INTEGRATED CIRCUITS
PTN3501
Maintenance and control device
Product specification
2001 Jan 17
Supersedes data of 2000 Nov 22
Philips
Semiconductors
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
2
CHARACTERISTICS OF THE I C-BUS
2
The I C-bus is for 2-way, 2-line communication between different ICs
Start and stop conditions
or modules. The two lines are a serial data line (SDA) and a serial
clock line (SCL). Both lines must be connected to a positive supply
via a pull-up resistor when connected to the output stages of a device.
Data transfer may be initiated only when the bus is not busy.
Both data and clock lines remain HIGH when the bus is not busy. A
HIGH-to-LOW transition of the data line, while the clock is HIGH is
defined as the start condition (S). A LOW-to-HIGH transition of the
data line while the clock is HIGH is defined as the stop condition (P)
(see Figure 4).
Bit transfer
One data bit is transferred during each clock phase. The data on the
SDA line must remain stable during the HIGH period of the clock
pulse as changes in the data line at this time will be interpreted as
control signals (See Figure 3).
System configuration
A device generating a message is a “transmitter”, a device receiving
is the “receiver”. The device that controls the message is the
“master” and the devices which are controlled by the master are the
“slaves” (see Figure 5).
SDA
SCL
DATA LINE
STABLE;
DATA VALID
CHANGE
OF DATA
ALLOWED
SW00542
Figure 3. Bit transfer
SDA
SCL
SDA
SCL
S
P
START CONDITION
STOP CONDITION
SW00543
Figure 4. Definition of start and stop conditions
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
MASTER
TRANSMITTER
SW00544
Figure 5. System configuration
3
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that
the SDA line is stable LOW during the HIGH period of the
acknowledge related clock pulse, set–up and hold times must be
taken into account.
Acknowledge (see Figure 6)
The number of data bytes transferred between the start and the stop
conditions from transmitter to receiver is not limited. Each byte of
eight bits is followed by one acknowledge bit. The acknowledge bit
is a HIGH level put on the bus by the transmitter whereas the
master generates an extra acknowledge related clock pulse.
A master receiver must signal an end of data to the transmitter by
not generating an acknowledge on the last byte that has been
clocked out of the slave. In this event the transmitter must leave the
data line HIGH to enable the master to generate a stop condition.
A slave receiver which is addressed must generate an acknowledge
after the reception of each byte. Also a master must generate an
acknowledge after the reception of each byte that has been clocked
DATA OUTPUT
BY TRANSMITTER
NOT ACKNOWLEDGE
ACKNOWLEDGE
DATA OUTPUT
BY RECEIVER
SCL FROM
MASTER
1
2
8
9
S
CLOCK PULSE FOR
ACKNOWLEDGEMENT
START
CONDITION
SW00545
2
Figure 6. Acknowledgment on the I C-bus
FUNCTIONAL DESCRIPTION
V
DD
WRITE PULSE
100 µA
DATA FROM
SHIFT REGISTER
D
C
Q
FF
P0 TO P7
I
S
POWER-ON
RESET
V
SS
D
C
Q
FF
I
READ PULSE
S
TO INTERRUPT LOGIC
SW00788
DATA TO
SHIFT REGISTER
Figure 7. Simplified schematic diagram of each I/O
4
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Product specification
Maintenance and control device
PTN3501
Addressing
For addressing, see Figure 8.
SLAVE ADDRESS
SLAVE ADDRESS
S
0
A5 A4 A3 A2 A1 A0
0
A
S
1
A5 A4
A3 A2 A1 A0
0
A
a.
b.
(a) I/O EXPANDER
(b) MEMORY
SW00648
Figure 8. PTN3501 slave addresses
Asynchronous Start
Following any Start condition on the bus, a minimum of 9 SCL clock cycles must be completed before a Stop condition can be issued. The
device does not support a Stop or a repeated Start condition during this time period.
I/O OPERATIONS (see also Figure 7)
Each of the PTN3501’s eight I/Os can be independently used as an input or output. Input I/O data is transferred from the port to the
microcontroller by the READ mode (See Figure 10). Output data is transmitted to the port by the I/O WRITE mode (see Figure 9).
SCL
SDA
1
2
3
4
5
6
7
8
SLAVE ADDRESS (I/O EXPANDER)
DATA TO PORT
DATA 2
DATA TO PORT
DATA 1
S
0
A5 A4 A3 A2 A1 A0
0
A
A
A
START CONDITION
R/W ACKNOWLEDGE
FROM SLAVE
ACKNOWLEDGE
FROM SLAVE
ACKNOWLEDGE
FROM SLAVE
WRITE TO
PORT
DATA OUT
FROM PORT
DATA 1 VALID
DATA 2 VALID
SW00649
t
t
pv
pv
Figure 9. I/O WRITE mode (output)
SLAVE ADDRESS (I/O EXPANDER)
DATA FROM PORT
DATA FROM PORT
DATA 4
SDA
S
0
A5 A4 A3 A2 A1 A0
1
A
DATA 1
A
1
P
START CONDITION
R/W ACKNOWLEDGE
FROM SLAVE
ACKNOWLEDGE
FROM MASTER
STOP
CONDITION
READ FROM
PORT
DATA INTO
PORT
DATA 1
DATA 2
DATA 3
DATA 4
t
t
ph
ps
INT
t
t
iv
ir
SW00650
Figure 10. I/O READ mode (input)
5
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Product specification
Maintenance and control device
PTN3501
Interrupt (see Figs 11 and 12)
• In the WRITE mode at the acknowledge bit after the
The PTN3501 provides an open drain output (INT) which can be fed
to a corresponding input of the microcontroller. This gives these
chips a type of master function which can initiate an action
elsewhere in the system.
HIGH–to–LOW transition of the SCL signal
• Returning of the port data to its original setting. A second port
state change will require an SCL rising clock edge to be captured
as an INT event.
An interrupt is generated by any rising or falling edge of the port
• Interrupts which occur during the acknowledge clock pulse may
be lost (or very short) due to the resetting of the interrupt during
this pulse.
inputs in the input mode. After time t the signal INT is valid.
iv
Resetting and reactivating the interrupt circuit is achieved when data
on the port is changed to the original setting or data is read from or
written to the port which has generated the interrupt.
Each change of the I/Os after resetting will be detected and, after
the next rising clock edge, will be transmitted as INT. Reading from
or writing to another device does not affect the interrupt circuit.
Resetting occurs as follows:
• In the READ mode at the acknowledge bit after the rising edge of
the SCL signal
PTN3501
(1)
PTN3501
(2)
PTN3501
(16)
V
DD
INT
INT
INT
MICROCONTROLLER
INT
SW00790
Figure 11. Application of multiple PTN3501s with interrupt
SLAVE ADDRESS (I/O EXPANDER)
DATA FROM PORT
SDA
S
0
A5
A4
A3
A2
A1
A0
1
A
1
1
P
START CONDITION
SCL
R/W
8
ACKNOWLEDGE
FROM SLAVE
STOP CONDITION
P5
1
2
3
4
5
6
7
DATA
INTO P5
INT
SW00791
t
t
iv
ir
Figure 12. Interrupt generated by a change of input to I/O P5
6
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
Quasi-bidirectional I/Os (see Figure 13)
A quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction. At power-on the I/Os are HIGH.
In this mode, only a current source to V is active. An additional strong pull-up to V allows fast rising edges into heavily loaded outputs.
DD
DD
These devices turn on when an output is written HIGH, and are switched off by the negative edge of SCL. The I/Os should be HIGH before
being used as inputs.
SLAVE ADDRESS (PTN3501)
DATA TO PORT
0
DATA TO PORT
1
SDA
S
0
A
A
A
3
A2 A1 A0
0
A
A
A
P
5
4
START CONDITION
R/W ACKNOWLEDGE
FROM SLAVE
P3
ACKNOWLEDGE
FROM SLAVE
P3
SCL
1
2
3
4
5
6
7
8
P3
OUTPUT
VOLTAGE
P3
PULL-UP
OUTPUT
CURRENT
I
I
OHt
OH
SW00789
Figure 13. Transient pull-up current I
PARAMETER
while P3 changes from LOW-to-HIGH and back to LOW
OHt
SYMBOL
MIN
–
TYP
MAX
UNIT
µs
t
t
t
Output data valid; C ≤ 100 pF
–
–
–
–
4
–
–
4
pv
ps
L
Input data setup time; C ≤ 100 pF
0
µs
L
Input data hold time; C ≤ 100 pF
4
µs
ph
L
t
iv
Interrupt input data valid time;
–
µs
C ≤ 100 pF
L
t
ir
Interrupt reset time; C ≤ 100 pF
–
–
4
µs
L
7
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
the master issues the stop condition, initiating the internal write cycle
to the non–volatile memory. Only write and read operations to the
quasi–bidirectional I/Os are allowed during the internal write cycle.
MEMORY OPERATIONS
Write operations
Write operations require an additional address field to indicate the
memory address location to be written. The address field is eight
bits long providing access to any one of the 256 words of memory.
There are two types of write operations, byte write and page write.
Page Write (see Figure 15)
A page write is initiated in the same way as the byte write, if after
sending the first word of data, the stop condition is not received the
PTN3501 considers subsequent words as data. After each data
word the PTN3501 responds with an acknowledge and the four least
significant bits of the memory address field are incremented. Should
the master not send a stop condition after 16 data words the
address counter will return to its initial value and overwrite the data
previously written. After the receipt of the stop condition the inputs
will behave as with the byte write during the internal write cycle.
Byte Write (see Figure 14)
To perform a byte write the start condition is followed by the memory
slave address and the R/W bit set to 0. The PTN3501 will respond
with an acknowledge and then consider the next eight bits sent as
the word address and the eight bits after the word address as the
data. The PTN3501 will issue an acknowledge after the receipt of
both the word address and the data. To terminate the data transfer
SLAVE
ADDRESS
(MEMORY)
WORD
ADDRESS
DATA
SDA
S
1
A5 A4 A3 A2 A1 A0
0
A
A
A
P
START CONDITION
R/W
ACKNOWLEDGE
FROM SLAVE
ACKNOWLEDGE STOP
FROM SLAVE CONDITION
ACKNOWLEDGE
FROM SLAVE
SW00651
Figure 14. Byte write
SLAVE ADDRESS
(MEMORY)
WORD ADDRESS
DATA TO MEMORY
DATA n
DATA TO MEMORY
SDA
DATA +3n
P
S
1
A5 A4 A3 A2 A1 A0
A
A
A
A
0
R/W
START
CONDITION
STOP
CONDITION
ACKNOWLEDGE
FROM SLAVE
ACKNOWLEDGE
FROM SLAVE
ACKNOWLEDGE
FROM SLAVE
SW00652
Figure 15. Page Write
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Product specification
Maintenance and control device
PTN3501
The master must perform a byte write to the address location to be
read, but instead of transmitting the data after receiving the
acknowledge from the PTN3501 the master reissues the start
condition and memory slave address with the R/W bit set to one.
The PTN3501 will then transmit an acknowledge and use the next
eight clock cycles to transmit the data contained in the addressed
location. The master ceases the transmission by issuing the stop
condition after the eighth bit, omitting the ninth clock cycle
acknowledge.
Read operations
PTN3501 read operations are initiated in an identical manner to
write operations with the exception that the memory slave address’
R/W bit is set to a one. There are three types of read operations;
current address, random and sequential.
Current Address Read (see Figure 16)
The PTN3501 contains an internal address counter that increments
after each read or write access, as a result if the last word accessed
was at address n then the address counter contains the address
n+1.
Sequential Read (see Figure 18)
The PTN3501 sequential read is an extension of either the current
address read or random read. If the master doesn’t issue a stop
condition after it has received the eighth data bit, but instead issues
an acknowledge, the PTN3501 will increment the address counter
and use the next eight cycles to transmit the data from that location.
The master can continue this process to read the contents of the
entire memory. Upon reaching address 255 the counter will return to
address 0 and continue transmitting data until a stop condition is
received. The master ceases the transmission by issuing the stop
condition after the eighth bit, omitting the ninth clock cycle
acknowledge.
When the PTN3501 receives its memory slave address with the
R/W bit set to one it issues an acknowledge and uses the next eight
clocks to transmit the data contained at the address stored in the
address counter. The master ceases the transmission by issuing the
stop condition after the eighth bit. There is no ninth clock cycle for
the acknowledge.
Random Read (see Figure 17)
The PTN3501’s random read mode allows the address to be read
from to be specified by the master. This is done by performing a
dummy write to set the address counter to the location to be read.
SLAVE ADDRESS
(MEMORY)
DATA FROM MEMORY
1 A5 A4 A3 A2 A1 A0
1
A
SDA
S
P
START
CONDITION
R/W
STOP
CONDITION
ACKNOWLEDGE
FROM SLAVE
SW00653
Figure 16. Current Address Read
SLAVE ADDRESS
(MEMORY)
WORD
ADDRESS
SLAVE ADDRESS
(MEMORY)
DATA FROM MEMORY
SDA
P
S
1
A5 A4 A3 A2 A1 A0
0
A
A
S
1 A5 A4 A3 A2 A1 A0
A
1
ACKNOWLEDGE
FROM SLAVE
R/W
R/W
START
CONDITION
STOP
CONDITION
ACKNOWLEDGE
FROM SLAVE
ACKNOWLEDGE
FROM SLAVE
START
CONDITION
SW00654
Figure 17. Random Read
SLAVE ADDRESS
(MEMORY)
DATA
FROM MEMORY
DATA
FROM MEMORY
DATA
FROM MEMORY
SDA
DATA n
DATA n+1
DATA N+X
P
S
1
A5 A4 A3 A2 A1 A0
A
A
A
1
R/W
START
CONDITION
STOP
CONDITION
ACKNOWLEDGE
FROM SLAVE
ACKNOWLEDGE
FROM MASTER
ACKNOWLEDGE
FROM MASTER
SW00655
Figure 18. Sequential Read
9
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Product specification
Maintenance and control device
PTN3501
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied.
SYMBOL
PARAMETER
MIN
MAX
UNIT
V
V
Supply Voltage
–0.5
4.0
5.5
20
V
V
CC
Input Voltage
V
SS
– 0.5
I
I
I
I
I
DC Input Current
DC Output Current
Supply Current
–20
–25
–100
–100
–
mA
mA
mA
mA
mW
mW
_C
I
25
O
100
100
400
100
DD
SS
Supply Current
P
P
T
Total Power Dissipation
tot
Total Power Dissipation per Output
Storage Temperature
–
O
–65
–40
+150
+85
STG
T
AMB
Operating Temperature
_C
V
ESD
Electrostatic Discharge:
Human Body Model, 1.5 kΩ, 100 pF
Machine Model, 0 Ω, 200 pF
–
–
>2000
>200
V
V
DC ELECTRICAL CHARACTERISTICS
T
= –40_C to +85_C unless otherwise specified; V = 3.3 V
amb
CC
SYMBOL
Supply
PARAMETER
MIN
TYP
MAX
UNIT
V
I
Supply Voltage
2.5
–
3.3
3.6
60
1
V
DD
Standby Current; A thru A , WC = HIGH
µA
mA
mA
V
DDQ
DD1
DD2
0
5
I
I
Supply Current Read
–
–
–
–
Supply Current Write
–
2
V
POR
Power on Reset Voltage
–
2.4
Input SCL; input, output SDA
V
V
Input LOW voltage
Input HIGH voltage
–0.5
0.7 V
3
–
–
–
–
–
0.3 V
V
IL
IH
OL
L
DD
5.5
–
V
DD
I
I
Output LOW current @ V = 0.4 V
mA
µA
pF
OL
Input leakage current @ V = V or V
SS
–1
1
I
DD
C
Input capacitance @ V = V
SS
–
7
I
I
I/O Expander Port
V
V
I
Input LOW voltage
Input HIGH voltage
–0.5
0.7 V
–400
10
–
0.3 V
5.5
400
–
V
IL
DD
–
V
IH
DD
Input current through protection diodes
–
µA
mA
µA
mA
pF
pF
IHL(max)
OL
I
I
I
Output LOW current @ V = 1 V
25
100
2
OL
Output HIGH current @ V = V
ss
30
300
–
OH
OH
Transient pull–up current
Input Capacitance
–
OHt
C
C
–
–
10
I
Output Capacitance
–
–
10
O
Address Inputs A thru A , WC input
0
5
V
V
I
Input LOW voltage
Input HIGH voltage
–0.5
0.7 V
–1
–
0.3 V
5.5
1
V
IL
DD
–
V
IH
DD
Input leakage current @ V = V
–
µA
µA
L
I
DD
Input leakage (pull-up) current @ V = V
10
25
100
I
SS
Interrupt output INT
I
OL
I
L
Low level output current; V = 0.4 V
1.6
–1
–
–
–
mA
OL
Leakage current @ V = V or V
SS
+1
µA
I
DD
10
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
2
I C-BUS TIMING CHARACTERISTICS
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
2
I C-bus timing (see Figure 19; Note 1)
f
t
t
t
t
t
t
t
t
t
t
SCL clock frequency
–
–
–
–
–
–
–
–
–
–
–
–
–
400
50
–
kHz
ns
µs
µs
µs
µs
µs
ns
ns
µs
µs
SCL
tolerable spike width on bus
bus free time
SW
1.3
0.6
0.6
–
BUF
START condition set–up time
START condition hold time
SCL and SDA rise time
SCL and SDA fall time
data set–up time
–
SU;STA
HD;STA
r
–
0.3
0.3
–
–
f
250
0
SU;DAT
HD;DAT
VD;DAT
SU;STO
data hold time
–
SCL LOW to data out valid
STOP condition set–up time
–
1.0
–
0.6
NOTE:
1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to V and V with an input
IL
IH
voltage swing of V to V
.
SS
DD
START
CONDITION
(S)
BIT 7
MSB
(A7)
BIT 6
(A6)
BIT 0
LSB
(R/W)
ACKNOWLEDGE
(A)
STOP
CONDITION
(P)
PROTOCOL
t
SU;STA
1 / f
SCL
SCL
SDA
t
t
t
f
BUF
r
t
t
t
t
t
HD;STA
SU;DAT
VD;DAT
SU;STO
HD;DAT
MBD820
SW00561
Figure 19.
11
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
POWER-UP TIMING
SYMBOL
PARAMETER
MAX.
UNIT
ms
1
t
Power-up to Read Operation
Power-up to Write Operation
1
5
PUR
1
t
ms
PUW
NOTE:
1. t
and t are the delays required from the time V is stable until the specified operation can be initiated. These parameters are
PUW CC
PUR
guaranteed by design.
WRITE CYCLE LIMITS
(5)
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
1
t
Write Cycle Time
–
5
10
ms
WR
NOTE:
1. t
is the maximum time that the device requires to perform the internal write operation.
WR
Write Cycle Timing
SCL
8th Bit
Word n
ACK
SDA
MEMORY
ADDRESS
t
WR
Stop
Condition
Start
Condition
SW00560
Figure 20.
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
SOLDERING
seconds depending on heating method. Typical reflow temperatures
range from 215 to 250°C.
Introduction
There is no soldering method that is ideal for all IC packages. Wave
soldering is often preferred when through-hole and surface mounted
components are mixed on one printed-circuit board. However, wave
soldering is not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these situations
reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate the binding
agent. Preheating duration: 45 minutes at 45°C.
Wave soldering
Wave soldering is not recommended for SSOP packages. This is
because of the likelihood of solder bridging due to closely-spaced
leads and the possibility of incomplete solder penetration in
multi-lead devices.
This text gives a very brief insight to a complex technology. A more
in-depth account of soldering ICs can be found in our IC Package
Databook (order code 9398 652 90011).
If wave soldering cannot be avoided, the following conditions
must be observed:
DIP
• A double-wave (a turbulent wave with high upward pressure
followed by a smooth laminar wave) soldering technique
should be used.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260°C;
solder at this temperature must not be in contact with the joint for
more than 5 seconds. The total contact time of successive solder
waves must not exceed 5 seconds.
• The longitudinal axis of the package footprint must be
parallel to the solder flow and must incorporate solder
thieves at the downstream end.
The device may be mounted up to the seating plane, but the
temperature of the plastic body must not exceed the specified
Even with these conditions, only consider wave soldering
SSOP packages that have a body width of 4.4 mm, that is
SSOP16 (SOT369–1) or SSOP20 (SOT266–1).
maximum storage temperature (T max). If the printed-circuit board
stg
has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
During placement and before soldering, the package must be fixed
with a droplet of adhesive. The adhesive can be applied by screen
printing, pin transfer or syringe dispensing. The package can be
soldered after the adhesive is cured.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of
the package, below the seating plane or not more than 2 mm above
it. If the temperature of the soldering iron bit is less than 300°C it
may remain in contact for up to 10 seconds. If the bit temperature is
between 300 and 400°C, contact may be up to 5 seconds.
Maximum permissible solder temperature is 260°C, and maximum
duration of package immersion in solder is 10 seconds, if cooled to
less than 150°C within 6 seconds. Typical dwell time is 4 seconds at
250°C.
SO and SSOP
A mildly-activated flux will eliminate the need for removal of
corrosive residues in most applications.
Reflow soldering
Reflow soldering techniques are suitable for all SO and SSOP
packages.
Repairing soldered joints
Fix the component by first soldering two diagonally opposite end
leads. Use only a low voltage soldering iron (less than 24 V) applied
to the flat part of the lead. Contact time must be limited to
10 seconds at up to 300 °C. When using a dedicated tool, all other
leads can be soldered in one operation within 2 to 5 seconds
between 270 and 320°C.
Reflow soldering requires solder paste (a suspension of fine solder
particles, flux and binding agent) to be applied to the printed-circuit
board by screen printing, stencilling or pressure-syringe dispensing
before package placement.
Several techniques exist for reflowing; for example, thermal
conduction by heated belt. Dwell times vary between 50 and 300
2
PURCHASE OF PHILIPS I C COMPONENTS
2
2
Purchase of Philips I C components conveys a license under the Philips’ I C patent
2
to use the components in the I C system provided the system conforms to the
I C specifications defined by Philips. This specification can be ordered using the
2
code 9398 393 40011.
13
2001 Jan 17
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
14
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2001 Jan 17
Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
Data sheet status
[1]
Data sheet
status
Product
status
Definition
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Righttomakechanges—PhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Copyright Philips Electronics North America Corporation 2001
All rights reserved. Printed in U.S.A.
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Date of release: 01-01
Document order number:
9397 750 07933
Philips
Semiconductors
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