This product complies with the RoHS Directive (EU 2002/95/EC).
Transistors
2SD0602A
Silicon NPN epitaxial planar type
For general amplification
Complementary to 2SB0710A
Features
Package
Low collector-emitter saturation voltage VCE(sat)
Mini type package, allowing downsizing of the equipment and automatic
insertion through the tape packing.
Code
Mini3-G1
Pin Name
1: Base
Absolute Maximum Ratings Ta = 25°C
2: Emitter
3: Collector
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Emitter-base voltage (Collector open)
Collector current
Symbol
VCBO
VCEO
VEBO
IC
Rating
Unit
V
60
Marking Symbol: X
50
V
5
V
500
mA
A
Peak collector current
ICP
1
200
Collector power dissipation
Junction temperature
PC
mW
°C
°C
Tj
150
Storage temperature
T
stg
–55 to +150
Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
60
50
5
Typ
Max
Unit
V
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Emitter-base voltage (Collector open)
VCBO IC = 10 mA, IE = 0
VCEO IC = 10 mA, IB = 0
VEBO IE = 10 mA, IC = 0
V
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = 20 V, IE = 0
0.1
mA
2
*
hFE1
VCE = 10 V, IC = 150 mA
VCE = 10 V, IC = 500 mA
85
40
340
1
Forward current transfer ratio *
hFE2
1
Collector-emitter saturation voltage *
VCE(sat) IC = 300 mA, IB = 30 mA
0.35
200
0.60
15
V
Transition frequency
fT
VCB = 10 V, IE = -50 mA, f = 200 MHz
VCB = 10 V, IE = 0, f = 1 MHz
MHz
Collector output capacitance
Cob
6
pF
(Common base, input open circuited)
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. 1: Pulse measurement
*
2: Rank classification
*
Rank
Q
85 to 170
XQ
R
120 to 240
XR
S
170 to 340
XS
No-rank
85 to 340
X
hFE1
Marking symbol
Product of no-rank is not classified and have no indication for rank.
Publication date: October 2008
SJC00191DED
1
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This product complies with the RoHS Directive (EU 2002/95/EC).
2SD0602A
Mini3-G1
Unit: mm
+0.10
−0.05
0.40
+0.10
−0.05
0.16
3
2
1
(0.95)
(0.95)
1.9 ±0.1
+0.20
−0.05
2.90
SJC00191DED
3
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Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
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(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
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other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
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equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
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– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
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(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
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maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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