2.55  
0.25 MAX  
1.00 ± 0.10  
Detail A  
Detail B  
October 2009  
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General Information  
DDR3 SDRAM  
x72 240pin DDR3 SDRAM Registered DIMM  
Units : Millimeters  
Max 4.0  
133.35 ± 0.15  
128.95  
C
9.76 10.9 18.92  
32.40  
18.93  
9.74  
2.50  
1.0 max  
54.675  
47.00  
A
B
1.27 ± 0.10  
71.00  
5.00  
0.80 ± 0.05  
3.80  
0.2 ± 0.15  
10.9  
0.4  
2.50  
1.00  
1.50±0.10  
Detail A  
Detail B  
Detail C  
2x 2.10 ± 0.15  
Address, Command and Control lines  
October 2009  
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General Information  
DDR3 SDRAM  
Registered DIMM Heat Spreader Design  
1. FRONT PART  
Outside  
133.15 ± 0.2  
0.65 ± 0.2  
130.45 ± 0.15  
9.26  
29.77  
11.9  
31.4  
0.15  
1.3  
1
127 ± 0.12  
1.3  
Inside  
Green Line : TIM Attatch Line  
Reg. pedestal line  
80.78  
119.29  
128.5  
2. BACK PART  
Outside  
Inside  
Green Line : TIM Attatch Line  
October 2009  
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General Information  
DDR3 SDRAM  
3. CLIP PART  
39.3 ± 0.2  
Upper Bending  
Tilting Gap  
29.77  
0.1 ~ 0.3  
A
B
C
0.5  
4. DDR3 RDIMM ASS’Y View  
Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)  
132.95 ± 133.45  
39.3 ± 0.2  
D
K
E (Clip open size)  
text mark ’B’ or ’K’  
punch press_stamp  
* Dimension Index  
Mono  
Typ.  
43.9  
6.8  
DDP  
Typ.  
44.4  
7.3  
6.3  
7.3  
-
Note  
Min.  
-
Max.  
-
Min.  
-
Max.  
-
A
B
6.7  
-
6.9  
-
7.2  
-
7.4  
-
C
5.8  
D
6.7  
2.5  
6.8  
6.9  
3.6  
7.2  
2.6  
7.4  
3.8  
E (Clip open size)  
-
October 2009  
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