Philips Switch ISP1122 User Manual

ISP1122

Universal Serial Bus stand-alone hub

Rev. 03 — 29 March 2000

Product speciﬁcation

1. General description

The ISP1122 is a stand-alone Universal Serial Bus (USB) hub device which complies

with USB Speciﬁcation Rev. 1.1. It integrates a Serial Interface Engine (SIE), hub

repeater, hub controller, USB data transceivers and a 3.3 V voltage regulator. It has a

conﬁgurable number of downstream ports, ranging from 2 to 5.

The ISP1122 can be bus-powered, self-powered or hybrid-powered. When it is

hybrid-powered the hub functions are powered by the upstream power supply (V_BUS),

but the downstream ports are powered by an external 5 Volt supply. The low power

consumption in ‘suspend’ mode allows easy design of equipment that is compliant

with the ACPI™, OnNow™ and USB power management requirements.

The ISP1122 has built-in overcurrent sense inputs, supporting individual and global

overcurrent protection for downstream ports. All ports (including the hub) have

GoodLink™ indicator outputs for easy visual monitoring of USB trafﬁc. The ISP1122

has a serial I²C-bus interface for external EEPROM access and a reduced frequency

(6 MHz) crystal oscillator. These features allow signiﬁcant cost savings in system

design and easy implementation of advanced USB functionality into PC peripherals.

2. Features

■ High performance USB hub device with integrated hub repeater, hub controller,

Serial Interface Engine (SIE), data transceivers and 3.3 V voltage regulator

■ Complies with Universal Serial Bus Speciﬁcation Rev. 1.1 and ACPI, OnNow and

USB power management requirements

■ Conﬁgurable from 2 to 5 downstream ports with automatic speed detection

■ Internal power-on reset and low voltage reset circuit

■ Supports bus-powered, hybrid-powered and self-powered application

■ Individual or ganged power switching for downstream ports

■ Individual or global port overcurrent protection with built-in sense circuits

■ 6 MHz crystal oscillator with on-chip PLL for low EMI

■ Visual USB trafﬁc monitoring (GoodLink™) for hub and downstream ports

■ I²C-bus interface to read vendor ID, product ID and conﬁguration bits from

external EEPROM

■ Operation over the extended USB bus voltage range (4.0 to 5.5 V)

■ Operating temperature range −40 to +85 °C

■ 8 kV in-circuit ESD protection for lower cost of external components

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USB stand-alone hub

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5. Pinning information

5.1 ISP1122D (SO32) and ISP1122NB (SDIP32)

5.1.1 Pinning

handbook, halfpage

reg(3.3)

PSW1/GL1

DP2

PSW1/GL1

DP2

PSW2/GL2

GND

PSW2/GL2

GND

DM2

DM3

DP0

DM3

DP0

DP3

DM0

DP3

DM0

DP1

DM1

OC1

OC2

OC1

OC2

DP5

ISP1122D

ISP1122NB

DM5

OC3

INDV/SDA

OPTION/SCL

INDV/SDA

OPTION/SCL

OC4

OC5/GOC

DM4

OC5/GOC

DM4

RESET

XTAL2

XTAL1

RESET

XTAL2

XTAL1

DP4

SP/BP

HUBGL

SP/BP

HUBGL

PSW5/GL5/GPSW

PSW4/GL4

PSW5/GL5/GPSW

PSW4/GL4

PSW3/GL3

MGR772

MGR773

Fig 2. Pin conﬁguration SO32.

Fig 3. Pin conﬁguration SDIP32.

5.1.2 Pin description

Table 2: Pin description for SO32 and SDIP32

Symbol^[1]

Type Description

[2]

V_reg(3.3)

regulated supply voltage (3.3 V ± 10%) from internal

regulator; used to connect pull-up resistor on DP0 line

PSW2/GL2^[3]

modes 4 to 6: power switch control output for downstream

port 2 (open-drain, 6 mA)

modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 2 (open-drain, 6 mA); to connect an LED

use a 330 Ω series resistor

GND

DM3

DP3

V_CC

ground supply

AI/O downstream port 3 D− connection (analog) ^[4]

AI/O downstream port 3 D+ connection (analog) ^[4]

supply voltage; connect to USB supply V_BUS(bus-powered or

hybrid-powered) or to local supply V_DD(self-powered)

OC1

AI/I

overcurrent sense input for downstream port 1 (analog^[5]

)

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Table 2: Pin description for SO32 and SDIP32…continued

Symbol^[1]

Type Description

OC2

AI/I

overcurrent sense input for downstream port 2 (analog^[5]

overcurrent sense input for downstream port 3 (analog^[5]

overcurrent sense input for downstream port 4 (analog^[5]

)

OC3

OC4

OC5/GOC^[3]

modes 5, 7: overcurrent sense input for downstream port 5

(analog^[5]

modes 0, 1, 3: global overcurrent sense input (analog^[5]

)

DM4

AI/O downstream port 4 D− connection (analog)^[4]

AI/O downstream port 4 D+ connection (analog) ^[4]

DP4

SP/BP

selects power mode:

self-powered: connect to V_DD(local power supply); also use

this mode for hybrid-powered operation

bus-powered: connect to GND; disable downstream port 5 to

meet supply current requirements^[4]

HUBGL

hub GoodLink LED indicator output (open-drain, 6 mA);

to connect an LED use a 330 Ω series resistor; if unused

connect to V_CCvia a 10 kΩ resistor

PSW3/GL3^[3]16

modes 4 to 6: power switch control output for downstream

port 3 (open-drain, 6 mA)

modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 3 (open-drain, 6 mA); to connect an LED

use a 330 Ω series resistor

PSW4/GL4^[3]17

modes 4 to 6: power switch control output for downstream

port 4 (open-drain, 6 mA)

modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 4 (open-drain, 6 mA); to connect an LED

use a 330 Ω series resistor

PSW5/GL5/

GPSW^[3]

mode 5: power switch control output for downstream port 5

(open-drain, 6 mA)

modes 3, 7: GoodLink LED indicator output for downstream

port 5 (open-drain, 6 mA); to connect an LED use a 330 Ω

series resistor

modes 0 to 2: gang mode power switch control output

(open-drain, 6 mA)

XTAL1

crystal oscillator input (6 MHz)

crystal oscillator output (6 MHz)

XTAL2

RESET^[2]

reset input (Schmitt trigger); a LOW level produces an

asynchronous reset; connect to V_CCfor power-on reset

(internal POR circuit)

OPTION/SCL 22

I/O

mode selection input; also functions as I²C-bus clock output

(open-drain, 6 mA)

INDV/SDA

selects individual (HIGH) or global (LOW) power switching

and overcurrent detection; also functions as bidirectional

I²C-bus data line (open-drain, 6 mA)

DM5

DP5

DM1

AI/O downstream port 5 D− connection (analog)^[4]

AI/O downstream port 5 D+ connection (analog) ^[4]

AI/O downstream port 1 D− connection (analog) ^[6]

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Table 2: Pin description for SO32 and SDIP32…continued

Symbol^[1]

Type Description

DP1

DM0

DP0

DM2

DP2

AI/O downstream port 1 D+ connection (analog) ^[6]

AI/O upstream port D− connection (analog)

AI/O upstream port D+ connection (analog)

AI/O downstream port 2 D− connection (analog) ^[6]

AI/O downstream port 2 D+ connection (analog) ^[6]

PSW1/GL1^[3]32

modes 4 to 6: power switch control output for downstream

port 1 (open-drain, 6 mA)

modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 1 (open-drain, 6 mA); to connect an LED

use a 330 Ω series resistor

[1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals.

[2] The voltage at pin V_reg(3.3)is gated by the RESET pin. This allows fully self-powered operation by

connecting RESET to V_BUS(+5 V USB supply). If V_BUSis lost upstream port D+ will not be driven.

[3] See Table 4 “Mode selection”.

[4] To disable a downstream port connect both D+ and D− to V_CCvia a 1 MΩ resistor; unused ports must

be disabled in reverse order starting from port 5.

[5] Analog detection circuit can be switched off using an external EEPROM, see Table 23; in this case,

the pin functions as a logic input (TTL level).

[6] Downstream ports 1 and 2 cannot be disabled.

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5.2 ISP1122BD (LQFP32)

5.2.1 Pinning

handbook, full pagewidth

DP3

24 DM0

23 DP1

OC1

OC2

22 DM1

21 DP5

ISP1122BD

OC3

20 DM5

OC4

19 INDV/SDA

18 OPTION/SCL

17 RESET

OC5/GOC

DM4

MBL018

Fig 4. Pin conﬁguration LQFP32.

5.2.2 Pin description

Table 3: Pin description for LQFP32

Symbol^[1]

Type Description

[2]

V_reg(3.3)

regulated supply voltage (3.3 V ± 10%) from internal

regulator; used to connect pull-up resistor on DP0 line

PSW2/GL2^[3]30

modes 4 to 6: power switch control output for downstream

port 2 (open-drain, 6 mA)

modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 2 (open-drain, 6 mA); to connect an LED

use a 330 Ω series resistor

GND

DM3

DP3

V_CC

ground supply

AI/O downstream port 3 D− connection (analog) ^[4]

AI/O downstream port 3 D+ connection (analog) ^[4]

supply voltage; connect to USB supply V_BUS(bus-powered or

hybrid-powered) or to local supply V_DD(self-powered)

OC1

OC2

OC3

OC4

AI/I

overcurrent sense input for downstream port 1 (analog^[5]

overcurrent sense input for downstream port 2 (analog^[5]

overcurrent sense input for downstream port 3 (analog^[5]

overcurrent sense input for downstream port 4 (analog^[5]

)

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Table 3: Pin description for LQFP32…continued

Symbol^[1]

OC5/GOC^[3]

Type Description

AI/I modes 5, 7: overcurrent sense input for downstream port 5

(analog^[5]

modes 0, 1, 3: global overcurrent sense input (analog^[5]

)

DM4

AI/O downstream port 4 D− connection (analog)^[4]

DP4

AI/O downstream port 4 D+ connection (analog) ^[4]

SP/BP

selects power mode:

self-powered: connect to V_DD(local power supply); also use

this mode for hybrid-powered operation

bus-powered: connect to GND; disable downstream port 5 to

meet supply current requirements^[4]

HUBGL

hub GoodLink LED indicator output (open-drain, 6 mA);

to connect an LED use a 330 Ω series resistor; if unused

connect to V_CCvia a 10 kΩ resistor

PSW3/GL3^[3]12

modes 4 to 6: power switch control output for downstream

port 3 (open-drain, 6 mA)

modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 3 (open-drain, 6 mA); to connect an LED

use a 330 Ω series resistor

PSW4/GL4^[3]13

modes 4 to 6: power switch control output for downstream

port 4 (open-drain, 6 mA)

modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 4 (open-drain, 6 mA); to connect an LED

use a 330 Ω series resistor

PSW5/GL5/

GPSW^[3]

mode 5: power switch control output for downstream port 5

(open-drain, 6 mA)

modes 3, 7: GoodLink LED indicator output for downstream

port 5 (open-drain, 6 mA); to connect an LED use a 330 Ω

series resistor

modes 0 to 2: gang mode power switch control output

(open-drain, 6 mA)

XTAL1

crystal oscillator input (6 MHz)

crystal oscillator output (6 MHz)

XTAL2

RESET^[2]

reset input (Schmitt trigger); a LOW level produces an

asynchronous reset; connect to V_CCfor power-on reset

(internal POR circuit)

OPTION/SCL 18

I/O

mode selection input; also functions as I²C-bus clock output

(open-drain, 6 mA)

INDV/SDA

selects individual (HIGH) or global (LOW) power switching

and overcurrent detection; also functions as bidirectional

I²C-bus data line (open-drain, 6 mA)

DM5

DP5

DM1

DP1

DM0

DP0

AI/O downstream port 5 D− connection (analog)^[4]

AI/O downstream port 5 D+ connection (analog) ^[4]

AI/O downstream port 1 D− connection (analog) ^[6]

AI/O downstream port 1 D+ connection (analog) ^[6]

AI/O upstream port D− connection (analog)

AI/O upstream port D+ connection (analog)

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Table 3: Pin description for LQFP32…continued

Symbol^[1]

Type Description

AI/O downstream port 2 D− connection (analog) ^[6]

DM2

DP2

AI/O downstream port 2 D+ connection (analog) ^[6]

PSW1/GL1^[3]28

modes 4 to 6: power switch control output for downstream

port 1 (open-drain, 6 mA)

modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 1 (open-drain, 6 mA); to connect an LED

use a 330 Ω series resistor

[1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals.

[2] The voltage at pin V_reg(3.3)is gated by the RESET pin. This allows fully self-powered operation by

connecting RESET to V_BUS(+5 V USB supply). If V_BUSis lost upstream port D+ will not be driven.

[3] See Table 4 “Mode selection”.

[4] To disable a downstream port connect both D+ and D− to V_CCvia a 1 MΩ resistor; unused ports must

be disabled in reverse order starting from port 5.

[5] Analog detection circuit can be switched off using an external EEPROM, see Table 23; in this case,

the pin functions as a logic input (TTL level).

[6] Downstream ports 1 and 2 cannot be disabled.

6. Functional description

The ISP1122 is a stand-alone USB hub with up to 5 downstream ports. The number

of ports can be conﬁgured between 2 and 5. The downstream ports can be used to

connect low-speed or full-speed USB peripherals. All standard USB requests from

the host are handled by the hardware without the need for ﬁrmware intervention. The

block diagram is shown in Figure 1.

The ISP1122 requires only a single supply voltage. An internal 3.3 V regulator

provides the supply voltage for the analog USB data transceivers.

The ISP1122 supports both bus-powered and self-powered hub operation. When

using bus-powered operation a downstream port cannot supply more than 100 mA to

a peripheral. In case of self-powered operation an external supply is used to power

the downstream ports, allowing a current consumption of max. 500 mA per port.

A basic I²C-bus interface is provided for reading vendor ID, product ID and

conﬁguration bits from an external EEPROM upon a reset.

6.1 Analog transceivers

The integrated transceiver interfaces directly to the USB cables through external

termination resistors. They are capable of transmitting and receiving serial data at

both ‘full-speed’ (12 Mbit/s) and ‘low-speed’ (1.5 Mbit/s) data rates. The slew rates

are adjusted according to the speed of the device connected and lie within the range

mentioned in the USB Speciﬁcation Rev. 1.1.

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6.2 Philips Serial Interface Engine (SIE)

The Philips SIE implements the full USB protocol layer. It is completely hardwired for

speed and needs no ﬁrmware intervention. The functions of this block include:

synchronization pattern recognition, parallel/serial conversion, bit (de-)stufﬁng, CRC

checking/generation, Packet IDentiﬁer (PID) veriﬁcation/generation, address

recognition, handshake evaluation/generation.

6.3 Hub repeater

The hub repeater is responsible for managing connectivity on a ‘per packet’ basis. It

implements ‘packet signalling’ and ‘resume’ connectivity. Low-speed devices can be

connected to downstream ports. If a low-speed device is detected the repeater will

not propagate upstream packets to the corresponding port, unless they are preceded

by a PREAMBLE PID.

6.4 End-of-frame timers

This block contains the speciﬁed EOF1 and EOF2 timers which are used to detect

‘loss-of-activity’ and ‘babble’ error conditions in the hub repeater. The timers also

maintain the low-speed keep-alive strobe which is sent at the beginning of a frame.

6.5 General and individual port controller

The general and individual port controllers together provide status and control of

individual downstream ports. Any port status change will be reported to the host via

the hub status change (interrupt) endpoint.

6.6 GoodLink

Indication of a good USB connection is provided through GoodLink technology. An

LED can be directly connected via an external 330 Ω resistor.

During enumeration the LED blinks on momentarily. After successful conﬁguration of

the ISP1122, the LED is permanently on. The LED blinks off for 100 ms upon each

successful packet transfer (with ACK). The hub GoodLink indicator blinks when the

hub receives a packet addressed to it. Downstream GoodLink indicators blink upon

an acknowledgment from the associated port. In ‘suspend’ mode the LED is off.

This feature provides a user-friendly indication of the status of the hub, the connected

downstream devices and the USB trafﬁc. It is a useful diagnostics tool to isolate faulty

USB equipment and helps to reduce ﬁeld support and hotline costs.

6.7 Bit clock recovery

The bit clock recovery circuit recovers the clock from the incoming USB data stream

using a 4× oversampling principle. It is able to track jitter and frequency drift as

speciﬁed by the USB Speciﬁcation Rev. 1.1.

6.8 Voltage regulator

A 5 to 3.3 V DC-DC regulator is integrated on-chip to supply the analog transceiver

and internal logic. This can also be used to supply the terminal 1.5 kΩ pull-up resistor

on the D+ line of the upstream connection.

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6.9 PLL clock multiplier

A 6 to 48 MHz clock multiplier Phase-Locked Loop (PLL) is integrated on-chip. This

allows for the use of low-cost 6 MHz crystals. The low crystal frequency also

minimizes Electro-Magnetic Interference (EMI). The PLL requires no external

components.

6.10 Overcurrent detection

An overcurrent detection circuit for downstream ports has been integrated on-chip. It

is self-reporting, resets automatically, has a low trip time and requires no external

components. Both individual and global overcurrent detection are supported.

6.11 I²C-bus interface

A basic serial I²C-bus interface (single master, 100 kHz) is provided to read VID, PID

and conﬁguration bits from an external I²C-bus EEPROM (e.g. Philips PCF8582 or

equivalent). At reset the ISP1122 reads 6 bytes of data from the external memory.

The I²C-bus interface timing complies with the standard mode of operation as

described in The I²C-bus and how to use it, order number 9398 393 40011.

7. Modes of operation

The ISP1122 has several modes of operation, each corresponding with a different pin

conﬁguration. Modes are selected by means of pins INDV, OPTION and SP/BP, as

shown in Table 4.

Table 4: Mode selection

Mode

INDV

OPTION SP/BP

PSWn/GLn

(n = 1 to 4)

PSW5/GL5/GPSW OCn

(n = 1 to 4)

OC5/GOC

[1]

[2]

GoodLink

ganged power

GoodLink^[4]

inactive

inactive ^[3]

inactive

global overcurrent

inactive^[3]

GoodLink

GoodLink^[4]

global overcurrent

inactive

individual power

individual

overcurrent

individual power

individual

overcurrent

individual power

GoodLink^[4]

inactive

GoodLink^[4]

inactive ^[3]

inactive^[3]

individual

overcurrent

[1] Port power switching: logic 0 = ganged, logic 1 = individual.

[2] Power mode: logic 0 = bus-powered, logic 1 = self-powered (or hybrid-powered).

[3] No overcurrent detection.

[4] No power switching.

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8. Endpoint descriptions

Each USB device is logically composed of several independent endpoints. An

endpoint acts as a terminus of a communication ﬂow between the host and the

device. At design time each endpoint is assigned a unique number (endpoint

identiﬁer, see Table 5). The combination of the device address (given by the host

during enumeration), the endpoint number and the transfer direction allows each

endpoint to be uniquely referenced.

The ISP1122 has two endpoints, endpoint 0 (control) and endpoint 1 (interrupt).

Table 5: Hub endpoints

Function

Ports

Endpoint

identiﬁer

Transfer

type

Direction^[1]Max. packet

size (bytes)

OUT

control

0: upstream

Hub

1 to 5: downstream

interrupt

[1] IN: input for the USB host; OUT: output from the USB host.

8.1 Hub endpoint 0 (control)

All USB devices and functions must implement a default control endpoint (ID = 0).

This endpoint is used by the host to conﬁgure the device and to perform generic USB

status and control access.

The ISP1122 hub supports the following USB descriptor information through its

control endpoint 0, which can handle transfers of 64 bytes maximum:

Device descriptor

Conﬁguration descriptor

Interface descriptor

Endpoint descriptor

Hub descriptor

•

String descriptor.

8.2 Hub endpoint 1 (interrupt)

Endpoint 1 is used by the ISP1122 hub to provide status change information to the

host. This endpoint can be accessed only after the hub has been conﬁgured by the

host (by sending the Set Conﬁguration command).

Endpoint 1 is an interrupt endpoint: the host polls it once every 255 ms by sending an

IN token. If the hub has detected no change in the port status it returns a NAK (Not

AcKnowledge) response to this request, otherwise it sends the Status Change byte

(see Table 6).

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Table 6: Status Change byte: bit allocation

Bit

Symbol

Description

Hub SC

a logic 1 indicates a status change on the hub’s upstream port

a logic 1 indicates a status change on downstream port 1

a logic 1 indicates a status change on downstream port 2

a logic 1 indicates a status change on downstream port 3

a logic 1 indicates a status change on downstream port 4

a logic 1 indicates a status change on downstream port 5

not used

Port 1 SC

Port 2 SC

Port 3 SC

Port 4 SC

Port 5 SC

reserved

not used

9. Host requests

The ISP1122 handles all standard USB requests from the host via control endpoint 0.

The control endpoint can handle a maximum of 64 bytes per transfer.

Remark: Please note that the USB data transmission order is Least Signiﬁcant Bit

(LSB) ﬁrst. In the following tables multi-byte variables are displayed least signiﬁcant

byte ﬁrst.

9.1 Standard requests

Table 7 shows the supported standard USB requests. Some requests are explicitly

unsupported. All other requests will be responded with a STALL packet.

Table 7: Standard USB requests

Request name

bmRequestType bRequest

wValue

byte 2, 3

(Hex)

wIndex

byte 4, 5

(Hex)

wLength

byte 6, 7

(Hex)

Data

byte 0 [7:0]

(Bin)

byte 1

(Hex)

Address

Set Address

Conﬁguration

Get Conﬁguration

X000 0000

1000 0000

address^[1]

00, 00

01, 00

none

conﬁguration

value = 01H

Set Conﬁguration (0)

Set Conﬁguration (1)

Descriptor

X000 0000

00, 00

01, 00

00, 00

none

Get Conﬁguration

Descriptor

1000 0000

00, 02

00, 00

length^[2]

conﬁguration,

interface and

endpoint

descriptors

Get Device Descriptor

1000 0000

00, 01

03, 00

03, 01

03, 02

00, 00

length^[2]

device

descriptor

Get String Descriptor (0) 1000 0000

Get String Descriptor (1) 1000 0000

Get String Descriptor (2) 1000 0000

language ID

string

manufacturer

string

product string

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Table 7: Standard USB requests…continued

Request name

bmRequestType bRequest

wValue

byte 2, 3

(Hex)

wIndex

byte 4, 5

(Hex)

wLength

byte 6, 7

(Hex)

Data

byte 0 [7:0]

(Bin)

byte 1

(Hex)

Feature

Clear Device Feature

(REMOTE_WAKEUP)

X000 0000

X000 0010

X000 0000

X000 0010

01, 00

00, 00

01, 00

00, 00

81, 00

00, 00

81, 00

00, 00

none

Clear Endpoint (1)

Feature (HALT/STALL)

Set Device Feature

(REMOTE_WAKEUP)

Set Endpoint (1)

Feature (HALT/STALL)

Status

Get Device Status

Get Interface Status

Get Endpoint (0) Status

1000 0000

1000 0001

1000 0010

00, 00

02, 00

device status

zero

00/80^[3], 00 02, 00

endpoint 0

status

Get Endpoint (1) Status

1000 0010

0000 0000

00, 00

81, 00

02, 00

endpoint 1

status

Unsupported

Set Descriptor

XX, XX

descriptor;

STALL

Get Interface

Set Interface

Synch Frame

1000 0001

X000 0001

1000 0010

00, 00

XX, XX

00, 00

XX, XX

01, 00

00, 00

02, 00

STALL

[1] Device address: 0 to 127.

[2] Returned value in bytes.

[3] MSB speciﬁes endpoint direction: 0 = OUT, 1 = IN. The ISP1122 accepts either value.

9.2 Hub speciﬁc requests

In Table 8 the supported hub speciﬁc requests are listed, as well as some

unsupported requests. Table 9 provides the feature selectors for setting or clearing

port features.

Table 8: Hub speciﬁc requests

Request name

bmRequestType bRequest

wValue

byte 2, 3

(Hex)

wIndex

byte 4, 5

(Hex)

wLength

byte 6, 7

(Hex)

Data

byte 0 [7:0]

(Bin)

byte 1

(Hex)

Descriptor

Get Hub Descriptor

Feature

1010 0000

00, 00/29^[1]00, 00

length^[2], 00 hub descriptor

Clear Hub Feature

(C_LOCAL_POWER)

X010 0000

X010 0011

00, 00

none

Clear Port Feature

(feature selectors)

feature^[3], 00 port ^[4], 00

Set Port Feature

(feature selectors)

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Table 8: Hub speciﬁc requests…continued

Request name

bmRequestType bRequest

wValue

byte 2, 3

(Hex)

wIndex

byte 4, 5

(Hex)

wLength

byte 6, 7

(Hex)

Data

byte 0 [7:0]

(Bin)

byte 1

(Hex)

Status

Get Hub Status

1010 0000

1010 0011

00, 00

04, 00

hub status and

status change

ﬁeld

Get Port Status

Unsupported

Get Bus Status

port^[4], 00

port status

1010 0011

X010 0000

00, 00

01, 00

port ^[4], 00

00, 00

01, 00

00, 00

STALL

Clear Hub Feature

(C_OVER_CURRENT)

Set Hub Descriptor

0010 0000

X010 0000

XX, XX

00, 00

3E, 00

00, 00

STALL

Set Hub Feature

(C_LOCAL_POWER)

Set Hub Feature

X010 0000

01, 00

00, 00

STALL

(C_OVER_CURRENT)

[1] USB Speciﬁcation Rev. 1.0 uses 00H, USB Speciﬁcation Rev. 1.1 speciﬁes 29H.

[2] Returned value in bytes.

[3] Feature selector value, see Table 9.

[4] Downstream port identiﬁer: 1 to N with N = number of enabled ports (2 to 5).

Table 9: Port feature selectors

Feature selector name

PORT_CONNECTION

PORT_ENABLE

Value (Hex) Set feature

Clear feature

not used

disables a port

resumes a port

not used

PORT_SUSPEND

PORT_OVERCURRENT

PORT_RESET

suspends a port

not used

resets and enables a not used

port

PORT_POWER

powers on a port

not used

powers off a port

PORT_LOW_SPEED

C_PORT_CONNECTION

not used

clears port connection

change bit

C_PORT_ENABLE

not used

clears port enable

change bit

C_PORT_SUSPEND

clears port suspend

change bit

C_PORT_OVERCURRENT 13

clears port overcurrent

change bit

C_PORT_RESET

clears port reset

change bit

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9.3 Descriptors

The ISP1122 hub controller supports the following standard USB descriptors:

Device

•

Conﬁguration

Interface

Endpoint

Hub

String.

Table 10: Device descriptor

Values in square brackets are optional.

Offset

(bytes)

Field name

Size

Value

Comments

(bytes) (Hex)

bLength

descriptor length = 18 bytes

type = DEVICE

USB Speciﬁcation Rev. 1.1

HUB_CLASSCODE

bDescriptorType

bcdUSB

10, 01

bDeviceClass

bDeviceSubClass

bDeviceProtocol

bMaxPacketSize0

idVendor

packet size = 64 bytes

CC, 04 Philips Semiconductors vendor ID

(04CC); can be customized using an

external EEPROM (see Table 23)

idProduct

22, 11

ISP1122 product ID; can be

customized using an external

EEPROM (see Table 23)

bcdDevice

01, 01

device release 1.1; silicon revision

increments this value

iManufacturer

no manufacturer string (default)

[01]

manufacturer string enabled

(using an external EEPROM)

iProduct

no product string (default)

[02]

product string enabled

(using an external EEPROM)

iSerialNumber

no serial number string

one conﬁguration

bNumConﬁgurations

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Table 11: Conﬁguration descriptor

Values in square brackets are optional.

Offset

(bytes)

Field name

Size

Value

Comments

(bytes) (Hex)

bLength

descriptor length = 9 bytes

type = CONFIGURATION

bDescriptorType

wTotalLength

19, 00

total length of conﬁguration, interface

and endpoint descriptors (25 bytes)

bNumInterfaces

bConﬁgurationValue

iConﬁguration

one interface

conﬁguration value = 1

no conﬁguration string

bmAttributes

self-powered with remote wake-up^[1]

bus-powered with remote wake-up^[1]

100 mA (default)

MaxPower^[2]

[00]

[FA]

0 mA (using an external EEPROM)

500 mA (using an external EEPROM)

[1] Selected by input SP/BP.

[2] Value in units of 2 mA.

Table 12: Interface descriptor

Offset

(bytes)

Field name

Size

Value

Comments

(bytes) (Hex)

bLength

descriptor length = 9 bytes

type = INTERFACE

bDescriptorType

bInterfaceNumber

bAlternateSetting

bNumEndpoints

bInterfaceClass

bInterfaceSubClass

bInterfaceProtocol

bInterface

no alternate setting

status change (interrupt) endpoint

HUB_CLASSCODE

no class-speciﬁc protocol

no interface string

Table 13: Endpoint descriptor

Offset

(bytes)

Field name

Size

Value

Comments

(bytes) (Hex)

bLength

descriptor length = 7 bytes

type = ENDPOINT

bDescriptorType

bEndpointAddress

bmAttributes

wMaxPacketSize

bInterval

endpoint 1, direction: IN

interrupt endpoint

01, 00

packet size = 1 byte

polling interval (255 ms)

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Table 14: Hub descriptor

Values in square brackets are optional.

Offset

(bytes)

Field name

Size

Value

Comments

(bytes) (Hex)

bDescLength

bDescriptorType

bNbrPorts

descriptor length = 9 bytes

type = HUB

05 to 02 number of enabled downstream ports;

selectable by DP/DM strapping

wHubCharacteristics

09, 00

individual power switching^[1]

overcurrent protection active

(modes 0, 1, 3, 4, 5, 7)

11, 00

individual power switching^[1], no

overcurrent protection (modes 2, 6) ^[2]

bPwrOn2PwrGood^[3]

bHubContrCurrent

100 ms (default; modes 0, 1, 2, 4, 5, 6)

0 ms (default; modes 3, 7)

[FA]

500 ms (using an external EEPROM;

modes 0, 1, 2, 4, 5, 6); see Table 23

maximum hub controller current

(100 mA)

DeviceRemovable

PortPwrCtrlMask

all devices removable

must be all ones for compatibility with

USB Speciﬁcation Rev. 1.0

[1] ISP1122 always reports power management status on an individual basis, even for ganged/global

modes. This is compliant with USB Speciﬁcation Rev. 1.1.

[2] Condition with no overcurrent detection is reported to the host.

[3] Value in units of 2 ms.

Table 15: String descriptors

String descriptors are optional and therefore disabled by default; they can be enabled through

an external EEPROM.

Offset

(bytes)

Field name

Size

Value

Comments

(bytes) (Hex)

String descriptor (0): language ID string

bLength

descriptor length = 4 bytes

type = STRING

bDescriptorType

bString

09, 04

LANGID code zero

String descriptor (1): manufacturer string

bLength

descriptor length = 46 bytes

type = STRING

bDescriptorType

bString

UC^[1]

“Philips Semiconductors”

String descriptor (2): product string

bLength

descriptor length = 16 bytes

type = STRING

bDescriptorType

bString

UC^[1]

“ISP1122”

[1] Unicode encoded string.

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9.4 Hub responses

This section describes the hub responses to requests from the USB host.

9.4.1 Get device status

The hub returns 2 bytes, see Table 16.

Table 16: Get device status response

Bit #

Function

Value

Description

self-powered

bus-powered

self-powered

no remote wake-up

remote wake-up enabled

remote wake-up

reserved

2 to 15

9.4.2 Get conﬁguration

The hub returns 1 byte, see Table 17.

Table 17: Get conﬁguration response

Bit #

Function

Value

Description

device not conﬁgured

device conﬁgured

conﬁguration value

1 to 7

reserved

9.4.3 Get interface status

The hub returns 2 bytes, see Table 18.

Table 18: Get interface status response

Bit #

Function

Value

Description

0 to 15

reserved

9.4.4 Get hub status

The hub returns 4 bytes, see Table 19.

Table 19: Get hub status response

Bit #

Function

Value

Description

local power source

local power supply good

local power supply lost

no overcurrent condition

hub overcurrent condition detected

overcurrent indicator

2 to 15

reserved

local power status change

no change in local power status

local power status changed

no change in overcurrent condition

overcurrent condition changed

overcurrent indicator change 0

18 to 31 reserved

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9.4.5 Get port status

The hub returns 4 bytes. The ﬁrst 2 bytes contain the port status bits (wPortStatus,

see Table 20). The last 2 bytes hold the port status change bits (wPortChange, see

Table 21).

Table 20: Get port status response (wPortStatus)

Bit #

Function

Value

Description

current connect status

no device present

device present on this port

port disabled

port enabled/disabled

suspend

port enabled

port not suspended

port suspended

no overcurrent condition

overcurrent condition detected

reset not asserted

reset asserted

overcurrent indicator

reset

5 to 7

reserved

port power

port powered off

port power on

low-speed device attached

full-speed device attached

low-speed device attached

10 to 15 reserved

Table 21: Get port status response (wPortChange)

Bit #

Function

Value

Description

connect status change

no change in current connect status

current connect status changed

no port error

port enabled/disabled

change

port disabled by a port error

no change in suspend status

resume complete

suspend change

overcurrent indicator change 0

no change in overcurrent status

overcurrent indicator changed

no change in reset status

reset complete

reset change

5 to 15

reserved

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9.4.6 Get conﬁguration descriptor

The hub returns 25 bytes containing the conﬁguration descriptor (9 bytes, see

Table 11), the interface descriptor (9 bytes, see Table 12) and the endpoint descriptor

(7 bytes, see Table 13).

9.4.7 Get device descriptor

The hub returns 18 bytes containing the device descriptor, see Table 10.

9.4.8 Get hub descriptor

The hub returns 9 bytes containing the hub descriptor, see Table 14.

9.4.9 Get string descriptor (0)

The hub returns 4 bytes containing the language ID, see Table 15.

9.4.10 Get string descriptor (1)

The hub returns 46 bytes containing the manufacturer name, see Table 15.

9.4.11 Get string descriptor (2)

The hub returns 16 bytes containing the product name, see Table 15.

10. I²C-bus interface

A simple I²C-bus interface is provided in the ISP1122 to read customized vendor ID,

product ID and some other conﬁguration bits from an external EEPROM. The

interface supports single master operation at a nominal bus speed of 93.75 kHz.

The I²C-bus interface is intended for bidirectional communication between ICs via two

serial bus wires, SDA (data) and SCL (clock). Both lines are driven by open-drain

circuits and must be connected to the positive supply voltage via pull-up resistors.

10.1 Protocol

The I²C-bus protocol deﬁnes the following conditions:

Bus free: both SDA and SCL are HIGH

•

START: a HIGH-to-LOW transition on SDA, while SCL is HIGH

STOP: a LOW-to-HIGH transition on SDA, while SCL is HIGH

Data valid: after a START condition, data on SDA are stable during the HIGH

period of SCL; data on SDA may only change while SCL is LOW.

Each device on the I²C-bus has a unique slave address, which the master uses to

select a device for access.

The master starts a data transfer using a START condition and ends it by generating

a STOP condition. Transfers can only be initiated when the bus is free. The receiver

must acknowledge each byte by means of a LOW level on SDA during the ninth clock

pulse on SCL.

For detailed information please consult The I²C-bus and how to use it., order number

9398 393 40011.

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10.2 Hardware connections

Via the I²C-bus interface the ISP1122 can be connected to an external EEPROM

(PCF8582 or equivalent). The hardware connections are shown in Figure 5.

The SCL and SDA pins are multiplexed with pins OPTION and INDV respectively.

idth

SCL

SDA

OPTION/SCL

INDV/SDA

I C-bus

PCF8582

ISP1122

USB HUB

EEPROM

equivalent

MGR780

Fig 5. EEPROM connection diagram.

The slave address which ISP1122 uses to access the EEPROM is 1010000B. Page

mode addressing is not supported, so pins A0, A1 and A2 of the EEPROM must be

connected to GND (logic 0).

10.3 Data transfer

When the ISP1122 is reset, the I²C-bus interface tries to read 6 bytes of conﬁguration

data from an external EEPROM. If no response is detected, the levels on inputs SDA

and SCL are interpreted as INDV and OPTION to select the operating mode (see

Table 4).

The data in the EEPROM memory are organized as shown in Table 22.

Table 22: EEPROM organization

Address

(Hex)

Default value

(Hex)

Contents

idVendor ^[1](lower byte)

idVendor ^[1](upper byte)

idProduct ^[2](lower byte)

idProduct ^[2](upper byte)

conﬁguration bits C7 to C0; see Table 23

signature

[1] Vendor ID code in the Device descriptor, see Table 10.

[2] Product ID code in the Device descriptor, see Table 10.

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Table 23: Conﬁguration bits

Bit

Function

Value

(Bin)

Description

OPTION

see Table 4 “Mode selection”

INDV

reserved

PwrOn2PwrGood^[2]

0^[1]

must always be programmed to logic 0

100 ms (bPwrOn2PwrGood = 32H)

500 ms (bPwrOn2PwrGood = FAH)

string descriptors disabled

string descriptor enable

0^[1]

string descriptors enabled (strings:

“Philips Semiconductors”, “ISP1122”)

internal analog overcurrent

detection enable

internal analog overcurrent detection

circuit disabled; overcurrent pins OCn

function as digital inputs (TTL level)

1^[1]

internal analog overcurrent detection

circuit enabled

C7, C6

MaxPower^[3]

00^[1]

100 mA (MaxPower = 32H)

500 mA (MaxPower = FAH)

0 mA (MaxPower = 00H)

[1] Default value at reset if no external EEPROM is present.

[2] Modiﬁes the Hub Descriptor ﬁeld ‘bPwrOn2PwrGood’, see Table 14.

[3] Modiﬁes the Hub Descriptor ﬁeld ‘MaxPower’, see Table 14.

11. Hub power modes

USB hubs can either be self-powered or bus-powered.

Self-powered — Self-powered hubs have a 5 V local power supply on board which

provide power to the hub and the downstream ports. The USB Speciﬁcation Rev. 1.1

requires that these hubs limit the current to 500 mA per downstream port and report

overcurrent conditions to the host. The hub may optionally draw 100 mA from the

USB supply (V_BUS) to power the interface functions (hybrid-powered).

Bus-powered — Bus-powered hubs obtain all power from the host or an upstream

self-powered hub. The maximum current is 100 mA per downstream port. Current

limiting and reporting of overcurrent conditions are both optional.

Power switching of downstream ports can be done individually or ganged, where all

ports are switched simultaneously with one power switch. The ISP1122 supports both

modes, which can be selected using input INDV (see Table 4).

11.1 Voltage drop requirements

11.1.1 Self-powered hubs

Self-powered hubs are required to provide a minimum of 4.75 V to its output port

connectors at all legal load conditions. To comply with Underwriters Laboratory Inc.

(UL) safety requirements, the power from any port must be limited to 25 W (5 A at

5 V). Overcurrent protection may be implemented on a global or individual basis.

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Assuming a 5 V ± 3% power supply the worst case supply voltage is 4.85 V. This only

allows a voltage drop of 100 mV across the hub printed-circuit board (PCB) to each

downstream connector. This includes a voltage drop across:

Power supply connector

•

Hub PCB (power and ground traces, ferrite beads)

Power switch (FET on-resistance)

Overcurrent sense device.

PCB resistance and power supply connector resistance may cause a drop of 25 mV,

leaving only 75 mV as the voltage drop allowed across the power switch and

overcurrent sense device. The individual voltage drop components are shown in

Figure 6.

voltage drop

75 mV

voltage drop

25 mV

handbook, full pagewidth

4.85 V(min)

4.75 V(min)

5 V

−

BUS

POWER SUPPLY

± 3% regulated

hub board

D+

D−

(1)

downstream

port

connector

low-ohmic

PMOS switch

resistance

ISP1122

power

switch

GND

SHIELD

MGR781

(1) Includes PCB traces, ferrite beads, etc.

Fig 6. Typical voltage drop components in self-powered mode using individual overcurrent detection.

In case of global overcurrent detection an increased voltage drop is needed for the

overcurrent sense device (in this case a low-ohmic resistor). This can be realized by

using a special power supply of 5.1 V ± 3%, as shown in Figure 7.

handbook, full pagewidth

voltage drop

100 mV

voltage drop

75 mV

voltage drop

25 mV

4.95 V(min)

4.75 V(min)

5.1 V KICK-UP

POWER SUPPLY

± 3% regulated

−

BUS

low-ohmic

sense resistor

for overcurrent

detection

hub board

resistance

D+

D−

(1)

downstream

port

connector

low-ohmic

PMOS switch

ISP1122

power

GND

SHIELD

switch

MGR782

(1) Includes PCB traces, ferrite beads, etc.

Fig 7. Typical voltage drop components in self-powered mode using global overcurrent detection.

11.1.2 Bus-powered hubs

Bus-powered hubs are guaranteed to receive a supply voltage of 4.5 V at the

upstream port connector and must provide a minimum of 4.4 V to the downstream

port connectors. The voltage drop of 100 mV across bus-powered hubs includes:

Hub PCB (power and ground traces, ferrite beads)

Power switch (FET on-resistance)

Overcurrent sense device.

•

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The PCB resistance may cause a drop of 25 mV, which leaves 75 mV for the power

switch and overcurrent sense device. The voltage drop components are shown in

Figure 8.

For bus-powered hubs overcurrent protection is optional. It may be implemented for

all downstream ports on a global or individual basis.

handbook, full pagewidth

voltage drop

75 mV

voltage drop

25 mV

4.50 V(min)

4.40 V(min)

BUS

hub board

resistance

D+

D−

D+

D−

(1)

upstream

port

connector

downstream

port

connector

low-ohmic

PMOS switch

ISP1122

power

switch

GND

SHIELD

MGR783

(1) Includes PCB traces, ferrite beads, etc.

Fig 8. Typical voltage drop components in bus-powered mode (no overcurrent detection).

12. Overcurrent detection

The ISP1122 has an analog overcurrent detection circuit for monitoring downstream

port lines. This circuit automatically reports an overcurrent condition to the host and

turns off the power to the faulty port. The host must reset the condition ﬂag.

Pins OC1 to OC5/GOC are used for individual port overcurrent detection. Pin

OC5/GOC can also be used for global overcurrent detection. This is controlled by

input INDV (see Table 4).

The overcurrent detection circuit can be switched off using an external EEPROM (see

Table 23). In this case, the overcurrent pins OCn function as logic inputs (TTL level).

12.1 Overcurrent circuit description

The integrated overcurrent detection circuit of ISP1122 senses the voltage drop

across the power switch or an extra low-ohmic sense resistor. When the port draws

too much current, the voltage drop across the power switch exceeds the trip voltage

threshold (∆V_trip). The overcurrent circuit detects this and switches off the power

switch control signal after a delay of 15 ms (t_trip). This delay acts as a ‘debounce’

period to minimize false tripping, especially during the inrush current produced by ‘hot

plugging’ of a USB device.

12.2 Power switch selection

From the voltage drop analysis given in Figure 6, Figure 7 and Figure 8, the power

switch has a voltage drop budget of 75 mV. For individual self-powered mode, the

current drawn per port can be up to 500 mA. Thus the power switch should have

maximum on-resistance of 150 mΩ.

If the voltage drop due to the hub board resistance can be minimized, the power

switch can have more voltage drop budget and therefore a higher on-resistance.

Power switches with a typical on-resistance of around 100 mΩ ﬁt into this application.

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The ISP1122 overcurrent detection circuit has been designed with a nominal trip

voltage (∆V_trip) of 85 mV. This gives a typical trip current of approximately 850 mA for

a power switch with an on-resistance of 100 mΩ¹.

12.3 Tuning the overcurrent trip voltage

The ISP1122 trip voltage can optionally be adjusted through external components to

set the desired trip current. This is done by inserting tuning resistors at pins SP/BP or

OCn (see Figure 9). R_tutunes up the trip voltage ∆V_tripand R_tdtunes it down

according to Equation 1.

∆V_trip= ∆V_{trip(intrinsic)}+ I_ref⋅ R_tu– I_OC⋅ R_td

(1)

with I_ref(nom)= 5 µA and I_OC(nom)= 0.5 µA.

handbook, halfpage

low-ohmic

handbook, halfpage

low-ohmic

PMOS switch

BUS

ref

SP/BP

OCn

SP/BP

OCn

ISP1122

MBL042

MBL043

I_ref(nom)= 5 µA

I_OC(nom)= 0.5 µA

a. Self-powered mode.

Fig 9. Tuning the overcurrent trip voltage.

b. Bus-powered mode.

12.4 Reference circuits

Some typical examples of port power switching and overcurrent detection modes are

given in Figure 10 to Figure 13.

The RC circuit (47 kΩ and 0.1 µF) around the PMOS switch provides for soft turn-on.

The series resistor connecting the SP/BP pin to V_CCtunes up the overcurrent trip

voltage slightly (see Figure 9). In the schematic diagram the resistor separates the

net names for pins V_CCand SP/BP. This allows an automatic router to use a wide

trace for V_CCand a narrow trace to connect pin SP/BP.

1. The following PMOS power switches have been tested to work well with the ISP1122: Philips PHP109, Vishay Siliconix Si2301DS,

Fairchild FDN338P.

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downstream

ports

handbook, full pagewidth

low-ohmic

PMOS switch

ferrite bead

+4.85 V(min)

5 V

POWER SUPPLY

± 3%

−

BUS

+4.75 V

(min)

120

D+

D−

0.1 µF

µF

47 kΩ

GND

SHIELD

low-ohmic

PMOS switch

ferrite bead

330 kΩ

BUS

(5×)

+4.75 V

(min)

120

µF

D+

D−

0.1 µF

47 kΩ

GND

SHIELD

low-ohmic

PMOS switch

+4.85 V(min)

ferrite bead

PSW1/GL1

PSW2/GL2

BUS

+4.75 V

(min)

120

µF

D+

D−

GND

0.1 µF

47 kΩ

GND

SHIELD

PSW3/GL3

100 Ω

1 kΩ

PSW4/GL4

low-ohmic

PMOS switch

ferrite bead

PSW5/GL5/GPSW

BUS

+4.75 V

(min)

120

µF

D+

D−

0.1 µF

47 kΩ

INDV

GND

SHIELD

SP/BP

low-ohmic

PMOS switch

ferrite bead

OPTION

BUS

+4.75 V

(min)

120

µF

D+

D−

0.1 µF

ISP1122

47 kΩ

GND

SHIELD

OC1

OC2

OC3

OC4

MGR784

OC5/GOC

Power switches 1 to 5 are low-ohmic PMOS devices as speciﬁed in Section 12.2.

Fig 10. Mode 5: self-powered hub; individual port power switching; individual overcurrent detection.

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downstream

dbook, full pagewidth

ports

ferrite bead

+4.95 V(min)

−

5.1 V KICK-UP

POWER SUPPLY

BUS

+4.75 V

(min)

120

µF

D+

D−

± 3%

low-ohmic

sense resistor

for overcurrent

detection

GND

SHIELD

330

kΩ

+4.95 V(min)

ferrite bead

BUS

PSW1/GL1

PSW2/GL2

PSW3/GL3

+4.75 V

(min)

120

µF

D+

D−

GND

low-ohmic

PMOS switch

GND

SHIELD

100 Ω

1 kΩ

0.1 µF

PSW4/GL4

ferrite bead

47 kΩ

PSW5/GL5/GPSW

BUS

+4.75 V

(min)

120

µF

D+

D−

GND

SHIELD

INDV

SP/BP

ferrite bead

OPTION

BUS

+4.75 V

(min)

120

µF

D+

D−

ISP1122

GND

SHIELD

OC1

OC2

OC3

OC4

ferrite bead

BUS

+4.75 V

(min)

120

µF

D+

D−

OC5/GOC

GND

SHIELD

MGR785

Power switch is low-ohmic PMOS device as speciﬁed in Section 12.2.

Fig 11. Mode 1: self-powered hub; ganged port power switching; global overcurrent detection.

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upstream

port

downstream

ports

handbook, full pagewidth

low-ohmic

PMOS switch

ferrite bead

+4.50 V(min)

BUS

+4.40 V

(min)

120

D+

D−

D+

D−

0.1 µF

µF

47 kΩ

GND

SHIELD

330 kΩ

(4×)

SHIELD

low-ohmic

PMOS switch

ferrite bead

BUS

+4.40 V

(min)

120

µF

D+

D−

0.1 µF

PSW1/GL1

47 kΩ

GND

SHIELD

PSW2/GL2

PSW3/GL3

GND

low-ohmic

PMOS switch

ferrite bead

PSW4/GL4

BUS

+4.40 V

(min)

120

µF

D+

D−

PSW5/GL5/GPSW

0.1 µF

47 kΩ

GND

SHIELD

INDV

low-ohmic

PMOS switch

ferrite bead

SP/BP

OPTION

BUS

+4.40 V

(min)

120

µF

D+

D−

0.1 µF

47 kΩ

GND

SHIELD

ISP1122

MGR786

OC1

OC2

OC3

OC4

OC5/GOC

Power switches 1 to 4 are low-ohmic PMOS devices as speciﬁed in Section 12.2.

Fig 12. Mode 4: bus-powered hub; individual port power switching; individual overcurrent detection.

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upstream

port

downstream

handbook, full pagewidth

ports

ferrite bead

+4.50 V(min)

BUS

+4.40 V

(min)

120

D+

D−

D+

D−

µF

GND

SHIELD

330

kΩ

ferrite bead

BUS

+4.40 V

(min)

120

µF

D+

D−

PSW1/GL1

PSW2/GL2

PSW3/GL3

GND

SHIELD

low-ohmic

PMOS switch

GND

ferrite bead

0.1 µF

PSW4/GL4

BUS

47 kΩ

+4.40 V

(min)

120

µF

D+

D−

PSW5/GL5/GPSW

INDV

GND

SHIELD

SP/BP

ferrite bead

OPTION

BUS

+4.40 V

(min)

120

µF

D+

D−

ISP1122

GND

SHIELD

MGR787

OC1

OC2

OC3

OC4

OC5/GOC

Power switch is low-ohmic PMOS device as speciﬁed in Section 12.2.

Fig 13. Mode 0: bus-powered hub; ganged port power switching; global overcurrent detection.

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13. Limiting values

Table 24: Absolute maximum ratings

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_CC

Parameter

Conditions

Min

−0.5

Max

Unit

supply voltage

+6.0

V_I

input voltage

V_CC+ 0.5

I_latchup

V_esd

T_stg

latchup current

V_I< 0 or V_I> V_CC

200

[1] [2]

electrostatic discharge voltage

storage temperature

total power dissipation

I_LI< 15 µA

±4000^[3]

+150

−60

°C

P_tot

[1] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).

[2] Values are given for device only; in-circuit V_esd(max)= ±8000 V.

[3] For open-drain pins V_esd(max)= ±2000 V.

Table 25: Recommended operating conditions

Symbol

V_CC

Parameter

Conditions

Min

Max

5.5

3.6

Unit

supply voltage

input voltage

4.0

V_I

V_I(AI/O)

input voltage on analog I/O pins

(D+/D−)

V_O(od)

T_amb

open-drain output pull-up voltage

operating ambient temperature

5.5

−40

+85

°C

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14. Static characteristics

Table 26: Static characteristics; supply pins

V_CC= 4.0 to 5.5 V; V_GND= 0 V; T_amb= −40 to +85 °C; unless otherwise speciﬁed.

Symbol

V_reg(3.3)

I_CC

Parameter

Conditions

Min

3.0^[1]

Typ

3.3

Max

3.6

Unit

regulated supply voltage

operating supply current

suspend supply current

µA

I_CC(susp

)

1.5 kΩ pull-up on upstream

270

port D+ (pin DP0)

no pull-up on upstream port

µA

D+ (pin DP0)

[1] In ‘suspend’ mode the minimum voltage is 2.7 V.

Table 27: Static characteristics: digital pins

V_CC= 4.0 to 5.5 V; V_GND= 0 V; T_amb= −40 to +85 °C; unless otherwise speciﬁed.

Symbol

Input levels

V_IL

Parameter

Conditions

Min

Typ

Max

Unit

LOW-level input voltage

HIGH-level input voltage

0.8

V_IH

2.0

Schmitt trigger inputs

V_th(LH)positive-going threshold

1.4

0.9

0.4

1.9

1.5

0.7

voltage

V_th(HL)

negative-going threshold

voltage

V_hys

hysteresis voltage

Output levels

V_OL

LOW-level output voltage

(open drain outputs)

I_OL= 6 mA

0.4

0.1

I_OL= 20 µA

Leakage current

I_LI

input leakage current

±1

µA

Open-drain outputs

I_OZ

OFF-state output current

±1

µA

Table 28: Static characteristics: overcurrent sense pins

V_CC= 4.0 to 5.5 V; V_GND= 0 V; T_amb= −40 to +85 °C; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1]

[2]

overcurrent detection

trip voltage on OCn pins

∆V = V_CC− V_OCn

∆V = V_SP/BP− V_OCn

∆V_trip

105

[1] Bus-powered mode.

[2] Self-powered or hybrid-powered mode.

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Table 29: Static characteristics: analog I/O pins (D+, D−)^[1]

V_CC= 4.0 to 5.5 V; V_GND= 0 V; T_amb= −40 to +85 °C; unless otherwise speciﬁed.

Symbol

Input levels

V_DI

Parameter

Conditions

Min

Typ

Max

Unit

differential input sensitivity

|V_I(D+)− V_I(D−)

0.2

0.8

V_CM

differential common mode

voltage

includes V_DIrange

2.5

V_IL

LOW-level input voltage

HIGH-level input voltage

0.8

V_IH

2.0

Output levels

V_OL

V_OH

LOW-level output voltage

HIGH-level output voltage

R_L= 1.5 kΩ to +3.6V

0.3

3.6

R_L= 15 kΩ to GND

2.8

Leakage current

I_LZ

OFF-state leakage current

±10

µA

Capacitance

C_IN

transceiver capacitance

pin to GND

Resistance

[2]

Z_DRV

driver output impedance

input impedance

steady-state drive

Ω

Z_INP

MΩ

Termination

[3]

V_TERM

termination voltage for

3.0^[4]

3.6

upstream port pull-up (R_PU

)

[1] D+ is the USB positive data pin (DPn); D− is the USB negative data pin (DMn).

[2] Includes external resistors of 20 Ω ±1% on both D+ and D−.

[3] This voltage is available at pin V_reg(3.3)

[4] In ‘suspend’ mode the minimum voltage is 2.7 V.

15. Dynamic characteristics

Table 30: Dynamic characteristics

V_CC= 4.0 to 5.5 V; V_GND= 0 V; T_amb= −40 to +85 °C; unless otherwise speciﬁed.

Symbol

Reset

Parameter

Conditions

Min

Typ

Max

Unit

t_W(RESET)

pulse width on input RESET

crystal oscillator running

crystal oscillator stopped

µs

2^[1]

Crystal oscillator

f_XTAL

crystal frequency

MHz

[1] Dependent on the crystal oscillator start-up time.

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Table 31: Dynamic characteristics: overcurrent sense pins

V_CC= 4.0 to 5.5 V; V_GND= 0 V; T_amb= −40 to +85 °C; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1]

t_trip

overcurrent trip response time see Figure 14

from OCn LOW to PSWn HIGH

[1] Operating modes 0, 1, 4 and 5; see Table 4.

Table 32: Dynamic characteristics: analog I/O pins (D+, D−); full-speed mode^[1]

V_CC= 4.0 to 5.5 V; V_GND= 0 V; T_amb= −40 to +85 °C; C_L= 50 pF; R_PU= 1.5 kΩ on D+ to V_TERM.; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Driver characteristics

t_FR

rise time

C_L= 50 pF;

10 to 90% of |V_OH− V_OL

t_FF

fall time

C_L= 50 pF;

10 to 90% of |V_OH− V_OL

[2]

FRFM

differential rise/fall time

matching (t_FR/t_FF

1.3

111.11

2.0

)

[2] [3]

V_CRS

output signal crossover voltage

Data source timing

t_DJ1source differential jitter for

[2] [3]

see Figure 15

see Figure 16

−3.5

+3.5

consecutive transitions

t_DJ2

source differential jitter for

paired transitions

−4

[3]

t_FEOPT

t_FDEOP

source EOP width

160

175

source differential data-to-EOP see Figure 16

transition skew

−2

Receiver timing

[3]

t_JR1

receiver data jitter tolerance for see Figure 17

consecutive transitions

−18.5

−9

+18.5

t_JR2

receiver data jitter tolerance for see Figure 17

paired transitions

t_FEOPR

t_FST

receiver SE0 width

accepted as EOP;

see Figure 16

width of SE0 during differential rejected as EOP;

transition see Figure 18

Hub timing (downstream ports conﬁgured as full-speed)

[3]

t_FHDD

hub differential data delay

(without cable)

see Figure 19;

C_L= 0 pF

t_FSOP

data bit width distortion after

SOP

see Figure 19

−5

[3]

t_FEOPD

t_FHESK

hub EOP delay relative to t_HDDsee Figure 20

hub EOP output width skew see Figure 20

−15

+15

[1] Test circuit: see Figure 22.

[2] Excluding the ﬁrst transition from Idle state.

[3] Characterized only, not tested. Limits guaranteed by design.

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Table 33: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode^[1]

V_CC= 4.0 to 5.5 V; V_GND= 0 V; T_amb= −40 to +85 °C; C_L= 50 pF; R_PU= 1.5 kΩ on D− to V_TERM; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Driver characteristics

t_LR

rise time

C_L= 200 to 600 pF;

10 to 90% of |V_OH− V_OL

1.3

300

125

2.0

t_LF

fall time

C_L= 200 to 600 pF;

10 to 90% of |V_OH− V_OL

[2]

LRFM

differential rise/fall time

matching (t_LR/t_LF

)

[2] [3]

V_CRS

output signal crossover voltage

Hub timing (downstream ports conﬁgured as low-speed)

t_LHDD

t_LSOP

hub differential data delay

see Figure 19

300

[3]

data bit width distortion after

SOP

−60

+60

[3]

t_LEOPD

t_LHESK

hub EOP delay relative to t_HDDsee Figure 20

hub EOP output width skew see Figure 20

200

−300

+300

[1] Test circuit: see Figure 22.

[2] Excluding the ﬁrst transition from Idle state.

[3] Characterized only, not tested. Limits guaranteed by design.

handbook, halfpage

∆V

trip

overcurrent

input

0 V

trip

power switch

output

MBL032

0 V

Overcurrent input: OCn; power switch output: PSWn.

Reference voltage for overcurrent sensing: V_CC(bus-powered mode) or V_SP/BP(self-powered mode).

Fig 14. Overcurrent trip response timing.

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handbook, full pagewidth

PERIOD

+3.3 V

crossover point

differential

data lines

0 V

MGR870

consecutive

transitions

+ t

N × T

PERIOD DJ1

paired

transitions

N × T

+ t

PERIOD DJ2

T_PERIODis the bit duration corresponding with the USB data rate.

Fig 15. Source differential data jitter.

handbook, full pagewidth

PERIOD

+3.3 V

crossover point

extended

crossover point

differential

data lines

0 V

differential data to

SE0/EOP skew

N × T + t

source EOP width: t

EOPT

receiver EOP width: t

EOPR

PERIOD DEOP

MGR776

T_PERIODis the bit duration corresponding with the USB data rate.

Full-speed timing symbols have a subscript preﬁx ‘F’, low-speed timings a preﬁx ‘L’.

Fig 16. Source differential data-to-EOP transition skew and EOP width.

handbook, full pagewidth

PERIOD

+3.3 V

differential

data lines

0 V

MGR871

JR1

JR2

consecutive

transitions

N × T

+ t

PERIOD JR1

paired

transitions

N × T

+ t

PERIOD JR2

T_PERIODis the bit duration corresponding with the USB data rate.

Fig 17. Receiver differential data jitter.

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handbook, halfpage

FST

+3.3 V

differential

data lines

IH(min)

0 V

MGR872

Fig 18. Receiver SE0 width tolerance.

+3.3 V

handbook, full pagewidth

crossover

point

crossover

point

upstream

differential

data lines

downstream

differential

data

0 V

hub delay

downstream

hub delay

upstream

HDD

+3.3 V

crossover

point

crossover

point

downstream

differential

data lines

upstream

differential

data

0 V

MGR777

(A) downstream hub delay

(B) upstream hub delay

SOP distortion:

= t

− t

SOP HDD (next J) HDD(SOP)

Full-speed timing symbols have a subscript preﬁx ‘F’, low-speed timings a preﬁx ‘L’.

Fig 19. Hub differential data delay and SOP distortion.

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+3.3 V

handbook, full pagewidth

crossover

point

extended

crossover

point

extended

upstream

differential

data lines

downstream

port

0 V

EOP−

EOP+

EOP−

EOP+

+3.3 V

downstream

differential

data lines

crossover

point

extended

crossover

point

extended

upstream

end of cable

0 V

MGR778

(A) downstream EOP delay

(B) upstream EOP delay

EOP delay:

= max (t

, t

)

EOP

EOP− EOP+

EOP delay relative to t

HDD

= t

− t

EOPD EOP HDD

EOP skew:

= t

− t

HESK EOP+ EOP−

Full-speed timing symbols have a subscript preﬁx ‘F’, low-speed timings a preﬁx ‘L’.

Fig 20. Hub EOP delay and EOP skew.

Table 34: Dynamic characteristics: I²C-bus pins (SDA, SCL)

V_CCand T_ambwithin recommended operating range; V_DD= +5 V; V_SS= V_GND; V_ILand V_IHbetween V_SSand V_DD

Symbol

f_SCL

Parameter

Conditions

Min

Typ

93.75^[1]

Max

Unit

kHz

µs

SCL clock frequency

bus free time

f_XTAL= 6 MHz

100

t_BUF

4.7

250

4.0

4.7

4.0

t_SU;STA

t_HD;STA

t_LOW

START condition set-up time

hold time START condition

SCL LOW time

µs

t_HIGH

t_r

SCL HIGH time

µs

[2]

SCL and SDA rise time

SCL and SDA fall time

data set-up time

1000

300

t_f

t_SU;DAT

t_HD;DAT

t_VD;DAT

250

data hold time

µs

SCL LOW to data out valid

time

0.4

µs

t_SU;STO

C_b

STOP condition set-up time

4.0

µs

capacitive load for each bus

line

400

[1] f_SCL= ¹⁄₆₄f_XTAL

[2] Rise time is determined by C_band pull-up resistor value R_p(typ. 4.7 kΩ).

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SDA

HD;STA

BUF

LOW

SCL

HD;STA

HIGH

SU;DAT

SU;STA

SU;STO

MGR779

Fig 21. I²C-bus timing.

16. Test information

The dynamic characteristics of the analog I/O ports (D+ and D−) as listed in Table 32

and Table 33, were determined using the circuit shown in Figure 22.

handbook, halfpage

D.U.T.

reg(3.3)

test point

1.5 kΩ

20 Ω

test

15 kΩ

D−/LS closed

D+/LS open

D−/FS open

closed

D+/FS

MGR775

Load capacitance:

C_L= 50 pF (full-speed mode)

C_L= 200 pF or 600 pF (low-speed mode, minimum or maximum timing).

Speed selection:

full-speed mode (FS): 1.5 kΩ pull-up resistor on D+

low-speed mode (LS): 1.5 kΩ pull-up resistor on D−.

Fig 22. Load impedance for D+ and D- pins.

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17. Package outline

SO32: plastic small outline package; 32 leads; body width 7.5 mm

SOT287-1

(A )

pin 1 index

w M

detail X

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

UNIT

max.

0.3

0.1

2.45

2.25

0.49

0.36

0.27 20.7

0.18 20.3

7.6

7.4

10.65

10.00

1.1

0.4

1.2

1.0

0.95

0.55

2.65

0.25

0.01

1.27

0.050

1.4

0.25

0.01

0.25

0.01

0.1

8^o

0^o

0.012 0.096

0.004 0.086

0.02 0.011 0.81

0.01 0.007 0.80

0.30

0.29

0.419

0.394

0.043 0.047

0.016 0.039

0.037

0.022

inches 0.10

0.004

0.055

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

97-05-22

99-12-27

SOT287-1

MO-119

Fig 23. SO32 package outline.

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SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)

SOT232-1

(e )

w M

pin 1 index

10 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

max.

(1)

UNIT

min.

max.

1.3

0.8

0.53

0.40

0.32

0.23

29.4

28.5

9.1

8.7

3.2

2.8

10.7

10.2

12.2

10.5

4.7

0.51

3.8

1.778

10.16

0.18

1.6

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

92-11-17

95-02-04

SOT232-1

Fig 24. SDIP32 package outline.

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LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm

SOT358-1

(A )

w M

pin 1 index

detail X

v M

w M

v M

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

UNIT

max.

7^o

0^o

0.20 1.45

0.05 1.35

0.4 0.18 7.1

0.3 0.12 6.9

7.1

6.9

9.15 9.15

8.85 8.85

0.75

0.45

0.9

0.5

0.9

0.5

1.60

0.25

0.8

1.0

0.2 0.25 0.1

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

99-12-27

00-01-19

SOT358 -1

136E03

MS-026

Fig 25. LQFP32 package outline.

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18. Soldering

18.1 Introduction

This text gives a very brief insight to a complex technology. A more in-depth account

of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit

Packages (document order number 9398 652 90011).

There is no soldering method that is ideal for all IC packages. Wave soldering is often

preferred when through-hole and surface mount components are mixed on one

printed-circuit board. However, wave soldering is not always suitable for surface

mount ICs, or for printed-circuit boards with high population densities. In these

situations reﬂow soldering is often used.

18.2 Surface mount packages

18.2.1 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling

or pressure-syringe dispensing before package placement.

Several methods exist for reﬂowing; for example, infrared/convection heating in a

conveyor type oven. Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 to 250 °C. The top-surface

temperature of the packages should preferable be kept below 230 °C.

18.2.2 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging

and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal

results:

Use a double-wave soldering method comprising a turbulent wave with high

upward pressure followed by a smooth laminar wave.

•

For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

For packages with leads on four sides, the footprint must be placed at a 45° angle

to the transport direction of the printed-circuit board. The footprint must

incorporate solder thieves downstream and at the side corners.

•

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During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated ﬂux will eliminate the

need for removal of corrosive residues in most applications.

18.2.3 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low

voltage (24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time

must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 to 5 seconds between 270 and 320 °C.

18.3 Through-hole mount packages

18.3.1 Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260 °C; solder at this

temperature must not be in contact with the joints for more than 5 seconds. The total

contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the

plastic body must not exceed the speciﬁed maximum storage temperature (T_stg(max)).

If the printed-circuit board has been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within the permissible limit.

18.3.2 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the

seating plane or not more than 2 mm above it. If the temperature of the soldering iron

bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit

temperature is between 300 and 400 °C, contact may be up to 5 seconds.

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18.4 Package related soldering information

Table 35: Suitability of IC packages for wave, reﬂow and dipping soldering methods

Mounting

Package

Soldering method

Wave

Reﬂow^[1]Dipping

Through-hole

mount

DBS, DIP, HDIP, SDIP, SIL suitable^[2]

−

suitable

Surface mount

BGA, LFBGA, SQFP,

TFBGA

not suitable

suitable

−

HBCC, HLQFP, HSQFP,

HSOP, HTQFP, HTSSOP,

SMS

not suitable^[3]

PLCC^[4], SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO

suitable

−

not recommended^{[4] [5]}suitable

not recommended^[6]

suitable

[1] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal

or external package cracks may occur due to vaporization of the moisture in them (the so called

popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated

Circuit Packages; Section: Packing Methods.

[2] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the

printed-circuit board.

[3] These packages are not suitable for wave soldering as a solder joint between the printed-circuit board

and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top

version).

[4] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[5] Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger

than 0.8 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[6] Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

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19. Revision history

Table 36: Revision history

Rev Date

CPCN

Description

03 20000329

Product speciﬁcation, third version; supersedes ISP1122-02 of 4 October 1999

(9397 750 06389). Modiﬁcations:

T a ble 1 “Ordering information”: table note on LQFP32 availability removed

•

Table 23 “Conﬁguration bits”: values of bits C7 and C6 exchanged

•

Section 12.4 “Reference circuits”: resistor value for soft turn-on RC-circuit changed from

10 kΩ to 47 kΩ; see also Figure 10 to 13.

•

02 19991004

Product speciﬁcation, second version; supersedes initial version ISP1122-01 of

3 June 1999 (9397 750 05154). Modiﬁcations:

Terminology made consistent: ganged power switching, global overcurrent detection

•

Added note on availability of LQFP32 to Table 1 “Ordering information”

•

Updated reference circuits in Section 12.4 “Reference circuits”: pull-up resistors changed

to 330 kΩ, soft turn-on RC network: capacitor moved and changed to 0.1 µF

•

Updated Figure 22 “Load impedance for D+ and D- pins.”: V_CC-> V_reg(3.3)

•

01 19990603

Product speciﬁcation; initial version.

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20. Data sheet status

Datasheet status

Product status Deﬁnition^[1]

Objective speciﬁcation

Development

This data sheet contains the design target or goal speciﬁcations for product development. Speciﬁcation may

change in any manner without notice.

Preliminary speciﬁcation Qualiﬁcation

This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips

Semiconductors reserves the right to make changes at any time without notice in order to improve design and

supply the best possible product.

Product speciﬁcation

Production

This data sheet contains ﬁnal speciﬁcations. Philips Semiconductors reserves the right to make changes at any

time without notice in order to improve design and supply the best possible product.

[1]

Please consult the most recently issued data sheet before initiating or completing a design.

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

21. Deﬁnitions

Short-form speciﬁcation — The data in

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

short-form speciﬁcation is

Right to make changes — Philips Semiconductors reserves the right to

make changes, without notice, in the products, including circuits, standard

cells, and/or software, described or contained herein in order to improve

design and/or performance. Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

licence or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products

are free from patent, copyright, or mask work right infringement, unless

otherwise speciﬁed.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

23. Licenses

Purchase of Philips I²C components

Purchase of Philips I²C components conveys a license

under the Philips’ I²C patent to use the components in the

I²C system provided the system conforms to the I²C

speciﬁcation deﬁned by Philips. This speciﬁcation can be

ordered using the code 9398 393 40011.

22. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

24. Trademarks

ACPI — is an open industry speciﬁcation for PC power management,

co-developed by Intel Corp., Microsoft Corp. and Toshiba

SMBus — is a bus speciﬁcation for PC power management, developed by

Intel Corp. based on the I²C-bus from Royal Philips Electronics

GoodLink — is a trademark of Royal Philips Electronics

SoftConnect — is a trademark of Royal Philips Electronics

OnNow — is a trademark of Microsoft Corp.

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Philips Semiconductors - a worldwide company

Argentina: see South America

Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399

Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

Austria: Tel. +43 160 101, Fax. +43 160 101 1210

Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773

Belgium: see The Netherlands

New Zealand: Tel. +64 98 49 4160, Fax. +64 98 49 7811

Norway: Tel. +47 22 74 8000, Fax. +47 22 74 8341

Philippines: Tel. +63 28 16 6380, Fax. +63 28 17 3474

Poland: Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Brazil: see South America

Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102

Canada: Tel. +1 800 234 7381

Romania: see Italy

Russia: Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

China/Hong Kong: Tel. +852 2 319 7888, Fax. +852 2 319 7700

Colombia: see South America

Czech Republic: see Austria

Slovenia: see Italy

Denmark: Tel. +45 3 288 2636, Fax. +45 3 157 0044

Finland: Tel. +358 961 5800, Fax. +358 96 158 0920

France: Tel. +33 14 099 6161, Fax. +33 14 099 6427

Germany: Tel. +49 40 23 5360, Fax. +49 402 353 6300

Hungary: see Austria

South Africa: Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Tel. +55 11 821 2333, Fax. +55 11 829 1849

Spain: Tel. +34 33 01 6312, Fax. +34 33 01 4107

Sweden: Tel. +46 86 32 2000, Fax. +46 86 32 2745

Switzerland: Tel. +41 14 88 2686, Fax. +41 14 81 7730

Taiwan: Tel. +886 22 134 2865, Fax. +886 22 134 2874

Thailand: Tel. +66 27 45 4090, Fax. +66 23 98 0793

Turkey: Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: Tel. +1 800 234 7381

India: Tel. +91 22 493 8541, Fax. +91 22 493 8722

Indonesia: see Singapore

Ireland: Tel. +353 17 64 0000, Fax. +353 17 64 0200

Israel: Tel. +972 36 45 0444, Fax. +972 36 49 1007

Italy: Tel. +39 039 203 6838, Fax +39 039 203 6800

Japan: Tel. +81 33 740 5130, Fax. +81 3 3740 5057

Korea: Tel. +82 27 09 1412, Fax. +82 27 09 1415

Malaysia: Tel. +60 37 50 5214, Fax. +60 37 57 4880

Mexico: Tel. +9-5 800 234 7381

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: Tel. +381 11 3341 299, Fax. +381 11 3342 553

Middle East: see Italy

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications,

Building BE, P.O. Box 218, 5600 MD EINDHOVEN,

The Netherlands, Fax. +31 40 272 4825

Internet: http://www.semiconductors.philips.com

(SCA69)

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Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering informatio n . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

11.1

11.1.1

11.1.2

Hub power modes . . . . . . . . . . . . . . . . . . . . . . 22

Voltage drop requirements . . . . . . . . . . . . . . . 22

Self-powered hubs . . . . . . . . . . . . . . . . . . . . . 22

Bus-powered hubs . . . . . . . . . . . . . . . . . . . . . 23

Overcurrent detection . . . . . . . . . . . . . . . . . . . 24

Overcurrent circuit description . . . . . . . . . . . . 24

Power switch selection . . . . . . . . . . . . . . . . . . 24

Tuning the overcurrent trip voltage . . . . . . . . . 25

Reference circuits . . . . . . . . . . . . . . . . . . . . . . 25

Pinning informatio n . . . . . . . . . . . . . . . . . . . . . . 3

ISP1122D (SO32) and ISP1122NB (SDIP32) . 3

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

ISP1122BD (LQFP32) . . . . . . . . . . . . . . . . . . . 6

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6

Limiting value s . . . . . . . . . . . . . . . . . . . . . . . . . 3 0

Static characteristic s . . . . . . . . . . . . . . . . . . . . 3 1

Dynamic characteristics . . . . . . . . . . . . . . . . . 32

Test informatio n . . . . . . . . . . . . . . . . . . . . . . . . 3 8

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 39

Functional description . . . . . . . . . . . . . . . . . . . 8

Analog transceivers . . . . . . . . . . . . . . . . . . . . . 8

Philips Serial Interface Engine (SIE). . . . . . . . . 9

Hub repeater. . . . . . . . . . . . . . . . . . . . . . . . . . . 9

End-of-frame timers . . . . . . . . . . . . . . . . . . . . . 9

General and individual port controlle r . . . . . . . . 9

GoodLink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Bit clock recovery . . . . . . . . . . . . . . . . . . . . . . . 9

Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . 9

PLL clock multiplier. . . . . . . . . . . . . . . . . . . . . 10

Overcurrent detection . . . . . . . . . . . . . . . . . . . 10

I²C-bus interface . . . . . . . . . . . . . . . . . . . . . . . 1 0

Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Surface mount packages . . . . . . . . . . . . . . . . 42

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 42

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 42

Manual soldering. . . . . . . . . . . . . . . . . . . . . . . 43

Through-hole mount packages . . . . . . . . . . . . 43

Soldering by dipping or by solder wave . . . . . 43

Manual soldering. . . . . . . . . . . . . . . . . . . . . . . 43

Modes of operation . . . . . . . . . . . . . . . . . . . . . 10

8.1

8.2

Endpoint description s . . . . . . . . . . . . . . . . . . . 1 1

Hub endpoint 0 (control) . . . . . . . . . . . . . . . . . 11

Hub endpoint 1 (interrupt). . . . . . . . . . . . . . . . 11

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 45

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 46

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Disclaimer s . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6

Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

9.1

9.2

9.3

Host request s . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2

Standard requests . . . . . . . . . . . . . . . . . . . . . 12

Hub specific requests . . . . . . . . . . . . . . . . . . . 13

Descriptors . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Hub responses . . . . . . . . . . . . . . . . . . . . . . . . 18

Get device status . . . . . . . . . . . . . . . . . . . . . . 18

Get configuration . . . . . . . . . . . . . . . . . . . . . . 18

Get interface status. . . . . . . . . . . . . . . . . . . . . 18

Get hub status . . . . . . . . . . . . . . . . . . . . . . . . 18

Get port status . . . . . . . . . . . . . . . . . . . . . . . . 19

Get configuration descriptor . . . . . . . . . . . . . . 20

Get device descriptor . . . . . . . . . . . . . . . . . . . 20

Get hub descriptor . . . . . . . . . . . . . . . . . . . . . 20

Get string descriptor (0) . . . . . . . . . . . . . . . . . 20

Get string descriptor (1) . . . . . . . . . . . . . . . . . 20

Get string descriptor (2) . . . . . . . . . . . . . . . . . 20

I²C-bus interface . . . . . . . . . . . . . . . . . . . . . . . 20

Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Hardware connections . . . . . . . . . . . . . . . . . . 21

Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . 21

10.1

10.2

10.3

Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner.

The information presented in this document does not form part of any quotation or

contract, is believed to be accurate and reliable and may be changed without notice. No

liability will be accepted by the publisher for any consequence of its use. Publication

thereof does not convey nor imply any license under patent- or other industrial or

intellectual property rights.

Date of release: 29 March 2000

Document order number: 9397 750 07002

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