TFA9843AJ
20 W stereo power amplifier with volume control
Rev. 01 — 28 April 2006
Preliminary data sheet
1. General description
The TFA9843AJ contains two identical audio power amplifiers. The TFA9843AJ can be
used as two Single-Ended (SE) channels with a volume control. The maximum gain is
26 dB.
The TFA9843AJ comes in a 9-pin DIL-bent-SIL (DBS9P) power package. The TFA9843AJ
is pin compatible with the TFA9842AJ, TFA9843(B)J, TFA9842(B)J and TFA9841J. The
difference between the TFA9843AJ and the TFA9843(B)J, TFA9842(B)J, TFA9841J is the
functionality of pin 7. The TFA9843AJ has a volume control on pin 7 (VC). The
TFA9843(B)J, TFA9842(B)J and TFA9841J have a mode select on pin 7 (MODE).
The TFA9843AJ contains a unique protection circuit that is solely based on multiple
temperature measurements inside the chip. This gives maximum output power for all
supply voltages and load conditions with no unnecessary audio holes. Almost any supply
voltage and load impedance combination can be made as long as thermal boundary
conditions (number of channels used, external heatsink and ambient temperature) allow
it.
2. Features
I 2 channel SE: 1 W to 20 W operation possibility
I Soft clipping
I Input clamps
I Volume control
I Standby and Mute mode
I No on or off switching plops
I Low standby current
I High supply voltage ripple rejection
I Outputs short-circuit protected to ground, supply and across the load
I Thermally protected
I Pin compatible with the TFA9842AJ, TFA9843(B)J, TFA9842(B)J, TFA9841J
3. Applications
I CRT TV and LCD TV
I Monitors
I PC speakers
I Boom box
I Mini and micro audio receivers
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TFA9843AJ
Philips Semiconductors
20 W stereo power amplifier with volume control
6. Block diagram
V
CC
9
4
8
2
IN1
OUT1
OUT2
60
kΩ
1
3
IN2
CIV
60
kΩ
SHORT-CIRCUIT
AND
TEMPERATURE
PROTECTION
V
REF
V
CC
7
VOLUME
CONTROL
VC
0.5V
CC
6
SVR
TFA9843AJ
5
001aae428
GND
Fig 1. Block diagram
7. Pinning information
7.1 Pinning
1
2
3
4
5
6
7
8
9
IN2
OUT2
CIV
IN1
GND
SVR
VC
TFA9843AJ
OUT1
V
CC
001aae429
Fig 2. Pin configuration
TFA9843AJ_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 — 28 April 2006
3 of 19
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TFA9843AJ
Philips Semiconductors
20 W stereo power amplifier with volume control
7.2 Pin description
Table 3.
Symbol
IN2
Pin description
Pin
1
Description
input 2
OUT2
CIV
2
loudspeaker terminal 2
3
common input voltage decoupling
input 1
IN1
4
GND
SVR
VC
5
ground
6
half supply voltage decoupling (ripple rejection)
volume control input (standby, mute and volume control)
loudspeaker terminal 1
7
OUT1
VCC
8
9
supply voltage
8. Functional description
8.1 Input configuration
The input cut-off frequency is as follows:
1
f i(–3dB)
=
(1)
(2)
----------------------------
2π(Ri × Ci)
Single-ended application: Ri = 60 kΩ and Ci = 220 nF:
1
f i(–3dB)
=
= 12 Hz
----------------------------------------------------------------
2π(60 × 103 × 220 × 10–9
)
switch-on delay during charging of the input capacitors can be minimized. This results in a
good low frequency response and good switch-on behavior.
The TFA9843AJ has clamps on the inputs. In Standby mode the voltage on the input pins
is clamped for voltages lower than −0.1 V. When the TFA9843AJ is in Mute, Volume
control or Operating mode (maximum gain) the input clamp voltage is 1 V (RMS).
8.2 Power amplifier
The power amplifier is a single-ended amplifier with an all NPN output stage, capable of
delivering a peak output current of 4 A.
8.2.1 Output power measurement
The output power as a function of the supply voltage is measured on the output pins at
26 V and the maximum available output current is 4 A repetitive peak current. A minimum
measured with one channel driven.
TFA9843AJ_1
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Preliminary data sheet
Rev. 01 — 28 April 2006
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Philips Semiconductors
8.2.2 Headroom
20 W stereo power amplifier with volume control
Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom, compared to
the average power output, for transferring the loudest parts without distortion. At
Average Listening Level (ALL) music power without any distortion yields:
6.5
15.85
Po(ALL, SE)
=
= 410 mW
(3)
------------
For the average listening level a power dissipation of 4.2 W can be used for a heatsink
calculation.
Table 4.
Power rating as function of headroom
Power output (THD < 0.5 %)
Headroom
Power dissipation (P);
both channels driven
(SE)
0 dB
Po = 6.5 W
Po(ALL) = 410 mW
8.2 W
4.2 W
12 dB
8.3 Mode selection
The TFA9843AJ has four functional modes, which can be selected by applying the proper
Table 5.
VI(VC)
Mode selection
Status
Definition
0 V to 0.8 V
Standby
in this mode the current consumption is very low
and the outputs are floating; the device is in
Standby mode when VI(VC) < 0.8 V
1.2 V to 1.5 V
Mute
in this mode the amplifier is DC-biased but not
operational (no audio output); this allows the input
coupling capacitors to be charged to avoid plop
noise; the device is in Mute mode when
1.2 V < VI(VC) < 1.5 V
1.5 V to 5.0 V
5.0 V to VCC
Volume control
in this mode the volume of the amplifier can be
controlled; the gain can be adjusted between the
range of 1.5 V < VI(VC) < 5.0 V
On (maximum gain) in this mode the amplifier has its maximum gain; the
Operating mode is activated at VI(VC) > 5.0 V
8.4 Supply voltage ripple rejection
The supply voltage ripple rejection (SVRR) is measured with an electrolytic capacitor of
150 µF connected to pin SVR with a bandwidth of 20 Hz to 22 kHz. The SVRR as a
improves the ripple rejection behavior at the lower frequencies.
TFA9843AJ_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 — 28 April 2006
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TFA9843AJ
Philips Semiconductors
20 W stereo power amplifier with volume control
8.5 Built-in protection circuits
The TFA9843AJ contains two types of temperature sensors; one measures the local
temperatures of the power stages and one measures the global chip temperature. At a
local temperature of the power stage of approximately 185 °C or a global temperature of
approximately 150 °C this detection circuit switches off the power stages for 2 ms. When
the outputs are switched off the voltage is measured on the outputs. In the event of a
short-circuit to ground or to VCC the device will remain in Protection mode. In all other
cases the power stages switch-on automatically and the detection will take place again;
however a too high temperature will switch-off the power stages immediately. This can
result in repetitive switching during too high junction temperature. This protects the
TFA9843AJ against short-circuits to ground, to the supply voltage, across the load and too
high chip temperatures.
The protection will only be activated when necessary, so even during a short-circuit
condition, a certain amount of (pulsed) current will still flow through the short-circuit (as
much as the power stage can handle without exceeding the critical temperature level).
9. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
Parameter
Conditions
Min
Max
Unit
V
supply voltage
operating
−0.3 +28
VI
input voltage
−0.3 VCC + 0.3
V
IORM
Tstg
repetitive peak output current
storage temperature
ambient temperature
total power dissipation
-
4
A
non-operating
operating
−55
+150
+85
35
°C
°C
W
V
Tamb
Ptot
−40
-
-
VCC(scp)
short-circuit protection supply
voltage
26
10. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Value
Unit
thermal resistance from
junction to ambient
in free air
40
K/W
Rth(j-c)
thermal resistance from
junction to case
both channels
driven
2.0
K/W
TFA9843AJ_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 — 28 April 2006
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Philips Semiconductors
20 W stereo power amplifier with volume control
11. Static characteristics
Table 8.
Static characteristics
unless otherwise specified.
Symbol
VCC
Parameter
Conditions
operating
RL = ∞
Min
Typ
18
60
-
Max Unit
supply voltage
quiescent current
9
-
28
V
Iq
100
150
mA
µA
ICC(stb)
standby supply current VCC = 18 V;
-
VI(VC) < 0.8 V
VO
output voltage
-
9
-
-
V
V
VI(VC)
input voltage on pin VC On mode (maximum
gain)
5.0
VCC
Volume control mode
Mute mode
1.5
1.2
0
-
-
-
-
5.0
1.5
0.8
20
V
V
Standby mode
V
II(VC)
input current on pin VC 0 V < VI(VC) < VCC
-
µA
[1] A minimum load of 3 Ω is allowed at supply voltages > 22 V.
[2] The DC output voltage with respect to ground is approximately 0.5VCC
.
12. Dynamic characteristics
Table 9.
Dynamic characteristics SE
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
8.5
6.5
14
Max Unit
Po
output power
THD = 10 %; RL = 4 Ω
THD = 0.5 %; RL = 4 Ω
7
-
-
-
-
W
W
W
VCC = 22 V;
-
THD = 10 %; RL = 4 Ω
THD
total harmonic
distortion
Po = 1 W
-
0.1
0.5
%
Gv(max)
∆Gv
Vi
maximum voltage gain VI(VC) > 5.0 V
25
-
26
80
27
-
dB
dB
V
voltage gain range
input voltage
1.5 V < VI(VC) < 5.0 V
gain = 0 dB;
THD < 1 %
1.0
-
Zi
input impedance
40
-
60
-
-
-
-
kΩ
µV
dB
dB
Vn(o)
SVRR
noise output voltage
150
60
supply voltage ripple
rejection
fripple = 1 kHz
-
fripple = 100 Hz to
20 kHz
-
60
Vo(mute)
αcs
mute output voltage
channel separation
-
-
150
µV
dB
dB
ZS = 0 Ω
50
-
60
-
-
|∆Gv(max)
|
maximum voltage gain
difference
1
TFA9843AJ_1
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Preliminary data sheet
Rev. 01 — 28 April 2006
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TFA9843AJ
Philips Semiconductors
20 W stereo power amplifier with volume control
[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz
(unweighted), with a source impedance ZS = 0 Ω at the input.
[2] Supply voltage ripple rejection is measured at the output, with a source impedance ZS = 0 Ω at the input
and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a
frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail.
[3] Output voltage in Mute mode (VI(VC) = 1.35 V) and an input voltage of 1 V (RMS) in a bandwidth from 20 Hz
to 22 kHz, including noise.
mce485
001aae340
60
50
G
(dB)
V
P
o
(W)
0
40
20
0
−50
−100
−150
2 Ω
3 Ω
4 Ω
R
L
= 1 Ω
8 Ω
8
12
16
20
24
28
0
2.0
4.0
6.0
V
(V)
V
(V)
CC
I(VC)
VCC = 18 V
THD = 10 %
Fig 3. Voltage gain as a function of volume control
voltage
Fig 4. Output power (one channel) as a function of
supply voltage for various loads
001aaa446
mce488
2
10
10
THD + N
(%)
THD+N
(%)
10
1
1
−1
10
−1
10
−2
10
−2
10
10
10
2
3
4
5
−1
2
10
10
10
10
1
10
10
f (Hz)
P
(W)
o
VCC = 18 V; f = 1 kHz; RL = 4 Ω
VCC = 18 V; Po = 1 W; RL = 4 Ω
Fig 5. Total harmonic distortion-plus-noise as a
function of output power
Fig 6. Total harmonic distortion-plus-noise as a
function of frequency
TFA9843AJ_1
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Preliminary data sheet
Rev. 01 — 28 April 2006
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TFA9843AJ
Philips Semiconductors
20 W stereo power amplifier with volume control
mce491
mce507
50
10
P
P
o
tot
(W)
(W)
40
8
30
20
6
4
10
0
2
0
8
12
16
20
24
V
28
0
4
8
12
16
20
P
o
(W)
(V)
CC
THD = 10 %; RL = 4 Ω; f = 1 kHz
VCC = 18 V; RL = 4 Ω
Fig 7. Output power as a function of supply voltage
Fig 8. Total power dissipation as a function of channel
output power per channel (worst case, both
channels driven)
mce497
mce495
0
0
α
(dB)
cs
SVRR
(dB)
−20
−20
−40
−60
−80
−40
−60
−80
−100
2
3
4
5
2
3
4
5
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
VCC = 18 V; RL = 4 Ω
VCC = 18 V; ZS = 0 Ω; Vripple = 300 mV (RMS); a
bandpass filter of 20 Hz to 22 kHz has been applied;
inputs short-circuited.
Fig 9. Channel separation as a function of frequency
(no bandpass filter applied)
Fig 10. Supply voltage ripple rejection as a function of
frequency
TFA9843AJ_1
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Preliminary data sheet
Rev. 01 — 28 April 2006
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20 W stereo power amplifier with volume control
13. Application information
13.1 Application diagrams
13.1.1 Single-ended application
V
CC
V
9
CC
100 nF
1000 µF
220 nF
IN1
OUT1
4
8
2
+
−
1000 µF
V
V
R
L
4 Ω
i
i
60 kΩ
220 nF
IN2
CIV
OUT2
1
3
−
+
1000 µF
R
L
60 kΩ
4 Ω
−
SHORT-CIRCUIT
AND
TEMPERATURE
PROTECTION
V
REF
V
CC
VC
VOLUME
7
CONTROL
MICRO-
CONTROLLER
0.5V
CC
6
SVR
TFA9843AJ
22 µF
10 µF
150 µF
5
001aae430
GND
Fig 11. SE application diagram
Remark: By switching inductive loads, the output voltage can rise beyond the maximum
supply voltage of 28 V. At high supply voltage it is recommended to use (Schottky) diodes
between the supply voltage and ground.
TFA9843AJ_1
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Preliminary data sheet
Rev. 01 — 28 April 2006
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TFA9843AJ
Philips Semiconductors
20 W stereo power amplifier with volume control
13.1.2 Volume control drive options
V
CC
R1
10 kΩ
T1
D1
5.6 V
5 V
R2
1 kΩ
R3
1 kΩ
GND
R4
VC
1 kΩ
T3
C1
R5
10 µF
PWM
3.3 V
T2
1 kΩ
001aae337
Fig 12. Volume control drive circuit with 3.3 V PWM
R4
PWM
VC
5 V
1 kΩ
C1
10 µF
001aae338
Fig 13. Volume control drive circuit with 5 V PWM
V
CC
R1
10 kΩ
T1
R5
D1
VC
10 V
16 kΩ
C1
R6
10 µF
16 kΩ
001aae339
Fig 14. Volume control drive circuit with potentiometer
TFA9843AJ_1
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Preliminary data sheet
Rev. 01 — 28 April 2006
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20 W stereo power amplifier with volume control
13.2 Printed-circuit board
13.2.1 Layout and grounding
To obtain a high-level system performance, certain grounding techniques are essential.
The input reference grounds have to be tied with their respective source grounds and
must have separate tracks from the power ground tracks; this will prevent the large output
signal currents from interfering with the small AC input signals. The small-signal ground
tracks should be physically located as far as possible from the power ground tracks.
Supply and output tracks should be as wide as possible for delivering maximum output
power.
AUDIO POWER CS NIJMEGEN
2 0 a 0 n 3 . / 2 F 7 P J
TVA
TFA9843J
100 nF
1000 µF
220
220
nF
nF
150 µF
CIV
MODE
22
µF
10
kΩ
SGND
+V
P
10 kΩ
CIV
SB ON
MUTE
IN2+
IN1+
mce506
Fig 15. Printed-circuit board layout (single-sided); components view
13.2.2 Power supply decoupling
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor location should be as close as possible to the
device and connected to the power ground. Proper power supply decoupling also prevents
unwanted oscillations.
For suppressing higher frequency transients (spikes) on the supply rail a capacitor with
low ESR (typical 100 nF) has to be placed as close as possible to the device. For
suppressing lower frequency noise and ripple signals, a large electrolytic capacitor (e.g.
1000 µF or greater) must be placed close to the device.
The bypass capacitor connected to pin SVR reduces the noise and ripple on the mid rail
voltage. For good THD and noise performance, a low ESR capacitor is recommended.
TFA9843AJ_1
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Preliminary data sheet
Rev. 01 — 28 April 2006
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20 W stereo power amplifier with volume control
13.3 Thermal behavior and heatsink calculation
The measured maximum thermal resistance of the IC package, Rth(j-mb), is 2.0 K/W.
A calculation for the heatsink can be made, with the following parameters:
Tamb(max) = 60 °C (example)
VCC = 18 V and RL = 4 Ω (SE)
Tj(max) = 150 °C (specification)
Rth(tot) is the total thermal resistance between the junction and the ambient including the
heatsink. This can be calculated using the maximum temperature increase divided by the
power dissipation:
Rth(tot) = (Tj(max) − Tamb(max))/P
At VCC = 18 V and RL = 4 Ω (2 × SE) the measured worst case sine wave dissipation is
dissipation, is: 150 − 60 = 90 °C:
P × Rth(tot) = 90 °C
Rth(tot) = 90/8.4 K/W = 10.7 K/W
Rth(h-a) = Rth(tot) − Rth(j-mb) = 10.7 K/W − 2.0 K/W = 8.7 K/W
This calculation is for an application at worst case (stereo) sine wave output signals. In
practice music signals will be applied, which decreases the maximum power dissipation to
use of a smaller heatsink:
P × Rth(tot) = 90 °C
Rth(tot) = 90/4.2 K/W = 21.4 K/W
Rth(h-a) = Rth(tot) − Rth(j-mb) = 21.4 K/W − 2.0 K/W = 19.4 K/W
TFA9843AJ_1
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Preliminary data sheet
Rev. 01 — 28 April 2006
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TFA9843AJ
Philips Semiconductors
20 W stereo power amplifier with volume control
mce504
150
(1)
(2)
(3)
(4)
(5)
T
j
(˚C)
100
50
0
8
12
16
20
24
28
VCC (V)
(1) RL = 2 Ω
(2) RL = 4 Ω
(3) RL = 6 Ω
(4) RL = 8 Ω
(5) RL = 16 Ω
2 × SE loads; Tamb = 25 °C; external heatsink of 10 K/W; music signals.
Fig 16. Junction temperature as a function of supply voltage
14. Test information
14.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
TFA9843AJ_1
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20 W stereo power amplifier with volume control
15. Package outline
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
q
1
non-concave
x
E
h
D
h
D
D
view B: mounting base side
1
P
A
2
k
q
2
B
E
q
L
3
L
2
L
1
L
1
9
e
w
M
Q
c
v
M
Z
1
b
p
e
m
e
2
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(2)
(1)
(2)
(1)
(1)
UNIT A
b
c
D
D
D
E
E
e
e
e
k
L
L
L
L
m
P
Q
q
q
q
2
v
w
x
Z
2
p
1
h
h
1
2
1
2
3
1
2.7 0.80 0.58 13.2 6.2
2.3 0.65 0.48 12.8 5.8
14.7
14.3
3
2
12.4 11.4 6.7 4.5
11.0 10.0 5.5 3.7
3.4
3.1
1.65
1.10
1.15 17.5
0.85 16.3
3.8
3.6
mm
2.8
4.85
0.8
0.3 0.02
3.5
3.5
2.54 1.27 5.08
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D may protrude 0.04 mm maximum.
1
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-07-03
03-03-12
SOT523-1
Fig 17. Package outline SOT523-1 (DBS9P)
TFA9843AJ_1
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Preliminary data sheet
Rev. 01 — 28 April 2006
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20 W stereo power amplifier with volume control
16. Soldering
16.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 °C and 400 °C, contact may be up to 5 seconds.
16.4 Package related soldering information
Table 10. Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Package
Soldering method
Dipping
Wave
CPGA, HCPGA
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP[2]
suitable
-
suitable[1]
not suitable
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
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Preliminary data sheet
Rev. 01 — 28 April 2006
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17. Revision history
Table 11. Revision history
Document ID
Release date
20060428
Data sheet status
Change notice
Supersedes
TFA9843AJ_1
Preliminary data sheet
-
-
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18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.semiconductors.philips.com.
malfunction of a Philips Semiconductors product can reasonably be expected
18.2 Definitions
to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is for the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
19. Contact information
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Rev. 01 — 28 April 2006
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20. Contents
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
Date of release: 28 April 2006
Document identifier: TFA9843AJ_1
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