INTEGRATED CIRCUITS
DATA SHEET
TDA8783
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
Product specification
2002 Oct 23
Supersedes data of 1999 Jun 25
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
QUICK REFERENCE DATA
SYMBOL
VCCA
PARAMETER
analog supply voltage
CONDITIONS
MIN.
TYP. MAX. UNIT
4.75
4.75
2.5
−
−
−
5
5.25
5.25
5.25
95
V
VCCD
VCCO
ICCA
digital supply voltage
5
V
digital outputs supply voltage
analog supply current
3
V
78
18
1
mA
mA
mA
ICCD
ICCO
digital supply current
20
digital outputs supply current
fCLK = 27 MHz;
CL = 20 pF; ramp input
−
ADCres
Vi(CDS)(p-p)
GCDS
ADC resolution
−
−
−
40
10
400
6
−
bits
CDS input voltage (peak-to-peak value)
CDS output amplifier gain
maximum clock frequency
1200 mV
−
−
dB
fCLK(max)
fcut(CDS) = 120 MHz;
fcut(AGC) = 54 MHz
−
MHz
AGCdyn
Ntot(rms)
AGC dynamic range
−
−
30
−
−
dB
total noise from CDS input to ADC output gain = 4.5 dB;
(RMS value)
0.125
LSB
fcut(CDS) = 120 MHz;
cut(AGC) = 40 MHz
f
Ptot
total power consumption
−
483
−
mW
2002 Oct 23
3
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
BLOCK DIAGRAM
V
V
V
CLPOB
1
DGND2
40
CCA3
45
CCD2
39
IND INP AGND3
SHD
44
SHP
43
CLPDM
42
CLK
41
OE
38
CCO
37
47
46
48
36
OGND
TRACK-
TRACK-
CLOCK
AND-HOLD
AND-HOLD
GENERATOR
35
34
33
32
31
30
29
28
27
TRACK-
AND-HOLD
D9
D8
8
CPCDS
CLAMP
CLAMP
5
AGND1
4-BIT DAC
CUT-OFF
D7
D6
D5
D4
D3
D2
D1
ref1
4
OUTPUTS
BUFFER
AMPOUT
6 dB
10-BIT ADC
2
AGND4
TDA8783
7
1
AGCOUT
AGC
1
4-BIT DAC
CUT-OFF
6
V
CCA1
9-BIT DAC
9
AGND5
10
26
25
3
ADCIN
D0
DGND1
OFDOUT
12
11
+
-
V
ref
CLPADC
8-BIT DAC
SERIAL
INTERFACE
10-BIT DAC
REGULATOR
16 17 18
13
14
15
22
SEN
21
20
24
19
23
V
V
DACOUT
CCA2
V
AGND6
STDBY
DEC1
SDATA
SCLK
CCD1
RT
MGM491
V
AGND2
RB
Fig.1 Block diagram.
4
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
PINNING
SYMBOL
PIN
DESCRIPTION
CLPOB
AGND4
OFDOUT
AMPOUT
AGND1
VCCA1
1
2
clamp pulse input at optical black
analog ground 4
3
analog output of the additional 8-bit control DAC (controlled via the serial interface)
CDS amplifier output (fixed gain = 6 dB)
analog ground 1
4
5
6
analog supply voltage 1
AGCOUT
CPCDS
AGND5
ADCIN
7
AGC amplifier signal output
8
clamp storage capacitor pin
9
analog ground 5
10
11
12
ADC analog signal input from AGCOUT via a short circuit
clamp control input for ADC analog input signal clamp (used with a capacitor from Vref to ground)
CLPADC
Vref
ADC input clamp reference voltage (normally connected to pin VRB or DACOUT, or connected to
ground via a capacitor)
DACOUT
AGND2
VCCA2
VRB
13
14
15
16
17
18
19
20
DAC output for ADC clamp level
analog ground 2
analog supply voltage 2
ADC reference voltage (BOTTOM) code 0
ADC reference voltage (TOP) code 1023
decoupling 1 (decoupled to ground via a capacitor)
analog ground 6
VRT
DEC1
AGND6
SDATA
serial data input for the 4 control DACs (9-bit DAC for AGC gain, 8-bit DAC for frequency cut-off;
additional 8-bit DAC for OFD output voltage; 10-bit DAC for ADC clamp level and the standby
mode per block and edge pulse control); see Fig.3, Fig.4 and Table 1
SCLK
SEN
21
22
serial clock input for the control DACs and their serial interface; see Fig.3, Fig.4 and Table 1
enable input for the serial interface shift register (active when SEN = logic 0); see Fig.3, Fig.4 and
Table 1
STDBY
VCCD1
DGND1
D0
23
24
25
26
27
28
29
30
31
32
33
34
35
36
standby control (active HIGH); all the output bits are logic 0 when standby is enabled
digital supply voltage 1
digital ground 1
ADC digital output 0 (LSB)
ADC digital output 1
D1
D2
ADC digital output 2
D3
ADC digital output 3
D4
ADC digital output 4
D5
ADC digital output 5
D6
ADC digital output 6
D7
ADC digital output 7
D8
ADC digital output 8
D9
ADC digital output 9 (MSB)
digital output ground
OGND
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
SYMBOL
VCCO
PIN
37
38
39
40
41
42
43
44
45
46
47
48
DESCRIPTION
digital output supply voltage
OE
output enable (active LOW: digital outputs active; active HIGH: digital outputs high impedance)
VCCD2
DGND2
CLK
digital supply voltage 2
digital ground 2
ADC clock input
CLPDM
SHP
clamp pulse input at dummy pixel
pre-set sample-and-hold pulse input
data sample-and-hold pulse input
analog supply voltage 3
pre-set input signal from CCD
data input signal from CCD
analog ground 3
SHD
VCCA3
INP
IND
AGND3
1
2
36 OGND
35
CLPOB
AGND4
D9
34 D8
33
OFDOUT
AMPOUT
AGND1
3
4
D7
32 D6
31
5
6
V
D5
CCA1
TDA8783HL
AGCOUT
CPCDS
AGND5
ADCIN
7
30 D4
29 D3
28 D2
27 D1
8
9
10
11
12
26
CLPADC
D0
V
25 DGND1
ref
MGM492
Fig.2 Pin configuration.
6
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VCCA
PARAMETER
analog supply voltage
CONDITIONS
note 1
MIN.
−0.3
−0.3
MAX.
+7.0
UNIT
V
V
V
VCCD
VCCO
∆VCC
digital supply voltage
output stages supply voltage
supply voltage difference
between VCCA and VCCD
between VCCA and VCCO
between VCCD and VCCO
input voltage
note 1
note 1
+7.0
+7.0
−0.3
−1.0
−1.0
−1.0
−0.3
−
+1.0
+4.0
+4.0
+7.0
VCCD
V
V
V
V
V
Vi
referenced to AGND
referenced to DGND
VCLK(p-p)
AC input voltage for switching
(peak-to-peak value)
Io
output current
−
10
mA
°C
°C
°C
Tstg
Tamb
Tj
storage temperature
ambient temperature
junction temperature
−55
−20
−
+150
+75
150
Note
1. The supply voltages VCCA, VCCD and VCCO may have any value between −0.3 and +7.0 V provided that the supply
voltage difference ∆VCC remains as indicated.
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient in free air
76
K/W
2002 Oct 23
7
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
CHARACTERISTICS
VCCA = VCCD = 5 V; VCCO = 3 V; fCLK = 27 MHz; Tamb = 25 °C; unless otherwise specified.
SYMBOL
Supplies
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
VCCA
VCCD
VCCO
ICCA
analog supply voltage
digital supply voltage
4.75
5
5.25
5.25
5.25
95
V
4.75
2.5
−
−
−
5
V
digital outputs supply voltage
analog supply current
3
V
78
18
1
mA
mA
mA
ICCD
digital supply current
20
ICCO
digital outputs supply current
CL = 20 pF on all data
outputs; ramp input
−
Digital inputs
CLOCK INPUT: CLK (REFERENCED TO DGND)
VIL
VIH
IIL
LOW-level input voltage
HIGH-level input voltage
LOW-level input current
HIGH-level input current
input impedance
0
−
−
−
−
46
1
0.8
VCCD
+1
20
−
V
2.0
−1
−
−
−
V
VCLK = 0.8 V
VCLK = 2.0 V
fCLK = 27 MHz
fCLK = 27 MHz
µA
µA
kΩ
pF
IIH
Zi
Ci
input capacitance
−
INPUTS: SHP AND SHD
VIL
VIH
IIL
LOW-level input voltage
0
−
−
−6
0
0.8
VCCD
−
V
HIGH-level input voltage
LOW-level input current
HIGH-level input current
2.0
−
−
V
VIL = 0.8 V
VIH = 2.0 V
µA
µA
IIH
−
INPUTS: SEN, SCLK, SDATA, OE, STDBY, CLPDM, CLPOB AND CLPADC
VIL
VIH
Ii
LOW-level input voltage
HIGH-level input voltage
input current
0
−
−
−
0.8
V
2.0
−2
VCCD
+2
V
µA
Correlated Double Sampling (CDS); note 1
Vi(CDS)(p-p)
CDS input amplitude pin 47
(peak-to-peak value)
−
400
−
1200 mV
ICPCDS, IINP,
IIND
input current pins 8, 46 and 47
−2
8
+2
µA
tCDS(min)
CDS control pulses minimum
active time
fi(CDS1,2) = fCLK(pix)
;
−
−
ns
Vi(CDS)(p-p) = 600 mV
black-to-white transition in
1 pixel (±1 LSB typ.);
fcut(CDS) = 120 MHz;
fcut(AGC) = 54 MHz
thd1
hold time INP compared to control see Fig.5
pulse SHP
−
1
−
ns
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
SYMBOL
thd2
PARAMETER
CONDITIONS
see Fig.5
MIN.
TYP. MAX. UNIT
hold time of IND compared to
control pulse SHD
−
1
−
ns
tset(CDS)
CDS settling time
see Fig.12; control DAC
4 bits input code;
AGC gain = 0 dB;
f
cut(AGC) = 54 MHz;
Vi(CDS) = 600 mV (p-p)
black-to-white transition in
1 pixel (±1 LSB typ.)
0000
0001
0010
0011
0100
0111
1000
1011
1111
−
−
−
−
−
−
−
−
−
8
−
−
−
−
−
−
−
−
−
ns
ns
ns
ns
ns
ns
ns
ns
ns
21
42
52
82
94
195
219
280
Amplifier outputs
GAMPOUT
output amplifier gain
ZAMPOUT output amplifier impedance
−
−
−
6
−
−
−
dB
Ω
300
2.4
VAMPOUT(p-p) output amplifier dynamic voltage
(peak-to-peak value)
V
VAMPOUT(bl)
output amplifier black level
voltage
−
−
−
−
1.5
2000
Vref
5
−
−
−
−
V
VAGCOUT(p-p) AGC output amplifier dynamic
voltage level (peak-to-peak value)
mV
V
VAGCOUT(bl)
AGC output amplifier black level
voltage
Vref connected to DACOUT
ZAGCOUT
AGC output amplifier output
impedance
at 10 kHz
Ω
IAGCOUT
AGC output static drive current
minimum gain of AGC circuit
static
−
−
−
4.5
1
mA
dB
GAGC(min)
AGC DAC input code = 00
(9-bit control); see Fig.7
−
GAGC(max)
fcut(AGC)
maximum gain of AGC circuit
cut-off frequency AGC
AGC DAC input code ≥ 319
−
34.5
−
dB
(9-bit control); see Fig.7
4-bit control DAC
input code = 00
−
−
54
4
−
−
MHz
MHz
input code = 15
other codes see Fig.13
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
SYMBOL
Clamps
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
gm(ADC)
gm(CDS)
ADC clamp transconductance
CDS clamp transconductance
at clamp level
−
−
7
−
−
mS
mS
at clamp level
1.5
Analog-to-Digital Converter (ADC)
fCLK(max)
tCPH
maximum clock frequency
clock pulse width HIGH
clock pulse width LOW
40
12
12
0.5
−
−
−
−
−
−
−
−
MHz
ns
tCPL
ns
SRCLK
clock input slew rate (rising and
falling edge)
10% to 90%
V/ns
Vi(ADC)(p-p)
VRB
ADC input voltage level
(peak-to-peak value)
−
−
−
2
−
−
−
V
V
V
ADC reference voltage output
code 0
1.5
3.5
VRT
ADC reference voltage output
code 1023
IADCIN
INL
ADC input current
−2
−
−
−
+120 µA
integral non-linearity
differential non-linearity
sampling delay time
ramp input
ramp input
±0.6
±0.2
−
±1.5
LSB
DNL
td(s)
±0.75 LSB
−
5
ns
Total chain characteristics (CDS + AGC + ADC)
td
delay between SHD and CLK
50% at rising edges
−
30
−
ns
CLK and SHD: transition full
scale code 0 to 1023;
f
cut(CDS) = 120 MHz;
fcut(AGC) = 54 MHz;
Vi(CDS) = 600 mV
Ntot(rms)
total output noise (RMS value)
fcut(CDS) = 120 MHz;
fcut(AGC) = 40 MHz; note 2
GAGC = 4.5 dB
−
−
−200
0.125
1.6
−
−
−
LSB
LSB
GAGC = 34.5 dB
Voffset(fl-d)
maximum offset between CCD
floating level and CCD dark pixel
level
+200 mV
Vn(i)(eq)(rms)
equivalent input noise voltage
(RMS value)
AGC gain = 34.5 dB
AGC gain = 4.5 dB
−
−
125
150
−
−
µV
µV
Digital-to-Analog Converter (OFDOUT)
VOFDOUT(p-p) additional 8-bit control DAC
(OFD) output voltage
−
1.4
−
V
(peak-to-peak value)
VOFDOUT(0)
DC output voltage for code 0
−
−
2.3
3.7
−
−
V
V
VOFDOUT(255) DC output voltage for code 255
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
ZOFDOUT
additional 8-bit control DAC
(OFD) output impedance
−
−
2000
−
Ω
IOFDOUT
OFD output current drive
static
−
50
µA
ADC clamp control DAC (see Fig.8)
VDACOUT(p-p) ADC clamp 10-bit control DAC
output voltage (peak-to-peak
value)
−
1
−
V
VDACOUT
DC output voltage
code 0
−
−
−
1.5
2.5
−
−
−
V
V
Ω
code 1023
ZDACOUT
ADC clamp control DAC output
impedance
250
IDACOUT
DAC output current drive
static
−
−
−
−
±5
±5
50
−
−
µA
LSB
LSB
OFELOOP
maximum offset error of
DAC + ADC clamp loop
code 0
code 1023
Digital outputs (fCLK = 40 MHz; CL = 20 pF); note 3
VOH
VOL
IOZ
HIGH-level output voltage
LOW-level output voltage
output current in 3-state mode
output hold time
IOH = −1 mA
IOL = 1 mA
VCCO − 0.5 −
VCCO
0.5
+20
−
V
0
−
V
0 V < Vo < VCCO
−20
8
−
−
µA
ns
ns
ns
ns
ns
ns
ns
to(h)
to(d)
output delay time
CL = 20 pF; VCCO = 5 V
CL = 10 pF; VCCO = 5 V
CL = 20 pF; VCCO = 3 V
CL = 10 pF; VCCO = 3 V
CL = 20 pF; VCCO = 2.5 V
CL = 10 pF; VCCO = 2.5 V
−
−
−
−
−
−
17
15
20
17
22
18
23
21
29
25
33
28
Serial interface
fSCLK(max)
maximum frequency of serial
interface
5
−
−
MHz
Notes
1. More information about CDS related signals is available in the following figures: The clamp current for pin CPCDS is
given in Fig. 9, clamp current for pins IND and INP in Fig 10 and for clamp current for pin Vref in Fig 11. The CDS
output amplitude is shown in Fig. 14
2. Noise measurement at ADC outputs: the coupling capacitor at the input is connected to ground, so that only the noise
contribution of the front-end is evaluated. The front-end operates at 18 Mpix with a line of 1024 pixels. The first 40 are
used to run CLPOB and the last 40 to run CLPDM. Data at the ADC outputs is measured during the other pixels.
The differences between the types of codes statistic is then computed; the result is the noise. No quantization noise
is taken into account as no signal is input. Figure15 gives noise figure graphs with signal input.
3. Depending on operating pixel frequency, the output voltage and capacitance must be determined according to the
output delay timings (to(d)), see Fig.5.
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
SDATA
SCLK
SHIFT REGISTER
D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 A0 A1 A2
LSB
MSB
10
LATCH
SEN
SELECTION
8
9
8
7
10
(D7 to D0)
(D8 to D0)
(D7 to D0)
(D6 to D0)
(D9 to D0)
CLAMP
REFERENCE
LATCHES
PARTIAL
STANDBY
AND EDGE
OFD
LATCHES
FREQUENCY
LATCHES
AGC GAIN
LATCHES
8-bit DAC
AGC control
frequency
control
standby
control
10-bit DAC
MGM515
CDS and AGC
or edge clocks
Fig.3 Serial interface block diagram.
t
SDATA
su2
t
hd4
MSB
A0
LSB
D3
A2
A1
D9
D8
D7
D6
D5
D4
D2
D1
D0
SCLK
SEN
MGE373
t
t
su1
hd3
t
su3
tsu1 = tsu2 = tsu3 = 4 ns (min.); thd3 = thd4 = 4 ns (min.).
Fig.4 Loading sequence of control DACs input data via the serial interface.
12
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
Table 1 Serial interface programming
ADDRESS BITS
DATA BITS D9 to D0
OFD output control (D7 to D0).
A2
A1
A0
0
0
0
0
0
1
Cut-off frequency of CDS and AGC. Only the 4 LSBs (D3 to D0) are used for
CDS. D4 to D7 are used for AGC. D8 and D9 should be set to logic 0.
0
0
1
1
0
1
AGC gain control (D8 to D0).
Partial standby controls for power consumption optimization. Only the 4 LSBs
(D3 to D0) are used. Edge control for pulses SHP, SHD, CLAMP and
clock ADC:
D0 = 1: CDS + AGC in standby; ICCA + ICCD = 35 mA
D1 = 1: OFD DAC in standby; ICCA + ICCD = 95 mA
D2 = 1: 6 dB amplifier (output on AMPOUT pin) in standby;
ICCA + ICCD = 95.5 mA
D3 = 1: SHP and SHD activated with falling edge (for positive pulse)
D4 = 1: CLPDM, CLPOB and CLPADC activated on HIGH level; note 1
D5 = 0: CLKADC activated with falling edge
D6 must be set to logic 0.
1
0
0
Clamp reference DAC (D9 to D0).
Note
1. When CLPADC is HIGH (D4 = 1: serial interface), the ADC input is clamped to voltage level Vref.
Vref is connected to ground via a capacitor.
Table 2 Standby selection
STDBY
DATA BITS D9 to D0
ICCA + ICCD (TYP.)
4 mA
1
0
LOW
active
96 mA
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
IND
N
N + 1
N + 2
N + 3
t
SHP
1.4 V
CDS
t
n(IN; SHP)
1.4 V
SHD
t
t
n(IN; SHD)
d
t
CLK
1.4 V
CPH
t
t
o(d)
d(s)
N
ADCIN
t
o(h)
90%
N − 3
N − 2
DATA
N − 1
N
10%
MGR395
Fig.5 Pixel frequency timing diagram.
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
1 pixel
1 pixel
AGCOUT
VIDEO
OPTICAL BLACK
HORIZONTAL FLYBLACK
DUMMY
VIDEO
CLPDM
CLPADC
WINDOW
CLPDM
CLPADC
WINDOW
CLPOB
(active HIGH)
CLPOB
WINDOW
CLPDM
(1)
(active HIGH)
CLPADC
(active HIGH)
(1)
MGR396
(1) When dummy pixels are not available.
Fig.6 Line frequency timing diagram.
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
MGM507
handbook, halfpage
34.5
G
AGC
(dB)
4.5
0
319
511
AGC control DAC input code
Fig.7 AGC gain as a function of DAC input code.
MGM508
3.7
2.5
OFD DAC
voltage
output
(V)
ADC CLAMP DAC
voltage
output
(V)
2.3
1.5
255
1023
0
0
OFD control DAC input code
ADC CLAMP control DAC input code
Fig.8 DAC voltage output as a function of DAC input code.
16
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
I
handbook, halfpage
(µA)
+100
0
V (V)
2.00
−100
200 mV
MGR397
Fig.9 Typical clamp current for pin CPCDS.
I
handbook, halfpage
(µA)
+300
0
V (V)
2.85
−300
400 mV
MGR398
Fig.10 Typical clamp current for pins IND and INP.
I
handbook, halfpage
(µA)
+200
0
V
V (V)
ref
−200
400 mV
MGR399
Fig.11 Typical clamp current for pin Vref.
17
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
MGR441
160
300
f
t
cut
set
(MHz)
(ns)
250
120
(2)
(3)
(4)
200
150
100
50
80
(1)
40
0
0
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
4-bit control DAC input code
(1) fcut
.
(2) tset (10 bits accuracy).
(3) tset (9 bits accuracy).
(4)
tset (8 bits accuracy).
Fig.12 CDS settling time and bandwidth.
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
MGR401
60
f
cut
(MHz)
40
20
0
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
4-bit control DAC input code
Fig.13 AGC bandwidth.
MGR442
1.6
(1)
(2)
V
o(CDS)(p-p)
(V)
1.2
(3)
(4)
(5)
(6)
0.8
0.4
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
V
(V)
i(CDS)(p-p)
(1) tset(CDS) = 12 ns
(2) tset(CDS) = 10 ns
(3) tset(CDS) = 8 ns
(4) tset(CDS) = 7 ns
(5) tset(CDS) = 6 ns
(6) tset(CDS) = 5 ns
Fig.14 CDS output.
19
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
MGR443
3
N
tot(rms)
(LSB)
(1)
2
(2)
(3)
(4)
1
0
(5)
(6)
00
40
80
C0
100
13F
code
(dB)
(4.5)
(10.5)
(16.5)
(22.5)
(28.5)
(34.5)
G
AGC
(1) fpix = 27 MHz; control DAC = 00H; fcut(CDS) = 120 MHz; fcut(AGC) = 54 MHz.
(2) fpix = 18 MHz; control DAC = 10H; fcut(CDS) = 120 MHz; fcut(AGC) = 40 MHz.
(3) fpix = 10 MHz; control DAC = 31H; fcut(CDS) = 80 MHz; fcut(AGC) = 30 MHz.
(4) fpix = 5 MHz; control DAC = 43H; fcut(CDS) = 35 MHz; fcut(AGC) = 12 MHz.
(5) fpix = 1 MHz; control DAC = F8H; fcut(CDS) = 6 MHz; fcut(AGC) = 4 MHz.
(6)
fpix = 375 kHz; control DAC = FFH; fcut(CDS) = 4 MHz; fcut(AGC) = 4 MHz.
Fig.15 Output noise (RMS value).
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
APPLICATION INFORMATION
5.0 V
5.0 V 2.5 to 5.25 V
CCD
(3)
(3)
(3)
220
nF
from timing
generator
48 47 46 45 44 43 42 41 40 39 38 37
CLPOB
AGND4
OGND
D9
36
35
34
33
32
31
30
29
28
27
26
25
1
2
OFDOUT
AMPOUT
AGND1
D8
3
D7
4
D6
5
(3)
V
D5
CCA1
6
5.0 V
TDA8783
AGCOUT
CPSDS
AGND5
ADCIN
D4
7
1 µF
D3
8
D2
9
D1
10
11
12
1 µF
CLPADC
D0
V
DGND1
ref
13 14 15 16 17 18 19 20 21 22 23 24
(2)
(1)
100
nF
2.2
nF
serial
interface
(3)
5.0 V
5.0 V
1
nF
1
(3)
MGM504
nF
Depending on the application, the following connections must be made:
(1) The clamp level of the signal input at ADCIN can be tuned from code 00 to code 511 in 0.5 LSB steps of ADC via the serial interface
(clamp ADC activated).
(2) Clamp ADC not activated, direct connection from DACOUT to Vref
.
(3) All supply pins must be decoupled with 100 nF capacitors as close as possible to the device.
Fig.16 Application diagram.
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
Power and grounding recommendations
In a two-ground system, in order to minimize the noise
from package and die parasitics, the following
recommendations must be implemented:
Care must be taken to minimize noise when designing a
printed-circuit board for applications such as PC cameras,
surveillance cameras, camcorders and digital still
cameras.
• The ground pin associated with the digital outputs must
be connected to the digital ground plane and special
care should be taken to avoid feedthrough in the analog
ground plane. The analog and digital ground planes
must be connected with an inductor as close as possible
to the IC package, in order to have the same DC voltage
on the ground planes.
For the front-end integrated circuit, the basic rules of
printed-circuit board design and implementation of analog
components (such as classical operational amplifiers)
must be taken into account, particularly with respect to
power and ground connections.
• The digital output pins and their associated lines should
be shielded by the digital ground plane, which can be
used as return path for the digital signals.
The connections between CCD interface and CDS input
should be as short as possible and a ground ring
protection around these connections can be beneficial.
Decoupling capacitors are necessary on all supply pins as
shown in Fig.16.
Separate analog and digital supplies provide the best
performance. If it is not possible to do this on the board,
then decouple the analog supply pins effectively from the
digital supply pins. The decoupling capacitors must be
placed as close as possible to the IC package.
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
PACKAGE OUTLINE
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
c
y
X
36
25
A
E
37
24
Z
E
e
H
E
A
2
A
(A )
3
A
1
w M
p
θ
pin 1 index
b
L
p
L
13
48
detail X
1
12
Z
v M
D
A
e
w M
b
p
D
B
H
v M
B
D
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
θ
1
2
3
p
E
p
D
E
max.
7o
0o
0.20 1.45
0.05 1.35
0.27 0.18 7.1
0.17 0.12 6.9
7.1
6.9
9.15 9.15
8.85 8.85
0.75
0.45
0.95 0.95
0.55 0.55
1.60
mm
0.25
0.5
1.0
0.2 0.12 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
99-12-27
00-01-19
SOT313-2
136E05
MS-026
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
not suitable
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, not suitable(3)
HVSON, SMS
suitable
PLCC(4), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
not recommended(4)(5) suitable
not recommended(6)
suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2002 Oct 23
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Philips Semiconductors
Product specification
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
TDA8783
NOTES
2002 Oct 23
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Philips Semiconductors – a worldwide company
Contact information
Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753504/03/pp28
Date of release: 2002 Oct 23
Document order number: 9397 750 10176
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