Philips Car Amplifier TDA8566 User Manual

TDA8566  
2 × 40 W/2 stereo BTL car radio power amplifier with  
differential inputs and diagnostic outputs  
Rev. 06 — 15 October 2007  
Product data sheet  
1. General description  
The TDA8566 is an integrated class-B output amplifier which is available in several  
packages. TDA8566TH is contained in a 20-lead small outline plastic package. The  
TDA8566TH1 is a 24-lead small outline plastic package which is pin compatible with the  
I2C-bus controlled amplifier TDA1566TH for one board layout. TDA8566Q is a 17-pin  
DIL-bent-SIL package.  
The device contains 2 amplifiers in a Bridge-Tied Load (BTL) configuration. The output  
power is 2 × 25 W in a 4 load or 2 × 40 W in a 2 load. It has a differential input stage  
and 2 diagnostic outputs. The device is primarily developed for car radio applications.  
2. Features  
I Differential inputs  
I Very high Common Mode Rejection Ratio (CMRR)  
I High common mode input signal handling  
I Requires very few external components  
I High output power  
I 4 and 2 load driving capability  
I Low offset voltage at output  
I Fixed gain  
I Diagnostic facility (distortion, short-circuit and temperature pre-warning)  
I Good ripple rejection  
I Mode select switch (operating, mute and standby)  
I Load dump protection  
I Short-circuit proof to ground, to VP and across the load  
I Low power dissipation in any short-circuit condition  
I Thermally protected  
I Reverse polarity safe  
I Protected against electrostatic discharge  
I No switch-on/switch-off plops  
I Low thermal resistance  
I TDA8566TH1 is pin compatible with TDA1566TH  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
5. Block diagram  
V
V
P2  
P1  
mute  
switch  
IN1+  
C
M
IN1  
OUT1+  
V
A
2.3  
k  
2.3 kΩ  
(9×)  
mute  
switch  
C
M
OUT1−  
V
A
60  
60  
2.3  
kΩ  
kΩ  
kΩ  
2.3 kΩ  
(9×)  
n.c.  
standby  
MODE  
switch  
TDA8566  
standby  
V
A
reference  
voltage  
V
ref  
mute  
switch  
CLIP  
CLIP  
DIAG  
SGND  
1×  
DIAG  
mute  
reference  
voltage  
60  
kΩ  
60  
kΩ  
mute  
switch  
IN2+  
C
M
IN2−  
OUT2+  
V
A
2.3  
kΩ  
2.3 kΩ  
(9×)  
mute  
switch  
C
M
OUT2−  
V
A
2.3  
kΩ  
(1)  
HEATTAB  
2.3 kΩ  
(9×)  
mgu358  
PGND2  
PGND1  
(1) Pin HEATTAB is available in TDA8566TH1 only.  
Fig 1. Block diagram  
TDA8566_6  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 06 — 15 October 2007  
3 of 21  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
6. Pinning information  
6.1 Pinning  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
1
2
HEATTAB  
DIAG  
IN2+  
IN2−  
n.c.  
V
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
1
2
MODE  
DIAG  
IN2+  
IN2  
n.c.  
P2  
3
n.c.  
OUT2−  
PGND2  
OUT2+  
OUT1−  
PGND1  
OUT1+  
n.c.  
V
P2  
4
3
OUT2−  
PGND2  
OUT2+  
OUT1−  
PGND1  
OUT1+  
5
n.c.  
4
6
n.c.  
5
n.c.  
TDA8566TH1  
TDA8566TH  
7
MODE  
n.c.  
6
n.c.  
8
7
n.c.  
9
n.c.  
8
IN1+  
IN1−  
SGND  
10  
11  
12  
IN1+  
IN1−  
SGND  
9
V
P1  
V
10  
CLIP  
P1  
CLIP  
001aag902  
001aah015  
Fig 2. Pin configuration TDA8566TH  
Fig 3. Pin configuration TDA8566TH1  
1
2
IN1+  
IN1−  
SGND  
CLIP  
3
4
5
V
P1  
6
OUT1+  
PGND1  
OUT1−  
n.c.  
7
8
9
TDA8566Q  
10  
11  
12  
13  
14  
15  
16  
17  
OUT2+  
PGND2  
OUT2−  
V
P2  
MODE  
DIAG  
IN2+  
IN2−  
001aah059  
Fig 4. Pin configuration TDA8566Q  
TDA8566_6  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 06 — 15 October 2007  
4 of 21  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
6.2 Pin description  
Table 3.  
Symbol  
Pin description TDA8566TH and TDA8566TH1  
Pin  
Description  
TDA8566TH  
TDA8566TH1  
DIAG  
1
1
short-circuit and temperature pre-warning  
diagnostic output  
IN2+  
2
2
channel 2 input positive  
channel 2 input negative  
not connected  
IN2−  
n.c.  
3
3
4
4
n.c.  
5
5
not connected  
n.c.  
6
6
not connected  
n.c.  
7
-
not connected  
n.c.  
-
8
not connected  
n.c.  
-
9
not connected  
IN1+  
8
10  
11  
12  
13  
14  
15  
16  
17  
18  
-
channel 1 input positive  
channel 1 input negative  
signal ground  
IN1−  
SGND  
CLIP  
VP1  
9
10  
11  
12  
-
clip detection output  
supply voltage 1  
n.c.  
not connected  
OUT1+  
PGND1  
OUT1−  
n.c.  
13  
14  
15  
-
channel 1 output positive  
power ground 1  
channel 1 output negative  
not connected  
OUT2+  
PGND2  
OUT2−  
n.c.  
16  
17  
18  
-
19  
20  
21  
22  
23  
7
channel 2 output positive  
power ground 2  
channel 2 output negative  
not connected  
VP2  
19  
20  
-
supply voltage 2  
MODE  
HEATTAB  
mode select switch input (standby/mute/operating)  
connect to ground, used for test purposes only  
24  
Table 4.  
Symbol  
IN1+  
Pin description TDA8566Q  
Pin  
1
Description  
channel 1 input positive  
channel 1 input negative  
signal ground  
IN1−  
2
SGND  
CLIP  
3
4
clip detection output  
supply voltage 1  
VP1  
5
OUT1+  
PGND1  
OUT1−  
n.c.  
6
channel 1 output positive  
power ground 1  
7
8
channel 1 output negative  
not connected  
9
TDA8566_6  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 06 — 15 October 2007  
5 of 21  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
Table 4.  
Pin description TDA8566Q …continued  
Symbol  
OUT2+  
PGND2  
OUT2−  
VP2  
Pin  
10  
11  
12  
13  
14  
15  
16  
17  
Description  
channel 2 output positive  
power ground 2  
channel 2 output negative  
supply voltage 2  
MODE  
DIAG  
mode select switch input (standby/mute/operating)  
short-circuit and temperature pre-warning diagnostic output  
channel 2 input positive  
IN2+  
IN2−  
channel 2 input negative  
7. Functional description  
The TDA8566 contains 2 identical amplifiers and can be used for BTL applications. The  
gain of each amplifier is fixed at 26 dB. Special features of this device are:  
Mode select switch  
Clip detection  
Short-circuit diagnostic  
Temperature pre-warning  
Open-collector diagnostic outputs  
Differential inputs  
7.1 Mode select switch (pin MODE)  
Standby: low supply current  
Mute: input signal suppressed  
Operating: normal on condition  
Since this pin has a very low input current (< 40 µA), a low-cost supply switch can be  
applied. To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode for  
a period of 150 ms (charging the input capacitors at pins IN1+, IN1, IN2+ and IN2).  
This can be realized by using a microcontroller or by using an external timing circuit as  
illustrated in Figure 8.  
7.2 Clip detection (pin CLIP)  
When clipping occurs at one or more output stages, the dynamic distortion detector  
becomes active and pin CLIP goes LOW. This information can be used to drive a sound  
processor or a DC volume control to attenuate the input signal and so limit the level of  
distortion. The output level of pin CLIP is independent of the number of channels that are  
being clipped. The clip detection circuit is disabled in a short-circuit condition, so if a fault  
condition occurs at the outputs, pin CLIP will remain at a HIGH level. The clip detection  
waveforms are illustrated in Figure 5.  
TDA8566_6  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 06 — 15 October 2007  
6 of 21  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
V
O
(V)  
0
0
V
CLIP  
(V)  
t (s)  
mgu357  
Fig 5. Clip detection waveforms  
7.3 Short-circuit diagnostic (pin DIAG)  
When a short-circuit occurs at one or more outputs to ground or to the supply voltage, the  
output stages are switched off until the short-circuit is removed and the device is switched  
on again (with a delay of approximately 20 ms after the removal of the short-circuit).  
During this short-circuit condition, pin DIAG is continuously LOW.  
When a short-circuit occurs across the load of one or both channels, the output stages are  
switched off for approximately 20 ms. After that time the load condition is checked during  
approximately 50 µs to see whether the short-circuit is still present. Due to this duty cycle  
of 50 µs/20 ms the average current consumption during the short-circuit condition is very  
low (approximately 40 mA). During this condition, pin DIAG is LOW for 20 ms and HIGH  
for 50 µs; see Figure 6. The power dissipation in any short-circuit condition is very low.  
current  
in  
output  
stage  
t (s)  
short-circuit over the load  
V
DIAG  
20 ms  
(V)  
t (s)  
50 µs  
mgu360  
Fig 6. Short-circuit diagnostic timing diagram  
7.4 Temperature pre-warning (pin DIAG)  
When the virtual junction temperature (Tvj) reaches 145 °C, pin DIAG will become  
continuously LOW.  
7.5 Open-collector diagnostic outputs  
Pins DIAG and CLIP are open-collector outputs, therefore more devices can be tied  
together. Pins DIAG and CLIP can also be tied together. An external pull-up resistor is  
required.  
TDA8566_6  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 06 — 15 October 2007  
7 of 21  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
7.6 Differential inputs  
The input stage is a high-impedance fully differential balanced input stage that is also  
capable of operating in a single-ended mode with one of the inputs capacitively coupled to  
an audio ground. It should be noted that if a source resistance is added (input voltage  
dividers) the CMRR degrades to lower values.  
8. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
operating  
Min  
Max  
18  
Unit  
V
VP  
supply voltage  
-
-
-
non-operating  
30  
V
load dump protection;  
45  
V
during 50 ms; tr 2.5 ms  
IOSM  
IORM  
non-repetitive peak output  
current  
-
-
10  
A
A
repetitive peak output  
current  
7.5  
Tstg  
Tvj  
storage temperature  
55  
+150  
150  
+85  
18  
°C  
°C  
°C  
V
virtual junction temperature  
ambient temperature  
-
Tamb  
Vpsc  
Vrp  
40  
short-circuit safe voltage  
reverse polarity voltage  
total power dissipation  
-
-
-
6.0  
V
Ptot  
60  
W
9. Thermal characteristics  
Table 6.  
Thermal characteristics  
Thermal characteristics in accordance with IEC 60747-1.  
Symbol Parameter  
Conditions  
Typ  
Unit  
Rth(j-c)  
Rth(j-a)  
thermal resistance from junction to case  
1.3  
40  
K/W  
K/W  
thermal resistance from junction to ambient in free air  
output 1  
output 2  
virtual junction  
2.2 K/W  
2.2 K/W  
0.2 K/W  
case  
001aaa155  
Fig 7. Equivalent thermal resistance network  
TDA8566_6  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 06 — 15 October 2007  
8 of 21  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
10. Static characteristics  
Table 7.  
Static characteristics  
VP = 14.4 V; Tamb = 25 °C; measured in test circuit of Figure 9; unless otherwise specified.  
Symbol Parameter  
Supply  
Conditions  
Min  
Typ  
Max  
Unit  
VP  
Iq  
supply voltage  
6
-
14.4  
115  
18  
V
quiescent current  
RL = ∞Ω  
180  
mA  
Operating condition  
VMODE mode select switch  
8.5  
-
-
VP  
40  
V
level  
IMODE  
mode select switch  
current  
VMODE = 14.4 V  
15  
µA  
VO  
output voltage  
-
-
7.0  
-
-
V
VOO  
output offset voltage  
100  
mV  
Mute condition  
VMODE  
mode select switch  
3.3  
-
6.4  
V
level  
VO  
output voltage  
output offset voltage  
-
-
-
7.0  
-
V
VOO  
VOO  
-
-
60  
60  
mV  
mV  
output offset voltage  
difference  
with respect to  
operating condition  
Standby condition  
VMODE  
mode select switch  
level  
0
-
-
2
V
Istb  
standby current  
0.1  
10  
µA  
Diagnostic  
VDIAG  
diagnostic output  
voltage  
during any fault  
condition  
-
-
0.6  
V
[1] The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V.  
[2] At VP = 18 V to 30 V the DC output voltage is 0.5VP.  
TDA8566_6  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 06 — 15 October 2007  
9 of 21  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
11. Dynamic characteristics  
Table 8.  
Dynamic characteristics  
VP = 14.4 V; Tamb = 25 °C; RL = 2 ; fi = 1 kHz; measured in test circuit of Figure 9; unless  
otherwise specified.  
Symbol Parameter  
Conditions  
Min  
25  
33  
45  
-
Typ  
30  
40  
55  
25  
35  
19  
25  
35  
14  
Max  
Unit  
W
Po  
output power  
THD = 0.5 %  
-
-
-
-
-
-
-
-
-
THD = 10 %  
W
THD = 30 %  
W
VP = 13.5 V; THD = 0.5 %  
VP = 13.5 V; THD = 10 %  
THD = 0.5 %; RL = 4 Ω  
THD = 10 %; RL = 4 Ω  
THD = 30 %; RL = 4 Ω  
W
-
W
16  
21  
28  
-
W
W
W
VP = 13.5 V;  
W
THD = 0.5 %; RL = 4 Ω  
VP = 13.5 V; THD = 10 %;  
-
22  
-
W
RL = 4 Ω  
THD  
total harmonic  
distortion  
Po = 1 W  
-
-
-
-
0.1  
8
-
-
-
-
%
%
%
Hz  
VCLIP = 0.6 V  
Po = 1 W; RL = 4 Ω  
0.05  
B
power bandwidth  
THD = 0.5 %; Po = 1 dB  
with respect to 25 W  
20 to  
20000  
fro(l)  
fro(h)  
Gv  
low frequency roll  
off  
1 dB  
-
25  
-
Hz  
high frequency roll 1 dB  
off  
20  
25  
-
-
kHz  
dB  
closed loop voltage  
gain  
26  
27  
SVRR  
supply voltage  
ripple rejection  
operating  
50  
50  
80  
100  
50  
-
60  
-
-
dB  
dB  
dB  
kΩ  
kΩ  
%
mute  
-
standby  
-
-
Zi  
input impedance  
differential  
single-ended  
120  
60  
2
150  
75  
-
|Zi|  
input impedance  
mismatch  
Vn(o)  
noise output  
voltage  
operating; Rs = 0 Ω  
-
85  
100  
60  
50  
-
120  
µV  
µV  
µV  
dB  
dB  
operating; Rs = 10 kΩ  
mute; independent of Rs  
-
-
-
-
αcs  
channel separation Po = 25 W; Rs = 10 kΩ  
45  
-
-
|Gv|  
channel unbalance  
1
TDA8566_6  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 06 — 15 October 2007  
10 of 21  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
Table 8.  
Dynamic characteristics …continued  
VP = 14.4 V; Tamb = 25 °C; RL = 2 ; fi = 1 kHz; measured in test circuit of Figure 9; unless  
otherwise specified.  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Vo(mute)  
output signal  
Vin = Vin(max) = 1 V (RMS)  
-
-
2
mV  
voltage in mute  
CMRR  
common mode  
rejection ratio  
Rs = 0 Ω  
60  
40  
75  
-
-
-
dB  
dB  
Rs = 45 kΩ  
[1] Dynamic distortion detector active; pin CLIP is LOW.  
[2] Frequency response externally fixed.  
[3] Vripple = Vripple(max) = 2 V (p-p); Rs = 0 .  
[4] Noise measured in a bandwidth of 20 Hz to 20 kHz.  
[5] Common mode rejection ratio measured at the output (over RL) with both inputs tied together;  
Vcommon 3.5 V (RMS); fi = 100 Hz to 10 kHz; Rs = 0 .  
[6] Common mode rejection ratio measured at the output (over RL) with both inputs tied together;  
Vcommon 3.5 V (RMS); fi = 1 kHz; Rs = 45 k. The mismatch of the input coupling capacitors is excluded.  
12. Application information  
12.1 Diagnostic output  
Special care must be taken in the PCB layout to separate pin CLIP from  
pins IN1+, IN1, IN2+ and IN2to minimize the crosstalk between the CLIP output and  
the inputs.  
12.2 Mode select switch  
To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode during  
150 ms (charging of the input capacitors at pins IN1+, IN1, IN2+ and IN2). The circuit  
in Figure 8 slowly ramps-up the voltage at the mode select switch pin when switching on  
and results in fast muting when switching off.  
+V  
P
S
10 k  
100 Ω  
mode  
select  
switch  
+
47 µF  
100 kΩ  
mgd102  
Fig 8. Mode select switch circuit  
TDA8566_6  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 06 — 15 October 2007  
11 of 21  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
13. Test information  
+
+
2200 µF  
(16V)  
100  
nF  
V
=
V
P
MODE  
_
14.4 V  
_
V
V
P2  
MODE  
P1  
220 nF  
220 nF  
220 nF  
220 nF  
R /2  
s
IN1+  
OUT1+  
60  
kΩ  
TDA8566  
R
V
L1  
in1  
60  
kΩ  
V
V
P
P
OUT1−  
R /2  
s
IN1−  
10  
kΩ  
10  
kΩ  
CLIP  
DETECTOR  
CLIP  
DIAG  
V
ref  
SGND  
IN2+  
DIAGNOSTIC  
INTERFACE  
R /2  
s
OUT2+  
60  
kΩ  
R
V
L2  
in2  
60  
kΩ  
OUT2−  
R /2  
s
IN2−  
PGND1 PGND2  
mgu359  
Fig 9. Stereo BTL test diagram  
TDA8566_6  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 06 — 15 October 2007  
12 of 21  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
14. Package outline  
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height  
SOT418-3  
E
A
D
x
X
c
y
E
H
2
v
M
A
E
D
1
D
2
10  
1
pin 1 index  
Q
A
A
2
(A )  
3
E
1
A
4
θ
L
p
detail X  
20  
11  
w M  
Z
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
max.  
(1)  
(2)  
(2)  
A
A
A
b
c
D
D
D
E
E
1
E
e
H
E
L
p
Q
v
w
x
y
Z
θ
UNIT  
2
3
4
p
1
2
2
8°  
0°  
+0.08 0.53 0.32  
0.04 0.40 0.23  
16.0 13.0 1.1 11.1 6.2  
15.8 12.6 0.9 10.9 5.8  
2.9  
2.5  
14.5 1.1  
13.9 0.8  
1.7  
1.5  
2.5  
2.0  
3.5  
3.2  
mm  
1.27  
3.5  
0.35  
0.25 0.25 0.03 0.07  
Notes  
1. Limits per individual lead.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-02-12  
03-07-23  
SOT418-3  
Fig 10. Package outline SOT418-3 (HSOP20)  
TDA8566_6  
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Product data sheet  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height  
SOT566-3  
E
A
D
x
X
c
y
E
H
2
v
M
A
E
D
1
D
2
12  
1
pin 1 index  
Q
A
A
2
(A )  
3
E
1
A
4
θ
L
p
detail X  
24  
13  
w M  
Z
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
max.  
(1)  
(2)  
(2)  
A
A
A
b
c
D
D
D
E
E
1
E
e
H
E
L
p
Q
v
w
x
y
Z
θ
UNIT  
2
3
4
p
1
2
2
8°  
0°  
+0.08 0.53 0.32  
0.04 0.40 0.23  
16.0 13.0 1.1 11.1 6.2  
15.8 12.6 0.9 10.9 5.8  
2.9  
2.5  
14.5 1.1  
13.9 0.8  
1.7  
1.5  
2.7  
2.2  
3.5  
3.2  
mm  
1
3.5  
0.35  
0.25 0.25 0.03 0.07  
Notes  
1. Limits per individual lead.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
03-02-18  
03-07-23  
SOT566-3  
Fig 11. Package outline SOT566-3 (HSOP24)  
TDA8566_6  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)  
SOT243-1  
non-concave  
D
h
x
D
E
h
view B: mounting base side  
A
2
d
B
j
E
A
L
3
L
Q
c
2
v
M
1
17  
e
e
m
w
M
1
Z
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
(1)  
(1)  
UNIT  
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0  
15.5 4.4 0.60 0.38 23.6 19.6  
12.2  
11.8  
3.4 12.4 2.4  
3.1 11.0 1.6  
2.00  
1.45  
2.1  
1.8  
6
mm  
10  
2.54 1.27 5.08  
0.8  
4.3  
0.4 0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-17  
03-03-12  
SOT243-1  
Fig 12. Package outline SOT243-1 (DBS17P)  
TDA8566_6  
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2 × 40 W/2 stereo BTL car radio power amplifier  
15. Soldering  
This text provides a very brief insight into a complex technology. A more in-depth account  
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow  
soldering description”.  
15.1 Introduction to soldering  
Soldering is one of the most common methods through which packages are attached to  
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both  
the mechanical and the electrical connection. There is no single soldering method that is  
ideal for all IC packages. Wave soldering is often preferred when through-hole and  
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not  
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high  
densities that come with increased miniaturization.  
15.2 Wave and reflow soldering  
Wave soldering is a joining technology in which the joints are made by solder coming from  
a standing wave of liquid solder. The wave soldering process is suitable for the following:  
Through-hole components  
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board  
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless  
packages which have solder lands underneath the body, cannot be wave soldered. Also,  
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,  
due to an increased probability of bridging.  
The reflow soldering process involves applying solder paste to a board, followed by  
component placement and exposure to a temperature profile. Leaded packages,  
packages with solder balls, and leadless packages are all reflow solderable.  
Key characteristics in both wave and reflow soldering are:  
Board specifications, including the board finish, solder masks and vias  
Package footprints, including solder thieves and orientation  
The moisture sensitivity level of the packages  
Package placement  
Inspection and repair  
Lead-free soldering versus PbSn soldering  
15.3 Wave soldering  
Key characteristics in wave soldering are:  
Process issues, such as application of adhesive and flux, clinching of leads, board  
transport, the solder wave parameters, and the time during which components are  
exposed to the wave  
Solder bath specifications, including temperature and impurities  
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TDA8566  
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2 × 40 W/2 stereo BTL car radio power amplifier  
15.4 Reflow soldering  
Key characteristics in reflow soldering are:  
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to  
higher minimum peak temperatures (see Figure 13) than a PbSn process, thus  
reducing the process window  
Solder paste printing issues including smearing, release, and adjusting the process  
window for a mix of large and small components on one board  
Reflow temperature profile; this profile includes preheat, reflow (in which the board is  
heated to the peak temperature) and cooling down. It is imperative that the peak  
temperature is high enough for the solder to make reliable solder joints (a solder paste  
characteristic). In addition, the peak temperature must be low enough that the  
packages and/or boards are not damaged. The peak temperature of the package  
depends on package thickness and volume and is classified in accordance with  
Table 9 and 10  
Table 9.  
SnPb eutectic process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
350  
220  
< 2.5  
235  
220  
2.5  
220  
Table 10. Lead-free process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
260  
350 to 2000  
> 2000  
260  
< 1.6  
260  
250  
245  
1.6 to 2.5  
> 2.5  
260  
245  
250  
245  
Moisture sensitivity precautions, as indicated on the packing, must be respected at all  
times.  
Studies have shown that small packages reach higher temperatures during reflow  
soldering, see Figure 13.  
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TDA8566  
NXP Semiconductors  
2 × 40 W/2 stereo BTL car radio power amplifier  
maximum peak temperature  
= MSL limit, damage level  
temperature  
minimum peak temperature  
= minimum soldering temperature  
peak  
temperature  
time  
001aac844  
MSL: Moisture Sensitivity Level  
Fig 13. Temperature profiles for large and small components  
For further information on temperature profiles, refer to Application Note AN10365  
“Surface mount reflow soldering description”.  
TDA8566_6  
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2 × 40 W/2 stereo BTL car radio power amplifier  
16. Revision history  
Table 11. Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
TDA8566_6  
20071015  
Product data sheet  
-
TDA8566Q_5  
TDA8566TH_2  
Modifications:  
The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors.  
Legal texts have been adapted to the new company name where appropriate.  
Section 9 “Thermal characteristics”: changed value of Rth(j-c) to 1.3 K/W  
Figure 7: values updated  
Included TDA8566TH1 and TDA8566Q in the data sheet  
TDA8566Q_5  
TDA8566TH_2  
20010221  
Product specification  
-
-
-
20030708  
Product specification  
-
TDA8566_6  
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2 × 40 W/2 stereo BTL car radio power amplifier  
17. Legal information  
17.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of a NXP Semiconductors product can reasonably be expected to  
17.2 Definitions  
result in personal injury, death or severe property or environmental damage.  
NXP Semiconductors accepts no liability for inclusion and/or use of NXP  
Semiconductors products in such equipment or applications and therefore  
such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
17.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
17.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
18. Contact information  
For additional information, please visit: http://www.nxp.com  
For sales office addresses, send an email to: [email protected]  
TDA8566_6  
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Rev. 06 — 15 October 2007  
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2 × 40 W/2 stereo BTL car radio power amplifier  
19. Contents  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2007.  
All rights reserved.  
For sales office addresses, please send an email to: [email protected]  
Date of release: 15 October 2007  
Document identifier: TDA8566_6  
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