Philips Stereo Amplifier TDA2611A User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA2611A  
5 W audio power amplifier  
November 1982  
Product specification  
File under Integrated Circuits, IC01  
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Philips Semiconductors  
Product specification  
5 W audio power amplifier  
TDA2611A  
Fig.1 Circuit diagram; pin 3 not connected.  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
Supply voltage  
V
max.  
35 V  
3 A  
P
Non-repetitive peak output current  
Repetitive peak output current  
Total power dissipation  
I
I
max.  
max.  
OSM  
ORM  
1,5 A  
see derating curves Fig. 2  
Storage temperature  
T
T
55 to + 150 °C  
25 to + 150 °C  
stg  
Operating ambient temperature  
amb  
November 1982  
3
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Philips Semiconductors  
Product specification  
5 W audio power amplifier  
TDA2611A  
Fig.2 Power derating curves.  
HEATSINK EXAMPLE  
Assume V = 18 V; R = 8 ; T  
= 60 °C maximum; T = 150 °C (max. for a 4 W application into an 8 load, the  
P
L
amb  
j
maximum dissipation is about 2,2 W).  
The thermal resistance from junction to ambient can be expressed as:  
150 60  
Rth j-a = Rth j-tab + Rth tab-h + Rth h-a  
=
= 41 K/W.  
----------------------  
2, 2  
Since R  
= 11 K/W and R  
= 1 K/W, R = 41 (11 + 1) = 29 K/W.  
th h-a  
th j-tab  
th tab-h  
November 1982  
4
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Philips Semiconductors  
Product specification  
5 W audio power amplifier  
TDA2611A  
D.C. CHARACTERISTICS  
Supply voltage range  
V
I
6 to 35 V  
P
Repetitive peak output current  
<
1,5 A  
ORM  
tot  
Total quiescent current at V = 18 V  
I
typ.  
25 mA  
P
A.C. CHARACTERISTICS  
T
= 25 °C; V = 18 V; R = 8 ; f = 1 kHz unless otherwise specified; see also Fig. 3  
amb  
P
L
A.F. output power at d = 10%  
tot  
>
4 W  
4,5 W  
1,7 W  
0,65 W  
6 W  
V = 18 V; R = 8 Ω  
P
P
L
o
typ.  
typ.  
typ.  
typ.  
typ.  
typ.  
<
V = 12 V; R = 8 Ω  
P
P
P
P
P
L
o
o
o
o
V = 8,3 V; R = 8 Ω  
P
L
V = 20 V; R = 8 Ω  
P
L
V = 25 V; R = 15 Ω  
5 W  
P
L
0,3 %  
1 %  
Total harmonic distortion at P = 2 W  
d
o
tot  
Frequency response  
Input impedance  
>
15 kHz  
(1)  
|Z |  
typ.  
typ.  
<
45 kΩ  
0,2 mV  
0,5 mV  
55 mV  
i
Noise output voltage at R = 5 k; B = 60 Hz to 15 kHz  
V
S
n
typ.  
Sensitivity for P = 2,5 W  
V
o
i
44 to 66 mV  
Note  
1. Input impedance can be increased by applying C and R between pins 5 and 9 (see also Figures 6 and 7).  
November 1982  
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Philips Semiconductors  
Product specification  
5 W audio power amplifier  
TDA2611A  
Fig.3 Test circuit; pin 3 not connected.  
Fig.4 Total harmonic distortion as a function of output power.  
November 1982  
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Philips Semiconductors  
Product specification  
5 W audio power amplifier  
TDA2611A  
Fig.5 Output power as a function of supply voltage.  
Fig.6 Input impedance as a function of frequency; curve a for C = 1 µF, R = 0 ; curve b for  
C = 1 µF, R = 1 k; circuit of Fig. 3; C2 = 10 pF; typical values.  
November 1982  
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Philips Semiconductors  
Product specification  
5 W audio power amplifier  
TDA2611A  
Fig.7 Input impedance as a function of R in circuit of Fig. 3; C = 1 µF; f = 1 kHz.  
Fig.8 Total harmonic distortion as a function of R in the circuit of Fig. 3; P = 3,5 W; f = 1 kHz.  
S
o
November 1982  
8
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Philips Semiconductors  
Product specification  
5 W audio power amplifier  
TDA2611A  
Fig.9 Total power dissipation and efficiency as a function of output power.  
November 1982  
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Philips Semiconductors  
Product specification  
5 W audio power amplifier  
TDA2611A  
APPLICATION INFORMATION  
Fig.10 Ceramic pickup amplifier circuit.  
Fig.11 Total harmonic distortion as a function of output power;  
with tone control;  
− − − without tone control; in circuit of Fig. 10; typical values.  
November 1982  
10  
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Philips Semiconductors  
Product specification  
5 W audio power amplifier  
TDA2611A  
Fig.12 Frequency characteristics of the circuit of Fig. 10;  
tone control max. high;  
− − tone control min. high; P relative to 0 dB = 3 W; typical values.  
o
Fig.13 Frequency characteristic of the circuit of Fig. 10; volume control at the top; tone control max. high.  
November 1982  
11  
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Philips Semiconductors  
Product specification  
5 W audio power amplifier  
TDA2611A  
PACKAGE OUTLINE  
SIL9MPF: plastic single in-line medium power package with fin; 9 leads  
SOT110-1  
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index  
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
Z
max.  
A
max.  
2
(1)  
(1)  
E
UNIT  
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5  
17.8  
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48  
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20  
3.9 2.75 3.4 1.75 15.1  
3.4 2.50 3.2 1.55 14.9  
4.4  
4.2  
5.9  
5.7  
2.54  
mm  
3.7  
0.25 1.0  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-02-25  
SOT110-1  
November 1982  
12  
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Philips Semiconductors  
Product specification  
5 W audio power amplifier  
TDA2611A  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
SOLDERING  
Introduction  
specified maximum storage temperature (T  
). If the  
stg max  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
November 1982  
13  
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