INTEGRATED CIRCUITS
DATA SHEET
TDA1510AQ
24 W BTL or 2 x 12 W stereo car
radio power amplifier
January 1992
Product specification
File under Integrated Circuits, IC01
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
Fig.1 Functional diagram; heavy lines indicate signal paths.
January 1992
3
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
Supply voltage:
operating
pin 10
V
V
−
−
18
V
V
P
P
non-operating
28
non-operating,
load dump protection
Peak output current
Total power dissipation
Storage temperature range
Crystal temperature
during 50 ms
see Fig.2
V
I
−
−
45
6
V
A
P
OM
P
tot
stg
c
T
T
−65
−
+ 150
+150
°C
°C
Fig.2 Power derating curves.
January 1992
4
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
HEATSINK DESIGN EXAMPLE
The derating of the encapsulation requires the following external heatsink (for sine-wave drive):
(R
) = 3,5 K/W
th j-mb
24 W BTL (4 Ω) or 2 × 12 W stereo (2 Ω); maximum sine-wave dissipation = 12 W;
T
= 65 °C (maximum):
amb
150 – 65
Rth h-a
=
– 3,5 = 3,5 K/W
----------------------
12
2 × 7 W stereo (4 Ω); maximum sine-wave dissipation = 6 W; T
= 65 °C (maximum):
amb
150 – 65
Rth h-a
=
– 3,5 = 10,5 K/W
----------------------
12
D.C. CHARACTERISTICS
PARAMETER
CONDITIONS
SYMBOL
MIN.
6,0
TYP.
14,4
MAX.
18,0
UNIT
Supply voltage range
Repetitive peak output current
Total quiescent current
Stand-by current
V
I
V
A
P
−
−
−
0,15
−
75
−
4,0
120
2
ORM
tot
I
I
I
mA
mA
mA
sb
Switch-on current
V
≤ V ; note 1
0,35
0,80
11
10
so
January 1992
5
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
A.C. CHARACTERISTICS
T
= 25 °C; V = 14,4 V; f = 1 kHz; unless otherwise specified
amb
P
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Bridge Tied Load application (BTL)
Output power
with bootstrap
note 6;
R = 4 Ω
L
V = 13,2 V
P
d
d
= 0,5%
= 10%
P
−
−
15,0
−
−
W
tot
tot
o
P
20,0
W
o
V = 14,4 V
P
d
d
= 0,5%
= 10%
P
15,5
20,0
−
39,5
−
18,0
24,0
75
−
−
−
40,5
W
tot
tot
o
P
W
o
Open loop voltage gain
Closed loop voltage gain
Frequency response
Input impedance
G
dB
dB
Hz
MΩ
o
note 2
G
40,0
c
at −3 dB; note 3
note 4
f
20 to > 20 k −
−
r
|Z |
1
−
i
Noise output voltage
(r.m.s. value)
f = 20 Hz to
20 kHz
R = 0 Ω
V
−
−
0,2
−
0,8
mV
mV
S
n (rms)
R = 10 Ω
V
0,35
S
n (rms)
R = 10 kΩ;
S
according to
IEC 179 curve A
f = 100 Hz; note 5
V
−
42
−
0,25
50
2
−
−
mV
dB
n (rms)
Supply voltage ripple rejection
SVRR
D.C. output offset voltage between
channels
|∆V
|
50
mV
5-9
Power bandwidth
−1 dB;
d
= 0,5%
B
−
30 to > 40 k −
Hz
tot
January 1992
6
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
PARAMETER
Stereo application
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Output power; with bootstrap
note 6;
R = 4 Ω
L
V = 13,2 V
P
d
d
= 0,5%
= 10%
P
−
−
4,5
6,0
−
−
W
tot
tot
o
P
W
o
V = 14,4 V
P
d
d
= 0,5%
= 10%
P
4,5
6,0
5,5
7,0
−
−
W
W
tot
tot
o
P
o
R = 2 Ω
L
V = 13,2 V
P
d
d
= 0,5%
= 10%
P
−
−
7,5
−
−
W
W
tot
tot
o
P
10,0
o
V = 14,4 V
P
d
d
= 0,5%
= 10%
P
7,75
10,0
9,0
−
−
W
W
tot
tot
o
P
12,0
o
Output power; without bootstrap
notes 6, 8 and 9
R = 4 Ω
L
V = 14,4 V
P
d
= 10%
P
−
−
−
6
−
W
tot
o
Frequency response
notes 3 and 6
−3 dB
f
40 to > 20 k −
Hz
dB
r
Supply voltage ripple rejection
Channel separation
note 5
f = 1 kHz
SVRR
50
−
R = 10 kΩ;
S
f = 1 kHz
note 7
α
G
40
50
−
40,5
dB
dB
Closed loop voltage gain
Noise output voltage
(r.m.s. value)
39,5
40,0
c
f = 20 Hz to 20 kHz;
R = 0 Ω
V
−
−
0,15
0,25
−
−
mV
mV
S
n (rms)
n (rms)
R = 10 kΩ
V
S
R = 10 kΩ;
S
according to
IEC179 curve A
V
−
0,2
−
mV
n (rms)
January 1992
7
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
Notes to the characteristics
1. If V > V then I must be < 10 mA.
11
10
11
2. Closed loop voltage gain can be chosen between 32 and 56 dB (BTL), and is determined by external components.
3. Frequency response externally fixed.
4. The input impedance in the test circuit (Fig.3) is typ. 100 kΩ.
5. Supply voltage ripple rejection measured with a source impedance of 0 Ω (maximum ripple amplitude 2 V).
6. Output power is measured directly at the output pins of the IC.
7. Closed loop voltage gain can be chosen between 26 and 50 dB (stereo), and is determined by external components.
8. A resistor of 56 kΩ between pins 3 and 7 is required for symmetrical clipping.
9. Without bootstrap the 100 µF capacitor between pins 5 and 6 and the 100 µF capacitor between pins 8 and 9 can
be omitted. Pins 6 and 8 connected to pin 10.
January 1992
8
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
APPLICATION INFORMATION
(1) belongs to power supply.
Fig.3 Test and application circuit; Bridge Tied Load (BTL).
(1) belongs to power supply.
Fig.4 Test and application circuit; stereo mode.
9
January 1992
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
PACKAGE OUTLINE
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
non-concave
x
D
h
D
E
h
view B: mounting base side
d
A
2
B
j
E
A
L
3
L
Q
c
2
v
M
1
13
e
e
m
w
M
1
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.2 0.60 0.38 23.6 19.6
12.2
11.8
3.4 12.4 2.4
3.1 11.0 1.6
2.00
1.45
2.1
1.8
6
mm
10
3.4
1.7 5.08
0.8
4.3
0.25 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-03-11
97-12-16
SOT141-6
January 1992
10
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
SOLDERING
Introduction
specified maximum storage temperature (T
). If the
stg max
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
January 1992
11
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