INTEGRATED CIRCUITS
DATA SHEET
TDA6107JF
Triple video output amplifier
Product specification
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
BLOCK DIAGRAM
V
DD
6
MIRROR 1
MIRROR 5
TDA6107JF
CASCODE 1
3×
MIRROR 4
V
V
oc(3),
oc(2),
9, 8, 7
CURRENT
SOURCE
1×
V
oc(1)
1×
R
f
THERMAL
VIP
REFERENCE
DIFFERENTIAL
STAGE
PROTECTION
CIRCUIT
V
V
,
,
i(1)
i(2)
1, 2, 3
5
MIRROR 3
I
o(m)
R
V
i
i(3)
R
a
3×
CASCODE 2
MIRROR 2
4
MBL525
Fig.1 Block diagram (one amplifier shown).
PINNING
handbook, halfpage
SYMBOL
PIN
DESCRIPTION
V
V
V
1
2
3
4
5
6
7
8
9
i(1)
i(2)
i(3)
Vi(1)
1
2
3
4
5
6
7
8
9
inverting input 1
Vi(2)
inverting input 2
Vi(3)
inverting input 3
GND
GND
Iom
ground (fin)
I
om
black-current measurement output
supply voltage
TDA6107JF
V
VDD
DD
Voc(3)
Voc(2)
Voc(1)
cathode output 3
cathode output 2
cathode output 1
V
V
V
oc(3)
oc(2)
oc(1)
MBL524
Fig.2 Pin configuration.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages measured with respect to pin 4
(ground); currents as specified in Fig.1; unless otherwise specified.
SYMBOL
PARAMETER
MIN.
MAX.
250
UNIT
VDD
Vi
supply voltage
0
0
0
0
0
V
V
V
V
A
input voltage at pins 1 to 3
12
6
Vo(m)
Voc
measurement output voltage
cathode output voltage
VDD
3
Iocsm(L)
LOW non-repetitive peak cathode output current at a flashover
discharge of 100 µC
Iocsm(H)
HIGH non-repetitive peak cathode output current at a flashover
discharge of 100 nC
0
6
A
Tstg
Tj
storage temperature
−55
−20
+150
+150
°C
°C
junction temperature
Ves
electrostatic handling voltage
Human Body Model (HBM)
Machine Model (MM)
−
−
3000
300
V
V
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices”).
QUALITY SPECIFICATION
Quality specification “SNW-FQ-611 part D” is applicable and can be found in the “Quality reference Handbook”.
The handbook can be ordered using the code 9397 750 00192.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
Rth(j-fin)
Rth(h-a)
PARAMETER
CONDITIONS
VALUE
UNIT
thermal resistance from junction to ambient
thermal resistance from junction to fin
56
11
18
K/W
K/W
K/W
note 1
thermal resistance from heatsink to ambient
Note
1. An external heatsink is necessary.
Thermal protection
The internal thermal protection circuit gives a decrease of
the slew rate at high temperatures: 10% decrease at
130 °C and 30% decrease at 145 °C (typical values on the
spot of the thermal protection circuit).
MBH989
8
handbook, halfpage
P
tot
(W)
(1)
6
4
(2)
outputs
5 K/W
handbook, halfpage
2
thermal protection circuit
6 K/W
0
−40
0
40
80
120
T
160
(°C)
MGK279
fin
amb
(1) Infinite heatsink.
(2) No heatsink.
Fig.3 Power derating curves.
Fig.4 Equivalent thermal resistance network.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
CHARACTERISTICS
Operating range: Tj = −20 to +150 °C; VDD = 180 to 210 V. Test conditions: Tamb = 25 °C; VDD = 200 V;
Vo(c1) = Vo(c2) = Vo(c3) = 1⁄2VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W
(measured in test circuit of Fig.8); unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
5.6
TYP.
6.6
MAX.
7.6
UNIT
mA
Iq
quiescent supply current
Vref(int)
internal reference voltage
(input stage)
−
2.5
−
V
Ri
input resistance
gain of amplifier
gain difference
−
3.6
51.0
0
−
kΩ
G
47.5
−2.5
116
55.0
+2.5
142
∆G
VO(oc)
nominal output voltage at
pins 7, 8 and 9 (DC value)
Ii = 0 µA
Ii = 0 µA
129
V
V
∆VO(oc)(offset) differential nominal output
offset voltage between
−
0
5
pins 7 and 8, 8 and 9 and
9 and 7 (DC value)
∆Vo(c)(T)
output voltage temperature
drift at pins 7, 8 and 9
−
−
10
0
−
−
mV/K
mV/K
∆Vo(c)(T)(offset) differential output offset
voltage temperature drift
between pins 7 and 8,
8 and 9 and 7 and 9
Io(m)(offset)
offset current of measurement Io(c) = 0 µA;
−50
−
+50
−1.1
−1.1
µA
output (for three channels)
1.5 V < Vi < 5.5 V;
1.8 V < Vo(m) < 6 V
∆Io(m)/∆Io(c)
linearity of current transfer
(for three channels)
−100 µA < Io(c) < 100 µA;
1.5 V < Vi < 5.5 V;
−0.9
−0.9
−1.0
−1.0
1.8 V < Vo(m) < 6 V
−100 µA ≤ Io(c) < 10 mA;
1.5 V < Vi < 5.5 V;
1.8 V < Vo(m) < 4 V
Io(c)(max)
Vo(c)(min)
Vo(c)(max)
BS
maximum peak output current 50 V < Vo(c) < VDD − 50 V
−
−
20
−
mA
V
(pins 7, 8 and 9)
minimum output voltage
(pins 7, 8 and 9)
Vi = 7.0 V; at Io(c) = 0 mA;
note 1
−
10
−
maximum output voltage
(pins 7, 8 and 9)
Vi = 1.0 V; at Io(c) = 0 mA;
note 1
VDD − 15 −
V
small signal bandwidth
(pins 7, 8 and 9)
Vo(c) = 60 V (p-p)
−
−
−
5.5
−
MHz
MHz
ns
BL
large signal bandwidth
(pins 7, 8 and 9)
Vo(c) = 100 V (p-p)
4.5
60
−
tPco
cathode output propagation
Vo(c) = 100 V (p-p) square
−
time 50% input to 50% output wave; f <1 MHz;
(pins 7, 8 and 9)
tr = tf = 40 ns
(pins 1, 2 and 3);
see Figs 6 and 7
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
SYMBOL
∆tPco
PARAMETER
CONDITIONS
MIN.
−10
TYP.
MAX.
+10
UNIT
ns
difference in cathode output
propagation time 50% input to wave; f < 1 MHz;
V
o(c) = 100 V (p-p) square
0
50% output (pins 7 and 8,
7 and 9 and 8 and 9)
tr = tf = 40 ns
(pins 1, 2 and 3)
to(r)
to(f)
tst
cathode output rise time
10% output to 90% output
(pins 7, 8 and 9)
Vo(c) = 50 to 150 V square
wave; f < 1 MHz; tf = 40 ns
(pins 1, 2 and 3); see Fig.6
67
67
−
91
91
−
113
113
350
ns
ns
ns
cathode output fall time
90% output to 10% output
(pins 7, 8 and 9)
Vo(c) = 150 to 50 V square
wave; f < 1 MHz; tr = 40 ns
(pins 1, 2 and 3); see Fig.7
settling time 50% input to
99% < output < 101%
(pins 7, 8 and 9)
Vo(c) = 100 V (p-p) square
wave; f < 1 MHz;
tr = tf = 40 ns
(pins 1, 2 and 3);
see Figs 6 and 7
SR
Ov
slew rate between
50 V to (VDD − 50 V)
(pins 7, 8 and 9)
Vi = 4 V (p-p) square wave;
f < 1 MHz; tr = tf = 40 ns
(pins 1, 2 and 3)
−
−
900
2
−
−
V/µs
cathode output voltage
overshoot (pins 7, 8 and 9)
Vo(c) = 100 V (p-p) square
wave; f < 1 MHz;
tr = tf = 40 ns
%
(pins 1, 2 and 3);
see Figs 6 and 7
PSRR
power supply rejection ratio
f < 50 kHz; note 2
−
−
55
−
−
dB
dB
αct(DC)
DC crosstalk between
channels
−50
Notes
1. See also Fig.5 for the typical DC-to-DC transfer of VI to VO(oc)
.
2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
MBH988
200
handbook, halfpage
V
o(c)
(V)
160
129
120
80
40
0
0
2.5
2
4
6
V (V)
i
Fig.5 Typical DC-to-DC transfer of VI to VOC
.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
4.04
V
i
(V)
3.08
t
2.12
t
st
O
(in %)
v
151
149
150
140
V
o(c)
(V)
100
60
50
t
t
o(r)
MGK280
t
Pco
Fig.6 Output voltage (pins 7, 8 and 9) rising edge as a function of the AC input signal.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
4.04
V
i
(V)
3.08
t
2.12
t
st
150
140
V
o(c)
(V)
100
O
(in %)
v
51
60
50
49
t
t
o(f)
MGK281
t
Pco
Fig.7 Output voltage (pins 7, 8 and 9) falling edge as a function of the AC input signal.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
Cathode output
Dissipation
The cathode output is protected against peak current
(caused by positive voltage peaks during high-resistance
flash) of 3 A maximum with a charge content of 100 µC (1)
Regarding dissipation, distinction must first be made
between static dissipation (independent of frequency) and
dynamic dissipation (proportional to frequency).
.
The cathode is also protected against peak currents
(caused by positive voltage peaks during low-resistance
flash) of 6 A maximum with a charge content of 100 nC (1)
The static dissipation of the TDA6107JF is due to voltage
supply currents and load currents in the feedback network
and CRT.
.
The DC voltage of VDD (pin 6) must be within the operating
range of 180 to 210 V during the peak currents.
The static dissipation Pstat equals:
Pstat = VDD × IDD + 3 × VOC × IOC
Flashover protection
Where:
VDD = supply voltage
The TDA6107JF incorporates protection diodes against
CRT flashover discharges that clamp the cathodes output
IDD = supply current
voltage up to a maximum of VDD + Vdiode
.
VOC = DC value of cathode voltage
IOC = DC value of cathode current.
To limit the diode current an external 1.5 kΩ carbon
high-voltage resistor in series with the cathode output and
a 2 kV spark gap are needed (for this resistor value, the
The dynamic dissipation Pdyn equals:
CRT has to be connected to the main PCB (1)
.
Pdyn = 3 × VDD × (CL + Cint) × fi × Voc(p-p) × δ
VDD must be decoupled to GND:
Where:
1. With a capacitor >20 nF with good HF behaviour
(e.g. foil); this capacitor must be placed as close as
possible to pins 6 and 4, but definitely within 5 mm.
CL = load capacitance
Cint = internal load capacitance (≈4 pF)
fi = input frequency
2. With a capacitor >3.3 µF on the picture tube base
Voc(p-p) = output voltage (peak-to-peak value)
δ = non-blanking duty cycle.
print, depending on the CRT size.
Switch-off behaviour
The IC must be mounted on the picture tube base print to
minimize the load capacitance CL.
The switch-off behaviour of the TDA6107JF is controllable.
This is because the output pins of the TDA6107JF are still
under control of the input pins for low power supply
voltages (approximately 30 V and higher).
Bandwidth
The addition of the flash resistor produces a decreased
bandwidth and increases the rise and fall times; see
“Application Note AN96072”.
(1)External protection against higher currents is described
in “Application Note AN96072”.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
TEST AND APPLICATION INFORMATION
V
DD
C7
20 nF
C8
10 µF
J1
6
R
C1
f
f
f
R
R
R
22 µF
i
V
I
1
of
V
V
V
V
i(1)
oc(1)
9
C2
1
R
a
a
a
C10
R1
om
22 nF
6.8 pF
2 MΩ
C9
probe 1
probe 2
probe 3
3.2 pF
C11
136 pF
R2
100 kΩ
J2
R
C3
22 µF
i
V
2
of
V
i(2)
oc(2)
8
C4
2
R
C13
6.8 pF
I
R3
2 MΩ
om
22 nF
C12
3.2 pF
C14
136 pF
R4
100 kΩ
J3
R
C5
22 µF
i
V
3
of
V
i(3)
oc(3)
7
C6
3
R
C16
6.8 pF
I
R5
2 MΩ
om
22 nF
C15
3.2 pF
C17
R6
136 pF
100 kΩ
VIP
REFERENCE
5
TDA6107JF
V
o(m)
4
4 V
MBL526
Current sources J1, J2 and J3 are to be tuned so that Vo(c) of pins 9, 8 and 7 is set to 100 V.
Fig.8 Test circuit.
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
INTERNAL CIRCUITRY
V
GND
4
DD
6
to cascode
stage
to black current
measurement circuit
TDA6107JF
1, 2, 3
(1)
esd
from
input
circuit
flash
7, 8, 9
esd
esd
esd
V
to black current
bias
from
input
circuit
measurement circuit
from
control
circuit
5
from black
current
esd
measurement
circuit
esd
6.8 V
from
control
circuit
to black current
measurement circuit
to black current
measurement circuit
MBL527
(1) All pins have an energy protection for positive or negative overstress situations.
Fig.9 Internal pin configuration.
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
PACKAGE OUTLINE
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
SOT111-1
D
D
1
A
q
2
P
P
1
Q
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
e
b
e
Z
2
b
w
M
2
θ
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
2
(1)
(1)
Z
UNIT
A
A
A
b
b
b
c
D
D
E
e
e
L
P
P
Q
q
q
q
2
w
θ
3
4
1
2
1
2
1
1
max.
o
o
18.5
17.8
8.7 15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
65
55
4.4 5.9
4.2 5.7
2.54 2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-03-11
SOT111-1
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
SOLDERING
The total contact time of successive solder waves must not
exceed 5 seconds.
Introduction to soldering through-hole mount
packages
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
300 and 400 °C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable(1)
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
NOTES
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
NOTES
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
NOTES
2002 Oct 18
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Philips Semiconductors – a worldwide company
Contact information
Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753504/02/pp20
Date of release: 2002 Oct 18
Document order number: 9397 750 10545
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