INTEGRATED CIRCUITS
DATA SHEET
TDA1552Q
2 x 22 W BTL stereo car radio
power amplifier
July 1994
Product specification
File under Integrated Circuits, IC01
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Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
V
V
P1
P2
3
10
1
mute switch
C
m
input 1
4
VA
output 1A
2
kΩ
18 kΩ
power stage
mute switch
C
m
6
VA
output 1B
60
kΩ
2
kΩ
18 kΩ
power stage
V
P
11
12
mute/stand-by
not connected
stand-by
switch
stand-by
reference
voltage
VA
15 kΩ
x1
mute
switch
TDA1552Q
15 kΩ
V
ref
13
mute switch
C
m
input 2
9
VA
output 2B
2
kΩ
18 kΩ
power stage
mute switch
C
m
7
VA
output 2A
60
kΩ
2
kΩ
V
ref
18 kΩ
power stage
2
5
GND1
8
MLB952
GND2
ground (signal)
power ground (substrate)
Fig.1 Block diagram.
3
July 1994
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Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
PINNING
1
2
3
4
5
6
7
IP1
input 1
8
9
GND2
power ground 2 (substrate)
GND
ground (signal)
positive supply voltage 1
output 1A
OUT2B
output 2B
V
10
11
12
13
V
positive supply voltage 2
mute/stand-by switch
not connected
input 2
P1
P2
OUT1A
GND1
M/SS
n.c.
power ground 1 (substrate)
output 1B
OUT1B
OUT2A
IP2
output 2A
FUNCTIONAL DESCRIPTION
The TDA1552Q contains two identical amplifiers with differential input stages and can be used for bridge applications.
The gain of each amplifier is fixed at 26 dB. A special feature of this device is:
Mute/stand-by switch
• low stand-by current (< 100 µA)
• low mute/stand-by switching current (low cost supply switch)
• mute facility.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
Supply voltage
operating
V
−
−
18
30
V
V
P
non-operating
V
P
load dump protected
during 50 ms;
t ≥ 2.5 ms
V
I
−
−
−
45
6
V
r
P
Non-repetitive peak output current
Repetitive peak output current
Storage temperature range
Junction temperature
A
OSM
ORM
I
4
A
T
T
−55
−
−
−
−
+150
150
18
°C
°C
V
stg
j
AC and DC short-circuit-safe voltage
Energy handling capability at outputs
Reverse polarity
V
PSC
V = 0 V
200
6
mJ
V
P
V
P
PR
Total power dissipation
see Fig.2
−
60
W
tot
July 1994
4
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Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
Fig.2 Power derating curve.
July 1994
5
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Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
DC CHARACTERISTICS
V = 14.4 V; T
= 25 °C; measurements taken using Fig.3; unless otherwise specified
P
amb
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply
Supply voltage range
Total quiescent current
DC output voltage
note 1
V
6.0
14.4
18.0
V
P
I
−
−
−
80
6.9
−
160
−
mA
V
tot
note 2
V
O
DC output offset voltage
|∆V |
150
mV
O
Mute/stand-by switch
Switch-on voltage level
Mute condition
V
8.5
3.3
−
−
−
6.4
V
V
ON
V
mute
Output signal in mute
position
V = 1 V (max);
I
f = 1 kHz
V
−
−
2
mV
O
DC output offset voltage
(between pins 4 to 6 and 7 to 9)
|∆V |
−
0
−
−
150
2
mV
V
O
V
Stand-by condition
sb
DC current in
V < 0.5 V
I
−
−
−
−
−
100
500
60
µA
µA
µA
II
sb
stand-by condition
Switch-on current
Supply current
0.5 V ≤ V < 2 V
I
I
II
sb
25
sw
short-circuit
to GND
note 3
I
−
5.5
−
mA
P
July 1994
6
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Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
AC CHARACTERISTICS
V = 14.4 V; R = 4 Ω; f = 1 kHz; T
= 25 °C; measurements taken using Fig.3; unless otherwise specified
P
L
amb
PARAMETER
CONDITIONS
SYMBOL
MIN.
15
TYP.
17
MAX.
UNIT
Output power
THD = 0.5%
THD = 10%
THD = 0.5%
THD = 10%
P
−
−
−
-
W
o
o
o
o
P
P
P
20
−
−
22
12
17
0.1
W
W
W
%
Output power at V = 13.2 V
P
Total harmonic distortion
Power bandwidth
P = 1 W
THD
−
−
o
THD = 0.5%
P = −1 dB
o
w.r.t. 15 W
B
-
20 to
−
Hz
w
15000
Low frequency roll-off
note 4
−1 dB
−1 dB
f
−
25
−
26
−
−
−
−
−
27
−
−
−
Hz
kHz
dB
dB
dB
dB
dB
kΩ
L
High frequency roll-off
Closed loop voltage gain
Supply voltage ripple rejection
ON
f
20
25
42
48
48
80
50
H
G
v
notes 5, 6
RR
RR
RR
RR
notes 5, 7
mute
notes 5, 6, 7
notes 5, 6, 7
stand-by
−
60
−
75
Input impedance
Noise output voltage
(RMS value)
|Z |
i
ON
R = 0 Ω; note 8
V
-
70
100
60
−
120
−
−
−
1
µV
µV
µA
dB
dB
S
no(rms)
no(rms)
no(rms)
ON
R = 10 kΩ; note 8 V
−
−
40
-
S
mute
notes 8, 9
V
Channel separation
Channel unbalance
α
|∆G |
−
v
Notes to the characteristics
1. The circuit is DC adjusted at V = 6 V to 18 V and AC operating at V = 8.5 V to 18 V.
P
P
2. At 18 V < V < 30 V the DC output voltage ≤ V /2.
P
P
3. Conditions:
a) V = 0 V
11
b) short-circuit to GND
c) switch V to MUTE or ON condition (rise time ≥ 10 µs).
11
4. Frequency response externally fixed.
5. Ripple rejection measured at the output with a source impedance of 0 Ω (maximum ripple amplitude of 2 V).
6. Frequency f = 100 Hz.
7. Frequency between 1 kHz and 10 kHz.
8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
9. Noise output voltage independent of R (V = 0 V).
S
I
July 1994
7
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Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
APPLICATION INFORMATION
mute/stand-by switch
V
P
not connected
12
14.4 V
2200
µF
100
nF
11
3
10
220 nF
1
input 1
4
6
R
= 4 Ω
L
60
kΩ
2
ground (signal)
TDA1552Q
reference
voltage
220 nF
13
input 2
9
60
kΩ
R
= 4 Ω
L
7
5
8
MLB951
power ground (substrate)
Fig.3 Application circuit diagram.
8
July 1994
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Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
PACKAGE OUTLINE
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
non-concave
x
D
h
D
E
h
view B: mounting base side
d
A
2
B
j
E
A
L
3
L
Q
c
1
13
e
e
m
v
M
w
M
1
Z
2
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.2 0.60 0.38 23.6 19.6
12.2
11.8
3.4 12.4 2.4
3.1 11.0 1.6
2.00
1.45
2.1
1.8
6
mm
10
3.4
1.7 5.08
0.8
4.3
0.25 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-03-11
SOT141-6
July 1994
9
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Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
SOLDERING
Introduction
specified maximum storage temperature (T
). If the
stg max
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994
10
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