Philips Stereo Amplifier TDA7050T User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA7050T  
Low voltage mono/stereo power  
amplifier  
July 1994  
Product specification  
File under Integrated Circuits, IC01  
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050T  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
Supply voltage  
V
max.  
max.  
6 V  
P
Peak output current  
I
150 mA  
OM  
Total power dissipation  
Storage temperature range  
Crystal temperature  
see derating curve Fig.1  
T
T
55 to + 150 °C  
max.  
stg  
c
100 °C  
A.C. and d.c. short-circuit duration  
at V = 3,0 V (during mishandling)  
t
max.  
5 s  
P
sc  
MLB950  
600  
handbook, halfpage  
P
tot  
(mW)  
400  
200  
0
50  
0
50  
100  
T
150  
( C)  
o
amb  
Fig.1 Power derating curve.  
SO PACKAGE DESIGN EXAMPLE  
To achieve the small dimension of the encapsulation the SO package is preferred with only 8 pins. Because a heatsink  
is not applicable, the dissipation is limited by the thermal resistance of the 8-pin SO encapsulation until:  
T
j max Tamb  
100 60  
----------------------  
160  
=
= 0.25 W  
---------------------------------  
Rth j-a  
July 1994  
3
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050T  
CHARACTERISTICS  
V = 3 V; f = 1 kHz; R = 32 ; T  
= 25 °C; unless otherwise specified  
P
L
amb  
PARAMETER  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Supply  
Supply voltage  
V
1,6  
6,0  
V
P
Total quiescent current  
I
3,2  
4
mA  
tot  
Bridge-tied load application (BTL); see Fig.4  
*
Output power  
V = 3,0 V; d = 10%  
P
P
140  
150  
32  
mW  
mW  
dB  
P
tot  
o
V = 4,5 V; d = 10% (R = 64 )  
P
tot  
L
o
Voltage gain  
G
v
Noise output voltage (r.m.s. value)  
R = 5 k; f = 1 kHz  
V
1
140  
tbf  
40  
70  
µV  
µV  
mV  
MΩ  
nA  
S
no(rms)  
no(rms)  
R = 0 ; f = 500 kHz; B = 5 kHz  
V
S
D.C. output offset voltage (at R = 5 k)  
|V|  
|Z |  
S
Input impedance (at R = )  
S
i
Input bias current  
I
i
Stereo application; see Fig.5  
*
Output power  
V = 3,0 V; d = 10%  
P
35  
75  
26  
mW  
mW  
dB  
P
tot  
o
V = 4,5 V; d = 10%  
P
P
tot  
o
Voltage gain  
G
24.5  
27.5  
v
Noise output voltage (r.m.s. value)  
R = 5 k; f = 1 kHz  
V
100  
tbf  
µV  
µV  
S
no(rms)  
no(rms)  
R = 0 ; f = 500 kHz; B = 5 kHz  
V
S
Channel separation  
R = 0 ; f = 1 kHz  
α
|Z |  
30  
2
40  
dB  
MΩ  
nA  
S
Input impedance (at R = )  
S
i
Input bias current  
I
20  
i
*
Output power is measured directly at the output pins of the IC. It is shown as a function of the supply voltage in Fig.2  
(BTL application) and Fig.3 (stereo application).  
July 1994  
4
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050T  
Fig.2 Output power across the load impedance (R ) as a function of supply voltage (V ) in BTL application.  
L
P
Measurements were made at f = 1 kHz; d = 10%; T  
= 25 °C.  
tot  
amb  
Fig.3 Output power across the load impedance (R ) as a function of supply voltage (V ) in stereo application.  
L
P
Measurements were made at f = 1 kHz; d = 10%; T  
= 25 °C.  
tot  
amb  
July 1994  
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050T  
APPLICATION INFORMATION  
Fig.4 Application diagram (BTL); also used as test circuit.  
Fig.5 Application diagram (stereo); also used as test circuit.  
6
July 1994  
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050T  
PACKAGE OUTLINE  
SO8: plastic small outline package; 8 leads; body width 3.9 mm  
SOT96-1  
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
4
e
w
M
detail X  
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(2)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
5.0  
4.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.050  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.20  
0.014 0.0075 0.19  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches 0.069  
0.01 0.004  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-02-04  
97-05-22  
SOT96-1  
076E03S  
MS-012AA  
July 1994  
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050T  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
SOLDERING  
Introduction  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Reflow soldering  
Reflow soldering techniques are suitable for all SO  
packages.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
Wave soldering  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
The package footprint must incorporate solder thieves at  
the downstream end.  
July 1994  
8
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050T  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
July 1994  
9
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