INTEGRATED CIRCUITS
DATA SHEET
TDA1574T
Integrated FM tuner for radio
receivers
August 1990
Product specification
File under Integrated Circuits, IC01
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Philips Semiconductors
Product specification
Integrated FM tuner for radio receivers
TDA1574T
Coil data
L1: TOKO MC-108, 514HNE-150023S14; L = 0.078 µH
L2: TOKO MC-111, E516HNS-200057; L = 0.08 µH
L3: TOKO Coil set 7P, N1 = 5.5 5.5 turns, N2 = 4 turns
Fig.1 Block diagram and test circuit.
August 1990
3
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Philips Semiconductors
Product specification
Integrated FM tuner for radio receivers
TDA1574T
PINNING
1.
Mixer input 1
2.
Mixer input 2
3.
Wideband information input
Ground
4.
5.
Voltage reference
Oscillator output
Oscillator input 1
Oscillator input 2
Buffered oscillator output
Not connected
Not connected
IF output
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
Standby switch
Narrowband information input
IF input 1
IF input 2
Supply voltage
Mixer output 1
Mixer output 2
AGC output
Fig.2 Pinning diagram.
FUNCTIONAL DESCRIPTION
Mixer
The mixer circuit uses a double balanced multiplier with a preamplifier (common base input) in order to obtain a large
signal handling range and low oscillator radiation.
Oscillator
The oscillator circuit uses an amplifier with a differential input. Voltage regulation is achieved by utilizing the symmetrical
tan h-transfer-function to obtain low order 2nd harmonics.
Linear IF amplifier
The IF amplifier is a one stage, differential input, wideband amplifier with an output buffer.
Keyed AGC
The AGC processor combines narrow and wideband information via an RF level detector, a comparator and an ANDing
stage. The level dependent current sinking output has an active load which sets the AGC threshold.
The AGC function can either be controlled by a combination of wideband narrowband information (keyed AGC) or by a
wideband/narrowband information only. If narrowband AGC is required pin 3 should be connected to pin 5. If wideband
AGC is required pin 14 should be connected to pin 15.
August 1990
4
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Philips Semiconductors
Product specification
Integrated FM tuner for radio receivers
TDA1574T
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134); note 1.
PARAMETER
Supply voltage (pin 17)
CONDITIONS
SYMBOL
V17-4
MIN.
MAX.
14
UNIT
−
−
V
V
Mixer output voltage
(pins 18 and 19)
V18,19-4
35
Standby switch input voltage
(pin 13)
V13-4
V5-4
Ptot
−
−
−
−55
−40
23
V
V
Reference voltage (pin 5)
Total power dissipation
Storage temperature range
Operating ambient temperature range
7
500
+ 150
+ 85
mW
°C
°C
Tstg
Tamb
Notes to the ratings
1. All pins are short-circuit protected to ground.
THERMAL RESISTANCE
From junction to ambient (in free air)
Rth j-a = 95 K/W
August 1990
5
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Philips Semiconductors
Product specification
Integrated FM tuner for radio receivers
TDA1574T
CHARACTERISTICS
VP = V17-4 = 8.5 V; Tamb = 25 °C; measured in test circuit Fig.1;
All measurements are with respect to ground (pin 4); unless otherwise specified
PARAMETER
Supply (pin 17)
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage
VP = V17
V17
7
−
14
V
Supply current
(except mixer)
IP = I17
I17
V5
16
23
30
mA
V
Reference voltage (pin 5)
4.0
4.2
4.4
Mixer
DC characteristics
Input bias voltage
(pins 1 and 2)
V1,2
−
4
1
−
V
Output voltage
(pins 18 and 19)
Other current
V18,19
−
35
−
V
(pins 18 and 19)
I18 + 19
−
4.5
mA
fi = 98 MHz
AC characteristics
Noise figure
NF
−
9
−
dB
Noise figure including
transforming network
3rd order intercept point
Conversion power gain
Input resistance
NF
−
−
−
11
−
−
−
dB
EMF1IP3
GCP
115
14
dB/µV
dB
note 1
(pins 1 and 2)
R1,2
−
−
14
13
−
−
Ω
Output capacitance
(pins 18 and 19)
C18, 19
pF
Oscillator
DC characteristics
Input voltage
(pins 7 and 8)
V7,8
V6
−
−
1.3
2
−
−
V
V
Output voltage (pin 6)
AC characteristics
Residual FM (bandwidth =
300 Hz to 15 kHz)
de-emphasis = 50 µs
∆f
−
−
2.2
1.2
−
−
Hz
V
Linear IF amplifier
DC characteristics
Input bias voltage (pin 15)
V15
August 1990
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Philips Semiconductors
Product specification
Integrated FM tuner for radio receivers
TDA1574T
PARAMETER
Output voltage (pin 12)
AC characteristics
Input impedance
CONDITIONS
SYMBOL
V12
MIN.
TYP.
4.5
MAX.
UNIT
−
−
V
fi = 10.7 MHz
R16-15
C16-15
R12
240
−
240
−
300
13
300
3
360
−
360
−
Ω
pF
Ω
pF
dB
Output impedance
C12
Voltage gain
note 2
Gv
27
30
−
Voltage gain with
variation of temperature
Tamb = −40
to + 85 °C
∆GT
−
0
−
dB
1 dB compression point
(RMS value)
at VP = 8.5 V
V12(rms)
V12(rms)
S/N
−
−
−
750
550
6.5
−
−
−
mV
mV
dB
at VP = 7.5 V
Signal-to-noise ratio
RS = 300 Ω
Keyed AGC
DC characteristics
Output voltage range
(pin 20)
∆V20
0.5
−
VP−0.3
V
AGC output current
at I3 = 0 or
V14 = 450 mV;
V20 = VP/2
−I20
25
2
50
100
5
µA
at V3 = 2 V and
V14 = 1 V; V20 = V15
I20
−
mA
Narrowband threshold
at V3 = 2 V; V14 = 550 mV
at V3 = 2 V; V14 = 450 mV
V20
V20
−
−
−
1
V
V
VP−0.3
−
fi = 98 MHz
AC characteristics
Input impedance
R3
C3
−
−
4
3
−
−
kΩ
pF
August 1990
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Philips Semiconductors
Product specification
Integrated FM tuner for radio receivers
TDA1574T
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Wideband threshold
(RMS value)
(see Figs 3, 4, 5 and 6)
at V14 = 0.7 V;
V
20 = VP/2; I20 = 0
EMF2(rms)
−
−
17
−
−
mV
Oscillator output buffer
(pin 9)
DC output voltage
Oscillator output voltage
(RMS value)
V9
6
V
at RL = oo; CL = 2 pF
at RL = 75 Ω
DC output resistance
Signal purity
V9(rms)
V9(rms)
R9-17
−
30
−
110
50
−
−
−
mV
mV
kΩ
2.5
Total harmonic distortion
Spurious frequencies
at EMF 1 = 1 V; RS1 = 50 Ω
THD
fS
−
−
−15
−
−
dB
dB
−35
Electronic standby switch
(pin 11)
Oscillator; linear IF
amplifier; AGC
Tamb = −40
to + 85 °C
Input switching voltage
for threshold ON
for threshold OFF
Input current
V
20 = > VP−3 V
V13
V13
0
−
−
2.3
23
V
V
V20 = < 0.5 V
3.3
at ON condition
at OFF condition
Input voltage
V
13 = 0 V
V13 = 23 V
13 = 0
−I13
−I13
V13
−
−
−
−
−
−
150
10
µA
µA
V
I
4.4
Notes to the characteristics
1. Power gain conversion is equated by the following equation:
4 (VM (out) 10.7MHz) 2
(EMF1 98 MHz) 2
R S1
10 log
x
----------------------------------------------------------- ----------
RML
2. Voltage gain is equated by the following equation:
V12
20 log ------------------
V16 – 15
August 1990
8
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Philips Semiconductors
Product specification
Integrated FM tuner for radio receivers
TDA1574T
Fig.3 Keyed AGC output voltage V20 as a function
of RMS input voltage V3. Measured in test
circuit Fig.1 at V14 = 0.7 V; I20 = 0.
Fig.4 Keyed AGC output voltage V20 as a function
of input voltage V14. Measured in test circuit
Fig.1 at V3 = 2 V; I20 = 0.
Fig.5 Keyed AGC output current I20 as a function
of RMS input voltage V3. Measured in test
circuit Fig.1 at V14 = 0.7 V; V20 = 8.5 V.
Fig.6 Keyed AGC output voltage I20 as a function
of input voltage V14. Measured in test circuit
Fig.1 at V3 = 2 V; V20 = 8.5 V.
August 1990
9
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Philips Semiconductors
Product specification
Integrated FM tuner for radio receivers
TDA1574T
Coil data
L1: TOKO MC-108, N1 = 5.5 turns, N2 = 1 turn
L2: see Fig.1
L3: see Fig.1
(1) Field strength indication of main IF amplifier.
Fig.7 TDA1574T application diagram.
August 1990
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Philips Semiconductors
Product specification
Integrated FM tuner for radio receivers
TDA1574T
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT163-1
075E04
MS-013AC
August 1990
11
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Philips Semiconductors
Product specification
Integrated FM tuner for radio receivers
TDA1574T
SOLDERING
Introduction
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
August 1990
12
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Philips Semiconductors
Product specification
Integrated FM tuner for radio receivers
TDA1574T
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
August 1990
13
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